JP2024003007A - Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a resin composition having excellent hygroscopicity and heat resistance while maintaining excellent dielectric properties; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed wiring board; and a semiconductor device.

SOLUTION: A resin composition comprises: a polymer (A) having a structural unit represented by formula (V); and a compound (B) having a molecular weight of less than 1,000 and containing, in its molecule, one organic group that contains a carbon-carbon unsaturated bond. In formula (V), Ar represents an aromatic hydrocarbon linking group. * represents a binding position.

SELECTED DRAWING: None

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a resin composition, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device.

In recent years, the integration and miniaturization of semiconductor elements used in mobile terminals, electronic equipment, communication equipment, etc. have been accelerating. Along with this, there is a need for technology that enables high-density packaging of semiconductor elements, and improvements are also needed for printed wiring boards, which play an important role.
On the other hand, the uses of electronic devices, etc. continue to diversify and expand. In response to this trend, the characteristics required of printed wiring boards, metal foil-clad laminates, prepregs, etc. used therein are becoming more diverse and demanding. Taking these required characteristics into consideration, various materials and processing methods have been proposed to obtain improved printed wiring boards. One example of this is the development and improvement of resin materials that make up prepregs and resin composite sheets.
For example, Patent Document 1 describes a novel soluble polyfunctional vinyl aromatic copolymer with improved heat resistance, compatibility, transparency, and toughness, a method for producing the same, and a curable composition containing the copolymer. is disclosed.

International Publication No. 2017/115813

As mentioned above, the uses of electronic devices and the like continue to diversify and expand, and there is a demand for new resin materials for prepregs and the like. In particular, there is a need for further material development for resin compositions that have excellent moisture absorption and heat resistance while maintaining excellent dielectric properties.
The present invention aims to solve the above problems, and provides a resin composition that maintains excellent dielectric properties and has excellent moisture absorption and heat resistance, as well as prepregs, metal foil-clad laminates, and resin composites. The purpose is to provide sheets, printed wiring boards, and semiconductor devices.

（式（Ｖ）中、Ａｒは芳香族炭化水素連結基を表す。＊は、結合位置を表す。）
＜２＞前記重合体（Ａ）の重量平均分子量が、１，０００～１６０，０００である、＜１＞に記載の樹脂組成物。
＜３＞樹脂組成物中の樹脂固形分１００質量部に対する、前記重合体（Ａ）の含有量が、５～７０質量部である、＜１＞または＜２＞に記載の樹脂組成物。
＜４＞前記炭素－炭素不飽和結合を含む有機基が、ＣＨ₂＝Ｃ（Ｘ）－（Ｘは水素原子またはメチル基である）構造を有する、＜１＞～＜３＞のいずれか１つに記載の樹脂組成物。
＜５＞前記炭素－炭素不飽和結合を含む有機基が、ビニル基、アリル基、アクリル基、および、メタクリル基からなる群より選ばれる１つである、＜１＞～＜４＞のいずれか１つに記載の樹脂組成物。
＜６＞前記化合物（Ｂ）の分子量が、７０～５００である、＜１＞～＜５＞のいずれか１つに記載の樹脂組成物。
＜７＞前記化合物（Ｂ）の沸点が、１１０～３００℃である、＜１＞～＜６＞のいずれか１つに記載の樹脂組成物。
＜８＞樹脂組成物中の樹脂固形分１００質量部に対する、前記化合物（Ｂ）の含有量が、１～１０質量部である、＜１＞～＜７＞のいずれか１つに記載の樹脂組成物。
＜９＞樹脂組成物中の前記重合体（Ａ）と前記化合物（Ｂ）の質量比率が、１：０．０２５～０．７である、＜１＞～＜８＞のいずれか１つに記載の樹脂組成物。
＜１０＞さらに、前記重合体（Ａ）および前記化合物（Ｂ）に該当しない、他の熱硬化性化合物（Ｃ）を含む、＜１＞～＜９＞のいずれか１つに記載の樹脂組成物。
＜１１＞前記他の熱硬化性化合物（Ｃ）が、マレイミド化合物、炭素－炭素不飽和二重結合を２以上含むポリフェニレンエーテル化合物、シアン酸エステル化合物、エポキシ化合物、フェノール化合物、アルケニル置換ナジイミド化合物、オキセタン樹脂、および、ベンゾオキサジン化合物からなる群より選ばれる少なくとも１種を含む、＜１０＞に記載の樹脂組成物。
＜１２＞前記他の熱硬化性化合物（Ｃ）が、式（Ｍ１）で表される化合物（Ｍ１）、式（Ｍ３）で表される化合物、式（Ｍ５）で表される化合物、および、式（ＯＰ－１）で表される化合物からなる群より選ばれる少なくとも１種を含む、＜１０＞に記載の樹脂組成物。

（式（Ｍ１）中、Ｒ^M1、Ｒ^M2、Ｒ^M3、およびＲ^M4は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M5およびＲ^M6は、それぞれ独立に、水素原子またはアルキル基を表す。Ａｒ^Mは２価の芳香族基を表す。Ａは、４～６員環の脂環基である。Ｒ^M7およびＲ^M8は、それぞれ独立に、アルキル基である。ｍｘは１または２であり、ｌｘは０または１である。Ｒ^M9およびＲ^M10は、それぞれ独立に、水素原子またはアルキル基を表す。Ｒ^M11、Ｒ^M12、Ｒ^M13、およびＲ^M14は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M15は、それぞれ独立に、炭素数１～１０のアルキル基、炭素数１～１０のアルキルオキシ基、炭素数１～１０のアルキルチオ基、炭素数６～１０のアリール基、炭素数１～１０のアリールオキシ基、炭素数１～１０のアリールチオ基、ハロゲン原子、水酸基またはメルカプト基を表す。ｐｘは０～３の整数を表す。ｎｘは１～２０の整数を表す。）

（式（Ｍ３）中、Ｒ⁵⁵は、それぞれ独立に、水素原子、炭素数１～８のアルキル基またはフェニル基を表し、ｎ₅は１以上１０以下の整数を表す。）

（式（Ｍ５）中、Ｒ⁵⁸は、それぞれ独立に、水素原子、炭素数１～８のアルキル基またはフェニル基を表し、Ｒ⁵⁹は、それぞれ独立に、水素原子またはメチル基を表し、ｎ₆は１以上の整数を表す。）

（式（ＯＰ－１）中、Ｘは芳香族基を表し、－（Ｙ－Ｏ）ｎ₂－はポリフェニレンエーテル構造を表し、Ｒ¹、Ｒ²、および、Ｒ³は、それぞれ独立して、水素原子、アルキル基、アルケニル基またはアルキニル基を表し、ｎ₁は１～６の整数を表し、ｎ₂は１～１００の整数を表し、ｎ₃は２～４の整数を表す。）
＜１３＞前記他の熱硬化性化合物（Ｃ）が、式（Ｍ１）で表される化合物（Ｍ１）、式（Ｍ３）で表される化合物、および、式（ＯＰ－１）で表される化合物からなる群より選ばれる少なくとも１種を含む、＜１０＞に記載の樹脂組成物。

（式（Ｍ１）中、Ｒ^M1、Ｒ^M2、Ｒ^M3、およびＲ^M4は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M5およびＲ^M6は、それぞれ独立に、水素原子またはアルキル基を表す。Ａｒ^Mは２価の芳香族基を表す。Ａは、４～６員環の脂環基である。Ｒ^M7およびＲ^M8は、それぞれ独立に、アルキル基である。ｍｘは１または２であり、ｌｘは０または１である。Ｒ^M9およびＲ^M10は、それぞれ独立に、水素原子またはアルキル基を表す。Ｒ^M11、Ｒ^M12、Ｒ^M13、およびＲ^M14は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M15は、それぞれ独立に、炭素数１～１０のアルキル基、炭素数１～１０のアルキルオキシ基、炭素数１～１０のアルキルチオ基、炭素数６～１０のアリール基、炭素数１～１０のアリールオキシ基、炭素数１～１０のアリールチオ基、ハロゲン原子、水酸基またはメルカプト基を表す。ｐｘは０～３の整数を表す。ｎｘは１～２０の整数を表す。）

（式（Ｍ３）中、Ｒ⁵⁵は、それぞれ独立に、水素原子、炭素数１～８のアルキル基またはフェニル基を表し、ｎ₅は１以上１０以下の整数を表す。）

（式（ＯＰ－１）中、Ｘは芳香族基を表し、－（Ｙ－Ｏ）ｎ₂－はポリフェニレンエーテル構造を表し、Ｒ¹、Ｒ²、および、Ｒ³は、それぞれ独立して、水素原子、アルキル基、アルケニル基またはアルキニル基を表し、ｎ₁は１～６の整数を表し、ｎ₂は１～１００の整数を表し、ｎ₃は２～４の整数を表す。）
＜１４＞樹脂組成物中の樹脂固形分１００質量部に対する、前記熱硬化性化合物（Ｃ）の含有量が、５～９５質量部である、＜１０＞に記載の樹脂組成物。
＜１５＞前記他の熱硬化性化合物（Ｃ）が、式（ＯＰ－１）で表される化合物からなる群より選ばれる少なくとも１種を含み、かつ、その含有量が、樹脂組成物中の樹脂固形分１００質量部に対し、３～５０質量部である、＜１０＞に記載の樹脂組成物。

（式（ＯＰ－１）中、Ｘは芳香族基を表し、－（Ｙ－О）ｎ₂－はポリフェニレンエーテル構造を表し、Ｒ¹、Ｒ²、および、Ｒ³は、それぞれ独立して、水素原子、アルキル基、アルケニル基またはアルキニル基を表し、ｎ₁は１～６の整数を表し、ｎ₂は１～１００の整数を表し、ｎ₃は２～４の整数を表す。）
＜１６＞さらに、充填材（Ｄ）を含む、＜１＞～＜１５＞のいずれか１つに記載の樹脂組成物。
＜１７＞樹脂組成物中の樹脂固形分１００質量部に対する、前記充填材（Ｄ）の含有量が、１０～５００質量部である、＜１６＞に記載の樹脂組成物。
＜１８＞樹脂組成物中の樹脂固形分１００質量部に対する、前記重合体（Ａ）の含有量が、５～７０質量部であり、前記化合物（Ｂ）の含有量が、１～１０質量部である、＜１＞～＜１７＞のいずれか１つに記載の樹脂組成物。
＜１９＞重合開始剤を実質的に含まない、＜１＞～＜１８＞のいずれか１つに記載の樹脂組成物。
＜２０＞前記重合体（Ａ）の重量平均分子量が、１，０００～１６０，０００であり、樹脂組成物中の樹脂固形分１００質量部に対する、前記重合体（Ａ）の含有量が、５～７０質量部であり、前記炭素－炭素不飽和結合を含む有機基が、ビニル基、アリル基、アクリル基、および、メタクリル基からなる群より選ばれる１つであり、前記化合物（Ｂ）の分子量が、７０～５００であり、前記化合物（Ｂ）の沸点が、１１０～３００℃であり、樹脂組成物中の樹脂固形分１００質量部に対する、前記化合物（Ｂ）の含有量が、１～１０質量部であり、樹脂組成物中の前記重合体（Ａ）と前記化合物（Ｂ）の質量比率が、１：０．０２５～０．７であり、さらに、前記重合体（Ａ）および前記化合物（Ｂ）に該当しない、他の熱硬化性化合物（Ｃ）を含み、前記他の熱硬化性化合物（Ｃ）が、マレイミド化合物、炭素－炭素不飽和二重結合を２以上含むポリフェニレンエーテル化合物、シアン酸エステル化合物、エポキシ化合物、フェノール化合物、アルケニル置換ナジイミド化合物、オキセタン樹脂、および、ベンゾオキサジン化合物からなる群より選ばれる少なくとも１種を含み、樹脂組成物中の樹脂固形分１００質量部に対する、前記熱硬化性化合物（Ｃ）の含有量が、５～９５質量部である、
＜１＞に記載の樹脂組成物。
＜２１＞前記他の熱硬化性化合物（Ｃ）が、式（ＯＰ－１）で表される化合物からなる群より選ばれる少なくとも１種を含み、かつ、その含有量が、樹脂組成物中の樹脂固形分１００質量部に対し、３～５０質量部である、＜２０＞に記載の樹脂組成物。

（式（ＯＰ－１）中、Ｘは芳香族基を表し、－（Ｙ－О）ｎ₂－はポリフェニレンエーテル構造を表し、Ｒ¹、Ｒ²、および、Ｒ³は、それぞれ独立して、水素原子、アルキル基、アルケニル基またはアルキニル基を表し、ｎ₁は１～６の整数を表し、ｎ₂は１～１００の整数を表し、ｎ₃は２～４の整数を表す。）
＜２２＞重合開始剤を実質的に含まない、＜２１＞に記載の樹脂組成物。
＜２３＞基材と、＜１＞～＜２２＞のいずれか１つに記載の樹脂組成物とから形成された、プリプレグ。
＜２４＞＜２３＞に記載のプリプレグから形成された少なくとも１つの層と、前記プリプレグから形成された層の片面または両面に配置された金属箔とを含む、金属箔張積層板。
＜２５＞支持体と、前記支持体の表面に配置された＜１＞～＜２２＞のいずれか１つに記載の樹脂組成物から形成された層とを含む、樹脂複合シート。
＜２６＞絶縁層と、前記絶縁層の表面に配置された導体層とを含むプリント配線板であって、前記絶縁層が、＜１＞～＜２２＞のいずれか１つに記載の樹脂組成物から形成された層を含む、プリント配線板。
＜２７＞＜２６＞に記載のプリント配線板を含む半導体装置。 Based on the above-mentioned problems, the present inventor conducted studies and found that a certain aromatic vinyl compound has a molecular weight of less than 1000 and contains one organic group containing a carbon-carbon unsaturated bond in the molecule. It has been found that the above problems can be solved by blending compound (B).
Specifically, the above problem was solved by the following means.
<1> A polymer (A) having a structural unit represented by formula (V),
A resin composition comprising a compound (B) having a molecular weight of less than 1000 and containing one organic group containing a carbon-carbon unsaturated bond in the molecule.

(In formula (V), Ar represents an aromatic hydrocarbon linking group. * represents the bonding position.)
<2> The resin composition according to <1>, wherein the polymer (A) has a weight average molecular weight of 1,000 to 160,000.
<3> The resin composition according to <1> or <2>, wherein the content of the polymer (A) is 5 to 70 parts by mass based on 100 parts by mass of resin solids in the resin composition.
<4> Any one of <1> to <3>, wherein the organic group containing a carbon-carbon unsaturated bond has a structure of CH ₂ =C(X)-(X is a hydrogen atom or a methyl group) The resin composition described in .
<5> Any one of <1> to <4>, wherein the organic group containing a carbon-carbon unsaturated bond is one selected from the group consisting of a vinyl group, an allyl group, an acrylic group, and a methacryl group. 1. The resin composition according to item 1.
<6> The resin composition according to any one of <1> to <5>, wherein the compound (B) has a molecular weight of 70 to 500.
<7> The resin composition according to any one of <1> to <6>, wherein the compound (B) has a boiling point of 110 to 300°C.
<8> The resin according to any one of <1> to <7>, wherein the content of the compound (B) is 1 to 10 parts by mass based on 100 parts by mass of resin solids in the resin composition. Composition.
<9> Any one of <1> to <8>, wherein the mass ratio of the polymer (A) and the compound (B) in the resin composition is 1:0.025 to 0.7. The resin composition described.
<10> The resin composition according to any one of <1> to <9>, further comprising another thermosetting compound (C) that does not correspond to the polymer (A) and the compound (B). thing.
<11> The other thermosetting compound (C) is a maleimide compound, a polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds, a cyanate ester compound, an epoxy compound, a phenol compound, an alkenyl-substituted nadimide compound, The resin composition according to <10>, containing at least one selected from the group consisting of an oxetane resin and a benzoxazine compound.
<12> The other thermosetting compound (C) is a compound represented by formula (M1), a compound represented by formula (M3), a compound represented by formula (M5), and The resin composition according to <10>, containing at least one selected from the group consisting of compounds represented by formula (OP-1).

(In formula (M1), R ^M1 , R ^M2 , R ^M3 , and R ^M4 each independently represent a hydrogen atom or an organic group. R ^M5 and R ^M6 each independently represent a hydrogen atom or an alkyl group. Ar ^M represents a divalent aromatic group. A is a 4- to 6-membered alicyclic group. R ^M7 and R ^M8 are each independently an alkyl group. mx is 1 or 2 and lx is 0 or 1. R ^M9 and R ^M10 each independently represent a hydrogen atom or an alkyl group. R ^M11 , R ^M12 , R ^M13 , and R ^M14 each independently represent a hydrogen atom or represents an organic group.R ^M15 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms. , represents an aryloxy group having 1 to 10 carbon atoms, an arylthio group having 1 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. px represents an integer of 0 to 3. nx represents an integer of 1 to 20. )

(In formula (M3), R ⁵⁵ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, and n ₅ represents an integer of 1 to 10.)

(In formula (M5), R ⁵⁸ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, R ⁵⁹ each independently represents a hydrogen atom or a methyl group, and n ₆ represents an integer greater than or equal to 1.)

(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, Represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer from 1 to 6, n ₂ represents an integer from 1 to 100, and n ₃ represents an integer from 2 to 4.)
<13> The other thermosetting compound (C) is a compound (M1) represented by formula (M1), a compound represented by formula (M3), and a compound represented by formula (OP-1) The resin composition according to <10>, containing at least one selected from the group consisting of compounds.

(In formula (M1), R ^M1 , R ^M2 , R ^M3 , and R ^M4 each independently represent a hydrogen atom or an organic group. R ^M5 and R ^M6 each independently represent a hydrogen atom or an alkyl group. Ar ^M represents a divalent aromatic group. A is a 4- to 6-membered alicyclic group. R ^M7 and R ^M8 are each independently an alkyl group. mx is 1 or 2 and lx is 0 or 1. R ^M9 and R ^M10 each independently represent a hydrogen atom or an alkyl group. R ^M11 , R ^M12 , R ^M13 , and R ^M14 each independently represent a hydrogen atom or represents an organic group.R ^M15 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms. , represents an aryloxy group having 1 to 10 carbon atoms, an arylthio group having 1 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. px represents an integer of 0 to 3. nx represents an integer of 1 to 20. )

(In formula (M3), R ⁵⁵ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, and n ₅ represents an integer of 1 to 10.)

(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, Represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer from 1 to 6, n ₂ represents an integer from 1 to 100, and n ₃ represents an integer from 2 to 4.)
<14> The resin composition according to <10>, wherein the content of the thermosetting compound (C) is 5 to 95 parts by mass based on 100 parts by mass of resin solid content in the resin composition.
<15> The other thermosetting compound (C) contains at least one selected from the group consisting of compounds represented by formula (OP-1), and the content thereof is in the resin composition. The resin composition according to <10>, wherein the amount is 3 to 50 parts by mass based on 100 parts by mass of resin solid content.

(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, Represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer from 1 to 6, n ₂ represents an integer from 1 to 100, and n ₃ represents an integer from 2 to 4.)
<16> The resin composition according to any one of <1> to <15>, further comprising a filler (D).
<17> The resin composition according to <16>, wherein the content of the filler (D) is 10 to 500 parts by mass based on 100 parts by mass of resin solids in the resin composition.
<18> The content of the polymer (A) is 5 to 70 parts by mass, and the content of the compound (B) is 1 to 10 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition. The resin composition according to any one of <1> to <17>.
<19> The resin composition according to any one of <1> to <18>, which does not substantially contain a polymerization initiator.
<20> The weight average molecular weight of the polymer (A) is 1,000 to 160,000, and the content of the polymer (A) is 5 parts by mass based on 100 parts by mass of resin solid content in the resin composition. ~70 parts by mass, the organic group containing a carbon-carbon unsaturated bond is one selected from the group consisting of a vinyl group, an allyl group, an acrylic group, and a methacryl group; The molecular weight is 70 to 500, the boiling point of the compound (B) is 110 to 300°C, and the content of the compound (B) is 1 to 100 parts by mass based on 100 parts by mass of resin solid content in the resin composition. 10 parts by mass, the mass ratio of the polymer (A) and the compound (B) in the resin composition is 1:0.025 to 0.7, and the polymer (A) and the compound (B) are A polyphenylene ether compound containing another thermosetting compound (C) that does not fall under the compound (B), where the other thermosetting compound (C) contains a maleimide compound or two or more carbon-carbon unsaturated double bonds. , a cyanate ester compound, an epoxy compound, a phenol compound, an alkenyl-substituted nadimide compound, an oxetane resin, and a benzoxazine compound, based on 100 parts by mass of the resin solid content in the resin composition. The content of the thermosetting compound (C) is 5 to 95 parts by mass,
The resin composition according to <1>.
<21> The other thermosetting compound (C) contains at least one selected from the group consisting of compounds represented by formula (OP-1), and the content thereof is within the range of the resin composition. The resin composition according to <20>, wherein the amount is 3 to 50 parts by mass based on 100 parts by mass of resin solid content.

