JP2023175097A - Method of producing electrocast member, method of producing electrocast pipe, and electrocasting device - Google Patents

Abstract

To prevent the irregularity from occurring on the inner peripheral surface of an electrocast layer present in an electrocast member and in an electrocast pipe.SOLUTION: The method of producing an electrocast member, comprises a step of forming an electrocast layer on the circumference of wire, a step of detecting at least one of the abnormal parts each present on the wire and the electrocast layer, and a step of applying a predetermined treatment to the abnormal part.SELECTED DRAWING: Figure 2

Description

The present invention relates to a method for manufacturing an electroformed member, a method for manufacturing an electroformed tube, and an electroforming apparatus.

In recent years, various methods for manufacturing electroformed parts and tubes have been developed. By forming an electroformed layer around the wire, an electroformed member including the wire and the electroformed layer is manufactured. An electroformed tube is manufactured by removing the wire from the electroformed member. Electroformed tubes are used, for example, as probes for testing objects to be tested, such as integrated circuits (ICs). For example, in the method described in Patent Document 1, a nickel layer is formed by electroforming around a stainless steel wire coated with gold plating. Next, by pulling at least one end of the wire, the cross-sectional area of the wire is reduced. As a result, a gap is formed between the outer circumferential surface of the wire and the inner circumferential surface of the nickel layer. Next, the wire is removed by pulling the wire with the gap formed.

Japanese Patent Application Publication No. 2004-115838

In the production of electroformed members and electroformed pipes, an electroformed layer is sometimes formed around the wire in a state where the wire has abnormal parts such as scratches. However, in this case, abnormal portions of the wire may be transferred to the electroformed layer. When an abnormal portion of the wire is transferred to the electroformed layer, unevenness may be formed in the portion of the electroformed layer where the abnormal portion is transferred. Furthermore, if the wire is removed from the electroformed member with the unevenness formed therein, there is a risk that the inner circumferential surface of the electroformed layer will be damaged. If a probe is manufactured using an electroformed tube having such an electroformed layer as a component, the sliding properties between the inner peripheral surface of the probe and the internal parts of the probe may deteriorate, or the durability of the probe or the internal parts of the probe may be poor. There is a possibility that Therefore, it is required to suppress irregularities on the inner circumferential surface of the electroformed layer in electroformed members and electroformed pipes.

One example of the object of the present invention is to suppress irregularities on the inner circumferential surface of an electroformed layer in an electroformed member and an electroformed pipe. Other objects of the invention will become apparent from the description herein.

One aspect of the present invention is
a step of forming an electroformed layer around the wire;
detecting an abnormality in at least one of the wire rod and the electroformed layer;
performing a predetermined treatment on the abnormal part;
A method for manufacturing an electroformed member, comprising:

One aspect of the present invention is
A method for manufacturing the above-mentioned electroformed member,
removing the wire from the electroformed layer;
A method for manufacturing an electroformed tube, comprising:

One aspect of the present invention is
an electroforming tank in which an electroforming layer is formed around the wire;
a detection unit that detects an abnormality in at least one of the wire rod and the electroformed layer;
a processing unit that performs predetermined processing on the abnormal portion;
This is an electroforming device equipped with.

According to the above aspect of the present invention, it is possible to suppress unevenness on the inner circumferential surface of the electroformed layer in the electroformed member and the electroformed pipe.

1 is a flowchart showing a method for manufacturing an electroformed pipe according to Embodiment 1. FIG. 1 is a front view of an electroforming apparatus according to Embodiment 1. FIG. 1 is a diagram for explaining a method for manufacturing an electroformed pipe according to Embodiment 1. FIG. 1 is a diagram for explaining a method for manufacturing an electroformed pipe according to Embodiment 1. FIG. 1 is a diagram for explaining a method for manufacturing an electroformed pipe according to Embodiment 1. FIG. FIG. 2 is a top view showing an example of an abnormal portion existing in the wire according to Embodiment 1. FIG. 7 is a diagram showing an electroformed layer formed on the AA′ cross section of FIG. 6. FIG. 7 is a diagram showing an electroformed layer formed on the BB′ cross section of FIG. 6. FIG. FIG. 3 is a front view of an electroforming apparatus according to a second embodiment. 7 is a front view of an inspection tank according to modification 1. FIG. FIG. 7 is a diagram for explaining the arrangement of a plurality of sensors according to Modification 2. FIG. FIG. 7 is a diagram for explaining the arrangement of a plurality of sensors according to Modification 2. FIG. FIG. 7 is a diagram for explaining a method of assigning an identifier to a wire according to modification example 3;

Embodiments and modifications of the present invention will be described below with reference to the drawings. In all the drawings, similar components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

FIG. 1 is a flowchart showing a method for manufacturing an electroformed tube according to a first embodiment. FIG. 2 is a front view of the electroforming apparatus 1A according to the first embodiment. 3 to 5 are diagrams for explaining the method for manufacturing an electroformed tube according to the first embodiment. FIG. 6 is a top view showing an example of an abnormal portion existing in the wire 100A according to the first embodiment. FIG. 7 is a diagram showing the electroformed layer 200A formed on the AA' cross section of FIG. FIG. 8 is a diagram showing the electroformed layer 200A formed on the BB' cross section of FIG.

