JP2023167334A - Marine led lighting device - Google Patents

Abstract

To provide a marine LED lighting device that can sufficiently dissipate heat generated from an LED board and a power supply board without using metal components that come into contact with outside air.SOLUTION: Light emitted from an LED component 27 arranged in an interior space S enclosed by a body 2 and a glove 3 is transmitted through the glove 3 and diffused to an outside. The marine LED lighting device comprises: a power supply board 4 which is arranged on a mounting base 7 of the body 2 across a first space S1 and has a semiconductor component 22 mounted thereon; and an LED board 5 which is arranged on the power supply board 4 across a second space S2 and has the LED component 27 mounted thereon. A heat-dissipating connection member 6 arranged in the first space S1 and having one end attached to the mounting base 7 of the body 2 and the other end in contact with the semiconductor component 22 mounted on the power supply board 4 is provided. A heat-dissipating board 12 facing the first space S1 is provided in the mounting base 7 of the body 2. A heat-dissipating plate 29 facing the second space S2 is provided in the LED board 5.SELECTED DRAWING: Figure 2

Description

The present invention relates to an LED lighting device for ships, and particularly to a heat dissipation structure thereof.

Conventionally, high-brightness LEDs have been used as lighting devices, but lighting devices for ships in particular need to have durability so that they do not break down during navigation. In particular, lighting devices with heat-generating parts such as LED parts and semiconductor parts become unstable due to heat generation, shorten their lifespan, corrode and deteriorate parts due to salt and moisture, reduce insulation, and rust. occurs. For this reason, LED lighting devices for ships are required to have heat dissipation properties and waterproof properties. Heat-generating components are generally provided with metal heat-radiating fins that have excellent heat dissipation properties as components that come into contact with the outside air, but these are not suitable for heat-generating components for ships that are exposed to salt water. Conventional lighting devices are provided with an integral globe because dew condensation inside the globe can cause malfunctions.

Patent Document 1 discloses that a lens frame is attached to an opening of a housing, a metal ring-shaped heat dissipation member is attached to a circular hole of the lens frame, and a lens is provided at the front part of the inner periphery of this heat dissipation member. An LED illumination light with an LED board provided at the rear is described. According to this LED lighting lamp, heat generated from the LED is radiated to the outside from around the lens via the heat radiating member. However, there is a problem in that the heat escaping to the back surface of the LED board is trapped inside the casing along with the heat generated from the LED driver (power supply board) housed in the casing, and the heat is not sufficiently radiated.

Patent No. 5148538 specification

The present invention has been made in view of the above-mentioned conventional problems, and provides an LED for ships that can sufficiently dissipate heat generated from an LED board and a power supply board without using metal parts for the parts that come into contact with the outside air. The objective is to provide a lighting device.

The means to solve the above problem are as follows:
In an LED lighting device for a ship, light emitted from an LED component arranged in an internal space surrounded by a main body and a globe is transmitted through the globe and diffused to the outside,
a power supply board disposed on the mounting base of the main body across a first space and having semiconductor components mounted thereon;
an LED board arranged on the power supply board with a second space in between, and on which an LED component is mounted;
A heat dissipation connecting member is provided that is disposed in the first space, one end of which is attached to the mounting base of the main body, and the other end of which is in contact with the semiconductor component mounted on the power supply board. do.
With this means, the heat generated in the semiconductor components of the power supply board is conducted to the heat dissipation coupling member, is radiated to the first space through the surface of the heat dissipation coupling member, and passes through the heat dissipation coupling member to the mounting base of the main body. Heat is conducted and radiated to the outside through the outer surface of the main body. Further, heat generated by the LED components of the LED board is radiated to the inner space of the glove and the second space.

Preferably, the mounting base of the main body is provided with a heat dissipation board facing the first space, and the heat dissipation board is in contact with the heat dissipation connecting member.
With this means, heat generated in the semiconductor components of the power supply board is conducted to the heat radiation board through the heat radiation connection member, and is radiated from the entire surface of the heat radiation board to the first space.

