JP2024013005A - Method for cleaning vapor deposition mask and equipment for cleaning vapor deposition mask - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the possibility that rust occurs due to galvanic corrosion in a vapor deposition mask.

SOLUTION: A method for cleaning a vapor deposition mask includes a step of electrolytically cleaning the vapor deposition mask. In the step of electrolytically cleaning the vapor deposition mask, the vapor deposition mask (1) is electrolytically cleaned by bringing a patch (35), made of a third metal, which does not melt into an electrolyte (41) and is baser than a first metal and a second metal being materials of the vapor deposition mask (1), into contact with one main surface of the vapor deposition mask (1) provided with a plurality of through holes (H).

SELECTED DRAWING: Figure 6

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present disclosure relates to a deposition mask cleaning method and a deposition mask cleaning apparatus.

Examples of display devices that display color images include self-luminous devices in which pixels of each color are regularly arranged and equipped with light-emitting elements of each color that emit red (R), green (G), and blue (B) light. type display devices are known.

Vacuum evaporation is often used to form organic films such as light-emitting layers in such display devices. The vacuum evaporation method has an advantage over the inkjet method in that it can form high-definition patterns. For this reason, for example, in a display device using an organic light-emitting material as a light-emitting material, in order to realize full-color display, the light-emitting layer is formed using a plurality of steps called FMM (fine metal mask) through which evaporated particles are passed. A high-definition vapor deposition mask having a vapor deposition hole (through hole) for each pixel is used. The evaporation mask is arranged to face the evaporation target substrate and forms a evaporation film made of the evaporation particles on the evaporation target substrate.

The evaporation material used in vacuum evaporation adheres not only to the surface of the substrate to be evaporated but also to the surface of the evaporation mask. Therefore, after a vapor deposition film is formed on a substrate to be vapor-deposited, the vapor deposition material (deposition particles) that did not reach the substrate to be vapor-deposited is deposited as deposits (deposition residue) on the surface of the vapor deposition mask. Adhesion of the evaporation material to the evaporation mask causes a decrease in the deposition accuracy of the evaporation film, and contamination of the substrate to be evaporated with foreign matter due to film peeling. For this reason, it is necessary to remove deposits from the vapor deposition mask periodically or every time it is used.

For example, Patent Document 1 discloses that a vapor deposition mask is electrolytically cleaned by performing electrolysis (electrolysis) with the vapor deposition mask in contact with an anode in a cleaning tank storing an alkaline electrolyte. There is. In Patent Document 1, oxygen is generated on the surface of the evaporation mask by bringing the evaporation mask into contact with the anode in the cleaning tank and using the evaporation mask itself as an anode. Removes dirt and deposits from the surface.

Japanese Patent Application Publication No. 2013-71062

However, when multiple types of metals are used in the vapor deposition mask, if electrolytic cleaning is repeatedly performed, rust may occur in the vapor deposition mask due to catalytic corrosion of different metals. If vapor deposition is performed using a vapor deposition mask with rust, the rust will adhere to the substrate to be vapor deposited.

One aspect of the present disclosure has been made in view of the above problems, and provides a method for cleaning a vapor deposition mask and a cleaning device for a vapor deposition mask, which can reduce the possibility that rust will occur due to contact corrosion of different metals in the vapor deposition mask. The purpose is to provide

In order to solve the above problems, a method for cleaning a vapor deposition mask according to an aspect of the present disclosure includes a first metal part made of a first metal, and a second metal part made of a second metal that contacts the first metal part. A method for cleaning a vapor deposition mask having a metal part and having a plurality of through holes through which vapor deposition particles pass, the method including a vapor deposition mask electrolytic cleaning step of electrolytically cleaning the vapor deposition mask, wherein the vapor deposition mask electrolytic cleaning step includes the above-mentioned A third metal member made of a third metal is brought into contact with one main surface of the vapor deposition mask on which the plurality of through holes are provided, and the vapor deposition mask is electrolytically cleaned in an electrolytic solution. The metal is a base metal that does not dissolve in the electrolytic solution and is baser than the first metal and the second metal.

In order to solve the above problems, a vapor deposition mask cleaning apparatus according to an aspect of the present disclosure includes a first metal part made of a first metal, and a second metal part made of a second metal that contacts the first metal part. A vapor deposition mask cleaning device for electrolytically cleaning a vapor deposition mask having a plurality of through holes for passing vapor deposition particles in an electrolytic solution, comprising: a cleaning tank for storing the electrolytic solution; and a cleaning tank in which the electrolytic solution is stored; a plurality of anodes provided in the cleaning tank with the cathode interposed therebetween; and a first main surface of the evaporation mask that is in contact with one main surface on which the plurality of through holes are provided. a third metal member made of three metals, wherein the third metal is a base metal that does not dissolve in the electrolytic solution and is baser than the first metal and the second metal, and the cathode is , a support portion that contacts the vapor deposition mask and the third metal member and detachably supports the vapor deposition mask and the third metal member, respectively.

In order to solve the above problems, a vapor deposition mask cleaning apparatus according to an aspect of the present disclosure includes a first metal part made of a first metal, and a second metal part made of a second metal that contacts the first metal part. A vapor deposition mask cleaning device for electrolytically cleaning a vapor deposition mask having a plurality of through holes for passing vapor deposition particles in an electrolytic solution, comprising: a cleaning tank for storing the electrolytic solution; and a cleaning tank in which the electrolytic solution is stored; and a plurality of anodes provided in the cleaning tank with the cathode interposed therebetween, wherein the cathode does not dissolve in the electrolytic solution, and the first metal and the second metal a third metal member made of a third metal, which is a base metal that is less base than the metal, and the cathode is in contact with one main surface of the vapor deposition mask on which the plurality of through holes are provided to perform the vapor deposition. It includes a support part that removably supports the mask.

According to one aspect of the present disclosure, it is possible to provide a method for cleaning a vapor deposition mask and a cleaning device for a vapor deposition mask, which can reduce the possibility that rust will occur due to contact corrosion of different metals in the vapor deposition mask.

A plan view illustrating an example of a vapor deposition mask used in Embodiment 1 before attaching a vapor deposition sheet, and a cross-sectional view taken along the line A-A and a cross-sectional view taken along the line B-B of the plan view side by side. It is. FIG. 2 is a plan view of an example of the vapor deposition mask used in Embodiment 1, after the vapor deposition sheet is attached, as viewed from the attachment surface side of the sheet-like member including the vapor deposition sheet. It is a flowchart which shows a part of manufacturing process of a display device using the above-mentioned vapor deposition mask. FIG. 3 is a cross-sectional view showing a vapor deposition process in manufacturing a display device using the above vapor deposition mask. FIG. 7 is a plan view schematically showing the surface state of the vapor deposition mask when electrolytic cleaning is repeatedly performed without using a base metal member. 1 is a cross-sectional view showing a schematic configuration of a main part of a cleaning apparatus according to Embodiment 1 in a deposition mask electrolytic cleaning process. FIG. 2 is a cross-sectional view showing a schematic configuration of the cleaning device according to the first embodiment at the time of carrying the caul plate into the cleaning tank. FIG. 2 is a cross-sectional view showing a part of a deposition mask electrolytic cleaning process using the cleaning apparatus according to the first embodiment. FIG. 2 is a cross-sectional view showing a schematic configuration of the cleaning apparatus according to the first embodiment after the electrolytically cleaned deposition mask is taken out after the deposition mask electrolytic cleaning process. FIG. 3 is a cross-sectional view showing processing in a caul plate cleaning step according to the first embodiment. FIG. 3 is a cross-sectional view showing a schematic configuration of a main part of a cleaning apparatus according to a second embodiment in a deposition mask electrolytic cleaning process. FIG. 7 is a cross-sectional view showing a part of a deposition mask electrolytic cleaning process using the cleaning apparatus according to Embodiment 2; FIG. 7 is a cross-sectional view showing a schematic configuration of the cleaning apparatus according to the second embodiment after carrying out the electrolytically cleaned deposition mask after the deposition mask electrolytic cleaning process. FIG. 7 is a cross-sectional view showing processing in a cathode cleaning step according to Embodiment 2.

[Embodiment 1]
Hereinafter, one embodiment of the present disclosure will be described in detail.

A method for cleaning a vapor deposition mask according to the present embodiment includes a first metal part made of a first metal and a second metal part made of a second metal that contacts the first metal part. It is.

