JP2023183054A - Detoxification treatment method of low concentration pcb waste - Google Patents

Detoxification treatment method of low concentration pcb waste Download PDF

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JP2023183054A
JP2023183054A JP2022096446A JP2022096446A JP2023183054A JP 2023183054 A JP2023183054 A JP 2023183054A JP 2022096446 A JP2022096446 A JP 2022096446A JP 2022096446 A JP2022096446 A JP 2022096446A JP 2023183054 A JP2023183054 A JP 2023183054A
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pcb waste
waste
pcb
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low
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洋一 福地
Yoichi Fukuchi
武史 池田
Takeshi Ikeda
勝士 村重
Katsushi Murashige
阿部 俊司
Shunji Abe
翔 佐々木
Sho Sasaki
洋人 中野
Hiroto Nakano
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Dowa Eco Systems Co Ltd
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Abstract

To provide a treatment method of low concentration PCB waste capable of applying detoxification treatment to various types of low concentration PCB waste by stably securing combustion temperature of 1,100°C or higher and retention time.SOLUTION: A treatment method of PCB waste includes: a heating step of heating waste containing PCB to evaporate PCB from PCB waste; and an exhaust gas processing step of heating exhaust gas discharged by the heating step to detoxify the exhaust gas. In the heating step, a refractory material is supplied together with the PCB waste to a rotary combustion furnace.SELECTED DRAWING: Figure 2

Description

本発明は、低濃度PCB廃棄物を無害化するためのPCB含有廃棄物の処理方法に関するものである。 TECHNICAL FIELD The present invention relates to a method for treating PCB-containing waste for rendering low-concentration PCB waste harmless.

PCB(ポリ塩化ビフェニル)は、耐熱性、絶縁性に優れ、難分解性であることから、かつて絶縁油等として広く用いられていたが、人体および環境に対する毒性の高さから、現在ではその製造、輸入および使用が禁止されている。また、PCB特別措置法により、PCBを使用した既存の機器類は、2027年3月までに無害化処理した上での廃棄処理を完了しなければならないことになっている。 PCB (polychlorinated biphenyls) has excellent heat resistance, insulation properties, and is difficult to decompose, so it was once widely used as insulating oil, etc. However, due to its high toxicity to the human body and the environment, it is no longer manufactured. , import and use are prohibited. Furthermore, according to the PCB Special Measures Law, existing equipment that uses PCBs must be rendered harmless and disposed of by March 2027.

従来、PCB廃棄物の処理として、溶剤洗浄や、真空加熱分離方式での処理が行われている。例えば特許文献1には、低濃度PCBを含有する液体や固体の廃棄物を850℃以上で分解し、無害化処理する方法が開示されている。なお、PCB廃棄物とは、PCBを含有した廃棄物をいい、特別に指定された保管・処分を行う必要があるものをいう。PCB廃棄物の具体例としては、絶縁油にPCBを使用したトランスやコンデンサ等が挙げられる。 Conventionally, PCB waste has been treated by solvent cleaning or vacuum heating separation. For example, Patent Document 1 discloses a method for decomposing liquid or solid waste containing low concentration PCBs at 850° C. or higher to render them harmless. Note that PCB waste refers to waste that contains PCBs and requires specially designated storage and disposal. Specific examples of PCB waste include transformers and capacitors that use PCBs as insulating oil.

ところが、近年新たに、感圧紙等に5,000mg/kgを超えるPCBが含有されていることが発覚した。これに伴い、PCB特別措置法が改正され、5,000mg/kg(0.5%)以上、100,000mg/kg(10%)以下のPCBを含有する汚泥、紙くず、木くず、繊維くず、廃プラスチック類が、改正低濃度PCB廃棄物と認定され、一般の無害化処理認定施設での無害化処理が可能となった。 However, in recent years, it has been newly discovered that pressure-sensitive paper and the like contain more than 5,000 mg/kg of PCBs. Along with this, the PCB Special Measures Law was revised, and sludge, paper waste, wood waste, fiber waste, and waste containing PCBs of 5,000 mg/kg (0.5%) or more and 100,000 mg/kg (10%) or less were revised. Plastics have been certified as revised low-concentration PCB waste, and can now be detoxified at a general certified detoxification facility.

特開2010-75848号公報Japanese Patent Application Publication No. 2010-75848

従来の低濃度PCB廃棄物よりも高濃度の改正低濃度PCB廃棄物においては、環境省による無害化実証試験に基づき、1,100℃以上で滞留時間2秒以上という処理基準が定められている。ところが、従来の無害化処理は、上記特許文献1に開示された方法のように、850℃で2秒以上の処理を行うものであり、改正低濃度PCB廃棄物の処理を行うことができない。 For the revised low-concentration PCB waste, which has a higher concentration than the conventional low-concentration PCB waste, treatment standards have been established for the residence time of 2 seconds or more at 1,100℃ or higher, based on a detoxification verification test conducted by the Ministry of the Environment. . However, conventional detoxification treatment, such as the method disclosed in Patent Document 1, involves treatment at 850° C. for 2 seconds or more, and cannot treat revised low-concentration PCB waste.

