CN118004596A

CN118004596A - Vapor deposition mask package and vapor deposition mask packaging method

Info

Publication number: CN118004596A
Application number: CN202311448327.0A
Authority: CN
Inventors: 射场将文; 岩仓康哲; 深谷胜美
Original assignee: Dai Nippon Printing Co Ltd
Current assignee: Dai Nippon Printing Co Ltd
Priority date: 2022-11-09
Filing date: 2023-11-02
Publication date: 2024-05-10
Also published as: JP2024069035A

Abstract

The vapor deposition mask package of the present disclosure includes a1 st base portion and a2 nd base portion. The 1 st base portion includes a1 st base sheet and a1 st spacer. The 1 st base sheet is joined to the 1 st opposing surface. The 1 st spacer is located outside the 1 st base sheet in plan view, and is joined to the 1 st facing surface. The 1 st spacer protrudes from the 1 st base sheet to the 2 nd facing surface and abuts against the 2 nd facing surface. The 2 nd base comprises a2 nd base sheet. The 2 nd base sheet is joined to the 2 nd opposite surface. When the vapor deposition mask is located between the 1 st foundation plate and the 2 nd foundation plate, the 1 st gap is located between the vapor deposition mask and the 1 st spacer in plan view.

Description

Vapor deposition mask package and vapor deposition mask packaging method

Technical Field

The present disclosure relates to vapor deposition mask packages and vapor deposition mask packaging methods.

Background

In electronic devices such as smartphones and tablet PCs, a high-definition display device is demanded in the market. The display device has a pixel density of, for example, 400ppi or more or 800ppi or more.

As such a display device, an organic EL display device having good responsiveness and/or high contrast is attracting attention. As a method of forming a pixel of an organic EL display device, a method of depositing a material constituting the pixel on a substrate is known. In this case, first, a vapor deposition mask device including a vapor deposition mask including through holes and a frame for supporting the vapor deposition mask is prepared. Next, in the vapor deposition apparatus, a vapor deposition material such as an organic material or an inorganic material is vapor deposited in a state where the vapor deposition mask is closely attached to the substrate. Thus, the vapor deposition material adheres to the substrate to form a vapor deposition layer. The vapor deposition layer forms a display region of the organic EL display device.

The vapor deposition mask is packaged during shipping. For example, a package having a receiving portion and a lid portion is known. The vapor deposition mask is sandwiched between the receiving portion and the lid portion. However, depending on the package structure, the vapor deposition mask may be plastically deformed.

Patent document 1: japanese patent No. 6904502

Patent document 2: international publication No. 2018-061757

Disclosure of Invention

An object of an embodiment of the present disclosure is to provide a vapor deposition mask package and a vapor deposition mask packaging method capable of suppressing plastic deformation of a vapor deposition mask.

The vapor deposition mask package of the present disclosure is a package in which a vapor deposition mask having a plurality of through holes is packaged. The vapor deposition mask package is provided with: a 1 st base portion including a 1 st facing surface and a 1 st base portion structure located on the 1 st facing surface; and a 2 nd base portion including a 2 nd facing surface facing the 1 st facing surface, and a 2 nd base structure located on the 2 nd facing surface. The 1 st base structure includes a 1 st base sheet and a 1 st spacer. The 1 st base sheet is joined to the 1 st facing surface, extends in the 1 st direction, and overlaps the vapor deposition mask in a plan view. The 1 st spacer is located outside the 1 st base sheet in plan view, and is joined to the 1 st facing surface. The 1 st spacer protrudes from the 1 st base sheet to the 2 nd facing surface and abuts against the 2 nd facing surface. The 2 nd base structure includes a 2 nd base sheet. The 2 nd base sheet is joined to the 2 nd facing surface, extends in the 1 st direction, and overlaps the vapor deposition mask in a plan view. When the vapor deposition mask is located between the 1 st foundation plate and the 2 nd foundation plate, the 1 st gap is located between the vapor deposition mask and the 1 st spacer in plan view.

The vapor deposition mask packaging method of the present disclosure is a method of packaging a vapor deposition mask in which a plurality of through holes are formed. The vapor deposition mask packaging method includes a preparation step, a placement step, and a clamping step. In the preparation process, a1 st base is prepared, and a 2 nd base is prepared. The 1 st base portion includes a1 st facing surface and a1 st base portion structure located on the 1 st facing surface. The 1 st base structure includes a1 st base sheet and a1 st spacer. The 1 st base sheet is joined to the 1 st opposing surface and extends in the 1 st direction. The 1 st spacer is located outside the 1 st base sheet in plan view, and is joined to the 1 st facing surface. The 1 st spacer protrudes from the 1 st base sheet. The 2 nd base includes a 2 nd facing surface and a 2 nd base structure located on the 2 nd facing surface. The 2 nd base structure includes a 2 nd base sheet. The 2 nd base sheet is joined to the 2 nd opposite surface and extends in the 1 st direction. In the placement step, the vapor deposition mask is placed so as to overlap the 1 st base sheet in a plan view. In the sandwiching step, the 2 nd base sheet is placed on the 1 st base via the vapor deposition mask so as to overlap the vapor deposition mask in a plan view. In the clamping step, the vapor deposition mask is clamped by the 1 st base and the 2 nd base. The 1 st spacer protrudes from the 1 st base sheet to the 2 nd facing surface and abuts against the 2 nd facing surface. The 1 st gap is located between the vapor deposition mask and the 1 st spacer in plan view.

According to the present disclosure, plastic deformation of the vapor deposition mask can be suppressed.

Drawings

Fig. 1 is a diagram showing a vapor deposition device according to an embodiment of the present disclosure.

Fig. 2 is a perspective view showing a vapor deposition mask package according to an embodiment of the present disclosure.

Fig. 3 is an exploded perspective view of the vapor deposition mask package shown in fig. 2.

Fig. 4 is a side view showing the socket shown in fig. 3.

Fig. 5 is a side view illustrating the cover part shown in fig. 3.

Fig. 6 is a partial cross-sectional view of the vapor deposition mask package taken along line A-A of fig. 2.

Fig. 7 is a plan view showing the vapor deposition mask placed on the 1 st base sheet.

Fig. 8 is a perspective view showing a preparation process of the vapor deposition mask packaging method according to an embodiment of the present disclosure.

Fig. 9 is a perspective view showing a mounting process of the vapor deposition mask packaging method according to one embodiment of the present disclosure.

Fig. 10 is a perspective view showing a mounting process continued from fig. 9.

Fig. 11 is a cross-sectional view showing a clamping process of the vapor deposition mask packaging method according to an embodiment of the present disclosure.

Fig. 12 is a cross-sectional view showing a modification of the vapor deposition mask laminate shown in fig. 6.

Fig. 13 is a cross-sectional view showing a modification of the vapor deposition mask package shown in fig. 6.

Fig. 14 is a perspective view showing a modification of the vapor deposition mask package shown in fig. 3.

Fig. 15 is a perspective view showing another modification of the vapor deposition mask package shown in fig. 3.

Detailed Description

In the present specification and the present drawings, unless otherwise specified, terms such as "substrate", "base material", "plate", "sheet", "film" and the like, which represent materials that form the basis of a certain structure, are not merely distinguished from each other by differences in terms of designation.

In the present specification and the present drawings, unless otherwise specified, terms such as "parallel", "orthogonal", and the like, values of length and angle, and the like, which specify the conditions of shape and geometry, and the degrees of these, are not limited to strict meanings, but are interpreted to include a range of degrees where the same functions can be expected.

In the present specification and the present drawings, unless otherwise specified, the following are included: a case where a certain structure such as a certain component or a certain region is located "on" or "under", "upper" or "lower" or "above" or "below" of another structure such as another component or another region; a situation where a structure is in direct contact with other structures. Further, a case where another structure is included between a certain structure and another structure, that is, a case where the structures are indirectly connected to each other, is also included. Unless otherwise specified, the terms "upper", or "lower", "lower" and "lower" may be reversed in the vertical direction.

In the present specification and the present drawings, the same reference numerals or similar reference numerals are given to the same parts or parts having the same functions unless otherwise specified, and repeated description thereof may be omitted. For convenience of explanation, the dimensional ratio in the drawings may be different from the actual ratio, and a part of the structure may be omitted from the drawings.

In the present specification and the present drawings, unless otherwise specified, the present invention may be combined with other embodiments and modifications insofar as no contradiction arises. The other embodiments, other embodiments and modifications may be combined within a range where no contradiction occurs. The modifications may be combined within a range where no contradiction occurs.

In the present specification and the present drawings, when a plurality of steps are disclosed in relation to a method such as a manufacturing method, other steps not disclosed may be performed between the disclosed steps unless otherwise specified. The order of the disclosed steps is arbitrary within a range where no contradiction occurs.

In the present specification and the present drawings, unless otherwise specified, numerical ranges expressed by such symbols as "to" include numerical values placed before and after such symbols as "to". For example, the numerical range defined by the expression "34 to 38 mass%" is the same as the numerical range defined by the expression "34 mass% or more and 38 mass% or less".

In one embodiment of the present specification, the following vapor deposition mask and a method for producing the same will be described by way of example: they are used in order to pattern an organic material on a substrate in a desired pattern when manufacturing an organic EL display device. However, the present embodiment is not limited to such an application, and can be applied to vapor deposition masks used for various purposes. For example, the mask of the present embodiment may be used to manufacture the following device: the device is used for displaying or projecting images or videos for representing virtual reality (so-called VR) or augmented reality (so-called AR).

In accordance with embodiment 1 of the present disclosure, there is provided a vapor deposition mask package for packaging a vapor deposition mask having a plurality of through holes formed therein,

The vapor deposition mask package includes:

a1 st base portion including a1 st facing surface and a1 st base portion structure located on the 1 st facing surface; and

A2 nd base portion including a2 nd facing surface facing the 1 st facing surface, and a2 nd base structure located on the 2 nd facing surface,

The 1 st base structure includes:

A1 st base sheet joined to the 1 st facing surface, extending in the 1 st direction, and overlapping the vapor deposition mask in a plan view; and

A1 st spacer which is located outside the 1 st base sheet in a plan view and is joined to the 1 st facing surface, the 1 st spacer protruding from the 1 st base sheet toward the 2 nd facing surface and being in contact with the 2 nd facing surface,

The 2 nd base structure includes a 2 nd base sheet joined to the 2 nd facing surface, extending in the 1 st direction, and overlapping the vapor deposition mask in a plan view,

When the vapor deposition mask is located between the 1 st base sheet and the 2 nd base sheet, a1 st gap is located between the vapor deposition mask and the 1 st spacer in a plan view.

In accordance with claim 2 of the present disclosure, in the vapor deposition mask package according to claim 1,

The 1 st base sheet has a long side direction along the 1 st direction,

The 1 st spacer includes 1 st convex portions located on both sides of the 1 st base sheet in a direction orthogonal to the 1 st direction,

When the vapor deposition mask is located between the 1 st base sheet and the 2 nd base sheet, the 1 st gap is located between the vapor deposition mask and the 1 st convex portion in a plan view.

In accordance with claim 3 of the present disclosure, in the vapor deposition mask package according to claim 2,

A2 nd gap is located between the 1 st projection and the 2 nd base sheet in plan view.

In accordance with claim 4 of the present disclosure, in the vapor deposition mask package according to claim 2 or claim 3,

The 2 nd base structure includes a2 nd arm piece joined to the 2 nd facing surface and extending from the 2 nd base piece to both sides in a direction orthogonal to the 1 st direction,

A plurality of arm pieces 2 are respectively positioned at two sides of the base piece 2,

The 2 nd abutment surface against which the 1 st convex portion abuts is located between two of the 2 nd arm pieces adjacent to each other in the 1 st direction.

In accordance with a5 th aspect of the present disclosure, in the vapor deposition mask package according to the 4 th aspect,

In a plan view, a 3 rd gap is located between the 1 st convex portion and the 2 nd arm piece adjacent to each other.

In a 6 th aspect of the present disclosure, in the vapor deposition mask package according to the 1 st aspect to the 5 th aspect,

The 1 st spacer includes 2 nd protrusions located on both sides of the 1 st base sheet in the 1 st direction,

When the vapor deposition mask is located between the 1 st base sheet and the 2 nd base sheet, the 1 st gap is located between the vapor deposition mask and the 2 nd convex portion.

In a 7 th aspect of the present disclosure, in the vapor deposition mask package according to the 6 th aspect,

A4 th gap is located between the 2 nd protrusion and the 2 nd base sheet in a plan view.

In an 8 th aspect of the present disclosure, in the vapor deposition mask package according to the 1 st aspect to the 7 th aspect,

The 2 nd base structure includes a2 nd spacer that is located outside the 2 nd base sheet in plan view and is joined to the 2 nd facing surface, the 2 nd spacer protruding from the 2 nd base sheet toward the 1 st facing surface and being in contact with the 1 st facing surface,

When the vapor deposition mask is located between the 1 st base sheet and the 2 nd base sheet, a 5 th gap is located between the vapor deposition mask and the 2 nd spacer in a plan view.

In accordance with a 9 th aspect of the present disclosure, in the vapor deposition mask package according to the 8 th aspect,

The 2 nd base sheet has a long side direction along the 1 st direction,

The 2 nd spacer includes 3 rd protrusions located on both sides of the 2 nd base sheet in a direction orthogonal to the 1 st direction,

In the case where the vapor deposition mask is located between the 1 st base sheet and the 2 nd base sheet, the 5 th gap is located between the vapor deposition mask and the 3 rd convex portion.

