JP2024021894A - High pressure water cutting device and cutting method of brittle material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high pressure water cutting device and a cutting method of a brittle material which can prevent the occurrence of cracking and the like of a brittle material by easily applying an adhesive to a rear surface and/or side surface of the brittle material.

SOLUTION: A high pressure water cutting device comprises: a nozzle head 2 which jets high pressure water supplied from a high pressure water supply device 1 from a nozzle 2a; a catcher 3 in which a lattice-like thin plate is arranged; and a workpiece fixing part 5 which fixes a brittle material W. An adhesive is applied to a rear surface and/or side surface of the brittle material W.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a high-pressure water cutting device and a method for cutting brittle materials.

Conventionally, various raw materials have been subjected to processing such as cutting and drilling using high-pressure water supplied from a high-pressure water supply device (for example, a high-pressure pump). In addition, when processing brittle materials (workpieces) such as glass or semiconductor raw materials, there are methods such as temporary processing using high-pressure water in a low pressure range, and then secondary processing using high-pressure water in a higher pressure range. was used (piercing process). However, even if such a processing method is adopted, brittle materials still exist, so intensive studies have been made.

For example, in Patent Document 1, when dicing semiconductor wafers and semiconductor-related materials with a water jet laser, chips can be diced by using a pressure-sensitive adhesive sheet for water-jet laser dicing in which a pressure-sensitive adhesive layer is laminated on a base film. Alternatively, a method for preventing defects such as chipping (cracking, chipping) during peeling of IC parts and the like has been disclosed.

Japanese Patent Application Publication No. 2008-060170

In the above-mentioned Patent Document 1, it is necessary to attach an adhesive sheet (dicing sheet) between the workpiece and the work table, which requires time and effort for attachment and a process (labor) for disposal after processing.
Semiconductor and glass materials that serve as workpieces tend to become thinner, so there has been a need for equipment and methods that can more easily perform the preparation process.

Furthermore, in the case of brittle materials, vibration of the brittle material can lead to deterioration of processing accuracy, so there has been a need for devices and methods that are free from the effects of vibration as much as possible.

Therefore, the present invention provides a high-pressure water cutting device and a method for cutting brittle materials that can prevent cracking of brittle materials by simply applying adhesive to the back and/or side surfaces of brittle materials. The issue is that.

In order to solve the above problems, the high-pressure water cutting device of the present invention includes a nozzle head that injects high-pressure water supplied from a high-pressure water supply device from a nozzle, a catcher in which a grid-like thin plate is arranged, and a brittle material that is fixed. A workpiece fixing part is provided, and an adhesive is applied to the back surface and/or side surface of the brittle material.

In order to solve the above problems, processing and cutting of a brittle material according to the present invention includes a step of applying an adhesive to the back side and/or side surface of the brittle material, a step of spraying high pressure water on the brittle material and cutting it, and a step of cutting the brittle material. (W) removing the adhesive adhered to the surface.

To provide a high-pressure water cutting device capable of preventing cracking of a brittle material by simply applying an adhesive to the back surface and/or side surface of the brittle material, and to process and cut the brittle material.

Schematic diagram of the high-pressure water cutting device of this embodiment (a) Cross-sectional view and (b) schematic diagram of the workpiece fixing part of this embodiment A schematic diagram of a modification of the high-pressure water cutting device of this embodiment (a) Cross-sectional view and (b) schematic diagram of a modified example of the workpiece fixing part of this embodiment Top views of modified examples of the work table of this embodiment (a) when the diameter is expanded and (b) when the diameter is reduced A schematic diagram of a modified example of the work table and work table support plate of this embodiment Flow of the method for cutting brittle materials according to this embodiment A schematic diagram showing the trajectory of the brittle material cutting method of this embodiment (a) Top view, (b) side view, (c) bottom view of the brittle material with the adhesive of this embodiment applied

Next, embodiments of the present invention will be described with reference to the drawings as appropriate.

(Configuration of high pressure water cutting device)
The high-pressure water cutting device 1 of this embodiment processes a brittle material W. There are a wide variety of brittle materials W such as ceramics and glass. The high-pressure water cutting device 1 includes a high-pressure water supply device P, an abrasive supply device A, a nozzle head 2, a catcher 3, a work fixing section 5, and a control section 20.

The high-pressure water supply device P is a pump that generates high-pressure water Q. The high-pressure water supply device P can pressurize high-pressure water within a range of 10 to 300 MPa. Specifically, a plunger pump or the like is desirable.

