JP2023182772A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

To contribute to an improvement of a production efficiency of a substrate processing apparatus.SOLUTION: A substrate processing method contains: a step (t1) of receiving data of a first control job CJ1 as a processing to a first lot; and a step (t2) of receiving data of a second control job CJ2 as a processing to a second lot after that. The first control job CJ1 contains processing jobs PJ11 to PJ13. The second control job CJ2 contains processing jobs PJ21 to PJ23. For example, each recipe of the processing jobs PJ11, PJ13, and PJ21 to PJ23 contains a common attribute, and a recipe of the processing job PJ12 contains a different attribute. In this case, an execution of the processing job contained in the second control job CJ2 is planed even before completion of the first control job CJ1 so that the processing job of the common attribute is continued.SELECTED DRAWING: Figure 16

Description

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate.

Patent Document 1 discloses a method for creating a schedule that defines the operation of a substrate processing apparatus having a single-wafer type processing unit that processes substrates one by one. Process job information that defines substrate processing is input from a host computer, and schedules corresponding to the process job information are created in the input order. According to the created schedule, the substrate is transported to the processing unit, processing is performed on the substrate in the processing unit, and the processed substrate is carried out from the processing unit. A process job is processing for one or more substrates.

Patent Document 1 further discloses a configuration in which the execution order of process jobs is scheduled so that process jobs having common categories such as substrate type and chemical temperature are consecutive.

Japanese Patent Application Publication No. 2016-139667

A substrate container containing substrates is set in the substrate processing apparatus. The substrate processing apparatus operates to take out a substrate from its substrate container, process it, and store the processed substrate in its substrate container. The substrate container can accommodate a plurality of substrates (for example, 25 substrates). One or more substrates accommodated in one substrate container constitute a processing lot. Information that defines the processing for this processing lot is called, for example, control job information. This control job information includes one or more process job information. In other words, processing for a processing lot is a control job, and one control job includes one or more process jobs.

The substrate processing apparatus may include a plurality of container holders each capable of setting a plurality of substrate containers. In this case, processing for a plurality of processing lots can be reserved for the substrate processing apparatus. More specifically, a plurality of pieces of control job information corresponding to a plurality of processing lots are input from a host computer to the substrate processing apparatus. Even if the order of process jobs is changed according to Patent Document 1, the order of process jobs will not be changed beyond the scope of the control job. This ensures that the processing lots are processed sequentially, and the time from the start of processing to the end of processing for one processing lot does not exceed a certain limit.

However, such limitations may hinder productivity improvements. For example, assume that the first control job includes a first process job in the first category and a second process job in the second category, and the second control job includes a third process job in the first category. . If it is possible to change the order of process jobs only within the scope of the control job, processing is executed in the order of the first process job, the second process job, and the third process job. Then, a preparation process for changing from the first category to the second category is performed between the first and second process jobs, and a preparation process for changing from the second category to the first category is performed between the second and third process jobs. A preparatory process for the change is carried out. Therefore, the process of changing from the first category to the second category and returning to the first category is performed, which requires two preparation steps. As described above, since the number of preparation steps increases, improvement in production efficiency of the substrate processing apparatus is hindered.

Therefore, one object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can contribute to improving the production efficiency of the substrate processing apparatus.

The present invention provides a substrate processing method in which a substrate is processed by a substrate processing apparatus equipped with a processing unit that performs processing on the substrate. This method includes a step in which the substrate processing apparatus receives first control job information that defines a first control job that is a process for a first lot; and after the substrate processing apparatus receives the first control job information. , receiving second control job information that defines a second control job that is a process for the second lot. The first control job information includes first process job information that defines a first process job that is processing of one or more substrates included in the first lot according to a first recipe, and first process job information that is included in the first lot. and second process job information that defines a second process job that is a process for one or more substrates to be processed according to a second recipe. The second control job information includes third process job information that defines a third process job that is processing according to a third recipe for one or more substrates included in the second lot. In the substrate processing method, when the first recipe and the third recipe include a common attribute and the second recipe does not include the attribute, the first process job and the second process job a scheduling step of formulating an execution plan for the first, second, and third process jobs in the order in which the third process job is to be executed; and a processing execution step of processing the substrate by the processing unit according to the formulated execution plan. and further includes.

A lot is a unit of processing that is composed of one or more substrates and for which a processing instruction or reservation is given to a substrate processing apparatus. When a substrate to be processed is introduced into a substrate processing apparatus using a substrate container that can accommodate a predetermined number of substrates, one or more substrates accommodated in the substrate container are It may constitute one lot.
A control job is a process that a substrate processing apparatus should perform on a lot. Control job information is information that defines the contents of a control job. Therefore, it can be said that the control job information defines a lot and also defines the processing contents for the lot. One control job includes one or more process jobs. Accordingly, the control job information includes one or more process job information.

A process job is processing for one or more substrates according to a common recipe. Process job information is information that defines the contents of a process job. The process job information includes information specifying a recipe. A recipe is information that defines processing conditions for a substrate. The processing conditions may include conditions regarding the fluid (liquid or gas) supplied to the substrate. The conditions regarding the fluid may include the type of fluid, the temperature of the fluid, the supply flow rate, the supply time, and the like.

The recipe attribute can also be referred to as a recipe category. For example, recipe attributes may be classified based on whether processing can be executed continuously. More specifically, the attributes of a recipe that are of interest when formulating an execution plan for a process job may be the type of fluid (for example, the type of chemical) or the temperature of the fluid supplied to the substrate.
The substrate processing apparatus may include multiple processing units. In this case, the recipe may include processing unit designation information that designates one or more processing units to perform processing.

The substrate processing apparatus may include a substrate transport means for transporting the substrate from a substrate standby location to the processing unit. In this case, it is preferable that the process job execution plan includes a plan for transporting the substrate. Accordingly, in the processing execution step, the substrate is transported and the substrate is processed in the processing unit.
In this invention, a process job included in the second control job may be executed before all process jobs included in the first control job are completed. More specifically, when a second control job includes a process job for which a recipe with a common attribute is specified as a process job included in the first control job, the process job is The order can be swapped. That is, the first control job includes a first process job and a second process job to which recipes with different attributes are specified, and the second control job includes a third process job to which a recipe having common attributes with the recipe of the first process job is specified. Consider a case where you have a process job. In this case, a plan is created to execute the process jobs in the order of the first process job, the third process job, and the second process job. That is, the process job of the second control job interrupts the process job before the first control job is completed. As a result, the order of process jobs is changed beyond the control job, and process jobs for which recipes with common attributes are specified can be executed all at once (successively). This makes it possible to reduce the number of times recipe attributes are switched, thereby realizing substrate processing with high production efficiency.

In one embodiment of the invention, the attribute is an attribute that requires a preparatory step before starting processing in the processing unit, and the scheduling step is included in the second recipe after the third process job. Develop a plan to perform the preparation steps corresponding to the attributes.
In this method, recipes are classified by focusing on attributes that require a preparation step, and process jobs that specify recipes with common attributes can be executed collectively (successively). As a result, the number of preparation steps required when switching recipes can be reduced, and substrate processing with high production efficiency can be realized.

In one embodiment of the present invention, the scheduling step, when a predetermined interrupt execution condition is satisfied, changes the plan of an unexecuted process job to execute a process job that is selected based on the interrupt execution condition. includes an interrupt scheduling step for planning the execution of interrupts.
"Planning interrupt execution" refers to changing the plan so that the execution order of a certain process job is moved up and interrupted.

For example, the interrupt execution condition may be a condition that should take priority over executing all process jobs that specify recipes with common attributes. By setting such interrupt execution conditions, if any inconvenience occurs due to the replacement of process jobs beyond the control job, such inconvenience can be avoided or eliminated. Thereby, it is possible to improve production efficiency while ensuring appropriate substrate processing.

In one embodiment of the present invention, the substrate processing method further includes a step of measuring a control job life representing progress from the start of execution of the first control job, and the scheduling step is performed so that the control job life is a predetermined time. The method includes an interrupt scheduling step of scheduling interrupt execution of an unprocessed process job included in the first control job when an interrupt execution condition including reaching a threshold is satisfied.

In this method, when the control job life representing the progress from the start of execution of a control job reaches a predetermined threshold, the execution order of unprocessed (unstarted) process jobs included in the control job is moved up. For example, the execution order is changed to run after the previously started process job (or the earliest possible order). This makes it possible to impose a substantial time limit from the start to the end of execution of one control job. Therefore, production efficiency can be improved by replacing process jobs beyond the control job, and at the same time, processing of one control job can be completed within a reasonable time.

In one embodiment of the present invention, the substrate processing method further includes a step of obtaining an attribute life representing a continuation status of processing using a common attribute common to the first recipe and the third recipe, and the scheduling step , when an interrupt execution condition including that the attribute life reaches a predetermined threshold is satisfied, the process using the common attribute is interrupted and interrupt execution of a process job of a recipe having a different attribute is planned. including an interrupt scheduling process.

It may be preferable to set a limit on the continuation of processing according to a recipe for one attribute. For example, if processing using a common chemical solution is continued for a long time, the performance (quality) of the chemical solution may deteriorate, thereby deteriorating the quality of substrate processing. In such a case, the quality of substrate processing can be maintained by switching attributes rather than continuing processing using a recipe with common attributes.

Therefore, by setting the interrupt execution condition to be that the attribute life representing the continuation status of processing by one attribute reaches a threshold value, and planning the interrupt execution of a process job that specifies a recipe with another attribute, high quality and It is possible to realize substrate processing that is both highly efficient.
The continuation status of processing may be the duration of processing for one attribute, the number of times the processing is repeated, or the like. The number of repetitions of processing may be the number of substrates that have been continuously processed with one attribute, the number of process jobs, or the number of control jobs.

In one embodiment of the present invention, the scheduling step plans the execution of a process job that has attributes common to a recipe of the process job, following the process job whose execution is scheduled by the interrupt scheduling step. .
In this method, following a process job planned by interrupt scheduling, execution of a process job that specifies the recipe of the process job and the recipe of the common attribute is planned. Thereby, switching of attributes can be suppressed while allowing interrupt execution of process jobs. Therefore, it is possible to improve processing efficiency while ensuring appropriate substrate processing through interrupt scheduling.

