JP2023009088A - Frame body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a frame body that has a reduced difference in expansion amount due to heat and can suppress generation of strain due to thermal expansion.

SOLUTION: A frame body is constituted of an upper frame 16 and a lower frame 17. The upper frame 16 and the lower frame 17 are made of a metal material having a low thermal linear expansion coefficient. The upper frame 16 and the lower frame 17 are joined via an adhesion layer 18.

SELECTED DRAWING: Figure 6

COPYRIGHT: (C)2023,JPO&INPIT

Description

The present invention relates to a frame, which can be used to support a mask body. The frame of the present invention can be applied to, for example, a vapor deposition mask (metal mask).

Organic EL displays, which are lighter and consume less power, have started to replace liquid crystal displays in mobile devices such as smartphones and tablet terminals that have display devices, in order to reduce the weight of the devices and increase the operating time. there is An organic EL display is manufactured by forming a light-emitting layer (vapor deposition layer) of an organic EL element on a substrate (vapor deposition object) by a vapor deposition mask method. At this time, by using a large vapor deposition mask having a larger number of mask bodies to manufacture more products in one vapor deposition operation, the manufacturing cost of the organic EL display can be reduced. Therefore, manufacturers of organic EL displays are increasingly demanding larger vapor deposition masks.

A vapor deposition mask used in the vapor deposition mask method is disclosed in Patent Document 1, for example. Patent Document 1 discloses a metal mask (mask main body) having a plurality of mask portions (evaporation patterns), and a frame (frame body) made of an invar material that is formed in a frame shape and holds the metal mask in a taut state. constitutes an evaporation mask. The metal mask is spot-welded to the frame.

This type of vapor deposition mask has also been proposed by the present applicant, and is disclosed in Patent Document 2, for example. Such a vapor deposition mask comprises a plurality of mask bodies having vapor deposition patterns, and a reinforcing frame that is inseparably and integrally joined to the mask body. The frame is made of an Invar material (a material with a low coefficient of thermal expansion), and the outer periphery of each mask body is joined to the frame surrounding the mask body with a metal layer formed by electroforming.

JP-A-2004-323888 JP-A-2005-15908

As in the vapor deposition masks of Patent Documents 1 and 2, the frame for fixing and holding the metal mask and the frame for reinforcing the mask body are made of Invar material, so that the working environment during vapor deposition is a high-temperature environment. Also, it is possible to suppress the expansion of the vapor deposition mask and ensure the reproducibility and vapor deposition accuracy of the vapor deposition layer (light emitting layer). However, the metal mask of the vapor deposition mask of Patent Document 1,
Although the metal mask is fixed and held by the frame in a tensioned state, if the vapor deposition mask is enlarged, the area of the metal mask not supported by the frame increases, and the metal mask warps due to its own weight. Therefore, it is inevitable that the reproducibility and the deposition accuracy are degraded.

On the other hand, in the deposition mask of Patent Document 2, each mask body is joined to the frame surrounding the mask body, so even if the deposition mask is enlarged, the mask body does not warp due to its own weight. Reproducibility and deposition accuracy of the deposited layer can be ensured. However, even the frame made of Invar expands slightly during vapor deposition. In addition, the frame is made of an Invar metal plate.
The plate thickness varies depending on the part of the frame. For this reason, the amount of expansion differs in each part of the frame,
A difference in expansion amount may appear as distortion of the entire vapor deposition mask. When the vapor deposition mask is distorted in this manner, the flatness of the vapor deposition mask deteriorates, and the reproducibility and vapor deposition accuracy are extremely lowered. This distortion becomes more conspicuous as the size of the frame is increased. The occurrence of distortion due to the plate thickness deviation of the base material can be suppressed by controlling the manufacturing process of the metal plate material and exclusively manufacturing and using a base material with a small plate thickness deviation. becomes expensive, which leads to an increase in the manufacturing cost of the vapor deposition mask. Here, the plate thickness deviation means the variation width of the thickness with respect to the standard dimension of the metal plate.

SUMMARY OF THE INVENTION An object of the present invention is to provide a frame body that can suppress the occurrence of strain due to thermal expansion by reducing the difference in the amount of thermal expansion. Such a frame is used, for example, to reinforce the mask body, and can realize an increase in size of the mask while suppressing an increase in manufacturing cost, maintain the flatness of the mask, and ensure the reproducibility and deposition accuracy of the deposited layer. You can get a mask.

The vapor deposition mask of the present invention comprises a mask body 2 having a vapor deposition pattern 6 consisting of a large number of independent vapor deposition through holes 5, and a reinforcing frame 3 made of a metal plate having a low coefficient of linear thermal expansion and disposed around the mask body 2. and The mask main body 2 and the frame 3 are inseparably and integrally joined via the metal layer 8 . The frame body 3 is composed of an upper frame 16 and a lower frame 17 formed in the same shape, and the upper frame 16 and the lower frame 17 are joined and integrated via an adhesive layer 18. and

A plurality of frame bodies 3 are laminated, and adjacent frame bodies 3 and 3 in the lamination direction are joined via an adhesive layer 19 .

The upper frame 16 and the lower frame 17 are joined together with their projecting arc surfaces or concave arc surfaces facing each other, and the two-dimensional curved surface or three-dimensional curved surface warping of the upper frame 16 and the lower frame 17 is offset. Then, the frame body 3 is formed flat.

The mask main body 2 is formed in a rectangular shape, and a plurality of mask main bodies 2 are arranged in a matrix.
The frame body 3 includes an outer peripheral frame 10 , and a lattice frame-shaped vertical frame 12 and horizontal frames 13 that partition a plurality of mask openings 11 in the outer peripheral frame 10 . W1 is the width dimension of the vertical frame 12 parallel to the long side of the mask body 2
Assuming that the width dimension of the horizontal frame 13 parallel to the short side of the mask body 2 is W2, the width dimension W1 of the vertical frame 12 and the width dimension W2 of the horizontal frame 13 are expressed by an inequality (W1≦W2≦W1×1 .1) is set to satisfy

A form in which the metal layer 8 is integrally formed with the mask body 2 can be adopted.

A support frame 46 fixed to the lower surface of the frame 3 and an auxiliary frame 47 fixed to the lower surface of the support frame 46 are provided. A frame opening 48 corresponding to the mask opening 11 of the frame 3 is formed in the support frame 46 . A support frame 46 supports the entire frame 13 . Further, the auxiliary frame 47 is formed in a picture frame shape and supports the four peripheral edges of the support frame 46 with the auxiliary frame 47 .

The vapor deposition mask according to the vapor deposition mask manufacturing method of the present invention includes a mask body 2 having a vapor deposition pattern 6 made up of a large number of independent vapor deposition through holes 5 in a pattern forming region 4, and a low thermal linear expansion mask disposed around the mask body 2. and a reinforcing frame 3 made of a metal plate material with a modulus. In the vapor deposition mask manufacturing method, a frame forming step of forming a reinforcing frame 3 and a primary pattern of providing a primary pattern resist 29 having a resist body 29 a corresponding to the vapor deposition through holes 5 on the surface of the master mold 24 . and a step of electroforming the electrodeposited metal on the master mold 24 using the primary pattern resist 29 to form a plurality of primary electroformed layers 30 corresponding to the mask body 2 on the master mold 24 at predetermined positions. 1, and the frame 3 is arranged on the matrix 24 while aligning the primary electroformed layer 30 corresponding to the mask opening 11 in each mask opening 11 of the frame 3. Then, in a state of covering the surface of the frame 3 and the surface of the outer peripheral edge 4a of the pattern forming region 4 of the mask body 2, the metal layer 8 is formed by electroforming, and the metal layer A second electroforming step in which the primary electroformed layer 30 and the frame 3 are inseparably and integrally joined via the mold 24, and the primary electroformed layer 30, the frame 3, and the metal layer 8 are integrated from the matrix 24. and a peeling step of peeling. In the frame forming process, the upper frame 16 and the lower frame 17 are joined together with an adhesive layer 18 in a state in which the convex arc surfaces or the concave arc surfaces of the upper frame 16 and the lower frame 17 face each other. It is characterized by forming the frame 3 including a joining step of flattening the frame 3 in a state in which the two-dimensional curved surface or three-dimensional curved surface warpage is canceled.