The electroformed tube according to the embodiment can be used, for example, as a probe for testing an object to be tested such as an IC. Hereinafter, the method for manufacturing an electroformed tube according to Embodiment 1 will be simply referred to as the method according to Embodiment 1.

To explain the directions, an X direction, a Y direction, and a Z direction will be defined. The Z direction is a direction parallel to the vertical direction. The X direction is one of the horizontal directions perpendicular to the Z direction. The Y direction is one of the horizontal directions perpendicular to the Z direction and the X direction. The direction indicated by the arrow in the X direction is defined as the right direction of the electroforming apparatus 1A. The direction indicated by the Y-direction arrow is defined as the rear direction of the electroforming apparatus 1A. The direction indicated by the Z-direction arrow is defined as the upward direction of the electroforming apparatus 1A. A white circle with an X indicating the X direction, Y direction, or Z direction indicates that the direction indicated by the arrow in the direction indicated by the white circle is the direction from the front to the back of the page. A white circle with a black dot indicating the X direction, Y direction, or Z direction indicates that the direction indicated by the arrow in the direction indicated by the white circle is the direction from the back of the page to the front.

The method according to the first embodiment will be described with reference to FIGS. 1 and 2 and, if necessary, FIGS. 3 to 8. In the method according to the first embodiment, first, an electroformed member 300A is manufactured in an electroforming apparatus 1A through an abnormal portion detection step S1A to an abnormal portion removal step S8A. Next, an electroformed pipe is manufactured from the electroformed member 300A through a wire rod removal step S9A and an electroformed layer cutting step S10A.

The electroforming apparatus 1A according to the first embodiment includes a delivery reel 12A, a tension jig 14A, a conveyance roller 16A, an inspection tank 20A, a probe 22A, a control section 24A, a degreasing tank 31A, a first cleaning tank 32A, and an electroforming system. It includes a tank 33A, a second cleaning tank 34A, a drying tank 35A, a marker 40A, and four marker auxiliary rollers 42A. The electroforming apparatus 1A according to the embodiment includes a path 2A along which the wire 100A is conveyed. Path 2A is located between delivery reel 12A and tension jig 14A. The conveyance roller 16A, the inspection tank 20A, the probe 22A, the degreasing tank 31A, the first cleaning tank 32A, the electroforming tank 33A, the second cleaning tank 34A, the drying tank 35A, the marker 40A, and the four marker auxiliary rollers 42A are connected to the path. It is located at 2A.

In the method according to the first embodiment, the wire rod 100A is sent from the delivery reel 12A toward the tensioning jig 14A. The left end portion of the wire 100A is wound around a delivery reel 12A. The right end portion of the wire 100A is stretched by a tensioning jig 14A. The wire 100A has conductivity. The wire 100A is made of stainless steel, for example. However, the wire 100A may be made of a material different from stainless steel. For example, the wire 100A may be made of iron, copper, gold, silver, brass, nickel, aluminum, carbon, plastic, resin, or the like. The cross section of the wire 100A perpendicular to the X direction has a substantially circular shape. The diameter of the wire 100A perpendicular to the X direction is, for example, 10 μm or more and 500 μm or less. When viewed from the X direction, the outer peripheral surface of the wire 100A may be covered with metal.

In the method according to the first embodiment, first, an abnormality detection step S1A is performed. In the abnormality detecting step S1A, the wire 100A is sent out from the delivery reel 12A and then sent to the inspection tank 20A. As shown in FIG. 6, the wire 100A may have an abnormal part such as a flaw 102A. In the example shown in FIG. 6, two flaws 102A exist as abnormal parts on the upper surface of the wire 100A. The scratch 102A on the left side of FIG. 6 extends substantially parallel to the X direction. The scratch 102A on the right side of FIG. 6 extends substantially parallel to the Y direction. In the method according to the first embodiment, an abnormal portion of the wire 100A is detected by an ultrasonic flaw detection test using the inspection tank 20A, the probe 22A, and the control unit 24A. The ultrasonic flaw detection test in Embodiment 1 is as follows.

Water 20A1 is stored in the inspection tank 20A. The wire 100A is moving inside the inspection tank 20A from the left to the right while being impregnated with the water 20A1. The probe 22A is impregnated with water 20A1. In the example shown in FIG. 2, the probe 22A is placed above the wire 100A and spaced apart from the wire 100A. However, the position where the probe 22A is arranged is not limited to this example. The probe 22A transmits ultrasonic waves toward the wire 100A and receives ultrasonic waves reflected by the wire 100A. In the method according to the first embodiment, the wire 100A and the probe 22A are impregnated with water 20A1. Therefore, it is not necessary to bring the probe 22A into contact with the wire 100A. However, the probe 22A may be brought into contact with the wire 100A. The wire 100A and the probe 22A do not need to be impregnated with the water 20A1. For example, the wire 100A and the probe 22A may be placed in the air. In this case, the probe 22A may be brought into contact with the wire 100A.