また、従来の処理施設では、改正低濃度PCB廃棄物と認定された廃ウェス類、スラッジ・活性炭、おがくず、紙くず、木くず、脱脂綿、繊維くず、廃プラスチック類、等の許可品目に対し、感圧紙、塗膜(Pb含有)、可燃固形物、不燃固形物、油泥といった多種多様な低濃度PCB汚染物の性状に対応しきれず、処理品目の限定や処理量の制限を必要としたり、安定操業ができないといった問題がある。 In addition, at conventional treatment facilities, permitted items such as waste rags, sludge/activated carbon, sawdust, paper waste, wood chips, absorbent cotton, textile waste, and waste plastics, which have been certified as revised low-concentration PCB waste, are treated with pressure-sensitive paper. , paint films (containing Pb), combustible solids, non-combustible solids, oil sludge, and other low-concentration PCB contaminants. There is a problem that it cannot be done.

本発明は、上記の課題に鑑みてなされたものであり、1,100℃以上の燃焼温度および滞留時間を安定して確保し、多種多様な低濃度PCB廃棄物を無害化処理することができる低濃度PCB廃棄物の処理方法を提供することを目的とする。 The present invention was made in view of the above problems, and is capable of stably securing a combustion temperature of 1,100°C or higher and a residence time, and detoxifying a wide variety of low-concentration PCB wastes. The purpose is to provide a method for processing low-concentration PCB waste.

上記問題を解決するため、本発明は、PCBを含有する廃棄物を加熱してPCB廃棄物からPCBを揮発させる加熱工程と、前記加熱工程により排出される排ガスを加熱して無害化処理する排ガス処理工程とを有するPCB廃棄物の処理方法であって、前記加熱工程において、前記PCB廃棄物とともに耐火物を回転燃焼炉に供給することを特徴とする、低濃度PCB廃棄物の無害化処理方法を提供する。 In order to solve the above problems, the present invention provides a heating process in which PCB-containing waste is heated to volatilize PCBs from the PCB waste, and an exhaust gas in which the exhaust gas discharged from the heating process is heated and detoxified. A method for detoxifying low-concentration PCB waste, the method comprising: a treatment step, wherein in the heating step, a refractory is supplied to a rotary combustion furnace along with the PCB waste. I will provide a.

前記耐火物は、溶倒温度1200℃以上であることが好ましい。また、前記耐火物は、目開き50mmの篩上且つ目開き200mmの篩下を90%以上含むことが好ましい。 It is preferable that the refractory has a melting temperature of 1200° C. or higher. Further, it is preferable that the refractory contains 90% or more of the upper part of the sieve having a mesh opening of 50 mm and the lower part of the sieve having a mesh opening of 200 mm.

前記耐火物は、前記回転燃焼炉の燃焼ガスカロリーに応じて0.04~0.3kg/MJで供給してもよい。 The refractory may be supplied at a rate of 0.04 to 0.3 kg/MJ depending on the combustion gas calorie of the rotary combustion furnace.

前記回転燃焼炉に供給する前記PCB廃棄物の重量に対する前記耐火物の重量が2~20倍でもよい。燃焼速度が速いPCB廃棄物と燃焼速度が遅いPCB廃棄物とを混合して前記回転燃焼炉に供給してもよい。また、固体の前記PCB廃棄物を一辺400mm以下として前記回転燃焼炉に供給してもよい。 The weight of the refractory may be 2 to 20 times the weight of the PCB waste supplied to the rotary combustion furnace. PCB waste having a high combustion rate and PCB waste having a low combustion rate may be mixed and supplied to the rotary combustion furnace. Further, the solid PCB waste may be supplied to the rotary combustion furnace with a side of 400 mm or less.

前記PCB廃棄物は、PCB濃度が5000mg/kg以上100,000mg/kg以下でもよい。 The PCB waste may have a PCB concentration of 5000 mg/kg or more and 100,000 mg/kg or less.

本発明によれば、回転燃焼炉内において、1,100℃以上の燃焼温度および滞留時間を安定して確保することができる。 According to the present invention, it is possible to stably secure a combustion temperature of 1,100° C. or higher and a residence time in a rotary combustion furnace.

本発明の実施形態にかかる低濃度PCB廃棄物の処理設備の例を示す概略図である。1 is a schematic diagram showing an example of a processing facility for low-concentration PCB waste according to an embodiment of the present invention. ロータリーキルンおよび二次燃焼室の内部の状態を示す断面図である。FIG. 2 is a sectional view showing the internal state of the rotary kiln and the secondary combustion chamber.

以下、本発明の実施の形態を、図を参照して説明する。なお、本明細書および図面において、実質的に同一の機能構成を有する要素においては、同一の符号を付することにより重複説明を省略する。 Embodiments of the present invention will be described below with reference to the drawings. Note that in this specification and the drawings, elements having substantially the same functional configuration are designated by the same reference numerals and redundant explanation will be omitted.

