JP2024017384A - Holding member, cutting device, and manufacturing method for cut-off product - Google Patents

Holding member, cutting device, and manufacturing method for cut-off product Download PDF

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JP2024017384A
JP2024017384A JP2022119983A JP2022119983A JP2024017384A JP 2024017384 A JP2024017384 A JP 2024017384A JP 2022119983 A JP2022119983 A JP 2022119983A JP 2022119983 A JP2022119983 A JP 2022119983A JP 2024017384 A JP2024017384 A JP 2024017384A
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cut
cutting
holding member
convex portion
cutting device
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哲也 山田
Tetsuya Yamada
雅浩 岩井
Masahiro Iwai
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Towa Corp
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Towa Corp
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Priority to JP2022119983A priority Critical patent/JP2024017384A/en
Priority to TW112113214A priority patent/TW202405916A/en
Priority to CN202310601370.XA priority patent/CN117476536A/en
Priority to KR1020230079961A priority patent/KR20240015565A/en
Publication of JP2024017384A publication Critical patent/JP2024017384A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
  • Details Of Cutting Devices (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a holding member capable of suppressing or preventing scattering of end material caused by cutting an object to be cut.
SOLUTION: A holding member 2X is for holding a to-be-cut object W. The holding member 2X includes convex portions 20a, 20b and a table 2 for holding the to-be-cut object. The convex portions 20a, 20b are provided in a portion around a position for holding the to-be-cut object W on a surface of the side that holds the to-be-cut object W of the table 2. The heights of the convex portions 20a, 20b are lower than the height of the to-be-cut object W held on the table 2.
SELECTED DRAWING: Figure 1
COPYRIGHT: (C)2024,JPO&INPIT

Description

本発明は、保持部材、切断装置、及び切断品の製造方法に関する。 The present invention relates to a holding member, a cutting device, and a method for manufacturing a cut product.

半導体チップを樹脂封止した樹脂成形品を製造する場合等において、パッケージ基板等の切断対象物を、切断装置（切削装置）により切断することがある（特許文献１等）。 In the case of manufacturing a resin molded product in which a semiconductor chip is sealed with resin, an object to be cut, such as a package substrate, may be cut by a cutting device (cutting device) (see Patent Document 1, etc.).

特開２０１６－１７８１０６号公報Japanese Patent Application Publication No. 2016-178106

図７の平面図に、切断装置の一例を示す。なお、同図では、説明の便宜のため、切断装置の一部のみを図示している。図７（ａ）に示すとおり、この切断装置は、切断対象物Ｗを保持するための保持部材（テーブル）２を有し、さらに、保護カバー１０と、端材収容部１１と、ＣＣＳブロック１３と、スライド部材１４とを含む。スライド部材１４は、スライド部材１４を移動させる移動機構（図示せず）により、水平方向の一方向に往復移動可能である。スライド部材１４が移動可能な方向は、同図では、矢印で図示したＹ軸方向（すなわち、図の上下方向）となる。スライド部材１４は、保護カバー１０の上に保持されている。保護カバー１０は、スライド部材１４を移動させる前述の移動機構を覆っており、その移動機構を保護している。また、保護カバー１０は、蛇腹構造を有し、スライド部材１４の移動とともに図示の上下方向に伸縮可能である。端材収容部１１は、保護カバー１０の一端（図の下端）に設けられ、切断対象物Ｗの切断により生じた端材Ｔを収容可能である。スライド部材１４が最も端材収容部１１側に移動した状態では、スライド部材１４の端部は、最も端材収容部１１側に位置する保護カバー１０の上面又はそれよりも端材収容部１１側に位置することになる。すなわち、この状態では、スライド部材１４は、保護カバー１０の上面全体又は略全体を覆うことになる。保持部材２は、スライド部材１４の上面に固定され、スライド部材１４とともに移動する。保持部材２は、その上面において、切断対象物Ｗを載置して保持可能である。切断装置は、例えば、切断対象物Ｗを切断するための回転刃（ブレード）を有する切断機構（図示せず）をＹ軸方向（図の上下方向）に移動させて、切断対象物Ｗを切断できる。また、切断装置は、例えば、スライド部材１４をＹ軸方向に移動させることにより、切断対象物Ｗを切断機構（ブレードを含む）に対し相対的に移動させることによっても、切断対象物Ｗを切断できる。また、切断装置は、スライド部材１４をＹ軸方向に移動させることにより、例えば、カバー部材１０の上に流された端材（図７（ａ）では図示せず）を押し出して、端材収容部１１内に落下させ収容することができる。ＣＣＳブロック１３は、スライド部材１４の上面に固定され、保持部材２に隣接して配置されている。例えば、切断対象物Ｗの切断に先立ち、切断対象物Ｗを切断するための回転刃（ブレード）をＣＣＳブロック１３に接触させることで、回転刃（ブレード）の高さを制御できる。 An example of a cutting device is shown in the plan view of FIG. In addition, in the figure, only a part of the cutting device is illustrated for convenience of explanation. As shown in FIG. 7(a), this cutting device has a holding member (table) 2 for holding the object W to be cut, and further includes a protective cover 10, a scrap storage section 11, and a CCS block 13. and a slide member 14. The slide member 14 can be reciprocated in one horizontal direction by a moving mechanism (not shown) that moves the slide member 14. In the figure, the direction in which the slide member 14 can move is the Y-axis direction (that is, the vertical direction in the figure) indicated by the arrow. The slide member 14 is held on the protective cover 10. The protective cover 10 covers the aforementioned moving mechanism that moves the slide member 14, and protects the moving mechanism. Further, the protective cover 10 has a bellows structure and can be expanded and contracted in the illustrated vertical direction as the slide member 14 moves. The scrap storage section 11 is provided at one end (lower end in the figure) of the protective cover 10 and can accommodate scraps T produced by cutting the object W to be cut. In the state where the slide member 14 has moved furthest toward the scraps storage section 11 side, the end of the slide member 14 is located on the upper surface of the protective cover 10 located closest to the scraps storage section 11 side or closer to the scraps storage section 11 side. It will be located in That is, in this state, the slide member 14 covers the entire or substantially entire upper surface of the protective cover 10. The holding member 2 is fixed to the upper surface of the slide member 14 and moves together with the slide member 14. The holding member 2 can place and hold the object W to be cut on its upper surface. For example, the cutting device cuts the object W by moving a cutting mechanism (not shown) having a rotary blade for cutting the object W in the Y-axis direction (up and down direction in the figure). can. The cutting device also cuts the object W by moving the object W to be cut relative to the cutting mechanism (including the blade), for example, by moving the slide member 14 in the Y-axis direction. can. Further, by moving the slide member 14 in the Y-axis direction, the cutting device, for example, pushes out the scraps (not shown in FIG. 7(a)) that have been swept onto the cover member 10, and stores the scraps. It can be dropped and stored in the section 11. The CCS block 13 is fixed to the upper surface of the slide member 14 and is arranged adjacent to the holding member 2. For example, before cutting the object W to be cut, the height of the rotary blade (blade) for cutting the object W can be controlled by bringing it into contact with the CCS block 13.

図７（ａ）に示した切断装置では、例えば、切断（切削）時に回転刃（ブレード）に吹き付けられる水流により、又は、それとは別の水流により、切断対象物Ｗの切断により生じた端材Ｔを吹き飛ばして、又は流して端材収容部１１内に収容することができる。また、例えば、前述のように、スライド部材１４を図示の上下方向に移動させることにより、端材収容部１１内に端材を収容することもできる。 In the cutting device shown in FIG. 7(a), for example, scraps generated by cutting the object W to be cut are generated by a water stream sprayed onto a rotary blade during cutting, or by a separate water stream. The T can be blown away or flowed and stored in the scrap storage section 11. Further, for example, as described above, by moving the slide member 14 in the vertical direction shown in the figure, the scraps can be stored in the scraps storage section 11.

