JP2023161923A - wiring board - Google Patents

Abstract

To improve property of a wiring board.SOLUTION: A wiring board of an embodiment, includes: a connection pad P1 formed on a surface S1 of a first insulation layer 111; a second insulation layer 110 formed on the surface S1; and a wiring body WS which includes a first surface A and a second surface B, and is disposed inside the open 110a of the second insulation layer 110 while the second surface B is disposed directed toward the first insulation layer 111. The wiring body WS comprises: a plurality of first conductive pads OP in the first surface A, and comprises a second conductive pad IP exposed to the second surface B. The second conductive pad IP and the connection pad P1 come in contact with each other via a conductive connection pad 4. Distance between a surface FS2 facing the connection pad P1 and the first surface A in the second conductive pad IP is shorter a distance between the surface S1 and an upper surface S2 of the second insulation layer 110. The distance between the surface S1 and the first surface A is nearly equal to the distance between the surface S1 and the upper surface S2, and a gap G between the surface S1 and the second surface B is filled with a plurality of particles 41 of the connection pad 4 and an insulation resin 42.SELECTED DRAWING: Figure 3

Description

The present invention relates to a wiring board.

Patent Document 1 discloses a wiring board in which a wiring structure is arranged in an opening provided in a solder resist layer of a main wiring board. The wiring structure has a conductor pad on one surface (upper surface). Semiconductor components such as an MPU and a DRAM are mounted on this conductor pad.

JP2014-82334A

In the wiring board disclosed in Patent Document 1, the conductor layer in the wiring structure and the conductor layer in the main wiring board may not be connected through a desired short path. Furthermore, the conductor pattern formed directly under the opening in which the wiring structure is placed in the main wiring board cannot be connected to a specific circuit element of the semiconductor component mounted on the wiring structure through a desired short path. Sometimes. Therefore, in the wiring board, the electrical characteristics of the semiconductor component may not be stably exhibited.

The wiring board of the present invention includes a first insulating layer, a conductive connection pad formed on the surface of the first insulating layer, and a connection pad formed on the surface and opposite to the first insulating layer. a second insulating layer having an upper surface facing the direction and an opening for exposing the connection pad; a first surface constituting a component mounting surface; and a second surface opposite to the first surface, and having at least one wiring. a wiring body disposed within the opening with the second surface facing the first insulating layer. The wiring body includes a plurality of first conductor pads formed on the first surface, and a first conductor pad that is electrically connected to any one of the plurality of first conductor pads and exposed on the second surface. 2 conductor pads, the component mounting surface includes a first component region and a second component region each including a part of the plurality of first conductor pads, and the component mounting surface includes a first component region and a second component region each including a part of the plurality of first conductor pads, and 1 conductor pad and the first conductor pad in the second component area are connected through the wiring layer, and the second conductor pad and the connection pad are in contact with each other through a conductive connection part. The distance between the surface of the second conductor pad facing the connection pad and the first surface is shorter than the distance between the surface of the first insulating layer and the upper surface of the second insulating layer; The distance between the surface of the first insulating layer and the first surface of the wiring body is approximately equal to the distance between the surface and the upper surface of the second insulating layer, and the connection portion includes a plurality of particles and an insulating resin, and a gap between the surface of the first insulating layer and the second surface of the wiring body is filled with the plurality of particles and the insulating resin.

According to the embodiments of the present invention, it is believed that a wiring board is provided in which the connection path between the internal conductor and the mounted components is short, and therefore desired electrical characteristics can be easily obtained.

FIG. 1 is a cross-sectional view showing an example of a wiring board according to an embodiment of the present invention. An enlarged view of part II in FIG. 1. An enlarged view of part III in FIG. 1. FIG. 3 is a cross-sectional view showing another example of the wiring body in one embodiment of the present invention. FIG. 1 is a cross-sectional view showing an example of a manufacturing process of a wiring board according to an embodiment. FIG. 1 is a cross-sectional view showing an example of a manufacturing process of a wiring board according to an embodiment. FIG. 1 is a cross-sectional view showing an example of a manufacturing process of a wiring board according to an embodiment. FIG. 1 is a cross-sectional view showing an example of a manufacturing process of a wiring board according to an embodiment. FIG. 1 is a cross-sectional view showing an example of a manufacturing process of a wiring board according to an embodiment. FIG. 3 is a cross-sectional view showing an example of a manufacturing process of a wiring body in one embodiment. FIG. 3 is a cross-sectional view showing an example of a manufacturing process of a wiring body in one embodiment. FIG. 3 is a cross-sectional view showing an example of a manufacturing process of a wiring body in one embodiment. FIG. 3 is a cross-sectional view showing an example of a manufacturing process of a wiring body in one embodiment. FIG. 3 is a cross-sectional view showing an example of a manufacturing process of a wiring body in one embodiment. FIG. 3 is a cross-sectional view showing an example of a manufacturing process of a wiring body in one embodiment. FIG. 3 is a cross-sectional view showing an example of a manufacturing process of a wiring body in one embodiment. FIG. 3 is a cross-sectional view showing an example of a wiring board according to another embodiment of the present invention.

A wiring board according to an embodiment of the present invention will be explained with reference to the drawings. FIG. 1 shows a cross-sectional view of a wiring board 1, which is an example of the wiring board of this embodiment. Note that the wiring board 1 is only an example of the wiring board of this embodiment. For example, the laminated structure of the wiring board of this embodiment and the number of conductive layers and insulating layers included in the wiring board of this embodiment are the same as the laminated structure of the wiring board 1 of FIG. The number of conductive layers and insulating layers is not limited. In addition, in the drawings referred to in the following description, certain parts may be enlarged to make it easier to understand the disclosed embodiments, and each component may differ from the other in terms of size and length. may not be drawn to exact proportions.

As shown in FIG. 1, the wiring board 1 includes a core board 100 including an insulating layer 101 and conductor layers 102 formed on both sides of the insulating layer 101. Insulating layers and conductive layers are alternately laminated on each of both sides of the core substrate 100. Specifically, on one surface F1 of the core substrate 100, a first buildup section 10 is formed in which an insulating layer 11, a conductor layer 12, an insulating layer 111, and a conductor layer 112 are stacked. On the other hand, on the other surface F2 of the core substrate 100, a second build-up portion 20 is formed in which an insulating layer 21 and a conductor layer 22 are laminated. That is, the wiring board 1 includes an insulating layer 111 and a conductor layer 112 formed on the surface S1 of the insulating layer 111. The insulating layer 111 is the outermost insulating layer among the insulating layers constituting the first buildup section 10, and is also referred to as the "first insulating layer 111." The conductor layer 112 is the outermost conductor layer among the conductor layers constituting the first buildup section 10, and is also referred to as the "first conductor layer 112."

