JP2023158001A - Substrate processing device and substrate processing system - Google Patents

Abstract

To improve cleaning performance by creating a highly active SPM solution.SOLUTION: A substrate processing device includes a processing tank, an external tank, a circulatory path, a heating unit, and a hydrogen peroxide water replenishment unit. The processing tank is for processing a substrate with a mixed solution including sulfuric acid and hydrogen peroxide water. The external tank is for collecting the mixed solution that overflows from the processing tank. One end of the circulatory path is connected to the mixed solution collected in the external tank. The other end of the circulatory path is connected and circulated in the mixed solution stored inside the processing tank. The circulatory path is for circulating the mixed solution from the external tank to the processing tank. The heating unit is arranged in the circulatory path for heating the mixed solution circulating through the circulatory path. The hydrogen peroxide water replenishment unit is for replenishing hydrogen peroxide water to the mixed solution in the vicinity of the one end of the circulatory path in the external tank or to the mixed solution on the upstream side of the heating unit in the circulatory path.SELECTED DRAWING: Figure 1

Description

The present invention relates to semiconductor wafers, liquid crystal display substrates, plasma display substrates, organic EL substrates, FEDs (Field Emission Displays), optical display substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, The present invention relates to a substrate processing apparatus and a substrate processing system that process a solar cell substrate (hereinafter simply referred to as a "substrate") using a processing liquid.

Conventionally, in order to remove resist peeling and other organic contaminants remaining on the surface of the substrate, a sulfuric acid/hydrogen peroxide mixture (SPM), which produces caroic acid with high cleaning ability, has been used. is used. In particular, in batch-type substrate processing equipment that cleans multiple substrates by simultaneously immersing them in a processing tank filled with a mixed solution, dozens of substrates are immersed in the SPM solution, and after a predetermined period of time, the substrates are cleaned. After taking out the substrate, repeat the process of dipping the next substrate. When cleaning is performed continuously in this way, the SPM solution in the processing tank adheres to the substrate surface and is carried out of the processing tank, reducing the level of the SPM solution. Replenishing hydrogen peroxide.

In addition, hydrogen peroxide is a relatively unstable substance and gradually decomposes to produce water, so even if sulfuric acid or hydrogen peroxide is replenished as the liquid level drops, the The sulfuric acid concentration decreases over time, which also reduces the cleaning ability of the SPM solution.

In consideration of such characteristics of hydrogen peroxide, various proposals have been made regarding replenishment of hydrogen peroxide. For example, in Patent Document 1, peroxide is added to a part between a heater installed in a circulation line that connects an outer tank and an inner tank and circulates a mixed liquid, and an SPM supply nozzle arranged at the bottom of the inner tank. A hydrogen water supply line is connected. Here, the hydrogen peroxide solution supplied from the hydrogen peroxide solution supply line to the circulation line is discharged from the discharge hole of the SPM supply nozzle within 5 seconds, or the hydrogen peroxide solution supplied to the circulation line of the hydrogen peroxide solution supply line is discharged from the discharge hole of the SPM supply nozzle. The distance from the connection part to the discharge hole of the SPM supply nozzle is 50 cm or less.

Patent No. 5454108

However, in such a configuration, Caro's acid may not be sufficiently activated in the liquid mixture discharged from the SPM supply nozzle.

Therefore, one aspect of the disclosed technology is to create a highly active liquid mixture containing sulfuric acid and hydrogen peroxide solution to improve the cleaning ability.

One aspect of the disclosed technology is exemplified by the following substrate processing apparatus.
In other words, this substrate processing apparatus:
In a substrate processing apparatus that processes a substrate,
a treatment tank for treating the substrate with a mixed solution containing sulfuric acid and hydrogen peroxide;
an outer tank for collecting the mixed liquid overflowing from the processing tank;
One end is connected to flow into the mixed liquid collected in the outer tank, the other end is connected to flow into the mixed liquid stored in the processing tank, and the mixed liquid is transferred from the outer tank to the processing tank. A circulation path that circulates toward
a heating unit that is disposed in the circulation path and heats the mixed liquid flowing in the circulation path;
replenishing the hydrogen peroxide solution to the mixed liquid existing in the vicinity of the one end of the circulation path in the outer tank or to the mixed liquid existing upstream of the heating section in the circulation path; A hydrogen oxide water replenishment section,
It is characterized by having the following.

