JP7339044B2 - SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD - Google Patents

Description

The present invention provides a semiconductor wafer, a liquid crystal display substrate, a plasma display substrate, an organic EL substrate, an FED (Field Emission Display), an optical display substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, The present invention relates to a substrate processing apparatus and a substrate processing method for processing a solar cell substrate (hereinafter simply referred to as "substrate") with a processing liquid.

Sulfuric acid/hydrogen peroxide mixture (SPM), which produces Karo's acid with high cleaning ability, is conventionally used to remove resist remaining on the substrate surface and remove other organic contaminants. is used. In particular, in a batch-type substrate processing apparatus in which a plurality of substrates are simultaneously immersed in a processing bath filled with a mixed solution for cleaning, dozens of substrates are immersed in the SPM solution, and after a predetermined time has elapsed, the substrates are washed. After taking out the substrate, the operation of immersing the next substrate is repeated. In the case of continuous cleaning in this manner, the SPM solution in the processing bath adheres to the substrate surface and is carried out of the processing bath, thereby lowering the level of the SPM solution. Refill with hydrogen peroxide.

In addition, since hydrogen peroxide is a relatively unstable substance and gradually decomposes to generate water, even if sulfuric acid or hydrogen peroxide is replenished as the liquid level drops, The concentration of sulfuric acid decreases over time, which also decreases the cleaning ability of the SPM liquid.

Considering such properties of hydrogen peroxide solution, various proposals have been made for replenishment of hydrogen peroxide solution. For example, in Patent Document 1, a heater provided in a circulation line that connects an outer tank and an inner tank to circulate a mixed liquid and an SPM supply nozzle disposed at the bottom of the inner tank are provided with peroxide. A hydrogen water supply line is connected. Here, the time required for the hydrogen peroxide solution supplied from the hydrogen peroxide solution supply line to the circulation line to be discharged from the discharge hole of the SPM supply nozzle is within 5 seconds, or to the circulation line of the hydrogen peroxide solution supply line. The distance from the connection portion of the SPM supply nozzle to the ejection hole of the SPM supply nozzle is 50 cm or less.

Japanese Patent No. 5454108

However, in such a configuration, caro's acid may not be sufficiently activated in the liquid mixture discharged from the SPM supply nozzle.

Therefore, one aspect of the disclosed technique is to prepare a highly active liquid mixture containing sulfuric acid and hydrogen peroxide to improve cleaning performance.

One aspect of the technology disclosed is exemplified by the following substrate processing apparatus.
That is, the present substrate processing apparatus
In a substrate processing apparatus for processing substrates,
a processing bath for processing the substrate with a mixed solution containing sulfuric acid and hydrogen peroxide;
an outer tank for collecting the mixed liquid overflowing from the processing tank;
One end is circulatingly connected to the mixed solution recovered in the outer tank, the other end is circulatedly connected to the mixed solution stored in the processing tank, and the mixed solution is transferred from the outer tank to the processing tank. A circulation path that circulates toward
a heating unit arranged in the circulation path and heating the mixed liquid flowing through the circulation path;
A excess hydrogen peroxide solution for replenishing the mixed solution existing in the vicinity of the one end of the circulation path in the outer tank or the mixed solution existing upstream of the heating section in the circulation path with the hydrogen peroxide solution. a hydrogen oxide water replenishment unit;
characterized by comprising

According to such an invention, the hydrogen peroxide solution is replenished to the mixed liquid existing near one end of the circulating path in the outer tank, so that the circulating path is circulated before being diluted with the mixed liquid in the outer tank. Hydrogen peroxide solution can be replenished to the mixed solution to be circulated. Further, by replenishing the mixed liquid existing upstream of the heating section in the circulation path, the hydrogen peroxide solution is replenished to the low-temperature mixed liquid before being heated by the heating section. A decrease in the concentration of hydrogen oxide water can be suppressed. Therefore, it is possible to prepare a mixed liquid having a high concentration of hydrogen peroxide and a high activity, thereby improving the ability to clean the substrate.
Here, the circulation connection means that the fluid is connected in such a manner that the fluid can be circulated.