(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, Represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer from 1 to 6, n ₂ represents an integer from 1 to 100, and n ₃ represents an integer from 2 to 4.)
<22> The resin composition according to <21>, which does not substantially contain a polymerization initiator.
<23> A prepreg formed from a base material and the resin composition according to any one of <1> to <22>.
<24> A metal foil-clad laminate comprising at least one layer formed from the prepreg according to <23> and metal foil disposed on one or both sides of the layer formed from the prepreg.
<25> A resin composite sheet comprising a support and a layer formed from the resin composition according to any one of <1> to <22> disposed on the surface of the support.
<26> A printed wiring board comprising an insulating layer and a conductor layer disposed on the surface of the insulating layer, wherein the insulating layer is made of the resin composition according to any one of <1> to <22>. A printed wiring board that includes layers formed from materials.
<27> A semiconductor device including the printed wiring board according to <26>.

The present invention makes it possible to provide a resin composition that maintains excellent dielectric properties and has excellent moisture absorption and heat resistance, as well as prepregs, metal foil-clad laminates, resin composite sheets, printed wiring boards, and semiconductor devices. Ta.

Hereinafter, a mode for carrying out the present invention (hereinafter simply referred to as "this embodiment") will be described in detail. Note that the present embodiment below is an illustration for explaining the present invention, and the present invention is not limited only to this embodiment.
In addition, in this specification, "~" is used to include the numerical values described before and after it as a lower limit value and an upper limit value.
In this specification, various physical property values and characteristic values are assumed to be at 23° C. unless otherwise stated.
In the description of a group (atomic group) in this specification, the description that does not indicate substituted or unsubstituted includes a group having a substituent (atomic group) as well as a group having no substituent (atomic group). For example, the term "alkyl group" includes not only an alkyl group without a substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). In this specification, for expressions that do not indicate substitution or non-substitution, non-substitution is preferred.
In this specification, the relative dielectric constant refers to the ratio of the dielectric constant to the vacuum dielectric constant of a substance. Further, in this specification, the relative dielectric constant may be simply referred to as "permittivity."
In this specification, "(meth)acrylic" represents both or either acrylic and methacrylic.
If the standards shown in this specification differ in measurement methods etc. depending on the year, unless otherwise stated, the standards as of January 1, 2021 shall be used.

In this specification, the resin solid content refers to components excluding the filler (D) and the solvent, and includes the polymer (A) having the structural unit represented by the formula (V) and the molecular weight of less than 1000. , and a compound (B) containing one organic group containing a carbon-carbon unsaturated bond in the molecule, and other thermosetting compounds (C) blended as necessary, an elastomer, a silane coupling agent, and The purpose is to include other resin additive components (additives such as flame retardants, etc.).

（式（Ｖ）中、Ａｒは芳香族炭化水素連結基を表す。＊は、結合位置を表す。）
このような構成とすることにより、優れた誘電特性を維持しつつ、吸湿耐熱性に優れた樹脂組成物を提供可能になる。
式（Ｖ）で表される構成単位を有する重合体（Ａ）は優れた誘電特性を有するが、吸湿耐熱性が劣る傾向にある。これは、式（Ｖ）で表される構成単位を有する重合体（Ａ）は、高分子であり、分子鎖中に多数のビニル基を有するためと推測された。すなわち、前記ビニル基は硬化時に未反応のまま残ると、吸湿耐熱性を劣化させてしまう。本実施形態では、化合物（Ｂ）を配合することにより、式（Ｖ）で表される構成単位を有する重合体（Ａ）の未反応のビニル基をキャップすることができたと推測された。この結果、得られる硬化物中の未反応ビニル基が減少し、吸湿耐熱性が大幅に改善したと推測された。また、化合物（Ｂ）は、分子量が１０００未満と小さい分子であるため、運動性・拡散性が高く、未反応のビニル基と反応する確率も高まったと推測された。
上記のようなキャップ効果は、炭素－炭素不飽和結合を含む有機基以外でも、前記重合体（Ａ）中のビニル基をキャップする官能基であれば、吸湿耐熱性を向上させると推測された。しかしながら、官能基の種類によっては、キャップした後でも極性が高い部位が残存して、硬化物の誘電特性に悪影響を与える場合も想定される。これに対し、本実施形態においては、炭素－炭素不飽和結合を含む有機基を有する化合物を用いることにより、得られる硬化物が極性を持ちにくくすることができると推測される。 The resin composition of the present embodiment includes a polymer (A) having a structural unit represented by formula (V), a molecular weight of less than 1000, and an organic group containing a carbon-carbon unsaturated bond in the molecule. (hereinafter sometimes simply referred to as "compound (B)").

(In formula (V), Ar represents an aromatic hydrocarbon linking group. * represents the bonding position.)
With such a configuration, it is possible to provide a resin composition that maintains excellent dielectric properties and has excellent moisture absorption and heat resistance.
The polymer (A) having the structural unit represented by formula (V) has excellent dielectric properties, but tends to have poor moisture absorption and heat resistance. This is presumed to be because the polymer (A) having the structural unit represented by formula (V) is a polymer and has a large number of vinyl groups in its molecular chain. That is, if the vinyl group remains unreacted during curing, the moisture absorption and heat resistance will deteriorate. In this embodiment, it was presumed that by blending the compound (B), the unreacted vinyl groups of the polymer (A) having the structural unit represented by the formula (V) could be capped. As a result, it was presumed that the number of unreacted vinyl groups in the resulting cured product was reduced, and the moisture absorption and heat resistance was significantly improved. Furthermore, since compound (B) is a small molecule with a molecular weight of less than 1000, it was assumed that it had high mobility and diffusivity, and that the probability of reacting with unreacted vinyl groups was also increased.
It was speculated that the above-mentioned capping effect would improve the hygroscopic heat resistance if the functional group caps the vinyl group in the polymer (A) other than the organic group containing a carbon-carbon unsaturated bond. . However, depending on the type of functional group, a highly polar site may remain even after capping, which may adversely affect the dielectric properties of the cured product. On the other hand, in this embodiment, by using a compound having an organic group containing a carbon-carbon unsaturated bond, it is presumed that the obtained cured product can be made less likely to have polarity.

（式（Ｖ）中、Ａｒは芳香族炭化水素連結基を表す。＊は、結合位置を表す。）
芳香族炭化水素連結基とは、置換基を有していてもよい芳香族炭化水素のみからなる基であってもよいし、置換基を有していてもよい芳香族炭化水素と他の連結基の組み合わせからなる基であってもよく、置換基を有していてもよい芳香族炭化水素のみからなる基であることが好ましい。なお、芳香族炭化水素が有していてもよい置換基は、置換基Ｚ（例えば、炭素数１～６のアルキル基、炭素数２～６のアルケニル基、炭素数２～６のアルキニル基、炭素数１～６のアルコキシ基、ヒドロキシ基、アミノ基、カルボキシ基、ハロゲン原子等）が挙げられる。また、上記芳香族炭化水素は、置換基を有さない方が好ましい。
芳香族炭化水素連結基は、通常、２価の連結基である。 <Polymer (A) having a structural unit represented by formula (V)>
The resin composition of this embodiment includes a polymer (A) having a structural unit represented by formula (V). By including the polymer (A) having the structural unit represented by formula (V), a resin composition having excellent low dielectric properties (low dielectric constant, low dielectric loss tangent) can be obtained.

(In formula (V), Ar represents an aromatic hydrocarbon linking group. * represents the bonding position.)
The aromatic hydrocarbon linking group may be a group consisting only of aromatic hydrocarbons that may have substituents, or may be a group consisting of aromatic hydrocarbons that may have substituents and other linkages. It may be a group consisting of a combination of groups, and is preferably a group consisting only of an aromatic hydrocarbon which may have a substituent. The substituent that the aromatic hydrocarbon may have is a substituent Z (for example, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an alkynyl group having 2 to 6 carbon atoms, alkoxy groups having 1 to 6 carbon atoms, hydroxy groups, amino groups, carboxy groups, halogen atoms, etc.). Further, it is preferable that the aromatic hydrocarbon has no substituent.
The aromatic hydrocarbon linking group is usually a divalent linking group.

Specific examples of the aromatic hydrocarbon linking group include a phenylene group, a naphthalenediyl group, an anthracenediyl group, a phenanthrenediyl group, a biphenyldiyl group, and a fluorenediyl group, which may have a substituent, Among these, a phenylene group which may have a substituent is preferred. The above-mentioned substituent Z is exemplified as the substituent, but it is preferable that groups such as the above-mentioned phenylene group have no substituent.

The structural unit represented by formula (V) is the structural unit represented by the following formula (V1), the structural unit represented by the following formula (V2), and the structural unit represented by the following formula (V3). More preferably, at least one is included. Note that * in the following formula represents the bonding position. Further, hereinafter, the constituent units represented by formulas (V1) to (V3) may be collectively referred to as "constituent unit (a)."

式（Ｖ１）～（Ｖ３）中、Ｌ¹は芳香族炭化水素連結基（炭素数６～２２が好ましく、６～１８がより好ましく、６～１０がさらに好ましい）である。具体的には、置換基を有していてもよい、フェニレン基、ナフタレンジイル基、アントラセンジイル基、フェナントレンジイル基、ビフェニルジイル基、フルオレンジイル基が挙げられ、中でも置換基を有していてもよいフェニレン基が好ましい。置換基は、上述の置換基Ｚが例示されるが、上述したフェニレン基等の基は置換基を有さない方が好ましい。
構成単位（ａ）を形成する化合物としては、ジビニル芳香族化合物であることが好ましく、例えば、ジビニルベンゼン、ビス（１－メチルビニル）ベンゼン、ジビニルナフタレン、ジビニルアントラセン、ジビニルビフェニル、ジビニルフェナントレンなどが挙げられる。中でもジビニルベンゼンが特に好ましい。これらのジビニル芳香族化合物は、１種を用いてもよく、必要に応じて２種以上を用いてもよい。

In formulas (V1) to (V3), L ¹ is an aromatic hydrocarbon linking group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, and even more preferably 6 to 10 carbon atoms). Specifically, examples include a phenylene group, a naphthalenediyl group, an anthracenediyl group, a phenanthrenediyl group, a biphenyldiyl group, and a fluorenediyl group, which may have a substituent. A phenylene group is preferred. The above-mentioned substituent Z is exemplified as the substituent, but it is preferable that groups such as the above-mentioned phenylene group have no substituent.
The compound forming the structural unit (a) is preferably a divinyl aromatic compound, such as divinylbenzene, bis(1-methylvinyl)benzene, divinylnaphthalene, divinylanthracene, divinylbiphenyl, divinylphenanthrene, etc. It will be done. Among them, divinylbenzene is particularly preferred. One type of these divinyl aromatic compounds may be used, or two or more types may be used as necessary.

As mentioned above, the polymer (A) having the structural unit represented by formula (V) may be a homopolymer of the structural unit (a), but it may also be a copolymer with a structural unit derived from another monomer. It may be a combination.
When the polymer (A) having the structural unit represented by formula (V) is a copolymer, the copolymerization ratio of the structural unit (a) is preferably 3 mol % or more, and 5 mol % or more. % or more, more preferably 10 mol% or more, and may be 15 mol% or more. The upper limit is preferably 90 mol% or less, more preferably 85 mol% or less, even more preferably 80 mol% or less, even more preferably 70 mol% or less, and 60 mol% or less. % or less, even more preferably 50 mol% or less, even more preferably 40 mol% or less, even more preferably 30 mol% or less, and furthermore, It may be 25 mol% or less, or 20 mol% or less.

As the structural unit derived from other monomers, the structural unit (b) derived from an aromatic compound having one vinyl group (monovinyl aromatic compound) is exemplified.

The structural unit (b) derived from a monovinyl aromatic compound is preferably a structural unit represented by the following formula (V4).

式（Ｖ４）中、Ｌ²は芳香族炭化水素連結基であり、好ましいものの具体例としては、上記Ｌ¹の例が挙げられる。
Ｒ^V1は水素原子または炭素数１～１２の炭化水素基（好ましくはアルキル基）である。Ｒ^V1が炭化水素基であるとき、その炭素数は１～６が好ましく、１～３がより好ましい。Ｒ^V1およびＬ²は上述の置換基Ｚを有していてもよい。

In formula (V4), L ² is an aromatic hydrocarbon linking group, and a preferred example is the above-mentioned example of L ¹ .
R ^V1 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms (preferably an alkyl group). When R ^V1 is a hydrocarbon group, the number of carbon atoms is preferably 1 to 6, more preferably 1 to 3. R ^V1 and L ² may have the above-mentioned substituent Z.

When the polymer (A) having the structural unit represented by formula (V) is a copolymer containing the structural unit (b) derived from a monovinyl aromatic compound, examples of the monovinyl aromatic compound include styrene. , vinyl aromatic compounds such as vinylnaphthalene, vinylbiphenyl; o-methylstyrene, m-methylstyrene, p-methylstyrene, o,p-dimethylstyrene, o-ethylvinylbenzene, m-ethylvinylbenzene, p-ethyl Examples include nuclear alkyl-substituted vinyl aromatic compounds such as vinylbenzene, methylvinylbiphenyl, and ethylvinylbiphenyl. The monovinyl aromatic compound exemplified here may have the above-mentioned substituent Z as appropriate. Further, these monovinyl aromatic compounds may be used alone or in combination of two or more.

When the polymer (A) having the structural unit represented by formula (V) is a copolymer containing the structural unit (b), the copolymerization ratio of the structural unit (b) shall be 10 mol% or more. is preferable, more preferably 15 mol% or more, furthermore 20 mol% or more, 30 mol% or more, 40 mol% or more, 50 mol% or more, 60 mol% or more, 70 mol% or more, 75 mol%. It may be more than that. The upper limit is preferably 98 mol% or less, more preferably 90 mol% or less, and even more preferably 85 mol% or less.

The polymer (A) having the structural unit represented by formula (V) may have other structural units other than the structural unit (a) and the structural unit (b). Examples of other structural units include a structural unit (c) derived from a cycloolefin compound. Examples of the cycloolefin compound include hydrocarbons having a double bond in the ring structure. Specifically, in addition to monocyclic cyclic olefins such as cyclobutene, cyclopentene, cyclohexene, and cyclooctene, compounds having a norbornene ring structure such as norbornene and dicyclopentadiene, and cycloolefin compounds condensed with aromatic rings such as indene and acenaphthylene. etc. can be mentioned. Examples of norbornene compounds include those described in paragraphs 0037 to 0043 of JP-A-2018-39995, the contents of which are incorporated herein. In addition, the cycloolefin compound illustrated here may further have the above-mentioned substituent Z.

When the polymer (A) having the structural unit represented by formula (V) is a copolymer containing the structural unit (c), the copolymerization ratio of the structural unit (c) shall be 10 mol% or more. is preferable, more preferably 20 mol% or more, and even more preferably 30 mol% or more. The upper limit is preferably 90 mol% or less, more preferably 80 mol% or less, even more preferably 70 mol% or less, may be 50 mol% or less, and may be 30 mol% or less. It may be the following.

The polymer (A) having a structural unit represented by formula (V) may further incorporate a structural unit (d) derived from a different polymerizable compound (hereinafter also referred to as other polymerizable compound). . Examples of other polymerizable compounds (monomers) include compounds containing three vinyl groups. Specific examples include 1,3,5-trivinylbenzene, 1,3,5-trivinylnaphthalene, and 1,2,4-trivinylcyclohexane. Alternatively, ethylene glycol diacrylate, butadiene, etc. may be mentioned. The copolymerization ratio of the structural unit (d) derived from another polymerizable compound is preferably 30 mol% or less, more preferably 20 mol% or less, and even more preferably 10 mol% or less. .

As one embodiment of the polymer (A) having a structural unit represented by formula (V), a polymer including the structural unit (a) as essential and at least one of the structural units (b) to (d) is Illustrated. Furthermore, an embodiment in which the total of structural units (a) to (d) accounts for 95 mol% or more, and further 98 mol% or more of the total structural units is exemplified.
Another embodiment of the polymer (A) having a structural unit represented by formula (V) is a structural unit in which the structural unit (a) is essential and among all the structural units excluding the terminal, a structural unit containing an aromatic ring. is preferably 90 mol% or more, more preferably 95 mol% or more, and may be 100 mol%.
In addition, when calculating the mol% per total structural unit, one structural unit refers to the monomer used to produce the polymer (A) having the structural unit represented by formula (V) (for example, divinyl Aromatic compounds, monovinyl aromatic compounds, etc.) shall originate from one molecule.

The method for producing the polymer (A) having the structural unit represented by formula (V) is not particularly limited and may be any conventional method. For example, a raw material containing a divinyl aromatic compound (if necessary, a monovinyl aromatic compound, cycloolefin compound, etc.) and polymerization in the presence of a Lewis acid catalyst. As the Lewis acid catalyst, a metal fluoride such as boron trifluoride or a complex thereof can be used.

The structure of the chain end of the polymer (A) having the structural unit represented by the formula (V) is not particularly limited, but when it comes to the group derived from the divinyl aromatic compound, the structure of the following formula (E1) is One example is taking. Note that L ¹ in formula (E1) is the same as defined in formula (V1) above. * represents the bonding position.
*-CH=CH-L ¹ -CH=CH ₂ (E1)

When a group derived from a monovinyl aromatic compound becomes a chain terminal, a structure of the following formula (E2) may be adopted. L ² and R ^V1 in the formula have the same meanings as defined in formula (V4) above. * represents the bonding position.
*-CH=CH-L ² -R ^V1 (E2)

The molecular weight of the polymer (A) having a structural unit represented by formula (V) is preferably 300 or more, more preferably 500 or more, and 1,000 or more in number average molecular weight Mn. More preferably, it is 1,500 or more. The upper limit is preferably 130,000 or less, more preferably 120,000 or less, even more preferably 110,000 or less, and even more preferably 100,000 or less.
The molecular weight of the polymer (A) having the structural unit represented by formula (V) is preferably 1,000 or more, more preferably 1,500 or more, in weight average molecular weight Mw, 2, 000 or more, more preferably 2,500 or more, even more preferably 3,000 or more, and may be 3,500 or more, or 4,000 or more. By setting the above lower limit value or more, the excellent low dielectric properties of the polymer (A) having the structural unit represented by the formula (V), especially the Df and the dielectric properties after moisture absorption, can be improved in the cured product of the resin composition. can be effectively demonstrated. The upper limit is preferably 160,000 or less, more preferably 150,000 or less, even more preferably 140,000 or less, even more preferably 130,000 or less, and 120,000 or less. , 110,000 or less. By setting it below the above-mentioned upper limit, when a prepreg or a resin sheet is laminated on a circuit forming board, embedding failure tends to occur less easily.
The monodispersity (Mw/Mn) expressed by the ratio of weight average molecular weight Mw to number average molecular weight Mn is preferably 100 or less, more preferably 50 or less, and even more preferably 20 or less. . As a lower limit value, it is practical to set it to 1.1 or more, and it may also be 5 or more, 7 or more, and even 10 or more will satisfy the required performance.
The above Mw and Mn are measured according to the description in the examples below.
When the resin composition of the present embodiment contains two or more kinds of polymers (A) having structural units represented by formula (V), it is preferable that Mw, Mn, and Mw/Mn of the mixture satisfy the above ranges.

The equivalent weight of vinyl groups in the polymer (A) having the structural unit represented by formula (V) is 200 g/eq. or more, preferably 230g/eq. More preferably, it is 250 g/eq. More preferably, it is 300g/eq. Above, 350g/eq. It may be more than that. Further, the equivalent weight of the vinyl group is 1200 g/eq. It is preferably less than 1000g/eq. It is more preferable that it is less than 800g/eq. Below, 600g/eq. Below, 500g/eq. Below, 400g/eq. Below, 350g/eq. It may be the following. By setting it to the above lower limit or more, the storage stability of the resin composition tends to improve, and the fluidity of the resin composition tends to improve. Therefore, moldability is improved, voids are less likely to occur during the formation of prepreg, etc., and a more reliable printed wiring board tends to be obtained. On the other hand, by setting it below the above upper limit, the heat resistance of the obtained cured product tends to improve.