The control unit 24A controls the operation of the probe 22A. The control unit 24A is, for example, a computer such as a personal computer or a microcomputer. When an abnormality such as a flaw 102A exists in the wire 100A, the ultrasound transmitted from the probe 22A generates a reflected wave due to the abnormality in the wire 100A. The probe 22A receives the reflected wave caused by the abnormal part of the wire 100A. The control unit 24A can detect the presence or absence of an abnormal part in the wire 100A, and the characteristics such as the position, size, range, etc. of the abnormal part in the wire 100A, based on the reflected wave received by the probe 22A. .

In the first embodiment, the probe 22A is fixed inside the inspection tank 20A. On the other hand, the wire 100A is moving from the left to the right inside the inspection tank 20A. While the wire 100A is moving from the left to the right inside the inspection tank 20A, the control unit 24A can operate the probe 22A. This allows the probe 22A to scan the wire 100A in the X direction.

In the ultrasonic flaw detection test in the first embodiment, abnormal portions such as the flaw 102A of the wire 100A can be detected by non-destructive testing. Therefore, the electroformed layer 200A can be formed as described later even at the location where the ultrasonic flaw detection test of the wire 100A has been performed. Therefore, in the ultrasonic flaw detection test in Embodiment 1, productivity of the electroformed member 300A and the electroformed pipe can be improved.

The ultrasonic flaw detection test of the abnormal part of the wire 100A is not limited to the above-mentioned example. Further, the control unit 24A may control not only the operation of the probe 22A but also the operation of at least one step in the flowchart shown in FIG. 1 of the electroforming apparatus 1A. For example, a program that executes the operation of at least one step in the flowchart shown in FIG. 1 is stored in a storage unit (not shown). The operation of the electroforming apparatus 1A is controlled by the control unit 24A acting as a computer and executing the program.

Next, a degreasing step S2A is performed. In the degreasing step S2A, the wire 100A passes through the inspection tank 20A and then is sent to the degreasing tank 31A. A degreasing liquid 31A1 is stored in the degreasing tank 31A. The wire 100A passes through the inside of the degreasing tank 31A while being impregnated with the degreasing liquid 31A1. Thereby, deposits such as oil and dirt present on the outer peripheral surface of the wire 100A can be removed. When deposits are present on the outer peripheral surface of the wire 100A, it may be difficult to form the electroformed layer 200A shown in FIG. 3, FIG. 7, or FIG. 8 on the outer peripheral surface of the wire 100A in the electroforming bath 33A. Therefore, by removing the deposit from the outer peripheral surface of the wire 100A, a homogeneous electroformed layer 200A can be formed on the outer peripheral surface of the wire 100A.

Next, a first cleaning step S3A is performed. In the first cleaning step S3A, the wire 100A is sent to the first cleaning tank 32A after passing through the degreasing tank 31A. A first cleaning liquid 32A1 is stored in the first cleaning tank 32A. The wire 100A passes through the first cleaning tank 32A while being impregnated with the first cleaning liquid 32A1. As a result, the outer peripheral surface of the wire 100A is cleaned by the first cleaning liquid 32A1.

Next, electroforming step S4A is performed. In the electroforming process S4A, the wire 100A is sent to the electroforming tank 33A after passing through the first cleaning tank 32A. An electroforming liquid 33A1 is stored in the electroforming tank 33A. The wire 100A passes through the electroforming tank 33A while being impregnated with the electroforming liquid 33A1. The electroforming liquid 33A1 is impregnated with an anode (not shown). The wire 100A and the electroforming liquid 33A1 are electrically connected to a power source (not shown). This allows the wire 100A to operate as a cathode. As the wire 100A operates as a cathode, as shown in FIG. 3, an electroformed layer 200A is formed around the wire 100A. The electroformed layer 200A is made of, for example, metals such as nickel, gold, copper, palladium, rhodium, platinum, and silver, or alloys thereof. The thickness of the electroformed layer 200A perpendicular to the X direction is, for example, 5 μm or more and 100 μm or less. The type of electroforming liquid 33A1 is determined by predetermined conditions such as the material of the electroforming layer 200A. The electroforming liquid 33A1 includes, for example, a nickel sulfate solution or a nickel sulfamate solution, and also includes a brightening agent and a bit prevention agent as necessary.

As shown in FIGS. 7 and 8, when the wire 100A has the scratches 102A shown in FIG. 6, the scratches 102A on the wire 100A may be transferred to the electroformed layer 200A. Therefore, unevenness may be formed in the portion where the scratches 102A on the inner circumferential surface of the electroformed layer 200A are transferred. In the example shown in FIGS. 7 and 8, two convex portions 202A are formed as abnormal portions on the inner peripheral surface of the upper portion of the electroformed layer 200A. The convex portion 202A on the left side of FIG. 7 extends substantially parallel to the X direction in the same manner as the flaw 102A on the left side of FIG. The convex portion 202A on the right side of FIG. 7 extends substantially parallel to the Y direction in the same manner as the scratch 102A on the right side of FIG. In the example shown in FIGS. 7 and 8, two recesses 204A are formed as abnormal portions on the outer peripheral surface of the upper part of the electroformed layer 200A. The recess 204A on the left side of FIG. 7 extends substantially parallel to the X direction, similar to the scratch 102A on the left side of FIG. The recess 204A on the right side of FIG. 7 extends substantially parallel to the Y direction, similar to the scratch 102A on the right side of FIG.