It is preferable that the LED board is provided with a heat sink facing the second space.
With this means, heat generated by the LED components of the LED board is radiated from the entire surface of the heat sink to the second space.

A first spacer is provided between the mounting base and the power supply board to regulate the distance between the first spaces,
It is preferable that a second spacer is provided between the power supply board and the LED board to regulate the distance between the second spaces.
With this means, the size of the first space is defined by the first spacer, and the size of the second space is defined by the second spacer. Furthermore, the heat generated in the semiconductor components of the power supply board is thermally conducted to the mounting board via the first spacer, and the heat generated in the LED components of the LED board is thermally conducted to the power supply board via the second spacer. Heat is conducted from the substrate to the mounting substrate via the first spacer.

It is preferable that the heat dissipation connecting member and the semiconductor component are in contact with each other via a heat dissipation sheet. Ensures heat dissipation for parts of the power supply board that are susceptible to deterioration from heat, and promotes heat conduction from the power supply board to the mounting board.
According to this means, the heat dissipation sheet also serves to ensure insulation, and it is possible to ensure electrical insulation between the heat dissipation connecting member and the semiconductor component.

Preferably, a bare wire portion of a power cable connected to the semiconductor component, a mounting surface of the power supply board, and a mounting surface of the LED board are coated.
According to this means, water resistance against moisture entering the inside of the glove through the inside of the power cable connected to the semiconductor component is improved.

Preferably, the glove is removably attached to the main body.
According to this method, the glove is removable from the main body, so if condensation occurs inside the glove, you can remove the glove, remove the moisture inside, and then attach it to the main body, allowing the lighting device to be used for a long time. can do.

It is preferable that a ground wire of a power cable passing through the mounting base of the main body is connected to the heat dissipation board.
According to this means, the noise voltage is lowered and the apparatus has sufficient electromagnetic environment compatibility as an electrical appliance for ships.

According to the present invention, the heat generated from the LED board and the power supply board can be sufficiently dissipated without using metal parts for the parts that come into contact with the outside air, and the operation of these parts is stabilized and durability is improved. This has the effect of improving.

FIG. 1 is an exploded perspective view of a marine LED lighting device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a marine LED lighting device. FIG. 3 is an exploded perspective view of the heat dissipation board, the power supply board, the heat dissipation connection member, and the heat dissipation sheet as seen diagonally from below. FIG. 3 is a perspective view of the main body with the glove and LED board removed, as seen diagonally from above. FIG. 3 is an enlarged view showing the connection between the power cable and the power board. A perspective view of the mounting base seen from the back side. A diagram showing conducted emission test results.

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows a marine LED lighting device (hereinafter sometimes simply referred to as a lighting device) 1 according to an embodiment of the present invention. The lighting device 1 includes a main body 2, a globe 3, a power supply board 4, an LED board 5, and a heat radiation connection member 6.

The main body 2 is made of a synthetic resin such as polybutylene terephthalate (PBT) resin containing glass fiber, and includes a circular mounting base 7, a first cylindrical part 8, and a second cylindrical part 9.

As shown in FIG. 2, the mounting base 7 has an annular groove 11 formed on its outer periphery, into which a packing 10 is mounted. A circular heat dissipation board 12 made of alumite is installed on the mounting base 7. The mounting base 7 is provided with a rubber bushing 13 for guiding the power cable A consisting of a three-core cabtyre cable from the second cylindrical part 9 side to the first cylindrical part 8 side through the mounting base 7 and the heat dissipation board 12. installed. A cylindrical coaming 7a is provided on the back surface of the mounting base 7, that is, the surface on the second cylindrical portion 9 side, so as to surround the rubber bushing 13. The combing 7a is filled with silicone resin 7b. This silicone resin 7b covers the sheath A _s of the power cable A and the three-core cords A ₁ , A ₂ , A ₃ exposed from the end face thereof. The first cylindrical portion 8 side and the second cylindrical portion 9 side of the power cable A are sealed by the silicone resin 7b and the rubber bushing 13. A first spacer 15 consisting of three hexagonal columns is attached to the heat dissipation board 12 by a mounting screw 14 inserted through the mounting base 7 and the heat dissipation board 12 from the second cylindrical portion 9 side. Further, a heat dissipation connecting member 6, which will be described later, is attached to the heat dissipation board 12 by a mounting screw 16 inserted through the mounting base 7 and the heat dissipation board 12 from the second cylindrical portion 9 side. It is preferable to apply a waterproof coat to the threaded portions of the mounting screws 14 and 16.