Further, it is preferable that the cured product of the polymer (A) having the structural unit represented by the formula (V) used in this embodiment has excellent low dielectric properties. For example, the cured product of the polymer (A) having the structural unit represented by the formula (V) used in this embodiment has a dielectric constant (Dk) of 2.80 or less at 10 GHz measured according to the cavity resonator perturbation method. It is preferably 2.60 or less, more preferably 2.50 or less, and even more preferably 2.40 or less. Moreover, the lower limit value of the relative permittivity is practically, for example, 1.80 or more. Further, the cured product of the polymer (A) having the structural unit represented by the formula (V) used in this embodiment has a dielectric loss tangent (Df) of 0.0030 or less at 10 GHz measured according to the cavity resonator perturbation method. It is preferably at most 0.0020, more preferably at most 0.0010. Further, the lower limit value of the dielectric loss tangent is practically, for example, 0.0001 or more.
The dielectric constant (Dk) and the dielectric loss tangent (Df) are measured according to the method described in the Examples below.

In this specification, regarding the polymer (A) having a structural unit represented by formula (V), the compounds described in paragraphs 0029 to 0058 of International Publication No. 2017/115813 and their synthesis reaction conditions, etc. Compounds described in paragraphs 0013 to 0058 of JP-A-039995 and their synthesis reaction conditions, etc., compounds described in paragraphs 0008 to 0043 of JP-A-2018-168347 and their synthesis reaction conditions, etc., JP-A-2006-070136 The compounds described in paragraphs 0014 to 0042 of JP-A No. 2006-089683 and their synthesis reaction conditions, etc., the compounds described in paragraphs 0014 to 0061 of JP-A-2006-089683 and their synthesis reaction conditions, etc., paragraphs 0008 to 0008 of JP-A-2008-248001. The compounds described in No. 0036, their synthesis reaction conditions, etc. can be referred to, and are incorporated herein.

In the resin composition of the present embodiment, the content of the polymer (A) having the structural unit represented by formula (V) is 5 to 70 parts by mass when the resin solid content in the resin composition is 100 parts by mass. Preferably. The lower limit of the content of the polymer (A) having a structural unit represented by formula (V) is preferably 7 parts by mass or more when the resin solid content in the resin composition is 100 parts by mass. It is preferably 9 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 15 parts by mass or more, even more preferably 20 parts by mass or more, and even more preferably 25 parts by mass. It is particularly more preferable that the amount is more than 1 part. By setting the content of the polymer (A) having the structural unit represented by formula (V) to the above lower limit or more, low dielectric properties, particularly low dielectric constant, can be effectively achieved. On the other hand, the upper limit of the content of the polymer (A) having a structural unit represented by formula (V) is 65 parts by mass or less when the resin solid content in the resin composition is 100 parts by mass. is preferably 60 parts by mass or less, further preferably 50 parts by mass or less, even more preferably 40 parts by mass or less, even more preferably 35 parts by mass or less, and 20 parts by mass or less. or less. By setting it below the above-mentioned upper limit, the metal foil peel strength of the obtained cured product can be effectively increased.
The resin composition may contain only one type of polymer (A) having a structural unit represented by formula (V), or may contain two or more types. When two or more types are included, it is preferable that the total amount falls within the above range.

<Compound (B) having a molecular weight of less than 1000 and containing one organic group containing a carbon-carbon unsaturated bond in the molecule>
The resin composition of the present embodiment includes a compound (B) having a molecular weight of less than 1000 and containing one organic group containing a carbon-carbon unsaturated bond in the molecule (compound (B)). It is speculated that the carbon-carbon unsaturated bond of compound (B) reacts with the vinyl group of polymer (A) having the structural unit represented by formula (V), improving the moisture absorption and heat resistance of the resulting cured product. be done.
The carbon-carbon unsaturated bonds constituting the organic group containing carbon-carbon unsaturated bonds do not include those included as part of an aromatic ring. On the other hand, it is meant to include carbon-carbon unsaturated bonds contained as part of non-aromatic rings. An example of a carbon-carbon unsaturated bond included as part of a non-aromatic ring includes a cyclohexenyl group in a molecule. It is also meant to include portions other than the terminals of linear or branched organic groups, ie, carbon-carbon unsaturated bonds contained in the linear or branched chains.
In this embodiment, the organic group containing a carbon-carbon unsaturated bond preferably has a structure of CH ₂ =C(X)- (X is a hydrogen atom or a methyl group). In this way, by employing a compound containing a carbon-carbon unsaturated bond at the end of the molecule, it is possible to more effectively interact with the vinyl group of the polymer (A) having the structural unit represented by formula (V). It becomes possible to react.
The organic group containing a carbon-carbon unsaturated bond is preferably one selected from the group consisting of a vinyl group, an allyl group, an acrylic group, and a methacryl group, and even more preferably a vinyl group.

It is also preferable that the compound (B) used in this embodiment is composed only of atoms selected from carbon atoms, hydrogen atoms, oxygen atoms, and silicon atoms.
The compound (B) used in this embodiment may or may not have a polar group. It is preferable that the compound (B) used in this embodiment does not have a polar group. Examples of the polar group include an amino group, a carboxyl group, a hydroxy group, and a nitro group.

In this embodiment, the molecular weight of compound (B) is preferably 70 or more, more preferably 80 or more, and even more preferably 90 or more. By setting it to the above lower limit or more, volatilization of the compound (B) from the resin composition of the present embodiment, its cured product, etc. can be tended to be suppressed. The upper limit of the molecular weight of the compound (B) is preferably 500 or less, more preferably 400 or less, even more preferably 300 or less, even more preferably 200 or less, and even more preferably 150 or less. You can. By setting it below the above-mentioned upper limit, the effect of increasing the reactivity with the polymer (A) having the structural unit represented by the formula (V) tends to be further improved.
When the resin composition of this embodiment contains two or more types of compounds (B), it is preferable that the average molecular weight value of the compound (B) is within the above range, and the molecular weight of each compound is within the above preferable range. is more preferable.

In this embodiment, the boiling point of compound (B) is preferably 110°C or higher, more preferably 115°C or higher, and even more preferably 120°C or higher. By setting the value above the lower limit, volatilization of the compound (B) during thermosetting of the resin composition is suppressed, and the polymer (A) having the structural unit represented by the formula (V) is more effectively produced. The vinyl group having the compound (B) can be reacted with the compound (B). The boiling point of the compound (B) is preferably 300°C or lower, more preferably 250°C or lower, and even more preferably 200°C or lower. By controlling the amount to be less than or equal to the upper limit, it is possible to make it difficult for residual solvent to remain in the cured product.
When the resin composition of the present embodiment contains two or more types of compounds (B), it is sufficient that the average boiling point falls within the above range, but it is preferable that the boiling point of each compound falls within the above preferable range.

Compound (B) includes (meth)acrylic acid ester compounds, aromatic vinyl compounds (preferably styrene compounds), saturated fatty acid vinyl compounds, vinyl cyanide compounds, ethylenically unsaturated carboxylic acids, ethylenically unsaturated carboxylic acids. Anhydrides, ethylenically unsaturated dicarboxylic acid monoalkyl esters, ethylenically unsaturated carboxylic acid amides, vinyl silane compounds (e.g., vinyltrialkoxysilanes, etc.), acrylic silane compounds (e.g., acryltrialkoxysilanes, etc.), methacrylsilane compounds ( Examples include (meth)acrylic ester compounds, aromatic vinyl compounds, saturated fatty acid vinyl compounds, vinyl silane compounds, and acrylic silane compounds. At least one selected from the group consisting of , methacrylsilane compounds, and styrylsilane compounds is preferred, and aromatic vinyl compounds and/or vinylsilane compounds are more preferred.
Specific examples of compound (B) include methylstyrene, ethylvinylbenzene, vinyltrimethoxysilane, and vinyltriethoxysilane.

In the resin composition of the present embodiment, the content of compound (B) is preferably 1 part by mass or more, more preferably 2 parts by mass or more, based on 100 parts by mass of resin solid content. More preferably, the amount is 5 parts by mass or more. By setting the amount above the lower limit, the amount of unreacted functional groups in the obtained cured product tends to be reduced, and the moisture absorption and heat resistance tends to be significantly improved. Further, the upper limit of the content of the compound (B) is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, and 10 parts by mass or less, based on 100 parts by mass of the resin solid content. The amount is more preferably 8 parts by mass or less, even more preferably 5 parts by mass or less. By setting it below the above-mentioned upper limit, the low dielectric properties (Dk and/or Df) of the obtained cured product tend to be further improved.
The resin composition of this embodiment may contain only one type of compound (B), or may contain two or more types of compound (B). When two or more types are included, it is preferable that the total amount falls within the above range.

In the resin composition of the present embodiment, the mass ratio of the polymer (A) to the compound (B) is preferably 0.025 or more, and preferably 0.05 or more with respect to 1 polymer (A). It is more preferably 0.1 or more, even more preferably 0.15 or more, and may be 0.2 or more. When the amount is equal to or more than the lower limit, the amount of unreacted functional groups in the obtained cured product tends to be reduced, and the moisture absorption and heat resistance tends to be significantly improved. The upper limit of the mass ratio of the polymer (A) to the compound (B) is preferably 0.7 or less, more preferably 0.5 or less, and 0.7 to 1 polymer (A), more preferably 0.5 or less. It is more preferably 4 or less, even more preferably 0.3 or less, and may be 0.25 or less. By setting it below the above-mentioned upper limit, the low dielectric properties (Dk and/or Df) of the obtained cured product tend to be further improved.

Further, the resin composition in this embodiment has a molecular weight of less than 1000 and has two organic groups in the molecule having a structure of CH ₂ =C(X)-(X is a hydrogen atom or a methyl group). It is also possible to have a structure in which the compound (B') containing the above compounds is not substantially contained. Specific examples of the compound (B') include aromatic divinyl compounds, particularly divinylbenzene. "Substantially free of the compound (B')" means that the content of the compound (B') is less than 1 part by mass based on 100 parts by mass of resin solid content in the resin composition, and 0 It is preferably less than .1 part by weight, more preferably less than 0.01 part by weight, even more preferably less than 0.001 part by weight.

（式（Ｍ１）中、Ｒ^M1、Ｒ^M2、Ｒ^M3、およびＲ^M4は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M5およびＲ^M6は、それぞれ独立に、水素原子またはアルキル基を表す。Ａｒ^Mは２価の芳香族基を表す。Ａは、４～６員環の脂環基である。Ｒ^M7およびＲ^M8は、それぞれ独立に、アルキル基である。ｍｘは１または２であり、ｌｘは０または１である。Ｒ^M9およびＲ^M10は、それぞれ独立に、水素原子またはアルキル基を表す。Ｒ^M11、Ｒ^M12、Ｒ^M13、およびＲ^M14は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M15は、それぞれ独立に、炭素数１～１０のアルキル基、炭素数１～１０のアルキルオキシ基、炭素数１～１０のアルキルチオ基、炭素数６～１０のアリール基、炭素数１～１０のアリールオキシ基、炭素数１～１０のアリールチオ基、ハロゲン原子、水酸基またはメルカプト基を表す。ｐｘは０～３の整数を表す。ｎｘは１～２０の整数を表す。）

（式（Ｍ３）中、Ｒ⁵⁵はそれぞれ独立に、水素原子、炭素数１～８のアルキル基またはフェニル基を表し、ｎ₅は１以上１０以下の整数を表す。）

（式（Ｍ５）中、Ｒ⁵⁸は、それぞれ独立に、水素原子、炭素数１～８のアルキル基またはフェニル基を表し、Ｒ⁵⁹は、それぞれ独立に、水素原子またはメチル基を表し、ｎ₆は１以上の整数を表す。）

（式（ＯＰ－１）中、Ｘは芳香族基を表し、－（Ｙ－Ｏ）ｎ₂－はポリフェニレンエーテル構造を表し、Ｒ¹、Ｒ²、および、Ｒ³は、それぞれ独立して、水素原子、アルキル基、アルケニル基またはアルキニル基を表し、ｎ₁は１～６の整数を表し、ｎ₂は１～１００の整数を表し、ｎ₃は２～４の整数を表す。） <Other thermosetting compounds (C)>
It is preferable that the resin composition of the present embodiment further contains another thermosetting compound (C) that does not correspond to the polymer (A) or the compound (B). By including such components, other desired performances required of the printed wiring board can be more effectively exhibited.
In particular, in this embodiment, the weight average molecular weight of the other thermosetting compound (C) is preferably 100 or more, more preferably 200 or more, and still more preferably 300 or more. Further, the upper limit of the weight average molecular weight of the other thermosetting compound (C) is preferably 5,000 or less, more preferably 4,000 or less. Further, the equivalent weight of the functional group of the other thermosetting compound (C) is preferably 100 g/eq. Above, more preferably 150g/eq. Above, more preferably 200g/eq. That's all. Further, the upper limit of the equivalent weight of the functional group of the other thermosetting compound (C) is preferably 1,500 g/eq. Below, more preferably 1,300g/eq. It is as follows.
In this embodiment, it is particularly preferable that the other thermosetting compound (C) satisfies the above-mentioned weight average molecular weight and functional group equivalent. Such other thermosetting compounds (C) tend to have a lower weight average molecular weight and higher functional group concentration than the polymer (A) having the structural unit represented by formula (V). Therefore, the number of crosslinking points increases, and the moisture absorption and heat resistance of the resulting cured product can be improved more effectively.
In this embodiment, the other thermosetting compound (C) is a maleimide compound, a polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds, a cyanate ester compound, an epoxy compound, a phenol compound, or an alkenyl-substituted nadimide compound. , an oxetane resin, and a benzoxazine compound, and more preferably a maleimide compound and/or a polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds. , a group consisting of a compound (M1) represented by formula (M1), a compound represented by formula (M3), a compound represented by formula (M5), and a compound represented by formula (OP-1) It is more preferable to include at least one selected from the compound (M1) represented by formula (M1), the compound represented by formula (M3), and the compound represented by formula (OP-1). It is even more preferable that the compound contains at least one selected from the group consisting of: From the viewpoint of low dielectric properties, it is even more preferable that the compound (M1) represented by the formula (M1) is included.

(In formula (M1), R ^M1 , R ^M2 , R ^M3 , and R ^M4 each independently represent a hydrogen atom or an organic group. R ^M5 and R ^M6 each independently represent a hydrogen atom or an alkyl group. Ar ^M represents a divalent aromatic group. A is a 4- to 6-membered alicyclic group. R ^M7 and R ^M8 are each independently an alkyl group. mx is 1 or 2 and lx is 0 or 1. R ^M9 and R ^M10 each independently represent a hydrogen atom or an alkyl group. R ^M11 , R ^M12 , R ^M13 , and R ^M14 each independently represent a hydrogen atom or represents an organic group.R ^M15 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms. , represents an aryloxy group having 1 to 10 carbon atoms, an arylthio group having 1 to 10 carbon atoms, a halogen atom, a hydroxyl group or a mercapto group. px represents an integer of 0 to 3. nx represents an integer of 1 to 20. )

(In formula (M3), R ⁵⁵ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, and n ₅ represents an integer of 1 to 10.)

(In formula (M5), R ⁵⁸ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, R ⁵⁹ each independently represents a hydrogen atom or a methyl group, and n ₆ represents an integer greater than or equal to 1.)

(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, Represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer of 1 to 6, n ₂ represents an integer of 1 to 100, and n ₃ represents an integer of 2 to 4.)

（式（Ｍ０）中、Ｒ⁵¹は、それぞれ独立に、水素原子、炭素数１～８のアルキル基またはフェニル基を表し、Ｒ⁵²は、それぞれ独立に、水素原子またはメチル基を表し、ｎ₁は１以上の整数を表す。）
Ｒ⁵¹は、水素原子、メチル基、エチル基、ｎ－プロピル基、イソプロピル基、ｎ－ブチル基、イソブチル基、ｔ－ブチル基、ｎ－ペンチル基、フェニル基であることが好ましく、水素原子およびメチル基の一方であることがより好ましく、水素原子であることがさらに好ましい。
Ｒ⁵²は、メチル基であることが好ましい。
ｎ₁は１～１０の整数が好ましく、１～５の整数がより好ましく、１～３の整数がさらに好ましく、１または２であることが一層好ましく、１であることがより一層好ましい。
式（Ｍ０）で表される化合物は、１種のみの他、２種以上の混合物であってもよい。混合物の例としては、ｎ₁が異なる化合物の混合物、Ｒ⁵¹および／またはＲ⁵²の置換基の種類が異なる化合物の混合物、ベンゼン環に対するマレイミド基と酸素原子の結合位置（メタ位、パラ位、オルト位）が異なる化合物の混合物、ならびに、前記の２つ以上の異なる点が組み合わされた化合物の混合物などが挙げられる。以下、式（Ｍ１）～（Ｍ５）で表される化合物についても同様である。

（式（Ｍ１）中、Ｒ^M1、Ｒ^M2、Ｒ^M3、およびＲ^M4は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M5およびＲ^M6は、それぞれ独立に、水素原子またはアルキル基を表す。Ａｒ^Mは２価の芳香族基を表す。Ａは、４～６員環の脂環基である。Ｒ^M7およびＲ^M8は、それぞれ独立に、アルキル基である。ｍｘは１または２であり、ｌｘは０または１である。Ｒ^M9およびＲ^M10は、それぞれ独立に、水素原子またはアルキル基を表す。Ｒ^M11、Ｒ^M12、Ｒ^M13、およびＲ^M14は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M15は、それぞれ独立に、炭素数１～１０のアルキル基、炭素数１～１０のアルキルオキシ基、炭素数１～１０のアルキルチオ基、炭素数６～１０のアリール基、炭素数１～１０のアリールオキシ基、炭素数１～１０のアリールチオ基、ハロゲン原子、水酸基またはメルカプト基を表す。ｐｘは０～３の整数を表す。ｎｘは１～２０の整数を表す。） <<Maleimide compound>>
The resin composition of this embodiment may contain a maleimide compound. The resin composition of this embodiment has one or more (preferably 2 to 12, more preferably 2 to 6, still more preferably 2 to 4, even more preferably 2 or 3, even more preferably 2) per molecule. The compound is not particularly limited as long as it has a maleimide group, and a wide variety of compounds commonly used in the field of printed wiring boards can be used.
In this embodiment, compounds represented by formulas (M0) to (M5) are preferred, compounds represented by formulas (M1) to (M4) are more preferred, and compounds represented by formula (M1) and/or formula ( The compound represented by M3) is more preferred, and the compound (M1) represented by formula (M1) is even more preferred. When these maleimide compounds are used in materials for printed wiring boards (for example, metal foil-clad laminates), they can provide excellent heat resistance. In particular, when the compound (M1) represented by formula (M1) is used, low dielectric properties tend to be achieved more effectively.

(In formula (M0), R ⁵¹ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, R ⁵² each independently represents a hydrogen atom or a methyl group, and n ₁ represents an integer greater than or equal to 1.)
R ⁵¹ is preferably a hydrogen atom, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group, or phenyl group; More preferably, it is a methyl group, and even more preferably a hydrogen atom.
R ⁵² is preferably a methyl group.
n ₁ is preferably an integer of 1 to 10, more preferably an integer of 1 to 5, even more preferably an integer of 1 to 3, even more preferably 1 or 2, and even more preferably 1.
The compound represented by formula (M0) may be one type or a mixture of two or more types. Examples of mixtures include mixtures of compounds in which n ₁ is different, mixtures of compounds in which the types of substituents for R ⁵¹ and/or R ⁵² are different, and the bonding position of the maleimide group and the oxygen atom to the benzene ring (meta position, para position, Examples include mixtures of compounds having different positions (ortho positions), and mixtures of compounds having two or more of the above-mentioned different points combined. The same applies to the compounds represented by formulas (M1) to (M5) below.

