JP2023172985A - Installation method of chip collection apparatus and coupling tool - Google Patents

Abstract

To provide an installation method of a chip collection apparatus capable of largely reducing an operation time required for installation without an another wide space for assembling a main duct, and provide a coupling tool used for the same.SOLUTION: In installation of a chip collection apparatus which is installed below an operation line formed by arranging a component mounting device 3 mounting a component supplied by a tape feeder to a substrate in one direction, and collects a chip KZ of a carrier tape discharged from the tape feeder via a main duct 31 formed by being serially connected in a direction where a plurality of duct pieces 41 extend on an operation line, the plurality of duct pieces 41 are inserted into below the component mounting device 3, and thereafter, both of adjacent duct pieces 41 inserted into below the component mounting device 3 are connected by a coupling tool (a L-type coupling tool 42 and a flat-type coupling tool).SELECTED DRAWING: Figure 20

Description

The present invention relates to a method for installing a chip collection device for collecting chips of a tape member discharged from a tape feeder, and a connector used therein.

BACKGROUND ART Conventionally, in a component mounting apparatus for mounting components on a board, a chip collection device is known that automatically collects chips of a tape member discharged from a tape feeder serving as a component supply unit (for example, Patent Document 1 below). In Patent Document 1, chips of a tape member cut by a tape cutter fall under their own weight and are received in a subduct (receiving part), and then are transported to a main duct ( be moved to the recovery route). The air is then sent to the air outlet side of the main duct by air discharged from an air discharger provided on the most upstream side of the main duct.

In the conventional chip collection device described above, the main duct has a configuration in which a plurality of duct pieces are connected in series in one direction. When installing a chip collection device below a work line where multiple component mounting devices are lined up in one direction, first, connect multiple duct pieces that correspond to all or part of the main duct in advance. In this state, the subduct is inserted by being pushed in the direction in which the work line extends from the upstream end or downstream end of the work line, and then the subduct is connected to the main duct from the side of the work line.

International Publication No. 2021/131165

However, with the above method, in addition to the space where the work line is installed, a large space is required to assemble the main duct, and it is also necessary to insert the assembled long main duct below the work line. The problem was that the work involved was difficult and took a lot of time.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for installing a chip collection device that does not require a separate large space for assembling a main duct and can significantly shorten the work time required for installation, and a connecting tool used therein. shall be.

In the installation method of the chip collection device of the present invention, a component mounting device for mounting components supplied by a tape feeder onto a board is installed below a work line lined up in one direction, and a plurality of duct pieces are mounted on the work line. A method for installing a chip collecting device that collects chips of a tape member discharged from the tape feeder through a main duct connected in series in the direction in which the line extends, the chip collecting device collecting the chips of the tape member discharged from the tape feeder through a main duct connected in series in the direction in which the line extends, The method includes an insertion step of inserting the duct pieces downward, and a connecting step of connecting adjacent duct pieces among the plurality of duct pieces inserted below the component mounting device in the insertion step using a connecting tool.

The connector of the present invention is installed below a work line in which a component mounting device for mounting components supplied by a tape feeder on a board is arranged in one direction, and a plurality of duct pieces are installed in a direction in which the work line extends. A connector used for assembling a chip collection device for collecting chips of a tape member discharged from the tape feeder through a main duct connected in series to the plurality of tape members inserted below the component mounting device. Of the duct pieces, the two adjacent duct pieces are connected in a state in which they are in contact with the upper surface or side surface of each of the two adjacent duct pieces.

According to the present invention, there is no need for a separate large space for assembling the main duct, and the work time required for installation can be significantly shortened.

A perspective view showing a chip collection device according to an embodiment of the present invention together with a work line of a component mounting device A side view of a component mounting device according to an embodiment of the present invention A sectional view of a part of a component mounting device and a part of a chip collection device in an embodiment of the present invention A perspective view of a chip collection device in an embodiment of the present invention A schematic plan view of a chip collection device in an embodiment of the present invention A perspective view of a part of a chip collection device in an embodiment of the present invention A plan view of a portion of a chip collection device in an embodiment of the present invention (a) (b) Operation explanatory diagrams of an air blower included in a chip collection device in an embodiment of the present invention (a) (b) (c) Diagrams explaining the assembly procedure of the main duct of the chip collection device in one embodiment of the present invention (a) (b) (c) Diagrams explaining the assembly procedure of the main duct of the chip collection device in one embodiment of the present invention (a) (b) (c) Diagrams explaining the assembly procedure of the main duct of the chip collection device in one embodiment of the present invention (a) (b) Perspective views of the second duct piece connected to the first duct piece included in the main duct of the chip collection device in an embodiment of the present invention (a) (b) Operation explanatory diagrams of an air discharger and a check valve included in a chip recovery device according to an embodiment of the present invention (a) Perspective view (b) Side view of a storage section included in a chip collection device according to an embodiment of the present invention (a) (b) (c) Operation explanatory diagram of the chip collection device in one embodiment of the present invention (a) (b) (c) Operation explanatory diagram of the chip collection device in one embodiment of the present invention A perspective view showing another example of the shutter included in the chip collection device according to an embodiment of the present invention A plan view of another example of the shutter included in the chip collection device according to an embodiment of the present invention (a) (b) (c) An explanatory diagram of the operation of the accommodating section included in the chip collection device in an embodiment of the present invention (a) (b) (c) Diagrams explaining the installation procedure of the chip collection device in an embodiment of the present invention (a) (b) (c) Diagrams explaining the installation procedure of the chip collection device in an embodiment of the present invention A schematic plan view of a chip collection device in a modification of an embodiment of the present invention (a) (b) (c) Explanatory diagrams of other examples of the operation of the chip collection device in one embodiment of the present invention (a) (b) (c) Explanatory diagrams of other examples of the operation of the chip collection device in one embodiment of the present invention

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a work line 2 in which a chip collection device 1 according to an embodiment of the present invention is installed. The work line 2 has a configuration in which a plurality of (three in this case) component mounting devices 3 for mounting components onto the board KB are arranged in one direction, and adjacent component mounting devices 3 transfer the board KB to each other. Attach the parts to the board KB. In this embodiment, in the work line 2, the direction in which the board KB is transferred (the left-right direction, the direction in which the component mounting devices 3 are lined up) is the X direction, the horizontal direction (front-back direction) orthogonal to the X direction is the Y direction, and the up-down direction is the Y direction. Let the direction be the Z direction.

