WO2023176763A1

WO2023176763A1 - Resin composition, cured product, prepreg, metal-foil-clad laminate, resin composite sheet, printed circuit board, and semiconductor device

Info

Publication number: WO2023176763A1
Application number: PCT/JP2023/009585
Authority: WO
Inventors: 祥一伊藤; 弘晃田所; 享印南; 真宮本; 圭亮二村
Original assignee: 三菱瓦斯化学株式会社
Priority date: 2022-03-14
Filing date: 2023-03-13
Publication date: 2023-09-21
Also published as: JP7501811B2; JPWO2023176763A1; TW202342631A; JP2024061808A

Abstract

Provided are: a resin composition having excellent moldability and a low dissipation factor (Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed circuit board; and a semiconductor device. A resin composition containing a resin (A) having a terminal group represented by formula (T1) and an indane skeleton and a polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at an end, in which the mass ratio of the resin (A) and the polyphenylene ether compound (B) is resin (A)/polyphenylene ether compound (B)=5/95-70/30. In formula (T1), Mb each independently represent a C1-12 hydrocarbon group optionally substituted by a halogen atom, y represents an integer of 0-4, and * represents a bonding position with another site.

Description

Resin compositions, cured products, prepregs, metal foil laminates, resin composite sheets, printed wiring boards, and semiconductor devices

The present invention relates to a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device.

In recent years, the integration and miniaturization of semiconductor elements used in electronic equipment, communication equipment, etc., including mobile terminals, have been accelerating. Along with this, there is a need for technology that enables high-density packaging of semiconductor elements, and improvements are also needed for printed wiring boards, which play an important role.
On the other hand, the uses of electronic devices, etc. continue to diversify and expand. In response to this trend, the characteristics required of printed wiring boards, metal foil-clad laminates, prepregs, etc. used therein are becoming more diverse and demanding. Taking these required characteristics into consideration, various materials and processing methods have been proposed to obtain improved printed wiring boards. One example of this is the development and improvement of resin materials that make up prepregs and resin composite sheets.

Patent Document 1 discloses a resin having an isopropenylphenyl group at the end and an indane skeleton as a material suitable for semiconductor sealing materials and printed wiring boards.

JP 2021-143333 Publication

However, if the resin described in Patent Document 1 is used as is, it will not be sufficiently cured. Therefore, there is a need for new resin compositions blended with other compounds, especially thermosetting compounds. In particular, a resin composition that has excellent moldability and a low dielectric loss tangent (Df) is required.
The present invention aims to solve such problems, and provides a resin composition that has excellent moldability and a low dielectric loss tangent (Df), as well as a cured product, a prepreg, a metal foil-clad laminate, and a resin composition. The purpose is to provide composite sheets, printed wiring boards, and semiconductor devices.

Based on the above-mentioned problems, the present inventor conducted studies and found that a polyphenylene ether compound having a carbon-carbon unsaturated double bond at the end was added to a resin having an isopropenyl group at the end and an indane skeleton. The above problem was solved by blending in a specific ratio.
Specifically, the above problem was solved by the following means.
<1> A resin (A) having a terminal group represented by formula (T1) and an indane skeleton, and a polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal. A resin composition, wherein the mass ratio of the content of the resin (A) and the polyphenylene ether compound (B) is resin (A)/polyphenylene ether compound (B) = 5/95 to 70/30.
(In formula (T1), Mb each independently represents a hydrocarbon group having 1 to 12 carbon atoms that may be substituted with a halogen atom, and y represents an integer of 0 to 4. )
<2> The resin composition according to <1>, wherein the resin (A) contains a resin represented by formula (T1-1) (preferably a resin represented by formula (T1-1-2)) .
(In formula (T1-1), R is a group containing a structural unit represented by formula (Tx). Represents a hydrogen group. y is an integer from 0 to 4.)
(In formula (Tx), n, o, and p are the average number of repeating units, n represents a number greater than 0 and less than or equal to 20, o and p each independently represent a number from 0 to 20, 1.0≦n+o+p≦20.0.Ma represents a hydrocarbon group having 1 to 12 carbon atoms which may be independently substituted with a halogen atom.x represents an integer of 0 to 4.Structure Units (a), (b), and (c) are each bonded to the structural unit (a), (b), (c), or another group at *, and each structural unit is bonded randomly. )
<3> The resin composition according to <1> or <2>, wherein the polyphenylene ether compound (B) includes a polyphenylene ether compound represented by formula (OP).
(In formula (OP), X represents an aromatic group, -(Y-O) _n1 - represents a polyphenylene ether structure, n1 represents an integer of 1 to 100, and n2 represents an integer of 1 to 4. Rx is a group represented by formula (Rx-1) or formula (Rx-2).)
(In formula (Rx-1) and formula (Rx-2), R ¹ , R ² , and R ³ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group. *: It is a bonding site with an oxygen atom. Mc each independently represents a hydrocarbon group having 1 to 12 carbon atoms. z represents an integer of 0 to 4. r represents an integer of 1 to 6.)
<4> The resin composition according to <1> or <2>, wherein the polyphenylene ether compound (B) contains a polyphenylene ether compound represented by formula (OP-1).
(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, It represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer of 1 to 6, n ₂ represents an integer of 1 to 100, and n ₃ represents an integer of 1 to 4.)
<5> Any one of <1> to <4>, wherein the polyphenylene ether compound (B) has a number average molecular weight (Mn) of 500 to 3000 and a weight average molecular weight (Mw) of 800 to 6000. The resin composition described in .
<6> The resin composition according to any one of <1> to <5>, wherein the resin (A) has a number average molecular weight (Mn) of 400 to 3,000.
<7> The mass ratio of the content of the resin (A) and the polyphenylene ether compound (B) is resin (A)/polyphenylene ether compound (B) = 5/95 to 45/55, <1> to The resin composition according to any one of <6>.
<8> The resin composition according to any one of <1> to <7>, which does not substantially contain a polymerization inhibitor.
<9> The resin composition according to any one of <1> to <8>, further comprising the resin (A) and a compound (C) other than the polyphenylene ether compound (B).
<10> The other compound (C) is a maleimide compound, a cyanate ester compound, an epoxy compound, a phenol compound, a compound containing a (meth)allyl group (for example, an alkenylnadimide compound), an oxetane resin, a benzoxazine compound, Arylcyclobutene resin, polyamide resin, polyimide resin, perfluorovinyl ether resin, compound having a styrene group other than the polyphenylene ether compound (B), compound having an isopropenyl group other than the resin having an indane skeleton (A), the polyphenylene The resin composition according to <9>, which contains one or more selected from the group consisting of a polyfunctional (meth)acrylate compound other than the ether compound (B), an elastomer, and a petroleum resin.
<11> The total content of the resin (A) and the polyphenylene ether compound (B) is 40 parts by mass or more based on 100 parts by mass of the resin solid content in the resin composition, <1> to <10>. The resin composition according to any one of the above.
<12> The resin composition according to any one of <1> to <11>, further comprising a filler (D).
<13> The resin composition according to <12>, wherein the content of the filler (D) is 10 to 1000 parts by mass based on 100 parts by mass of resin solids in the resin composition.
<14> The resin (A) includes a resin represented by formula (T1-1),
The polyphenylene ether compound (B) includes a polyphenylene ether compound represented by formula (OP-1),
The polyphenylene ether compound (B) has a number average molecular weight (Mn) of 500 to 3000, and a weight average molecular weight (Mw) of 800 to 6000,
The resin (A) has a number average molecular weight (Mn) of 400 to 3000,
The mass ratio of the content of the resin (A) and the polyphenylene ether compound (B) is resin (A)/polyphenylene ether compound (B) = 5/95 to 45/55,
Substantially free of polymerization inhibitors,
Any one of <1> to <13>, wherein the total content of the resin (A) and the polyphenylene ether compound (B) is 40 parts by mass or more based on 100 parts by mass of the resin solid content in the resin composition. The resin composition described in .
(In formula (T1-1), R is a group containing a structural unit represented by formula (Tx). Represents a hydrogen group. y is an integer from 0 to 4.)
(In formula (Tx), n, o, and p are the average number of repeating units, n represents a number greater than 0 and less than or equal to 20, o and p each independently represent a number from 0 to 20, 1.0≦n+o+p≦20.0.Ma represents a hydrocarbon group having 1 to 12 carbon atoms which may be independently substituted with a halogen atom.x represents an integer of 0 to 4.Structure Units (a), (b), and (c) are each bonded to the structural unit (a), (b), (c), or another group at *, and each structural unit is bonded randomly. )
(In formula (OP), X represents an aromatic group, -(Y-O) _n1 - represents a polyphenylene ether structure, n1 represents an integer of 1 to 100, and n2 represents an integer of 1 to 4. Rx is a group represented by formula (Rx-1) or formula (Rx-2).)
(In formula (Rx-1) and formula (Rx-2), R ¹ , R ² , and R ³ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group. *: It is a bonding site with an oxygen atom. Mc each independently represents a hydrocarbon group having 1 to 12 carbon atoms. z represents an integer of 0 to 4. r represents an integer of 1 to 6.)
<15> A cured product of the resin composition according to any one of <1> to <14>.
<16> A prepreg formed from a base material and the resin composition according to any one of <1> to <14>.
<17> A metal foil-clad laminate comprising at least one layer formed from the prepreg according to <16> and metal foil disposed on one or both sides of the layer formed from the prepreg.
<18> A resin composite sheet comprising a support and a layer formed from the resin composition according to any one of <1> to <14> disposed on the surface of the support.
<19> A printed wiring board comprising an insulating layer and a conductor layer disposed on the surface of the insulating layer, wherein the insulating layer is made of the resin composition according to any one of <1> to <14>. A printed wiring board comprising at least one of a layer formed from a material and a layer formed from a prepreg according to <16>.
<20> A semiconductor device including the printed wiring board according to <19>.

The present invention makes it possible to provide resin compositions with excellent moldability and low dielectric loss tangent (Df), as well as cured products, prepregs, metal foil-clad laminates, resin composite sheets, printed wiring boards, and semiconductor devices. Became.

An NMR chart of Synthesis Example 1 is shown.

Hereinafter, a mode for carrying out the present invention (hereinafter simply referred to as "this embodiment") will be described in detail. Note that the present embodiment below is an illustration for explaining the present invention, and the present invention is not limited only to this embodiment.
In addition, in this specification, "~" is used to include the numerical values described before and after it as a lower limit value and an upper limit value.
In this specification, various physical property values and characteristic values are assumed to be at 23° C. unless otherwise stated.
In the description of a group (atomic group) in this specification, the description that does not indicate substituted or unsubstituted includes a group having a substituent (atomic group) as well as a group having no substituent (atomic group). For example, the term "alkyl group" includes not only an alkyl group without a substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). In this specification, for expressions that do not indicate substitution or non-substitution, non-substitution is preferred.
In the present specification, the (meth)allyl group represents allyl and/or methallyl, "(meth)acrylate" represents both acrylate and/or methacrylate, and "(meth)acrylate" represents acrylate and/or methacrylate; "Acrylic" represents both or either of acrylic and methacrylic, and "(meth)acryloyl" represents both or either of acryloyl and methacryloyl.
In this specification, the term "process" is used not only to refer to an independent process, but also to include a process in which the intended effect of the process is achieved even if the process cannot be clearly distinguished from other processes. .
If the measurement methods, etc. explained in the standards shown in this specification differ from year to year, unless otherwise stated, they shall be based on the standards as of January 1, 2022.

In this specification, the resin solid content refers to the components excluding the filler and the solvent, and includes the resin (A), the polyphenylene ether compound (B), and other compounds (C) blended as necessary. The purpose is to include other resin additive components (additives such as flame retardants, etc.).
In this specification, relative dielectric constant and dielectric constant are used interchangeably.

The resin composition of the present embodiment includes a resin (A) having a terminal group represented by formula (T1) and an indane skeleton (sometimes simply referred to as "resin (A)"), A polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal (sometimes simply referred to as "polyphenylene ether compound (B)"), the resin (A) and the polyphenylene ether compound (B) The mass ratio of the content of resin (A)/polyphenylene ether compound (B) is 5/95 to 70/30.
(In formula (T1), Mb represents a hydrocarbon group having 1 to 12 carbon atoms that may be independently substituted with a halogen atom, and y represents an integer of 0 to 4. )
With such a configuration, a resin composition having excellent moldability and having a low dielectric loss tangent (Df) when cured is obtained.
The resin (A) having a terminal group represented by formula (T1) and an indane skeleton is difficult to polymerize alone. Further, unless used in combination with a compound that is compatible with the resin (A), phase separation is likely to occur. In this embodiment, by blending the polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the end with the resin (A) at a predetermined ratio, compatibility is improved and moldability is improved. It is assumed that a resin composition was obtained and a cured product was obtained. Furthermore, since the resin (A) has an indane skeleton, it is presumed that a resin composition that can have a low dielectric loss tangent (Df) when cured is obtained.
Furthermore, in this embodiment, a resin composition with low melt viscosity is obtained. Moreover, a resin composition with high heat resistance can be obtained. Furthermore, since the resin (A) has an indane skeleton, it is presumed that a resin composition with a low dielectric constant (Dk) was obtained.

<Resin (A) having a terminal group represented by formula (T1) and an indane skeleton>
The resin composition of the present embodiment includes a resin (A) having a terminal group represented by formula (T1) and an indane skeleton. By using the resin (A), a resin composition having excellent low dielectric properties (Dk and/or Df) when cured is obtained.
(In formula (T1), Mb represents a hydrocarbon group having 1 to 12 carbon atoms that may be independently substituted with a halogen atom, and y represents an integer of 0 to 4. )

In formula (T1), Mb is each independently preferably a hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a halogen atom; It is more preferably a hydrocarbon group having 5 carbon atoms, and even more preferably a hydrocarbon group having 1 to 3 carbon atoms which may be substituted with a halogen atom. Examples of the halogen atom include a fluorine atom, a chlorine atom, and a bromine atom, with a fluorine atom or a chlorine atom being preferred. Each Mb is preferably a hydrocarbon group having 1 to 12 carbon atoms that is not substituted with a halogen atom.
The hydrocarbon group is preferably an alkyl group, more preferably a linear alkyl group. As Mb, a methyl group and an ethyl group are preferable.

y is preferably an integer of 0 to 3, more preferably an integer of 0 to 2, even more preferably 0 or 1, and even more preferably 0.

The resin (A) may have terminal groups represented by formula (T1) at all ends or only at some ends of each resin molecule.
It is preferable that the number of terminal groups represented by formula (T1) in the resin molecule of resin (A) is two.

The resin (A) has an indane skeleton. Although it is not particularly limited as long as at least one molecule of the resin molecules contained in the resin (A) has at least one indane skeleton, the number of indane skeletons in the resin molecules of the resin (A) is 1 molecule. It is preferable to contain one or more, and more preferably from 1 to 20. With such a configuration, the effects of the present invention tend to be more effectively exhibited.

It is preferable that the resin (A) contains a structural unit represented by the following formula (Txn).
(In the formula (Txn), n is the average number of repeating units and represents a number greater than 0 and less than or equal to 20. Ma each independently represents a hydrocarbon group having 1 to 12 carbon atoms that may be substituted with a halogen atom. (X represents an integer from 0 to 4.)

In formula (Txn), each Ma is preferably a hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a halogen atom; It is more preferably a hydrocarbon group having 5 carbon atoms, and even more preferably a hydrocarbon group having 1 to 3 carbon atoms which may be substituted with a halogen atom. Examples of the halogen atom include a fluorine atom, a chlorine atom, and a bromine atom, with a fluorine atom or a chlorine atom being preferred. Each Ma is preferably a hydrocarbon group having 1 to 12 carbon atoms that is not substituted with a halogen atom. The hydrocarbon group is preferably an alkyl group, more preferably a linear alkyl group.
As Ma, a methyl group and an ethyl group are particularly preferable.

x is preferably an integer of 0 to 3, more preferably an integer of 0 to 2, even more preferably 0 or 1, and even more preferably 0.

The resin (A) more preferably contains a resin represented by formula (T1-1), and more preferably contains a resin represented by formula (T1-1-2).
(In formula (T1-1), R is a group containing a structural unit represented by formula (Tx). Represents a hydrogen group. y is an integer from 0 to 4.)
In formula (T1-1), Mb and y have the same meanings as Mb and y in formula (T1), and the preferred ranges are also the same.
(In formula (T1-2), R is a group containing a structural unit represented by formula (Tx).)
(In formula (Tx), n, o, and p are the average number of repeating units, n represents a number greater than 0 and less than or equal to 20, and o and p each independently represent a number from 0 to 20, 1.0≦n+o+p≦20.0.Ma represents a hydrocarbon group having 1 to 12 carbon atoms which may be independently substituted with a halogen atom.x represents an integer of 0 to 4.Structure Units (a), (b), and (c) are each bonded to the structural unit (a), (b), (c), or another group at *, and each structural unit is bonded randomly. )

In formula (Tx), n, o and p each mean the average number of repeating units in all molecules in the resin.
In formula (Tx), the sum of n, o and p is preferably 1.1≦n+o+p, more preferably 1.2≦n+o+p, and even more preferably 1.5≦n+o+p, It is more preferable that 2.0≦n+o+p, even more preferably that 2.5≦n+o+p, even more preferably that 3.0≦n+o+p, and even more preferably that 3.3≦n+o+p. . Further, in formula (Tx), the sum of n, o, and p is preferably n+o+p≦20.0, more preferably n+o+p≦10.0, and furthermore preferably n+o+p≦8.0. Preferably, n+o+p≦7.0, even more preferably n+o+p≦6.4. The sum of n, o, and p can be calculated by the method described in Examples described later.
In formula (Tx), Ma and x have the same meanings as Ma and x in formula (Txn), respectively, and the preferred ranges are also the same.

The resin represented by formula (T1-1) (preferably the resin represented by formula (T1-1-2)) further has a parameter α calculated from formula (α) of 0.55 or more and 1. 00 or less, and the parameter β calculated from equation (β) is preferably 0.20 or more and 3.00 or less. By setting the parameters α and β within the above ranges, the resulting cured product tends to have excellent low dielectric properties (Dk and/or Df) and excellent heat resistance.
(The value in parentheses in formula (α) and formula (β) indicates the integral value between the corresponding chemical shift values in ¹ H-NMR.)

Here, α is a structural unit having an indane skeleton (a structural unit in formula (Tx)) in a resin represented by formula (T1-1), preferably a resin represented by formula (T1-1-2). (a)) shows the ratio. More specifically, it is presumed that by adjusting the structural unit having an indane skeleton so as to satisfy the range of the parameter α, the resulting resin molecule has high rigidity and a high glass transition temperature. Furthermore, since molecules with high rigidity have lower mobility than molecules with low rigidity, it is presumed that the relaxation time during dielectric relaxation is longer and Df can be lowered. When synthesizing the resin represented by formula (T1-1), α can be increased by reducing the concentration of raw materials, using a highly polar solvent, increasing the amount of catalyst, raising the reaction temperature, etc. .
On the other hand, β defines the terminal double bond ratio in the resin represented by formula (T1-1) (preferably, the resin represented by formula (T1-1-2)). More specifically, for example, the number of crosslinking points with the functional groups of other compounds (C) (particularly thermosetting compounds) described later increases, making it easier to form a network when thermosetting, and increasing the glass transition temperature. It is presumed that a cured product with high Df and low Df can be obtained. β can be increased by reducing the amount of catalyst, lowering the reaction temperature, using a low polar solvent, etc. when synthesizing the resin represented by formula (T1-1).
When synthesizing the resin represented by formula (T1-1) (preferably the resin represented by formula (T1-1-2)), using the method of increasing the parameters α and β described above, the formula The parameters α and β of the resin represented by (T1-1) (preferably the resin represented by formula (T1-1-2)) can be adjusted. Of course, the parameters α and β may be adjusted by methods other than those described above.

The parameter α is preferably 0.57 or more, more preferably 0.59 or more, even more preferably 0.60 or more, even more preferably 0.62 or more, and 0. It may be 65 or more, 0.70 or more, 0.75 or more, or 0.80 or more. When the amount is equal to or more than the lower limit, the heat resistance of the obtained cured product tends to be further improved. Since the obtained cured product tends to have excellent low dielectric properties (Dk and/or Df) and heat resistance, it is better for the parameter α to be larger, but it is preferably 0.95 or less, It may be .90 or less, 0.85 or less, 0.82 or less, 0.80 or less, 0.77 or less, 0.75 or less, or 0.74 or less.
The parameter β is preferably 0.25 or more, more preferably 0.30 or more, even more preferably 0.35 or more, even more preferably 0.40 or more, and 0.43 It is even more preferably at least 0.50, even more preferably at least 0.60, at least 0.65, at least 0.70, at least 0.77, at least 0.80, at least 0.90. , 0.95 or more. When the amount is equal to or more than the lower limit, the heat resistance of the resulting cured product tends to improve and Df tends to decrease. The parameter β is preferably 2.50 or less, more preferably 2.00 or less, even more preferably 1.50 or less, even more preferably 1.30 or less, and 1.20 It is even more preferable that it is below, even more preferable that it is 1.10 or less, furthermore, it is 1.00 or less, 0.95 or less, 0.90 or less, 0.85 or less, 0.83 or less, 0 It may be .80 or less. By setting the parameter β to be less than or equal to the upper limit value, the heat resistance of the obtained cured product tends to be improved and the Df tends to be lowered.

The number average molecular weight (Mn) of the resin (A) in terms of polystyrene determined by GPC (gel permeation chromatography) (details follow the method described in the Examples below) is preferably 400 or more, and preferably 500 or more. It is more preferable that it is 550 or more, even more preferably that it is 600 or more, and even more preferably that it is 650 or more. By setting the number average molecular weight to the above lower limit or more, the heat resistance of the resulting cured product tends to improve and the Df tends to decrease. Further, the upper limit of the number average molecular weight (Mn) of the resin (A) in terms of polystyrene determined by GPC (gel permeation chromatography) is preferably 3000 or less, more preferably 2500 or less, and 2000 or less. It is more preferably 1,500 or less, even more preferably 1,250 or less, and may be 1,000 or less, or 800 or less depending on the application. By controlling the number average molecular weight to be less than or equal to the upper limit, the heat resistance of the resulting cured product tends to improve, and the dielectric constant (Dk) and dielectric loss tangent (Df) tend to decrease.
In addition, the weight average molecular weight (Mw) of the resin (A) in terms of polystyrene by GPC (details according to the method described in the examples below) is preferably 500 or more, more preferably 800 or more, It is more preferably 900 or more, even more preferably 1000 or more. By setting the weight average molecular weight to the above lower limit or more, the heat resistance of the resulting cured product tends to improve and Df tends to decrease. The upper limit of the polystyrene-equivalent weight average molecular weight (Mw) of the resin (A) by GPC (details follow the method described in the Examples below) is preferably 6000 or less, more preferably 5000 or less. , more preferably 4,000 or less, even more preferably 3,000 or less, even more preferably 2,800 or less, and may be 2,500 or less, 2,000 or less, or 1,500 or less depending on the application. By controlling the weight average molecular weight to be less than or equal to the upper limit value, the heat resistance of the resulting cured product tends to improve, and the dielectric constant (Dk) and dielectric loss tangent (Df) tend to decrease.