The first cylindrical portion 8 has a female thread 17 formed on its inner surface. A glove 3, which will be described later, is attached to the first cylindrical portion 8.

The second cylindrical portion 9 has a smaller outer diameter than the first cylindrical portion 8, and has a male thread 18 formed on its outer surface. The second cylindrical portion 9 is adapted to be attached to a mounting base (not shown).

The glove 3 is milky white and is made of a material such as polycarbonate that transmits light. The globe 3 is cylindrical and has an opening 19 at one end and a spherical head 20 at the other end. The opening 19 is sized to be inserted into the first cylindrical portion 8 of the main body, and has a male thread 21 formed on its outer surface to be screwed into the female thread 17 of the first cylindrical portion 8 of the main body 2 . The open end of the opening 19 presses the packing 10 of the main body 2 when the glove 3 is attached to the main body 2, so that the inside of the glove 3 is sealed from the outside.

The power supply board 4 has a circular shape that can be accommodated in the first cylindrical portion 8 of the main body 2, and has a power supply circuit (not shown) including a semiconductor component 22 such as a transistor on the surface of the mounting base 7 facing the heat dissipation board 12 (lower surface in the figure). Implemented. In FIG. 1, reference numeral 23 is an input terminal to which two power cords A ₁ and A ₂ of the power cable A wired inside the rubber bushing 13 and a ground wire A ₃ are connected. Further, reference numeral 24 is an output terminal to the LED board 5. The power supply board 4 is placed on the first spacer 15 with the mounting surface, that is, the semiconductor component 22 facing the heat dissipation board 12 of the main body 2, so that the power supply board 4 is placed on the mounting base 7 of the main body 2 across the first space S1. has been done. The first spacer 15 regulates the distance between the first spaces S1 to a predetermined distance. An insulating wall 25 is provided on the outer periphery of the power supply board 4 so as to protrude toward the mounting base 7 in order to maintain a creepage distance between the power supply circuit including the semiconductor component 22 and the globe 3. The insulating wall 25 is cut out at a portion that interferes with a heat dissipation connecting member 6, which will be described later. On the opposite side of the power supply board 4 from the mounting surface, that is, on the spherical head 20 side of the globe 3, recesses 4a are formed in which three second spacers 26 are arranged at the same positions as the first spacers 15.

The second spacer 26 is made of a hexagonal column, and has a male thread formed at one end and a screw hole formed at the other end. The second spacer 26 fixes the power supply board 4 onto the first spacer 15 by inserting a male screw through the recess 4 a of the power supply board 4 and screwing it into the screw hole of the first spacer 15 .

The LED board 5 has a circular shape that can be accommodated in the first cylindrical portion 8 of the main body 2, and an unillustrated LED drive circuit including an LED component 27 is mounted on the surface of the globe 3 facing the spherical head 20. In FIG. 1, reference numeral 28 is an input terminal that is read directly from the output terminal 24 of the power supply board 4 via a wire (not shown). On the side opposite to the mounting surface of the LED board 27, a circular heat dissipation plate 29 made of an alumite material and having the same diameter as the LED board 5 is arranged in an overlapping manner. The heat sink 29 is provided with a notch 30 through which a wire (not shown) connecting the output terminal 24 of the power supply board 4 and the input terminal 28 of the LED board 5 passes. The LED board 5 is installed on the second spacer together with the heat sink 29 with the mounting surface, that is, the LED component 27 facing the spherical head 20 side of the globe 3, thereby creating a second space S2 in the mounting base 7 of the main body 2. are located apart from each other. The second spacer 26 regulates the interval between the second spaces S2 to a predetermined interval. The second spacer 26 is formed shorter than the first spacer 15, and the second space S2 is smaller than the first space S1.