Next, a second cleaning step S5A is performed. In the second cleaning step S5A, the wire 100A is sent to the second cleaning tank 34A after passing through the electroforming tank 33A. A second cleaning liquid 34A1 is stored in the second cleaning tank 34A. The wire 100A passes through the second cleaning tank 34A while being impregnated with the second cleaning liquid 34A1. As a result, the electroformed layer 200A formed on the outer peripheral surface of the wire 100A is cleaned.

In the first embodiment, one electroforming tank 33A and one second cleaning tank 34A are provided. As a result, a single electroformed layer 200A is formed. However, the electroformed layer 200A may have multiple layers. Further, the number of electroforming tanks 33A and second cleaning tanks 34A may vary depending on the number of layers included in the electroforming layer 200A. For example, when the electroformed layer 200A includes two layers of different materials, the two electroforming tanks 33A and the two second cleaning tanks 34A may be arranged alternately in the X direction.

A predetermined sacrificial layer may be provided between the outer peripheral surface of the wire 100A and the inner peripheral surface of the electroformed layer 200A. The sacrificial layer is removed, for example, by etching before removing the wire 100A from the electroformed layer 200A. Thereby, a gap can be formed between the outer peripheral surface of the wire 100A and the inner peripheral surface of the electroformed layer 200A. Therefore, the wire 100A can be more easily removed from the electroformed layer 200A than in the case where the gap does not exist.

Next, a drying step S6A is performed. In the drying step S6A, the wire 100A and the electroformed layer 200A are sent to the drying tank 35A after passing through the second cleaning tank 34A. The wire 100A and the electroformed layer 200A are dried in the drying tank 35A. This makes it possible to remove the second cleaning liquid 34A1 that adheres to the outer peripheral surface of the electroformed layer 200A when the wire 100A and the electroformed layer 200A pass through the second cleaning tank 34A.

Next, an identifier assigning step S7A is performed. In the identifier provision step S7A, the wire 100A and the electroformed layer 200A pass through the drying tank 35A, and then are sent below the marker 40A via the conveyance roller 16A. The marker 40A refers to the detection result of the abnormal part such as the flaw 102A of the wire 100A by the control unit 24A, and gives an identifier to the abnormal part of at least one of the wire 100A and the electroformed layer 200A. Therefore, the user of the electroforming apparatus 1A can determine the presence, location, size, and range of abnormalities in at least one of the wire 100A and the electroformed layer 200A based on the identifier given to the wire 100A and the electroformed layer 200A. It is possible to obtain information regarding an abnormality in at least one of the wire rod 100A and the electroformed layer 200A. Examples of methods for providing the identifier include laser irradiation, paint application, and the like. In this example, the identifier is, for example, a portion of at least one of the wire rod 100A and the electroformed layer 200A that is irradiated with a laser or a portion that is coated with paint.

A pair of marker auxiliary rollers 42A is arranged to the left of the marker 40A. A pair of marker auxiliary rollers 42A on the left side of the marker 40A are arranged above and below the wire 100A. Another pair of marker auxiliary rollers 42A are arranged to the right of the marker 40A. Another pair of marker auxiliary rollers 42A to the right of the marker 40A are arranged above and below the wire 100A. The marker auxiliary roller 42A allows the center of the wire 100A in the Y direction to be aligned with the center of the marker 40A in the Y direction. Therefore, the marker 40A can provide an identifier to at least one of the wire 100A and the electroformed layer 200A. However, these marker auxiliary rollers 42A may not be provided.

Next, an abnormal part removal step S8A is performed. In the abnormal part removal step S8A, the portion of the electroformed member 300A including the wire 100A and the electroformed layer 200A to which the identifier is attached is removed. Specifically, the portion of the electroformed member 300A that has passed below the marker 40A is pulled by the tension jig 14A, and the portion of the electroformed member 300A is removed. As a result, abnormal portions such as the flaws 102A shown in FIG. 6 of the wire 100A and abnormal portions such as the convex portions 202A and the recessed portions 204A shown in FIGS. 7 and 8 of the electroformed layer 200A are removed. The method for removing the abnormal portion of the electroformed member 300A is not particularly limited. For example, the electroformed member 300A may be cut so that the abnormal portion of the electroformed member 300A is separated from the periphery of the abnormal portion of the electroformed member 300A.

Note that the abnormal portion removal step S8A may be performed at a location different from the electroforming apparatus 1A. In this case, for example, in the electroforming apparatus 1A, a predetermined length of the right end of the electroformed member 300A is cut out while the right end of the electroformed member 300A is pulled by the tension jig 14A. Next, at a location different from the electroforming device 1A, the portion to which the identifier of the cut-out portion of the electroforming member 300A is attached is removed.