In a 10 th aspect of the present disclosure, in the vapor deposition mask package according to the 9 th aspect,

A6 th gap is located between the 3 rd projection and the 1 st base sheet in a plan view.

In an 11 th aspect of the present disclosure, in the vapor deposition mask package according to the 9 th or 10 th aspect,

The 1 st base structure includes a1 st arm piece joined to the 1 st facing surface and extending from the 1 st base piece to both sides in a direction orthogonal to the 1 st direction,

A plurality of arm pieces 1 are respectively positioned at two sides of the base piece 1,

The 1 st abutment surface against which the 3 rd projection abuts is located between two 1 st arm pieces adjacent to each other in the 1 st direction.

In a 12 th aspect of the present disclosure, in the vapor deposition mask package according to the 11 th aspect,

In a plan view, a 7 th gap is located between the 3 rd protruding portion and the 1 st arm piece adjacent to each other.

In a 13 th aspect of the present disclosure, in the vapor deposition mask package according to the 8 th aspect to the 12 th aspect,

The 2 nd spacer includes 4 th protrusions on both sides of the 2 nd base sheet in the 1 st direction,

In the case where the vapor deposition mask is located between the 1 st base sheet and the 2 nd base sheet, the 5 th gap is located between the vapor deposition mask and the 4 th convex portion.

In a 14 th aspect of the present disclosure, in the vapor deposition mask package according to the 13 th aspect,

An 8 th gap is located between the 4 th protrusion and the 1 st base sheet in a plan view.

In accordance with claim 15 of the present disclosure, in the vapor deposition mask package according to claim 1,

The 1 st base sheet has a long side direction along the 1 st direction,

A plurality of 1 st convex parts are respectively positioned at two sides of the 1 st base plate,

The 2 nd base structure includes a 2 nd spacer, the 2 nd spacer being located outside the 2 nd base sheet in plan view, protruding from the 2 nd base sheet toward the 1 st facing surface, and abutting the 1 st facing surface,

The 2 nd base sheet has a long side direction along the 1 st direction,

A plurality of 3 rd protruding parts are respectively positioned at two sides of the 2 nd base sheet,

In the 1 st direction, the 1 st convex portions and the 3 rd convex portions are alternately arranged.

In a 16 th aspect of the present disclosure, in the vapor deposition mask package according to each of the 1 st to 15 th aspects,

The vapor deposition mask package includes a vapor deposition mask located between the 1 st base sheet and the 2 nd base sheet.

In a 17 th aspect of the present disclosure, in the vapor deposition mask package according to the 16 th aspect,

The vapor deposition mask package includes a plurality of spacers located between the 1 st base sheet and the vapor deposition mask and between the vapor deposition mask and the 2 nd base sheet.

In an 18 th aspect of the present disclosure, in the vapor deposition mask package according to any one of the 1 st aspect to the 17 th aspect,

The 1 st base includes a plurality of the 1 st base structures adjacent to each other in a direction orthogonal to the 1 st direction,

The 2 nd base comprises a plurality of the 2 nd base structures,

The 2 nd base sheet of the 2 nd base structure overlaps the 1 st base sheet of the corresponding 1 st base structure in a plan view.

In a 19 th aspect of the present disclosure, in the vapor deposition mask package according to the 18 th aspect,

The two 1 st base structures adjacent to each other in a direction orthogonal to the 1 st direction include a 3 rd base structure and a 4 th base structure,

The portion of the 1 st spacer of the 3 rd base structure that faces the 1 st base sheet of the 4 th base structure and the portion of the 1 st spacer of the 4 th base structure that faces the 1 st base sheet of the 3 rd base structure are integrated.

In a 20 th aspect of the present disclosure, in the vapor deposition mask package according to the 18 th aspect or the 19 th aspect,

The two 2 nd base structures adjacent to each other in a direction orthogonal to the 1 st direction include a 5 th base structure and a 6 th base structure,

The portion of the 2 nd spacer of the 5 th base structure that faces the 2 nd base sheet of the 6 th base structure and the portion of the 2 nd spacer of the 6 th base structure that faces the 2 nd base sheet of the 5 th base structure are integrated.

A 21 st aspect of the present disclosure is a vapor deposition mask packaging method of packaging a vapor deposition mask having a plurality of through holes formed therein,

The vapor deposition mask packaging method comprises the steps of:

A preparation step of preparing a1 st base portion and preparing a2 nd base portion, wherein the 1 st base portion includes a1 st facing surface and a1 st base portion structure located on the 1 st facing surface, and the 2 nd base portion includes a2 nd facing surface and a2 nd base portion structure located on the 2 nd facing surface;

A mounting step; and

A clamping process, wherein in the clamping process,

The 1 st base structure includes: a1 st base sheet joined to the 1 st facing surface and extending in the 1 st direction; and a1 st spacer protruding from the 1 st base sheet, located outside the 1 st base sheet in plan view, and joined to the 1 st facing surface,

The 2 nd base structure comprises a 2 nd base sheet joined to the 2 nd opposing face and extending in the 1 st direction,

In the mounting step, the vapor deposition mask is mounted so as to overlap the 1 st base sheet in a plan view,

In the sandwiching step, the 2 nd base portion is placed on the 1 st base portion through the vapor deposition mask so as to overlap the 2 nd base sheet with the vapor deposition mask in a plan view, and the vapor deposition mask is sandwiched between the 1 st base portion and the 2 nd base portion,

The 1 st spacer protrudes from the 1 st base sheet toward the 2 nd facing surface and abuts against the 2 nd facing surface,

A1 st gap is located between the vapor deposition mask and the 1 st spacer in a plan view.

An embodiment of the present disclosure is described in detail below with reference to the accompanying drawings. The embodiments described below are examples of embodiments of the present disclosure, and the present disclosure is not limited to these embodiments.

As shown in fig. 1, the vapor deposition device 80 may include a vapor deposition source (e.g., a crucible 81), a heater 83, and a vapor deposition mask device 10. The vapor deposition device 80 may include an exhaust mechanism (not shown) for creating a vacuum atmosphere inside the vapor deposition device 80. The crucible 81 is provided inside the vapor deposition device 80, and is configured to house a vapor deposition material 90 such as an organic light-emitting material. The heater 83 is configured to heat the crucible 81. By heating the crucible 81 under a vacuum atmosphere, the vapor deposition material 90 is evaporated.

The vapor deposition mask device 10 may include a frame 15 and a vapor deposition mask 20 fixed to the frame 15. The frame 15 may include a frame opening 16. The frame opening 16 overlaps an effective region 23 of the vapor deposition mask 20 in which a through hole 25 described later is formed in a plan view. The vapor deposition mask 20 may be fixedly supported by the frame 15 in a stretched state. In this case, deflection of the vapor deposition mask 20 can be suppressed. A plurality of vapor deposition masks 20 may be fixed to the frame 15. The term "planar view" refers to a term viewed in the thickness direction of the vapor deposition mask 20, and for example, refers to a term viewed in the vertical direction in fig. 1.

The vapor deposition mask device 10 is located in the vapor deposition device 80 so as to face the crucible 81. The vapor deposition mask device 10 may be located above the crucible 81. The substrate 91 may be positioned to face the vapor deposition mask 20 of the vapor deposition mask device 10. The substrate 91 is an object to which the vapor deposition material 90 is attached. The substrate 91 may be positioned above the vapor deposition mask 20.

As shown in fig. 1, the vapor deposition device 80 may include a magnet 85 disposed above a substrate 91. By providing the magnet 85, the vapor deposition mask 20 is attracted to the direction in which the magnet 85 is located by a magnetic force, and the vapor deposition mask 20 can be made to adhere to the substrate 91. A cooling plate 84 for cooling the substrate 91 during vapor deposition may be interposed between the substrate 91 and the magnet 85.

When the vapor deposition material 90 is vapor deposited on the substrate 91, the vapor deposition material flying from the crucible 81 adheres to the substrate 91 through the frame opening 16 and the through holes 25. Accordingly, the vapor deposition material 90 is attached to the substrate 91 in a pattern corresponding to the pattern of the through holes 25.

Next, the vapor deposition mask 20 will be described. The vapor deposition mask 20 may be manufactured by an etching process or a plating process.

As shown in fig. 2 and 3, the vapor deposition mask 20 may be rectangular so as to have a 1 st direction D1, which is a longitudinal direction, and a 2 nd direction D2 orthogonal to the 1 st direction D1. The vapor deposition mask 20 may include longitudinal end portions 21 located at both end portions in the 1 st direction D1. The vapor deposition mask 20 may include at least 1 active area 23. The effective area 23 may be located between the 2 long-side direction end portions 21. As shown in fig. 3, the vapor deposition mask 20 may include 1 active region 23. However, the vapor deposition mask 20 may include a plurality of active regions 23. The plurality of effective regions 23 may be arranged in the 1 st direction D1 or in the 2 nd direction D2. The plurality of effective regions 23 may be arranged in the 1 st direction D1 and the 2 nd direction D2.

The end opening 24 may be located at each longitudinal end 21 of the vapor deposition mask 20. The end opening 24 may be located on both sides of the effective region 23 in the 1 st direction D1. The end opening 24 may penetrate the vapor deposition mask 20 in the thickness direction. In the present embodiment, the end opening 24 has a U-shaped outline in a shape cut out from the corresponding end edge of the vapor deposition mask 20 in a plan view. The end opening 24 may be located at the center in the 2 nd direction D2. The vapor deposition mask 20 is stretched by holding both sides of the end opening 24 in the 2 nd direction D2 by jigs (not shown) of a stretching tool. In this case, a tensile force is applied from each jig, and the positions of the through holes 25 of the vapor deposition mask 20 can be easily adjusted.

The 1 effective area 23 may correspond to 1 display area of the organic EL display device. Or 1 effective area 23 may correspond to a plurality of display areas. The effective region 23 may have a substantially rectangular outline in a plan view, for example, but may have an outline other than a rectangle.

As shown in fig. 1, the vapor deposition mask 20 may include a1 st surface 20a, a2 nd surface 20b located on the opposite side of the 1 st surface 20a, and a plurality of through holes 25. The through-hole 25 extends from the 1 st surface 20a to the 2 nd surface 20b of the vapor deposition mask, and penetrates the vapor deposition mask 20.

A through-hole group 26 (see fig. 3) composed of a plurality of through-holes 25 may be located in the effective region 23. The 1 active area 23 may be constituted by 1 through hole group 26. The effective region 23 may be a region occupied by the through-hole group 26. The through hole group 26 may overlap with the frame opening 16 of the frame 15 in a plan view. The through-hole group 26 is used as a term meaning an aggregate of a plurality of through-holes 25 arranged regularly. The through holes 25 constituting the outer edge of the 1 through hole group 26 are outermost through holes 25 among the plurality of through holes 25 which are also regularly arranged. Outside the outer edge through holes 25 in the 1 through hole group 26, there may be no through holes 25 that are arranged uniformly and intended to pass the vapor deposition material 90. As an example of the regular arrangement, for example, the through holes 25 may be arranged in parallel. The through-hole group 26 may have a substantially rectangular outline in a plan view, similarly to the effective region 23.

The vapor deposition mask 20 has a thickness T1 (see fig. 6) from the 1 st surface 20a to the 2 nd surface 20 b. The thickness T1 may be, for example, 2 μm or more, 5 μm or more, 10 μm or more, or 15 μm or more. By setting the thickness T1 to 2 μm or more, the mechanical strength of the vapor deposition mask 20 can be ensured. The thickness T1 may be, for example, 20 μm or less, 30 μm or less, 40 μm or less, or 50 μm or less. By setting the thickness T1 to 50 μm or less, occurrence of masking can be suppressed. The masking is a phenomenon in which the vapor deposition material 90 adheres to the wall surface of the through hole 25, and the accuracy of the thickness of the vapor deposition layer formed on the substrate 91 is reduced. The range of the thickness T1 can be determined by group 1 consisting of 2 μm, 5 μm, 10 μm and 15 μm and/or group 2 consisting of 20 μm, 30 μm, 40 μm and 50 μm. The range of the thickness T1 can be determined by a combination of any 1 of the values contained in the above-described 1 st group and any 1 of the values contained in the above-described 2 nd group. The range of the thickness T1 may be determined by a combination of any 2 of the values contained in the above-described group 1. The range of the thickness T1 may be determined by a combination of any 2 of the values contained in the above-described group 2. For example, the ratio may be 2 μm or more and 50 μm or less, may be 2 μm or more and 40 μm or less, may be 2 μm or more and 30 μm or less, may be 2 μm or more and 15 μm or less, may be 2 μm or more and 10 μm or less, may be 2 μm or more and 5 μm or less, may be 5 μm or more and 50 μm or less, may be 5 μm or more and 40 μm or less, may be 5 μm or more and 30 μm or less, may be 5 μm or more and 20 μm or less, may be 5 μm or more and 15 μm or less, may be 5 μm or more and 10 μm or less, may be 10 μm or more and 50 μm or less, may be 10 μm or more and 40 μm or less, may be 10 μm or more and 30 μm or less, and may be 10 μm or more and 15 μm or less. May be 20 μm or less, may be 20 μm or more and 50 μm or less, may be 20 μm or more and 40 μm or less, may be 20 μm or more and 30 μm or less, may be 30 μm or more and 50 μm or less, may be 30 μm or more and 40 μm or less, and may be 40 μm or more and 50 μm or less.