The LED board 5 is fixed on the second spacer 26 by screwing into the second spacer 26 a mounting screw 31 that is inserted through the LED board 5 and the heat sink 29 from the spherical head 20 side of the globe 3 .

The heat dissipation connecting member 6 is made of an alumite material, and as shown in FIG. The leg portion 34 is bent 90 degrees from the portion 33 and extends parallel to the heat dissipation board 12 . The contact portion 32 and both leg portions 33 form an inverted U shape. The heat dissipation connecting member 6 is arranged such that the foot part 34 is placed on the heat dissipation board 12 and the contact part 32 contacts the semiconductor component 22 of the power supply board 4 via the heat dissipation sheet 35, so that the second cylindrical part 9 side It is fixed onto the heat dissipation board 12 by screwing the mounting screws 16 inserted through the mounting base 7 and the heat dissipation board 12 into the foot portions 34 . The heat dissipation sheet 35 is preferably made of silicone rubber that has insulation, thermal conductivity, and flame retardancy. As shown in FIG. 4, the leg portions 34 are formed as large as possible so as to have a large contact area with the heat dissipation board 12 and not interfere with surrounding members.

As shown in FIG. 5, the bare wire portion of the power cable A connected to the input terminal 23 of the power supply board 4, the mounting surface of the power supply board 4, and the mounting surface of the LED board 5 are coated with a waterproof coating agent 36. has been done.

Further, as shown in FIG. 5, the ground wire _A3 of the power cable A is connected to the input terminal 23 of the power supply board ₄ , and as shown in FIG. 15 and the heat dissipation board 12. Thereby, the ground wire _A3 of the power cable A is electrically connected to the heat dissipation board 12.

As shown in FIG. 6, the power cord A coming out from the silicone resin 7b of the combing 7a on the back surface of the mounting base 7, that is, on the side of the second cylindrical portion 9, is located at a position eccentric from the center of the second cylindrical portion 9, so that the power cord The wires are gathered at the center of the second cylindrical portion 9 with a tie 37 and wired to a mounting portion (not shown).

Marine electrical appliances such as the marine LED lighting device 1 of this embodiment have dustproof properties (IP5X: protection from dust) and waterproof properties (IPX6: protection from jets of water in all directions) specified by the IEC standard. (No harmful effects) and electromagnetic compatibility (EMC) specified in JIS F 0808:2009. In the embodiment of the present invention, it was confirmed that dustproofness complies with IP5X and waterproofness complies with IPX6. In the conducted emission test, a pseudo power supply network is connected between the power supply and the power port of the product under test (the marine LED lighting device 1 of this embodiment), and the noise voltage between the power port and the ground is measured. FIG. 7 shows the conducted emission test results for the marine LED lighting device 1 of this embodiment. In FIG. 7, the vertical axis shows the noise level, and the horizontal axis shows the frequency. 7A shows the case where the heat dissipation board 12 is not connected to the ground, and FIG. 7B shows the case where the heat dissipation board 12 is connected to the ground. As is clear from the test results, when the heat dissipation board 12 was not grounded (Fig. 7(a)), the measured values exceeded the criteria in the high frequency region of 0.1 MHz or higher, whereas in this test In the LED lighting device 1 for ships according to the present invention, since the power supply board 4 is connected to the heat dissipation board 12 via the ground wires A ₃ and A ₄ , the measured value of the noise voltage is less than the criterion (Fig. 7(b) )), and was confirmed to have sufficient electromagnetic compatibility. This is because by grounding the heat dissipation board 12, the radiation noise generated from, for example, the switching elements of the power supply board 4 is absorbed by the heat dissipation board 12, and as a result, the noise level is reduced.