According to such an invention, the hydrogen peroxide solution is replenished to the liquid mixture existing near one end of the circulation path in the outer tank, so that the hydrogen peroxide solution is added to the liquid mixture in the outer tank before being diluted into the liquid mixture in the outer tank. The flowing mixed liquid can be replenished with hydrogen peroxide solution. In addition, hydrogen peroxide water is replenished into the mixed liquid existing upstream of the heating part in the circulation path, and the low-temperature mixed liquid before being heated by the heating part is replenished, so the hydrogen peroxide solution is A decrease in the concentration of hydrogen oxide water can be suppressed. Therefore, a highly active mixed solution with a high concentration of hydrogen peroxide solution can be prepared, and the ability to clean the substrate is improved.
Here, the term "flow connection" refers to connection in such a manner that fluid can flow therethrough.

In the present invention,
The hydrogen peroxide replenishment section is
a hydrogen peroxide water storage tank that stores the hydrogen peroxide water;
a hydrogen peroxide water replenishment pipe whose one end is connected to the hydrogen peroxide water storage tank and whose other end is connected to the mixed liquid collected in the outer tank;
Equipped with
The other end of the hydrogen peroxide water replenishment pipe may be arranged near the one end of the circulation path.

According to the present invention, by arranging the other end of the hydrogen peroxide solution replenishment pipe near one end of the circulation path, the mixed liquid flowing through the circulation path before being diluted with the mixed liquid in the outer tank is can be refilled with hydrogen peroxide. Therefore, a highly active mixed solution with a high concentration of hydrogen peroxide solution can be prepared, and the ability to clean the substrate is improved.

In the present invention,
A mixed liquid feeding pump is provided upstream of the heating part of the circulation path to feed the mixed liquid collected in the outer tank toward the processing tank,
When the mixed liquid in the outer tank is sucked from the one end of the circulation path by the mixed liquid feeding pump, the other part of the hydrogen peroxide water replenishment pipe is placed in an area where the pressure is more negative than the surrounding area. The ends may be arranged.

As described above, according to the present invention, the hydrogen peroxide water replenishment pipe is installed in the area where the pressure is more negative than the surrounding area when the mixed liquid in the outer tank is sucked from one end of the circulation path by the mixed liquid feeding pump. By arranging the other end, before the refilled hydrogen peroxide solution is diluted into the mixed liquid in the outer tank, it is sucked into the mixed liquid in the circulation path by the next suction operation of the mixed liquid feed pump. mixed. Therefore, a highly active mixed solution with a high concentration of hydrogen peroxide solution can be prepared, and the ability to clean the substrate is improved.

In the present invention,
The hydrogen peroxide replenishment section is
a hydrogen peroxide water storage tank that stores the hydrogen peroxide water;
a hydrogen peroxide water replenishment pipe, one end of which is connected to the hydrogen peroxide storage tank, and the other end of which is connected to the upstream side of the heating section of the circulation path;
may be provided.

According to the present invention, the other end of the hydrogen peroxide replenishment pipe is connected to the upstream side of the heating section in the circulation path, so that the hydrogen peroxide solution is connected to the upstream side of the heating section in the circulation path. This will be replenished by the mixed liquid present in the Thereby, the hydrogen peroxide solution is replenished into the low-temperature mixed liquid before being heated by the heating section, so that a decrease in the concentration of the hydrogen peroxide solution due to decomposition can be suppressed. Therefore, a highly active mixed solution with a high concentration of hydrogen peroxide solution can be prepared, and the ability to clean the substrate is improved.

In the present invention,
A mixed liquid feeding pump is provided upstream of the heating part of the circulation path to feed the mixed liquid collected in the outer tank toward the processing tank,
The other end of the hydrogen peroxide water replenishment pipe may be fluidly connected to the circulation path upstream of the mixed liquid feeding pump.

As described above, according to the present invention, the negative pressure generated on the upstream side of the mixed liquid feeding pump promotes mixing with the replenished hydrogen peroxide mixture, and promotes activation of the mixed liquid. Therefore, a highly active mixed solution can be created, and the ability to clean the substrate is improved.

In the present invention,
The hydrogen peroxide water replenishment unit further includes a hydrogen peroxide water feeding pump that feeds the hydrogen peroxide water to the hydrogen peroxide water replenishment pipe,
further comprising a control unit that controls the mixed liquid feeding pump and the hydrogen peroxide water feeding pump,
The control unit controls the mixed liquid feeding pump and the peroxide solution so that the hydrogen peroxide solution is replenished from the hydrogen peroxide solution replenishing unit before the suction operation of the mixed liquid feeding pump is started. The hydrogen water supply pump may also be controlled.

