JP2023537606A - 作業面上に規定のレーザラインを生成するための装置 - Google Patents

作業面上に規定のレーザラインを生成するための装置 Download PDF

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Publication number
JP2023537606A
JP2023537606A JP2023510377A JP2023510377A JP2023537606A JP 2023537606 A JP2023537606 A JP 2023537606A JP 2023510377 A JP2023510377 A JP 2023510377A JP 2023510377 A JP2023510377 A JP 2023510377A JP 2023537606 A JP2023537606 A JP 2023537606A
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JP
Japan
Prior art keywords
optical
assembly
optical assembly
profile
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023510377A
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English (en)
Japanese (ja)
Inventor
ハイメス アンドレアス
ヴィマー マーティン
ヘルシュテアン ユリアン
シュヴァルツ マリオ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trumpf Laser und Systemtechnik GmbH
Original Assignee
Trumpf Laser und Systemtechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trumpf Laser und Systemtechnik GmbH filed Critical Trumpf Laser und Systemtechnik GmbH
Publication of JP2023537606A publication Critical patent/JP2023537606A/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Lenses (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Laser Beam Processing (AREA)
JP2023510377A 2020-08-14 2021-08-03 作業面上に規定のレーザラインを生成するための装置 Pending JP2023537606A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020121440.5 2020-08-14
DE102020121440.5A DE102020121440A1 (de) 2020-08-14 2020-08-14 Vorrichtung zum Erzeugen einer definierten Laserlinie auf einer Arbeitsebene
PCT/EP2021/071651 WO2022033923A1 (de) 2020-08-14 2021-08-03 Vorrichtung zum erzeugen einer definierten laserlinie auf einer arbeitsebene

Publications (1)

Publication Number Publication Date
JP2023537606A true JP2023537606A (ja) 2023-09-04

Family

ID=77317034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023510377A Pending JP2023537606A (ja) 2020-08-14 2021-08-03 作業面上に規定のレーザラインを生成するための装置

Country Status (5)

Country Link
JP (1) JP2023537606A (ko)
KR (1) KR20230048546A (ko)
CN (1) CN116033993A (ko)
DE (1) DE102020121440A1 (ko)
WO (1) WO2022033923A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116184681B (zh) * 2023-04-27 2023-08-04 成都莱普科技股份有限公司 二氧化碳激光的光束整形设备以及光束整形方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008524662A (ja) 2004-12-22 2008-07-10 カール・ツアイス・レーザー・オプティクス・ゲーエムベーハー 線ビームを生成するための光学照射系
DE202007018689U1 (de) * 2006-08-18 2009-03-05 Highyag Lasertechnologie Gmbh Vorrichtung zur Stabilisierung der Fokuslage bei Optiken für Hochleistungs-Laserstrahlung zur Lasermaterialbearbeitung
DE102007024700A1 (de) * 2007-05-25 2008-12-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens
JP2013193110A (ja) 2012-03-21 2013-09-30 Sumitomo Heavy Ind Ltd レーザ加工装置及びレーザ加工方法
US10293436B2 (en) * 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9873628B1 (en) * 2014-12-02 2018-01-23 Coherent Kaiserslautern GmbH Filamentary cutting of brittle materials using a picosecond pulsed laser
EP4331768A3 (en) 2016-07-27 2024-04-24 TRUMPF Laser GmbH Laser line illumination
WO2019040854A1 (en) * 2017-08-25 2019-02-28 Corning Incorporated APPARATUS AND METHOD FOR LASER PROCESSING OF TRANSPARENT WORKPIECES USING AFOCAL BEAM ADJUSTMENT ASSEMBLY
DE102018200078B4 (de) 2018-01-04 2020-07-02 Innovavent Gmbh Optisches System und Verfahren zum Erzeugen einer Beleuchtungslinie

Also Published As

Publication number Publication date
CN116033993A (zh) 2023-04-28
WO2022033923A1 (de) 2022-02-17
DE102020121440A1 (de) 2022-02-17
KR20230048546A (ko) 2023-04-11

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