In FIG. 2, the component mounting device 3 has a base 11 and a cover member 12 that covers the top of the base 11. A work space 13 covered by a cover member 12 is formed above the base 11 . A substrate transport section 14 is installed on the upper surface of the base 11 and extends in the work space 13 in the X direction. The substrate transport section 14 is composed of a pair of conveyor mechanisms arranged in the Y direction. The substrate transport unit 14 transports the board KB in the X direction and positions the board KB at a predetermined work position within the work space 13 .

In FIG. 2, feeder carts 15 are attached to the front and rear ends of the base 11, respectively. A plurality of tape feeders 16 are attached to each feeder truck 15 in line in the X direction (see also FIG. 1). Each tape feeder 16 takes in a carrier tape 18 as a tape member unreeled from a tape reel 17 held on a feeder cart 15, transports it in the Y direction (direction toward the substrate transport section 14), and stores the carrier tape 18 in the carrier tape 18. Component BH is supplied to component supply position 16K.

In FIG. 2, two mounting heads 21 are provided above the base 11 so as to be movable by a head moving mechanism 22. As shown in FIG. Each mounting head 21 includes a nozzle 21N extending downward. The head moving mechanism 22 is composed of, for example, a Cartesian coordinate robot, and moves the two mounting heads 21 independently within a horizontal plane. Each mounting head 21 picks up the component BH supplied by the tape feeder 16 to the component supply position 16K by adsorbing it to the lower end of the nozzle 21N (FIG. 2).

In FIG. 2 , the component mounting device 3 includes a control device 23 . The control device 23 controls the operations of the substrate transport section 14, tape feeder 16, mounting head 21, head moving mechanism 22, and the like.

When performing component mounting work, the component mounting device 3 first operates the board transport section 14 to receive the board KB from the upstream device and positions it at a work position. After positioning the board KB at the work position, the component mounting device 3 operates the tape feeder 16 to supply the component BH to the component supply position 16K, and operates the head moving mechanism 22 to transfer the component to the mounting head 21. Have them do it repeatedly. In the component transfer work, the mounting head 21 picks up the component BH supplied by the tape feeder 16 and then mounts the component BH onto the board KB.

After each component mounting device 3 mounts the component BH to be mounted on the board KB by repeatedly carrying out the component transfer operation using the mounting head 21, it operates the board transport section 14 to transport the board KB to the downstream side. . As a result, each of the three component mounting devices 3 mounts the component BH on the board KB, and when the component mounting device 3 located on the most downstream side carries out the board KB, the component mounting work on the board KB by the work line 2 ends. do.

Next, the chip collecting device 1 will be explained. First, cutting of the carrier tape 18 will be explained. As shown in FIG. 2, the feeder truck 15 included in each component mounting device 3 includes a tape cutter 24 and a shooter 25. The tape cutter 24 is provided below the tape feeder 16, and cuts the carrier tape 18 after the tape feeder 16 has finished supplying the parts BH. The shooter 25 is provided below the tape cutter 24, as shown in FIG. 3 (an enlarged view of the region RY in FIG. 2). The shooter 25 guides the scraps KZ of the carrier tape 18 cut by the tape cutter 24 and falling under its own weight, and discharges them to the outside of the feeder truck 15 from the discharge opening 25K at the lower end.

In this way, chips KZ of the carrier tape 18 are generated from each component mounting device 3 constituting the work line 2, and the amount of chips KZ of the carrier tape 18 generated in the entire work line 2 is enormous. The chip collection device 1 in this embodiment facilitates the disposal of the chips KZ by automatically collecting the large amount of chips KZ of the carrier tape 18 generated from the work line 2 without manual intervention.

In FIGS. 1, 4, and 5, the chip collection device 1 includes a main duct 31, a plurality of subducts 32, and a storage section 33. The main duct 31 extends below the work line 2 extending in the X direction (specifically, below each of the plurality of component mounting devices 3) in the direction in which the work line 2 extends (X direction), and has an upstream side (one end side). Each has an opening on the downstream side (the other end side). Hereinafter, the air outlet in the main duct 31 will be referred to as an "air outlet 31D."

4 and 5, the main duct 31 is formed by connecting a plurality of duct pieces 41 in one direction (the direction in which the component mounting devices 3 are arranged, which is the X direction). As shown in FIGS. 3 and 6, the duct piece 41 has a hollow shape with a rectangular cross section, and includes an upper wall 41a, a lower wall 41b, and two side walls 41c facing each other in the Y direction.

In FIG. 4, the main duct 31 is formed by combining two types of duct pieces 41: a main duct piece 41M and a sub duct piece 41S which is a duct piece for distance adjustment (adjustment duct piece). The main duct piece 41M has chip entrance openings 41K formed in each of two side walls 41c corresponding to the Y direction. Therefore, a plurality of chip entry openings 41K are provided in the direction in which the main duct 31 extends (X direction).

1, 2, and 4, the plurality of subducts 32 are each installed on the floor surface FL below the feeder truck 15, and each subduct 32 has two subducts 32 facing each other in the front and rear (Y direction) of the main duct 31. It is connected to each of the side walls 41c so as to cover the chip entrance opening 41K (see also FIG. 5). Hereinafter, the subduct 32 located on the front side of the main duct 31 will be referred to as a "first subduct 32A", and the subduct 32 located on the rear side of the main duct 31 will be referred to as a "second subduct 32B" (FIG. 5).