しかし、図７（ａ）に示した切断装置では、切断対象物Ｗの切断により生じた端材が散乱することにより、切断装置を損傷、又は切断対象物Ｗの切断により製造される切断品を損傷させるおそれがある。図７（ｂ）は、図７（ａ）に示した切断装置において、端材が散乱した例を示す平面図である。図７（ｂ）において、Ｔ１～Ｔ４は、散乱した端材を示す。Ｔ１は、切断対象物Ｗの上に散乱した端材を示す。このように端材Ｔ１が切断対象物Ｗの上に散乱することで、端材Ｔ１が回転刃（ブレード）による切断対象物Ｗの切断を阻害し、又は製品（切断品）を損傷させるおそれがある。Ｔ２は、ＣＣＳブロック１３上に散乱した端材を示す。このようにＣＣＳブロック１３上に端材Ｔ２が散乱することで、回転刃（ブレード）の高さを制御しようとする際に、回転刃（ブレード）が端材Ｔ２に接触し、回転刃（ブレード）を損傷させるおそれがある。図７（ｂ）において、Ｔ３は、保持部材２上に散乱した端材を示す。このように保持部材２上に端材Ｔ３が散乱することで、端材Ｔ３がさらに別の場所に散逸するなどして、切断装置を損傷させるおそれがある。Ｔ４は、スライド部材１４、保護カバー１０及び端材収容部１１が２つ以上隣接して配置された場合において、隣接する保護カバー１０の上に散乱した端材を示す。このように保護カバー１０の上に端材Ｔ４が散乱することで、保護カバー１０の伸縮時に保護カバー１０を損傷させるおそれがある。また、前述のように、スライド部材１４を図示の上下方向に移動させることによって、カバー部材１０の上に散乱した端材Ｔ４を押し出して端材収容部１１内に落下させようとした場合にも、同様に保護カバー１０を損傷させるおそれがある。 However, in the cutting device shown in FIG. 7(a), scraps generated by cutting the object W to be cut are scattered, which may damage the cutting device or damage the cut products manufactured by cutting the object W. There is a risk of damage. FIG. 7(b) is a plan view showing an example in which scraps are scattered in the cutting device shown in FIG. 7(a). In FIG. 7(b), T1 to T4 indicate scattered scraps. T1 indicates scraps scattered on the object W to be cut. As the scraps T1 are scattered on the object W to be cut in this way, there is a risk that the scraps T1 may obstruct the cutting of the object W by the rotary blade (blade) or damage the product (cut product). be. T2 indicates scraps scattered on the CCS block 13. By scattering the scraps T2 on the CCS block 13 in this way, when trying to control the height of the rotary blade (blade), the rotary blade (blade) comes into contact with the scraps T2, ) may cause damage. In FIG. 7(b), T3 indicates scraps scattered on the holding member 2. When the scraps T3 are scattered on the holding member 2 in this way, the scraps T3 may further scatter to another location, which may damage the cutting device. T4 indicates scraps scattered on an adjacent protective cover 10 when two or more slide members 14, protective covers 10, and scrap storage parts 11 are arranged adjacent to each other. If the scraps T4 are scattered on the protective cover 10 in this way, there is a risk that the protective cover 10 will be damaged when the protective cover 10 is expanded or contracted. Furthermore, as described above, by moving the slide member 14 in the vertical direction shown in the figure, even if the scraps T4 scattered on the cover member 10 are pushed out and tried to fall into the scraps storage section 11, , there is a risk of damaging the protective cover 10 as well.

そこで、本発明は、切断対象物の切断により生じる端材の散乱を抑制又は防止できる保持部材、切断装置、及び切断品の製造方法を提供することを目的とする。 SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a holding member, a cutting device, and a method for manufacturing a cut product that can suppress or prevent scattering of scraps generated by cutting an object.

この目的を達成するために、本発明の保持部材は、
切断対象物を保持するための保持部材であって、
前記保持部材は、切断対象物を保持するテーブルと、凸部とを含み、
前記凸部は、前記テーブルにおける前記切断対象物を保持する側の面において、前記切断対象物を保持する位置の周囲の一部の、前記切断対象物と接触しない位置に設けられ、
前記凸部の高さは、前記テーブルに保持される前記切断対象物の高さよりも低い、保持部材である。 To achieve this objective, the holding member of the present invention includes:
A holding member for holding an object to be cut,
The holding member includes a table that holds the object to be cut and a convex portion,
The convex portion is provided on a side of the table that holds the object to be cut, at a position that does not come into contact with the object to be cut, in a part of the periphery of the position where the object to be cut is held,
The height of the convex portion is a holding member that is lower than the height of the object to be cut held on the table.

本発明の切断装置は、前記本発明の保持部材と、前記保持部材に保持された前記切断対象物を切断する切断機構と、含む、切断装置である。 The cutting device of the present invention includes the holding member of the present invention, and a cutting mechanism that cuts the object to be cut held by the holding member.

本発明の切断品の製造方法は、
切断対象物を切断して製造される切断品の製造方法であって、
前記切断品の製造方法は、
前記本発明の切断装置を用いて行い、
前記保持部材に前記切断対象物を保持する切断対象物保持工程と、
前記保持部材に保持された前記切断対象物を切断する切断対象物切断工程と、
を含む、切断品の製造方法である。 The method for manufacturing a cut product of the present invention includes:
A method for manufacturing a cut product manufactured by cutting an object to be cut, the method comprising:
The method for manufacturing the cut product includes:
carried out using the cutting device of the present invention,
a cutting object holding step of holding the cutting object on the holding member;
a cutting object cutting step of cutting the cutting object held by the holding member;
A method of manufacturing a cut product, including:

本発明によれば、切断対象物の切断により生じる端材の散乱を抑制又は防止できる保持部材、切断装置、及び切断品の製造方法を提供することができる。 According to the present invention, it is possible to provide a holding member, a cutting device, and a method for manufacturing a cut product that can suppress or prevent scattering of scraps generated by cutting an object to be cut.

図１は、本発明の保持部材及びそれを用いた本発明の切断装置の一例を示す平面図である。FIG. 1 is a plan view showing an example of a holding member of the present invention and a cutting device of the present invention using the holding member. 図２（ａ）は、図１の保持部材及び切断装置を用いて切断対象物を切断する状態の一例を示す平面図である。図２（ｂ）は、図１の保持部材及び切断装置を用いた切断対象物の切断における別の一例を示す平面図である。FIG. 2A is a plan view showing an example of a state in which an object to be cut is cut using the holding member and cutting device shown in FIG. 1. FIG. FIG. 2(b) is a plan view showing another example of cutting an object to be cut using the holding member and cutting device shown in FIG. 図３（ａ）は、本発明の保持部材及びそれを用いた本発明の切断装置の別の一例を示すとともに、それらを用いて切断対象物を切断する状態の一例を示す平面図である。図３（ｂ）は、図３（ａ）の保持部材及び切断装置を用いた切断対象物の切断における別の一例を示す平面図である。FIG. 3(a) is a plan view showing another example of the holding member of the present invention and the cutting device of the present invention using the holding member, and also showing an example of a state in which an object to be cut is cut using them. FIG. 3(b) is a plan view showing another example of cutting an object to be cut using the holding member and cutting device shown in FIG. 3(a). 図４（ａ）は、凸部を有しない保持部材において、切削粉による汚れを例示する平面図である。図４（ｂ）は、本発明の保持部材において、切削粉による汚れがない状態を例示する平面図である。FIG. 4A is a plan view illustrating dirt caused by cutting powder in a holding member that does not have a convex portion. FIG. 4(b) is a plan view illustrating a state in which the holding member of the present invention is free from dirt caused by cutting powder. 図５は、本発明の保持部材及びそれを用いた本発明の切断装置のさらに別の一例を示す平面図である。FIG. 5 is a plan view showing still another example of the holding member of the present invention and the cutting device of the present invention using the same. 図６は、本発明の切断装置における全体の構成を例示する平面図である。FIG. 6 is a plan view illustrating the overall configuration of the cutting device of the present invention. 図７（ａ）は、凸部を有しない保持部材及びそれを用いた切断装置の一例を示す平面図である。図７（ｂ）は、図７（ａ）の保持部材及び切断装置を用いて切断対象物を切断する状態の一例を示す平面図である。FIG. 7A is a plan view showing an example of a holding member without a convex portion and a cutting device using the holding member. FIG. 7(b) is a plan view showing an example of a state in which an object to be cut is cut using the holding member and cutting device shown in FIG. 7(a).

本発明において、切断対象物は特に限定されず、例えば、基板を樹脂封止したパッケージ基板（樹脂成形品）等であってもよいし、樹脂封止していない基板等であってもよい。また、本発明における切断対象物は、これらに限定されず任意である。 In the present invention, the object to be cut is not particularly limited, and may be, for example, a package substrate (resin molded product) in which the substrate is sealed with resin, or a substrate that is not sealed with resin. Further, the object to be cut in the present invention is not limited to these but is arbitrary.

本発明において、樹脂成形品は、特に限定されず、例えば、単に樹脂を成形した樹脂成形品でもよいし、半導体チップ、抵抗素子、キャパシタ素子等の電子素子を樹脂成形により樹脂封止した樹脂成形品でもよい。本発明において、樹脂成形品は、例えば、電子部品等であってもよい。電子部品としては、特に限定されず任意であり、例えば、半導体チップ、抵抗素子、キャパシタ素子等の任意の電子素子を樹脂封止した任意の電子部品でもよい。電子素子の種類、形態等も特に限定されず、例えば、前述した各種形態（フリップチップを含む）の少なくとも一つであってもよい。また、樹脂成形品は、半導体チップ、抵抗素子、キャパシタ素子等の電子素子を樹脂封止した電子部品をさらに樹脂封止したものであってもよい。 In the present invention, the resin molded product is not particularly limited, and may be, for example, a resin molded product simply molded with resin, or a resin molded product in which electronic elements such as semiconductor chips, resistive elements, and capacitor elements are sealed with resin by resin molding. It can also be a product. In the present invention, the resin molded product may be, for example, an electronic component. The electronic component is not particularly limited and may be any electronic component, for example, any electronic component such as a semiconductor chip, a resistor element, a capacitor element, etc., sealed with resin. The type, form, etc. of the electronic element are not particularly limited, and may be, for example, at least one of the various forms described above (including a flip chip). Further, the resin molded product may be an electronic component in which an electronic element such as a semiconductor chip, a resistive element, a capacitor element, etc. is sealed with a resin, and the electronic component is further sealed with a resin.

