JP2023180023A - Grinding device - Google Patents

Abstract

To take out an end material from a machining chamber even in a course of grinding in a grinding device.SOLUTION: A grinding device 1 including: a chuck table 20 which holds a wafer 100 on a holding surface 210, a grinding mechanism 30 which grinds the wafer 100, held on the holding surface 210, by means of a grinding wheel 352, and a moving mechanism 50 which moves the chuck table 20 to a processing position using the grinding wheel 352, comprises: an annular groove 70 which is movable together with the chuck table 20 by means of the moving mechanism 50, rotatably surrounds the chuck table, and has a recessed cross-sectional shape which is open at an upper portion thereof; an outlet 73 formed in a part of an outer peripheral wall 72 of the annular groove 70; a collecting unit 74 which has an inlet 743 corresponding to the outlet 73 of the annular groove 70 positioned at a machining position by the moving mechanism 50 and collects an end material in one place; and a discharge mechanism which discharges the end material, collected by the collecting unit 74, to an outside of a machining chamber.SELECTED DRAWING: Figure 1

Description

The present invention relates to a grinding apparatus for grinding wafers.

If a wafer with a chamfered portion formed on the outer periphery is held on a chuck table and the back surface is ground using a rotating grinding wheel to thin it, the outer periphery will become sharp and easily chipped or cracked. The chamfered portion is removed by trimming before grinding. During this trimming, if the chamfered part is not completely cut off and the cut is made halfway through the thickness from the front side, the trimmed part will break while grinding the back side, creating scraps, which will prevent the rotation of the chuck table. .

Therefore, a grinding device has been proposed in which a cover having an inclined surface that descends toward the outer circumference is disposed around the chuck table (for example, see Patent Document 1). In a grinding device equipped with this cover, the scraps are collected at one location on the bottom plate of the processing chamber by lowering the scraps along the slope using the grinding water supplied to the grinding wheel during wafer grinding.

Japanese Patent Application Publication No. 2013-188813

A worker opens the cover of the processing room and takes out the scraps that have gathered in one place, and this work is done when the processing equipment is not processing, or when processing is temporarily stopped. It has been going since. However, when a large amount of scraps accumulate, it may be necessary to take out the scraps from the processing chamber even during the grinding process.

The present invention is. In view of these problems, the object is to make it possible to take out the scraps from the processing chamber even during the grinding process.

This grinding device includes a chuck table that holds a wafer with a holding surface, a grinding mechanism that uses a grindstone to grind the wafer held on the holding surface, and a movement mechanism that moves the chuck table to a processing position by the grindstone. A grinding device comprising: an annular groove that is movable together with the chuck table by the moving mechanism, rotatably surrounds the chuck table, has a concave cross section with an open top, and an outlet formed in a part of the outer peripheral wall of the annular groove. a collecting section that collects the scraps in one place and has an entrance corresponding to the outlet of the annular groove positioned at the processing position by the moving mechanism; and a discharge mechanism for discharging to the outside.
The ejection mechanism includes an ejection port opening in a side wall of the processing chamber, an ejection lane extending through the ejection port and connected at one end to the collection section, and the other end of the ejection lane. There is a configuration that includes a container arranged in a container and a container for storing scraps.
It is preferable that the bottom surface of the annular groove is inclined so that the outlet is the lowest, and that a water nozzle is provided in a high part of the annular groove to form a water flow toward the outlet.
The discharge lane is arranged so that one end side inside the processing chamber is low and the other end is high, and a skewer blade or brush is set up at one end of the discharge lane, and the skewers are collected at one place in the collection section. There is a configuration that includes a scraping unit that moves the collected scraps along the discharge lane and scrapes out the scraps gathered at one end of the discharge lane.