The abrasive supply device A is a part that supplies the abrasive AB to the nozzle head 2 by force-feeding the abrasive AB. The high-pressure water Q supplied from the high-pressure water supply device P and the abrasive AB supplied from the abrasive supply device A are mixed and sprayed from the nozzle 2a. The abrasive AB may be one having hardness such as sapphire, and the particle size can be changed as appropriate.

The nozzle head 2 injects high-pressure water Q supplied from a high-pressure water supply device P and abrasives supplied from an abrasive supply device A from a nozzle 2a. The nozzle head 2 can be moved in the XYZ directions by a movement mechanism that realizes two-dimensional and three-dimensional movements such as the X-axis, Y-axis, and Z-axis.

The catcher 3 has a brittle material W placed inside and collects chips and the like after processing. Although not shown in this specification, the catcher 3 can be filled with water by connecting a liquid supply pump. By processing the brittle material W under water, the influence of heat can be reduced, leading to a reduction in the load on the brittle material during processing.

Furthermore, a lattice-shaped thin plate 4 is arranged inside the catcher 3. The high-pressure water Q is sprayed downward, but if it collides with a surface, that surface will be damaged. By using the grid-like thin plate 4, damage to the device due to the high pressure water Q can be prevented. The thickness and number of the thin plates 4 are such that the high-pressure water Q can escape, and the thin plates 4 are arranged at equal intervals on the left and right sides. Further, since the high-pressure water Q contains an abrasive, it is desirable to use a metal material with high hardness so that damage to the thin plate 4 can be avoided as much as possible.

The workpiece fixing section 5 fixes the brittle material W. The workpiece fixing section 5 includes a workbench 6, a workbench support plate 7, and a fastener 8.

The work table 6 is arranged on the upper surface of the thin plate 4, and a brittle material W is placed thereon. The work table 6 is a cylindrical member. Note that if the shape of the brittle material W is a polygon, for example, a quadrangle or a pentagon, the shape of the work table 6 may also be a polygon. Moreover, since the brittle material W is processed gradually from the outer circumferential direction, it is desirable that the work table 6 has a diameter smaller than that of the brittle material W, and further smaller than the processing dimensions.

As a modification of the work table 6, as shown in FIGS. 5(a) and 5(b), the outer diameter may be adjusted according to the size of the brittle material W.
A modification of the work table 6 includes a work table main body 6b, an outer diameter adjuster 6c, and a work table outer shell 6d. The work table body 6b is a member placed at the center of the brittle material W. The outer diameter adjuster 6c is a member that is connected to the side surface of the work table main body 6b and whose length is adjusted using a screw, a spring, or the like. In addition, a pantograph structure can also be adopted. The work table outer shell 6d is a member that is connected to the outer diameter adjuster 6c and on which the outer peripheral edge of the lower surface of the brittle material W is placed. The shape of the work table outer shell 6d is not limited to a semicircular arc shape (crescent shape), but may also be a cylindrical shape or a polygonal shape.

As shown in FIG. 5(a), when the outer diameter adjuster 6c is in a long state, the work table outer shell 6d connected to the tip of the outer diameter adjuster 6c expands in diameter, causing the brittle material W It can be set so that it can be easily placed when it is large. Further, as shown in FIG. 5(b), when the outer diameter adjuster 6c becomes short, the diameter of the worktable outer shell 6d connected to the tip of the outer diameter adjuster 6c is reduced, causing brittleness. It can be set so that it can be easily placed when the material W is small.

The work table support plate 7 is arranged on the lower surface of the thin plate 4. Since the high-pressure water Q jetted from the nozzle 2a is jetted so as to pass through the thin plate 4, the worktable support plate 7 is desirably smaller than the outer diameter of the worktable 6. Unlike the work table 6, it is not a plate on which the brittle material W is placed, but is a fixed plate, so by forming passage holes inside and adopting a honeycomb structure, weight reduction and passage performance are improved. You can also do so.

As a modification of the work table 6 and the work table support plate 7, as shown in FIG. 6, a work table fixing claw 6e and a work support plate fixing claw 7a are arranged on the work table 6 and the work table support plate 7, respectively.
The work table 6 and the work table support plate 7 are fastened together with the thin plate 4 in between, but in order to suppress positional deviation and vibration, the thin plate 4 is temporarily held by the work table fixing claw 6e and the work support plate fixing claw 7a. After fixing, secondary fixing is performed using fasteners 8. The work table fixing claw 6e and the work support plate fixing claw 7a may have a claw shape that can be hooked onto the thin plate 4, or a shape that can be folded inward.