In this embodiment, two first subducts 32A adjacent in the X direction correspond to one front feeder truck 15 included in one component mounting apparatus 3, and two second subducts 32A adjacent in the X direction correspond to one front feeder truck 15 provided in one component mounting apparatus 3. 32B corresponds to one rear feeder cart 15 included in one component mounting apparatus 3 (FIG. 5). Each subduct 32 has a box shape open to the main duct 31 side (FIGS. 6, 7, and 8(a), (b)).

3, FIG. 6, and FIGS. 8(a) and (b), the upper wall of each subduct 32 is provided with a chip receiving opening 32K that opens upward (toward the tape feeder 16 side). The subduct 32 receives the chips KZ of the carrier tape 18 (that is, the chips KZ discharged from the tape feeder 16) that fall under its own weight through the corresponding shooter 25 located directly above, through the chip receiving opening 32K.

In FIGS. 1 and 4, the end of the main duct 31 on the air outlet 31D side extends obliquely upward toward the downstream side, and the end of the end extending obliquely upward becomes a horizontal portion. The air outlet 31D is provided to open at the lower surface of the horizontal portion.

The two adjacent main duct pieces 41M constituting one main duct unit are placed in a state where their ends are butted against each other (FIG. 9(a)→FIG. 9(b)), and the L-shaped connector 42 are connected using . As shown in FIGS. 9(b) and 9(c), the L-shaped connector 42 has a horizontal portion 42a and a vertical portion 42b extending downward from one end of the horizontal portion 42a, and has an L-shape as a whole. are doing. The horizontal portion 42a is a portion that contacts the upper surface of each of the two adjacent main duct pieces 41M (the upper surface of the upper wall 41a), and the vertical portion 42b is a portion that contacts the respective side surfaces of the two adjacent main duct pieces 41M (the upper surface of one side wall 41c). This is the part that touches the outside surface.

In FIG. 9(b), the end of the horizontal part 42a of the L-shaped connector 42 opposite to the side where the vertical part 42b is formed has an end on the side where the vertical part 42b is formed. Two notch grooves 42K extending toward the front are provided. Further, the vertical portion 42b of the L-shaped connector 42 is provided with screw insertion holes 42H arranged in the X direction and passing through the vertical portion 42b in the thickness direction.

In FIGS. 9A, 9B, and 9C, a bolt is provided as a protrusion 43 extending upward on the upper surface of each main duct piece 41M (the upper surface of the upper wall 41a). Moreover, a plurality of screw holes 41H are provided above and below the side wall 41c of each main duct piece 41M (FIG. 9(a)). When the ends of the two main duct pieces 41M are butted against each other, the distance between the two adjacent protrusions 43 in the X direction matches the distance between the two notch grooves 42K provided in the L-shaped connector 42, The distance between two adjacent screw holes 41H in the X direction matches the distance between two screw insertion holes 42H provided in the L-shaped connector 42.

When connecting two main duct pieces 41M with their ends butted against each other using the L-shaped connector 42, the two main duct pieces 41M have two notch grooves 42K provided in the L-shaped connector 42. The L-shaped connector 42 is brought closer to the two main duct pieces 41M from a position facing the two protrusions 43 in the horizontal direction (Y direction) (FIG. 9(b)→FIG. 9(c)). Then, the two notch grooves 42K formed in the L-shaped connector 42 are engaged with the two protrusions 43 of the two main duct pieces 41M from the lateral direction (Y direction), and the L-shaped connector 42 is vertically engaged. The portions 42b are brought into contact with the side surfaces (outer surfaces of the side walls 41c) of the two main duct pieces 41M.

When the vertical part 42b comes into contact with the side surfaces of the two main duct pieces 41M, two screws 44 as fasteners are inserted through the two screw insertion holes 42H provided in the vertical part 42b, and the two main duct pieces 41M are closed. It is screwed into the screw hole 41H provided in the side wall 41c. As a result, the L-shaped connector 42 is fixed to the two main duct pieces 41M, and these two main duct pieces 41M are connected by the L-shaped connector 42 (FIG. 9(c)).

As mentioned above, the two main duct pieces 41M connected in the X direction correspond to one component mounting device 3, and the sub duct piece 41S corresponds to the two connected main duct pieces 41M (for convenience, (referred to as "duct unit").

In FIGS. 10(a) and 10(b), the sub duct piece 41S has an extending portion 41E at one end. The other end of the sub duct piece 41S is the same as the end of the main duct piece 41M, and can be connected to the main duct piece 41M by the aforementioned L-shaped connector 42 and screw 44 (FIG. 10(b)). →Figure 10(c)).

As described above, in this embodiment, the L-shaped connector 42 is configured such that the ends of two adjacent duct pieces 41 (the main duct pieces 41M or the main duct pieces 41M and the sub-duct piece 41S) are butted against each other. Two duct pieces 41 are connected. More specifically, the L-shaped connector 42 connects the two duct pieces 41 while being in contact with the top and side surfaces of each of the two duct pieces 41.

As described above, in the present embodiment, the L-shaped connector 42 has two notch grooves 42K formed in a portion (horizontal portion 42a) that is in contact with the upper surface of each of the two duct pieces 41. It is adapted to be engaged from the lateral direction with a protrusion 43 provided to protrude upward from the upper surface of the holder. Further, the vertical portion 42b of the L-shaped connector 42 is fastened to the side surfaces of the two duct pieces 41 by screws 44 as fasteners.

The sub duct piece 41S, whose one end side is connected to the main duct piece 41M, is attached by fitting the extension part 41E formed on the other end side to the other main duct piece 41M (Fig. 11(a) → 11(b)). Since the sub duct piece 41S is inro-fitted to the main duct piece 41M, the sub duct piece 41S is slidable in the X direction with respect to the main duct piece 41M. Therefore, the distance between the two main duct pieces 41M located on both end sides of the sub duct piece 41S can be changed and the distance can be adjusted.

The sub-duct piece 41S and main duct piece 41M, which are inro-fitted, are connected using a flat plate type connector 45 shown in FIGS. 11(b) and 11(c). The flat plate connector 45 is in contact with the side surfaces of the two adjacent duct pieces 41 (the main duct piece 41M and the sub duct piece 41S), and is attached to the side surfaces of the two duct pieces 41 by means of screws 44 as fasteners. It is concluded.