In this grinding device, the scraps generated by grinding are collected in the collection part through the annular groove, and the discharge mechanism discharges the scraps collected in the collection part out of the processing chamber, so even during the grinding process. , the scraps can be discharged from the machining chamber to the outside of the machining chamber without stopping the grinding.
A discharge mechanism includes a discharge port opening in the side wall of the processing chamber, a discharge lane extending through the discharge port and connected to the collection section at one end, and a discharge mechanism disposed at the other end of the discharge lane to collect the scraps. If the configuration is provided with a storage container, the scraps that have come out of the processing chamber from the outlet are stored in the collector, and the scraps accumulated in the container outside the processing chamber can be taken out, so even during the grinding process. Offcuts can be discarded.
If the bottom surface of the annular groove is inclined so that the outlet is the lowest, and a water nozzle is placed in the higher part of the annular groove to form a water flow toward the outlet, the waste material can be flowed toward the outlet by the water flow. This makes it possible to smoothly discharge the scraps.
The discharge lane is arranged so that one end of the inside of the processing chamber is low and the other end is high, and a skewer blade or brush is set up at one end of the discharge lane, and the scraps are collected in one place in the collection section. By moving the scraper along the discharge lane and scraping out the scraps gathered at one end of the discharge lane, it is possible to reliably store the scraps in the container without leaving any scraps on the discharge lane. can.

It is a perspective view showing an example of a grinding device. FIG. 3 is a perspective view showing a state in which the chuck table is in a processing position. FIG. 3 is a perspective view showing the chuck table at the loading/unloading position. It is a sectional view showing a first example of a discharge mechanism. It is a sectional view showing a state where a scraping unit is tilted in the first example of the ejection mechanism. It is a perspective view showing a part of example of a scraping unit. FIG. 3 is a cross-sectional view schematically showing a state in which a chamfered portion on the outer periphery of a wafer is trimmed. It is a perspective view which shows the state where the scraping skewer blade is located in the scraping start position. It is a perspective view showing a state where a scraping skewer blade passes through a lane skewer blade. It is a sectional view showing a state where a scraping unit is tilted. It is a sectional view showing a state where a scraping unit stores scraps in a container. FIG. 7 is a sectional view showing a second example of the ejection mechanism. FIG. 7 is a sectional view showing a state in which the inner box of the container is taken out in the second example of the ejection mechanism.

(Configuration of grinding device)
The grinding apparatus 1 shown in FIG. 1 includes a chuck table 20 that holds a wafer, a grinding mechanism 30 that grinds the wafer 100 held on the chuck table 20, a grinding feed mechanism 40 that moves the grinding mechanism 30 up and down, and the chuck table 20. A moving mechanism 50 that moves the grinding mechanism 30 in a direction toward and away from the grinding mechanism 30 is provided.

The chuck table 20 includes a suction member 21 made of a porous material and having a holding surface 210 on its surface, and a frame 22 that supports the suction member 21 from below and from the outer circumferential side. A chuck shaft 23 is connected to the lower part of the frame 22, and the chuck shaft 23 is rotatable by being driven by a motor (not shown). The chuck shaft 23 is rotatably supported by the base member 24. A holding surface tilt adjustment mechanism 25 is interposed between the base member 24 and the slider 54 located below it.

The grinding mechanism 30 includes a spindle 31 having an axis in the Z-axis direction perpendicular to the holding surface 210, a housing 32 that rotatably supports the spindle 31, and a housing 32 that is connected to one end of the spindle 31 and rotates the spindle 31 in forward and reverse directions. It is composed of a motor 33, a mount 34 connected to the lower end of the spindle 31, and a grinding wheel 35 attached to the mount 34. The grinding wheel 35 includes a base 351 attached to the mount 34 and a plurality of grindstones 352 fixed to the lower surface of the base 351 in an annular shape.

The grinding feed mechanism 40 includes a ball screw 41 having an axis in the Z-axis direction, a pair of guide rails 42 arranged in parallel with the ball screw 41, a motor 43 that rotates the ball screw 41 in forward and reverse directions, and a motor 43 that slides on the guide rails 42. It includes an elevating plate 44 having a nut portion (not shown) that is in contact with the ball screw 41 and screwed into the ball screw 41, and a holder 45 that is attached to the elevating plate 44 and supports the housing 32. When the ball screw 41 is rotated by being driven by the motor 43, the elevating plate 44 is moved up and down while being guided by the guide rail 42, and the grinding mechanism 30 is also moved up and down accordingly.