また本発明において、「チップ」は、樹脂封止する前のチップをいい、具体的には、例えば、ＩＣ、ＬＥＤチップ、半導体チップ、電力制御用の半導体素子等のチップが挙げられる。本発明において、樹脂封止する前のチップは、樹脂封止後の電子部品と区別するために、便宜上「チップ」という。しかし、本発明における「チップ」は、樹脂封止する前のチップであれば、特に限定されず、チップ状でなくてもよい。 In the present invention, the term "chip" refers to a chip before resin sealing, and specifically includes chips such as an IC, an LED chip, a semiconductor chip, and a semiconductor element for power control. In the present invention, a chip before resin sealing is referred to as a "chip" for convenience in order to distinguish it from an electronic component after resin sealing. However, the "chip" in the present invention is not particularly limited as long as it is a chip before being sealed with resin, and may not be in the form of a chip.

本発明において、「フリップチップ」とは、ＩＣチップ表面部の電極（ボンディングパット）にバンプと呼ばれる瘤状の突起状電極を有するＩＣチップ、あるいはそのようなチップ形態のことをいう。このチップを、下向きに（フェースダウン）してプリント基板などの配線部に接続させる。前記フリップチップは、例えば、ワイヤレスボンディング用のチップあるいは接続方式の一つとして用いられる。 In the present invention, the term "flip chip" refers to an IC chip having bump-like protruding electrodes called bumps on the electrodes (bonding pads) on the surface of the IC chip, or any such chip form. This chip is connected face down to a wiring section of a printed circuit board or the like. The flip chip is used, for example, as a chip for wireless bonding or as one of the connection methods.

本発明において、樹脂成形の成形対象物は、特に限定されないが、例えば、基板であってもよい。また、本発明において、例えば、基板（成形対象物）に固定された電子素子（例えば半導体チップ、抵抗素子、キャパシタ素子等）を樹脂封止（樹脂成形）して樹脂成形品を製造してもよい。本発明において、樹脂成形の成形対象物である基板（インターポーザともいう。）としては、特に限定されないが、例えば、リードフレーム、配線基板、ウェハー、ガラスエポキシ製基板、セラミック製基板、樹脂製基板、金属製基板等であっても良い。基板は、例えば、その一方の面又は両面にチップが固定された実装基板であっても良い。チップの固定方法は、特に限定されないが、例えば、ワイヤーボンディング、フリップチップボンディング等が挙げられる。本発明では、例えば、チップが固定された基板を樹脂封止することにより、チップが樹脂封止された電子部品を製造しても良い。また、本発明の樹脂成形装置により樹脂封止される基板の用途は、特に限定されないが、例えば、ＬＥＤ用基板、携帯通信端末用の高周波モジュール基板、電力制御用モジュール基板、機器制御用基板等が挙げられる。 In the present invention, the object to be molded by resin molding is not particularly limited, but may be, for example, a substrate. Further, in the present invention, for example, a resin molded product may be manufactured by resin-sealing (resin molding) an electronic element (for example, a semiconductor chip, a resistor element, a capacitor element, etc.) fixed to a substrate (molding object). good. In the present invention, the substrate (also referred to as an interposer) that is the object to be molded by resin molding is not particularly limited, but includes, for example, a lead frame, a wiring board, a wafer, a glass epoxy substrate, a ceramic substrate, a resin substrate, It may also be a metal substrate or the like. The substrate may be, for example, a mounting substrate with chips fixed to one or both surfaces thereof. The method of fixing the chip is not particularly limited, and examples thereof include wire bonding, flip chip bonding, and the like. In the present invention, for example, an electronic component having a resin-sealed chip may be manufactured by resin-sealing a substrate to which a chip is fixed. Further, the uses of the substrate resin-sealed by the resin molding apparatus of the present invention are not particularly limited, but include, for example, LED substrates, high-frequency module substrates for mobile communication terminals, power control module substrates, device control substrates, etc. can be mentioned.

以下、本発明の具体的な実施形態を図面に基づいて説明する。各図は、説明の便宜のため、適宜省略、誇張等をして模式的に描画されている。ただし、本発明は以下の説明又は描画により限定されない。 Hereinafter, specific embodiments of the present invention will be described based on the drawings. Each figure is schematically drawn with appropriate omissions, exaggerations, etc. for convenience of explanation. However, the present invention is not limited by the following description or drawings.

実施形態１Embodiment 1

実施形態１では、本発明の保持部材及びそれを用いた本発明の切断装置の一例について説明する。 In Embodiment 1, an example of a holding member of the present invention and a cutting device of the present invention using the holding member will be described.

図１の平面図に、本発明の切断装置の一例を示す。なお、同図では、説明の便宜のため、切断装置の一部のみを図示している。図示のとおり、この切断装置は、保持部材が凸部を有すること以外は図７に示した切断装置と同様である。具体的には、図７では保持部材がテーブル２のみからなっていたが、図１の保持部材２Ｘは、切断対象物Ｗを保持するテーブル２と、凸部２０ａ及び２０ｂとを含む。凸部２０ａ及び２０ｂは、図示のとおり、テーブル２における切断対象物Ｗを保持する側の面において、切断対象物Ｗを保持する位置の周囲の一部の、切断対象物Ｗと接触しない位置（すなわち、切断対象物Ｗを保持する位置から離れた位置）に設けられている。切断対象物Ｗを保持する位置の周囲において、凸部２０ａと凸部２０ｂとの隙間、すなわち凸部２０ａ及び２０ｂが設けられていない部分から、切断対象物Ｗの切断により生じた端材が保持部材２Ｘの外に出ることが可能である。 The plan view of FIG. 1 shows an example of the cutting device of the present invention. In addition, in the figure, only a part of the cutting device is illustrated for convenience of explanation. As shown, this cutting device is similar to the cutting device shown in FIG. 7 except that the holding member has a convex portion. Specifically, in FIG. 7, the holding member consists of only the table 2, but the holding member 2X in FIG. 1 includes the table 2 that holds the object W to be cut, and convex portions 20a and 20b. As shown in the figure, the convex portions 20a and 20b are located at a part of the periphery of the position where the object to be cut W is held, on the surface of the table 2 on the side that holds the object to be cut, at a position that does not come into contact with the object to be cut (W). That is, it is provided at a position away from the position where the object to be cut W is held. Around the position where the object to be cut W is held, the scraps produced by cutting the object to be cut are held from the gap between the protrusions 20a and 20b, that is, from the part where the protrusions 20a and 20b are not provided. It is possible to get out of the member 2X.

図１では、切断対象物Ｗは矩形である。凸部２０ａは二つあり、切断対象物Ｗの二つの長辺の外側の、長辺と接触しない位置（すなわち、長辺から離れた位置）にそれぞれ設けられている。凸部２０ｂは二つあり、切断対象物Ｗの二つの短辺の外側の、短辺と接触しない位置（すなわち、短辺から離れた位置）にそれぞれ設けられている。切断対象物Ｗの長辺の外側に設けられた凸部２０ａの長さは、切断対象物Ｗの長辺の長さよりも短い。これにより、切断対象物Ｗの切断により生じた端材が保持部材２Ｘの外に出やすい。そして、凸部２０ａは、図示のとおり、テーブル２上において、切断対象物Ｗの長辺に垂直でその長辺の両端にそれぞれ接する二本の仮想線ａ１及びａ２に挟まれた内側に配置されている。これにより、切断対象物Ｗの切断により生じた端材は、さらに保持部材２Ｘの外に出やすい。同様に、切断対象物Ｗの短辺の外側に設けられた凸部２０ｂの長さも、切断対象物Ｗの短辺の長さよりも短い。これにより、切断対象物Ｗの切断により生じた端材は保持部材２Ｘの外に出やすい。そして、凸部２０ｂは、図示のとおり、テーブル２上において、切断対象物Ｗの短辺に垂直でその短辺の両端にそれぞれ接する二本の仮想線ｂ１及びｂ２に挟まれた内側に配置されている。これにより、切断対象物Ｗの切断により生じた端材は、さらに保持部材２Ｘの外に出やすい。 In FIG. 1, the object W to be cut is rectangular. There are two protrusions 20a, each of which is provided outside the two long sides of the object W to be cut, at a position that does not contact the long sides (that is, a position away from the long sides). There are two protrusions 20b, each of which is provided outside the two short sides of the object W to be cut, at a position that does not contact the short sides (that is, a position away from the short sides). The length of the convex portion 20a provided on the outside of the long side of the object W to be cut is shorter than the length of the long side of the object W to be cut. Thereby, scraps generated by cutting the object W to be cut easily come out of the holding member 2X. As shown in the figure, the convex portion 20a is arranged on the table 2 between two imaginary lines a1 and a2 that are perpendicular to the long side of the object to be cut W and touch both ends of the long side, respectively. ing. Thereby, the scraps generated by cutting the object W to be cut are more likely to come out of the holding member 2X. Similarly, the length of the convex portion 20b provided on the outside of the short side of the object W to be cut is also shorter than the length of the short side of the object W to be cut. Thereby, scraps generated by cutting the object W to be cut easily come out of the holding member 2X. As shown in the figure, the convex portion 20b is arranged on the table 2 between two imaginary lines b1 and b2 that are perpendicular to the short side of the object W to be cut and touch both ends of the short side, respectively. ing. Thereby, the scraps generated by cutting the object W to be cut are more likely to come out of the holding member 2X.