In addition, the vapor deposition mask according to the vapor deposition mask manufacturing method of the present invention includes a mask main body 2 having a vapor deposition pattern 6 made up of a large number of independent vapor deposition through holes 5 in the pattern forming region 4, and a low A reinforcing frame 3 made of a metal plate having a coefficient of linear thermal expansion is provided. In the manufacturing method of the vapor deposition mask, a frame body forming step of forming the frame body 3 for reinforcement and a primary patterning step of providing a primary pattern resist 29 having a resist body 29a corresponding to the mask body 2 on the surface of the master mold 24 are performed. a step of attaching an adhesive resist 43 to the entire upper surface of the master mold 24 including the primary pattern resist 29, and then adhering and fixing the frame 3 on the master mold 24 so as to surround the primary pattern resist 29; a step of arranging the body, and an adhesive resist 4 positioned on the lower surface of the frame 3;
3, the surface of the master mold 24 excluding the resist body 29a, and the surface of the frame body 3 are covered. and the metal layer 8 that joins the mask body 2 and the frame 3 to the integral electroforming process, and the primary electroforming layer 30 and the metal layer 8 from the master mold 24 , and a peeling step of peeling the frame 3 integrally. In the frame forming process, the upper frame 16 and the lower frame 17 are joined together with an adhesive layer 18 in such a state that the convex arc surfaces or the concave arc surfaces of the upper frame 16 and the lower frame 17 face each other. It is characterized by forming the frame 3 including a joining step of flattening the frame 3 in a state in which the two-dimensional curved surface or three-dimensional curved surface warp is offset.

In the primary patterning step, a photoresist layer 25 was laminated on the surface of a conductive matrix 24, and a pattern film 26 having transparent holes 26a corresponding to the primary patterning was laminated on the surface of the photoresist layer 25. A patterning pre-stage body 27 is formed. The temperature of the pre-patterning body 27 and the furnace temperature of the ultraviolet irradiation device are preheated to the furnace temperature for the exposure work, and the photoresist layer 25 is exposed by the ultraviolet irradiation device.

The temperature range of the electroforming liquid used in the first electroforming process and the temperature range of the electroforming liquid used in the second electroforming process are set to substantially the same temperature range.

According to the vapor deposition mask of the present invention, it is possible to reduce the difference in the amount of expansion due to heat in each part of the frame 3 and suppress the occurrence of distortion of the frame 3 due to thermal expansion. More specifically, the thinner the thickness of the commonly distributed metal plate that is the base material of the frame 3, the more times it passes through rolling rolls in the manufacturing process. There is For this reason, the frame 3 is composed of an upper frame 16 and a lower frame 17, and the upper and lower frames 16 and 17 are joined together via an adhesive layer 18 to form a frame 3 having the same thickness as the conventional one. Since the frame 3 can be formed using a thinner metal plate material when forming, the plate thickness deviation of the entire frame 3 can be reduced. As a result, even with a large vapor deposition mask, it is possible to suppress the occurrence of distortion due to thermal expansion resulting from the plate thickness deviation of the metal plate material. In addition, since a generally available thin metal plate is used as the base material, there is no need to form the frame 3 using a special metal plate. As described above, according to the present invention, it is possible to increase the size of the vapor deposition mask while suppressing an increase in manufacturing cost, and furthermore, it is possible to maintain the flatness of the vapor deposition mask, and to achieve good reproducibility and vapor deposition accuracy of the vapor deposition layer. can be ensured. In addition, according to the frame 3 in which the adhesive layer 18 is interposed between the upper frame 16 and the lower frame 17, when an external force that causes bending deformation is applied to the vapor deposition mask, the frame 3 is stretched by the adhesive layer 18. Flexible and elastic deformation can effectively prevent damage to the vapor deposition mask.

By stacking a plurality of frames 3 and joining the frames 3 adjacent to each other in the stacking direction via an adhesive layer 19, when forming the frame 3 having the same thickness as the conventional one, a thinner metal plate material can be obtained. can be used to form the frame 3, it is possible to further suppress the occurrence of strain due to thermal expansion resulting from the plate thickness deviation of the metal plate. Therefore, it is possible to increase the size of the vapor deposition mask, maintain the flatness of the vapor deposition mask, and ensure better reproducibility and vapor deposition accuracy of the vapor deposition layer. In addition, since the number of adhesive layers 18 and 19 that join the frames 3 together increases, elastic deformation can be performed more flexibly against external force, so damage to the vapor deposition mask can be more effectively prevented.

When the upper frame 16 and the lower frame 17 are joined in a state in which the two-dimensional curved surface or three-dimensional curved surface warp is offset and the frame body 3 is formed flat, a slight warp due to the metal plate material is eliminated. hand,
It is possible to further improve the flatness, and to ensure better reproducibility and deposition accuracy of the deposited layer.

The width dimension W1 of the vertical frame 12 and the width dimension W2 of the horizontal frame 13 are defined by an inequality (W1≦W2≦W1×1.
If 1) is satisfied, the cross-sectional area of the horizontal frame 13 can be equal to or larger than the cross-sectional area of the vertical frame 12, and the length of the horizontal frame 13 is smaller than that of the vertical frame 12. , vertical frame 12
is firmly supported by the horizontal frame 13 to prevent the bending deformation of the long vertical frame 12 due to its own weight. Therefore, deformation of the frame 3 due to its own weight can be prevented, and the size of the vapor deposition mask can be increased. Further, the flatness of the vapor deposition mask can be maintained, and the reproducibility and vapor deposition accuracy of the vapor deposition layer can be improved. In addition, since the rigidity of the vertical frame 12 and the horizontal frame 13 can be made substantially uniform as a whole, when an external force that bends and deforms the vapor deposition mask 1 is applied, the external force can be evenly dispersed to eliminate local concentration. , deformation and breakage of the vapor deposition mask 1 can be effectively prevented. In addition, horizontal frame 13
The width dimension W2 is set to (W2 ≤ W1 × 1.1), so the weight increase of the frame 3 due to the cross-sectional area of the horizontal frame 13 becoming larger than necessary is suppressed, and the weight of the entire vapor deposition mask is reduced. The structural strength and rigidity of the frame body 3 can be enhanced while eliminating the increase in size.

If the metal layer 8 is integrally formed with the mask main body 2 and the mask main body 2 and the frame 3 are inseparably and integrally joined, the labor of forming the metal layer 8 separately and joining the mask main body 2 and the frame 3 is eliminated. Therefore, it is possible to reduce the manufacturing cost of the vapor deposition mask by omitting the steps required for manufacturing and shortening the time.

By supporting the entire vertical frame 12 and horizontal frame 13 of the frame body 3 with the supporting frame 46 and further supporting the four peripheral edges of the supporting frame 46 with the auxiliary frame 47, the structural strength and rigidity of the entire vapor deposition mask are further enhanced. , the vapor deposition mask can be prevented from bending and deforming to maintain flatness, and the reproducibility and vapor deposition accuracy of the vapor deposition layer can be further improved.

According to the method for manufacturing a vapor deposition mask according to the present invention, in the frame forming step, the two-dimensional curved surface or the three-dimensional curved surface of the upper frame 16 and the lower frame 17 are flatly joined in a state in which the warp is offset. , the flatness can be further improved by eliminating a slight warp derived from the metal plate material. Therefore, it is possible to obtain a vapor deposition mask that can be increased in size while suppressing an increase in manufacturing cost, can maintain flatness, and can ensure good reproducibility and vapor deposition accuracy of the vapor deposition layer.

According to another manufacturing method of the vapor deposition mask according to the present invention, the labor for forming the metal layer 8 is omitted,
The flatness can be further improved in the same manner as described above while omitting the steps required for manufacturing and shortening the time. Therefore, it is possible to obtain a vapor deposition mask that can be increased in size while suppressing an increase in manufacturing cost, can maintain flatness, and can ensure good reproducibility and vapor deposition accuracy of the vapor deposition layer.

