JP2024012355A - Vapor deposition mask packing body and device for packing vapor deposition mask - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vapor deposition mask packing body that inhibits a vapor deposition mask from plastically deforming during transportation, and to provide a device for packing a vapor deposition mask.

SOLUTION: A vapor deposition mask packing body includes: a first proximal part; a second proximal part facing the first proximal part; and a vapor deposition mask 20 which is disposed between the first proximal part and the second proximal part and in which a plurality of through-holes is formed. A spacer 64 is disposed on each of both sides in a width direction D2 of the vapor deposition mask. A first sheet 82 is disposed between the vapor deposition mask and the second proximal part. The second proximal part includes a protrusion 67 disposed in at least one of both end parts in a longitudinal direction of the vapor deposition mask in plan view. The protrusion presses the first sheet. An air gap 68 is formed between the first sheet and the second proximal part around the protrusion.

SELECTED DRAWING: Figure 31

COPYRIGHT: (C)2024,JPO&INPIT

Description

Embodiments of the present disclosure relate to a vapor deposition mask package in which a vapor deposition mask including a plurality of through holes is packed, and a vapor deposition mask packaging device.

In recent years, display devices used in portable devices such as smartphones and tablet PCs are desired to have high definition, for example, to have a pixel density of 500 ppi or more. Furthermore, there is an increasing demand for portable devices to be compatible with ultra-high definition, and in this case, it is desired that the pixel density of the display device be, for example, 800 ppi or higher.

Among display devices, organic EL display devices are attracting attention because of their good responsiveness, low power consumption, and high contrast. 2. Description of the Related Art As a method for forming pixels of an organic EL display device, a method is known in which pixels are formed in a desired pattern using a vapor deposition mask in which through-holes are formed in a desired pattern. Specifically, first, a vapor deposition mask is brought into close contact with a substrate for an organic EL display device, and then the adhered vapor deposition mask and substrate are both put into a vapor deposition apparatus, and an organic material is vapor deposited onto the substrate. I do. In this case, in order to precisely manufacture an organic EL display device with high pixel density, it is desirable to precisely reproduce the position and shape of the through-holes of the vapor deposition mask according to the design.

As a method for manufacturing a vapor deposition mask, a method is known in which through holes are formed in a metal plate by etching using photolithography, as disclosed in Patent Document 1, for example. For example, first, a first resist pattern is formed on the first surface of the metal plate, and a second resist pattern is formed on the second surface of the metal plate. Next, a region of the first surface of the metal plate that is not covered by the first resist pattern is etched to form a first opening on the first surface of the metal plate. Thereafter, a region of the second surface of the metal plate that is not covered by the second resist pattern is etched to form a second opening on the second surface of the metal plate. At this time, by performing etching so that the first opening and the second opening communicate with each other, a through hole penetrating the metal plate can be formed. A metal plate for producing a deposition mask is obtained, for example, by rolling a base material such as an iron alloy.

In addition, as a method of manufacturing a vapor deposition mask, a method of manufacturing a vapor deposition mask using a plating process is known, for example, as disclosed in Patent Document 2. For example, in the method described in Patent Document 2, first, a conductive base material is prepared. Next, a resist pattern is formed on the base material with predetermined gaps. This resist pattern is provided at the position where the through hole of the vapor deposition mask is to be formed. Thereafter, a plating solution is supplied into the gaps between the resist patterns, and a metal layer is deposited on the base material by electrolytic plating. Thereafter, by separating the metal layer from the base material, a vapor deposition mask in which a plurality of through holes are formed can be obtained. When plating is used in this way, it is possible to achieve high definition through holes.

Patent No. 5382259 Japanese Patent Application Publication No. 2001-234385

When transporting a vapor deposition mask, the vapor deposition mask is sometimes held between a receiving part (first base part) and a lid part (second base part) made of a plastic board or the like. However, in this case, the pressure applied to the vapor deposition mask from the receiving part and the lid part may become partially non-uniform. As a result, when external vibrations are transmitted to the deposition mask via the receiving part and the lid, the part of the deposition mask where the pressure is relatively weak moves relative to the receiving part and the lid, causing the deposition There is a problem that the mask can be plastically deformed.

Here, when forming a film of vapor deposition material on a substrate using a vapor deposition mask, the vapor deposition material adheres not only to the substrate but also to the vapor deposition mask. For example, some evaporation materials move towards the substrate along a direction that is highly inclined to the normal direction of the evaporation mask, but such evaporation materials are deposited before reaching the substrate. It reaches and adheres to the wall of the through hole of the mask. In this case, it becomes difficult for the vapor deposition material to adhere to the area of the substrate located near the wall surface of the through hole of the vapor deposition mask, and as a result, the thickness of the deposited vapor deposition material becomes smaller than other parts. It is conceivable that some parts may not be coated with the vapor deposition material. That is, it is conceivable that the vapor deposition near the wall surface of the through hole of the vapor deposition mask becomes unstable. As a result, the luminous efficiency of the organic EL display device decreases.

In order to solve such problems, it is conceivable to reduce the thickness of the metal plate used to manufacture the vapor deposition mask. This is because by reducing the thickness of the metal plate, the height of the wall surface of the through hole in the evaporation mask can be reduced, thereby reducing the proportion of the evaporation material that adheres to the wall surface of the through hole. This is because it can be done.

As described above, in order to suppress a decrease in luminous efficiency of an organic EL display device, the thickness of a vapor deposition mask tends to become thinner. For this reason, it is desired that plastic deformation during transportation be suppressed even with a thin vapor deposition mask.

Another problem is that the vapor deposition mask may be plastically deformed due to temperature changes during transportation. That is, when the receiving part, the lid part, and the vapor deposition mask have different coefficients of thermal expansion, the dimensional changes due to temperature changes of each member are different, and the vapor deposition mask may be plastically deformed into wrinkles.

An object of the embodiments of the present disclosure is to provide a vapor deposition mask package and a vapor deposition mask packaging device that can suppress plastic deformation of a vapor deposition mask during transportation.

A first aspect of the present disclosure includes:
a first base;
a second base opposite to the first base;
a vapor deposition mask disposed between the first base and the second base and having a plurality of through holes formed therein;
spacers arranged on both sides of the vapor deposition mask in the width direction;
a first sheet disposed between the vapor deposition mask and the second base;
The second base has a convex portion disposed at at least one of both ends in the longitudinal direction of the vapor deposition mask in a plan view,
The convex portion presses the first sheet,
A vapor deposition mask package, wherein a gap is formed between the first sheet and the second base in the periphery of the convex part;
It is.

A second aspect of the present disclosure is a vapor deposition mask package according to the first aspect described above, which includes:
The convex portion does not overlap the through hole in plan view.

A third aspect of the present disclosure is a vapor deposition mask package according to the first aspect or the second aspect described above,
The vapor deposition mask has end openings provided at both ends in the longitudinal direction,
The convex portion is arranged at a position overlapping the corresponding end opening in plan view.

A fourth aspect of the present disclosure is a vapor deposition mask package according to the third aspect described above,
The convex portion does not protrude from the corresponding end opening in plan view.

A fifth aspect of the present disclosure is a vapor deposition mask package according to the first aspect or the second aspect described above,
The convex portion extends in the width direction of the vapor deposition mask.

A sixth aspect of the present disclosure is the vapor deposition mask package according to the first aspect described above,
The convex portion extends in the longitudinal direction of the vapor deposition mask.

A seventh aspect of the present disclosure is a vapor deposition mask package according to the sixth aspect described above, which includes:
The convex portions are arranged at both ends in the longitudinal direction of the vapor deposition mask in plan view,
The pair of convex portions are integrally formed in a continuous shape.

An eighth aspect of the present disclosure is a vapor deposition mask package according to the first to seventh aspects described above,
The hardness of the convex portion is lower than the hardness of the first base and the hardness of the second base.

A ninth aspect of the present disclosure provides a vapor deposition mask package according to the first to eighth aspects described above,
The hardness of the spacer is higher than the hardness of the first base and the hardness of the second base.

A tenth aspect of the present disclosure is:
A fourth sheet is arranged between the first sheet and the second base,
The thickness of the fourth sheet is greater than the thickness of the first sheet.

An eleventh aspect of the present disclosure is:
a first base;
a second base opposite to the first base;
a vapor deposition mask disposed between the first base and the second base and having a plurality of through holes formed therein;
spacers arranged on both sides of the vapor deposition mask in the width direction;
a first sheet disposed between the vapor deposition mask and the second base;
The first base has a facing surface facing the second base,
The opposing surface includes a curved surface that is convex toward the second base,
The curved surface includes a ridge line extending from one end edge of the vapor deposition mask in the longitudinal direction to the other edge, or extending from one side edge to the other side edge of the vapor deposition mask in the width direction. Vapor deposition mask packaging,
It is.

A twelfth aspect of the present disclosure is a vapor deposition mask package according to the first to eleventh aspects described above,
The method further includes a second sheet disposed between the vapor deposition mask and the first base.

A thirteenth aspect of the present disclosure is a vapor deposition mask package according to the above-described twelfth aspect, comprising:
A plurality of the vapor deposition masks are stacked between the first sheet and the second sheet,
a third sheet is arranged between the vapor deposition masks adjacent to each other;
You can do it like this.

A fourteenth aspect of the present disclosure is:
A vapor deposition mask packing device for packing a longitudinal vapor deposition mask in which a plurality of through holes are formed,
a first base;
a second base opposite to the first base;
a pair of spacers arranged between the first base and the second base, the pair of spacers defining an accommodation space in which the vapor deposition mask is accommodated between the pair of spacers;
a packaging device for a vapor deposition mask, wherein the second base has a convex portion disposed at at least one of both ends in the longitudinal direction of the accommodation space in plan view;
It is.

A fifteenth aspect of the present disclosure is:
A vapor deposition mask packing device for packing a longitudinal vapor deposition mask in which a plurality of through holes are formed,
a first base;
a second base opposite to the first base;
a pair of spacers arranged between the first base and the second base, the pair of spacers defining an accommodation space in which the vapor deposition mask is accommodated between the pair of spacers;
The first base has a facing surface facing the second base,
The opposing surface includes a curved surface that is convex toward the second base,
In plan view, the curved surface extends from one end edge of the accommodation space in the longitudinal direction to the other end edge, or extends from one side edge of the accommodation space in a direction orthogonal to the longitudinal direction. a packaging device for a vapor deposition mask, the packaging device including a ridge line extending across the
It is.

According to an embodiment of the present disclosure, plastic deformation of the deposition mask during transportation can be suppressed.

FIG. 1 is a diagram showing a vapor deposition apparatus including a vapor deposition mask device according to an embodiment of the present disclosure. 2 is a cross-sectional view showing an organic EL display device (organic EL display device intermediate) manufactured using the vapor deposition mask device shown in FIG. 1. FIG. FIG. 1 is a plan view showing a vapor deposition mask device according to an embodiment of the present disclosure. FIG. 4 is a partial plan view showing an effective area of the deposition mask shown in FIG. 3; 5 is a sectional view taken along line AA in FIG. 4. FIG. 5 is a sectional view taken along line BB in FIG. 4. FIG. 5 is a sectional view taken along line CC in FIG. 4. FIG. FIG. 6 is an enlarged cross-sectional view showing the through hole shown in FIG. 5 and a region in the vicinity thereof. It is a figure which shows the process of rolling a base material and obtaining the metal plate which has desired thickness. It is a figure which shows the process of annealing the metal plate obtained by rolling. FIG. 2 is a schematic diagram for generally explaining an example of a method for manufacturing a vapor deposition mask. It is a figure which shows the process of forming a resist film on a metal plate. FIG. 3 is a diagram showing a process of bringing an exposure mask into close contact with a resist film. It is a figure which shows the process of developing a resist film. It is a figure which shows the 1st surface etching process. It is a figure which shows the process of covering a 1st recessed part with resin. It is a figure which shows the second surface etching process. 19 is a diagram showing a second surface etching step following FIG. 18. FIG. It is a figure which shows the process of removing resin and a resist pattern from a long metal plate. FIG. 3 is a plan view showing an enlarged effective area of a vapor deposition mask. 21 is a cross-sectional view of the effective area in FIG. 20 viewed from the DD direction. FIG. 22 is a partially enlarged cross-sectional view of the vapor deposition mask of FIG. 21. FIG. FIG. 2 is a diagram illustrating an example of a method for manufacturing a deposition mask according to an embodiment of the present disclosure. FIG. 2 is a diagram illustrating an example of a method for manufacturing a deposition mask according to an embodiment of the present disclosure. FIG. 2 is a diagram illustrating an example of a method for manufacturing a deposition mask according to an embodiment of the present disclosure. FIG. 2 is a diagram illustrating an example of a method for manufacturing a deposition mask according to an embodiment of the present disclosure. FIG. 1 is a perspective view showing a vapor deposition mask package according to an embodiment of the present disclosure. 28 is a cross-sectional view showing the vapor deposition mask package of FIG. 27. FIG. FIG. 28 is a perspective view showing the lid portion of FIG. 27 turned over; FIG. 28 is a perspective view showing the receiving portion of FIG. 27; 28 is a partially enlarged sectional view of the vapor deposition mask package shown in FIG. 27. FIG. 32 is a sectional view taken along line EE shown in FIG. 31. FIG. FIG. 7 is a cross-sectional view showing a vapor deposition mask package according to a first modified example of an embodiment of the present disclosure. FIG. 7 is a partially enlarged sectional view of a vapor deposition mask package according to a second modification of an embodiment of the present disclosure. It is a perspective view which shows the 2nd base according to the 3rd modification of one embodiment of this disclosure upside down. FIG. 7 is a partially enlarged sectional view of a vapor deposition mask package according to a third modification of an embodiment of the present disclosure. FIG. 33 is a cross-sectional view corresponding to FIG. 32 in a third modified example of an embodiment of the present disclosure. It is a perspective view which shows the 2nd base according to the 4th modification of one embodiment of this disclosure upside down. FIG. 33 is a cross-sectional view corresponding to FIG. 32 in a fourth modified example of an embodiment of the present disclosure. It is a perspective view which shows the 2nd base according to the 5th modification of one embodiment of this disclosure upside down. It is a perspective view which shows the 1st base by the 5th modification of one embodiment of this disclosure. FIG. 7 is a partially enlarged sectional view of a vapor deposition mask package according to a fifth modification of an embodiment of the present disclosure. FIG. 33 is a cross-sectional view corresponding to FIG. 32 in a fifth modification example of an embodiment of the present disclosure. It is a perspective view which shows the 1st base by the 6th modification of one embodiment of this disclosure. It is a longitudinal cross-sectional view which shows the vapor deposition mask package by the 6th modification of one embodiment of this disclosure. FIG. 33 is a cross-sectional view corresponding to FIG. 32 in a sixth modification example of an embodiment of the present disclosure. 3 is a table showing the results of an environmental test and a drop test according to an example of an embodiment of the present disclosure.

Embodiments of the present disclosure will be described below with reference to the drawings. In addition, in the drawings attached to this specification, for convenience of illustration and ease of understanding, the scale and the vertical and horizontal dimensional ratios are appropriately changed and exaggerated from those of the actual drawings.

Note that in this specification, for example, the term "plate" is used to have the same meaning as a member that can be called a sheet or a film.

In this specification, "planar view" refers to the state seen from the normal direction orthogonal to the plane direction of the plate-shaped member when the symmetrical plate-shaped member is viewed from a holistic perspective. . For example, a statement that a plate-shaped member "has a rectangular shape in plan view" means that the member has a rectangular shape when the member is viewed from the normal direction.

Furthermore, as used herein, terms such as "parallel," "perpendicular," "identical," "equivalent," and lengths and angles specify shapes, geometrical conditions, physical characteristics, and their degree. In addition, the values of physical properties, etc. shall be interpreted to include the range to which similar functions can be expected, without being bound by strict meanings.

Note that the embodiments of the present disclosure may be combined with other embodiments and modifications to the extent that no contradiction occurs. Further, other embodiments and other embodiments and modifications may be combined as long as no contradiction occurs. Furthermore, the modified examples may be combined with each other as long as no contradiction occurs.

Further, in an embodiment of the present disclosure, when a plurality of steps are disclosed regarding a method such as a manufacturing method, other steps not disclosed may be performed between the disclosed steps. Further, the order of the disclosed steps is arbitrary as long as no contradiction occurs.

In this specification, the numerical range expressed by the symbol "~" includes the numerical values placed before and after the symbol "~". For example, the numerical range defined by the expression "34-38 mass%" is the same as the numerical range defined by the expression "34 mass% or more and 38 mass% or less."

(Vapor deposition equipment)
First, a vapor deposition apparatus 90 that performs a vapor deposition process of vapor depositing a vapor deposition material onto an object will be described with reference to FIG. As shown in FIG. 1, the vapor deposition apparatus 90 includes a vapor deposition source (for example, a crucible 94), a heater 96, and a vapor deposition mask device 10. Crucible 94 contains a deposited material 98, such as an organic light emitting material. The heater 96 heats the crucible 94 to evaporate the deposition material 98. The vapor deposition mask device 10 is arranged to face the crucible 94.

(Vapor deposition mask device)
The vapor deposition mask device 10 will be explained below. As shown in FIG. 1, the vapor deposition mask device 10 includes a vapor deposition mask 20 and a frame 15 that supports the vapor deposition mask 20. The frame 15 supports the vapor deposition mask 20 in a stretched state in its longitudinal direction D1 (first direction, see FIG. 3) so that the vapor deposition mask 20 does not bend. As shown in FIG. 1, the vapor deposition mask device 10 is arranged within the vapor deposition device 90 so that the vapor deposition mask 20 faces a substrate to which a vapor deposition material 98 is attached, for example, an organic EL substrate 92. In the following description, among the surfaces of the vapor deposition mask 20, the surface on the organic EL substrate 92 side will be referred to as a first surface 20a, and the surface located on the opposite side of the first surface 20a will be referred to as a second surface 20b. The frame 15 faces the second surface 20b of the vapor deposition mask 20.

The vapor deposition mask device 10 may include a magnet 93 arranged on the surface of the organic EL substrate 92 opposite to the vapor deposition mask 20, as shown in FIG. By providing the magnet 93, the vapor deposition mask 20 can be drawn toward the magnet 93 by magnetic force, and the vapor deposition mask 20 can be brought into close contact with the organic EL substrate 92.