As described above, according to the present invention, the mixed liquid feeding pump and the peroxide solution are refilled with hydrogen peroxide from the hydrogen peroxide replenishing section before the suction operation of the mixed liquid feeding pump is started. Since the hydrogen water pump is controlled, the mixed solution is replenished with hydrogen peroxide before the concentration of the hydrogen peroxide drops due to dilution or decomposition of the hydrogen peroxide. Therefore, a highly active mixed solution with a high concentration of hydrogen peroxide solution can be prepared, and the ability to clean the substrate is improved.

In the present invention,
You may make it further include a sulfuric acid replenishment part which replenishes the said sulfuric acid to the said mixed liquid in the said processing tank.

As described above, according to the present invention, sulfuric acid can be replenished by the sulfuric acid replenisher, so that the concentration of sulfuric acid in the mixed liquid can be maintained appropriately. Therefore, a highly active mixed solution can be created, and the ability to clean the substrate is improved.

Further, the present invention is a substrate processing system including the substrate processing apparatus.

As described above, according to the present invention, by configuring a substrate processing system from the above-described substrate processing apparatus, the substrate cleaning ability of the substrate processing system is improved.

Moreover, the present invention
A substrate processing method for processing a substrate, the method comprising:
a treatment tank for treating the substrate with a mixed solution containing sulfuric acid and hydrogen peroxide;
an outer tank for collecting the mixed liquid overflowing from the processing tank;
One end is connected to the mixed liquid collected in the outer tank, the other end is connected to the mixed liquid stored in the processing tank, and the mixed liquid is directed from the outer tank to the processing tank. a circulation path for circulating the
a heating unit that is disposed in the circulation path and heats the mixed liquid flowing in the circulation path;
A mixed liquid sending pump that sends the mixed liquid collected in the outer tank toward the processing tank upstream of the heating part of the circulation path;
replenishing the hydrogen peroxide solution to the mixed liquid existing in the vicinity of the one end of the circulation path in the outer tank or to the mixed liquid existing upstream of the heating section in the circulation path; a hydrogen peroxide water replenishing unit, the hydrogen peroxide water replenishing unit having a hydrogen peroxide water feeding pump for feeding the hydrogen peroxide water to be refilled;
A substrate processing apparatus comprising:
suctioning the mixed liquid by the mixed liquid feeding pump;
Suctioning the hydrogen peroxide solution by the hydrogen peroxide water supply pump before starting suction of the mixed solution by the mixed solution supply pump;
A substrate processing method including:

As described above, according to the present invention, the mixed liquid feeding pump and the peroxide solution are refilled with hydrogen peroxide from the hydrogen peroxide replenishing section before the suction operation of the mixed liquid feeding pump is started. Since the hydrogen water pump is controlled, the mixed solution is replenished with hydrogen peroxide before the concentration of the hydrogen peroxide drops due to dilution or decomposition of the hydrogen peroxide. Therefore, a highly active mixed solution with a high concentration of hydrogen peroxide solution can be prepared, and the ability to clean the substrate is improved.

According to the substrate processing apparatus according to the present invention, it is possible to create a highly active mixed solution containing sulfuric acid and hydrogen peroxide solution, and improve cleaning performance.

FIG. 1 is a block diagram showing a schematic configuration of a substrate processing apparatus according to a first embodiment. FIG. 2 is a flowchart showing the substrate processing method of Example 1. FIG. 3 is a block diagram showing a schematic configuration of a substrate processing apparatus according to a second embodiment. FIG. 4 is a flowchart showing part of the substrate processing method according to the second embodiment. FIG. 5 is a block diagram showing a schematic configuration of a substrate processing apparatus according to the third embodiment. FIG. 6 is a block diagram showing a schematic configuration of a substrate processing apparatus according to the fourth embodiment. FIG. 7 is a plan view showing a schematic configuration of a substrate processing system of Example 5.

<Example 1>
Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. Note that the example shown below is one aspect of the present invention, and does not limit the technical scope of the present invention. FIG. 1 is a block diagram showing a schematic configuration of a substrate processing apparatus 1 according to a first embodiment.

The substrate processing apparatus 1 is a batch type apparatus that cleans a plurality of substrates W at once with an SPM liquid L. This substrate processing apparatus 1 includes a processing tank 11 and an overflow tank 12. The processing tank 11 has a size capable of accommodating a plurality of substrates W, stores SPM liquid L, and performs a cleaning process using the SPM liquid L on the plurality of substrates W. The overflow tank 12 is provided around the upper edge of the processing tank 11 and collects the SPM liquid overflowing from the processing tank 11. Here, the SPM liquid corresponds to the "mixed liquid" of the present invention, and the overflow tank 12 corresponds to the "outer tank" of the present invention.