FIG. 1 is a plan view showing an example of a vapor deposition mask 1 used in the present embodiment before attaching a vapor deposition sheet, and a cross-sectional view taken along the line AA and sectional view taken along the line B-B in the plan view. , is a diagram illustrating them side by side. 101 in FIG. 1 is a plan view showing an example of the vapor deposition mask 1, 102 in FIG. 1 is a sectional view taken along the line AA in the plan view shown in 101 in FIG. 1, and 103 in FIG. , is a sectional view taken along the line BB in the plan view shown at 101 in FIG. FIG. 2 is a plan view of an example of the vapor deposition mask 1 after the vapor deposition sheet 6 is attached, which is used in this embodiment, as viewed from the attachment surface side of the sheet-like member including the vapor deposition sheet 6.

In order to realize full-color display, a self-luminous display device includes a light-emitting layer that emits light of a desired color in correspondence with a plurality of pixels. The vapor deposition mask 1 according to the present embodiment shown in 101 to 103 in FIG. 1 and FIG. It is a vapor deposition mask. In a vapor deposition process in manufacturing a display device such as an organic EL (electroluminescent) display device using a vapor deposition mask 1, an organic layer such as a light emitting layer is selectively patterned ( Separate coating vapor deposition). It should be noted that in this way, a dedicated vapor deposition mask 1 is used for each luminescent color of the luminescent layer in separately coating the luminescent layer in each pixel using FMM.

The vapor deposition mask 1 includes a mask frame 2, a howling sheet 3, a cover sheet 4, an alignment sheet 5, and a vapor deposition sheet 6.

The howling sheet 3, cover sheet 4, alignment sheet 5, and vapor deposition sheet 6 are sheet-like members fixed to the mask frame 2. These howling sheet 3, cover sheet 4, alignment sheet 5, and vapor deposition sheet 6 are each thin flat sheet-like members that are elongated in one direction and extend from one end to the other end. It is stretched in a straight line. Of these sheet-like members, the howling sheet 3 and the cover sheet 4 are support sheets that support the vapor deposition sheet 6.

The mask frame 2 is a frame-shaped support for fixing the sheet-like member described above, and has a frame opening 2a as an opening, as shown at 101 in FIG.

For the mask frame 2, an Fe--Ni (iron-nickel) alloy called Invar, which has extremely small thermal expansion, is used as a base material, for example. The mask frame 2 is sufficiently thicker than the sheet-like member, and has high rigidity so as to ensure sufficient accuracy even when the sheet-like member is stretched and welded.

The mask frame 2 is, for example, a frame-like member having a quadrilateral shape such as a square or a rectangle in plan view. In the example shown at 101 in FIG. 1, the mask frame 2 has a rectangular outer shape. However, the outer shape of the mask frame 2 and the opening shape of the frame opening 2a are not limited to a rectangular shape, and any shape can be adopted.

The mask frame 2 has a frame portion 2b that frames the frame opening 2a, and an outer peripheral portion 2c that surrounds the outer periphery of the frame portion 2b.

The frame portion 2b is a region that comes into contact with sheet-like members (howling sheet 3, cover sheet 4, alignment sheet 5, vapor deposition sheet 6) attached to the mask frame 2, and fixes these sheet-like members.

As shown at 101 to 103 in FIG. 1, the frame portion 2b includes a plurality of grooves 2d for fixing the howling sheets 3, a plurality of grooves 2e for fixing the cover sheets 4, and an alignment sheet. A plurality of grooves 2f are provided for fixing the grooves 5, respectively.

The howling sheet 3 is attached to the mask frame 2 by welding or the like so that both longitudinal ends of the howling sheet 3 are located within the groove 2d. The cover sheet 4 is attached to the mask frame 2 by welding or the like so that both ends of the cover sheet 4 in the longitudinal direction are located within the groove 2e. The alignment sheet 5 is attached to the mask frame 2 by welding or the like so that both longitudinal ends of the alignment sheet 5 are located within the groove 2f.

The outer peripheral portion 2c is a region for reinforcing the frame portion 2b, and is thinner than the frame portion 2b. The outer peripheral portion 2c does not need to be in contact with the sheet-like member, and in the examples shown at 101 to 103 in FIG. 1, it is not in contact with the sheet-like member.

The howling sheet 3 is formed into a thin flat plate shape that is elongated in one direction, and extends linearly from one end of the howling sheet 3 to the other end.

The howling sheet 3 is provided across the plurality of vapor deposition sheets 6. The howling sheet 3 plays the role of supporting the vapor deposition sheets 6 so that they do not loosen and blocking the dummy patterns formed on the vapor deposition sheets 6.

For this reason, the howling sheet 3 is arranged to extend in a direction perpendicular to the plurality of vapor deposition sheets 6. In the example shown in 101 in FIG. 1 and FIG. 2, the direction 101 in FIG. 1 and the left-right direction in FIG. The stretching direction (longitudinal direction) of the sheet 6, 101 in FIG. 1 and the vertical direction in FIG. 2, corresponds to the lateral direction of the howling sheet 3.

For the howling sheet 3, stainless steel (SUS) or the like is used as a base material, for example. SUS has high strength, corrosion resistance, and heat resistance. Therefore, it is suitably used for the howling sheet 3 provided parallel to the long sides of the mask frame 2 and perpendicular to the plurality of vapor deposition sheets 6 .

In addition, in the example shown in 101 in FIG. 1 and FIG. , sides parallel to the transverse direction). However, the present invention is not limited to this, and at least one howling sheet 3 may be provided.

The cover sheet 4 is formed into a thin flat plate shape that is elongated in one direction, and extends linearly from one end of the cover sheet 4 to the other end.

The cover sheet 4 is disposed between adjacent vapor deposition sheets 6 so as to extend parallel to the stretching direction of the vapor deposition sheets 6.

The ends parallel to the long sides of the cover sheet 4 (in other words, the ends in the short direction of the cover sheet 4) overlap the ends parallel to the long sides of each vapor deposition sheet 6 adjacent to the cover sheet 4. are doing. The cover sheet 4 supports a plurality of vapor deposition sheets 6 along the long sides of these vapor deposition sheets 6, and also fills gaps between adjacent vapor deposition sheets 6 and covers dummy patterns (not shown) formed on the vapor deposition sheets 6. It plays a role of blocking. For the cover sheet 4, for example, Invar or the like is used as a base material.

The alignment sheet 5 is arranged to extend parallel to the long side of the vapor deposition sheet 6 with the plurality of vapor deposition sheets 6 and the plurality of cover sheets 4 in between, and is attached parallel to the short side of the mask frame 2. . For the alignment sheet 5, for example, Invar or the like is used as a base material.

As mentioned above, Invar has an extremely small coefficient of thermal expansion and is suitable for these sheet-like members.

In this embodiment, as shown at 101 in FIG. 1, after the cover sheet 4 is attached to the mask frame 2 to which the howling sheet 3 is attached, the alignment sheet 5 is attached. However, the order of attaching the howling sheet 3 and the cover sheet 4 may be reversed, and the cover sheet 4 may be attached to the mask frame 2 first, and then the howling sheet 3 may be attached.

By attaching a plurality of howling sheets 3 and a plurality of cover sheets 4 to the mask frame 2 in a grid pattern, openings partitioned by the howling sheets 3 facing each other and the cover sheets 4 facing each other are formed side by side. be done. The mask frame 2, the howling sheet 3, the cover sheet 4, and the alignment sheet 5 function as a frame portion to which the vapor deposition sheet 6 is fixed.

The vapor deposition sheet 6 is formed into a strip shape that is wider than other sheet-like members attached to the mask frame 2. The vapor deposition sheet 6 is applied as a vapor deposition layer to, for example, pixels of each color of R, G, and B (red pixel, green pixel, and blue pixel) on a vapor deposition target substrate provided with an active area where pixels contributing to display are lined up. This is a sheet for forming a pattern (separate coating vapor deposition) of a light-emitting layer. The vapor deposition sheet 6 is sometimes called a mask sheet or an FMM sheet.

The vapor deposition sheets 6 are arranged to extend parallel to the longitudinal direction of the alignment sheets 5, and a plurality of vapor deposition sheets 6 are arranged in parallel between the alignment sheets 5.

The vapor deposition sheet 6 is formed of a thin sheet in order to prevent the thickness of the vapor deposition film (for example, the thickness of the vapor-deposited light emitting layer) from becoming non-uniform. For the vapor deposition sheet 6, as a base material, for example, invar, which has an extremely small coefficient of thermal expansion as described above, is used.

Between both ends of the vapor deposition sheet 6 in the longitudinal direction, a plurality of effective parts YA are formed in line along the longitudinal direction of the vapor deposition sheet 6. The effective area YA is an area in which a plurality of evaporation holes H are formed for depositing evaporation particles for each pixel of a deposition target substrate provided with an active region. The outer shape of each effective portion YA has the same shape as the outer shape of the active region of the deposition target substrate. Each effective portion YA is provided for each active region of the substrate to be deposited, and the effective portions YA are formed apart from each other. The edge FA surrounding the effective area YA overlaps with the frame area surrounding the active area of the substrate to be deposited.