Next, a wire removal step S9A is performed. In the wire rod removal step S9A, as shown in FIG. 4, the wire rod 100A is removed from the electroformed member 300A. For example, the wire 100A may be pulled out from the electroformed layer 200A by pulling at least one of both ends of the wire 100A. However, the method for removing the wire 100A is not limited to this example. In the method according to Embodiment 1, abnormal parts such as the flaw 102A shown in FIG. 6 of the wire 100A and abnormal parts such as the convex part 202A and the recessed part 204A shown in FIGS. 7 and 8 of the electroformed layer 200A are It is removed before removing the wire rod 100A from the cast layer 200A. If the wire 100A is removed from the electroformed layer 200A with these abnormal parts remaining, there is a risk that the inner peripheral surface of the electroformed tube manufactured from the electroformed layer 200A will be damaged. If a probe is manufactured using such an electroformed tube as a component, there is a possibility that the slidability between the inner peripheral surface of the probe and the internal parts of the probe will be poor, or the durability of the probe or the internal parts of the probe will be deteriorated. be. On the other hand, in the method according to the first embodiment, when removing the wire rod 100A from the electroformed layer 200A, it is possible to prevent the above-described abnormal portion from remaining. Therefore, in the method according to the first embodiment, it is possible to suppress unevenness on the inner circumferential surface of the electroformed layer 200A in the electroformed member 300A and the electroformed tube.

Next, an electroformed layer cutting step S10A is performed. In the electroformed layer cutting step S10A, as shown in FIG. 5, the electroformed layer 200A is cut into a plurality of pieces P. Each cut out P piece becomes an electroformed pipe. In this way, the electroformed tube according to the embodiment is manufactured.

The method for manufacturing an electroformed pipe is not limited to the method according to the first embodiment.

For example, in the method according to the first embodiment, before the electroforming layer 200A is formed on the outer peripheral surface of the wire 100A in the electroforming tank 33A, an abnormal part such as a flaw 102A on the wire 100A is detected in the inspection tank 20A. . However, the abnormal portion of the wire 100A may be detected after the electroformed layer 200A is formed on the outer peripheral surface of the wire 100A. For example, when a flaw 102A shown in FIG. 6 exists on the outer circumferential surface of the wire 100A, a recess 204A may be formed on the outer circumferential surface of the electroformed layer 200A, as shown in FIGS. 7 and 8. Therefore, even after the electroformed layer 200A is formed on the outer peripheral surface of the wire 100A, an abnormal part of the wire 100A can be detected by detecting the recess 204A on the outer peripheral surface of the electroformed layer 200A.

In the method according to the first embodiment, the processing of the abnormal portion of the wire 100A includes adding an identifier to the abnormal portion of the wire 100A and removing the abnormal portion of the wire 100A. However, the processing performed on the abnormal portion of the wire 100A is not limited to these. Further, the processing performed on the abnormal portion of the wire 100A may be only one of adding an identifier to the abnormal portion of the wire 100A and removing the abnormal portion of the wire 100A.

FIG. 9 is a front view of an electroforming apparatus 1B according to the second embodiment. The electroforming apparatus 1B according to the second embodiment is the same as the electroforming apparatus 1A according to the first embodiment except for the following points. Hereinafter, the method for manufacturing an electroformed tube according to the second embodiment will be simply referred to as the method according to the second embodiment.

The electroforming apparatus 1B according to the second embodiment includes a delivery reel 12B, a tension jig 14B, a conveyance roller 16B, a sensor 22B, a control section 24B, four sensor auxiliary rollers 26B, a degreasing tank 31B, a first cleaning tank 32B, and an electric It includes a casting tank 33B, a second cleaning tank 34B, a drying tank 35B, a marker 40B, and four marker auxiliary rollers 42B. A degreasing liquid 31B1 is stored in the degreasing tank 31B. A first cleaning liquid 32B1 is stored in the first cleaning tank 32B. An electroforming liquid 33B1 is stored in the electroforming tank 33B. A second cleaning liquid 34B1 is stored in the second cleaning tank 34B. The electroforming apparatus 1B according to the second embodiment includes a path 2B along which the wire rod 100B is conveyed. Path 2B is located between delivery reel 12B and tension jig 14B. The conveyance roller 16B, the sensor 22B, the four sensor auxiliary rollers 26B, the degreasing tank 31B, the first cleaning tank 32B, the electroforming tank 33B, the second cleaning tank 34B, the drying tank 35B, the marker 40B, and the four marker auxiliary rollers 42B are: It is located on route 2B.