The fastener 8 fixes the work table 6 and the work table support plate 7 by tightening them. For example, the work table support column 6a fixed or connected below the work table 6 and the fastener 8 are formed with male and female threads to adjust the fastening. In addition, the fastener 8 can be changed as appropriate depending on the fastening force by appropriately selecting a screw, a spring, a cylinder, or the like.
Note that the number of fasteners 8 is set according to the number of work platform supports 6a and the fastening force. The workbench supports 6a are rod-shaped members, and the number can be set as appropriate, such as from 2 to 10.

In addition, when cutting the brittle material W, the upper surface of the thin plate 4 is placed so that the cut-off brittle material W (unnecessary material) does not collide with the main body of the brittle material W (after processing) and have an adverse effect. , the support guide 9 can be arranged so as to surround the outer periphery of the brittle material W. By creating a structure in which the cut-off brittle material W (unnecessary material) falls onto the support guide 9 and then falls downward, when the brittle material W is cut off (peeled off from the brittle material W main body), due to gravity and weight, It is possible to prevent cracks from occurring. The shape of the support guide 9 can be selected from not only a cylindrical shape but also a polygonal shape, a rod shape, etc. Further, below the support guide 9, a support guide column 9a is arranged. The support guide columns 9a are rod-shaped members, and the number can be set as appropriate, such as from 2 to 10.

The support guide 9 disposed on the upper surface of the thin plate 4 and the support guide support plate 10 disposed on the lower surface of the thin plate 4 are fixed by tightening with a support guide fastener 11.
The support guide 9 and the support guide support plate 10, like the work table 6 and the work support plate, can also adjust the diameter according to the size of the brittle material W and improve the tightening force function.

By arranging the support guide 9, it becomes possible to specify a location in the catcher 3 where chips of the brittle material W after processing fall downward. Further, in order to smooth the flow of water around the lower part of the support guide 9, a promoter for promoting the direction of the flow velocity within the catcher 3 or a recovery device connected to the outside of the catcher 3 may be disposed. As a result, chips of the brittle material W can be collected efficiently.

The control unit 20 controls the pressure, speed, etc. of the high-pressure water Q supplied by the high-pressure water supply device P. Further, the control unit 20 has a numerical control function, and cuts the brittle material W according to rotation, angle, speed, etc. set in advance or in real time. Specifically, as shown by the cutting line L in FIG. 8, the nozzle head 2 (nozzle 2a) moves from above the brittle material W to the outer peripheral edge of the brittle material W, and repeats arc-shaped curved surface processing. This allows the brittle material W to be cut smoothly. When contacting the brittle material W, the nozzle head 2 (nozzle 2a) starts cutting the brittle material W from an oblique direction while moving in a curved manner. After starting cutting, the nozzle head 2 (nozzle 2a) moves in a curved manner along the outer periphery of the columnar brittle material W to perform cutting in an arc shape. Also, when passing through the point where cutting is started or the point where cutting of the brittle material W is finished, the nozzle head 2 (nozzle 2a) moves in an arc shape while making a curved movement.

When cutting in a straight line, the high-pressure water Q must remain in the same position while moving, and by applying a curved surface processing to flow like a single stroke, the effect on the brittle material W can be reduced. . In addition to such curved surface machining, the pressure of high-pressure water Q is set to be low until the high-pressure water Q first comes into contact with the brittle material W, as in piercing machining, and once the cutting is on track, the high-pressure water It is also possible to set the pressure of water Q higher.

Further, as shown in FIGS. 9(a) to 9(c), adhesive B is applied to the back surface and/or side surface of the brittle material W. 9(a) is a top view of the brittle material W with adhesive B applied, FIG. 9(b) is a side view of the brittle material W with adhesive B applied, and FIG. 9(c) is a top view of the brittle material W with adhesive B applied. , is a bottom view of the brittle material W with adhesive B applied thereto. Adhesive B is applied to the back surface of the brittle material W so as to uniformly cover it. The adhesive B is applied to the side surface of the brittle material W within a range of an adhesive application height H2 relative to the brittle material height H1. The adhesive application height H2 is 1/2 or less, preferably 1/3 or less of the brittle material height H1. The thickness of adhesive B is desirably 5 mm or less.

If the brittle material W is a brittle member, there is a possibility that cracking may occur due to the high pressure water Q, but by applying adhesive B to the brittle material W, it is possible to avoid using something like dicing tape. Cost reduction and labor simplification can be achieved.

The adhesive B is preferably an epoxy adhesive or acrylic adhesive that does not cause peeling or shifting during processing and has excellent mechanical properties, electrical properties, and durability.
As the epoxy adhesive, it is desirable to use a commercially available adhesive. For example, you can use either a two-component epoxy adhesive, which can be used in liquid form, and which mixes a separate epoxy resin and a hardening agent, or a one-component epoxy adhesive, which mixes an epoxy resin and a hardening agent. .
As the acrylic adhesive, it is desirable to use a commercially available adhesive. For example, you can use either a two-component epoxy adhesive that can be used in liquid form, which is a mixture of a separate acrylic resin and a hardening agent, or a one-component acrylic adhesive that is a mixture of an acrylic resin and a hardening agent. .

