JP2023160025A - Maintenance method and circuit fabricating device - Google Patents

Abstract

To properly execute maintenance of a device that discharges fluid stored in a tank through a discharge port thereof.SOLUTION: In a maintenance method, which performs maintenance of a discharge device that discharges fluid stored in a tank through a discharge port thereof, by executing at least either of purge operation of discharging fluid through the discharge port and wiping operation of wiping the discharge port with a sheet, the maintenance is performed by changing at least either of a time when the purge operation is executed and the number of times of executing the wiping operation, in accordance with an actuation state of the discharge device.SELECTED DRAWING: Figure 6

Description

The present invention relates to a discharge device that discharges fluid stored in a tank from a discharge port.

The following patent document describes a discharge device that discharges fluid stored in a tank from a discharge port.

Patent No. 4415398 Japanese Patent Application Publication No. 6-122206

An object of this specification is to appropriately perform maintenance of a device that discharges fluid stored in a tank from a discharge port.

In order to solve the above problems, the present specification provides a discharge device that discharges fluid stored in a tank from a discharge port, which includes a purge operation for discharging fluid from the discharge port, and a wiping operation for wiping the discharge port with a sheet. A maintenance method that performs maintenance by performing at least one of the above, wherein the maintenance is performed by changing at least one of the execution time of the purge operation and the number of times the wiping operation is performed according to the operating state of the discharge device. Disclose maintenance methods.

In order to solve the above problems, the present specification also provides a first forming device that discharges a curable resin stored in a tank from a discharge port to form a resin laminate, and a metal-containing liquid stored in a tank. a second forming device that forms wiring by discharging fluid from a discharge port; and a purge operation of discharging fluid from the discharge port and a sheeting operation of the discharge port in at least one of the first forming device and the second forming device. a maintenance device that performs maintenance by performing at least one of a wiping operation, and the maintenance device performs maintenance according to an operating state of at least one of the first forming device and the second forming device. A circuit manufacturing apparatus is disclosed that performs maintenance by changing at least one of the execution time of a purge operation and the number of executions of the wiping operation.

In the present disclosure, maintenance is performed by changing at least one of the purge operation execution time and the wiping operation execution number according to the operating state of the device that discharges fluid. Thereby, it becomes possible to appropriately perform maintenance of the device that discharges fluid.

It is a figure showing a circuit formation device. It is a figure showing a cleaning part. FIG. 2 is a block diagram showing a control device. FIG. 2 is a cross-sectional view showing a circuit board with a resin laminate formed thereon. FIG. 2 is a cross-sectional view showing a circuit board with wiring formed on a resin laminate. This is map data showing the relationship between purge time, wiping frequency, and capping time. This is map data showing the relationship between purge time, wiping frequency, and uncapped time. This is map data showing the relationship between purge time, wiping frequency, and temperature drop. This is map data showing the relationship between the purge time, the number of times of wiping, and the number of times of ejection.

FIG. 1 shows a circuit forming apparatus 10 according to an embodiment. The circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a cleaning unit 26, and a control device (see FIG. 3) 28. The transport device 20, the first modeling unit 22, the second modeling unit 24, and the cleaning unit 26 are arranged on the base 29 of the circuit forming apparatus 10. The base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the short direction of the base 29 is the Y-axis direction, and it is perpendicular to both the X-axis direction and the Y-axis direction. The direction will be described as the Z-axis direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 3) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by driving the electromagnetic motor 38. Further, the Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a table 52. The Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A table 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Further, the Y-axis slide mechanism 32 includes an electromagnetic motor (see FIG. 3) 56, and the table 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. Thereby, the table 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The table 52 includes a base 60, a holding device 62, and a lifting device 64 (see FIG. 3). The base 60 is formed into a flat plate shape, and a pallet (see FIG. 4) 70 is placed on the top surface. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edges of the pallet 70 placed on the base 60 in the X-axis direction are held between the holding devices 62, so that the pallet 70 is fixedly held. Further, the lifting device 64 is disposed below the base 60 and raises and lowers the base 60.

The first modeling unit 22 is a unit that models wiring on a circuit board, and includes a first printing section 72 and a firing section 74. The first printing section 72 has an inkjet head (see FIG. 3) 76, and the inkjet head 76 discharges metal ink in a linear manner. Metal ink is made by dispersing nanometer-sized metal particles, such as silver, in a solvent. Note that the surface of the metal fine particles is coated with a dispersant to prevent agglomeration in the solvent. The inkjet head 76 has a tank 77, as shown in FIG. 2, and metal ink is stored in the tank 77. Further, an ejection nozzle 78 is arranged on the lower surface of the inkjet head 76, and a plurality of ejection ports 79 are formed in the ejection nozzle 78. The inkjet head 76 then discharges the metal ink stored in the tank 77 from the plurality of ejection ports 79 by actuation of a piezoelectric element (see FIG. 3) 80. Note that in order to prevent the metal ink from drying at the ejection port 79, a capping device (see FIG. 3) 81 is provided on the lower surface of the ejection nozzle 78. The capping device 81 closes the plurality of ejection ports 79 opened on the lower surface of the ejection nozzle 78, and is controllably moved between a position where the plurality of ejection ports 79 are opened and a position where the plurality of ejection ports 79 are closed.