Next, the operation of the marine LED lighting device 1 having the above configuration will be explained.

The LED components 27 of the LED board 5 can be turned into a light-emitting or non-light-emitting state by the power supplied and controlled from the power supply board 4, and can be blinked or the brightness or color can be adjusted as necessary. The light emitted by the LED component 27 passes through the globe 3 and illuminates the outside.

The heat generated in the semiconductor components 22 of the power supply board 4 is conducted to the heat dissipation connecting member 6 via the heat dissipation sheet 35, and is radiated from the surface of the heat dissipation coupling member 6 to the first space S1, and also passes through the heat dissipation coupling member 6. Heat is conducted to the mounting base 7 of the main body 2 and radiated to the outside from the outer surface of the main body 2. Moreover, the heat generated by the LED components 27 of the LED board 5 is radiated to the internal space S of the globe 3 and the second space S2.

A heat dissipation board 12 is provided on the mounting base 7 of the main body 2, and the heat dissipation board 12 is in contact with the heat dissipation connection member 6, so that the heat generated in the semiconductor components 22 of the power supply board 4 is radiated through the heat dissipation connection member 6. The heat is conducted to the substrate 12 and radiated from the entire surface of the heat dissipation substrate 12 to the first space S1, and the heat is conducted to the mounting base 7 of the main body 2, and the heat is radiated to the outside from the outer surface of the main body 2.

Furthermore, since the LED board 5 is provided with the heat sink 29 facing the second space S2, the heat generated by the LED components 27 of the LED board 5 is thermally conducted to the heat sink 29 and from the entire surface of the heat sink 29. Heat is radiated to the second space S2.

Since the first spacer 15 is provided between the mounting base 7 and the power supply board 4, and the second spacer 26 is provided between the power supply board 4 and the LED board 5, the heat generated in the semiconductor components 22 of the power supply board 4 is is thermally conducted to the mounting base 7 via the first spacer 15, and heat generated in the LED components 27 of the LED board 5 is thermally conducted to the power supply board 4 via the second spacer 26, and from the power supply board 4 to the first Heat is conducted to the mounting base 7 via the spacer 15 and radiated to the outside from the outer surface of the main body 2.

In this way, the heat of the semiconductor component 22 is radiated from the surfaces of the heat dissipation connecting member 6 and the heat dissipation board 12 to the first space S1, and the heat of the LED component 27 is dissipated from the surface of the heat dissipation plate 29 to the second space S2. Therefore, the heat transfer area is large, heat is radiated sufficiently, the operation of these parts is stabilized, and the durability is improved.

Since the heat dissipation coupling member 6 and the semiconductor component 22 are in contact with each other via the heat dissipation sheet 35, electrical insulation between the heat dissipation coupling member 6 and the semiconductor component 22 can be ensured.

The bare wire portion of the power cable A connected to the input terminal 23 of the power supply board 4, the mounting surface of the power supply board 4, and the mounting surface of the LED board 5 are coated with a waterproof coating agent. The water resistance against moisture entering the inside of the glove 3 through the inside of the power cable A connected to the glove 3 is improved.

The glove 3 is attached to the main body 2 with screws and is removable, so if condensation occurs inside the glove 3, remove the glove 3 and remove the moisture inside before attaching it to the main body 2. The device 1 can be used for a long period of time.

The present invention is not limited to the embodiments described above, and modifications and changes can be made within the scope of the invention described in the claims.

For example, although the heat dissipation connecting member 6 is formed into an inverted U-shape by the contact portion 32 and both legs 33, it may be T-shaped or an inverted L-shape.