(In formula (M1), R ^M1 , R ^M2 , R ^M3 , and R ^M4 each independently represent a hydrogen atom or an organic group. R ^M5 and R ^M6 each independently represent a hydrogen atom or an alkyl group. Ar ^M represents a divalent aromatic group. A is a 4- to 6-membered alicyclic group. R ^M7 and R ^M8 are each independently an alkyl group. mx is 1 or 2 and lx is 0 or 1. R ^M9 and R ^M10 each independently represent a hydrogen atom or an alkyl group. R ^M11 , R ^M12 , R ^M13 , and R ^M14 each independently represent a hydrogen atom or represents an organic group.R ^M15 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms. , represents an aryloxy group having 1 to 10 carbon atoms, an arylthio group having 1 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. px represents an integer of 0 to 3. nx represents an integer of 1 to 20. )

R ^M1 , R ^M2 , R ^M3 and R ^M4 in the formula each independently represent a hydrogen atom or an organic group. The organic group here is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, and a methyl group, an ethyl group, a propyl group, or a butyl group. More preferred is a methyl group, especially a methyl group. R ^M1 and R ^M3 are each independently preferably an alkyl group, and R ^M2 and R ^M4 are preferably a hydrogen atom.
R ^M5 and R ^M6 each independently represent a hydrogen atom or an alkyl group, preferably an alkyl group. The alkyl group here is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group, an ethyl group, a propyl group, or a butyl group, with a methyl group being particularly preferred. preferable.
Ar ^M represents a divalent aromatic group, preferably a phenylene group, a naphthalenediyl group, a phenanthrenediyl group, an anthracenediyl group, more preferably a phenylene group, still more preferably a m-phenylene group. Ar ^M may have a substituent, and the substituent is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, a methyl group, Ethyl group, propyl group, and butyl group are more preferable, and methyl group is particularly preferable. However, Ar ^M is preferably unsubstituted.
A is a 4- to 6-membered alicyclic group, and more preferably a 5-membered alicyclic group (preferably a group that forms an indane ring when combined with a benzene ring). R ^M7 and R ^M8 each independently represent an alkyl group, preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and particularly preferably a methyl group.
mx is 1 or 2, preferably 2.
lx is 0 or 1, preferably 1.
R ^M9 and R ^M10 each independently represent a hydrogen atom or an alkyl group, and an alkyl group is more preferred. The alkyl group here is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group, an ethyl group, a propyl group, or a butyl group, with a methyl group being particularly preferred. preferable.
R ^M11 , R ^M12 , R ^M13 , and R ^M14 each independently represent a hydrogen atom or an organic group. The organic group here is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, and a methyl group, an ethyl group, a propyl group, or a butyl group. More preferred is a methyl group, especially a methyl group. R ^M12 and R ^M13 are each independently preferably an alkyl group, and R ^M11 and R ^M14 are preferably a hydrogen atom.
R ^M15 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an aryl group having 1 to 10 carbon atoms; represents an aryloxy group, an arylthio group having 1 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group, an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or a cycloalkyl group having 6 to 10 carbon atoms. is preferably an aryl group.
px represents an integer of 0 to 3, preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0.
nx represents an integer from 1 to 20. nx may be an integer of 10 or less.
The resin composition of the present embodiment may contain only one type of compound (M1) represented by formula (M1), or may contain two or more types of compounds having at least different values of nx. You can stay there. When two or more types are included, the average value of nx (average number of repeating units) n in the compound (M1) represented by formula (M1) in the resin composition has a low melting point (low softening point) and a melt viscosity. In order to have a low value and excellent handling properties, it is preferably 0.92 or more, more preferably 0.95 or more, even more preferably 1.0 or more, and 1.1 or more. It is more preferable that there be. Further, n is preferably 10.0 or less, more preferably 8.0 or less, even more preferably 7.0 or less, even more preferably 6.0 or less, and 5. It may be 0 or less. The same applies to equation (M1-1) and the like, which will be described later.

（式（Ｍ１－１）中、Ｒ^M21、Ｒ^M22、Ｒ^M23、およびＲ^M24は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M25およびＲ^M26は、それぞれ独立に、水素原子またはアルキル基を表す。Ｒ^M27、Ｒ^M28、Ｒ^M29、およびＲ^M30は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M31およびＲ^M32は、それぞれ独立に、水素原子またはアルキル基を表す。Ｒ^M33、Ｒ^M34、Ｒ^M35、およびＲ^M36は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M37、Ｒ^M38、およびＲ^M39は、それぞれ独立に、水素原子またはアルキル基を表す。ｎｘは１以上２０以下の整数を表す。） The compound (M1) represented by formula (M1) is preferably a compound represented by formula (M1-1) below.

(In formula (M1-1), R ^M21 , R ^M22 , R ^M23 , and R ^M24 each independently represent a hydrogen atom or an organic group. R ^M25 and R ^M26 each independently represent a hydrogen atom or an alkyl R ^M27 , R ^M28 , R ^M29 , and R ^M30 each independently represent a hydrogen atom or an organic group. R ^M31 and R ^M32 each independently represent a hydrogen atom or an alkyl group. R ^M33 , R ^M34 , R ^M35 , and R ^M36 each independently represent a hydrogen atom or an organic group. R ^M37 , R ^M38 , and R ^M39 each independently represent a hydrogen atom or an alkyl group. nx is Represents an integer between 1 and 20.)

R ^M21 , R ^M22 , R ^M23 , and R ^M24 in the formula each independently represent a hydrogen atom or an organic group. The organic group here is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, and a methyl group, an ethyl group, a propyl group, or a butyl group. More preferred is a methyl group. R ^M21 and R ^M23 are preferably alkyl groups, and R ^M22 and R ^M24 are preferably hydrogen atoms.
R ^M25 and R ^M26 each independently represent a hydrogen atom or an alkyl group, preferably an alkyl group. The alkyl group here is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group, an ethyl group, a propyl group, or a butyl group, with a methyl group being particularly preferred. preferable.
R ^M27 , R ^M28 , R ^M29 , and R ^M30 each independently represent a hydrogen atom or an organic group, and preferably a hydrogen atom. The organic group here is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, and a methyl group, an ethyl group, a propyl group, or a butyl group. More preferred is a methyl group.
R ^M31 and R ^M32 each independently represent a hydrogen atom or an alkyl group, preferably an alkyl group. The alkyl group here is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group, an ethyl group, a propyl group, or a butyl group, with a methyl group being particularly preferred. preferable.
R ^M33 , R ^M34 , R ^M35 , and R ^M36 each independently represent a hydrogen atom or an organic group. The organic group here is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, and a methyl group, an ethyl group, a propyl group, or a butyl group. More preferred is a methyl group.
R ^M33 and R ^M36 are preferably hydrogen atoms, and R ^M34 and R ^M35 are preferably alkyl groups.
R ^M37 , R ^M38 and R ^M39 each independently represent a hydrogen atom or an alkyl group, preferably an alkyl group. The alkyl group here is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group, an ethyl group, a propyl group, or a butyl group, with a methyl group being particularly preferred. preferable.
nx represents an integer from 1 to 20. nx may be an integer of 10 or less.

（式（Ｍ１－２）中、Ｒ^M21、Ｒ^M22、Ｒ^M23、およびＲ^M24は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M25およびＲ^M26は、それぞれ独立に、水素原子またはアルキル基を表す。Ｒ^M27、Ｒ^M28、Ｒ^M29、およびＲ^M30は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M31およびＲ^M32は、それぞれ独立に、水素原子またはアルキル基を表す。Ｒ^M33、Ｒ^M34、Ｒ^M35、およびＲ^M36は、それぞれ独立に、水素原子または有機基を表す。Ｒ^M37、Ｒ^M38、およびＲ^M39は、それぞれ独立に、水素原子またはアルキル基を表す。ｎｘは１以上２０以下の整数を表す。） The compound represented by formula (M1-1) is preferably a compound represented by formula (M1-2) below.

(In formula (M1-2), R ^M21 , R ^M22 , R ^M23 , and R ^M24 each independently represent a hydrogen atom or an organic group. R ^M25 and R ^M26 each independently represent a hydrogen atom or an alkyl R ^M27 , R ^M28 , R ^M29 , and R ^M30 each independently represent a hydrogen atom or an organic group. R ^M31 and R ^M32 each independently represent a hydrogen atom or an alkyl group. R ^M33 , R ^M34 , R ^M35 , and R ^M36 each independently represent a hydrogen atom or an organic group. R ^M37 , R ^M38 , and R ^M39 each independently represent a hydrogen atom or an alkyl group. nx is Represents an integer between 1 and 20.)

In formula (M1-2), ^RM21 , ^RM22 , ^RM23 , ^RM24 , RM25, ^{RM26 , RM27} , ^RM28 , ^RM29 , ^RM30 , ^RM31 , ^RM32 , ^RM33 , ^RM34 , R ^M35 , R ^M36 , R ^M37 , R ^M38 , R ^M39 , and nx are R ^M21 , R ^M22 , R ^M23 , R ^M24 , R ^M25 , R ^M26 , R ^M27 in formula (M1-1), respectively; Synonymous with R ^M28 , R ^M29 , R ^M30 , R ^M31 , R ^M32 , R ^M33 , R ^M34 , R ^{M35 , R M36 , R M37 , R M38} , R ^M39 , and nx, and the preferred ranges are also the same. .

（式（Ｍ１－３）中、ｎｘは１以上２０以下の整数を表す。）
ｎｘは１０以下の整数であってもよい。

（式（Ｍ１－４）中、ｎｘは１以上２０以下の整数を表す。） The compound represented by the formula (M1-1) is further preferably a compound represented by the following formula (M1-3), and more preferably a compound represented by the following formula (M1-4). More preferred.

(In formula (M1-3), nx represents an integer from 1 to 20.)
nx may be an integer of 10 or less.

(In formula (M1-4), nx represents an integer from 1 to 20.)

（式（Ｍ２）中、Ｒ⁵⁴は、それぞれ独立に、水素原子またはメチル基を表し、ｎ₄は１以上の整数を表す。）
ｎ₄は１～１０の整数が好ましく、１～５の整数がより好ましく、１～３の整数がさらに好ましく、１または２であることが一層好ましい。

（式（Ｍ３）中、Ｒ⁵⁵は、それぞれ独立に、水素原子、炭素数１～８のアルキル基またはフェニル基を表し、ｎ₅は１以上１０以下の整数を表す。）
Ｒ⁵⁵は、水素原子、メチル基、エチル基、ｎ－プロピル基、イソプロピル基、ｎ－ブチル基、イソブチル基、ｔ－ブチル基、ｎ－ペンチル基、フェニル基であることが好ましく、水素原子およびメチル基の一方であることがより好ましく、水素原子であることがさらに好ましい。
ｎ₅は１以上５以下の整数であることが好ましく、１～３の整数がさらに好ましく、１または２であることが一層好ましい。

（式（Ｍ４）中、Ｒ⁵⁶は、それぞれ独立に、水素原子、メチル基またはエチル基を表し、Ｒ⁵⁷は、それぞれ独立に、水素原子またはメチル基を表す。） The molecular weight of the compound (M1) represented by formula (M1) is preferably 500 or more, more preferably 600 or more, and even more preferably 700 or more. When the amount is equal to or more than the lower limit, the resulting cured product tends to have improved low dielectric properties and low water absorption. Further, the molecular weight of the compound (M1) represented by formula (M1) is preferably 10,000 or less, more preferably 9,000 or less, even more preferably 7,000 or less, and preferably 5,000 or less. More preferably, it is 4000 or less. By setting it below the above-mentioned upper limit, the heat resistance and handleability of the obtained cured product tend to be further improved.

(In formula (M2), R ⁵⁴ each independently represents a hydrogen atom or a methyl group, and n ₄ represents an integer of 1 or more.)
n ₄ is preferably an integer of 1 to 10, more preferably an integer of 1 to 5, even more preferably an integer of 1 to 3, and even more preferably 1 or 2.

(In formula (M3), R ⁵⁵ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, and n ₅ represents an integer of 1 to 10.)
R ⁵⁵ is preferably a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, or a phenyl group; More preferably, it is a methyl group, and even more preferably a hydrogen atom.
n ₅ is preferably an integer of 1 or more and 5 or less, more preferably an integer of 1 to 3, and even more preferably 1 or 2.

(In formula (M4), R ⁵⁶ each independently represents a hydrogen atom, a methyl group, or an ethyl group, and R ⁵⁷ each independently represents a hydrogen atom or a methyl group.)

（式（Ｍ５）中、Ｒ⁵⁸は、それぞれ独立に、水素原子、炭素数１～８のアルキル基またはフェニル基を表し、Ｒ⁵⁹は、それぞれ独立に、水素原子またはメチル基を表し、ｎ₆は１以上の整数を表す。）
Ｒ⁵⁸は、水素原子、メチル基、エチル基、ｎ－プロピル基、イソプロピル基、ｎ－ブチル基、イソブチル基、ｔ－ブチル基、ｎ－ペンチル基、フェニル基であることが好ましく、水素原子およびメチル基の一方であることがより好ましく、水素原子であることがさらに好ましい。
Ｒ⁵⁹は、メチル基であることが好ましい。
ｎ₆は１～１０の整数が好ましく、１～５の整数がより好ましく、１～３の整数がさらに好ましく、１または２であることが一層好ましく、１であってもよい。
式（Ｍ５）で表される化合物は、ｎ₆が異なる化合物の混合物あってもよく、混合物であることが好ましい。また、式（Ｍ０）で表される化合物の所で述べたように、他の部分が異なる化合物の混合物であってもよい。

(In formula (M5), R ⁵⁸ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, R ⁵⁹ each independently represents a hydrogen atom or a methyl group, and n ₆ represents an integer greater than or equal to 1.)
R ⁵⁸ is preferably a hydrogen atom, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group, or phenyl group; One of the methyl groups is more preferable, and a hydrogen atom is even more preferable.
R ⁵⁹ is preferably a methyl group.
n ₆ is preferably an integer of 1 to 10, more preferably an integer of 1 to 5, even more preferably an integer of 1 to 3, even more preferably 1 or 2, and may be 1.
The compound represented by formula (M5) may be a mixture of compounds having different n ₆ values, and is preferably a mixture. Further, as described in the section of the compound represented by formula (M0), it may be a mixture of compounds having different parts.

The maleimide compound may be manufactured by a known method, or a commercially available product may be used. Commercially available products include, for example, "BMI-80" manufactured by K-I Kasei Co., Ltd. as a compound represented by formula (M0), and "NE-80" manufactured by DIC Corporation as a compound (M1) represented by formula (M1). X-9470S'', the compound represented by formula (M2) is ``BMI-2300'' manufactured by Daiwa Chemical Industries, Ltd., and the compound represented by formula (M3) is ``MIR-3000-70MT'' manufactured by Nippon Kayaku Co., Ltd. Examples of the compound represented by formula (M4) include "BMI-70" manufactured by K.I. Kasei, and examples of the compound represented by formula (M5) include "MIR-5000" manufactured by Nippon Kayaku Co., Ltd.

Examples of maleimide compounds other than those mentioned above include N-phenylmaleimide, phenylmethanemaleimide oligomers, m-phenylenebismaleimide, 2,2-bis(4-(4-maleimidophenoxy)-phenyl)propane, 4- Methyl-1,3-phenylenebismaleimide, 1,6-bismaleimide-(2,2,4-trimethyl)hexane, 4,4'-diphenyl ether bismaleimide, 4,4'-diphenylsulfone bismaleimide, 1,3 Examples include -bis(3-maleimidophenoxy)benzene, 1,3-bis(4-maleimidophenoxy)benzene, prepolymers thereof, and prepolymers of these maleimides and amines.

When the resin composition of this embodiment contains a maleimide compound, the lower limit of the content of the maleimide compound is preferably 1 part by mass or more, and 5 parts by mass, based on 100 parts by mass of resin solids in the resin composition. It is more preferably at least 1 part by mass, even more preferably at least 10 parts by mass, even more preferably at least 20 parts by mass, and even more preferably at least 25 parts by mass. When the content of the maleimide compound is 1 part by mass or more, the flame resistance of the obtained cured product tends to improve. Further, the upper limit of the content of the maleimide compound is preferably 70 parts by mass or less, more preferably 50 parts by mass or less, and 40 parts by mass based on 100 parts by mass of the resin solid content in the resin composition. The following may be sufficient. When the content of the maleimide compound is 70 parts by mass or less, the metal foil peel strength and low water absorption tend to improve.
The resin composition in this embodiment may contain only one type of maleimide compound, or may contain two or more types of maleimide compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also be configured to substantially not contain a maleimide compound, particularly a monofunctional maleimide compound. "Substantially free" means that the content of the monofunctional maleimide compound, and furthermore, the maleimide compound, is less than 1 part by mass with respect to 100 parts by mass of resin solid content in the resin composition, and 0.1 mass part. It is preferably less than 0.01 part by mass, more preferably less than 0.01 part by mass. By substantially not containing monofunctional maleimide, the relationship between the maleimide group of the maleimide compound and the vinyl group of the polymer (A) having the structural unit represented by formula (V) or the inorganic filler (B) is reduced. The reaction between the vinyl groups proceeds preferentially over the reaction between the vinyl groups, and a cured product with better low dielectric properties tends to be obtained. Further, when the reaction between vinyl groups proceeds preferentially, the degree of curing after heating tends to improve from the viewpoint of steric hindrance.

<<Polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds>>
The resin composition of this embodiment may contain a polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds.
A polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds is a polyphenylene ether compound having at its terminal two or more groups selected from the group consisting of (meth)acrylic group, maleimide group, and vinylbenzyl group. It is preferable. By using these polyphenylene ether compounds, there is a tendency that the dielectric properties, low water absorption, etc. of printed wiring boards and the like can be more effectively improved.
These details will be explained below.

The polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds is exemplified by a compound having a phenylene ether skeleton represented by the following formula (X1).

(In formula (X1), R ²⁴ , R ²⁵ , R ²⁶ , and R ²⁷ may be the same or different and represent an alkyl group having 6 or less carbon atoms, an aryl group, a halogen atom, or a hydrogen atom. )

The polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds has the formula (X2):
(In formula (X2), R ²⁸ , R ²⁹ , R ³⁰ , R ³⁴ , and R ³⁵ may be the same or different and represent an alkyl group or a phenyl group having 6 or less carbon atoms. R ³¹ , R ³² , and R ³³ may be the same or different and are a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group.)
A repeating unit represented by and/or formula (X3):
(In formula (X3), R ³⁶ , R ³⁷ , R ³⁸ , R ³⁹ , R ⁴⁰ , R ⁴¹ , R ⁴² and R ⁴³ may be the same or different, hydrogen atom, alkyl having 6 or less carbon atoms) or a phenyl group. -A- is a linear, branched or cyclic divalent hydrocarbon group having 20 or less carbon atoms.

A polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds is a modified polyphenylene ether compound (hereinafter referred to as a "modified polyphenylene ether compound (g )"), and more preferably a modified polyphenylene ether compound having two or more groups selected from the group consisting of a (meth)acrylic group, a maleimide group, and a vinylbenzyl group at the end. preferable. By employing such a modified polyphenylene ether compound (g), it becomes possible to further reduce the dielectric loss tangent (Df) of the cured product of the resin composition, and to increase low water absorption and metal foil peel strength. . These may be used alone or in combination of two or more.

（式（ＯＰ－１）中、Ｘは芳香族基を表し、－（Ｙ－Ｏ）ｎ₂－はポリフェニレンエーテル構造を表し、Ｒ¹、Ｒ²、および、Ｒ³は、それぞれ独立して、水素原子、アルキル基、アルケニル基またはアルキニル基を表し、ｎ₁は１～６の整数を表し、ｎ₂は１～１００の整数を表し、ｎ₃は２～４の整数を表す。）
ｎ₂が２以上の整数の場合、および、ｎ₃について、ｎ₂個の構造単位（Ｙ－Ｏ）および／またはｎ₃個の構造単位は、それぞれ同一であっても異なっていてもよい。ｎ₃は、好ましくは２である。 Examples of the modified polyphenylene ether compound (g) include a compound represented by formula (OP-1).

(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, Represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer of 1 to 6, n ₂ represents an integer of 1 to 100, and n ₃ represents an integer of 2 to 4.)
When n ₂ is an integer of 2 or more, and for n ₃ , the n ₂ structural units (YO) and/or the n ₃ structural units may be the same or different. n ₃ is preferably 2.