図1は、本発明に係る低濃度PCB廃棄物の処理設備の例を示す。本実施形態において、被処理物である低濃度PCB廃棄物は、5,000mg/kg~100,000mg/kgのPCBを含有するものとする。処理装置1は、低濃度PCB廃棄物からPCBを揮発させる加熱工程を行う廃棄物焼却部11と、加熱工程で発生した排ガスを無害化処理する排ガス処理工程を行う排ガス処理部12とを有している。廃棄物焼却部11は、低濃度PCB廃棄物9を燃焼させる回転燃焼炉の一例であるロータリーキルン21と、ロータリーキルン21の出口に連結して設けられた二次燃焼室22とを備えている。排ガス処理部12は、二次燃焼室22で発生する排ガスを燃焼処理する三次燃焼炉23、および三次燃焼炉23で処理された煤塵を含む排ガスを冷却、中和、および除塵する冷却塔24、第一洗浄塔25、第二洗浄塔26、第一湿式電気集塵機27、第二湿式電気集塵機28が順に配置されている。なお、回転燃焼炉には、ロータリーキルンの他に回転ストーカ式焼却炉などがある。 FIG. 1 shows an example of a low-concentration PCB waste treatment facility according to the present invention. In this embodiment, it is assumed that the low-concentration PCB waste to be treated contains 5,000 mg/kg to 100,000 mg/kg of PCBs. The treatment device 1 includes a waste incineration unit 11 that performs a heating process to volatilize PCBs from low-concentration PCB waste, and an exhaust gas treatment unit 12 that performs an exhaust gas treatment process to detoxify exhaust gas generated in the heating process. ing. The waste incineration unit 11 includes a rotary kiln 21, which is an example of a rotary combustion furnace that burns the low-concentration PCB waste 9, and a secondary combustion chamber 22 connected to the outlet of the rotary kiln 21. The exhaust gas treatment unit 12 includes a tertiary combustion furnace 23 that burns and processes the exhaust gas generated in the secondary combustion chamber 22, and a cooling tower 24 that cools, neutralizes, and removes dust from the exhaust gas containing soot and dust treated in the tertiary combustion furnace 23. A first cleaning tower 25, a second cleaning tower 26, a first wet electrostatic precipitator 27, and a second wet electrostatic precipitator 28 are arranged in this order. In addition to the rotary kiln, the rotary combustion furnace includes a rotary stoker type incinerator.

図2は、ロータリーキルン21および二次燃焼室22の内部を示す図である。ロータリーキルン21の片端(図2において左端)が低濃度PCB廃棄物9の搬入口31である。他端(下流側)が出口32であり、出口32は二次燃焼室22の側方に連結されている。ロータリーキルン21は、内部を所定温度、例えば600℃~1300℃に加熱するバーナー(図示省略)を備え、被処理物である低濃度PCB廃棄物9を搬出方向に搬送しながら加熱する。 FIG. 2 is a diagram showing the inside of the rotary kiln 21 and the secondary combustion chamber 22. One end of the rotary kiln 21 (the left end in FIG. 2) is an entrance 31 for the low-concentration PCB waste 9. The other end (downstream side) is an outlet 32, and the outlet 32 is connected to the side of the secondary combustion chamber 22. The rotary kiln 21 is equipped with a burner (not shown) that heats the inside to a predetermined temperature, for example, 600° C. to 1300° C., and heats the low-concentration PCB waste 9, which is the material to be treated, while conveying it in the discharge direction.

低濃度PCB廃棄物9は、供給ホッパ20(図1)から、ロータリーキルン21内に、耐火物の一例である耐火レンガ10とともに投入する。被処理物である低濃度PCB廃棄物9は、感圧紙、塗膜(Pb含有)、可燃固形物、不燃固形物、油泥等であり、これらが混在してもよい。固形物の場合、円滑な供給を行うためには、粒径400mm以下に破砕してから供給することが好ましい。また、油泥のような燃焼速度の速いPCB廃棄物に対しては、供給熱負荷量の管理だけでは安定処理が困難な場合がある。このようなときには、ウェス等を同梱し、固体の表面燃焼で燃焼速度を低下させることにより、確実にPCBを揮発させることができるようになる。 The low-concentration PCB waste 9 is fed from a supply hopper 20 (FIG. 1) into a rotary kiln 21 together with refractory bricks 10, which are an example of a refractory. The low-concentration PCB waste 9 that is the object to be treated is pressure-sensitive paper, paint film (containing Pb), combustible solids, non-combustible solids, oil mud, etc., and these may be mixed. In the case of solid materials, in order to smoothly supply them, it is preferable to crush them into particles with a particle size of 400 mm or less before supplying them. Furthermore, it may be difficult to stably treat PCB waste such as oil sludge, which burns at a high rate, only by controlling the supplied heat load amount. In such a case, the PCB can be reliably volatilized by including a rag or the like in the package and reducing the combustion rate by burning the solid surface.