FIG. 3 is a plan view showing the vapor deposition mask device 10 when viewed from the first surface 20a side of the vapor deposition mask 20. As shown in FIG. 3, the vapor deposition mask device 10 includes a plurality of vapor deposition masks 20 having a substantially rectangular shape in plan view, and each vapor deposition mask 20 has a pair of end portions 20e in the longitudinal direction D1 of the vapor deposition mask 20. , it is welded and fixed to the frame 15.

Vapor deposition mask 20 includes a plurality of through holes 25 passing through vapor deposition mask 20 . The vapor deposition material 98 that has evaporated from the crucible 94 and reached the vapor deposition mask device 10 passes through the through hole 25 of the vapor deposition mask 20 and adheres to the organic EL substrate 92 . Thereby, the vapor deposition material 98 can be deposited on the surface of the organic EL substrate 92 in a desired pattern corresponding to the positions of the through holes 25 of the vapor deposition mask 20.

FIG. 2 is a cross-sectional view showing an organic EL display device 100 manufactured using the vapor deposition apparatus 90 of FIG. The organic EL display device 100 includes an organic EL substrate 92 and pixels including a vapor deposition material 98 provided in a pattern. Although not shown, the organic EL display device 100 further includes an electrode electrically connected to the pixel containing the vapor deposition material 98. The electrodes are provided on the organic EL substrate 92 in advance, for example, before the vapor deposition material 98 is attached to the organic EL substrate 92 through a vapor deposition process. Furthermore, the organic EL display device 100 may further include other components such as a sealing member that seals the space around the pixel containing the vapor deposition material 98 from the outside. Therefore, it can be said that the organic EL display device 100 in FIG. 2 is an organic EL display device intermediate produced at an intermediate stage of manufacturing an organic EL display device.

Note that if it is desired to perform color display using a plurality of colors, vapor deposition apparatuses 90 each equipped with a vapor deposition mask 20 corresponding to each color are prepared, and the organic EL substrates 92 are sequentially introduced into each vapor deposition apparatus 90. Thereby, for example, an organic light emitting material for red, an organic light emitting material for green, and an organic light emitting material for blue can be sequentially deposited on the organic EL substrate 92.

Incidentally, the vapor deposition process may be performed inside the vapor deposition apparatus 90, which is in a high-temperature atmosphere. In this case, during the vapor deposition process, the vapor deposition mask 20, frame 15, and organic EL substrate 92 held inside the vapor deposition apparatus 90 are also heated. At this time, the vapor deposition mask 20, the frame 15, and the organic EL substrate 92 exhibit dimensional change behavior based on their respective coefficients of thermal expansion. In this case, if the thermal expansion coefficients of the vapor deposition mask 20 or frame 15 and the organic EL substrate 92 are significantly different, a positional shift will occur due to the difference in their dimensional changes, and as a result, the deposits on the organic EL substrate 92 will occur. The dimensional accuracy and positional accuracy of the vapor deposition material 98 will deteriorate.

In order to solve such problems, it is preferable that the thermal expansion coefficients of the vapor deposition mask 20 and the frame 15 are equivalent to the thermal expansion coefficient of the organic EL substrate 92. For example, when a glass substrate is used as the organic EL substrate 92, an iron alloy containing nickel can be used as the main material for the vapor deposition mask 20 and the frame 15. For example, as the material of the metal plate constituting the vapor deposition mask 20, an iron alloy containing 30% by mass or more and 54% by mass or less of nickel can be used. Specific examples of iron alloys containing nickel include Invar material containing nickel of 34% by mass to 38% by mass, Super Invar material containing cobalt in addition to nickel of 30% to 34% by mass, and 48% by mass Examples include low thermal expansion Fe--Ni plating alloys containing 54% by mass or less of nickel.

Note that if the temperatures of the vapor deposition mask 20, frame 15, and organic EL substrate 92 do not reach a high temperature during the vapor deposition process, the thermal expansion coefficients of the vapor deposition mask 20 and frame 15 are set to the thermal expansion coefficient of the organic EL substrate 92. There is no particular need to set them to the same value. In this case, a material other than the above-mentioned iron alloy may be used as the material constituting the vapor deposition mask 20. For example, iron alloys other than the above-mentioned nickel-containing iron alloys, such as chromium-containing iron alloys, may be used. As the iron alloy containing chromium, for example, an iron alloy called stainless steel can be used. Furthermore, alloys other than iron alloys such as nickel and nickel-cobalt alloys may be used.

(vapor deposition mask)
Next, the vapor deposition mask 20 will be explained in detail. As shown in FIGS. 3 to 5, the vapor deposition mask 20 includes an effective region 22 in which a through hole 25 extending from the first surface 20a to the second surface 20b is formed, and a peripheral region 23 surrounding the effective region 22. It's okay to stay. The surrounding region 23 is a region for supporting the effective region 22 and is not a region through which the vapor deposition material 98 intended to be vapor deposited onto the organic EL substrate 92 passes. For example, the effective area 22 is an area of the vapor deposition mask 20 that faces the display area of the organic EL substrate 92.

As shown in FIG. 3, the effective area 22 has, for example, a substantially quadrangular shape in a plan view, and more precisely, a substantially rectangular outline in a plan view. Although not shown, each effective area 22 can have various contours depending on the shape of the display area of the organic EL substrate 92. For example, each effective area 22 may have a circular outline.

As shown in FIG. 3, a plurality of effective regions 22 may be arranged at predetermined intervals along the longitudinal direction D1 of the vapor deposition mask 20. One effective area 22 corresponds to a display area of one organic EL display device 100. Therefore, according to the vapor deposition mask device 10 shown in FIG. 1, it is possible to perform multi-sided vapor deposition of the organic EL display device 100. As shown in FIG. 4, in the effective area 22, the plurality of through holes 25 may be regularly arranged at a predetermined pitch in two directions perpendicular to each other.

As shown in FIG. 3, the vapor deposition mask 20 in this embodiment is formed in an elongated rectangular shape, and the plurality of effective regions 22 are arranged in a line in the center of the vapor deposition mask 20 in the longitudinal direction D1. You can leave it there. The effective area 22 may not be provided at both ends 20e of the vapor deposition mask 20 in the longitudinal direction D1, and an end opening 24 may be provided at each end 20e. That is, in the longitudinal direction D1 of the vapor deposition mask 20, the end openings 24 may be provided on both sides of the plurality of effective regions 22, respectively. The end opening 24 passes through the vapor deposition mask 20 in the thickness direction, and in this embodiment, it has a U-shaped shape that is cut out from the corresponding edge 20g of the vapor deposition mask 20 in plan view. It may also be formed to have a contour. Each end opening 24 is arranged at the center of the vapor deposition mask 20 in the width direction D2 (the second direction, the direction perpendicular to the longitudinal direction D1). Portions on both sides of the end opening 24 in the width direction D2 are held by separate clamps (not shown) of a tensioning jig, so that the vapor deposition mask 20 is stretched. That is, by gripping the end portion 20e of the vapor deposition mask 20 with two clamps and applying tensile force from each clamp, the position of the through hole 25 of the vapor deposition mask 20 during tensioning can be easily adjusted. There is.

Hereinafter, the shape of the through hole 25 and its surrounding portion will be described in detail.

(Vapor deposition mask manufactured by etching process)
Here, the shape of the through hole 25 and its surrounding area will be described when the vapor deposition mask 20 is formed by etching.

FIG. 4 is an enlarged plan view showing the effective region 22 from the second surface 20b side of the vapor deposition mask 20 manufactured by etching. As shown in FIG. 4, in the illustrated example, the plurality of through holes 25 formed in each effective area 22 are arranged at a predetermined pitch in two directions orthogonal to each other in the effective area 22. There is. An example of the through hole 25 will be described in further detail with reference mainly to FIGS. 5 to 7. 5 to 7 are cross-sectional views of the effective area 22 in FIG. 4 taken along the AA direction, the BB direction, and the CC direction, respectively. Note that the boundary line between the effective area 22 and the surrounding area 23 shown in FIGS. 5 to 7 is an example, and the position of this boundary line is arbitrary. For example, this boundary line may be arranged in a region where the second recess 35 is not formed (left side of the leftmost second recess 35 in FIG. 5).

As shown in FIGS. 5 to 7, the plurality of through holes 25 extend from the first surface 20a, which is one side along the normal direction N of the vapor deposition mask 20, along the normal direction N of the vapor deposition mask 20. It penetrates to the second surface 20b, which is the other side. In the illustrated example, a first recess 30 (or first opening 30) is etched on the first surface 21a of the metal plate 21 on one side in the normal direction N of the vapor deposition mask 20, as will be described in detail later. A second recess 35 (or second opening 35) is formed on the second surface 21b of the metal plate 21 on the other side in the normal direction N of the vapor deposition mask 20. The first recess 30 is connected to the second recess 35, so that the second recess 35 and the first recess 30 communicate with each other. The through hole 25 includes a second recess 35 and a first recess 30 connected to the second recess 35 .

As shown in FIGS. 5 to 7, the plate of the vapor deposition mask 20 at each position along the normal direction N of the vapor deposition mask 20 from the second surface 20b side to the first surface 20a side of the vapor deposition mask 20. The opening area of each second recess 35 in a cross section along the surface gradually becomes smaller. Similarly, the opening area of each first recess 30 in the cross section along the plate surface of the vapor deposition mask 20 at each position along the normal direction N of the vapor deposition mask 20 is determined from the first surface 20a side of the vapor deposition mask 20. It gradually becomes smaller toward the second surface 20b.

As shown in FIGS. 5 to 7, the wall surface 31 of the first recess 30 and the wall surface 36 of the second recess 35 are connected via a circumferential connecting portion 41. As shown in FIGS. In the connecting portion 41, a wall surface 31 of the first recess 30 inclined with respect to the normal direction N of the vapor deposition mask 20 and a wall surface 36 of the second recess 35 inclined with respect to the normal direction N of the vapor deposition mask 20 merge. It is defined by the ridgeline of the overhanging part. The connecting portion 41 defines a through portion 42 in which the opening area of the through hole 25 is minimized when the vapor deposition mask 20 is viewed from above.

As shown in FIGS. 5 to 7, on the other side of the vapor deposition mask 20 along the normal direction N, that is, on the first surface 20a of the vapor deposition mask 20, two adjacent through holes 25 are They are spaced apart from each other along the plate surface of the mask 20. That is, when the first recess 30 is created by etching the metal plate 21 from the first surface 21a side of the metal plate 21 that corresponds to the first surface 20a of the vapor deposition mask 20, as in the manufacturing method described below. , the first surface 21a of the metal plate 21 remains between two adjacent first recesses 30.

Similarly, as shown in FIGS. 5 and 7, on one side of the vapor deposition mask 20 along the normal direction N, that is, on the second surface 20b side of the vapor deposition mask 20, two adjacent second recesses 35 may be spaced apart from each other along the plate surface of the vapor deposition mask 20. That is, the second surface 21b of the metal plate 21 may remain between two adjacent second recesses 35. In the following description, the portion of the effective area 22 on the second surface 21b of the metal plate 21 that remains unetched is also referred to as a top portion 43. By manufacturing the vapor deposition mask 20 such that the top portion 43 remains, the vapor deposition mask 20 can have sufficient strength. This can prevent the vapor deposition mask 20 from being damaged during transportation, for example. Note that if the width β of the top portion 43 is too large, shadows may occur during the vapor deposition process, which may reduce the utilization efficiency of the vapor deposition material 98. Therefore, it is preferable that the vapor deposition mask 20 is manufactured so that the width β of the top portion 43 does not become excessively large. For example, it is preferable that the width β of the top portion 43 is 2 μm or less. Note that the width β of the top portion 43 generally changes depending on the direction in which the vapor deposition mask 20 is cut. For example, the width β of the top portion 43 shown in FIGS. 5 and 7 may be different from each other. In this case, the vapor deposition mask 20 may be configured such that the width β of the top portion 43 is 2 μm or less when the vapor deposition mask 20 is cut in any direction.

Note that, as shown in FIG. 6, etching may be performed so that two adjacent second recesses 35 are connected depending on the location. That is, there may be a place between two adjacent second recesses 35 where the second surface 21b of the metal plate 21 does not remain. Although not shown, etching may be performed so that two adjacent second recesses 35 are connected over the entire second surface 21b.

When the vapor deposition mask device 10 is housed in the vapor deposition device 90 as shown in FIG. 1, the first surface 20a of the vapor deposition mask 20 faces the organic EL substrate 92, as shown by the two-dot chain line in FIG. The second surface 20b of the vapor deposition mask 20 is located on the side of the crucible 94 holding the vapor deposition material 98. Therefore, the vapor deposition material 98 passes through the second recess 35 whose opening area gradually becomes smaller and adheres to the organic EL substrate 92. As shown by the arrow pointing from the second surface 20b side to the first surface 20a in FIG. 5, the vapor deposition material 98 moves from the crucible 94 toward the organic EL substrate 92 along the normal direction N of the organic EL substrate 92. In addition, the organic EL substrate 92 may move in a direction largely inclined with respect to the normal direction N. At this time, if the thickness of the vapor deposition mask 20 is large, most of the vapor deposition material 98 moving diagonally reaches the wall surface 36 of the second recess 35 before reaching the organic EL substrate 92 through the through hole 25. and adhere. Therefore, in order to increase the utilization efficiency of the vapor deposition material 98, it is possible to reduce the thickness T0 of the vapor deposition mask 20, thereby reducing the height of the wall surface 36 of the second recess 35 and the wall surface 31 of the first recess 30. considered preferable. That is, it can be said that it is preferable to use a metal plate 21 that is as thin as possible within a range that can ensure the strength of the vapor deposition mask 20 as the metal plate 21 for forming the vapor deposition mask 20. Considering this point, in this embodiment, the thickness T0 of the vapor deposition mask 20 is preferably set to 85 μm or less, for example, 5 μm or more and 85 μm or less. Alternatively, the thickness T0 is set to 80 μm or less, for example, 10 μm or more and 80 μm, or 20 μm or more and 80 μm or less. In order to further improve the accuracy of vapor deposition, the thickness T0 of the vapor deposition mask 20 may be set to 40 μm or less, for example, 10 or more and 40 μm or less, or 20 or more and 40 μm or less. Note that the thickness T0 is the thickness of the peripheral region 23, that is, the thickness of the portion of the vapor deposition mask 20 where the first recess 30 and the second recess 35 are not formed. Therefore, the thickness T0 can also be said to be the thickness of the metal plate 21.

In FIG. 5, a straight line L1 passing through the connecting portion 41, which is the portion with the minimum opening area of the through hole 25, and any other position on the wall surface 36 of the second recess 35, is in the normal direction of the vapor deposition mask 20. The minimum angle formed with respect to N is represented by the symbol θ1. That is, as in the case shown in FIG. 21 described later, the path of the vapor deposition material 98 passing through the end portion 38 of the through hole 25 (second recess 35) on the second surface 20b side of the vapor deposition mask 20, and the organic EL substrate Among the routes that can reach 92, the route that forms an angle θ1 with respect to the normal direction N of the vapor deposition mask 20 is represented by the symbol L1. In order to make the vapor deposition material 98 moving obliquely reach the organic EL substrate 92 as much as possible without reaching the wall surface 36, it is advantageous to increase the angle θ1. In order to increase the angle θ1, in addition to reducing the thickness T0 of the vapor deposition mask 20, it is also effective to reduce the width β of the top portion 43 described above.

In FIG. 7, the symbol α represents the width of a portion (hereinafter also referred to as a rib portion) that remains unetched in the effective area 22 of the first surface 21a of the metal plate 21. The width α of the rib portion and the dimension r2 of the through portion 42 are determined as appropriate depending on the dimensions and the number of display pixels of the organic EL display device. Table 1 shows an example of the number of display pixels and the values of the width α of the rib portion and the dimension r2 of the through portion 42 depending on the number of display pixels in a 5-inch organic EL display device.

Although not limited, the vapor deposition mask 20 according to this embodiment is particularly effective when manufacturing an organic EL display device with a pixel density of 450 ppi or more. Hereinafter, with reference to FIG. 8, an example of the dimensions of the vapor deposition mask 20 for producing such a high pixel density organic EL display device will be described. FIG. 8 is an enlarged cross-sectional view showing the through hole 25 of the vapor deposition mask 20 shown in FIG. 5 and a region in the vicinity thereof.

In FIG. 8, the parameter related to the shape of the through hole 25 is the distance from the first surface 20a of the vapor deposition mask 20 to the connection part 41 in the direction along the normal direction N of the vapor deposition mask 20, that is, the first recess. The height of the wall surface 31 of 30 is represented by the symbol r1. Furthermore, the dimension of the first recess 30 at the portion where the first recess 30 connects to the second recess 35, that is, the dimension of the through portion 42, is represented by the symbol r2. Further, in FIG. 8, the angle that the straight line L2 connecting the connecting portion 41 and the tip edge of the first recess 30 on the first surface 21a of the metal plate 21 makes with the normal direction N of the metal plate 21 is It is represented by the symbol θ2.

When manufacturing an organic EL display device with a pixel density of 450 ppi or more, the dimension r2 of the penetration portion 42 is preferably set to 10 or more and 60 μm or less. As a result, it is possible to provide a vapor deposition mask 20 that can produce an organic EL display device with high pixel density. Preferably, the height r1 of the wall surface 31 of the first recess 30 is set to 6 μm or less.

Next, the above-mentioned angle θ2 shown in FIG. 8 will be explained. The angle θ2 is tilted with respect to the normal direction N of the metal plate 21, and the vapor deposition material 98 that has flown to pass through the penetration portion 42 near the connection portion 41 can reach the organic EL substrate 92. This corresponds to the maximum value of the inclination angle of the material 98. This is because the vapor deposition material 98 that has flown through the connection portion 41 at an inclination angle larger than the angle θ2 adheres to the wall surface 31 of the first recess 30 before reaching the organic EL substrate 92. Therefore, by reducing the angle θ2, it is possible to prevent the vapor deposition material 98 that has flown at a large angle of inclination and passed through the penetration portion 42 from adhering to the organic EL substrate 92. It is possible to prevent the vapor deposition material 98 from adhering to a portion outside the portion overlapping the through portion 42 . That is, reducing the angle θ2 leads to suppression of variations in the area and thickness of the vapor deposition material 98 attached to the organic EL substrate 92. From this point of view, for example, the through hole 25 is formed so that the angle θ2 is 45 degrees or less. Note that in FIG. 8, the dimension of the first recess 30 on the first surface 21a, that is, the opening dimension of the through hole 25 on the first surface 21a is larger than the dimension r2 of the first recess 30 on the connecting portion 41. An example was given. That is, an example is shown in which the value of the angle θ2 is a positive value. However, although not shown, the dimension r2 of the first recess 30 in the connecting portion 41 may be larger than the dimension of the first recess 30 in the first surface 21a. That is, the value of the angle θ2 may be a negative value.