The moving mechanism 50 is located inside the grinding device 1 and includes a ball screw 51 having an axis in the Y-axis direction, which is the front-rear direction, a pair of guide rails 52 arranged parallel to the ball screw 51, and one end of the ball screw 51. A motor 53 is connected to the motor 53 and rotates the ball screw 51 in forward and reverse directions, and a slider 54 has a nut portion (not shown) that slides on the guide rail 52 and screws onto the ball screw 51. When the ball screw 51 is rotated by being driven by the motor 53, the slider 54 is guided by the guide rail 52 and moves in the Y-axis direction, and the chuck table 20 also moves in the Y-axis direction accordingly. The range of movement of the chuck table 20 in the Y-axis direction is the processing position 13 on the rear side (+Y direction side) shown in FIG. This is between the loading/unloading position 14 on the front side shown in FIG.

A cover 26 is provided around the chuck table 20, bellows 27 are connected to both ends of the cover 26 in the Y-axis direction, and when the chuck table 20 is moved in the Y-axis direction by being driven by the moving mechanism 50, the cover 26 The bellows 27 also moves in the Y-axis direction as the bellows 27 expands and contracts.
The chuck table 20, the cover 26, and the bellows 27 are housed in a recess 11 formed by recessing from the upper surface of the base 10, and a space surrounded by this recess 11 and a cover (not shown) above it forms a processing chamber. are doing.

A thickness measuring device 60 for measuring the thickness of the wafer 100 held on the chuck table 20 is disposed on the side of the moving path of the chuck table 20. The thickness measuring device 60 includes a first gauge 61 that comes into contact with the top surface of the wafer to measure its height position, and a second gauge 62 that comes into contact with the top surface of the frame 22 to measure its height. The difference between the measured value of the first gauge 61 and the measured value of the second gauge 62 is calculated as the thickness of the wafer.

An annular groove 70 is provided on the outer peripheral side of the frame 22 of the chuck table 20. The annular groove 70 is open at the top and has a concave cross-section including a bottom surface 71 and an outer peripheral wall 72 that stands up from the bottom surface 71. This annular groove 70 is a space in which scraps generated by grinding are accommodated, and a part of the outer peripheral wall 72 of the annular groove 70 has an outlet 73 that opens from the outer peripheral wall 72 toward the outer periphery and discharges the scraps. It is equipped with The annular groove 70 is driven by the moving mechanism 50 and is movable together with the chuck table 20 in the Y-axis direction. Further, the annular groove 70 does not rotate even when the chuck table 20 rotates, and rotatably surrounds the chuck table 20 around the frame body 22.

The bottom surface 71 of the annular groove 70 is an inclined surface whose inner circumferential side is continuous at the same height as the upper surface of the frame body 22 and descends toward the outer circumferential side. Further, the bottom surface 71 is sloped in the circumferential direction so that the outlet 73 is the lowest, and is highest at the position opposite to the outlet 73 (180 degrees away from the center of the chuck table 20). ing.

A water nozzle 75 is disposed at a position where the circumferential height of the bottom surface 71 is highest. This water nozzle 75 communicates with a water source 76. The water nozzle 75 includes two injection ports 751 and 752 that form a water stream toward the outlet 73. The injection port 751 is oriented to allow water to flow in the clockwise direction of the annular groove 70, and the injection port 752 is oriented to allow water to flow in the counterclockwise direction of the annular groove 70.

The outlet 73 is connected to a collection section 74 that collects the scraps in one place. The collecting section 74 includes a bottom surface 741 , a pair of side walls 742 erected from both ends of the bottom surface 741 in the width direction, and an inlet 743 opened to communicate with the outlet 73 . As shown in FIG. 2, a part of the side wall 12 is opened to form an outlet 81, and one end of the collection section 74 (the end opposite to the inlet 743) is connected to the outlet 81. . In addition, in FIG. 2, illustration of the grinding mechanism 30 and the grinding feed mechanism 40 shown in FIG. 1 is omitted.