The resin (A) preferably has Mw/Mn, which is the ratio of weight average molecular weight to number average molecular weight, of 1.1 to 3.0. Mw/Mn of the resin (A) is more preferably 1.2 or more, even more preferably 1.3 or more, even more preferably 1.4 or more, and 1.5 or more. is even more preferable, and even more preferably 1.6 or more. Further, Mw/Mn of the resin (A) is more preferably 2.5 or less, even more preferably 2.4 or less, may be 2.3 or less, and may be 2.0 or less. It may be 1.8 or less.
The weight average molecular weight and number average molecular weight are measured according to the methods described in the Examples below.

The content of the resin (A) in the resin composition of the present embodiment is preferably 5 parts by mass or more, more preferably 8 parts by mass or more, based on 100 parts by mass of resin solids in the resin composition. Preferably, the amount may be 10 parts by mass or more, and depending on the use etc., it may be 15 parts by mass or more, 20 parts by mass or more, or 25 parts by mass or more. By setting the content of the resin (A) to the lower limit value or more, the Df of the resulting cured product tends to be lower. Further, the upper limit of the content of the resin (A) is preferably 70 parts by mass or less, more preferably 55 parts by mass or less, and 50 parts by mass or less, based on 100 parts by mass of resin solids in the resin composition. It is more preferably at most parts by mass, even more preferably at most 45 parts by mass, even more preferably at most 40 parts by mass, even more preferably at most 35 parts by mass. By controlling the content of the resin (A) to be less than or equal to the above upper limit, the moldability of the resin composition and the heat resistance of the resulting cured product tend to improve.
The resin composition of this embodiment may contain only one type of resin (A), or may contain two or more types of resin (A). When two or more types are included, it is preferable that the total amount falls within the above range.

The method for producing the resin (A) in this embodiment is not particularly limited, and those obtained by known production methods can be used. In addition, the raw materials, reaction temperature, catalyst species, catalyst amount, reaction solvent, raw material concentration, etc. when synthesizing the resin (A) are not particularly limited, and are appropriately selected depending on the desired physical properties described above. Or it can be controlled.

In this embodiment, examples of raw materials for synthesizing the resin (A) include m-bis(α-hydroxyisopropyl)benzene, p-bis(α-hydroxyisopropyl)benzene, 1,3-diisopropenylbenzene, Also, 1,4-diisopropenylbenzene and the like can be used.

In this embodiment, the reaction temperature when synthesizing the resin (A) is preferably 40°C or higher, more preferably 50°C or higher, even more preferably 60°C or higher, and even more preferably 70°C or higher. , 80°C or higher, 90°C or higher, 100°C or higher, 110°C or higher, or 120°C or higher. By setting it to the above lower limit or more, the reaction rate tends to be improved and the indane skeleton (constituent unit (a) in formula (Tx)) ratio tends to improve, which is preferable. Further, the reaction temperature is preferably 180°C or lower, more preferably 150°C or lower, and even more preferably 140°C or lower. By setting it below the upper limit, it tends to be possible to effectively suppress the production of by-products.
Further, the reaction temperature does not need to be the same from the start to the end of the reaction, and the temperature may be changed. In this case, it is preferable that the average reaction temperature of all steps is within the above range.

In this embodiment, the catalyst used when synthesizing the resin (A) is not particularly limited, but an acid catalyst is exemplified. Examples of acid catalysts include inorganic acids such as hydrochloric acid, sulfuric acid, and phosphoric acid, organic acids such as oxalic acid, benzenesulfonic acid, toluenesulfonic acid, methanesulfonic acid, and fluoromethanesulfonic acid, _BF3 ether complex, and _BF3phenol complex. , Lewis acids such as aluminum chloride, zinc chloride, and indium chloride, solid acids such as activated clay, acid clay, silica alumina, and zeolite, heteropolyhydrochloric acid, strongly acidic ion exchange resins, and the like can be used.
When a catalyst is used, the amount thereof is 0.01 to 20.0 parts by mass based on 100 parts by mass of the above-mentioned raw materials for resin (A).
Usually, one kind of catalyst is used alone, but two or more kinds may be used in combination. When used together, the total amount is preferably within the above range.

In this embodiment, the reaction solvent for synthesizing the resin (A) is not particularly defined, but aromatic hydrocarbon solvents such as toluene, benzene, chlorobenzene, and xylene, and halogenated carbonaceous solvents such as methylene chloride and chloroform Can be used in combination with hydrogen solvents, aliphatic hydrocarbon solvents such as hexane and heptane, ester solvents such as ethyl acetate and propyl acetate, amide solvents such as dimethylformamide and dimethylacetamide, alcohol solvents, and ketone solvents. , water can also be added. Examples of alcohol solvents include methanol, ethanol, butanol, propanol, methylpropylene diglycol, diethylene glycol ethyl ether, butylpropylene glycol, propylpropylene glycol, and examples of ketone solvents include acetone, methylethylketone, diethylketone, methylbutylketone, Examples include methyl isobutyl ketone, and others include, but are not limited to, tetrahydrofuran and dioxane.
An example of the reaction solvent in this embodiment includes an aromatic hydrocarbon solvent.

In this embodiment, the concentration of the above-mentioned raw materials when synthesizing the resin (A) is preferably 5% or more, more preferably 8% or more, preferably 10% or more, and 12% or more. % or more, 15% or more, 17% or more, 20% or more, 22% or more, or 25% or more. By setting it to the above lower limit or more, the reaction rate tends to be improved and the indane skeleton (constituent unit (a) in formula (Tx)) ratio tends to improve, which is preferable. Furthermore, the concentration of the above-mentioned raw materials is preferably 49% or less, more preferably 40% or less. By setting it below the upper limit, it tends to be possible to effectively suppress the production of by-products.
Further, the concentration does not need to be the same from the start to the end of the reaction, and the concentration may be changed.

<Polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the end>
The resin composition of this embodiment includes a polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the end. In this embodiment, the polyphenylene ether compound (B) preferably includes a polyphenylene ether compound (B2) containing two or more carbon-carbon unsaturated double bonds.
The polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal has a group represented by the formula (Rx-1) such as a vinylbenzyl group, or a group represented by the formula (Rx-1) such as a (meth)acrylic group at the terminal. A polyphenylene ether compound having a group selected from the group consisting of a group represented by -2) and a maleimide group is preferable, and a group represented by formula (Rx-1) such as a vinylbenzyl group and/or ( More preferably, it is a polyphenylene ether compound having a group represented by formula (Rx-2) such as a meth)acrylic group, and a group represented by formula (Rx-1) such as a vinylbenzyl group and/or at the terminal. More preferably, it is a polyphenylene ether compound containing two or more groups represented by formula (Rx-2) such as (meth)acrylic groups.
(In formula (Rx-1) and formula (Rx-2), R ¹ , R ² , and R ³ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group. *: It is a bonding site with an oxygen atom. Mc each independently represents a hydrocarbon group having 1 to 12 carbon atoms. z represents an integer of 0 to 4. r represents an integer of 1 to 6.)

By using these polyphenylene ether compounds, it tends to be possible to more effectively improve the low dielectric properties (Dk and/or Df), low water absorption, etc. of printed wiring boards and the like. In this embodiment, it is particularly preferable to use a polyphenylene ether compound having a vinylbenzyl group at the end. By having a vinylbenzyl group, the compatibility with the resin (A) tends to be significantly improved.
These details will be explained below.

The polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal (preferably the polyphenylene ether compound (B2) containing two or more carbon-carbon unsaturated double bonds) is represented by the following formula (X1). Examples include compounds having a phenylene ether skeleton.

(In formula (X1), R ²⁴ , R ²⁵ , R ²⁶ , and R ²⁷ may be the same or different, and represent an alkyl group having 6 or less carbon atoms, an aryl group, a halogen atom, or a hydrogen atom. )

A polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal (preferably a polyphenylene ether compound (B2) containing two or more carbon-carbon unsaturated double bonds) has the formula (X2):
(In formula (X2), R ²⁸ , R ²⁹ , R ³⁰ , R ³⁴ , and R ³⁵ may be the same or different and represent an alkyl group or a phenyl group having 6 or less carbon atoms. R ³¹ , R ³² , and R ³³ may be the same or different and are a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group.)
A repeating unit represented by and/or formula (X3):
(In formula (X3), R ³⁶ , R ³⁷ , R ³⁸ , R ³⁹ , R ⁴⁰ , R ⁴¹ , R ⁴² and R ⁴³ may be the same or different, hydrogen atom, alkyl having 6 or less carbon atoms) or a phenyl group. -A- is a linear, branched or cyclic divalent hydrocarbon group having 20 or less carbon atoms.

The polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal (preferably the polyphenylene ether compound (B2) containing two or more carbon-carbon unsaturated double bonds) has a part or all of the terminal is preferably a modified polyphenylene ether compound functionalized with an ethylenically unsaturated group (hereinafter sometimes referred to as "modified polyphenylene ether compound (g)"), and has a formula (Rx It is a modified polyphenylene ether compound having two or more groups selected from the group consisting of a group represented by -1), a group represented by formula (Rx-2) such as a (meth)acrylic group, and a maleimide group. More preferably, it is a group represented by formula (Rx-1) such as a vinylbenzyl group and/or a group represented by formula (Rx-2) such as a (meth)acrylic group. By employing such a modified polyphenylene ether compound (g), the low dielectric properties (Dk and/or Df) of the cured product of the resin composition can be made smaller, and the low water absorption and metal foil peel strength can be improved. becomes possible. These may be used alone or in combination of two or more.

Examples of the modified polyphenylene ether compound (g) include polyphenylene ether compounds represented by formula (OP).
(In formula (OP), X represents an aromatic group, -(Y-O) _n1 - represents a polyphenylene ether structure, n1 represents an integer of 1 to 100, and n2 represents an integer of 1 to 4. Rx is a group represented by formula (Rx-1) or formula (Rx-2).)
(In formula (Rx-1) and formula (Rx-2), R ¹ , R ² , and R ³ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group. *: It is a bonding site with an oxygen atom. Mc each independently represents a hydrocarbon group having 1 to 12 carbon atoms. z represents an integer of 0 to 4. r represents an integer of 1 to 6.)

When n ₁ and/or n ₂ are integers of 2 or more, the n ₁ structural units (YO) and/or the n ₂ structural units may be the same or different. n ₂ is preferably 2 or more, more preferably 2.

In formulas (Rx-1) and (Rx-2), R ¹ , R ² , and R ³ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group.
R ¹ is preferably a hydrogen atom or an alkyl group, more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom.
R ² and R ³ are each independently preferably a hydrogen atom or an alkyl group, more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom.
The number of carbon atoms in each of the alkyl group, alkenyl group, or alkynyl group as R ¹ , R ² , and R ³ is preferably 5 or less, more preferably 3 or less.

In formula (Rx-1), r represents an integer of 1 to 6, preferably an integer of 1 to 5, more preferably an integer of 1 to 4, and preferably an integer of 1 to 3. More preferably, it is 1 or 2, even more preferably 1.

In formula (Rx-1), Mc each independently represents a hydrocarbon group having 1 to 12 carbon atoms, preferably a hydrocarbon group having 1 to 10 carbon atoms, and a linear chain having 1 to 10 carbon atoms. or a branched alkyl group, more preferably a methyl group, ethyl group, isopropyl group, isobutyl group, t-butyl group, pentyl group, octyl group, or nonyl group, and a methyl group, an ethyl group , isopropyl group, isobutyl group, or t-butyl group are more preferable.
In formula (Rx-1), z represents an integer of 0 to 4, preferably an integer of 0 to 3, more preferably an integer of 0 to 2, further preferably 0 or 1, and most preferably 0.

A specific example of the group represented by formula (Rx-1) is a vinylbenzyl group, and a specific example of the group represented by formula (Rx-2) is a (meth)acryloyl group.
Rx is preferably a group represented by formula (Rx-1).

Examples of the modified polyphenylene ether compound (g) include a polyphenylene ether compound represented by formula (OP-1).
(In formula (OP-1), X represents an aromatic group, -(Y-O)n ₂ - represents a polyphenylene ether structure, and R ¹ , R ² and R ³ are each independently, It represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n ₁ represents an integer of 1 to 6, n ₂ represents an integer of 1 to 100, and n ₃ represents an integer of 1 to 4.)
When n ₂ and/or n ₃ are integers of 2 or more, the n ₂ structural units (YO) and/or the n ₃ structural units may be the same or different. _n3 is preferably 2 or more, more preferably 2.

The modified polyphenylene ether compound (g) in this embodiment is also preferably a compound represented by formula (OP-2), more preferably a compound represented by formula (OP-2-2). preferable.
Here, -(O-X-O)- is the formula (OP-3):
(In formula (OP-3), R ⁴ , R ⁵ , R ⁶ , R ¹⁰ , and R ¹¹ may be the same or different and are an alkyl group or a phenyl group having 6 or less carbon atoms. R ⁷ , R ⁸ and R ⁹ may be the same or different and are a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group.)
and/or formula (OP-4):
(In formula (OP-4), R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ , R ¹⁸ , and R ¹⁹ may be the same or different, and each has a hydrogen atom and a carbon number of 6 or less. is an alkyl group or phenyl group. -A- is a linear, branched or cyclic divalent hydrocarbon group having 20 or less carbon atoms.

Moreover, -(YO)- is the formula (OP-5):
(In formula (OP-5), R ²⁰ and R ²¹ may be the same or different and are an alkyl group or a phenyl group having 6 or less carbon atoms. R ²² and R ²³ may be the same or different, It is preferably represented by a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group. In particular, R ²⁰ and R ²¹ are each independently a group having one or more methyl group and/or cyclohexyl group, so that the resulting resin molecule has high rigidity, and molecules with high rigidity have high rigidity. It is preferable because it has a lower mobility than a low-temperature molecule, so the relaxation time during dielectric relaxation is longer, and the low dielectric properties (Dk and/or Df) are improved.
An example of formula (OP-5) is the following structure.
Regarding the polyphenylene compound having the above structure, the description in JP-A-2019-194312 can be referred to, and the contents thereof are incorporated herein.

In formula (OP-2), a and b each independently represent an integer of 0 to 100, and at least one of a and b is an integer of 1 to 100. a and b are each independently preferably an integer of 0 to 50, more preferably an integer of 1 to 30, and preferably an integer of 1 to 10. When a and/or b is an integer of 2 or more, 2 or more -(YO)- may each independently be an array of one type of structure, or two or more types of structures may be a block or They may be arranged randomly.
Furthermore, when multiple types of compounds represented by formula (OP-2) are included, the average value of a is preferably 1<a<10, and the average value of b is preferably 1<b<10. .

-A- in formula (OP-4) is, for example, a methylene group, ethylidene group, 1-methylethylidene group, 1,1-propylidene group, 1,4-phenylenebis(1-methylethylidene) group, 1, Examples include, but are not limited to, divalent organic groups such as 3-phenylenebis(1-methylethylidene) group, cyclohexylidene group, phenylmethylene group, naphthylmethylene group, and 1-phenylethylidene group. .

Rx has the same meaning as Rx in formula (OP), and the preferred range is also the same.

In the compound represented by the above formula (OP-2), R ⁴ , R ⁵ , R ⁶ , R ¹⁰ , R ¹¹ , R ²⁰ and R ²¹ are alkyl groups having 3 or less carbon atoms, and R ⁷ , R ⁸ , R ⁹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ , R ¹⁸ , R ¹⁹ , R ²² and R ²³ are hydrogen atoms or alkyl groups having 3 or less carbon atoms A polyphenylene ether compound is preferable, and in particular, -(O-X-O)- represented by formula (OP-3) or formula (OP-4) is represented by formula (OP-9) or formula (OP-10). , and/or formula (OP-11), and -(YO)- represented by formula (OP-5) is preferably formula (OP-12) or formula (OP-13) . When a and/or b are integers of 2 or more, -(Y-O)- of 2 or more each independently represents a structure in which two or more of formula (OP-12) and/or formula (OP-13) are arranged. Alternatively, it may have a structure in which formula (OP-12) and formula (OP-13) are arranged in blocks or randomly.

(In formula (OP-10), R ⁴⁴ , R ⁴⁵ , R ⁴⁶ , and R ⁴⁷ may be the same or different and are a hydrogen atom or a methyl group. -B- is a straight line having 20 or less carbon atoms. It is a chain, branched, or cyclic divalent hydrocarbon group.)
Specific examples of -B- include the same examples as -A- in formula (OP-4).
(In formula (OP-11), -B- is a straight chain, branched or cyclic divalent hydrocarbon group having 20 or less carbon atoms.)
Specific examples of -B- include the same examples as -A- in formula (OP-4).

The modified polyphenylene ether compound (g) used in this embodiment is more preferably a compound represented by formula (OP-14) and/or a compound represented by formula (OP-15).
(In formula (OP-14), a and b each independently represent an integer of 0 to 100, and at least one of a and b is an integer of 1 to 100.)
a and b in formula (OP-14) each independently have the same meaning as a and b in formula (OP-2), and the preferred ranges are also the same.
(In formula (OP-15), a and b each independently represent an integer of 0 to 100, and at least one of a and b is an integer of 1 to 100.)
a and b in formula (OP-15) each independently have the same meaning as a and b in formula (OP-2), and the preferred ranges are also the same.

A polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal (preferably a polyphenylene ether compound (B2) containing two or more carbon-carbon unsaturated double bonds, more preferably a modified polyphenylene ether The number average molecular weight (Mn) of compound (g)) as calculated by GPC (gel permeation chromatography) in terms of polystyrene (details follow the method described in the Examples below) is, for example, 500 or more, furthermore, 800 or more. It is preferably 3,000 or less, and preferably 3,000 or less. When the number average molecular weight is 500 or more, stickiness tends to be further suppressed when the resin composition of this embodiment is formed into a coating film. When the number average molecular weight is 3,000 or less, the solubility in a solvent tends to be further improved.
Further, a polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal (preferably a polyphenylene ether compound (B2) containing two or more carbon-carbon unsaturated double bonds, more preferably a modified The polyphenylene ether compound (g)) has a polystyrene-equivalent weight average molecular weight (Mw) determined by GPC (details follow the method described in the Examples below), preferably from 800 to 6,000, and from 800 to 5,000. It is more preferable. By setting the above lower limit or more, the dielectric constant (Dk) and dielectric loss tangent (Df) of the cured product of the resin composition tend to become lower. By setting the above upper limit or less, the varnish etc. described below The solubility, low viscosity, and moldability of the resin composition in the solvent during production tend to be further improved.
Furthermore, in the case of the modified polyphenylene ether compound (g), the terminal carbon-carbon unsaturated double bond equivalent is preferably 400 to 5000 g, and 400 to 2500 g per carbon-carbon unsaturated double bond. It is more preferable that By setting it above the lower limit, the dielectric constant (Dk) and dielectric loss tangent (Df) of the cured product of the resin composition tend to become lower. By setting it below the above upper limit, the solubility of the resin composition in a solvent, low viscosity, and moldability tend to be further improved.

The polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal in the resin composition of the present embodiment (preferably the polyphenylene ether compound (B2) containing two or more carbon-carbon unsaturated double bonds) The lower limit of the content is preferably 10 parts by mass or more, more preferably 30 parts by mass or more, and preferably 50 parts by mass or more, based on 100 parts by mass of resin solids in the resin composition. More preferably, the amount is 60 parts by mass or more. When the amount is equal to or more than the lower limit, the moldability of the resin composition, the heat resistance, low water absorption, and low dielectric properties (Dk and/or Df) of the obtained cured product tend to be further improved. Further, the upper limit of the content of the polyphenylene ether compound (B) containing two or more carbon-carbon unsaturated double bonds should be 90 parts by mass or less based on 100 parts by mass of resin solid content in the resin composition. It is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and even 75 parts by mass or less. When the amount is less than or equal to the upper limit, the resulting cured product tends to have better low dielectric properties (especially low dielectric loss tangent), heat resistance, and chemical resistance.
The resin composition in this embodiment may contain only one type of polyphenylene ether compound (B) containing two or more carbon-carbon unsaturated double bonds, or may contain two or more types. When two or more types are included, it is preferable that the total amount falls within the above range.

In this embodiment, the mass ratio of the content of the resin (A) and the polyphenylene ether compound (B) is resin (A)/polyphenylene ether compound (B) = 5/95 to 70/30. )/polyphenylene ether compound (B)=5/95 to 65/35, more preferably resin (A)/polyphenylene ether compound (B)=5/95 to 55/45, and resin ( It is more preferable that A)/polyphenylene ether compound (B)=5/95 to 45/55, and even more preferable that resin (A)/polyphenylene ether compound (B)=5/95 to 40/60. It is even more preferable that resin (A)/polyphenylene ether compound (B) = 5/95 to 35/65, and resin (A)/polyphenylene ether compound (B) = 7/93 to 35/65. More preferably, the ratio of resin (A)/polyphenylene ether compound (B) is from 10/90 to 35/65. By setting the mass ratio of the content within the above range, the moldability of the resin composition, the heat resistance of the resulting cured product, and the low dielectric properties (Dk and/or Df) tend to be excellent.

In the resin composition of this embodiment, it is preferable that the total content of the resin (A) and the polyphenylene ether compound (B) is 40 parts by mass or more based on 100 parts by mass of the resin solid content in the resin composition. According to It is even more preferable that the amount is at least 75 parts by mass, and may be at least 75 parts by mass. By setting the total content of the resin (A) and the polyphenylene ether compound (B) to the above lower limit or more, the low dielectric properties (Dk and/or Df) of the resulting cured product tend to be further improved. Moreover, it is preferable that the total content of the resin (A) and the polyphenylene ether compound (B) is 100 parts by mass or less based on 100 parts by mass of the resin solid content in the resin composition. By setting the total content of the resin (A) and the polyphenylene ether compound (B) to the above upper limit or less, the moldability of the resin composition, the low dielectric properties (Dk and/or Df), and the heat resistance of the resulting cured product can be improved. , tend to have an excellent balance of chemical resistance, etc.

<Other compounds (C)>
The resin composition of the present embodiment further includes a resin (A), a polyphenylene ether compound (B), and another compound (C) (preferably another curable compound and/or plastic compound, more preferably another thermosetting compound). and/or thermoplastic compounds, more preferably other thermosetting compounds). Other compounds (C) include maleimide compounds, cyanate ester compounds, epoxy compounds, phenol compounds, compounds containing (meth)allyl groups (e.g. alkenylnadimide compounds), oxetane resins, benzoxazine compounds, arylcyclobutene resins. , polyamide resin, polyimide resin, perfluorovinyl ether resin, compound having a styrene group other than the polyphenylene ether compound (B), compound having an isopropenyl group other than the resin having an indane skeleton (A), the polyphenylene ether compound (B) It is preferable to include one or more selected from the group consisting of polyfunctional (meth)acrylate compounds other than ), elastomers, and petroleum resins, including maleimide compounds, cyanate ester compounds, epoxy compounds, phenol compounds, (meth) It is more preferable to include at least one selected from the group consisting of a compound containing an allyl group (for example, an alkenylnadimide compound), an oxetane resin, and a benzoxazine compound. By including such components, the desired performance required of the printed wiring board can be more effectively exhibited.