In the primary patterning process, the temperature of the pre-patterning body 27 and the temperature in the furnace of the ultraviolet irradiation device are preheated to the temperature in the furnace for the exposure work, and the exposure work of the photoresist layer 25 is performed by the ultraviolet irradiation device. By doing so, the primary pattern resist 29 can be provided on the matrix 24 with good positional accuracy and in the intended shape. Specifically, the matrix 24, the photoresist layer 25, and the pattern film 26, which constitute the patterning preform 27, have different thermal linear expansion coefficients. Therefore, when the pre-patterning body 27 is housed in the furnace at a temperature lower than the temperature in the furnace during the exposure work and the exposure work is performed, the pre-patterning body 27 is heated by the ultraviolet irradiation and expands, resulting in the above three factors. The exposure work is performed while the relative positional relationship of 24, 25 and 26 is shifted. Along with this, the positional accuracy of the primary pattern resist 29 with respect to the matrix 24 is lowered, and furthermore, the primary pattern resist 2
The shape of 9 also cannot be exposed as intended. A decrease in positional accuracy or a defective shape of the primary pattern resist 29 affects the formation of the mask body 2 in the first electroforming process or the integrated electroforming process, and the mask body 2 with the intended dimensional accuracy cannot be formed by electroforming. A problem occurs. However, by preheating the pre-patterning body 27 and the temperature in the furnace of the ultraviolet irradiation device to the temperature in the furnace during the exposure work, the temperature rise due to the ultraviolet irradiation is eliminated and the heat of the pre-patterning body 27 is reduced. Inflation can be prevented. Therefore, the primary pattern resist 29 can be provided on the master mold 24 with good positional accuracy and in the intended shape, and the mask main body 2 with good dimensional accuracy can be formed, thereby improving the reproducibility of the vapor deposition layer and the vapor deposition accuracy. It can contribute to higher accuracy.

The temperature range of the electroforming solution used in the first electroforming process and the second electroforming process is set to be substantially the same, and the primary electroformed layer 30 and the frame body are formed through the metal layer 8 that will be the metal layer. 3 are inseparably and integrally joined, it is possible to prevent the mask body 2 from being joined to the frame 3 while being thermally expanded. Therefore, the frame 3
The positional accuracy of the joining position of the mask main body 2 to the mask can be improved, and a vapor deposition mask can be obtained in which the reproducibility of the vapor deposition layer and the vapor deposition accuracy are further improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is a longitudinal front view which shows the principal part of the vapor deposition mask which concerns on 1st Embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the whole vapor deposition mask which concerns on 1st Embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a vertical side view of the vapor deposition mask which concerns on 1st Embodiment of this invention. It is a top view which shows the principal part of the vapor deposition mask which concerns on 1st Embodiment of this invention. It is a top view of the frame of the vapor deposition mask which concerns on 1st Embodiment of this invention. FIG. 4 is an explanatory diagram showing the first stage of a frame forming step in the method for manufacturing a vapor deposition mask according to the first embodiment of the present invention; It is explanatory drawing which shows the latter stage of the frame formation process in the manufacturing method of the vapor deposition mask which concerns on 1st Embodiment of this invention. FIG. 4 is an explanatory diagram showing a primary patterning step and a first electroforming step in the method for manufacturing a vapor deposition mask according to the first embodiment of the present invention; FIG. 4 is an explanatory diagram showing an activation treatment step in the method for manufacturing a vapor deposition mask according to the first embodiment of the present invention; It is explanatory drawing which shows the secondary patterning process, the frame arrangement|positioning process, the 2nd electroforming process, and the peeling process in the manufacturing method of the vapor deposition mask which concerns on 1st Embodiment of this invention. It is a vertical front view which shows the principal part of the vapor deposition mask which concerns on 2nd Embodiment of this invention. It is explanatory drawing which shows the frame arrangement|positioning process of the vapor deposition mask which concerns on 2nd Embodiment of this invention, a 2nd electroforming process, and a peeling process. It is a longitudinal front view showing the principal part of the vapor deposition mask concerning 3rd Embodiment of this invention. It is explanatory drawing which shows the primary patterning process and 1st electroforming process in the manufacturing method of the vapor deposition mask which concerns on 3rd Embodiment of this invention. It is explanatory drawing which shows the secondary patterning process, the frame arrangement|positioning process, the 2nd electroforming process, and the peeling process in the manufacturing method of the vapor deposition mask which concerns on 3rd Embodiment of this invention. It is a longitudinal front view showing the principal part of the vapor deposition mask which concerns on 4th Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the vapor deposition mask which concerns on 4th Embodiment of this invention. It is a vertical front view which shows the vapor deposition mask which concerns on 5th Embodiment of this invention. It is an exploded perspective view of a vapor deposition mask concerning a 5th embodiment of the present invention. It is a top view of the vapor deposition mask based on 5th Embodiment of this invention. It is an exploded perspective view showing a modification of a vapor deposition mask concerning a 5th embodiment of the present invention.

(First Embodiment) FIGS. 1 to 10 show a vapor deposition mask according to the present invention and a method for manufacturing the same according to a first embodiment. Note that the dimensions such as thickness and width in FIGS. 1 to 10 of the present embodiment do not show the actual state, but are shown schematically. The same applies to the drawings of the following embodiments.

As shown in FIGS. 2 and 3, the vapor deposition mask 1 includes a plurality of mask bodies 2 and a reinforcing frame 3 surrounding the mask bodies 2 . The mask main body 2 is formed in a rectangular shape with rounded corners, and has a pattern forming region 4 inside. A vapor deposition pattern 6 composed of a large number of independent vapor deposition through holes 5 is formed in the pattern forming region 4 . As shown in FIG. 4, the mask body 2 is provided with a large number of joining through holes 7 along the entire circumference of the outer peripheral edge 4a of the pattern forming region 4. As shown in FIG.

The mask body 2 is formed by electroforming using an electrodeposited metal made of nickel as a material. The thickness of the mask body 2 is preferably in the range of 10 to 20 μm, and is set to 12 μm in this embodiment. The dimensions of the mask body 2 in plan view were set to 108 mm in the longitudinal direction and 62 mm in the lateral direction, and 30 mask bodies 2 were arranged in a matrix of 6 rows and 5 columns. The mask main body 2 can be made of a nickel alloy such as nickel-cobalt or other electrodeposited metal other than nickel. The vapor deposition mask 1 of this embodiment is made of organic E.
When applied to the vapor deposition mask for the L element, the vapor deposition pattern 6 is formed so as to correspond to the light emitting layer of the organic EL element.

As shown in FIG. 5 , the frame 3 includes an outer peripheral frame 10 , and a lattice frame-like vertical frame 12 and lateral frame 13 that partition the mask opening 11 within the outer peripheral frame 10 . The vertical frame 12 is provided parallel to the long sides of the mask body 2 , and the horizontal frame 13 is provided parallel to the short sides of the mask body 2 . In this embodiment, the frame 3 is made of a metal plate material having a low coefficient of linear thermal expansion and made of Invar, which is a nickel-iron alloy. 6mm
set to In plan view, the dimensions of the frame 3 were set to 460×730 mm, and the dimensions of the mask opening 11 were set to 110 mm in the longitudinal direction and 64 mm in the lateral direction. The frame 3 may be made of a nickel-iron-cobalt alloy such as Super Invar, and its thickness can be set to, for example, about 1 to 5 mm. The reason why the Invar material or the Super Invar material is used as the material for forming the frame body 3 is that its coefficient of linear thermal expansion is extremely small.
This is because the dimensional change of the mask body 2 due to the heat effect in the vapor deposition process can be well suppressed.

When the width dimension of the vertical frame 12 is W1 and the width dimension of the horizontal frame 13 is W2, the width dimension W1 of the vertical frame 12 and the width dimension W2 of the horizontal frame 13 are expressed by an inequality (W1≦W2≦W1×1. 1) is set to satisfy. In this embodiment, the width dimension W1 of the vertical frame 12 is set to 10 mm,
The width dimension W2 of the horizontal frame 13 was set to 10.64 mm. Thus, the width dimension W1 of the vertical frame 12
If the width dimension W2 of the horizontal frame 13 is set larger than that, the cross-sectional area of the horizontal frame 13 can be made larger than the cross-sectional area of the vertical frame 12, and the length of the horizontal frame 13 is smaller than the length of the vertical frame 12. Vertical frame 12
is firmly supported by the horizontal frame 13 to prevent the bending deformation of the long vertical frame 12 due to its own weight. Therefore, deformation of the frame 3 due to its own weight can be prevented, and an increase in the size of the vapor deposition mask 1 can be realized.
Furthermore, the flatness of the vapor deposition mask 1 can be maintained, and the reproducibility of the vapor deposition pattern and the vapor deposition accuracy can be improved. In addition, since the rigidity of the vertical frame 12 and the horizontal frame 13 can be made substantially uniform as a whole, when an external force that bends and deforms the vapor deposition mask 1 is applied, the external force can be evenly dispersed to eliminate local concentration. , deformation and breakage of the vapor deposition mask 1 can be effectively prevented. In addition, the width dimension W2 of the horizontal frame 13 is set to (W2≦W1×1.1), so the horizontal frame 1 is more than necessary.
The structural strength and rigidity of the frame 3 can be enhanced while suppressing the increase in the weight of the frame 3 due to the increase in the cross-sectional area of the frame 3 and eliminating the unnecessary increase in the weight of the vapor deposition mask as a whole.