ここで、－（Ｏ－Ｘ－Ｏ）－は、式（ＯＰ－３）：

（式（ＯＰ－３）中、Ｒ⁴、Ｒ⁵、Ｒ⁶、Ｒ¹⁰、および、Ｒ¹¹は、同一または異なってもよく、炭素数６以下のアルキル基またはフェニル基である。Ｒ⁷、Ｒ⁸、および、Ｒ⁹は、同一または異なってもよく、水素原子、炭素数６以下のアルキル基またはフェニル基である。）
および／または式（ＯＰ－４）：

（式（ＯＰ－４）中、Ｒ¹²、Ｒ¹³、Ｒ¹⁴、Ｒ¹⁵、Ｒ¹⁶、Ｒ¹⁷、Ｒ¹⁸、および、Ｒ¹⁹は、同一または異なってもよく、水素原子、炭素数６以下のアルキル基またはフェニル基である。－Ａ－は、炭素数２０以下の直鎖、分岐または環状の２価の炭化水素基である。）で表されることが好ましい。 The modified polyphenylene ether compound (g) in this embodiment is preferably a compound represented by formula (OP-2).

Here, -(O-X-O)- is the formula (OP-3):

(In formula (OP-3), R ⁴ , R ⁵ , R ⁶ , R ¹⁰ , and R ¹¹ may be the same or different and are an alkyl group or a phenyl group having 6 or less carbon atoms. R ⁷ , R ⁸ and R ⁹ may be the same or different and are a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group.)
and/or formula (OP-4):

(In formula (OP-4), R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ , R ¹⁸ , and R ¹⁹ may be the same or different, and each has a hydrogen atom and a carbon number of 6 or less. is an alkyl group or phenyl group. -A- is a linear, branched or cyclic divalent hydrocarbon group having 20 or less carbon atoms.

（式（ＯＰ－５）中、Ｒ²⁰、Ｒ²¹は、同一または異なってもよく、炭素数６以下のアルキル基またはフェニル基である。Ｒ²²、Ｒ²³は、同一または異なってもよく、水素原子、炭素数６以下のアルキル基またはフェニル基である。）で表されることが好ましい。
式（ＯＰ－２）において、ａ、ｂは、少なくともいずれか一方が０でない、０～１００の整数を表し、０～５０の整数であることが好ましく、１～３０の整数であることがより好ましい。ａおよび／またはｂが２以上の整数の場合、２以上の－（Ｙ－Ｏ）－は、それぞれ独立に、１種の構造が配列したものであってよく、２種以上の構造がブロックまたはランダムに配列していてもよい。 Moreover, -(YO)- is the formula (OP-5):

(In formula (OP-5), R ²⁰ and R ²¹ may be the same or different and are an alkyl group or a phenyl group having 6 or less carbon atoms. R ²² and R ²³ may be the same or different, It is preferably represented by a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group.
In formula (OP-2), a and b represent an integer of 0 to 100, at least one of which is not 0, preferably an integer of 0 to 50, more preferably an integer of 1 to 30. preferable. When a and/or b is an integer of 2 or more, 2 or more -(YO)- may each independently be an array of one type of structure, or two or more types of structures may be a block or They may be arranged randomly.

-A- in formula (OP-4) is, for example, a methylene group, ethylidene group, 1-methylethylidene group, 1,1-propylidene group, 1,4-phenylenebis(1-methylethylidene) group, 1, Examples include, but are not limited to, divalent organic groups such as 3-phenylenebis(1-methylethylidene) group, cyclohexylidene group, phenylmethylene group, naphthylmethylene group, and 1-phenylethylidene group. .

In the modified polyphenylene ether compound (g), R ⁴ , R ⁵ , R ⁶ , R ¹⁰ , R ¹¹ , R ²⁰ , and R ²¹ are alkyl groups having 3 or less carbon atoms, and R ⁷ , R ⁸ , R ⁹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ , R ¹⁸ , R ¹⁹ , R ²² and R ²³ are hydrogen atoms or alkyl groups having 3 or less carbon atoms, polyphenylene ether Compounds are preferred, and in particular -(O-X-O)- represented by formula (OP-3) or formula (OP-4) is represented by formula (OP-9), formula (OP-10), and/or Formula (OP-11) and -(YO)- represented by formula (OP-5) are preferably formula (OP-12) or formula (OP-13). When a and/or b are integers of 2 or more, -(YO)- of 2 or more each independently represents a structure in which two or more of formula (OP-12) and/or formula (OP-13) are arranged. Alternatively, it may have a structure in which formula (OP-12) and formula (OP-13) are arranged in blocks or randomly.

（式（ＯＰ－１０）中、Ｒ⁴⁴、Ｒ⁴⁵、Ｒ⁴⁶、および、Ｒ⁴⁷は、同一または異なってもよく、水素原子またはメチル基である。－Ｂ－は、炭素数２０以下の直鎖、分岐または環状の２価の炭化水素基である。）
－Ｂ－は、式（ＯＰ－４）における－Ａ－の具体例と同じものが具体例として挙げられる。

（式（ＯＰ－１１）中、－Ｂ－は、炭素数２０以下の直鎖、分岐または環状の２価の炭化水素基である。）
－Ｂ－は、式（ＯＰ－４）における－Ａ－の具体例と同じものが具体例として挙げられる。

(In formula (OP-10), R ⁴⁴ , R ⁴⁵ , R ⁴⁶ , and R ⁴⁷ may be the same or different and are a hydrogen atom or a methyl group. -B- is a straight line having 20 or less carbon atoms. It is a chain, branched, or cyclic divalent hydrocarbon group.)
Examples of -B- include the same examples as -A- in formula (OP-4).

(In formula (OP-11), -B- is a straight chain, branched or cyclic divalent hydrocarbon group having 20 or less carbon atoms.)
Examples of -B- include the same examples as -A- in formula (OP-4).

In addition, for details of the polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds, the description in JP 2018-016709 can be referred to, and the contents thereof are incorporated herein.

The number average molecular weight of a polyphenylene ether compound (preferably a modified polyphenylene ether compound (g)) containing two or more carbon-carbon unsaturated double bonds (preferably a modified polyphenylene ether compound (g)) in terms of polystyrene determined by GPC (gel permeation chromatography) is 500 or more and 3,000 or more. It is preferable that it is below. When the number average molecular weight is 500 or more, stickiness tends to be further suppressed when the resin composition of this embodiment is formed into a coating film. When the number average molecular weight is 3,000 or less, the solubility in a solvent tends to be further improved.
In addition, the weight average molecular weight of the polyphenylene ether compound (preferably the modified polyphenylene ether compound (g)) containing two or more carbon-carbon unsaturated double bonds (preferably the modified polyphenylene ether compound (g)) in terms of polystyrene by GPC is 800 or more and 10,000 or less. It is preferably 800 or more and 5,000 or less. By setting the above lower limit or more, the dielectric constant (Dk) and dielectric loss tangent (Df) of the cured product of the resin composition tend to become lower. By setting the above upper limit or less, the varnish etc. described below The solubility, low viscosity, and moldability of the resin composition in the solvent during production tend to be further improved.
Further, in the case of the modified polyphenylene ether compound (g), the terminal carbon-carbon unsaturated double bond equivalent is preferably 400 to 5000 g per carbon-carbon unsaturated double bond, and 400 to 2500 g. It is more preferable that By setting it above the lower limit, the relative dielectric constant (Dk) and dielectric loss tangent (Df) of the cured product of the resin composition tend to become lower. By setting it below the above upper limit, the solubility, low viscosity, and moldability of the resin composition in a solvent tend to be further improved.

When the resin composition of the present embodiment contains a polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds, the lower limit of the content of the polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds is is preferably 1 part by mass or more, more preferably 3 parts by mass or more, even more preferably 5 parts by mass or more, and 7 parts by mass, based on 100 parts by mass of resin solids in the resin composition. It is more preferable that the amount is above, and even more preferably that it is 10 parts by mass or more. When the amount is equal to or more than the lower limit, the resulting cured product tends to have improved low water absorption and low dielectric properties (Dk and/or Df). Further, the upper limit of the content of the polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds is preferably 70 parts by mass or less, and 60 parts by mass or less, based on 100 parts by mass of the resin solid content in the resin composition. It is more preferably at most parts by mass, even more preferably at most 50 parts by mass, even more preferably at most 40 parts by mass, even more preferably at most 35 parts by mass, and even more preferably at most 25 parts by mass. Even more preferably, the amount may be 20 parts by mass or less. When the amount is below the upper limit, the heat resistance and chemical resistance of the obtained cured product tend to be further improved.
The resin composition in this embodiment may contain only one type of polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds, or may contain two or more types. When two or more types are included, it is preferable that the total amount falls within the above range.

<<Cyanate ester compound>>
The resin composition of this embodiment may contain a cyanate ester compound.
The cyanate ester compound has one or more cyanate groups (cyanato groups) in one molecule (preferably 2 to 12, more preferably 2 to 6, still more preferably 2 to 4, even more preferably 2 or 3, even more preferably is not particularly limited as long as it is a compound containing 2), and a wide range of compounds commonly used in the field of printed wiring boards can be used. Further, the cyanate ester compound is preferably a compound in which a cyanate group is directly bonded to an aromatic skeleton (aromatic ring).
Examples of cyanate ester compounds include phenol novolac type cyanate ester compounds, naphthol aralkyl type cyanate ester compounds (naphthol aralkyl type cyanate), naphthylene ether type cyanate ester compounds, biphenylaralkyl type cyanate ester compounds, and xylene resins. Consists of type cyanate ester compound, trisphenolmethane type cyanate ester compound, adamantane skeleton type cyanate ester compound, bisphenol M type cyanate ester compound, bisphenol A type cyanate ester compound, and diallylbisphenol A type cyanate ester compound At least one selected from the group. Among these, from the viewpoint of further improving the low water absorption of the obtained cured product, phenol novolak type cyanate ester compounds, naphthol aralkyl type cyanate ester compounds, naphthylene ether type cyanate ester compounds, xylene resin type cyanate ester compounds are used. It is preferably at least one selected from the group consisting of ester compounds, bisphenol M-type cyanate ester compounds, bisphenol A-type cyanate ester compounds, and diallylbisphenol A-type cyanate ester compounds, and phenol novolak-type cyanate esters. The cyanate compound is more preferably at least one selected from the group consisting of a naphthol aralkyl cyanate ester compound, and a naphthol aralkyl cyanate ester compound. These cyanate ester compounds may be prepared by known methods, or commercially available products may be used. Note that cyanate ester compounds having a naphthol aralkyl skeleton, naphthylene ether skeleton, xylene skeleton, trisphenolmethane skeleton, or adamantane skeleton have a relatively large number of functional group equivalents, and the number of unreacted cyanate ester groups is small. Therefore, cured products of resin compositions using these materials tend to have even better low water absorption. Moreover, mainly due to having an aromatic skeleton or an adamantane skeleton, plating adhesion tends to be further improved.

As the naphthol aralkyl cyanate ester compound, a compound represented by the following formula (1) is more preferable.

（式（１）中、Ｒ³は、それぞれ独立して、水素原子またはメチル基を表し、ｎ３は、１以上の整数を表す。）

(In formula (1), ^R3 each independently represents a hydrogen atom or a methyl group, and n3 represents an integer of 1 or more.)

In formula (1), R ³ each independently represents a hydrogen atom or a methyl group, and among these, a hydrogen atom is preferred.
In formula (1), n3 is an integer of 1 or more, preferably an integer of 1 to 20, more preferably an integer of 1 to 10, even more preferably an integer of 1 to 6. .

（式（ＶＩＩ）中、Ｒ⁶は、それぞれ独立して、水素原子またはメチル基を表し、ｎ７は１以上の整数を表す。） Further, the novolac type cyanate ester compound is not particularly limited, but for example, a compound represented by the following formula (VII) is preferable.

(In formula (VII), R ⁶ each independently represents a hydrogen atom or a methyl group, and n7 represents an integer of 1 or more.)

In formula (VII), R ⁶ each independently represents a hydrogen atom or a methyl group, and among these, a hydrogen atom is preferred.
In formula (VII), n7 is an integer of 1 or more, preferably an integer of 1 to 20, more preferably an integer of 1 to 10, and even more preferably an integer of 1 to 6.

The bisphenol A type cyanate ester compound is one selected from the group consisting of 2,2-bis(4-cyanatophenyl)propane and a prepolymer of 2,2-bis(4-cyanatophenyl)propane. The above may also be used.

The resin composition of the present embodiment preferably contains a cyanate ester compound within a range that does not impair the effects of the present invention. When the resin composition of the present embodiment contains a cyanate ester compound, the lower limit of its content is preferably 0.1 parts by mass or more based on 100 parts by mass of resin solids in the resin composition. , more preferably 0.2 parts by mass or more, and still more preferably 0.5 parts by mass or more. When the content of the cyanate ester compound is 0.1 parts by mass or more, the heat resistance, flame resistance, chemical resistance, low dielectric constant, low dielectric loss tangent, and insulation properties of the obtained cured product are improved. There is a tendency. When the resin composition of this embodiment contains a cyanate ester compound, the upper limit of the content of the cyanate ester compound may be 70 parts by mass or less based on 100 parts by mass of the resin solid content in the resin composition. Preferably, the amount is 50 parts by mass or less, more preferably 40 parts by mass or less, even more preferably 30 parts by mass or less, even more preferably 20 parts by mass or less, and 10 parts by mass. Below, it may be 5 parts by mass or less.
The resin composition in this embodiment may contain only one type of cyanate ester compound, or may contain two or more types of cyanate ester compounds. When two or more types are included, it is preferable that the total amount falls within the above range.

<<Epoxy compound>>
The resin composition of this embodiment may contain an epoxy compound.
An epoxy compound is a compound having one or more (preferably 2 to 12, more preferably 2 to 6, still more preferably 2 to 4, even more preferably 2 or 3, even more preferably 2) epoxy groups in one molecule. Alternatively, it is not particularly limited as long as it is a resin, and a wide variety of compounds commonly used in the field of printed wiring boards can be used.
Examples of epoxy compounds include bisphenol A epoxy resin, bisphenol E epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, bisphenol A novolac epoxy resin, glycidyl ester epoxy resin, and aralkyl epoxy resin. Novolac type epoxy resin, biphenylaralkyl type epoxy resin, naphthylene ether type epoxy resin, cresol novolac type epoxy resin, multifunctional phenol type epoxy resin, naphthalene type epoxy resin, anthracene type epoxy resin, naphthalene skeleton modified novolac type epoxy resin, phenol Aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, polyol type epoxy resin, phosphorus-containing epoxy resin, glycidyl amine, glycidyl ester, butadiene, etc. Examples include compounds in which bonds are epoxidized and compounds obtained by reacting hydroxyl group-containing silicone resins with epichlorohydrin. By using these, the moldability and adhesion of the resin composition are improved. Among these, from the viewpoint of further improving flame retardancy and heat resistance, biphenylaralkyl epoxy resins, naphthylene ether epoxy resins, polyfunctional phenol epoxy resins, and naphthalene epoxy resins are preferred; More preferably, it is a type epoxy resin.

The resin composition of the present embodiment preferably contains an epoxy compound within a range that does not impair the effects of the present invention. When the resin composition of the present embodiment contains an epoxy compound, the content is preferably 0.1 parts by mass or more, and 1 part by mass or more, based on 100 parts by mass of resin solids in the resin composition. It is more preferable that the amount is at least 2 parts by mass, and even more preferably 2 parts by mass or more. When the content of the epoxy compound is 0.1 parts by mass or more, the peel strength and toughness of the metal foil tend to improve. When the resin composition of this embodiment contains an epoxy compound, the upper limit of the content of the epoxy compound is preferably 50 parts by mass or less, and 30 parts by mass or less, based on 100 parts by mass of resin solids in the resin composition. It is more preferably at most 20 parts by mass, even more preferably at most 10 parts by mass, even more preferably at most 8 parts by mass, and even more preferably at most 5 parts by mass. is even more preferred. When the content of the epoxy compound is 50 parts by mass or less, the electrical properties of the obtained cured product tend to improve.
The resin composition in this embodiment may contain only one type of epoxy compound, or may contain two or more types of epoxy compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also have a structure that does not substantially contain an epoxy compound. "Substantially free" means that the content of the epoxy compound is less than 0.1 parts by mass, preferably less than 0.01 parts by mass, based on 100 parts by mass of resin solids in the resin composition. , and even less than 0.001 part by mass.

<<Phenol compounds>>
The resin composition of this embodiment may contain a phenol compound.
The phenol compound has one or more (preferably 2 to 12, more preferably 2 to 6, even more preferably 2 to 4, even more preferably 2 or 3, even more preferably 2) phenolic hydroxyl groups in one molecule. The phenol compound is not particularly limited, and a wide variety of compounds commonly used in the field of printed wiring boards can be used.
Examples of the phenol compound include bisphenol A type phenol resin, bisphenol E type phenol resin, bisphenol F type phenol resin, bisphenol S type phenol resin, phenol novolak resin, bisphenol A novolac type phenol resin, glycidyl ester type phenol resin, aralkyl novolak phenol. Resin, biphenylaralkyl type phenolic resin, cresol novolac type phenolic resin, polyfunctional phenolic resin, naphthol resin, naphthol novolac resin, polyfunctional naphthol resin, anthracene type phenolic resin, naphthalene skeleton modified novolak type phenolic resin, phenol aralkyl type phenolic resin, Examples include naphthol aralkyl type phenol resin, dicyclopentadiene type phenol resin, biphenyl type phenol resin, alicyclic phenol resin, polyol type phenol resin, phosphorus-containing phenol resin, and hydroxyl group-containing silicone resin. Among these, from the viewpoint of further improving the flame resistance of the obtained cured product, at least one selected from the group consisting of biphenyl aralkyl type phenol resin, naphthol aralkyl type phenol resin, phosphorus-containing phenol resin, and hydroxyl group-containing silicone resin. Preferably it is a seed.

The resin composition of the present embodiment preferably contains a phenol compound within a range that does not impair the effects of the present invention. When the resin composition of the present embodiment contains a phenol compound, the content thereof is preferably 0.1 parts by mass or more, and 50 parts by mass based on 100 parts by mass of resin solids in the resin composition. It is preferable that it is below.
The resin composition in this embodiment may contain only one type of phenol compound, or may contain two or more types of phenol compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also have a structure that does not substantially contain a phenol compound. "Substantially free" means that the content of the phenol compound is less than 0.1 parts by mass based on 100 parts by mass of resin solids in the resin composition.

（式（ＡＮ－１）中、Ｒ₁は、各々独立して、水素原子、または、炭素数１～６のアルキル基を示し、Ｒ₂は、炭素数１～６のアルキレン基、フェニレン基、ビフェニレン基、ナフチレン基、式（ＡＮ－２）で表される基、または、式（ＡＮ－３）で表される基を示す。）

（式（ＡＮ－２）中、Ｒ₃は、メチレン基、イソプロピリデン基、－Ｃ（＝Ｏ）－、－Ｏ－、－Ｓ－、または、－Ｓ（＝Ｏ）₂－を示す。）

（式（ＡＮ－３）中、Ｒ₄は、各々独立して、炭素数１～４のアルキレン基、または、炭素数５～８のシクロアルキレン基を示す。） <<Alkenyl-substituted nadimide compound>>
The alkenyl-substituted nadimide compound is not particularly limited as long as it is a compound having one or more alkenyl-substituted nadimide groups in the molecule. Among these, the compound represented by formula (AN-1) is preferred. By using such an alkenyl-substituted nadimide compound, the coefficient of thermal expansion of the resulting cured product tends to be lowered, and the heat resistance tends to be further improved.

(In formula (AN-1), R ₁ each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R ₂ represents an alkylene group having 1 to 6 carbon atoms, a phenylene group, Indicates a biphenylene group, a naphthylene group, a group represented by formula (AN-2), or a group represented by formula (AN-3).)

(In formula (AN-2), R ₃ represents a methylene group, an isopropylidene group, -C(=O)-, -O-, -S-, or -S(=O) ₂ -.)

(In formula (AN-3), each R ₄ independently represents an alkylene group having 1 to 4 carbon atoms or a cycloalkylene group having 5 to 8 carbon atoms.)

Among the compounds represented by formula (AN-1), compounds represented by formula (AN-4) and compounds represented by (AN-5) are preferred. By using such an alkenyl-substituted nadimide compound, the coefficient of thermal expansion of the resulting cured product tends to be lowered, and the heat resistance tends to be further improved.

In addition, commercially available alkenyl-substituted nadimide compounds can also be used. Commercially available products include, but are not limited to, BANI-M (manufactured by Maruzen Petrochemical Co., Ltd., a compound represented by formula (AN-4)), BANI-X (manufactured by Maruzen Petrochemical Co., Ltd.) and the compound represented by the formula (AN-5).

