JP2023501303A - レーザ切断方法及びそれに関連するレーザ切断装置 - Google Patents
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- 239000000463 material Substances 0.000 claims abstract description 80
- 238000000034 method Methods 0.000 claims abstract description 41
- 238000003698 laser cutting Methods 0.000 claims abstract description 27
- 230000001678 irradiating effect Effects 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims description 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 7
- 238000010008 shearing Methods 0.000 claims description 3
- 239000006058 strengthened glass Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 9
- 238000000926 separation method Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000003313 weakening effect Effects 0.000 description 3
- 229910052779 Neodymium Inorganic materials 0.000 description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
- B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
Description
レーザ切断装置は、特に
・被切断材のシートを保持するワークホルダと、
・第1のレーザ光を発生させる第1のレーザと、
・第2のレーザ光を発生させる第2のレーザと、
・第1レーザ光及び第2レーザ光及び第2レーザ光をワークホルダに対して相対的に移動させる送り機構と、
・本発明による方法を実行するための送り機構及び2つのレーザの制御装置と、
を備える。
2 ガラス板
3 ワークホルダ
4 支持板
5 散乱層
6 送り機構
7 矢印
10 (第1の)レーザ
11 (第1の)レーザ光
12 (第2の)レーザ
13 (第2の)レーザ光
14 アキシコンレンズ
15 ベッセルビーム
16 集束領域
17 制御コンピュータ
18 制御プログラム
20 切断線
21 焦点
22 点
23 部分
30 チップ
31 ウエハ
Claims (11)
- 板形状の材料を切断するためのレーザ切断方法であって、
第1のステップにおいて、被切断材を、所定の切断線(20)に沿ってパルス状の第1のレーザ光(11)を照射することによって弱め、特に穿孔し、
第2のステップにおいて、第2のレーザ光(13)を照射することによって、前記被切断材を、前記切断線(20)の領域において局所的に加熱し、材料応力を発生させ、
前記被切断材を、前記第2のステップにおいて、前記切断線(20)上の1つの点(22)のみにおいて、又は互いに離間した複数の点(22)のみにおいて加熱する、レーザ切断方法。 - 前記被切断材を、前記第2のステップにおいて、前記切断線(20)上の互いに離間した、ちょうど2つの点(22)のみにおいて加熱する、請求項1に記載の方法。
- 第3のステップにおいて、前記被切断材を、機械的負荷によって、特に前記被切断材の曲げ、せん断、及び/又は、引き離しによって、前記切断線(20)において分離する、請求項1又は2に記載の方法。
- 前記第1のレーザ光(11)をアキシコンレンズ(14)によってベッセルビーム(15)に集束し、そのベッセルビームの集束領域(16)に前記被切断材を配置する、請求項1~3のいずれか一項に記載の方法。
- 前記第2のレーザ光(13)を、弱く集束して又は集束せずに、前記被切断材に放射する、請求項1~4のいずれか一項に記載の方法。
- 前記被切断材は、前記第1のレーザ光(11)に対して透明である、請求項1~5のいずれか一項に記載の方法。
- 前記被切断材は、前記第2のレーザ光(13)に対して不透明又は半透明である、請求項1~6のいずれか一項に記載の方法。
- 前記第1のレーザ光(11)を、前記被切断材に、300フェムト秒と30ピコ秒との間のパルス長を有するパルスにおいて放射する、請求項1~7のいずれか一項に記載の方法。
- 前記被切断材として、ガラス板(2)を用い、特に非強化ガラスを用い、
前記第1のレーザ光(11)は約1マイクロメートルの波長を有し、
前記第2のレーザ光(13)は約10マイクロメートルの波長を有する、請求項1~8のいずれか一項に記載の方法。 - 前記被切断材として、シリコン製の板(31)を用い、
前記第1のレーザ光(11)は約2マイクロメートルの波長を有し、
前記第2のレーザ光(13)は約1マイクロメートルの波長を有する、請求項1~9のいずれか一項に記載の方法。 - 板形状の材料を切断するためのレーザ切断装置(1)であって、請求項1~10のいずれか一項に記載の方法を実行するように構成されている、レーザ切断装置(1)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102019217021.8A DE102019217021A1 (de) | 2019-11-05 | 2019-11-05 | Laserschneidverfahren und zugehörige Laserschneidvorrichtung |
DE102019217021.8 | 2019-11-05 | ||
PCT/EP2020/080823 WO2021089546A1 (de) | 2019-11-05 | 2020-11-03 | Laserschneidverfahren und zugehörige laserschneidvorrichtung |
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JP2023501303A true JP2023501303A (ja) | 2023-01-18 |
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Country Status (6)
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US (1) | US20220258285A1 (ja) |
EP (1) | EP4031315B1 (ja) |
JP (1) | JP2023501303A (ja) |
CN (1) | CN114616071A (ja) |
DE (1) | DE102019217021A1 (ja) |
WO (1) | WO2021089546A1 (ja) |
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CN115283848B (zh) * | 2022-08-19 | 2023-07-25 | 东莞市光博士激光科技股份有限公司 | 双工位激光切割设备 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016513016A (ja) * | 2013-02-04 | 2016-05-12 | ニューポート コーポレーション | 透明及び半透明な基板をレーザ切断する方法及び装置 |