The vapor deposition mask 20 may be made of, for example, a nickel-containing iron alloy. The iron alloy may contain cobalt in addition to nickel. For example, as a material of the vapor deposition mask 20, an iron alloy in which the total content of nickel and cobalt is 30 mass% or more and 54 mass% or less and the content of cobalt is 0 mass% or more and 6 mass% or less can be used. Specific examples of the nickel-containing ferroalloy include invar alloy materials containing 34 to 38 mass% of nickel, low-thermal expansion fe—ni-based plating alloys containing 38 to 54 mass% of nickel, and the like. Specific examples of the iron alloy containing nickel and cobalt include a super invar material containing cobalt in addition to nickel in an amount of 30 mass% to 34 mass%. By using such an iron alloy, the thermal expansion coefficient of the vapor deposition mask 20 can be reduced. For example, when a glass substrate is used as the substrate 91, the thermal expansion coefficient of the vapor deposition mask 20 can be set to a value equivalent to that of the glass substrate. In this way, in the vapor deposition step, it is possible to suppress a decrease in the shape accuracy and the positional accuracy of the light-emitting layer formed on the substrate 91 due to a difference in the thermal expansion coefficients between the vapor deposition mask 20 and the substrate 91.

As a material constituting the vapor deposition mask 20, in the case where the thermal expansion coefficient is not set to a value equal to that of the glass substrate, the material may be made of, for example, elemental nickel or a nickel alloy containing cobalt instead of the iron alloy described above. In the case of a nickel alloy containing cobalt, a nickel alloy having a cobalt content of 8 mass% or more and 10 mass% or less can be used as a material of the vapor deposition mask 20. When the vapor deposition mask 20 is manufactured by plating treatment, the use of nickel or a nickel alloy as described above stabilizes the plating solution used to deposit the plating film forming the vapor deposition mask 20. Therefore, the management of the plating process can be facilitated, and the handling property can be improved. In addition, the plating film can be made uniform in composition, and the quality of the vapor deposition mask 20 can be improved.

Next, a vapor deposition mask package 30 for packaging the vapor deposition mask 20 will be described. The vapor deposition mask package 30 is configured to package the vapor deposition mask 20 having the through-hole group 26 in which the plurality of through-holes 25 are formed.

As shown in fig. 2 and 3, the vapor deposition mask package 30 may include a receiving portion 40, a lid portion 50, and a vapor deposition mask laminate 60. The vapor deposition mask stack 60 may be located between the receiving portion 40 and the lid portion 50. The vapor deposition mask stack 60 may include the vapor deposition mask 20 described above. As shown in fig. 2, the lid 50 may be positioned above the receiving portion 40 in a state where the vapor deposition mask 20 is packed.

The receiver 40 and cover 50 may also be strapped by an elastic strap 70. In the example shown in fig. 2, the receiving portion 40 and the cover portion 50 are bound by two elastic bands 70, but the number of elastic bands 70 is arbitrary as long as the receiving portion 40 and the cover portion 50 can be restrained from being displaced.

The receiving portion 40 is an example of the 1 st base portion. As shown in fig. 3 and 4, the receiving portion 40 may include a receiving portion main body 41, a1 st opposing surface 42, and a receiving portion structure 40a. The receiving portion 40 of the present embodiment includes one receiving portion structure 40a.

The receiving unit body 41 may be rectangular so as to extend in the 1 st direction D1 and the 2 nd direction D2. The bay body 41 may also be formed from 1 or more corrugated sheets. For example, the land body 41 may be formed of one corrugated paper sheet having a honeycomb structure. In this case, the corrugated paper sheet contains 2 liner sheets, and a center core having a planar cross section of a honeycomb structure interposed between the liner sheets. The central core comprises a plurality of holes in the shape of a honeycomb extending in the normal direction of the corrugated sheet. Alternatively, for example, the receiving unit body 41 may be formed by stacking 2 corrugated paper sheets. Each corrugated sheet comprised 2 liner panels, and a central core with a wave-shaped cross section between the liner panels. In the case of overlapping a plurality of corrugated sheets, the corrugated sheets may be overlapped in such a manner that the directions in which the ridges or valleys of the wave shapes of the central cores of the corrugated sheets adjacent to each other extend are orthogonal. In this case, the mechanical strength of the receiving portion body 41 can be improved. The corrugated paper sheet is not particularly limited, and may be made of plastic. The material of the corrugated paper sheet may have a coefficient of thermal expansion greater than that of the material of the vapor deposition mask 20. For example, the corrugated sheet material may be polypropylene, polystyrene, polycarbonate, vinyl chloride, polyacetal. In order to suppress the generation of static electricity, the corrugated paper sheet may also be subjected to antistatic coating. For example, antistatic layers may be formed on both sides of the corrugated paper sheet. Or an antistatic agent may be added to the corrugated paper sheet.

The 1 st facing surface 42 may be a surface facing the cover 50 in the receiving unit body 41. The 1 st opposing surface 42 may be formed flat. Alternatively, the 1 st opposing surface 42 may be formed with small irregularities or the like, or may not be formed flat as long as the 1 st base sheet 43 described later can be fixed flat.

The receiving unit structure 40a is an example of the 1 st base structure. The receiving unit structure 40a may be located on the 1 st facing surface 42. The receiving unit structure 40a may include a1 st base piece 43, a1 st arm piece 44, and a1 st spacer 46.

The 1 st base sheet 43 may be located on the 1 st facing surface 42. The 1 st base sheet 43 may extend in the 1 st direction D1. The 1 st base sheet 43 may have a longitudinal direction along the 1 st direction D1. The 1 st base sheet 43 may be rectangular in plan view so as to extend along the 1 st direction D1 and the 2 nd direction D2. The vapor deposition mask 20 may overlap the 1 st base sheet 43 in plan view. The 1 st base sheet 43 may be joined to the 1 st facing surface 42. For example, the 1 st base sheet 43 may be fixed to the 1 st facing surface 42 by an adhesive.

The 1 st arm piece 44 may be located on the 1 st facing surface 42. The 1 st arm piece 44 may extend from the 1 st base piece 43 to both sides in the 2 nd direction D2 orthogonal to the 1 st direction D1. The 1 st arm piece 44 may be located on both sides of the 1 st base piece 43. More specifically, the 1 st arm piece 44 may be located on one side of the 1 st base piece 43 in the 2 nd direction D2. The plurality of 1 st arm pieces 44 located on one side of the 1 st base piece 43 may be separated in the 1 st direction D1. In the 2 nd direction D2, the 1 st arm piece 44 may be located on the other side of the 1 st base piece 43. The plurality of 1 st arm pieces 44 located on the other side of the 1 st base piece 43 may also be separated in the 1 st direction D1. The 1 st arm piece 44 may be rectangular in plan view so as to extend along the 1 st direction D1 and the 2 nd direction D2. The 1 st arm piece 44 may be joined to the 1 st facing surface 42. For example, the 1 st arm piece 44 may be fixed to the 1 st facing surface 42 by an adhesive.

The 1 st opposing surface 42 may include a plurality of 1 st contact surfaces 45. The 1 st contact surface 45 may be located between two 1 st arm pieces 44 adjacent to each other in the 1 st direction D1. The 1 st contact surface 45 may be located on both sides of a2 nd convex portion 48 described later in the 2 nd direction D2. The 1 st contact surface 45 may be a surface against which the 3 rd projection 57 or the 4 th projection 58 of the 2 nd spacer 56 described later is brought into contact. The 1 st contact surface 45 may be a portion of the 1 st facing surface 42 exposed from the 1 st base piece 43 and the 1 st arm piece 44.

As shown in fig. 6, the thickness T3 of the 1 st base sheet 43 may be thicker than the thickness T4 of the 1 st arm sheet 44. The 1 st base sheet 43 may be formed of one resin sheet RS, or may be formed by overlapping a plurality of resin sheets RS. The 1 st arm piece 44 may be formed of one resin piece RS, or may be formed by overlapping a plurality of resin pieces RS. The resin sheet RS constituting the 1 st arm sheet 44 may be the same resin sheet RS as the resin sheet RS constituting the 1 st base sheet 43. In the present embodiment, as shown in fig. 6, the 1 st base sheet 43 is composed of two resin sheets RS, and the 1 st arm sheet 44 is composed of one resin sheet RS. In the case where the 1 st base sheet 43 and the 1 st arm sheet 44 are formed of the same resin sheet RS, the 1 st base sheet 43 may be formed of 1 st resin sheet RS in the same manner as the 1 st arm sheet 44. The material of the resin sheet RS may have a larger coefficient of thermal expansion than the material of the vapor deposition mask 20. For example, the material of the resin sheet RS may be polypropylene, polystyrene, polycarbonate, vinyl chloride, or polyacetal. In order to suppress the generation of static electricity, the resin sheet RS may be coated with static electricity. For example, antistatic layers may be formed on both surfaces of the resin sheet RS. Alternatively, an antistatic agent may be added to the resin sheet RS. The cross section at the position where the arm pieces 44, 54 exist is shown on the left side of fig. 6, and the cross section at the position where the 1 st convex portion 47 and the 3 rd convex portion 57 exist is shown on the right side of fig. 6.

As shown in fig. 3, the 1 st spacer 46 may be located outside the 1 st base sheet 43 in a plan view, or may be joined to the 1 st facing surface 42. The 1 st spacer 46 may protrude from the 1 st base sheet 43 toward a2 nd facing surface 52 described later and may contact the 2 nd facing surface 52.

The 1 st spacer 46 may also include a1 st convex portion 47 and a 2 nd convex portion 48. The 1 st spacer 46 may also include a plurality of 1 st convex portions 47 and a plurality of 2 nd convex portions 48. The 1 st convex portion 47 and the 2 nd convex portion 48 may be located outside the 1 st base sheet 43 in a plan view. The 1 st convex portion 47 and the 2 nd convex portion 48 may be joined to the 1 st facing surface 42. For example, the 1 st convex portion 47 and the 2 nd convex portion 48 may be fixed to the 1 st facing surface 42 by an adhesive. The thermal expansion coefficient of the material of the 1 st convex portion 47 and the 2 nd convex portion 48 may be larger than the thermal expansion coefficient of the material of the vapor deposition mask 20. For example, the material of the 1 st projection 47 and the 2 nd projection 48 may be polypropylene, polystyrene, polycarbonate, vinyl chloride, polyacetal, ABS resin, polyethylene, or ethylene-vinyl acetate copolymer. To suppress the generation of static electricity, the convex portions 47 and 48 may be coated with antistatic coating. For example, an antistatic layer may be formed on the entire surfaces of the protrusions 47 and 48. Alternatively, an antistatic agent may be added to the convex portions 47 and 48.

The 1 st protruding portion 47 may be located on both sides of the 1 st base sheet 43 in the 2 nd direction D2 orthogonal to the 1 st direction D1. The 1 st protruding portions 47 may be located on both sides of the 1 st base sheet 43. More specifically, the 1 st protruding portion 47 may be located on the 1 st base sheet 43 side in the 2 nd direction D2. The plurality of 1 st protruding portions 47 located on one side of the 1 st base sheet 43 may be separated in the 1 st direction D1. The 1 st projection 47 may be located between two 1 st arm pieces 44 adjacent to each other in the 1 st direction D1. In the 2 nd direction D2, the 1 st convex portions 47 may be located on the other side of the 1 st base sheet 43. The plurality of 1 st protruding portions 47 located on the other side of the 1 st base sheet 43 may be separated in the 2 nd direction D2. The 1 st projection 47 may be located between two 1 st arm pieces 44 adjacent to each other in the 1 st direction D1. The 1 st convex portions 47 on both sides of the 1 st base sheet 43 may be aligned in the 2 nd direction D2. The 1 st protruding portion 47 may be opposed to the 1 st base sheet 43 in a plan view.

As shown in fig. 3 and 4, the 2 nd convex portion 48 may be located on both sides of the 1 st base sheet 43 in the 1 st direction D1. The 2 nd protrusion 48 may also be located at the center of the 1 st base sheet 43 in the 2 nd direction D2. The 2 nd projection 48 may be opposed to the 1 st base sheet 43 in a plan view.

The 1 st convex portion 47 and the 2 nd convex portion 48 protrude toward the 2 nd facing surface 52 from the 1 st base sheet 43. The 1 st convex portion 47 and the 2 nd convex portion 48 are in contact with a 2 nd contact surface 55 described later. The thickness T5 of the 1 st protruding portion 47 is thicker than the thickness T3 of the 1 st base sheet 43. The thickness of the 2 nd convex portion 48 may be equal to the thickness T5 of the 1 st convex portion 47.

The lid 50 is an example of the 2 nd base. As shown in fig. 3 and 5, the lid 50 may include a lid body 51, a 2 nd facing surface 52, and a lid structure 50a. The 2 nd facing surface 52 may face the 1 st facing surface 42 of the receiving unit 40. The lid 50 of the present embodiment includes one lid structure 50a.

The lid body 51 may be rectangular along the 1 st and 2 nd directions D1 and D2. The cover main body 51 may be formed of one or more corrugated paper sheets as in the receiving portion 40.

The 2 nd facing surface 52 may be a surface facing the receiving unit 40 in the cover main body 51. The 2 nd facing surface 52 may be formed flat. Alternatively, the 2 nd facing surface 52 may be formed with small irregularities or the like, or may not be formed flat as long as the 2 nd base sheet 53 to be described later can be fixed flat.

The lid structure 50a is an example of the 2 nd base structure. The lid structure 50a may be located on the 2 nd facing surface 52. The lid structure 50a may include a2 nd base piece 53, a2 nd arm piece 54, and a2 nd spacer 56. The lid structure 50a may overlap the receiving structure 40a in a plan view.