A method for cutting a brittle material according to this embodiment will be explained.

Preparatory work for fixing the brittle material W is performed. A work fixing part 5 is placed on top of a thin plate 4 placed inside a catcher 3 of a high-pressure water cutting device 1. After that, an adhesive B such as an epoxy adhesive or an acrylic adhesive is applied to the back surface and/or side surface of the brittle material W (S1). Thereafter, the brittle material W is placed on the work table 6.

The range of adhesive B applied to the brittle material W is as shown in FIGS. 9(a) to 9(c). Adhesive B is applied to the side surface of W in an adhesive application height H2 relative to the brittle material height H1. The adhesive application height H2 is 1/2 or less, preferably 1/3 or less of the brittle material height H1. The thickness of adhesive B is desirably 5 mm or less.

The high-pressure water supply device P and the abrasive supply device A are operated, and the high-pressure water cutting device 1 is prepared. The nozzle head 2 is moved close to the brittle material W, and high-pressure water Q mixed with an abrasive is sprayed. The jetting pressure of the high-pressure water Q is adjusted by jetting high-pressure water Q mixed with an abrasive before cutting near the brittle material W.

High-pressure water Q mixed with an abrasive is jetted onto the brittle material W to cut it (S2). In the cutting step S2, as shown by the cutting line L in FIG. By repeating this, the brittle material W can be cut smoothly. When contacting the brittle material W, the nozzle head 2 (nozzle 2a) starts cutting the brittle material W from an oblique direction while moving in a curved manner. After starting cutting, the nozzle head 2 (nozzle 2a) moves in a curved manner along the outer periphery of the columnar brittle material W to perform cutting in an arc shape. Also, when passing through the point where cutting is started or the point where cutting of the brittle material W is finished, the nozzle head 2 (nozzle 2a) moves in an arc shape while making a curved movement.

When cutting in a straight line, the high-pressure water Q must remain in the same position while moving, and by applying a curved surface processing to flow like a single stroke, the effect on the brittle material W can be reduced. . In addition to such curved surface machining, the pressure of high-pressure water Q is set to be low until the high-pressure water Q first comes into contact with the brittle material W, as in piercing machining, and once the cutting is on track, the high-pressure water It is also possible to set the pressure of water Q higher.

After cutting is completed, the brittle material W placed on the work table 6 is removed, and the adhesive B adhering to the brittle material W is removed (S3).

As mentioned above, it goes without saying that the present invention is not limited to the embodiments described above, and that the present invention can be modified as appropriate without departing from the spirit thereof.

1 High-pressure water cutting device 2 Nozzle head 2a Nozzle 3 Catcher 4 Thin plate 5 Work fixing part 6 Work stand 7 Work stand support plate 8 Work stand fastener 9 Support guide 10 Support guide support plate 11 Support guide fastener 20 Control part B Adhesive

Claims (8)

It has a nozzle head that injects high-pressure water supplied from a high-pressure water supply device from a nozzle, a catcher in which a grid-like thin plate is arranged, and a workpiece fixing part that fixes a brittle material, / High pressure water cutting equipment with adhesive applied to the sides. The work fixing part is arranged on the upper surface of the thin plate, and tightens the work table on which the brittle material is placed, the work table support plate arranged on the lower surface of the thin plate, and the work table and the work table support plate. The high-pressure water cutting device according to claim 1, further comprising a work table fastener. The high-pressure water cutting device according to claim 1 or 2, further comprising a support guide disposed on the upper surface of the thin plate so as to surround the outer periphery of the brittle material. The high-pressure water cutting device according to claim 1, further comprising a support guide support plate disposed on the lower surface of the thin plate, and a support guide fastener that tightens the support guide and the support guide support plate. The high-pressure water cutting device according to claim 1, wherein the adhesive is an epoxy adhesive or an acrylic adhesive. A brittle material comprising the steps of applying an adhesive to the back and/or side surfaces of the brittle material, spraying high-pressure water onto the brittle material to cut it, and removing the adhesive adhered to the brittle material. How to cut the material. 7. The method for cutting a brittle material according to claim 6, wherein in the cutting step, arc-shaped curved surface processing is repeated on the outer peripheral edge of the brittle material. 7. The method for cutting a brittle material according to claim 6, wherein the adhesive is an epoxy adhesive or an acrylic adhesive.

Images