The resin composition of the present embodiment preferably contains an alkenyl-substituted nadimide compound within a range that does not impair the effects of the present invention. When the resin composition of the present embodiment contains an alkenyl-substituted nadimide compound, the content is preferably 0.1 parts by mass or more, and 50 parts by mass or more, based on 100 parts by mass of resin solids in the resin composition. It is preferably less than parts by mass.
The resin composition in this embodiment may contain only one type of alkenyl-substituted nadimide compound, or may contain two or more types of alkenyl-substituted nadimide compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also be configured to be substantially free of alkenyl-substituted nadimide compounds. "Substantially free" means that the content of the alkenyl-substituted nadimide compound is less than 0.1 part by mass based on 100 parts by mass of resin solid content in the resin composition.

<<Oxetane resin>>
The resin composition of this embodiment may contain oxetane resin.
The oxetane resin is particularly a compound having one or more oxetanyl groups (preferably 2 to 12, more preferably 2 to 6, even more preferably 2 to 4, even more preferably 2 or 3, even more preferably 2). There are no limitations, and a wide variety of compounds commonly used in the field of printed wiring boards can be used.
Examples of the oxetane resin include oxetane, alkyloxetane (for example, 2-methyloxetane, 2,2-dimethyloxetane, 3-methyloxetane, 3,3-dimethyloxetane, etc.), 3-methyl-3-methoxymethyloxetane, 3,3-di(trifluoromethyl)oxetane, 2-chloromethyloxetane, 3,3-bis(chloromethyl)oxetane, biphenyl-type oxetane, OXT-101 (manufactured by Toagosei Co., Ltd.), OXT-121 (manufactured by Toagosei Co., Ltd.) ), etc.

The resin composition of this embodiment preferably contains an oxetane resin within a range that does not impair the effects of the present invention. When the resin composition of the present embodiment contains an oxetane resin, the content thereof is preferably 0.1 parts by mass or more, and 1 part by mass or more based on 100 parts by mass of resin solids in the resin composition. More preferably, the amount is 2 parts by mass or more. When the content of the oxetane resin is 0.1 parts by mass or more, the peel strength and toughness of the metal foil tend to improve. When the resin composition of this embodiment contains an oxetane resin, the upper limit of the content of oxetane resin is preferably 50 parts by mass or less, and 30 parts by mass or less, based on 100 parts by mass of resin solid content in the resin composition. It is more preferably at most 20 parts by mass, even more preferably at most 10 parts by mass, even more preferably at most 8 parts by mass. When the content of the oxetane resin is 50 parts by mass or less, the electrical properties of the resulting cured product tend to improve.
The resin composition in this embodiment may contain only one type of oxetane resin, or may contain two or more types of oxetane resin. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also be configured not to substantially contain oxetane resin. "Substantially free" means that the content of oxetane resin is less than 0.1 part by mass based on 100 parts by mass of resin solid content in the resin composition.

<<Benzoxazine compound>>
The resin composition of this embodiment may contain a benzoxazine compound.
The benzoxazine compound includes 2 or more (preferably 2 to 12, more preferably 2 to 6, even more preferably 2 to 4, even more preferably 2 or 3, even more preferably 2) dihydrobenzoxazines in one molecule. Any compound having a ring is not particularly limited, and a wide range of compounds commonly used in the field of printed wiring boards can be used.
Examples of benzoxazine compounds include bisphenol A-type benzoxazine BA-BXZ (manufactured by Konishi Chemical Co., Ltd.), bisphenol F-type benzoxazine BF-BXZ (manufactured by Konishi Chemical Co., Ltd.), and bisphenol S-type benzoxazine BS-BXZ (manufactured by Konishi Chemical Co., Ltd.). ), etc.

The resin composition of the present embodiment preferably contains a benzoxazine compound within a range that does not impair the effects of the present invention. When the resin composition of the present embodiment contains a benzoxazine compound, the content thereof is preferably 0.1 parts by mass or more and 50 parts by mass or less based on 100 parts by mass of resin solids in the resin composition. It is preferable that
The resin composition in this embodiment may contain only one type of benzoxazine compound, or may contain two or more types of benzoxazine compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also have a structure that does not substantially contain a benzoxazine compound. "Substantially free" means that the content of the benzoxazine compound is less than 0.1 parts by mass based on 100 parts by mass of resin solid content in the resin composition.

When the resin composition of the present embodiment contains a thermosetting compound (C), its content (total amount) is preferably 3 parts by mass or more, and 5 parts by mass or more based on 100 parts by mass of the resin solid content. It is more preferably 10 parts by mass or more, even more preferably 20 parts by mass or more, even more preferably 25 parts by mass or more, and even more preferably 30 parts by mass or more. More preferred. By setting it above the lower limit, heat resistance, plating adhesion, low thermal expansion, etc. tend to be further improved. Further, the upper limit of the content of the thermosetting compound (C) is preferably 95 parts by mass or less, more preferably 85 parts by mass or less, and 75 parts by mass, based on 100 parts by mass of the resin solid content. It is more preferably at most 65 parts by mass, even more preferably at most 50 parts by mass. By setting it below the upper limit value, low dielectric properties and low water absorption tend to be further improved.
The resin composition of this embodiment may contain only one type of thermosetting compound (C), or may contain two or more types. When two or more types are included, it is preferable that the total amount falls within the above range.

<Filler (D)>
It is preferable that the resin composition of this embodiment contains a filler (D). By including the filler (D), physical properties such as dielectric properties (low dielectric constant, low dielectric loss tangent, etc.), flame resistance, and low thermal expansion of the resin composition and its cured product can be further improved.
Moreover, it is more preferable that the filler (D) used in this embodiment has excellent low dielectric properties. For example, the filler (D) used in this embodiment preferably has a dielectric constant (Dk) of 8.0 or less, more preferably 6.0 or less, as measured according to the cavity resonator perturbation method, More preferably, it is 4.0 or less. Moreover, the lower limit of the relative permittivity is practically, for example, 2.0 or more. Furthermore, the filler (D) used in this embodiment preferably has a dielectric loss tangent (Df) of 0.05 or less, more preferably 0.01 or less, as measured according to the cavity resonator perturbation method. Further, the lower limit value of the dielectric loss tangent is practically, for example, 0.0001 or more.

The type of filler (D) used in this embodiment is not particularly limited, and those commonly used in the industry can be suitably used. Specifically, silicas such as natural silica, fused silica, synthetic silica, amorphous silica, Aerosil, and hollow silica, metal oxides such as alumina, white carbon, titanium white, titanium oxide, zinc oxide, magnesium oxide, and zirconium oxide. , complex oxides such as zinc borate, zinc stannate, forsterite, barium titanate, strontium titanate, calcium titanate, nitrides such as boron nitride, agglomerated boron nitride, silicon nitride, aluminum nitride, aluminum hydroxide, Heat-treated aluminum hydroxide products (aluminum hydroxide heat-treated to reduce some of the crystal water), metal hydroxides (including hydrates) such as boehmite and magnesium hydroxide, molybdenum oxide and molybdic acid Molybdenum compounds such as zinc, barium sulfate, clay, kaolin, talc, calcined clay, calcined kaolin, calcined talc, mica, E-glass, A-glass, NE-glass, C-glass, L-glass, D-glass, Inorganic fillers such as S-glass, M-glass G20, short glass fibers (including fine glass powders such as E glass, T glass, D glass, S glass, and Q glass), hollow glass, and spherical glass. Other examples include organic fillers such as styrene-type, butadiene-type, acrylic-type rubber powders, core-shell type rubber powders, silicone resin powders, silicone rubber powders, and silicone composite powders.
In this embodiment, inorganic fillers are preferred and are selected from the group consisting of silica, aluminum hydroxide, aluminum nitride, boron nitride, forsterite, titanium oxide, barium titanate, strontium titanate, and calcium titanate. It is more preferable to include one or more types, and from the viewpoint of low dielectric properties, it is more preferable to include one or more types selected from the group consisting of silica and aluminum hydroxide, and it is even more preferable to include silica. . By using these inorganic fillers, properties such as heat resistance, dielectric properties, thermal expansion properties, dimensional stability, and flame retardance of the cured product of the resin composition are further improved.

The content of the filler (D) in the resin composition of the present embodiment can be appropriately set depending on the desired characteristics, and is not particularly limited, but the content is based on 100 parts by mass of the resin solid content in the resin composition. It is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, even more preferably 40 parts by mass or more, even more preferably 60 parts by mass or more, and 80 parts by mass or more. is even more preferable. By setting it to the above lower limit or more, low thermal expansion property and low dielectric loss tangent property tend to be further improved. Further, the upper limit of the content of the filler (D) is preferably 500 parts by mass or less, more preferably 300 parts by mass or less, and 200 parts by mass or less based on 100 parts by mass of the resin solid content. It is more preferable that the amount is at most 150 parts by mass, even more preferably at most 120 parts by mass. By setting it below the upper limit value, moldability tends to be further improved.
In the resin composition of the present embodiment, as an example of a preferred embodiment, the content of the filler (D) is 30% by mass to 80% by mass of the components excluding the solvent.
The resin composition of this embodiment may contain only one type of filler (D), or may contain two or more types of filler (D). When two or more types are included, it is preferable that the total amount falls within the above range.

In the resin composition of this embodiment, when using a filler (D), especially an inorganic filler, it may further contain a silane coupling agent. By including a silane coupling agent, the dispersibility of the filler (D) and the adhesive strength between the resin component and the filler (D) and the substrate described below tend to be further improved.
Silane coupling agents are not particularly limited, and include silane coupling agents that are generally used for surface treatment of inorganic materials, such as aminosilane compounds (for example, γ-aminopropyltriethoxysilane, N-β-(aminoethyl) -γ-aminopropyltrimethoxysilane, etc.), epoxysilane compounds (e.g., γ-glycidoxypropyltrimethoxysilane, etc.), vinylsilane compounds (e.g., vinyltrimethoxysilane, etc.), styrylsilane compounds, acrylic silane type compounds (e.g., γ-acryloxypropyltrimethoxysilane, etc.), cationic silane type compounds (e.g., N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane hydrochloride, etc.), phenyl Examples include silane compounds. The silane coupling agents may be used alone or in combination of two or more.
The content of the silane coupling agent is not particularly limited, but may be 0.1 to 5.0 parts by weight based on 100 parts by weight of the resin solid content.

<Elastomer>
The resin composition of this embodiment may contain an elastomer.
In this embodiment, the elastomer is not particularly limited, and includes, for example, polyisoprene, polybutadiene, styrene butadiene, butyl rubber, ethylene propylene rubber, styrene butadiene ethylene, styrene butadiene styrene, styrene isoprene styrene, styrene ethylene butylene styrene, styrene propylene styrene. , styrene ethylene propylene styrene, fluororubber, silicone rubber, hydrogenated compounds thereof, alkyl compounds thereof, and copolymers thereof.
Moreover, although it may be a thermoplastic elastomer or a thermosetting elastomer, a thermoplastic elastomer is preferable.

The number average molecular weight of the elastomer used in this embodiment is preferably 50,000 or more. By setting the number average molecular weight to 50,000 or more, the resulting cured product tends to have better low dielectric properties. The number average molecular weight is preferably 60,000 or more, more preferably 70,000 or more, and even more preferably 80,000 or more. The upper limit of the number average molecular weight of the thermal elastomer is preferably 400,000 or less, more preferably 350,000 or less, and even more preferably 300,000 or less. By setting it below the above upper limit, the solubility of the elastomer component in the resin composition tends to improve.
When the resin composition of this embodiment contains two or more types of elastomers, it is preferable that the number average molecular weight of the mixture satisfies the above range.

In this embodiment, the elastomer is preferably a thermoplastic elastomer (hereinafter referred to as "thermoplastic elastomer (E)") containing a styrene monomer unit and a conjugated diene monomer unit. By using such a thermoplastic elastomer (E), the obtained cured product has better low dielectric properties.

The thermoplastic elastomer (E) contains styrene monomer units. By including the styrene monomer unit, the solubility of the thermoplastic elastomer (E) in the resin composition is improved. Styrene monomers include styrene, α-methylstyrene, p-methylstyrene, divinylbenzene (vinylstyrene), N,N-dimethyl-p-aminoethylstyrene, N,N-diethyl-p-aminoethylstyrene, etc. Among these, from the viewpoint of availability and productivity, one or more selected from the group consisting of styrene, α-methylstyrene, and p-methylstyrene are preferred. Among these, styrene is particularly preferred.
The content of styrene monomer units in the thermoplastic elastomer (E) is preferably in the range of 10 to 50% by mass, more preferably in the range of 13 to 45% by mass, and more preferably in the range of 15 to 40% by mass. The range is more preferred. If the content of styrene monomer units is 50% by mass or less, the adhesiveness and tackiness to the substrate etc. will be better. Further, if it is 10% by mass or more, it is preferable because it is possible to suppress the increase in adhesion, it is difficult to form adhesive residue or stop marks, and the easy peelability between the adhesive surfaces tends to be good.
The thermoplastic elastomer (E) may contain only one type of styrene monomer unit, or may contain two or more types of styrene monomer units. When two or more types are included, it is preferable that the total amount is within the above range.
In addition, for the method of measuring the content of styrene monomer units in the thermoplastic elastomer (E), the description in International Publication No. 2017/126469 can be referred to, and the content thereof is incorporated herein. The same applies to the conjugated diene monomer unit, etc., which will be described later.

The thermoplastic elastomer (E) contains conjugated diene monomer units. By including the conjugated diene monomer unit, the solubility of the thermoplastic elastomer (E) in the resin composition is improved. The conjugated diene monomer is not particularly limited as long as it is a diolefin having one pair of conjugated double bonds. Conjugated diene monomers include, for example, 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 2-methyl- Examples include 1,3-pentadiene, 1,3-hexadiene, and farnesene, with 1,3-butadiene and/or isoprene being preferred, and 1,3-butadiene being more preferred.
The thermoplastic elastomer (E) may contain only one type of conjugated diene monomer unit, or may contain two or more types.

In the thermoplastic elastomer (E), the mass ratio of styrene monomer units and conjugated diene monomer units is in the range of styrene monomer units/conjugated diene monomer units = 5/95 to 80/20. It is preferably in the range of 7/93 to 77/23, even more preferably in the range of 10/90 to 70/30. If the mass ratio of the styrene monomer unit to the conjugated diene monomer unit is in the range of 5/95 to 80/20, the increase in adhesion can be suppressed and the adhesive force can be maintained high, and the adhesive surfaces can be easily peeled from each other. becomes good.

In the thermoplastic elastomer (E), all or some of the conjugated diene bonds of the thermoplastic elastomer may be hydrogenated, or may not be hydrogenated.

The thermoplastic elastomer (E) may or may not contain other monomer units in addition to the styrene monomer unit and the conjugated diene monomer unit. Examples of other monomer units include aromatic vinyl compound units other than styrene monomer units.
In the thermoplastic elastomer (E), the total of styrene monomer units and conjugated diene monomer units is preferably 90% by mass or more, more preferably 95% by mass or more of the total monomer units, It is more preferably 97% by mass or more, even more preferably 99% by mass or more.
The thermoplastic elastomer (E) may contain only one type of styrene monomer unit and conjugated diene monomer unit, or may contain two or more types of each. When two or more types are included, it is preferable that the total amount falls within the above range.

The thermoplastic elastomer (E) may be a block polymer or a random polymer. In addition, even if it is a hydrogenated elastomer in which the conjugated diene monomer unit is hydrogenated, an unhydrogenated elastomer in which the conjugated diene monomer unit is not hydrogenated, or a partially hydrogenated elastomer in which the conjugated diene monomer unit is partially hydrogenated, good.
In one embodiment of the present embodiment, the thermoplastic elastomer (E) is a hydrogenated elastomer. Here, the hydrogenated elastomer means, for example, a thermoplastic elastomer in which the double bond based on the conjugated diene monomer unit is hydrogenated, and the hydrogenation rate (hydrogenation rate) is 100%. In addition, the purpose is to include 80% or more. The hydrogenation rate in the hydrogenated elastomer is preferably 85% or more, more preferably 90% or more, and even more preferably 95% or more. In this embodiment, the hydrogenation rate is calculated from the measurement results of ¹ H-NMR spectrum measurement.
In one embodiment of the present embodiment, the thermoplastic elastomer (E) is an unhydrogenated elastomer. Here, unhydrogenated elastomer refers to the proportion of double bonds based on conjugated diene monomer units in the elastomer that are hydrogenated, that is, the hydrogenation rate (hydrogenation rate) is 20% or less. The purpose is to include things. The hydrogenation rate in the unhydrogenated elastomer is preferably 15% or less, more preferably 10% or less, even more preferably 5% or less.
On the other hand, a partially hydrogenated elastomer refers to a thermoplastic elastomer in which a portion of the double bonds based on conjugated diene monomer units are hydrogenated, and the hydrogenation rate (hydrogenation rate) is usually 80%. % or more than 20%.

Commercially available thermoplastic elastomers (E) used in this embodiment include SEPTON (registered trademark) 2104 manufactured by Kuraray Co., Ltd. and SEPTON (registered trademark) 2104 manufactured by Asahi Kasei Corporation. O. E. (registered trademark) S1606, S1613, S1609, S1605, manufactured by JSR Corporation, DYNARON (registered trademark) 9901P, TR2250, and the like.

When the resin composition of the present embodiment contains an elastomer (preferably a thermoplastic elastomer (E)), the content thereof is preferably 1 part by mass or more, and 5 parts by mass based on 100 parts by mass of the resin solid content. It is more preferably at least 1 part by mass, even more preferably at least 10 parts by mass, even more preferably at least 15 parts by mass, and even more preferably at least 20 parts by mass. By setting it to the above lower limit or more, the low dielectric properties tend to be further improved. Further, the upper limit value of the content of the elastomer is preferably 45 parts by mass or less, more preferably 40 parts by mass or less, and preferably 35 parts by mass or less, based on 100 parts by mass of the resin solid content. It is more preferably 32 parts by mass or less, even more preferably 28 parts by mass or less. By setting it below the upper limit value, heat resistance tends to be further improved.
The resin composition of this embodiment may contain only one type of elastomer, or may contain two or more types of elastomer. When two or more types are included, it is preferable that the total amount falls within the above range.

<Active ester compound>
The resin composition of this embodiment may contain an active ester compound.
The active ester compound is not particularly limited, and for example, 2 or more (preferably 2 to 12, more preferably 2 to 6, still more preferably 2 to 4, even more preferably 2 or 3, even more preferably 2 to 3) per molecule. Examples of 2) include compounds having an active ester group.
The active ester compound may be a linear or branched or cyclic compound. Among these, active ester compounds obtained by reacting a carboxylic acid compound and/or a thiocarboxylic acid compound with a hydroxy compound and/or a thiol compound are preferred, from the viewpoint of further improving the heat resistance of the obtained cured product. An active ester compound obtained by reacting a carboxylic acid compound with one or more compounds selected from the group consisting of a phenol compound, a naphthol compound, and a thiol compound is more preferable, and has a carboxylic acid compound and a phenolic hydroxyl group. An aromatic compound obtained by reacting with an aromatic compound and having two or more active ester groups in one molecule is more preferable, and a compound having two or more carboxylic acids in one molecule and a phenolic hydroxyl group. Particularly preferred are aromatic compounds obtained by reacting with aromatic compounds and having two or more active ester groups in one molecule.
Examples of the above carboxylic acid compounds include one or more selected from the group consisting of benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Among them, from the viewpoint of further improving the heat resistance of the obtained cured product, one or more selected from the group consisting of succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, and terephthalic acid is preferable, and isophthalic acid and More preferably, one or more types selected from the group consisting of terephthalic acid.
Examples of the above thiocarboxylic acid compound include one or more selected from thioacetic acid and thiobenzoic acid.
The above phenolic compounds or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalin, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m- Cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, One or more selected from the group consisting of benzenetriol, dicyclopentadienyl diphenol, and phenol novolak, and from the viewpoint of further improving the heat resistance and solvent solubility of the resulting cured product, bisphenol A, bisphenol F, bisphenol S, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene , dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadienyl diphenol, and phenol novolac are preferred, and catechol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6- More preferably, one or more selected from the group consisting of dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadienyl diphenol, and phenol novolak, 1,5-dihydroxynaphthalene, More preferably, one or more selected from the group consisting of 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, dicyclopentadienyl diphenol, and phenol novolak, and dihydroxy One or more selected from the group consisting of benzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, dicyclopentadienyl diphenol, and phenol novolak (preferably selected from the group consisting of dicyclopentadienyl diphenol and phenol novolac) One or more types, more preferably dicyclopentadienyl diphenol) are particularly preferred.
Examples of the above-mentioned thiol compounds include one or more selected from the group consisting of benzenedithiol and triazinedithiol.
In addition, from the viewpoint of further improving the compatibility with the epoxy compound, the active ester compound is preferably a compound having two or more carboxylic acids in one molecule and containing an aliphatic chain, which further improves heat resistance. From the viewpoint of improvement, a compound having an aromatic ring is preferable. More specific active ester compounds include those described in JP-A No. 2004-277460.