The baking section 74 has an infrared irradiation device (see FIG. 3) 82. The infrared irradiation device 82 is a device that irradiates the ejected metal ink with infrared rays. The metal ink irradiated with infrared rays is fired and wiring is formed. Incidentally, firing metal ink means that energy is applied to vaporize the solvent and decompose the protective film of the metal particles, that is, the dispersant, etc., and the metal particles contact or fuse to form a conductive layer. This is a phenomenon where the rate increases. Then, metal wiring is formed by firing the metal ink.

Further, the second modeling unit 24 is a unit that models the resin layer of the circuit board, and includes a second printing section 84 and a curing section 86 . The second printing section 84 has an inkjet head (see FIG. 3) 88, and the inkjet head 88 discharges ultraviolet curing resin. Ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. Further, the inkjet head 88 also has a tank 89, as shown in FIG. 2, and an ultraviolet curing resin is stored in the tank 89. Further, an ejection nozzle 90 is arranged on the lower surface of the inkjet head 88, and a plurality of ejection ports 91 are formed in the ejection nozzle 90. The inkjet head 88 then discharges the ultraviolet curing resin stored in the tank 89 from the plurality of ejection ports 91 by actuation of the piezoelectric element (see FIG. 3) 92. Note that, in order to prevent the ultraviolet curing resin from drying at the jet nozzle 91, a capping device (see FIG. 3) 93 is provided on the lower surface of the jet nozzle 90. The capping device 93 closes the plurality of ejection ports 91 opened on the lower surface of the ejection nozzle 90, and is controllably moved between a position where the plurality of ejection ports 91 are opened and a position where the plurality of ejection ports 91 are closed.

The curing section 86 includes a flattening device (see FIG. 3) 96 and an irradiation device (see FIG. 3) 98. The flattening device 96 flattens the upper surface of the ultraviolet curable resin discharged by the inkjet head 88, and for example, scrapes off excess resin with a roller or blade while leveling the surface of the ultraviolet curable resin. to make the thickness of the ultraviolet curing resin uniform. Further, the irradiation device 98 includes a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curing resin with ultraviolet rays. As a result, the discharged ultraviolet curing resin is cured and a resin layer is formed.

The cleaning unit 26 is a unit that cleans the inkjet head 76 of the first modeling unit 22 and the inkjet head 88 of the second modeling unit 24, and performs a wiping operation of the inkjet heads 76 and 88. The cleaning unit 26 includes a cleaning section 100 and a moving section 102. The moving unit 102 includes a moving device (see FIG. 3) 106, and the moving device 106 moves the inkjet head 76 between the first modeling unit 22 and the cleaning unit 26. Further, the moving device 106 moves the inkjet head 88 between the second modeling unit 24 and the cleaning unit 26.

As shown in FIG. 2, the cleaning section 100 includes a wipe roll 110, a take-up roller 112, two auxiliary rollers 114, 116, and a pressing block 118. The wipe roll 110 includes a first roller 124 and a band-shaped wipe sheet 126 wound around the first roller 124. Then, one end of the wipe sheet 126 is pulled out from the wipe roll 110 and wound around the take-up roller 112. Then, the wipe sheet 126 is wound onto the take-up roller 112 from the wipe roll 110 as the take-up roller 112 is rotated by the drive of an electromagnetic motor (see FIG. 3) 128. As a result, the wipe sheet 126 is sent out from the wipe roll 110 toward the take-up roller 112. Further, two auxiliary rollers 114 and 116 are arranged at the same height between the wipe roll 110 and the take-up roller 112, and are wound around the wipe sheet 126. As a result, the wipe sheet 126 is generally extended horizontally between the two auxiliary rollers 114 and 116.

Further, a pressing block 118 is disposed below the wipe sheet 126 which extends horizontally between the two auxiliary rollers 114 and 116. Note that when the inkjet heads 76 and 88 are moved from the first modeling unit 22 or the second modeling unit 24 to the cleaning unit 26 by the moving device 106, the inkjet heads 76 and 88 are moved to the pressing block 118 with the wipe sheet 126 in between. located above. Therefore, the wipe sheet 126 is sent out from the wipe roll 110 toward the take-up roller 112 so as to pass between the lower surfaces of the inkjet heads 76 and 88 and the upper surface of the pressing block 118.