As shown in FIG. 11(b), the flat plate connector 45 has two screw insertion holes 45H arranged above and below, and two elongated holes 45N arranged above and below and extending in the X direction. . By inserting the screws 44 inserted through the two screw insertion holes 45H and the screws 44 inserted through the two long holes 45N into the screw holes 41H provided on the side surface of the main duct piece 41M, the sub duct piece 41S and It can be fixed to the main duct piece 41M, and thereby the sub duct piece 41S and the main duct piece 41M can be connected (FIG. 11(c)).

In this embodiment, the connectors (L-shaped connector 42 and flat plate connector 45) connecting two adjacent duct pieces 41 are in contact with the top or side surfaces of each of the two adjacent duct pieces 41. The two duct pieces 41 are connected in this state.

3, FIG. 4, FIG. 5, and FIG. 6, an air blower 51 is provided inside each subduct 32. As shown in FIG. The air blower 51 is made of, for example, a pipe-shaped member extending in the X direction, and includes a plurality of air blowing ports 51N arranged in the X direction.

In FIG. 6 and FIGS. 8(a) and 8(b), each air outlet 51N opens toward the chip entrance opening 41K of the main duct 31. Hereinafter, the air blower 51 provided in the first subduct 32A on the front side of the main duct 31 will be referred to as the "first air blower 51A", and the air blower 51 provided in the second subduct 32B on the rear side of the main duct 31 will be referred to as the "first air blower 51A". The blower 51 is referred to as a "second air blower 51B" (FIG. 5).

In FIG. 4, a plurality of first air blowers 51A located in front of the main duct 31 and lined up in the X direction are each connected to a first air supply path 52A extending in the X direction in front of the main duct 31. Further, the plurality of second air blowers 51B located on the rear side of the main duct 31 and lined up in the X direction are each connected to a second air supply path 52B extending in the X direction behind the main duct 31.

3, FIG. 5, FIG. 6, and FIGS. 8(a) and (b), the side wall 41c of the main duct piece 41M constituting the main duct 31 is provided with a shutter 53 that opens and closes the chip entrance opening 41K. . The shutter 53 is made of a rectangular plate-like member as a whole, and its upper edge is supported by the main duct 31. Specifically, the shutter 53 is attached to the ceiling surface of the main duct 31 (lower surface of the upper wall 41a) by a hinge (shutter hinge 54) whose upper edge has its axis oriented in the X direction (horizontal direction) (see FIG. (see also 7). Therefore, the shutter 53 is swingable in a vertical plane (YZ plane) using the shutter hinge 54 as a fulcrum.

Both ends of each shutter 53 in the X direction are bent toward the side wall 41c of the main duct piece 41M (that is, the main duct 31). As a result, both ends of the shutter 53 serve as air receiving portions 53T that receive air discharged from an air discharge device 71 (described later) (FIGS. 6, 7, and 8(a), (b)).

The shutters 53 are provided corresponding to the chip entrance openings 41K formed in each of the two side walls 41c of the main duct 31 facing each other in the Y direction. Therefore, inside the main duct 31, the shutter 53 located on the front side and the shutter 53 located on the rear side are located facing each other in the Y direction. Hereinafter, the shutter 53 located on the front side of the main duct 31 and corresponding to the first subduct 32A will be referred to as "first shutter 53A", and the shutter 53 located on the rear side of the main duct 31 and corresponding to the second subduct 32B will be referred to as "first shutter 53A". It is called "second shutter 53B" (FIG. 5).

As described above, the chip collection device 1 in the embodiment has the first subduct 32A and the second subduct 32B as the subduct 32 at opposing positions with the main duct 31 in between, and the first subduct 32A as the air blower 51. The first air blower 51A moves the chips KZ received in the subduct 32B into the main duct 31, and the second air blower 51B moves the chips KZ received in the second subduct 32B into the main duct 31. ing. Further, the shutter 53 includes a first shutter 53A that opens and closes the chip entrance opening 41K corresponding to the first subduct 32A, and a second shutter 53B that opens and closes the chip entrance opening 41K that corresponds to the second subduct 32B.

Each shutter 53 is swingable about a shutter hinge 54, and has a closed position (FIGS. 6, 7, and 8(a)) where it hangs under its own weight and closes the chip entrance opening 41K, and an air blower. It is pushed toward the main duct 31 side by the air blown out from 51 and moves between the open position (FIG. 8(b)) where the chip entrance opening 41K is opened. When the shutter 53 is in the closed position, both ends of the shutter 53 (ends of the air receiving portion 53T) are in contact with the inner surface of the main duct 31 (FIGS. 6 and 7).

In FIG. 4, the first air supply passage 52A disposed on the front side of the main duct 31 and the second air blower 51B disposed on the rear side of the main duct 31 are respectively connected to the control valve 61 via the air supply passage 52. It is connected. The control valve 61 is connected to an air generation source (not shown).

The operation of the control valve 61 is controlled by a management device 62 (FIG. 4), and supplies air generated by an air generation source to the first air supply path 52A or the second air supply path 52B. When air is supplied to the first air supply path 52A by the control valve 61, air is blown out from each of the plurality of first air blowers 51A, and when air is supplied to the second air supply path 52B by the control valve 61, air is blown out from each of the plurality of first air blowers 51A. , air is blown out from each of the plurality of second air blowers 51B.

When air is not blown out from the air blower 51, the shutter 53 is in a hanging position due to its own weight, and is in the closed position (FIG. 8(a)). When air is blown out from the air blower 51 in this state, the shutter 53 is pushed to the open position (FIG. 8(a) → FIG. 8(b)), and the chips KZ in the subduct 32 are pushed by the air. moves into the main duct 31 from the chip entry opening 41K (FIG. 8(b)). When the air blower 51 stops blowing air, the shutter 53 returns to the hanging position due to its own weight and returns to the closed position (FIG. 8(b)→FIG. 8(a)).