Next, a method for manufacturing the vapor deposition mask 20 by etching processing will be described.

(Metal plate manufacturing method)
First, a method for manufacturing a metal plate used for manufacturing a vapor deposition mask will be described.

[Rolling process]
First, as shown in FIG. 9, a base material 155 made of an iron alloy containing nickel is prepared, and the base material 155 is directed toward a rolling device 156 including a pair of rolling rolls 156a and 156b in the direction indicated by the arrow. Transport along. The base material 155 that has arrived between the pair of rolling rolls 156a, 156b is rolled by the pair of rolling rolls 156a, 156b, and as a result, the thickness of the base material 155 is reduced and the base material 155 is stretched along the conveyance direction. It will be done. As a result, a plate material 164X having a thickness t0 can be obtained. As shown in FIG. 9, a rolled body 162 may be formed by winding a plate material 164X around a core 161. The specific value of the thickness t0 is preferably 5 μm or more and 85 μm or less as described above.

Note that FIG. 9 merely shows an outline of the rolling process, and the specific configuration and procedure for carrying out the rolling process are not particularly limited. For example, the rolling process may include a hot rolling process in which the base material is processed at a temperature higher than the temperature that changes the crystal orientation of the Invar material constituting the base material 155, or a hot rolling process in which the base material is processed at a temperature lower than the temperature that changes the crystal orientation of the Invar material. It may also include a cold rolling process. Further, the direction in which the base material 155 and the plate material 164X are passed between the pair of rolling rolls 156a and 156b is not limited to one direction. For example, in FIGS. 9 and 10, the base material 155 and the plate material 164X are repeatedly passed between a pair of rolling rolls 156a and 156b from the left side to the right side of the page and from the right side to the left side of the page. The material 155 and the plate material 164X may be rolled gradually.

[Slitting process]
Thereafter, a slitting step may be performed in which both ends in the width direction of the plate material 164X obtained by the rolling process are cut off over a predetermined range so that the width of the plate material 164X falls within a predetermined range. This slitting process is performed to remove cracks that may occur at both ends of the plate material 164X due to rolling. By performing such a slitting process, it is possible to prevent the phenomenon in which the plate material 164X breaks, that is, so-called plate breakage, from occurring starting from a crack.

[Annealing process]
Thereafter, in order to remove residual stress (internal stress) accumulated in the plate material 164X due to rolling, the plate material 164X is annealed using an annealing device 157, as shown in FIG. 10, thereby obtaining a long metal plate 164. The annealing process may be performed while pulling the plate material 164X or the long metal plate 164 in the transport direction (longitudinal direction), as shown in FIG. That is, the annealing step may be performed not as so-called batch annealing but as continuous annealing while being transported.

Preferably, the above-mentioned annealing step is performed in a non-reducing atmosphere or an inert gas atmosphere. The non-reducing atmosphere here refers to an atmosphere that does not contain reducing gas such as hydrogen. "Contains no reducing gas" means that the concentration of reducing gas such as hydrogen is 4% or less. The inert gas atmosphere is an atmosphere in which 90% or more of an inert gas such as argon gas, helium gas, or nitrogen gas exists. By performing the annealing process in a non-reducing atmosphere or an inert gas atmosphere, it is possible to suppress the formation of the above-mentioned nickel hydroxide on the first surface 164a and the second surface 164b of the long metal plate 164. .

By performing the annealing process, it is possible to obtain a long metal plate 164 with a thickness t0 from which residual strain has been removed to some extent. Note that the thickness t0 is usually equal to the thickness T0 of the vapor deposition mask 20.

Note that the elongated metal plate 164 having a thickness t0 may be produced by repeating the above-described rolling process, slitting process, and annealing process multiple times. Although FIG. 10 shows an example in which the annealing process is carried out while pulling the long metal plate 164 in the longitudinal direction, the annealing process is not limited to this, and the long metal plate 164 is It may also be carried out in a state where it is wound up. That is, batch annealing may be performed. Note that if the annealing process is performed with the long metal plate 164 wound around the core 161, the long metal plate 164 may have a tendency to warp depending on the winding diameter of the rolled body 162. . Therefore, depending on the winding diameter of the roll 162 and the material constituting the base material 155, it is advantageous to carry out the annealing process while pulling the long metal plate 164 in the longitudinal direction.

[Cutting process]
Thereafter, a cutting process is performed in which both ends of the long metal plate 164 in the width direction are cut off over a predetermined range, thereby adjusting the width of the long metal plate 164 to a desired width. In this way, a long metal plate 164 having a desired thickness and width can be obtained.

(Method for manufacturing a vapor deposition mask)
Next, a method for manufacturing the vapor deposition mask 20 using the elongated metal plate 164 will be explained with reference mainly to FIGS. 11 to 19. In the method for manufacturing the vapor deposition mask 20 described below, as shown in FIG. By doing so, a vapor deposition mask 20 made of a sheet metal plate 21 is obtained.

More specifically, the method for manufacturing the vapor deposition mask 20 includes a step of supplying a long metal plate 164 extending in a band shape, and etching the long metal plate 164 using photolithography technology to form a long metal plate. 164 from the first surface 164a side, and etching using photolithography technology is performed on the long metal plate 164 to form the first recesses 30 on the long metal plate 164 from the second surface 164b side. 2. The method includes a step of forming two recesses 35. Then, the first recess 30 and the second recess 35 formed in the elongated metal plate 164 communicate with each other, thereby creating the through hole 25 in the elongated metal plate 164. In the examples shown in FIGS. 12 to 19, the step of forming the first recess 30 is performed before the step of forming the second recess 35, and the step of forming the first recess 30 and the formation of the second recess 35 are performed. Between the steps, a step of sealing the created first recess 30 is further provided. The details of each step will be explained below.

FIG. 11 shows a manufacturing apparatus 160 for manufacturing the vapor deposition mask 20. As shown in FIG. 11, first, a roll 162 is prepared by winding a long metal plate 164 around a core 161. When the core 161 rotates and the roll 162 is unwound, a long metal plate 164 extending in a band shape is supplied as shown in FIG. Note that the elongated metal plate 164 has a through hole 25 formed therein so as to form a sheet metal plate 21 and further a vapor deposition mask 20 .

The supplied long metal plate 164 is conveyed to an etching device (etching means) 170 by a conveyance roller 172. The etching apparatus 170 performs each process shown in FIGS. 12 to 19. In this embodiment, it is assumed that a plurality of vapor deposition masks 20 are allocated in the width direction of the long metal plate 164. That is, a plurality of vapor deposition masks 20 are produced from regions occupying predetermined positions of the long metal plate 164 in the longitudinal direction. In this case, preferably, the plurality of vapor deposition masks 20 are allocated to the long metal plate 164 so that the longitudinal direction D1 of the vapor deposition masks 20 coincides with the rolling direction of the long metal plate 164.

First, as shown in FIG. 12, resist films 165c and 165d containing a negative photosensitive resist material are formed on the first surface 164a and the second surface 164b of the elongated metal plate 164. As a method for forming the resist films 165c and 165d, a so-called dry film, which is a film on which a layer containing a photosensitive resist material such as an acrylic photocurable resin is formed, is coated on the first surface 164a of the elongated metal plate 164 and on the first surface 164a of the elongated metal plate 164. A method of pasting on the second surface 164b is adopted.

Next, prepare exposure masks 168a and 168b that do not allow light to pass through the regions of the resist films 165c and 165d that you want to remove, and place the exposure masks 168a and 168b on the resist films 165c and 165d, respectively, as shown in FIG. Place it in As the exposure masks 168a and 168b, for example, glass dry plates are used that do not allow light to pass through the regions of the resist films 165c and 165d that are desired to be removed. Thereafter, the exposure masks 168a and 168b are brought into sufficient contact with the resist films 165c and 165d by vacuum contact. Note that a positive type photosensitive resist material may be used. In this case, an exposure mask is used that allows light to pass through the region of the resist film that is desired to be removed.

Thereafter, the resist films 165c and 165d are exposed through the exposure masks 168a and 168b (exposure step). Furthermore, the resist films 165c and 165d are developed to form images on the exposed resist films 165c and 165d (development step). As described above, as shown in FIG. 14, the first resist pattern 165a is formed on the first surface 164a of the long metal plate 164, and the second resist pattern 165b can be formed. Note that the development step may include a resist heat treatment step for increasing the hardness of the resist films 165c, 165d or for making the resist films 165c, 165d more firmly adhere to the long metal plate 164. The resist heat treatment step is performed at a temperature of, for example, 100° C. or more and 400° C. or less in an atmosphere of an inert gas such as argon gas, helium gas, or nitrogen gas.

Next, as shown in FIG. 15, a first surface etching step is performed in which a region of the first surface 164a of the long metal plate 164 that is not covered by the first resist pattern 165a is etched using a first etching solution. implement. For example, the first etching solution is directed toward the first surface 164a of the long metal plate 164 through the first resist pattern 165a from a nozzle placed on the side facing the first surface 164a of the long metal plate 164 being transported. is injected. As a result, as shown in FIG. 15, the areas of the long metal plate 164 that are not covered by the first resist pattern 165a are eroded by the first etching solution. As a result, a large number of first recesses 30 are formed on the first surface 164a of the long metal plate 164. As the first etching solution, for example, one containing a ferric chloride solution and hydrochloric acid is used.

Thereafter, as shown in FIG. 16, the first recess 30 is covered with a resin 169 that is resistant to the second etching solution used in a later second surface etching step. That is, the first recess 30 is sealed with the resin 169 having resistance to the second etching solution. In the example shown in FIG. 16, the film of resin 169 is formed to cover not only the formed first recess 30 but also the first surface 164a (first resist pattern 165a).

Next, as shown in FIG. 17, a region of the second surface 164b of the long metal plate 164 that is not covered by the second resist pattern 165b is etched to form a second recess 35 in the second surface 164b. Perform a two-sided etching process. The second surface etching process is performed until the first recess 30 and the second recess 35 communicate with each other, thereby forming the through hole 25. As the second etching solution, one containing, for example, a ferric chloride solution and hydrochloric acid is used, similar to the first etching solution described above.

Note that the erosion by the second etching liquid occurs in the portion of the long metal plate 164 that is in contact with the second etching liquid. Therefore, the erosion progresses not only in the normal direction N (thickness direction) of the long metal plate 164 but also in the direction along the plate surface of the long metal plate 164. Preferably, in the second surface etching step, the two second recesses 35 formed at positions facing the two adjacent holes 166a of the second resist pattern 165b are located between the two holes 166a. It is terminated before merging on the back side of the bridge portion 167a. Thereby, as shown in FIG. 18, the above-mentioned top portion 43 can be left on the second surface 164b of the long metal plate 164.

Thereafter, as shown in FIG. 19, the resin 169 is removed from the long metal plate 164. The resin 169 can be removed, for example, by using an alkaline stripping solution. When an alkaline stripper is used, as shown in FIG. 19, resist patterns 165a and 165b are removed simultaneously with resin 169. Note that after removing the resin 169, the resist patterns 165a and 165b may be removed separately from the resin 169 using a stripping solution different from the stripping solution for stripping the resin 169.

The long metal plate 164 in which a large number of through holes 25 are formed in this way is conveyed to a cutting device (cutting means) 173 by conveying rollers 172, 172 that rotate while holding the long metal plate 164 between them. be done. Note that the above-mentioned supply core 161 is rotated through the tension (tensile stress) acting on the long metal plate 164 due to the rotation of the conveyance rollers 172, 172, and the long metal plate 164 is supplied from the roll 162. It looks like this.

Thereafter, the long metal plate 164 in which a large number of through holes 25 have been formed is cut into a predetermined length and width by a cutting device (cutting means) 173, thereby producing a sheet metal sheet in which a large number of through holes 25 have been formed. A plate 21, ie a deposition mask 20, is obtained.

(Vapor deposition mask manufactured by plating process)
By the way, the vapor deposition mask 20 can also be manufactured using a plating process. Therefore, the vapor deposition mask 20 manufactured by plating processing will be described below. Here, first, the shape of the through hole 25 and its surrounding portion will be described when the vapor deposition mask 20 is formed by plating.

FIG. 20 is an enlarged plan view showing the effective region 22 from the first surface 20a side of the vapor deposition mask 20 manufactured by plating. As shown in FIG. 4, in the illustrated example, the plurality of through holes 25 formed in each effective area 22 are arranged at a predetermined pitch in two directions orthogonal to each other in the effective area 22. There is. An example of the through hole 25 will be described in further detail with reference mainly to FIG. 21. FIG. 21 is a cross-sectional view of the effective area 22 in FIG. 20 viewed from the DD direction.

As shown in FIG. 21, the vapor deposition mask 20 includes a first metal layer 32 constituting a first surface 20a, a second metal layer 37 provided on the first metal layer 32 and constituting a second surface 20b, Equipped with. When vapor-depositing the vapor deposition material 98 onto the organic EL substrate 92 (at the time of vapor deposition), the second metal layer 37 is placed on the side of the frame 15 described above (see FIG. 1, etc.). The first metal layer 32 is provided with first openings 30 in a predetermined pattern, and the second metal layer 37 is provided with second openings 35 in a predetermined pattern. The first opening 30 and the second opening 35 communicate with each other, thereby forming a through hole 25 extending from the first surface 20a to the second surface 20b of the vapor deposition mask 20.

As shown in FIG. 20, the first opening 30 and the second opening 35 that constitute the through hole 25 may have a substantially polygonal shape in plan view. Here, an example is shown in which the first opening 30 and the second opening 35 have a substantially rectangular shape, more specifically a substantially square shape. Although not shown, the first opening 30 and the second opening 35 may have other substantially polygonal shapes such as a substantially hexagonal shape or a substantially octagonal shape. Note that the term "substantially polygonal shape" is a concept that includes a shape in which the corners of a polygon are rounded. Further, although not shown, the first opening 30 and the second opening 35 may have a circular shape. Further, as long as the second opening 35 has a contour surrounding the first opening 30 in plan view, the shape of the first opening 30 and the shape of the second opening 35 do not need to be similar.

In FIG. 21, reference numeral 41 represents a connection portion where the first metal layer 32 and the second metal layer 37 are connected. Further, the symbol S0 represents the dimension of the through hole 25 in the connection portion 41 between the first metal layer 32 and the second metal layer 37. Although FIG. 21 shows an example in which the first metal layer 32 and the second metal layer 37 are in contact with each other, the present invention is not limited to this, and the first metal layer 32 and the second metal layer 37 are in contact with each other. Other layers may be interposed therebetween. For example, a catalyst layer may be provided between the first metal layer 32 and the second metal layer 37 to promote precipitation of the second metal layer 37 on the first metal layer 32.

FIG. 22 is an enlarged view of a portion of the first metal layer 32 and second metal layer 37 in FIG. 21. As shown in FIG. 22, the width M2 of the second metal layer 37 on the second surface 20b of the vapor deposition mask 20 is smaller than the width M1 of the first metal layer 32 on the first surface 20a of the vapor deposition mask 20. In other words, the opening size S2 of the through hole 25 (second opening 35) on the second surface 20b is larger than the opening size S1 of the through hole 25 (first opening 30) on the first surface 20a. The advantages of configuring the first metal layer 32 and the second metal layer 37 in this way will be explained below.

The vapor deposition material 98 flying from the second surface 20b side of the vapor deposition mask 20 passes through the second opening 35 and the first opening 30 of the through hole 25 in this order and adheres to the organic EL substrate 92 . The region of the organic EL substrate 92 to which the vapor deposition material 98 adheres is mainly determined by the opening size S1 and opening shape of the through hole 25 on the first surface 20a. By the way, as shown by an arrow L1 pointing from the second surface 20b side to the first surface 20a in FIGS. 21 and 22, the evaporation material 98 is directed from the crucible 94 toward the organic EL substrate 92 in the normal direction N of the evaporation mask 20. In addition to moving along the evaporation mask 20, the evaporation mask 20 may also move in a direction largely inclined with respect to the normal direction N. Here, if the opening size S2 of the through hole 25 on the second surface 20b is the same as the opening size S1 of the through hole 25 on the first surface 20a, the Most of the vapor deposition material 98 moving in the direction is deposited on the second surface 20b of the vapor deposition mask 20 (the upper surface of the second metal layer 37 in FIG. 21) before reaching the organic EL substrate 92 through the through hole 25. Not only does it adhere, but it also reaches the wall surface 36 of the second opening 35 of the through hole 25 and adheres thereto. Therefore, a large amount of the vapor deposition material 98 cannot pass through the through hole 25. Therefore, in order to increase the utilization efficiency of the vapor deposition material 98, it is preferable to increase the opening size S2 of the second opening 35, that is, to decrease the width M2 of the second metal layer 37.

In FIG. 21, the minimum angle that a straight line L1 that is in contact with the wall surface 36 of the second metal layer 37 and the wall surface 31 of the first metal layer 32 makes with respect to the normal direction N of the vapor deposition mask 20 is represented by the symbol θ1. . In order to make the vapor deposition material 98 moving obliquely reach the organic EL substrate 92 as much as possible, it is advantageous to increase the angle θ1. For example, it is preferable that the angle θ1 is 45° or more.

In order to increase the angle θ1, it is effective to make the width M2 of the second metal layer 37 smaller than the width M1 of the first metal layer 32. Furthermore, as is clear from the figure, in order to increase the angle θ1, it is also effective to decrease the thickness T1 of the first metal layer 32 and the thickness T2 of the second metal layer 37. Note that if the width M2 of the second metal layer 37, the thickness T1 of the first metal layer 32, and the thickness T2 of the second metal layer 37 are made excessively small, the strength of the vapor deposition mask 20 will decrease, and therefore, during transportation. It is conceivable that the vapor deposition mask 20 may be damaged during use. For example, it is conceivable that the vapor deposition mask 20 may be damaged due to tensile stress applied to the vapor deposition mask 20 when the vapor deposition mask 20 is stretched over the frame 15 . Considering these points, it can be said that the dimensions of the first metal layer 32 and the second metal layer 37 are preferably set within the following ranges. Thereby, the above-mentioned angle θ1 can be made, for example, 45° or more.