The resin composition of this embodiment may contain other compounds (C) (preferably other curable compounds and/or plastic compounds, more preferably other thermosetting compounds and/or thermoplastic compounds, even more preferably other thermosetting compounds). curable compound), its content (total amount) is preferably 1 part by mass or more, more preferably 10 parts by mass or more, and 15 parts by mass or more based on 100 parts by mass of resin solid content. It is more preferably 20 parts by mass or more, even more preferably 30 parts by mass or more. By setting it above the lower limit, heat resistance, plating adhesion, low thermal expansion, etc. tend to be further improved. Further, the content of other compounds (C) (preferably other curable compounds and/or plastic compounds, more preferably other thermosetting compounds and/or thermoplastic compounds, still more preferably other thermosetting compounds) The upper limit of the amount is preferably 50 parts by mass or less, more preferably 45 parts by mass or less, and even more preferably 40 parts by mass or less, based on 100 parts by mass of the resin solid content. By setting it below the upper limit value, low dielectric properties (Dk and/or Df) and low water absorption tend to be further improved.
The resin composition of this embodiment may contain only one type of other compound (C), or may contain two or more types. When two or more types are included, it is preferable that the total amount falls within the above range.

<<Maleimide compound>>
The resin composition of this embodiment may contain a maleimide compound.
The maleimide compound may be a compound containing one or more (preferably 2 to 12, more preferably 2 to 6, still more preferably 2 to 4, even more preferably 2 or 3, even more preferably) maleimide groups in the molecule. There are no particular limitations, and a wide variety of compounds commonly used in the field of printed wiring boards can be used.
In this embodiment, the maleimide compound is a compound represented by formula (M0), a compound represented by formula (M1), a compound represented by formula (M2), a compound represented by formula (M3), It is preferable to include one or more selected from the group consisting of a compound represented by formula (M4), a compound represented by formula (M5), a maleimide compound (M6), and a maleimide compound (M7); A compound represented by (M0), a compound represented by formula (M1), a compound represented by formula (M3), a compound represented by formula (M4), a compound represented by formula (M5), and , a maleimide compound (M6), a compound represented by formula (M1), a compound represented by formula (M3), a compound represented by formula (M4), It is more preferable to include one or more selected from the group consisting of a compound represented by formula (M5), a compound represented by formula (M1), and a compound represented by formula (M3). It is more preferable to include one or more selected from the group consisting of , and a compound represented by formula (M5), and a compound represented by formula (M1) and/or a compound represented by formula (M3). The compound represented by formula (M1) is even more preferable. When these maleimide compounds are used in materials for printed wiring boards (for example, metal foil-clad laminates), they can provide excellent heat resistance.

(In formula (M0), R ⁵¹ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, R ⁵² each independently represents a hydrogen atom or a methyl group, and n ₁ represents an integer greater than or equal to 1.)
R ⁵¹ is each independently selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, and a phenyl group. It is preferably one selected from the group, more preferably a hydrogen atom and/or a methyl group, and even more preferably a hydrogen atom.
R ⁵² is preferably a methyl group.
n ₁ is preferably an integer of 1 to 10, more preferably an integer of 1 to 5, even more preferably an integer of 1 to 3, even more preferably 1 or 2, and even more preferably 1.
Specifically, the following compounds are mentioned as preferred examples of formula (M0).
In the above formula, R ⁸ each independently represents a hydrogen atom, a methyl group or an ethyl group, and a methyl group is preferred.

The compound represented by formula (M0) may be one type or a mixture of two or more types. Examples of mixtures include mixtures of compounds in which _n1 is different, mixtures of compounds in which the types of substituents for ^R51 and/or ^R52 are different, and the bonding position of the maleimide group and the oxygen atom to the benzene ring (meta position, para position, Examples include mixtures of compounds having different positions (ortho positions), and mixtures of compounds having two or more of the above-mentioned different points combined. The same applies to the compounds represented by formulas (M1) to (M6) below.
(In formula (M1), R ^M1 , R ^M2 , R ^M3 , and R ^M4 each independently represent a hydrogen atom or an organic group. R ^M5 and R ^M6 each independently represent a hydrogen atom or an alkyl group. Ar ^M represents a divalent aromatic group. A is a 4- to 6-membered alicyclic group. R ^M7 and R ^M8 are each independently an alkyl group. mx is 1 or 2 , and lx is 0 or 1. R ^M9 and R ^M10 each independently represent a hydrogen atom or an alkyl group. R ^M11 , R ^M12 , R ^M13 , and R ^M14 each independently represent a hydrogen atom or represents an organic group. R ^M15 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or a cycloalkyl group having 3 to 10 carbon atoms. px represents an integer of 0 to 3. px represents an integer of 0 to 3. nx represents an integer from 1 to 20.)

R ^M1 , R ^M2 , R ^M3 , and R ^M4 in the formula each independently represent a hydrogen atom or an organic group. The organic group here is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, and a methyl group, an ethyl group, a propyl group, or a butyl group. More preferred is a methyl group, especially a methyl group. R ^M1 and R ^M3 are each independently preferably an alkyl group, and R ^M2 and R ^M4 are preferably a hydrogen atom.
R ^M5 and R ^M6 each independently represent a hydrogen atom or an alkyl group, preferably an alkyl group. The alkyl group here is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group, an ethyl group, a propyl group, or a butyl group, with a methyl group being particularly preferred. preferable.
Ar ^M represents a divalent aromatic group, preferably a phenylene group, a naphthalenediyl group, a phenanthrenediyl group, an anthracenediyl group, more preferably a phenylene group, still more preferably a m-phenylene group. Ar ^M may have a substituent, and the substituent is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, a methyl group, Ethyl group, propyl group, and butyl group are more preferable, and methyl group is particularly preferable. However, it is preferable that Ar ^M is unsubstituted.
A is a 4- to 6-membered alicyclic group, and more preferably a 5-membered alicyclic group (preferably a group that forms an indane ring when combined with a benzene ring). R ^M7 and R ^M8 each independently represent an alkyl group, preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and particularly preferably a methyl group.
mx is 1 or 2, preferably 2.
lx is 0 or 1, preferably 1.
R ^M9 and R ^M10 each independently represent a hydrogen atom or an alkyl group, and an alkyl group is more preferred. The alkyl group here is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group, an ethyl group, a propyl group, or a butyl group, with a methyl group being particularly preferred. preferable.
R ^M11 , R ^M12 , R ^M13 , and R ^M14 each independently represent a hydrogen atom or an organic group. The organic group here is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, and a methyl group, an ethyl group, a propyl group, or a butyl group. More preferred is a methyl group, especially a methyl group. R ^M12 and R ^M13 are each independently preferably an alkyl group, and R ^M11 and R ^M14 are preferably a hydrogen atom.
R ^M15 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, or a cycloalkyl group having 6 to 10 carbon atoms. 10 aryl group, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a halogen atom, a hydroxyl group or a mercapto group, an alkyl group having 1 to 4 carbon atoms, a cyclo group having 3 to 6 carbon atoms, Preferably, it is an alkyl group or an aryl group having 6 to 10 carbon atoms.
px represents an integer of 0 to 3, preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0.
nx represents an integer from 1 to 20. nx may be an integer of 10 or less.
The resin composition of the present embodiment may contain only one type of compound represented by formula (M1), or may contain two or more types of compounds having at least different values of nx. . When two or more types are included, the average value of nx (average number of repeating units) n in the compound represented by formula (M1) in the resin composition has a low melting point (low softening point) and a low melt viscosity, In order to have excellent handling properties, it is preferably 0.92 or more, more preferably 0.95 or more, even more preferably 1.0 or more, and preferably 1.1 or more. More preferred. Further, n is preferably 10.0 or less, more preferably 8.0 or less, even more preferably 7.0 or less, even more preferably 6.0 or less, and 5. It may be 0 or less. The same applies to compounds represented by formula (M1-2) and formula (M1-3) described later.
The compound represented by formula (M1) is preferably a compound represented by formula (M1-1) below.
(In formula (M1-1), R ^M21 , R ^M22 , R ^M23 , and R ^M24 each independently represent a hydrogen atom or an organic group. R ^M25 and R ^M26 each independently represent a hydrogen atom or an alkyl R ^M27 , R ^M28 , R ^M29 , and R ^M30 each independently represent a hydrogen atom or an organic group. R ^M31 and R ^M32 each independently represent a hydrogen atom or an alkyl group. R ^M33 , R ^M34 , R ^M35 , and R ^M36 each independently represent a hydrogen atom or an organic group. R ^M37 , R ^M38 , and R ^M39 each independently represent a hydrogen atom or an alkyl group. nx is Represents an integer between 1 and 20.)

R ^M21 , R ^M22 , R ^M23 , and R ^M24 in the formula each independently represent a hydrogen atom or an organic group. The organic group here is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, and a methyl group, an ethyl group, a propyl group, or a butyl group. More preferred is a methyl group. R ^M21 and R ^M23 are preferably alkyl groups, and R ^M22 and R ^M24 are preferably hydrogen atoms.
R ^M25 and R ^M26 each independently represent a hydrogen atom or an alkyl group, preferably an alkyl group. The alkyl group here is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group, an ethyl group, a propyl group, or a butyl group, with a methyl group being particularly preferred. preferable.
R ^M27 , R ^M28 , R ^M29 , and R ^M30 each independently represent a hydrogen atom or an organic group, and preferably a hydrogen atom. The organic group here is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, and a methyl group, an ethyl group, a propyl group, or a butyl group. More preferred is a methyl group.
R ^M31 and R ^M32 each independently represent a hydrogen atom or an alkyl group, preferably an alkyl group. The alkyl group here is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group, an ethyl group, a propyl group, or a butyl group, with a methyl group being particularly preferred. preferable.
R ^M33 , R ^M34 , R ^M35 , and R ^M36 each independently represent a hydrogen atom or an organic group. The organic group here is preferably an alkyl group, more preferably an alkyl group having 1 to 12 carbon atoms, even more preferably an alkyl group having 1 to 6 carbon atoms, and a methyl group, an ethyl group, a propyl group, or a butyl group. More preferred is a methyl group.
R ^M33 and R ^M36 are preferably hydrogen atoms, and R ^M34 and R ^M35 are preferably alkyl groups.
R ^M37 , R ^M38 , and R ^M39 each independently represent a hydrogen atom or an alkyl group, and an alkyl group is preferable. The alkyl group here is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and still more preferably a methyl group, an ethyl group, a propyl group, or a butyl group, with a methyl group being particularly preferred. preferable.
nx represents an integer from 1 to 20. nx may be an integer of 10 or less.

The compound represented by formula (M1-1) is preferably a compound represented by formula (M1-2) below.
(In formula (M1-2), R ^M21 , R ^M22 , R ^M23 , and R ^M24 each independently represent a hydrogen atom or an organic group. R ^M25 and R ^M26 each independently represent a hydrogen atom or an alkyl R ^M27 , R ^M28 , R ^M29 , and R ^M30 each independently represent a hydrogen atom or an organic group. R ^M31 and R ^M32 each independently represent a hydrogen atom or an alkyl group. R ^M33 , R ^M34 , R ^M35 , and R ^M36 each independently represent a hydrogen atom or an organic group. R ^M37 , R ^M38 , and R ^M39 each independently represent a hydrogen atom or an alkyl group. nx is Represents an integer between 1 and 20.)

In formula (M1-2), ^RM21 , ^RM22 , ^RM23 , ^RM24 , ^RM25 , RM26, ^RM27 , ^RM28 , ^RM29 , ^RM30 ^, ^RM31 , ^RM32 , ^RM33 , ^RM34 , R ^M35 , R ^M36 , R ^M37 , R ^M38 , R ^M39 , and nx are R ^M21 , R ^M22 , R ^M23 , R ^M24 , R ^M25 , R ^M26 , R ^M27 in formula (M1-1), respectively; It is synonymous with R ^M28 , R ^M29 , R ^M30 , R ^M31 , R ^M32 , R ^M33 , R ^M34 , R ^M35 , R ^M36 , R ^M37 , R ^M38 , R ^M39 , and nx, and the preferred ranges are also the same. .

The compound represented by the formula (M1-1) is preferably a compound represented by the following formula (M1-3), and more preferably a compound represented by the following formula (M1-4).
(In formula (M1-3), nx represents an integer from 1 to 20.)
nx may be an integer of 10 or less.
(In formula (M1-4), nx represents an integer from 1 to 20.)
nx may be an integer of 10 or less.

The molecular weight of the compound represented by formula (M1) is preferably 500 or more, more preferably 600 or more, and even more preferably 700 or more. When the amount is equal to or more than the lower limit, the resulting cured product tends to have better low dielectric properties (Dk and/or Df) and low water absorption. Further, the molecular weight of the compound represented by formula (M1) is preferably 10,000 or less, more preferably 9,000 or less, even more preferably 7,000 or less, even more preferably 5,000 or less, It is even more preferable that it is 4000 or less. By setting it below the above-mentioned upper limit, the heat resistance and handleability of the obtained cured product tend to be further improved.

The compound represented by formula (M1) has a maleimide group equivalent of 50 g/eq. or more, preferably 100g/eq. More preferably, it is 200g/eq. It is more preferable that it is above. The upper limit of the maleimide equivalent is 2000 g/eq. It is preferably less than 1000g/eq. It is more preferably less than 800g/eq. It is more preferable that it is the following. Here, the maleimide group equivalent represents the mass of the maleimide compound per 1 equivalent of maleimide group. When the maleimide group equivalent of the compound represented by formula (M1) is within the above range, the resulting cured product tends to have improved low dielectric properties (Dk and/or Df), low water absorption, heat resistance, and handleability. It is in.

The compound represented by formula (M1) preferably has a molecular weight distribution Mw/Mn calculated from gel permeation chromatography (GPC) measurement of 1.0 to 4.0, preferably 1.1 to 3.8. It is more preferably 1.2 to 3.6, even more preferably 1.3 to 3.4. When Mw/Mn of the compound represented by formula (M1) is within the above range, the resulting cured product tends to have improved low dielectric properties (Dk and/or Df), low water absorption, heat resistance, and handleability. It is in.

For other details of the compound represented by formula (M1), the description in International Publication No. 2020-217679 can be referred to, and the contents thereof are incorporated herein.

(In formula (M2), R ⁵⁴ each independently represents a hydrogen atom or a methyl group, and n ₄ represents an integer of 1 or more.)
n ₄ is preferably an integer of 1 to 10, more preferably an integer of 1 to 5, even more preferably an integer of 1 to 3, even more preferably 1 or 2, and may be 1.
The compound represented by formula (M2) may be a mixture of compounds in which n ₄ is different, and is preferably a mixture. Further, as described in the section of the compound represented by formula (M0), it may be a mixture of compounds having different parts.
(In formula (M3), R ⁵⁵ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, and n ₅ represents an integer of 1 to 10.)
R ⁵⁵ is each independently a group consisting of a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, and a phenyl group It is preferably one type selected from these, more preferably a hydrogen atom and/or a methyl group, and even more preferably a hydrogen atom.
n ₅ is preferably an integer of 1 or more and 5 or less, more preferably an integer of 1 to 3, and even more preferably 1 or 2.
The compound represented by formula (M3) may be a mixture of compounds having different n ₅ values, and is preferably a mixture. Further, as described in the section of the compound represented by formula (M0), it may be a mixture of compounds having different parts.
(In formula (M4), R ⁵⁶ each independently represents a hydrogen atom, a methyl group, or an ethyl group, and R ⁵⁷ each independently represents a hydrogen atom or a methyl group.)
R ⁵⁶ is preferably each independently a methyl group or an ethyl group, more preferably a methyl group and an ethyl group in each of the two benzene rings, and R ⁵⁷ is preferably a methyl group.

(In formula (M5), R ⁵⁸ each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a phenyl group, R ⁵⁹ each independently represents a hydrogen atom or a methyl group, and n ₆ represents an integer greater than or equal to 1.)
R ⁵⁸ each independently represents a group consisting of a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, and a phenyl group It is preferably one type selected from these, more preferably a hydrogen atom and/or a methyl group, and even more preferably a hydrogen atom.
R ⁵⁹ is preferably a methyl group.
n ₆ is preferably an integer of 1 to 10, more preferably an integer of 1 to 5, even more preferably an integer of 1 to 3, even more preferably 1 or 2, and may be 1.
The compound represented by formula (M5) may be a mixture of compounds having different n ₆ values, and is preferably a mixture. Further, as described in the section of the compound represented by formula (M0), it may be a mixture of compounds having different parts.

The maleimide compound (M6) is a compound having a structural unit represented by formula (M6) and maleimide groups at both ends of the molecular chain.
(In formula (M6), R ⁶¹ represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. R ⁶² is R ⁶³ represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Represents a chain or branched alkyl group, or a straight or branched alkenyl group having 2 to 16 carbon atoms. Each n independently represents an integer of 0 to 10.)
For details of the maleimide compound (M6) and its manufacturing method, the description in paragraphs 0061 to 0066 of International Publication No. 2020/262577 can be referred to, the contents of which are incorporated herein.

The maleimide compound (M7) is produced by reacting an aromatic amine compound (a1) having 1 to 3 alkyl groups in its aromatic ring, an aromatic divinyl compound (a2) having 2 ethenyl groups, and maleic anhydride as raw materials ( 1) is a maleimide compound.
The maleimide compound (M7) is preferably a compound represented by formula (M7).
(In the above formula (M7), R ¹ each independently represents the alkyl group, R ² each independently represents an alkyl group, alkoxy group, or alkylthio group having 1 to 10 carbon atoms; represents an aryl group, aryloxy group or arylthio group; a cycloalkyl group having 3 to 10 carbon atoms; a halogen atom; a hydroxyl group; or a mercapto group;
R ³ , R ⁴ , R ⁵ and R ⁶ each independently represent a hydrogen atom or a methyl group, and one of R ³ and R ⁴ is a hydrogen atom and the other is a methyl group, and R ⁵ and R ⁶ are One is a hydrogen atom, the other is a methyl group,
X ¹ is the following formula (x):
(In formula (x), R ⁷ and R ⁸ each independently represent a hydrogen atom or a methyl group, and one of R ⁷ and R ⁸ is a hydrogen atom, the other is a methyl group, and R ⁹ is each independently an alkyl group, alkoxy group or alkylthio group having 1 to 10 carbon atoms; an aryl group, aryloxy group or arylthio group having 6 to 10 carbon atoms; a cycloalkyl group having 3 to 10 carbon atoms; a halogen atom; a hydroxyl group; or It represents a mercapto group, and t represents an integer from 0 to 4.)
represents a substituent represented by, r is the average value of the number of substitutions of X ¹ per benzene ring to which X ¹ is bonded, and represents a number from 0 to 4, p is an integer from 1 to 3 , q represents an integer from 0 to 4, and k represents an integer from 1 to 100. )

For details of the polymaleimide compound (M7) used in this embodiment, the description in Japanese Patent No. 7160151 can be referred to, the contents of which are incorporated herein.

The maleimide compound may be produced by a known method, or a commercially available product may be used. Commercially available products include, for example, "BMI-80" manufactured by K.I. Kasei Co., Ltd. as a compound represented by formula (M0), and "NE-X-9470S" manufactured by DIC Corporation as a compound represented by formula (M1). ", the compound represented by formula (M2) is "BMI-2300" manufactured by Daiwa Chemical Industries, Ltd., and the compound represented by formula (M3) is "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., formula ( The compound represented by M4) is "BMI-70" manufactured by K.I. Kasei Co., Ltd., the compound represented by formula (M5) is "MIR-5000" manufactured by Nippon Kayaku Co., Ltd., and the maleimide compound (M6) is manufactured by Nippon Kayaku Co., Ltd. Examples include "MIZ-001" manufactured by Kayaku Co., Ltd., and "NE-X-9500" manufactured by DIC Corporation as the maleimide compound (M7).

In addition, examples of maleimide compounds other than those mentioned above include N-phenylmaleimide, N-cyclohexylmaleimide, oligomers of phenylmethanemaleimide, m-phenylenebismaleimide, 4-methyl-1,3-phenylenebismaleimide, 1,6- Bismaleimide-(2,2,4-trimethyl)hexane, 4,4'-diphenyl ether bismaleimide, 4,4'-diphenylsulfone bismaleimide, 1,3-bis(3-maleimidophenoxy)benzene, 1,3- Examples include bis(4-maleimidophenoxy)benzene, prepolymers thereof, and prepolymers of these maleimides and amines.

When the resin composition of the present embodiment contains a maleimide compound, the lower limit of its content is preferably 1 part by mass or more, and 5 parts by mass or more, based on 100 parts by mass of resin solids in the resin composition. The amount is more preferably 10 parts by mass or more, even more preferably 20 parts by mass or more, and even more preferably 25 parts by mass or more. When the content of the maleimide compound is 1 part by mass or more, the resulting cured product tends to have improved low dielectric properties and flame resistance. Further, the upper limit of the content of the maleimide compound is preferably 70 parts by mass or less, more preferably 50 parts by mass or less, and 40 parts by mass based on 100 parts by mass of the resin solid content in the resin composition. It may be the following. When the content of the maleimide compound is 70 parts by mass or less, the metal foil peel strength and low water absorption tend to improve.
The resin composition in this embodiment may contain only one type of maleimide compound, or may contain two or more types of maleimide compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also have a structure that does not substantially contain a maleimide compound. "Substantially free" means that the content of the maleimide compound is less than 1 part by mass, preferably less than 0.1 part by mass, with respect to 100 parts by mass of resin solids in the resin composition. More preferably, it is less than .01 part by mass.

<<Cyanate ester compound>>
The resin composition of this embodiment may contain a cyanate ester compound.
The cyanate ester compound has one or more cyanate groups (cyanato groups) in the molecule (preferably 2 to 12, more preferably 2 to 6, still more preferably 2 to 4, even more preferably 2 or 3, even more preferably 2) There are no particular limitations as long as the compound is included, and a wide range of compounds commonly used in the field of printed wiring boards can be used.