Note that in the description of the wiring board of the embodiment, the side far from the insulating layer 101 is also referred to as "upper", "upper side", "outer side", or simply "outer". On the other hand, the side closer to the insulating layer 101 is also referred to as "lower", "lower side", "inside", or simply "inner". Further, in each component of the wiring board of the embodiment, the surface facing away from the core board 100 is also referred to as the "upper surface", and the surface facing the core board 100 side is also referred to as the "lower surface". Note that the thickness direction of the wiring board 1 is also simply referred to as the "Z direction."

Each of the conductor layers 102, 12, 112, and 22 included in the wiring board 1 includes an arbitrary conductor pattern. In particular, the first conductor layer 112 includes a plurality of conductor pads P1. The conductor pad P1 is used for electrical connection with wiring within the wiring body WS, which will be described later. Therefore, conductor pad P1 is also referred to as "connection pad P1." The connection pad P1 included in the first conductor layer 112 has electrical conductivity. In this way, the wiring board 1 includes a plurality of electrically conductive connection pads P1 formed on the surface of the first insulating layer 111. In the example of FIG. 1, the first conductor layer 112 protrudes from the surface S1 of the first insulating layer 111, and therefore the connection pad P1 also protrudes from the surface S1. Since the connection pad P1 protrudes from the surface S1, it is considered that the connection pad P1 and the wiring body WS are connected more reliably.

The wiring board 1 further includes a second insulating layer 110 formed on the surface S1 of the first insulating layer 111 and the first conductor layer 112. The second insulating layer 110 covers the first insulating layer 111, and may cover the first conductor layer 112, although not shown. The second insulating layer 110 has an upper surface S2 facing in the opposite direction to the first insulating layer 111. The second insulating layer 110 further has an opening 110a that is a through hole passing through the second insulating layer 110 in its thickness direction and exposing the connection pad P1. In the example of FIG. 1, a plurality of connection pads P1 are exposed within the opening 110a. On the other hand, a third insulating layer 210 is formed on the second buildup section 20. An opening 210a is formed in the third insulating layer 210, and the conductor pad 22p of the outermost conductor layer 22 in the second buildup section 20 is exposed from the opening 210a. The second insulating layer 110 and the third insulating layer 210 may be a solder resist layer that covers the outermost interlayer insulating layer and the conductor layer of the wiring board 1.

The wiring board 1 further includes a wiring body WS disposed within the opening 110a of the second insulating layer 110. The wiring body WS has an upper surface (first surface A) and a lower surface (second surface B) opposite to the first surface A, and is placed inside the opening 110a with the second surface B facing the first insulating layer 111. It is located in The wiring body WS includes a plurality of conductor pads OP (first conductor pads) formed on the first surface A. The conductor pad OP is a component mounting conductor pad used to connect the wiring board 1 and an external component mounted on the wiring board 1. That is, the first surface A of the wiring body WS constitutes a component mounting surface IS on the wiring board 1. FIG. 1 shows an example in which components E1 to E3 are mounted on a wiring board 1 using a plurality of conductor pads OP.

The wiring body WS further includes a plurality of conductor pads IP (second conductor pads) on the second surface B, and the conductor pads IP are exposed on the second surface B. The plurality of conductor pads IP are connected to the plurality of connection pads P1 of the first conductor layer 112. In the example of FIG. 1, the conductor pad IP is electrically connected to any one of the plurality of conductor pads OP of the wiring body WS. Therefore, in the example of FIG. 1, when external components E1 to E3 are connected to conductor pad OP, conductor pad IP is electrically connected to any of the external components E1 to E3 via conductor pad OP.

The insulating layers 101, 11, 111, and 21 constituting the wiring board 1 may each be formed using an insulating resin such as epoxy resin, bismaleimide triazine resin (BT resin), or phenol resin. Each insulating layer 101, 11, 111, 21 may contain a reinforcing material (core material) such as glass fiber, and/or an inorganic filler such as silica or alumina. The second insulating layer 110 and the third insulating layer 210, which may be solder resist layers, may be formed using, for example, photosensitive epoxy resin or polyimide resin.

A through-hole conductor 103 is formed in the insulating layer 101 to connect the conductor layers 102 on both sides of the insulating layer 101. Via conductors 13 and 23 are formed in each of the insulating layers 11, 111, and 21 to connect the conductor layers sandwiching the insulating layers 11, 111, and 21, respectively. The through-hole conductor 103 in the example of FIG. 1 has a cylindrical shape along the inner wall of a through hole that penetrates the insulating layer 101 in its thickness direction. The inside (cavity portion) of the cylindrical through-hole conductor 103 is filled with a filler 104 made of, for example, an insulating resin such as epoxy resin, or a conductive resin containing metal particles.

The conductor layers 102, 12, 112, 22, the via conductors 13, 23, and the through-hole conductor 103 are formed using any metal such as copper or nickel, for example, metal foil such as copper foil, and/or It can be made of a metal film formed by plating, sputtering, or the like. Although the conductor layers 102, 12, 112, 22, the via conductors 13, 23, and the through-hole conductor 103 are shown as having a single layer structure in FIG. 1, they may have two or more metal layers, such as metal foil, electroless plating It may have a multilayer structure including a film or sputtered film and an electrolytically plated film.

The component mounting surface IS constituted by the first surface A of the wiring body WS has a component area in which each external component is arranged, and in the example of FIG. It includes an area EA1 (first component area), a component area EA2 (second component area), and a component area EA3 (third component area). Components E1, E2, and E3 are arranged in component areas EA1, EA2, and EA3, respectively. The component areas EA1, EA2, and EA3 each include a part of the plurality of conductor pads OP of the wiring body WS. That is, the plurality of conductor pads OP are arranged across the three component areas EA1, EA2, and EA3, and are located in each of the component areas EA1, EA2, and EA3. The conductor pad OP can be electrically and mechanically connected to the electrodes of the components E1, E2, and E3, for example, via a conductive bonding material (not shown) such as solder.

Examples of the components E1 to E3 that can be mounted on the wiring board 1 include electronic components such as semiconductor integrated circuit devices and active components such as transistors. That is, an MCM (Multi Chip Module) can be configured by the wiring board 1 and the components E1 to E3. The component E1 may be, for example, an integrated circuit such as a logic chip incorporating a logic circuit, or a processing device such as an MPU (Micro Processor Unit), and the components E2 and E3 may be, for example, an integrated circuit such as an HBM (High Bandwidth Memory). It may be a memory element, etc.