In the method according to the second embodiment, first, the wire 100B is sent out from the delivery reel 12B and then sent below the sensor 22B. The sensor 22B detects abnormalities in the wire 100B, such as scratches on the outer peripheral surface of the wire 100B, through non-destructive testing. Therefore, in the same manner as in the method according to the first embodiment, the electroformed layer 200B can be formed even at a location where the wire rod 100B has been subjected to a non-destructive inspection. Therefore, in the method according to the second embodiment, productivity of the electroformed member 300B and the electroformed pipe can be improved. Note that the position where the sensor 22B is arranged is not limited to the example shown in FIG. 9. For example, the sensor 22B may be placed below the wire 100B.

A pair of sensor auxiliary rollers 26B is arranged to the left of the sensor 22B. A pair of sensor auxiliary rollers 26B on the left side of the sensor 22B are arranged above and below the wire 100B. Another pair of sensor auxiliary rollers 26B are arranged to the right of the sensor 22B. Another pair of sensor auxiliary rollers 26B to the right of the sensor 22B are arranged above and below the wire 100B. The sensor auxiliary roller 26B allows the center of the wire 100B in the Y direction to be aligned with the center of the sensor 22B in the Y direction. For example, the control unit 24B may recognize the position of the wire 100B by object recognition from an image of the wire 100B. In this example, the control unit 24B can align the center of the wire 100B in the Y direction with the center of the sensor 22B in the Y direction using the sensor auxiliary roller 26B, based on the recognition result of the position of the wire 100B. However, the sensor auxiliary roller 26B may not be provided.

Examples of the non-destructive inspection using the sensor 22B include a laser flaw detection test, a visual inspection, an eddy current flaw detection test, and the like. In these non-destructive tests of the method according to the second embodiment, abnormalities on the surface of the wire 100B, such as scratches on the surface of the wire 100B, are detected in comparison with the ultrasonic flaw detection test of the method according to the first embodiment. It can be made easier. Furthermore, in these non-destructive tests using the method according to the second embodiment, there is no need to impregnate the wire 100B in water, compared to the ultrasonic flaw detection test using the method according to the first embodiment. Therefore, in the method according to the second embodiment, compared to the method according to the first embodiment, the cost can be reduced by the amount of the test tank in which the wire rod 100B is impregnated.

In the laser flaw detection test of the method according to the second embodiment, the wire 100B is irradiated with a laser from a light source (not shown). In this example, the sensor 22B is a shape measuring element that measures the shape of the surface of the laser irradiated portion of the wire 100B. The control unit 24B detects the presence or absence of an abnormal portion of the wire 100B, and characteristics such as the position, size, and range of the wire 100B from the surface shape data of the wire 100B measured by the sensor 22B.

In the visual inspection of the method according to the second embodiment, the sensor 22B is, for example, an imaging device such as a CCD (charge coupled device) or a CMOS (complementary metal oxide semiconductor). The control unit 24B detects the presence or absence of an abnormal part of the wire 100B and characteristics such as the position, size, and range of the wire 100B from the image captured by the sensor 22B.

In the eddy current flaw detection test of the method according to the second embodiment, the sensor 22B is a detection coil. The control unit 24B detects the presence or absence of an abnormality in the wire 100B and characteristics such as the position, size, and range of the wire 100B from the current flowing through the sensor 22B.

In the second embodiment, the sensor 22B is fixed. On the other hand, the wire rod 100B is moving from the left to the right. While the wire rod 100B is moving from the left to the right, the control unit 24B can operate the sensor 22B. This allows the sensor 22B to scan the wire 100B in the X direction.

The non-destructive inspection for detecting abnormalities in the wire rod 100B is not limited to the example described above. Furthermore, the non-destructive inspection for detecting abnormalities in the wire rod 100B may be a combination of the above-mentioned examples. In this case, the non-destructive inspection for detecting abnormalities in the wire 100B may include an ultrasonic flaw detection test in the method according to the first embodiment. For example, the non-destructive inspection for detecting abnormalities in the wire 100B may include at least one of an ultrasonic flaw detection test, a laser flaw detection test, a visual inspection, and an eddy current flaw detection test.

Next, in the method according to the second embodiment, in the same manner as the method according to the first embodiment, the wire rod 100B is placed inside the degreasing tank 31B, inside the first cleaning tank 32B, inside the electroforming tank 33B, and in the second cleaning tank. 34B, the inside of the drying tank 35B, and below the marker 40B, and is sent to the tensioning jig 14B. In the electroforming tank 33B according to the second embodiment, an electroforming layer 200B is formed around the wire 100B in the same manner as the electroforming tank 33A according to the first embodiment. Thereby, in the electroforming apparatus 1B according to the second embodiment, the electroformed member 300B is manufactured in the same manner as the electroforming apparatus 1A according to the first embodiment. The subsequent steps of the method according to the second embodiment are similar to the method according to the first embodiment.

Also in the method according to the second embodiment, in the same manner as the method according to the first embodiment, it is possible to prevent the above-described abnormal portion from remaining when removing the wire rod 100B from the electroformed layer 200B. Therefore, in the method according to the second embodiment, unevenness on the inner peripheral surface of the electroformed layer 200B in the electroformed member 300B and the electroformed pipe can be suppressed in the same manner as the method according to the first embodiment.