As shown in FIGS. 1 and 2, when the moving mechanism 50 moves the chuck table 20 in the +Y direction and the chuck table 20 is in the processing position, the inlet 743 corresponding to the outlet 73 is connected to the outlet 73. . On the other hand, as shown in FIG. 3, when the chuck table 20 is away from the processing position 13, such as when it is at the carry-in/out position, the outlet 73 and the inlet 743 are not connected. Note that, also in FIG. 3, the illustration of the grinding mechanism 30 and the grinding feed mechanism 40 shown in FIG. 1 is omitted.
Note that the moving mechanism 50 may be a turntable on which a plurality of chuck tables 20 are arranged. When the turntable is rotated and the chuck table 20 is in the processing position, the inlet 743 corresponding to the outlet 73 is connected to the outlet 73.

As shown in FIG. 4, one end of the collection section 74 (the end opposite to the inlet 743) constitutes a connection port 744 that is connected to a discharge mechanism 80 disposed inside the device. The collecting portion 74 is formed so as to be inclined downward from the outlet 73 side shown in FIGS. 1-3 toward the connection port 744.

The ejection mechanism 80 includes an ejection port 81 that opens in the side wall 12, an ejection lane 82 that extends through the ejection port 81 and has one end connected to the connection port 744 of the collection section 74, and the other side of the ejection lane 82. and a container 83 disposed on the end side of the container 83 for storing scraps.

The discharge lane 82 is formed, for example, in the shape of a rectangular tube in cross section, and a long scraping member 841 is disposed inside the discharge lane 82 along the longitudinal direction of the discharge lane 82 . The scraping member 841 is driven in the longitudinal direction of the discharge lane 82 by a scraping drive section 842. The scraping drive unit 842 includes, for example, an air cylinder 843 and a piston 844 movable in the axial direction of the air cylinder 843. The tip of the piston 844 is connected to the scraping member 841. When air is supplied to the air cylinder 843, the piston 844 moves along the longitudinal direction of the discharge lane 82. In this way, the scraping member 841 and the scraping drive section 842 constitute a scraping unit 84 that scrapes off scraps.

The scraping member 841 includes a rod 845 that is connected to a piston 844 and extends to the center of the discharge lane 82, and is provided at one end of the rod 845 on the outlet 81 side in a direction perpendicular to the longitudinal direction of the rod 845 downward. It is provided with a raking part 846 for raking up scraps.

In the example of FIG. 4, the discharge lane 82 rises diagonally upward from the outlet 81 toward the container 83 so that one end on the inside of the processing chamber is low and the other end is high. A branch path 821 is provided that branches diagonally downward toward the container 83 from the middle of the path 823. An opening 822 is formed at the lower end of the branch path 821, and a box-shaped container 83 is placed below the opening 822. The container 83 has an opening 831 formed in its upper part, which serves as an entrance for storing the scraps.

An angle changing mechanism 85 that changes the angle of the scraping unit 84 with respect to the discharge lane 82 is disposed below the air cylinder 843 that constitutes the scraping unit 84 . The angle changing mechanism 85 includes a bracket 851 fixed to the lower part of the discharge lane 82, a piston 852 whose tip end is connected to the longitudinally intermediate portion of the air cylinder 843, and an air cylinder 853 that is supported by the bracket 851 and moves the piston 852 forward and backward. and a fulcrum 854 interposed between the bracket 851 and the lower surface of the air cylinder 843. As shown in FIG. 4, when the air cylinder 853 moves the piston 852 upward, the rod 845 and the longitudinal direction of the discharge lane 82 are parallel to each other. On the other hand, as shown in FIG. 5, when the air cylinder 853 has retracted the piston 852 downward, the rod 845 and the longitudinal direction of the discharge lane 82 are not parallel to each other, and as the rod 845 moves toward the discharge port 81 side, It is inclined in the direction approaching the upper part of the discharge lane 82. In this way, the air cylinder 853 can change the angle of the rod 845 with respect to the longitudinal direction of the discharge lane 82 by tilting and rotating the scraping unit 84 about the fulcrum 854.