The processing tank 11 and the overflow tank 12 are connected through a circulation pipe 13 . One end of the circulation pipe 13 is arranged from the top to the bottom of the overflow tank 12, and the other end is connected to SPM liquid supply pipes 141 and 142 arranged at the bottom of the processing tank 11. In the circulation pipe 13, an in-line heater 16, a filter 17, and a control valve 18 are connected from the SPM liquid feeding pump 15 provided on the overflow tank 12 side toward the processing tank 11 side, that is, the downstream side of the processing liquid. They are arranged in order. Here, the circulation pipe 13 corresponds to the "circulation path" of the present invention, the SPM liquid feed pump 15 corresponds to the "mixed liquid feed pump" of the present invention, and the inline heater 16 corresponds to the "heating section" of the present invention. corresponds to

The SPM liquid feeding pump 15 pumps the SPM liquid through the circulation piping 13 . The in-line heater 16 heats the SPM liquid flowing through the circulation pipe 13 and adjusts the temperature to a processing temperature (for example, about 120° C. to 140° C.). The filter 17 filters and removes foreign substances such as particles in the SPM liquid flowing through the circulation pipe 13. The control valve 18 controls the flow of the processing liquid in the circulation pipe 13 . When the SPM liquid feed pump 15 is turned on, the SPM liquid stored in the overflow tank 12 is sucked into the circulation pipe 13, temperature-controlled by the in-line heater 16, filtered by the filter 17, and sent to the processing tank 11. .

One end of a sulfuric acid supply pipe 20 for supplying sulfuric acid from the sulfuric acid supply section 19 to the processing tank 11 is arranged in the processing tank 11 . Sulfuric acid is stored in the sulfuric acid supply section 19. The sulfuric acid supply pipe 20 is provided with a control valve 21 that controls the supply of sulfuric acid from the sulfuric acid supply section 19 to the processing tank 11 .

One end of a hydrogen peroxide water supply pipe 23 that supplies hydrogen peroxide water from a hydrogen peroxide water supply section 22 to the processing tank 11 is arranged in the processing tank 11 . Hydrogen peroxide solution is stored in the hydrogen peroxide solution supply section 22 . The hydrogen peroxide supply pipe 23 is provided with a control valve 24 that controls the supply of hydrogen peroxide from the hydrogen peroxide supply section 22 to the processing tank 11 .

The overflow tank 12 has a discharge port 26a (shown as a circle in FIG. ) are located. Hydrogen peroxide water is stored in the hydrogen peroxide water storage tank 25 . The hydrogen peroxide replenishment pipe 26 is provided with a control valve 27 that controls the supply of hydrogen peroxide from the hydrogen peroxide storage tank 25 to the overflow tank 12 . The hydrogen peroxide storage tank 25 replenishes the SPM liquid flowing through the circulation pipe 13 with hydrogen peroxide. Here, the hydrogen peroxide water storage tank 25 and the hydrogen peroxide water replenishment pipe 26 correspond to the "hydrogen peroxide water replenishment section" of the present invention.

Here, the discharge port 26a of the hydrogen peroxide water replenishment pipe 26 is arranged near the suction port 13a (circled in FIG. 1), which is one end of the circulation pipe 13. The vicinity of the suction port 13a of the circulation pipe 13 refers to an area where the SPM liquid is sucked from the suction port 13a by the suction operation of the SPM liquid feeding pump 15. In other words, it is the area around the suction port 13a, and the area around the suction port 13a is On the other hand, this is a region where the pressure becomes negative and a pressure difference occurs. The specific range in the vicinity varies depending on the capacity of the SPM liquid feeding pump 15, but is, for example, within a radius of about 100 mm from the suction port 13a. In this way, by arranging the discharge port 26a of the hydrogen peroxide water replenishment pipe 26 near the suction port 13a, which is one end of the circulation pipe 13, the hydrogen peroxide solution replenishment pipe 26 is located near the suction port 13a, which is one end of the circulation pipe 13. The SPM solution is replenished with hydrogen peroxide. In this way, the SPM solution supplemented with hydrogen peroxide near the suction port 13a of the circulation pipe 13 is returned to the processing tank 10 after about 10 to about 20 seconds in a state where the activity of caroic acid generated by the reaction of the SPM solution is high. reach.