また、凸部２０ａ及び２０ｂの高さは、テーブル２に保持される切断対象物Ｗの高さよりも低い。これにより、凸部２０ａ及び２０ｂが切断対象物Ｗを切断するための回転刃（ブレード）に引っかかって、切断の邪魔になることを防止できる。 Further, the height of the convex portions 20a and 20b is lower than the height of the object W to be cut held on the table 2. This can prevent the convex portions 20a and 20b from getting caught by a rotary blade for cutting the object W to be cut and becoming a hindrance to the cutting.

なお、図１では、保持部材２Ｘ、保護カバー１０、端材収容部１１、ＣＣＳブロック１３、及びスライド部材１４のセットが、２つ並列に配置されている。ただし、これは例示であり、これらのセットの数は特に限定されず、１つのみでもよいし３つ以上でもよい。 In addition, in FIG. 1, two sets of the holding member 2X, the protective cover 10, the scrap storage section 11, the CCS block 13, and the slide member 14 are arranged in parallel. However, this is just an example, and the number of these sets is not particularly limited, and may be only one or three or more.

図２（ａ）及び（ｂ）に、図１の保持部材及び切断装置を用いて切断対象物を切断する状態の一例を、それぞれ示す。図２（ａ）は、切断対象物Ｗの長辺を、切断対象物Ｗを切断するための回転刃の回転面と平行になるように保持した例である。図２（ｂ）は、切断対象物Ｗの短辺を、切断対象物Ｗを切断するための回転刃の回転面と平行になるように保持した例である。 FIGS. 2(a) and 2(b) each show an example of a state in which an object to be cut is cut using the holding member and cutting device of FIG. 1. FIG. 2A shows an example in which the long side of the object W to be cut is held parallel to the rotating surface of the rotary blade for cutting the object W. FIG. 2(b) is an example in which the short side of the object W to be cut is held parallel to the rotating surface of the rotary blade for cutting the object W.

図２（ａ）を用いて、この保持部材及び切断装置を用いて切断対象物を切断する状態の一例について説明する。図示のとおり、この切断装置の一部であるスピンドル６及びスピンドル６に取り付けられた回転刃（ブレード）６１を用いて切断対象物Ｗを切断する。スピンドル６は、この切断装置において、保持部材２Ｘに保持された切断対象物Ｗを切断する「切断機構」に該当する。また、この切断装置を用いた切断対象物Ｗの切断は、本発明の切断品の製造方法における一例であるということもできる。この切断品の製造方法は、保持部材２Ｘに切断対象物Ｗを保持する「切断対象物保持工程」と、保持部材２Ｘに保持された切断対象物Ｗを切断する「切断対象物切断工程」と、を含む。 An example of a state in which an object to be cut is cut using this holding member and cutting device will be described with reference to FIG. 2(a). As shown in the figure, the object W to be cut is cut using a spindle 6 and a rotary blade 61 attached to the spindle 6, which are part of this cutting device. In this cutting device, the spindle 6 corresponds to a "cutting mechanism" that cuts the cutting object W held by the holding member 2X. Further, it can be said that cutting the object W to be cut using this cutting device is an example of the method for manufacturing a cut product of the present invention. This method of manufacturing a cut product includes a "cutting object holding step" in which the cutting object W is held on the holding member 2X, and a "cutting object cutting step" in which the cutting object W held in the holding member 2X is cut. ,including.

まず、図２（ａ）に示したとおり保持部材２Ｘに切断対象物Ｗを保持する「切断対象物保持工程」を行う。保持部材２Ｘに切断対象物Ｗを保持する方法は特に限定されず、例えば、本発明の技術分野における一般的な方法と同様でもよいし、他の任意の方法でもよい。具体的には、例えば、切断対象物Ｗを保持部材２Ｘに載置し、機械的な機構（例えばねじ、クランプ等）により保持部材２Ｘ上に固定することで、保持部材２Ｘに切断対象物Ｗを保持してもよい。また、例えば、切断対象物Ｗを保持部材２Ｘに載置し、保持部材２Ｘ及びスライド部材１４に設けられた吸引孔（図示せず）から吸引して保持部材２Ｘに吸着させ固定することで、保持部材２Ｘに切断対象物Ｗを保持してもよい。また、図２（ａ）では、切断対象物Ｗは、長辺が保護カバー１０の伸縮方向及びスライド部材１４の移動方向と平行に（図示の上下方向に）なるように配置されている。 First, as shown in FIG. 2(a), a "cutting object holding step" is performed in which the cutting object W is held on the holding member 2X. The method for holding the object W to be cut on the holding member 2X is not particularly limited, and may be, for example, the same as a general method in the technical field of the present invention, or any other method. Specifically, for example, by placing the object W to be cut on the holding member 2X and fixing it on the holding member 2X using a mechanical mechanism (for example, a screw, a clamp, etc.), the object W to be cut is placed on the holding member 2X. may be retained. Further, for example, by placing the object W to be cut on the holding member 2X, suctioning it through suction holes (not shown) provided in the holding member 2X and the slide member 14, and fixing it by adsorption to the holding member 2X, The object W to be cut may be held by the holding member 2X. Furthermore, in FIG. 2A, the object to be cut W is arranged so that its long sides are parallel to the direction of expansion and contraction of the protective cover 10 and the direction of movement of the slide member 14 (in the vertical direction in the drawing).

つぎに、保持部材２Ｘに保持された切断対象物Ｗを切断する「切断対象物切断工程」を行う。切断対象物Ｗを切断する方法も特に限定されず、例えば、本発明の技術分野における一般的な方法と同様でもよいし、他の任意の方法でもよい。具体的には、例えば、スピンドル６及び回転刃６１を保護カバー１０の伸縮方向及びスライド部材１４の移動方向と平行に（図示の上下方向に）移動させることにより、回転刃６１で切断対象物Ｗを切断してもよい。また、例えば、保護カバー１０を伸縮させるとともに、スライド部材１４及び保持部材２Ｘをスピンドル６及び回転刃６１に対して相対的に移動させることにより、回転刃６１で切断対象物Ｗを切断してもよい。切断対象物Ｗの切断時には、一般的な切断方法と同様に、回転刃６１を冷却するための切削水を回転刃６１に吹き付けながら切断を行うことが好ましい。また、例えば、回転刃６１で切断対象物Ｗを切断するに先立ち、回転刃６１をＣＣＳブロック１３に接触させることで、回転刃６１の高さを制御してもよい。ＣＣＳブロック１３のより具体的な使用方法は特に限定されないが、例えば、特開２０２２－００６７１５号公報に記載された使用方法と同様又はそれに準じてもよい。 Next, a "cutting object cutting step" is performed in which the cutting object W held by the holding member 2X is cut. The method of cutting the object W to be cut is also not particularly limited, and may be, for example, the same as a general method in the technical field of the present invention, or any other method. Specifically, for example, by moving the spindle 6 and the rotary blade 61 in parallel to the expansion/contraction direction of the protective cover 10 and the moving direction of the slide member 14 (in the vertical direction in the drawing), the rotary blade 61 can cut the object W. may be cut. Furthermore, for example, by expanding and contracting the protective cover 10 and moving the slide member 14 and the holding member 2X relative to the spindle 6 and the rotary blade 61, the object W to be cut can be cut by the rotary blade 61. good. When cutting the object W to be cut, it is preferable to perform the cutting while spraying cutting water onto the rotary blade 61 to cool the rotary blade 61, similarly to a general cutting method. Furthermore, for example, the height of the rotary blade 61 may be controlled by bringing the rotary blade 61 into contact with the CCS block 13 before the rotary blade 61 cuts the object W to be cut. A more specific method of using the CCS block 13 is not particularly limited, but may be similar to or based on, for example, the method described in Japanese Patent Application Laid-Open No. 2022-006715.