Further, the pressing block 118 is moved up and down by driving an electromagnetic motor (see FIG. 3) 130. Therefore, the pressing block 118 rises, lifting the wipe sheet 126 and pressing it against the lower surfaces of the inkjet heads 76 and 88. Therefore, the wipe sheet 126 lifted by the pressing block 118 is pressed against the plurality of ejection ports 79 and 91 of the inkjet heads 76 and 88. Further, the pressing block 118 generally vibrates in the horizontal direction by being driven by an electromagnetic motor (see FIG. 3) 134. Therefore, the pressing block 118 rises and vibrates while pressing the wipe sheet 126 against the plurality of ejection ports 79, 91 of the inkjet heads 76, 88, so that the plurality of ejection ports 79, 91 126. As a result, the ejection ports 79 and 91 of the inkjet heads 76 and 88 are cleaned by the wipe sheet 126. Then, after the vibration of the pressing block 118 is stopped, the pressing block 118 is lowered, thereby releasing the pressing of the wipe sheet 126 against the spout ports 79 and 91. At this time, the pressing block 118 descends until it separates from the wipe sheet 126.

Further, the control device 28 includes a controller 150 and a plurality of drive circuits 152, as shown in FIG. The plurality of drive circuits 152 include the electromagnetic motors 38, 56, 128, 130, 134, the holding device 62, the lifting device 64, the piezoelectric elements 80, 92, the capping devices 81, 93, the infrared irradiation device 82, the flattening device 96, It is connected to the irradiation device 98 and the moving device 106. The controller 150 is mainly a computer, including a CPU, ROM, RAM, etc., and is connected to a plurality of drive circuits 152. As a result, the operations of the transport device 20 , the first modeling unit 22 , the second modeling unit 24 , and the cleaning unit 26 are controlled by the controller 150 .

In the circuit forming apparatus 10, with the above-described configuration, a resin laminate is formed on the pallet 70 placed on the base 60 of the table 52, and wiring is formed on the upper surface of the resin laminate, thereby forming a circuit. A substrate is formed.

Specifically, when the pallet 70 is set on the base 60 of the table 52, the table 52 moves below the second modeling unit 24. Then, in the second modeling unit 24, a resin laminate 160 is formed on the pallet 70, as shown in FIG. The resin laminate 160 is formed by repeatedly ejecting the ultraviolet curable resin from the inkjet head 88 and irradiating the ejected ultraviolet curable resin with ultraviolet rays from the irradiation device 98 .

Specifically, in the second printing section 84 of the second modeling unit 24, the inkjet head 88 discharges ultraviolet curing resin in a thin film onto the upper surface of the pallet 70. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by a flattening device 96 in the curing section 86 so that the thickness of the ultraviolet curable resin becomes uniform. Then, the irradiation device 98 irradiates the thin film of ultraviolet curing resin with ultraviolet light. As a result, a thin film-like resin layer 162 is formed on the pallet 70.

Subsequently, the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the thin film resin layer 162. Then, the thin film-shaped ultraviolet curable resin is flattened by the flattening device 96, and the irradiation device 98 irradiates the ultraviolet ray curable resin discharged in the thin film shape with ultraviolet rays, thereby forming a layer on the thin film-shaped resin layer 162. A thin film-like resin layer 162 is laminated. In this way, the resin laminate 160 is formed by repeating the discharging of the ultraviolet curable resin onto the thin film-like resin layer 162 and the irradiation of ultraviolet rays, and by stacking a plurality of resin layers 162.

Next, after the resin laminate 160 is formed, the table 52 moves below the first modeling unit 22. Then, in the first printing section 72 of the first modeling unit 22, the inkjet head 76 discharges the metal ink 166 linearly onto the upper surface of the resin laminate 160 according to the circuit pattern, as shown in FIG. Subsequently, in the firing section 74 of the first modeling unit 22, the infrared ray irradiation device 82 irradiates the metal ink 166 discharged according to the circuit pattern with infrared rays. As a result, the metal ink 166 is fired, and a wiring 168 is formed on the upper surface of the resin laminate 160.

In this way, the resin laminate 160 is modeled using the ultraviolet curing resin discharged by the inkjet head 88 in the second modeling unit 24, and the wiring 168 is modeled by the metal ink discharged by the inkjet head 76 in the first modeling unit 22. By doing so, a circuit board is formed. Then, as the ultraviolet curing resin and metal ink are repeatedly ejected from the inkjet heads 76 and 88, the ejection state deteriorates, so maintenance of the inkjet heads 76 and 88 is performed. Note that in the circuit forming apparatus 10, a purge operation and a wiping operation are performed as maintenance for the inkjet heads 76 and 88.