JP2017530867A (ja) * | 2014-07-14 | 2017-10-19 | コーニング インコーポレイテッド | 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6770544B2 (en) * | 2001-02-21 | 2004-08-03 | Nec Machinery Corporation | Substrate cutting method |
WO2011025908A1 (en) * | 2009-08-28 | 2011-03-03 | Corning Incorporated | Methods for laser cutting articles from chemically strengthened glass substrates |
JP5446631B2 (ja) * | 2009-09-10 | 2014-03-19 | アイシン精機株式会社 | レーザ加工方法及びレーザ加工装置 |
JP5879201B2 (ja) * | 2012-05-24 | 2016-03-08 | 三星ダイヤモンド工業株式会社 | ガラス基板の分断方法 |
EP3024616B1 (de) * | 2013-07-23 | 2019-04-10 | 3D-Micromac AG | Verfahren und vorrichtung zur trennung eines flachen werkstücks in mehrere teilstücke |
CN105828965B (zh) * | 2013-12-18 | 2019-09-06 | Posco公司 | 钢板切边装置及方法 |
LT2965853T (lt) * | 2014-07-09 | 2016-11-25 | High Q Laser Gmbh | Medžiagos apdorojimas, naudojant pailgintuosius lazerio spindulius |
WO2016122821A2 (en) * | 2015-01-29 | 2016-08-04 | Imra America, Inc. | Laser-based modification of transparent materials |
EP3274306B1 (en) * | 2015-03-24 | 2021-04-14 | Corning Incorporated | Laser cutting and processing of display glass compositions |
KR102077667B1 (ko) * | 2015-08-10 | 2020-02-14 | 쌩-고벵 글래스 프랑스 | 박형 유리 층의 절단 방법 |
DE102015116846A1 (de) * | 2015-10-05 | 2017-04-06 | Schott Ag | Verfahren zum Filamentieren eines Werkstückes mit einer von der Sollkontur abweichenden Form sowie durch Filamentation erzeugtes Werkstück |
DE102015120950B4 (de) * | 2015-12-02 | 2022-03-03 | Schott Ag | Verfahren zum lasergestützten Ablösen eines Teilstücks von einem flächigen Glas- oder Glaskeramikelement, flächiges zumindest teilweise keramisiertes Glaselement oder Glaskeramikelement und Kochfläche umfassend ein flächiges Glas- oder Glaskeramikelement |
DE102016000051A1 (de) * | 2016-01-05 | 2017-07-06 | Siltectra Gmbh | Verfahren und Vorrichtung zum planaren Erzeugen von Modifikationen in Festkörpern |
DE102016213802A1 (de) * | 2016-07-27 | 2018-02-01 | 4Jet Microtech Gmbh & Co. Kg | Trennen mit Laserstrahlung |
EP3507057A1 (en) * | 2016-08-30 | 2019-07-10 | Corning Incorporated | Laser processing of transparent materials |
JP6955684B2 (ja) * | 2017-03-09 | 2021-10-27 | 株式会社リコー | 光加工装置、及び光加工物の生産方法 |
US20180257170A1 (en) * | 2017-03-13 | 2018-09-13 | Coherent Lasersystems Gmbh & Co. Kg | Controlled separation of laser processed brittle material |
US11401195B2 (en) * | 2018-03-29 | 2022-08-02 | Corning Incorporated | Selective laser processing of transparent workpiece stacks |
-
2019
- 2019-11-05 DE DE102019217021.8A patent/DE102019217021A1/de active Pending
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2020
- 2020-11-03 CN CN202080076130.7A patent/CN114616071A/zh active Pending
- 2020-11-03 JP JP2022525845A patent/JP2023501303A/ja active Pending
- 2020-11-03 WO PCT/EP2020/080823 patent/WO2021089546A1/de unknown
- 2020-11-03 EP EP20800645.2A patent/EP4031315B1/de active Active
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016513016A (ja) * | 2013-02-04 | 2016-05-12 | ニューポート コーポレーション | 透明及び半透明な基板をレーザ切断する方法及び装置 |
JP2017530867A (ja) * | 2014-07-14 | 2017-10-19 | コーニング インコーポレイテッド | 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法 |
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EP4031315A1 (de) | 2022-07-27 |
WO2021089546A1 (de) | 2021-05-14 |
US20220258285A1 (en) | 2022-08-18 |
CN114616071A (zh) | 2022-06-10 |
EP4031315B1 (de) | 2023-09-27 |
DE102019217021A1 (de) | 2021-05-06 |
EP4031315C0 (de) | 2023-09-27 |
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