そして、図２（ａ）に示すとおり、切断対象物Ｗの切断により生じた端材を流すための端材処理水３０を、矢印で図示したＹ軸方向（すなわち、図の上下方向）に、保持部材２Ｘから端材収容部１１に向かって流す。これにより、端材が保持部材２Ｘの外に流れ出て、さらに端材収容部１１に向かって流れる。同図において、Ｔ１１、Ｔ１２及びＴ１３は、それぞれ端材を表す。図示のとおり、端材処理水３０が流れる方向の上流から下流に向かってＴ１１、Ｔ１２及びＴ１３の順序で示している。端材処理水３０によって流された端材は、最終的に、端材収容部１１内に落ちて収容される。端材処理水３０を流すタイミングは特に限定されず、例えば、切断対象物切断工程と同時に流してもよいし、切断対象物切断工程が終了後に流してもよいし、その両方でもよい。また、切断対象物切断工程前に端材処理水３０を流し始めてもよい。また、例えば、回転刃６１を冷却するために回転刃６１に吹き付ける切削水が端材処理水３０を兼ねてもよい。しかしながら、切削水とは別に端材処理水３０を流すことが、端材を流す効率等の観点から好ましい。また、実施形態１では端材処理水３０として水を用いているが、これに限定されず、水に加え、又は水に代えて任意の流体（例えば、水以外の液体、又は空気等の任意の気体）を用いることもできる。しかしながら、水を用いることが、コスト、簡便さ等の観点から好ましい。端材処理水３０としての水も特に限定されず、例えば、一般的な切削水と同様でもよく、例えば、水道水、蒸留水等であってもよい。 Then, as shown in FIG. 2(a), the waste treatment water 30 for discharging the waste generated by cutting the object W to be cut is directed in the Y-axis direction (i.e., in the vertical direction of the figure) as indicated by the arrow. It flows from the holding member 2X toward the scrap storage section 11. Thereby, the scraps flow out of the holding member 2X and further flow toward the scraps storage section 11. In the figure, T11, T12, and T13 each represent offcuts. As shown in the figure, the treated waste water 30 is shown in the order of T11, T12, and T13 from upstream to downstream in the flowing direction. The scraps washed away by the scraps treatment water 30 eventually fall into the scraps storage section 11 and are stored therein. The timing of flowing the waste material treatment water 30 is not particularly limited, and for example, it may be flowed at the same time as the process of cutting the object to be cut, or after the process of cutting the object to be cut, or both. Alternatively, the waste material treatment water 30 may start flowing before the process of cutting the object to be cut. Further, for example, the cutting water sprayed onto the rotary blade 61 to cool the rotary blade 61 may also serve as the scrap treatment water 30. However, it is preferable to flow the offcuts treated water 30 separately from the cutting water from the viewpoint of the efficiency of flowing off the offcuts. Further, in the first embodiment, water is used as the waste material treatment water 30, but the present invention is not limited to this, and in addition to or in place of water, any fluid (for example, a liquid other than water, or any fluid such as air) can be used. gas) can also be used. However, it is preferable to use water from the viewpoints of cost, simplicity, etc. The water used as the waste material treatment water 30 is also not particularly limited, and may be, for example, the same as general cutting water, such as tap water, distilled water, or the like.

以上のようにして、図２（ａ）に示す切断対象物Ｗを切断し、切断品を製造することができる。 In the manner described above, the object W to be cut shown in FIG. 2(a) can be cut to produce a cut product.

また、図２（ｂ）における切断対象物Ｗの切断では、「切断対象物保持工程」において、切断対象物Ｗを、短辺が保護カバー１０の伸縮方向及びスライド部材１４の移動方向（図示のＹ軸方向）と平行になるように保持する。これ以外は、図２（ｂ）における切断対象物Ｗの切断は、図２（ａ）と同様にして行うことができる。 In addition, in cutting the object W to be cut in FIG. 2(b), in the "object holding step", the object W to be cut is held so that the short side is in the expansion and contraction direction of the protective cover 10 and in the moving direction of the slide member 14 (as shown in the figure). (Y-axis direction). Other than this, the cutting target object W in FIG. 2(b) can be cut in the same manner as in FIG. 2(a).

実施形態１では、切断対象物Ｗの切断により生じた端材が、凸部２０ａと凸部２０ｂとの隙間からのみ保持部材Ｗの外に出て、凸部２０ａ及び２０ｂが配置された箇所からは出て行かない。また、例えば、凸部２０ａ及び２０ｂにより、端材を吹き飛ばす（拡散させる）水流の方向を変え、端材を端材回収部１１に向かって押し流す水流に変換する効果が得られる。したがって、実施形態１によれば、切断対象物Ｗの切断により生じた端材の拡散を抑制又は防止できるので、端材の拡散により起こる切断品の損傷、切断装置の損傷等を抑制又は防止できる。また、切断対象物Ｗの切断により生じた端材の拡散を抑制又は防止できることにより、端材を効率的に回収することもできる。 In Embodiment 1, the scraps produced by cutting the object W to be cut come out of the holding member W only through the gap between the protrusions 20a and 20b, and from the locations where the protrusions 20a and 20b are arranged. won't go out. Further, for example, the convex portions 20a and 20b change the direction of the water flow that blows off (diffuses) the scraps, and has the effect of converting the scraps into a water flow that sweeps the scraps toward the scrap collection unit 11. Therefore, according to the first embodiment, it is possible to suppress or prevent the dispersion of the scraps generated by cutting the object W to be cut, so it is possible to suppress or prevent damage to the cut product, damage to the cutting device, etc. caused by the dispersion of the scraps. . Furthermore, by being able to suppress or prevent the spread of offcuts produced by cutting the object W to be cut, the offcuts can also be efficiently collected.

なお、図１及び２の切断装置において、図示した部分以外（例えば、保護カバー１０を伸縮させスライド部材１４を移動させる機構等）の構成及び動作は特に限定されず、例えば、一般的な切断装置と同様でもよく、例えば、特許第６８７６５８６号公報に記載された装置と同様又はそれに準じてもよい。 In the cutting apparatus shown in FIGS. 1 and 2, the configuration and operation of parts other than those shown in the figures (for example, the mechanism for expanding and contracting the protective cover 10 and moving the slide member 14, etc.) are not particularly limited. For example, the device may be similar to or based on the device described in Japanese Patent No. 6,876,586.

図３（ａ）及び（ｂ）に、図１及び２の切断装置の変形例を示す。図示のとおり、この切断装置は、切断対象物Ｗの長辺の外側に設けられる凸部２０ａが凸部２０ａ１及び２０ａ２に二分割されていること以外は、図１及び２の切断装置と同様である。図示のとおり、凸部２０ａは、切断対象物Ｗの長辺の中央部で離間するように、凸部２０ａ１及び２０ａ２に二分割されている。図３（ａ）は、切断対象物Ｗの長辺を、切断対象物Ｗを切断するための回転刃の回転面と平行になるように保持した例である。図３（ｂ）は、切断対象物Ｗの短辺を、切断対象物Ｗを切断するための回転刃の回転面と平行になるように保持した例である。 FIGS. 3(a) and 3(b) show a modification of the cutting device shown in FIGS. 1 and 2. As shown, this cutting device is similar to the cutting device shown in FIGS. 1 and 2, except that the protrusion 20a provided on the outside of the long side of the object W to be cut is divided into two protrusions 20a1 and 20a2. be. As illustrated, the convex portion 20a is divided into two convex portions 20a1 and 20a2 separated from each other at the center of the long side of the object W to be cut. FIG. 3A shows an example in which the long side of the object W to be cut is held parallel to the rotating surface of the rotary blade for cutting the object W. FIG. 3(b) is an example in which the short side of the object W to be cut is held parallel to the rotating surface of the rotary blade for cutting the object W.

図３（ａ）及び（ｂ）における切断対象物Ｗの切断（切断品の製造方法）は、それぞれ、図２（ａ）及び（ｂ）と同様にして行うことができる。ただし、本変形例では、図３（ｂ）に示すとおり、切断対象物Ｗの切断により生じた端材が、凸部２０ａを二分割した凸部２０ａと凸部２０ｂとの隙間からも、端材処理水３０の水流とともに保持部材２Ｘの外に出ることが可能である。これにより、例えば、切断により分割された切断対象物Ｗの内側からも端材を出すことができるため、端材がいっそう保持部材２Ｘの外に出やすくなる。 The cutting of the cutting target W in FIGS. 3(a) and 3(b) (method for manufacturing a cut product) can be performed in the same manner as in FIGS. 2(a) and 2(b), respectively. However, in this modified example, as shown in FIG. 3(b), the scraps generated by cutting the object W to be cut can be seen at the end from the gap between the convex part 20a and the convex part 20b, which are the two parts of the convex part 20a. It is possible for the material treatment water 30 to flow out of the holding member 2X together with the water flow. Thereby, for example, the scraps can be taken out from the inside of the object to be cut W that has been divided by cutting, so the scraps can come out of the holding member 2X even more easily.

なお、実施形態１（図１～２）及びその変形例（図３）では、例えば、前述のとおり、凸部２０ａ及び２０ｂにより、端材を吹き飛ばす（拡散させる）水流の方向を変え、端材を端材回収部１１に向かって押し流す水流に変換する効果が得られる。したがって、端材処理水３０を効率的に利用できるので、副次的効果として、端材処理水３０の使用量を大幅に低減することも可能である。例えば、凸部２０ａ及び２０ｂが無い場合と比較して、端材処理水３０の使用量を約半分又はそれ以下に低減することも可能である。 In Embodiment 1 (FIGS. 1 and 2) and its modified example (FIG. 3), for example, as described above, the convex portions 20a and 20b change the direction of the water flow that blows away (diffuses) the scraps, This has the effect of converting the water into a water flow that flows toward the scrap collection section 11. Therefore, since the treated waste water 30 can be used efficiently, as a side effect, it is also possible to significantly reduce the amount of treated waste water 30 used. For example, it is also possible to reduce the amount of waste treatment water 30 used to about half or less compared to the case where there are no convex portions 20a and 20b.