An embodiment of the present invention further includes a step of receiving an input of an interrupt execution condition from a user to the substrate processing apparatus, and the accepted interrupt execution condition is applied in the interrupt scheduling step. With this method, the user can specify the interrupt execution conditions, so processing efficiency can be improved while responding to the user's requests.
In one embodiment of the present invention, the substrate processing apparatus includes a processing liquid supply unit that supplies a processing liquid to the processing unit, and the attribute includes conditions regarding the processing liquid supplied from the processing liquid supply unit, The first recipe and the third recipe commonly specify a first treatment liquid condition, and the second recipe specifies a second treatment liquid condition different from the first treatment liquid condition.

With this method, process jobs with common processing liquid conditions can be executed together (successively), so the number of times the processing liquid conditions are changed can be reduced. This allows efficient substrate processing. Particularly, when a preparation step is required in response to a change in processing liquid conditions, the number of preparation steps can be reduced, so that processing efficiency can be improved.
The treatment liquid conditions may include one or both of the type of treatment liquid and the temperature of the treatment liquid.

The present invention also provides a substrate processing method in which a substrate is processed by a substrate processing apparatus equipped with a processing unit that performs processing on the substrate, wherein the substrate processing apparatus processes one or more substrates included in a first lot. a first processing step in which a substrate is processed; and the substrate processing apparatus, after the first processing step, performs processing on one or more substrates included in a second lot different from the first lot. a second processing step in which the substrate processing apparatus performs processing on one or more substrates included in the first lot after the second processing step; and a third processing step in which the substrate processing apparatus performs processing on one or more substrates included in the first lot A method for processing a substrate is provided.

In one embodiment of the present invention, the first lot includes one or more substrates to be processed by a first recipe, and one or more substrates to be processed by a second recipe having attributes different from the first recipe. the second lot includes one or more substrates to be processed according to a third recipe having attributes in common with the first recipe, and the first processing step includes the first The second processing step includes processing according to the third recipe, and the third processing step includes processing according to the second recipe.

In one embodiment of the present invention, the attribute is an attribute that requires a preparation process before starting processing in the processing unit, and the substrate processing apparatus is configured to perform the second processing step and the third processing step. Perform preparatory steps for switching attributes during the process.
In one embodiment of the present invention, when the continuation status of a recipe with a common attribute reaches a predetermined threshold, the substrate processing apparatus executes processing on a substrate to be processed using a recipe with a different attribute.

In one embodiment of the present invention, when the elapsed time since the substrate processing apparatus started processing the first lot reaches a predetermined threshold, the substrate processing apparatus removes the unprocessed substrates of the first lot. Process with priority.
In one embodiment of the present invention, the elapsed time since the substrate processing apparatus started processing the first lot, or the number of substrates or lots that have been processed since the substrate processing apparatus started processing the first lot is a predetermined number. When the threshold value is reached, the substrate processing apparatus interrupts the processing of the second lot and preferentially processes the unprocessed substrates of the first lot.
The present invention also provides a program executed by a computer installed in a substrate processing apparatus, in which a group of steps are incorporated to execute a substrate processing method having the above-mentioned characteristics. Provide computer programs. By executing this computer program by a computer installed in a substrate processing apparatus, it is possible to realize a substrate processing method with high processing efficiency as described above.

The present invention also provides a substrate processing apparatus that includes a processing unit that executes processing on a substrate, and control job information receiving means that receives input of control job information that defines a control job that is processing on a lot. The control job information includes process job information that defines a process job that is a process for one or more substrates included in the lot. The substrate processing apparatus further includes a scheduling means for formulating a processing plan for the substrate based on the process job information, and a processing execution control means for causing the processing unit to perform substrate processing according to the processing plan formulated by the scheduling means. including. The control job information receiving means receives first control job information that defines a first control job that is a process for a first lot, and after receiving the first control job information, specifies a second control job that is a process for a second lot. Second control job information defining a control job is received. The first control job information includes first process job information that defines a first process job that is processing of one or more substrates included in the first lot according to a first recipe, and first process job information that is included in the first lot. and second process job information that defines a second process job that is a process for one or more substrates to be processed according to a second recipe. The second control job information includes third process job information that defines a third process job that is processing according to a third recipe for one or more substrates included in the second lot. The scheduling means may be arranged between the first process job and the second process job when the first recipe and the third recipe include a common attribute and the second recipe does not include the attribute. An execution plan for the first, second, and third process jobs is formulated in the order in which the third process jobs are to be executed.

In one embodiment of the present invention, the attribute is an attribute that requires a preparatory step before starting processing in the processing unit, and the scheduling means is included in the second recipe after the third process job. Develop a plan to perform the preparation steps corresponding to the attributes.
In one embodiment of the present invention, when a predetermined interrupt execution condition is satisfied, the scheduling means changes the plan of an unexecuted process job to execute a process job that is selected based on the interrupt execution condition. Execute interrupt scheduling to plan interrupt execution.

In one embodiment of the present invention, the substrate processing apparatus further includes means for measuring a control job life representing a progress from the start of execution of the first control job, and the scheduling means is arranged such that the control job life is a predetermined period. When an interrupt execution condition including reaching a threshold value is satisfied, interrupt scheduling is executed to plan interrupt execution of an unprocessed process job included in the first control job.

In one embodiment of the present invention, the substrate processing apparatus further includes means for obtaining an attribute life representing a continuation status of processing using a common attribute common to the first recipe and the third recipe, and the scheduling means , when an interrupt execution condition including that the attribute life reaches a predetermined threshold is satisfied, the process using the common attribute is interrupted and interrupt execution of a process job of a recipe having a different attribute is planned. Executes interrupt scheduling.

In one embodiment of the present invention, the scheduling means plans execution of a process job that has attributes common to a recipe of the process job, following the process job whose execution is scheduled by the interrupt scheduling.
In one embodiment of the present invention, the substrate processing apparatus further includes means for receiving an input of an interrupt execution condition from a user, and the scheduling means inputs the accepted interrupt execution condition in the interrupt scheduling. Apply.

In one embodiment of the present invention, the substrate processing apparatus further includes a processing liquid supply unit that supplies a processing liquid to the processing unit, and the attribute includes conditions regarding the processing liquid supplied from the processing liquid supply unit. , the first recipe and the third recipe specify a first treatment liquid condition in common, and the second recipe specifies a second treatment liquid condition different from the first treatment liquid condition.

The present invention also provides a substrate comprising: a processing unit that performs processing on a substrate; a substrate transport means that transports the substrate to the processing unit; and a control unit that controls the processing unit and the substrate transport means. Provide processing equipment. The control unit includes a first processing step in which one or more substrates included in a first lot are transported to the processing unit by the substrate transport means and processed, and a first processing step after the first processing step. a second processing step in which one or more substrates included in a second lot different from the lot are transported to the processing unit by the substrate transport means and processed; and after the second processing step, the first lot is a third processing step of transporting one or more substrates included in the processing unit to the processing unit by the substrate transport means and processing them.

In one embodiment of the present invention, the first lot includes one or more substrates to be processed by a first recipe, and one or more substrates to be processed by a second recipe having attributes different from the first recipe. the second lot includes one or more substrates to be processed according to a third recipe having attributes in common with the first recipe, and the first processing step includes the first The second processing step includes processing according to the third recipe, and the third processing step includes processing according to the second recipe.

In one embodiment of the present invention, the attribute is an attribute that requires a preparatory step before the start of processing in the processing unit, and the control unit is configured to control the process between the second processing step and the third processing step. Execute the preparation process for switching the attributes to .
In one embodiment of the present invention, when the continuation status of a recipe with a common attribute reaches a predetermined threshold, the control unit transports a substrate to be processed according to a recipe with a different attribute to the processing unit by the substrate transport means. Let it be processed.

In one embodiment of the present invention, when the elapsed time since the start of processing for the first lot reaches a predetermined threshold, the control unit may preferentially transport the unprocessed substrates of the first lot. It is conveyed to the processing unit by means for processing.
In one embodiment of the present invention, when the elapsed time since the start of processing for the first lot, or the number of substrates or lots that have been processed since the start of processing for the first lot, reaches a predetermined threshold. , the control unit interrupts the processing of the second lot, and preferentially transports the unprocessed substrates of the first lot to the processing unit by the substrate transport means for processing.

FIG. 1 is a schematic plan view showing the layout of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic side view of the substrate processing apparatus. FIG. 3 is a block diagram for explaining the electrical configuration of the substrate processing apparatus. FIG. 4 is a flowchart for explaining an example of processing by a scheduling function section provided in the substrate processing apparatus. FIG. 5 is a flowchart for explaining details of overall scheduling. FIG. 6 is a flowchart for explaining an example of processing for generating an interrupt. FIG. 7 is a flowchart for explaining another example of processing for generating an interrupt. FIG. 8 shows an example of a temporary timetable corresponding to a route passing through one processing unit. FIG. 9 is a diagram for explaining an example of control job data input from the host computer to the substrate processing apparatus. 10A and 10B show an example of a temporary timetable created corresponding to the control job data of FIG. 9. FIG. 11 shows an example in which all blocks constituting a temporary timetable corresponding to one board of the first process job PJ11 of the first received control job CJ1 are arranged. FIG. 12 shows a state in which the second process job PJ12 of the control job CJ1 is put on hold and the third process job PJ13 is planned. FIG. 13 shows a scheduling example (first comparative example) in which process jobs are replaced within the framework of a control job. FIG. 14 shows a scheduling example (second comparative example) according to the order of control jobs and the order of process jobs. FIG. 15 shows a scheduling example (embodiment) in which process jobs are replaced beyond the control job. 16A to 16D show examples (embodiments) in which interrupt scheduling is applied, FIG. 16A shows a scheduling example immediately after receiving control job CJ1, and FIG. 16B shows scheduling immediately after receiving control job CJ2. For example, FIG. 16C shows an example of interrupt scheduling immediately after the life of control job CJ1 reaches a threshold, and FIG. 16D shows an example of scheduling immediately after receiving control job CJ3.