Note that the surface of the wiring board 1 opposite to the component mounting surface IS is connected to an external element when the wiring board 1 itself is mounted on an external element such as an external wiring board (for example, a motherboard of any electrical device). It can be a connecting surface. The conductive pad 22p can be connected to any substrate, electrical component, mechanical component, or the like.

The configuration of the wiring body WS and the connection structure between the wiring body WS and the plurality of connection pads P1 will be further explained with reference to FIGS. 2 and 3. 2 is an enlarged view of section II in FIG. 1, and FIG. 3 is an enlarged view of section III in FIG.

As shown in FIG. 2, the wiring body WS includes one or more wiring layers (in the example of FIG. 2, a plurality of wiring layers including wiring layers 320 to 322) and an interlayer insulating layer 31. In the example of FIG. 2, a wiring layer 320, three wiring layers 321, and a wiring layer 322 are provided in order from the second surface B side, and an interlayer insulating layer 31 is interposed between each wiring layer. . The plurality of wiring layers 320 to 322 are stacked with an interlayer insulating layer 31 in between. The wiring layer 320 includes a plurality of conductor pads IP, and the wiring layer 322 includes a plurality of conductor pads OP. A via conductor 33 passing through each interlayer insulating layer 31 is formed in each interlayer insulating layer 31 . The via conductor 33 connects the wiring layers sandwiching each interlayer insulating layer 31 between them. The wiring layers 320 to 322 in the wiring body WS may be formed by a different process from that of the conductor layers 102, 12, 112, and 22 (see FIG. 1). Therefore, each of the wiring layers 320 to 322 may include wiring that is finer and arranged at a higher density than the wiring that the conductor layer 112 or the like may include.

The first surface A of the wiring body WS is constituted by the surface (upper surface) of the interlayer insulating layer 31 located closest to the first surface A among the plurality of interlayer insulating layers 31. The second surface B is constituted by the surface (lower surface) of the interlayer insulating layer 31 located closest to the second surface B. In FIG. 2, the wiring layer 320 is embedded in the interlayer insulating layer 31 constituting the second surface B, so the second surface B includes the lower surface of the interlayer insulating layer 31 closest to the second surface and the contact pad IP. It is constituted by the front surface (lower surface) of the wiring layer 320, such as the front surface (lower surface). On the other hand, the wiring layer 322 protrudes from the first surface A of the wiring body WS, and the conductor pad OP also protrudes from the first surface A.

A metal layer PS is formed on the surface of the conductor pad OP. The metal layer PS is composed of two layers: a base layer PS1 and a connection layer PS2 on the base layer PS1. The base layer PS1 is formed by, for example, electroless plating or electrolytic plating, contains metal such as nickel, and functions as a barrier layer between the connection layer PS2 and the conductor pad OP. The connection layer PS2 is also formed by electroless plating or electrolytic plating, but the connection layer PS2 contains a metal with a relatively low melting point, such as tin, and further contains a few percent of silver or copper. It may be included in the content. The connection layer PS2 preferably dissolves when the components E1 to E3 and the conductor pad OS are connected, and contributes to the electrical and mechanical connection between the components E1 to E3 and the conductor pad OS.

The interlayer insulating layer 31 may be formed using an insulating resin such as epoxy resin or phenol resin, for example. The interlayer insulating layer 31 may include any one of a fluororesin, a liquid crystal polymer (LCP), a fluorinated ethylene resin (PTFE), a polyester resin (PE), and a modified polyimide resin (MPI). Examples of the conductor constituting the wiring layers 320 to 322 and the via conductor 33 include copper and nickel. The wiring layers 320 to 322 and the via conductor 33 include a metal film layer (for example, an electroless copper plating film layer) NP (see FIG. 3) and a plating film layer (for example, an electrolytic copper plating film) EP (see FIG. 3). It has a two-layer structure.

In the wiring body WS in the example of FIG. 2, the three wiring layers 321 are embedded in the interlayer insulating layer 31 below each wiring layer 321, that is, in the upper surface of the interlayer insulating layer 31 formed before each wiring layer 321. It is. These three wiring layers 321 are composed of conductors that fill grooves formed in the upper surface of the interlayer insulating layer 31 below each wiring layer 321. The wiring layer 321 embedded in the lower interlayer insulating layer 31 may have a wiring group FW having a relatively small wiring width and a relatively small distance between wirings. The wiring layer 321 may include a wiring group FW having the smallest wiring width and distance between wirings among the wirings constituting the wiring board 1. Wiring having a characteristic impedance more appropriate for electric signals propagating within the wiring body WS may be provided. Further, the density of wiring within the wiring body WS may be improved, and the degree of freedom in wiring design may be improved.

The minimum value of the wiring width LW of each wiring of the wiring group FW included in the wiring body WS may be, for example, 3.0 μm or less, and the minimum value of the inter-wiring distance GW of the wiring group FW may be, for example, 3.0 μm or less. . Further, the aspect ratio of each wire in the wire group FW may be, for example, 1.8 or more and 6.0 or less.

In the example of FIG. 2, among the one or more wiring layers 320 to 322 included in the wiring body WS, three wiring layers 321 are embedded in the interlayer insulating layer 31 below each of them, and one of them The layer includes a wiring group FW. However, each of the three wiring layers 321 may include a wiring group FW having the smallest wiring width and the smallest distance between wirings in the wiring board 1. Furthermore, the wiring body WS may include any number of wiring layers embedded in the lower interlayer insulating layer. As shown in the example of FIG. 2, a part of one or more wiring layers 320 to 322 included in the wiring body WS may be embedded in the lower interlayer insulating layer 31, or all of one or more wiring layers 320 to 322 may be embedded in the lower interlayer insulating layer 31. may be embedded in the lower interlayer insulating layer 31. Note that when the wiring layer 322 is embedded in the upper surface of the interlayer insulating layer 31 constituting the first surface A of the wiring body WS, the upper surface of the interlayer insulating layer 31 and the upper surface of the wiring layer 322 (for example, the upper surface of the conductor pad OP) ) constitutes the first surface A of the wiring body WS.

A high frequency signal may be transmitted to the wiring group FW included in the wiring body WS. Therefore, it is preferable that the interlayer insulating layer 31 has characteristics that are advantageous for transmitting high-frequency signals, and it may be preferable that the interlayer insulating layer 31 is made of a material with a small dielectric constant and a small dielectric loss tangent. For example, the interlayer insulating layer 31 may have a dielectric constant of 3.3 or less and a dielectric loss tangent of 0.03 or less at a frequency of 1 GHz.

As shown in FIG. 2, among the plurality of conductor pads OP of the wiring body WS, nine conductor pads OP near the center are located in the component area EA1, and four conductor pads OP on the left side thereof are located in the component area. The remaining four conductor pads OP are located in the component area EA3. That is, when the wiring board 1 is used, the nine conductor pads OP near the center are connected to the component E1, the four conductor pads OP to the left thereof are connected to the component E2, and the remaining four conductor pads OP are connected to the component E3. obtain.