FIG. 10 is a front view of an inspection tank 20C according to Modification 1. Hereinafter, the method for manufacturing an electroformed tube according to Modification Example 1 will be simply referred to as the method according to Modification Example 1. The method according to Modification 1 is the same as the method according to Embodiment 1 except for the following points.

In the method according to the first modification, detection of an abnormal part of the wire rod 100C in the inspection tank 20C and formation of an electroformed layer in the electroforming tank are not performed continuously. In other words, in the method according to the first modification, the device that detects the abnormal portion of the wire 100C and the device that forms the electroformed layer are independent from each other.

In the method according to modification 1, water 20C1 is stored in the inspection tank 20C. The wire 100C and the probe 22C are impregnated in the water 20C1. The probe 22C transmits ultrasonic waves toward the wire 100C and receives the ultrasonic waves reflected by the wire 100C. In the same manner as the method according to the first embodiment, the control unit 24C according to the first modification detects the presence or absence of an abnormal part in the wire 100C and the characteristics such as the position, size, range, etc. of the wire 100C through an ultrasonic flaw detection test. can do.

In the method according to the first modification, the position of the wire 100C is fixed in the water 20C1. On the other hand, the probe 22C is movable in the X direction within the water 20C1. Therefore, when the control unit 24C moves the probe 22C in the X direction, the probe 22C can scan the wire 100C in the X direction.

Also in the method according to the first modification, as in the method according to the first embodiment, unevenness on the inner circumferential surface of the electroformed layer in the electroformed member and the electroformed pipe can be suppressed.

FIGS. 11 and 12 are diagrams for explaining the arrangement of a plurality of sensors 22D according to Modification 2. FIG. Hereinafter, the method for manufacturing an electroformed pipe according to Modification 2 will be simply referred to as the method according to Modification 2. The method according to Modification 2 is the same as the method according to Embodiment 2 except for the following points.

In the method according to Modification Example 2, in the same manner as in the method according to Modification Example 1, the apparatus for detecting the abnormal part of the wire rod 100D and the apparatus for forming the electroformed layer are independent of each other. There is.

In the method according to the second modification, a plurality of sensors 22D are arranged around the wire 100D when viewed from the X direction. In the example shown in FIG. 12, four sensors 22D are arranged at four locations above, below, in front of, and behind the wire 100D when viewed from the X direction. However, the arrangement of the sensor 22D is not limited to this example. Abnormal portions of the wire 100D can be detected by non-destructive testing such as laser flaw detection, visual inspection, and eddy current flaw detection using these sensors 22D.

In the method according to the second modification, the position of the wire 100D is fixed. On the other hand, the plurality of sensors 22D are movable in the X direction. Therefore, by moving the plurality of sensors 22D in the X direction, the plurality of sensors 22D can scan the wire 100D in the X direction.

Also in the method according to the second modification, as in the method according to the second embodiment, unevenness on the inner circumferential surface of the electroformed layer in the electroformed member and the electroformed pipe can be suppressed.

FIG. 13 is a diagram for explaining a method of assigning an identifier 110E to a wire 100E according to Modification 3.

In modification 3, the wire rod 100E is moved between a position that is a distance X1 to the left from the reference position X0 at the right end of the wire rod 100E and a distance X2 to the left from the reference position X0 at the right end of the wire rod 100E. An abnormal part has been detected. The abnormal portion of the wire 100E is detected, for example, by the method described in Modification 1 or Modification 2. An identifier 110E is assigned between a position of the wire 100E that is a distance X1 to the left from the reference position X0 and a position that is a distance X2 to the left from the reference position X0 of the wire 100E. The portion of the wire 100E to which the identifier 110E is given can be removed before the wire 100E is removed from the electroformed layer. Therefore, similarly to each embodiment, unevenness on the inner peripheral surface of the electroformed layer in the electroformed member and the electroformed pipe can be suppressed.

Although the embodiments and modified examples of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various configurations other than those described above may also be adopted.

For example, the treatment performed on the abnormal portion of at least one of the wire rod and the electroformed layer is not limited to the example described above. For example, the abnormal portion on the outer circumferential surface of the wire may be surface-treated to smooth the abnormal portion on the outer circumferential surface of the wire. When an electroformed layer is formed around the wire after the surface treatment, abnormal portions on the outer peripheral surface of the wire can be prevented from being transferred to the electroformed layer.

According to the present specification, a method for manufacturing an electroformed member, a method for manufacturing an electroformed pipe, and an electroforming apparatus according to the following aspects are provided.
(Aspect 1)
In aspect 1, the method for manufacturing an electroformed member includes the steps of forming an electroformed layer around a wire, detecting an abnormality in at least one of the wire and the electroformed layer, and applying a predetermined amount to the abnormality. and a step of applying the treatment.

According to the above aspect, by subjecting the abnormal part to appropriate processing such as adding an identifier to the abnormal part and removing the abnormal part, it is possible to prevent the abnormal part from remaining when removing the wire from the electroformed layer. can do. Therefore, in the above-described aspect, it is possible to suppress unevenness on the inner circumferential surface of the electroformed layer in the electroformed member and the electroformed pipe.

