JP2023525815A5 - - Google Patents
Info
- Publication number
- JP2023525815A5 JP2023525815A5 JP2022568877A JP2022568877A JP2023525815A5 JP 2023525815 A5 JP2023525815 A5 JP 2023525815A5 JP 2022568877 A JP2022568877 A JP 2022568877A JP 2022568877 A JP2022568877 A JP 2022568877A JP 2023525815 A5 JP2023525815 A5 JP 2023525815A5
- Authority
- JP
- Japan
- Prior art keywords
- executed
- program
- perform
- cause
- mobile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20174175.8 | 2020-05-12 | ||
| EP20174175.8A EP3911130A1 (en) | 2020-05-12 | 2020-05-12 | Transferring viscous materials |
| PCT/NL2021/050309 WO2021230746A1 (en) | 2020-05-12 | 2021-05-12 | Transferring viscous materials |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023525815A JP2023525815A (ja) | 2023-06-19 |
| JP2023525815A5 true JP2023525815A5 (enExample) | 2024-05-17 |
| JP7721574B2 JP7721574B2 (ja) | 2025-08-12 |
Family
ID=70682635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022568877A Active JP7721574B2 (ja) | 2020-05-12 | 2021-05-12 | 粘性材料を移すこと |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12414241B2 (enExample) |
| EP (2) | EP3911130A1 (enExample) |
| JP (1) | JP7721574B2 (enExample) |
| KR (1) | KR20230008802A (enExample) |
| CN (1) | CN115700015A (enExample) |
| WO (1) | WO2021230746A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3911130A1 (en) * | 2020-05-12 | 2021-11-17 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO | Transferring viscous materials |
| EP4037442A1 (en) * | 2021-02-01 | 2022-08-03 | Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno | Donor plate, deposition device and deposition method |
| EP4319486A1 (en) | 2022-08-04 | 2024-02-07 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Heater plate, heater device comprising a heater plate and method of manufacturing a heater plate |
| EP4335641A1 (en) | 2022-09-08 | 2024-03-13 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Method and device for printing a substance on a target surface of a target |
| EP4346339A1 (en) * | 2022-09-30 | 2024-04-03 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Method and device for printing a substance on a target surface of a target |
| EP4383321A1 (en) * | 2022-12-06 | 2024-06-12 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Method and device for depositing components on a substrate |
| EP4400625A1 (en) * | 2023-01-13 | 2024-07-17 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Deposition apparatus, method for depositing, method for packaging a die in a chip package |
| DE102023134256A1 (de) * | 2023-12-07 | 2025-06-12 | Ams-Osram International Gmbh | Vorrichtung zum aufbringen eines materials auf ein zielsubstrat, verfahren zur verwendung einer solchen vorrichtung und verfahren zur herstellung einer solchen vorrichtung |
| EP4586308A1 (en) * | 2024-01-15 | 2025-07-16 | FononTech Holding B.V. | Deposition system and method |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3729819A (en) * | 1970-01-09 | 1973-05-01 | Nippon Toki Kk | Method and device for fabricating printed wiring or the like |
| JPS61254350A (ja) * | 1985-05-08 | 1986-11-12 | Mitsubishi Electric Corp | サ−マルジエツト用記録ヘツド |
| US4956653A (en) * | 1989-05-12 | 1990-09-11 | Eastman Kodak Company | Bubble jet print head having improved multi-layer protective structure for heater elements |
| US4991287A (en) * | 1989-12-26 | 1991-02-12 | Eastman Kodak Company | Method for fabricating printed circuit boards |
| US5598189A (en) * | 1993-09-07 | 1997-01-28 | Hewlett-Packard Company | Bipolar integrated ink jet printhead driver |
| JPH07218716A (ja) | 1994-01-27 | 1995-08-18 | Fujitsu Ltd | カラーフィルタの製造方法 |
| JPH09511459A (ja) | 1994-04-20 | 1997-11-18 | シーメンス ニクスドルフ インフオルマチオーンスジステーメ アクチエンゲゼルシヤフト | インキを記録媒体に転写するための熱電気式の印刷機 |
| US6609652B2 (en) * | 1997-05-27 | 2003-08-26 | Spheretek, Llc | Ball bumping substrates, particuarly wafers |
| US6114088A (en) * | 1999-01-15 | 2000-09-05 | 3M Innovative Properties Company | Thermal transfer element for forming multilayer devices |
| US6871396B2 (en) * | 2000-02-09 | 2005-03-29 | Matsushita Electric Industrial Co., Ltd. | Transfer material for wiring substrate |
| JP2005305966A (ja) | 2004-04-26 | 2005-11-04 | Canon Inc | 液体吐出ヘッド |
| US9647555B2 (en) | 2005-04-08 | 2017-05-09 | Lincoln Global, Inc. | Chopper output stage for arc welder power source |
| US8556389B2 (en) * | 2011-02-04 | 2013-10-15 | Kateeva, Inc. | Low-profile MEMS thermal printhead die having backside electrical connections |
| WO2009153792A2 (en) | 2008-06-19 | 2009-12-23 | Utilight Ltd. | Light induced patterning |
| JP5629298B2 (ja) * | 2012-10-26 | 2014-11-19 | ヤマハ発動機株式会社 | 粘性材供給装置および粘性材印刷装置 |
| BR112015009655B1 (pt) * | 2012-10-31 | 2020-12-29 | Hewlett-Packard Indigo B.V. | método e aparelho para formar em um substrato um padrão de um material |
| WO2015128857A1 (en) | 2014-02-28 | 2015-09-03 | Utilight Ltd. | Tracks patterns production apparatus |
| WO2015140775A1 (en) | 2014-03-19 | 2015-09-24 | Utilight Ltd. | Printing high aspect ratio patterns |
| KR101758087B1 (ko) | 2014-07-23 | 2017-07-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 튜닝가능한 온도 제어되는 기판 지지 어셈블리 |
| US11089690B2 (en) | 2016-03-16 | 2021-08-10 | Ncc Nano, Llc | Method for depositing a functional material on a substrate |
| US20180171468A1 (en) | 2016-12-21 | 2018-06-21 | Ncc Nano, Llc | Method for deposting a functional material on a substrate |
| CN112118964A (zh) * | 2018-10-03 | 2020-12-22 | 惠普发展公司，有限责任合伙企业 | 热转印 |
| US11446750B2 (en) * | 2020-02-03 | 2022-09-20 | Io Tech Group Ltd. | Systems for printing solder paste and other viscous materials at high resolution |
| EP3902380A1 (en) * | 2020-04-24 | 2021-10-27 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO | Pattern transfer of high viscosity material |
| EP3911130A1 (en) * | 2020-05-12 | 2021-11-17 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO | Transferring viscous materials |
-
2020
- 2020-05-12 EP EP20174175.8A patent/EP3911130A1/en not_active Withdrawn
-
2021
- 2021-05-12 CN CN202180041547.4A patent/CN115700015A/zh active Pending
- 2021-05-12 JP JP2022568877A patent/JP7721574B2/ja active Active
- 2021-05-12 WO PCT/NL2021/050309 patent/WO2021230746A1/en not_active Ceased
- 2021-05-12 KR KR1020227042790A patent/KR20230008802A/ko active Pending
- 2021-05-12 US US17/923,258 patent/US12414241B2/en active Active
- 2021-05-12 EP EP21727005.7A patent/EP4151057B1/en active Active
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