1... LED lighting device for ships 2... Main body 3... Glove 4... Power supply board 5... LED board 6... Heat dissipation connecting member 7... Mounting base 12... Heat dissipation board 15... First spacer 22... Semiconductor component 26... Second spacer 27... LED parts 29... Heat dissipation plate 35... Heat dissipation sheet A... Power cable A ₃ ... Earth wire A ₄ ... Earth wire S... Internal space S1... First space S2... Second space

The means to solve the above problem are as follows:
In an LED lighting device for ships, in which light emitted from an LED component arranged in an internal space surrounded by a main body and a globe is transmitted through the globe and diffused to the outside,
a power supply board disposed on the mounting base of the main body across a first space and having semiconductor components mounted thereon;
an LED board arranged on the power supply board with a second space therebetween and on which the LED component is mounted;
A gap is formed between each outer peripheral edge of the power supply board and the LED board and an inner surface of the globe,
A heat dissipation connecting member is provided, which is disposed in the first space, one end of which is attached to the mounting base of the main body, and the other end of which is in contact with the semiconductor component mounted on the power supply board. do.
With this means, the heat generated in the semiconductor components of the power supply board is conducted to the heat dissipation coupling member, is radiated to the first space through the surface of the heat dissipation coupling member, and is transferred to the mounting base of the main body through the heat dissipation coupling member. Heat is conducted and radiated to the outside through the outer surface of the main body. Further, heat generated by the LED components of the LED board is radiated to the inner space of the glove and the second space.

The LED board 5 has a circular shape that can be accommodated in the first cylindrical portion 8 of the main body 2, and an unillustrated LED drive circuit including an LED component 27 is mounted on the surface of the globe 3 facing the spherical head 20. In FIG. 1, reference numeral 28 is an input terminal that is read directly from the output terminal 24 of the power supply board 4 via a wire (not shown). On the side opposite to the mounting surface of the LED board 5 , a circular heat dissipation plate 29 made of an alumite material and having the same diameter as the LED board 5 is arranged in an overlapping manner. The heat sink 29 is provided with a notch 30 through which a wire (not shown) connecting the output terminal 24 of the power supply board 4 and the input terminal 28 of the LED board 5 passes. The LED board 5 is installed on the second spacer together with the heat sink 29 with the mounting surface, that is, the LED component 27 facing the spherical head 20 side of the globe 3, thereby creating a second space S2 in the mounting base 7 of the main body 2. are located apart from each other. The second spacer 26 regulates the interval between the second spaces S2 to a predetermined interval. The second spacer 26 is formed shorter than the first spacer 15, and the second space S2 is smaller than the first space S1.

Claims (8)

In an LED lighting device for a ship, light emitted from an LED component arranged in an internal space surrounded by a main body and a globe is transmitted through the globe and diffused to the outside,
a power supply board disposed on the mounting base of the main body across a first space and having semiconductor components mounted thereon;
an LED board arranged on the power supply board with a second space in between, and on which an LED component is mounted;
A heat dissipation connecting member is provided that is disposed in the first space, one end of which is attached to the mounting base of the main body, and the other end of which is in contact with the semiconductor component mounted on the power supply board. LED lighting equipment for ships. The LED lighting device for a ship according to claim 1, wherein a heat dissipation board facing the first space is provided on the mounting base of the main body, and the heat dissipation board is in contact with the heat dissipation connecting member. . The LED lighting device for a ship according to claim 1 or 2, wherein the LED board is provided with a heat sink facing the second space. A first spacer is provided between the mounting base and the power supply board to regulate the distance between the first spaces,
2. The LED lighting device for a ship according to claim 1, further comprising a second spacer provided between the power supply board and the LED board to regulate an interval of the second space. The LED lighting device for a ship according to claim 1, wherein the heat dissipation connecting member and the semiconductor component are in contact with each other via a heat dissipation sheet. 2. The LED lighting device for a ship according to claim 1, wherein a bare wire portion of a power cable connected to the semiconductor component, a mounting surface of the power supply board, and a mounting surface of the LED board are coated. The LED lighting device for a ship according to claim 1, wherein the glove is detachably provided on the main body. 3. The LED lighting device for a ship according to claim 2, wherein a ground wire of a power cable passing through the mounting base of the main body is connected to the heat dissipation board.

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