耐火レンガ10は、1100℃以上の炉内での溶融、固着を防ぐため、溶倒温度1200℃以上のものが好ましい。また、粒径が小さすぎると軟化・溶融状態になる部分が多くなりクリンカを形成しやすく、廃棄物の飛散を防止する効果が低減することがあり、廃棄物が耐火レンガ10にマスキングされて酸欠状態になり燃焼が妨げられることがある。さらに、粒径が大きすぎると供給時のトラブルが増加するおそれがあり、炉壁内を破損するおそれも高まる。そのため、目開き50mmの篩上且つ目開き200mmの篩下を90%以上含むものが好ましい。さらに、耐火レンガ10の供給量は、ロータリーキルン21に加熱の目的で供給する燃焼ガスの総熱量(燃焼ガスカロリー)を見て、廃棄物燃焼熱量当たりの供給量として0.04~0.3kg/MJの範囲で調整できる。このとき、供給される廃棄物の重量に対する耐火レンガ10の重量は2~20倍程度となりうる。または1t~2t/hで供給することができる。 The refractory brick 10 preferably has a melting temperature of 1200° C. or higher to prevent melting and sticking in a furnace at 1100° C. or higher. In addition, if the particle size is too small, many parts become softened and molten, making it easy to form clinker, which may reduce the effectiveness of preventing waste from scattering, and the waste may be masked by the refractory bricks 10 and oxidized. It may become depleted and combustion may be hindered. Furthermore, if the particle size is too large, troubles during feeding may increase, and the inside of the furnace wall may be damaged. Therefore, it is preferable that the material contains 90% or more of the upper part of the sieve with a mesh opening of 50 mm and the lower part of the sieve with a mesh opening of 200 mm. Furthermore, the amount of refractory bricks 10 to be supplied is 0.04 to 0.3 kg per waste combustion calorie, considering the total amount of heat (combustion gas calories) of combustion gas supplied to the rotary kiln 21 for heating purposes. It can be adjusted within the range of MJ. At this time, the weight of the refractory bricks 10 may be about 2 to 20 times the weight of the supplied waste. Alternatively, it can be supplied at a rate of 1 t to 2 t/h.

さらに、必要に応じて、PCB廃棄物の焼却時に従来用いていた灯油等の助燃剤を、ロータリーキルン21内に供給する。 Furthermore, if necessary, a combustion improver such as kerosene, which is conventionally used when incinerating PCB waste, is supplied into the rotary kiln 21.

低濃度PCB廃棄物9を耐火レンガ10とともに供給することにより、熱容量を向上させ、ロータリーキルン21の出口付近、例えば図2に示すように出口32から3mの位置から二次燃焼室22の煙道33にわたり、安定して1100℃以上を確保することができる。したがって、低濃度PCB廃棄物9を1100℃以上の範囲に2秒以上対流させ、PCBを完全分解させることができる。そのため、従来用いていた助燃剤の量を削減できる。また、低濃度PCB廃棄物9が高温の耐火レンガ10に接触して撹拌されながら燃焼するので、確実にPCBを分解、揮発させることができる。 By supplying the low-concentration PCB waste 9 together with the refractory bricks 10, the heat capacity is improved, and the flue 33 of the secondary combustion chamber 22 is supplied from the vicinity of the outlet of the rotary kiln 21, for example, from a position 3 m from the outlet 32 as shown in FIG. It is possible to stably maintain a temperature of 1100° C. or higher over a period of time. Therefore, the PCBs can be completely decomposed by causing the low concentration PCB waste 9 to undergo convection at a temperature of 1100° C. or higher for 2 seconds or more. Therefore, the amount of combustion improver that was conventionally used can be reduced. Further, since the low concentration PCB waste 9 comes into contact with the high-temperature firebrick 10 and burns while being stirred, the PCB can be reliably decomposed and volatilized.

さらに、低濃度PCB廃棄物9が紙状の場合、耐火レンガ10に接触していることで、キルン入口からの燃焼空気によって紙状の廃棄物が炉内を飛散するのを抑制する効果がある。また、耐火レンガ10により低濃度PCB廃棄物9の燃え殻等が溶融固着せずに間隙が生じ、酸欠による未燃焼を抑制する効果も発揮される。すなわち、低濃度PCB廃棄物9のPCBの分解を促進するとともに、排出系統のトラブルを抑制することができる。 Furthermore, if the low-concentration PCB waste 9 is in the form of paper, its contact with the refractory bricks 10 has the effect of suppressing the paper-like waste from being scattered inside the furnace by the combustion air from the kiln inlet. . In addition, the refractory bricks 10 prevent the cinders and the like of the low concentration PCB waste 9 from melting and solidifying, creating gaps, thereby exhibiting the effect of suppressing unburnt combustion due to oxygen deficiency. That is, it is possible to promote the decomposition of PCBs in the low-concentration PCB waste 9 and to suppress troubles in the discharge system.

なお、本発明で使用される耐火レンガ10は、耐火物の補修工事などで発生するハツリ品を利用することができるので、低コストで実施可能である。 Note that the refractory brick 10 used in the present invention can be manufactured at low cost since it is possible to use chiseled items generated during refractory repair work.