In the present invention,
The hydrogen peroxide solution replenishment unit
a hydrogen peroxide water storage tank for storing the hydrogen peroxide water;
a hydrogen peroxide solution replenishment pipe having one end circulatingly connected to the hydrogen peroxide solution storage tank and the other end connected to the mixed liquid collected in the outer tank;
with
The other end of the hydrogen peroxide solution replenishment pipe may be arranged in the vicinity of the one end of the circulation path.

As described above, according to the present invention, by arranging the other end of the hydrogen peroxide solution replenishing pipe near one end of the circulation path, the mixture that flows through the circulation path before being diluted with the mixture in the outer tank can be replenished with hydrogen peroxide. Therefore, it is possible to prepare a mixed liquid having a high concentration of hydrogen peroxide and a high activity, thereby improving the ability to clean the substrate.

In the present invention,
A mixed solution sending pump for sending the mixed solution collected in the outer tank toward the processing tank is provided on the upstream side of the heating unit in the circulation path,
The hydrogen peroxide solution replenishing pipe is installed in a region where the pressure of the mixed liquid in the outer tank is lower than that of the surrounding region when the mixed liquid in the outer tank is sucked from the one end of the circulation path by the mixed liquid feeding pump. Edges may be arranged.

As described above, according to the present invention, the hydrogen peroxide solution replenishing pipe is provided in the region where the pressure becomes more negative than the surrounding region when the mixed liquid in the outer tank is sucked from one end of the circulation path by the mixed liquid feeding pump. By arranging the other end, the replenished hydrogen peroxide solution is sucked into the mixed liquid in the circulation path by the next suction operation of the mixed liquid feeding pump before being diluted with the mixed liquid in the outer tank. mixed. Therefore, it is possible to prepare a mixed liquid having a high concentration of hydrogen peroxide and a high activity, thereby improving the ability to clean the substrate.

In the present invention,
The hydrogen peroxide solution replenishment unit
a hydrogen peroxide water storage tank for storing the hydrogen peroxide water;
a hydrogen peroxide solution replenishing pipe having one end circulatingly connected to the hydrogen peroxide solution storage tank and the other end circulatingly connected upstream of the heating section in the circulation path;
may be provided.

As described above, according to the present invention, the other end of the hydrogen peroxide solution replenishing pipe is connected to the upstream side of the heating section in the circulation path, so that the hydrogen peroxide solution is supplied to the upstream side of the heating section in the circulation path. will be replenished to the mixed liquid present in the As a result, the hydrogen peroxide solution is replenished to the low-temperature mixed liquid before being heated by the heating unit, so that the decrease in concentration of the hydrogen peroxide solution due to decomposition can be suppressed. Therefore, it is possible to prepare a mixed liquid having a high concentration of hydrogen peroxide and a high activity, thereby improving the ability to clean the substrate.

In the present invention,
A mixed solution sending pump for sending the mixed solution collected in the outer tank toward the processing tank is provided on the upstream side of the heating unit in the circulation path,
The other end of the hydrogen peroxide solution replenishing pipe may be connected to the circulation path on the upstream side of the mixed liquid feeding pump.

Thus, according to the present invention, the negative pressure generated on the upstream side of the liquid mixture feed pump promotes mixing of the replenished hydrogen peroxide solution with the liquid mixture, thereby facilitating activation of the liquid mixture. Therefore, a highly active liquid mixture can be prepared, and the ability to clean the substrate is improved.

In the present invention,
The hydrogen peroxide solution replenishing unit further has a hydrogen peroxide solution sending pump for sending the hydrogen peroxide solution to the hydrogen peroxide solution replenishing pipe,
further comprising a control unit that controls the mixed liquid feeding pump and the hydrogen peroxide water feeding pump,
The control unit controls the mixed solution sending pump and the peroxide solution so that the hydrogen peroxide solution is replenished from the hydrogen peroxide solution replenishing unit before the suction operation of the mixed solution sending pump is started. A hydrogen water supply pump may be controlled.

As described above, according to the present invention, the mixed solution sending pump and the peroxide solution are supplied so that the hydrogen peroxide solution is replenished from the hydrogen peroxide solution replenishing unit before the suction operation of the mixed solution sending pump is started. Since the hydrogen water supply pump is controlled, the mixed liquid is replenished with the hydrogen peroxide water before the concentration of the hydrogen peroxide water decreases due to dilution or decomposition of the hydrogen peroxide water. Therefore, it is possible to prepare a mixed liquid having a high concentration of hydrogen peroxide and a high activity, thereby improving the ability to clean the substrate.