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
FIG. 1 is a schematic plan view showing the layout of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic side view thereof. This substrate processing apparatus includes an indexer section 1, a processing section 2, and a chemical solution cabinet CC1. The processing section 2 includes a transfer unit PASS for transferring the substrate W to and from the indexer section 1. The indexer section 1 passes unprocessed substrates W to the transfer unit PASS, and receives processed substrates W from the transfer unit PASS. The processing section 2 receives the unprocessed substrate W from the delivery unit PASS, and processes the substrate W using a processing agent (processing liquid or processing gas), processing using electromagnetic waves such as ultraviolet rays, and physical cleaning. Perform various treatments such as cleaning (brush cleaning, spray nozzle cleaning, etc.). Then, the processing section 2 transfers the processed substrate W to the transfer unit PASS.

Indexer section 1 includes a plurality of stages ST1 to ST4 and an indexer robot IR.
Stages ST1 to ST4 are substrate container holders capable of holding substrate containers C each containing a plurality of substrates W (for example, semiconductor wafers) in a stacked state, and provide a substrate waiting area. The substrate storage container C may be a FOUP (Front Opening Unified Pod) that stores the substrate W in a sealed state, a SMIF (Standard Mechanical Interface) pod, an OC (Open Cassette), or the like. For example, when the substrate container C is placed on the stages ST1 to ST4, a plurality of substrates W in a horizontal position are stacked in the vertical direction with an interval between them.

The indexer robot IR includes, for example, a base 6, a multi-joint arm 7, and a pair of hands 8A, 8B. The base portion 6 is fixed to, for example, a frame of the substrate processing apparatus. The multi-joint arm 7 is constructed by rotatably connecting a plurality of arm parts that can rotate along a horizontal plane, and the angle between the arm parts can be changed at the joint part where the arm parts are joined. It is configured to bend and stretch by doing this. A base end portion of the multi-joint arm 7 is coupled to the base portion 6 so as to be rotatable about a vertical axis. Further, the multi-joint arm 7 is coupled to the base portion 6 so as to be movable up and down. In other words, the base portion 6 has built-in a lifting drive mechanism for raising and lowering the multi-joint arm 7 and a rotation drive mechanism for rotating the multi-joint arm 7 around the vertical axis. Further, the multi-joint arm 7 is equipped with an individual rotation drive mechanism for independently rotating each arm portion. Hands 8A and 8B are coupled to the distal end of the multi-joint arm 7 so as to be able to individually rotate around the vertical axis and move forward and backward in the horizontal direction. The multi-joint arm 7 includes a hand rotation drive mechanism for individually rotating the hands 8A and 8B around a vertical axis, and a hand advancement/retraction mechanism for individually advancing and retracting the hands 8A and 8B in the horizontal direction. It is being The hands 8A and 8B are configured to be able to each hold one substrate W, for example. Note that the hands 8A and 8B may be arranged in a vertically overlapping state, but in FIG. 1, the hands 8A and 8B are drawn shifted in a direction parallel to the page (horizontal direction) for clarity. be.

With this configuration, the indexer robot IR operates to carry out one unprocessed substrate W from the substrate container C held on any of the stages ST1 to ST4 using the hand 8A and transfer it to the transfer unit PASS. Furthermore, the indexer robot IR operates to receive one processed substrate W from the transfer unit PASS with the hand 8B and to store it in the substrate storage container C held on any of the stages ST1 to ST4.

The processing section 2 includes a plurality of (12 in this embodiment) processing units MPC1 to MPC12, a main transfer robot CR, and the aforementioned delivery unit PASS.
In this embodiment, the processing units MPC1 to MPC12 are arranged three-dimensionally. More specifically, a plurality of processing units MPC1 to MPC12 are arranged to form a three-layer structure, with four processing units arranged in each layer. That is, four processing units MPC1, MPC4, MPC7, and MPC10 are arranged in the first layer part, another four processing units MPC2, MPC5, MPC8, and MPC11 are arranged in the second layer part, and further in the third layer part. Other processing units MPC3, MPC6, MPC9, MPC12 are arranged.

More specifically, the main transport robot CR is arranged at the center of the processing section 2 in a plan view, and the delivery unit PASS is arranged between the main transport robot CR and the indexer robot IR. A first processing unit group G1, in which three processing units MPC1 to MPC3 are stacked, and a second processing unit group G2, in which another three processing units MPC4 to MPC6 are stacked, are arranged so as to face each other with the delivery unit PASS in between. has been done. A third processing unit group G3 in which three processing units MPC7 to MPC9 are stacked is arranged adjacent to the first processing unit group G1 on the side far from the indexer robot IR. Similarly, a fourth processing unit group G4 in which three processing units MPC10 to MPC12 are stacked is arranged adjacent to the second processing unit group G2 on the side far from the indexer robot IR. The main transport robot CR is surrounded by the first to fourth processing unit groups G1 to G4.

The main transport robot CR includes, for example, a base portion 11, a multi-joint arm 12, and a pair of hands 13A, 13B. The base portion 11 is fixed to, for example, a frame of the substrate processing apparatus. The multi-joint arm 12 is configured by connecting a plurality of arm parts extending along a horizontal plane so as to be rotatable with each other, and the angle between the arm parts can be changed at the joint part where the arm parts are joined. It is configured to bend and stretch. A proximal end portion of the multi-joint arm 12 is coupled to the base portion 11 so as to be rotatable about a vertical axis. Further, the multi-joint arm 12 is coupled to the base portion 11 so as to be movable up and down. In other words, the base portion 11 has built-in a lifting drive mechanism for raising and lowering the multi-joint arm 12 and a rotation drive mechanism for rotating the multi-joint arm 12 around the vertical axis. Further, the multi-joint arm 12 is equipped with an individual rotation drive mechanism for independently rotating each arm portion. Hands 13A and 13B are coupled to the distal end of the multi-joint arm 12 so as to be able to independently rotate around a vertical axis and move forward and backward in the horizontal direction. The multi-joint arm 12 includes a hand rotation drive mechanism for individually rotating the hands 13A, 13B around a vertical axis, and a hand advancement/retraction mechanism for individually advancing and retracting the hands 13A, 13B in the horizontal direction. It is being Hands 13A and 13B are configured to be able to each hold one substrate W, for example. Note that the hands 13A and 13B may be arranged in a vertically overlapping state, but in FIG. 1, the hands 13A and 13B are drawn shifted in a direction parallel to the page (horizontal direction) for clarity. be.

With this configuration, the main transport robot CR receives one unprocessed substrate W from the transfer unit PASS with the hand 13A, and carries the unprocessed substrate W into one of the processing units MPC1 to MPC12. Further, the main transfer robot CR receives the processed substrate W processed by the processing units MPC1 to MPC12 with the hand 13B, and transfers the substrate W to the transfer unit PASS.

The processing units MPC1 to MPC12 are single-wafer type processing units that process the substrates W one by one. The processing units MPC1 to MPC12 each include, for example, a spin chuck 15 that holds and rotates one substrate W in a horizontal position, and a processing liquid nozzle 16 that supplies a processing liquid (chemical liquid or rinsing liquid) to the spin chuck 15. It may be a rotary liquid processing unit that is provided in the processing chamber 17 (chamber). In FIG. 2, only the internal configuration of the processing unit MPC3 is shown, and illustrations of the internal configurations of other processing units are omitted.

The chemical liquid cabinet CC1 is an example of a processing liquid supply unit that supplies a chemical liquid as a processing liquid to the processing units MPC1 to MPC12. In this embodiment, the chemical liquid cabinet CC1 is configured to commonly supply chemical liquid to all the processing units MPC1 to MPC12. However, a configuration may also be adopted in which a plurality of chemical liquid cabinets are provided and each chemical liquid cabinet supplies chemical liquid to one or more processing units. The chemical liquid cabinet CC1 includes a tank 3 for storing a chemical liquid, a temperature adjustment unit 4 for adjusting the temperature of the chemical liquid in the tank 3, and a pump 5 for delivering the chemical liquid in the tank 3 to the processing units MPC1 to MPC12.

FIG. 3 is a block diagram for explaining the electrical configuration of the substrate processing apparatus. The substrate processing apparatus includes a computer 20 as a control unit. The computer 20 controls the processing units MPC1 to MPC12, the chemical solution cabinet CC1, the main transport robot CR, and the indexer robot. The computer 20 may have the form of a personal computer (FA personal computer). The computer 20 includes a control section 21, an input/output section 22, and a storage section 23. The control unit 21 includes an arithmetic unit such as a CPU. The input/output unit 22 includes an output device such as a display unit, and an input device such as a keyboard, pointing device, and touch panel. Further, the input/output unit 22 includes a communication module for communicating with a host computer 24, which is an external computer. The storage unit 23 includes storage devices such as solid-state memory devices and hard disk drives.

The control section 21 includes a scheduling function section 25 (scheduling means) and a process execution instruction section 26 (process execution control means). The scheduling function unit 25 uses resources of the substrate processing apparatus in order to unload the substrate W from the substrate container C, process it in one or more of the processing units MPC1 to MPC12, and then store it in the substrate container C. Create a plan (schedule) for operating according to the series. The processing execution instruction unit 26 operates the resources of the substrate processing apparatus according to the schedule created by the scheduling function unit 25. Resources are various units provided in the substrate processing apparatus and used for processing the substrate W, and specifically include processing units MPC1 to MPC12, indexer robot IR, main transfer robot CR, chemical solution cabinet CC1, and including those components. The indexer robot IR and the main transfer robot CR are examples of substrate transfer means.

The storage unit 23 stores various data including a program 30 executed by the control unit 21, control job data (control job information) 40 received from the host computer 24, and schedule data 50 created by the scheduling function unit 25. configured to remember. The control job data 40 includes process job data (process job information) 41.

The program 30 stored in the storage unit 23 includes a schedule creation program 31 for operating the control unit 21 as the scheduling function unit 25 and a process execution program 32 for operating the control unit 21 as the process execution instruction unit 26. including.
The control job data 40 includes a control job (CJ) code given to a processing lot defined by one or more substrates housed in one substrate container C, and one or more process job data 41 including. The process job data 41 includes a process job (PJ) code given to each substrate W and a recipe associated with the process job code.