- Width M1 of first metal layer 32: 5 μm or more and 25 μm or less. - Width M2 of second metal layer 37: 2 μm or more and 20 μm or less. - Thickness T0 of vapor deposition mask 20: 3 μm or more and 50 μm or less, more preferably 3 μm or more and 50 μm or less, more preferably 3 μm or more and 30 μm or less, even more preferably 3 μm or more and 25 μm or less - Thickness T1 of first metal layer 32: 5 μm or less - Thickness T2 of second metal layer 37: 2 μm or more and 50 μm or less, more preferably is 3 μm or more and 50 μm or less, more preferably 3 μm or more and 30 μm or less, and even more preferably 3 μm or more and 25 μm or less. In this embodiment, the thickness T0 of the vapor deposition mask 20 is the same in the effective region 22 and the surrounding region 23. be.

The above-mentioned opening dimensions S0, S1, and S2 are appropriately set in consideration of the pixel density of the organic EL display device, the desired value of the above-mentioned angle θ1, and the like. For example, when manufacturing an organic EL display device with a pixel density of 400 ppi or more, the opening size S0 of the through hole 25 in the connecting portion 41 may be set to 15 μm or more and 60 μm or less. Further, the opening size S1 of the first opening 30 on the first surface 20a is set to 10 μm or more and 50 μm or less, and the opening size S2 of the second opening 35 on the second surface 20b is set to 15 μm or more and 60 μm or less. can be done.

As shown in FIG. 22, a recessed portion 34 may be formed in the first surface 20a of the vapor deposition mask 20 constituted by the first metal layer 32. The recessed portion 34 is formed corresponding to a conductive pattern 52 of a patterned substrate 50, which will be described later, when manufacturing the deposition mask 20 by plating. The depth D of the recessed portion 34 is, for example, 50 nm or more and 500 nm or less. Preferably, the outer edge 34e of the recess 34 formed in the first metal layer 32 is located between the end 33 of the first metal layer 32 and the connection part 41.

Next, an example in which the vapor deposition mask 20 is manufactured by plating processing will be described.

(Method for manufacturing a vapor deposition mask)
23 to 26 are diagrams illustrating a method of manufacturing the vapor deposition mask 20.

[Pattern board preparation process]
First, a patterned substrate 50 shown in FIG. 23 is prepared. The patterned substrate 50 includes a base material 51 having insulating properties and a conductive pattern 52 formed on the base material 51. The conductive pattern 52 has a pattern corresponding to the first metal layer 32 . Incidentally, in order to facilitate a separation process to be described later in which the vapor deposition mask 20 is separated from the patterned substrate 50, the patterned substrate 50 may be subjected to a mold release treatment.

[First plating process]
Next, a first plating process is performed in which a first plating solution is supplied onto the base material 51 on which the conductive pattern 52 is formed to deposit the first metal layer 32 on the conductive pattern 52. For example, the base material 51 on which the conductive pattern 52 is formed is immersed in a plating tank filled with a first plating solution. As a result, as shown in FIG. 24, a first metal layer 32 in which first openings 30 are provided in a predetermined pattern can be obtained on a patterned substrate 50.

Note that due to the characteristics of the plating process, as shown in FIG. It may also be formed in a portion that does not overlap with 52. This is because the first metal layer 32 is further deposited on the surface of the first metal layer 32 deposited in the portion overlapping with the end portion 54 of the conductive pattern 52 . As a result, as shown in FIG. 24, the end portion 33 of the first opening 30 may be located in a portion that does not overlap with the conductive pattern 52 when viewed along the normal direction of the base material 51. . Furthermore, the above-described recess 34 corresponding to the thickness of the conductive pattern 52 is formed on the surface of the first metal layer 32 that is in contact with the conductive pattern 52 .

The specific method of the first plating process is not particularly limited as long as the first metal layer 32 can be deposited on the conductive pattern 52. For example, the first plating process may be performed as a so-called electrolytic plating process in which the first metal layer 32 is deposited on the conductive pattern 52 by passing a current through the conductive pattern 52. Alternatively, the first plating process may be an electroless plating process.

The components of the first plating solution used are determined as appropriate depending on the characteristics of the first metal layer 32. For example, when the first metal layer 32 is made of an iron alloy containing nickel, a mixed solution of a solution containing a nickel compound and a solution containing an iron compound can be used as the first plating solution. For example, a mixed solution of a solution containing nickel sulfamate or nickel bromide and a solution containing ferrous sulfamate can be used. The plating solution may contain various additives. Additives include pH buffering agents such as boric acid, primary brightening agents such as saccharin sodium, secondary brightening agents such as butynediol, propargyl alcohol, coumarin, formalin, and thiourea, antioxidants, stress relaxation agents, etc. can be used. Among these, the primary brightener may contain a sulfur component.

[Resist formation process]
Next, a resist forming step is performed in which a resist pattern 55 is formed on the base material 51 and the first metal layer 32 with a predetermined gap 56 therebetween. As shown in FIG. 25, the resist forming step is performed so that the first opening 30 of the first metal layer 32 is covered with the resist pattern 55 and the gap 56 of the resist pattern 55 is located on the first metal layer 32. Implemented.

[Second plating process]
Next, a second plating process is performed in which a second plating solution is supplied into the gaps 56 of the resist pattern 55 to deposit a second metal layer 37 on the first metal layer 32 . For example, the base material 51 on which the first metal layer 32 is formed is immersed in a plating tank filled with a second plating solution. Thereby, as shown in FIG. 26, the second metal layer 37 can be formed on the first metal layer 32.

As long as the second metal layer 37 can be deposited on the first metal layer 32, the specific method of the second plating process is not particularly limited. For example, the second plating process may be performed as a so-called electrolytic plating process in which the second metal layer 37 is deposited on the first metal layer 32 by passing a current through the first metal layer 32. Alternatively, the second plating process may be an electroless plating process.

As the second plating solution, the same plating solution as the above-mentioned first plating solution may be used. Alternatively, a plating solution different from the first plating solution may be used as the second plating solution. When the composition of the first plating solution and the composition of the second plating solution are the same, the composition of the metal forming the first metal layer 32 and the composition of the metal forming the second metal layer 37 are also the same.

[Resist removal process]
Thereafter, a resist removal step for removing the resist pattern 55 is performed. For example, by using an alkaline stripping solution, the resist pattern 55 can be stripped from the base material 51, the first metal layer 32, and the second metal layer 37.

[Separation process]
Next, a separation step is performed in which the combination of the first metal layer 32 and the second metal layer 37 is separated from the base material 51. When the combination is separated from the base material 51, since the organic film formed by the above-described mold release process is formed on the conductive pattern 52, the first metal layer 32 of the combination is , the conductive pattern 52 is peeled off from the surface of the organic film, and the conductive pattern 52 remains on the base material 51 together with the organic film. This includes a first metal layer 32 provided with first openings 30 in a predetermined pattern, and a second metal layer 37 provided with second openings 35 communicating with the first openings 30. A vapor deposition mask 20 can be obtained.

In the above description, an example has been described in which the vapor deposition mask 20 formed by plating is composed of the first metal layer 32 and the second metal layer 37. However, the present invention is not limited to this, and the vapor deposition mask 20 formed by plating may be composed of a single metal layer (not shown).

(Manufacturing method of vapor deposition mask device)
Next, a method for manufacturing the vapor deposition mask device 10 using the vapor deposition mask 20 obtained as described above will be described.

First, a welding process is performed in which the vapor deposition mask 20 prepared as described above is welded to the frame 15 by etching or plating. Thereby, the vapor deposition mask device 10 including the vapor deposition mask 20 and the frame 15 can be obtained. The obtained vapor deposition mask 20 is welded to the frame 15 in a stretched state to obtain a vapor deposition mask device 10 as shown in FIG. 3.

(Vapour-deposition mask packaging and packaging device for vapor-deposition masks)
Next, a vapor deposition mask package 60 and a vapor deposition mask packing device 60a in which the above-described vapor deposition mask 20 obtained by etching or plating is packed will be described with reference to FIGS. 27 to 32. The vapor deposition mask packing device 60a is a device for packing the above-described vapor deposition mask 20, that is, the vapor deposition mask 20 having the longitudinal direction D1 and having a plurality of through holes 25 formed therein. The vapor deposition mask package 60 mainly includes a vapor deposition mask 20 and a vapor deposition mask packing device 60a in which the vapor deposition mask 20 is packed. Here, FIG. 28 shows a cross section of the vapor deposition mask package 60. The cross section means a cross section along the width direction D2 (direction perpendicular to the longitudinal direction D1) of the vapor deposition mask 20 to be packed. FIG. 45, which will be described later, shows a vertical cross section of a vapor deposition mask package 60 in a sixth modification, and the vertical cross section means a cross section along the longitudinal direction D1 of the vapor deposition mask 20 to be packed.

As shown in FIGS. 27 and 28, the vapor deposition mask package 60 according to the present embodiment includes a first base, a second base provided above the first base and facing the first base, and a first base. and a vapor deposition mask stack 80 disposed between the base and the second base. The first base may be a first substrate formed in a plate shape. Here, the substrate is not limited to a plate-shaped member in which a pair of main surfaces provided on opposite sides are parallel to each other and are formed in a flat shape. For example, when one main surface is formed flat, the pair of main surfaces may be non-parallel, or one main surface may be formed non-flat. Like the first base, the second base may also be a second substrate formed in a plate shape. In this embodiment, the following description will be made by taking a plate-shaped receiving part 61 as an example of a first base, and a plate-shaped lid part 62 as an example of a second base. do.

The vapor deposition mask laminate 80 may include the plurality of vapor deposition masks 20 described above. Details of the vapor deposition mask stack 80 will be described later. The vapor deposition mask packing device 60a described above is a device for packing the vapor deposition mask stack 80 including the vapor deposition mask 20. This vapor deposition mask packaging device 60a mainly includes the above-described receiving section 61, a lid section 62, and a pair of spacers 64, which will be described later. That is, the structure of the vapor deposition mask packaging device 60a is obtained by removing the vapor deposition mask stack 80, the cover side intercalating sheet 82, and the receiver side intercalating sheet 83, which will be described later, from the vapor deposition mask package 60.

Each vapor deposition mask 20 of the vapor deposition mask stack 80 is held by a receiving portion 61 and a lid portion 62. In this embodiment, the receiving part 61 and the lid part 62 are formed separately and bound together by a binding part. In this embodiment, an elastic belt 63 will be used as an example of the binding part in the following description. The elastic force of the elastic belt 63 causes the receiving portion 61 and the lid portion 62 to be pressed against each other. Here, an example is shown in which the receiving part 61 and the lid part 62 are bound by two elastic belts 63, but if the receiving part 61 and the lid part 62 can be prevented from shifting from each other during transportation etc. The number of elastic belts 63 is arbitrary. For example, when two or more elastic belts 63 are used, it is possible to prevent the receiving part 61 and the lid part 62 from relative rotation and displacement from each other within a plane including the first direction D1 and the second direction D2. . Further, as long as the receiving part 61 and the lid part 62 can hold the vapor deposition mask 20, the use of the elastic belt 63 is not limited.

The receiving part 61 and the lid part 62 may be made of one material sheet, or may be made of a plurality of material sheets (for example, cardboard sheets made of plastic such as polypropylene) stacked and bonded. Plastic corrugated sheets are suitable from the viewpoint of strength and mass, that is, they are lightweight despite having the desired strength, and are made of a pair of liners and a wavy cross section interposed between the liners. It has a configuration including a core having a surface. When laminating a plurality of corrugated sheets, it is preferable that the corrugated sheets are laminated so that the directions in which the corrugated ridges (or valleys) of the cores of adjacent corrugated sheets extend are perpendicular to each other. In this case, it is possible to improve the strength of the receiving part 61 and the lid part 62, which are each made of laminated corrugated cardboard sheets. Examples of corrugated cardboard sheets made of polypropylene include Sunply manufactured by Sumika Plastech, Danplate, Single Cone, and Twin Cone manufactured by Ube Eximo, and Minadan manufactured by Sakai Chemical Industries, Ltd., and the like.

Further, the receiving portion 61 and the lid portion 62 are preferably coated with an antistatic coating to suppress generation of static electricity. More specifically, the receiving portion 61 and the lid portion 62 may be coated with an antistatic agent to form antistatic layers on both surfaces of the receiving portion 61 and the lid portion 62. In this case, it is possible to prevent the receiving part 61 and the lid part 62 from being electrically charged, and it is possible to prevent the deposition mask 20 from adhering to intervening sheets 81, 82, and 83, which will be described later, due to electrostatic action when unpacking. Examples of such antistatic agents include surfactants, conductive polymers, carbon black, and metals. Alternatively, the material of the receiving part 61 may be a material with a conductive layer or an antistatic layer formed on the surface layer, or a material in which an antistatic agent is kneaded, and the material of the lid part 62 may be a material with a conductive layer or an antistatic layer on the surface layer. A material with an antistatic layer formed thereon or a material mixed with an antistatic agent may also be used. For example, in the above-mentioned polypropylene corrugated sheet, an antistatic or conductive grade sheet may be used. It is preferable that a spacer 64, which will be described later, is similarly coated with an antistatic coating, or the material of the spacer 64 may be a material mixed with an antistatic agent.

As shown in FIGS. 28 and 30, the receiving portion 61 has a first opposing surface 65 that faces the lid portion 62. As shown in FIGS. This first opposing surface 65 may be formed in a flat shape, and the vapor deposition mask stack 80 is placed on this first opposing surface 65 . On the other hand, as shown in FIGS. 28 and 29, the lid portion 62 has a second opposing surface 66 that faces the receiving portion 61. As shown in FIGS. This second opposing surface 66 may be formed in a flat shape.

It is preferable that the receiving part 61 and the lid part 62 overlap each other in a plan view (described later). The dimensions of the receiving part 61 and the lid part 62 in the longitudinal direction D1 of the vapor deposition mask 20 can be arbitrarily set according to the dimensions in the longitudinal direction D1 of the vapor deposition mask 20, but for example, the lower limit is 100 mm or more. The length may be 300 mm or more, 500 mm or more, or 700 mm or more. Further, the upper limit may be 1000 mm or less, 1500 mm or less, 2000 mm or less, or 3000 mm or less. The range may be determined by a combination of any one of the plurality of lower limit candidate values described above and any one of the plurality of upper limit candidate values described above. For example, it may be 100 mm or more and 1000 mm or less, 700 mm or more and 3000 mm or less, or 500 mm or more and 1500 mm or less. Further, the range may be determined by a combination of any two of the plurality of lower limit candidate values described above. For example, it may be 100 mm or more and 700 mm or less, 300 mm or more and 500 mm or less, or 500 mm or more and 700 mm or less. Further, the range may be determined by a combination of any two of the plurality of upper limit candidate values described above. For example, it may be 1000 mm or more and 3000 mm or less, 1500 mm or more and 2000 mm or less, or 2000 mm or more and 3000 mm or less. For example, by setting the length to 100 mm or more, a vapor deposition mask 20 having a desired dimension in the longitudinal direction D1 can be accommodated. On the other hand, by setting the thickness to 3000 mm or less, for example, deformation of the vapor deposition mask package 60 and the vapor deposition mask packaging device 60a during transportation or storage can be suppressed.

The dimensions of the receiving portion 61 and the lid portion 62 in the width direction D2 of the vapor deposition mask 20 can be arbitrarily set according to the dimensions of the vapor deposition mask 20 in the width direction D2, but for example, the lower limit is 30 mm or more. The length may be 50 mm or more, 100 mm or more, or 200 mm or more. Further, the upper limit may be 300 mm or less, 500 mm or less, 800 mm or less, or 1000 mm or less. The range may be determined by a combination of any one of the plurality of lower limit candidate values described above and any one of the plurality of upper limit candidate values described above. For example, it may be 30 mm or more and 1000 mm or less, 50 mm or more and 800 mm or less, or 100 mm or more and 500 mm or less. Further, the range may be determined by a combination of any two of the plurality of lower limit candidate values described above. For example, it may be 30 mm or more and 200 mm or less, 50 mm or more and 200 mm or less, or 100 mm or more and 200 mm or less. Further, the range may be determined by a combination of any two of the plurality of upper limit candidate values described above. For example, it may be 300 mm or more and 1000 mm or less, 300 mm or more and 800 mm or less, or 500 mm or more and 800 mm or less. For example, by setting the width to 30 mm or more, a vapor deposition mask 20 having a desired dimension in the width direction D2 can be accommodated. On the other hand, by setting the thickness to 700 mm or less, for example, deformation of the vapor deposition mask package 60 and the vapor deposition mask packaging device 60a during transportation or storage can be suppressed.

The lower limit of the thickness of the receiving portion 61 may be, for example, 0.5 mm or more, 1.5 mm or more, or 5 mm or more. Further, the upper limit may be 10 mm or less, 20 mm or less, or 40 mm or less. The range may be determined by a combination of any one of the plurality of lower limit candidate values described above and any one of the plurality of upper limit candidate values described above. For example, it may be 0.5 mm or more and 40 mm or less, 1.5 mm or more and 20 mm or less, or 5 mm or more and 10 mm or less. Further, the range may be determined by a combination of any two of the plurality of lower limit candidate values described above. For example, it may be 0.5 mm or more and 5 mm or less, 0.5 mm or more and 1.5 mm or less, or 1.5 mm or more and 5 mm or less. Further, the range may be determined by a combination of any two of the plurality of upper limit candidate values described above. For example, it may be 10 mm or more and 40 mm or less, 10 mm or more and 20 mm or less, or 20 mm or more and 40 mm or less. . For example, by setting the thickness to 0.5 mm or more, deformation of the vapor deposition mask package 60 and the vapor deposition mask packaging device 60a during transportation or storage can be suppressed. On the other hand, by setting the thickness to 40 mm or less, for example, the vapor deposition mask packaging device 60a can be made heavy enough to be transported manually. Even when the receiving portion 61 is constructed by stacking a plurality of corrugated cardboard sheets as necessary, the thickness is preferably within the above-mentioned range.