ロータリーキルン21で燃焼した低濃度PCB廃棄物9の燃え殻は、二次燃焼室22の下部の排出口34から排出され、排ガスは、二次燃焼室22の煙道33を介して三次燃焼炉23へ排出される。三次燃焼炉23では、所定温度および滞留時間で排ガスを燃焼させ、高温燃焼した煤塵を含む排ガスは、冷却塔24、第一洗浄塔25、第二洗浄塔26、第一湿式電気集塵機27、第二湿式電気集塵機28を順に通過して冷却、中和、および除塵された後、大気に放出される。なお、本発明において、排ガス処理部12は、図1に示す構成に限るものではない。 The burnt remains of the low-concentration PCB waste 9 burned in the rotary kiln 21 are discharged from the outlet 34 at the bottom of the secondary combustion chamber 22, and the exhaust gas is sent to the tertiary combustion furnace 23 through the flue 33 of the secondary combustion chamber 22. be discharged. In the tertiary combustion furnace 23, the exhaust gas is burned at a predetermined temperature and residence time, and the exhaust gas containing soot and dust burned at a high temperature is sent to a cooling tower 24, a first cleaning tower 25, a second cleaning tower 26, a first wet electrostatic precipitator 27, and a second cleaning tower 25. After sequentially passing through a double-wet electrostatic precipitator 28 to be cooled, neutralized, and dust removed, it is released into the atmosphere. Note that in the present invention, the exhaust gas treatment section 12 is not limited to the configuration shown in FIG.

以上のように、本発明によれば、低濃度PCB廃棄物9と耐火レンガ10との混焼により燃焼効率が向上し、100,000mg/kg以下の低濃度PCB廃棄物9を安定して無害化処理することが可能となる。また、低濃度PCB廃棄物9を破砕しなくても処理が可能であり、さらに低濃度PCB廃棄物9が耐火レンガ10に接触しながらロータリーキルン21内で搬送されることで、多種多様な性状の低濃度PCB廃棄物9を処理することができる。さらに、燃焼速度が速いPCB廃棄物9と燃焼速度が遅いPCB廃棄物9とを混合してロータリーキルン21に供給すれば、油泥、塗膜屑など、幅広い熱量の低濃度PCB廃棄物9に対応することができる。ここで、燃焼速度が速いPCB廃棄物としては、可燃性のPCB廃棄物、例えば、油泥、廃プラスチック類などがあり、燃焼速度が遅いPCB廃棄物としては、不燃性の汚泥などがある。 As described above, according to the present invention, the combustion efficiency is improved by co-firing the low concentration PCB waste 9 and the refractory bricks 10, and the low concentration PCB waste 9 of 100,000 mg/kg or less is stably rendered harmless. It becomes possible to process. Furthermore, it is possible to process the low concentration PCB waste 9 without crushing it, and furthermore, by conveying the low concentration PCB waste 9 in the rotary kiln 21 while contacting the refractory bricks 10, it is possible to process the low concentration PCB waste 9 with a wide variety of properties. Low concentration PCB waste 9 can be treated. Furthermore, by mixing PCB waste 9 with a fast combustion rate and PCB waste 9 with a slow combustion rate and supplying the mixture to the rotary kiln 21, it is possible to handle a wide range of low-concentration PCB wastes 9 with a wide range of calorific values, such as oil sludge and paint film debris. be able to. Here, examples of PCB waste with a fast combustion rate include combustible PCB waste, such as oil sludge and waste plastics, and examples of PCB waste with a slow combustion rate include nonflammable sludge.

以上、本発明の好適な実施形態について説明したが、本発明はかかる例に限定されない。当業者であれば、特許請求の範囲に記載された技術的思想の範疇内において、各種の変更例または修正例に想到しうることは明らかであり、それらについても当然に本発明の技術的範囲に属するものと了解される。例えば、上記実施形態の構成要件は任意に組み合わせることができる。当該任意の組み合せからは、組み合わせにかかるそれぞれの構成要件についての作用及び効果が当然に得られるとともに、本明細書の記載から当業者には明らかな他の作用及び他の効果が得られる。 Although the preferred embodiments of the present invention have been described above, the present invention is not limited to such examples. It is clear that those skilled in the art can come up with various changes or modifications within the scope of the technical idea described in the claims, and these naturally fall within the technical scope of the present invention. It is understood that it belongs to For example, the constituent features of the above embodiments can be combined arbitrarily. This arbitrary combination naturally provides the effects and effects of the respective constituent elements of the combination, as well as other effects and effects that will be apparent to those skilled in the art from the description of this specification.

また、本明細書に記載された効果は、あくまで説明的または例示的なものであって限定的ではない。つまり、本開示に係る技術は、上記の効果とともに、又は、上記の効果に代えて、本明細書の記載から当業者には明らかな他の効果を奏しうる。 Further, the effects described in this specification are merely explanatory or illustrative, and are not limiting. In other words, the technology according to the present disclosure can have other effects that are obvious to those skilled in the art from the description of this specification, in addition to or in place of the above effects.