The 2 nd base sheet 53 may be located on the 2 nd opposite surface 52. The 2 nd base sheet 53 may extend in the 1 st direction D1. The 2 nd base sheet 53 may have a longitudinal direction along the 2 nd direction D2. The 2 nd base sheet 53 may be rectangular in plan view along the 1 st direction D1 and the 2 nd direction D2. The vapor deposition mask 20 may overlap the 2 nd base sheet 53 in plan view. The 2 nd base sheet 53 may overlap the 1 st base sheet 43 in plan view. The 2 nd base sheet 53 may cover the vapor deposition mask 20 and may not contact the vapor deposition mask 20 or the vapor deposition mask laminate 60 described later. The 2 nd base sheet 53 may also be joined to the 2 nd opposing surface 52. For example, the 2 nd base sheet 53 may be fixed to the 2 nd facing surface 52 by an adhesive.

The 2 nd arm piece 54 may be located on the 2 nd facing surface 52. The 2 nd arm piece 54 may extend from the 2 nd base piece 53 to both sides in the 2 nd direction D2 orthogonal to the 1 st direction D1. The plurality of 2 nd arm pieces 54 may be located on both sides of the 2 nd base piece 53. More specifically, the plurality of 2 nd arm pieces 54 may be located on one side of the 2 nd base piece 53 in the 2 nd direction D2. The plurality of 2 nd arm pieces 54 located on one side of the 2 nd base piece 53 may be separated in the 1 st direction D1. The plurality of 2 nd arm pieces 54 may be located on the other side of the 2 nd base piece 53 in the 2 nd direction D2. The plurality of 2 nd arm pieces 54 located on the other side of the 2 nd base piece 53 may also be separated in the 1 st direction D1. The 2 nd arm piece 54 may be rectangular in plan view so as to extend along the 1 st direction D1 and the 2 nd direction D2. The 2 nd arm piece 54 may be joined to the 2 nd facing surface 52. For example, the 2 nd arm piece 54 may be fixed to the 2 nd facing surface 52 by an adhesive.

The 2 nd opposing surface 52 may include a plurality of 2 nd contact surfaces 55. The 2 nd abutment surface 55 may be located between two 2 nd arm pieces 54 adjacent to each other in the 1 st direction D1. The 2 nd contact surface 55 may be located between two 4 th convex portions 58, which will be described later, adjacent to each other in the 2 nd direction D2. The 2 nd contact surface 55 may be a surface against which the 1 st convex portion 47 or the 2 nd convex portion 48 of the 1 st spacer 46 described above is in contact. The 2 nd contact surface 55 may be a portion of the 2 nd facing surface 52 exposed from the 2 nd base piece 53 and the 2 nd arm piece 54.

As shown in fig. 6, the thickness T6 of the 2 nd base sheet 53 may be thicker than the thickness T7 of the 2 nd arm sheet 54. The 2 nd base sheet 53 may be formed of one resin sheet RS or may be formed by overlapping a plurality of resin sheets RS. The 2 nd arm piece 54 may be formed of one resin piece RS, or may be formed by overlapping a plurality of resin pieces RS. The resin sheet RS constituting the 2 nd arm sheet 54 may be the same resin sheet RS as the resin sheet RS constituting the 2 nd base sheet 53. In the present embodiment, as shown in fig. 6, the 2 nd base sheet 53 is composed of two resin sheets RS, and the 2 nd arm sheet 54 is composed of one resin sheet RS. In the case where the 2 nd base sheet 53 and the 2 nd arm sheet 54 are composed of the same resin sheet RS, the 2 nd base sheet 53 may be composed of 1 resin sheet RS in the same manner as the 2 nd arm sheet 54. The resin sheet RS constituting the 2 nd base sheet 53 and the 2 nd arm sheet 54 may be the same as the resin sheet RS constituting the 1 st base sheet 43 and the 1 st arm sheet 44.

As shown in fig. 3, the 2 nd spacer 56 may be located outside the 2 nd base sheet 53 in a plan view, or may be joined to the 2 nd facing surface 52. The 2 nd spacer 56 may protrude toward the 1 st facing surface 42 above the 2 nd base piece 53 and may abut against the 1 st facing surface 42.

The 2 nd spacer 56 may also include a 3 rd protrusion 57 and a 4 th protrusion 58. The 2 nd spacer 56 may include a plurality of 3 rd protrusions 57 and a plurality of 4 th protrusions 58. The 3 rd protruding portion 57 and the 4 th protruding portion 58 may be located outside the 2 nd base sheet 53 in a plan view. The 3 rd projection 57 and the 4 th projection 58 may be joined to the 1 st facing surface 42. For example, the 3 rd protruding portion 57 and the 4 th protruding portion 58 may be fixed to the 1 st facing surface 42 by an adhesive. The material of the 3 rd projection 57 and the 4 th projection 58 may be the same as that of the 1 st projection 47 and the 2 nd projection 48 described above.

The 3 rd protruding portion 57 may be located on both sides of the 2 nd base piece 53 in the 2 nd direction D2 orthogonal to the 1 st direction D1. The 3 rd protrusions 57 may be located on both sides of the 2 nd base sheet 53. More specifically, the 3 rd protruding portions 57 may be located on one side of the 2 nd base sheet 53 in the 2 nd direction D2. The 3 rd protrusions 57 located on one side of the 2 nd base sheet 53 may be separated in the 1 st direction D1. The 3 rd projection 57 may be located between two 2 nd arm pieces 54 adjacent to each other in the 1 st direction D1. The 3 rd protruding portions 57 may be located on the other side of the 2 nd base plate 53 in the 2 nd direction D2. The plurality of 3 rd protrusions 57 located at the other side of the 2 nd base sheet 53 may also be separated in the 2 nd direction D2. The 3 rd projection 57 may be located between two 2 nd arm pieces 54 adjacent to each other in the 1 st direction D1. The 3 rd protrusions 57 located on both sides of the 2 nd base sheet 53 may be aligned in the 2 nd direction D2. The 3 rd projection 57 may be opposed to the 2 nd base sheet 53 in a plan view.

As shown in fig. 3 and 5, the 4 th convex portion 58 may be located on both sides of the 2 nd base sheet 53 in the 1 st direction D1. The 4 th convex portion 58 may be located on both sides of the 2 nd base sheet 53 in the 2 nd direction D2. The 4 th convex portion 58 may be opposed to the 2 nd arm portion 54 connected to the end portion of the 2 nd base portion 53 in the 1 st direction D1 in a plan view.

The 3 rd projection 57 and the 4 th projection 58 protrude toward the 1 st facing surface 42 than the 2 nd base sheet 53. The 3 rd convex portion 57 and the 4 th convex portion 58 are in contact with the 1 st contact surface 45. The thickness T8 of the 3 rd projection 57 is thicker than the thickness T6 of the 2 nd base sheet 53. The thickness of the 4 th convex portion 58 may be equal to the thickness T8 of the 3 rd convex portion 57.

In the 1 st direction D1, the 1 st convex portions 47 of the 1 st spacer 46 and the 3 rd convex portions 57 of the 2 nd spacer 56 may be alternately arranged (see fig. 7 and 11). In other words, the 3 rd protruding portion 57 is located between two 1 st protruding portions 47 adjacent to each other in the 1 st direction D1. The 1 st convex portion 47 is located between two 3 rd convex portions 57 adjacent to each other in the 1 st direction D1. However, the 1 st convex portion 47 and the 3 rd convex portion 57 may not be alternately arranged. For example, the 1 st convex portion 47 may be formed to extend in the 1 st direction D1 and abut against the 2 nd abutment surface 55 of the cover 50. In this case, the 3 rd protruding portion 57 may not be included in the cover 50. Alternatively, the 3 rd protruding portion 57 may be formed so as to extend in the 1 st direction D1 and may abut against the 1 st abutment surface 45 of the receiving portion 40. In this case, the receiving portion 40 may not include the 1 st protruding portion 47. Alternatively, the 3 rd protruding portion 57 may be located on the other side of the 1 st base sheet 43 instead of the 1 st protruding portion 47 being located on the one side of the 1 st base sheet 43, and the 1 st protruding portion 47 may be located on the other side of the 1 st base sheet 43 instead of the 1 st protruding portion 57 being located on the other side of the 1 st base sheet 43. In this case, the 1 st convex portion 47 and the 3 rd convex portion 57 may be formed to extend in the 1 st direction D1. One 1 st protruding portion 47 may be formed on one side of the 1 st base sheet 43, or a plurality of 1 st protruding portions 47 may be formed. On the other side of the 1 st base piece 43, 13 rd protruding portions 57 may be formed, or a plurality of 3 rd protruding portions 57 may be formed.

As shown in fig. 3, the lid 50 may include a pressing protrusion 59 located at least one of the pair of longitudinal end portions 21 of the vapor deposition mask 20 in a plan view. The pressing projection 59 may be located at the longitudinal end of the 2 nd base sheet 53. The pressing convex portion 59 may include one or more pressing convex portions 59. In the present embodiment, an example is shown in which: one pressing protrusion 59 is located at each longitudinal end 21, and the cover 50 includes two pressing protrusions 59 located at the two longitudinal ends 21. Alternatively, the plurality of pressing projections 59 may be located at one longitudinal end 21, and the plurality of pressing projections 59 may be located at the other longitudinal end 21. Alternatively, the plurality of pressing projections 59 may be located at one longitudinal end 21, and one pressing projection 59 may be located at the other longitudinal end 21. Alternatively, one or more pressing projections 59 may be located at one longitudinal end 21, but the pressing projections 59 may not be located at the other longitudinal end 21.

The pressing projection 59 may be located on the 2 nd base sheet 53. The pressing projection 59 may be joined to the 2 nd base sheet 53, or may be fixed to the 2 nd base sheet 53 by an adhesive. The pressing projection 59 may protrude toward the 1 st base piece 43. More specifically, the pressing projection 59 may be formed to protrude from the 2 nd base sheet 53.

The pressing projection 59 of the present embodiment may not overlap the through hole 25 through which the vapor deposition material 90 passes in the vapor deposition in a plan view. As shown in fig. 7, the pressing protrusion 59 may be located at a position overlapping the corresponding end opening 24 of the vapor deposition mask 20 in a plan view, or may be located at the center of the vapor deposition mask 20 in the 2 nd direction D2. Each pressing projection 59 may not protrude from the corresponding end opening 24 in a plan view. Each pressing projection 59 may be in contact with an interposer 61 described later. The pressing projection 59 may be formed separately from the 2 nd base sheet 53 and joined to the 2 nd base sheet 53 by an adhesive or the like.

The material of the pressing projection 59 is not particularly limited, and may be made of plastic, rubber, sponge, or the like. The pressing projection 59 may have a hardness lower than that of the receiving portion 40 and the cover portion 50. As a result, the pressing force of the pressing protrusion 59 to press the interposer 61 can be effectively reduced, and the force applied to the vapor deposition mask 20 from the pressing protrusion 59 can be reduced. Therefore, due to the temperature change during transportation, the receiving portion 40 and the lid portion 50 can smoothly thermally expand or contract with respect to the vapor deposition mask 20, and plastic deformation of the vapor deposition mask 20 can be suppressed. Such pressing convex portion 59 may have a hardness of, for example, C/3 or more and C/60 or less. By setting the hardness to C/3 or more, the pressing protrusion 59 can press and support the vapor deposition mask 20 via the interposer 61, and movement of the vapor deposition mask 20 in the up-down direction during transportation can be effectively suppressed. On the other hand, by setting the hardness to C/60 or less, it is possible to suppress the pressing force by the pressing convex portion 59 from becoming excessively high, and it is possible to effectively suppress plastic deformation of the vapor deposition mask 20. The hardness measurement value of the pressing projection 59 may be a value measured based on JIS K7312 using an ASKER rubber durometer type C manufactured by polymer company. The pressing projection 59 may have a 25% compression hardness of 50N or more (JIS K6400, D method). By setting the 25% compression hardness to 80N or more, the pressing force against the vapor deposition mask 20 can be appropriately maintained. When the pressing projection 59 corresponds to a molded product of a thermosetting polyurethane elastomer such as rubber, JIS K7312 can be applied to the hardness measurement of the pressing projection 59. In the case where the pressing projection 59 corresponds to a soft foam material such as a sponge, JIS K6400 may be applied.

The planar dimensions of the pressing projections 59 may be arbitrarily set according to the size of the end openings 24 of the vapor deposition mask 20. The size of the pressing projection 59 in the 1 st direction D1 of the vapor deposition mask 20 may be, for example, 5mm or more. By setting the thickness to 5mm or more, the vapor deposition mask 20 can be supported by the pressing projection 59 and the receiving portion 40. In this case, the vapor deposition mask 20 can be prevented from moving in the up-down direction during transportation, and the vapor deposition mask 20 can be prevented from moving in a plane including the 1 st direction D1 and the 2 nd direction D2.

The thickness T9 of the pressing projection 59 may be, for example, 0.1mm or more, 1mm or more, or 5mm or more. By setting the thickness T9 to 0.1mm or more, the vapor deposition mask 20 can be supported by the pressing projection 59 and the receiving portion 40, and the vapor deposition mask 20 can be prevented from moving in the up-down direction during transportation. The thickness T9 may be 20mm or less, 40mm or less, or 60mm or less, for example. By setting the thickness T9 to 60mm or less, the pressing protrusion 59 can be prevented from excessively pressing the region of the interposer 61 that overlaps the end opening 24, and the force applied to the vapor deposition mask 20 from the pressing protrusion 59 can be reduced. The range of the thickness T9 can also be determined by group 1 consisting of 0.1mm, 1mm and 5mm and/or group 2 consisting of 20mm, 40mm and 60 mm. The range of the thickness T9 can also be determined by a combination of any one of the values included in the above-described group 1 and any one of the values included in the above-described group 2. The range of the thickness T9 may also be determined by a combination of any two of the values contained in the above-described group 1. The range of the thickness T9 may also be determined by a combination of any two of the values contained in the above group 2. For example, the thickness of the sheet may be 0.1mm or more and 60mm or less, 0.1mm or more and 40mm or less, 0.1mm or more and 20mm or less, 0.1mm or more and 5mm or less, 0.1mm or more and 1mm or less, 1mm or more and 60mm or less, 1mm or more and 40mm or less, 1mm or more and 20mm or less, 1mm or more and 5mm or less, 5mm or more and 60mm or less, 5mm or more and 40mm or less, 20mm or more and 60mm or less, 20mm or more and 40mm or less, and 40mm or more and 40mm or less.