The recipe is data that defines the content of substrate processing, and includes substrate processing conditions and substrate processing procedures. More specifically, it includes substrate type information, parallel processing unit information, used processing liquid information, processing time information, etc. The substrate type information is information representing the type of substrate to be processed. Specific examples of types of substrates include product substrates used for manufacturing products, non-product substrates used for maintenance of processing units, etc., and not used for manufacturing products. Parallel processing unit information is processing unit designation information that designates usable processing units, and indicates that parallel processing by the designated processing units is possible. In other words, when one of the designated processing units cannot be used, it can be replaced by another designated processing unit. "When it cannot be used" means when the processing unit is in use for processing another substrate W, when the processing unit is out of order, or when the operator wants the processing unit to process the substrate W. When you think that there is no such thing, etc. The processing liquid information used is information specifying the type of processing liquid used for substrate processing. A specific example is information specifying the type of chemical liquid and the temperature of the chemical liquid. The processing time information includes, for example, the duration of supplying the processing liquid. Processing liquid information and processing time information are examples of processing condition information.

A process job (PJ) refers to a process performed on one or more substrates W to which a common process is to be performed. The process job code is identification information (substrate group identification information) for identifying a process job. That is, a plurality of substrates W given a common process job code are subjected to a common process according to a recipe associated with the process job code. However, there may be cases where the substrate processing contents (recipes) corresponding to different process job codes are the same. For example, when a common process is performed on a plurality of substrates W whose processing order (order of discharging from the substrate container C) is consecutive, a common process job is applied to the plurality of substrates W. A sign is assigned.

A control job (CJ) is processing for one processing lot. One control job includes one or more process jobs.
The control unit 21 acquires control job data corresponding to each substrate container C (lot) from the host computer 24 via the input/output unit 22 and stores it in the storage unit 23 . Thereby, the control unit 21 acquires the process job data included in the control job data and stores it in the storage unit 23. Acquisition and storage of process job data may be performed before scheduling for each substrate W is performed. For example, control job data corresponding to the substrate holder C may be provided from the host computer 24 to the control unit 21 immediately after the substrate holder C is held on the stages ST1 to ST4. The scheduling function unit 25 plans each process job based on the process job data included in the control job data 40 stored in the storage unit 23, and stores schedule data 50 representing the plan in the storage unit 23. The processing execution instruction section 26 controls the indexer robot IR, the main transfer robot CR, the processing units MPC1 to MPC12, and the chemical solution cabinet CC1 based on the schedule data 50 stored in the storage section 23, thereby instructing the substrate processing apparatus. Run the process job.

4 to 7 are flowcharts for explaining processing examples by the scheduling function unit 25. More specifically, the process is shown to be repeated at a predetermined control cycle when the control unit 21 (computer 20) executes the schedule creation program 31. In other words, the schedule creation program 31 includes a group of steps that cause the computer to execute the processes shown in FIGS. 4 to 7.

The host computer 24 provides control job data to the control unit 21 and instructs the control unit 21 to start a process job defined by process job data (PJ) included in the control job data (CJ). The control section 21 receives the control job data (step S1; control job information receiving means), and stores the process job data included therein in the storage section 23 (step S2). Using the process job data, the scheduling function unit 25 performs scheduling for executing the process job.

The scheduling function unit 25 first creates a temporary timetable for processing each substrate to be processed by the process job (step S3). For example, assume that a recipe associated with a certain process job code in the process job data specifies parallel processing of the processing units MPC1 to MPC12. That is, consider a case where substrate processing according to the recipe can be executed in any of the 12 processing units MPC1 to MPC12. In this case, there are 12 routes that the substrate W given the process job code takes when undergoing processing. That is, the routes that can be selected for processing the substrate W are 12 routes that pass through any of the processing units MPC1 to MPC12. Therefore, the scheduling function section 25 creates a temporary timetable corresponding to the 12 routes for each board.

FIG. 8 shows a temporary timetable corresponding to the route passing through the processing unit MPC1. This temporary timetable includes a block representing the unloading (Get) of the substrate W from the substrate container C by the indexer robot IR, a block representing the loading (Put) of the substrate W into the delivery unit PASS by the indexer robot IR, A block representing unloading (Get) of the substrate W from the delivery unit PASS by the main transport robot CR, a block representing loading (Put) of the relevant substrate W to the processing unit MPC1 by the main transport robot CR, and a block representing the transport (Put) of the relevant substrate W from the transfer unit PASS by the main transport robot CR. A processing block representing processing for the substrate W, a block representing unloading (Get) of the processed substrate W from the processing unit MPC1 by the main transfer robot CR, and a block representing the transfer (Get) of the processed substrate W from the processing unit MPC1 by the main transfer robot CR to the transfer unit PASS. A block representing loading (Put), a block representing loading (Get) of the substrate W from the transfer unit PASS by the indexer robot IR, and a block representing loading (Put) of the substrate W into the substrate container C by the indexer robot IR. and a block representing the block. The scheduling function unit 25 creates a temporary timetable by arranging these blocks in order so that they do not overlap on the time axis. Furthermore, the temporary timetable in FIG. 8 includes a chemical solution supply block that represents the supply of a chemical solution from the chemical solution cabinet CC1 during the period in which the processing blocks are arranged.

The scheduling function unit 25 creates similar temporary timetables (temporary timetables in which processing blocks are arranged in processing units MPC2 to MPC12, respectively) corresponding to routes passing through processing units MPC2 to MPC12, respectively, for the same substrate W. . In this way, temporary timetables for a total of 12 routes are created for one board W.
On the other hand, as shown in FIG. 4, the scheduling function unit 25 determines the attributes of the process job based on the process job data, and stores attribute data representing the attributes in the storage unit 23 (step S4). An attribute is a type of processing. More specifically, the type of substrate to be processed is one example of the attribute. Other examples of attributes are substrate processing conditions. More specifically, examples of substrate processing conditions include the type of processing liquid (especially chemical liquid) specified in the recipe in the process job data, the temperature of the processing liquid, and the like. In the example of the temporary timetable shown in FIG. 8, a case is shown in which the recipe specifies the supply of a chemical solution whose temperature is adjusted to 60° C. from the chemical solution cabinet CC1. Therefore, in this example, attribute data representing supply of chemical liquid at 60° C. is stored in the storage unit 23.

If the chemical liquid cabinet CC1 is configured such that it is not possible to supply chemical liquids at two or more different temperatures at the same time, it is possible to plan the supply of chemical liquids at only one type of temperature at the same time. In order to supply chemicals at different temperatures, adjustments are required to change the temperature of the chemicals in the tank 3 (see FIG. 2). Therefore, chemical liquid supplies at different temperatures need to be scheduled at different times. More specifically, it is necessary to plan for different periods with sufficient time required for the preparation process for changing the temperature of the chemical solution. Therefore, during a period in which the use of a chemical liquid at a certain temperature is planned, planning of process jobs that use chemical liquids at other temperatures is prohibited. In this embodiment, the chemical liquid is supplied from one chemical liquid cabinet CC1 to all the processing units MPC1 to MPC12, and the chemical liquid cabinet CC1 is configured to supply chemical liquid at only one type of temperature at the same time. is possible. Therefore, when the use of a chemical solution at a certain temperature is planned for any processing unit, plans for the use of a chemical solution at other temperatures are prohibited in any processing unit.

The chemical solution cabinet CC1 may be configured to be able to simultaneously supply chemical solutions to a plurality of predetermined processing units. In this case, it is permissible to plan to use the same type of chemical solution at the same temperature in different processing units during overlapping periods.
The created temporary timetable is stored in the storage unit 23 as part of the schedule data 50 (step S5 in FIG. 4). A similar temporary timetable is created corresponding to all the substrates W assigned the same process job code. At the stage of creating the temporary timetable, interference with blocks related to another substrate W (overlap on the time axis) is not taken into account.

After completing the creation of temporary timetables for all received process jobs (step S6: YES), the scheduling function unit 25 executes overall scheduling (step S7). Overall scheduling means arranging the blocks of the created temporary timetable on the time axis so as not to overlap with other blocks of each resource. The schedule data created by the overall scheduling is stored in the storage unit 23 (step S8).

When new control job data is received (step S1: YES), there may be a case where there is a process job that has already been scheduled and has not yet been executed. In such a case, in the overall scheduling (step S7), scheduling is again performed for all unexecuted process jobs, including those unexecuted process jobs.

If new control job data is not received (step S1: NO), the scheduling function unit 25 determines whether an interruption for rescheduling has occurred (step S9). If no interrupt occurs (step S9: NO), the processing for the current control cycle ends. When an interrupt occurs (step S9: YES), scheduling for all unexecuted process jobs is executed again (step S7: interrupt scheduling step). An interrupt for rescheduling is generated when necessary by an interrupt determination process that will be described later with reference to FIGS. 6 and 7. The interrupt determination process generates an interrupt when an interrupt execution condition for changing the execution order of unexecuted process jobs from the planned order is satisfied.

FIG. 5 is a flowchart for explaining details of the overall scheduling (step S7 in FIG. 4). The scheduling function unit 25 reads the temporary timetable of the substrate W from the storage unit 23 and arranges the blocks forming the temporary timetable on the time axis.
More specifically, the scheduling function unit 25 determines whether an interrupt has occurred (step S21), and if no interrupt has occurred, determines whether there is an unplanned process job (step S22). ). "Unplanned process jobs" include not only process jobs that have never been planned, but also process jobs that are not planned for rescheduling when an interruption for rescheduling occurs. In other words, it is an unplanned process job among the process jobs to be scheduled.

If all the process jobs have been planned (step S22: NO), the processing for the current control cycle ends. If there is an unplanned process job (step S22: YES), the scheduling function unit 25 reads the temporary timetable corresponding to one substrate W of the unplanned process job with the earliest reception time (step S23). The scheduling function unit 25 determines whether the attributes corresponding to the read provisional timetable are common to the attributes of the process job currently being processed (step S24). More specifically, the temperature of the chemical solution (attribute, an example of processing solution conditions) used in the process job currently being executed in the substrate processing apparatus is specified in the recipe of the process job corresponding to the temporary timetable. Determine whether the attribute is in common with the specified attribute. This determination can be made using attribute data stored in the storage unit 23 for each temporary timetable (or for each process job). If there is no process job currently being executed, the determination in step S24 will be negative.