なお、以下のような構成も本開示の技術的範囲に属する。
(1)PCBを含有する廃棄物を加熱してPCB廃棄物からPCBを揮発させる加熱工程と、前記加熱工程により排出される排ガスを加熱して無害化処理する排ガス処理工程とを有するPCB廃棄物の処理方法であって、
前記加熱工程において、前記PCB廃棄物とともに耐火物を回転燃焼炉に供給することを特徴とする、低濃度PCB廃棄物の無害化処理方法。
(2)前記耐火物は、溶倒温度1200℃以上であることを特徴とする、前記(1)に記載の低濃度PCB廃棄物の無害化処理方法。
(3)前記耐火物は、目開き50mmの篩上且つ目開き200mmの篩下を90%以上含むことを特徴とする、前記(1)または(2)に記載の低濃度PCB廃棄物の無害化処理方法。
(4)前記耐火物は、前記回転燃焼炉の燃焼ガスカロリーに応じて0.04~0.3kg/MJで供給することを特徴とする、前記(1)~(3)のいずれかに記載の低濃度PCB廃棄物の無害化処理方法。
(5)前記回転燃焼炉に供給する前記PCB廃棄物の重量に対する前記耐火物の重量が2~20倍であることを特徴とする、前記(1)~(4)のいずれかに記載の低濃度PCB廃棄物の無害化処理方法。
(6)燃焼速度が速いPCB廃棄物と燃焼速度が遅いPCB廃棄物とを混合して前記回転燃焼炉に供給することを特徴とする、前記(1)~(5)のいずれかに記載の低濃度PCB廃棄物の無害化処理方法。
(7)固体の前記PCB廃棄物を一辺400mm以下として前記回転燃焼炉に供給することを特徴とする、前記(1)~(6)のいずれかに記載の低濃度PCB廃棄物の無害化処理方法。
(8)前記PCB廃棄物は、PCB濃度が5000mg/kg以上100,000mg/kg以下であることを特徴とする、前記(1)~(7)のいずれかに記載の低濃度PCB廃棄物の無害化処理方法。
Note that the following configurations also belong to the technical scope of the present disclosure.
(1) PCB waste that has a heating process in which PCB-containing waste is heated to volatilize PCBs from the PCB waste, and an exhaust gas treatment process in which the exhaust gas discharged from the heating process is heated and detoxified. A method of processing,
A method for detoxifying low-concentration PCB waste, characterized in that in the heating step, a refractory is supplied to a rotary combustion furnace together with the PCB waste.
(2) The method for detoxifying low-concentration PCB waste according to (1) above, wherein the refractory has a melting temperature of 1200° C. or higher.
(3) The refractory contains 90% or more of the upper part of the sieve with an opening of 50 mm and the lower part of the sieve with an opening of 200 mm. processing method.
(4) The refractory according to any one of (1) to (3) above, characterized in that the refractory is supplied at a rate of 0.04 to 0.3 kg/MJ depending on the combustion gas calorie of the rotary combustion furnace. A method for detoxifying low-concentration PCB waste.
(5) The refractory according to any one of (1) to (4), wherein the weight of the refractory is 2 to 20 times the weight of the PCB waste to be supplied to the rotary combustion furnace. A method for detoxifying concentrated PCB waste.
(6) The method according to any one of (1) to (5) above, characterized in that PCB waste with a fast burning rate and PCB waste with a slow burning rate are mixed and supplied to the rotary combustion furnace. A method for detoxifying low-concentration PCB waste.
(7) The detoxification treatment of low-concentration PCB waste according to any one of (1) to (6) above, characterized in that the solid PCB waste is supplied to the rotary combustion furnace with a side of 400 mm or less. Method.
(8) The PCB waste is a low-concentration PCB waste according to any one of (1) to (7) above, characterized in that the PCB concentration is 5000 mg/kg or more and 100,000 mg/kg or less. Detoxification treatment method.

[実施例1]
表1に示すように、PCB濃度が5,500~65,000mg/kgの低濃度PCB廃棄物9を1260kg用意し、種類ごとに40L容量のメディカルペール(471mm×320mm×354mm)に詰め替えて、供給ホッパ20から搬入口31を介して全長8.3mのロータリーキルン21に投入した。なお、低濃度PCB廃棄物9は、必要に応じて一辺が400mm以下の大きさに破砕等を行った後、種類ごとにメディカルペールに詰めた。
[Example 1]
As shown in Table 1, 1260 kg of low-concentration PCB waste 9 with a PCB concentration of 5,500 to 65,000 mg/kg was prepared, and each type was refilled into 40 L capacity medical pails (471 mm x 320 mm x 354 mm). The material was fed from the supply hopper 20 through the loading port 31 into a rotary kiln 21 having a total length of 8.3 m. Note that the low-concentration PCB waste 9 was crushed into pieces with a side of 400 mm or less as necessary, and then packed into medical pails by type.

ロータリーキルン21の燃焼ガスカロリーは6,437MJであった。耐火レンガ10(溶倒温度1400℃、目開き50mmの篩上且つ目開き200mmの篩下を95%含む)を1870kg/hで供給し、低濃度PCB廃棄物9を103kg/hで供給し、燃焼処理を行った。供給した低濃度PCB廃棄物の重量に対する耐火レンガ10の重量は18.2倍であった。 The combustion gas calorie of rotary kiln 21 was 6,437 MJ. Refractory bricks 10 (melting temperature 1400 ° C., 95% of the upper part of the sieve with an opening of 50 mm and the lower part of the sieve with an opening of 200 mm) were supplied at 1870 kg/h, the low concentration PCB waste 9 was supplied at 103 kg/h, Burning treatment was performed. The weight of the refractory brick 10 was 18.2 times the weight of the supplied low concentration PCB waste.

ロータリーキルン21において、低濃度PCB廃棄物9を1,100℃以上の高温で焼却したところ、表2に示すように、排ガスの滞留時間2s以上を確保できた。また、PCB分解率は99.9997%であった。 When the low-concentration PCB waste 9 was incinerated at a high temperature of 1,100° C. or higher in the rotary kiln 21, as shown in Table 2, a residence time of 2 seconds or more of the exhaust gas was ensured. Moreover, the PCB decomposition rate was 99.9997%.