The cyanate ester compound is preferably a cyanate ester compound having two or more aromatic moieties substituted with at least one cyanato group in the molecule, which are commonly used in printed wiring boards.
Specifically, the lower limit of the number of cyanato groups that the cyanate ester compound has is preferably 2 or more, and more preferably 3 or more. When the content is equal to or more than the above lower limit, heat resistance tends to be further improved. Further, the upper limit of the number of cyanato groups is preferably 100 or less, more preferably 50 or less.
Further, it is preferable that the cured product of the cyanate ester compound has excellent low dielectric properties (Dk and/or Df). For example, the cured product of the cyanate ester compound preferably has a dielectric constant (Dk) of 4.0 or less, more preferably 3.5 or less, at a frequency of 10 GHz measured according to the cavity resonance perturbation method. Further, the lower limit of the dielectric constant is practically, for example, 2.0 or more. Further, the cured product of the cyanate ester compound (B) preferably has a dielectric loss tangent (Df) of 0.02 or less, more preferably 0.015 or less at a frequency of 10 GHz measured according to the cavity resonance perturbation method. . Further, the lower limit value of the dielectric loss tangent is practically, for example, 0.0001 or more. The dielectric constant and dielectric loss tangent can be measured, for example, according to the method described in Examples (curing conditions, measurement conditions).

Furthermore, it is preferable that the cured product of the cyanate ester compound has high heat resistance. The cured product of the cyanate ester compound preferably has a glass transition temperature of 150°C or higher, more preferably 180°C or higher, and further preferably 200°C or higher, as measured according to JIS C6481 dynamic viscoelasticity measurement. preferable. By setting the glass transition temperature to the lower limit or higher, a cured product with excellent heat resistance can be obtained.

The cyanate ester compound preferably has a weight average molecular weight of 200 or more, more preferably 300 or more, and even more preferably 400 or more, as determined by GPC in terms of polystyrene. By setting the weight average molecular weight to the above lower limit or more, heat resistance tends to be further improved. Further, the weight average molecular weight of the cyanate ester compound is preferably 1000 or less, more preferably 900 or less, and even more preferably 800 or less. By controlling the weight average molecular weight to be less than or equal to the above upper limit, moldability and handleability tend to be further improved.

As for the preferred range of the cyanate ester compound, the description in paragraphs 0028 to 0033 of International Publication No. 2021/172317 can be referred to, the contents of which are incorporated herein.

Preferred cyanate ester compounds include phenol novolac type cyanate ester compounds, naphthol aralkyl type cyanate ester compounds (naphthol aralkyl type cyanate), naphthylene ether type cyanate ester compounds, biphenylaralkyl type cyanate ester compounds, and xylene resin type cyanate ester compounds. At least one selected from the group consisting of a cyanate ester compound, a trisphenolmethane type cyanate ester compound, an adamantane skeleton type cyanate ester compound, a bisphenol M type cyanate ester compound, and a bisphenol A type cyanate ester compound. Can be mentioned. Among these, from the viewpoint of further improving low water absorption, phenol novolak type cyanate ester compounds, naphthol aralkyl type cyanate ester compounds, naphthylene ether type cyanate ester compounds, xylene resin type cyanate ester compounds, and It is preferably at least one selected from the group consisting of bisphenol M-type cyanate ester compounds, bisphenol A-type cyanate ester compounds, phenol novolac-type cyanate ester compounds, naphthol aralkyl-type cyanate ester compounds, and naphthylene ether. It is more preferably at least one selected from the group consisting of a cyanate ester compound, a bisphenol A cyanate ester compound, and a bisphenol M cyanate ester compound, a phenol novolak cyanate ester compound, a naphthol aralkyl It is more preferable that the compound is at least one selected from the group consisting of a cyanate ester compound and a bisphenol A cyanate ester compound, and a naphthol aralkyl cyanate ester compound and/or a bisphenol A cyanate ester compound. More preferably, it is a naphthol aralkyl cyanate ester compound.

As the naphthol aralkyl cyanate ester compound, a compound represented by formula (N1) is more preferable.

Formula (N1)
(In formula (N1), R ³ each independently represents a hydrogen atom or a methyl group, and n3 represents an integer of 1 or more.)

In formula (N1), R ³ each independently represents a hydrogen atom or a methyl group, and among these, a hydrogen atom is preferred.
In formula (N1), n3 is an integer of 1 or more, preferably an integer of 1 to 50, more preferably an integer of 1 to 20, even more preferably an integer of 1 to 10. , more preferably an integer from 1 to 6.

Further, the phenol novolac type cyanate ester compound is not particularly limited, but for example, a compound represented by formula (VII) is preferable.
(In formula (VII), R ⁶ each independently represents a hydrogen atom or a methyl group, and n 7 represents an integer of 1 or more.)

In formula (VII), R ⁶ each independently represents a hydrogen atom or a methyl group, and among these, a hydrogen atom is preferred.
In formula (VII), n7 is an integer of 1 or more, preferably an integer of 1 to 20, more preferably an integer of 1 to 10, and even more preferably an integer of 1 to 6.

The bisphenol A cyanate ester compound is 1 selected from the group consisting of 2,2-bis(4-cyanatophenyl)propane and a prepolymer of 2,2-bis(4-cyanatophenyl)propane. More than one species may be used.

These cyanate ester compounds may be prepared by known methods, or commercially available products may be used. Note that cyanate ester compounds having a naphthol aralkyl skeleton, naphthylene ether skeleton, xylene skeleton, trisphenolmethane skeleton, or adamantane skeleton have a relatively large number of functional group equivalents, and the number of unreacted cyanate ester groups is small. Therefore, resin compositions using these materials tend to have even better low water absorption. Moreover, mainly due to having an aromatic skeleton or an adamantane skeleton, plating adhesion tends to be further improved.

When the resin composition of the present embodiment contains a cyanate ester compound, the lower limit of its content is preferably 1 part by mass or more based on 100 parts by mass of resin solids in the resin composition, and 5 parts by mass or more. It is more preferably at least 10 parts by mass, even more preferably at least 10 parts by mass, and may be at least 20 parts by mass. When the content of the cyanate ester compound is at least the above lower limit, heat resistance, flame resistance, chemical resistance, low dielectric constant, low dielectric loss tangent, and insulation properties tend to improve. When the resin composition of this embodiment contains a cyanate ester compound, the upper limit of the content of the cyanate ester compound may be 70 parts by mass or less based on 100 parts by mass of the resin solid content in the resin composition. It is preferably 60 parts by mass or less, more preferably 50 parts by mass or less, and may be 40 parts by mass or less, or 30 parts by mass or less.
The resin composition in this embodiment may contain only one type of cyanate ester compound, or may contain two or more types of cyanate ester compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also be configured to substantially not contain a cyanate ester compound. "Substantially free" means that the content of the cyanate ester compound is less than 1 part by mass, preferably less than 0.1 part by mass, per 100 parts by mass of resin solids in the resin composition. , more preferably less than 0.01 part by mass.

<<Epoxy compound>>
The resin composition of this embodiment may contain an epoxy compound.
An epoxy compound is a compound having one or more (preferably 2 to 12, more preferably 2 to 6, still more preferably 2 to 4, even more preferably 2 or 3, even more preferably 2) epoxy groups in one molecule. Alternatively, it is not particularly limited as long as it is a resin, and a wide variety of compounds commonly used in the field of printed wiring boards can be used.
Examples of epoxy compounds include bisphenol A epoxy resin, bisphenol E epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, bisphenol A novolac epoxy resin, glycidyl ester epoxy resin, and aralkyl epoxy resin. Novolac type epoxy resin, biphenylaralkyl type epoxy resin, naphthylene ether type epoxy resin, cresol novolac type epoxy resin, multifunctional phenol type epoxy resin, naphthalene type epoxy resin, anthracene type epoxy resin, naphthalene skeleton modified novolac type epoxy resin, phenol Aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, polyol type epoxy resin, phosphorus-containing epoxy resin, glycidyl amine, glycidyl ester, butadiene, etc. Examples include compounds in which bonds are epoxidized and compounds obtained by reacting hydroxyl group-containing silicone resins with epichlorohydrin. By using these, the moldability and adhesion of the resin composition are improved. Among these, from the viewpoint of further improving flame retardancy and heat resistance, biphenylaralkyl epoxy resins, naphthylene ether epoxy resins, polyfunctional phenol epoxy resins, and naphthalene epoxy resins are preferred; More preferably, it is a type epoxy resin.

The resin composition of the present embodiment preferably contains an epoxy compound within a range that does not impair the effects of the present invention. From the viewpoint of moldability and adhesion, when the resin composition of this embodiment contains an epoxy compound, the content is 0.1 part by mass or more with respect to 100 parts by mass of resin solid content in the resin composition. The amount is preferably 1 part by mass or more, more preferably 2 parts by mass or more. When the content of the epoxy compound is 0.1 part by mass or more, the peel strength and toughness of the metal foil tend to improve. When the resin composition of this embodiment contains an epoxy compound, the upper limit of the content of the epoxy compound is preferably 50 parts by mass or less, and 30 parts by mass or less, based on 100 parts by mass of the resin solid content in the resin composition. The amount is more preferably at most 20 parts by mass, even more preferably at most 10 parts by mass, and may be at most 8 parts by mass, and may be at most 5 parts by mass. When the content of the epoxy compound is 50 parts by mass or less, the electrical properties of the obtained cured product tend to improve.
The resin composition in this embodiment may contain only one type of epoxy compound, or may contain two or more types of epoxy compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also have a structure that does not substantially contain an epoxy compound. "Substantially free" means that the content of the epoxy compound is less than 0.1 parts by mass, preferably less than 0.01 parts by mass, based on 100 parts by mass of resin solids in the resin composition. , and even less than 0.001 part by mass.

<<Phenol compounds>>
The resin composition of this embodiment may contain a phenol compound.
For details of the phenolic resin, the description in paragraph 0049 of International Publication No. 2021/172317 can be referred to, and the contents thereof are incorporated herein.

The resin composition of the present embodiment preferably contains a phenol compound within a range that does not impair the effects of the present invention. When the resin composition of the present embodiment contains a phenol compound, the content thereof is preferably 0.1 parts by mass or more, and 50 parts by mass based on 100 parts by mass of resin solids in the resin composition. It is preferable that it is below.
The resin composition in this embodiment may contain only one type of phenol compound, or may contain two or more types of phenol compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also have a structure that does not substantially contain a phenol compound. "Substantially free" means that the content of the phenol compound is less than 0.1 parts by mass based on 100 parts by mass of resin solids in the resin composition.

<<Compound containing (meth)allyl group>>
The resin composition of this embodiment preferably contains a compound containing a (meth)allyl group, and more preferably contains a compound containing an allyl group.
Further, the compound containing a (meth)allyl group is preferably a compound containing two or more (meth)allyl groups, and more preferably a compound containing two or more allyl groups.
Examples of compounds containing a (meth)allyl group include (meth)allyl isocyanurate compounds, tri(meth)allyl cyanurate compounds, (meth)allyl group-substituted nadimide compounds, (meth)allyl compounds having a glycoluril structure, and The group preferably contains at least one selected from the group consisting of diallyl phthalate, and the group consisting of (meth)allyl isocyanurate compounds, (meth)allyl group-substituted nadimide compounds, and (meth)allyl compounds having a glycoluril structure. It is more preferable that at least one selected from It is even more preferable.

Examples of tri(meth)allyl cyanurate compounds include tri(meth)allyl cyanurate compounds (for example, triallyl cyanurate having the structure shown below).
In addition, as a compound containing a (meth)allyl group, resins having an allyl group described in International Publication No. 2022/210095 (for example, compounds described in Synthesis Examples 3, 4, 6, 20, and 22 of the same publication) is exemplified, the contents of which are incorporated herein.

When the resin composition of the present embodiment contains a compound containing a (meth)allyl group, its molecular weight is preferably 195 or more, more preferably 300 or more, and even more preferably 400 or more. , more preferably 500 or more. When the content is equal to or more than the lower limit, the low dielectric property and heat resistance tend to be further improved. The molecular weight of the compound containing a (meth)allyl group is also preferably 3,000 or less, more preferably 2,000 or less, even more preferably 1,000 or less, and even more preferably 800 or less. By setting it below the upper limit value, the low thermal expansion property tends to be further improved.

When the resin composition of the present embodiment contains a compound containing a (meth)allyl group, the content thereof is preferably 1 part by mass or more, and 3 parts by mass or more based on 100 parts by mass of resin solids in the resin composition. It is more preferably at least 5 parts by mass, even more preferably at least 5 parts by mass, and may be at least 10 parts by mass. By setting the content of the compound containing a (meth)allyl group to the above lower limit or more, moldability tends to be excellent and heat resistance is further improved. Further, the upper limit of the content of the compound containing a (meth)allyl group is preferably 40 parts by mass or less, and preferably 30 parts by mass or less, based on 100 parts by mass of the resin solid content in the resin composition. More preferably, the amount is 20 parts by mass or less. By controlling the content of the compound containing a (meth)allyl group to the above upper limit value or less, the low thermal expansion property tends to be further improved.
The resin composition of this embodiment may contain only one type of compound containing a (meth)allyl group, or may contain two or more types. When two or more types are included, it is preferable that the total amount falls within the above range.

<<<(meth)allylisocyanurate compound>>>
The (meth)allyl isocyanurate compound is not particularly defined as long as it has two or more (meth)allyl groups and an isocyanurate ring (nurate skeleton). Since the (meth)allylisocyanurate compound has a large number of (meth)allyl groups that serve as crosslinking points, it is difficult to combine the resin (A), the polyphenylene ether compound (B), and other resin components (for example, other compounds (C)). There is a tendency to obtain a cured product that is strongly cured and has excellent low dielectric properties (Dk and/or Df) and heat resistance. As the (meth)allylisocyanurate compound, a compound represented by formula (TA) is preferable.
Formula (TA)
(In formula (TA), ^RA represents a substituent).

In formula (TA), R ^A represents a substituent, and a substituent having a formula weight of 15 to 500 is more preferable.

A first example of R ^A is an alkyl group having 1 to 22 carbon atoms or an alkenyl group having 2 to 22 carbon atoms. A resin composition capable of obtaining a cured product having excellent crosslinkability and high toughness by using an allyl compound having an alkyl group having 1 to 22 carbon atoms or an alkenyl group having 2 to 22 carbon atoms. can be provided. Thereby, even if the resin composition does not include a base material such as glass cloth, it is possible to suppress cracking during etching treatment or the like.
The number of carbon atoms in the alkyl group and/or alkenyl group is preferably 3 or more, more preferably 8 or more, and furthermore, may be 12 or more and 18 or less, from the viewpoint of improving handling properties. As a result, the resin composition has good resin flowability, and it is considered that the resin composition of the present embodiment has better circuit filling properties when producing a multilayer circuit board or the like.

A second example of R ^A is a group containing an allyl isocyanurate group. When R ^A contains an allyl isocyanurate group, the compound represented by formula (TA) is preferably a compound represented by formula (TA-1).
Formula (TA-1)
(In formula (TA-1), R ^A2 is a divalent linking group.)

In formula (TA-1), R ^A2 is preferably a divalent linking group having a formula weight of 54 to 250, and a divalent linking group having a formula weight of 54 to 250 and having carbon atoms at both ends. is more preferable, and an aliphatic hydrocarbon group having 2 to 20 carbon atoms is even more preferable (however, the aliphatic hydrocarbon group may contain an ether group, and may have a hydroxyl group). ). More specifically, R ^A2 is preferably a group represented by any of the following formulas (i) to (iii).
(In the formulas (i) to (iii), p ^c1 represents the number of repeating units of the methylene group and is an integer from 2 to 18. ^{p c2} represents the number of repeating units of the oxyethylene group and is 0 or 1. .* is the binding site.)
The p ^c1 is preferably an integer of 2 to 10, more preferably an integer of 3 to 8, and still more preferably an integer of 3 to 5.
The p ^c2 may be 0 or 1, but is preferably 1.

A third example of R ^A is a phosphorus-based substituent.

Preferably, R ^A2 is the first example.

In this embodiment, it is preferable that the reactive group (allyl group) equivalent of the compound represented by formula (TA) is 1000 g/eq. or less. It is considered that if the equivalent weight is 1000 g/eq. or less, a high Tg can be obtained more reliably.

Examples of the alkyl group having 1 to 22 carbon atoms include linear or branched alkyl groups, such as methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group. group, nonyl group, decyl group, dodecyl group, tetradecyl group, hexadecyl group, octadecyl group, eicosyl group, docosyl group, and the like. Further, examples of the alkenyl group having 2 to 22 carbon atoms include an allyl group and a decenyl group.

Specific examples of the compound represented by formula (TA) include triallylisocyanurate, 5-octyl-1,3-diallylisocyanurate, 5-dodecyl-1,3-diallylisocyanurate, 5-tetradecyl- 1,3-diallylisocyanurate, 5-hexadecyl-1,3-diallylisocyanurate, 5-octadecyl-1,3-diallylisocyanurate, 5-eicosyl-1,3-diallylisocyanurate, 5-docosyl-1, Examples include 3-diallylisocyanurate and 5-decenyl-1,3-diallylisocyanurate. These may be used alone or in combination of two or more, or may be used as a prepolymer.

The method for producing the compound represented by formula (TA) is not particularly limited, but for example, diallylisocyanurate and alkyl halide are mixed in an aprotic polar solvent such as N,N'-dimethylformamide, and sodium hydroxide is added. It can be obtained by reacting at a temperature of about 60°C to 150°C in the presence of a basic substance such as , potassium carbonate, or triethylamine.

Furthermore, commercially available compounds can also be used as the compound represented by formula (TA). Commercially available products include, but are not particularly limited to, L-DAIC manufactured by Shikoku Kasei Kogyo Co., Ltd. and P-DAIC manufactured by Shikoku Kasei Kogyo Co., Ltd. having a phosphorus substituent. Examples of triallyl isocyanurate include TAIC manufactured by Shinryo Co., Ltd. Examples of the compound represented by formula (TA-1) include DD-1 manufactured by Shikoku Kasei Kogyo Co., Ltd.

The molecular weight of the (meth)allylisocyanurate compound (preferably the compound represented by formula (TA)) is preferably 200 or more, more preferably 300 or more, and even more preferably 400 or more. , more preferably 500 or more. By setting the molecular weight to the lower limit value or more, the resulting cured product tends to have improved low dielectric properties (Dk and/or Df) and heat resistance. Further, the molecular weight of the (meth)allylisocyanurate compound (preferably the compound represented by formula (TA)) is preferably 3000 or less, more preferably 2000 or less, and preferably 1000 or less. More preferably, it is 800 or less. By controlling the molecular weight to be less than or equal to the upper limit value, the resulting cured product tends to have improved low thermal expansion properties.

When the resin composition of the present embodiment contains a (meth)allylisocyanurate compound, the content thereof is preferably 1 part by mass or more, and 3 parts by mass based on 100 parts by mass of resin solids in the resin composition. It is more preferably at least 5 parts by mass, even more preferably at least 5 parts by mass, and may be at least 10 parts by mass. By setting the content of the (meth)allylisocyanurate compound to the above lower limit or more, the resin composition tends to have excellent moldability, and the heat resistance and low thermal expansion properties of the resulting cured product tend to be further improved. Further, the upper limit of the content of the (meth)allylisocyanurate compound is preferably 40 parts by mass or less, more preferably 30 parts by mass or less, based on 100 parts by mass of the resin solid content in the resin composition. Preferably, the amount may be 20 parts by mass or less. By controlling the content of the (meth)allylisocyanurate compound to the above upper limit or less, the heat resistance and low dielectric properties (Dk and/or Df) of the resulting cured product tend to be further improved.
The resin composition of the present embodiment may contain only one type of (meth)allylisocyanurate compound, or may contain two or more types of (meth)allyl isocyanurate compounds. When two or more types are included, it is preferable that the total amount falls within the above range.

<<<(meth)allyl group-substituted nadimide compound>>>
The (meth)allyl-substituted nadimide compound is not particularly limited as long as it is a compound having two or more (meth)allyl-substituted nadimide groups in the molecule. A specific example thereof is a compound represented by the following formula (AN).
Formula (AN)
(In formula (AN), R ₁ each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R ₂ represents an alkylene group having 1 to 6 carbon atoms, a phenylene group, a biphenylene group, Represents a naphthylene group or a group represented by formula (AN-2) or (AN-3).
Formula (AN-2)
(In formula (AN-2), R ₃ is represented by a methylene group, an isopropylidene group, -C(=O)-, -O-, -S-, or -S(=O) ₂ - (Represents a group.)
Formula (AN-3)
(In formula (AN-3), R ₄ each independently represents an alkylene group having 1 to 4 carbon atoms or a cycloalkylene group having 5 to 8 carbon atoms.)

Moreover, a commercially available compound can also be used as the compound represented by formula (AN). Commercially available compounds include, but are not particularly limited to, compounds represented by the formula (AN-4) (BANI-M (manufactured by Maruzen Petrochemical Co., Ltd.)), compounds represented by the formula (AN-5), Examples include compounds such as BANI-X (manufactured by Maruzen Petrochemical Co., Ltd.). These may be used alone or in combination of two or more.
Formula (AN-4)
Formula (AN-5)

The molecular weight of the (meth)allyl group-substituted nadimide compound (preferably the compound represented by formula (AN)) is preferably 400 or more, more preferably 500 or more, and may be 550 or more. By setting the molecular weight of the (meth)allyl group-substituted nadimide compound to the above lower limit or more, low dielectricity, low thermal expansion, and heat resistance tend to be further improved. The molecular weight of the (meth)allyl group-substituted nadimide compound (preferably a compound represented by formula (AN)) is also preferably 1,500 or less, more preferably 1,000 or less, and preferably 800 or less. More preferably, it may be 700 or less, or 600 or less. By controlling the molecular weight of the (meth)allyl group-substituted nadimide compound to be less than or equal to the above upper limit, moldability and peel strength tend to be further improved.

When the resin composition of the present embodiment contains a (meth)allyl group-substituted nadimide compound (preferably a compound represented by formula (AN)), the content thereof is based on 100 parts by mass of the resin solid content in the resin composition. On the other hand, it is preferably 1 part by mass or more, more preferably 3 parts by mass or more, even more preferably 5 parts by mass or more, and may be 10 parts by mass or more. By setting the content of the (meth)allyl group-substituted nadimide compound to the above lower limit or more, moldability tends to be excellent, and low dielectricity, low thermal expansion, and heat resistance tend to be further improved. Further, the upper limit of the content of the (meth)allyl group-substituted nadimide compound (preferably the compound represented by formula (AN)) is 40 parts by mass or less with respect to 100 parts by mass of the resin solid content in the resin composition. The amount is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, and may be 20 parts by mass or less. By controlling the content of the (meth)allyl group-substituted nadimide compound to the above upper limit or less, moldability and peel strength tend to be further improved.
The resin composition of this embodiment may contain only one kind of (meth)allyl group-substituted nadimide compound, or may contain two or more kinds. When two or more types are included, it is preferable that the total amount falls within the above range.