In this way, by arranging the discharge port 26a of the hydrogen peroxide water replenishment pipe 26 near the suction port 13a of the circulation pipe 13, the hydrogen peroxide water is prevented from diluting into the SPM liquid in the overflow tank 12. The SPM liquid flowing through the circulation pipe 13 can be replenished. Therefore, a highly active SPM liquid can be generated, and the ability to clean the substrates W in the processing tank 11 is also improved.

The hydrogen peroxide water storage tank 25 may be provided within the substrate processing apparatus 1 or may be provided as equipment for each facility. Further, a flow meter may be provided downstream of the control valve 27.

One end of a sulfuric acid replenishment pipe 29 for supplying sulfuric acid from the sulfuric acid replenishment section 28 to the processing tank 11 is arranged in the processing tank 11 . Sulfuric acid is stored in the sulfuric acid replenishment section 28. The sulfuric acid replenishment pipe 29 is provided with a control valve 30 that controls replenishment of sulfuric acid from the sulfuric acid replenishment section 28 to the processing tank 11 .

The substrate W is held in an upright position by holding rods 312, 313, and 314 provided at the lower part of the main body plate 311 of the substrate holding section 31. The substrate holder 31 is moved up and down by the lifting unit 32 between a processing position where the substrate W shown in FIG.

The SPM liquid feeding pump 15, in-line heater 16, filter 17, control valve 18, control valve 21, control valve 24, control valve 27, control valve 30, and lifting unit 32 described above are collectively controlled by a control unit 33. . The control unit 33 can be configured by a computer having a processor such as a CPU, a main memory such as RAM or ROM, and an auxiliary memory such as EPROM. The auxiliary storage device stores various programs, various tables, etc. The programs stored there are loaded into the work area of the main storage device and executed, and each component etc. is controlled through the execution of the program. , it is possible to realize each function that meets a predetermined purpose, as will be described later.

(Substrate processing method)
The substrate processing method according to the first embodiment will be described below with reference to the flowchart in FIG. 2.
A state in which the SPM liquid in the processing tank 11 is discarded and becomes empty will be described as an initial state.

First, the SPM liquid L is supplied to the processing tank 11 (step S1). Specifically, the control unit 33 controls the control valve 24 to supply hydrogen peroxide solution from the hydrogen peroxide solution supply unit 22 to the processing tank 11 via the hydrogen peroxide solution supply pipe 23 . Similarly, the control valve 21 is controlled by the control unit 33, and sulfuric acid is supplied from the sulfuric acid supply unit 19 to the processing tank 11 via the sulfuric acid supply pipe 20. The SPM liquid L generated in the processing tank 11 in this way is stored in the processing tank 11 and also overflows from the processing tank 11 and stored in the overflow tank 12 .

When a predetermined amount of SPM liquid is stored in the processing tank 11 and overflow tank 12, the control unit 33 turns on the SPM liquid feeding pump 15, and the SPM liquid circulates through the processing tank 11, overflow tank 12, and circulation pipe 13 (step S2). . At this time, the control unit 33 turns on the in-line heater 16 and adjusts the temperature of the SPM liquid flowing through the circulation pipe 13 to 120°C to 140°C.

With the liquid feed pump 15 turned on and the inline heater 16 turned on, the control unit 33 controls the control valve 27 to convert the hydrogen peroxide solution stored in the hydrogen peroxide solution storage tank 25 into a hydrogen peroxide solution. It is replenished via the replenishment pipe 26 (step S3). Further, if necessary, the control unit 33 controls the control valve 30 to replenish sulfuric acid from the sulfuric acid replenishment unit 28 via the sulfuric acid replenishment pipe 29.

When the SPM liquid is adjusted to a predetermined temperature, the control unit 33 controls the lifting unit 32 to lower the substrate holding unit 31 from the standby position to the processing position, and transfer the plurality of substrates W into the processing tank 11. It is immersed in the stored SPM liquid L (step S4).

Then, the control unit 33 supplies the SPM liquid L from the SPM liquid supply pipes 141 and 142 arranged at the bottom of the processing tank 11, and circulates the SPM liquid L through the processing tank 11, the overflow tank 12, and the circulation pipe 13. The substrate W held by the substrate holding section 31 is then cleaned (step S5).

When the cleaning is completed, the control unit 33 controls the lifting unit 32 to raise the substrate holding unit 31 from the processing position to the standby position, and transfers the cleaned substrate W to the transfer robot (step S6).