As shown in fig. 2 and 3, the receiving portion 40 and the lid portion 50 may constitute a packing box 75. The package 75 may include a hinge 76 that connects the receiving portion 40 and the lid 50. In this case, the receiving portion 40 and the cover portion 50 may be connected by a hinge portion 76, and the cover portion 50 may be rotatable with respect to the receiving portion 40. The package 75 may be bendable. The package 75 may be expandable as shown in fig. 3 or bendable as shown in fig. 2.

As shown in fig. 3, the receiving portion 40, the cover portion 50, and the hinge portion 76 may be integrally formed. A receiver side groove 77 may be formed between the receiver 40 and the hinge 76. A lid side groove 78 may be formed between the hinge portion 76 and the lid 50. Thus, the receiving portion 40 and the lid portion 50 may be rotatable relative to each other, and the packing box 75 may be bendable.

As shown in fig. 3 and 6, the vapor deposition mask stack 60 is located between the receiving portion 40 and the lid portion 50. More specifically, the vapor deposition mask stack 60 is located between the 1 st base sheet 43 and the 2 nd base sheet 53. The vapor deposition mask laminate 60 can be sandwiched between the receiving portion 40 and the lid portion 50 in a state where the vapor deposition mask 20 is packaged. In this case, the vapor deposition mask laminate 60 is pressed by the pressing protrusion 59 of the lid portion 50, and therefore, as shown in fig. 6, a space 65 is formed between the 2 nd base sheet 53 and the vapor deposition mask laminate 60.

The vapor deposition mask stack 60 may include 1 vapor deposition mask 20 and a plurality of spacers 61. The spacers 61 may be located on the 1 st surface 20a and the 2 nd surface 20b of the vapor deposition mask 20. The vapor deposition mask 20 may be positioned between 2 of the spacers 61, and the vapor deposition mask 20 may be sandwiched between the spacers 61. The 1 st surface 20a of the vapor deposition mask 20 may face the 1 st facing surface 42 of the receiving unit 40. However, the 1 st surface 20a may be opposed to the 2 nd opposed surface 52 of the cover 50.

The interposer 61 may be located between the vapor deposition mask 20 and the 1 st base sheet 43. 1 or more spacers 61 may be interposed between the vapor deposition mask 20 and the 1 st base sheet 43. For example, two or three spacers 61 may be interposed between the vapor deposition mask 20 and the 1 st base sheet 43. In the present embodiment, two spacers 61 are interposed between the vapor deposition mask 20 and the 1 st base sheet 43.

The interposer 61 may be located between the vapor deposition mask 20 and the 2 nd base sheet 53. 1 or more spacers 61 may be interposed between the vapor deposition mask 20 and the 2 nd base plate 53. In the present embodiment, two spacers 61 are interposed between the vapor deposition mask 20 and the 2 nd base plate 53.

The interposer 61 is a sheet for the following purposes: by preventing the through-holes 25 of the vapor deposition mask 20 from being caught by the 1 st base plate 43 or the 2 nd base plate 53, plastic deformation of the vapor deposition mask 20 is prevented. Therefore, both surfaces of the interposer 61 may be formed substantially flat. However, minute holes, irregularities, and the like may be formed in the interposer 61. The interposer 61 in contact with the vapor deposition mask 20 may not be fixed to the vapor deposition mask 20. The interposer 61 connected to the 1 st base sheet 43 may not be fixed to the 1 st base sheet 43. The interposer 61 connected to the 2 nd base sheet 53 may not be fixed to the 2 nd base sheet 53.

As shown in fig. 3, the interposer 61 may be rectangular when viewed in the normal direction N, so as to extend along the 1 st and 2 nd directions D1 and D2. The interposer 61 may have a longitudinal direction along the 1 st direction D1. The normal direction N may be a direction perpendicular to the 1 st facing surface 42 or a direction perpendicular to the 2 nd facing surface 52 in a state where the vapor deposition mask 20 is packaged. The normal direction N may be along the thickness direction of the vapor deposition mask 20.

The material of the interposer 61 is arbitrary. For example, the material of the interposer 61 may be a material having a small difference between the thermal expansion coefficients of the vapor deposition mask 20. For example, the interposer 61 may also be made of 42 alloy. The 42 alloy may also be an iron alloy containing 42% nickel. The interposer 61 may be made of the same material as the vapor deposition mask 20. Alternatively, the interposer 61 may be made of a material containing fibers such as paper, or may be made of, for example, an acrylic impregnated paper, as long as the adhesion to the through holes 25 of the vapor deposition mask 20 is suppressed. Alternatively, the interposer 61 may be made of a resin film such as polypropylene, PET, polyethylene, or nylon. In this case, the interposer 61 may be coated with antistatic coating to suppress the generation of static electricity. For example, antistatic layers may be formed on both surfaces of the interposer 61. Alternatively, an antistatic agent may be added to the interposer 61.

The thickness T2 of the interposer 61 shown in fig. 6 is arbitrary. For example, the thickness T2 may be 20 μm or more, 70 μm or more, or 100 μm or more, for example. By setting the thickness T2 to 20 μm or more, mechanical strength of the interposer 61 can be ensured, and the through holes 25 of the vapor deposition mask 20 can be prevented from being caught by other members. The thickness T2 may be, for example, 200 μm or less, 250 μm or less, or 300 μm or less. By setting the thickness T2 to 300 μm or less, the thickness of the vapor deposition mask laminate 60 can be suppressed. The range of the thickness T2 can be determined by group 1 consisting of 20 μm, 70 μm and 100 μm and/or group 2 consisting of 200 μm, 250 μm and 300 μm. The range of the thickness T2 may be determined by a combination of any one of the values included in the above-described group 1 and any one of the values included in the above-described group 2. The range of the thickness T2 may also be determined by a combination of any two of the values contained in the above-mentioned group 1. The range of thickness T2 may also be determined by a combination of any two of the values contained in group 2 above. For example, the particle size may be 20 μm or more and 300 μm or less, may be 20 μm or more and 250 μm or less, may be 20 μm or more and 200 μm or less, may be 20 μm or more and 100 μm or less, may be 20 μm or more and 70 μm or less, may be 70 μm or more and 300 μm or less, may be 70 μm or more and 250 μm or less, may be 70 μm or more and 200 μm or less, may be 70 μm or more and 100 μm or less, may be 100 μm or more and 300 μm or less, may be 100 μm or more and 250 μm or less, may be 100 μm or more and 200 μm or less, may be 200 μm or more and 300 μm or less, and may be 200 μm or more and 250 μm or less.

As shown in fig. 7, in the 1 st direction D1, the dimension L2 of the interposer 61 may be larger than the dimension L1 of the vapor deposition mask 20. The spacers 61 may extend outward from both sides of the vapor deposition mask 20 in the 1 st direction D1. In the 2 nd direction D2, the dimension W2 of the interposer 61 may be larger than the dimension W1 of the vapor deposition mask 20. The spacers 61 may extend outward from both sides of the vapor deposition mask 20 in the 2 nd direction D2. In this way, the entire vapor deposition mask 20 may be overlapped with the interposer 61. This can prevent the vapor deposition mask 20 from getting caught on other members, and can prevent plastic deformation from occurring.

In the 1 st direction D1, the dimension L2 of the interposer 61 may be smaller than the dimension L3 of the 1 st base sheet 43. In other words, the 1 st base sheet 43 may extend outward from both sides of the interposer 61 in the 1 st direction D1. In the 2 nd direction D2, the dimension W2 of the interposer 61 may be smaller than the dimension W3 of the 1 st base sheet 43. In other words, the 1 st base sheet 43 may extend outward from both sides of the interposer 61 in the 2 nd direction D2. In this way, the entire interposer 61 may overlap the 1 st base sheet 43 in a plan view. Similarly, the entire interposer 61 may overlap the 2 nd base sheet 53 in plan view. Alternatively, the dimension L2 of the interposer 61 may be equal to the dimension L3 of the 1 st chassis sheet 43. The dimension W2 of the interposer 61 may be equal to the dimension W3 of the 1 st base sheet 43.

Next, with reference to fig. 7, the respective gaps formed when the vapor deposition mask stack 60 including the vapor deposition mask 20 is located between the 1 st base sheet 43 and the 2 nd base sheet 53 will be described.

The 1 st gaps δ11, δ12 may be located between the vapor deposition mask 20 and the 1 st spacer 46 in plan view.

The 1 st gap δ11 may be located between the vapor deposition mask 20 and the 1 st convex portion 47. In a state where the vapor deposition mask 20 and the 1 st base sheet 43 are stacked, each 1 st convex portion 47 is in contact with the corresponding 2 nd contact surface 55, and faces the vapor deposition mask 20 in the 2 nd direction D2. Therefore, a1 st gap δ11 is formed between the vapor deposition mask 20 and each 1 st projection 47. Fig. 7 representatively shows a1 st gap δ11 between 1 st convex portion 47 and vapor deposition mask 20. The 1 st gap δ11 is a dimension along the 2 nd direction D2.

The 1 st gap δ11 may be, for example, 1mm or more, 5mm or more, or 9mm or more. By setting the 1 st gap δ11 to 1mm or more, the influence of thermal expansion or thermal contraction of the receiving portion 40 and the lid portion 50 on the vapor deposition mask 20 can be suppressed by the 1 st gap δ11. The 1 st gap δ11 may be, for example, 12mm or less, 50mm or less, or 80mm or less. By setting the 1 st gap δ11 to 80mm or less, the size of the vapor deposition mask package 30 along the 2 nd direction D2 can be reduced. The range of the 1 st gap δ11 may also be determined by the 1 st group consisting of 1mm, 5mm and 9mm and/or the 2 nd group consisting of 12mm, 50mm and 80 mm. The range of the 1 st gap δ11 may be determined by a combination of any one of the values included in the 1 st group and any one of the values included in the 2 nd group. The range of the 1 st gap δ11 may be determined by a combination of any two of the values included in the above-described 1 st group. The range of the 1 st gap δ11 may be determined by a combination of any two of the values included in the above-described group 2. For example, the length of the sheet may be 1mm or more and 80mm or less, 1mm or more and 50mm or less, 1mm or more and 12mm or less, 1mm or more and 9mm or less, 1mm or more and 5mm or less, 5mm or more and 80mm or less, 5mm or more and 50mm or less, 5mm or more and 12mm or less, 5mm or more and 9mm or less, 9mm or more and 80mm or less, 9mm or more and 50mm or less, 9mm or more and 12mm or more and 80mm or less, 12mm or more and 50mm or less, and 50mm or more and 80mm or less.

The 1 st gap δ12 may be located between the vapor deposition mask 20 and the 2 nd convex portion 48. In a state where the vapor deposition mask 20 and the 1 st base sheet 43 are stacked, each 2 nd convex portion 48 is in contact with the corresponding 2 nd contact surface 55, and faces the vapor deposition mask 20 in the 1 st direction D1. Therefore, a 1 st gap δ12 is formed between the vapor deposition mask 20 and each 2 nd convex portion 48. Fig. 7 representatively shows a 1 st gap δ12 between 12 nd convex portion 48 and vapor deposition mask 20. The 1 st gap δ12 is a dimension along the 1 st direction D1. The 1 st gap δ12 may be the same as the 1 st gap δ11 described above, or may be different.

The 2 nd gap δ2 may be located between the 1 st convex portion 47 and the 2 nd base piece 53 in plan view. In a state where the cover 50 and the receiving portion 40 are overlapped, each 1 st protruding portion 47 is in contact with the corresponding 2 nd contact surface 55, and faces the 2 nd base piece 53 in the 2 nd direction D2. Therefore, a2 nd gap δ2 is formed between each 1 st projection 47 and the 2 nd base piece 53. In fig. 7, a2 nd gap δ2 between one 1 st convex portion 47 and the 2 nd base sheet 53 is representatively illustrated. The 2 nd gap δ2 is a dimension along the 2 nd direction D2. The 2 nd gap δ2 may be smaller than the 1 st gaps δ11 and δ12.

The 1 st gap δ12 may be, for example, 1mm or more, 3mm or more, or 5mm or more. By setting the 1 st gap δ12 to 1mm or more, the influence of thermal expansion or thermal contraction of the receiving portion 40 and the lid portion 50 on the vapor deposition mask 20 can be suppressed by the 1 st gap δ12. The 1 st gap δ12 may be, for example, 10mm or less, 100mm or less, or 200mm or less. By setting the 1 st gap δ12 to 200mm or less, the size of the vapor deposition mask package 30 along the 1 st direction D1 can be reduced. The range of the 1 st gap δ12 may also be determined by the 1 st group consisting of 1mm, 3mm and 5mm and/or the 2 nd group consisting of 10mm, 100mm and 200 mm. The range of the 1 st gap δ12 may be determined by a combination of any one of the values included in the 1 st group and any one of the values included in the 2 nd group. The range of the 1 st gap δ12 may be determined by a combination of any two of the values included in the above-described 1 st group. The range of the 1 st gap δ12 may be determined by a combination of any two of the values included in the above-described group 2. For example, the length of the sheet may be 1mm or more and 200mm or less, 1mm or more and 100mm or less, 1mm or more and 5mm or less, 1mm or more and 3mm or less, 3mm or more and 200mm or less, 3mm or more and 100mm or less, 3mm or more and 10mm or less, 3mm or more and 5mm or less, 5mm or more and 200mm or less, 5mm or more and 100mm or less, 5mm or more and 10mm or more and 200mm or less, and 10mm or more and 200mm or less.