As described above, in this embodiment, the shutter 53 is provided so as to be able to swing freely within the vertical plane (here, within the YZ plane), and when the air blower 51 is not blowing out air, the shutter 53 closes the chip entrance opening 41K. When the air blower 51 is in the closed position and is blowing out air, the air blower 51 is pushed by the blowing air and is in the open position to open the chip entrance opening 41K.

4 and 5, a plurality of air dischargers 71 are provided within the main duct 31. As shown in FIG. These plurality of air dischargers 71 are arranged in series in the direction in which the main duct 31 extends. In this embodiment, the air discharge device 71 is provided within the sub-duct piece 41S (that is, between the two main duct units) (FIGS. 12(a) and (b)).

As described above, in this embodiment, the air discharge device 71 is provided for each main duct unit, that is, at a position that separates two (one or more) chip inlet openings 41K (FIG. 5).

In FIGS. 12A and 12B, the air discharger 71 is made of, for example, a pipe-shaped member extending in the Y direction, and includes a plurality of air discharge ports 71N arranged in the Y direction. The air discharge device 71 is provided in the sub-duct piece 41S at a position close to the ceiling, and the air discharge port 71N is directed diagonally downward toward the air outlet 31D (FIGS. 13(a) and 13(b)). (see also).

In FIG. 4, the plurality of air dischargers 71 are connected to an air supply pipe 71T (FIG. 4) extending in the X direction, and the air supply pipe 71T is connected to a control valve 61. When the management device 62 controls the control valve 61 and supplies air to each air discharge device 71 through the air supply pipe 71T, air is discharged from the air discharge device 71.

The management device 62 controls the plurality of air dischargers 71 so that air is discharged in order from the air discharger 71 located on the upstream side. As a result, air flows in the main duct 31 in order from the upstream side to the downstream side (air outlet 31D), and the chips KZ moved from the subduct 32 into the main duct 31 are transferred to the downstream side (air outlet 31D) in a relay manner. (exit 31D side) (sequentially sent).

In this way, in the chip collection device 1 according to the present embodiment, a plurality of air dischargers 71 that discharge air into the main duct 31 are arranged in series in the direction in which the main duct 31 extends, and these plurality of air dischargers 71 are arranged in series in the direction in which the main duct 31 extends. By sequentially discharging air from the discharge device 71, the chips KZ that have entered the main duct 31 from the subduct 32 are sequentially sent to the air outlet 31D. Therefore, the air discharge force required for each air discharger 71 is sufficient to send the chips KZ to the position of the air discharger 71 located on the nearest downstream side. Since the discharge force required to send the chips KZ all at once from the most upstream side to the most downstream side (air outlet 31D) is not required, the operating cost can be reduced accordingly.

12(a), (b) and FIG. 13(a), (b), a plurality of check valves 72 are provided within the main duct 31. As shown in FIGS. As will be described later, the check valve 72 has a function of preventing the movement of the chips KZ in the direction opposite to the direction in which the air is discharged by the air discharger 71 within the main duct 31 (direction from the downstream side to the upstream side). It has the following.

Each check valve 72 is provided at the downstream end of each sub-duct piece 41S (FIGS. 12(a), (b) and FIGS. 13(a), (b)). As described above, the sub duct piece 41S is provided between the two main duct units aligned in the X direction, and the check valve 72 is located between two adjacent component mounting devices 3. Therefore, in this embodiment, the check valve 72 is provided for each main duct unit, that is, at a position that separates two (one or more) of the plurality of chip entry openings 41K (Fig. 5 ).

10(a) and FIGS. 12(a) and (b), the check valve 72 has an upper edge hinged (valve hinge 72H) on the ceiling surface (lower surface of the upper wall 41a) of the downstream end of the sub duct piece 41S. ) is attached via. Therefore, the check valve 72 can swing in a vertical plane (XZ plane), and has a closed position where it hangs down due to its own weight, and an open position where its lower end is swung in the direction of moving toward the downstream side (air outlet 31D side). It is possible to move between

Even if the check valve 72 attempts to swing in the direction of moving its lower end from the closed position to the upstream side (the side opposite to the air outlet 31D), the stopper 41P provided on the inner wall of the sub duct piece 41S (FIG. 12(b)) and cannot be moved (remains in the closed position). In this way, the check valve 72 is configured to be able to swing only in the direction of moving the lower end downstream.

The check valve 72 is provided at a position downstream of the air discharge device 71 included in the sub duct piece 41S to which the check valve 72 is attached. When air is discharged from the nearest upstream air discharger 71, the check valve 72 is pushed downstream by the air and swings in a direction to move its lower end downstream from the closed position. By being located in the open position, that position in the main duct 31 (the position where the check valve 72 is provided) is brought into the open state (FIG. 13(a)→FIG. 13(b)). Then, the chips KZ located in the sub-duct piece 41S are moved downstream through the check valve 72 by the air discharged by the air discharger 71 (FIG. 13(b)).

On the other hand, the check valve 72 controls the air discharged by the air blower 51 in the subduct 32 located on the immediately downstream side when the air discharger 71 located on the immediately upstream side is not discharging air. When the chips flow upstream through the chip entry opening 41K corresponding to the subduct 32, the state at the closed position is maintained. Therefore, the chips KZ that have moved from the subduct 32 to the main duct 31 by blowing out air from the air blower 51 located on the downstream side do not pass through the check valve 72 and move to the upstream side thereof.

In this embodiment, the check valve 72 in the open position allows the chips KZ in the main duct 31 to pass downstream by the air discharged by the air discharger 71, and The movement of the chips KZ in the direction opposite to the direction in which air is discharged by the air discharger 71 within the duct 31 is prevented.

In FIGS. 14(a) and 14(b), the storage section 33 has a belt conveyor 91. As shown in FIGS. The belt conveyor 91 includes a pair of frames 92 arranged opposite to each other in the X direction, a plurality of pulleys (a driving pulley 93K and a plurality of driven pulleys 93J) rotatably supported by the pair of frames 92, and these plurality of pulleys. It is configured to include a conveyor belt 94 that is stretched over the conveyor belt 94. On the surface of the conveyor belt 94, partition members 95 extending in the width direction of the conveyor belt 94 are formed at regular intervals.