In the flowchart of FIG. 2, the process ends at step S6 for the sake of explanation, but in reality, the process returns to step S3, and after the hydrogen peroxide solution is replenished as necessary, the process proceeds to step S4. Washing with W is performed and this process is repeated.

Here, the hydrogen peroxide solution is replenished before the substrate holder 31 is lowered from the standby position to the processing position in step S4, but the hydrogen peroxide solution is replenished between step S4 and step S5. However, the timing of replenishing the hydrogen peroxide solution is not limited to this.

<Example 2>
Hereinafter, a second embodiment of the present invention will be described in detail with reference to the drawings. FIG. 3 is a block diagram showing a schematic configuration of the substrate processing apparatus 2 according to the second embodiment. Components similar to those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

The substrate processing apparatus 2 according to the second embodiment is provided with a hydrogen peroxide water supply pump 34 that transports the hydrogen peroxide water stored in the hydrogen peroxide water storage tank 25 to the hydrogen peroxide water replenishment pipe 26. . Here, the hydrogen peroxide water storage tank 25, the hydrogen peroxide water replenishment pipe 26, and the hydrogen peroxide water supply pump 34 correspond to the "hydrogen peroxide water replenishment unit" of the present invention.
The configuration of the substrate processing apparatus 2 is the same as that of the substrate processing apparatus 1 according to the first embodiment, except for the hydrogen peroxide water supply pump 34. Further, the cleaning process of the substrate W in the substrate processing apparatus 2 is basically the same as that in the substrate processing apparatus 1.

A substrate processing method specific to the substrate processing apparatus 2 will be described below with reference to the flowchart shown in FIG. FIG. 4 shows details of the process of replenishing the hydrogen peroxide solution (step S3) in the entire substrate processing method shown in FIG.
In the substrate processing apparatus 2, the control unit 33 controls mutual suction timing between the SPM liquid feeding pump 15 and the hydrogen peroxide water feeding pump 34.

First, by controlling the hydrogen peroxide water supply pump 34 and the control valve 27, hydrogen peroxide water is sucked from the hydrogen peroxide water storage tank 25, and the hydrogen peroxide water is sucked into the overflow tank 12 from the discharge port 26a of the hydrogen peroxide water replenishment pipe 26. The hydrogen peroxide solution is discharged (step S31).

Then, the SPM liquid in the overflow tank 12 is sucked from the suction port 13a of the circulation pipe 13 by the suction operation of the SPM liquid feeding pump 15 (step S32).

That is, before starting the suction operation of suctioning the SPM liquid in the overflow tank 12 from the suction port 13a of the circulation pipe 13 by the suction operation of the SPM liquid supply pump 15, hydrogen peroxide is The hydrogen peroxide solution is sucked from the water storage tank 25 and is discharged into the overflow tank 12 from the discharge port 26a of the hydrogen peroxide solution replenishment pipe 26.

In this way, the SPM solution is replenished with hydrogen peroxide before the concentration of hydrogen peroxide decreases due to dilution or decomposition of hydrogen peroxide, and the circulation piping is refilled while the concentration of hydrogen peroxide is high. 13
The SPM liquid can be sent to the processing tank 11 through the tank. Therefore, the ability to clean the substrates W in the processing tank 11 is improved.

Although FIG. 4 shows that the hydrogen peroxide water pump 34 and the SPM liquid pump 15 operate only once, these processes are repeated as necessary.

<Example 3>
Hereinafter, a third embodiment of the present invention will be described in detail with reference to the drawings. FIG. 5 is a block diagram showing a schematic configuration of the substrate processing apparatus 3 according to the third embodiment. Components similar to those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In the substrate processing apparatus 3 according to the third embodiment, the hydrogen peroxide replenishment pipe 26 for replenishing the SPM liquid with hydrogen peroxide from the hydrogen peroxide storage tank 25 is connected to the suction port 13a of the circulation pipe 13 for supplying the SPM liquid. It is connected to a portion 13b between the pump 15 and the pump 15. In this way, by connecting the hydrogen peroxide replenishment pipe 26 to the portion 13b between the suction port 13a of the circulation pipe 13 and the SPM liquid feed pump 15, the SPM liquid feed pump 15 in the circulation pipe 13 can be The SPM liquid present on the upstream side, that is, on the upstream side of the in-line heater 16, is replenished with hydrogen peroxide solution.