The lower limit of the thickness of the lid portion 62 may be, for example, 0.5 mm or more, 1.5 mm or more, or 5 mm or more. Further, the upper limit may be 10 mm or less, 20 mm or less, or 40 mm or less. The range may be determined by a combination of any one of the plurality of lower limit candidate values described above and any one of the plurality of upper limit candidate values described above. For example, it may be 0.5 mm or more and 40 mm or less, 1.5 mm or more and 20 mm or less, or 5 mm or more and 10 mm or less. Further, the range may be determined by a combination of any two of the plurality of lower limit candidate values described above. For example, it may be 0.5 mm or more and 5 mm or less, 0.5 mm or more and 1.5 mm or less, or 1.5 mm or more and 5 mm or less. Further, the range may be determined by a combination of any two of the plurality of upper limit candidate values described above. For example, it may be 10 mm or more and 40 mm or less, 10 mm or more and 20 mm or less, or 20 mm or more and 40 mm or less. . For example, by setting the thickness to 0.5 mm or more, deformation of the vapor deposition mask package 60 and the vapor deposition mask packaging device 60a during transportation or storage can be suppressed. On the other hand, by setting the thickness to 40 mm or less, for example, the vapor deposition mask packaging device 60a can be made heavy enough to be transported manually. Even when the lid portion 62 is constructed by stacking a plurality of corrugated cardboard sheets as necessary, the thickness is preferably within the above-mentioned range.

A pair of spacers 64 are interposed between the receiving portion 61 and the lid portion 62. The pair of spacers 64 are arranged on both sides of the vapor deposition mask 20 in the width direction D2, and a housing space 64a for the vapor deposition mask stack 80 is defined between the pair of spacers 64. This accommodation space 64a has a longitudinal direction D3 along the longitudinal direction D1 of the vapor deposition mask 20 accommodated. The spacer 64 extends in the longitudinal direction D1 of the vapor deposition mask 20 along the side edge 20f in the width direction D2 of the vapor deposition mask 20, and each intervening sheet 81, 82, 83, which will be described later, It is regulated to move to. In this embodiment, the spacer 64 is formed separately from the receiving portion 61 and the lid portion 62, and may be bonded to the second opposing surface 66 of the lid portion 62 with an adhesive or the like. However, the spacer 64 may be joined to the first opposing surface 65 of the receiving portion 61. The material of the spacer 64 is not particularly limited as long as it can withstand the force applied when the receiving part 61 and the lid part 62 are tied together by the elastic belt 63. For example, it may be made of a plastic material (for example, polyester, polycarbonate, polypropylene, polyacetal, polyoxymethylene, MC nylon, supramolecular polyethylene, epoxy, etc.) that has the desired strength in terms of mass. Further, the hardness of the spacer 64 may be higher than that of the receiving portion 61 and the lid portion 62. Thereby, the rigidity can be increased against the vertical force applied to the vapor deposition mask package 60, and it is possible to suppress the vertical force from being applied to the vapor deposition mask stack 80.

The adhesive for joining the spacer 64 to the lid 62 is preferably an adhesive using a material that suppresses shrinkage during curing, such as a two-component epoxy adhesive, a UV-curable epoxy adhesive, etc. A type adhesive or a modified silicone type adhesive may also be used. Moreover, an adhesive may be used instead of the adhesive. In this case, for example, a double-sided adhesive tape having adhesive layers formed on both sides of a base material may be used. The base material may be, for example, a nonwoven fabric, paper, or a plastic film such as polyester, and the adhesive may be, for example, an adhesive containing an acrylic resin.

The dimensions of the spacer 64 in the longitudinal direction D1 of the vapor deposition mask 20 may be the same dimensions as the receiving part 61 and the lid part 62. Further, the dimensions of the spacer 64 in the width direction D2 of the vapor deposition mask 20 (corresponding to the width direction D4 in the accommodation space 64a) may be set so that the accommodation space 64a can be formed. The dimension of the accommodation space 64a in the width direction D4 can be arbitrarily set depending on the vapor deposition mask 20 to be packed. For example, the lower limit of the dimension along the width direction D2 of the vapor deposition mask 20 may be 10 mm or more, 20 mm or more, or 50 mm or more. Further, the upper limit may be 100 mm or less, 500 mm or less, or 1000 mm or less. The range may be determined by a combination of any one of the plurality of lower limit candidate values described above and any one of the plurality of upper limit candidate values described above. For example, it may be 10 mm or more and 1000 mm or less, 20 mm or more and 500 mm or less, or 50 mm or more and 100 mm or less. Further, the range may be determined by a combination of any two of the plurality of lower limit candidate values described above. For example, it may be 10 mm or more and 20 mm or less, 10 mm or more and 50 mm or less, or 20 mm or more and 50 mm or less. Further, the range may be determined by a combination of any two of the plurality of upper limit candidate values described above. For example, it may be 100 mm or more and 500 mm or less, 100 mm or more and 1000 mm or less, or 500 mm or more and 1000 mm or less. In this case, the lower limit of the dimension along the width direction D4 of the accommodation space 64a may be, for example, 10 mm or more, 20 mm or more, or 50 mm or more. Further, the upper limit may be 100 mm or less, 500 mm or less, or 1000 mm or less. The range may be determined by a combination of any one of the plurality of lower limit candidate values described above and any one of the plurality of upper limit candidate values described above. For example, it may be 10 mm or more and 1000 mm or less, 20 mm or more and 500 mm or less, or 50 mm or more and 100 mm or less. Further, the range may be determined by a combination of any two of the plurality of lower limit candidate values described above. For example, it may be 10 mm or more and 20 mm or less, 10 mm or more and 50 mm or less, or 20 mm or more and 50 mm or less. Further, the range may be determined by a combination of any two of the plurality of upper limit candidate values described above. For example, it may be 100 mm or more and 500 mm or less, 100 mm or more and 1000 mm or less, or 500 mm or more and 1000 mm or less. For example, by setting the width to 10 mm or more, various width dimensions of the vapor deposition mask 20 can be accommodated. On the other hand, by setting the width to 1000 mm or less, for example, a gap can be provided between the vapor deposition mask 20 and the spacer 64 to avoid contact with the package when the vapor deposition mask 20 is shifted in the width direction. Handlability can be improved.

The lower limit of the thickness of the spacer 64 may be, for example, 1 mm or more, 5 mm or more, 10 mm or more, or 20 mm or more. Further, the upper limit may be 30 mm or less, 40 mm or less, 60 mm or less, or 80 mm or less. The range may be determined by a combination of any one of the plurality of lower limit candidate values described above and any one of the plurality of upper limit candidate values described above. For example, it may be 1 mm or more and 80 mm or less, 5 mm or more and 60 mm or less, 10 mm or more and 40 mm or less, or 20 mm or more and 30 mm or less. Further, the range may be determined by a combination of any two of the plurality of lower limit candidate values described above. For example, it may be 1 mm or more and 20 mm or less, 5 mm or more and 10 mm or less, 1 mm or more and 10 mm or less, or 5 mm or more and 20 mm or less. Further, the range may be determined by a combination of any two of the plurality of upper limit candidate values described above. For example, it may be 30 mm or more and 80 mm or less, 40 mm or more and 60 mm or less, 30 mm or more and 60 mm or less, or 40 mm or more and 80 mm or less. For example, by making it 5 mm or more, a sufficient accommodation space 64a can be secured even when the vapor deposition mask stack 80 is accommodated. On the other hand, by setting the thickness to 40 mm or less, for example, the weight applied to the lowest vapor deposition mask 20 of the vapor deposition mask stack 80 can be suppressed, and deformation of this vapor deposition mask 20 during transportation or storage can be suppressed.

Although not shown, spacers (not shown) may also be arranged on both sides of the vapor deposition mask 20 in the longitudinal direction D1. In this case, in plan view, the accommodation space 64a of the vapor deposition mask laminate 80 is defined so as to be surrounded by the spacer, and each intervening sheet 81, 82, 83, which will be described later, is restricted from moving in the longitudinal direction D1. ing.

As shown in FIGS. 29 and 32, the lid portion 62 has a convex portion 67 disposed on at least one of both ends 20e of the vapor deposition mask 20 in the longitudinal direction D1 in plan view. In other words, the convex portion 67 is disposed at at least one of both ends in the longitudinal direction D3 of the above-described accommodation space 64a defined by the pair of spacers 64 in plan view. Here, since FIG. 32 shows a cross section taken along the line EE in FIG. 31, the receiving part 61 is arranged on the back side of the paper of the vapor deposition mask 20, and the lid part 62 is arranged on the near side of the paper. In this embodiment, an example is shown in which the lid part 62 has a pair of protrusions 67 arranged at both ends 20e, but the lid part 62 is not provided with one of the protrusions 67. You don't have to.

The convex portion 67 according to this embodiment does not need to overlap the through hole 25 through which the vapor deposition material 98 passes during vapor deposition in plan view. As shown in FIG. 32, the convex portion 67 has an effective area in the longitudinal direction D1 of the vapor deposition mask 20 in a plan view (when viewed from a direction perpendicular to the first surface 20a or the second surface 20b of the vapor deposition mask 20). They are placed on both sides of 22. More specifically, each convex portion 67 is disposed at a position overlapping the corresponding end opening 24 of the vapor deposition mask 20 in plan view, and is disposed at the center of the vapor deposition mask 20 in the width direction D2. Each convex portion 67 does not protrude from the corresponding end opening 24 in plan view. Further, each convex portion 67 includes a lower surface 67a that comes into contact with a lid side intervening sheet 82, which will be described later. The convex portion 67 may be formed separately from the lid portion 62 and may be joined to the second opposing surface 66 of the lid portion 62 with an adhesive or the like. The material of the protrusion 67 is not particularly limited, but may be made of plastic, rubber, sponge, or the like. The hardness of the convex portion 67 may be lower than the hardness of the receiving portion 61 and the lid portion 62. As a result, the pressing force that the convex portion 67 presses against the lid-side intervening sheet 82 can be effectively weakened, and the force that the vapor deposition mask 20 receives from the convex portion 67 can be weakened. Therefore, the vapor deposition mask 20 can thermally expand or contract smoothly in response to temperature changes during transportation, and generation of thermal stress in the vapor deposition mask 20 can be suppressed. Such a convex portion 67 may have a hardness of, for example, not less than C/3 and not more than C/60. By setting the hardness to C/3 or higher, the convex portion 67 can press and support the vapor deposition mask 20 via the lid side intervening sheet 82, and prevent vertical movement of the vapor deposition mask 20 during transportation. can be effectively suppressed. On the other hand, by setting the hardness to C/60 or less, it is possible to prevent the pressing force by the convex portions 67 from becoming too high, and it is possible to effectively suppress generation of thermal stress in the vapor deposition mask 20. The hardness of the above-mentioned convex portion 67 was measured according to JIS K7312 using an Asker rubber hardness meter C type manufactured by Kobunshi Keiki Co., Ltd. Further, the convex portion 67 may have a 25% compression hardness (JIS K6400, D method) of 50N or more. By setting the 25% compression hardness to 80N or more, the pressure on the vapor deposition mask 20 can be maintained appropriately.

The planar dimensions of the convex portion 67 can be arbitrarily set depending on the size of the end opening 24 of the vapor deposition mask 20. The dimension of the convex portion 67 in the longitudinal direction D1 of the vapor deposition mask 20 may be, for example, 5 mm or more. By setting the length to 5 mm or more, the vapor deposition mask 20 can be supported by the convex portion 67 and the receiving portion 61, and vertical movement of the vapor deposition mask 20 can be suppressed during transportation. Movement within a plane including two directions D2 can be suppressed.

The lower limit of the thickness of the convex portion 67 may be, for example, 0.1 mm or more, 1 mm or more, 5 mm or more, or 10 mm or more. Further, the upper limit may be 20 mm or less, 30 mm or less, 40 mm or less, or 60 mm or less. The range may be determined by a combination of any one of the plurality of lower limit candidate values described above and any one of the plurality of upper limit candidate values described above. For example, it may be 0.1 mm or more and 60 mm or less, 1 mm or more and 40 mm or less, 5 mm or more and 30 mm or less, or 10 mm or more and 20 mm or less. Further, the range may be determined by a combination of any two of the plurality of lower limit candidate values described above. For example, it may be 0.1 mm or more and 10 mm or less, 1 mm or more and 5 mm or less, 0.1 mm or more and 5 mm or less, or 1 mm or more and 10 mm or less. Further, the range may be determined by a combination of any two of the plurality of upper limit candidate values described above. For example, it may be 20 mm or more and 60 mm or less, 30 mm or more and 40 mm or less, 20 mm or more and 40 mm or less, or 30 mm or more and 60 mm or less. For example, by setting the thickness to 0.1 mm or more, the vapor deposition mask 20 can be supported by the convex portion 67 and the receiving portion 61, and vertical movement of the vapor deposition mask 20 during transportation can be suppressed. On the other hand, by setting the width to 60 mm or less, for example, it is possible to prevent the convex portion 67 from excessively pressing the region overlapping with the end opening 24 of the lid-side intervening sheet 82, so that the vapor deposition mask 20 receives the pressure from the convex portion 67. power can be weakened.

As shown in FIGS. 28 and 31, the vapor deposition mask stack 80 includes a plurality of vapor deposition masks 20 stacked on each other, and a plurality of third sheets stacked on the first surface 20a and second surface 20b of the vapor deposition mask 20. It has . The present embodiment will be described below by taking the intermediate insert sheet 81 as an example of the third sheet. In this embodiment, a plurality of vapor deposition masks 20 and a plurality of intervening sheets 81 are alternately stacked, and the intervening sheets 81 are arranged between adjacent vapor deposition masks 20 . The bottom and top tiers of the deposition mask stack 80 are the evaporation masks 20 .

The first surface 20a of the vapor deposition mask 20, which is neither the bottom nor the top, is covered with an intermediate sheet 81 facing the first surface 20a, and the second surface 20b is covered with an intermediate sheet 81 facing the second surface 20b. It is covered with an intermediate intervening sheet 81. As a result, each intervening sheet 81 prevents the through holes 25 of one vapor deposition mask 20 and the other vapor deposition mask 20 that are adjacent to each other from getting caught and deformed.

A first sheet is arranged between the vapor deposition mask stack 80 and the lid part 62. In the present embodiment, the following description will be given by taking the lid-side insertion sheet 82 as an example of the first sheet. This lid side intervening sheet 82 faces and covers the vapor deposition mask 20 constituting the uppermost layer of the vapor deposition mask stack 80 . This suppresses deformation of the through hole 25 of the uppermost vapor deposition mask 20. Further, a second sheet is arranged between the vapor deposition mask stack 80 and the receiving part 61. In the present embodiment, the following description will be made by taking the receiving section side intervening sheet 83 as an example of the second sheet. This receiving section side intervening sheet 83 faces and covers the vapor deposition mask 20 constituting the lowermost stage of the vapor deposition mask stack 80 . This suppresses deformation of the through hole 25 of the lowermost vapor deposition mask 20. In this way, the vapor deposition mask laminate 80 is arranged between the lid-side intervening sheet 82 and the receiver-side intervening sheet 83.

Note that the number of lid-side intercalating sheets 82 disposed between the vapor deposition mask stack 80 and the lid 62 is arbitrary. That is, the number of lid-side intercalating sheets 82 may be set according to the thickness and number of vapor deposition masks 20 so that the dimension G of the gap 68, which will be described later, has a desired value. Similarly, the number of receiving part-side intervening sheets 83 disposed between the vapor deposition mask stack 80 and the receiving part 61 is arbitrary. That is, the number of receiving part side intercalating sheets 83 may be set according to the thickness and number of vapor deposition masks 20 so that the dimension G of a gap 68, which will be described later, falls within a desired range.

The lower limit of the number of vapor deposition masks 20 constituting the vapor deposition mask laminate 80 may be, for example, 1 or more, 5 or more, 10 or more, 15 or more. It may be. Further, the upper limit may be 20 or less, 25 or less, 30 or less, or 35 or less. The range may be determined by a combination of any one of the plurality of lower limit candidate values described above and any one of the plurality of upper limit candidate values described above. For example, the number may be 1 or more and 35 or less, 5 or more and 30 or less, 10 or more and 25 or less, or 15 or more and 20 or less. Further, the range may be determined by a combination of any two of the plurality of lower limit candidate values described above. For example, the number may be 1 or more and 15 or less, 5 or more and 10 or less, 1 or more and 10 or less, or 5 or more and 15 or less. Further, the range may be determined by a combination of any two of the plurality of upper limit candidate values described above. For example, the number may be between 20 and 35, between 25 and 30, between 20 and 30, and between 25 and 35.

The lower limit of the thickness of the vapor deposition mask 20 may be, for example, 1 μm or more, 5 μm or more, 10 μm or more, or 20 μm or more. Further, the upper limit may be 25 μm or less, 30 μm or less, 40 μm or less, or 60 μm or less. The range may be determined by a combination of any one of the plurality of lower limit candidate values described above and any one of the plurality of upper limit candidate values described above. For example, it may be 1 μm or more and 60 μm or less, 5 μm or more and 40 μm or less, 10 μm or more and 30 μm or less, or 20 μm or more and 25 μm or less. Further, the range may be determined by a combination of any two of the plurality of lower limit candidate values described above. For example, it may be 1 μm or more and 20 μm or less, 5 μm or more and 10 μm or less, 1 μm or more and 10 μm or less, or 5 μm or more and 20 μm or less. Further, the range may be determined by a combination of any two of the plurality of upper limit candidate values described above. For example, it may be 25 μm or more and 60 μm or less, 30 μm or more and 40 μm or less, 25 μm or more and 40 μm or less, or 30 μm or more and 60 μm or less.

Depending on the number and thickness of the vapor deposition masks 20, which are exemplified as such numerical ranges, the lid part side insertion sheet 82 and the receiving part side insertion sheet 83 are adjusted so that the dimension G of the gap 68 falls within a desired range. It is sufficient if the number of sheets is set.

In addition, when using a plurality of lid side intercalating sheets 82, at least one lid side intercalating sheet 82 is formed of PET film, and the remaining lid side intercalating sheets 82 are made of acrylic impregnated paper, It may also be formed of other paper. When using a plurality of receiver-side inserting sheets 83, at least one receiver-side inserting sheet 83 is made of PET film, and the remaining receiver-side inserting sheets 83 are made of acrylic-impregnated paper or other materials. It may also be formed of paper.

When using a plurality of lid-side inserting sheets 82, they may be made of the same material (described later) and the same thickness, or they may be made of the same material (described later) and different thicknesses (thinner or thicker). The lid side inserts are made of various combinations, such as different materials (described later) and the same thickness, or different materials (described later) and different thicknesses (thinner or thicker). A spacer sheet 82 may also be used. Further, the longitudinal dimension (described later) and the width dimension of the lid side inserting sheet 82 may be the same or different from each other, and the lid side inserting sheet 82 may be formed in various combinations. 82 may be used.