In FIGS. 14(a) and 14(b), a drive motor 96 is attached to one frame 92 of the belt conveyor 91. As shown in FIGS. When the drive motor 96 rotates the drive pulley 93K via the drive belt 97, the conveyor belt 94 runs. The frame 92 is provided with a pair of belt guides 98. The conveyor belt 94 is guided at both ends by the pair of belt guides 98, and travels along a predetermined path. The operation of the drive motor 96 is controlled by the management device 62.

As shown in FIG. 14(b), the conveyance area by the belt conveyor 91 includes a discharge area R1 that extends almost horizontally in the front-rear direction, a rising area R2 that extends diagonally upward and extends from the discharge area R1, and a Y area that extends from the rising area R2. It consists of a dumping area R3 that extends substantially horizontally along the direction. When the drive pulley 93K is rotationally driven by the drive motor 96, the conveyor belt 94 moves through these three regions in this order (discharge region R1→raise region R2→discard region R3).

In FIG. 4, the belt conveyor 91 is installed such that the discharge area R1 of the conveyor belt 94 is located directly below the air outlet 31D. As shown in FIG. 4 and FIGS. 14(a) and (b), a chip passage 99 is provided below the dumping area R3 of the conveyor belt 94, and a storage box 100 is installed below the chip passage 99. ing. The storage box 100 is composed of a box-shaped member that is open upward.

Next, the operation of collecting chips KZ by the chip collecting device 1 will be explained. As described above, the chips KZ of the carrier tape 18 discharged by the feeder cart 15 included in each component mounting device 3 are discharged downward through the shooter 25. The chips KZ discharged downward through the shooter 25 are received in the subduct 32 through a chip receiving opening 32K formed in the subduct 32 (FIGS. 3 and 8(a)).

While the component mounting device 3 constituting the work line 2 is performing component mounting work, the chip collection device 1 performs a chip collection operation of the chips KZ at regular intervals. In the recovery operation, first, the management device 62 operates the control valve 61 to blow out air from all the first air blowers 51A for a certain period of time (about several seconds) (FIG. 8(b)). As a result, all the first shutters 53A swing from the closed position to the open position, and the chips KZ in the first subduct 32A move into the main duct 31 from the corresponding front chip entrance opening 41K (Fig. 15 (a)). When the first air blower 51A finishes blowing out air, the first shutter 53A returns to the closed position by its own weight.

When the first shutter 53A is located at the closed position, the management device 62 then blows out air from all the second air blowers 51B for a certain period of time (FIG. 15(b)). As a result, all the second shutters 53B swing from the closed position to the open position, and the chips KZ in the second sub-duct 32B move into the main duct 31 from the corresponding rear chip entrance opening 41K (Fig. 15(b)). When the second air blower 51B finishes blowing out air, the second shutter 53B returns to the closed position by its own weight.

Here, the upper edges of the shutters 53 (first shutter 53A and second shutter 53B) that open and close the chip entrance opening 41K are attached to the main duct 31, and are swingable in a vertical plane (YZ plane). When pushed by the air blown from the air blower 51 to the open position, its lower edge is moved in a direction (upward) away from the bottom surface of the main duct 31 (the upper surface of the lower wall 41b of the duct piece 41). . For this reason, the shutter 53 that has moved to the open position does not catch the chips KZ between its lower edge and the bottom surface inside the main duct 31, and the shutter 53 becomes unable to open and close due to the chips KZ being caught. This prevents the situation of being put away.

When the second shutter 53B is located at the closed position, the management device 62 then causes each of the plurality of air dischargers 71 to discharge air through the air supply pipe 71T. At this time, the plurality of air dischargers 71 provided in series in the main duct 31 are arranged to discharge air in sequence toward the downstream side (air outlet 31D side) for a certain period of time (Fig. 15(c) → 16(a)→FIG. 16(b)→FIG. 16(c)). As a result, an air flow is formed in the main duct 31 in the direction toward the air outlet 31D, and the chips KZ that have moved into the main duct 31 from each sub-duct 32 are transferred downstream in a relay manner due to the air flow (pressure). side (air outlet 31D side) (FIG. 16(c)).

While each component mounting device 3 constituting the work line 2 executes the component mounting work, the management device 62 performs the above operation (FIG. 15(a)→FIG. 15(b)→...FIG. 16(c)) Execute repeatedly. As a result, the chips KZ that have fallen into the subduct 32 from the tape feeder 16 of each component mounting device 3 are moved to the main duct 31 at regular intervals, then moved to the downstream side of the main duct 31, and then sent from the air outlet 31D. It is discharged to the outside of the main duct 31.

In the chip collecting device 1 in this embodiment, each shutter 53 hangs down under its own weight and is located in the closed position when the corresponding air blower 51 is not blowing out air (FIGS. 6, 7, and 8(a) )). Therefore, when one air blower 71 is blowing out air, the shutters 53 located downstream of that air blower 71 are all in the closed position; When the air hits the air receiving portions 53T formed at both ends of the shutter 53, a biasing force toward the closed position acts on the shutter 53 (arrow P shown in FIG. 7), and the shutter 53 is reliably closed. located in position. As a result, while air is being discharged from the air discharger 71, each chip entry opening 41K can be reliably closed by the shutter 53, and a situation in which the chips KZ in the main duct 31 flow back into the subduct 32 can be prevented. It can be prevented.

Note that here, the bent portions of both ends of the shutter 53 served as the air receiving portions 53T, but as in other examples shown in FIGS. 17 and 18, the surface of the flat shutter 53 (the main duct 31 Even if the configuration is such that a chevron-shaped overhanging member 53H having a pair of sloped portions diagonally intersecting in the X direction is provided on the side surface), and the sloped portion of this overhanging member 53H functions as the air receiving portion 53T. good. Even with this configuration, when the air blown from the air blower 51 hits the air receiver 53T, a biasing force toward the closed position acts on the shutter 53 (as indicated by the arrow P shown in FIG. 18). ), while air is being discharged from the air discharger 71, each chip entry opening 41K is reliably closed by the shutter 53, and the same effect can be obtained.