<<<(meth)allyl compound having glycoluril structure>>>
The (meth)allyl compound having a glycoluril structure is not particularly defined as long as it is a compound containing a glycoluril structure and two or more (meth)allyl groups. Also when a (meth)allyl compound having a glycoluril structure is blended into the resin composition, the number of (meth)allyl groups can be increased, that is, the number of crosslinking points can be increased. Therefore, like the (meth)allylisocyanurate compound, it hardens firmly with the resin (A), the polyphenylene ether compound (B), and other resin components (for example, other compounds (C)), and has low dielectric properties (Dk and/or Df), and a cured product with excellent heat resistance tends to be obtained.
In this embodiment, the (meth)allyl compound having a glycoluril structure is preferably a compound represented by formula (GU).
Formula (GU)
(In formula (GU), each R is independently a hydrogen atom or a substituent, and at least two of R are groups containing a (meth)allyl group.)
In formula (GU), each R is preferably a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or an alkenyl group having 2 to 5 carbon atoms, and an alkenyl group having 2 to 5 carbon atoms. It is preferably a (meth)allyl group, more preferably an allyl group.
In formula (GU), R is preferably a group in which three or four of them contain (meth)allyl groups, and more preferably a group in which four of them contain (meth)allyl groups.

A specific example of the compound represented by formula (GU) is 1,3,4,6-tetraallylglycoluril (a compound in which all R's are allyl groups in formula (GU)).

Further, as the compound represented by formula (GU), a commercially available one can also be used. Commercially available products include, but are not particularly limited to, TA-G manufactured by Shikoku Kasei Kogyo Co., Ltd., for example.

The molecular weight of the (meth)allyl compound having a glycoluril structure (preferably a compound represented by formula (GU)) is preferably 195 or more, more preferably 220 or more, and preferably 250 or more. More preferably, it may be 300 or more, or 400 or more. By setting the molecular weight of the (meth)allyl compound having a glycoluril structure to the above lower limit or more, the heat resistance and low thermal expansion properties of the resulting cured product tend to be further improved. The molecular weight of the (meth)allyl compound having a glycoluril structure (preferably a compound represented by formula (GU)) is also preferably 1500 or less, more preferably 1000 or less, and 800 or less. More preferably, it is 700 or less, or may be 600 or less. By controlling the molecular weight of the (meth)allyl compound having a glycoluril structure to be less than or equal to the above upper limit, the resulting cured product tends to have improved low dielectric properties (Dk and/or Df) and heat resistance.

When the resin composition of the present embodiment contains a (meth)allyl compound having a glycoluril structure (preferably a compound represented by formula (GU)), the content thereof is based on 100 mass of resin solid content in the resin composition. It is preferably 1 part by mass or more, more preferably 3 parts by mass or more, even more preferably 5 parts by mass or more, and may be 10 parts by mass or more. By setting the content of the (meth)allyl compound having a glycoluril structure to the above lower limit or more, the resin composition tends to have excellent moldability, and the heat resistance and low thermal expansion of the obtained cured product tend to be further improved. . In addition, the upper limit of the content of the (meth)allyl compound having a glycoluril structure (preferably a compound represented by formula (GU)) is 40 parts by mass based on 100 parts by mass of the resin solid content in the resin composition. It is preferably at most 30 parts by mass, more preferably at most 25 parts by mass, and may be at most 20 parts by mass. By controlling the content of the (meth)allyl compound having a glycoluril structure to the above upper limit or less, the low dielectric properties (Dk and/or Df) of the obtained cured product tend to be further improved.
The resin composition of this embodiment may contain only one kind of (meth)allyl compound having a glycoluril structure, or may contain two or more kinds. When two or more types are included, it is preferable that the total amount falls within the above range.

<<Oxetane resin>>
The resin composition of this embodiment may contain oxetane resin.
The oxetane resin is particularly a compound having one or more oxetanyl groups (preferably 2 to 12, more preferably 2 to 6, even more preferably 2 to 4, even more preferably 2 or 3, even more preferably 2). There are no limitations, and a wide variety of compounds commonly used in the field of printed wiring boards can be used.
Examples of the oxetane resin include oxetane, alkyloxetane (for example, 2-methyloxetane, 2,2-dimethyloxetane, 3-methyloxetane, 3,3-dimethyloxetane, etc.), 3-methyl-3-methoxymethyloxetane, 3,3-di(trifluoromethyl)oxetane, 2-chloromethyloxetane, 3,3-bis(chloromethyl)oxetane, biphenyl-type oxetane, OXT-101 (manufactured by Toagosei Co., Ltd.), OXT-121 (manufactured by Toagosei Co., Ltd.) ), etc.

The resin composition of this embodiment preferably contains an oxetane resin within a range that does not impair the effects of the present invention. When the resin composition of the present embodiment contains an oxetane resin, the content thereof is preferably 0.1 parts by mass or more, and 1 part by mass or more based on 100 parts by mass of resin solids in the resin composition. More preferably, the amount is 2 parts by mass or more. When the content of the oxetane resin is 0.1 part by mass or more, the metal foil peel strength and toughness of the resulting cured product tend to improve. When the resin composition of this embodiment contains an oxetane resin, the upper limit of the content of oxetane resin is preferably 50 parts by mass or less, and 30 parts by mass or less, based on 100 parts by mass of resin solid content in the resin composition. It is more preferably at most 20 parts by mass, even more preferably at most 10 parts by mass, even more preferably at most 8 parts by mass. When the content of the oxetane resin is 50 parts by mass or less, the electrical properties of the resulting cured product tend to improve.
The resin composition in this embodiment may contain only one type of oxetane resin, or may contain two or more types of oxetane resin. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also be configured to substantially not contain oxetane resin. "Substantially free" means that the content of oxetane resin is less than 0.1 part by mass based on 100 parts by mass of resin solid content in the resin composition.

<<Benzoxazine compound>>
The resin composition of this embodiment may contain a benzoxazine compound.
The benzoxazine compound includes 2 or more (preferably 2 to 12, more preferably 2 to 6, even more preferably 2 to 4, even more preferably 2 or 3, even more preferably 2) dihydrobenzoxazines in one molecule. Any compound having a ring is not particularly limited, and a wide variety of compounds commonly used in the field of printed wiring boards can be used.
Examples of benzoxazine compounds include bisphenol A-type benzoxazine BA-BXZ (manufactured by Konishi Chemical Co., Ltd.), bisphenol F-type benzoxazine BF-BXZ (manufactured by Konishi Chemical Co., Ltd.), and bisphenol S-type benzoxazine BS-BXZ (manufactured by Konishi Chemical Co., Ltd.). ), etc.

The resin composition of the present embodiment preferably contains a benzoxazine compound within a range that does not impair the effects of the present invention. When the resin composition of the present embodiment contains a benzoxazine compound, the content thereof is preferably 0.1 parts by mass or more and 50 parts by mass or less based on 100 parts by mass of resin solids in the resin composition. It is preferable that
The resin composition in this embodiment may contain only one type of benzoxazine compound, or may contain two or more types of benzoxazine compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also be configured to substantially not contain a benzoxazine compound. "Substantially free" means that the content of the benzoxazine compound is less than 0.1 part by mass based on 100 parts by mass of resin solid content in the resin composition.

<<Arylcyclobutene resin>>
The resin composition of this embodiment may contain an arylcyclobutene resin.
The details are exemplified by the arylcyclobutene resin described in paragraph 0042 of JP-A-2019-194312, the contents of which are incorporated herein.

<<Polyamide resin>>
The resin composition of this embodiment may contain a polyamide resin or may contain a thermosetting polyamide resin.
For details, reference can be made to the polyamide described in paragraph 0065 of Japanese Patent Application Publication No. 2019-194312 and the polyamide described in paragraph 0063 of Japanese Patent No. 6951829, the contents of which are incorporated herein.

<<Polyimide resin>>
The resin composition of this embodiment may contain a polyimide resin or may contain a thermosetting polyimide resin.
For details, reference may be made to the polyimide described in paragraphs 0063 to 0064 of Japanese Patent No. 6951829, the contents of which are incorporated herein.

<<Perfluorovinyl ether resin>>
The resin composition of this embodiment may contain a perfluorovinyl ether resin or a perfluorovinyl benzyl ether resin.
The details are exemplified by the perfluorovinyl ether resin described in paragraph 0043 of JP-A-2019-194312, the contents of which are incorporated herein.

<<Compounds having a styrene group other than the polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal>>
The resin composition of the present embodiment may contain a compound having a styrene group other than the polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal.
Details of these can be found in the compounds having styrene at the terminal described in International Publication No. 2022/210095 (for example, the compounds described in Synthesis Examples 12 to 16 of the same publication), and paragraphs 0029 to 0038 of JP 2022-85610 Publication. and the vinyl benzyl ether resin described in paragraph 0041 of JP-A No. 2019-194312, the contents of which are incorporated herein.

<<Compounds having isopropenyl groups other than resin (A) having indane skeleton>>
The resin composition of this embodiment may contain a compound having an isopropenyl group other than the resin (A) having an indane skeleton.
The details of these are exemplified by the resin having an isopropenyl group described in International Publication No. 2022/210095 (for example, the compounds described in Synthesis Examples 1, 2, 7, and 8 of the same publication), and the contents thereof are included in the present specification. incorporated into the book.

<<Polyfunctional (meth)acrylate compound other than the polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal>>
The resin composition of the present embodiment may contain a polyfunctional (meth)acrylate compound other than the polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal. Here, the polyfunctional (meth)acrylate compound means a compound containing two or more (meth)acryloyloxy groups in one molecule, and may contain three or more (meth)acryloyloxy groups in one molecule. preferable.
The polyfunctional (meth)acrylate compound is preferably a compound having three to five (meth)acryloyloxy groups, and preferably a compound having three or four (meth)acryloyloxy groups. More preferably, it is a compound having three (meth)acryloyloxy groups. The (meth)acrylate compound is preferably a compound having a methacryloyloxy group.
Since the polyfunctional (meth)acrylate compound has a large number of (meth)acrylate groups that serve as crosslinking points, the resin (A), the polyphenylene ether compound (B), and other resin components (for example, other compounds (C)) A cured product is obtained which is strongly cured and has excellent low dielectric properties (Dk and/or Df) and heat resistance. As the polyfunctional (meth)acrylate compound, a compound represented by formula (MA) is preferable.
Formula (MA)
(In formula (MA), R ¹ represents a hydrogen atom or a substituent, and R ² each independently represents a hydrogen atom or a methyl group.)

In formula (MA), R ¹ represents a hydrogen atom or a substituent, more preferably a substituent with a formula weight of 15 to 500, more preferably a substituent with a formula weight of 15 to 300, A substituent having a formula weight of 15 to 100 is more preferable, and a substituent having a formula weight of 15 to 50 is even more preferable.

R ¹ is preferably a hydrocarbon group or a (meth)acryloyloxy group, more preferably a hydrocarbon group having 22 or less carbon atoms, and even more preferably an alkyl group having 1 to 22 carbon atoms, or a C 2 ~22 alkenyl groups. By using a compound having an alkyl group having 1 to 22 carbon atoms or an alkenyl group having 2 to 22 carbon atoms, a resin composition can be obtained that has excellent crosslinkability and high toughness. can be provided. Thereby, even if the resin composition does not include a base material such as glass cloth, it is possible to suppress cracking during etching treatment or the like.
The number of carbon atoms in the alkyl group and/or alkenyl group is preferably 2 or more, and may be 8 or more, more preferably 12 or more, or 18 or less, from the viewpoint of improving handling properties. good. As a result, the resin composition has good resin flowability, and it is considered that the resin composition of the present embodiment has better circuit filling properties when producing a multilayer circuit board or the like.

In this embodiment, it is preferable that the (meth)acrylic group equivalent of the compound represented by formula (MA) is 1000 g/eq. or less. If the equivalent weight is 1000 g/eq. or less, it tends to be possible to obtain a high Tg more reliably. The lower limit of the (meth)acrylic group equivalent is, for example, 99 g/eq. That's all.

The alkyl group having 1 to 22 carbon atoms is preferably a linear alkyl group having 1 to 22 carbon atoms or a branched alkyl group having 3 to 22 carbon atoms, such as methyl group, ethyl group, propyl group, butyl group. group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, dodecyl group, tetradecyl group, hexadecyl group, octadecyl group, eicosyl group, docosyl group, and the like. The alkenyl group having 2 to 22 carbon atoms is preferably an alkenyl group having 2 to 15 carbon atoms, such as an allyl group or a decenyl group.

Specific examples of the compound represented by formula (MA) include trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, pentaerythritol tetra(meth)acrylate, and the like. These may be used alone or in combination of two or more, or may be used as a prepolymer.

Furthermore, commercially available compounds can also be used as the compound represented by formula (MA). Commercially available products include, but are not particularly limited to, "NK Ester TMPT" manufactured by Shin-Nakamura Chemical Co., Ltd., as trimethylolpropane trimethacrylate.

The molecular weight of the polyfunctional (meth)acrylate compound is preferably 300 or more, more preferably 330 or more, may be 400 or more, or may be 500 or more. By setting the molecular weight to the lower limit value or more, the resulting cured product tends to have improved low dielectric properties (Dk and/or Df) and heat resistance. Further, the molecular weight of the (meth)acrylate compound (preferably the compound represented by formula (MA)) is preferably 3000 or less, more preferably 2000 or less, and even more preferably 1000 or less. , more preferably 800 or less. By controlling the molecular weight to be less than or equal to the upper limit value, the resulting cured product tends to have improved low thermal expansion properties.

The details of these are the resins having a (meth)acrylic group described in International Publication No. 2022/210095 (for example, the compounds described in Synthesis Examples 5 and 21 of the same publication) and the (meth)acrylic group described in Patent No. 6962507. (eg, the compounds described in Examples 1-9), the contents of which are incorporated herein.

When the resin composition of the present embodiment contains a polyfunctional (meth)acrylate compound, the content thereof is preferably 1 part by mass or more, and 3 parts by mass based on 100 parts by mass of resin solids in the resin composition. It is more preferably at least 5 parts by mass, even more preferably at least 5 parts by mass, and may be at least 10 parts by mass. By setting the content of the polyfunctional (meth)acrylate compound to the above lower limit or more, the resin composition tends to have excellent moldability, and the heat resistance and low thermal expansion of the resulting cured product tend to be further improved. Further, the upper limit of the content of the (meth)acrylate compound is preferably 40 parts by mass or less, more preferably 30 parts by mass or less, based on 100 parts by mass of resin solid content in the resin composition. It may be 20 parts by mass or less. By controlling the content of the polyfunctional (meth)acrylate compound to the above upper limit or less, the heat resistance and low dielectric properties (Dk and/or Df) of the resulting cured product tend to be further improved.
The resin composition of this embodiment may contain only one type of polyfunctional (meth)acrylate compound, or may contain two or more types of polyfunctional (meth)acrylate compounds. When two or more types are included, it is preferable that the total amount falls within the above range.

<<Elastomer>>
The resin composition of this embodiment may contain an elastomer. The elastomer may be thermoplastic, thermosetting, or neither thermoplastic nor thermosetting, but thermoplastic is preferred.
The elastomer in this embodiment is not particularly limited, and examples thereof include polyisoprene, polybutadiene, styrene butadiene, butyl rubber, ethylene propylene rubber, styrene butadiene ethylene, styrene butadiene styrene, styrene isoprene styrene, styrene ethylene butylene styrene, styrene propylene styrene, and styrene. At least one selected from the group consisting of ethylene propylene styrene, fluororubber, silicone rubber, hydrogenated compounds thereof, alkyl compounds thereof, and copolymers thereof can be mentioned.
Further, examples of the elastomer include oligomers or polymers having a curable vinyl functional group, and polybutadiene resins described in paragraphs 0044 and 0045 of JP-A No. 2019-194312, the contents of which are incorporated herein.

The number average molecular weight of the elastomer (preferably a thermoplastic elastomer) used in this embodiment is preferably 1000 or more. By setting the number average molecular weight to 1000 or more, the resulting cured product tends to have better low dielectric properties (Dk and/or Df, particularly low dielectric loss tangent). The number average molecular weight is preferably 1500 or more, more preferably 2000 or more, and may be 600,000 or more, 700,000 or more, or 800,000 or more depending on the application. The upper limit of the number average molecular weight of the elastomer is preferably 400,000 or less, more preferably 350,000 or less, and even more preferably 300,000 or less. By setting it below the upper limit, the solubility of the elastomer component in the resin composition tends to improve.
When the resin composition of this embodiment contains two or more types of elastomers, it is preferable that the number average molecular weight of the mixture satisfies the above range.

The elastomer used in this embodiment includes a resin containing a polybutadiene structure. Part or all of the polybutadiene structure may be hydrogenated. Specific examples include Nippon Soda Co., Ltd., B-1000, B-2000, B-3000, BI-2000, BI-3000, CRAY VALLEY, Ricon100, Ricon130, Ricon131, Ricon142, Ricon150, Ricon181, Ricon 184th grade can be mentioned.

The elastomer used in this embodiment includes a resin containing a poly(meth)acrylate structure. Specific examples include Teisan Resin manufactured by Nagase ChemteX, ME-2000, W-197C, KG-15, and KG-3000 manufactured by Negami Kogyo.

Examples of the elastomer used in this embodiment include resins containing a polycarbonate structure. A resin containing a polycarbonate structure is sometimes referred to as a "polycarbonate resin." Examples of such resins include carbonate resins without reactive groups, carbonate resins containing hydroxy groups, carbonate resins containing phenolic hydroxyl groups, carbonate resins containing carboxy groups, carbonate resins containing acid anhydride groups, carbonate resins containing isocyanate groups, and urethane group-containing carbonate resins. Examples include carbonate resins containing carbonate resins, carbonate resins containing epoxy groups, and the like. Here, the reactive group refers to a functional group that can react with other components, such as a hydroxy group, a phenolic hydroxyl group, a carboxy group, an acid anhydride group, an isocyanate group, a urethane group, and an epoxy group.
Specific examples of the polycarbonate resin include FPC0220 and FPC2136 manufactured by Mitsubishi Gas Chemical Co., Ltd., and T6002 and T6001 (polycarbonate diol) manufactured by Asahi Kasei Chemicals.

The elastomer used in this embodiment includes a resin containing a polysiloxane structure. Specific examples include SMP-2006, SMP-2003PGMEA, SMP-5005PGMEA, KR-510, and SMP-7014-3S manufactured by Shin-Etsu Silicone.

Examples of the elastomer used in this embodiment include resins containing a polyalkylene structure and/or a polyalkyleneoxy structure. The polyalkyleneoxy structure is preferably a polyalkyleneoxy structure having 2 to 15 carbon atoms, more preferably a polyalkyleneoxy structure having 3 to 10 carbon atoms, and particularly preferably a polyalkyleneoxy structure having 5 to 6 carbon atoms. Specific examples of resins containing a polyalkylene structure and/or polyalkyleneoxy structure include PTXG-1000 and PTXG-1800 manufactured by Asahi Kasei Fibers.

The elastomer used in this embodiment includes a resin containing a polyisoprene structure. Specific examples include KL-610 and KL613 manufactured by Kuraray.

The elastomer used in this embodiment includes a resin containing a polyisobutylene structure. Specific examples include SIBSTAR-073T (styrene-isobutylene-styrene triblock copolymer) and SIBSTAR-042D (styrene-isobutylene diblock copolymer) manufactured by Kaneka.

In this embodiment, the elastomer is preferably an elastomer containing a styrene monomer unit and a conjugated diene monomer unit (hereinafter referred to as "elastomer (e)"). By using such an elastomer (e), the obtained cured product has better low dielectric properties (Dk and/or Df, especially low dielectric loss tangent).

The elastomer (e) contains styrene monomer units. By including the styrene monomer unit, the solubility of the elastomer (e) in the resin composition is improved. Styrene monomers include styrene, α-methylstyrene, p-methylstyrene, divinylbenzene (vinylstyrene), N,N-dimethyl-p-aminoethylstyrene, N,N-diethyl-p-aminoethylstyrene, etc. Among these, styrene, α-methylstyrene, and p-methylstyrene are preferred from the viewpoint of availability and productivity. Among these, styrene is particularly preferred.
The content of styrene monomer units in the elastomer (e) is preferably in the range of 10 to 50% by mass, more preferably in the range of 13 to 45% by mass, and more preferably in the range of 15 to 40% by mass of the total monomer units. is even more preferable. If the content of styrene monomer units is 50% by mass or less, the adhesiveness and tackiness to the substrate etc. will be better. Further, if it is 10% by mass or more, it is preferable because it is possible to suppress the increase in adhesion, it is difficult to form adhesive residue or stop marks, and the easy peelability between adhesive surfaces tends to be good.
The elastomer (e) may contain only one type of styrene monomer unit, or may contain two or more types of styrene monomer units. When two or more types are included, it is preferable that the total amount is within the above range.
For the method of measuring the content of styrene monomer units in the elastomer (e) of the present embodiment, the description in International Publication No. 2017/126469 can be referred to, and the contents thereof are incorporated herein. The same applies to the conjugated diene monomer unit, etc., which will be described later.

The elastomer (e) contains conjugated diene monomer units. By including the conjugated diene monomer unit, the solubility of the elastomer (e) in the resin composition is improved. The conjugated diene monomer is not particularly limited as long as it is a diolefin having one pair of conjugated double bonds. Conjugated diene monomers include, for example, 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 2-methyl- Examples include 1,3-pentadiene, 1,3-hexadiene, and farnesene, with 1,3-butadiene and isoprene being preferred, and 1,3-butadiene being more preferred.
The elastomer (e) may contain only one type of conjugated diene monomer unit, or may contain two or more types of conjugated diene monomer units.

In the above elastomer (e), the mass ratio of styrene monomer units to conjugated diene monomer units is in the range of styrene monomer units/conjugated diene monomer units = 5/95 to 80/20. It is preferably in the range of 7/93 to 77/23, and even more preferably in the range of 10/90 to 70/30. If the mass ratio of the styrene polymer unit to the conjugated diene monomer unit is in the range of 5/95 to 80/20, it is possible to suppress the increase in adhesion and maintain high adhesion, and the easy peelability between adhesive surfaces is good. become.

In the above elastomer (e), all of the conjugated diene bonds of the elastomer may be hydrogenated, some of them may be hydrogenated, or there is no need to be hydrogenated.

The elastomer (e) may or may not contain other monomer units in addition to the styrene monomer unit and the conjugated diene monomer unit. Examples of other monomer units include aromatic vinyl compound units other than styrene monomer units.
In the elastomer (e), the total amount of styrene monomer units and conjugated diene monomer units is preferably 90% by mass or more, more preferably 95% by mass or more of the total monomer units, and 97% by mass or more. It is more preferably at least 99% by mass, even more preferably at least 99% by mass.
As described above, the elastomer (e) may contain only one type of styrene monomer unit and conjugated diene monomer unit, or may contain two or more types of each. When two or more types are included, it is preferable that the total amount falls within the above range.