The wiring body WS illustrated in FIG. 2 includes wiring BW that electrically connects each of the plurality of conductor pads OP. In the example of FIG. 2, among the three wiring layers 321, two wiring layers 321 on the second surface B side include wiring BW. The wiring BW is connected to one of the plurality of conductor pads OP via a via conductor 33 at two portions such as both ends thereof. In the wiring board 1 of the embodiment, the conductor pads OP in at least two of the component areas EA1 to EA3 are connected to each other via any wiring layer in the wiring body WS. In the example of FIG. 2, a part of the conductor pad OP arranged in the component area EA1 and a part of the conductor pad OP arranged in the component area EA2 are electrically connected via the wiring BW of the wiring layer 321. It is connected. Further, a part of the conductor pads OP arranged in the component area EA1 and a part of the conductor pads OP arranged in the component area EA3 are electrically connected via the wiring BW of the wiring layer 321. There is. With such a configuration, when three components E1, E2, and E3 are mounted as shown in the diagram when the wiring board 1 is used, each of the adjacent components is considered to be electrically connected through a short path. It will be done. Therefore, it is considered that stable operation can be easily obtained in each of the components E1 to E3.

Note that in the wiring board 1 of the embodiment, in the example of FIG. It may be electrically connected only to some or all of the conductor pads OP arranged, or it may be electrically connected only to some or all of the conductor pads OP arranged in the component area EA3. good. Further, some or all of the conductor pads OP arranged in the component area EA2 and some or all of the conductor pads OP arranged in the component area EA3 are connected to each other via any of the wiring layers 320 to 322. It may be electrically connected. In that case, the conductor pad OP disposed in the component area EA1 is electrically connected to either or both of the conductor pad OP disposed in the component area EA2 and the conductor pad OP disposed in the component area EA3. You don't have to.

As described above, in the wiring body WS, the conductor pad IP and the conductor pad OP are electrically connected. Specifically, in the example of FIG. 2, conductor pad IP and conductor pad OP are electrically connected via wiring layers 320 to 322 and via conductor 33 that constitute wiring body WS. In this embodiment, the conductor pad IP of the wiring body WS and the connection pad P1 exposed in the opening 110a of the second insulating layer 110 are in contact with each other via the conductive connection part 4. That is, conductor pad IP and connection pad P1 are electrically connected. Therefore, wiring layers configuring the wiring body WS such as the wiring layers 320 to 322 and conductor layers formed separately from the wiring body WS such as the first conductor layer 112 are electrically connected through a short path. can do.

Further, since the conductor pad IP and the connection pad P1 are electrically connected, the first conductor layer 112 and the conductor pad OP of the wiring body WS are also connected via the conductor in the wiring body WS, such as the via conductor 33. electrically connected. Therefore, the conductor pattern of the conductor layer 112 and the conductor layer 12 (see FIG. 1) provided directly under the wiring body WS in plan view, such as the connection pad P1, and the components E1 to 1 mounted when the wiring board 1 is used. It may be possible to electrically connect electronic components such as E3 through a short path. Note that "planar view" means viewing the wiring board of the embodiment from a line of sight parallel to its thickness direction (Z direction).

In particular, a conductor pattern provided directly below the wiring body WS and a specific circuit element located directly above the conductor pattern across the wiring body WS in electronic components such as components E1 to E3 are connected through a short path. There are things you can do. In this way, in the wiring board 1 of the embodiment, when the wiring board 1 is used, the conductor such as the internal conductor layer and the components mounted on the wiring board 1 can be connected through a short path, so that the components mounted on the wiring board 1 can be connected through short paths. It is considered that the electrical characteristics of the component are likely to be stably exhibited without deterioration. Therefore, it is considered that desired electrical characteristics can be easily obtained.

In this embodiment, the connecting portion 4 includes a plurality of particles 41 and an insulating resin 42. The plurality of particles 41 and the insulating resin 42 fill the gap G between the surface S1 of the first insulating layer 111 and the second surface B of the wiring body WS. That is, the connecting portion 4 is interposed between the surface S1 and the second surface B. The insulating resin 42 functions as an adhesive. The surface S1 of the first insulating layer 111 and the second surface B of the wiring body WS are bonded by the insulating resin 42. Similarly, a surface FS1 of the connection pad P1 facing the conductor pad IP and a surface FS2 of the conductor pad IP facing the connection pad P1 are bonded together by the insulating resin 42. In the examples of FIGS. 2 and 3, adjacent connection pads P1 of the plurality of connection pads P1 are insulated by the insulating resin 42, and similarly, the insulating resin 42 insulates the plurality of conductor pads P1 from each other. Adjacent conductor pads IPs among the IPs are insulated from each other. However, the facing surface FS1 of the connection pad P1 and the facing surface FS2 of the conductor pad IP are in contact with each other via the particles 41 of the connecting portion 4.

As shown in FIG. 3, the particles 41 included in the connecting portion 4 include a core portion 41a forming a central portion, a metal portion 41b covering the core portion 41a, and a surface portion of the particle 41 covering the metal portion 41b. It has a covering part 41c. As shown in FIG. 3, the particles 41 between the connection pad P1 and the conductor pad IP are pressed by the connection pad P1 and the conductor pad IP, so that the particles 41 at the contact portions between the connection pad P1 and the conductor pad IP, respectively. It has a flattened shape. In each of these contact portions, a metal portion 41b is exposed on the surface of the particle 41, and the exposed metal portion 41b electrically connects the connection pad P1 and the conductor pad IP. The metal portion 41b is made of, for example, nickel, copper, or gold. Examples of the insulating resin 42 include thermosetting resins such as epoxy resins and acrylic resins. The connecting portion 4 is provided using, for example, a so-called anisotropic conductive film, an anisotropic conductive sheet, or the like.

Note that in embodiments other than this embodiment, the connecting portion 4 may have any structure, shape, and properties that partially or entirely include a conductor. For example, in such an embodiment, the connection pad P1 and the conductor pad IP may be joined by metal-to-metal ultrasonic bonding. In that case, the connecting portion 4 may be configured by a deformed portion due to friction (a portion where interatomic bonding occurs) on the opposing surfaces of the connecting pad P1 and the conductor pad IP, respectively. The conductor included in the connection part 4 is, for example, a connection material (not shown) such as solder used to connect the components E1 to E3 and the wiring board 1, or a connection layer PS2 of the metal layer PS that contributes to the connection. It may also be composed of a metal with a higher melting point than the metal.