As shown in FIGS. 1 and 6A, the frame 3 is composed of an upper frame 16 and a lower frame 17 which are formed to have the same thickness and the same shape. They are bonded and integrated through an adhesive layer 18 . Specifically, as shown in FIG. 6(b), the upper frame 16 and the lower frame 17 are
The frame body 3 is formed in a flat shape in a state in which the two-dimensional curved surfaces are canceled out by joining the projecting arc surfaces in a state of facing each other. The two-dimensional curved warp is a slight warp derived from the metal plate, and may be a three-dimensional curved warp. In this embodiment, the adhesive layer 18
uses a sheet-like uncured photosensitive dry film resist, and the upper frame 16 and the lower frame 1
After the bonding of 7, the adhesive layer 18 of unnecessary portions is removed. Various commercially available adhesives may be used for the adhesive layer 18 . The reason why the upper and lower frames 16 and 17 constituting the frame 3 have the same thickness is that the frame 3 is formed flat by joining them in a state in which the warpage of the two-dimensional curved surface is offset. This is for simplification. The arcuate surface may be a concave arcuate surface, or may include both. It should be noted that if the warp of the two-dimensional curved surface can be canceled and the joint can be made flat, the upper and lower frames 16 and
The thickness dimension of 17 may be different.

As described above, when the upper frame 16 and the lower frame 17 are joined in a state in which the two-dimensional curved warpages are offset to form the frame body 3 in a flat shape, a slight warp due to the metal plate material is eliminated. Therefore, it is possible to further improve the flatness, and to ensure better reproducibility and deposition accuracy of the deposited layer.

As shown in FIG. 1, in the present embodiment, a pair (plurality) of frames 3 formed by the above method are laminated, and adjacent frames 3, 3 in the lamination direction are bonded together via an adhesive layer 19. joined together.
The thickness dimension of the upper and lower frames 16 and 17 constituting the frame body 3 on the upper surface side is set to 0.3 mm, and the thickness dimension of the upper and lower frames 16 and 17 constituting the frame body 3 on the lower surface side is set to 0.3 mm. .5 mm.

In FIG. 1, reference numeral 8 denotes a metal layer formed on the upper surface of the outer peripheral edge 4a of the pattern forming region 4 of the mask body 2. As shown in FIG. The metal layer 8 is formed by laminating nickel by an electroforming method. Each mask body 2 is arranged in the mask opening 11, and the outer peripheral edge 4a of the pattern forming region 4 of the mask body 2 is inseparably and integrally joined to the frame 3 by the metal layer 8 formed by electroforming. It is As shown in FIGS. 1 and 4, the metal layer 8 includes the upper surface of the outer peripheral edge 4a of the pattern formation region 4, the upper surface of the frame 3, the side surfaces facing the pattern formation region 4, the mask main body 2, and the frame 3. A hat-shaped cross section is formed over the gap. Moreover, the metal layer 8 is also formed in the bonding through hole 7 , thereby improving the bonding strength between the mask body 2 and the frame 3 . In addition to nickel, the metal layer 8 can be formed using a nickel alloy such as nickel-cobalt, or other electrodeposited metal.

6 to 10 show a method for manufacturing the vapor deposition mask 1 according to this embodiment, in which
First, a frame forming step is performed to form the reinforcing frame 3 .

(Frame forming step)
First, a cutting step is performed in which the metal plate is cut into the sizes of the upper frame 16 and the lower frame 17 using, for example, a wire electric discharge machine having a small thermal effect on the metal plate. Next, the upper frame 16 and the lower frame 17 cut out are subjected to etching or laser processing to perform a mask opening forming step of forming a plurality of openings to be mask openings 11, as shown in FIG. 6(a). Next, as shown in FIG. 6(b), both frames 16 and 17 are joined with an adhesive layer 18 in a state in which the protruding surfaces of the upper frame 16 and the lower frame 17 derived from metal plates are opposed to each other. A joining step is performed to flatten the frame 3 in a state in which the warp of the dimensionally curved surface is cancelled. The adhesive layer 18 is made of a sheet-like uncured photosensitive dry film resist.

Next, as shown in FIG. 6(c), the upper and lower rolling rolls 2 arranged with a predetermined inter-roll dimension
A fixing process is performed in which the sheet is passed between 2 and 22 and pressed. Furthermore, the frame 3 was obtained by removing (developing) the adhesive layer 18 of unnecessary portions (portions exposed outside the mask opening 11 and the outer peripheral frame 10). Thus, the reason why the sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18 is that the uncured photosensitive dry film resist has adhesiveness, and furthermore, the primary patterning step, etc., which will be described later. However, since it is a material to be used, there is no need to separately prepare a commercially available adhesive or the like, and the manufacturing cost of the vapor deposition mask 1 can be reduced accordingly. In the cutting process, while cooling the metal plate material using a laser cutting machine, the upper and lower frames 16
・17 can also be cut out.

A pair of frames 3, 3 are manufactured from metal plates having different thicknesses by carrying out the above steps, as shown in FIG. 7(a). These frames 3.3 are laminated as shown in FIG. 7(b), and the frames 3.3
They were joined together with an adhesive layer 19 made of an uncured photosensitive dry film resist sheet. After that, as shown in FIG. 7(c), a stacking step is performed in which the film is passed between upper and lower rolling rolls 22 arranged at a predetermined distance between rolls and pressed. Thus, a pair of laminated frames 3 and 3 were obtained.

(Patterning pre-stage body forming step)
As shown in FIG. 8A, a photoresist layer 25 is formed on the surface of a conductive matrix 24 made of stainless steel or brass, for example. The photoresist layer 25 is formed by laminating one or several sheets of a negative type photosensitive dry film resist by thermocompression bonding so as to have a predetermined thickness. Next, on the photoresist layer 25, a pattern film 26 (glass mask) having light-transmitting holes 26a corresponding to the vapor deposition through holes 5 and the bonding through holes 7 (primary patterning) is adhered, and a patterning pre-stage body 27 is formed. Obtained.

(Preheating process)
The pre-patterning body 27 is preheated to the temperature in the furnace of the ultraviolet irradiating device during the exposure work, for example, by using a heater plate, a preheating furnace, or the like. In parallel with the preheating of the pre-patterning body 27, the inside of the furnace of the ultraviolet irradiation device is also preheated to the temperature in the furnace during the exposure work. Preheating in the furnace of the ultraviolet irradiation device is performed by turning on the ultraviolet lamp 28 in a state in which the irradiation target is not accommodated in the furnace, or in a state in which a dummy mold (matrix+photoresist layer+protective film) is accommodated in the furnace. The pre-patterning body 27 and the furnace are preheated to 23±3° C., for example. Incidentally, the maximum temperature in the furnace of the ultraviolet irradiation device in the exposure work is around 26.degree.

(Primary patterning process)
After preheating the furnace of the ultraviolet irradiation device and the pre-patterning body 27 is completed, the pre-patterning body 27 is housed in the furnace of the ultraviolet irradiation device, and as shown in FIG. Exposure is performed by irradiating light, and each processing of development and drying is performed. Next, by dissolving and removing the unexposed portions, as shown in FIG.
A primary pattern resist 29 having a resist body 29a corresponding to . As described above, when the inside of the furnace of the ultraviolet irradiation device and the pre-patterning body 27 are preheated to the temperature in the furnace during the exposure work, the pre-patterning body 2 is irradiated with ultraviolet rays.
7 is heated and expanded, and it is possible to eliminate the fact that the exposure work is performed while the relative positional relationship of the three members 24, 25, and 26 is deviated. Therefore, the primary pattern resist 29 can be provided on the master mold 24 with high positional accuracy and in the intended shape, which contributes to the improvement of the reproducibility of the vapor deposition layer and the vapor deposition accuracy.