Specifically, as described above, the inkjet heads 76 and 88 eject the ultraviolet curing resin or metal ink stored in the tanks 77 and 89 from the ejection ports 79 and 91 by operating the piezoelectric elements 80 and 92. Then, the resin laminate 160 or the wiring 168 is formed. For this reason, if the ejection condition of the ultraviolet curable resin or metal ink from the ejection ports 79 and 91 deteriorates, the resin laminate 160 or the wiring 168 cannot be appropriately formed. For this reason, the inkjet heads 76, 88 are provided with pumps 170, 171 for increasing the pressure inside the tanks 77, 89, as shown in FIG. Then, the pressure in the tanks 77, 89 is increased by operating the pumps 170, 171, and the ultraviolet curing resin or metal ink is forcibly ejected from the ejection ports 79, 91, thereby performing a purge operation.

Further, a wiping operation is performed in the cleaning unit 26 to wipe the ejection ports 79 and 91 of the inkjet heads 76 and 88. Specifically, as described above, the moving device 106 of the cleaning unit 26 moves the inkjet heads 76 and 88 above the pressing block 118 of the cleaning section 100. Thereby, the inkjet heads 76 and 88 are located above the pressing block 118 with the wipe sheet 126 in between. Then, by raising the pressing block 118, the wipe sheet 126 is lifted by the pressing block 118 and pressed against the lower surface of the ejection nozzles 78, 90 of the inkjet heads 76, 88. At this time, the wiping operation is performed by vibrating the press block 118 in the raised state and wiping the jet ports 79 and 91 with the wipe sheet 126.

Note that the purge operation and the wiping operation are executed as a series of operations. Specifically, before the purge operation is performed, the moving device 106 of the cleaning unit 26 moves the inkjet heads 76 and 88 above the pressing block 118 of the cleaning section 100. As a result, the inkjet heads 76 and 88 are connected to the pressing block 11 with the wipe sheet 126 in between.
Located above 8. At this time, by increasing the pressure in the tanks 77, 89 by operating the pumps 170, 171 and performing a purge operation, the ultraviolet curing resin or metal ink is discharged from the jet ports 79, 91 of the inkjet heads 76, 88 onto the wipe sheet. It is ejected towards 126. Then, after the ultraviolet curing resin or metal ink is ejected onto the wipe sheet 126 from the ejection ports 79 and 91, the wipe sheet 126 is sent out by a predetermined amount from the wipe roll 110 toward the take-up roller 112. As a result, a wipe sheet 126 on which no ultraviolet curing resin or metal ink has been ejected, that is, a clean wipe sheet 126, is sent out below the inkjet heads 76, 88. Then, when the clean wipe sheet 126 is sent out below the inkjet heads 76, 88, a wiping operation is performed.

Then, when the purging operation and the wiping operation are performed and the maintenance of the inkjet heads 76 and 88 is completed, a flushing operation is performed as a preparation before the formation of the resin laminate 160 or the wiring 168 by the inkjet heads 76 and 88. The flushing operation is the same operation as the inkjet heads 76 and 88 when forming the resin laminate 160 or the wiring 168. That is, in the flushing operation, ultraviolet curable resin or metal ink is ejected from the ejection ports 79 and 91 by actuation of the piezoelectric elements 80 and 92. Note that in the flushing operation, the ultraviolet curable resin or metal ink is ejected toward the wipe sheet 126 similarly to the purging operation.

In this way, the purging operation and the wiping operation are performed as maintenance for the inkjet heads 76 and 88, and after the maintenance of the inkjet heads is performed, the flushing operation is performed, thereby ensuring stable ejection by the inkjet heads. Ru. However, maintenance of the inkjet heads 76 and 88 has conventionally been performed at predetermined timing and according to one type of maintenance pattern. Specifically, immediately before a circuit board is formed in the circuit forming apparatus 10, and every time the inkjet heads 76 and 88 repeat a predetermined number of reciprocating movements while discharging ultraviolet curing resin or metal ink during the formation of a circuit board, the inkjet Maintenance of heads 76 and 88 is performed. At this time, the pressure inside the tank is increased for 200 msec to perform a purge operation, and the pressing block is vibrated twice with the wipe sheet 126 pressed against the ejection nozzle of the inkjet head to perform a wiping operation. Maintenance was performed according to one type of maintenance pattern.