As shown in FIG. 6, a plurality of rod-shaped lane skewer blades 824 that stand up in a direction perpendicular to the bottom surface 823 of the discharge lane 82 are provided at the end of the discharge lane 82 on the side of the discharge port 81. They are arranged in a row at regular intervals in the width direction. Although the lane skewer blades 824 are arranged in one row in the illustrated example, they may be arranged in two rows. Moreover, a brush may be installed in place of the skewer blade.

On the other hand, the scraping section 846 at the tip of the rod 845 includes a support rod 847 extending horizontally and perpendicularly to the rod 845, and a plurality of scraping skewer blades 848 hanging down from the lower surface of the support rod 847 at regular intervals. It consists of The alignment direction of the scraping skewer blades 848 is parallel to the alignment direction of the lane skewer blades 824, and when the air cylinder 843 shown in FIG. A scraping skewer blade 848 can pass between the spaces 824.

(Operation of grinding device)
When the wafer 100 is to be ground in the grinding apparatus 1 shown in FIG. 1, the moving mechanism 50 positions the chuck table 20 at the loading/unloading position 14. Then, the operator places the front surface 101 side of the wafer 100 on the holding surface 210 of the chuck table 20. Here, the surface 101 is the side on which the device is formed. Note that a protective tape may be attached to the surface 101, and in this case, the protective tape is placed on the holding surface 210. After the wafer 100 is placed on the holding surface 210 in this manner, a suction force is applied to the holding surface 210 to suction and hold the wafer 100.

Here, as shown in FIG. 7, the outer periphery of the wafer 100 is chamfered in an arc shape. Furthermore, a stepped portion 103 is formed at the outer periphery of the surface 101 and is lowered by a predetermined depth from the surface 101 . This stepped portion 103 is formed by rotating the chuck table 90 of the cutting device with the back surface 102 side held, and by rotating the cutting blade 92 attached to the tip of the spindle 91 to form a predetermined area on the front surface 101 of the wafer 100. It is formed by making a deep cut. Note that the stepped portion 103 may be formed by irradiating a laser beam while rotating a chuck table that holds the wafer 100.

Next, the moving mechanism 50 shown in FIG. 1 moves the chuck table 20 to the processing position 13. Then, a motor (not shown) rotates the chuck table 20 to rotate the wafer 100. Furthermore, the motor 33 of the grinding mechanism 30 rotates the spindle 31, and the motor 43 of the grinding feed mechanism 40 rotates the ball screw 41, thereby lowering the grinding mechanism 30. Then, the rotating grindstone 352 comes into contact with the back surface 102 of the wafer 100 to perform grinding.

During grinding, the first gauge 61 contacts the back surface 102 of the wafer to measure its height position, and the second gauge 62 contacts the top surface of the frame 22 to measure its height, and both measured values are The difference is calculated as the thickness of the wafer 100 (if a protective tape is attached to the surface 101 of the wafer 100, the thickness also includes the thickness of the protective tape). Then, when the calculated value reaches a desired value, the grinding feed mechanism 40 raises the grinding mechanism 30 to end the grinding.

During the grinding process until the thickness of the wafer 100 reaches a desired value, the stepped portion 103 shown in FIG. Before the stepped portion 103 is completely ground and disappears, part of it becomes scraps and separates from the wafer 100, so the scraps fall to the outer peripheral side of the holding surface 210. The scraps then fall into the annular groove 70.

During grinding, water is supplied to the water nozzle 75 from the water source 76 and is injected from the injection ports 751 and 752, and the bottom surface 71 of the annular groove 70 is sloped downward toward the outlet 73. Therefore, due to the water flow and the slope, the scraps flow along the circumferential direction of the annular groove 70 and are guided to the outlet 73. Note that by intermittently jetting water from the jet ports 751 and 752 of the water nozzle 75 to form waves in the annular groove 70, the scraps can be effectively guided to the outlet 73. .