If the attributes are the same as those of the process job currently being executed (step S24: YES), the scheduling function unit 25 arranges each block constituting the temporary timetable in the corresponding resource in a front-justified manner on the time axis. (Step S27). That is, each block is placed at the earliest position on the time axis while preventing the same resource from being used redundantly at the same time. A similar process is performed for the temporary timetables of all substrates of the same process job.

Similar processing is then repeated for the unplanned process job data stored in the storage unit 23 (step S22).
If the attributes of the process job for which the temporary timetable has been read are different from the attributes of the currently executing process job (step S24: NO), there is an unplanned process job that has the same attributes as the currently executing process job. It is determined whether or not (step S25). If the corresponding process job exists, the temporary timetable of the process job that is received first among the process jobs with the common attribute is read (step S26). Then, the process of step S27 is executed on this temporary timetable.

On the other hand, if there is no unplanned process job with the common attribute (step S25: NO), the scheduling function unit 25 determines whether a preparation process is necessary based on the attributes of the process job in the read provisional timetable. (Step S28). For example, when the temperature of the chemical liquid to be supplied from the chemical liquid cabinet CC1 is to be changed, a preparation step is required to adjust the temperature of the chemical liquid within the chemical liquid cabinet CC1. When such a preparation process is necessary (step S28: YES), the scheduling function unit 25 arranges a preparation process block representing the preparation process in the chemical solution cabinet CC1 (step S29), and then performs the preparation process block in step S27. Execute processing. At this time, the arrangement of the processing blocks on the time axis is adjusted so that the processing blocks are not arranged before the preparation step, that is, before the temperature adjustment of the chemical solution is completed, for example. If the preparation process is not necessary (step S28: NO), the arrangement of the preparation process block is omitted.

When an interruption occurs (step S21: YES), the scheduling function unit 25 reads from the storage unit 23 a temporary timetable of a process job to be processed preferentially by the interruption. The processes of steps S28, S29, and S27 are executed for the temporary timetable (interrupt scheduling).
When an interrupt occurs, all unexecuted process jobs are rescheduled. Therefore, after planning (step S27) for a process job to be processed with priority by an interrupt (a process job selected according to the established interrupt execution condition), other unexecuted process jobs are It is treated as a job (step S22: YES), and its scheduling is executed.

FIG. 6 is a flowchart for explaining an example of the interrupt determination process. When the control unit 21 instructs execution of the first process job included in the control job (step S41: YES), it starts measuring the life of the control job (control job life) (step S42). In this example, the control job life is a quantity representing the progress since the start of the control job. One specific example of the control job life is the elapsed time since the control job was started. Other examples of control job life are the number of process jobs that have started (or finished being processed) by the substrate processing equipment since starting the control job, and the number of process jobs that have started (or finished being processed) by the substrate processing equipment since starting the control job. ), the number of control jobs processed by the substrate processing apparatus after starting the control job (or completed), and the like.

The control job life is measured for each control job. That is, the control unit 21 measures the control job life of all the control jobs being executed. When a new control job is started, the control unit 21 starts measuring the control job life of the control job (step S42). Furthermore, when any control job ends, the control unit 21 ends the measurement of the control job life of that control job (steps S43, S44).

The scheduling function unit 25 refers to all the control job lives being measured and determines whether any control job life has reached a predetermined threshold (interrupt execution condition) (step S45). If the life of any control job has not reached the threshold (step S45: NO), the process ends without generating an interrupt. When the life of any control job reaches the threshold value, the scheduling function unit 25 generates an interrupt (step S46). More specifically, the scheduling function unit 25 generates an interrupt to cause an unexecuted process job among the control jobs whose control job life has reached a threshold value to be executed with priority over other process jobs.

The scheduling function unit 25 executes rescheduling to interrupt the created schedule with the process job in order to execute the process job preferentially (step S9 in FIG. 4: YES, FIG. Step S21: YES). In this rescheduling, the scheduling function unit 25 discards the existing scheduling and executes the scheduling again so that the process job to be interrupted is executed next to the process job that has already started execution.

With such interrupt rescheduling, it is possible to set a substantial time limit from the start to the end of processing of one control job. Thereby, it is possible to avoid waiting for a long time in the substrate container C after the first substrate of a certain control job is processed. For example, when the substrate container C is a container with an opening/closing lid (such as a FOUP), it is possible to prevent the opening/closing lid from remaining open for a long time. Thereby, adverse effects on the surface of the processed substrate, such as the growth of a natural oxide film and the effects of the surrounding atmosphere, can be suppressed. Furthermore, it is possible to avoid that the stage ST holding the substrate accommodating container C is occupied by one substrate accommodating container C for a long time, and the time until the next substrate accommodating container C can be loaded can be shortened.

FIG. 7 is a flowchart for explaining another example of the interrupt determination process. In this example, when a process job having a recipe specifying a new attribute is started to be executed (step S51: YES), the control unit 21 measures the life of the attribute (attribute life). In this example, the attribute life is a quantity representing the progress from the start of processing for a certain attribute (in other words, attribute switching). One specific example of the attribute life is the elapsed time from the start of processing using a new attribute. Other examples of attribute life are the number of process jobs that have started (or finished being processed) by a substrate processing device since starting processing with a new attribute, and the number of process jobs processed by a substrate processing device since starting processing with a new attribute. These include the number of substrates W that have started (or finished processing), the number of control jobs that have started processing (or finished processing) by the substrate processing apparatus after starting processing based on a new attribute, and so on.

When multiple attributes are defined, attribute life measurement is performed for each individual attribute. That is, the control unit 21 measures the attribute life of each attribute currently applied for substrate processing. When processing using a new attribute is started, the control unit 21 starts measuring the new attribute (step S52). Furthermore, when the application of any attribute is completed, the control unit 21 ends the measurement of the attribute life of that attribute (steps S53, S54).

The scheduling function unit 25 refers to all attribute lives being measured and determines whether any attribute life has reached a predetermined threshold (interrupt execution condition) (step S55). If none of the attribute lives has reached the threshold (step S55: NO), the process ends without generating an interrupt. When the life of any attribute reaches the threshold value, the scheduling function unit 25 generates an interrupt (step S56). More specifically, the scheduling function unit 25 generates an interrupt to preferentially execute an unexecuted process job for which an attribute different from the attribute whose attribute life has reached the threshold value is specified.

The scheduling function unit 25 executes rescheduling to interrupt the created schedule with the process job in order to execute the process job preferentially (step S9 in FIG. 4: YES, FIG. Step S21: YES). In this rescheduling, the scheduling function unit 25 discards the existing scheduling and executes the scheduling again so that the process job to be interrupted is executed next to the process job that has already started execution.

For example, when the type of chemical liquid is one of the attributes, if the same chemical liquid is used repeatedly, the quality of the chemical liquid may deteriorate and substrate processing may be affected. Therefore, the life of a certain type of chemical solution from the start of use (for example, the number of substrates processed) is measured, and when the life reaches a threshold, a process job that specifies a different type of chemical solution is executed with priority. Measures can be taken to replace the chemical solution whose life has reached the threshold.

Only one or both of the interrupt determination processes shown in FIGS. 6 and 7 may be performed. Furthermore, an interruption determination process that provides an opportunity for rescheduling may be performed from another perspective.
FIG. 9 shows an example of control job data input from the host computer 24 to the computer 20. In this example, it is assumed that control job data corresponding to three control jobs CJ1, CJ2, and CJ3 are given to the computer 20 in this order.

When the computer 20 receives control job data from the host computer 24, it manages the control jobs by assigning codes CJ1, CJ2, and CJ3 to the control jobs in the order in which they are received. In this example, control job CJ1 includes a plurality of process jobs PJ11, PJ12, PJ13, which are ordered in the control job data. That is, the data of control job CJ1 (control job data) includes process job data representing a plurality of process jobs PJ11 to PJ13. Furthermore, the control job CJ2 includes a plurality of process jobs PJ21, PJ22, and PJ23, which are ordered in the control job data. That is, the data of control job CJ2 (control job data) includes process job data representing a plurality of process jobs PJ21 to PJ23. The control job CJ3 includes a plurality of process jobs PJ31, PJ32, and PJ33, which are ordered in the control job data. That is, the data of control job CJ3 (control job data) includes process job data representing a plurality of process jobs PJ31 to PJ33. The computer 20 manages the process jobs included in the received control job by assigning codes PJ11, PJ12, PJ13; PJ21, PJ22, PJ23; PJ31, PJ32, PJ33 to avoid duplication.

Process job data representing each process job includes recipe data that defines a recipe representing substrate processing conditions. The recipe data includes instructions (processing liquid conditions) regarding usable processing units, specific processing procedures in the processing units, and processing liquids (especially chemical liquids) used in each processing procedure. In this embodiment, the instructions regarding the processing liquid include chemical liquid recipe data that specifies the type and/or temperature of the chemical liquid. Process job data may further include transport option data. The transport option data includes, for example, hand setting data for setting a robot hand to be used during substrate transport. The process job data may further include setting data for skipping pre- and post-processing. Skip pre-processing and post-processing refers to skipping pre-processing and post-processing when the same recipe as the recipe of the process job to be executed immediately before is specified in the process job data. Pre- and post-processing refers to preparation processing that is executed as necessary between process jobs with different recipes.

In the example of FIG. 9, chemical recipe C1 (first processing liquid condition) is specified for process jobs PJ11, PJ13; PJ21, PJ22, PJ23; PJ32, PJ33, and chemical recipe C1 (first processing liquid condition) is specified for process jobs PJ12; C2 (second processing liquid condition) is specified. For example, the chemical liquid recipe C1 specifies the use of a chemical liquid at a first temperature (for example, 60° C.), and the chemical liquid cabinet CC1 is controlled to supply the chemical liquid at the first temperature accordingly. Further, the chemical liquid recipe C2 specifies the use of a chemical liquid at a second temperature (for example, 80° C.) different from the first temperature, and in response, the chemical liquid cabinet CC1 supplies the chemical liquid at the second temperature. controlled by. The temperature of the chemical solution supplied from the chemical solution cabinet CC1 cannot be changed instantaneously. That is, a preparatory step for temperature adjustment is required in the chemical liquid cabinet CC1, and it takes a considerable amount of time to change the chemical liquid temperature and supply a stable chemical liquid at the changed temperature.