The 3 rd gap δ3 may be located between the 1 st convex portion 47 and the 2 nd arm piece 54 adjacent to each other in a plan view. In a state where the cover 50 and the receiving portion 40 are overlapped, each 1 st protruding portion 47 is in contact with the corresponding 2 nd contact surface 55, and is opposed to the corresponding 2 nd arm piece 54 in the 1 st direction D1. Therefore, a3 rd gap δ3 is formed between each 1 st protruding portion 47 and the 2 nd arm piece 54. In fig. 7, a3 rd gap δ3 between one 1 st convex portion 47 and the 2 nd arm piece 54 is representatively shown. The 3 rd gap δ3 is a dimension along the 1 st direction D1. The 3 rd gap δ3 may be equal to the 2 nd gap δ2 described above, or may be different.

The 4 th gap δ4 may be located between the 2 nd convex portion 48 and the 2 nd base piece 53 in a plan view. In a state where the cover 50 and the receiving portion 40 are overlapped, each 2 nd convex portion 48 is in contact with the corresponding 2 nd contact surface 55, and is opposed to the 2 nd base piece 53 in the 1 st direction D1. Therefore, a4 th gap δ4 is formed between each 2 nd convex portion 48 and the 2 nd base piece 53. In fig. 7, a4 th gap δ4 between one 2 nd boss 48 and a2 nd base sheet 53 is representatively illustrated. The 4 th gap δ4 is a dimension along the 1 st direction D1. The 4 th gap δ4 may be equal to the 2 nd gap δ2 described above, or may be different.

The 5 th gaps δ51 and δ52 may be located between the vapor deposition mask 20 and the 2 nd spacer 56 in plan view.

The 5 th gap δ51 may be located between the vapor deposition mask 20 and each 3 rd convex portion 57. In a state where the 2 nd base sheet 53 covers the vapor deposition mask 20, each 3 rd convex portion 57 is in contact with the corresponding 1 st contact surface 45, and faces the vapor deposition mask 20 in the 2 nd direction D2. Therefore, a5 th gap δ51 is formed between the vapor deposition mask 20 and each 3 rd projection 57. Fig. 7 representatively shows a5 th gap δ51 between 13 rd protruding portion 57 and vapor deposition mask 20. The 5 th gap δ51 is a dimension along the 2 nd direction D2. The 5 th gap δ51 may be the same as the 1 st gap δ11 described above, or may be different.

The 5 th gap δ52 may be located between the vapor deposition mask 20 and the 4 th convex portion 58. In a state where the 2 nd base sheet 53 is overlapped with the vapor deposition mask 20, each 4 th convex portion 58 is in contact with the corresponding 1 st contact surface 45, and faces the vapor deposition mask 20 in the 1 st direction D1. Therefore, a 5 th gap δ52 is formed between the vapor deposition mask 20 and each 4 th convex portion 58. Fig. 7 representatively shows a 5 th gap δ52 between 14 th convex portion 58 and vapor deposition mask 20. The 5 th gap δ52 is a dimension along the 1 st direction D1. The 5 th gap δ52 may be equal to the 1 st gap δ12 described above, or may be different. The 5 th gap δ52 may be equal to the 5 th gap δ51 described above, or may be different.

The 6 th gap δ6 may be located between the 3 rd convex portion 57 and the 1 st base plate 43 in a plan view. In a state where the cover 50 and the receiving portion 40 are overlapped, each 3 rd protruding portion 57 is in contact with the corresponding 1 st contact surface 45, and is opposed to the 1 st base piece 43 in the 2 nd direction D2. Therefore, a 6 th gap δ6 is formed between each 3 rd protruding portion 57 and the 1 st base plate 43. In fig. 7, a 6 th gap δ6 is representatively shown between one 3 rd projection 57 and the 1 st base plate 43. The 6 th gap δ6 is a dimension along the 2 nd direction D2. The 6 th gap δ6 may be equal to the 2 nd gap δ2 described above, or may be different. The 6 th gap δ6 may be smaller than the 5 th gaps δ51 and δ52.

The 7 th gap δ7 may be located between the 3 rd protruding portion 57 and the 1 st arm piece 44 adjacent to each other in a plan view. In a state where the cover 50 and the receiving portion 40 are overlapped, each 3 rd protruding portion 57 is in contact with the corresponding 1 st contact surface 45, and faces the corresponding 1 st arm piece 44 in the 1 st direction D1. Therefore, a 7 th gap δ7 is formed between each 3 rd protruding portion 57 and the 1 st arm piece 44. In fig. 7, a 7 rd gap δ7 between one 3 rd protruding portion 57 and the 1 st arm piece 44 is representatively shown. The 7 th gap δ7 is a dimension along the 1 st direction D1. The 7 th gap δ7 may be equal to the 3 rd gap δ3 described above, or may be different. The 7 th gap δ7 may be equal to the 6 th gap δ6 described above, or may be different.

The 8 th gap δ8 may be located between the 4 th convex portion 58 and the 1 st base plate 43 in plan view. In a state where the cover 50 and the receiving portion 40 are overlapped, each 4 th convex portion 58 is in contact with the corresponding 1 st contact surface 45, and faces the 1 st base piece 43 in the 1 st direction D1. Therefore, an 8 th gap δ8 is formed between each 4 th convex portion 58 and the 1 st base piece 43. In fig. 7, an 8 th gap δ8 between 14 th convex portion 58 and 1 st base sheet 43 is representatively illustrated. The 8 th gap δ8 is a dimension along the 1 st direction D1. The 8 th gap δ8 may be equal to or different from the 4 th gap δ4 described above. The 8 th gap δ8 may be equal to the 6 th gap δ6 described above, or may be different.

The vapor deposition mask package 30 may be housed in an external bag, not shown, and sealed. The desiccant may also be contained within a sealed bag. In this case, the air in the outer bag is dried, and deterioration of the vapor deposition mask 20 due to moisture can be suppressed.

Next, a vapor deposition mask packaging method according to the present embodiment will be described with reference to fig. 8 to 11. The vapor deposition mask packaging method is a method of packaging the vapor deposition mask 20. The vapor deposition mask packaging method may include a preparation step, a placement step, a clamping step, and a bundling step. Fig. 8 to 11 are perspective views similar to fig. 3.

As a preparation step, as shown in fig. 8, a package 75 including the receiving portion 40, the lid portion 50, and the hinge portion 76 may be prepared.

After the preparation step, as shown in fig. 9 and 10, the vapor deposition mask laminate 60 including the vapor deposition mask 20 may be placed so as to overlap the 1 st base sheet 43 in a plan view.

For example, first, two interposer sheets 61 are placed on the 1 st base sheet 43. The interposer 61 is placed at a desired position of the 1 st base sheet 43.

Next, as shown in fig. 9, the vapor deposition mask 20 is placed on the interposer 61. The vapor deposition mask 20 is placed at a desired position of the interposer 61. More specifically, the vapor deposition mask 20 may be placed on the interposer 61 so as to form a desired gap with respect to the 1 st convex portion 47 and the 2 nd convex portion 48. In this case, the 1 st gap δ11 is formed between the vapor deposition mask 20 and the 1 st projection 47, and the 1 st gap δ12 is formed between the vapor deposition mask 20 and the 2 nd projection 48.

Next, as shown in fig. 10, 2 spacers 61 are placed on the vapor deposition mask 20. The spacers 61 located above the vapor deposition mask 20 may be placed at the same positions as the spacers 61 located below the vapor deposition mask 20. In this way, the vapor deposition mask laminate 60 including the vapor deposition mask 20 and the interlayer sheet 61 is placed on the 1 st base sheet 43.

After the placement step, as shown in fig. 11, the vapor deposition mask 20 may be held by the receiving portion 40 and the lid portion 50 as a holding step. By bending the package case 75 via the hinge portion 76, the lid portion 50 overlaps the vapor deposition mask laminate 60. Thus, the lid 50 is placed on the receiving portion 40 through the vapor deposition mask laminate 60 so that the 2 nd base sheet 53 overlaps the vapor deposition mask 20 in a plan view. Thus, 1 vapor deposition mask stack 60 is sandwiched between the receiving unit 40 and the lid unit 50. In this case, the 2 nd facing surface 52 of the cover 50 faces the 1 st facing surface 42 of the receiving unit 40. The pressing protrusion 59 of the lid 50 presses the vapor deposition mask 20 through the interposition of the spacer 61. Thereby, a space 65 is formed between the 2 nd base sheet 53 located on the 2 nd facing surface 52 and the interposer sheet 61 located at the uppermost position of the vapor deposition mask stack 60. The 5 th gap δ51 is formed between the vapor deposition mask 20 and the 3 rd protruding portion 57, and the 5 th gap δ52 is formed between the vapor deposition mask 20 and the 4 th protruding portion 58. The 2 nd gap δ2,3 rd gap δ3, 4 th gap δ4, 6 th gap δ6, 7 th gap δ7, and 8 th gap δ8 are formed.

After the clamping step, as shown in fig. 2, the receiving portion 40 and the cover portion 50 are bound by an elastic band 70 as a binding step. Thus, the vapor deposition mask 20 was packaged, and the vapor deposition mask package 30 according to the present embodiment was obtained. The vapor deposition mask package 30 may be housed in an external pouch, not shown.

The vapor deposition mask package 30 obtained as described above is transported to a destination. During transportation, a force or impact in the vertical direction may be applied to the vapor deposition mask 20.

For example, consider a case where an upward force is applied to the vapor deposition mask 20. As described above, the vapor deposition mask 20 receives the pressing force from the pressing convex portion 59 via the interposer 61. Thus, both ends in the 1 st direction D1 of the vapor deposition mask 20 are supported by the pressing projections 59 via the spacers 61, and upward movement of the vapor deposition mask 20 is suppressed. When receiving an upward force, the effective region 23 of the vapor deposition mask 20 may also flex upward. But the vapor deposition mask 20 is supported by the spacers 61. This suppresses upward deflection of the effective region 23. Therefore, the deformation of the vapor deposition mask 20 can be limited to the elastic deformation range, and even when the vapor deposition mask 20 is subjected to an impact during transportation, the occurrence of plastic deformation can be suppressed.

On the other hand, a case is considered in which a downward force is applied to the vapor deposition mask 20 due to an impact during transportation. Each vapor deposition mask 20 is supported by a receiving portion 40 having a flat 1 st opposing surface 42 via an interposed sheet 61. This suppresses downward movement of the vapor deposition masks 20, and also suppresses downward deflection of the effective regions 23 of the vapor deposition masks 20. Therefore, plastic deformation of the vapor deposition mask 20 can be suppressed.

During transportation, the temperature of the vapor deposition mask package 30 may change due to a change in the surrounding environment. In this case, the receiving portion 40 and the lid portion 50 thermally expand or contract with respect to the vapor deposition mask 20. However, in the present embodiment, the interlayer sheet 61 is interposed between the vapor deposition mask 20 and the receiving unit 40. The vapor deposition mask 20 is not directly subjected to the force from the lid 50, but is subjected to the force from the pressing protrusion 59. When the hardness of the pressing convex portion 59 is low, the force received from the pressing convex portion 59 is reduced. Accordingly, the receiving portion 40 and the lid portion 50 can smoothly thermally expand or contract with respect to the vapor deposition mask 20. Therefore, plastic deformation of the vapor deposition mask 20 can be suppressed.

In the vapor deposition mask package 30 according to the present embodiment, the receiving portion 40 and the lid portion 50 can be thermally expanded or contracted smoothly with respect to the vapor deposition mask 20. More specifically, a1 st gap δ11 is formed between the vapor deposition mask 20 and the 1 st projection 47, and a1 st gap δ12 is formed between the vapor deposition mask 20 and the 2 nd projection 48. Accordingly, even when the receiving portion 40 and the lid portion 50 thermally expand or contract, the effect of the thermal expansion or contraction of the receiving portion 40 and the lid portion 50 on the vapor deposition mask 20 can be suppressed by the 1 st gaps δ11 and δ12. Similarly, a 5 th gap δ51 is formed between the vapor deposition mask 20 and the 3 rd protruding portion 57, and a 5 th gap δ52 is formed between the vapor deposition mask 20 and the 4 th protruding portion 58. Accordingly, even when the receiving portion 40 and the lid portion 50 thermally expand or contract, the influence of the thermal expansion or contraction of the receiving portion 40 and the lid portion 50 on the vapor deposition mask 20 can be suppressed by the 5 th gaps δ51 and δ52. Accordingly, the receiving portion 40 and the cover portion 50 can smoothly thermally expand or contract in the 1 st direction D1 and the 2 nd direction D2.

The vapor deposition mask package 30 reaching the destination may be unpacked in a reverse step to the vapor deposition mask packaging method described above. This allows the vapor deposition mask 20 to be removed. In the present embodiment, since the vapor deposition mask 20 is sandwiched by the spacers 61, the vapor deposition mask 20 can be prevented from being caught by other members when the vapor deposition mask 20 is taken out. Therefore, plastic deformation of the vapor deposition mask 20 can be suppressed, and the unpacking work efficiency of the vapor deposition mask 20 can be improved.