In this way, the hydrogen peroxide solution is replenished in the area where the SPM solution becomes negative pressure in the circulation piping 13 on the upstream side of the SPM solution feed pump 15, so that the hydrogen peroxide solution is efficiently added to the SPM solution. Since the SPM liquid is mixed and the concentration does not decrease, it is possible to supply the SPM liquid with a high concentration of hydrogen peroxide solution to the processing tank 11. Therefore, activation of the SPM liquid L is promoted, and the ability to clean the substrates W in the processing tank 11 is improved.

In addition, in the substrate processing apparatus 3 according to the third embodiment, as well as the substrate processing apparatus 2 according to the second embodiment, hydrogen peroxide solution is sent from the hydrogen peroxide solution storage tank 25 to the hydrogen peroxide solution replenishment pipe 26. A hydrogen peroxide water pump 34 may be provided.

<Example 4>
Hereinafter, a fourth embodiment of the present invention will be described in detail with reference to the drawings. FIG. 6 is a block diagram showing a schematic configuration of the substrate processing apparatus 4 according to the fourth embodiment. Components similar to those in Embodiments 1 and 2 are designated by the same reference numerals, and detailed description thereof will be omitted.

In the substrate processing apparatus 4 according to the fourth embodiment, the hydrogen peroxide replenishment pipe 26 for replenishing the SPM liquid with hydrogen peroxide from the hydrogen peroxide storage tank 25 is in-line with the SPM liquid supply pump 15 of the circulation piping 13. It is connected to a portion 13c between the heater 16 and the heater 16. In this way, by connecting the hydrogen peroxide solution replenishment pipe 26 to the part 13c of the circulation pipe 13 between the SPM liquid feeding pump 15 and the in-line heater 16, it can be connected to the upstream side of the in-line heater 16 in the circulation pipe 13. The existing SPM solution is replenished with hydrogen peroxide.

In this way, the hydrogen peroxide solution is replenished to the SPM solution before it is heated by the in-line heater 16, so that it is possible to suppress a decrease in the concentration due to the decomposition of the hydrogen peroxide solution. SPM liquid with a high concentration of hydrogen oxide water can be sent to the processing tank 11. In this way, it is possible to create a highly active SPM liquid L with a high concentration of hydrogen peroxide solution, so that the ability to clean the substrates W in the processing tank 11 is improved.

In addition, in the substrate processing apparatus 4 according to the fourth embodiment, as well as the substrate processing apparatus 2 according to the second embodiment, hydrogen peroxide solution is sent from the hydrogen peroxide solution storage tank 25 to the hydrogen peroxide solution replenishment pipe 26. A hydrogen peroxide water pump 34 may be provided.

<Example 5>
(Substrate processing system)
FIG. 7 is a plan view schematically showing the overall configuration of a substrate processing system 100 to which the substrate processing apparatus according to the present embodiment is applied. The substrate processing system 100 is a system that includes the substrate processing apparatuses 1 to 4 according to the first to fourth embodiments described above.

The substrate processing system 100 is a batch type device that processes a plurality of substrates W at once. The substrate processing system 100 includes a load port LP to which a carrier C containing a disk-shaped substrate W such as a semiconductor wafer is transported, and a substrate W transported from the load port LP is processed with a processing liquid such as a chemical solution or a rinsing liquid. The processing unit 102 includes a processing unit 102 , a plurality of transport robots that transport the substrate W between the load port LP and the processing unit 102 , and a control device 103 that controls the substrate processing system 100 .

The processing unit 102 includes a first chemical solution processing tank 104 that stores a first chemical solution in which a plurality of substrates W are immersed, and a first rinsing processing tank 105 that stores a first rinsing solution in which a plurality of substrates W is immersed. , a second chemical solution processing tank 106 that stores a second chemical solution into which a plurality of substrates W are immersed, and a second rinsing processing tank 107 which stores a second rinsing solution into which a plurality of substrates W are immersed. . The processing unit 102 further includes a drying tank 108 that dries the plurality of substrates W. The first chemical liquid processing tank 104 and the second chemical liquid processing tank 106 of the present substrate processing system 100 can be configured by the substrate processing apparatuses 1, 2, 3, or 4 according to the above-described embodiments. By configuring the substrate processing system 100 in this way, the ability to clean the substrate W is improved.
Note that the configuration of the substrate processing system including the substrate processing apparatuses 1, 2, 3, or 4 according to the embodiments described above is not limited to that described above.

Here, the first chemical liquid and the second chemical liquid are SPM liquids. The first rinsing liquid and the second rinsing liquid are, for example, pure water (deionized water). The first rinsing liquid and the second rinsing liquid may be rinsing liquids other than pure water. The first rinsing liquid and the second rinsing liquid may be different types of rinsing liquid.

