JP2023516857A - 選択的堆積の方法 - Google Patents
選択的堆積の方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 71
- 230000008021 deposition Effects 0.000 title claims abstract description 35
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000004094 surface-active agent Substances 0.000 claims abstract description 15
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 12
- 229910021529 ammonia Inorganic materials 0.000 claims abstract description 11
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 85
- 238000000151 deposition Methods 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 34
- 239000003989 dielectric material Substances 0.000 claims description 30
- 239000004020 conductor Substances 0.000 claims description 29
- 239000007789 gas Substances 0.000 claims description 20
- 239000000356 contaminant Substances 0.000 claims description 18
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 229910017052 cobalt Inorganic materials 0.000 claims description 9
- 239000010941 cobalt Substances 0.000 claims description 9
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000005229 chemical vapour deposition Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 229910000069 nitrogen hydride Inorganic materials 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 230000002411 adverse Effects 0.000 abstract description 4
- 238000011109 contamination Methods 0.000 abstract 1
- 239000013545 self-assembled monolayer Substances 0.000 description 52
- 239000002094 self assembled monolayer Substances 0.000 description 42
- 239000010410 layer Substances 0.000 description 32
- 210000002381 plasma Anatomy 0.000 description 31
- 230000000903 blocking effect Effects 0.000 description 18
- 150000001875 compounds Chemical class 0.000 description 15
- 239000002243 precursor Substances 0.000 description 14
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 11
- 239000001257 hydrogen Substances 0.000 description 10
- 229910052739 hydrogen Inorganic materials 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000000376 reactant Substances 0.000 description 6
- 238000000231 atomic layer deposition Methods 0.000 description 5
- 230000002209 hydrophobic effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000003795 desorption Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- NQZFAUXPNWSLBI-UHFFFAOYSA-N carbon monoxide;ruthenium Chemical group [Ru].[Ru].[Ru].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-] NQZFAUXPNWSLBI-UHFFFAOYSA-N 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 description 1
- 229910000071 diazene Inorganic materials 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 239000003701 inert diluent Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- URHRKEBGHLRDGY-UHFFFAOYSA-N n-[dodecyl(dimethyl)silyl]-n-methylmethanamine Chemical compound CCCCCCCCCCCC[Si](C)(C)N(C)C URHRKEBGHLRDGY-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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Abstract
Description
Claims (20)
- 選択的堆積の方法であって、
導電性材料および誘電体材料を含む基板を一般式((CH3)2N)xSi(CH3)y((CH2)zCH3)のシリルアミンに曝露して、前記誘電体材料上に界面活性剤層を選択的に形成するステップであって、ここで、xは1~3であり、yは0~2であり、x+yは3に等しく、zは0~17である、ステップと、
前記導電性材料上に膜を選択的に堆積させるステップと
を含む、方法。 - 前記導電性材料が、銅、マンガン、コバルト、タングステン、ルテニウム、またはモリブデンのうちの1つまたは複数を含む、請求項1に記載の方法。
- 前記誘電体材料が、酸化ケイ素または低誘電率誘電体のうちの1つまたは複数を含む、請求項1に記載の方法。
- 前記シリルアミンが、(N(CH3)2)Si(CH3)3から本質的になる、請求項1に記載の方法。
- zが5以下である、請求項1に記載の方法。
- 前記膜を選択的に堆積させることが、化学気相堆積プロセスを含む、請求項1に記載の方法。
- 前記膜が金属膜を含む、請求項1に記載の方法。
- 前記金属が、ルテニウムから本質的になる、請求項7に記載の方法。
- コバルトキャップが、Ru-Coキャッピング層を形成するために前記膜上に堆積される、請求項8に記載の方法。
- 前記膜が選択的に堆積された後、前記界面活性剤層が除去されない、請求項1に記載の方法。
- 選択性を改善する方法であって、酸化物汚染物質をもつ導電性材料と、-OH表面終端をもつ誘電体材料とを含む基板を、窒素含有ガスから形成されたプラズマに曝露して、前記酸化物汚染物質を除去し、前記誘電体材料上に-NH表面終端を形成するステップを含む、方法。
- 前記導電性材料が銅を含み、前記酸化物汚染物質がCuOを含む、請求項11に記載の方法。
- 前記窒素含有ガスが、NH3、N2H2、またはN2のうちの1つまたは複数を含む、請求項11に記載の方法。
- 前記窒素含有ガスが、アンモニア(NH3)から本質的になる、請求項13に記載の方法。
- 前記プラズマが、300W~800Wの範囲の電力を有する、請求項11に記載の方法。
- 前記基板が、1秒~10秒の期間前記プラズマによって洗浄される、請求項11に記載の方法。
- 前記基板を界面活性剤に曝露して、前記導電性材料よりも前記誘電体材料上に、またはその逆に、界面活性剤層を選択的に形成するステップと、前記導電性材料または前記誘電体材料上に、それぞれ、膜を選択的に堆積させるステップとをさらに含む、請求項11に記載の方法。
- 前記膜の前記選択性が、前記基板を洗浄しない同様のプロセスと比較して20パーセント以上向上する、請求項17に記載の方法。
- 選択的堆積の方法であって、
酸化物汚染物質をもつ導電性材料と、-OH表面終端をもつ誘電体材料とを含む基板を、窒素含有ガスから形成されたプラズマに曝露して、前記酸化物汚染物質を除去し、前記誘電体材料上に-NH表面終端を形成するステップと、
前記基板を一般式(N(CH3)2)xSi(CH3)y((CH2)zCH3)のシリルアミンに曝露して、前記誘電体材料上に界面活性剤層を選択的に形成するステップであって、ここで、xは1~3であり、yは0~2であり、x+yは3に等しく、zは0~5である、ステップと、
前記導電性材料上に膜を選択的に堆積させるステップと
を含む、方法。 - 前記導電性材料が銅を含み、前記膜がルテニウムを含む、請求項19に記載の方法。
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US20160133563A1 (en) * | 2014-11-07 | 2016-05-12 | Applied Materials, Inc. | Methods for thermally forming a selective cobalt layer |
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