さらに、実施形態１（図１～２）及びその変形例（図３）の副次的効果として、凸部２０ａ及び２０ｂがあることにより、保持部材２Ｘのテーブル２上面で端材処理水３０の渦流を発生させることができる。これにより、例えば、切断対象物Ｗの切断により生じた切削粉をテーブル２上面から洗い流すことができるので、切削粉がテーブル２上面に滞留することを抑制又は防止できる。図４は、平面視において、その効果を模式的に示す。図４（ａ）は、凸部２０ａ及び２０ｂが無い場合である。図４（ｂ）は、図１～２と同様に凸部２０ａ及び２０ｂがある場合である。図示のとおり、図４（ａ）では、テーブル２上面の切断対象物Ｗと隣接する領域αに切削粉ｃが滞留している。これに対し、図４（ｂ）では、領域αに切削粉ｃは滞留していない。 Furthermore, as a side effect of the first embodiment (FIGS. 1 and 2) and its modification (FIG. 3), the presence of the convex portions 20a and 20b allows the waste material treatment water 30 to flow on the upper surface of the table 2 of the holding member 2X. A vortex can be generated. Thereby, for example, the cutting powder generated by cutting the object W to be cut can be washed away from the upper surface of the table 2, so that the accumulation of cutting powder on the upper surface of the table 2 can be suppressed or prevented. FIG. 4 schematically shows the effect in plan view. FIG. 4(a) shows a case where there are no convex portions 20a and 20b. FIG. 4(b) shows a case where there are convex portions 20a and 20b, similar to FIGS. 1 and 2. As shown in the figure, in FIG. 4(a), cutting powder c remains in the area α on the upper surface of the table 2 adjacent to the object W to be cut. In contrast, in FIG. 4(b), no cutting powder c remains in the area α.

また、図５に、実施形態１（図１～３）のさらに別の変形例を示す。図示のとおり、この保持部材２Ｘ及び切断装置は、切断対象物Ｗの長辺の外側に設けられた凸部２０ａ１及び２０ａ２が、端材回収部１１に向かって（すなわち、端材処理水３０の上流側から下流側に向かって）開くように傾斜していること以外は、図３と同じである。凸部２０ａ１及び２０ａ２が傾斜していることで、例えば、端材処理水３０を流した時に端材が傾いて流れても、凸部２０ａ１及び２０ａ２に引っかかりにくく、スムーズにテーブル２上から出ていくことができる。 Further, FIG. 5 shows yet another modification of the first embodiment (FIGS. 1 to 3). As shown in the figure, in this holding member 2X and cutting device, the convex portions 20a1 and 20a2 provided on the outside of the long side of the object W to be cut are directed toward the scraps collecting section 11 (i.e., toward the scraps-treated water 30). It is the same as FIG. 3 except that it is slanted so as to open (from the upstream side to the downstream side). Because the protrusions 20a1 and 20a2 are slanted, for example, even if the waste material flows at an angle when the waste material treatment water 30 is poured, it will not be easily caught on the protrusions 20a1 and 20a2, and will come out smoothly from the table 2. I can go.

さらに、実施形態１には種々の変形例が可能である。例えば、図３及び５では凸部２０ａを凸部２０ａ１及び２０ａ２に二分割したが、これに限定されず、三つ以上の凸部に分割してもよい。また、図１～５では切断対象物Ｗが矩形である例を示したが、切断対象物Ｗの形状は、矩形に限定されず任意である。例えば、切断対象物Ｗの形状は、正方形でもよいし、方形以外の任意の多角形でもよいし、円形でもよいし、楕円形でもよい。 Furthermore, various modifications are possible to the first embodiment. For example, although the convex portion 20a is divided into two convex portions 20a1 and 20a2 in FIGS. 3 and 5, the present invention is not limited to this, and may be divided into three or more convex portions. Further, although FIGS. 1 to 5 show examples in which the object W to be cut is rectangular, the shape of the object W to be cut is not limited to a rectangle but may be arbitrary. For example, the shape of the object W to be cut may be a square, any polygon other than a rectangle, a circle, or an ellipse.

実施形態２Embodiment 2

つぎに、本発明の実施形態２について説明する。実施形態２では、本発明の切断装置における全体の構成及びその動作の一例について説明する。 Next, a second embodiment of the present invention will be described. In Embodiment 2, an example of the overall configuration and operation of a cutting device of the present invention will be described.

実施形態２の切断装置１００は、図６に示すように、切断対象物である樹脂成形された基板Ｗを切断することによって複数の製品Ｐに個片化する切断装置である。この切断装置１００は、基板供給モジュールＡと基板切断モジュールＢと検査モジュールＣとを、それぞれ構成要素として備える。各構成要素（各モジュールＡ～Ｃ）は、それぞれ他の構成要素に対して着脱可能かつ交換可能である。 As shown in FIG. 6, the cutting device 100 of the second embodiment is a cutting device that singulates a plurality of products P by cutting a resin-molded substrate W, which is an object to be cut. This cutting device 100 includes a substrate supply module A, a substrate cutting module B, and an inspection module C as constituent elements. Each component (modules A to C) is removable and replaceable with respect to other components.

基板供給モジュールＡには、基板供給モジュールＡには基板供給機構１が設けられる。被切断物に相当する樹脂成形された基板Ｗが、基板供給機構１から搬出され、移送機構（図示なし）によって基板切断モジュールＢに移送される。 The substrate supply module A is provided with a substrate supply mechanism 1 . A resin-molded substrate W corresponding to an object to be cut is carried out from the substrate supply mechanism 1 and transferred to the substrate cutting module B by a transfer mechanism (not shown).

図６に示す切断装置１００は、ツインカットテーブル方式の切断装置である。したがって、基板切断モジュールＢには、２個のテーブル２Ａ及び２Ｂが設けられる。テーブル２Ａ及び２Ｂは、例えば、実施形態１（図１～５）のテーブル２と同様でもよい。また、テーブル２Ａ及び２Ｂには、それぞれ実施形態１と同様に凸部（図６では図示せず）が設けられ、テーブル２Ａ又は２Ｂと共に保持部材を構成している。この保持部材は、例えば、実施形態１の保持部材２Ｘと同様でもよい。テーブル２Ａには切断用治具３Ａが取り付けられている。テーブル２Ｂには切断用治具３Ｂが取り付けられている。テーブル２Ａは、移動機構４Ａによって図６の矢印で示したＹ軸方向（図の左右方向）に移動可能であり、かつ、回転機構５Ａによってθ方向に回動可能である。テーブル２Ｂは、移動機構４Ｂによって図６のＹ軸方向に移動可能であり、かつ、回転機構５Ｂによってθ方向に回動可能である。 The cutting device 100 shown in FIG. 6 is a twin cut table type cutting device. Therefore, the substrate cutting module B is provided with two tables 2A and 2B. Tables 2A and 2B may be similar to table 2 of Embodiment 1 (FIGS. 1 to 5), for example. Furthermore, the tables 2A and 2B are each provided with a convex portion (not shown in FIG. 6) as in the first embodiment, and constitute a holding member together with the table 2A or 2B. This holding member may be similar to the holding member 2X of Embodiment 1, for example. A cutting jig 3A is attached to the table 2A. A cutting jig 3B is attached to the table 2B. The table 2A is movable in the Y-axis direction (left-right direction in the figure) indicated by the arrow in FIG. 6 by the moving mechanism 4A, and can be rotated in the θ direction by the rotation mechanism 5A. The table 2B is movable in the Y-axis direction in FIG. 6 by a moving mechanism 4B, and can be rotated in the θ direction by a rotation mechanism 5B.

また、基板切断モジュールＢには、位置合わせ用のカメラ（図示せず）が設けられている。位置合わせ用のカメラは独立して矢印で示したＸ軸方向（図の上下方向）に移動可能である。基板切断モジュールＢには、切断機構として２個のスピンドル６Ａ及び６Ｂが設けられている。切断装置１００は、２個のスピンドル６Ａ及び６Ｂが設けられるツインスピンドル構成の切断装置である。スピンドル６Ａ及び６Ｂは、独立してＸ方向とＺ方向とに移動可能である。スピンドル６Ａ及び６Ｂは、例えば、図２及び３のスピンドル６と同様でよい。また、スピンドル６Ａには回転刃６１Ａが取り付けられ、スピンドル６Ｂには回転刃６１Ｂが取り付けられている。回転刃６１Ａ及び６１Ｂは、例えば、図２及び３の回転刃６１と同様でよい。 Further, the substrate cutting module B is provided with a camera (not shown) for positioning. The positioning camera can be independently moved in the X-axis direction (vertical direction in the figure) indicated by the arrow. The substrate cutting module B is provided with two spindles 6A and 6B as cutting mechanisms. The cutting device 100 has a twin spindle configuration in which two spindles 6A and 6B are provided. Spindles 6A and 6B are independently movable in the X direction and the Z direction. Spindles 6A and 6B may be similar to spindle 6 of FIGS. 2 and 3, for example. Further, a rotary blade 61A is attached to the spindle 6A, and a rotary blade 61B is attached to the spindle 6B. The rotary blades 61A and 61B may be similar to the rotary blade 61 in FIGS. 2 and 3, for example.