The vapor deposition holes H are formed to correspond to pixels of luminescent colors to be vapor deposited. As described above, the vapor deposition hole H is a through hole. The vapor deposition hole H has a cross section parallel to the sheet surface of the vapor deposition sheet 6 from the opening on the mounting surface side of the sheet-like member including the vapor deposition sheet 6 toward the surface opposite to the mounting surface side of the sheet-like member. It has an increasing shape.

Here, a method for manufacturing a display device using the vapor deposition mask 1 will be described. FIG. 3 is a flowchart showing a part of the manufacturing process of a display device using the vapor deposition mask 1. As shown in FIG. FIG. 4 is a cross-sectional view showing a vapor deposition process in manufacturing a display device using the vapor deposition mask 1.

As shown in FIG. 3, in manufacturing a display device using the vapor deposition mask 1, a vapor deposition film is formed on a substrate to be vapor deposited via the vapor deposition mask 1 (step 1, vapor deposition process).

As shown in FIG. 4, in a vapor deposition process in manufacturing a display device using a vapor deposition mask 1, a vapor deposition film is formed on a deposition target substrate 11 via the vapor deposition mask 1.

The deposition target substrate 11 is held by a substrate holder (not shown), and the vapor deposition mask 1 is held by a mask holder (not shown). The deposition target substrate 11 is a substrate on which a deposited film is formed. As the deposition target substrate 11, for example, an active matrix substrate including active elements such as thin film transistors (TFTs) is used.

A plurality of display panel formation regions are arranged on the deposition target substrate 11. The display panel forming region is a region that becomes a display panel in a display device by dividing the deposition target substrate 11 into pieces. Of the display panel forming area, the area where the active area is formed is the display area. The active area is an area in which, for example, R, G, and B pixels that contribute to display are formed. The outer shape of each effective portion YA of the vapor deposition sheet 6 in the vapor deposition mask 1 has the same shape as the outer shape of the active region of the vapor deposition target substrate 11.

In the vapor deposition step, as shown in FIG. 4, a vapor deposition mask 1 provided with the vapor deposition sheet 6 having the plurality of vapor deposition holes H described above is arranged to face the vapor deposition substrate 11 on which the vapor deposition film is to be formed.

The vapor deposition mask 1 is arranged with the mounting surface of the sheet-like member including the vapor deposition sheet 6 as the surface facing the substrate to be vaporized during vapor deposition. Therefore, the mounting surface (first surface) of the sheet-like member is the surface facing the deposition target substrate, and the surface (second surface) opposite to the mounting surface of the sheet-like member is the surface facing the deposition target substrate. This is the opposite surface of the opposite surface. Therefore, the opening of the vapor deposition hole H on the second surface side is larger than the opening of the vapor deposition hole H on the first surface side.

The vapor deposition mask 1 is brought into close contact with the surface of the substrate 11 on which the vapor deposition film is to be formed. Then, the vapor deposition material, which has been vaporized (evaporated or sublimed) as vapor deposition particles Z, is emitted from the vapor deposition nozzle 22 of the vapor deposition source 21 toward the substrate 11 to be vapor deposited under vacuum, thereby depositing the vapor deposition particles Z. Vapor deposition is performed on each pixel of the deposition target substrate 11 through the mask 1 .

During the evaporation process, some of the evaporation particles Z emitted from the evaporation source 21 toward the evaporation mask 1 pass through the evaporation holes H in the effective area YA and are deposited on the active region of the substrate 11 to be evaporated. , the remaining part is blocked by the edge FA and does not reach the active area. As a result, a vapor deposition film (vapor deposition pattern) made of vapor deposition particles Z is formed on the vapor deposition target substrate 11 in a pattern corresponding to each vapor deposition hole H of the vapor deposition sheet 6 .

In the vapor deposition step, the vapor deposition particles Z adhere not only to the surface of the substrate to be vapor deposited 11 but also to the surface of the vapor deposition mask 1 . Therefore, after a vapor deposition film is formed on the deposition target substrate 11, the deposition material (deposition particles Z) that did not reach the deposition target substrate 11 is deposited on the surface of the deposition mask 1 as deposits (film formation residue). deposited as

The film thickness of such film-forming residue increases each time film-forming is repeated. As the film thickness of the film formation residue increases, the film formation residue tends to peel off from the vapor deposition mask 1. For example, the film-forming residue that has peeled off is reheated in the vapor deposition source 21, turns into a gas, and adheres to the vapor-deposited substrate 11, reducing the quality of the vapor-deposited film formed on the vapor-depositing substrate 11, or causing defects. This may cause foreign matter to enter the deposition target substrate 11, such as by causing . Moreover, the pattern accuracy of the vapor deposition film formed on the deposition target substrate 11 may be reduced due to the vapor deposition material deposited on the vapor deposition mask 1 .

Therefore, after forming the vapor deposition film, the vapor deposition mask 1 is cleaned, as shown in FIG. 3, periodically or every time it is used, in order to remove the deposits attached to the vapor deposition mask 1. . Note that the cleaning step may be performed when the number of times of film formation reaches a predetermined number (N times, N≧1), and the cleaning process may be performed to remove deposits (film formation residues consisting of the above-mentioned vapor deposition particles Z) attached to the vapor deposition mask 1. ) may be performed when the thickness reaches a predetermined thickness. At this time, for example, the number of times of film formation is measured by a measurement unit in the control unit (not shown), and when the measured number of times of film formation reaches a predetermined number (step S2), the cleaning step (step S3) is performed. good. Note that the number of times of film formation may be measured by the operation of the evaporation apparatus for film formation, or may be measured by the number of times the deposition target substrate 11 is carried in and out by the transport apparatus. Of course, it is also possible to manually switch between the deposition process and the cleaning process. Further, instead of measuring the number of times of film formation by the measurement unit, the thickness of the deposits attached to the vapor deposition mask 1 may be measured using a sensor or the like.

Furthermore, if the cleaning process of the vapor deposition mask 1 is always performed before or after the vapor deposition process, it is possible to always perform film formation using the cleaned (cleaned) vapor deposition mask 1. It becomes possible to form a high-quality deposited film in which the oxidation is suppressed. That is, the cleaning step may be performed every time the number of times of film formation is counted once (N=1).

The cleaning step (Step S3) includes a deposition mask electrolytic cleaning step (Step S3a) in which the deposition mask 1 is electrolytically cleaned in an electrolytic solution.

As described above, in this embodiment, as an example, invar is used as the first metal for the mask frame 2, cover sheet 4, alignment sheet 5, and vapor deposition sheet 6 in the vapor deposition mask 1. There is. Further, as the material of the howling sheet 3, SUS is used as the second metal.

In this way, the vapor deposition mask 1 includes a first metal part made of a first metal and a second metal part made of a second metal that contacts the first metal part, and in a state where they are in contact, electrolysis is performed. When cleaning (electrolytic cleaning) is performed, rust due to contact corrosion of different metals may occur on the vapor deposition mask 1 due to the difference in natural potential.

In this embodiment, as described above, if the first metal is, for example, Invar, the second metal is SUS. Therefore, in this case, the first metal parts are the mask frame 2, the cover sheet 4, the alignment sheet 5, and the vapor deposition sheet 6, and the second metal part is the howling sheet 3. As shown in 101 of FIG. 1 and FIG. 2, the howling sheet 3 is in contact with the mask frame 2, the cover sheet 4, the alignment sheet 5, and the vapor deposition sheet 6, respectively.

In addition, in this embodiment, the howling sheet 3 is formed of a metal different from the mask frame 2, cover sheet 4, alignment sheet 5, and vapor deposition sheet 6, as described above, and these mask frame 2, cover sheet 4, and alignment sheet 5 and vapor deposition sheet 6, respectively, will be described as an example. However, this embodiment is not limited to this. If two or more different metals are included and those metals are in contact at even one place, electrolytic cleaning can cause rust due to catalytic corrosion of different metals.

Therefore, in this embodiment, a third metal member made of a third metal is provided on one main surface of the vapor deposition mask 1, and is not dissolved in the electrolytic solution and is made of the material of the vapor deposition mask 1 (that is, the first metal and the third metal member). The vapor deposition mask electrolytic cleaning step (step S3a) is performed in a state in which a base metal member made of a base metal that is baser than the second metal is in contact with the base metal member.

Note that the main surface of the vapor deposition mask 1 herein refers to the surface of the vapor deposition mask 1 provided with a plurality of vapor deposition holes H (through holes) through which the vapor deposition particles Z pass (that is, the first surface and the second surface). ) is shown. Moreover, the term "baser than the first metal and the second metal" indicates that the standard potential (standard electrode potential) is lower than that of the first metal and the second metal. In other words, being more base than the first metal and the second metal means that the ionization tendency is greater than that of the first metal and the second metal.