The scraps led to the outlet 73 pass through the inlet 743 of the collection section 74, descend on the bottom surface 741, flow into the connection port 744, and flow into the discharge lane 82. In the discharge lane 82, at one location on the side of the outlet 81, the scraps flowing into the discharge lane 82 from the gap formed between the lane skewer blades 824 shown in FIG. Scraps of leftover materials accumulate. When the scraps accumulate at one end of the discharge lane 82 in this way, the scraps are stored in the storage container 83 by the scraping unit 84 in the following manner.

During grinding of the wafer 100, as shown in FIG. 6, in the scraping unit 84, the air cylinder 843 moves the rod 845 back toward the air cylinder 843. In this state, the angle changing mechanism 85 causes the piston 852 to retreat and descend using the air cylinder 853. Then, the scraping unit 84 rotates about the fulcrum 854, and the tip of the rod 845 rises as shown in FIG. Next, in this state, the air cylinder 843 that constitutes the scraping unit 84 moves the rod 845 forward. Then, as shown in FIG. 5, when the scraping skewer blade 848 that constitutes the scraping section 846 passes over the lane skewer blade 824, the air cylinder 853 that constitutes the angle changing mechanism 85 opens as shown in FIG. The piston 852 is advanced and raised. Then, the scraping unit 84 is tilted about the fulcrum 854, the tip of the rod 845 is lowered as shown in FIG. Located at the scraping start position. Note that in FIG. 8, illustration of the rod 845 is omitted.

Next, when the air cylinder 843 moves the rod 845 backward, the scraping skewer blade 848 passes between the lane skewer blades 824 as shown in FIG. As it goes, the scraps caught on the scraping skewer blade 848 move obliquely upward on the bottom surface 823. Then, as shown in FIG. 11, when the scraping skewer blade 848 moves the scraps 104 to the branch path 821, the scraps 104 fall into the container 83 via the branch path 821. Note that in FIG. 9, illustration of the rod 845 is omitted.

In this way, even when the wafer 100 is being ground, the scraps collected on the exit 81 side of the discharge lane 82 are discharged from the processing chamber by the discharge mechanism 80 without stopping the grinding. Then, the scraps can be collected in the container 83 and disposed of. Moreover, since the scraps can be smoothly discharged, rotation of the chuck table 20 can be prevented from being hindered.
The scraping operation described above may be performed each time one wafer 100 is ground, or may be performed when a preset number of wafers are ground.
Further, when the chuck table 20 is moved by the moving mechanism 50, a scraping operation may be performed.
Further, the wafer 100 is ground in the state shown in FIGS. 4 and 8, and after the grinding of the wafer 100 is finished, the scraping skewer blade 848 is moved diagonally upward as shown in FIGS. 6 and 11 in order to scrape out the scraps. , the scraps are stored in the container 83. As a result, the lane skewer blade 824 and the scraping skewer blade 848 are in an engaged state during grinding, making it difficult for scraps to pass through.

(Modified example of ejection mechanism)
Note that the ejection mechanism 80a shown in FIGS. 12 and 13 may be used instead of the ejection mechanism 80 shown in FIGS. 4 to 11. This discharge mechanism 80a includes a discharge lane 86 and a container 87 that accommodates the scraps discharged from the discharge lane 86.

The discharge lane 86 is located at the carry-out port 81 and includes a receiving port 861 that receives the scraps from 744 of the collection section 74 and a discharge port 862 that discharges the scraps that have flowed within the discharge lane 86 . The discharge lane 86 has a slope that descends from the receiving port 861 to the discharge port 862.

The container 87 includes an outer box 871 and an inner box 872 accommodated in the outer box 871. The outer box 871 has an opening 874 at the top for taking the inner box 872 in and out. On the other hand, the inner box 872 has an opening 875 at the top that serves as an entrance for the scraps. In addition, the inner box 872 includes a net portion 873 at its bottom. The net portion 873 has holes large enough to prevent scraps from passing through.