In the wiring board 1 in the example of FIGS. 2 and 3, the conductor pad IP and the connection pad P1 are connected using connection bumps made of metal such as solder or gold on the connection pad P1 before placing the wiring body WS. connected without being connected. That is, in the wiring board 1 of the embodiment, the wiring body WS is preferably connected to the connection pad P1 without bumping. When the wiring body WS and the connection pad P1 are connected via the metal bump for connection, a relatively thick connection layer based on the metal bump is likely to be formed between the connection pad P1 and the conductor pad IP. Therefore, it may not be possible to obtain a wiring board with a desired thickness (thinness) or an electronic component module with a desired thickness (thinness) including electronic components mounted on the wiring board.

However, in this embodiment, since the wiring body WS is connected to the connection pad P1 by the connection part 4 illustrated in FIG. It is thought that a component module can be obtained. A wiring board 1 having a desired thickness and an electronic component module including the wiring board 1 may be obtained.

In the wiring board 1 to which the wiring body WS is connected in this way, the Z between each surface of the wiring body WS, each surface of the first and second insulating layers 111 and 110, and the opposing surface FS1 of the connection pad IP. The positional relationship in direction will be explained with continued reference to FIG.

As shown in FIG. 3, the distance D3 between the surface FS2 of the conductor pad IP of the wiring body WS facing the connection pad P1 and the first surface A of the wiring body WS is the distance D3 between the surface S1 of the first insulating layer 111 and the second surface FS2 of the conductor pad IP of the wiring body WS. It is shorter than the distance D1 from the upper surface S2 of the insulating layer 110. On the other hand, the distance D2 between the surface S1 of the first insulating layer 111 and the first surface A of the wiring body WS is approximately equal to the distance D1 between the surface S1 of the first insulating layer 111 and the upper surface S2 of the second insulating layer 110. . That is, since the distance D1 and the distance D2 are substantially equal, substantially the entire wiring body WS, except for the conductor pad OP protruding from the first surface A of the wiring body WS, is connected to the second layer constituting the outermost layer of the wiring board 1. It is housed within an opening 110a of the insulating layer 110. Therefore, the wiring board 1 including fine wiring included in the wiring body WS is realized without increasing the thickness due to the provision of the wiring body WS. A distance D2 (distance between the surface S1 of the first insulating layer 111 and the first surface A of the wiring body WS) that is substantially equal to the distance D1 is, for example, 25 μm or more and 45 μm or less.

Furthermore, under the substantially same relationship between the distances D1 and D2, the distance D3 is shorter than the distance D1. A gap G exists between the surface S1 and the surface S1. Since the gap G exists, the connection pad P1 can be made to protrude from the surface S1 so that the connection pad P1 and the conductor pad IP are connected more reliably. In the example shown in FIG. 3, the connection pad P1 actually protrudes from the surface S1, and it is considered that a more reliable connection with the conductor pad IP is realized. In this manner, in this embodiment, a relatively thin wiring board that partially includes fine wiring, has short connection paths with mounted components, and is relatively thin can be realized.

Furthermore, in the example of FIG. 3, the distance D3 is greater than the distance D4 in the Z direction between the opposing surface FS1 of the connection pad P1 and the upper surface S2 of the second insulating layer 110 (height of the upper surface S2 with respect to the opposing surface FS1). small. Therefore, a gap G1 is also generated between the opposing surface FS1 of the connection pad P1 and the opposing surface FS2 of the conductor pad IP. Therefore, the particles 41 including the metal part 41b can be interposed between the facing surface FS1 and the facing surface FS2, and therefore, a more reliable electrical connection between the connection pad P1 and the conductive pad IP is realized. Conceivable. The length of the gap G1 (the thickness of the connection portion 4 between the conductor pad IP and the connection pad P1) is, for example, 2 μm or more and 5 μm or less. In the example of FIG. 3, the connection pad P1 is provided with a surface treatment layer PSS including three layers, for example, a nickel layer, a palladium layer, and a gold layer, on its surface. When the connection pad P1 is provided with the surface treatment layer PSS as in the example of FIG. 3, the facing surface FS1 is the surface facing the conductor pad IP in the surface treatment layer PSS, as shown in FIG. Note that the connection pad P1 may have any number of surface treatment layers other than three.

Further, as shown in FIG. 3, the wiring body WS illustrated in FIGS. 1 to 3 includes a plurality of via conductors 33 that penetrate mutually different interlayer insulating layers 31. Each of the plurality of via conductors 33 connects the wiring layer 320 and the wiring layer 321, connects the wiring layers 321 to each other, or connects the wiring layer 321 and the wiring layer 322. A plurality of via conductors 33 penetrating these mutually different interlayer insulating layers 31 are formed so as to overlap each other in a plan view, and constitute a stacked via conductor. In the example of FIG. 3, conductor pad IP and conductor pad OP are connected by a stacked via conductor. Therefore, the connection pad P1 and, for example, the component E3 (see FIG. 1) may be electrically connected through a substantially shortest path.

FIG. 4 shows a wiring body WS1 that is a modification of the wiring body WS shown in FIGS. 1 to 3. In FIG. In the example wiring body WS1 of FIG. 4, none of the wiring layers 320 to 322 is embedded in the lower interlayer insulating layer 31. In this way, the wiring board 1 of the embodiment may include the wiring body WS1 that does not include a wiring layer embedded in the lower interlayer insulating layer 31. In the wiring body WS1 shown in FIG. 4, the wiring layer 320 and three wiring layers 321 constituting the wiring body WS1 protrude into the upper interlayer insulating layer 31, and the wiring layer 322 is Like the wiring layer 322 shown, it protrudes from the first surface A of the wiring body WS1.

With reference to FIGS. 5A to 5E, a method for manufacturing the wiring board according to the embodiment will be described, taking as an example the case in which the wiring board 1 shown in FIG. 1 is manufactured. First, as shown in FIG. 5A, a core substrate 100 is prepared. To prepare the core substrate 100, for example, a double-sided copper-clad laminate including the insulating layer 101 is prepared. Then, a conductor layer 102 including a predetermined conductor pattern is formed on both sides of the insulating layer 101 by a subtractive method or the like, and a through-hole conductor 103 is formed in the insulating layer 101. Filler 104 is formed in the cavity of through-hole conductor 103 by injecting epoxy resin or the like.

As shown in FIG. 5B, an insulating layer 11 is formed on one surface F1 of the core substrate 100, and a conductor layer 12 is formed on the insulating layer 11. An insulating layer 21 is formed on the other surface F2 of the core substrate 100, and a conductor layer 22 is formed on the insulating layer 21. For example, the insulating layers 11 and 21 are formed by thermocompression bonding a film-like insulating resin onto the core substrate 100. The conductor layers 12 and 22 are formed by using any method such as a semi-additive method after forming through holes in the insulating layers 11 and 21 by, for example, irradiation with laser light. Along with the formation of the conductor layers 12 and 22, via conductors 13 and 23 are formed inside the through holes formed in the insulating layers 11 and 21.