The elastomer (e) used in this embodiment may be a block polymer or a random polymer. In addition, even if it is a hydrogenated elastomer in which the conjugated diene monomer unit is hydrogenated, an unhydrogenated elastomer in which the conjugated diene monomer unit is not hydrogenated, or a partially hydrogenated elastomer in which the conjugated diene monomer unit is partially hydrogenated, Often, unhydrogenated or partially hydrogenated elastomers are preferred.
In one embodiment of this embodiment, the elastomer (e) is a hydrogenated elastomer. Here, the hydrogenated elastomer means, for example, an elastomer in which a double bond based on a conjugated diene monomer unit is hydrogenated, and in addition to one with a hydrogenation rate (hydrogenation rate) of 100%, The purpose is to include 80% or more. The hydrogenation rate in the hydrogenated elastomer is preferably 85% or more, more preferably 90% or more, and even more preferably 95% or more. In this embodiment, the hydrogenation rate is calculated from the measurement results of ¹ H-NMR spectrum measurement.
In one embodiment of this embodiment, the elastomer (e) is an unhydrogenated elastomer. Here, unhydrogenated elastomer refers to the proportion of double bonds based on conjugated diene monomer units in the elastomer that are hydrogenated, that is, the hydrogenation rate (hydrogenation rate) is 20% or less. say something The hydrogenation rate is preferably 15% or less, more preferably 10% or less, even more preferably 5% or less.
On the other hand, a partially hydrogenated elastomer refers to an elastomer in which a portion of the double bonds based on conjugated diene monomer units are hydrogenated, and the hydrogenation rate (hydrogenation rate) is usually less than 80%. , more than 20%.

Commercial products of the elastomer (e) used in this embodiment include SEPTON (registered trademark) 2104, V9461, and S8104 manufactured by Kuraray Co., Ltd., and SEPTON (registered trademark) manufactured by Asahi Kasei Corporation. O. E. (registered trademark) S1606, S1613, S1609, S1605, H1041, H1043, P2000, MP10 of Tuftec (registered trademark) manufactured by Asahi Kasei Corporation, DYNARON (registered trademark) 9901P, TR2250 manufactured by JSR Corporation, etc. .

The elastomer used in this embodiment may also be a liquid diene. Liquid diene means a liquid elastomer containing a conjugated diene monomer unit. Conjugated diene monomers include 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 2-methyl-1 , 3-pentadiene, 1,3-hexadiene, and farnesene, 1,3-butadiene and isoprene are preferred, and 1,3-butadiene is more preferred.
Examples of the liquid diene used in this embodiment include liquid polybutadiene, liquid polyisoprene, modified products of liquid polybutadiene, modified products of liquid polyisoprene, liquid acrylonitrile-butadiene copolymers, and liquid styrene-butadiene copolymers. .
Further, the number average molecular weight of the liquid diene is not particularly limited as long as it is liquid at 20°C, but is preferably 500 or more and 10,000 or less.

When the resin composition of the present embodiment contains an elastomer (preferably elastomer (e)), the content thereof is preferably 1 part by mass or more based on 100 parts by mass of resin solids in the resin composition. , more preferably 5 parts by mass or more, even more preferably 8 parts by mass or more, and may be 10 parts by mass or more, or 12 parts by mass or more depending on the application. By setting it to the above-mentioned lower limit or more, the dielectric properties (low dielectric loss tangent property) tend to be further improved. Further, the upper limit of the content of the elastomer is preferably 45 parts by mass or less, more preferably 40 parts by mass or less, and 35 parts by mass or less, based on 100 parts by mass of the resin solid content in the resin composition. It is more preferably 32 parts by mass or less, even more preferably 28 parts by mass or less. By setting it below the upper limit value, heat resistance tends to be further improved.
The resin composition of this embodiment may contain only one type of elastomer, or may contain two or more types of elastomer. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also have a structure that does not substantially contain an elastomer. "Substantially free" means that the content of the elastomer is less than 1 part by mass, preferably less than 0.1 part by mass, and preferably less than 0.1 part by mass, based on 100 parts by mass of resin solids in the resin composition. More preferably, it is less than 0.01 parts by mass.

<<Petroleum resin>>
The resin composition of this embodiment may contain petroleum resin. By including petroleum resin, the melt viscosity can be lowered.
Petroleum resin is a resin obtained by thermally decomposing petroleum naphtha, collecting the necessary fractions, and polymerizing the remaining components without isolating unsaturated hydrocarbons, either without a catalyst or in the presence of a catalyst. . The remaining fraction is mainly a fraction containing a C5 fraction (isoprene, piperylene, cyclopentadiene, pentenes, pentanes, etc.) or a C9 fraction (vinyltoluene, indene, dicyclopentadiene, etc.).

The catalyst used in the production of petroleum resin is preferably an acidic catalyst. Specifically, boron trifluoride phenol complex, boron trifluoride ether complex, aluminum chloride, aluminum bromide, Lewis acids such as iron (III) chloride, iron (III) bromide, zeolite, silica, montmorillonite, alumina. solid acids such as sulfonic acid group-containing fluororesins, ion exchange resins such as sulfonic acid group-containing polystyrene resins, protonic acids such as sulfuric acid, hydrochloric acid, acetic acid, phosphoric acid, oxalic acid, nitric acid, p-toluenesulfonic acid, trifluoroacetic acid, etc. etc. can be used. Among these, it is preferable to use Lewis acids and solid acids, which are less likely to cause side reactions and have a fast reaction rate, and various complexes of boron trifluoride and aluminum chloride are more preferable because they are easily available and have high reactivity. .

The weight average molecular weight of the petroleum resin is not particularly limited, but is preferably 500 to 10,000, more preferably 500 to 5,000. When the content is below the upper limit, it tends to be more compatible with other resins and also tends to have higher solubility in solvents. When the amount is equal to or more than the lower limit, the heat resistance and mechanical strength of the resulting cured product tend to be further improved.

The softening point of the petroleum resin is not particularly limited, but is preferably high, preferably 80°C or higher, and more preferably 100°C or higher. When the amount is at least the lower limit, the heat resistance of the resulting cured product tends to improve.

Examples of petroleum resins include aliphatic petroleum resins, aromatic petroleum resins, copolymer petroleum resins, and dicyclopentadiene petroleum resins, with dicyclopentadiene petroleum resins being preferred.
Dicyclopentadiene petroleum resins include resins obtained by polymerizing dicyclopentadiene fractions such as dicyclopentadiene, isopropenylnorbornene, dimethyldicyclopentadiene, and tricyclopentadiene, and dicyclopentadiene fractions and other Examples include resins obtained by polymerizing monomers having unsaturated bonds, preferably unsaturated cyclic olefins.

Examples of the unsaturated cyclic olefins include cyclopentadiene; 2-norbornene, 5-methyl-2-norbornene, 5-ethylidene-2-norbornene, 5-phenylnorbornene, 5-propenyl-2-norbornene, 5-ethylidene-2 - Norbornene monomers such as norbornene; Furthermore, as tricyclic or higher norbornene monomers, tricyclics other than dicyclopentadiene fractions such as diethyldicyclopentadiene and dihydrodicyclopentadiene, and tetracyclics such as tetracyclododecene Examples include pentacyclic bodies such as tricyclopentadiene, heptacyclic bodies such as tetracyclopentadiene, and alkyl-substituted bodies, alkylidene-substituted bodies, and aryl-substituted bodies of these polycyclic bodies. Examples of the alkyl substituent of the polycyclic body include methyl, ethyl, propyl, butyl substituents, etc.; examples of the alkylidene substituent of the polycyclic body include ethylidene substituents; Examples of the aryl substituted product of the polycyclic body include phenyl, tolyl, and naphthyl substituted products.

Furthermore, as monomers having other unsaturated bonds other than unsaturated cyclic olefins, olefins having 3 to 12 carbon atoms may be copolymerized, such as propylene, butene-1, pentene-1, pentene-1, 3-pentadiene, hexene-1, heptene-1, octene-1, diisobutene-1, nonene-1, decene-1, 4-phenylbutene-1, 6-phenylhexene-1, 3-methylbutene-1, 4- Methylpentene-1, 3-methylpentene-1, 3-methylhexene-1, 4-methylhexene-1, 5-methylhexene-1, 3,3-dimethylpentene-1, 3,4-dimethylpentene-1 , 4,4-dimethylpentene-1, vinylcyclohexane, vinylcyclohexene, etc.; halogen-substituted α-olefins such as hexafluoropropene, 2-fluoropropene, 3-fluoropropene, 3,4-dichlorobutene-1, etc. etc.

Examples of monomers having other unsaturated bonds other than those mentioned above include ethylene, tetrafluoroethylene, fluoroethylene, 1,1-difluoroethylene, trifluoroethylene; styrene, p-methylstyrene, o-methylstyrene, m- Alkylstyrenes such as methylstyrene, 2,4-dimethylstyrene, 2,5-dimethylstyrene, 3,4-dimethylstyrene, 3,5-dimethylstyrene, pt-butylstyrene; p-chlorostyrene, m-chlorostyrene; Halogenated styrenes such as styrene, o-chlorostyrene, p-bromostyrene, m-bromostyrene, o-bromostyrene, p-fluorostyrene, m-fluorostyrene, o-fluorostyrene, o-methyl-p-fluorostyrene ; Maleic anhydride, maleic acid, fumaric acid, allyl alcohol, 3-buten-2-ol, methylbuten-1-ol, vinyl acetate, vinyl chloride and the like.

The above monomers may be used alone or in combination of two or more.

Commercially available petroleum resins can be used as appropriate. Examples of aliphatic petroleum resins include Quinton A100, Quinton B170, Quinton K100, Quinton M100, Quinton R100, Quinton C200S, and Maruzen Petrochemical manufactured by Zeon Corporation. Marukaretsu T-100AS, Marukaretsu R-100AS manufactured by JXTG Energy Corporation, Neopolymer L-90, Neopolymer 120, Neopolymer 130, Neopolymer 140, Neopolymer 150, Neopolymer manufactured by JXTG Energy Corporation as aromatic petroleum resins. 170S, Neopolymer 160, Neopolymer E-100, Neopolymer E-130, Neopolymer 130S, Neopolymer S, Tosoh Corporation Petcol LX, Petcol LX-HS, Petcol 100T, Petcol 120, Petcol 120HS, Petcol 130, Petcol 140, Petcol 140HM, Petcol 140HM5, Petcol 150, Petcol 150AS, copolymer petroleum resins include Quinton D100, Quinton N180, Quinton P195N, Quinton S100, Quinton S195, Quinton U185, Quinton G100B, Quinton manufactured by Zeon Corporation. G115, Quinton D200, Quinton E200SN, Quinton N295, Tosoh Corporation Petrotac 60, Petrotac 70, Petrotac 90, Petrotac 90V, Petrotac 100, Petrotac 100V, Petrotac 90HM, DCPD (dicyclopentadiene) system Examples of petroleum resins include Marukaretz M-890A and Marukaretz M-845A manufactured by Maruzen Petrochemical Co., Ltd., Quinton 1325, Quinton 1345, Quinton 1500, Quinton 1525L, and Quinton 1700 manufactured by Nippon Zeon Corporation, and HA085, HA103, and HA105 manufactured by ENEOS Corporation. , HA125, HB103, HB125, etc.
Furthermore, as the petroleum resin, those described in Organic Synthetic Chemistry Vol. 25, No. 6 (1967) can also be employed.

When the resin composition of the present embodiment contains a petroleum resin, the lower limit of its content is preferably 1 part by mass or more, and 5 parts by mass or more, based on 100 parts by mass of resin solids in the resin composition. The amount is more preferably 10 parts by mass or more, even more preferably 20 parts by mass or more, and even more preferably 25 parts by mass or more. By setting it above the lower limit, the melt viscosity tends to decrease. Further, the upper limit of the content of petroleum resin is preferably 70 parts by mass or less, more preferably 50 parts by mass or less, and 40 parts by mass based on 100 parts by mass of resin solids in the resin composition. The following may be sufficient. By setting it below the upper limit value, Df tends to decrease.
The resin composition in this embodiment may contain only one type of petroleum resin, or may contain two or more types. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also be configured not to substantially contain petroleum resin. Substantially free of petroleum resin means that the petroleum resin content is less than 1 part by mass, preferably less than 0.1 part by mass, with respect to 100 parts by mass of resin solids in the resin composition. More preferably, it is less than .01 part by mass.

<Filler (D)>
It is preferable that the resin composition of this embodiment contains a filler (D). By including the filler (D), physical properties such as low dielectric properties (Dk and/or Df), flame resistance, and low thermal expansion of the resin composition and its cured product can be further improved.
Moreover, it is more preferable that the filler (D) used in this embodiment has excellent low dielectric properties (Dk and/or Df). For example, the filler (D) used in this embodiment preferably has a dielectric constant (Dk) of 8.0 or less, and preferably 6.0 or less, at a frequency of 10 GHz measured according to the cavity resonator perturbation method. More preferably, it is 4.0 or less. Moreover, the lower limit of the relative permittivity is practically, for example, 2.0 or more. Furthermore, the filler (D) used in this embodiment preferably has a dielectric loss tangent (Df) of 0.05 or less, more preferably 0.01 or less, at a frequency of 10 GHz measured according to the cavity resonator perturbation method. preferable. Further, the lower limit value of the dielectric loss tangent is practically, for example, 0.0001 or more.

The type of filler (D) used in this embodiment is not particularly limited, and those commonly used in the industry can be suitably used. Specifically, silicas such as natural silica, fused silica, synthetic silica, amorphous silica, Aerosil, and hollow silica, metal oxides such as alumina, white carbon, titanium white, titanium oxide, zinc oxide, magnesium oxide, and zirconium oxide. , complex oxides such as zinc borate, zinc stannate, forsterite, barium titanate, strontium titanate, calcium titanate, nitrides such as boron nitride, agglomerated boron nitride, silicon nitride, aluminum nitride, aluminum hydroxide, Heat-treated aluminum hydroxide products (aluminum hydroxide heat-treated to reduce some of the crystal water), metal hydroxides (including hydrates) such as boehmite and magnesium hydroxide, molybdenum oxide and molybdic acid Molybdenum compounds such as zinc, barium sulfate, clay, kaolin, talc, calcined clay, calcined kaolin, calcined talc, mica, E-glass, A-glass, NE-glass, NER-glass, C-glass, L-glass, D-glass, S-glass, M-glass G20, short glass fibers (including fine glass powders such as E glass, T glass, D glass, S glass, Q glass, etc.), hollow glass, spherical glass, and other inorganic glass In addition to the above fillers, examples include organic fillers such as styrene type, butadiene type, acrylic type rubber powder, core shell type rubber powder, silicone resin powder, silicone rubber powder, silicone composite powder, etc.
In this embodiment, inorganic fillers are preferred and are selected from the group consisting of silica, aluminum hydroxide, aluminum nitride, boron nitride, forsterite, titanium oxide, barium titanate, strontium titanate, and calcium titanate. It is more preferable to include one or more types, and from the viewpoint of low dielectric properties (Dk and/or Df), it is more preferable to include one or more types selected from the group consisting of silica and aluminum hydroxide. It is further preferable that silica is included. By using these inorganic fillers, properties such as heat resistance, low dielectric properties (Dk and/or Df), thermal expansion properties, dimensional stability, flame retardance, etc. of the cured resin composition are further improved. .

The content of the filler (D) in the resin composition of the present embodiment can be appropriately set depending on the desired properties, and is not particularly limited, but the content is based on 100 parts by mass of the resin solid content in the resin composition. It is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, even more preferably 40 parts by mass or more, even more preferably 60 parts by mass or more, and even more preferably 80 parts by mass or more. is even more preferable. By setting it to the above lower limit or more, the heat resistance, low thermal expansion property, and low dielectric loss tangent of the obtained cured product tend to be further improved. Further, the upper limit of the content of the filler (D) is preferably 1000 parts by mass or less, more preferably 500 parts by mass or less, and 300 parts by mass or less based on 100 parts by mass of the resin solid content. It is more preferable that the amount is 250 parts by mass or less, even more preferably 200 parts by mass or less, or 120 parts by mass or less. By setting it below the upper limit value, the moldability of the resin composition tends to be further improved.
In the resin composition of the present embodiment, as an example of a preferred embodiment, the content of the filler (D) is 30% by mass to 90% by mass of the components excluding the solvent.
The resin composition of this embodiment may contain only one type of filler (D), or may contain two or more types of filler (D). When two or more types are included, it is preferable that the total amount falls within the above range.

In the resin composition of this embodiment, when using a filler (D), especially an inorganic filler, it may further contain a silane coupling agent. By including the silane coupling agent, the dispersibility of the filler (D) and the adhesive strength between the resin component and the filler (D) and the base material described below tend to be further improved.
Silane coupling agents are not particularly limited, and include silane coupling agents that are generally used for surface treatment of inorganic materials, such as aminosilane compounds (for example, γ-aminopropyltriethoxysilane, N-β-(aminoethyl) -γ-aminopropyltrimethoxysilane, etc.), epoxysilane compounds (e.g., γ-glycidoxypropyltrimethoxysilane, etc.), vinylsilane compounds (e.g., vinyltrimethoxysilane, etc.), styrylsilane compounds, acrylic silane type compounds (e.g., γ-acryloxypropyltrimethoxysilane, etc.), cationic silane type compounds (e.g., N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane hydrochloride, etc.), phenyl Examples include silane compounds. The silane coupling agents may be used alone or in combination of two or more.
The content of the silane coupling agent is not particularly limited, but may be 0.1 to 5.0 parts by weight based on 100 parts by weight of the resin solid content.

<Monomer or oligomer having ethylenically unsaturated group>
In the resin composition of this embodiment, a monomer or oligomer having an ethylenically unsaturated group may be used in combination to enhance thermosetting properties and curability by active energy rays (for example, photocurability by ultraviolet rays). It is. The oligomer or monomer having an ethylenically unsaturated group used in this embodiment is not particularly limited as long as it has one or more ethylenically unsaturated group in one molecule. Examples include monomers or oligomers having a propenyl group, allyl group, (meth)acryloyl group, etc., and monomers or oligomers having a vinyl group are preferred.
In this specification, a compound that corresponds to a monomer or oligomer having an ethylenically unsaturated group and also corresponds to a polyphenylene ether compound (B) is referred to as a polyphenylene ether compound (B).

More specifically, as a monomer having an ethylenically unsaturated group, a compound (F1) (compound (F1)).
The ethylenically unsaturated bond constituting the organic group containing an ethylenically unsaturated bond is not intended to be included as part of an aromatic ring. On the other hand, it is meant to include ethylenically unsaturated bonds contained as part of the non-aromatic ring. An example of the ethylenically unsaturated bond included as part of the non-aromatic ring is a cyclohexenyl group in the molecule. It is also meant to include portions other than the terminals of linear or branched organic groups, that is, ethylenically unsaturated bonds contained in the linear or branched chains.
The organic group containing an ethylenically unsaturated bond is more preferably one selected from the group consisting of a vinyl group, an isopropenyl group, an allyl group, an acryloyl group, and a methacrylic group, and is a vinyl group. is even more preferable.
Further, in this specification, a compound that corresponds to a monomer or oligomer having an ethylenically unsaturated group and also corresponds to a silane coupling agent is referred to as a silane coupling agent.

The compound (F1) used in this embodiment is preferably composed only of atoms selected from carbon atoms, hydrogen atoms, oxygen atoms, nitrogen atoms, and silicon atoms; It is more preferable to be composed only of atoms selected from atoms and silicon atoms, and still more preferably composed only of atoms selected from carbon atoms, hydrogen atoms, oxygen atoms, and oxygen atoms.
The compound (F1) used in this embodiment may or may not have a polar group. It is preferable that the compound (F1) used in this embodiment does not have a polar group. Examples of the polar group include an amino group, a carboxyl group, a hydroxy group, and a nitro group.

In this embodiment, the molecular weight of compound (F1) is preferably 70 or more, more preferably 80 or more, and even more preferably 90 or more. By setting it to the above-mentioned lower limit or more, there is a tendency that volatilization of the compound (F1) from the resin composition of the present embodiment, its cured product, etc. can be suppressed. The upper limit of the molecular weight of the compound (F1) is preferably 500 or less, more preferably 400 or less, even more preferably 300 or less, even more preferably 200 or less, and even more preferably 150 or less. You can. By setting it below the above-mentioned upper limit, the effect of increasing reactivity with other resin components tends to be further improved.
When the resin composition of the present embodiment contains two or more types of compounds (F1), it is preferable that the average molecular weight value of the compound (F1) is within the above range, and the molecular weight of each compound is within the above preferable range. is more preferable.

In this embodiment, the compound (F1) preferably has a boiling point of 110°C or higher, more preferably 115°C or higher, and even more preferably 120°C or higher. By setting it to the above-mentioned lower limit or more, volatilization of compound (F1) when thermosetting the resin composition is suppressed, and other curable compounds and compound (F1) can be reacted. The boiling point of the compound (F1) is preferably 300°C or lower, more preferably 250°C or lower, and even more preferably 200°C or lower. By setting the amount to be less than or equal to the above upper limit, it is possible to make it difficult for residual solvent to remain in the cured product.
When the resin composition of the present embodiment contains two or more types of compounds (F1), it is sufficient that the average value of the boiling points falls within the above range, but it is preferable that the boiling points of each compound fall within the above preferable range.

Compound (F1) includes (meth)acrylic acid ester compounds, aromatic vinyl compounds (preferably styrene compounds), isopropenyl group-containing compounds, saturated fatty acid vinyl compounds, vinyl cyanide compounds, ethylenically unsaturated carboxylic acids, Unsaturated polyester compounds based on ethylenically unsaturated carboxylic anhydrides, ethylenically unsaturated dicarboxylic acid monoalkyl esters, ethylenically unsaturated carboxylic acid amides, maleic anhydride, fumaric acid, itaconic acid, and citraconic acid; acryloyl or methacryloyl groups; unsaturated epoxy compounds containing vinyl or (meth)allyl groups, urethane (meth)acrylate compounds, polyether (meth)acrylate compounds, polyalcohols ( Examples include meth)acrylate compounds, alkyd acrylate compounds, polyester acrylate compounds, spiroacetal acrylate compounds, diallyl phthalate compounds, diallyltetrabromophthalate compounds, diethylene glycol bisallyl carbonate, and polyethylene polythiol; At least one selected from the group consisting of vinyl compounds and saturated fatty acid vinyl compounds is preferred, and aromatic vinyl compounds are more preferred.
Specific examples of compound (F1) include methylstyrene (eg, 4-methylstyrene), ethylvinylbenzene, diethyl 4-vinylbenzylphosphonate, 4-vinylbenzylglycidyl ether, α-methylstyrene, and the like. Further, as a specific example of compound (F1), the descriptions in paragraphs 0046 and 0049 of JP-A-2019-194312 can be referred to, the contents of which are incorporated herein.