In this embodiment, as described above, the first shutter 53A and the second shutter 53B, which face each other with the main duct 31 in between, are positioned at the open position at different times. That is, the time during which the first air blower 51A blows out air and the time during which the second air blower 51B blows out air do not overlap. Therefore, the two opposing shutters 53 (first shutter 53A and second shutter 53B) do not interfere with each other because they are located at the open position at the same time, and damage to the shutters 53 can be prevented. It is also possible to prevent the chips KZ from being returned into the subduct 32 by the air blown out by the two opposing air blowers 51 (the first air blower 51A and the second air blower 51B).

When the chips KZ are moved in the main duct 31 in a relay manner by the plurality of air dischargers 71 and reach the air outlet 31D, the chips KZ fall downward from the air outlet 31D. As a result, the chips KZ are discharged to the discharge region R1 on the conveyor belt 94 of the storage section 33 located below the air outlet 31D (FIG. 19(a)).

When the chips KZ in the main duct 31 are discharged onto the conveyor belt 94 of the storage section 33, the management device 62 activates the drive motor 96 of the storage section 33 to cause the conveyor belt 94 to travel. As a result, the chips KZ discharged to the discharge area R1 of the conveyor belt 94 are conveyed in the upward direction through the ascending area R2 (arrow H1 shown in FIG. 19(b)), and are conveyed to the dumping area R3 (FIG. 19(c)). Arrow H2 shown inside). As described above, since the partitioning member 95 extending in the width direction of the conveyor belt 94 is provided on the surface of the conveyor belt 94, the chips KZ are prevented from separating (falling) from the conveyor belt 94 even in the rising region R2. The waste is reliably transported to the dumping area R3 without any damage.

The chips KZ carried to the dumping area R3 are then dumped downward from the end of the dumping area R3. The chips KZ dumped from the end of the dumping area R3 fall through the chip passage 99 located directly below and are stored in the storage box 100. Therefore, the chips KZ collected through the two main ducts 31 at the front and rear are finally stored in one storage box 100. Once the chips KZ are stored in the storage box 100, the operator removes the storage box 100 from the storage section 33, disposes of the chips KZ at a predetermined location, and then returns the storage box 100 to its original position. This completes a series of chip collection operations.

Next, the execution procedure (installation method) of the installation work of the chip collection device 1 in this embodiment will be explained. When installing the chip collection device 1 below the work line 2 in which the component placement devices 3 are lined up in one direction, first, each of the plurality of duct pieces 41 is placed below the component placement device 3 (work line 2). (insertion step. FIG. 20(a)→FIG. 20(b)). After inserting the plurality of duct pieces 41 below the component mounting device 3, adjacent ones of the inserted plurality of duct pieces 41 are connected to each other by connecting tools (L-shaped connecting tool 42 and flat plate-type connecting tool 45) ( connection process).

In the connecting step, first, two adjacent main duct pieces 41M are connected using the L-shaped connector 42 (FIG. 20(c), FIG. 10(b)→FIG. 10(c)). By changing the length of the fitting portion between the main duct piece 41M and the sub duct piece 41S that are inro fitted, the two main duct pieces 41M that are positioned with the sub duct piece 41S in between can be After adjusting the distance (distance between the two main duct units) (arrow U shown in FIG. 21(a)), use the flat plate connector 45 to connect the sub duct piece 41S and main duct piece that are inro-fitted. 41M (FIG. 21(b), FIG. 11(b)→FIG. 11(c)).

As described above, in the installation work (installation method) of the chip collection device 1 in this embodiment, in the connection process, two duct pieces 41 ( After adjusting the distance between the main duct pieces 41M, the sub duct pieces 41S are connected to the main duct pieces 41M.

After connecting the adjacent main duct pieces 41M in the above connection process, attach the subduct 32 to each main duct piece 41M (subduct installation process, FIG. 21(c)), and install the housing part 33 on the air outlet 31D side of the main duct 31. (accommodation section installation process). This completes the installation work of the chip collection device 1.

As described above, in this embodiment, when the main duct 31 in which the plurality of duct pieces 41 are connected in series in the direction in which the work line 2 extends (X direction) is installed below the work line 2, the plurality of duct pieces 41 are After each piece 41 is inserted below the component mounting device 3 (insertion process), adjacent pieces 41 of the plurality of duct pieces 41 inserted below the component mounting device 3 are connected to each other using a connecting tool (L-shaped connecting tool 42). They are connected by a flat plate type connecting tool 45) (connection step).

For this reason, when the main duct 31 is installed below the work line 2 as in the past, a plurality of duct pieces 41 corresponding to all or part of the main duct 31 are connected in advance, and the work line 2 is There is no need to perform a large-scale operation such as pushing and inserting from the upstream or downstream end in the direction in which the work line 2 extends (X direction). Therefore, a large work space is not required for the installation work of the main duct 31, the work can be carried out by a small number of people, and the work time required for installation can be significantly shortened. In addition, since the duct piece 41 includes a distance adjustment duct piece 41 (sub duct piece 41S) for adjusting the distance between the other two duct pieces 41 located at both ends, the connection In the process, the distance between adjacent duct pieces 41 (main duct pieces 41M) can be easily adjusted.

In the above embodiment, there is one main duct 31, but as shown in FIG. 22, the main duct 31 has two main ducts, a first main duct 31A and a second main duct 31B, which extend parallel to each other. 31, in the insertion step of inserting each of the plurality of duct pieces 41 below the component mounting device 3, the plurality of duct pieces 41 forming the first main duct 31A and the second main duct 31B are formed. A plurality of duct pieces 41 are inserted under the component mounting device 3 from opposite sides (opposed in the Y direction) with the work line 2 in between.