また、煙道の排ガス中のPCB濃度、燃え殻及び煤塵中のPCB溶出濃度、排水中のPCB濃度、敷地境界大気中のPCB濃度、敷地外周辺大気中のPCB濃度、のそれぞれについて測定を行った。その結果、いずれも基準値等を下回り、試料の投入及び1,100℃以上の高温燃焼により、低濃度PCB廃棄物が完全に分解されていることを確認した。 In addition, we measured the PCB concentration in the flue gas, the PCB elution concentration in cinders and soot, the PCB concentration in wastewater, the PCB concentration in the air surrounding the site, and the PCB concentration in the air around the outside of the site. . As a result, all of the results were below standard values, confirming that the low-concentration PCB waste was completely decomposed by the sample injection and high-temperature combustion at 1,100°C or higher.

Figure 2023183054000002
Figure 2023183054000002

Figure 2023183054000003
Figure 2023183054000003

[実施例2、実施例3]
実施例2として、目開き50mm篩下の耐火レンガ10(平均粒径35mm程度)を実施例1と同重量で供給し、それ以外は実施例1と同様の操作を繰り返して、燃焼処理を実施した。また、実施例3として、目開き200mmの篩上の耐火レンガ10(平均粒径500mm程度)を実施例1と同重量で供給し、それ以外は実施例1と同様の操作を繰り返して、燃焼処理を実施した。
[Example 2, Example 3]
As Example 2, 10 refractory bricks (average particle diameter of about 35 mm) under the sieve with an opening of 50 mm were supplied in the same weight as in Example 1, and the same operations as in Example 1 were repeated to carry out the combustion treatment. did. In addition, as Example 3, 10 refractory bricks (average particle size of about 500 mm) on a sieve with an opening of 200 mm were supplied in the same weight as in Example 1, and the same operations as in Example 1 were repeated except for the combustion. Processing was carried out.

その結果、実施例2、3ともに、実施例1と同様、排ガスは各基準値等を下回り、低濃度PCB廃棄物が完全に分解されていることを確認できた。 As a result, in both Examples 2 and 3, as in Example 1, the exhaust gas was below each standard value, etc., and it was confirmed that the low concentration PCB waste was completely decomposed.

ただし、実施例2では、目開き50mm篩下の耐火レンガ10を供給したため、耐火レンガ10および燃え殻が、ロータリーキルン21や二次燃焼室22の下部で溶融固着している箇所が見られた。また、実施例3では、目開き200mmの篩上の耐火レンガ10を供給したため、供給時に供給ホッパ20やダンパに動作不良が発生し対応が必要となることがあった。 However, in Example 2, since the refractory bricks 10 under the sieve with an opening of 50 mm were supplied, there were places where the refractory bricks 10 and cinders were melted and fixed in the lower part of the rotary kiln 21 and the secondary combustion chamber 22. Further, in Example 3, since the refractory bricks 10 on a sieve with an opening of 200 mm were supplied, malfunctions occurred in the supply hopper 20 and the damper during supply, which required countermeasures.

[比較例1]
比較例として、耐火レンガ10を供給しないこと以外は実施例1と同様の操作を繰り返して、燃焼処理を実施した。その結果、排ガス温度が1100℃未満であり、PCB廃棄物の処理基準を満たさなかった。
[Comparative example 1]
As a comparative example, combustion treatment was carried out by repeating the same operation as in Example 1 except that the refractory brick 10 was not supplied. As a result, the exhaust gas temperature was less than 1100°C, which did not meet the treatment standards for PCB waste.

表3に、実施例1の耐火レンガを供給した場合と、耐火レンガを供給しなかった比較例1のそれぞれにおける、全長8.3mのロータリーキルンの4点の炉内温度の測定結果を示す。なお、実施例2、実施例3の場合も、炉内温度は実施例1と同様であった。 Table 3 shows the measurement results of the furnace temperature at four points in a rotary kiln with a total length of 8.3 m in each of the case where the refractory brick of Example 1 was supplied and the comparative example 1 where no refractory brick was supplied. In addition, in the case of Example 2 and Example 3, the temperature inside the furnace was the same as in Example 1.

Figure 2023183054000004
Figure 2023183054000004

耐火レンガを供給した実施例1~3では、入口から2m以降の下流側で1100℃を超えたが、比較例1では全長にわたって1100℃に達することがなかった。すなわち、本発明例である実施例1~3は、耐火レンガとの混焼により燃焼効率が向上し、低濃度PCB廃棄物を1100℃以上、2秒以上で安定して焼却し、100,000mg/kg以下の改正低濃度PCB汚染物の無害化処理が確実に行われることがわかった。比較例1は実施例1~3と同じ量の燃焼ガスをロータリーキルン21に供給したが、ロータリーキルン21内の温度は、実施例1~3に比較して低い結果となった。 In Examples 1 to 3 in which refractory bricks were supplied, the temperature exceeded 1100°C on the downstream side after 2 m from the entrance, but in Comparative Example 1, the temperature did not reach 1100°C over the entire length. That is, in Examples 1 to 3, which are examples of the present invention, the combustion efficiency is improved by co-firing with refractory bricks, and low concentration PCB waste can be stably incinerated at 1100°C or higher for 2 seconds or more, and 100,000mg/ It was found that detoxification treatment of modified low-concentration PCB contaminants weighing less than 1 kg can be carried out reliably. In Comparative Example 1, the same amount of combustion gas as in Examples 1 to 3 was supplied to the rotary kiln 21, but the temperature inside the rotary kiln 21 was lower than in Examples 1 to 3.