Thus, according to the present embodiment, the 1 st base piece 43 is engaged with the 1 st facing surface 42 of the receiving portion 40, and the 1 st spacer 46 is positioned outside the 1 st base piece 43 and engaged with the 1 st facing surface 42. The 1 st spacer 46 protrudes toward the 2 nd facing surface 52 of the cover 50 than the 1 st base sheet 43, and abuts against the 2 nd facing surface 52. The 1 st gaps δ11, δ12 are located between the vapor deposition mask 20 and the 1 st spacer 46 in a plan view. This ensures a space between the vapor deposition mask 20 and the 1 st spacer 46, and prevents the vapor deposition mask 20 from being affected by thermal expansion and thermal contraction of the receiving portion 40 and the lid portion 50 through the 1 st gaps δ11 and δ12. Therefore, even when the temperature of the vapor deposition mask package 30 changes due to a change in the surrounding environment during transportation of the vapor deposition mask package 30, the receiving portion 40 and the lid portion 50 can thermally expand and thermally contract smoothly. As a result, plastic deformation of the vapor deposition mask 20 packed in the vapor deposition mask package 30 can be suppressed.

In addition, according to the present embodiment, the 1 st spacer 46 includes 1 st protruding portions 47 located on both sides in the 2 nd direction D2 of the 1 st base sheet 43, and the 1 st gap δ11 is located between the vapor deposition mask 20 and the 1 st protruding portions 47 in a plan view. This ensures a space between the vapor deposition mask 20 and the 1 st convex portion 47, and prevents the vapor deposition mask 20 from being affected by thermal expansion and thermal contraction of the receiving portion 40 and the lid portion 50 through the 1 st gap δ11. Therefore, the receiving portion 40 and the lid portion 50 can smoothly thermally expand and contract in the 2 nd direction D2, and plastic deformation of the vapor deposition mask 20 can be suppressed.

In addition, according to the present embodiment, the 2 nd base piece 53 is joined to the 2 nd facing surface 52 of the lid 50, and the 2 nd gap δ2 is located between the 1 st convex portion 47 and the 2 nd base piece 53 in a plan view. This ensures a space between the 1 st convex portion 47 and the 2 nd base plate 53, and can suppress the influence of thermal expansion and thermal contraction of the receiving portion 40 and the lid portion 50 from affecting the vapor deposition mask 20 through the 2 nd gap δ2. Therefore, the receiving portion 40 and the lid portion 50 can smoothly thermally expand and contract in the 2 nd direction D2, and plastic deformation of the vapor deposition mask 20 can be suppressed.

Further, according to the present embodiment, the 2 nd arm piece 54 extending from the 2 nd base piece 53 to both sides in the 2 nd direction D2 is joined to the 2 nd facing surface 52 of the cover 50. The 2 nd abutment surface 55 against which the 1 st convex portion 47 abuts is located between two 2 nd arm pieces 54 adjacent to each other in the 1 st direction D1. Thus, when the lid 50 and the receiving portion 40 are overlapped, the 1 st protruding portion 47 of the receiving portion 40 can be brought into contact with the 2 nd contact surface 55 located between the 2 nd arm pieces 54. Therefore, the 1 st protruding portion 47 can be prevented from abutting the 2 nd arm portion 54, and the stability of the posture of the receiving portion 40 and the cover portion 50 can be improved. As a result, the reliability of the vapor deposition mask package 30 can be improved.

In addition, according to the present embodiment, the 3 rd gap δ3 is located between the 1 st convex portion 47 and the 2 nd arm portion piece 54 adjacent to each other in a plan view. This ensures a space between the 1 st protruding portion 47 and the 2 nd arm portion 54, and prevents the vapor deposition mask 20 from being affected by thermal expansion and thermal contraction of the receiving portion 40 and the lid portion 50 through the 3 rd gap δ3. Therefore, the receiving portion 40 and the lid portion 50 can smoothly thermally expand and contract in the 1 st direction D1, and plastic deformation of the vapor deposition mask 20 can be suppressed.

In addition, according to the present embodiment, the 1 st spacer 46 includes the 2 nd convex portions 48 located on both sides of the 1 st base sheet 43 in the 1 st direction D1, and the 1 st gap δ12 is located between the vapor deposition mask 20 and the 2 nd convex portions 48 in a plan view. This ensures a space between vapor deposition mask 20 and 2 nd convex portion 48, and prevents the influence of thermal expansion and thermal contraction of receiving portion 40 and lid portion 50 from affecting vapor deposition mask 20 through 1 st gap δ12. Therefore, the receiving portion 40 and the lid portion 50 can smoothly thermally expand and contract in the 1 st direction D1, and plastic deformation of the vapor deposition mask 20 can be suppressed.

In addition, according to the present embodiment, the 4 th gap δ4 is located between the 2 nd convex portion 48 and the 2 nd base piece 53 in a plan view. This ensures a space between the 2 nd convex portion 48 and the 2 nd base plate 53, and prevents the vapor deposition mask 20 from being affected by thermal expansion and thermal contraction of the receiving portion 40 and the lid portion 50 through the 4 th gap δ4. Therefore, the receiving portion 40 and the lid portion 50 can smoothly thermally expand and contract in the 1 st direction D1, and plastic deformation of the vapor deposition mask 20 can be suppressed.

In addition, according to the present embodiment, the 2 nd spacer 56 is located outside the 2 nd base sheet 53 and is joined to the 2 nd facing surface 52. The 2 nd spacer 56 protrudes toward the 1 st facing surface 42 of the receiving portion 40 than the 2 nd base piece 53, and abuts against the 1 st facing surface 42. The 5 th gaps δ51 and δ52 are located between the vapor deposition mask 20 and the 2 nd spacer 56 in plan view. This ensures a space between the vapor deposition mask 20 and the 2 nd spacer 56, and prevents the vapor deposition mask 20 from being affected by thermal expansion and thermal contraction of the receiving portion 40 and the lid portion 50 through the 5 th gaps δ51 and δ52. Therefore, even when the temperature of the vapor deposition mask package 30 changes due to a change in the surrounding environment during transportation of the vapor deposition mask package 30, the receiving portion 40 and the lid portion 50 can thermally expand and thermally contract smoothly. As a result, plastic deformation of the vapor deposition mask 20 packed in the vapor deposition mask package 30 can be suppressed.

In addition, according to the present embodiment, the 2 nd spacer 56 includes the 3 rd protruding portion 57 located on both sides of the 2 nd base sheet 53 in the 2 nd direction D2, and the 5 th gap δ51 is located between the vapor deposition mask 20 and the 3 rd protruding portion 57 in a plan view. This ensures a space between the vapor deposition mask 20 and the 3 rd protruding portion 57, and can suppress the influence of thermal expansion and thermal contraction of the receiving portion 40 and the lid portion 50 from affecting the vapor deposition mask 20 through the 5 th gap δ51. Therefore, the receiving portion 40 and the lid portion 50 can smoothly thermally expand and contract in the 2 nd direction D2, and plastic deformation of the vapor deposition mask 20 can be suppressed.

In addition, according to the present embodiment, the 6 th gap δ6 is located between the 3 rd protruding portion 57 and the 1 st base plate 43 in a plan view. This ensures a space between the 3 rd projection 57 and the 1 st base plate 43, and prevents the vapor deposition mask 20 from being affected by thermal expansion and thermal contraction of the receiving portion 40 and the lid portion 50 through the 6 th gap δ6. Therefore, the receiving portion 40 and the lid portion 50 can smoothly thermally expand and contract in the 2 nd direction D2, and plastic deformation of the vapor deposition mask 20 can be suppressed.

Further, according to the present embodiment, the 1 st arm piece 44 extending from the 1 st base piece 43 to both sides in the 2 nd direction D2 is joined to the 1 st facing surface 42 of the receiving unit 40. The 1 st contact surface 45 against which the 3 rd projection 57 contacts is located between the two 1 st arm pieces 44 adjacent to each other in the 1 st direction D1. Thus, when the lid 50 and the receiving portion 40 are overlapped, the 3 rd projecting portion 57 of the lid 50 can be brought into contact with the 1 st contact surface 45 located between the 1 st arm pieces 44. Therefore, the 3 rd protruding portion 57 can be prevented from abutting the 1 st arm piece 44, and the stability of the posture of the receiving portion 40 and the cover portion 50 can be improved. As a result, the reliability of the vapor deposition mask package 30 can be improved.

In addition, according to the present embodiment, the 7 th gap δ7 is located between the 3 rd protruding portion 57 and the 1 st arm piece 44 adjacent to each other in a plan view. This ensures a space between the 3 rd protruding portion 57 and the 1 st arm piece 44, and prevents the vapor deposition mask 20 from being affected by thermal expansion and thermal contraction of the receiving portion 40 and the lid portion 50 through the 7 th gap δ7. Therefore, the receiving portion 40 and the lid portion 50 can smoothly thermally expand and contract in the 1 st direction D1, and plastic deformation of the vapor deposition mask 20 can be suppressed.

In addition, according to the present embodiment, the 2 nd spacer 56 includes the 4 th convex portion 58 located on both sides of the 2 nd base sheet 53 in the 1 st direction D1, and the 5 th gap δ52 is located between the vapor deposition mask 20 and the 4 th convex portion 58 in a plan view. This ensures a space between vapor deposition mask 20 and 4 th convex portion 58, and prevents the influence of thermal expansion and thermal contraction of receiving portion 40 and lid portion 50 from affecting vapor deposition mask 20 through 5 th gap δ52. Therefore, the receiving portion 40 and the lid portion 50 can smoothly thermally expand and contract in the 1 st direction D1, and plastic deformation of the vapor deposition mask 20 can be suppressed.

In addition, according to the present embodiment, the 8 th gap δ8 is located between the 4 th convex portion 58 and the 1 st base piece 43 in a plan view. This ensures a space between the 4 th convex portion 58 and the 1 st base plate 43, and can suppress the influence of thermal expansion and thermal contraction of the receiving portion 40 and the lid portion 50 from affecting the vapor deposition mask 20 through the 8 th gap δ8. Therefore, the receiving portion 40 and the lid portion 50 can smoothly thermally expand and contract in the 1 st direction D1, and plastic deformation of the vapor deposition mask 20 can be suppressed.

In addition, according to the present embodiment, in the 1 st direction D1, the 1 st convex portions 47 and the 3 rd convex portions 57 are alternately arranged. This can improve the stability of the posture of the receiving portion 40 and the cover portion 50. Therefore, the reliability of the vapor deposition mask package 30 can be improved.

Various modifications can be applied to the above-described embodiments. The following describes modifications as needed with reference to the drawings. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above-described embodiments are used for the parts that can be configured similarly to the above-described embodiments, and overlapping descriptions are omitted. In addition, in the modification, when the operational effects obtained in the above-described embodiments can be obtained, the description thereof may be omitted.

In the present embodiment described above, an example in which the receiving portion 40 and the lid portion 50 are coupled via the hinge portion 76 is described. But is not limited thereto. For example, the receiving portion 40 and the cover portion 50 may be formed separately. In this case, the vapor deposition mask 20 may be held between the receiving portion 40 and the lid portion 50 by bundling the receiving portion 40 and the lid portion 50 with the elastic band 70.

In the present embodiment described above, an example in which the vapor deposition mask stack 60 includes 1 vapor deposition mask 20 is described. But is not limited thereto. For example, as shown in fig. 12, the vapor deposition mask stack 60 may include a plurality of vapor deposition masks 20. In this case, 1 or more spacers 61 may be interposed between 2 adjacent vapor deposition masks 20. In the example shown in fig. 12, 2 spacers 61 are interposed between 2 adjacent vapor deposition masks 20. In this way, by interposing the spacers 61 between the adjacent 2 vapor deposition masks 20, the vapor deposition masks 20 can be prevented from being caught by each other. Therefore, plastic deformation of the vapor deposition mask 20 can be suppressed. For example, in the case where two spacers 61 are interposed between two adjacent vapor deposition masks 20, the vapor deposition masks 20 can be effectively prevented from getting stuck.

In the present embodiment described above, an example is described in which the spacer 61 is located between the vapor deposition mask 20 and the 1 st base plate 43, and the spacer 61 is in contact with the 1 st base plate 43. But is not limited thereto. For example, as shown in fig. 13, the 1 st cushioning sheet 101 may be located between the interposer sheet 61 and the 1 st base sheet 43.

Buffer 1 st piece 101 may be connected to base 1 st piece 43. The 1 st buffer sheet 101 may be a sheet for suppressing plastic deformation of the vapor deposition mask 20 when the vapor deposition mask package 30 receives a force or impact in the up-down direction during transportation. The 1 st buffer sheet 101 may have flexibility to a degree capable of absorbing a force or impact applied to the vapor deposition mask 20 in a state where the vapor deposition mask 20 is packaged.

The 1 st buffer sheet 101 may have mechanical strength to such an extent that it can support the vapor deposition mask stack 60. The 1 st buffer sheet 101 may be rectangular in shape so as to extend along the 1 st direction D1 and the 2 nd direction D2 when viewed in the normal direction N. The 1 st buffer sheet 101 may have a longitudinal direction along the 1 st direction D1.

The material of the 1 st buffer sheet 101 is arbitrary. For example, the 1 st buffer sheet 101 may be formed of a PET (polyethylene terephthalate) film. PET films are relatively hard and difficult to form wrinkles. Therefore, plastic deformation of the vapor deposition mask 20 can be effectively suppressed.