この基板切断モジュールＢの動作の一例は次のとおりである。テーブル２Ａでの切断は、当該テーブル２Ａと２個のスピンドル６Ａ及び６Ｂとを相対的に移動させることによって、樹脂成形された基板Ｗを切断して個片化する。また、テーブル２Ｂでの切断は、当該テーブル２Ｂと、２個のスピンドル６Ａ及び６Ｂとを相対的に移動させることによって、樹脂成形された基板Ｗを切断して個片化する。スピンドル６Ａの回転刃６１Ａ及びスピンドル６Ｂの回転刃６１Ｂは、Ｙ軸方向とＺ軸方向とを含む面内において回転することによって各テーブル２Ａ、２Ｂに保持された樹脂成形された基板Ｗを切断する。なお、テーブル２Ａでの切断処理と、テーブル２Ｂでの切断処置は、交互に行われる。 An example of the operation of this substrate cutting module B is as follows. In cutting with the table 2A, the resin-molded substrate W is cut into pieces by relatively moving the table 2A and the two spindles 6A and 6B. Further, in cutting with the table 2B, the resin-molded substrate W is cut into pieces by relatively moving the table 2B and the two spindles 6A and 6B. The rotary blade 61A of the spindle 6A and the rotary blade 61B of the spindle 6B cut the resin-molded substrate W held on each table 2A, 2B by rotating in a plane including the Y-axis direction and the Z-axis direction. . Note that the cutting process on the table 2A and the cutting process on the table 2B are performed alternately.

基板切断モジュールＢを用いた樹脂成形された基板（切断対象物）Ｗの切断、すなわち切断品の製造方法については、例えば、実施形態１で説明したとおり「切断対象物保持工程」と「切断対象物切断工程」とを行うことにより実施できる。 Regarding the cutting of a resin-molded substrate (object to be cut) W using the substrate cutting module B, that is, the method for manufacturing a cut product, for example, as explained in Embodiment 1, the "object holding step" and the "object to be cut" It can be carried out by performing the "object cutting step".

検査モジュールＣには検査用テーブル７が設けられている。検査用テーブル７には、樹脂成形された基板Ｗを切断して個片化された複数の製品（切断品）Ｐからなる集合体が載置される。複数の製品Ｐは、検査用のカメラ（図示せず）によって検査され、良品と不良品とに選別される。良品はトレイ８に収容される。 The inspection module C is provided with an inspection table 7. On the inspection table 7, an assembly consisting of a plurality of products (cut products) P obtained by cutting a resin-molded substrate W into individual pieces is placed. The plurality of products P are inspected by an inspection camera (not shown) and sorted into non-defective products and defective products. Good products are stored in tray 8.

なお、実施形態２においては、切断装置１００の動作、樹脂成形された基板Ｗの搬送、樹脂成形された基板Ｗの切断、製品Ｐの検査など、すべての動作を制御する制御部ＣＴＬが基板供給モジュールＡ内に設けられている。これに限らず、制御部ＣＴＬは他のモジュール内に設けられてもよい。 In the second embodiment, the control unit CTL, which controls all operations such as the operation of the cutting device 100, the transportation of the resin-molded substrate W, the cutting of the resin-molded substrate W, and the inspection of the product P, supplies the substrate. It is provided in module A. The control unit CTL is not limited to this, and may be provided in another module.

また、実施形態２では、図６を用いて、本発明の切断装置における全体の構成及びその動作の一例について説明した。しかし、本発明の切断装置における全体の構成及びその動作は、これに限定されず任意であり、あらゆる変更が可能である。例えば、図６では、ツインカットテーブル方式であって、ツインスピンドル構成の切断装置を説明した。しかし、本発明の切断装置は、これに限定されず、例えば、シングルカットテーブル方式であってシングルスピンドル構成の切断装置であってもよいし、シングルカットテーブル方式であってツインスピンドル構成の切断装置等であってもよい。 Furthermore, in the second embodiment, an example of the overall configuration and operation of the cutting device of the present invention was explained using FIG. 6 . However, the overall configuration and operation of the cutting device of the present invention are not limited to this, but are arbitrary and can be modified in any way. For example, in FIG. 6, a twin cut table type cutting device having a twin spindle configuration has been described. However, the cutting device of the present invention is not limited to this, for example, it may be a cutting device of a single cut table type and a single spindle configuration, or a cutting device of a single cut table type and a twin spindle configuration. etc. may be used.

また、図６では、切断対象物として樹脂成形された基板Ｗを用いる例を説明した。しかし、前述のとおり、本発明では、切断対象物は樹脂成形された基板に限定されず、例えば、樹脂成形されていない基板等であってもよい。 Further, in FIG. 6, an example is described in which a resin-molded substrate W is used as the object to be cut. However, as described above, in the present invention, the object to be cut is not limited to a resin-molded substrate, but may be, for example, a non-resin-molded substrate.

さらに、本発明は、上述の実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に組み合わせ、変更し、又は選択して採用できるものである。 Furthermore, the present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected as necessary and adopted without departing from the spirit of the present invention. It is something.

上記実施形態の一部又は全部は、以下の付記のようにも記載し得るが、以下には限定されない。
（付記１）
切断対象物を保持するための保持部材であって、
前記保持部材は、切断対象物を保持するテーブルと、凸部とを含み、
前記凸部は、前記テーブルにおける前記切断対象物を保持する側の面において、前記切断対象物を保持する位置の周囲の一部の、前記切断対象物と接触しない位置に設けられ、
前記凸部の高さは、前記テーブルに保持される前記切断対象物の高さよりも低い、保持部材。
（付記２）
前記切断対象物の形状が多角形であり、
前記凸部は、前記切断対象物を保持する位置の周囲において、前記切断対象物の辺の外側に該当する位置の一部の、前記切断対象物の辺と接触しない位置に設けられ、
前記切断対象物の一辺の外側に設けられる前記凸部の長さは、前記一辺の長さよりも短い、付記１記載の保持部材。
（付記３）
前記切断対象物の一辺の外側に設けられた前記凸部は、前記テーブル上において、前記一辺に垂直で前記一辺の両端にそれぞれ接する二本の仮想線に挟まれた内側に配置されている、付記２記載の保持部材。
（付記４）
前記切断対象物の形状が矩形である、付記１から３のいずれかに記載の保持部材。
（付記５）
前記切断対象物の長辺の外側に設けられる前記凸部が複数に分割され、前記複数の凸部の間の隙間から、前記切断対象物の切断により生じた端材が前記保持部材の外に出ることが可能である、付記４記載の保持部材。
（付記６）
前記複数の凸部の間の隙間が、少なくとも前記切断対象物の長辺の中央部に該当する位置に設けられている、付記５記載の保持部材。
（付記７）
前記保持部材における前記凸部が設けられた側の面に流体を流すことにより、前記凸部が設けられていない部分から、前記切断対象物の切断により生じた端材が前記保持部材の外に出ることが可能である、付記１から６のいずれかに記載の保持部材。
（付記８）
付記１から７のいずれかに記載の保持部材と、
前記保持部材に保持された前記切断対象物を切断する切断機構と、
を含む、切断装置。
（付記９）
切断対象物を切断して製造される切断品の製造方法であって、
前記切断品の製造方法は、
付記８記載の切断装置を用いて行い、
前記保持部材に前記切断対象物を保持する切断対象物保持工程と、
前記保持部材に保持された前記切断対象物を切断する切断対象物切断工程と、
を含む、切断品の製造方法。 Part or all of the above embodiment may be described as in the following additional notes, but is not limited to the following.
(Additional note 1)
A holding member for holding an object to be cut,
The holding member includes a table that holds the object to be cut and a convex portion,
The convex portion is provided on a side of the table that holds the object to be cut, at a position that does not come into contact with the object to be cut, in a part of the periphery of the position where the object to be cut is held,
The height of the convex portion is lower than the height of the object to be cut held on the table.
(Additional note 2)
The shape of the object to be cut is a polygon,
The convex portion is provided around the position where the object to be cut is held, in a part of the position corresponding to the outside of the side of the object to be cut, and at a position that does not contact the side of the object to be cut,
The holding member according to supplementary note 1, wherein the length of the convex portion provided on the outside of one side of the object to be cut is shorter than the length of the one side.
(Appendix 3)
The convex portion provided on the outside of one side of the object to be cut is located on the table between two imaginary lines that are perpendicular to the one side and touch both ends of the one side, respectively. The holding member described in Supplementary Note 2.
(Additional note 4)
The holding member according to any one of Supplementary Notes 1 to 3, wherein the object to be cut has a rectangular shape.
(Appendix 5)
The convex portion provided on the outside of the long side of the object to be cut is divided into a plurality of parts, and the scraps generated by cutting the object to be cut are released from the gaps between the plurality of convex parts to the outside of the holding member. The holding member according to supplementary note 4, which is removable.
(Appendix 6)
The holding member according to appendix 5, wherein the gap between the plurality of convex portions is provided at least at a position corresponding to a central portion of a long side of the object to be cut.
(Appendix 7)
By flowing fluid to the surface of the holding member on the side where the convex portion is provided, the scraps produced by cutting the object to be cut are released from the part where the convex portion is not provided to the outside of the holding member. The holding member according to any one of appendices 1 to 6, which is removable.
(Appendix 8)
The holding member according to any one of Supplementary Notes 1 to 7;
a cutting mechanism that cuts the object to be cut held by the holding member;
cutting equipment, including;
(Appendix 9)
A method for manufacturing a cut product manufactured by cutting an object to be cut, the method comprising:
The method for manufacturing the cut product includes:
Performed using the cutting device described in Appendix 8,
a cutting object holding step of holding the cutting object on the holding member;
a cutting object cutting step of cutting the cutting object held by the holding member;
A method of manufacturing cut products, including:

