JP2024018430A - レーザ加工装置、レーザ加工装置の制御方法およびプログラム - Google Patents

レーザ加工装置、レーザ加工装置の制御方法およびプログラム Download PDF

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Publication number
JP2024018430A
JP2024018430A JP2022121775A JP2022121775A JP2024018430A JP 2024018430 A JP2024018430 A JP 2024018430A JP 2022121775 A JP2022121775 A JP 2022121775A JP 2022121775 A JP2022121775 A JP 2022121775A JP 2024018430 A JP2024018430 A JP 2024018430A
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JP
Japan
Prior art keywords
light
pulse
seed
light source
pulses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022121775A
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English (en)
Japanese (ja)
Inventor
直毅 吉武
Naoki Yoshitake
忠正 横井
Tadamasa Yokoi
豊 加藤
Yutaka Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Priority to JP2022121775A priority Critical patent/JP2024018430A/ja
Priority to PCT/JP2023/024339 priority patent/WO2024024388A1/fr
Publication of JP2024018430A publication Critical patent/JP2024018430A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067—Fibre lasers

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)
JP2022121775A 2022-07-29 2022-07-29 レーザ加工装置、レーザ加工装置の制御方法およびプログラム Pending JP2024018430A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022121775A JP2024018430A (ja) 2022-07-29 2022-07-29 レーザ加工装置、レーザ加工装置の制御方法およびプログラム
PCT/JP2023/024339 WO2024024388A1 (fr) 2022-07-29 2023-06-30 Dispositif d'usinage au laser ainsi que procédé et programme de commande pour dispositif d'usinage au laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022121775A JP2024018430A (ja) 2022-07-29 2022-07-29 レーザ加工装置、レーザ加工装置の制御方法およびプログラム

Publications (1)

Publication Number Publication Date
JP2024018430A true JP2024018430A (ja) 2024-02-08

Family

ID=89706232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022121775A Pending JP2024018430A (ja) 2022-07-29 2022-07-29 レーザ加工装置、レーザ加工装置の制御方法およびプログラム

Country Status (2)

Country Link
JP (1) JP2024018430A (fr)
WO (1) WO2024024388A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7505196B2 (en) * 2004-03-31 2009-03-17 Imra America, Inc. Method and apparatus for controlling and protecting pulsed high power fiber amplifier systems
JP5724173B2 (ja) * 2009-11-16 2015-05-27 オムロン株式会社 レーザ加工装置およびレーザ加工方法
JP5251902B2 (ja) * 2010-03-02 2013-07-31 オムロン株式会社 レーザ加工装置
US11081855B2 (en) * 2018-06-18 2021-08-03 Coherent, Inc. Laser-MOPA with burst-mode control

Also Published As

Publication number Publication date
WO2024024388A1 (fr) 2024-02-01

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