Similarly to the lid side inserting sheet 82, the receiving part side intervening sheet 83 may be made of the same material (described later) and the same thickness, or may be made of the same material (described later) and different thickness (thinner or thinner). Formed in various combinations, such as different materials (described later) and the same thickness, or different materials (described later) and different thicknesses (thinner or thicker). It is also possible to use the lid side intervening sheet 82. Further, the longitudinal dimension (described later) and the width dimension of the receiving part side intervening sheets 83 may be the same or different from each other, and the receiving part side intervening sheets 83 may be formed in various combinations. 83 may be used.

Both surfaces of the intermediate intervening sheet 81, the lid side intervening sheet 82, and the receiving section side intervening sheet 83 may be formed flat, and each of the intervening sheets 81, 82, to 83 may be There may be no holes or unevenness, except for minute holes or unevenness that are sometimes formed. The intervening sheets 81, 82, to 83 suppress plastic deformation of the vapor deposition masks 20 when each vapor deposition mask 20 is taken out from the vapor deposition mask stack 80.

It is preferred that the vapor deposition masks 20 in the vapor deposition mask stack 80 have the same shape and that the effective areas 22 of each vapor deposition mask 20 are arranged so as to overlap when viewed along the stacking direction. , but not limited to this. The number or shape of the effective regions 22 of each vapor deposition mask 20 may be different as long as the convex portion 67 of the lid portion 62 can be arranged at the end 20e of the vapor deposition mask 20 where the effective region 22 is not formed.

The lower surface 67a of the convex portion 67 of the lid portion 62 is in contact with the upper surface of the lid-side intervening sheet 82, and the lid-side intervening sheet 82 is pressed against the convex portion 67. As a result, the lid side inserting sheet 82 moves in the plane direction with respect to the convex part 67 due to friction between the upper surface of the lid part side inserting sheet 82 and the lower surface 67a of the convex part 67 of the lid part 62. What people are saying - Write a review

As shown in FIG. 31, a gap 68 is formed around the convex portion 67 between the lid side intercalating sheet 82 and the second facing surface 66 of the lid portion 62. As shown in FIG. That is, a gap 68 is formed between the lid side intercalating sheet 82 and the second opposing surface 66 around the convex portion 67 including the area between one convex portion 67 and the other convex portion 67. There is. Therefore, the void 68 is formed above the effective area of the vapor deposition mask 20. This gap 68 has a desired dimension G as the distance between the lid-side insertion sheet 82 and the second opposing surface 66. This dimension G may be equal to the height of the convex portion 67. However, if the convex part 67 is formed of a soft material with low hardness and is contracted in the vertical direction after packaging, the dimension G will be smaller than the height of the convex part 67 when it is not contracted. You can leave it there. Note that since the height of the accommodation space 64a is defined by the spacer 64, even if the convex portion 67 contracts, the thickness or number of vapor deposition masks 20 of the vapor deposition mask stack 80, or the intervening sheet 81, A gap 68 can be formed around the protrusion 67 by adjusting the thickness or number of the protrusions 82 and 83. The dimension G in this case may be the height of the convex portion 67 when it is contracted, or may be smaller than the height.

The intermediate insertion sheet 81, the lid side insertion sheet 82, and the receiver side insertion sheet 83 have flexibility that can absorb to some extent the force applied to the vapor deposition mask 20 in the packaged state and the impact applied during transportation. It is preferable to have. Further, each of the intervening sheets 81, 82, and 83 preferably has a strength sufficient to support the vapor deposition mask stack 80 including the vapor deposition mask 20. A common sheet can be used for each of the intervening sheets 81, 82, and 83 as long as the sheet has such characteristics. For example, any film material having any thickness can be used for each of the intervening sheets 81, 82, 83, and for example, PET (polyethylene terephthalate) film can be suitably used. The lower limit of the thickness of the film material may be, for example, 0.0010 mm or more, 0.0050 mm or more, 0.010 mm or more, or 0.050 mm or more. . Further, the upper limit may be 0.10 mm or less, 0.20 mm or less, 0.30 mm or less, or 0.50 mm or less. The range may be determined by a combination of any one of the plurality of lower limit candidate values described above and any one of the plurality of upper limit candidate values described above. For example, it may be 0.0010 mm or more and 0.50 mm or less, 0.0050 mm or more and 0.30 mm or less, 0.010 mm or more and 0.20 mm or less, and 0.050 mm or more and 0.00 mm or more. It may be 10 mm or less. Further, the range may be determined by a combination of any two of the plurality of lower limit candidate values described above. For example, it may be 0.0010 mm or more and 0.050 mm or less, 0.0050 mm or more and 0.010 mm or less, 0.0010 mm or more and 0.010 mm or less, and 0.0050 mm or more and 0.0050 mm or more and 0.010 mm or less. It may be 0.050 mm or less. Further, the range may be determined by a combination of any two of the plurality of upper limit candidate values described above. For example, it may be 0.10 mm or more and 0.50 mm or less, 0.20 mm or more and 0.30 mm or less, 0.10 mm or more and 0.30 mm or less, and 0.20 mm or more and 0.30 mm or less. It may be 50 mm or less. For example, by setting the thickness of the intervening sheets 81, 82, 83 to 0.010 mm or more, the uneven shape formed by the through holes 25 of the vapor deposition mask 20 laminated on one side of the intervening sheets 81, 82, 83 can be Appearance on the other side can be suppressed. Further, it is possible to suppress the intervening sheets 81, 82, 83 from being torn, and the intervening sheets 81, 82, 83 can be reused, which is economical. For example, on the other hand, by setting the thickness of the intervening sheets 81, 82, and 83 to 0.50 mm or less, the mass of the intervening sheets 81, 82, and 83 can be reduced, and the mass of the vapor deposition mask package 60 can be increased. can be suppressed. Furthermore, since the PET film is relatively hard and does not easily form wrinkles, plastic deformation of the vapor deposition mask 20 can be effectively suppressed. Furthermore, each of the intervening sheets 81, 82, and 83 may be made of a fiber material such as paper instead of PET film. For example, the intercalating sheets 81, 82, 83 may be made of acrylic impregnated paper. When acrylic-impregnated paper is used, transfer of foreign matter generated from the fibers to the vapor deposition mask 20 can be suppressed.

As shown in FIGS. 31 and 32, each of the intervening sheets 81, 82, 83 has a periphery that extends over the entire circumference of the evaporation mask 20 when viewed along the stacking direction of the evaporation mask 20. It is preferable that it has dimensions that allow it to protrude from 20. In this embodiment, the dimensions (longitudinal total length) of the intervening sheets 81, 82, and 83 in the longitudinal direction D1 of the vapor deposition mask 20 are larger than the total longitudinal length of the vapor deposition mask 20 (for example, 0.1 mm or more and 20 mm or less). ), and the widthwise dimension of the vapor deposition mask 20 of the intervening sheets 81, 82, 83 is larger than the widthwise dimension of the vapor deposition mask 20 (for example, within the range of 0.1 mm or more and 20 mm or less) (larger) As a result, in the deposition mask stack 80, the intervening sheets 81, 82, and 83 can be made to protrude from the deposition mask 20 over the entire circumference, and the deposition masks 20 adjacent to each other can be prevented from directly touching and overlapping each other. It can be suppressed. That is, if the total length in the longitudinal direction of the intervening sheets 81, 82, 83 is smaller than the total length in the longitudinal direction of the vapor deposition mask 20, the vapor deposition mask 20 on one side of the intervening sheets 81, 82, 83 and the other side may There is a possibility that the through holes 25 may be deformed due to direct contact and overlapping with a certain vapor deposition mask 20 . Furthermore, when the widthwise dimension of the intervening sheets 81, 82, and 83 is smaller than the widthwise dimension of the vapor deposition mask 20, the through hole 25 may similarly be deformed. On the other hand, according to the present embodiment, the total length in the longitudinal direction of the intervening sheets 81, 82, 83 is larger than the total length in the longitudinal direction of the vapor deposition mask 20, and the widthwise dimension of the intervening sheets 81, 82, 83 is is larger than the widthwise dimension of the vapor deposition mask 20, it is possible to prevent the vapor deposition masks 20 on both sides of the intervening sheets 81, 82, and 83 from coming into direct contact with each other and overlapping each other. Therefore, deformation of the through hole 25 can be effectively suppressed.

Each of the intervening sheets 81, 82, and 83 is preferably coated with an antistatic coating to suppress generation of static electricity. More specifically, the intervening sheets 81, 82, 83 may be coated with an antistatic agent to form antistatic layers on both surfaces of the intervening sheets 81, 82, 83. In this case, it is possible to prevent the intervening sheets 81, 82, 83 from being electrically charged, and it is possible to prevent the vapor deposition mask 20 and the intervening sheets 81, 82, 83 from adhering to each other due to electrostatic action when unpacking. Examples of such antistatic agents include surfactants, conductive polymers, carbon black, and metals. Examples of the intervening sheets 81, 82, and 83 include polyester synthetic paper K2323-188-690 mm manufactured by Toyobo Co., Ltd. and sold under the trade name CRISPR (registered trademark). Alternatively, the material of the intervening sheets 81, 82, and 83 may be acrylic impregnated paper or film into which an antistatic agent is kneaded. An example of the acrylic-impregnated paper in which an antistatic agent is kneaded is AS Staclin manufactured by Sakurai Co., Ltd. Such antistatic treatment can prevent foreign matter from adhering to the intervening sheets 81 to 83 due to electrical charge during packaging, and can prevent foreign matter from being transferred to the vapor deposition mask 20. Furthermore, it is possible to suppress adhesion between the intervening sheets 81, 82, and 83 and the vapor deposition mask 20 due to electrostatic action during unpacking.

The lid part side insertion sheet 82 is not attached to the convex part 67 or the second opposing surface 66 of the lid part 62. Furthermore, the receiving section side intervening sheet 83 is not attached to the first opposing surface 65 of the receiving section 61. As a result, during thermal expansion, the lid-side insertion sheet 82 and the receiving-side insertion sheet 83 can thermally expand or contract smoothly.

As shown in FIG. 28, the receiving part 61 and the lid part 62 which sandwich the vapor deposition mask stack 80 are sealed in a sealed bag 69. The pressure inside the sealed bag 69 is reduced from atmospheric pressure. Further, a desiccant 70 (for example, silica gel) is stored in the sealed bag 69, and the desiccant 70 adsorbs moisture in the sealed bag 69 to maintain the dry atmosphere inside the sealed bag 69. There is. This prevents the vapor deposition mask 20 from deteriorating due to moisture. Note that the sealed bag 69 is omitted in FIG. 27.

Further, as shown in FIG. 28, the vapor deposition mask package 60 according to this embodiment may include an impact sensor 71 that detects an impact applied to the vapor deposition mask 20. In this case, the impact applied to the vapor deposition mask 20 during transportation can be confirmed after transportation. Therefore, if an impact of more than a predetermined value is applied during transportation, it is possible to estimate the possibility that the vapor deposition mask 20 is defective, and the quality of transportation of the vapor deposition mask 20 can be improved. . The sealed bag 69 is housed in a cardboard box 72, and the cardboard box 72 is packed in a wooden box 73. As shown in FIG. 28, it is preferable to attach an impact sensor 71 inside this wooden box 73, but the present invention is not limited thereto. As the impact sensor 71, for example, Shockwatch Label L-30 (green) manufactured by SHOCKWATCH Inc. can be suitably used.

Next, the operation of this embodiment having such a configuration will be explained. Here, a method of packing the vapor deposition mask 20 will be explained.

(Deposition mask packaging method)
First, a lid part 62 shown in FIG. 29 and a receiving part 61 shown in FIG. 30 are prepared as the vapor deposition mask packaging device 60a. In addition, a vapor deposition mask 20, an intermediate intervening sheet 81, a cover side intervening sheet 82, and a receiving section intervening sheet 83 are prepared. The receiving portion 61, the lid portion 62, the spacer 64, each of the intervening sheets 81, 82, 83, etc. may be reused if it is deemed that there are no problems in use such as deterioration.

Next, as shown in FIG. 31, a deposition mask stack 80 placed on the receiving portion 61 is obtained.

In this case, first, the receiving part-side insertion sheet 83 is placed on the receiving part 61. The receiving part-side insertion sheet 83 is arranged at a position where it can be accommodated in the accommodation space 64a defined by the pair of spacers 64 when the lid part 62 is arranged on the receiving part 61. Subsequently, the vapor deposition mask 20 is placed on the receiving section side intervening sheet 83. In this case, the vapor deposition mask 20 is arranged so that the periphery of the receiving section side intercalating sheet 83 protrudes from the vapor deposition mask 20 over the entire circumference. Further, the vapor deposition mask 20 is arranged such that the center in the longitudinal direction D1 of the vapor deposition mask 20 is positioned at the center of the longitudinal direction of the receiving portion 61, and the center of the vapor deposition mask 20 in the width direction D2 is positioned at the center of the receiving portion 61 in the width direction. Mask 20 is placed. Next, an intermediate sheet 81 is placed on the vapor deposition mask 20. In this case, the intermediate intervening sheet 81 is arranged so as to overlap the receiving part side intervening sheet 83 in plan view. Thereafter, by repeating the placement of the vapor deposition masks 20 and the intermediate intervening sheets 81, the plurality of vapor deposition masks 20 and the plurality of intermediate intervening sheets 81 are alternately stacked. Then, the lid side intervening sheet 82 is placed on the vapor deposition mask 20 that is finally stacked. The lid section side insertion sheet 82 is arranged so as to overlap the receiving section side insertion sheet 83 and the intermediate insertion sheet 81 in a plan view.

After the vapor deposition mask stack 80 placed on the receiving part 61 is obtained, the lid part 62 is placed on the vapor deposition mask stack 80. As a result, the receiving portion 61 and the lid portion 62 face each other, and the receiving portion 61 and the lid portion 62 are arranged on both sides of the vapor deposition mask stack 80 in the vertical direction. In this case, the lower surface 67a of the convex portion 67 of the lid portion 62 comes into contact with the lid portion side insertion sheet 82.

Next, as shown in FIG. 27, the receiving part 61 and the lid part 62 are bound together by an elastic belt 63. As a result, the receiving portion 61 and the lid portion 62 are pressed against each other by the elastic force of the elastic belt 63. In this case, as shown in FIG. 31, the convex portion 67 presses the lid side insertion sheet 82. The pressing force from the convex portion 67 is transmitted to the vapor deposition mask 20 in a weakened manner. That is, in this embodiment, as shown in FIG. 32, the convex portion 67 is arranged at a position overlapping the corresponding end opening 24 of the vapor deposition mask 20, and the convex portion 67 is arranged at a position overlapping the corresponding end opening 24 of the vapor deposition mask 20, and The region overlapping the opening 24 is not supported by the deposition mask 20 below the region. As a result, when the convex portion 67 presses the area overlapping with the end opening 24 of the lid side intercalating sheet 82, this area is bent. Through this bending deformation, the lid-side intervening sheet 82 presses each vapor deposition mask 20 disposed below. In this way, a portion of the pressing force of the convex portion 67 is absorbed by the lid-side intervening sheet 82, and the pressing force of the convex portion 67 is prevented from being directly transmitted to the vapor deposition mask 20. Therefore, the force that the vapor deposition mask 20 receives from the convex portion 67 is weakened.

After the receiving part 61 and the lid part 62 are tied together, the receiving part 61 and the lid part 62 are sealed together with the desiccant 70 in a sealed bag 69, as shown in FIG. Subsequently, the inside of the sealed bag 69 is evacuated from the opening. When the pressure inside the sealed bag 69 decreases to a predetermined degree of vacuum, the opening of the sealed bag 69 is sealed.

The receiving portion 61 and the lid portion 62 sealed with the sealed bag 69 are housed in a cardboard box 72, and the cardboard box 72 is packed in a wooden box 73, as shown in FIG. At this time, the impact sensor 71 is attached inside the wooden box 73. In this way, the vapor deposition mask package 60 according to this embodiment is obtained.

Next, a case will be described in which the vapor deposition mask package 60 obtained as described above is transported. While the vapor deposition mask package 60 is being transported, the vapor deposition mask 20 may be subjected to impact.

For example, consider a case where an upward force is applied to the vapor deposition mask 20 due to this impact. As described above, the vapor deposition mask 20 receives the pressing force from the convex portion 67 via the lid side intervening sheet 82. As a result, both ends of each vapor deposition mask 20 in the longitudinal direction D1 are supported by the convex portion 67 via the lid side intervening sheet 82, and upward movement of each vapor deposition mask 20 is suppressed. . Further, when receiving this upward force, the effective area 22 of each vapor deposition mask 20 may bend upward. However, each vapor deposition mask 20 is supported by a lid side intervening sheet 82, and an intermediate intervening sheet 81 is interposed between the vapor deposition masks 20. This prevents the effective area 22 from bending upward. Therefore, the deformation of the vapor deposition mask 20 can be kept within the elastic deformation range, and even if the vapor deposition mask 20 receives an impact during transportation, plastic deformation of the vapor deposition mask 20 can be suppressed.

On the other hand, consider a case where a downward force is applied to the vapor deposition mask 20 due to impact during transportation. Each vapor deposition mask 20 is supported by a receiving part 61 having a flat first facing surface 65 via a receiving part side intervening sheet 83 . This suppresses downward movement of each vapor deposition mask 20, and also suppresses downward deflection of the effective area 22 of each vapor deposition mask 20. Therefore, plastic deformation of the vapor deposition mask 20 can be suppressed.

Moreover, since the intermediate intervening sheet 81 is interposed between the vapor deposition masks 20 adjacent to each other, it is avoided that the vapor deposition masks 20 adjacent to each other come into direct contact with each other and overlap. Therefore, even if the vapor deposition masks 20 are subjected to impact during transportation, it is suppressed that the vapor deposition masks 20 engage with each other in the effective area 22, and that the vapor deposition masks 20 adjacent to each other are suppressed from rubbing against each other. In this way, plastic deformation of the vapor deposition mask 20 can be suppressed.