本発明は、廃棄物等を高温燃焼処理する方法として適用できる。 INDUSTRIAL APPLICABILITY The present invention can be applied as a method for high-temperature combustion treatment of waste and the like.

1 処理装置
9 低濃度PCB廃棄物
10 耐火レンガ
11 廃棄物焼却部
12 排ガス処理部
20 供給ホッパ
21 ロータリーキルン
22 二次燃焼室
23 三次燃焼炉
24 冷却塔
25 第一洗浄塔
26 第二洗浄塔
27 第一湿式電気集塵機
28 第二湿式電気集塵機
31 搬入口
32 出口
33 煙道
34 排出口
1 Treatment device 9 Low concentration PCB waste 10 Refractory bricks 11 Waste incineration unit 12 Exhaust gas treatment unit 20 Supply hopper 21 Rotary kiln 22 Secondary combustion chamber 23 Tertiary combustion furnace 24 Cooling tower 25 First cleaning tower 26 Second cleaning tower 27 First wet type electric precipitator 28 Second wet type electric precipitator 31 Inlet 32 Exit 33 Flue 34 Discharge port

Claims (8)

PCBを含有する廃棄物を加熱してPCB廃棄物からPCBを揮発させる加熱工程と、前記加熱工程により排出される排ガスを加熱して無害化処理する排ガス処理工程とを有するPCB廃棄物の処理方法であって、
前記加熱工程において、前記PCB廃棄物とともに耐火物を回転燃焼炉に供給することを特徴とする、低濃度PCB廃棄物の無害化処理方法。
A method for treating PCB waste, comprising: a heating step of heating waste containing PCBs to volatilize PCBs from the PCB waste; and an exhaust gas treatment step of heating exhaust gas discharged in the heating step to detoxify it. And,
A method for detoxifying low-concentration PCB waste, characterized in that in the heating step, a refractory is supplied to a rotary combustion furnace together with the PCB waste.
前記耐火物は、溶倒温度1200℃以上であることを特徴とする、請求項1に記載の低濃度PCB廃棄物の無害化処理方法。 2. The method for detoxifying low-concentration PCB waste according to claim 1, wherein the refractory has a melting temperature of 1200° C. or higher. 前記耐火物は、目開き50mmの篩上且つ目開き200mmの篩下を90%以上含むことを特徴とする、請求項1または2に記載の低濃度PCB廃棄物の無害化処理方法。 3. The method for detoxifying low-concentration PCB waste according to claim 1 or 2, wherein the refractory contains 90% or more of the upper part of the sieve with an opening of 50 mm and the lower part of the sieve with an opening of 200 mm. 前記耐火物は、前記回転燃焼炉の燃焼ガスカロリーに応じて0.04~0.3kg/MJで供給することを特徴とする、請求項1または2に記載の低濃度PCB廃棄物の無害化処理方法。 The detoxification of low-concentration PCB waste according to claim 1 or 2, wherein the refractory is supplied at a rate of 0.04 to 0.3 kg/MJ depending on the combustion gas calorie of the rotary combustion furnace. Processing method. 前記回転燃焼炉に供給する前記PCB廃棄物の重量に対する前記耐火物の重量が2~20倍であることを特徴とする、請求項1または2に記載の低濃度PCB廃棄物の無害化処理方法。 The method for detoxifying low-concentration PCB waste according to claim 1 or 2, wherein the weight of the refractory is 2 to 20 times the weight of the PCB waste supplied to the rotary combustion furnace. . 燃焼速度が速いPCB廃棄物と燃焼速度が遅いPCB廃棄物とを混合して前記回転燃焼炉に供給することを特徴とする、請求項1または2に記載の低濃度PCB廃棄物の無害化処理方法。 3. The detoxification treatment for low-concentration PCB waste according to claim 1 or 2, characterized in that PCB waste with a high burning rate and PCB waste with a slow burning rate are mixed and supplied to the rotary combustion furnace. Method. 固体の前記PCB廃棄物を一辺400mm以下として前記回転燃焼炉に供給することを特徴とする、請求項1または2に記載の低濃度PCB廃棄物の無害化処理方法。 3. The method for detoxifying low-concentration PCB waste according to claim 1, wherein the solid PCB waste is supplied to the rotary combustion furnace in a size of 400 mm or less on a side. 前記PCB廃棄物は、PCB濃度が5000mg/kg以上100,000mg/kg以下であることを特徴とする、請求項1または2に記載の低濃度PCB廃棄物の無害化処理方法。 3. The method for detoxifying low-concentration PCB waste according to claim 1, wherein the PCB waste has a PCB concentration of 5000 mg/kg or more and 100,000 mg/kg or less.
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