However, if the inkjet head is maintained according to one type of maintenance pattern, there is a risk that the ultraviolet curing resin or metal ink will be wasted. Furthermore, there is a possibility that the time required for maintenance of the inkjet head becomes longer. In other words, for example, if the ejection state of the inkjet head has not deteriorated significantly, there is no need to increase the pressure in the tank for 200 msec as a purge operation, and it is not necessary to vibrate the press block twice as a wiping operation. Nor. In such cases, a large amount of ultraviolet curable resin or metal ink is ejected due to the pressure increase in the tank for an unnecessarily long period of time, resulting in wasteful consumption of the ultraviolet curable resin or metal ink. . Furthermore, the maintenance time for the inkjet head becomes longer due to an unnecessarily long increase in the pressure in the tank and an unnecessarily large number of vibrations of the pressing block. On the other hand, if the ejection condition of the inkjet head has significantly decreased, the pressure inside the tank may be increased for 200 msec to perform a purge operation, and the pressing block may be vibrated twice to perform a wiping operation. , there is also a possibility that the discharge condition cannot be appropriately improved.

In view of this, in the circuit forming device 10, the ejection state of the inkjet head is estimated according to the operating state of the inkjet head, and the pressure inside the tank during the purge operation is increased based on the estimated ejection state of the inkjet head. The time and the number of vibrations of the pressing block in the wiping operation are changed. That is, the execution time of the purge operation (hereinafter referred to as "purge time") and the number of times the wiping operation is executed (hereinafter referred to as "wiping number") are changed depending on the operating state of the inkjet head.

Specifically, as described above, the inkjet head is provided with a capping device. Therefore, when the inkjet head is not used for a long time, for example, when the circuit forming apparatus 10 is powered off, the ejection ports of the ejection nozzles of the inkjet head are blocked by the capping device. Thereby, it is possible to prevent the ultraviolet curing resin or metal ink from drying at the ejection port of the inkjet head. However, as the time during which the ejection ports of the inkjet head are continuously blocked by the capping device (hereinafter referred to as "capping time") increases, the ejection state of the inkjet head tends to deteriorate. Therefore, when maintenance of the inkjet head is performed immediately before a circuit board is formed in the circuit forming apparatus 10, the longer the capping time, the longer the purge time and the greater the number of wiping operations.

Specifically, capping time is counted in controller 150. Further, as shown in FIG. 6, the controller 150 stores map data indicating the relationship between the purge time, the number of times of wiping, and the capping time. In the map data, the longer the capping time is, the longer the purge time is, and the more times the wiping is performed. Therefore, the controller 150 calculates the purge time and the number of wiping times according to the capping time before maintenance execution based on the map data. Then, a purge operation is performed with the calculated purge time, and a wiping operation is performed with the calculated number of wiping times. As a result, the longer the capping time, the longer the purge operation is performed, and the more times the wiping operation is performed. Conversely, the shorter the capping time is, the shorter the purge operation is performed, and the fewer times the wiping operation is performed.

As a result, if the ejection condition of the inkjet head has not deteriorated significantly, a short purge operation is performed and a wiping operation is performed fewer times, thereby reducing wasteful consumption of ultraviolet curing resin or metal ink. This makes it possible to reduce maintenance time. On the other hand, if the ejection condition of the inkjet head has significantly deteriorated, a long purge operation is performed and a wiping operation is performed many times, making it possible to appropriately improve the ejection condition. . As a specific example of the purge time and the number of wiping times, for example, if the capping time is 10 minutes, a purge operation with a purge time of 0 msec, that is, a wiping operation with a wiping number of one time, without performing a purge operation, is performed. is executed. Further, for example, when the capping time is one hour, a purge operation with a purge time of 100 msec is executed, and a wiping operation with one wiping count is executed. Further, for example, when the capping time is 2 hours, a purge operation with a purge time of 300 msec is executed, and a wiping operation with a wiping count of 2 is executed.

In addition, as described above, maintenance of the inkjet head is performed every time the inkjet head repeats reciprocating movement a predetermined number of times while discharging ultraviolet curable resin or metal ink during the formation of a circuit board. During circuit formation, the ejection ports of the inkjet head are naturally not blocked by the capping device and are open, but if the circuit forming device 10 comes to an emergency stop during circuit formation, the ejection ports of the inkjet head are opened. left in the same condition. In this way, the longer the time the ejection port of the inkjet head is left open, that is, the time the ejection port is left uncapped (hereinafter referred to as "uncapping time"), the longer the ejection port is left open. , the ejection condition of the inkjet head tends to deteriorate. Therefore, when maintenance of the inkjet head is performed after the circuit forming apparatus 10 is brought to an emergency stop during circuit formation, the longer the uncapping time is, the longer the purge time is and the more times the wiping is performed.