To simplify the explanation, assume that the recipe data of process jobs PJ11, PJ12, PJ13; PJ21, PJ22, PJ23; PJ31, PJ32, PJ33 all specify processing in one processing unit MPC1. Suppose.
FIG. 10A shows a temporary timetable created for each board of process jobs PJ11, PJ13; PJ21, PJ22, PJ23; PJ32, PJ33 for which chemical recipe C1 is specified, and FIG. 10B shows a temporary timetable for each board for which chemical recipe C2 is specified. A temporary timetable created for each substrate of process jobs PJ12 and PJ31 is shown.

The scheduling function unit 25 creates temporary timetables corresponding to all process jobs PJ11, PJ12, PJ13; PJ21, PJ22, PJ23; PJ31, PJ32, PJ33, respectively.
In the assumed example, the recipe data for process jobs PJ11, PJ12, PJ13; PJ21, PJ22, PJ23; PJ31, PJ32, PJ33 all specify processing by one processing unit MPC1, so A temporary timetable is created for specifying processing in one processing unit MPC1 and processing the substrate. That is, a temporary timetable is created in which processing blocks are arranged in each processing unit MPC1. A processing block represents that the processing unit is occupied for substrate processing. If a recipe for a certain process job allows parallel processing in multiple processing units, multiple temporary timetables are created in which processing blocks are placed in each of the allowed processing units. .

Moreover, during the period of the processing blocks arranged in the processing unit MPC1, during the period when the chemical liquid is to be supplied from the chemical liquid cabinet CC1, a chemical liquid supply block is arranged corresponding to the chemical liquid cabinet CC1. The chemical solution supply block represents that the chemical solution cabinet CC1 is used for drug solution supply. In the tentative timetable of FIG. 10A, a chemical solution supply block that specifies the supply of a first temperature (for example, 60° C.) according to the chemical recipe C1 is arranged, and in the tentative timetable of FIG. A chemical solution supply block that specifies the supply of a chemical solution at a temperature of (for example, 80° C.) is arranged.

FIG. 11 shows an example in which all blocks constituting a temporary timetable corresponding to the first substrate of the first process job PJ11 of the first received control job CJ1 are arranged.
The scheduling function unit 25 first arranges the blocks acquired from the temporary timetable of the process job PJ11 in the corresponding resource space in order at the earliest position on the time axis (that is, in a front-aligned manner). At this time, the scheduling function unit 25 arranges each block so that the blocks do not overlap in the same resource space. The process job PJ11 is, for example, a process that specifies that processing for one substrate should be performed by the processing unit MPC1. Therefore, the scheduling function section 25 arranges the processing blocks so as to correspond to the processing unit MPC1.

Furthermore, since the chemical solution recipe C1 of the process job PJ11 specifies the use of a chemical solution at the first temperature (for example, 60° C.), the chemical solution cabinet CC1 A chemical solution supply block (60° C.) is arranged in correspondence with the above. If another process job specifying chemical recipe C1 is not executed or planned immediately before process job PJ11, a chemical liquid temperature adjustment corresponding to chemical liquid recipe C1 is performed before the chemical liquid supply block (60°C). Preparation process blocks are placed. In this way, scheduling for process job PJ11 is completed.

If the process job PJ11 is processing for two or more substrates, the processing in the processing unit MPC1 is repeatedly planned for the second and subsequent substrates in the same manner. If the process job PJ11 allows parallel processing in multiple processing units, a temporary timetable using any of the allowed processing units is created so that processing blocks can be placed at earlier times. selected.

Next, the scheduling function unit 25 starts scheduling for the process job PJ12 described next to the process job PJ11 in the data of the control job CJ1. However, the recipe data for process job PJ12 includes a chemical recipe C2 that specifies the use of a chemical at a second temperature (for example, 80°C), and this chemical recipe C1 is different from the chemical recipe C1 for process job PJ11 that was planned immediately before. different. Therefore, the scheduling function unit 25 puts the plan of the process job PJ12 on hold.

Next, as shown in FIG. 12, the scheduling function unit 25 suspends the processing scheduling of the process job PJ12, and executes a process for which information (process job data) is written next to the process job PJ12 in the control job CJ1. Scheduling is performed for job PJ13. The recipe for process job PJ13 specifies the same chemical recipe C1 as process job PJ11, so the processing conditions (chemical temperature) of the previously planned process job PJ11 and the processing conditions (chemical temperature) of the currently planned process job PJ13 are specified. ) are the same.

Therefore, the scheduling function unit 25 arranges the blocks constituting the temporary timetable of the process job PJ13 so that they do not overlap with other blocks of the same resource so that they are shifted toward the front on the time axis. Thereby, the processing block is placed in the processing unit MPC1. In addition, since the process job PJ13 specifies the use of a chemical solution at 60°C, a chemical solution supply block is placed in association with the chemical solution cabinet CC1 during the period in which the chemical solution is used within the period in which the processing block is placed. . In this way, scheduling for process job PJ13 is completed.

If the process job PJ13 is processing for two or more substrates, the processing in the processing unit MPC1 is repeatedly planned for the second and subsequent substrates in the same manner.
Thereafter, process jobs are scheduled in the same manner.
FIG. 13 shows scheduling according to the first comparative example. To simplify the explanation, FIG. 13 shows only the processing block, chemical solution supply block, and preparatory process block. The preparatory process block is a block for instructing a preparatory process necessary to execute a chemical liquid recipe. More specifically, prior to execution of the chemical liquid recipe C1, a preparation process for adjusting the chemical liquid to a first temperature (for example, 60° C.) is performed in the chemical liquid cabinet CC1. Similarly, prior to execution of the chemical liquid recipe C2, a preparation process for adjusting the chemical liquid to a second temperature (for example, 80° C.) is performed in the chemical liquid cabinet CC1. If the temperature of the chemical solution has been adjusted, there is no need to plan a preparation process.

Since the recipe of the first process job PJ11 specifies the chemical recipe C1, the preparation process block is placed before the corresponding processing block (more precisely, before the chemical supply block). This preparation process block instructs a preparation process for executing the chemical liquid recipe C1 (chemical liquid supply at the first temperature). After process job PJ11, execution of process job PJ13 that specifies the same chemical recipe C1 is planned, so there is no need to execute a preparation process before the corresponding processing block, and therefore no preparation process block is placed. .

In this comparative example, changing the order of process jobs is allowed only within the scope of one control job. Therefore, process job PJ12 is planned to be executed next to process job PJ13. Since the recipe for the process job PJ12 specifies the chemical liquid recipe C2 (chemical liquid supply at the second temperature), the preparation process block is placed before the corresponding processing block. This preparation process block is a block for adjusting the temperature of the chemical solution to a second temperature in the chemical solution cabinet CC1.

In this way, when all the process jobs PJ11 to PJ13 of the control job CJ1 have been planned, the next control job CJ2 is planned. The recipes for process jobs PJ21 to PJ23 included in control job CJ2 all specify chemical recipe C1 (chemical liquid supply at the first temperature), so the process block corresponding to the first process job PJ21 is , a preparation process block is placed. This preparation process block is a block for adjusting the temperature of the chemical liquid to the first temperature in the chemical liquid cabinet CC1. The recipes of the other process jobs PJ22 and PJ23 that make up the control job CJ1 both specify the chemical recipe C1, so these processing blocks are arranged in order with respect to the processing unit MPC1, and the processing blocks and the previous one are arranged in order. No preparation process block is placed between the processing block and the processing block.

In this way, when all process jobs PJ21 to PJ23 of control job CJ2 have been planned, the next control job CJ3 is planned. Control job CJ3 is not planned next to control job CJ1 with control job CJ2 postponed.
Control job CJ3 includes process jobs PJ32 and PJ33 that specify the same chemical recipe C1 as the recipe of process job PJ23 that was planned immediately before. Therefore, process jobs PJ32 and PJ33 are planned in order before process job PJ31, and after that, process job PJ31 that specifies chemical liquid recipe C2 (chemical liquid at the second temperature) is planned. This eliminates the need to arrange a preparatory process block between the processing blocks of process jobs PJ23 and PJ32. A preparation process block is arranged between process jobs PJ33 and PJ31. This preparation process block is a block that instructs a preparation process for adjusting the temperature of the chemical liquid to the second temperature in the chemical liquid cabinet CC1.

FIG. 14 shows scheduling according to the second comparative example. In this second comparative example, control jobs CJ1, CJ2, and CJ3 are planned in this order, and the process jobs included in each control job are planned in the order in which they are described. As a result, before the processing block of process job PJ11, between the processing blocks of process jobs PJ11 and PJ12, between the processing blocks of process jobs PJ12 and PJ13, between the processing blocks of process jobs PJ23 and PJ31, and the processing blocks of process jobs PJ31 and PJ32 Preparation process blocks are arranged between them. Therefore, a total of five preparatory steps are performed. On the other hand, in the first comparative example shown in FIG. 13, the preparation process is executed a total of four times. Therefore, since the first comparative example requires fewer preparation steps, the overall substrate processing time is shorter and productivity is higher.

FIG. 15 shows a scheduling example (example) in one embodiment of the present invention. In this embodiment, the control jobs CJ1, CJ2, and CJ3 do not need to be executed in the order in which they were received, and it is permissible to change the execution order of the process jobs beyond the scope of the control jobs. That is, the received process jobs are rearranged and planned so that process jobs that specify the same chemical recipe as the previously planned process job specify are consecutive.

That is, the process jobs PJ11, PJ13, PJ21, PJ22, PJ23, PJ32, PJ33, PJ12, and PJ31 are planned in this order. As a result, preparation process blocks are arranged before the processing block of process job PJ11 and between the processing blocks of process jobs PJ33 and PJ12. Therefore, since the preparation process is performed only twice, the overall substrate processing time is shorter and the productivity is higher than in the first and second comparative examples.