(Aspect 2)
In aspect 2, in the step of detecting the abnormal portion, the abnormal portion is detected by non-destructive testing.

According to the above aspect, an electroformed member can be manufactured even at a location where at least one of the wire rod and the electroformed layer has been subjected to non-destructive testing. Therefore, in the above-described aspect, productivity of electroformed members and electroformed pipes can be improved.

(Aspect 3)
In aspect 3, the step of subjecting the abnormal portion to the predetermined process includes at least one of assigning an identifier to the abnormal portion and removing the abnormal portion.

According to the above aspect, when an identifier is assigned to an abnormal part, information about the abnormal part, such as the presence or absence of the abnormal part, its position, size, range, etc., can be obtained from the identifier. Moreover, according to the above-mentioned aspect, when the abnormal part is removed, the abnormal part can be removed before removing the wire from the electroformed layer. Therefore, in the above-described aspect, it is possible to suppress unevenness on the inner circumferential surface of the electroformed layer in the electroformed member and the electroformed pipe.

(Aspect 4)
In aspect 4, a method for manufacturing an electroformed tube includes the above-described method for manufacturing an electroformed member, and a step of removing the wire from the electroformed layer.

According to the above aspect, similarly to aspect 1, it is possible to suppress unevenness on the inner circumferential surface of the electroformed layer in the electroformed pipe.

(Aspect 5)
In aspect 5, the electroforming apparatus includes an electroforming tank in which an electroformed layer is formed around the wire, a detection unit that detects an abnormal part in at least one of the wire rod and the electroformed layer, and a predetermined part in the abnormal part. and a processing section that performs processing.

The "detection unit" corresponds to the "probe" and "sensor" in the above-described embodiments and modifications. The "processing unit" corresponds to the "marker" in the embodiment and modification described above.

According to the above aspect, similarly to aspect 1, it is possible to suppress unevenness on the inner circumferential surface of the electroformed layer in the electroformed member and the electroformed layer.

(Aspect 6)
In aspect 6, the detection section detects the abnormal portion by non-destructive testing.

According to the above-mentioned aspect, similarly to the second aspect, an electroformed member can be manufactured even at a location where at least one of the wire rod and the electroformed layer has been subjected to a non-destructive inspection.

(Aspect 7)
In aspect 7, the predetermined process includes at least one of assigning an identifier to the abnormal portion and removing the abnormal portion.

According to the above aspect, similarly to aspect 3, it is possible to suppress unevenness on the inner circumferential surface of the electroformed layer in the electroformed member and the electroformed tube.

1A, 1B Electroforming equipment 2A, 2B Routes 12A, 12B Delivery reels 14A, 14B Tension jigs 16A, 16B Conveyance rollers 20A, 20C Inspection tanks 20A1, 20C1 Water 22A, 22C Probes 22B, 22D Sensors 24A, 24B, 24C Control section 26B Sensor auxiliary rollers 31A, 31B Degreasing tank 31A1, 31B1 Degreasing liquid 32A, 32B First cleaning tank 32A1, 32B1 First cleaning liquid 33A, 33B Electroforming tank 33A1, 33B1 Electroforming liquid 34A, 34B Second cleaning tank 34A1 , 34B1 Second cleaning liquid 35A, 35B Drying tank 40A, 40B Marker 42A, 42B Marker auxiliary roller 100A, 100B, 100C, 100D, 100E Wire 102A Scratch 110E Identifier 200A, 200B Electroformed layer 202A Convex portion 204A Concave portion 300A, 300B Electroforming Member S1A Abnormal part detection process S2A Degreasing process S3A First cleaning process S4A Electroforming process S5A Second cleaning process S6A Drying process S7A Identifier provision process S8A Abnormal part removal process S9A Wire rod removal process S10A Electroformed layer cutting process P Piece

Claims (7)

a step of forming an electroformed layer around the wire;
detecting an abnormality in at least one of the wire rod and the electroformed layer;
performing a predetermined treatment on the abnormal part;
A method for manufacturing an electroformed member, comprising: The method for manufacturing an electroformed member according to claim 1, wherein the step of detecting the abnormal portion detects the abnormal portion by non-destructive testing. Manufacturing the electroformed member according to claim 1, wherein the step of subjecting the abnormal portion to the predetermined treatment includes at least one of adding an identifier to the abnormal portion and removing the abnormal portion. Method. A method for manufacturing an electroformed member according to any one of claims 1 to 3,
removing the wire from the electroformed layer;
A method for manufacturing an electroformed pipe, comprising: an electroforming tank in which an electroforming layer is formed around the wire;
a detection unit that detects an abnormality in at least one of the wire rod and the electroformed layer;
a processing unit that performs predetermined processing on the abnormal portion;
An electroforming device equipped with. The electroforming apparatus according to claim 5, wherein the detection section detects the abnormal portion by non-destructive testing. The electroforming apparatus according to claim 5 or 6, wherein the predetermined process includes at least one of adding an identifier to the abnormal portion and removing the abnormal portion.

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