The active ester compound may be a commercially available product or may be prepared by a known method. Commercially available products include compounds containing a dicyclopentadienyldiphenol structure (for example, EXB9451, EXB9460, EXB9460S, HPC-8000-65T (all manufactured by DIC), etc.), acetylated products of phenol novolac (for example, DC808 ( (manufactured by Mitsubishi Chemical Corporation)), and benzoylated products of phenol novolacs (for example, YLH1026, YLH1030, YLH1048 (all manufactured by Mitsubishi Chemical Corporation)), which improve the storage stability of varnishes, and when the resin composition is cured (cured EXB9460S is preferred from the viewpoint of further improving the low thermal expansion property of the product.

The active ester compound can be prepared by a known method, for example, by a condensation reaction between a carboxylic acid compound and a hydroxy compound. As a specific example, (a) a carboxylic acid compound or its halide, (b) a hydroxy compound, and (c) an aromatic monohydroxy compound, per mole of the carboxy group or acid halide group of (a), (b) (c) in a ratio of 0.05 to 0.75 mole of phenolic hydroxyl group and 0.25 to 0.95 mole of (c).

The active ester compound is preferably included within a range that does not impair the effects of the present invention. When the resin composition of this embodiment contains an active ester compound, it is preferably 1 part by mass or more, and preferably 90 parts by mass or less, based on 100 parts by mass of resin solid content in the resin composition. .
The resin composition in this embodiment may contain only one type of active ester compound, or may contain two or more types of active ester compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also be configured to substantially not contain an active ester compound. "Substantially free" means that the content of the active ester compound is less than 1 part by mass, preferably less than 0.1 part by mass, per 100 parts by mass of resin solids in the resin composition. More preferably, it is less than 0.01 part by mass.

<Flame retardant>
The resin composition of this embodiment may contain a flame retardant. Examples of the flame retardant include phosphorus-based flame retardants, halogen-based flame retardants, inorganic flame retardants, and silicone-based flame retardants, with phosphorus-based flame retardants being preferred.
As the flame retardant, known ones can be used, such as brominated epoxy resin, brominated polycarbonate, brominated polystyrene, brominated styrene, brominated phthalimide, tetrabromobisphenol A, pentabromobenzyl (meth)acrylate, pentabromo Halogenated flame retardants such as toluene, tribromophenol, hexabromobenzene, decabromodiphenyl ether, bis-1,2-pentabromophenylethane, chlorinated polystyrene, chlorinated paraffin, red phosphorus, tricresyl phosphate, triphenyl phosphate , cresyl diphenyl phosphate, trixylenyl phosphate, trialkyl phosphate, dialkyl phosphate, tris(chloroethyl) phosphate, phosphazene, 1,3-phenylenebis(2,6-dixylenyl phosphate), 10-(2,5- Phosphorous flame retardants such as dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, inorganic types such as aluminum hydroxide, magnesium hydroxide, partial boehmite, boehmite, zinc borate, and antimony trioxide. Examples include flame retardants, silicone-based flame retardants such as silicone rubber, and silicone resin.
In the present embodiment, among these, 1,3-phenylenebis(2,6-dixylenyl phosphate) is preferred because it does not impair low dielectric properties.

When the resin composition of the present embodiment contains a flame retardant, the content thereof is preferably 1 part by mass or more, and preferably 5 parts by mass or more, based on 100 parts by mass of resin solids in the resin composition. is more preferable. Further, the lower limit of the content of the flame retardant is preferably 25 parts by mass or less, more preferably 20 parts by mass or less.
One kind of flame retardant can be used alone or two or more kinds can be used in combination. When two or more types are used, the total amount falls within the above range.

<Dispersant>
The resin composition of this embodiment may contain a dispersant. As the dispersant, those commonly used for paints can be suitably used, and the type thereof is not particularly limited. As the dispersant, preferably a copolymer-based wetting and dispersing agent is used, and specific examples thereof include DISPERBYK®-110, 111, 161, 180, 2009, and 2152 manufactured by BYK Chemie Japan Co., Ltd. , 2155, BYK (registered trademark)-W996, W9010, W903, W940, etc.

When the resin composition of the present embodiment contains a dispersant, the lower limit of its content is preferably 0.01 parts by mass or more, and 0.01 parts by mass or more, based on 100 parts by mass of resin solids in the resin composition. It is more preferably 1 part by mass or more, and may be 0.3 parts by mass or more. Further, the upper limit of the content of the dispersant is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and 3 parts by mass, based on 100 parts by mass of the resin solid content in the resin composition. It is more preferable that the amount is less than 1 part.
One type of dispersant can be used alone or two or more types can be used in combination. When two or more types are used, the total amount falls within the above range.

<Curing accelerator>
The resin composition of this embodiment may further contain a curing accelerator. Examples of the curing accelerator include, but are not limited to, imidazoles such as 2-ethyl-4-methylimidazole and triphenylimidazole; benzoyl peroxide, lauroyl peroxide, acetyl peroxide, parachlorobenzoyl peroxide, di- Organic peroxides such as tert-butyl-di-perphthalate; azo compounds such as azobisisobutyronitrile; N,N-dimethylbenzylamine, N,N-dimethylaniline, N,N-dimethyltoluidine, 2- Tertiary amines such as N-ethylanilinoethanol, tri-n-butylamine, pyridine, quinoline, N-methylmorpholine, triethanolamine, triethylenediamine, tetramethylbutanediamine, N-methylpiperidine; phenol, xylenol, Phenols such as cresol, resorcin, and catechol; lead naphthenate, lead stearate, zinc naphthenate, zinc octylate, manganese octylate, tin oleate, dibutyltin malate, manganese naphthenate, cobalt naphthenate, iron acetylacetonate, etc. Organic metal salts; these organic metal salts dissolved in hydroxyl group-containing compounds such as phenol and bisphenol; inorganic metal salts such as tin chloride, zinc chloride, and aluminum chloride; dioctyltin oxide, other alkyltin oxides, and alkyltin oxides Examples include organic tin compounds such as.
Preferred curing accelerators are imidazoles and organometallic salts, and it is more preferred to use both imidazoles and organometallic salts in combination.
The resin composition of the present embodiment can be configured to be substantially free of organic peroxides (eg, organic peroxides with a molecular weight of 30 to 500). "Substantially free" means that the amount is less than 0.1 parts by mass, and preferably 0.01 parts by mass or less, based on 100 parts by mass of resin solids contained in the resin composition of the present embodiment. . By setting it within such a range, a cured product with more excellent various performances can be obtained.
The resin composition of the present embodiment can be configured to be substantially free of an azo compound (for example, an azo compound having a molecular weight of 30 to 500). "Substantially free" means that the amount is less than 0.1 parts by mass, and preferably 0.01 parts by mass or less, based on 100 parts by mass of resin solids contained in the resin composition of the present embodiment. . By setting it within such a range, a cured product with more excellent various performances can be obtained.

When the resin composition of the present embodiment contains a curing accelerator, the lower limit of its content is preferably 0.005 parts by mass or more, based on 100 parts by mass of resin solids in the resin composition, and 0. It is more preferably .01 part by mass or more, and even more preferably 0.1 part by mass or more. Further, the upper limit of the content of the curing accelerator is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, based on 100 parts by mass of resin solids in the resin composition. It is more preferably less than parts by mass.
The curing accelerator can be used alone or in combination of two or more. When two or more types are used, the total amount falls within the above range.

<Solvent>
The resin composition of this embodiment may contain a solvent, and preferably contains an organic solvent. When containing a solvent, the resin composition of the present embodiment is in a form (solution or varnish) in which at least a portion, preferably all, of the various resin solid components described above are dissolved or compatible with the solvent. The solvent is not particularly limited as long as it is a polar organic solvent or a non-polar organic solvent that can dissolve or be compatible with at least a portion, preferably all, of the various resin solids mentioned above. Examples of the polar organic solvent include ketones, etc. (e.g., acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.), cellosolves (e.g., propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, etc.), esters (e.g., ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, acetic acid) isoamyl, ethyl lactate, methyl methoxypropionate, methyl hydroxyisobutyrate, etc.), amides (e.g., dimethoxyacetamide, dimethylformamide, etc.), and nonpolar organic solvents include aromatic hydrocarbons (e.g., toluene, xylene, etc.).
One kind of solvent can be used alone or two or more kinds can be used in combination. When two or more types are used, the total amount falls within the above range.

<Other ingredients>
The resin composition of the present embodiment may contain, in addition to the above-mentioned components, various polymeric compounds such as thermoplastic resins and oligomers thereof, and various additives. Additives include ultraviolet absorbers, antioxidants, photopolymerization initiators, optical brighteners, photosensitizers, dyes, pigments, thickeners, fluidity regulators, lubricants, antifoaming agents, leveling agents, and gloss. agents, polymerization inhibitors, etc. These additives can be used alone or in combination of two or more.
The resin composition of this embodiment can also be configured to substantially not contain a polymerization initiator. "Substantially free" means that the content of the polymerization initiator is less than 0.1 parts by mass, based on 100 parts by mass of resin solids contained in the resin composition of this embodiment, and 0.01 parts by mass. It is preferable that the amount is less than 1 part. By setting it within such a range, a cured product with more excellent various performances can be obtained.

<Application>
The resin composition of this embodiment is used as a cured product. Specifically, the resin composition of this embodiment is suitable as a low dielectric constant material and/or a low dielectric loss tangent material as a resin composition for electronic materials such as insulating layers of printed wiring boards, materials for semiconductor packages, etc. Can be used. The resin composition of this embodiment can be suitably used as a material for prepreg, a metal foil-clad laminate using prepreg, a resin composite sheet, and a printed wiring board.

The resin composition of this embodiment preferably has a low dielectric constant (Dk) when molded into a cured plate with a thickness of 0.8 mm. Specifically, the dielectric constant (Dk) of the cured plate at 10 GHz measured according to the cavity resonator perturbation method is preferably 2.50 or less, more preferably 2.45 or less. Although the lower limit of the dielectric constant (Dk) is not particularly determined, for example, 0.01 or more is practical.
Moreover, it is preferable that the resin composition of this embodiment has a low dielectric loss tangent (Df) when molded into a cured plate with a thickness of 0.8 mm. Specifically, the dielectric loss tangent (Df) at 10 GHz measured according to the cavity resonator perturbation method is preferably 0.0020 or less, more preferably 0.0018 or less. Although the lower limit value of the dielectric loss tangent (Df) is not particularly determined, for example, 0.0001 or more is practical.
More specifically, the dielectric constant (Dk) and dielectric loss tangent (Df) of the cured plate are measured by the method described in the Examples described below.

The resin composition of the present embodiment is used as a layered material (including film-like, sheet-like, etc.) such as prepreg and resin composite sheet, which becomes an insulating layer of a printed wiring board. In this case, the thickness is preferably 5 μm or more, more preferably 10 μm or more. The upper limit of the thickness is preferably 200 μm or less, more preferably 180 μm or less. Incidentally, the thickness of the above-mentioned layered material means the thickness including the glass cloth, for example, when the resin composition of the present embodiment is impregnated into a glass cloth or the like.
The material formed from the resin composition of this embodiment may be used for forming a pattern by exposure and development, or may be used for applications that are not exposed and developed. It is particularly suitable for applications that do not involve exposure and development.

<<Prepreg>>
The prepreg of this embodiment is formed from a base material (prepreg base material) and the resin composition of this embodiment. The prepreg of the present embodiment can be produced by, for example, applying the resin composition of the present embodiment to a base material (for example, impregnating and/or coating it), and then heating it (for example, drying it at 120 to 220°C for 2 to 15 minutes). etc.) by semi-curing. In this case, the amount of the resin composition adhered to the base material, that is, the amount of the resin composition (including filler (D)) relative to the total amount of prepreg after semi-curing, is preferably in the range of 20 to 99% by mass, and 20% by mass. More preferably, the content is in the range of 80% by mass.

The base material is not particularly limited as long as it is a base material used for various printed wiring board materials. Examples of the material of the base material include glass fiber (e.g., E-glass, D-glass, L-glass, S-glass, T-glass, Q-glass, UN-glass, NE-glass, spherical glass, etc.) , inorganic fibers other than glass (eg, quartz, etc.), and organic fibers (eg, polyimide, polyamide, polyester, liquid crystal polyester, polytetrafluoroethylene, etc.). The form of the base material is not particularly limited, and examples thereof include woven fabric, nonwoven fabric, roving, chopped strand mat, surfacing mat, and the like. These base materials may be used alone or in combination of two or more. Among these base materials, from the viewpoint of dimensional stability, woven fabrics subjected to ultra-opening treatment and packing treatment are preferable, and from the viewpoints of strength and low water absorption, the base material has a thickness of 200 μm or less, a mass of 250 g/ A glass woven fabric having a size of m ² or less is preferable, and from the viewpoint of moisture absorption and heat resistance, a glass woven fabric surface-treated with a silane coupling agent such as epoxysilane or aminosilane is preferable. From the viewpoint of electrical properties, a low dielectric glass cloth made of glass fibers exhibiting a low dielectric constant and a low dielectric loss tangent, such as L-glass, NE-glass, and Q-glass, is more preferable.
Examples of the base material having a low dielectric constant include a base material having a dielectric constant of 5.0 or less (preferably 3.0 to 4.9). Examples of the low dielectric loss tangent base material include base materials with a dielectric loss tangent of 0.006 or less (preferably 0.001 to 0.005). The relative dielectric constant and dielectric loss tangent are values measured at 10 GHz using a perturbation method cavity resonator.

<<Metal foil clad laminate>>
The metal foil-clad laminate of this embodiment includes at least one layer formed from the prepreg of this embodiment, and metal foil disposed on one or both sides of the layer formed from the prepreg. As a method for producing the metal foil-clad laminate of this embodiment, for example, at least one prepreg of this embodiment is arranged (preferably two or more prepregs are stacked), metal foil is arranged on one or both sides of the prepreg, and laminated molding is performed. One method is to do so. More specifically, it can be produced by arranging a metal foil such as copper or aluminum on one or both sides of a prepreg and laminating it. The number of prepreg sheets is preferably 1 to 10 sheets, more preferably 2 to 10 sheets, and even more preferably 2 to 9 sheets. The metal foil is not particularly limited as long as it is used as a material for printed wiring boards, and examples thereof include copper foils such as rolled copper foil and electrolytic copper foil. The thickness of the metal foil (preferably copper foil) is not particularly limited, and may be about 1.5 to 70 μm. Examples of the molding method include methods normally used when molding laminates for printed wiring boards, and more specifically, using a multistage press machine, a multistage vacuum press machine, a continuous molding machine, an autoclave molding machine, etc. Examples include a method of lamination molding at a temperature of about 180 to 350°C, a heating time of about 100 to 300 minutes, and a surface pressure of about 20 to 100 kg/cm ² . Furthermore, a multilayer board can be obtained by laminating and molding a combination of the prepreg of this embodiment and a separately produced wiring board for an inner layer. As a method for manufacturing a multilayer board, for example, copper foil of about 35 μm is placed on both sides of one sheet of prepreg of this embodiment, and after lamination is formed using the above-mentioned forming method, an inner layer circuit is formed, and this circuit is coated with black. After that, the inner layer circuit board and the prepreg of this embodiment are alternately placed one by one, and a copper foil is placed on the outermost layer, and the above conditions are met. A multilayer board can be produced by lamination molding, preferably under vacuum. The metal foil-clad laminate of this embodiment can be suitably used as a printed wiring board.

As described above, the resin composition for electronic materials obtained using the resin composition of the present embodiment (resin composition consisting of a combination of specific components) has dielectric properties (low dielectric loss tangent), moisture absorption, etc. In addition to heat resistance, it can have properties that are excellent in crack resistance, appearance of cured products, and low thermal expansion.

<<Printed wiring board>>
The printed wiring board of the present embodiment is a printed wiring board including an insulating layer and a conductor layer disposed on the surface of the insulating layer, the insulating layer being formed from the resin composition of the present embodiment. and a layer formed from the prepreg of this embodiment. Such a printed wiring board can be manufactured according to a conventional method, and the manufacturing method is not particularly limited. An example of a method for manufacturing a printed wiring board will be shown below. First, a metal foil-clad laminate such as the metal foil-clad laminate described above is prepared. Next, the surface of the metal foil-clad laminate is etched to form an inner layer circuit, thereby producing an inner layer substrate. The surface of the inner layer circuit of this inner layer board is subjected to surface treatment to increase adhesive strength as necessary, and then the required number of sheets of prepreg described above are layered on the surface of the inner layer circuit, and then metal foil for the outer layer circuit is laminated on the outside. Then, heat and press to form an integral mold. In this way, a multilayer laminate is produced in which an insulating layer made of the base material and the cured resin composition is formed between the inner layer circuit and the metal foil for the outer layer circuit. Next, after drilling holes for through holes and via holes in this multilayer laminate, a plating metal film is formed on the wall of the hole to conduct the inner layer circuit and the metal foil for the outer layer circuit, and then the outer layer circuit is formed. A printed wiring board is manufactured by performing an etching process on metal foil to form an outer layer circuit.

The printed wiring board obtained in the above manufacturing example has an insulating layer and a conductor layer formed on the surface of this insulating layer, and the insulating layer is made of the resin composition of the above-mentioned embodiment and/or a cured product thereof. The configuration includes That is, the prepreg of the present embodiment described above (for example, the prepreg formed from the base material and the resin composition of the present embodiment impregnated or applied thereto), the resin composition of the metal foil-clad laminate of the present embodiment described above The layer formed from the material becomes the insulating layer of this embodiment.
The present embodiment also relates to a semiconductor device including the printed wiring board. For details of the semiconductor device, the descriptions in paragraphs 0200 to 0202 of JP-A-2021-021027 can be referred to, and the contents thereof are incorporated into this specification.

<<Resin composite sheet>>
The resin composite sheet of this embodiment includes a support and a layer formed from the resin composition of this embodiment disposed on the surface of the support. The resin composite sheet can be used as a build-up film or a dry film solder resist. The method for producing the resin composite sheet is not particularly limited, but for example, the resin composite sheet may be produced by applying (coating) a solution of the resin composition of the present embodiment described above in a solvent to a support and drying it. There are several ways to obtain it.

Examples of the support used here include polyethylene film, polypropylene film, polycarbonate film, polyethylene terephthalate film, ethylenetetrafluoroethylene copolymer film, and release films in which a release agent is applied to the surface of these films. Examples include organic film base materials such as polyimide film, conductive foils such as copper foil and aluminum foil, plate-like materials such as glass plates, SUS (Steel Use Stainless) plates, and FRP (Fiber-Reinforced Plastics). It is not particularly limited.

Examples of the coating method (coating method) include a method in which a solution of the resin composition of the present embodiment dissolved in a solvent is coated onto the support using a bar coater, die coater, doctor blade, Baker applicator, etc. It will be done. Further, after drying, the support can be peeled off or etched from the resin composite sheet in which the support and the resin composition are laminated, thereby forming a single layer sheet. Note that the support can be used by supplying a solution in which the resin composition of the present embodiment described above is dissolved in a solvent into a mold having a sheet-like cavity and drying it to form it into a sheet. It is also possible to obtain a single layer sheet.

In the production of the single-layer sheet or resin composite sheet of this embodiment, the drying conditions for removing the solvent are not particularly limited, but if the temperature is low, the solvent tends to remain in the resin composition, and if the temperature is high, Since curing of the resin composition progresses, the temperature is preferably 20° C. to 200° C. for 1 to 90 minutes. Further, the single layer sheet or the resin composite sheet can be used in an uncured state where the solvent is simply dried, or it can be used in a semi-cured (B-staged) state if necessary. Further, the thickness of the resin layer in the single-layer sheet or resin composite sheet of this embodiment can be adjusted by the concentration of the solution of the resin composition of this embodiment used for application (coating) and the coating thickness, and there are no particular limitations. However, in general, as the coating thickness increases, solvent tends to remain during drying, so 0.1 to 500 μm is preferable.