Specifically, the controller 150 counts the uncapping time when the circuit forming apparatus 10 makes an emergency stop during circuit formation. Furthermore, as shown in FIG. 7, the controller 150 stores map data showing the relationship between the purge time, the number of wiping times, and the uncapped time. In the map data, the longer the uncapped time, the longer the purge time and the greater the number of wiping. Therefore, the controller 150 calculates the purge time and the number of times of wiping according to the uncapped time when the circuit forming apparatus 10 makes an emergency stop during circuit formation, based on the map data. Then, a purge operation is performed with the calculated purge time, and a wiping operation is performed with the calculated number of wiping times. As a result, the longer the uncapped time is, the longer the purge operation is performed, and the more times the wiping operation is performed. Conversely, the shorter the uncapping time is, the shorter the purge operation is performed, and the fewer times the wiping operation is performed.

As a result, if the ejection condition of the inkjet head has not deteriorated significantly, a short purge operation is performed and a wiping operation is performed fewer times, thereby reducing wasteful consumption of ultraviolet curing resin or metal ink. This makes it possible to reduce maintenance time. On the other hand, if the ejection condition of the inkjet head has significantly deteriorated, a long purge operation is performed and a wiping operation is performed many times, making it possible to appropriately improve the ejection condition. . As a specific example of the purge time and the number of wiping operations, for example, if the uncapping time is 10 minutes, a purge operation with a purge time of 100 msec is executed, and a wiping operation with a wiping number of 0 times, that is, a wiping operation. is not executed. Further, for example, when the uncapping time is 30 minutes, a purge operation with a purge time of 100 msec is executed, and a wiping operation with a wiping count of 1 is executed. Further, for example, when the uncapping time is one hour, a purge operation with a purge time of 300 msec is executed, and a wiping operation is executed with a wiping count of two.

In addition, in an inkjet head, ultraviolet curable resin or metal ink is stored in a tank, and the ultraviolet curable resin or metal ink is heated to a predetermined set temperature, for example, 70°C, by a heating device (not shown). It is stored in a tank in a stable condition. This makes it possible to maintain the viscosity of the ultraviolet curable resin or metal ink in a constant state, and to ensure a stable discharge state of the ultraviolet curable resin or metal ink. On the other hand, there is a risk that the heating device may malfunction during circuit formation and the temperature of the ultraviolet curing resin or metal ink in the tank may drop. As described above, when the temperature of the ultraviolet curable resin or metal ink in the tank decreases, the ejection state of the inkjet head may deteriorate due to an increase in viscosity. Further, there is a possibility that the ultraviolet curable resin or metal ink shrinks due to a decrease in the temperature of the ultraviolet curable resin or metal ink in the tank, causing air to enter the ejection nozzle and reducing the ejection condition of the inkjet head. In other words, as the temperature of the ultraviolet curing resin or metal ink in the tank decreases, the ejection state of the inkjet head tends to decrease. Therefore, when inkjet head maintenance is performed after the temperature of the UV-curable resin or metal ink in the tank drops during circuit formation, the purge time increases as the temperature of the UV-curable resin or metal ink in the tank decreases. is made longer and the number of wiping is increased.

Specifically, the inkjet head is provided with a measuring device (not shown) that measures the temperature inside the tank, and the controller 150 monitors the temperature inside the tank during circuit formation. The controller 150 calculates the temperature drop from the set temperature when the temperature inside the tank drops from the set temperature. Further, as shown in FIG. 8, the controller 150 stores map data showing the relationship between the purge time, the number of wiping operations, and the temperature drop. In the map data, the greater the temperature drop, that is, the lower the temperature of the ultraviolet curing resin or metal ink in the tank, the longer the purge time and the greater the number of wiping operations. Therefore, the controller 150 calculates the purge time and the number of times of wiping based on the map data in accordance with the temperature drop of the ultraviolet curing resin or metal ink in the tank during circuit formation. Then, a purge operation is performed with the calculated purge time, and a wiping operation is performed with the calculated number of wiping times. As a result, the greater the temperature drop, the longer the purge operation is performed and the more times the wiping operation is performed. Conversely, the smaller the temperature drop, the shorter the purge operation is performed and the fewer times the wiping operation is performed.

As a result, if the ejection condition of the inkjet head has not deteriorated significantly, a short purge operation is performed and a wiping operation is performed fewer times, thereby reducing wasteful consumption of ultraviolet curing resin or metal ink. This makes it possible to reduce maintenance time. On the other hand, if the ejection condition of the inkjet head has significantly deteriorated, a long purge operation is performed and a wiping operation is performed many times, making it possible to appropriately improve the ejection condition. . As a specific example of the purge time and the number of wiping operations, for example, when the temperature drop is 10° C., a purge operation with a purge time of 300 msec is performed, and a wiping operation with a wiping number of one time is performed. Further, for example, when the temperature drop is 40° C., three sets of a purge operation with a purge time of 300 msec and a wiping operation with one wiping count are repeatedly executed.