As shown in FIG. 5C, on one surface F1 side of the core substrate 100, the insulating layer and the conductor layer are repeatedly laminated to form the first buildup portion 10. On the other surface F2 side of the core substrate 100, the insulating layer and the conductor layer are repeatedly laminated to form the second build-up portion 20. The outermost conductor layer (first conductor layer 112) in the first buildup section 10 is formed to include the connection pad P1. The outermost conductor layer 22 in the second buildup section 20 is provided with a conductor pad 22p. A surface treatment layer PSS (see FIG. 3) including three layers, a nickel layer, a palladium layer, and a gold layer, may be formed on the surfaces of the connection pad P1 and the conductor pad 22p, for example, by electroless plating.

As shown in FIG. 5D, a second insulating layer 110 is formed on the first build-up part 10, and a third insulating layer 210 is formed on the second build-up part 20. An opening 110a is formed in the second insulating layer 110 to expose the connection pad P1. An opening 210a is formed in the third insulating layer 210 to expose the conductor pad 22p. For example, the second and third insulating layers 110 and 210 are formed by forming a photosensitive epoxy resin film by spray coating, curtain coating, or film attachment, and the openings 110a and 210 are formed by exposure and development. 210a may be formed.

As shown in FIG. 5E, a wiring body WS formed, for example, by a method described later is placed in the opening 110a, and the conductor pad IP of the wiring body WS and the connection pad P1 of the first conductor layer 112 are electrically connected. connected to. FIG. 5E shows a method using a resin film 40 containing particles containing a conductor and an insulating resin as illustrated in FIGS. 2 and 3. Note that when, for example, the aforementioned ultrasonic bonding is used to electrically connect the conductor pad IP and the connection pad P1, ultrasonic waves are applied to the wiring body WS after the wiring body WS is placed in the opening 110a. The ultrasonic vibration causes the metal atoms of the conductor pad IP and the connection pad P1 to approach each other until interatomic bonding occurs, thereby joining the conductor pad IP and the connection pad P1.

In the example of FIG. 5E, resin film 40 is placed within opening 110a. The resin film 40 is temporarily bonded to the first insulating layer 111 and the first conductive layer 112 by heating as appropriate. The wiring body WS is placed thereon with the second surface B facing the bottom of the opening 110a, and heated and pressurized. The wiring body WS, the first insulating layer 111, and the first conductive layer 112 are bonded together by the insulating resin in the resin film 40 being melted by heating and pressurizing and then re-hardened. Furthermore, the particles in the resin film 40 that are sandwiched and pressed between the conductor pad IP and the connection pad P1 are deformed, thereby exposing the metal portions 41b (see FIG. 3) within the particles. By contacting the conductor pad IP and the connection pad P1 via the exposed metal portion 41b, both pads are electrically connected to each other. The wiring body WS is arranged and fixed in the opening 110a so that the distance D1 and the distance D2 described above with reference to FIG. 3 are approximately equal. As a result, the wiring board 1 of the example shown in FIG. 1 is completed.

Next, using the wiring body WS shown in FIG. 2 as an example, a method for forming the wiring body included in the wiring board of the embodiment will be described with reference to FIGS. 6A to 6I. First, as shown in FIG. 6A, a first support substrate GS1, which is a glass substrate and has a good surface flatness, is prepared. Note that in forming the wiring bodies, a plurality of wiring bodies may be formed on one first support substrate GS1. In the examples of FIGS. 6A to 6I, a plurality of wiring bodies are formed in a connected state, but only one of them is illustrated. In addition, in the following explanation regarding the method for forming a wiring body, the side closer to the first support substrate GS1 is referred to as "lower" or "lower side", and the side farther from the first support substrate GS1 is referred to as "upper" or "upper side". It is called. Therefore, the surface of each element constituting the wiring body facing the first support substrate GS1 side is referred to as the "lower surface", and the surface facing the side opposite to the first support substrate GS1 is also referred to as the "upper surface".

On one surface of the first support substrate GS1, an adhesive layer AL1 containing an azobenzene-based polymer adhesive, which can be attached and detached by, for example, light irradiation, is provided, and a metal film layer NP is formed on the adhesive layer AL1. The metal film layer NP is, for example, a metal film (preferably a copper film) formed by electroless plating or sputtering. The metal film layer NP may be formed by adhering a relatively thin metal foil.

As shown in FIG. 6B, a wiring layer 320 including a metal film layer NP (see FIG. 6A) and an electroplated film layer EP (see FIG. 3) is formed on the support substrate GS1 via an adhesive layer AL1. Ru. The wiring layer 320 is formed to include the conductor pad IP. In forming the wiring layer 320, for example, a plating resist (not shown) is formed on the metal film layer NP, and an opening corresponding to the formation area of the conductor pad IP is formed in the plating resist by, for example, photolithography. Next, an electroplated film is formed in the opening of the plating resist by electrolytic plating using the metal film layer NP as a power supply layer. Thereafter, the plating resist is removed, and the metal film layer NP exposed by the removal of the plating resist is removed by etching. A wiring layer 320 shown in FIG. 6B is obtained.

As shown in FIG. 6C, interlayer insulating layer 31 covering wiring layer 320 is formed. The interlayer insulating layer 31 is formed using an insulating resin such as epoxy resin or phenol resin, for example. Fluororesin, LCP, PTFE resin, PE resin, or MPI resin may be used.

Grooves T1 and T2 are formed in the interlayer insulating layer 31. The trench T1 is formed at a position where the via conductor 33 is to be formed, and penetrates the interlayer insulating layer 31 to expose the wiring layer 320. The trench T2 is formed at a position corresponding to the wiring pattern of the wiring layer 321 embedded in the interlayer insulating layer 31. The grooves T1 and T2 are formed, for example, by laser processing using an excimer laser. Then, a metal film layer NP is formed to cover the entire upper surface of the wiring layer 320 exposed from the interlayer insulating layer 31 and the trench T1, and an electroplated film layer EP is formed by electrolytic plating using the metal film layer NP as a power supply layer. be done. A via conductor 33 is formed in the trench T1, and a wiring layer 321 is formed in the trench T2.