The present invention will be explained in more detail with reference to Examples below. The materials, usage amounts, ratios, processing details, processing procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.
If the measuring equipment used in the examples is difficult to obtain due to discontinuation or the like, measurements can be made using other equipment with equivalent performance.

<Synthesis Example 1 Synthesis of naphthol aralkyl cyanate ester compound (SNCN)>
α-Naphthol aralkyl resin (SN495V, OH group equivalent: 236 g/eq., manufactured by Nippon Steel Chemical Co., Ltd.: The number of naphthol aralkyl repeating units is 1 to 5.) 0.47 mol (OH group (converted) was dissolved in 500 mL of chloroform, and 0.7 mol of triethylamine was added to this solution to prepare Solution 1. While maintaining the temperature at -10°C, Solution 1 was added dropwise over 1.5 hours to 300 g of a 0.93 mol cyanogen chloride chloroform solution charged in the reactor, and after the dropwise addition was completed, the mixture was stirred for 30 minutes. Thereafter, a mixed solution of 0.1 mol of triethylamine and 30 g of chloroform was added dropwise into the reactor and stirred for 30 minutes to complete the reaction. After the by-produced triethylamine hydrochloride was filtered out from the reaction solution, the resulting filtrate was washed with 500 mL of 0.1N hydrochloric acid, and then washed with 500 mL of water, which was repeated four times. After drying this with sodium sulfate, it was evaporated at 75°C and further degassed under reduced pressure at 90°C to produce a brown solid naphthol aralkyl cyanate ester compound represented by formula (S1) (R ^C1 in the formula ~R ^C4 are all hydrogen atoms, and n ^c is a mixture of 1 to 5). When the obtained naphthol aralkyl cyanate ester compound was analyzed by infrared absorption spectrum, absorption of the cyanate ester group was confirmed at around 2264 cm ^-1 .

<Synthesis Example 2 Synthesis of modified polyphenylene ether compound>
<<Synthesis of bifunctional phenylene ether oligomer>>
9.36 g (42.1 mmol) of CuBr ₂ and 1.81 g (10 g of N,N'-di-t-butylethylenediamine) were placed in a 12 L vertical reactor equipped with a stirrer, a thermometer, an air inlet tube, and a baffle plate. .5 mmol), n-butyldimethylamine 67.77 g (671.0 mmol), and toluene 2,600 g were stirred at a reaction temperature of 40°C. 3,3',5,5'-hexamethyl-(1,1'-biphenol)-4,4'-diol 129.32 g (0.48 mol), 2,6-dimethylphenol 878.4 g (7.2 mol) A mixed solution of 1.22 g (7.2 mmol) of N,N'-di-t-butylethylenediamine and 26.35 g (260.9 mmol) of n-butyldimethylamine was mixed with nitrogen and air to give an oxygen concentration of 8. A mixed gas adjusted to volume % was added dropwise over 230 minutes while bubbling at a flow rate of 5.2 L/min, followed by stirring. After the dropwise addition was completed, 1,500 g of water in which 48.06 g (126.4 mmol) of tetrasodium ethylenediaminetetraacetate was dissolved was added to stop the reaction. The aqueous layer and the organic layer were separated, and the organic layer was washed with a 1N aqueous hydrochloric acid solution and then with pure water. The obtained solution was concentrated to 50% by mass using an evaporator to obtain 1981 g of a toluene solution of a bifunctional phenylene ether oligomer (resin "A"). Resin "A" had a number average molecular weight in terms of polystyrene determined by GPC of 1975, a weight average molecular weight in terms of polystyrene determined by GPC of 3514, and a hydroxyl equivalent of 990.

<<Synthesis of modified polyphenylene ether compound>>
In a reactor equipped with a stirring device, a thermometer, and a reflux tube, 833.4 g of a toluene solution of resin "A", 76.7 g of vinylbenzyl chloride (manufactured by AGC Seimi Chemical Co., Ltd., "CMS-P"), 1 methylene chloride, 600 g of benzyldimethylamine, 6.2 g of benzyldimethylamine, 199.5 g of pure water, and 83.6 g of a 30.5% by mass NaOH aqueous solution were charged, and the mixture was stirred at a reaction temperature of 40°C. After stirring for 24 hours, the organic layer was washed with a 1N aqueous hydrochloric acid solution and then with pure water. The obtained solution was concentrated using an evaporator, solidified by dropping into methanol, and the solid was collected by filtration and vacuum dried to obtain 450.1 g of a modified polyphenylene ether compound. The modified polyphenylene ether compound had a number average molecular weight in terms of polystyrene determined by GPC of 2250, a weight average molecular weight in terms of polystyrene determined by GPC of 3920, and a vinyl group equivalent of 1189 g/vinyl group.

<<Measurement of weight average molecular weight and number average molecular weight>>
The weight average molecular weight (Mw) and number average molecular weight (Mn) were measured by gel permeation chromatography (GPC). Liquid pump (manufactured by Shimadzu Corporation, LC-20AD), differential refractive index detector (manufactured by Shimadzu Corporation, RID-10A), GPC column (manufactured by Showa Denko Corporation, GPC KF-801, 802, 803, 804) The experiment was carried out using tetrahydrofuran as the solvent, a flow rate of 1.0 ml/min, a column temperature of 40° C., and a calibration curve using monodisperse polystyrene.

<Synthesis Example 3 Synthesis of polymer (va) having a structural unit represented by formula (V)>
2.25 moles (292.9 g) of divinylbenzene, 1.32 moles (172.0 g) of ethylvinylbenzene, 11.43 moles (1190.3 g) of styrene, and 15.0 moles (1532.0 g) of n-propyl acetate. The mixture was placed in a reactor, and 600 mmol of boron trifluoride diethyl ether complex was added at 70°C, followed by reaction for 4 hours. After stopping the polymerization reaction with an aqueous sodium hydrogen carbonate solution, the oil layer was washed three times with pure water and devolatilized under reduced pressure at 60°C to recover a polymer (va) having a structural unit represented by formula (V). did. The obtained polymer (va) having a structural unit represented by formula (V) was weighed, and 860.8 g of a polymer (va) having a structural unit represented by formula (V) was obtained. It was confirmed.

The obtained polymer (va) having a structural unit represented by formula (V) had a number average molecular weight Mn of 2,060, a weight average molecular weight Mw of 30,700, and a monodispersity Mw/Mn of 14.9. there were. By performing ¹³ C-NMR and ¹ H-NMR analysis, it was found that the polymer (va) having the structural unit represented by formula (V) had resonance lines originating from each monomer unit used as a raw material. observed. Based on the NMR measurement results and the GC analysis results, the proportion of each monomer unit (constituent unit derived from each raw material) in the polymer (va) having the structural unit represented by formula (V) is as follows. was calculated.
Structural unit derived from divinylbenzene: 20.9 mol% (24.3 mass%)
Structural unit derived from ethylvinylbenzene: 9.1 mol% (10.7 mass%)
Structural unit derived from styrene: 70.0 mol% (65.0 mass%)
Furthermore, the amount of structural units having residual vinyl groups derived from divinylbenzene was 16.7 mol% (18.5% by mass).

Example 1
30 parts by mass of maleimide compound (ma) having the structure shown below (manufactured by DIC, "NE-X-9470S", compound represented by formula (M1)), maleimide compound (manufactured by Nippon Kayaku Co., Ltd., MIR-3000) -70MT, corresponding to the compound represented by formula (M3)) 1 part by mass, cyanate ester compound (naphthol aralkyl cyanate ester compound (SNCN) obtained in Synthesis Example 1) 1 part by mass, Synthesis Example 2 above 15 parts by mass of the modified polyphenylene ether compound obtained in 15 parts by mass of a phosphorus flame retardant (PX-200, Daihachi Kagaku Kogyo Co., Ltd.), an unhydrogenated styrene thermoplastic elastomer (SBS, TR2250, Mn115000, JSR Corporation) 25 parts by mass of the polymer (VA) having the structural unit represented by formula (V) obtained in Synthesis Example 3, 3 parts by mass of 4-methylstyrene (boiling point 175°C), manganese octylate 0.005 parts by mass, 0.6 parts by mass of TPIZ (2,4,5-triphenylimidazole, catalyst), 0.25 parts by mass of imidazole catalyst (manufactured by Shikoku Kasei Co., Ltd., 2E4MZ (trade name)) (catalyst), A varnish was obtained by dissolving and mixing with methyl ethyl ketone. Note that each amount added above indicates the amount of solid content.

ｎは、１～２０の整数である。 maleimide compound (ma)

n is an integer from 1 to 20.

<Manufacture of a cured plate test piece with a thickness of 0.8 mm>
A mixed resin powder was obtained by evaporating the solvent from the obtained varnish. The mixed resin powder was filled into a mold with a side of 100 mm and a thickness of 0.8 mm, 12 μm copper foil (3EC-M2S-VLP, manufactured by Mitsui Mining & Mining Co., Ltd.) was placed on both sides, and the pressure was 30 kg/cm ² and the temperature was Vacuum pressing was performed at 220° C. for 120 minutes to obtain a cured plate with a side of 100 mm and a thickness of 0.8 mm.
Using the obtained cured plate, the dielectric constant (Dk), dielectric loss tangent (Df), and moisture absorption heat resistance were evaluated. The evaluation results are shown in Table 1.

<Measurement method and evaluation method>
(1) Specific permittivity (Dk) and dielectric loss tangent (Df)
After removing the copper foil of the cured plate by etching and drying it at 120 ° C. for 60 minutes, the relative dielectric constant (Dk) and dielectric loss tangent (Df) after drying at 10 GHz were determined using a perturbation method cavity resonator. It was measured. The measurement temperature was 23°C.
The perturbation method cavity resonator used was Agilent 8722ES manufactured by Agilent Technologies.
Specific permittivity (Dk)
A: 2.45 or less B: Over 2.45 and 2.50 or less C: 2.50 super dielectric loss tangent (Df)
A: 0.0018 or less B: More than 0.0018 and less than 0.0020 C: More than 0.0020

(2) Moisture absorption and heat resistance The cured board was cut into 50 mm x 50 mm (downsizing), all the copper foil on one side was removed by etching, and half of the copper foil on the other side was removed by etching. It was removed to obtain a sample for measuring moisture absorption and heat resistance. The obtained sample was dried at 120°C for 60 minutes, then left to stand for 5 hours at 121°C in the presence of saturated steam at 2 atm using a pressure cooker tester, and then placed in a solder bath at 260°C for 30 seconds. The samples were dipped and visually observed for any abnormalities in appearance. The pressure cooker tester used was model PC-3 manufactured by Hirayama Seisakusho Co., Ltd. For each measurement, three sheets were tested for each sheet, and if there were no abnormalities in appearance among the three sheets, it would be rated "A," and if one or two sheets were found to have abnormalities in appearance, it would be rated "B." When three abnormalities were observed, the evaluation was rated as "C". The appearance was observed by five experts and a majority vote was taken.

Example 2
The same procedure as in Example 1 was carried out except that 4-methylstyrene was replaced with the same amount of vinyltrimethoxysilane (KBM-1003, manufactured by Shin-Etsu Chemical Co., Ltd., boiling point 123°C).

Example 3
In Example 1, the content of the polymer (va) having the structural unit represented by formula (V) obtained in Synthesis Example 3 was changed to 20 parts by mass, and the maleimide compound (ma) (manufactured by DIC Corporation, The content of "NE-X-9470S" (compound represented by formula (M1)) was changed to 20 parts by mass, and the same procedure was repeated except for changing the content to 20 parts by mass.

Comparative example 1
In Example 1, 4-methylstyrene was not blended, and the content of the maleimide compound (manufactured by Nippon Kayaku Co., Ltd., MIR-3000-70MT, equivalent to the compound represented by formula (M3)) was 4 parts by mass. I made the following changes and did the other things in the same way.

Comparative example 2
In Comparative Example 1, the content of the polymer (va) having the structural unit represented by formula (V) obtained in Synthesis Example 3 was changed to 20 parts by mass, and the maleimide compound (ma) (manufactured by DIC Corporation, The content of "NE-X-9470S" (compound represented by formula (M1)) was changed to 20 parts by mass, and the same procedure was repeated except for changing the content to 20 parts by mass.

Comparative example 3
In Comparative Example 1, the polymer (va) having the structural unit represented by formula (V) obtained in Synthesis Example 3 was not blended, and the content of the modified polyphenylene ether compound obtained in Synthesis Example 2 was reduced to 25%. The same procedure was carried out except that the parts by mass were changed.

Comparative example 4
Example 1 was carried out in the same manner as in Example 1, except that 4-methylstyrene was not blended and 3 parts by mass of 3-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Silicone, "KBM-403") was blended.

Claims (27)

A polymer (A) having a structural unit represented by formula (V),
A resin composition comprising a compound (B) having a molecular weight of less than 1000 and containing one organic group containing a carbon-carbon unsaturated bond in the molecule.

(In formula (V), Ar represents an aromatic hydrocarbon linking group. * represents the bonding position.) The resin composition according to claim 1, wherein the polymer (A) has a weight average molecular weight of 1,000 to 160,000. The resin composition according to claim 1, wherein the content of the polymer (A) is 5 to 70 parts by mass based on 100 parts by mass of resin solids in the resin composition. The resin composition according to claim 1, wherein the organic group containing a carbon-carbon unsaturated bond has a structure of CH ₂ =C(X)- (X is a hydrogen atom or a methyl group). The resin composition according to claim 1, wherein the organic group containing a carbon-carbon unsaturated bond is one selected from the group consisting of a vinyl group, an allyl group, an acrylic group, and a methacryl group. The resin composition according to claim 1, wherein the compound (B) has a molecular weight of 70 to 500. The resin composition according to claim 1, wherein the compound (B) has a boiling point of 110 to 300°C. The resin composition according to claim 1, wherein the content of the compound (B) is 1 to 10 parts by mass based on 100 parts by mass of resin solids in the resin composition. The resin composition according to claim 1, wherein the mass ratio of the polymer (A) and the compound (B) in the resin composition is 1:0.025 to 0.7. The resin composition according to claim 1, further comprising another thermosetting compound (C) that does not correspond to the polymer (A) and the compound (B). The other thermosetting compound (C) is a maleimide compound, a polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds, a cyanate ester compound, an epoxy compound, a phenol compound, an alkenyl-substituted nadimide compound, an oxetane resin, The resin composition according to claim 10, comprising at least one selected from the group consisting of: and benzoxazine compounds. The other thermosetting compound (C) is a compound represented by formula (M1), a compound represented by formula (M3), a compound represented by formula (M5), and a compound represented by formula (OP The resin composition according to claim 10, comprising at least one selected from the group consisting of compounds represented by -1).

(In formula (M1), R ^M1 , R ^M2 , R ^M3 , and R ^M4 each independently represent a hydrogen atom or an organic group. R ^M5 and R ^M6 each independently represent a hydrogen atom or an alkyl group. Ar ^M represents a divalent aromatic group. A is a 4- to 6-membered alicyclic group. R ^M7 and R ^M8 are each independently an alkyl group. mx is 1 or 2 and lx is 0 or 1. R ^M9 and R ^M10 each independently represent a hydrogen atom or an alkyl group. R ^M11 , R ^M12 , R ^M13 , and R ^M14 each independently represent a hydrogen atom or represents an organic group.R ^M15 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms. , represents an aryloxy group having 1 to 10 carbon atoms, an arylthio group having 1 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. px represents an integer of 0 to 3. nx represents an integer of 1 to 20. )

(In formula (M3), R ⁵⁵ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, and n ₅ represents an integer of 1 to 10.)

(In formula (M5), R ⁵⁸ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, R ⁵⁹ each independently represents a hydrogen atom or a methyl group, and n ₆ represents an integer greater than or equal to 1.)

(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, Represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer from 1 to 6, n ₂ represents an integer from 1 to 100, and n ₃ represents an integer from 2 to 4.) The other thermosetting compound (C) consists of a compound represented by formula (M1), a compound represented by formula (M3), and a compound represented by formula (OP-1). The resin composition according to claim 10, comprising at least one selected from the group.

(In formula (M1), R ^M1 , R ^M2 , R ^M3 , and R ^M4 each independently represent a hydrogen atom or an organic group. R ^M5 and R ^M6 each independently represent a hydrogen atom or an alkyl group. Ar ^M represents a divalent aromatic group. A is a 4- to 6-membered alicyclic group. R ^M7 and R ^M8 are each independently an alkyl group. mx is 1 or 2 and lx is 0 or 1. R ^M9 and R ^M10 each independently represent a hydrogen atom or an alkyl group. R ^M11 , R ^M12 , R ^M13 , and R ^M14 each independently represent a hydrogen atom or represents an organic group.R ^M15 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms. , represents an aryloxy group having 1 to 10 carbon atoms, an arylthio group having 1 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. px represents an integer of 0 to 3. nx represents an integer of 1 to 20. )

(In formula (M3), R ⁵⁵ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, and n ₅ represents an integer of 1 to 10.)

(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, Represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer from 1 to 6, n ₂ represents an integer from 1 to 100, and n ₃ represents an integer from 2 to 4.) The resin composition according to claim 10, wherein the content of the thermosetting compound (C) is 5 to 95 parts by mass based on 100 parts by mass of resin solid content in the resin composition. The other thermosetting compound (C) contains at least one selected from the group consisting of compounds represented by formula (OP-1), and the content thereof is equal to or less than the resin solid content in the resin composition. The resin composition according to claim 10, wherein the amount is 3 to 50 parts by mass based on 100 parts by mass.

(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, Represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer of 1 to 6, n ₂ represents an integer of 1 to 100, and n ₃ represents an integer of 2 to 4.) The resin composition according to claim 1, further comprising a filler (D). The resin composition according to claim 16, wherein the content of the filler (D) is 10 to 500 parts by mass based on 100 parts by mass of resin solids in the resin composition. The content of the polymer (A) is 5 to 70 parts by mass, and the content of the compound (B) is 1 to 10 parts by mass, based on 100 parts by mass of the resin solid content in the resin composition. The resin composition according to claim 1. The resin composition according to claim 1, which is substantially free of a polymerization initiator. The weight average molecular weight of the polymer (A) is 1,000 to 160,000,
The content of the polymer (A) is 5 to 70 parts by mass with respect to 100 parts by mass of resin solid content in the resin composition,
The organic group containing a carbon-carbon unsaturated bond is one selected from the group consisting of a vinyl group, an allyl group, an acrylic group, and a methacryl group,
The molecular weight of the compound (B) is 70 to 500,
The boiling point of the compound (B) is 110 to 300°C,
The content of the compound (B) is 1 to 10 parts by mass with respect to 100 parts by mass of resin solid content in the resin composition,
The mass ratio of the polymer (A) and the compound (B) in the resin composition is 1:0.025 to 0.7,
Furthermore, it contains another thermosetting compound (C) that does not fall under the polymer (A) and the compound (B),
The other thermosetting compound (C) is a maleimide compound, a polyphenylene ether compound containing two or more carbon-carbon unsaturated double bonds, a cyanate ester compound, an epoxy compound, a phenol compound, an alkenyl-substituted nadimide compound, an oxetane resin, and at least one selected from the group consisting of benzoxazine compounds,
The content of the thermosetting compound (C) is 5 to 95 parts by mass with respect to 100 parts by mass of resin solid content in the resin composition.
The resin composition according to claim 1. The other thermosetting compound (C) contains at least one selected from the group consisting of compounds represented by formula (OP-1), and the content thereof is equal to or greater than the resin solid content in the resin composition. The resin composition according to claim 20, wherein the amount is 3 to 50 parts by mass based on 100 parts by mass.

(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, Represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer from 1 to 6, n ₂ represents an integer from 1 to 100, and n ₃ represents an integer from 2 to 4.) 22. The resin composition according to claim 21, which is substantially free of a polymerization initiator. A prepreg formed from a base material and the resin composition according to any one of claims 1 to 22. A metal foil-clad laminate comprising at least one layer formed from the prepreg according to claim 23 and a metal foil disposed on one or both sides of the layer formed from the prepreg. A resin composite sheet comprising a support and a layer formed from the resin composition according to any one of claims 1 to 22 disposed on the surface of the support. A printed wiring board comprising an insulating layer and a conductor layer disposed on a surface of the insulating layer, the insulating layer being formed from the resin composition according to any one of claims 1 to 22. Printed wiring board, including layers. A semiconductor device comprising the printed wiring board according to claim 26.