FIG. 5 is a plan view schematically showing the surface state of the vapor deposition mask 1 when electrolytic cleaning is repeatedly performed without using the base metal member. FIG. 5 shows the surface of the mask frame 2 opposite to the surface on which the sheet-like member is attached, and the surface (that is, the second surface) opposite to the surface facing the substrate 11 to be evaporated during vapor deposition. FIG.

Two types of metals, Invar and SUS, are used as materials for the vapor deposition mask 1, and when the vapor deposition mask 1 is electrolytically cleaned with these metals in contact with each other, as shown in FIG. Rust R may occur due to corrosion.

According to studies by the inventors of the present application, this rust R occurs only on one main surface of the vapor deposition mask 1. In addition, the rust R is not on the surface facing the substrate to be deposited (first surface), which is the mounting surface of these dissimilar metals (that is, the mounting surface of the second metal part with respect to the first metal part), but on the opposite side. This occurs only on the surface (second surface). In other words, the rust R occurs not on the attachment surface of the howling sheet 3 to the mask frame 2 or the attachment surface of the cover sheet 4 or vapor deposition sheet 6 to the howling sheet 3, but only on the opposite surface.

Moreover, as shown in FIG. 5, rust R does not occur on the mask frame 2, that is, on the frame portion or on the contact area between the howling sheet 3 and the vapor deposition sheet 6, but only on the vapor deposition sheet 6. It was also confirmed that this phenomenon occurs only in a portion of the vapor deposition sheet 6 that is spaced apart from the howling sheet 3.

Therefore, in this embodiment, as described above, the vapor deposition mask 1 is electrolytically cleaned with the base metal member as the third metal member in contact with one main surface (that is, one surface) of the vapor deposition mask 1. .

When the vapor deposition mask 1 is brought into contact with a base metal member that is more base than the material of the vapor deposition mask 1, due to contact corrosion of different metals, the corrosion rate of the base metal member whose standard potential is relatively low increases, while the corrosion rate of the base metal member whose standard potential is relatively low The corrosion rate of the first metal and the second metal with high corrosion rates is reduced. As a result, the base metal member acts as a sacrificial electrode, and only the base metal member corrodes and rust R occurs only on the base metal member. As a result, the possibility that rust R will occur on the vapor deposition mask 1 can be reduced.

FIG. 6 is a sectional view showing a schematic configuration of the main parts of the cleaning device 31 according to the present embodiment in the vapor deposition mask electrolytic cleaning process.

The cleaning device 31 according to this embodiment is a deposition mask cleaning device that electrolytically cleans the deposition mask 1 in the electrolytic solution 41, as described above.

As shown in FIG. 6, the cleaning device 31 transports a cleaning tank 32, a cathode 33, an anode 34, a patch plate 35 as a third metal member, a power source 36 (current carrying part), and a vapor deposition mask 1. It includes a transport device 37 (see FIGS. 7 and 8) and a control device (not shown).

The cleaning tank 32 is an electrolytic tank, and an electrolytic solution 41 is stored in the cleaning tank 32. The cleaning tank 32 has a size that can accommodate the vapor deposition mask 1, the cathode 33, the anode 34, and the patch plate 35 inside. The cleaning tank 32 stores an amount of electrolytic solution 41 capable of immersing the vapor deposition mask 1 , the cathode 33 , the anode 34 , and the patch plate 35 . Note that the cleaning device 31 may include a storage tank that stores the electrolytic solution 41 to be supplied to the cleaning tank 32 and a pump that supplies the electrolytic solution 41 from the storage tank to the cleaning tank 32.

As the electrolytic solution 41, an alkaline electrolytic solution (alkaline solution) is used. As the electrolytic solution, for example, a potassium hydroxide (KOH) solution or a sodium hydroxide (NaOH) solution, which has an etching effect, is used.

A cathode 33 and an anode 34 are installed inside the cleaning tank 32. The cathode 33 includes a support portion 33a that comes into contact with the vapor deposition mask 1 and the patch plate 35, respectively, and supports the vapor deposition mask 1 and the patch plate 35 in a removable manner.

The support portion 33a only needs to have a size and shape that can support the vapor deposition mask 1 and the patch plate 35. In this embodiment, the vapor deposition mask 1 and the patch plate 35 are placed on the support portion 33a of the cathode 33. Therefore, the support portion 33a must have a flat portion on which the vapor deposition mask 1 and the patch plate 35 are placed, and a size that allows the vapor deposition mask 1 and the patch plate 35 to be stably placed. Bye.

As described above, the vapor deposition mask 1 and the patch plate 35 are installed in the cleaning tank 32 in a state in which they are in contact with the support portion 33a of the cathode 33. Therefore, the vapor deposition mask 1 and the patch plate 35 themselves each function as a cathode.

The anode 34 is provided in the cleaning tank 32 so as to be spaced apart from the cathode 33 so as to sandwich the cathode 33 in a plan view. These cathode 33 and anode 34 are connected to a power source 36. The power supply 36 is a so-called DC power supply for supplying current between the cathode 33 and the anode 34 .

As the material for the cathode 33 and the anode 34, an electrode material with high corrosion resistance, which is conventionally used for electrolytic cleaning as a cathode and an anode, can be used, and the material is not particularly limited. For example, platinum-coated titanium electrodes are used.

When the cathode 33 and anode 34 in the electrolytic solution 41 are energized from the power source 36, the cathode 33 satisfies the following equation (1).
2H ₂ O+2e ^- →H ₂ +2OH ^- (1)
As shown in the figure, water molecules are reduced and hydrogen is generated. On the other hand, at the anode 34, the following formula (2)
2OH→H ₂ O+1/2O ₂ +2e ^- (2)
As shown in Figure 2, hydroxide ions are oxidized to generate water molecules and oxygen.

At this time, since the vapor deposition mask 1 and the patch plate 35 each function as a cathode as described above, electrolysis occurs using the entire vapor deposition mask 1 and the patch plate 35 as cathodes, and the surface of the vapor deposition mask 1 and the patch plate 35 is Hydrogen is generated from each. The bubbles generated by the generated hydrogen remove dirt and deposits that have adhered to the surface of the vapor deposition mask 1. Note that at this time, dirt and deposits on the surface of the backing plate 35 are also removed.

As described above, the patch plate 35 is made of a base metal that is baser than the first metal and the second metal, which are the materials of the vapor deposition mask 1 . In this embodiment, a base metal that is baser than Invar and SUS is used as the material of the backing plate 35. In this way, when Invar and SUS are used as the material of the vapor deposition mask 1, Mg (magnesium) or an Mg alloy is used as the base metal. Mg and Mg alloys are less base than Invar and SUS, and are suitable as base metals constituting the backing plate 35.

Vapor deposition masks made of multiple types of metals, such as Invar and SUS, are prone to rust due to contact corrosion of different metals, as described above. As described above, when the patch plate 35 made of a base metal that is less base than any of the metals used in the vapor deposition mask 1 is brought into contact with the vapor deposition mask 1, corrosion occurs only in the patch plate 35. As a result, the possibility that rust R will occur on the vapor deposition mask 1 can be reduced.

Even when cleaning a vapor deposition mask using a material other than Invar or SUS as the vapor deposition mask 1, a base metal that does not dissolve in the electrolytic solution 41 and is less base than the metal that is the material of the vapor deposition mask 1 can be used as the material for the backing plate 35. By doing so, effects similar to those described above can be obtained. The vapor deposition mask 1 may be of various sizes and shapes depending on the size of the substrate 11 to be vapor deposited and the vapor deposition method. It is not limited to mask 1.

The patch plate 35 may be brought into contact with either the first surface or the second surface of the vapor deposition mask 1, but as described above, the surface on which rust R will occur if electrolytic cleaning is performed without using the patch plate 35 is It is desirable to contact the

As mentioned above, when the patch plate 35 is not used, the rust R is on the second surface of the vapor deposition mask 1, which is the surface opposite to the surface where the second metal part is attached to the first metal part, and during vapor deposition. This occurs only on the surface opposite to the surface facing the substrate 11 to be deposited. Therefore, it is preferable that one main surface of the vapor deposition mask 1 that is brought into contact with the patch plate 35 is the second surface.

Furthermore, as mentioned above, rust R does not occur on the frame portion of the vapor deposition mask 1, but only on the vapor deposition sheet 6, so the possibility of rust R occurring on the vapor deposition sheet 6 is reduced. Therefore, it is desirable that the patch plate 35 be brought into contact with the vapor deposition sheet 6.