As shown in FIG. 6D, part of the electroplated film layer EP and the metal film layer NP (see FIG. 6C) is removed by polishing. A wiring layer 321 including desired wiring patterns separated from each other is obtained. The electroplated film layer EP and the metal film layer NP are polished by, for example, chemical mechanical polishing (CMP). Then, the formation of the interlayer insulating layer 31 and the formation of the wiring layer 321 are repeated on the upper surface of the interlayer insulating layer 31 and the formed wiring layer 321 exposed by the polishing.

As shown in FIG. 6E, the uppermost interlayer insulating layer 31 of the wiring body WS is formed on the uppermost wiring layer 321. An opening 33a is formed in this interlayer insulating layer 31, a wiring layer 322 is formed by, for example, a semi-additive method, and a via conductor 33 is formed within the opening 33a. The wiring layer 322 is formed to include a plurality of conductor pads OP. On the upper surface of the conductor pad OP, for example, a metal layer PS including a base layer PS1 containing nickel and a connection layer PS2 containing tin is formed by electroless plating or electrolytic plating.

As shown in FIG. 6F, the second support substrate GS2 is attached on the wiring layer 322. The second support substrate GS2 is made of, for example, a glass plate, and is attached to the wiring layer 322 with an adhesive layer AL2 interposed therebetween, with one surface thereof facing the wiring layer 322 side. The adhesive layer AL2 is made of, for example, the same material as the adhesive layer AL1. When a plurality of wiring bodies WS are formed on one first support substrate GS1, one second support substrate GS2 may be attached to the entire plurality of wiring bodies WS.

As shown in FIG. 6G, the first support substrate GS1 is removed. The lower surface of the conductor pad IP and the lower surface of the interlayer insulating layer 31 covering the conductor pad IP, that is, the second surface B of the wiring body WS are exposed. The first support substrate GS1 is peeled off from the conductor pad IP and the interlayer insulating layer 31 after the adhesive layer AL1 is softened by irradiating the adhesive layer AL1 with a laser beam, for example. Note that the adhesive layer AL1 that may remain on the second surface B side can be removed by cleaning. When one second support substrate GS2 is attached to a plurality of interconnected wiring bodies WS in a connected state, the plurality of interconnected wiring bodies WS are separated into pieces together with the second support substrate GS2. For example, the second support substrate GS2 and the connected wiring body WS are cut along a predetermined cutting line C using a dicing saw. Individual wiring bodies WS each having the second support substrate GS2 on the first surface A side are obtained.

As described with reference to FIG. 5E, each wiring body WS is arranged in the opening 110a of the second insulating layer 110, and the conductor pad IP and the connection pad P1 are electrically connected. Thereafter, the second support substrate GS2 is removed in the same manner as the separation of the first support substrate GS1. The wiring board 1 shown in FIG. 1 is completed.

Note that when the wiring body WS1 in the example of FIG. 4 is formed, the method for forming the wiring layer 321 described with reference to FIGS. 6C and 6D is not used, but the method for forming the wiring layer 321 described above is used. The wiring layer 321 is formed using a method similar to that for forming the layer 322. For example, the wiring layer 321 is formed by a semi-additive method.

FIG. 7 shows a wiring board 1a that is an example of a wiring board of another embodiment different from the one embodiment illustrated in FIG. The wiring board 1a differs from the wiring board 1 of FIG. 1 in that it includes a conductor post MP and two wiring bodies WS2. Except for these points, the wiring board 1a is formed using the same material as the wiring board 1 of FIG. 1, includes the same components, and has the same structure. Components in the wiring board 1a that are similar to those in the wiring board 1 in FIG. 1 are designated with the same symbols in FIG. 7 as those in FIG. Repetitive explanations will be omitted.

The wiring board 1a, like the wiring board 1 of FIG. The wiring body WS2 includes a plurality of conductor pads OP on the surface A and a conductor pad IP on the second surface B. The conductor pad IP and the connection pad P1 are in contact with each other via a conductive connection portion similar to the connection portion 4 described with reference to FIG. The distance between the facing surface FS2 of the conductor pad IP and the first surface A of the wiring body WS2 is shorter than the distance between the surface S1 of the first insulating layer 111 and the upper surface S2 of the second insulating layer 110. The distance between the surface S1 and the first surface A of the wiring body WS2 is approximately equal to the distance between the surface S1 and the upper surface S2 of the second insulating layer 110.

The wiring board 1a includes a first conductor layer 112 including connection pads P1 similarly to the wiring board 1 of FIG. 1, and also includes conductor posts MP formed on the first conductor layer 112. The conductor post MP penetrates the second insulating layer 110 and protrudes from the upper surface S2 of the second insulating layer 110. The conductor post MP has an end surface MPa opposite to the first conductor layer 112, and a portion of the conductor post MP including the end surface MPa opposite to the first conductor layer 112 is the upper surface of the second insulating layer 110. It protrudes from S2. The conductor post MP is made of a metal having appropriate conductivity, such as copper or nickel.

The first conductor layer 112 included in the wiring board 1a includes, in addition to the connection pad P1, a connection pad P2 that is a conductor pad for connection to the conductor post MP. A conductor post MP is formed on the connection pad P2. On the other hand, the second insulating layer 110 included in the wiring board 1a has an opening 110b penetrating the second insulating layer 110 above the connection pad P2. The conductor post MP is configured by, for example, an electroless plating film, a sputtering film, an electrolytic plating film, or a laminate of these metal films, which fills the opening 110b.

The wiring board 1a in the example of FIG. 7 includes a plurality of conductor posts MP, and each conductor post MP is located within the component area EA1 (first component area) and within the component area EA2 (second component area) in plan view. , or formed within the component area EA3 (third component area). That is, the end surface MPa of each conductor post MP is located inside any one of component area EA1, component area EA2, and component area EA3 in plan view, and is located within any one of component area EA1, component area EA2, and component area EA3, and is a conductive pad for mounting each of components E1 to E3. It can be used as Therefore, each of the components E1 to E3 may include an electrode connected to the conductor pad OP of the wiring body WS2 and an electrode connected to the end surface MPa of the conductor post MP.

In the wiring board 1a of the present embodiment, the distance D5 between the surface S1 of the first insulating layer 111 and the end surface MPa of the conductor post MP is the same as the distance D5 between the surface OPa of the conductor pad OP on the side opposite to the first insulating layer 111 side and the first insulating layer 111. It is approximately equal to the distance D6 from the surface S1 of the layer 111. Therefore, it is considered that the components E1 to E3 can be stably placed on the wiring board 1a. In addition, when the conductor pad OP is provided with the metal layer PS on the side opposite to the first insulating layer 111 as in the example of FIGS. This is the surface opposite to the layer 111 side. However, if the conductor pad OP does not have a coating such as the metal layer PS on the side opposite to the first insulating layer 111 side, the surface OPa of the conductor pad OP is opposite to the first insulating layer 11 side of the conductor pad OP. This is the exposed side.