16A to 16D show other examples (examples) of scheduling in one embodiment of the present invention. In this scheduling example, interrupt scheduling is performed based on the elapsed time from the start of execution of the control job (an example of the control job life).
In the scheduling example shown in FIG. 15, it takes a long time from the start of execution of process job PJ11, which is executed first among control jobs CJ1, to the start of process job PJ12, which is executed last. (control job life) may reach the threshold. As a result, after the substrates corresponding to the process job PJ11 are processed and stored in the substrate container C, the substrates corresponding to the process job PJ11 are stored in the substrate container C for a long time until all the substrates of the last process job PJ12 are stored in the substrate container C. It will be in a standby state for a while. For example, when the substrate container C is provided with an opening/closing lid, the opening/closing lid remains open for a long period of time, and the substrates in the substrate container C are exposed to the surrounding atmosphere for a long period of time. The scheduling examples shown in FIGS. 16A to 16D solve this problem.

This scheduling example assumes that control jobs CJ1, CJ2, and CJ3 are received at times t1, t2, and t3, respectively.
When control job CJ1 is received at time t1, scheduling function section 25 plans execution of process jobs PJ11, PJ12, and PJ13, and processing execution instruction section 26 immediately executes the plan. At this point, control jobs CJ2 and CJ3 have not been received. If no process job has been scheduled immediately before, the scheduling function unit 25 plans the first process job PJ11 of the control job CJ1. As shown in FIG. 16A, the scheduling function unit 25 arranges the preparation process block for the chemical liquid recipe C1 before the processing block of the process job PJ11 (more precisely, before the chemical liquid supply block). The scheduling function unit 25 plans to execute a process job PJ13 that specifies the common chemical recipe C1 next to the process job PJ11, and then plans to execute the process job PJ12. A preparatory step block for the chemical recipe C2 is arranged between the processing block of the process job PJ13 and the processing block of the process job PJ12.

When another control job CJ2 is received at time t2 after starting the execution of the process job PJ11 and before starting the execution of the process job PJ13, the scheduling function unit 25 sends the unexecuted process job at that time. Scheduling is executed for PJ13, PJ12, PJ21, PJ22, and PJ23, and the processing execution instruction unit 26 immediately executes the plan. That is, rescheduling is performed, and the processing resulting from the rescheduling is executed.

As shown in FIG. 16B, the scheduling function unit 25 sequentially executes process jobs PJ13, PJ21, PJ22, and PJ23 that specify a chemical recipe C1 that is common to the process job PJ11 that is being executed, and then After the preparation process, the process job PJ12 is scheduled to be executed.
While the process is being executed according to this plan, as shown in FIG. 16C, the process job PJ22 starts executing, and at time t11 before starting the process job PJ23, the progress from the start of the control job CJ1 execution starts. Suppose that the time (control job life) reaches a threshold value. Then, the scheduling function unit 25 plans interrupt execution of the unexecuted process job PJ12 among the control jobs CJ1.

More specifically, the scheduling function unit 25 reschedules the process job PJ12 to be executed following the process job PJ22 that started execution immediately before. Since the process job PJ12 specifies the chemical recipe C2, a preparation process block for the chemical recipe C2 is placed before the processing block of the process job PJ2. At time t11, since no process job specifying chemical recipe C2 has been received in addition to process job PJ12, the scheduling function unit 25 plans to execute the remaining process job PJ23 after process job PJ12. A preparatory process block for the chemical recipe C1 is arranged before the processing block for the process job PJ23.

After rescheduling in this manner, as shown in FIG. 16D, the control job CJ3 is received at time t3 after the start of execution of the process job PJ12 and before the start of execution of the preparation process. Then, the scheduling function unit 25 reschedules the process jobs PJ23, PJ31, PJ32, and PJ33 that have not been started at time t3. As a result, execution of process job PJ31 that specifies chemical recipe C2 that is common to process job PJ12 that is being executed is planned, and then a preparation process for switching to chemical recipe C1 is planned, and further, the process job PJ31 that specifies chemical recipe C1 is planned. A plan is formulated to execute process jobs PJ23, PJ32, and PJ33 in order.

In this way, the scheduling function unit 25 performs rescheduling every time control job data is received, thereby minimizing the number of preparation steps. Furthermore, the scheduling function unit 25 measures the life of each control job, such as the elapsed time from the execution of the first process job, and when the life reaches a threshold value, interrupts execution of the unexecuted process job of the control job. reschedule to allow

As described above, according to this embodiment, before all process jobs PJ11 to PJ13 included in control job CJ1 are completed, process job PJ21 and the like included in another control job CJ2 are executed. In other words, since the control job CJ2 includes process jobs PJ21 to PJ23 in which the chemical recipe C1 having the common attribute is specified as process jobs PJ11 and PJ13 included in the control job CJ1, the process jobs PJ11 and PJ13 included in the control job CJ1 are included in the control job CJ2. The order of is swapped. As a result, process jobs in which the chemical recipe C1 with the common attribute is specified can be executed all at once (successively), so the number of times the chemical recipe is switched can be reduced, and the number of preparation steps can be reduced accordingly. Thereby, substrate processing with high production efficiency can be realized.

On the other hand, when a predetermined interrupt execution condition is satisfied (step S45 in FIG. 6, step S55 in FIG. 7), the plan of unexecuted process jobs is changed and the process job corresponding to the interrupt execution condition is prioritized. make it execute. As a result, if any inconvenience occurs due to the replacement of process jobs beyond the control job, such inconvenience can be avoided or eliminated. Thereby, it is possible to improve production efficiency while ensuring appropriate substrate processing.
Specifically, a substantial time limit can be set from the start to the end of processing for one control job (see FIG. 6). Thereby, it is possible to avoid waiting for a long time in the substrate container C after the first substrate of a certain control job is processed. For example, when the substrate container C is a container with an opening/closing lid (such as a FOUP), it is possible to prevent the opening/closing lid from remaining open for a long time. Thereby, adverse effects on the surface of the processed substrate, such as the growth of a natural oxide film and the effects of the surrounding atmosphere, can be suppressed. Furthermore, it is possible to avoid that the stage ST holding the substrate accommodating container C is occupied by one substrate accommodating container C for a long time, and the time until the next substrate accommodating container C can be loaded can be shortened. Further, restrictions can be placed on the continued use of the chemical solution (see FIG. 7). If the same chemical solution is used repeatedly, the quality of the chemical solution may deteriorate and the substrate processing may be affected. Therefore, the life of a certain type of chemical solution from the start of use (for example, the number of substrates processed) is measured, and when the life reaches a threshold, a process job that specifies a different type of chemical solution is executed with priority. Measures can be taken to replace the chemical solution whose life has reached the threshold.

Further, when such interrupt scheduling is performed, execution of a process job having attributes common to the recipe of the process job is planned to follow the process job for which interrupt execution is planned. Thereby, it is possible to suppress switching of attributes while allowing interrupt execution planning. Therefore, processing efficiency can be improved while ensuring appropriate substrate processing through interrupt execution.

The interrupt execution conditions may be input and specified by the user using an operating device, which is an example of the input/output unit 22 (see FIG. 3). The computer 20 receives such input, monitors interrupt execution conditions, and executes interrupt scheduling when the conditions are satisfied. Thereby, the processing efficiency of the substrate processing apparatus can be improved while meeting user demands.
Although one embodiment of this invention has been described above, this invention can also be implemented in other forms. For example, in the above-described embodiment, the temperature of the processing liquid was mainly explained as an example of the attribute specified by the recipe, but as mentioned above, the type of processing liquid also has an attribute that requires a preparation process when changing it. This is an example. In addition to these examples, if a recipe specifies an attribute that requires preparation when starting or changing, the execution order of the process job should be changed beyond the control job so that the attribute is as continuous as possible. By replacing them, the production efficiency of the substrate processing apparatus can be improved.

Further, in the above-described embodiment, a configuration in which one chemical liquid cabinet CC1 is provided has been described, but two or more chemical liquid cabinets may be provided.
Further, in the above-described embodiment, a configuration in which the processing section 2 is provided with one main transport robot CR has been described, but two or more main transport robots may be provided. The two or more main transport robots may be arranged so that each of them directly transfers the substrate W to and from the indexer robot IR (without going through another main transport robot). Further, at least one of the two or more main transport robots may be arranged to exchange the substrate W with the indexer robot IR via another main transport robot.

Further, the arrangement and number of processing units MPC1 to MPC12 in the above-described embodiment are merely examples, and it goes without saying that the arrangement and number can be changed. Of course, the plurality of processing units may be of the same type or may include processing units of different types.
Furthermore, in the above-described embodiment, the case where the control job data is given from the host computer 24 was mainly explained, but the control job data is controlled by an instruction from the operating device (an example of the input/output section 22) operated by the user. 21.

In addition, various design changes can be made within the scope of the claims.

1: Indexer section 2: Processing section 3: Tank 4: Temperature adjustment unit 5: Pump 15: Spin chuck 16: Processing liquid nozzle 17: Processing chamber 20: Computer 21: Control section 22: Input/input section 23: Storage section 24: Host computer 25: Scheduling function unit 26: Processing execution instruction unit 30: Program 31: Schedule creation program 32: Processing execution program 40: Control job data 41: Process job data 50: Schedule data C: Substrate containers C1, C2: Chemical solution Recipe CC1: Chemical solution cabinet CJ1-CJ3: Control job CR: Main transfer robot G1-G4: Processing unit group IR: Indexer robot MPC1-MPC12: Processing unit PASS: Delivery unit PJ11-PJ13: Process job PJ21-PJ23: Process job PJ31 ~PJ33: Process job ST1~ST4: Stage W: Substrate

The present invention provides a substrate processing method in which a substrate is processed by a substrate processing apparatus equipped with a processing unit that performs processing on the substrate. A method according to an embodiment of the present invention includes a step in which the substrate processing apparatus receives first control job information defining a first control job that is a process for a first lot; After receiving the control job information, the method includes the step of receiving second control job information that defines a second control job that is a process for the second lot. The first control job information includes first process job information that defines a first process job that is processing of one or more substrates included in the first lot according to a first recipe, and first process job information that is included in the first lot. and third process job information that defines a third process job that is a process for one or more substrates to be processed according to a third recipe. The second control job information includes second process job information that defines a second process job that is a process for one or more substrates included in the second lot according to a second recipe. In the substrate processing method, when the first recipe and the second recipe include a common attribute and the third recipe does not include the attribute, the process is performed between the first process job and the third process job. a scheduling step of formulating an execution plan for the first , second, and third process jobs in the order in which the second process job is to be executed; and a processing execution step of processing the substrate by the processing unit according to the formulated execution plan; It may further include .