１ 基板供給機構
２、２Ａ、２Ｂ テーブル
２Ｘ 保持部材
３Ａ、３Ｂ 切断用治具
４Ａ、４Ｂ 移動機構
５Ａ、５Ｂ 回転機構
６、６Ａ、６Ｂ スピンドル
６１、６１Ａ、６１Ｂ 回転刃（ブレード）
７ 検査用テーブル
８ トレイ
１０ 保護カバー
１１ 端材収容部
１３ ＣＣＳブロック
１４ スライド部材
２０ａ、２０ａ１、２０ａ２、２０ｂ 凸部
３０ 端材処理水
１００ 切断装置
Ｗ 樹脂成形された基板（切断対象物）
ａ１、ａ２ 切断対象物Ｗの長辺に垂直でその長辺の各端にそれぞれ接する二本の仮想線
ｂ１、ｂ２ 切断対象物Ｗの短辺に垂直でその短辺の各端にそれぞれ接する二本の仮想線
Ｔ、Ｔ１、Ｔ２、Ｔ３、Ｔ４、Ｔ１１、Ｔ１２、Ｔ１３ 端材
α テーブル２上面の切断対象物Ｗと隣接する領域
ｃ 切削粉
Ｐ 製品（切断品）
Ａ 基板供給モジュール
Ｂ 基板切断モジュール
Ｃ 検査モジュール
ＣＴＬ 制御部 1 Substrate supply mechanism 2, 2A, 2B Table 2X Holding member 3A, 3B Cutting jig 4A, 4B Moving mechanism 5A, 5B Rotating mechanism 6, 6A, 6B Spindle 61, 61A, 61B Rotating blade (blade)
7 Inspection table 8 Tray 10 Protective cover 11 Offcuts storage section 13 CCS block 14 Slide members 20a, 20a1, 20a2, 20b Convex portion 30 Offcuts treated water 100 Cutting device W Resin-molded substrate (object to be cut)
a1, a2 two imaginary lines b1, b2 perpendicular to the long side of the object W to be cut and touching each end of the long side; two imaginary lines perpendicular to the short side of the object W to be cut and touching each end of the short side, respectively; Imaginary line of book T, T1, T2, T3, T4, T11, T12, T13 Offcuts α Area c adjacent to object W to be cut on the top surface of table 2 Cutting powder P Product (cut product)
A Substrate supply module B Substrate cutting module C Inspection module CTL Control section

Claims (9)

切断対象物を保持するための保持部材であって、
前記保持部材は、切断対象物を保持するテーブルと、凸部とを含み、
前記凸部は、前記テーブルにおける前記切断対象物を保持する側の面において、前記切断対象物を保持する位置の周囲の一部の、前記切断対象物と接触しない位置に設けられ、
前記凸部の高さは、前記テーブルに保持される前記切断対象物の高さよりも低い、保持部材。 A holding member for holding an object to be cut,
The holding member includes a table that holds the object to be cut and a convex portion,
The convex portion is provided on a side of the table that holds the object to be cut, at a position that does not come into contact with the object to be cut, in a part of the periphery of the position where the object to be cut is held,
The height of the convex portion is lower than the height of the object to be cut held on the table. 前記切断対象物の形状が多角形であり、
前記凸部は、前記切断対象物を保持する位置の周囲において、前記切断対象物の辺の外側に該当する位置の一部の、前記切断対象物の辺と接触しない位置に設けられ、
前記切断対象物の一辺の外側に設けられる前記凸部の長さは、前記一辺の長さよりも短い、請求項１記載の保持部材。 The shape of the object to be cut is a polygon,
The convex portion is provided at a position that does not come into contact with the side of the object to be cut, in a part of the position corresponding to the outside of the side of the object to be cut, around the position where the object to be cut is held,
The holding member according to claim 1, wherein the length of the convex portion provided on the outside of one side of the object to be cut is shorter than the length of the one side. 前記切断対象物の一辺の外側に設けられた前記凸部は、前記テーブル上において、前記一辺に垂直で前記一辺の両端にそれぞれ接する二本の仮想線に挟まれた内側に配置されている、請求項２記載の保持部材。 The convex portion provided on the outside of one side of the object to be cut is arranged on the table between two imaginary lines that are perpendicular to the one side and touch both ends of the one side, respectively. The holding member according to claim 2. 前記切断対象物の形状が矩形である、請求項１から３のいずれか一項に記載の保持部材。 The holding member according to any one of claims 1 to 3, wherein the object to be cut has a rectangular shape. 前記切断対象物の長辺の外側に設けられる前記凸部が複数に分割され、前記複数の凸部の間の隙間から、前記切断対象物の切断により生じた端材が前記保持部材の外に出ることが可能である、請求項４記載の保持部材。 The convex portion provided on the outside of the long side of the object to be cut is divided into a plurality of parts, and the scraps generated by cutting the object to be cut are released from the holding member through the gaps between the plurality of convex parts. 5. A retaining member according to claim 4, which is removable. 前記複数の凸部の間の隙間が、少なくとも前記切断対象物の長辺の中央部に該当する位置に設けられている、請求項５記載の保持部材。 6. The holding member according to claim 5, wherein a gap between the plurality of convex portions is provided at least at a position corresponding to a central portion of a long side of the object to be cut. 前記保持部材における前記凸部が設けられた側の面に流体を流すことにより、前記凸部が設けられていない部分から、前記切断対象物の切断により生じた端材が前記保持部材の外に出ることが可能である、請求項１から６のいずれか一項に記載の保持部材。 By flowing fluid to the surface of the holding member on the side where the convex portion is provided, the scraps produced by cutting the object to be cut are released from the portion where the convex portion is not provided to the outside of the holding member. 7. A retaining member according to any one of claims 1 to 6, which is removable. 請求項１から７のいずれか一項に記載の保持部材と、
前記保持部材に保持された前記切断対象物を切断する切断機構と、
を含む、切断装置。 A holding member according to any one of claims 1 to 7,
a cutting mechanism that cuts the object to be cut held by the holding member;
cutting equipment, including; 切断対象物を切断して製造される切断品の製造方法であって、
前記切断品の製造方法は、
請求項８記載の切断装置を用いて行い、
前記保持部材に前記切断対象物を保持する切断対象物保持工程と、
前記保持部材に保持された前記切断対象物を切断する切断対象物切断工程と、
を含む、切断品の製造方法。 A method for manufacturing a cut product manufactured by cutting an object to be cut, the method comprising:
The method for manufacturing the cut product includes:
Performed using the cutting device according to claim 8,
a cutting object holding step of holding the cutting object on the holding member;
a cutting object cutting step of cutting the cutting object held by the holding member;
A method of manufacturing cut products, including:
JP2022119983A 2022-07-27 2022-07-27 Holding member, cutting device, and manufacturing method for cut-off product Pending JP2024017384A (en)

Priority Applications (4)

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JP2022119983A JP2024017384A (en) 2022-07-27 2022-07-27 Holding member, cutting device, and manufacturing method for cut-off product
TW112113214A TW202405916A (en) 2022-07-27 2023-04-10 Holding component, cutting device, and method of manufacturing cut product capable of preventing or suppressing the scattering of end materials generated by cutting an object to be cut
CN202310601370.XA CN117476536A (en) 2022-07-27 2023-05-25 Holding member, cutting device, and method for manufacturing cut product
KR1020230079961A KR20240015565A (en) 2022-07-27 2023-06-21 Retainng member, cutting apparatus and manufacturing method of cut product

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Publication number Priority date Publication date Assignee Title
JP2016178106A (en) 2015-03-18 2016-10-06 株式会社ディスコ Cutting apparatus

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