However, if the patch plate 35 is brought into contact only with the vapor deposition sheet 6, there is a concern that contact damage may be caused to the vapor deposition sheet 6 when the patch plate 35 is installed. For this reason, it is desirable that the patch plate 35 has a shape that contacts not only the vapor deposition sheet 6 but also the mask frame 2, and the entire main surface of one of the vapor deposition masks 1, including the mask frame 2, is preferably It is desirable that the entire second surface of the mask 1 be covered. Since the patch plate 35 has a shape that covers the entire one main surface of the vapor deposition mask 1, the above-mentioned contact damage can be reduced and the contact area of the patch plate 35 with the vapor deposition mask 1 can be increased. Therefore, the occurrence of rust R on the vapor deposition mask 1 can be more reliably reduced or prevented.

As shown in FIG. 6, the contact surface of the contact plate 35 with the vapor deposition mask 1 has a shape along the above-mentioned one main surface of the vapor deposition mask 1; It is desirable to have a shape along two sides. Thereby, the vapor deposition mask 1 and the patch plate 35 are brought into close contact with each other, the contact area of the patch plate 35 with the vapor deposition mask 1 is increased, and the occurrence of rust R on the vapor deposition mask 1 can be more reliably reduced or prevented. At the same time, cleaning efficiency can be further improved.

FIG. 7 is a sectional view showing a schematic configuration of the cleaning device 31 when the caul plate 35 is carried into the cleaning tank 32.

As shown in FIG. 7, the backing plate 35 may include a frame portion 35a and a mesh portion 35b provided within the frame portion 35a. The frame portion 35a corresponds to the contact portion of the vapor deposition mask 1 with the mask frame 2, and the mesh portion 35b corresponds to the contact portion with the vapor deposition sheet 6. In this way, since the part of the patch plate 35 in contact with the vapor deposition sheet 6 has a mesh structure, the flow of the electrolytic solution 41 in the cleaning tank 32 is not obstructed by the patch plate 35, and the cleaning process is facilitated. capacity can be maintained and cleaning efficiency can be improved.

In addition, in order to ensure a sufficient contact area between the patch plate 35 and the vapor deposition sheet 6 of the vapor deposition mask 1 in the mesh portion 35b, the finer the mesh (the smaller the opening), the better. The coarser the mesh (larger the opening), the better in order to avoid interfering with the contact between the two. The wire diameter (line width) and opening of the mesh structure in the mesh portion 35b may be appropriately set according to the size, material, cleaning conditions, etc. of the vapor deposition mask 1, and are not particularly limited, but as an example, For example, it is set to about the size of a screen door.

Note that the cleaning device 31 may include a stirring member (not shown) in the cleaning tank 32, and perform electrolytic cleaning of the vapor deposition mask 1 while stirring the electrolytic solution 41 with the stirring member. When the cleaning device 31 further includes the stirring member in this way, the stirring member causes liquid flow such as convection and circulation of the electrolytic solution 41, so that cleaning efficiency can be further improved. The stirring member may be, for example, a stirring blade, a stirring member using magnetic force such as a magnetic stirrer, or a jet-type stirring member that blows out the high-pressure electrolyte 41. good.

Next, the flow of the vapor deposition mask electrolytic cleaning step (step S3a) using the cleaning device 31 will be described below with reference to FIGS. 7 and 8.

FIG. 8 is a cross-sectional view showing a part of the vapor deposition mask electrolytic cleaning process using the cleaning device 31.

As shown in FIGS. 7 and 8, in the deposition mask electrolytic cleaning step, first, the cleaning tank 32 is filled with an amount of electrolytic solution 41 sufficient to immerse the deposition mask 1 and the patch plate 35. Next, the caul plate 35 is connected to the cathode 33 by immersing the caul plate 35 in the electrolytic solution 41 and placing it on the support portion 33a of the cathode 33 using a conveyor device 37 equipped with a conveyor arm 37a.

Next, the vapor deposition mask 1 is supported by the support part 33a of the cathode 33 by immersing the vapor deposition mask 1 in the electrolytic solution 41 and placing it on the support part 33a of the cathode 33 using the transfer device 37. . Thereby, the vapor deposition mask 1 is placed in the cleaning tank 32 in a state where it is in contact with the patch plate 35 and the cathode 33. As a result, the vapor deposition mask 1 and the patch plate 35 are placed in contact with the cathode 33 in the electrolytic solution 41, and are arranged to face the anode 34, respectively. As described above, a plurality of anodes 34 are provided in the cleaning tank 32 with the cathode 33 sandwiched therebetween in plan view. Therefore, by supporting the vapor deposition mask 1 and the patch plate 35 with the support portion 33a, the vapor deposition mask 1 and the patch plate 35 are opposed to the anode 34, respectively.

Next, electricity is supplied from a power source 36 between the cathode 33 and the anode 34. Thereby, as described above, hydrogen is generated from the surface of the vapor deposition mask 1 and the surface of the patch plate 35, respectively, and the vapor deposition mask 1 is electrolytically cleaned. As a result, as described above, dirt and deposits on the surface of the vapor deposition mask 1 are removed.

Note that the concentration of the electrolytic solution 41 and the voltage applied between the cathode 33 and the anode 34 may be set in the same manner as in the past, and are not particularly limited.

The vapor deposition mask 1 electrolytically cleaned by the cleaning device 31 is lifted out of the cleaning tank 32 by a transportation device 37 and transported to a rinsing device (not shown). The vapor deposition mask 1 that has been electrolytically cleaned in the cleaning device 31 is cleaned (rinsed) with, for example, pure water in this rinsing device, and then transported to a drying device (not shown) and dried.

FIG. 9 is a sectional view showing a schematic configuration of the cleaning device 31 after the electrolytically cleaned deposition mask 1 is taken out after the deposition mask electrolytic cleaning step.

As described above, when the vapor deposition mask 1 is electrolytically cleaned with the patch plate 35 in contact with the vapor deposition mask 1, the corrosion rate of the patch plate 35 increases due to catalytic corrosion of different metals, while the corrosion rate of the vapor deposition mask 1 decreases. . As a result, the patch plate 35 acts as a sacrificial electrode, and only the patch plate 35 corrodes, causing rust R to occur only on the patch plate 35, as shown in FIG. As a result, the possibility that rust R will occur on the vapor deposition mask 1 can be reduced.

When the vapor deposition mask 1 is electrolytically cleaned with the patch plate 35 in contact with the vapor deposition mask 1 in this manner, rust R is generated on the patch plate 35 instead of suppressing the generation of rust R on the vapor deposition mask 1.

As described above, the caul plate 35 itself is also cleaned to some extent during cleaning of the vapor deposition mask 1, but rust R is generated on the caul plate 35 by repeating electrolytic cleaning.

Therefore, the cleaning step (step S3) is a third metal member cleaning step of cleaning the third metal member used for electrolytic cleaning of the deposition mask 1, and is performed by electrolytic cleaning of the deposition mask where rust R has occurred as shown in FIG. The process may further include a patch cleaning step of electrolytically cleaning the patch plate 35 after the process.

As described above, the backing plate 35 is removably supported by the support portion 33a. Therefore, the patch plate 35 with rust R may be replaced with a new patch plate 35 as a consumable item, but waste can be reduced by regenerating and using (recycling) the patch plate 35 through electrolytic cleaning. and ensure sustainable production and consumption patterns. This will contribute to achieving the Sustainable Development Goals (SDGs).

FIG. 10 is a cross-sectional view showing the processing in the caulking plate cleaning step.

As shown in FIG. 10, in the caul plate cleaning process, only the caul plate 35 on which rust R has occurred after the vapor deposition mask electrolytic cleaning process is placed in contact with the cathode 33 and facing the anode 34 in the electrolytic solution 41. , Hydrogen is generated from the surface of the patch plate 35 and the patch plate 35 is electrolytically cleaned. By performing electrolysis with only the caul plate 35 of the vapor deposition mask 1 and the caul plate 35 in the cleaning tank 32, the rust R generated on the caul plate 35 can be removed, and the caul plate 35 can be removed. , can be kept in a clean state. Thereby, in the vapor deposition mask electrolytic cleaning process, the patch plate 35 in a clean state can be used for cleaning the vapor deposition mask 1.

Note that the cleaning process (step S3) includes, in addition to the above-described deposition mask electrolytic cleaning process and the patch plate cleaning process as the third metal member cleaning process, a solvent cleaning process in which the deposition mask 1 is cleaned using a solvent, and a solvent cleaning process in which the deposition mask 1 is cleaned using a solvent. The method may further include a cleaning step such as a rinsing step in which the solvent used in the cleaning step is washed away with pure water or the like.

As described above, according to this embodiment, the patch plate 35 acts as a sacrificial electrode during electrolytic cleaning of the vapor deposition mask 1, and rust R occurs only on the patch plate 35. As a result, the possibility that rust R will occur on the vapor deposition mask 1 can be reduced. Therefore, according to the present embodiment, a method for cleaning the deposition mask 1 and a cleaning device 31 for cleaning the deposition mask 1 are provided, which can reduce the possibility that rust R will occur due to contact corrosion of different metals in the deposition mask 1. can be provided.