The substrate processing apparatus may include a substrate transport means for transporting the substrate from a substrate standby location to the processing unit. In this case, it is preferable that the process job execution plan includes a plan for transporting the substrate. Accordingly, in the processing execution step, the substrate is transported and the substrate is processed in the processing unit.
In one embodiment of the present invention, a process job included in the second control job may be executed before all process jobs included in the first control job are completed. More specifically, when a second control job includes a process job for which a recipe with a common attribute is specified as a process job included in the first control job, the process job is The order can be swapped. That is, the first control job includes a first process job and a third process job to which recipes with different attributes are specified, and the second control job includes a second process job to which a recipe having common attributes with the recipe of the first process job is specified . Consider a case where you have a process job. In this case, a plan is created to execute the process jobs in the order of the first process job, the second process job, and the third process job. That is, the process job of the second control job interrupts the process job before the first control job is completed. As a result, the order of process jobs is changed beyond the control job, and process jobs for which recipes with common attributes are specified can be executed all at once (successively). This makes it possible to reduce the number of times recipe attributes are switched, thereby realizing substrate processing with high production efficiency.

In one embodiment of the invention, the attribute is an attribute that requires a preparatory step before starting processing in the processing unit, and the scheduling step is included in the third recipe after the second process job. Develop a plan to perform the preparation steps corresponding to the attributes.
In this method, recipes are classified by focusing on attributes that require a preparation step, and process jobs that specify recipes with common attributes can be executed collectively (successively). As a result, the number of preparation steps required when switching recipes can be reduced, and substrate processing with high production efficiency can be realized.

In one embodiment of the present invention, the substrate processing method further includes a step of obtaining an attribute life representing a continuation status of processing using a common attribute common to the first recipe and the second recipe, and the scheduling step includes: , when an interrupt execution condition including that the attribute life reaches a predetermined threshold is satisfied, the process using the common attribute is interrupted and interrupt execution of a process job of a recipe having a different attribute is planned. including an interrupt scheduling process.

An embodiment of the present invention further includes a step of receiving an input of an interrupt execution condition from a user to the substrate processing apparatus, and the accepted interrupt execution condition is applied in the interrupt scheduling step. With this method, the user can specify the interrupt execution conditions, so processing efficiency can be improved while responding to the user's requests.
In one embodiment of the present invention, the substrate processing apparatus includes a processing liquid supply unit that supplies a processing liquid to the processing unit, and the attribute includes conditions regarding the processing liquid supplied from the processing liquid supply unit, The first recipe and the second recipe commonly specify a first treatment liquid condition, and the third recipe specifies a second treatment liquid condition different from the first treatment liquid condition.

In one embodiment of the present invention, the first lot includes one or more substrates to be processed by a first recipe, and one or more substrates to be processed by a third recipe having attributes different from the first recipe. the second lot includes one or more substrates to be processed according to a second recipe having attributes common to the first recipe, and the first processing step includes the first The second processing step includes processing according to the second recipe, and the third processing step includes processing according to the third recipe.

An embodiment of the present invention also provides a substrate processing apparatus that includes a processing unit that executes processing on a substrate, and a control job information receiving means that receives input of control job information that defines a control job that is processing on a lot. I will provide a. The control job information includes process job information that defines a process job that is a process for one or more substrates included in the lot. The substrate processing apparatus further includes a scheduling means for formulating a processing plan for the substrate based on the process job information, and a processing execution control means for causing the processing unit to perform substrate processing according to the processing plan formulated by the scheduling means. including. The control job information receiving means receives first control job information that defines a first control job that is a process for a first lot, and after receiving the first control job information, specifies a second control job that is a process for a second lot. Second control job information defining a control job is received. The first control job information includes first process job information that defines a first process job that is processing of one or more substrates included in the first lot according to a first recipe, and first process job information that is included in the first lot. and third process job information that defines a third process job that is a process for one or more substrates to be processed according to a third recipe. The second control job information includes second process job information that defines a second process job that is a process for one or more substrates included in the second lot according to a second recipe. The scheduling means may be arranged between the first process job and the third process job when the first recipe and the second recipe include a common attribute and the third recipe does not include the attribute. An execution plan for the first, second , and third process jobs is formulated in the order in which the second process job is executed.

In one embodiment of the invention, the attribute is an attribute that requires a preparatory step before starting processing in the processing unit, and the scheduling means is included in the third recipe after the second process job. Develop a plan to perform the preparation steps corresponding to the attributes.
In one embodiment of the present invention, when a predetermined interrupt execution condition is satisfied, the scheduling means changes the plan of an unexecuted process job to execute a process job that is selected based on the interrupt execution condition. Execute interrupt scheduling to plan interrupt execution.

In one embodiment of the present invention, the substrate processing apparatus further includes means for obtaining an attribute life representing a continuation status of processing using a common attribute common to the first recipe and the second recipe, and the scheduling means , when an interrupt execution condition including that the attribute life reaches a predetermined threshold is satisfied, the process using the common attribute is interrupted and interrupt execution of a process job of a recipe having a different attribute is planned. Executes interrupt scheduling.

In one embodiment of the present invention, the substrate processing apparatus further includes a processing liquid supply unit that supplies a processing liquid to the processing unit, and the attribute includes conditions regarding the processing liquid supplied from the processing liquid supply unit. , the first recipe and the second recipe specify a first treatment liquid condition in common, and the third recipe specifies a second treatment liquid condition different from the first treatment liquid condition.

In one embodiment of the present invention, the first lot includes one or more substrates to be processed by a first recipe, and one or more substrates to be processed by a third recipe having attributes different from the first recipe. the second lot includes one or more substrates to be processed according to a second recipe having attributes common to the first recipe, and the first processing step includes the first The second processing step includes processing according to the second recipe, and the third processing step includes processing according to the third recipe.

The program 30 stored in the storage unit 23 includes a schedule creation program 31 for operating the control unit 21 as the scheduling function unit 25 and a process execution program 32 for operating the control unit 21 as the process execution instruction unit 26. include.
The control job data 40 includes a control job (CJ) code given to a processing lot defined by one or more substrates housed in one substrate container C, and one or more process job data 41 including. The process job data 41 includes a process job (PJ) code given to each substrate W and a recipe associated with the process job code.

Claims (9)

A substrate processing method in which a substrate is processed by a substrate processing apparatus equipped with a processing unit that performs processing on the substrate,
a first processing step in which the substrate processing apparatus performs processing on one or more substrates included in a first lot;
a second processing step in which the substrate processing apparatus performs processing on one or more substrates included in a second lot different from the first lot after the first processing step;
The substrate processing apparatus includes, after the second processing step, a third processing step of performing processing on one or more substrates included in the first lot,
When the elapsed time since the substrate processing apparatus started processing the first lot or the number of substrates or lots that have been processed since the start of processing the first lot reaches a predetermined threshold, the substrate processing apparatus A substrate processing method, wherein the processing apparatus interrupts processing for the second lot and preferentially processes unprocessed substrates of the first lot. The first lot includes one or more substrates to be processed according to a first recipe, and one or more substrates to be processed according to a second recipe having different attributes from the first recipe,
the second lot includes one or more substrates to be processed by a third recipe having attributes in common with the first recipe;
the first treatment step includes treatment according to the first recipe,
the second treatment step includes treatment according to the third recipe,
The substrate processing method according to claim 1, wherein the third processing step includes processing according to the second recipe. The attribute is an attribute that requires a preparatory step before starting processing in the processing unit,
3. The substrate processing method according to claim 2, wherein the substrate processing apparatus executes a preparation step for switching attributes between the second processing step and the third processing step. 4. The substrate processing method according to claim 2, wherein when the continuation status of a recipe with a common attribute reaches a predetermined threshold, the substrate processing apparatus executes processing on a substrate to be processed using a recipe with a different attribute. A computer program executed by a computer installed in a substrate processing apparatus, the computer program including a group of steps for executing the method according to any one of claims 1 to 4 in the substrate processing apparatus. . a processing unit that performs processing on the substrate;
a substrate transport means for transporting the substrate to the processing unit;
a control unit that controls the processing unit and the substrate transport means,
The control unit includes:
A first processing step in which one or more substrates included in a first lot are transported to the processing unit by the substrate transport means and processed;
After the first processing step, a second processing step in which one or more substrates included in a second lot different from the first lot is transported to the processing unit by the substrate transport means and processed;
After the second processing step, a third processing step in which one or more substrates included in the first lot is transported to the processing unit by the substrate transport means and processed;
Run
When the elapsed time since the start of processing for the first lot or the number of substrates or lots that have been processed since the start of processing for the first lot reaches a predetermined threshold, the control unit The substrate processing apparatus interrupts the processing of two lots, and preferentially transports the unprocessed substrates of the first lot to the processing unit by the substrate transport means for processing. The first lot includes one or more substrates to be processed according to a first recipe, and one or more substrates to be processed according to a second recipe having different attributes from the first recipe,
the second lot includes one or more substrates to be processed by a third recipe having attributes in common with the first recipe;
the first treatment step includes treatment according to the first recipe,
the second treatment step includes treatment according to the third recipe,
The substrate processing apparatus according to claim 6, wherein the third processing step includes processing according to the second recipe. The attribute is an attribute that requires a preparatory step before starting processing in the processing unit,
The substrate processing apparatus according to claim 7 , wherein the control unit executes a preparation step for switching attributes between the second processing step and the third processing step. 9. When the continuation status according to a recipe with a common attribute reaches a predetermined threshold, the control unit transports a substrate to be processed according to a recipe with a different attribute to the processing unit by the substrate transport means and processes it. The substrate processing apparatus described in .

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