In the discharge mechanism 80 configured in this manner, the scraps that have reached the connection port 744 of the collection section 74 flow directly through the discharge lane 86 and are stored inside the inner box 872 . By lifting only the inner box 872, the water collected in the container 87 remains in the outer box 871, and the scraps stored in the inner box 872 can be collected and disposed of by draining the water. Note that the container 87 shown in FIGS. 12 and 13 may be used instead of the container 83 shown in FIGS. 4, 5, 10, and 11.

The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the claims and the technical idea described in the specification and drawings.

1: Grinding device
10: Base, 11: Recess, 12: Side wall, 13: Processing position, 14: Carrying in/out position 20: Chuck table, 21: Suction member, 210: Holding surface 22: Frame, 23: Chuck shaft, 24: Base member , 25: Holding surface inclination adjustment mechanism 26: Cover, 27: Bellows 30: Grinding mechanism, 31: Spindle, 32: Housing, 33: Motor, 34: Mount, 35: Grinding wheel, 351: Base, 352: Grinding wheel 40 : Grinding feed mechanism, 41: Ball screw, 42: Guide rail, 43: Motor,
44: Elevating plate, 45: Holder 50: Moving mechanism, 51: Ball screw, 52: Guide rail, 53: Motor,
54: slider 60: thickness measuring device, 61: first gauge, 62: second gauge 70: annular groove, 71: bottom surface, 72: outer peripheral wall, 73: outlet,
74: Collection part, 741: Bottom surface, 742: Side wall, 743: Inlet, 744: Connection port 75: Water nozzle, 751: Spray port, 752: Spray port 76: Water source 80: Discharge mechanism, 80a: Discharge mechanism, 81: Exit port 82: Discharge lane, 821: Branch path, 822: Opening, 823: Bottom surface,
824: lane skewer blade 83: container, 831: opening 84: scraping unit 841: scraping member, 842: scraping drive unit, 843: air cylinder,
844: Piston, 845: Rod, 846: Scraping part, 847: Support rod,
848: scraping skewer blade 85: angle changing mechanism 851: bracket, 852: piston, 853: air cylinder, 854: fulcrum 86: discharge lane, 861: receiving port, 862: discharge port 87: container, 871: outer box, 872: Inner box, 873: Net portion, 874: Opening portion 875: Opening portion 90: Chuck table, 91: Spindle, 92: Cutting blade 100: Wafer, 101: Front surface, 102: Back surface, 103: Step portion, 104: End material

Claims (4)

A grinding device comprising a chuck table that holds a wafer by a holding surface, a grinding mechanism that uses a grindstone to grind the wafer held on the holding surface, and a movement mechanism that moves the chuck table to a processing position by the grindstone,
an annular groove movable together with the chuck table by the moving mechanism, rotatably surrounding the chuck table, and having a concave cross section with an open top; an outlet formed in a portion of the outer peripheral wall of the annular groove; and the moving mechanism. a collecting section having an entrance corresponding to the outlet of the annular groove positioned at the processing position and collecting the scraps in one place; and discharging the scraps collected in the collecting section out of the processing chamber. A grinding device comprising a discharge mechanism. The ejecting mechanism includes an ejection port opening in a side wall of the processing chamber, an ejection lane extending through the ejection port and connected at one end to the collection section, and an ejection lane at the other end of the ejection lane. The grinding device according to claim 1, further comprising a container for arranging and accommodating the scraps. The bottom surface of the annular groove is inclined so that the outlet is the lowest,
The grinding device according to claim 1, further comprising a water nozzle disposed in a high portion of the annular groove to form a water stream toward the outlet. The discharge lane is arranged so that one end side inside the processing chamber is low and the other end side is high,
A skewer blade or brush is erected at one end of the discharge lane,
2. The grinding device according to claim 1, further comprising a scraping unit that moves the scraps collected at one location of the collection section along the discharge lane and scrapes out the scraps collected at one end of the discharge lane.

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