(First electroforming step)
Next, the master mold 24 is placed in an electroforming tank in which the temperature of the electroforming solution is set to 40 to 50° C.,
As shown in FIG. 8(c), within the range of the height of the resist body 29a, the surface of the master mold 24 not covered with the resist body 29a is subjected to primary electroforming with an electrodeposited metal made of nickel. Electroformed layer 3
0, that is, a layer that will become the mask body 2 was formed. Next, by dissolving and removing the resist body 29a, as shown in FIG. 8(d), a mask body 2 having a vapor deposition pattern 6 composed of a large number of independent vapor deposition through-holes 5 and bonding through-holes 7 was obtained. In addition, the code|symbol 30a in FIG.8(d) is
The primary electrodeposition layer formed between the mask bodies 2 and removed in the later-described peeling process is shown.

(Activation treatment step)
As shown in FIG. 9A, a photoresist layer 3 is formed on the entire surfaces of the primary electroformed layers 30 and 30a.
3 is formed, a pattern film 34 having light-transmitting holes 34a corresponding to the peripheral portions of the joining through holes 7 is brought into close contact, placed in a furnace of an ultraviolet irradiation device, and irradiated with ultraviolet light from an ultraviolet light lamp 28. Then, the film is exposed, developed, and dried. The photoresist layer 33 here is formed by laminating one or several sheets of negative type photosensitive dry film resist by thermocompression bonding in the same manner as described above so as to have a predetermined thickness. Next, by dissolving and removing the unexposed portion of the photoresist layer 33, a pattern resist 35 having openings 35a corresponding to the peripheral portions of the bonding through-holes 7 was obtained as shown in FIG. 9(b). That is, the joint through hole 7
A pattern resist 35 is formed so that only the peripheral portion of the substrate is exposed to the surface.

Next, the portions of the primary electroformed layer 30 exposed in the openings 35a of the pattern resist 35, that is, the primary electroformed layers 30 around the bonding through-holes 7 are subjected to an activation treatment such as acid immersion or electrolytic treatment. The pattern resist 35 was dissolved and removed as shown in (c). In FIG. 9(c), reference numeral 36 indicates a portion subjected to the activation treatment. Activation treatment was applied. When the activation treatment is performed around the bonding through-hole 7 in this way, the bonding strength between the primary electroformed layer 30 and the metal layer 8 formed in the second electroforming process described later is increased compared to the case of no treatment. It can be greatly improved. A thin layer of strike nickel, matte nickel, or the like may be formed on the primary electroformed layer 30 around the bonding through hole 7 instead of the activation process described above. This also makes it possible to improve the bonding strength between the peripheral portion of the bonding through-hole 7 and the metal layer 8 .

(Secondary patterning step and frame arrangement step)
As shown in FIG. 10(a), a photoresist layer 38 is formed over the entire surface of the matrix 24 including the portions where the primary electroformed layers 30 and 30a are to be formed. This photoresist layer 38 was formed by laminating one or several sheets of negative type photosensitive dry film resist by thermocompression bonding in the same manner as described above so as to have a predetermined thickness. Next, the pattern film 39 having the light-transmitting holes 39a corresponding to the pattern forming regions 4 is brought into close contact with the pattern film 39, which is housed in the furnace of the ultraviolet irradiating device. each process.
In this state, the portion (38a) related to the pattern forming region 4 was exposed, and the remaining portions (38b) of the photoresist layer 38 were obtained (see FIG. 10(b)).

Next, as shown in FIG. 10(b), the frame 3 was arranged on the matrix 24 so as to surround the primary electroformed layer 30 while being aligned. Here, the frame 3 was temporarily fixed on the master mold 24 by utilizing the adhesiveness of the unexposed photoresist layer 38b. Further, as shown in FIG. 10(c), the unexposed photoresist layer 38b exposed on the surface is removed by dissolving, and the pattern forming region 4 is formed.
A secondary pattern resist 40 having a resist body 40a covering is formed. At this time, the unexposed photoresist layer 38b on the lower surface of the frame 3 is covered with the frame 3 and remains on the matrix 24 without being dissolved and removed.

(Second electroforming step)
The master mold 24 is placed in an electroforming bath in which the temperature condition of the electroforming solution is set to 23 ± 3 ° C., and
), the upper surface of the primary electroformed layer 30 facing the outer peripheral edge 4a of the pattern forming region 4, the surface of the frame 3, and the matrix exposed to the surface between the frame 3 and the primary electroformed layer 30 A metal layer 8 was formed by electroforming an electrodeposited metal made of nickel on the surface of the mold 24 and in the joint hole 7 . As a result, the primary electrodeposition layer 30 and the frame 3 can be inseparably and integrally joined with the metal layer 8 .

(Peeling process)
After peeling the primary electroformed layer 30 and the metal layer 8 from the master mold 24, the primary electroformed layer 30a located on the lower surface of the frame 3 was peeled from both layers 30 and 8. As shown in FIG. Finally, the deposition mask 1 shown in FIG. 3 was obtained by removing the secondary pattern resist 40 and the unexposed photoresist layer 38b.

In this embodiment, the temperature range of the electroforming liquid in the first electroforming process is set to a temperature range higher than the temperature range of the electroforming liquid in the second electroforming process. According to this, the mask body 2
It can be held against the frame 3 in such a state that a tension is applied so that a stress in the direction of shrinking inward acts on the frame. Therefore, the expansion of the mask body 2 due to temperature rise in the vapor deposition kiln can be absorbed by the tension, thereby preventing displacement of the mask body 2 with respect to the frame body 3 and generation of wrinkles due to the expansion.

(Second Embodiment) FIGS. 11 and 12 show a vapor deposition mask and a method for manufacturing the same according to a second embodiment of the present invention. In this embodiment, as shown in FIG. 11, the mask body 2 and the frame body 3
In order to prevent the frame 3 from being distorted due to the internal stress of the metal layer 8 that inseparably and integrally joins the metal layer 8, the metal layer 8 should not be formed on the upper surface of the frame 3 other than on the periphery of the mask opening 11. This embodiment is different from the first embodiment in that the metal layer 8 is divided at 1 to provide the stress relief portions 42 .

Since the frame 3 according to the first embodiment is surrounded by the metal layer 8 on three sides, that is, the top surface and both edges of the mask opening 11 that is continuous with the top surface, the metal layer 8 is formed by electroforming. In addition, if the mask is formed with internal stress, the frame 3 may be distorted due to the internal stress, and the flatness of the vapor deposition mask 1 may be adversely affected. However, by providing the stress relaxation portion 42 as in the present embodiment, the internal stress of the metal layer 8 can be relieved by the stress relaxation portion 42, thereby preventing the frame 3 from being distorted. Here, "dividing the metal layer 8" means that the metal layer 8 should not be formed so as to be connected over the entire upper surface of the frame 3, and the aspect thereof is limited to that of the present embodiment. Absent. Since other parts are the same as those of the first embodiment, the same reference numerals are given to the same members, and the description thereof will be omitted. The same applies to the following embodiments.

In the manufacturing method of the vapor deposition mask 1 according to the present embodiment, at the final stage of the frame forming step,
A step of forming a resist body 42a corresponding to the stress relaxation portion 42 on the upper surface of the frame 3 is performed, and the resist body 42a is provided on the upper surface of the frame 3. As shown in FIG. The subsequent patterning pre-stage body forming step to the secondary patterning step are shown in FIGS. 8(a) to (d), FIGS.
and the method shown in FIG. 10(a), the first electroforming step is performed in a state where the temperature range of the electroforming solution is set to 23±2°C.

(Frame arranging process)
As shown in FIG. 12( a ), a resist body 4 is formed on the matrix 24 so as to surround the primary electroformed layer 30 .
The frame 3 provided with 2a was placed while being aligned. Here, the frame 3 was temporarily fixed on the master mold 24 by utilizing the adhesiveness of the unexposed photoresist layer 38b. Furthermore, FIG. 12(b)
4, the unexposed photoresist layer 38b exposed on the surface was removed by dissolution to form a secondary pattern resist 40 having a resist body 40a covering the pattern forming region 4. As shown in FIG. At this time, the unexposed photoresist layer 38b on the lower surface of the frame 3 is covered with the frame 3 and remains on the matrix 24 without being dissolved and removed.