Furthermore, maintenance of conventional inkjet heads is performed immediately before a circuit board is formed, and every time the inkjet head moves back and forth a predetermined number of times while discharging ultraviolet curable resin or metal ink during the formation of a circuit board. On the other hand, in the circuit forming apparatus 10, maintenance of the inkjet head is further performed every time the number of operations of the inkjet head reaches a predetermined set number of times. Specifically, as the number of times the inkjet head is operated, that is, the number of times the inkjet head ejects ultraviolet curing resin or metal ink increases, the ejection state of the inkjet head tends to deteriorate. Therefore, the controller 150 cumulatively counts the number of ejections each time the inkjet head ejects ultraviolet curing resin or metal ink. As shown in FIG. 9, the controller 150 stores map data showing the relationship between the purge time, the number of times of wiping, and the number of ejections of the inkjet head. In the map data, for each predetermined number of times of ejection, the greater the number of times of ejection, the longer the purge time and the greater the number of times of wiping. Therefore, each time the counted number of ejections reaches a predetermined number of ejections, the controller 150 calculates the purge time and the number of wipings based on the map data in accordance with the number of ejections that has reached the predetermined number. Then, a purge operation is performed with the calculated purge time, and a wiping operation is performed with the calculated number of wiping times. Accordingly, each time the number of ejections of the inkjet head reaches a predetermined number of times, the greater the number of ejections of the inkjet head, the longer the purge operation is performed, and the more times the wiping operation is performed. Conversely, the fewer times the inkjet head ejects, the shorter the purge operation is performed and the fewer times the wiping operation is performed.

As a result, if the ejection condition of the inkjet head has not deteriorated significantly, a short purge operation is performed and a wiping operation is performed fewer times, thereby reducing wasteful consumption of ultraviolet curing resin or metal ink. This makes it possible to reduce maintenance time. On the other hand, if the ejection condition of the inkjet head has significantly deteriorated, a long purge operation is performed and a wiping operation is performed many times, making it possible to appropriately improve the ejection condition. . As a specific example of the purge time and the number of wiping times, for example, when the number of ejections of the inkjet head reaches 50,000 times, a purge operation with a purge time of 100 msec is performed, and a wiping operation with a wiping number of one time is performed. Ru. Further, for example, when the number of ejections of the inkjet head reaches 200,000, a purge operation with a purge time of 300 msec is performed, and a wiping operation with a wiping number of one time is performed. Note that the cumulatively counted number of ejections of the inkjet head is reset to 0 when the power of the circuit forming apparatus 10 is turned off.

In this way, in the circuit forming apparatus 10, the operation of the inkjet head is changed by changing the purge time and the number of times of wiping according to the operating state of the inkjet head, that is, the capping time, the uncapping time, the temperature drop, and the number of ejections. It becomes possible to perform maintenance according to the state. Note that when the purging operation and wiping operation are performed and the maintenance of the inkjet head is completed, the flushing operation is performed as described above, but after the maintenance and flushing operation of the inkjet head is performed, the nozzle inspection is performed at a predetermined timing. executed. Specifically, the nozzle inspection is performed after the maintenance and flushing operation immediately before the circuit board is formed, and after the maintenance and flushing operation after the predetermined number of resin layers 162 are formed during the circuit board formation. In the nozzle test, an inkjet head discharges ultraviolet curing resin or metal ink in a predetermined pattern onto a test plate (not shown). Subsequently, an imaging device (not shown) images the ejected ultraviolet curable resin or metal ink. Then, based on the image data captured by the imaging device, the controller 150 determines whether the ultraviolet curing resin or metal ink is being ejected according to a predetermined pattern. At this time, if the ultraviolet curable resin or metal ink is being discharged according to a predetermined pattern, the circuit board is formed. On the other hand, if the ultraviolet curing resin or metal ink is not being ejected according to the predetermined pattern, maintenance and flushing operations of the inkjet head are performed again. Executing the nozzle inspection in this way makes it possible to ensure appropriate maintenance and flushing operations.

Note that in the above embodiments, the circuit forming apparatus 10 is an example of a circuit manufacturing apparatus. The first modeling unit 22 is an example of a second forming device. The second modeling unit 24 is an example of the first modeling device. The cleaning unit 26 is an example of a maintenance device. The inkjet heads 76 and 88 are examples of ejection devices. Tanks 77 and 89 are examples of tanks. The jet ports 79 and 91 are examples of discharge ports. The capping devices 81 and 93 are examples of caps. The wipe sheet 126 is an example of a sheet. The resin laminate 160 is an example of a resin laminate. The wiring 168 is an example of wiring. Pumps 170 and 171 are examples of maintenance devices.

