JPWO2023047782A1 - - Google Patents

Info

Publication number
JPWO2023047782A1
JPWO2023047782A1 JP2023501346A JP2023501346A JPWO2023047782A1 JP WO2023047782 A1 JPWO2023047782 A1 JP WO2023047782A1 JP 2023501346 A JP2023501346 A JP 2023501346A JP 2023501346 A JP2023501346 A JP 2023501346A JP WO2023047782 A1 JPWO2023047782 A1 JP WO2023047782A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023501346A
Other languages
Japanese (ja)
Other versions
JPWO2023047782A5 (en
JP7380943B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023047782A1 publication Critical patent/JPWO2023047782A1/ja
Publication of JPWO2023047782A5 publication Critical patent/JPWO2023047782A5/ja
Priority to JP2023179632A priority Critical patent/JP2024003007A/en
Application granted granted Critical
Publication of JP7380943B2 publication Critical patent/JP7380943B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
JP2023501346A 2021-09-27 2022-07-22 Resin compositions, prepregs, metal foil laminates, resin composite sheets, printed wiring boards, and semiconductor devices Active JP7380943B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023179632A JP2024003007A (en) 2021-09-27 2023-10-18 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021157023 2021-09-27
JP2021157023 2021-09-27
PCT/JP2022/028443 WO2023047782A1 (en) 2021-09-27 2022-07-22 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023179632A Division JP2024003007A (en) 2021-09-27 2023-10-18 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device

Publications (3)

Publication Number Publication Date
JPWO2023047782A1 true JPWO2023047782A1 (en) 2023-03-30
JPWO2023047782A5 JPWO2023047782A5 (en) 2023-08-29
JP7380943B2 JP7380943B2 (en) 2023-11-15

Family

ID=85720483

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023501346A Active JP7380943B2 (en) 2021-09-27 2022-07-22 Resin compositions, prepregs, metal foil laminates, resin composite sheets, printed wiring boards, and semiconductor devices
JP2023179632A Pending JP2024003007A (en) 2021-09-27 2023-10-18 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023179632A Pending JP2024003007A (en) 2021-09-27 2023-10-18 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device

Country Status (5)

Country Link
JP (2) JP7380943B2 (en)
KR (1) KR20240088944A (en)
CN (1) CN118019799A (en)
TW (1) TW202323426A (en)
WO (1) WO2023047782A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI835402B (en) 2022-11-11 2024-03-11 南亞塑膠工業股份有限公司 Resin composition

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006274169A (en) * 2005-03-30 2006-10-12 Nippon Steel Chem Co Ltd Curable resin composition
JP2007262191A (en) * 2006-03-28 2007-10-11 Nippon Steel Chem Co Ltd Flame-retardant curable resin composition
JP2008248001A (en) * 2007-03-29 2008-10-16 Nippon Steel Chem Co Ltd Curable resin composition
JP2019178233A (en) * 2018-03-30 2019-10-17 日鉄ケミカル＆マテリアル株式会社 Low dielectric fire retardant composition containing phosphorus-containing vinyl resin
JP2020515701A (en) * 2017-08-04 2020-05-28 廣東生益科技股▲ふん▼有限公司Ｓｈｅｎｇｙｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． Thermosetting resin composition, prepreg produced using the same, and metal foil-clad laminate
JP2020105352A (en) * 2018-12-27 2020-07-09 日鉄ケミカル＆マテリアル株式会社 Curable resin composition, prepreg, metal-clad laminate, printed wiring board
WO2020175537A1 (en) * 2019-02-28 2020-09-03 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate board, resin composite sheet, and, printed circuit board
WO2020175538A1 (en) * 2019-02-28 2020-09-03 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminated sheet, composite resin sheet, and printed wiring board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017115813A1 (en) 2015-12-28 2017-07-06 新日鉄住金化学株式会社 Soluble polyfunctional vinyl aromatic copolymer, method for producing same and curable composition

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006274169A (en) * 2005-03-30 2006-10-12 Nippon Steel Chem Co Ltd Curable resin composition
JP2007262191A (en) * 2006-03-28 2007-10-11 Nippon Steel Chem Co Ltd Flame-retardant curable resin composition
JP2008248001A (en) * 2007-03-29 2008-10-16 Nippon Steel Chem Co Ltd Curable resin composition
JP2020515701A (en) * 2017-08-04 2020-05-28 廣東生益科技股▲ふん▼有限公司Ｓｈｅｎｇｙｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． Thermosetting resin composition, prepreg produced using the same, and metal foil-clad laminate
JP2019178233A (en) * 2018-03-30 2019-10-17 日鉄ケミカル＆マテリアル株式会社 Low dielectric fire retardant composition containing phosphorus-containing vinyl resin
JP2020105352A (en) * 2018-12-27 2020-07-09 日鉄ケミカル＆マテリアル株式会社 Curable resin composition, prepreg, metal-clad laminate, printed wiring board
WO2020175537A1 (en) * 2019-02-28 2020-09-03 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate board, resin composite sheet, and, printed circuit board
WO2020175538A1 (en) * 2019-02-28 2020-09-03 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminated sheet, composite resin sheet, and printed wiring board

Also Published As

Publication number Publication date
KR20240088944A (en) 2024-06-20
CN118019799A (en) 2024-05-10
JP7380943B2 (en) 2023-11-15
TW202323426A (en) 2023-06-16
JP2024003007A (en) 2024-01-11
WO2023047782A1 (en) 2023-03-30

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