On the other hand, it is also preferable that the resin composition according to the present embodiment contains a styrene oligomer (F2) in order to improve low dielectric constant and low dielectric loss tangent. The styrene oligomer (F2) according to the present embodiment is preferably formed by polymerizing at least one member selected from the group consisting of styrene, the above-mentioned styrene derivatives, and vinyltoluene. The number average molecular weight of the styrene oligomer (F2) is preferably 178 or more, and preferably 1,600 or less. In addition, the styrene oligomer (F2) must be a compound without a branched structure with an average number of aromatic rings of 2 to 14, a total amount of 2 to 14 aromatic rings of 50% by mass or more, and a boiling point of 300°C or higher. preferable.

Examples of the styrene oligomer (F2) used in this embodiment include styrene polymer, vinyltoluene polymer, α-methylstyrene polymer, vinyltoluene-α-methylstyrene polymer, styrene-α-styrene polymer, etc. can be mentioned. As the styrene polymer, commercially available products may be used, such as Picolastic A5 (manufactured by Eastman Chemical Company), Picolastic A-75 (manufactured by Eastman Chemical Company), Picotex 75 (manufactured by Eastman Chemical Company), Examples include FTR-8100 (manufactured by Mitsui Chemicals, Inc.) and FTR-8120 (manufactured by Mitsui Chemicals, Inc.). Furthermore, examples of the vinyltoluene-α-methylstyrene polymer include Picotex LC (manufactured by Eastman Chemical Company). In addition, as the α-methylstyrene polymer, Crystallex 3070 (manufactured by Eastman Chemical Company), Crystallex 3085 (manufactured by Eastman Chemical Company), Crystallex (3100), Crystallex 5140 (manufactured by Eastman Chemical Company), FMR -0100 (manufactured by Mitsui Chemicals, Inc.) and FMR-0150 (manufactured by Mitsui Chemicals, Inc.). Furthermore, examples of the styrene-α-styrene polymer include FTR-2120 (manufactured by Mitsui Chemicals, Inc.). These styrene oligomers may be used alone or in combination of two or more.
In the resin composition of the present embodiment, α-methylstyrene oligomer is preferable because it can be thermally cured well and is excellent in embedding of fine wiring, soldering heat resistance, low dielectric constant, and low dielectric loss tangent.

Further, the resin composition according to the present embodiment preferably contains a divinyl compound (F3) as a monomer having an ethylenically unsaturated group in order to improve low dielectric constant and low dielectric loss tangent.
A divinyl compound is a low molecular compound having two vinyl groups. The presence of two vinyl groups provides a good crosslinking density that does not increase too much, and as a result, the free volume of the molecules becomes large, so that the dielectric loss tangent (Df) of the obtained cured product can be kept small. Furthermore, since the divinyl compound (F3) is used as a substitute for the resin (A), the polyphenylene ether compound (B), and a part of other curable compounds, the content of components having polar groups is reduced. This itself is considered to contribute to reducing the dielectric loss tangent (Df). In addition, since the two functional groups of the divinyl compound are both vinyl groups, the reactivity with the resin (A) and the polyphenylene ether compound (B) becomes good, and as a result, the heat resistance tends to improve. It is thought that there is a tendency.
In addition, the divinyl compound (F3) here refers to one having a molecular weight of less than 600, preferably 300 or less, and more preferably less than 195. Further, a practical lower limit of the molecular weight is 54. As the divinyl compound (F3), divinylbenzene, 1-ethynyl-4-[2-(4-ethynylphenyl)ethyl]benzene (BVPE)
, 1,3-vinyltetramethylsiloxane and the like.

In addition, as the monomer or oligomer having an ethylenically unsaturated group, 1,3-diisopropenylbenzene and 1,4-diisopropenylbenzene are also preferably used.
In addition, for details of the monomer or oligomer having an ethylenically unsaturated group, the description in paragraphs 0069 to 0087 of International Publication No. 2017/135168 and the paragraphs 0065 to 0067 of International Publication No. 2019/230945 can be referred to. The contents are incorporated herein.

When the resin composition of the present embodiment contains a monomer or oligomer having an ethylenically unsaturated group, the content thereof should be 0.5 parts by mass or more based on 100 parts by mass of resin solids in the resin composition. The amount is preferably 1 part by mass or more, more preferably 2 parts by mass or more, even more preferably 3 parts by mass or more, and even more preferably 5 parts by mass or more. By setting it to the above lower limit or more, the low dielectric properties (Dk and/or Df) of the obtained cured product tend to be further improved. Further, the upper limit of the content of the monomer or oligomer having an ethylenically unsaturated group is preferably 30 parts by mass or less, and preferably 25 parts by mass or less, based on 100 parts by mass of the resin solid content in the resin composition. The content is more preferably 20 parts by mass or less, even more preferably 15 parts by mass or less, and even more preferably 10 parts by mass or less. By setting it below the above-mentioned upper limit, the heat resistance of the obtained cured product tends to be further improved. Furthermore, low dielectric constant, low dielectric loss tangent, and chemical resistance tend to be further improved.
The resin composition of this embodiment may contain only one type of monomer or oligomer having an ethylenically unsaturated group, or may contain two or more types. When two or more types are included, it is preferable that the total amount falls within the above range.

<Flame retardant>
The resin composition of this embodiment may contain a flame retardant. Examples of the flame retardant include phosphorus-based flame retardants, halogen-based flame retardants, inorganic flame retardants, and silicone-based flame retardants, with phosphorus-based flame retardants being preferred.
Known flame retardants can be used, such as brominated epoxy resin, brominated polycarbonate, brominated polystyrene, brominated styrene, brominated phthalimide, tetrabromobisphenol A, pentabromobenzyl (meth)acrylate, pentabromo Halogen flame retardants such as toluene, tribromophenol, hexabromobenzene, decabromodiphenyl ether, bis-1,2-pentabromophenylethane, chlorinated polystyrene, chlorinated paraffin, red phosphorus, tricresyl phosphate, triphenyl phosphate , cresyl diphenyl phosphate, trixylenyl phosphate, trialkyl phosphate, dialkyl phosphate, tris(chloroethyl) phosphate, phosphazene, 1,3-phenylenebis(2,6-dixylenyl phosphate), 10-(2,5- Phosphorous flame retardants such as dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, inorganic types such as aluminum hydroxide, magnesium hydroxide, partial boehmite, boehmite, zinc borate, and antimony trioxide. Examples include flame retardants, silicone-based flame retardants such as silicone rubber, and silicone resin.
In the present embodiment, among these, 1,3-phenylenebis(2,6-dixylenyl phosphate) is preferred because it does not impair the low dielectric properties (Dk and/or Df) of the resulting cured product.

When the resin composition of the present embodiment contains a flame retardant, the content thereof is preferably 1 part by mass or more, and preferably 5 parts by mass or more, based on 100 parts by mass of resin solids in the resin composition. is more preferable. Further, the lower limit of the flame retardant content is preferably 30 parts by mass or less, more preferably 25 parts by mass or less.
One kind of flame retardant can be used alone or two or more kinds can be used in combination. When two or more types are used, the total amount falls within the above range.

<Active ester compound>
The resin composition of this embodiment may contain an active ester compound. The active ester compound is not particularly limited, and for example, the description in paragraphs 0064 to 0066 of International Publication No. 2021/172317 can be referred to, the contents of which are incorporated herein.

When the resin composition of this embodiment contains an active ester compound, it is preferably 1 part by mass or more, and preferably 90 parts by mass or less, based on 100 parts by mass of resin solid content in the resin composition. .
The resin composition in this embodiment may contain only one type of active ester compound, or may contain two or more types of active ester compounds. When two or more types are included, it is preferable that the total amount falls within the above range.
Moreover, the resin composition in this embodiment can also be configured to substantially not contain an active ester compound. "Substantially free" means that the content of the active ester compound is less than 1 part by mass, preferably less than 0.1 part by mass, based on 100 parts by mass of resin solids in the resin composition. , more preferably less than 0.01 part by mass.

<Dispersant>
The resin composition of this embodiment may contain a dispersant. As the dispersant, those commonly used for paints can be suitably used, and the type thereof is not particularly limited. As the dispersant, preferably a copolymer-based wetting and dispersing agent or a fluorine-based dispersing agent containing fluorine is used.
Specific examples of the dispersant include DISPERBYK (registered trademark) -110, 111, 161, 180, 2009, 2152, 2155, BYK (registered trademark) -W996, W9010, W903, W940, manufactured by BYK Chemie Japan Co., Ltd. Examples include Ftargient manufactured by Neos Co., Ltd. and MPT manufactured by Mitsubishi Pencil Co., Ltd.

When the resin composition of the present embodiment contains a dispersant, the lower limit of its content is preferably 0.01 parts by mass or more, and 0.01 parts by mass or more, based on 100 parts by mass of resin solids in the resin composition. It is more preferably 1 part by mass or more, and may be 0.3 parts by mass or more. Further, the upper limit of the content of the dispersant is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and 3 parts by mass based on 100 parts by mass of the resin solid content in the resin composition. It is more preferable that it is the following.
One type of dispersant can be used alone or two or more types can be used in combination. When two or more types are used, the total amount falls within the above range.

<Curing accelerator>
The resin composition of this embodiment may further contain a curing accelerator. Examples of the curing accelerator include, but are not limited to, imidazoles such as 2-ethyl-4-methylimidazole and triphenylimidazole; benzoyl peroxide, bis(1-methyl-1-phenylethyl) peroxide), and -t-butyl peroxide, lauroyl peroxide, acetyl peroxide, parachlorobenzoyl peroxide, di-tert-butyl-di-perphthalate, α,α'-di(t-butylperoxy)diisopropylbenzene, 2, Organic peroxides such as 5-dimethyl-2,5-di(t-butylperoxy)hexane, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexine-3; azobisnitrile (e.g. azo compounds such as azobisisobutyronitrile); N,N-dimethylbenzylamine, N,N-dimethylaniline, N,N-dimethyltoluidine, 2-N-ethylanilinoethanol, tri-n-butylamine, pyridine , quinoline, N-methylmorpholine, triethanolamine, triethylenediamine, tetramethylbutanediamine, N-methylpiperidine, and other tertiary amines; phenols, xylenol, cresol, resorcinol, catechol, and other phenols; 2,3- High-temperature decomposition radical generators such as dimethyl-2,3-diphenylbutane; lead naphthenate, lead stearate, zinc naphthenate, zinc octylate, manganese octylate, tin oleate, dibutyltin malate, manganese naphthenate, naphthene Organic metal salts such as cobalt acid and iron acetylacetonate; These organic metal salts dissolved in hydroxyl group-containing compounds such as phenol and bisphenol; Inorganic metal salts such as tin chloride, zinc chloride, and aluminum chloride; Dioctyltin oxide, and others Examples include organic tin compounds such as alkyltin and alkyltin oxide.
The curing accelerator is preferably at least one selected from the group consisting of imidazoles, organic peroxides, and organic metal salts, more preferably imidazoles and/or organic metal salts, and imidazoles and organic metal salts. It is further preferred to use both salts in combination.
Further, in this embodiment, a configuration may be adopted in which substantially no polymerization initiator such as an organic peroxide or an azo compound is contained. "Substantially free" means that the content of the polymerization initiator is less than 0.1 parts by mass, and less than 0.01 parts by mass, based on 100 parts by mass of resin solids in the resin composition. is preferable, and more preferably less than 0.001 parts by mass.
In particular, when a polyphenylene ether compound represented by formula (OP-1) is used as the polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal, a polymerization initiator (including a curing accelerator) Even with a configuration that does not substantially contain , it can be sufficiently cured.

When the resin composition of the present embodiment contains a curing accelerator, the lower limit of its content is preferably 0.005 parts by mass or more, based on 100 parts by mass of resin solids in the resin composition, and 0. It is more preferably .01 part by mass or more, and even more preferably 0.1 part by mass or more. Further, the upper limit of the content of the curing accelerator is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and 2 parts by mass or less, based on 100 parts by mass of the resin solid content in the resin composition. It is more preferable that the amount is less than 1 part.
The curing accelerator can be used alone or in combination of two or more. When two or more types are used, the total amount falls within the above range.

<Solvent>
The resin composition of this embodiment may contain a solvent, and preferably contains an organic solvent. When containing a solvent, the resin composition of the present embodiment is in a form (solution or varnish) in which at least a portion, preferably all, of the various resin solid components described above are dissolved or compatible with the solvent. The solvent is not particularly limited as long as it is a polar organic solvent or a non-polar organic solvent that can dissolve or be compatible with at least a portion, preferably all, of the various resin solids mentioned above. Examples of the polar organic solvent include ketones, etc. (e.g., acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.), cellosolves (e.g., propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, etc.), esters (e.g., ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, acetic acid) isoamyl, ethyl lactate, methyl methoxypropionate, methyl hydroxyisobutyrate, etc.), amides (e.g., dimethoxyacetamide, dimethylformamide, etc.), and nonpolar organic solvents include aromatic hydrocarbons (e.g., toluene, xylene, etc.).
One kind of solvent can be used alone or two or more kinds can be used in combination. When two or more types are used, the total amount falls within the above range.

<Other ingredients>
The resin composition of this embodiment may contain various polymeric compounds such as resins and oligomers thereof, and various additives in addition to the above-mentioned components. Additives include ultraviolet absorbers, antioxidants, photopolymerization initiators, optical brighteners, photosensitizers, dyes, pigments, thickeners, fluidity regulators, lubricants, antifoaming agents, leveling agents, and gloss. agents, polymerization inhibitors, etc. These additives can be used alone or in combination of two or more.
Moreover, the resin composition of this embodiment can also be configured to substantially not contain a polymerization inhibitor. "Substantially free" means that the resin composition does not contain a polymerization inhibitor, or the content of the polymerization inhibitor in the resin composition is, for example, less than 0.008 parts by mass based on 100 parts by mass of resin solids. It is preferably 0.007 parts by mass or less, more preferably 0.001 parts by mass or less, and even more preferably 0.0001 parts by mass or less.

<Application>
The resin composition of this embodiment is used as a cured product. Specifically, the resin composition of this embodiment is a material having low dielectric properties (Dk and/or Df), and is suitable as a resin composition for electronic materials such as insulating layers of printed wiring boards, materials for semiconductor packages, etc. It can be used for. The resin composition of this embodiment can be suitably used as a material for prepreg, a metal foil-clad laminate using prepreg, a resin composite sheet, and a printed wiring board.

The resin composition of this embodiment preferably has a minimum melt viscosity of 100,000 Pa·s or less, more preferably 20,000 Pa·s or less. The lower limit of the minimum melt viscosity is not particularly determined, but 10 Pa·s or more is practical. Such a low melt viscosity is achieved by using resin (A).
Further, in the resin composition of the present embodiment, the viscosity/minimum melt viscosity (minimum melting temperature + 10° C.) is preferably 80 times or less, more preferably 20 times or less. When the viscosity (minimum melting temperature + 10° C.) divided by the minimum melt viscosity is low, the curing reaction tends to proceed mildly and void formation can be prevented.
The minimum melt viscosity is measured according to the method described in the Examples below.

The minimum melting temperature of the resin composition of the present embodiment is preferably 210°C or lower, more preferably 200°C or lower, even more preferably 190°C or lower, and even more preferably 180°C or lower. The temperature is preferably 175°C or less, and even more preferably. A practical lower limit is, for example, 120° C. or higher.
The minimum melting temperature is measured according to the method described in the Examples below.

The resin composition of this embodiment preferably has a glass transition temperature according to DMA (dynamic mechanical analysis) of 130°C or higher, more preferably 150°C or higher, and 165°C. The temperature is more preferably 170°C or higher, even more preferably 180°C or higher, or 190°C or higher. Such a high glass transition temperature is mainly achieved by using the polyphenylene ether compound (B). The practical upper limit of the glass transition temperature is, for example, 350° C. or less.
The glass transition temperature is measured according to the method described in the Examples below.

It is preferable that the cured product of the resin composition of this embodiment has a low dielectric constant (Dk). Specifically, the dielectric constant (Dk) at a frequency of 10 GHz measured according to the cavity resonator perturbation method is preferably 2.50 or less, more preferably less than 2.45, and 2.44 or less. It is even more preferable. Although the lower limit of the dielectric constant (Dk) is not particularly determined, for example, 0.01 or more is practical.
Further, it is preferable that the cured product of the resin composition of this embodiment has a low dielectric loss tangent (Df). Specifically, the dielectric loss tangent (Df) at a frequency of 10 GHz measured according to the cavity resonator perturbation method is preferably less than 0.0022, more preferably 0.0021 or less, and more preferably 0.0020 or less. is preferable, and may be 0.0018 or less, 0.0015 or less, 0.0014 or less, or 0.0013 or less. Although the lower limit value of the dielectric loss tangent (Df) is not particularly determined, for example, 0.0001 or more is practical.
The low dielectric properties (Dk and/or Df) of such a cured product can be obtained by combining the resin (A) and the polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal in a predetermined ratio. This is achieved by using
The dielectric constant (Dk) and the dielectric loss tangent (Df) are measured by the method described in the Examples below.

The resin composition of this embodiment is used as a layered material (including film-like, sheet-like, etc.) such as prepreg, resin composite sheet, etc., which becomes an insulating layer of a printed wiring board. In this case, the thickness is preferably 5 μm or more, more preferably 10 μm or more. The upper limit of the thickness is preferably 200 μm or less, more preferably 180 μm or less. In addition, the thickness of the above-mentioned layered material means the thickness including the glass cloth, for example, when the resin composition of the present embodiment is impregnated into a glass cloth or the like.
The material formed from the resin composition of this embodiment may be used for forming a pattern by exposure and development, or may be used for applications that are not exposed and developed. It is particularly suitable for applications that do not involve exposure and development.

<<Prepreg>>
The prepreg of this embodiment is formed from a base material (prepreg base material) and the resin composition of this embodiment. The prepreg of the present embodiment can be produced by, for example, applying the resin composition of the present embodiment to a base material (for example, impregnating and/or coating it), and then heating it (for example, drying it at 120 to 220°C for 2 to 15 minutes). etc.) by semi-curing. In this case, the amount of the resin composition adhered to the base material, that is, the amount of the resin composition (including filler (D)) relative to the total amount of prepreg after semi-curing, is preferably in the range of 20 to 99% by mass, and 20% by mass. More preferably, the content is in the range of 80% by mass.

The base material is not particularly limited as long as it is a base material used for various printed wiring board materials. Examples of the material of the base material include glass fiber (e.g., E-glass, D-glass, L-glass, S-glass, T-glass, Q-glass, UN-glass, NE-glass, NER-glass, Spherical glass, etc.), inorganic fibers other than glass (eg, quartz, etc.), and organic fibers (eg, polyimide, polyamide, polyester, liquid crystal polyester, polytetrafluoroethylene, etc.). The form of the base material is not particularly limited, and examples thereof include woven fabric, nonwoven fabric, roving, chopped strand mat, surfacing mat, and the like. These base materials may be used alone or in combination of two or more. Among these base materials, from the viewpoint of dimensional stability, woven fabrics subjected to ultra-opening treatment and packing treatment are preferable, and from the viewpoints of strength and low water absorption, the base material has a thickness of 200 μm or less, a mass of 250 g/ A glass woven fabric having a size of m ² or less is preferable, and from the viewpoint of moisture absorption and heat resistance, a glass woven fabric surface-treated with a silane coupling agent such as epoxy silane or amino silane is preferable. From the viewpoint of electrical properties, a low dielectric glass cloth made of glass fibers exhibiting a low dielectric constant and a low dielectric loss tangent, such as L-glass, NE-glass, NER-glass, Q-glass, etc., is more preferable.
Examples of the base material having a low dielectric constant include a base material having a dielectric constant of 5.0 or less (preferably 3.0 to 4.9). Examples of the low dielectric loss tangent base material include base materials with a dielectric loss tangent of 0.006 or less (preferably 0.001 to 0.005). The relative permittivity and dielectric loss tangent are values measured at a frequency of 10 GHz using a perturbation method cavity resonator.

<<Metal foil clad laminate>>
The metal foil-clad laminate of this embodiment includes at least one layer formed from the prepreg of this embodiment, and metal foil disposed on one or both sides of the layer formed from the prepreg. As a method for producing the metal foil-clad laminate of this embodiment, for example, at least one prepreg of this embodiment is arranged (preferably two or more prepregs are stacked), metal foil is arranged on one or both sides of the prepreg, and laminated molding is performed. One method is to do so. More specifically, it can be produced by arranging a metal foil such as copper or aluminum on one or both sides of a prepreg and laminating it. The number of prepreg sheets is preferably 1 to 10 sheets, more preferably 2 to 10 sheets, and even more preferably 2 to 9 sheets. The metal foil is not particularly limited as long as it is used as a material for printed wiring boards, and examples thereof include copper foils such as rolled copper foil and electrolytic copper foil. The thickness of the metal foil (preferably copper foil) is not particularly limited, and may be about 1.5 to 70 μm. Further, when copper foil is used as the metal foil, it is preferable that the roughness Rz of the surface of the copper foil measured according to JIS B0601:2013 is adjusted to 0.2 to 4.0 μm. By setting the roughness Rz of the copper foil surface to 0.2 μm or more, the roughness of the copper foil surface becomes appropriate, and the copper foil peel strength tends to be further improved. On the other hand, by setting the roughness Rz of the copper foil surface to 4.0 μm or less, the roughness of the copper foil surface becomes appropriate, and conductor loss tends to be further reduced. The roughness Rz of the copper foil surface is more preferably 0.5 μm or more, still more preferably 0.6 μm or more, particularly preferably 0.7 μm or more, from the viewpoint of improving peel strength, and also reduces conductor loss. From the viewpoint of reducing , the thickness is more preferably 3.5 μm or less, further preferably 3.0 μm or less, and particularly preferably 2.0 μm or less.

Examples of the lamination molding method include methods normally used when molding laminate boards for printed wiring boards and multilayer boards, and more specifically, multistage press machines, multistage vacuum press machines, continuous molding machines, autoclave molding machines, etc. An example of this is a method of laminated molding at a temperature of about 180 to 350° C., a heating time of about 100 to 300 minutes, and a surface pressure of about 20 to 100 kg/cm ² . Furthermore, a multilayer board can be obtained by laminating and molding a combination of the prepreg of this embodiment and a separately produced wiring board for an inner layer. As a method for manufacturing a multilayer board, for example, copper foil of about 35 μm is placed on both sides of one sheet of prepreg of this embodiment, and after lamination is formed using the above-mentioned forming method, an inner layer circuit is formed, and this circuit is coated with black. After that, the inner layer circuit board and the prepreg of this embodiment are alternately placed one by one, and a copper foil is placed on the outermost layer, and the above conditions are met. A multilayer board can be produced by lamination molding, preferably under vacuum. The metal foil-clad laminate of this embodiment can be suitably used as a printed wiring board.

As described above, the resin composition for electronic materials obtained using the resin composition of the present embodiment (resin composition consisting of a combination of specific components) has excellent moldability and low dielectric properties of the cured product. In addition to Dk and/or Df (especially low dielectric loss tangent), it can have excellent properties such as low dielectric constant, crack resistance, appearance of cured product, low thermal expansion, and moisture absorption and heat resistance.