(Second electroforming step)
The master mold 24 is placed in an electroforming bath prepared so that the temperature of the electroforming solution is 23±3° C., and
), the upper surface of the primary electroformed layer 30 facing the outer peripheral edge 4a of the pattern forming region 4, the surface of the frame 3 not covered with the resist body 42a, the frame 3 and the primary electroformed layer 30. A metal layer 8 was formed by electroforming an electrodeposited metal made of nickel on the surface of the matrix 24 exposed on the surface between the two and the inside of the joining hole 7 . As a result, the primary electrodeposition layer 30 and the frame 3 can be inseparably and integrally joined with the metal layer 8 . In this embodiment, the temperature range of the electroforming solution used in the first electroforming process and the second electroforming process is set to be the same (23±3° C.). As a result, it is possible to prevent the primary electroformed layer 30, that is, the mask main body 2 from being thermally expanded and joined to the frame 3, thereby improving the positional accuracy of the joint position of the mask main body 2 with respect to the frame 3. It is possible to obtain a vapor deposition mask with higher reproducibility and vapor deposition accuracy of the vapor deposition layer. In both the first electroforming process and the second electroforming process, the lower the temperature of the electroforming liquid in the electroforming bath, the lower the temperature of the primary electroforming layer 3.
0 and the thermal expansion of the metal layer 8 can be suppressed as much as possible. At this time, the temperature of the electroforming liquid in the electroforming tank in the first electroforming process and the temperature of the electroforming liquid in the electroforming tank in the second electroforming process are the same or ±
3°C is more preferred.

(Peeling process)
After peeling the primary electroformed layer 30 and the metal layer 8 from the master mold 24, the primary electroformed layer 30a located on the lower surface of the frame 3 was peeled from both layers 30 and 8. As shown in FIG. Finally, by removing the secondary pattern resist 40, the resist body 42a, and the unexposed photoresist layer 38b, the vapor deposition mask 1 provided with the stress relief portion 42 shown in FIG. 11 was obtained.

(Third Embodiment) FIGS. 13 to 15 show a vapor deposition mask and a third manufacturing method thereof according to the present invention.
1 shows an embodiment. In this embodiment, as shown in FIG. 13, the frame 3 is composed of one frame 3 to reinforce the mask main body 2, and the joining through hole 7 of the mask main body 2 through which the metal layer 8 penetrates. is different from the previous first embodiment. The upper frame 16 and the lower frame 17 in this embodiment are
A 0.8 mm metal plate is used as a base material, and the frame body 3 is set to have the same thickness dimension as that of the first embodiment.

14 and 15 show a method for manufacturing the vapor deposition mask 1 according to the present embodiment. First, the frame forming step shown in FIG. 6 described in the first embodiment is performed to form a reinforcing frame. 3 is formed.

(Frame forming step)
First, a cutting step is performed in which the metal plate is cut into the sizes of the upper frame 16 and the lower frame 17 using, for example, a wire electric discharge machine having a small thermal effect on the metal plate. Next, the upper frame 16 and the lower frame 17 cut out are subjected to etching or laser processing to perform a mask opening forming step of forming a plurality of openings to be mask openings 11, as shown in FIG. 6(a). Next, as shown in FIG. 6(b), both frames 16 and 17 are joined with an adhesive layer 18 in a state in which the protruding surfaces of the upper frame 16 and the lower frame 17 derived from metal plates are opposed to each other. A joining step is performed to flatten the frame 3 in a state in which the warp of the dimensionally curved surface is cancelled. The adhesive layer 18 is made of a sheet-like uncured photosensitive dry film resist.

Next, as shown in FIG. 6(c), the upper and lower rolling rolls 2 arranged with a predetermined inter-roll dimension
A fixing process is performed in which the sheet is passed between 2 and 22 and pressed. Furthermore, the frame 3 was obtained by removing (developing) the adhesive layer 18 of unnecessary portions (portions exposed outside the mask opening 11 and the outer peripheral frame 10). Thus, the reason why the sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18 is that the uncured photosensitive dry film resist has adhesiveness, and furthermore, the primary patterning step, etc., which will be described later. However, since it is a material to be used, there is no need to separately prepare a commercially available adhesive or the like, and the manufacturing cost of the vapor deposition mask 1 can be reduced accordingly.

(Patterning pre-stage body forming step)
As shown in FIG. 14(a), a matrix 24 having conductivity, for example, made of stainless steel or brass.
A photoresist layer 25 is formed on the surface of . The photoresist layer 25 is formed by laminating one or several sheets of a negative type photosensitive dry film resist by thermocompression bonding so as to have a predetermined thickness. Next, a pattern film 26 (glass mask) having light-transmitting holes 26a corresponding to the vapor deposition holes 5 was brought into close contact with the photoresist layer 25 to obtain a patterning pre-stage body 27 .

(Preheating process)
The pre-patterning body 27 is preheated to the temperature in the furnace of the ultraviolet irradiating device during the exposure work, for example, by using a heater plate, a preheating furnace, or the like. In parallel with the preheating of the pre-patterning body 27, the inside of the furnace of the ultraviolet irradiation device is also preheated to the temperature in the furnace during the exposure work. Preheating in the furnace of the ultraviolet irradiation device is performed by turning on the ultraviolet lamp 28 in a state in which the irradiation target is not accommodated in the furnace, or in a state in which a dummy mold (matrix+photoresist layer+protective film) is accommodated in the furnace. The pre-patterning body 27 and the furnace are preheated to 23±3° C., for example. Incidentally, the maximum temperature in the furnace of the ultraviolet irradiation device in the exposure work is around 26.degree.

(Primary patterning process)
After the preheating of the furnace of the ultraviolet irradiation device and the pre-patterning body 27 is completed, the pre-patterning body 27 is housed in the furnace of the ultraviolet irradiation device, and as shown in FIG. Exposure is performed by irradiating light, and each processing of development and drying is performed. Next, by dissolving and removing the unexposed portions, a primary pattern resist 29 having resist bodies 29a corresponding to vapor deposition through holes 5 (primary patterning) is formed on the master mold 24, as shown in FIG. 14(b). bottom. As described above, when the inside of the furnace of the ultraviolet irradiation device and the pre-patterning body 27 are preheated to the furnace temperature during the exposure work, the pre-patterning body 27 is heated by the ultraviolet irradiation and expands. , it is possible to eliminate the fact that the exposure work is performed while the relative positional relationship of the three members 24, 25, and 26 is shifted. Therefore, the primary pattern resist 29 can be provided on the master mold 24 with high positional accuracy and in the intended shape, which contributes to the improvement of the reproducibility of the vapor deposition layer and the vapor deposition accuracy.

(First electroforming step)
Next, the master mold 24 is placed in an electroforming tank in which the temperature of the electroforming solution is set to 40 to 50° C.,
As shown in FIG. 14(c), within the range of the height of the resist body 29a, the surface of the matrix 24 not covered with the resist body 29a is subjected to primary electroforming with an electrodeposited metal made of nickel, and the primary An electroformed layer 30, that is, a layer that will become the mask body 2 was formed. Next, by dissolving and removing the resist body 29a, a mask body 2 having a vapor deposition pattern 6 composed of a large number of independent vapor deposition through-holes 5 was obtained as shown in FIG. 14(d).

(Secondary patterning step and frame arrangement step)
As shown in FIG. 15(a), on the entire surface of the matrix 24 including the formation portion of the primary electroformed layer 30,
A photoresist layer 38 was formed. This photoresist layer 38 was formed by laminating one or several sheets of negative type photosensitive dry film resist by thermocompression bonding in the same manner as described above so as to have a predetermined thickness. Next, the pattern film 39 having the transparent holes 39a corresponding to the pattern forming regions 4 is brought into close contact with the pattern film 39 and placed in the furnace of the ultraviolet irradiation device, and the ultraviolet lamp 28 is irradiated with ultraviolet light for exposure. In this state, a portion (38a) related to the pattern forming region 4 was exposed, and the remaining portion (38b) of the photoresist layer 38 was obtained (see FIG. 15B). Also in this embodiment, the activation treatment step is performed prior to the secondary patterning step, and the primary electroformed layer 30 forming the outer peripheral edge 4a of the pattern forming region 4 is subjected to an activation treatment such as acid immersion or electrolytic treatment. may be applied.