It should be noted that the present invention is not limited to the above embodiments, but can be implemented in various forms with various changes and improvements based on the knowledge of those skilled in the art. For example, in the embodiment described above, the purge time and the number of times of wiping are determined according to the operating state of the inkjet head, that is, the parameters of the capping time, the uncapped time, the lowering temperature, and the number of ejections. On the other hand, the purge time and the number of wiping times may be determined in accordance with the two or more parameters by combining two or more parameters of the capping time, the uncapping time, the lower temperature, and the number of discharges.

Further, in the above embodiment, the purge time and the number of wiping times are determined depending on the operating state of the inkjet head, but either the purge time or the number of wiping times may be determined.

Further, in the above embodiment, the purge operation is performed by increasing the pressure in the tanks 77, 89 by operating the pumps 170, 171 and forcibly ejecting the ultraviolet curing resin or metal ink from the jet ports 79, 91. be done. On the other hand, a purge operation is performed by suctioning the ejection ports 79, 91 from the lower surfaces of the ejection nozzles 78, 90 using a suction device or the like, and forcibly ejecting the ultraviolet curing resin or metal ink from the ejection ports 79, 91. may be done.

Further, in the above embodiment, a piezo-type inkjet head using a piezoelectric element is used, but a thermal-type inkjet head that ejects ultraviolet curable resin or the like by generating bubbles by heating may also be used. Further, the present invention is not limited to an inkjet head, and various ejection devices such as a dispenser may be employed.

Further, in the above embodiment, ultraviolet curable resin or metal ink is used as the fluid discharged from the discharging device, but coloring ink, conductive paste, cream solder, curable resin other than ultraviolet curable resin, etc. Various fluids can be employed.

Further, in the above embodiments, the present invention is applied to a dispensing device for modeling a circuit base material, but the present invention is applied to a discharging device for modeling various three-dimensional objects such as figures. Good too. Further, the present invention is not limited to a discharging device for modeling a three-dimensional object, but may be applied to a discharging device that discharges fluids such as adhesives, adhesives, cream solder, and the like. Further, the present invention may be applied to a discharge device used in a printing device for printing an image.

10: Circuit forming device (circuit forming device) 22: First modeling unit (second forming device)
24: Second modeling unit (first forming device) 26: Cleaning unit (maintenance device) 76: Inkjet head (discharge device) 77: Tank 79: Spout port (discharge port) 81: Capping device (cap) 88: Inkjet head (Discharge device) 89: Tank 91: Spout port (discharge port) 93: Capping device (cap) 126: Wipe sheet (sheet) 160: Resin laminate 168: Wiring
170: Pump (maintenance device) 171: Pump (maintenance device)

Claims (6)

A maintenance method for performing maintenance on a discharge device that discharges fluid stored in a tank from a discharge port by performing at least one of a purge operation for discharging fluid from the discharge port and a wiping operation for wiping the discharge port with a sheet. And,
A maintenance method that performs maintenance by changing at least one of the execution time of the purge operation and the number of executions of the wiping operation according to the operating state of the discharge device. The discharge device includes a cap that closes the discharge port,
The longer the time period during which the discharge port is continuously blocked by the cap, the longer the execution time or the greater the number of executions of at least one of the execution time of the purge operation and the number of executions of the wiping operation. The maintenance method according to claim 1, wherein the maintenance is performed by changing the maintenance method as follows. The discharge device includes a cap that closes the discharge port,
The longer the time during which fluid is not discharged from the discharge port that is not blocked by the cap, the longer the execution time or the 2. The maintenance method according to claim 1, wherein maintenance is performed by changing the number of executions to increase. A claim in which maintenance is performed by changing at least one of the execution time of the purge operation and the number of executions of the wiping operation so that the execution time becomes longer or the number of executions increases as the temperature of the fluid in the tank decreases. Maintenance method described in item 1. The maintenance is performed by changing at least one of the execution time of the purge operation and the number of executions of the wiping operation so that the execution time becomes longer or the number of executions increases as the number of operations of the discharge device increases. The maintenance method described in 1. a first forming device that discharges a curable resin stored in a tank from a discharge port to form a resin laminate;
a second forming device that forms wiring by discharging a metal-containing liquid stored in a tank from a discharge port;
Maintenance performed in at least one of the first forming device and the second forming device by performing at least one of a purge operation for discharging fluid from the discharge port and a wiping operation for wiping the discharge port with a sheet. a device;
Equipped with
The maintenance device includes:
A circuit manufacturing apparatus that performs maintenance by changing at least one of the execution time of the purge operation and the number of executions of the wiping operation according to an operating state of at least one of the first forming apparatus and the second forming apparatus.

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