The plurality of transfer robots transfer the carriers C between the load port LP and the processing unit 102, and transfer the carriers C to the carrier transfer device 109 that accommodates the plurality of carriers C and the carriers C held in the carrier transfer device 109. It includes an attitude changing robot 110 that carries in and out a plurality of substrates W and changes the attitude of the substrates W between a horizontal attitude and a vertical attitude. The attitude changing robot 110 performs a batch assembly operation in which a plurality of substrates W taken out from a plurality of carriers C form one batch, and a batch assembly operation in which a plurality of substrates W included in one batch are accommodated in a plurality of carriers C. Performs a release operation.

The plurality of transfer robots further include a main transfer robot 111 that transfers a plurality of substrates W between the attitude conversion robot 110 and the processing unit 102, and a main transfer robot 111 that transfers a plurality of substrates W between the main transfer robot 111 and the processing unit 102. It includes a plurality of sub-transport robots 112 that transport W. The plurality of sub-transport robots 112 include a first sub-transfer robot 112A that transports a plurality of substrates W between a first chemical processing tank 104 and a first rinsing processing tank 105, a second sub-transport robot 112A that transports a plurality of substrates W between a first chemical processing tank 104 and a first rinsing processing tank 105; A second sub-transport robot 112B that transports a plurality of substrates W to and from the rinsing treatment tank 107 is included.

The main transfer robot 111 receives one batch of substrates W consisting of a plurality of substrates W (for example, 50 substrates W) from the posture changing robot 110 . The main transfer robot 111 passes one batch of substrates W received from the attitude conversion robot 110 to the first sub-transfer robot 112A and the second sub-transfer robot 112B, and holds them in the first sub-transfer robot 112A and the second sub-transfer robot 112B. One batch of substrates W is received. The main transport robot 111 further includes 1
The batch of substrates W is transported to the drying treatment tank 108.

The first sub-transport robot 112A transports one batch of substrates W received from the main transport robot 111 between the first chemical processing tank 104 and the first rinsing processing tank 105. 1 chemical solution or the first rinsing liquid in the first rinsing tank 105. Similarly, the second sub-transport robot 112B transports one batch of substrates W received from the main transport robot 111 between the second chemical processing tank 106 and the second rinsing tank 107, and or the second rinsing liquid in the second rinsing tank 107.

1, 2, 3, 4... Substrate processing device 11... Processing tank 12... Overflow tank 13... Circulation piping 13a... Suction port 15... SPM liquid feeding pump 16... In-line Heater 25...Hydrogen peroxide water storage tank 26...Hydrogen peroxide water replenishment pipe 26a...Discharge port 33...Control unit 34...Hydrogen peroxide water supply pump L...SPM liquid W... Board

Claims (5)

In a substrate processing apparatus that processes a substrate,
a treatment tank for treating the substrate with a mixed solution containing sulfuric acid and hydrogen peroxide;
an outer tank for collecting the mixed liquid overflowing from the processing tank;
One end is connected to flow into the mixed liquid collected in the outer tank, the other end is connected to flow into the mixed liquid stored in the processing tank, and the mixed liquid is transferred from the outer tank to the processing tank. A circulation path that circulates toward
a mixed liquid feeding pump that is disposed in the circulation path and sends the mixed liquid collected in the outer tank toward the processing tank;
a heating unit that is disposed downstream of the mixed liquid feeding pump in the circulation path and heats the mixed liquid flowing in the circulation path;
a hydrogen peroxide solution replenishing unit that replenishes the hydrogen peroxide solution to the mixed solution present in the circulation path between the mixed solution feed pump and the heating unit;
A substrate processing apparatus comprising: The hydrogen peroxide replenishment section is
a hydrogen peroxide water storage tank that stores the hydrogen peroxide water;
a hydrogen peroxide water replenishment pipe having one end fluidly connected to the hydrogen peroxide water storage tank and the other end fluidly connected to the circulation path between the mixed liquid feeding pump and the heating section;
The substrate processing apparatus according to claim 1, further comprising: The substrate processing apparatus according to claim 2, wherein the hydrogen peroxide solution replenishment unit further includes a hydrogen peroxide solution supply pump that sends the hydrogen peroxide solution to the hydrogen peroxide solution replenishment pipe. . 4. The substrate processing apparatus according to claim 1, further comprising a sulfuric acid replenisher that replenishes the mixed liquid in the processing tank with the sulfuric acid. A substrate processing system comprising the substrate processing apparatus according to any one of claims 1 to 4.

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