Next, as shown in FIG. 15(b), the frame 3 was arranged on the matrix 24 so as to surround the primary electroformed layer 30 while being aligned. Here, the frame 3 was temporarily fixed on the master mold 24 by utilizing the adhesiveness of the unexposed photoresist layer 38b. Further, as shown in FIG. 15(c), the unexposed photoresist layer 38b exposed on the surface is removed by dissolution, and the pattern formation region 4 is formed.
A secondary pattern resist 40 having a resist body 40a covering is formed. At this time, the unexposed photoresist layer 38b on the lower surface of the frame 3 is covered with the frame 3 and remains on the matrix 24 without being dissolved and removed.

(Second electroforming step)
Next, the master mold 24 is placed in an electroforming tank in which the temperature condition of the electroforming liquid is set to 23±3° C., and as shown in FIG. An electrodeposited metal made of nickel is electroformed on the upper surface of the electroformed layer 30, the surface of the frame 3, and the surface of the matrix 24 exposed between the frame 3 and the primary electroformed layer 30. metal layer 8 was formed. As a result, the primary electrodeposition layer 30 and the frame 3 can be inseparably and integrally joined with the metal layer 8 .

(Peeling process)
After peeling the primary electroformed layer 30 and the metal layer 8 from the master mold 24, the primary electroformed layer 30a located on the lower surface of the frame 3 was peeled from both layers 30 and 8. As shown in FIG. Finally, the deposition mask 1 shown in FIG. 13 was obtained by removing the secondary pattern resist 40 and the unexposed photoresist layer 38b.

(Fourth Embodiment) FIGS. 16 and 17 show a vapor deposition mask according to a fourth embodiment of the present invention and a method for manufacturing the same. In this embodiment, as shown in FIG. 16, the mask body 2 and the frame body 3
is inseparably and integrally joined with the metal layer 8, and the metal layer 8 is connected to the primary electroformed layer 3 constituting the mask body 2.
It is different from the previous embodiments in that it is integrally formed with 0. When the metal layer 8 is integrally formed with the mask body 2 in this way, it is possible to omit the trouble of separately forming the metal layer 8 and joining the mask body 2 and the frame body 3, thereby omitting the processes required for manufacturing and shortening the time. Therefore, the manufacturing cost of the vapor deposition mask 1 can be reduced.

FIG. 17 shows a manufacturing method of the vapor deposition mask 1 according to the present embodiment. 3 is formed.

(Frame forming step)
First, a cutting step is performed in which the metal plate is cut into the sizes of the upper frame 16 and the lower frame 17 using, for example, a wire electric discharge machine having a small thermal effect on the metal plate. Next, the upper frame 16 and the lower frame 17 cut out are subjected to etching or laser processing to perform a mask opening forming step of forming a plurality of openings to be mask openings 11, as shown in FIG. 6(a). Next, as shown in FIG. 6(b), both frames 16 and 17 are joined with an adhesive layer 18 in a state in which the protruding surfaces of the upper frame 16 and the lower frame 17 derived from metal plates are opposed to each other. A joining step is performed to flatten the frame 3 in a state in which the warp of the dimensionally curved surface is cancelled. The adhesive layer 18 is made of a sheet-like uncured photosensitive dry film resist.

Next, as shown in FIG. 6(c), the upper and lower rolling rolls 2 arranged with a predetermined inter-roll dimension
A fixing process is performed in which the sheet is passed between 2 and 22 and pressed. Furthermore, the frame 3 was obtained by removing (developing) the adhesive layer 18 of unnecessary portions (portions exposed outside the mask opening 11 and the outer peripheral frame 10). Thus, the reason why the sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18 is that the uncured photosensitive dry film resist has adhesiveness, and furthermore, the primary patterning step, etc., which will be described later. However, since it is a material to be used, there is no need to separately prepare a commercially available adhesive or the like, and the manufacturing cost of the vapor deposition mask 1 can be reduced accordingly.

A pair of frames 3, 3 are manufactured from metal plates having different thicknesses by carrying out the above steps, as shown in FIG. 7(a). These frames 3.3 are laminated as shown in FIG. 7(b), and the frames 3.3
They were joined together with an adhesive layer 19 made of an uncured photosensitive dry film resist sheet. After that, as shown in FIG. 7(c), a stacking step is performed in which the film is passed between upper and lower rolling rolls 22 arranged at a predetermined distance between rolls and pressed. Thus, a pair of laminated frames 3 and 3 were obtained.

(Patterning pre-stage body forming step)
As shown in FIG. 17(a), a matrix 24 having conductivity, for example, made of stainless steel or brass,
A photoresist layer 25 is formed on the surface of . The photoresist layer 25 is formed by laminating one or several sheets of a negative type photosensitive dry film resist by thermocompression bonding so as to have a predetermined thickness. Next, a pattern film 26 (glass mask) having light-transmitting holes 26a corresponding to the mask body 2 was brought into close contact with the photoresist layer 25 to obtain a patterning pre-stage body 27 .

(Preheating process)
The pre-patterning body 27 is preheated to the temperature in the furnace of the ultraviolet irradiating device during the exposure work, for example, by using a heater plate, a preheating furnace, or the like. In parallel with the preheating of the pre-patterning body 27, the inside of the furnace of the ultraviolet irradiation device is also preheated to the temperature in the furnace during the exposure work. Preheating in the furnace of the ultraviolet irradiation device is performed by turning on the ultraviolet lamp 28 in a state in which the irradiation target is not accommodated in the furnace, or in a state in which a dummy mold (matrix+photoresist layer+protective film) is accommodated in the furnace. The pre-patterning body 27 and the furnace are preheated to 23±3° C., for example. Incidentally, the maximum temperature in the furnace of the ultraviolet irradiation device in the exposure work is around 26.degree.

(Primary patterning process)
After the preheating of the furnace of the ultraviolet irradiation device and the patterning pre-stage body 27 is completed, the patterning pre-stage body 27 is housed in the furnace of the ultraviolet irradiation device, and as shown in FIG. Exposure is performed by irradiating light, and each processing of development and drying is performed. Next, by dissolving and removing the unexposed portions, a primary pattern resist 29 having a resist body 29a corresponding to the mask body 2 (primary patterning) is formed into a matrix 24, as shown in FIG. 17(b).
formed above. In this way, the inside of the furnace of the ultraviolet irradiation device and the patterning pre-stage body 27 are
When the exposure work is performed in a state in which the furnace is preheated to the temperature during the exposure work, the pre-patterning body 27 is heated by the ultraviolet irradiation and expands, and the relative positional relationship between the three members 24, 25, and 26 shifts. It is possible to eliminate the exposure work. Therefore, the primary pattern resist 29 can be provided on the matrix 24 with good positional accuracy and in the intended shape.
It can contribute to the improvement of the reproducibility of the deposition layer and the deposition accuracy.

(Frame arranging process)
As shown in FIG. 17(c), an adhesive resist 43 was formed on the entire surface of the master mold 24 including the portion where the primary pattern resist 29 was to be formed. This adhesive resist 43 is formed by laminating one or several sheets of negative type photosensitive dry film resist by thermocompression bonding in the same manner as described above so as to have a predetermined thickness. Next, the frame 3 was placed on the matrix 24 so as to surround the primary pattern resist 29 while being aligned. Here, the frame 3 was temporarily fixed on the matrix 24 by utilizing the adhesiveness of the unexposed adhesive resist 43 . Furthermore, FIG.
), the unexposed adhesive resist 43 exposed on the surface was removed by dissolution. At this time, the adhesive resist 43 on the lower surface of the frame 3 is covered with the frame 3 and remains on the matrix 24 without being dissolved and removed.

(Integrated electroforming process)
The master mold 24 is placed in an electroforming tank in which the temperature condition of the electroforming liquid is set to 23 ± 3 ° C., and
), an electrodeposited metal made of nickel was electroformed to form a metal layer 8 on the surface of the master mold 24 not covered with the resist layer 29a and the surface of the frame 3. As shown in FIG. As a result, the primary electroformed layer 30 forming the mask body 2 and the metal layer 8 joining the mask body 2 and the frame 3 can be integrally formed.

(Peeling process)
The primary electroformed layer 30, the metal layer 8, and the frame 3 are peeled off from the master mold 24, and then the adhesive resist 43 located on the lower surface of the frame 3 is removed from these layers 30 and 8. A deposition mask 1 shown in FIG. 16 was obtained.