During transportation, the temperature of the vapor deposition mask package 60 may change due to changes in the surrounding environment. In this case, each vapor deposition mask 20 and each intervening sheet 81, 82, 83 thermally expands or contracts, respectively. However, in the present embodiment, a lid-side intervening sheet 82 is interposed between the vapor deposition mask 20 on the uppermost stage and the convex portion 67 of the lid part 62, and a lid-side insertion sheet 82 is interposed between the vapor deposition mask 20 on the lowermost stage and the convex part 67 of the lid part 62. A receiving part-side intervening sheet 83 is interposed between the receiving part 61 and the receiving part 61 . Although each vapor deposition mask 20 receives a force from the convex portion 67, the force is weakened because it is received via the lid side intervening sheet 82. Furthermore, a gap 68 is formed around the convex portion 67 between the lid portion side insertion sheet 82 and the second opposing surface 66 of the lid portion 62 . Therefore, the vapor deposition mask 20 can thermally expand or contract smoothly with respect to the receiving part 61 and the lid part 62. Therefore, generation of thermal stress in the vapor deposition mask 20 is suppressed.

By the way, when unpacking the vapor deposition mask package 60 after transportation, it is sufficient to follow the reverse procedure of the method for packing the vapor deposition mask 20 described above. In particular, since the intervening sheet 81 is interposed between the adjacent vapor deposition masks 20, the vapor deposition masks 20 are prevented from meshing with the vapor deposition masks 20 disposed below. Therefore, each vapor deposition mask 20 can be smoothly taken out from the vapor deposition mask stack 80. Therefore, plastic deformation of the vapor deposition mask 20 can be suppressed, and the ease of handling the vapor deposition mask 20 can be improved.

As described above, according to the present embodiment, the lid part-side intervening sheet 82 is arranged between the lid part 62 and the vapor deposition mask 20, and is arranged at both ends of the vapor deposition mask 20 in the longitudinal direction D1 in a plan view. The convex portion 67 presses the lid side intervening sheet 82. Thereby, the vapor deposition mask 20 can be supported by the convex portion 67 and the receiving portion 61, and vertical movement of the vapor deposition mask 20 during transportation can be suppressed. Further, the vapor deposition mask 20 can be supported by the lid side intervening sheet 82 arranged between the convex portion 67 and the vapor deposition mask 20. Therefore, vertical movement of the vapor deposition mask 20 can be suppressed, and upward bending of the vapor deposition mask 20 can be suppressed. As a result, plastic deformation of the vapor deposition mask 20 during transportation can be suppressed.

Further, according to the present embodiment, the convex portion 67 of the lid portion 62 may press the lid portion side insertion sheet 82. As a result, the pressing force of the convex portion 67 is transmitted to the vapor deposition mask 20 via the lid side intervening sheet 82, so that the force that the vapor deposition mask 20 receives from the convex portion 67 can be weakened. Further, around the convex portion 67, a gap 68 is formed between the lid portion side insertion sheet 82 and the second opposing surface 66 of the lid portion 62. Therefore, even if the temperature changes during transportation, the vapor deposition mask 20 can thermally expand or contract smoothly, and generation of thermal stress in the vapor deposition mask 20 can be suppressed. Therefore, plastic deformation of the vapor deposition mask 20 during transportation can be suppressed. Furthermore, since the lid-side intervening sheet 82 is disposed between the vapor deposition mask 20 and the convex portion 67 of the lid 62, the vapor deposition mask 20 can be smoothly thermally expanded or heated relative to the lid 62. Can be deflated.

Further, according to the present embodiment, the convex portion 67 of the lid portion 62 does not need to overlap the through hole 25 of the vapor deposition mask 20 in plan view. This can prevent the convex portion 67 from coming into contact with the through hole 25 formed in the effective area 22, and can suppress deformation of the through hole 25.

Further, according to the present embodiment, the convex portion 67 of the lid portion 62 may be arranged at a position overlapping the corresponding end opening 24 of the vapor deposition mask 20 in plan view. As a result, part of the pressing force of the convex portion 67 is absorbed by the lid-side intervening sheet 82, and the force that the vapor deposition mask 20 receives from the convex portion 67 can be effectively weakened. In particular, according to the present embodiment, since the protrusions 67 do not protrude from the corresponding end openings 24, the force that the vapor deposition mask 20 receives from the protrusions 67 can be further weakened. Therefore, the vapor deposition mask 20 can be thermally expanded or contracted even more smoothly when the temperature changes.

Further, according to the present embodiment, a receiving part side intervening sheet 83 may be arranged between the vapor deposition mask 20 and the receiving part 61. Thereby, the vapor deposition mask 20 can be thermally expanded or contracted smoothly with respect to the receiving part 61 when the temperature changes.

Further, according to the present embodiment, an intermediate sheet 81 may be arranged between adjacent vapor deposition masks 20 in the vapor deposition mask stack 80. This makes it possible to avoid direct contact and overlapping of the vapor deposition masks 20 that are adjacent to each other. Therefore, the vapor deposition mask 20 can be thermally expanded or contracted smoothly with respect to other vapor deposition masks 20 when the temperature changes, and plastic deformation of the vapor deposition mask 20 can be further suppressed.

Further, according to the present embodiment, the hardness of the convex portion 67 may be lower than the hardness of the receiving portion 61 and the hardness of the lid portion 62. Thereby, the force that the vapor deposition mask 20 receives from the convex portion 67 can be weakened. Therefore, even if the temperature changes during transportation, the vapor deposition mask 20 can thermally expand or contract smoothly, and the generation of thermal stress in the vapor deposition mask 20 can be effectively suppressed. , plastic deformation of the vapor deposition mask 20 during transportation can be suppressed.

Further, according to the present embodiment, the hardness of the spacer 64 may be higher than the hardness of the receiving part 61 and the hardness of the lid part 62. Thereby, the hardness of the spacer 64 can be increased, and the rigidity can be increased against vertical forces that the vapor deposition mask package 60 receives. Therefore, it is possible to suppress the application of force in the vertical direction to the vapor deposition mask 20.

(First modification)
Note that in the present embodiment described above, the receiving part 61 and the lid part 62 that sandwich the vapor deposition mask stack 80 are sealed in a sealed bag 69, and even if the desiccant 70 is stored in the sealed bag 69, Explained a good example. However, it is not limited to this. For example, as shown in FIG. 33, the receiving part 61 and the lid part 62 which sandwich the vapor deposition mask stack 80 may be doubly sealed with two sealed bags 69a and 69b. In the modification shown in FIG. 33, the receiving part 61 and the lid part 62 which sandwich the vapor deposition mask stack 80 are sealed with a first sealed bag 69a, and the first sealed bag 69a is sealed with a second sealed bag 69b. It's also sealed.

The pressure inside the first sealed bag 69a is reduced from atmospheric pressure. Further, an oxygen absorber 70a is stored in the first sealed bag 69a, and the oxygen absorber 70a absorbs the oxygen remaining in the first sealed bag 69a. Oxygen is removed from the atmosphere. This can suppress deterioration of the vapor deposition mask 20 due to oxygen (for example, generation of rust).

The pressure inside the second sealed bag 69b is reduced from atmospheric pressure. Further, a desiccant 70b is stored in the second sealed bag 69b, and the desiccant 70b adsorbs moisture in the second sealed bag 69b, thereby making the atmosphere inside the second sealed bag 69b dry. is maintained. This can suppress moisture from entering the first sealed bag 69a from the second sealed bag 69b, and can suppress deterioration of the vapor deposition mask 20 due to moisture.

In addition, in the first modified example, the second sealed bag 69b shows an example in which a pair of the receiving part 61 and the lid part 62 are sealed with the first sealed bag 69a. It is not limited to this. For example, a plurality of sets of receiving portions 61 and lid portions 62, each of which is sealed with a first sealed bag 69a, may be sealed in one second sealed bag 69b.

Further, the first sealed bag 69a is not limited to storing the oxygen absorber 70a, and may store a desiccant 70b instead of or in addition to the oxygen absorber 70a. Similarly, the second sealed bag 69b is not limited to containing the desiccant 70b, and may contain an oxygen absorber 70a instead of or in addition to the desiccant 70b. Further, the first sealed bag 69a may be filled with an inert gas such as nitrogen gas or a non-reducing gas. The second sealed bag 69b may be filled with an inert gas or non-reducing gas such as nitrogen gas. The concentration of the inert gas or non-reducing gas, such as nitrogen gas, may be 85% or more, 90% or more, or 95% or more.

Moreover, the receiving part 61 and the lid part 62 which sandwich the vapor deposition mask laminate 80 may be sealed multiple times with three or more sealed bags. In this case, each bag may contain at least one of an oxygen absorber and a desiccant. Further, it may be filled with an inert gas such as nitrogen gas or a non-reducing gas. Further, the concentration of the inert gas or non-reducing gas such as nitrogen gas may be 85% or more, 90% or more, or 95% or more. Further, various combinations can be adopted as to whether or not an oxygen scavenger and/or desiccant is stored and whether or not an inert gas such as nitrogen gas and/or a non-reducing gas is filled.

Moreover, not only the desiccant 70 but also an oxygen absorber may be stored in the sealed bag 69 shown in FIG. 28. In this case, it is possible to further suppress deterioration of the vapor deposition mask 20 due to moisture and further suppress deterioration due to oxygen.

(Second modification)
Further, in the present embodiment described above, the receiving part side intervening sheet 83, the vapor deposition mask laminate 80, and the lid part side interposing sheet 82 are arranged between the receiving part 61 and the lid part 62. explained. However, it is not limited to this. For example, as shown in FIG. 34, an auxiliary sheet (also referred to as a pressing sheet) may be arranged between the receiving section 61 and the receiving section side intervening sheet 83. In the present embodiment, as an example of the auxiliary sheet (fourth sheet) between the receiving part 61 and the receiving part-side intervening sheet 83, the receiving part-side auxiliary sheet 88 will be explained below as an example. Moreover, another auxiliary sheet may be arranged between the lid part-side interposed sheet 82 and the lid part 62. In the present embodiment, a cover-side auxiliary sheet 89 will be described below as an example of an auxiliary sheet (fifth sheet) between the cover-side intervening sheet 82 and the cover 62. One of the receiving section side auxiliary sheet 88 and the lid section side auxiliary sheet 89 may not be used.

Both sides of the receiving section side auxiliary sheet 88 and the lid section side auxiliary sheet 89 are each formed flat, and each auxiliary sheet 88, 89 has no holes or irregularities formed during sheet manufacturing. , holes, irregularities, etc. may not be formed. The lid side auxiliary sheet 89 presses the vapor deposition mask 20 with its own weight. This makes it possible to suppress vertical movement of the vapor deposition mask 20 during transportation. Further, the receiving section side auxiliary sheet 88 is for adjusting the height of the accommodation space 64a.

It is preferable that the receiver-side auxiliary sheet 88 and the lid-side auxiliary sheet 89 have flexibility that can absorb to some extent the force applied to the vapor deposition mask 20 in the packaged state and the impact applied during transportation. Further, each of the auxiliary sheets 88 and 89 preferably has a strength sufficient to support the vapor deposition mask stack 80 including the vapor deposition mask 20. A common sheet can be used for each of the auxiliary sheets 88 and 89 as long as it has such characteristics. For example, each auxiliary sheet 88, 89 may be made of any film material having any thickness, but each auxiliary sheet 88, 89 may be thicker than the intervening sheets 81, 82, 83. It may be thin, or it may be thin. For each of the auxiliary sheets 88 and 89, for example, a sheet made of polyethylene terephthalate (PET), polypropylene, polyethylene, polycarbonate, polystyrene, etc. with a thickness of 10 μm or more and 300 μm or less can be used, and preferably a 100 μm PET film is suitably used. be able to. By setting the thickness of the lid side auxiliary sheet 89 to 10 μm or more, the mass of the lid side auxiliary sheet 89 can be increased. On the other hand, by setting the thickness of the lid-side auxiliary sheet 89 to 300 μm or less, it is possible to suppress the lid-side auxiliary sheet 89 from pressing the vapor deposition mask laminate 80 excessively. The receiving part side auxiliary sheet 88 may be made to have the same thickness as the lid part side auxiliary sheet 89 to make the sheet common. The PET film used for the auxiliary sheet may be a PET film containing filler. Examples of filler materials include silica, particles of inorganic oxides such as calcium carbonate or titanium oxide, carbon black, metal particles, and metal fibers. In this way, the mass of the auxiliary sheets 88 and 89 can be increased, and the effect of pressing the vapor deposition mask 20 can be increased. It is preferable that each of the auxiliary sheets 88, 89, like each of the intervening sheets 81, 82, 83, is antistatic coated or kneaded with an antistatic agent. Furthermore, the filler itself may be made conductive, or the filler may be made conductive by covering it with a metal film or a metal oxide film, thereby serving as both a filler and an antistatic agent.

Furthermore, in the deposition mask stack 80 shown in FIG. 31, one intermediate sheet 81 is arranged between the adjacent deposition masks 20. However, the present invention is not limited to this, and two or more intermediate sheets 81 may be arranged between the vapor deposition masks 20 adjacent to each other. In a second modification shown in FIG. 34, two intermediate sheets 81 are arranged between adjacent vapor deposition masks 20. This can further prevent the vapor deposition masks 20 that are adjacent to each other from directly coming into contact with each other and overlapping each other. Therefore, the vapor deposition mask 20 can be thermally expanded or contracted smoothly with respect to other vapor deposition masks 20 when the temperature changes, and plastic deformation of the vapor deposition mask 20 can be further suppressed. The point that two or more intermediate sheets 81 are arranged between adjacent vapor deposition masks 20 can also be applied to the form shown in FIG. 31. Further, when two or more intermediate sheets 81 are arranged between adjacent vapor deposition masks 20, the materials of these intermediate sheets 81 may be the same or different. For example, when two intermediate sheets 81 are arranged between adjacent vapor deposition masks 20, one intermediate sheet 81 is formed of PET film, and the other intermediate sheet 81 is impregnated with acrylic. It may also be formed of paper. Further, when three intermediate sheets 81 are arranged between adjacent vapor deposition masks 20, at least one intermediate sheet 81 is formed of PET film, and the remaining intermediate sheets 81 are formed of PET film. It may also be formed from acrylic impregnated paper or other paper.

When using a plurality of intermediate sheets 81, they may be made of the same material (described later) and the same thickness, or they may be made of the same material (described later) and different thicknesses (thinner or thicker). , intermediate sheets 81 formed of various combinations such as mutually different materials (described later) and the same thickness, mutually different materials (described later) and different thicknesses (thinner, thicker), etc. May be used. Further, the longitudinal dimension (described later) and the width dimension of the intermediate sheets 81 may be the same or different from each other, and intermediate sheets 81 formed in various combinations may be used. Good too.

Further, in the present embodiment described above, an example has been described in which each convex portion 67 is arranged at a position overlapping the corresponding end opening 24 of the vapor deposition mask 20 in plan view. However, the present invention is not limited to this, and as long as at least some of the convex parts 67 are arranged at both ends of the vapor deposition mask 20 in the longitudinal direction D1, the arrangement of each convex part 67 is arbitrary.

(Third modification)
For example, as in the third modified example shown in FIGS. 35 to 37, each convex portion 67 is arranged in the width direction of the vapor deposition mask 20 so that a portion thereof overlaps with the corresponding end opening 24. D2 and is arranged to extend across the end opening 24. In this case, each convex portion 67 has a longitudinal direction along the width direction D2 of the vapor deposition mask 20, and the contact area between the vapor deposition mask 20 and the convex portion 67 can be increased. Therefore, support of the vapor deposition mask 20 can be stabilized. Further, the pressing force from the convex portion 67 of the lid portion 62 can be dispersed. Therefore, when the temperature changes, the vapor deposition mask 20 can thermally expand or contract smoothly with respect to the receiving part 61 and the lid part 62. Therefore, generation of thermal stress in the vapor deposition mask 20 can be suppressed, and plastic deformation of the vapor deposition mask 20 can be suppressed. Note that, also in the third modification, the convex portion 67 does not need to overlap the through hole 25 through which the vapor deposition material 98 passes during vapor deposition. If a through hole is provided on both sides of the end opening 24 in the width direction D2 and is not intended for the vapor deposition material 98 to pass through, the convex portion 67 may overlap the through hole. good.

(Fourth modification)
Further, for example, as in the fourth modification shown in FIGS. 38 and 39, each convex portion 67 is arranged in the vapor deposition mask 20 so that a portion thereof overlaps with the corresponding end opening 24. It may extend in the longitudinal direction D1. In the fourth modification, a pair of convex portions 67 are integrated and formed continuously. In this case, the integrated convex portion 67 is formed along the longitudinal direction D1 of the vapor deposition mask 20, extending from one end edge 20g (see FIG. 3) to the other end edge 20g. By this, the contact area between the vapor deposition mask 20 and the convex portion 67 can be further increased, and the support of the vapor deposition mask 20 can be stabilized. Further, the pressing force from the convex portion 67 of the lid portion 62 can be dispersed. Therefore, when the temperature changes, the vapor deposition mask 20 can thermally expand or contract smoothly with respect to the receiving part 61 and the lid part 62.

Further, in the fourth modification, the integrated convex portion 67 is arranged at the center of the vapor deposition mask 20 in the width direction D2. In this case, the force due to thermal expansion of the vapor deposition mask 20 can be released to the pair of side edges 20f of the vapor deposition mask 20 that are disposed far from the convex portion 67. Also in this respect, the vapor deposition mask 20 can be thermally expanded smoothly, and plastic deformation of the vapor deposition mask 20 can be suppressed. In particular, since the integrated convex portion 67 is arranged at the center of the vapor deposition mask 20 in the width direction D2, symmetry can be given to the deformation of the vapor deposition mask 20 during thermal expansion. Therefore, plastic deformation of the vapor deposition mask 20 can be effectively suppressed.

In addition, in the fourth modification, an example in which the pair of convex portions 67 are integrated has been described. However, the present invention is not limited to this, and each convex portion 67 may extend in the longitudinal direction D1 of the vapor deposition mask 20 but may not be integrated. Furthermore, one or more other protrusions 67 may be formed between the pair of protrusions 67 arranged at both ends 20e of the vapor deposition mask 20 in plan view, and may be arranged intermittently in a row. . In this case, each convex portion 67 may be arranged in a region other than the effective region 22 (that is, the surrounding region 23).

(Fifth modification)
Furthermore, in the present embodiment described above, an example has been described in which the first opposing surface 65 of the receiving portion 61 is formed in a flat shape. However, it is not limited to this.

For example, as in a fifth modification shown in FIGS. 40 to 43, the first opposing surface 65 of the receiving portion 61 includes a curved surface 84 that is curved to be convex toward the lid portion 62. You can stay there. The curved shape of the curved surface 84 can be formed by any arbitrary curve, such as a perfect circle or a part of an elliptical arc. In a fifth modification, the curved surface 84 is configured as a rigid body. Spacer abutting surfaces 85 are formed on both sides of the curved surface 84 in the width direction D2 of the vapor deposition mask 20, with which the spacer 64 abuts.