The thickness T10 of the 1 st buffer sheet 101 shown in fig. 13 is arbitrary. For example, the thickness T10 may be, for example, 0.05mm or more, 0.08mm or more, or 0.10mm or more. By setting the thickness T10 to 0.05mm or more, force or impact can be absorbed, and mechanical strength can be ensured. The thickness T10 may be, for example, 0.15mm or less, 0.17mm or less, or 0.20mm or less. By setting the thickness T10 to 0.20mm or less, the thickness of the vapor deposition mask laminate 60 can be suppressed. The range of the thickness T10 can be determined by group 1 consisting of 0.05mm, 0.08mm and 0.10mm and/or group 2 consisting of 0.15mm, 0.17mm and 0.20 mm. The range of the thickness T10 may be determined by a combination of any one of the values included in the above-described group 1 and any one of the values included in the above-described group 2. The range of the thickness T10 may also be determined by a combination of any two of the values contained in the above group 1. The range of the thickness T10 may also be determined by a combination of any two of the values contained in the above group 2. For example, the thickness of the sheet may be 0.05mm or more and 0.20mm or less, 0.05mm or more and 0.17mm or less, 0.05mm or more and 0.15mm or less, 0.05mm or more and 0.10mm or less, 0.05mm or more and 0.08mm or less, 0.08mm or more and 0.20mm or less, 0.08mm or more and 0.17mm or less, 0.08mm or more and 0.15mm or less, 0.08mm or more and 0.10mm or less, 0.10mm or more and 0.20mm or less, 0.10mm or more and 0.17mm or less, 0.10mm or more and 0.15mm or less, 0.15mm or more and 0.20mm or less, 0.15mm or more and 0.17mm or less.

In order to suppress the generation of static electricity, the 1 st buffer sheet 101 may be coated with an antistatic coating. For example, antistatic layers may be formed on both surfaces of the 1 st buffer sheet 101. As an example of the 1 st cushioning sheet 101 to which the antistatic coating is applied, there is mentioned polyester synthetic paper K2323-188-690 mm sold under the trade name CRISPER (registered trademark) manufactured by Toyobo Co., ltd.

By positioning the 1 st buffer sheet 101 between the interposer sheet 61 and the 1 st base sheet 43, the force or impact applied to the vapor deposition mask 20 can be absorbed when the vapor deposition mask 20 receives the force or impact in the up-down direction.

As shown in fig. 13, the 2 nd buffer sheet 102 may be located between the interposer sheet 61 and the 2 nd base sheet 53. Buffer 2 102 may be configured in the same manner as buffer 1. In this case, by positioning the 2 nd buffer sheet 102 between the interposer sheet 61 and the 2 nd base sheet 53, the force or impact applied to the vapor deposition mask 20 can be absorbed when the vapor deposition mask 20 receives the force or impact in the up-down direction.

In the present embodiment described above, an example is described in which the receiving unit 40 includes one receiving unit structure 40a, and the cover 50 includes one cover structure 50a. But is not limited thereto. The receiving portion 40 may include a plurality of receiving portion structures 40a, and the lid 50 may include a plurality of lid structures 50a. In this case, the plurality of vapor deposition mask stacks 60 can be packed by sandwiching the plurality of vapor deposition mask stacks 60 between the receiving portion 40 and the lid portion 50.

For example, as shown in fig. 14, the receiving portion 40 may include two receiving portion structures 40a adjacent to each other in the 2 nd direction D2, and the lid portion 50 may include two lid portion structures 50a adjacent to each other in the 2 nd direction D2. In the following description, the two supporting unit structures 40a are referred to as a 1 st supporting unit structure 40b and a2 nd supporting unit structure 40c. The 1 st receiving unit structure 40b is an example of the 3 rd base structure, and the 2 nd receiving unit structure 40c is an example of the 4 th base structure. The two lid structures 50a are referred to as a 1 st lid structure 50b and a2 nd lid structure 50c. The 1 st lid structure 50b is an example of the 5 th base structure, and the 2 nd lid structure 50c is an example of the 6 th base structure.

In the example shown in fig. 14, the two receiving unit structures 40b and 40c are adjacent to each other in the 2 nd direction D2 orthogonal to the 1 st direction D1. The 2 receiving unit structures 40b and 40c are arranged in the 2 nd direction D2. The 1 st receiving unit structure 40b may be located closer to the hinge 76 than the 2 nd receiving unit structure 40 c. The 1 st spacer 46 of each receiving unit structure 40b, 40c is located outside the corresponding 1 st base piece 43.

Similarly, the two cover structures 50b and 50c are adjacent to each other in the 2 nd direction D2. The 2 lid structures 50b and 50c are arranged in the 2 nd direction D2. The 1 st lid structure 50b may be located closer to the hinge 76 than the 2 nd lid structure 50 c. The 2 nd spacer 56 of each cover structure 50b, 50c is located outside the corresponding 2 nd base piece 53.

When the cover 50 is placed on the receiving portion 40, the 2 nd base piece 53 of the cover structure 50b, 50c may overlap the 1 st base piece 43 of the corresponding receiving portion structure 40b, 40c in a plan view. Thus, according to the example shown in fig. 14, 2 vapor deposition mask stacks 60 are sandwiched between the receiving unit 40 and the lid unit 50. For example, the 2 nd base piece 53 of the 1 st lid structure 50b may overlap with the 1 st base piece 43 of the 1 st receiving structure 40b in a plan view. The 2 nd base piece 53 of the 2 nd lid structure 50c may overlap the 1 st base piece 43 of the 1 st receiving portion structure 40b in a plan view.

As shown in fig. 14, the portion of the 1 st spacer 46 of the 1 st receiver structure 40b that faces the 1 st base piece 43 of the 2 nd receiver structure 40c may be integrated with the portion of the 1 st spacer 46 of the 2 nd receiver structure 40c that faces the 1 st base piece 43 of the 1 st receiver structure 40 b. In the example shown in fig. 14, the 1 st convex portion 47 is integrated. The 1 st convex portion 47 located between two 1 st base pieces 43 adjacent to each other in the 2 nd direction D2 functions as the 1 st spacer 46 of the 1 st receiver structure 40b and functions as the 1 st spacer 46 of the 2 nd receiver structure 40 c.

Similarly, the 1 st arm piece 44 connected to the 1 st base piece 43 of the 2 nd receiver structure 40c out of the 1 st arm pieces 44 of the 1 st receiver structure 40b and the 1 st arm piece 44 connected to the 1 st base piece 43 of the 1 st receiver structure 40b out of the 1 st arm pieces 44 of the 2 nd receiver structure 40c are integrated. The 1 st arm piece 44 located between the two 1 st base pieces 43 functions as the 1 st arm piece 44 of the 1 st receiver structure 40b, and functions as the 1 st arm piece 44 of the 2 nd receiver structure 40 c.

As shown in fig. 14, the portion of the 2 nd spacer 56 of the 1 st lid structure 50b facing the 2 nd base piece 53 of the 2 nd lid structure 50c may be integrated with the portion of the 2 nd spacer 56 of the 2 nd lid structure 50c facing the 2 nd base piece 53 of the 2 nd lid structure 50 c. In the example shown in fig. 14, the 3 rd protruding portion 57 is integrated. The 3 rd protruding portion 57 located between two 2 nd base pieces 53 adjacent to each other in the 2 nd direction D2 functions as the 2 nd spacer 56 of the 1 st lid structure 50b, and functions as the 2 nd spacer 56 of the 2 nd lid structure 50 c.

Similarly, out of the 2 nd arm pieces 54 of the 1 st lid structure 50b, the 2 nd arm piece 54 connected to the 2 nd base piece 53 of the 2 nd lid structure 50c and out of the 2 nd arm pieces 54 of the 2 nd lid structure 50c, the 2 nd arm piece 54 connected to the 2 nd base piece 53 of the 1 st lid structure 50b are integrated. The 2 nd arm piece 54 located between the two 2 nd base pieces 53 functions as the 2 nd arm piece 54 of the 1 st lid structure 50b, and functions as the 2 nd arm piece 54 of the 2 nd lid structure 50 c.

According to the example shown in fig. 14, the receiving portion 40 and the lid portion 50 can sandwich 2 vapor deposition mask stacks 60. This can increase the number of vapor deposition masks 20 that can be packaged, and can improve the transportation efficiency of the vapor deposition masks 20. For example, when the vapor deposition mask package 30 to be applied to the vapor deposition mask 20 having a large size is used for packaging the vapor deposition mask 20 having a small size, a plurality of receiving unit structures 40a and a plurality of lid unit structures 50a may be formed. This can easily increase the number of vapor deposition masks 20 that can be packaged. Further, as described above, by forming the 1 st gaps δ11, δ12, etc., plastic deformation of the vapor deposition mask 20 can be suppressed.

In the example shown in fig. 14, an example is described in which the 1 st receiving portion structure 40b and the 2 nd receiving portion structure 40c are adjacent to each other in the 2 nd direction D2, and the 1 st lid structure 50b and the 2 nd lid structure 50c are adjacent to each other in the 2 nd direction D2. However, the present embodiment is not limited thereto.

For example, as shown in fig. 15, the 1 st receiving unit structure 40b and the 2 nd receiving unit structure 40c may be adjacent to each other in the 1 st direction D1, and the 1 st lid structure 50b and the 2 nd lid structure 50c may be adjacent to each other in the 1 st direction D1. In this case, the portion of the 1 st spacer 46 of the 1 st receiver structure 40b that faces the 1 st base piece 43 of the 2 nd receiver structure 40c may be integrated with the portion of the 1 st spacer 46 of the 2 nd receiver structure 40c that faces the 1 st base piece 43 of the 1 st receiver structure 40 b. For example, the 2 nd protrusion 48 may be integrated. The portion of the 2 nd spacer 56 of the 1 st lid structure 50b facing the 2 nd arm piece 54 of the 2 nd lid structure 50c may be integrated with the portion of the 2 nd spacer 56 of the 2 nd lid structure 50c facing the 2 nd arm piece 54 of the 1 st lid structure 50 b. For example, the 4 th convex portion 58 may be integrated. The planar shape of the 4 th convex portion 58 located between the 2 nd arm piece 54 of the 1 st lid structure 50b and the 2 nd arm piece 54 of the 2 nd lid structure 50c may be larger than the planar shape of the other 4 th convex portion 58 of the lid structures 50b and 50 c. For example, the size of the 4 th convex portion 58 in the 1 st direction D1 may be larger.

As shown in fig. 15, the receiving portion 40 may include 4 receiving portion structures 40a, and the lid portion 50 may include 4 lid portion structures 50a.

More specifically, among the 4 land structures 40a, 2 sets of land structures 40a adjacent to each other in the 2 nd direction D2 are included, and 2 sets of land structures 40a adjacent to each other in the 1 st direction D1 are included. In fig. 15, 1 group of the receiving unit structures 40a adjacent to each other in the 1 st direction D1 are shown as a 1 st receiving unit structure 40b and a 2 nd receiving unit structure 40c.

Of the 4 lid structures 50a, two sets of lid structures 50a adjacent to each other in the 2 nd direction D2 are included, and two sets of lid structures 50a adjacent to each other in the 1 st direction D1 are included. In fig. 15, 1 group of lid structures 50a adjacent to each other in the 1 st direction D1 are shown as a1 st lid structure 50b and a 2 nd lid structure 50c.

According to the example shown in fig. 15, the receiving portion 40 and the lid portion 50 can hold 4 vapor deposition mask stacks 60. This can further increase the number of vapor deposition masks 20 that can be packaged, and can further improve the transportation efficiency of the vapor deposition masks 20. Further, as described above, by forming the 1st gaps δ11, δ12, etc., plastic deformation of the vapor deposition mask 20 can be suppressed.

Claims

1. A vapor deposition mask package for packaging a vapor deposition mask having a plurality of through holes formed therein,

The vapor deposition mask package includes:

The 1 st base structure includes:

2. The vapor deposition mask package according to claim 1, wherein,

The 1 st base sheet has a long side direction along the 1 st direction,

3. The vapor deposition mask package according to claim 2, wherein,

4. The vapor deposition mask package according to claim 2 or 3, wherein,

5. The vapor deposition mask package according to claim 4, wherein,

6. The vapor deposition mask package according to any one of claims 1 to 3, wherein,

7. The vapor deposition mask package of claim 6, wherein,

8. The vapor deposition mask package according to any one of claims 1 to 3, wherein,

9. The vapor deposition mask package of claim 8, wherein,

The 2 nd base sheet has a long side direction along the 1 st direction,

10. The vapor deposition mask package of claim 9, wherein,

11. The vapor deposition mask package of claim 9, wherein,

12. The vapor deposition mask package of claim 11, wherein,

13. The vapor deposition mask package of claim 8, wherein,

14. The vapor deposition mask package of claim 13, wherein,

15. The vapor deposition mask package according to claim 1, wherein,

The 1 st base sheet has a long side direction along the 1 st direction,

The 2 nd base sheet has a long side direction along the 1 st direction,

16. The vapor deposition mask package according to any one of claims 1 to 3, wherein,

17. The vapor deposition mask package of claim 16, wherein,

18. The vapor deposition mask package according to claim 1, wherein,

The 2 nd base comprises a plurality of the 2 nd base structures,

19. The vapor deposition mask package of claim 18, wherein,

20. The vapor deposition mask package of claim 18, wherein,

21. A method for packaging a vapor deposition mask, which comprises packaging a vapor deposition mask having a plurality of through holes formed therein,

The vapor deposition mask packaging method comprises the steps of:

A mounting step; and

A clamping process, wherein in the clamping process,