<<Printed wiring board>>
The printed wiring board of the present embodiment is a printed wiring board including an insulating layer and a conductor layer disposed on the surface of the insulating layer, the insulating layer being formed from the resin composition of the present embodiment. and a layer formed from the prepreg of this embodiment. Such a printed wiring board can be manufactured according to a conventional method, and the manufacturing method is not particularly limited. An example of a method for manufacturing a printed wiring board will be shown below. First, a metal foil-clad laminate such as the copper foil-clad laminate described above is prepared. Next, the surface of the metal foil-clad laminate is etched to form an inner layer circuit, thereby producing an inner layer substrate. The surface of the inner layer circuit of this inner layer board is subjected to surface treatment to increase adhesive strength as necessary, and then the required number of sheets of prepreg described above are layered on the surface of the inner layer circuit, and then metal foil for the outer layer circuit is laminated on the outside. Then heat and press to form an integral mold. In this way, a multilayer laminate is produced in which an insulating layer made of a base material and a cured resin composition is formed between the inner layer circuit and the metal foil for the outer layer circuit. Next, after drilling holes for through holes and via holes in this multilayer laminate, a plated metal film is formed on the wall of the hole to conduct the inner layer circuit and the metal foil for the outer layer circuit, and then the outer layer circuit is formed. A printed wiring board is manufactured by performing an etching process on metal foil to form an outer layer circuit.

The printed wiring board obtained in the above manufacturing example has an insulating layer and a conductor layer formed on the surface of this insulating layer, and the insulating layer is made of the resin composition of the present embodiment described above and/or a cured product thereof. The configuration includes That is, the prepreg of the present embodiment described above (for example, the prepreg formed from the base material and the resin composition of the present embodiment impregnated or applied thereto), the resin composition of the metal foil-clad laminate of the present embodiment described above. The layer formed from the material becomes the insulating layer of this embodiment.
The present embodiment also relates to a semiconductor device including the printed wiring board. For details of the semiconductor device, the descriptions in paragraphs 0200 to 0202 of JP-A-2021-021027 can be referred to, and the contents thereof are incorporated into this specification.

Further, it is preferable that the insulating layer formed of the cured product of the resin composition of the present embodiment has a reduced surface roughness after the insulating layer is subjected to roughening treatment. Specifically, the arithmetic mean roughness Ra of the surface of the insulating layer after the roughening treatment is preferably 200 nm or less, more preferably 150 nm or less, particularly preferably 100 nm or less. The lower limit of the arithmetic mean roughness Ra is not particularly limited, but may be, for example, 10 nm or more. The arithmetic mean roughness Ra of the surface of the insulating layer is measured using a non-contact surface roughness meter in VSI mode using a 50x lens.
The non-contact surface roughness meter used is WYKONT3300 manufactured by Beaco Instruments.

<<Resin composite sheet>>
The resin composite sheet of this embodiment includes a support and a layer formed from the resin composition of this embodiment disposed on the surface of the support. The resin composite sheet can be used as a build-up film or a dry film solder resist. The method for producing the resin composite sheet is not particularly limited, but for example, the resin composite sheet may be produced by applying (coating) a solution of the resin composition of the present embodiment described above in a solvent to a support and drying it. There are several ways to obtain it.

Examples of the support used here include polyethylene film, polypropylene film, polycarbonate film, polyethylene terephthalate film, ethylenetetrafluoroethylene copolymer film, and release films in which a release agent is applied to the surface of these films. Examples include organic film base materials such as polyimide film, conductive foils such as copper foil and aluminum foil, plate-like materials such as glass plates, SUS (Steel Use Stainless) plates, and FRP (Fiber-Reinforced Plastics). It is not particularly limited.

Examples of the coating method (coating method) include a method in which a solution of the resin composition of the present embodiment dissolved in a solvent is coated onto the support using a bar coater, die coater, doctor blade, Baker applicator, etc. It will be done. Further, after drying, the support can be peeled off or etched from the resin composite sheet in which the support and the resin composition are laminated, thereby forming a single layer sheet. Note that the support can be used by supplying a solution in which the resin composition of the present embodiment described above is dissolved in a solvent into a mold having a sheet-like cavity and drying it to form it into a sheet. It is also possible to obtain a single layer sheet.

In the production of the single-layer sheet or resin composite sheet of this embodiment, the drying conditions for removing the solvent are not particularly limited, but if the temperature is low, the solvent tends to remain in the resin composition, and if the temperature is high, Since curing of the resin composition progresses, the temperature is preferably 20° C. to 200° C. for 1 to 90 minutes. Further, the single layer sheet or the resin composite sheet can be used in an uncured state where the solvent is simply dried, or it can be used in a semi-cured (B-staged) state if necessary. Furthermore, the thickness of the resin layer in the single-layer sheet or resin composite sheet of this embodiment can be adjusted by the concentration of the solution of the resin composition of this embodiment used for application (coating) and the coating thickness, and there are no particular limitations. However, in general, the thicker the coating, the more likely the solvent will remain during drying, so 0.1 to 500 μm is preferable.

The present invention will be explained in more detail with reference to Examples below. The materials, usage amounts, ratios, processing details, processing procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.
If the measuring equipment used in the examples is difficult to obtain due to discontinuation or the like, measurements can be made using other equipment with equivalent performance.

<Measurement of weight average molecular weight and number average molecular weight>
Weight average of resin (A) having a terminal group represented by formula (T1) and having an indane skeleton, polyphenylene ether compounds (B1) and (B2) having a carbon-carbon unsaturated double bond at the terminal Molecular weight (Mw) and number average molecular weight (Mn) were measured by gel permeation chromatography (GPC) method. Liquid pump (manufactured by Shimadzu Corporation, LC-20AD), differential refractive index detector (manufactured by Shimadzu Corporation, RID-20A), GPC column (manufactured by Showa Denko Corporation, GPC KF-801, 802, 803, 804) The experiment was carried out using tetrahydrofuran as the solvent, a flow rate of 1.0 mL/min, a column temperature of 40° C., and a calibration curve using monodisperse polystyrene.

<Measurement of parameters α and β>
Parameters α and β in resin (A) were calculated by ¹ H-NMR measurement. The residual solvent contained in the recovered solid was removed by repeatedly dissolving the synthesized resin in a mixed solvent of heptane and methanol and drying it to solidity. Thereafter, the recovered solid was dissolved in CDCl ₃ and ¹ H-NMR measurement was performed. In the measured ¹ H-NMR, parameters α and β of each resin were calculated using the formula shown below.
(The value in parentheses in formula (α) and formula (β) indicates the integral value between the corresponding chemical shift values in ¹ H-NMR.)

<Synthesis Example 1 Synthesis of resin (A) having a terminal group represented by formula (T1) and an indane skeleton>
520 g of toluene, 3 g of activated clay, and a stirrer were placed in a three-necked flask equipped with a thermometer and a cooling tube, and the mixture was heated to an internal temperature of 70° C. while stirring. Thereafter, 150 g of 1,3-diisopropenylbenzene (manufactured by Tokyo Kasei Co., Ltd.) was added dropwise while controlling the dropping rate so that the internal temperature did not exceed 80°C. After the dropwise addition, the mixture was stirred until the internal temperature dropped to 70°C. Thereafter, 150 g of 1,3-diisopropenylbenzene (manufactured by Tokyo Kasei Co., Ltd.) was added dropwise in the same manner, and after the dropwise addition was completed, the reaction was continued for an additional 2 hours. At the end of the reaction, 433 g of toluene was added and activated clay was removed by filtration. By heating the filtrate and distilling off the solvent under reduced pressure, 231 g of solid resin was obtained.
The resulting resin (A) has Mw of 2674, Mn of 1153, Mw/Mn of 2.3, and in formula (Tx), parameter α is 0.71 and parameter β is 0. 50, and n+o+p was 6.3. The structures in parentheses shown in (a), (b), and (c) all have the same molecular weight, and n+o+p was calculated assuming that Mn of the synthesized resin is the average molecular weight. Furthermore, it was confirmed by GPC analysis that the residual monomer content was 1% by mass or less.
FIG. 1 shows an NMR chart of the obtained resin.

<Synthesis Example 2 Polyphenylene ether compound (B1) having a carbon-carbon unsaturated double bond at the terminal>
<<Synthesis of bifunctional phenylene ether oligomer>>
In a 12 L vertical reactor equipped with a stirring device, thermometer, air inlet tube, and baffle plate, 9.64 g (43.2 mmol) of CuBr ₂ and 1.86 g of N,N'-di-t-butylethylenediamine ( 10.8 mmol), 69.83 g (690.1 mmol) of n-butyldimethylamine, and 2,600 g of toluene were charged and stirred at a reaction temperature of 40°C. , 3,3',5,5'-hexamethyl-(1,1'-biphenol)-4,4'-diol 129.3 g (0.48 mol), 2,6-dimethylphenol 878.4 g (7.2 mol) ), N,N'-di-t-butylethylenediamine 1.26g (7.3mmol), and n-butyldimethylamine 27.19g (268.7mmol) were mixed with nitrogen and air to determine the oxygen concentration. A mixed gas adjusted to 8% by volume was added dropwise over 230 minutes while bubbling at a flow rate of 5.2 L/min, followed by stirring. After the dropwise addition was completed, 1,500 g of an aqueous solution in which 48.06 g (126.4 mmol) of tetrasodium ethylenediaminetetraacetate was dissolved was added to stop the reaction. The aqueous layer and the organic layer were separated, and the organic layer was washed with a 1N aqueous hydrochloric acid solution and then with pure water. The obtained solution was concentrated to 50% by mass using an evaporator to obtain 1980 g of a toluene solution of a bifunctional phenylene ether oligomer (resin "B0"). The number average molecular weight of the resin "B0" in terms of polystyrene by GPC method was 2,100, the weight average molecular weight in terms of polystyrene by GPC method was 3,740, and the hydroxyl equivalent was 1,070.

<<Synthesis of modified polyphenylene ether compound>>
After drying 792 g of a 50% by mass toluene solution of the bifunctional phenylene ether oligomer (B0) in an evaporator, 2772 g of N,N-dimethylacetamide was added and concentrated until the solid content became 20% by mass, and the difunctional phenylene ether oligomer (B0) was dried. 1980 g of a solution (B0) of ether oligomer N,N-dimethylacetamide 79.80% by mass and toluene 0.20% by mass was obtained. Next, 1980 g (0.37 mol in OH equivalent) of the bifunctional phenylene ether oligomer solution (B0) and 67.78 g chloromethylstyrene (CMS-P) ( 0.44 mol) and stirred while heating to 50°C. While maintaining the reaction temperature at 50° C., 84.48 g (0.44 mol) of a methanol solution of sodium methoxide (concentration: 28.4% by mass) was added dropwise, and the mixture was stirred for 1 hour. Further, 9.75 g (0.05 mol) of a methanol solution of sodium methoxide (concentration: 28.4% by mass) was added dropwise, and the mixture was stirred for 2 hours. After that, 5.91 g (0.05 mol) of 85% by mass phosphoric acid aqueous solution was added, and after removing the generated inorganic salt, the reaction solution was solidified by dropping it into 1975 g of water. After separation, the mixture was washed with pure water and methanol, and then dried under reduced pressure to obtain 381.87 g of the target polyphenylene ether compound (B1). The modified polyphenylene ether compound had a number average molecular weight of 2350, a weight average molecular weight of 3880, and a vinyl group equivalent of 1220 g/vinyl group in terms of polystyrene by GPC.

Examples 1 to 3, Comparative Example 1, Reference Example 2, Reference Example 3
The resin (A) obtained in Synthesis Example 1 above and the polyphenylene ether compound (B1) having a carbon-carbon unsaturated double bond at the terminal obtained in Synthesis Example 2 were mixed in the proportions shown in Table 1, and methyl ethyl ketone and toluene were added. The mixture was dissolved and mixed to obtain a varnish. The ratio of each component in the table indicates the value in terms of solid content.

<Manufacture of a 1.0 mm thick hardened plate test piece>
A resin composition powder was obtained by evaporating the solvent from the varnish obtained in each Example and Comparative Example. A cured plate was produced as follows using the powder of the obtained resin composition. 4.5 g of resin composition powder was placed in a stainless steel mold frame measuring 100 mm x 30 mm x 1.0 mm high, set in a vacuum press machine (manufactured by Kitagawa Seiki Co., Ltd.), and held at 200°C for 1.5 hours. , Pressing was performed at a surface pressure of 1.9 MPa.
Using the powder or cured plate of the obtained resin composition, the minimum melt viscosity, viscosity of (minimum melting temperature + 10°C) ÷ minimum melt viscosity, moldability, minimum melting temperature, glass transition temperature, dielectric constant (Dk) , dielectric loss tangent (Df) was evaluated. The evaluation results are shown in Table 1.

<Measurement method and evaluation method>
(1) Minimum melt viscosity and viscosity of (minimum melting temperature + 10°C) ÷ minimum melt viscosity The resin composition powder obtained in each example and comparative example was measured by GC measurement (GC-2025, Shimadzu Corporation). After confirming that the amount of residual solvent was 1% by mass or less using a viscoelasticity measuring device (ARES-G2, TA Instrument), 1 g was taken and formed into a tablet with a diameter of 25 mm to prepare a sample for measurement. Co., Ltd.) under the conditions of a heating temperature of 2°C/min and a frequency of 10 rad/s to determine the minimum melt viscosity (Pa・s) and the viscosity of (minimum melting temperature + 10°C) .
The minimum melt viscosity was evaluated as follows.
A: 20,000 Pa・s or less B: More than 20,000 Pa・s and 100,000 Pa・s or less C: More than 100,000 Pa・s In addition, the value of viscosity (minimum melting temperature + 10°C) ÷ minimum melt viscosity was calculated. . It was evaluated as follows.
A: 20 times or less B: More than 20 times but less than 80 times C: More than 80 times

(2) Moldability Moldability was evaluated as follows.
A: The evaluation results of the above minimum melt viscosity and the value of viscosity/minimum melt viscosity (minimum melt viscosity + 10° C.) are both A.
B: The evaluation result of the above minimum melt viscosity and the value of viscosity/minimum melt viscosity (minimum melt viscosity + 10°C) is A or B, and at least one is B.
C: C is included in the evaluation result of the above minimum melt viscosity and (minimum melt viscosity + 10° C.) viscosity ÷ minimum melt viscosity.

(3) Minimum melting temperature The temperature at which the minimum melt viscosity was reached was defined as the minimum melting temperature.
The unit is shown in °C.

(4) Glass transition temperature A sample obtained by downsizing the cured plate to 12.7 mm x 30 mm was subjected to DMA (dynamic mechanical analysis: Dynamic Mechanical Analysis) bending method was used to measure, and the peak temperature of the resulting loss modulus was defined as the glass transition temperature. The unit is shown in °C.
The dynamic viscoelasticity analyzer used was DMA Q800, manufactured by TA Instruments Co., Ltd.

(5) Relative permittivity (Dk) and dielectric loss tangent (Df)
After downsizing the cured plate to a width of 1.0 mm and drying it at 120°C for 60 minutes, the relative dielectric constant (Dk) and dielectric loss tangent (Df) after drying at 10 GHz were determined using a perturbation method cavity resonator. ) was measured. The measurement temperature was 23°C.
The perturbation method cavity resonator used was Agilent 8722ES manufactured by Agilent Technologies.

Example 4
15 parts by mass of the resin (A) obtained in the above Synthesis Example 1 and a polyphenylene ether compound (B2) (Polyphenylene ether compound (B2): Noryl SA9000, a compound having the structure shown below, manufactured by SABIC Japan LLC, with a vinyl group) 85 parts by mass of heavy bond equivalent (1011 g/eq.) and 1.5 parts by mass of Perbutyl P (1,3-bis(butylperoxyisopropyl)benzene, manufactured by NOF Corporation) as a curing accelerator, methyl ethyl ketone and toluene. The mixture was dissolved and mixed to obtain a varnish. The amount of each component mentioned above indicates the amount of solid content.
The obtained varnish was evaluated in the same manner as in Example 1. The results are shown in Table 2.

Comparative example 2
100 parts by mass of polyphenylene ether compound (B2) and 1.5 parts by mass of Perbutyl P were dissolved in methyl ethyl ketone and toluene and mixed to obtain a varnish. The amount of each component mentioned above indicates the amount of solid content.
The obtained varnish was evaluated in the same manner as in Example 1. The results are shown in Table 2.

Claims

A resin (A) having a terminal group represented by formula (T1) and an indane skeleton, and a polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at the terminal, the resin A resin composition in which the mass ratio of the content of (A) and the polyphenylene ether compound (B) is resin (A)/polyphenylene ether compound (B) = 5/95 to 70/30.
(In formula (T1), Mb each independently represents a hydrocarbon group having 1 to 12 carbon atoms that may be substituted with a halogen atom, and y represents an integer of 0 to 4. )
The resin composition according to claim 1, wherein the resin (A) contains a resin represented by formula (T1-1).
(In formula (T1-1), R is a group containing a structural unit represented by formula (Tx). Represents a hydrogen group. y is an integer from 0 to 4.)
(In formula (Tx), n, o, and p are the average number of repeating units, n represents a number greater than 0 and less than or equal to 20, o and p each independently represent a number from 0 to 20, 1.0≦n+o+p≦20.0.Ma represents a hydrocarbon group having 1 to 12 carbon atoms which may be independently substituted with a halogen atom.x represents an integer of 0 to 4.Structure Units (a), (b), and (c) are each bonded to the structural unit (a), (b), (c), or another group at *, and each structural unit is bonded randomly. )
The resin composition according to claim 1 or 2, wherein the polyphenylene ether compound (B) includes a polyphenylene ether compound represented by formula (OP).
(In formula (OP), X represents an aromatic group, -(Y-O) n1 - represents a polyphenylene ether structure, n1 represents an integer of 1 to 100, and n2 represents an integer of 1 to 4. Rx is a group represented by formula (Rx-1) or formula (Rx-2).)
(In formula (Rx-1) and formula (Rx-2), R 1 , R 2 , and R 3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group. *: It is a bonding site with an oxygen atom. Mc each independently represents a hydrocarbon group having 1 to 12 carbon atoms. z represents an integer of 0 to 4. r represents an integer of 1 to 6.)
The resin composition according to claim 1 or 2, wherein the polyphenylene ether compound (B) contains a polyphenylene ether compound represented by formula (OP-1).
(In formula (OP-1), X represents an aromatic group, -(Y-O)n 2 - represents a polyphenylene ether structure, and R 1 , R 2 and R 3 are each independently, It represents a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, n 1 represents an integer of 1 to 6, n 2 represents an integer of 1 to 100, and n 3 represents an integer of 1 to 4.)
The resin composition according to claim 1 or 2, wherein the polyphenylene ether compound (B) has a number average molecular weight (Mn) of 500 to 3,000 and a weight average molecular weight (Mw) of 800 to 6,000.
The resin composition according to claim 1 or 2, wherein the resin (A) has a number average molecular weight (Mn) of 400 to 3,000.
According to claim 1 or 2, the mass ratio of the content of the resin (A) and the polyphenylene ether compound (B) is resin (A)/polyphenylene ether compound (B) = 5/95 to 45/55. resin composition.
The resin composition according to claim 1 or 2, which does not substantially contain a polymerization inhibitor.
The resin composition according to claim 1 or 2, further comprising a compound (C) other than the resin (A) and the polyphenylene ether compound (B).
The other compound (C) is a maleimide compound, a cyanate ester compound, an epoxy compound, a phenol compound, a compound containing a (meth)allyl group, an oxetane resin, a benzoxazine compound, an arylcyclobutene resin, a polyamide resin, a polyimide resin, perfluorovinyl ether resin, a compound having a styrene group other than the polyphenylene ether compound (B), a compound having an isopropenyl group other than the resin having an indane skeleton (A), a polyfunctional (meth) other than the polyphenylene ether compound (B), ) The resin composition according to claim 9, comprising one or more selected from the group consisting of acrylate compounds, elastomers, and petroleum resins.
The resin composition according to claim 1 or 2, wherein the total content of the resin (A) and the polyphenylene ether compound (B) is 40 parts by mass or more based on 100 parts by mass of resin solids in the resin composition. .
The resin composition according to claim 1 or 2, further comprising a filler (D).
The resin composition according to claim 12, wherein the content of the filler (D) is 10 to 1000 parts by mass based on 100 parts by mass of resin solids in the resin composition.
The resin (A) includes a resin represented by formula (T1-1),
The polyphenylene ether compound (B) includes a polyphenylene ether compound represented by formula (OP),
The polyphenylene ether compound (B) has a number average molecular weight (Mn) of 500 to 3000, and a weight average molecular weight (Mw) of 800 to 6000,
The resin (A) has a number average molecular weight (Mn) of 400 to 3000,
The mass ratio of the content of the resin (A) and the polyphenylene ether compound (B) is resin (A)/polyphenylene ether compound (B) = 5/95 to 45/55,
Substantially free of polymerization inhibitors,
The resin composition according to claim 1, wherein the total content of the resin (A) and the polyphenylene ether compound (B) is 40 parts by mass or more based on 100 parts by mass of resin solid content in the resin composition.
(In formula (T1-1), R is a group containing a structural unit represented by formula (Tx). Represents a hydrogen group. y is an integer from 0 to 4.)
(In formula (Tx), n, o, and p are the average number of repeating units, n represents a number greater than 0 and less than or equal to 20, o and p each independently represent a number from 0 to 20, 1.0≦n+o+p≦20.0.Ma represents a hydrocarbon group having 1 to 12 carbon atoms which may be independently substituted with a halogen atom.x represents an integer of 0 to 4.Structure Units (a), (b), and (c) are each bonded to the structural unit (a), (b), (c), or another group at *, and each structural unit is bonded randomly. )
(In formula (OP), X represents an aromatic group, -(Y-O) n1 - represents a polyphenylene ether structure, n1 represents an integer of 1 to 100, and n2 represents an integer of 1 to 4. Rx is a group represented by formula (Rx-1) or formula (Rx-2).)
(In formula (Rx-1) and formula (Rx-2), R 1 , R 2 , and R 3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group. *: It is a bonding site with an oxygen atom. Mc each independently represents a hydrocarbon group having 1 to 12 carbon atoms. z represents an integer of 0 to 4. r represents an integer of 1 to 6.)
A cured product of the resin composition according to claim 1, 2 or 14.
A prepreg formed from a base material and the resin composition according to claim 1, 2 or 14.
A metal foil-clad laminate comprising at least one layer formed from the prepreg according to claim 16 and a metal foil disposed on one or both sides of the layer formed from the prepreg.
A resin composite sheet comprising a support and a layer formed from the resin composition according to claim 1, disposed on the surface of the support.
A printed wiring board comprising an insulating layer and a conductor layer disposed on a surface of the insulating layer, the insulating layer comprising a layer formed from the resin composition according to claim 1, 2 or 14. , printed wiring board.
A semiconductor device comprising the printed wiring board according to claim 19.