As shown in FIG. 43, the curved surface 84 includes a ridge line 86 extending from one end edge 20g to the other end edge 20g in the longitudinal direction D1 of the vapor deposition mask 20 in plan view. In other words, the ridge line 86 of the curved surface 84 extends from one edge of the accommodation space 64a defined by the pair of spacers 64 to the other edge in plan view. Here, the ridge line 86 means a line connecting the highest point of the curved surface 84 (the point closest to the lid part 62) in the cross section at each position in the longitudinal direction D1 of the vapor deposition mask 20. In this way, in the fifth modification, as shown in FIG. 42, the vapor deposition mask 20 placed on the curved surface 84 and the intervening sheets 81, 82, 83 are placed on the curved surface 84 under the influence of gravity. bend along. That is, the vapor deposition mask 20 is bent so that the pair of side edges 20f of the vapor deposition mask 20 are arranged below the widthwise center of the vapor deposition mask 20. Therefore, movement of the vapor deposition mask 20 in the width direction D2 is restricted by the curved surface 84.

In the fifth modification, the ridge line 86 is formed parallel to the second opposing surface 66 of the lid portion 62. That is, the minimum distance from the lid portion 62 to the curved surface 84 is constant over the longitudinal direction D1 of the vapor deposition mask 20. The ridge line 86 of the curved surface 84 extends through the vapor deposition mask 20 in the longitudinal direction D1. As a result, the deflection shape of the vapor deposition mask 20 and each intervening sheet 81, 82, 83 is made uniform in the longitudinal direction D1 of the vapor deposition mask 20, and the vapor deposition mask 20 and each intervening sheet 81, 82, 83 are This prevents it from bending into a two-dimensionally complex shape. Therefore, plastic deformation of the vapor deposition mask 20 is suppressed.

In the fifth modification, as shown in FIG. 40, the lid part 62 does not have the convex part 67 as shown in FIG. 29, and the second opposing surface 66 of the lid part 62 is It is in contact with the sheet 82 (particularly the portion of the lid-side interposed sheet 82 that overlaps the ridge line 86). As a result, the lid-side intervening sheet 82 can be supported by the second opposing surface 66. Therefore, even if vertical force is applied to the vapor deposition mask 20 during transportation, vertical movement of the vapor deposition mask 20 can be suppressed. Furthermore, since the lid-side intervening sheet 82 covers the vapor deposition mask 20, the vapor deposition mask 20 can be supported by the lid-side intervening sheet 82. Therefore, vertical movement of the vapor deposition mask 20 can be suppressed, and upward bending of the vapor deposition mask 20 can be suppressed.

Furthermore, in the fifth modification, as described above, the lid side intercalating sheet 82 is supported by the second opposing surface 66, so that the pressing force from the lid 62 can be dispersed. This allows the vapor deposition mask 20 to thermally expand or contract smoothly with respect to the receiving portion 61 and the lid portion 62 when the temperature changes. Therefore, generation of thermal stress in the vapor deposition mask 20 can be suppressed, and plastic deformation of the vapor deposition mask 20 can be suppressed.

Furthermore, in the fifth modification, a portion of the lid-side interposed sheet 82 that overlaps the ridge line 86 is arranged at the center of the vapor deposition mask 20 in the width direction D2. In this case, the force due to thermal expansion of the vapor deposition mask 20 can be released to the pair of side edges 20f of the vapor deposition mask 20 located far from the ridge line 86. Also in this respect, the vapor deposition mask 20 can be thermally expanded smoothly, and plastic deformation of the vapor deposition mask 20 can be suppressed. In particular, since the ridge line 86 is arranged at the center of the vapor deposition mask 20 in the width direction D2, symmetry can be given to the deformation of the vapor deposition mask 20 during thermal expansion. Therefore, plastic deformation of the vapor deposition mask 20 can be effectively suppressed.

In addition, in the fifth modification, the second opposing surface 66 of the lid 62 is in contact with the lid side insertion sheet 82 (that is, the portion of the lid side insertion sheet 82 that overlaps with the ridge line 86). An example was explained. However, the invention is not limited to this, and a gap may be formed between the second opposing surface 66 and the lid-side insertion sheet 82 as a whole, and the lid-side insertion sheet 82 may be inserted into the second opposing surface 66. does not have to be in contact with Even in this case, since the vapor deposition mask 20 can bend along the curved surface 84 of the receiving part 61, the movement of the vapor deposition mask 20 in the width direction D2 can be restricted by the curved surface 84. Furthermore, since the lid-side intervening sheet 82 covers the vapor deposition mask 20, the vapor deposition mask 20 can be supported by the lid-side intervening sheet 82. Therefore, plastic deformation of the vapor deposition mask 20 can be suppressed.

Further, an example in which the curved surface 84 is configured as a rigid body has been described. However, the present invention is not limited to this, and the curved surface 84 may have elasticity. In this case, the vertical force applied to the vapor deposition mask 20 during transportation can be absorbed, and plastic deformation of the vapor deposition mask 20 can be suppressed. For example, the receiving part 61 is configured by a rectangular parallelepiped receiving part main body and a curved part provided on the lid part 62 side of the receiving part main body, and the curved part is made of an elastic material such as rubber into a solid shape. Alternatively, it may be formed into a hollow shape. It is preferable that the receiving part main body is formed of a rigid material (for example, a plastic corrugated sheet) like the receiving part 61 shown in FIG. 30. The same applies to the sixth modification example described later.

Further, as in a sixth modification shown in FIGS. 44 to 46, the curved surface 84 of the first opposing surface 65 may have a shape different from that in the fifth modification. For example, as shown in FIG. 46, the curved surface 84 may include a ridge line 87 extending from one side edge 20f to the other side edge 20f in the width direction D2 of the vapor deposition mask 20 in plan view. In other words, the ridge line 87 of the curved surface 84 extends from one side edge to the other side edge in a direction perpendicular to the longitudinal direction of the accommodation space 64a defined by the pair of spacers 64 in plan view. The ridge line 87 here means a line connecting the highest point (the point closest to the lid part 62) of the curved surface 84 in the longitudinal section at each position in the width direction D2 of the vapor deposition mask 20. Also in this case, the vapor deposition mask 20 and the intervening sheets 81, 82, 83 bend along the curved surface 84 under the influence of gravity. That is, the vapor deposition mask 20 is bent so that the pair of edges 20g of the vapor deposition mask 20 are arranged below the longitudinal center of the vapor deposition mask 20. Therefore, movement of the vapor deposition mask 20 in the longitudinal direction D1 is restricted by the curved surface 84.

Also in the sixth modification, the ridge line 87 is formed parallel to the second opposing surface 66 of the lid portion 62. That is, the minimum distance from the lid portion 62 to the curved surface 84 is constant across the width direction D2 of the vapor deposition mask 20. The ridge line 87 of the curved surface 84 extends through the vapor deposition mask 20 in the width direction D2. As a result, the deflection shape of the vapor deposition mask 20 and each intervening sheet 81, 82, 83 is made uniform across the width direction D2 of the vapor deposition mask 20, and the vapor deposition mask 20 and each intervening sheet 81, 82, 83 are This prevents it from bending into a two-dimensionally complex shape. Therefore, plastic deformation of the vapor deposition mask 20 is suppressed.

In the sixth modification, the lid part 62 does not have the convex part 67 as shown in FIG. (a portion of the side intervening sheet 82 that overlaps with the ridge line 87). As a result, the lid-side intervening sheet 82 can be supported by the second opposing surface 66. Therefore, even if vertical force is applied to the vapor deposition mask 20 during transportation, vertical movement of the vapor deposition mask 20 can be suppressed. Furthermore, since the lid-side intervening sheet 82 covers the vapor deposition mask 20, the vapor deposition mask 20 can be supported by the lid-side intervening sheet 82. Therefore, vertical movement of the vapor deposition mask 20 can be suppressed, and upward bending of the vapor deposition mask 20 can be suppressed.

Furthermore, in the sixth modification, as described above, since the lid side intercalating sheet 82 is supported by the second opposing surface 66, the pressing force from the lid 62 can be dispersed. This allows the vapor deposition mask 20 to thermally expand or contract smoothly with respect to the receiving portion 61 and the lid portion 62 when the temperature changes. Therefore, generation of thermal stress in the vapor deposition mask 20 can be suppressed, and plastic deformation of the vapor deposition mask 20 can be suppressed.

Furthermore, in the sixth modification, a portion of the lid-side interposed sheet 82 that overlaps the ridge line 87 is arranged at the center of the vapor deposition mask 20 in the longitudinal direction D1. In this case, the force due to thermal expansion of the vapor deposition mask 20 can be released to the pair of edges 20g of the vapor deposition mask 20 located far from the ridge line 87. Also in this respect, the vapor deposition mask 20 can be thermally expanded smoothly, and plastic deformation of the vapor deposition mask 20 can be suppressed. In particular, since the ridge line 87 is arranged at the center of the vapor deposition mask 20 in the longitudinal direction D1, symmetry can be given to the deformation of the vapor deposition mask 20 during thermal expansion. Therefore, plastic deformation of the vapor deposition mask 20 can be effectively suppressed.

Note that in the sixth modification, the second opposing surface 66 of the lid 62 is in contact with the lid side insertion sheet 82 (particularly the portion of the lid side insertion sheet 82 that overlaps with the ridge line 87). An example was explained. However, the invention is not limited to this, and a gap may be formed between the second opposing surface 66 and the lid-side insertion sheet 82 as a whole, and the lid-side insertion sheet 82 may be inserted into the second opposing surface 66. does not have to be in contact with Even in this case, since the vapor deposition mask 20 can bend along the curved surface 84 of the receiving part 61, the movement of the vapor deposition mask 20 in the width direction D2 can be restricted by the curved surface 84. Furthermore, since the lid-side intervening sheet 82 covers the vapor deposition mask 20, the vapor deposition mask 20 can be supported by the lid-side intervening sheet 82. Therefore, plastic deformation of the vapor deposition mask 20 can be suppressed.

Although the embodiments of the present disclosure have been described in detail above, the vapor deposition mask packaging body and the vapor deposition mask packaging device according to the present invention are not limited to the above embodiments, and depart from the spirit of the present invention. Various changes are possible within the scope of the invention.

In the present embodiment described above, an example has been described in which the receiving portion 61 and the lid portion 62 are formed separately and bound together by the elastic belt 63. However, the invention is not limited to this, and the receiving part 61 and the lid part 62 are connected via a hinge part (not shown), and the receiving part 61 and the lid part 62 can be bent via the hinge part. It may be. Due to the elastic force of the elastic belt 63, the receiving portion 61 and the lid portion 62 can be pressed against each other, and the vapor deposition mask 20 can be held.

Furthermore, in the present embodiment described above, an example has been described in which the vapor deposition mask stack 80 disposed between the receiving portion 61 and the lid portion 62 includes a plurality of vapor deposition masks 20. However, the present invention is not limited to this, and only one vapor deposition mask 20 may be disposed between the receiving portion 61 and the lid portion 62.

An environmental test and a drop test were conducted on the vapor deposition mask package 60 in which the vapor deposition mask 20 in the embodiment shown in FIGS. 27 to 32 was packed, and the condition of the vapor deposition mask 20 was confirmed.

The vapor deposition mask 20 used in the test was produced by the etching process shown in FIGS. 4 to 19. The material of this vapor deposition mask 20 was an invar material containing 36% by mass of nickel. Each vapor deposition mask 20 had a width direction dimension of 67 mm and a longitudinal direction total length of 850 mm. The thickness of the vapor deposition mask 20 was 15 μm.

In Example 1 and Comparative Examples 1 and 2 shown in FIG. 47, a vapor deposition mask package 60 having the same configuration as the embodiment shown in FIGS. 27 to 32 was used. In Comparative Examples 1 and 2, the convex portion 67 was not provided on the lid portion 62. Among these, in Comparative Example 1, the void 68 was not provided. That is, the lid part side insertion sheet 82 was brought into contact with the second opposing surface 66 of the lid part 62, so that no gap 68 was formed therebetween. In Comparative Example 2, the convex portion 67 was not provided, but the dimension of the gap 68 was set to 0.6 mm.

In Example 1, a convex portion 67 was provided on the lid portion 62. In Example 1, the dimension G (see FIG. 31) of the void 68 thus formed was set to 0.6 mm.

As shown in FIG. 47, PET film was used for the intermediate intervening sheet 81, the lid side intervening sheet 82, and the receiving section intervening sheet 83.

In both Comparative Examples 1 and 2 and Example 1, the receiving portion 61 was made of a single corrugated cardboard sheet made of polypropylene and having a thickness of 10 mm. The thickness of the receiving portion 61 was 10 mm. The lid part 62 was made from one same cardboard sheet, and the thickness of the lid part 62 was set to 10 mm.

As described above, in Example 1, the convex portion 67 was provided on the lid portion 62. The convex portion 67 was made of foamed urethane sponge, and the dimension of the convex portion 67 along the longitudinal direction D1 of the vapor deposition mask 20 was 20 mm, and the dimension along the width direction D2 was 10 mm. The thickness of the convex portion 67 was set according to the size of the gap 68 (here, 0.6 mm) formed between the lid side intercalating sheet 82 and the second opposing surface 66 of the lid portion 62. The dimension of the end opening 24 along the width direction D2 of the vapor deposition mask 20 was 10 mm. Thereby, each convex part 67 was arranged at a position overlapping with the corresponding end opening 24 of the vapor deposition mask 20 in plan view, and was arranged so as not to protrude from the corresponding end opening 24.

One receiving part side intercalating sheet 83 is placed on the first facing surface 65 of the receiving part 61, and the vapor deposition mask 20 and the intermediate intervening sheet 81 are alternately stacked on top of it to form a vapor deposition mask. A laminate 80 was produced, and a lid side intercalating sheet 82 was further stacked thereon. In Comparative Examples 1 and 2 and Example 1, nine vapor deposition masks 20 and eight intermediate sheets 81 were used. Thereafter, the lid portion 62 was placed and the elastic belt 63 was attached to obtain the vapor deposition mask package 60 according to the present embodiment. The vapor deposition mask package 60 was manufactured in a work room whose room temperature was controlled at 25°C.

The produced vapor deposition mask package 60 was housed in a temperature controllable device (not shown), and the temperature inside the device was changed. Specifically, first, the temperature inside the apparatus was set to -10°C and maintained for a predetermined period of time. Subsequently, the temperature inside the apparatus was raised to 60° C. and maintained for a predetermined period of time. Thereafter, the temperature inside the apparatus was returned to room temperature, and the vapor deposition mask package 60 was taken out from the apparatus. Then, the vapor deposition mask package 60 was unpacked in a work room whose room temperature was controlled at 25°C.

After unpacking, as an appearance inspection, it was visually confirmed (with the naked eye) whether or not wavy wrinkles were formed on each vapor deposition mask 20. The results are shown in FIG. FIG. 47 shows the number of vapor deposition masks 20 in which wrinkles were confirmed.

After visual confirmation, the vapor deposition mask 20 was packed again and a drop test was conducted. In the drop test, the vapor deposition mask package 60 was naturally dropped from a height of 60 cm from a hard floor surface. The attitude of the vapor deposition mask package 60 at this time was such that the up-down direction in FIG. 28 was the vertical direction, with the receiving part 61 being on the lower side and the lid part 62 being on the upper side. This attitude was maintained even when the vapor deposition mask package 60 landed on the floor. After being dropped, the vapor deposition mask package 60 was unpacked, and whether or not a dent was formed in the vapor deposition mask 20 was confirmed visually (with the naked eye). The results are shown in FIG. FIG. 47 shows the number of vapor deposition masks 20 in which dents were confirmed.

As shown in Comparative Example 1 in FIG. Wrinkles were confirmed on all nine vapor deposition masks 20. In this case, it is considered that the vapor deposition mask 20 was unable to thermally expand or contract smoothly, resulting in wrinkles.

In Comparative Example 2, since the convex portion 67 was not provided on the lid portion 62 and the dimension of the gap 68 was set to 0.6 mm, no wrinkles due to temperature changes were observed. This is considered to be due to the fact that the lid part-side insertion sheet 82 does not come into contact with the lid part 62 and the gap 68 is formed. However, in Comparative Example 2, dents were observed in two vapor deposition masks 20 due to the drop test. This is thought to be due to the fact that the lid-side intervening sheet 82 is not supported by the lid 62 or the like.

On the other hand, when the convex portion 67 was provided on the lid portion 62 as shown in Example 1, no dents were observed in any of the nine vapor deposition masks 20 due to the drop test. This is thought to be due to the fact that the lid-side intervening sheet 82 is supported by the lid 62 via the convex portion 67.

Further, according to Example 1, no wrinkles due to temperature changes were observed in all nine vapor deposition masks 20. This is considered to be due to the gap 68 being provided around the convex portion 67. In Example 1, the dimension G of the void 68 was 0.6 mm. Therefore, when there is a gap size G of 0.6 mm or more, it is possible to effectively suppress the occurrence of plastic deformation in the vapor deposition mask 20 even when a temperature rise of 60° C. is assumed. This was confirmed.

In this example, the vapor deposition mask 20 produced by etching is used, but it is believed that at least similar results can be obtained with the vapor deposition mask 20 produced by plating. That is, as described above, the metal plate 21 produced as a rolled material is used as the vapor deposition mask 20 for the etching process, but the crystals of the vapor deposition mask 20 produced by the plating process are smaller than the crystals of the metal plate 21. The finer the details. As a result, the hardness and yield strength of the vapor deposition mask 20 for plating treatment are greater than those of the metal plate 21. Therefore, even when using the vapor deposition mask 20 made by plating, results equivalent to or better than those of this example can be obtained, and plastic deformation of the vapor deposition mask 20 during transportation can be suppressed. Think of it as possible.

Claims (1)

a first base;
a second base opposite to the first base;
a vapor deposition mask disposed between the first base and the second base and having a plurality of through holes formed therein;
spacers arranged on both sides of the vapor deposition mask in the width direction;
a first sheet disposed between the vapor deposition mask and the second base;
The second base has a convex portion disposed at at least one of both ends in the longitudinal direction of the vapor deposition mask in a plan view,
The convex portion presses the first sheet,
A vapor deposition mask package, wherein a gap is formed between the first sheet and the second base around the convex portion.