[Embodiment 2]
Other embodiments of the present disclosure will be described below. Below, differences from Embodiment 1 will be explained. For convenience of explanation, members having the same functions as those described in Embodiment 1 will be denoted by the same reference numerals, and the description thereof will be omitted.

FIG. 11 is a cross-sectional view showing a schematic configuration of a main part of a cleaning device 51 according to this embodiment in the vapor deposition mask electrolytic cleaning step.

The cleaning device 51 according to this embodiment is a deposition mask cleaning device that electrolytically cleans the deposition mask 1 in an electrolytic solution 41, like the cleaning device 31 according to the first embodiment.

As shown in FIG. 11, the cleaning device 51 according to the present embodiment has the same configuration as the cleaning device 31 according to the first embodiment, except that a cathode 52 is provided in place of the cathode 33 and the backing plate 35. have. Therefore, the cleaning device 51 according to the present embodiment includes a cleaning tank 32, a cathode 52, an anode 34, a power source 36 (current-carrying section), a transport device 37, and a control device (not shown).

The cathode 52 is a base metal member (third metal member) made of a base metal (third metal) that does not dissolve in the electrolyte 41 and is baser than the first metal and second metal that are the materials of the vapor deposition mask 1. It is. The cathode 52 includes a support portion 52a that contacts one main surface of the vapor deposition mask 1 and supports the vapor deposition mask 1 in a detachable manner.

The support portion 52a only needs to have a size and shape that can support the vapor deposition mask 1. In this embodiment, the vapor deposition mask 1 is placed on the support portion 52a of the cathode 52. Therefore, the support portion 52a only needs to have a flat portion on which the vapor deposition mask 1 is placed and a size that allows the vapor deposition mask 1 to be stably placed thereon.

The vapor deposition mask 1 is installed in the cleaning tank 32 in a state in which it is in contact with the support portion 52a of the cathode 52. Therefore, also in this embodiment, the vapor deposition mask 1 itself functions as a cathode.

The anode 34 is provided in the cleaning tank 32 so as to be spaced apart from the cathode 52 so as to sandwich the cathode 52 in a plan view. These cathode 52 and anode 34 are connected to a power source 36.

When the cathode 52 and the anode 34 in the electrolytic solution 41 are energized from the power source 36, water molecules are reduced at the cathode 52 as shown in equation (1) above, and hydrogen is generated. On the other hand, at the anode 34, hydroxide ions are oxidized to generate water molecules and oxygen, as shown in equation (2) above.

At this time, since the vapor deposition mask 1 functions as a cathode as described above, electrolysis occurs in which the entire vapor deposition mask 1 is used as a cathode in addition to the cathode 52, and hydrogen is released from the surfaces of the vapor deposition mask 1 and the cathode 52, respectively. Occur. The bubbles generated by the generated hydrogen remove dirt and deposits that have adhered to the surface of the vapor deposition mask 1. Note that at this time, dirt and deposits attached to the surface of the cathode 52 are also removed.

In this embodiment, when invar and SUS are used as the material of the vapor deposition mask 1 as described above, Mg or an Mg alloy is used as the base metal constituting the cathode 52, for example. Mg and Mg alloys are less base than Invar and SUS, and are suitable as base metals constituting the cathode 52.

According to this embodiment, as described above, by bringing the vapor deposition mask 1 into contact with the cathode 52 made of a base metal that is more base than any of the metals used in the vapor deposition mask 1, corrosion occurs only in the cathode 52. . As a result, the possibility that rust R will occur on the vapor deposition mask 1 can be reduced.

Even when cleaning a vapor deposition mask using a material other than Invar and SUS as the vapor deposition mask 1, the material of the cathode 52 is a base metal that does not dissolve in the electrolytic solution 41 and is less base than the metal that is the material of the vapor deposition mask 1. By doing so, effects similar to those described above can be obtained.

The cathode 52 may be brought into contact with either the first surface or the second surface of the vapor deposition mask 1, but as described above, the cathode 52 may be brought into contact with either of the first and second surfaces of the vapor deposition mask 1, but as described above, the cathode 52 may contact the surface where rust R occurs when electrolytic cleaning is performed without using the third metal member. It is desirable to contact the Therefore, it is preferable that one main surface of the vapor deposition mask 1 with which the cathode 52 comes into contact is the second surface.

Furthermore, as shown in FIG. 11, in this embodiment, similarly to Embodiment 1, the contact surface of the cathode 52 with the vapor deposition mask 1 is arranged along the one principal surface of the vapor deposition mask 1. It is desirable that the vapor deposition mask 1 has a shape that follows the second surface of the vapor deposition mask 1 . Thereby, the vapor deposition mask 1 and the cathode 52 are brought into close contact with each other, the contact area of the cathode 52 with the vapor deposition mask 1 is increased, and the occurrence of rust R on the vapor deposition mask 1 can be more reliably reduced or prevented. Cleaning efficiency can be further improved.

In this embodiment, the cathode 52 may include a frame portion 52b having a frame shape and a mesh portion 52c provided within the frame portion 52b, as shown in FIG. 13 described later. The frame portion 52b corresponds to the contact portion of the vapor deposition mask 1 with the mask frame 2, and the mesh portion 52c corresponds to the contact portion with the vapor deposition sheet 6. As described above, since the part of the cathode 52 in contact with the vapor deposition sheet 6 has a mesh structure, the flow of the electrolytic solution 41 in the cleaning tank 32 is not obstructed by the cathode 52, and the cleaning ability is improved. cleaning efficiency can be improved.

Note that even in the case where the cathode 52 is the third metal member and has the frame portion 52b and the mesh portion 52c, the cathode 52 and the vapor deposition sheet 6 of the vapor deposition mask 1 are separated from each other in the mesh portion 52c. In order to ensure a sufficient contact area, the finer the mesh (smaller the opening), the better, and in order not to impede the contact between the vapor deposition mask 1 and the electrolyte 41, the coarser the mesh (larger the opening). Moderately good. The wire diameter (line width) and opening of the mesh structure in the mesh portion 52c may be appropriately set according to the size, material, cleaning conditions, etc. of the vapor deposition mask 1, and are not particularly limited, but as an example, For example, it is set to about the size of a screen door.

Further, like the cleaning device 31, the cleaning device 51 according to the present embodiment also includes a stirring member (not shown) in the cleaning tank 32, and performs electrolytic cleaning of the vapor deposition mask 1 while stirring the electrolyte 41 with the stirring member. Good too. When the cleaning device 51 further includes the stirring member in this way, the stirring member causes liquid flow such as convection and circulation of the electrolytic solution 41, so that cleaning efficiency can be further improved.

Next, the flow of the deposition mask electrolytic cleaning step (step S3a) using the cleaning device 51 will be described below with reference to FIG. 12.

FIG. 12 is a sectional view showing a part of the vapor deposition mask electrolytic cleaning process using the cleaning device 51.

As shown in FIG. 12, in the vapor deposition mask electrolytic cleaning step, first, the cleaning tank 32 is filled with an amount of electrolytic solution 41 sufficient to immerse the vapor deposition mask 1. Next, the vapor deposition mask 1 is immersed in the electrolytic solution 41 and placed on the support portion 52a of the cathode 52 using the transfer device 37 equipped with the transfer arm 37a. It is supported by the portion 52a. Thereby, the vapor deposition mask 1 is placed in the cleaning tank 32 in a state in which it is in contact with the cathode 52. As a result, the vapor deposition mask 1 and the cathode 52 are arranged to face the anode 34, respectively, with the vapor deposition mask 1 in contact with the cathode 52 in the electrolytic solution 41. As described above, in this embodiment as well, a plurality of anodes 34 are provided in the cleaning tank 32 with the cathode 52 interposed therebetween in plan view. Therefore, by supporting the vapor deposition mask 1 with the support portion 52a, the vapor deposition mask 1 faces the anode 34.

Next, electricity is supplied from the power source 36 between the cathode 52 and the anode 34. Thereby, as described above, hydrogen is generated from the surface of the vapor deposition mask 1 and the surface of the cathode 52, respectively, and the vapor deposition mask 1 is electrolytically cleaned. As a result, as described above, dirt and deposits on the surface of the vapor deposition mask 1 are removed.

In addition, also in this embodiment, the concentration of the electrolytic solution 41 and the voltage applied between the cathode 52 and the anode 34 may be set in the same manner as in the conventional case, and are not particularly limited.