As explained above, in the installation method of the chip collection device 1 in this embodiment, after each of the plurality of duct pieces 41 is inserted below the component mounting device 3, the plurality of duct pieces 41 inserted below the component mounting device 3 are Adjacent duct pieces 41 are connected to each other using connectors (L-shaped connector 42 and flat plate connector 45). Therefore, as in the past, a plurality of duct pieces 41 corresponding to all or part of the main duct 31 are connected in advance, and the direction in which the work line 2 extends from the upstream or downstream end of the work line 2 is There is no need to perform large-scale work such as pushing in and inserting the main duct 31 (in the X direction), there is no need for a large work space for the installation work of the main duct 31, and the work can be done by a small number of people, and the work required for installation The time can be significantly reduced.

Although the embodiments of the present invention have been described so far, the present invention is not limited to the above-described embodiments, and various modifications are possible. For example, in the embodiment described above, the storage section 33 is configured to convey the chips KZ discharged from the outlet (air outlet 31D) of the main duct 31 by the belt conveyor 91 and discharge them into the storage box 100. The belt conveyor 91 may not be used, and the storage box 100 may be installed below the air outlet 31D.

Furthermore, in the above-described embodiment, in the chip KZ collection operation performed by the chip collection device 1, after blowing out air from all the first air blowers 51A for a certain period of time (FIG. 15(a)), The procedure was such that the second air blower 51B blows out air for a certain period of time (FIG. 15(b)), and then the plurality of air blowers 71 sequentially blow out air from the upstream side to the downstream side for a certain period of time. However, (FIG. 15(c)→FIG. 16(a)→FIG. 16(b)→FIG. 16(c)), this is just an example, and the operation for collecting the chips KZ may be performed using other procedures. For example, as mentioned above, "All the first air blowers 51A blow out air at the same time → All the second air blowers 51B blow out air at the same time → The plurality of air blowers 71 blow out air in order from the upstream side to the downstream side. Instead of the procedure of "Blowing out", the procedure is "The first air blower 51A blows out air → The second air blower 51B opposite to this blows out air → Immediately between these first air blower 51A and second air blower 51B" 23(a) → FIG. 23(b) → FIG. 23(c) → FIG. 24( a)→FIG. 24(b)→FIG. 24(c)→...), etc. may be used.

To provide a method for installing a chip collecting device, which does not require a separate large space for assembling a main duct, and can greatly shorten the working time required for installation, and a connecting tool used therefor.

1 Chip collection device 2 Work line 3 Component mounting device 16 Tape feeder 18 Carrier tape (tape member)
31 Main duct 31A First main duct 31B Second main duct 31D Air outlet 32 Subduct 32A First subduct 32B Second subduct 32K Chip receiving opening 41 Duct piece 41M Main duct piece 41S Sub-duct piece (adjustment duct piece)
41K Chip entry opening 42 L-shaped connector (connector)
42K Notch groove 43 Projection 44 Screw (fastener)
45 Flat plate type connector (connector)
51 Air blower 51A First air blower 51B Second air blower 52A First air supply path 52B Second air supply path 53 Shutter 53A First shutter 53B Second shutter KZ Chips BH Parts KB Board

Claims (11)

A component mounting device for mounting components supplied by a tape feeder onto a board is installed below a work line arranged in one direction, and a plurality of duct pieces are connected in series in the direction in which the work line extends. A method for installing a chip collection device for collecting chips of a tape member discharged from the tape feeder through a main duct, the method comprising:
an insertion step of inserting each of the plurality of duct pieces below the component mounting device;
a connecting step of connecting adjacent ones of the plurality of duct pieces inserted below the component mounting device in the inserting step with a connecting tool;
How to install a chip collection device including. The method for installing a chip collection device according to claim 1, wherein the connecting tool connects the two adjacent duct pieces with their respective ends butted against each other. 3. The method for installing a chip collection device according to claim 2, wherein the connecting tool connects the two adjacent duct pieces while being in contact with an upper surface or a side surface of each of the two adjacent duct pieces. 4. The method for installing a chip collecting device according to claim 3, wherein the connecting tool has an L-shape and connects the two duct pieces while being in contact with the side and top surfaces of each of the two duct pieces. The connector has two notch grooves formed in a portion that contacts the upper surface of each of the two duct pieces, and the two notch grooves are provided so as to protrude upward from the upper surface of each of the two duct pieces. 5. The method for installing a chip collecting device according to claim 4, wherein the chip collecting device is laterally engaged with the protrusion that has been removed. The method for installing a chip collection device according to claim 4 or 5, wherein the connector is fastened to the side surfaces of the two duct pieces by a fastener. The duct piece includes an adjustment duct piece for adjusting the distance between the other two duct pieces located at both ends, and is positioned across the adjustment duct piece in the connection step. The method for installing a chip collection device according to claim 1, wherein the distance between the two duct pieces is adjusted. The method for installing a chip recovery device according to claim 7, wherein the adjusting duct piece is connected to the duct piece after adjusting the distance between the two duct pieces located across the adjusting duct piece. . The main duct consists of a first main duct and a second main duct that extend parallel to each other, and in the insertion step, the plurality of duct pieces forming the first main duct and the plurality of duct pieces forming the second main duct are 2. The method for installing a chip collection device according to claim 1, wherein each duct piece is inserted below the component mounting device from opposite sides across the work line. A component mounting device for mounting components supplied by a tape feeder onto a board is installed below a work line arranged in one direction, and a plurality of duct pieces are connected in series in the direction in which the work line extends. A connector used for assembling a chip collection device for collecting chips of a tape member discharged from the tape feeder through a main duct,
A connector for connecting two adjacent duct pieces among the plurality of duct pieces inserted below the component mounting device in a state in which they are in contact with the upper surface or side surface of each of the two adjacent duct pieces. 11. The connector according to claim 10, further comprising two cutout grooves that laterally engage two protrusions that are provided to protrude upward from the upper surfaces of the two adjacent duct pieces.

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