According to the manufacturing method of the fourth embodiment, it is possible to increase the rigidity of the frame body 3 in the same manner as described above, while saving time and labor for forming the metal layer 8 and omitting the steps required for manufacturing. Therefore,
It is possible to obtain a vapor deposition mask 1 that can be enlarged while suppressing an increase in manufacturing cost, maintain flatness, and ensure good reproducibility and vapor deposition accuracy of the vapor deposition layer.

(Fifth Embodiment) FIGS. 18 to 20 show a fifth embodiment of the vapor deposition mask according to the present invention. The vapor deposition mask 1 in this embodiment includes a support frame 46 fixed to the lower surface of the frame 3 and an auxiliary frame 47 fixed to the lower surface of the support frame 46, as shown in FIG. The outer shape of the support frame 46 and the auxiliary frame 47 matches the frame 3 . As shown in FIGS. 19 and 20, the support frame 46 is formed with a frame opening 48 corresponding to the mask opening 11 of the frame 3, and the frame opening 48 is formed in an opening shape that is one size larger than the mask opening 11. It is The entire vertical frame 12 and horizontal frame 13 of the frame 3 are supported by a support frame 46 . Furthermore, the auxiliary frame 47 is formed in a picture frame shape,
Four peripheral edges of the support frame 46 are supported by auxiliary frames 47 . After the vapor deposition mask 1, the support frame 46, and the auxiliary frame 47 are aligned with each other, the triplets 1 and 46 are assembled.
・By spot-welding 47, they are joined and integrated. Weld point 4 of spot welding
9 are provided at the four corners and at the four peripheral edge portions on the extension lines of the vertical frame 12 and the horizontal frame 13 (
See Figure 20).

As described above, the support frame 46 supports the entire vertical frame 12 and horizontal frame 13 of the frame 3,
Furthermore, by supporting the four peripheral edges of the support frame 46 with the auxiliary frame 47, the structural strength and rigidity of the entire vapor deposition mask can be further enhanced, and the vapor deposition mask 1 can be prevented from bending and deformed to maintain its flatness. , the reproducibility of the deposition layer and the deposition accuracy can be further improved.

FIG. 21 shows a modification of the vapor deposition mask according to the fifth embodiment of the present invention. In this embodiment, the deposition mask 1 has ten mask bodies 2 arranged in a matrix of two rows and five columns. Three vapor deposition masks 1 were manufactured, and these three vapor deposition masks 1 were supported by a support frame 46 and an auxiliary frame 47 . Specifically, first, one vapor deposition mask 1 is prepared and fixed to the support frame 46 after adjusting the position and tension. Such fixation is performed by spot-welding the corners of the frame 3 and the peripheral portions on the extension lines of the vertical frame 12 and the horizontal frame 13 . The remaining two vapor deposition masks 1 are also fixed to the support frame 46 in the same manner. Finally, an auxiliary frame 47 is fixed (spot welded) to the side of the support frame 46 opposite to the side to which the vapor deposition mask 1 is fixed. With this configuration in which a plurality of vapor deposition masks 1 are supported by the support frame 46 and the auxiliary frame 47, the relative positions of the adjacent vapor deposition masks 1 can be finely adjusted. The relative positional accuracy of the mask body 2 can be improved. Therefore, good reproducibility and vapor deposition accuracy can be ensured. In addition, the vapor deposition mask 1 having a desired size can be freely set.

As described above, in the vapor deposition mask and the vapor deposition mask manufacturing method of each of the above embodiments,
Since the frame 3 is composed of the upper frame 16 and the lower frame 17, and the upper and lower frames 16 and 17 are joined and integrated through the adhesive layer 18, the frame 3 having the same thickness as the conventional one can be formed. , the frame 3 can be formed using a thinner metal plate, and the plate thickness deviation of the entire frame 3 can be reduced. As a result, even with a large vapor deposition mask 1, it is possible to suppress the occurrence of distortion due to thermal expansion resulting from the plate thickness deviation of the metal plate material. In addition, since the base material is only a thin metal plate material that is generally distributed,
There is no need to form the frame body 3 using a dedicated metal plate material. As described above, according to the vapor deposition mask of each of the above-described embodiments, it is possible to increase the size of the vapor deposition mask 1 while suppressing an increase in manufacturing cost, and furthermore, the flatness of the vapor deposition mask 1 can be maintained, and good reproduction can be achieved. Accuracy and deposition accuracy can be secured. Further, according to the frame 3 in which the adhesive layer 18 is interposed between the upper frame 16 and the lower frame 17,
When an external force that causes bending deformation is applied to the vapor deposition mask 1, the frame body 3 is expanded by the amount of the adhesive layer 18.
flexibly and elastically deforms to effectively prevent the vapor deposition mask 1 from being damaged.

Moreover, in the vapor deposition masks of the first, second, fourth, and fifth embodiments, the plurality of frames 3
3 are laminated and the frames 3 adjacent in the lamination direction are joined together via the adhesive layer 19, so that even thinner metal plates can be used when forming the frame 3 with the same thickness as the conventional one. Since the frame 3 can be formed, it is possible to further suppress the occurrence of strain due to thermal expansion resulting from the plate thickness deviation of the metal plate.

As in each of the above-described embodiments, the number and arrangement of the mask bodies 2 included in the vapor deposition mask 1 are not limited to those shown in the above-described embodiments. Moreover, the number of mask bodies 2 does not need to be plural and may be one. Prior to the process of joining the upper and lower frames 16 and 17, the upper and lower frames 16 and 17 cut out are press-worked using upper and lower molds for imparting curved surfaces to impart two-dimensional curved surfaces or three-dimensional curved surfaces. can be done. In this case, by providing a two-dimensional curved surface or a three-dimensional curved surface having a line-symmetrical relationship, it is possible to easily form the frame body 3 in a flat shape in the subsequent joining step. The primary electroformed layer 30 and the metal layer 8 may have a two-layer structure of bright nickel and matte nickel electroformed thereon. In this case, the bright nickel is less likely to stick to the matrix 24, and the process of removing the vapor deposition mask 1 from the matrix 24 in the manufacturing process can proceed with good work efficiency.

1 Deposition Mask 2 Mask Main Body 3 Frame 4 Pattern Forming Area 4a Peripheral Edge 5 Vapor Deposition Through Hole 6 Deposition Pattern 8 Metal Layer 10 Peripheral Frame 11 Mask Opening 12 Vertical Frame 13 Horizontal Frame 16 Upper Frame 17 Lower Frame 18 Adhesive Layer 19 Adhesive Layer 24 matrix 25 photoresist layer 26 pattern film 26a transparent hole 27 patterning pre-stage body 29 primary pattern resist 29a resist body 30 primary electroforming layer 43 adhesive resist 46 support frame 47 auxiliary frame 48 frame opening W1 width dimension of vertical frame W2 Width of horizontal frame

Claims (6)

A frame composed of an upper frame (16) and a lower frame (17),
The upper frame (16) and the lower frame (17) are made of a metal material with a low coefficient of linear thermal expansion,
A frame body, characterized in that an upper frame (16) and a lower frame (17) are joined via an adhesive layer (18). It comprises an outer peripheral frame (10), and a grid frame-like vertical frame (12) and horizontal frame (13) that partition a plurality of mask openings (11) in the outer peripheral frame (10),
When the width dimension of the vertical frame (12) is (W1) and the width dimension of the horizontal frame (13) is (W2), the width of the horizontal frame (13) is greater than the width dimension (W1) of the vertical frame (12). The frame according to claim 1, characterized in that the dimension (W2) is set large. The width dimension (W1) of the vertical frame (12) and the width dimension (W2) of the horizontal frame (13) are set so as to satisfy the inequality (W1<W2≤W1×1.1). The frame according to claim 2. 4. The frame according to any one of claims 1 to 3, characterized in that a plurality of frames are laminated, and adjacent frames in the lamination direction are joined together via an adhesive layer (19). 5. The frame according to claim 4, wherein a pair of frames are stacked, and the thickness of the upper frame is set smaller than the thickness of the lower frame. 6. The frame according to any one of claims 1 to 5, wherein the upper frame (16) and the lower frame (17) are joined together with their projecting arc surfaces or concave arc surfaces facing each other.

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