The vapor deposition mask 1 electrolytically cleaned by the cleaning device 51 is lifted out of the cleaning tank 32 by the transportation device 37 and transported to a rinsing device (not shown). The vapor deposition mask 1 electrolytically cleaned in the cleaning device 51 is cleaned (rinsed) with, for example, pure water in this rinsing device, and then transported to a drying device (not shown) and dried.

FIG. 13 is a sectional view showing a schematic configuration of the cleaning device 51 after the electrolytically cleaned deposition mask 1 is taken out after the deposition mask electrolytic cleaning step.

As described above, when the vapor deposition mask 1 is electrolytically cleaned with the cathode 52 in contact with the vapor deposition mask 1, the corrosion rate of the cathode 52 increases due to catalytic corrosion of different metals, while the corrosion rate of the vapor deposition mask 1 decreases. As a result, the cathode 52 acts as a sacrificial electrode, and only the cathode 52 corrodes, causing rust R to occur only on the cathode 52, as shown in FIG. As a result, the possibility that rust R will occur on the vapor deposition mask 1 can be reduced.

When the vapor deposition mask 1 is electrolytically cleaned with the cathode 52 in contact with the vapor deposition mask 1 in this manner, rust R is generated on the cathode 52 instead of suppressing the formation of rust R on the vapor deposition mask 1.

As described above, the cathode 52 itself is also cleaned to some extent during cleaning of the vapor deposition mask 1, but rust R inevitably occurs on the cathode 52 by repeating electrolytic cleaning.

Therefore, the cleaning process (step S3) is a third metal member cleaning process for cleaning the third metal member used for electrolytic cleaning of the evaporation mask 1. As shown in FIG. It is desirable to further include a cathode cleaning step of electrolytically cleaning the cathode 52 after the step.

FIG. 14 is a cross-sectional view showing the treatment in the cathode cleaning step.

As shown in FIG. 14, in the cathode cleaning step, only the cathode 52 where rust R has occurred after the vapor deposition mask electrolytic cleaning step is opposed to the anode 34 in the electrolytic solution 41, and hydrogen is generated from the surface of the cathode 52. The cathode 52 is electrolytically cleaned. By performing electrolysis with only the cathode 52 of the vapor deposition mask 1 and the cathode 52 in the cleaning tank 32, the rust R generated on the cathode 52 can be removed, and the cathode 52 can be kept in a clean state. can be kept.

As described above, according to this embodiment, the cathode 52 acts as a sacrificial electrode during electrolytic cleaning of the vapor deposition mask 1, and rust R occurs only on the cathode 52. As a result, the possibility that rust R will occur on the vapor deposition mask 1 can be reduced. Therefore, according to the present embodiment, a method for cleaning the deposition mask 1 and a cleaning device 51 for cleaning the deposition mask 1 are provided, which can reduce the possibility that rust R will occur due to contact corrosion of different metals in the deposition mask 1. can be provided.

Further, in this embodiment, as described above, the cathode 52 itself in the cleaning tank 32 is made of a base metal that is baser than the first metal and the second metal that are the materials of the vapor deposition mask 1, and the base metal member (the third Electrolysis is performed by connecting the vapor deposition mask 1 to the cathode 52, which is a metal member. Therefore, according to the present embodiment, there is no need to transport and install the third metal member every time the vapor deposition mask 1 is cleaned, and the same electrolysis as in the first embodiment can be performed by transporting and installing only the vapor deposition mask 1. Can be washed.

〔summary〕
A method for cleaning a vapor deposition mask according to aspect 1 of the present disclosure includes a first metal part made of a first metal, and a second metal part made of a second metal that contacts the first metal part, and the method includes a second metal part made of a second metal, and removes vapor deposition particles. A method for cleaning a vapor deposition mask having a plurality of through holes through which the vapor deposition mask is passed, the method including a vapor deposition mask electrolytic cleaning step of electrolytically cleaning the vapor deposition mask, wherein the vapor deposition mask electrolytic cleaning step includes cleaning the plurality of through holes in the vapor deposition mask. A third metal member made of a third metal is brought into contact with one main surface provided with the vapor deposition mask in an electrolytic solution, and the third metal is dissolved in the electrolytic solution. and is a base metal that is baser than the first metal and the second metal.

A method for cleaning a vapor deposition mask according to Aspect 2 of the present disclosure is such that in Aspect 1, in the electrolytic cleaning step of the vapor deposition mask, the vapor deposition mask and the third metal member are each brought into contact with a cathode in the electrolytic solution. The vapor deposition mask may be electrolytically cleaned by generating hydrogen from the surface of the vapor deposition mask and the surface of the third metal member, each of which is disposed to face the anode.

Aspect 3 of the present disclosure provides a method for cleaning a vapor deposition mask according to Aspect 2, in which, after the electrolytic cleaning step of the vapor deposition mask, only the third metal member is brought into contact with the cathode in the electrolytic solution. The method may further include a third metal member cleaning step of electrolytically cleaning the third metal member by generating hydrogen from the surface of the third metal member facing the anode.

In the vapor deposition mask cleaning method according to Aspect 4 of the present disclosure, in Aspect 1, the third metal member is a cathode, and in the vapor deposition mask electrolytic cleaning step, the vapor deposition mask and the third metal member are The vapor deposition mask may be electrolytically cleaned by generating hydrogen from the surface of the vapor deposition mask and the surface of the third metal member, each of which is disposed in a solution to face an anode.

Aspect 5 of the present disclosure provides a method for cleaning a vapor deposition mask according to Aspect 4, in which, after the electrolytic cleaning step of the vapor deposition mask, only the third metal member is made to face the anode in the electrolytic solution, and The method may further include a third metal member cleaning step of electrolytically cleaning the third metal member by generating hydrogen from the surface of the metal member.

Aspect 6 of the present disclosure provides a method for cleaning a vapor deposition mask according to any one of Aspects 1 to 5 above, in which in the electrolytic cleaning step of the vapor deposition mask, the third metal member is provided on the entire one principal surface of the vapor deposition mask. may be covered.

Aspect 7 of the present disclosure provides a method for cleaning a vapor deposition mask according to any one of Aspects 1 to 6, wherein the vapor deposition mask includes a mask frame having the first metal part and the second metal part, and the plurality of through holes. A vapor deposition sheet having holes and fixed to the mask frame may be provided, and a contact portion of the third metal member with the vapor deposition sheet may have a mesh structure.

Aspect 8 of the present disclosure provides a method for cleaning a vapor deposition mask according to any of Aspects 1 to 7, in which a contact surface of the third metal member with the vapor deposition mask is located on the one main surface of the vapor deposition mask. It may have a shape that follows.

Aspect 9 of the present disclosure provides a method for cleaning a vapor deposition mask according to any one of Aspects 1 to 8, in which the one main surface of the vapor deposition mask that contacts the third metal member is opposite to the substrate to be vapor deposited. The surface may be on the opposite side.

Aspect 10 of the present disclosure provides a method for cleaning a vapor deposition mask according to any one of Aspects 1 to 9, in which the one main surface of the vapor deposition mask that is in contact with the third metal member is opposite to the first metal part. It may be the surface opposite to the mounting surface of the second metal part.

Aspect 11 of the present disclosure provides a method for cleaning a vapor deposition mask according to any one of Aspects 1 to 10, wherein the first metal and the second metal are invar and stainless steel, and the third metal is magnesium or It may also be a magnesium alloy.

A vapor deposition mask cleaning apparatus according to aspect 12 of the present disclosure includes a first metal part made of a first metal, and a second metal part made of a second metal that contacts the first metal part, and allows vapor deposition particles to pass through. A deposition mask cleaning device for electrolytically cleaning a deposition mask having a plurality of through holes in an electrolytic solution, the cleaning device comprising: a cleaning tank storing the electrolytic solution, a cathode provided in the cleaning tank, and the cleaning tank. a plurality of anodes provided with the cathode sandwiched therein; and a third metal member made of a third metal that is in contact with one main surface of the vapor deposition mask on which the plurality of through holes are provided. , the third metal is a base metal that does not dissolve in the electrolytic solution and is more base than the first metal and the second metal, and the cathode is a base metal that does not dissolve in the electrolytic solution, and the cathode is a base metal that does not dissolve in the electrolytic solution and is less noble than the first metal and the second metal, and the cathode The device includes a support portion that contacts the members and removably supports the vapor deposition mask and the third metal member.

A vapor deposition mask cleaning apparatus according to aspect 13 of the present disclosure includes a first metal part made of a first metal, and a second metal part made of a second metal that contacts the first metal part, and allows vapor deposition particles to pass through. A deposition mask cleaning device for electrolytically cleaning a deposition mask having a plurality of through holes in an electrolytic solution, the cleaning device comprising: a cleaning tank storing the electrolytic solution, a cathode provided in the cleaning tank, and the cleaning tank. a plurality of anodes provided with the cathode sandwiched therein, the cathode being a base metal that does not dissolve in the electrolyte and is baser than the first metal and the second metal. a third metal member made of a third metal, the support part in which the cathode removably supports the vapor deposition mask by contacting one main surface of the vapor deposition mask on which the plurality of through holes are provided; Equipped with.