As described above, the wiring board 1a includes two wiring bodies WS2. The two wiring bodies WS2 are individually arranged in two openings 110a separately provided in the second insulating layer 110. The two wiring bodies WS are each arranged so as to partially overlap with two different component regions in a plan view. In FIG. 7, the wiring body WS2 on the left side is arranged so as to partially overlap with each of the component area EA1 and the component area EA2, and the conductor pad OP included in the component area EA1 and the conductor pad OP included in the component area EA2. are electrically connected by wiring within the wiring body WS2. On the other hand, the wiring body WS2 on the right side in FIG. 7 is arranged so as to partially overlap with each of the component area EA1 and the component area EA3, and the conductor pad OP included in the component area EA1 and the conductor pad included in the component area EA3. OP is electrically connected to the wiring body WS2 by wiring. In this way, the wiring board according to the embodiment may include a plurality of wiring bodies arranged so as to partially overlap each of a plurality of component regions.

The wiring board of the embodiment is not limited to the structure illustrated in each drawing and the structure, shape, and material illustrated in this specification. For example, the wiring board of the embodiment may include only one connection pad P1 and one conductor pad IP. The component mounting surface may include any number of component areas greater than or equal to two. The wiring body WS may have any number of interlayer insulating layers and wiring layers. The first buildup section 10 and the second buildup section 20 may have any number of insulating layers and conductive layers. Moreover, the wiring board of the embodiment is not limited to an embodiment having a core board.

1, 1a Wiring board 110 Second insulating layers 110a, 110b Opening 111 First insulating layer 112 First conductor layer 31 Interlayer insulating layers 320 to 322 Wiring layer 33 Via conductor 4 Connection part 41 Particle 41b Metal part 42 Insulating resin A Wiring First surface B of the wiring body Second surface D1 of the wiring body D1 Distance between the surface of the first insulating layer and the upper surface of the second insulating layer D2 Distance between the surface of the first insulating layer and the first surface of the wiring body D3 Second conductor Distance D5 between the opposing surface of the pad and the first surface of the wiring body Distance D6 between the surface of the first insulating layer and the end surface of the conductor post D6 The surface of the first conductor pad opposite to the first insulating layer side and the first insulating layer Distance from the surface of EA1 to EA3 Component area (1st to 3rd component area)
FS2 Opposing surface FW of the second conductor pad Wiring group G Gap between the surface of the first insulating layer and the second surface of the wiring body G1 Gaps between the opposing surface of the connection pad and the opposing surface of the second conductor pad (Conductor pad and the connection pad)
GW Inter-wiring distance of wiring group IP Conductor pad (second conductor pad)
IS Component mounting surface LW Wiring width of wiring group MP Conductor post MPa End surfaces P1, P2 Connection pad OP Conductor pad (first conductor pad)
OPa Surface S1 Surface S2 of first insulating layer Upper surface WS, WS1, WS2 of second insulating layer Wiring body

Claims (12)

a first insulating layer;
a conductive connection pad formed on the surface of the first insulating layer;
a second insulating layer formed on the surface and having an upper surface facing away from the first insulating layer and an opening exposing the connection pad;
It has a first surface constituting a component mounting surface and a second surface opposite to the first surface, and includes one or more wiring layers, and the second surface is directed toward the first insulating layer within the opening. A wiring body arranged in
A wiring board comprising:
The wiring body includes a plurality of first conductor pads formed on the first surface, and a second conductor that is electrically connected to any one of the plurality of first conductor pads and exposed on the second surface. comprising a pad;
The component mounting surface includes a first component area and a second component area each including a part of the plurality of first conductor pads,
The first conductor pad in the first component region and the first conductor pad in the second component region are connected via the wiring layer,
The second conductor pad and the connection pad are in contact with each other via a conductive connection part,
The distance between the surface of the second conductor pad facing the connection pad and the first surface is shorter than the distance between the surface of the first insulating layer and the upper surface of the second insulating layer,
The distance between the surface of the first insulating layer and the first surface of the wiring body is approximately equal to the distance between the surface and the upper surface of the second insulating layer,
The connecting portion includes a plurality of particles having a metal portion and an insulating resin,
A gap between the surface of the first insulating layer and the second surface of the wiring body is filled with the plurality of particles and the insulating resin. 2. The wiring board according to claim 1, wherein a distance between the surface of the first insulating layer and the first surface of the wiring body is 25 μm or more and 45 μm or less. 2. The wiring board according to claim 1, wherein the thickness of the connection portion between the second conductor pad and the connection pad is 2 μm or more and 5 μm or less. The wiring board according to claim 1,
The wiring board includes a plurality of the connection pads,
The connection pads are insulated from each other by the insulating resin. 2. The wiring board according to claim 1, wherein the wiring body includes a plurality of wiring layers laminated with an interlayer insulating layer interposed therebetween as the one or more wiring layers. The wiring board according to claim 5,
The wiring body further includes a plurality of via conductors that penetrate the different interlayer insulating layers and connect each of the plurality of wiring layers,
The plurality of via conductors are formed so as to overlap each other in a plan view. The wiring board according to claim 1, further comprising a conductor layer including the connection pad, and a conductor post formed on the conductor layer and penetrating the second insulating layer,
The conductor post has an end face located within the first component region or the second component region on the opposite side from the conductor layer,
The distance between the end surface of the conductor post and the surface of the first insulating layer is the distance between the surface of the first conductor pad opposite to the first insulating layer and the surface of the first insulating layer. Almost equal. The wiring board according to claim 1,
The component mounting surface further includes a third component region including a portion of the plurality of first conductor pads,
The first conductor pad in the third component region is connected to at least one of the first conductor pad in the first component region and the first conductor pad in the second component region via the wiring layer. has been done. 2. The wiring board according to claim 1, wherein the one or more wiring layers include a wiring group having the smallest wiring width and the smallest distance between wirings in the wiring board. The wiring board according to claim 1,
The wiring body further includes an interlayer insulating layer interposed between each of the one or more wiring layers,
A part or all of the one or more wiring layers included in the wiring body are constituted by a conductor filling a groove formed in the interlayer insulating layer. 2. The wiring board according to claim 1, wherein the wiring group included in the wiring body has a minimum value of 3.0 μm or less for each of a wiring width and a distance between wirings, and an aspect ratio of each wiring in the wiring group. is 1.8 or more and 6.0 or less. The wiring board according to claim 1,
The wiring body further includes an interlayer insulating layer interposed between each of the one or more wiring layers,
The dielectric loss tangent of the interlayer insulating layer at a frequency of 1 GHz is 0.03 or less, and the dielectric constant is 3.3 or less.

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