In the vapor deposition mask cleaning apparatus according to aspect 14 of the present disclosure, in aspect 12 or 13, the third metal member may have a shape that covers the entire one principal surface of the vapor deposition mask.

A vapor deposition mask cleaning apparatus according to an aspect 15 of the present disclosure is a vapor deposition mask cleaning apparatus according to any one of the aspects 12 to 14, wherein the vapor deposition mask includes a mask frame having the first metal part and the second metal part, and the plurality of through holes. and a vapor deposition sheet fixed to the mask frame, and a contact portion of the third metal member with the vapor deposition sheet may have a mesh structure.

In the vapor deposition mask cleaning apparatus according to aspect 16 of the present disclosure, in any one of aspects 12 to 15, the contact surface of the third metal member with the vapor deposition mask is arranged along the one main surface of the vapor deposition mask. It may have a different shape.

In the vapor deposition mask cleaning apparatus according to aspect 17 of the present disclosure, in any one of aspects 12 to 16, the one main surface of the vapor deposition mask that contacts the third metal member is a surface facing the substrate to be vapor deposited. It may be the opposite side.

In the vapor deposition mask cleaning apparatus according to aspect 18 of the present disclosure, in any one of the aspects 12 to 17, the one main surface of the vapor deposition mask that is in contact with the third metal member is the same as that of the first metal part. It may be the surface opposite to the mounting surface of the second metal part.

In the vapor deposition mask cleaning apparatus according to aspect 19 of the present disclosure, in any one of aspects 12 to 18, the first metal and the second metal are invar and stainless steel, and the third metal is magnesium or magnesium. It may be an alloy.

The present disclosure is not limited to the embodiments described above, and various changes can be made within the scope of the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. are also included within the technical scope of the present disclosure. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment.

1 Vapor deposition mask 2 Mask frame (frame part, first metal part)
3 Howling seat (frame part, second metal part)
4 Cover sheet (frame part, first metal part)
5 Alignment sheet (frame part, first metal part)
6 Vapor deposition sheet (first metal part)
11 Deposition substrate 31, 51 Cleaning device 32 Cleaning tank 33 Cathode 35 Backing plate (third metal member)
52 Cathode (third metal member)
34 Anode 33a, 52a Support part 35b, 52c Mesh part (mesh structure)
41 Electrolyte Z Vapor deposited particles

Claims (19)

A method for cleaning a vapor deposition mask comprising a first metal part made of a first metal and a second metal part made of a second metal in contact with the first metal part, and having a plurality of through holes through which vapor deposition particles pass. There it is,
including a deposition mask electrolytic cleaning step of electrolytically cleaning the deposition mask,
In the vapor deposition mask electrolytic cleaning step, a third metal member made of a third metal is brought into contact with one main surface of the vapor deposition mask on which the plurality of through holes are provided, and the vapor deposition mask is placed in an electrolytic solution. Along with electrolytic cleaning,
A method for cleaning a vapor deposition mask, characterized in that the third metal is a base metal that does not dissolve in the electrolytic solution and is baser than the first metal and the second metal. In the vapor deposition mask electrolytic cleaning step, the vapor deposition mask and the third metal member are each placed in contact with the cathode and facing the anode in the electrolytic solution, and the surface of the vapor deposition mask and the third metal member are placed in contact with the cathode. 2. The method of cleaning a vapor deposition mask according to claim 1, wherein the vapor deposition mask is electrolytically cleaned by generating hydrogen from the surfaces of each member. After the vapor deposition mask electrolytic cleaning step, only the third metal member is placed in contact with the cathode and facing the anode in the electrolytic solution, and hydrogen is generated from the surface of the third metal member to generate the 3. The method of cleaning a vapor deposition mask according to claim 2, further comprising a third metal member cleaning step of electrolytically cleaning the third metal member. the third metal member is a cathode,
In the evaporation mask electrolytic cleaning step, the evaporation mask and the third metal member are each arranged to face an anode in the electrolytic solution, and hydrogen is generated from the surface of the evaporation mask and the surface of the third metal member, respectively. 2. The method for cleaning a vapor deposition mask according to claim 1, wherein the vapor deposition mask is electrolytically cleaned. After the vapor deposition mask electrolytic cleaning step, only the third metal member is placed facing the anode in the electrolytic solution, hydrogen is generated from the surface of the third metal member, and the third metal member is electrolytically cleaned. 5. The method for cleaning a vapor deposition mask according to claim 4, further comprising a third metal member cleaning step. The vapor deposition mask according to any one of claims 1 to 5, wherein in the vapor deposition mask electrolytic cleaning step, the third metal member covers the entire one main surface of the vapor deposition mask. cleaning method. The above vapor deposition mask is
a frame portion having the first metal portion and the second metal portion;
a vapor deposition sheet having the plurality of through holes and fixed to the frame portion,
7. The method for cleaning a vapor deposition mask according to claim 6, wherein a portion of the third metal member that comes into contact with the vapor deposition sheet has a mesh structure. 8. The method for cleaning a vapor deposition mask according to claim 7, wherein a contact surface of the third metal member with the vapor deposition mask has a shape along the one main surface of the vapor deposition mask. . Cleaning of the vapor deposition mask according to claim 8, wherein the one main surface of the vapor deposition mask that is in contact with the third metal member is a surface opposite to a surface facing the substrate to be vapor deposited. Method. Claim 9, wherein the one main surface of the vapor deposition mask that the third metal member comes into contact with is a surface opposite to a surface on which the second metal part is attached to the first metal part. The method for cleaning a vapor deposition mask described in . the first metal and the second metal are invar and stainless steel,
11. The method for cleaning a vapor deposition mask according to claim 10, wherein the third metal is magnesium or a magnesium alloy. A vapor deposition mask comprising a first metal part made of a first metal and a second metal part made of a second metal in contact with the first metal part, and having a plurality of through holes through which vapor deposition particles pass, is connected to an electrolytic solution. A vapor deposition mask cleaning device that performs electrolytic cleaning inside the device,
a cleaning tank that stores the electrolyte;
a cathode provided in the cleaning tank;
a plurality of anodes provided in the cleaning tank with the cathode sandwiched therebetween;
a third metal member made of a third metal and in contact with one main surface of the vapor deposition mask provided with the plurality of through holes;
The third metal is a base metal that does not dissolve in the electrolytic solution and is baser than the first metal and the second metal,
A vapor deposition mask cleaning apparatus characterized in that the cathode includes a support portion that is in contact with the vapor deposition mask and the third metal member, and supports the vapor deposition mask and the third metal member in a removable manner. A vapor deposition mask comprising a first metal part made of a first metal and a second metal part made of a second metal in contact with the first metal part, and having a plurality of through holes through which vapor deposition particles pass, is connected to an electrolytic solution. A vapor deposition mask cleaning device that performs electrolytic cleaning inside the device,
a cleaning tank that stores the electrolyte;
A cathode provided in the cleaning tank;
a plurality of anodes provided in the cleaning tank with the cathode sandwiched therebetween;
The cathode is a third metal member made of a third metal that does not dissolve in the electrolytic solution and is a base metal that is baser than the first metal and the second metal,
A vapor deposition mask cleaning apparatus characterized in that the cathode includes a support portion that removably supports the vapor deposition mask by contacting one main surface of the vapor deposition mask on which the plurality of through holes are provided. The vapor deposition mask cleaning apparatus according to claim 12 or 13, wherein the third metal member has a shape that covers the entire one main surface of the vapor deposition mask. The above vapor deposition mask is
a frame portion having the first metal portion and the second metal portion;
a vapor deposition sheet having the plurality of through holes and fixed to the frame portion,
15. The vapor deposition mask cleaning apparatus according to claim 14, wherein a portion of the third metal member that comes into contact with the vapor deposition sheet has a mesh structure. 16. The vapor deposition mask cleaning apparatus according to claim 15, wherein a contact surface of the third metal member with the vapor deposition mask has a shape along the one main surface of the vapor deposition mask. The vapor deposition mask cleaning apparatus according to claim 16, wherein the one main surface of the vapor deposition mask that is in contact with the third metal member is a surface opposite to a surface facing the substrate to be vapor deposited. . 17. The one main surface of the vapor deposition mask that is in contact with the third metal member is a surface opposite to the attachment surface of the second metal part to the first metal part. The vapor deposition mask cleaning device described in . the first metal and the second metal are invar and stainless steel,
19. The vapor deposition mask cleaning apparatus according to claim 18, wherein the third metal is magnesium or a magnesium alloy.

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