In the present invention,
A sulfuric acid replenishing unit for replenishing the mixed solution in the processing tank with the sulfuric acid may be further provided.

As described above, according to the present invention, sulfuric acid can be replenished by the sulfuric acid replenishing unit, so that the concentration of sulfuric acid in the liquid mixture can be appropriately maintained. Therefore, a highly active liquid mixture can be prepared, and the ability to clean the substrate is improved.

Moreover, this invention is a substrate processing system provided with the said substrate processing apparatus.

Thus, according to the present invention, by constructing a substrate processing system from the substrate processing apparatus described above, the substrate cleaning capability in the substrate processing system is improved.

In addition, the present invention
A substrate processing method for processing a substrate,
a processing bath for processing the substrate with a mixed solution containing sulfuric acid and hydrogen peroxide;
an outer tank for collecting the mixed liquid overflowing from the processing tank;
One end is connected to the mixed liquid collected in the outer tank, the other end is connected in circulation to the mixed liquid stored in the processing tank, and the mixed liquid is directed from the outer tank to the processing tank. a circulation path that circulates through
a heating unit arranged in the circulation path and heating the mixed liquid flowing through the circulation path;
a mixed liquid feeding pump that feeds the mixed liquid collected in the outer tank toward the processing tank upstream of the heating unit in the circulation path;
A excess hydrogen peroxide solution for replenishing the mixed solution existing in the vicinity of the one end of the circulation path in the outer tank or the mixed solution existing upstream of the heating section in the circulation path with the hydrogen peroxide solution. a hydrogen peroxide solution replenishment unit, the hydrogen peroxide solution replenishment unit having a hydrogen peroxide solution sending pump for sending the hydrogen peroxide solution to be replenished;
In a substrate processing apparatus comprising
a step of sucking the mixed liquid by the mixed liquid feeding pump;
a step of sucking the hydrogen peroxide solution by the hydrogen peroxide solution sending pump before starting to suck the mixed solution by the mixed solution sending pump;
A substrate processing method comprising:

As described above, according to the present invention, the mixed solution sending pump and the peroxide solution are supplied so that the hydrogen peroxide solution is replenished from the hydrogen peroxide solution replenishing unit before the suction operation of the mixed solution sending pump is started. Since the hydrogen water supply pump is controlled, the mixed liquid is replenished with the hydrogen peroxide water before the concentration of the hydrogen peroxide water decreases due to dilution or decomposition of the hydrogen peroxide water. Therefore, it is possible to prepare a mixed liquid having a high concentration of hydrogen peroxide and a high activity, thereby improving the ability to clean the substrate.

According to the substrate processing apparatus of the present invention, it is possible to prepare a highly active liquid mixture containing sulfuric acid and hydrogen peroxide solution, thereby improving the cleaning performance.

FIG. 1 is a block diagram showing a schematic configuration of a substrate processing apparatus of Example 1. As shown in FIG. FIG. 2 is a flow chart showing the substrate processing method of the first embodiment. FIG. 3 is a block diagram showing a schematic configuration of the substrate processing apparatus of Example 2. As shown in FIG. FIG. 4 is a flow chart showing part of the substrate processing method of the second embodiment. FIG. 5 is a block diagram showing a schematic configuration of a substrate processing apparatus of Example 3. As shown in FIG. FIG. 6 is a block diagram showing a schematic configuration of a substrate processing apparatus of Example 4. As shown in FIG. FIG. 7 is a plan view showing a schematic configuration of a substrate processing system of Example 5. FIG.

<Example 1>
EMBODIMENT OF THE INVENTION Hereinafter, it demonstrates in detail, referring drawings for Example 1 of this invention. In addition, the example shown below is one aspect of the present invention, and does not limit the technical scope of the present invention. FIG. 1 is a block diagram showing a schematic configuration of a substrate processing apparatus 1 according to a first embodiment.

The substrate processing apparatus 1 is a batch-type apparatus that cleans a plurality of substrates W with an SPM liquid L at once. This substrate processing apparatus 1 includes a processing bath 11 and an overflow bath 12 . The processing tank 11 has a size capable of accommodating a plurality of substrates W, stores the SPM liquid L, and performs a cleaning process on the plurality of substrates W with the SPM liquid L. As shown in FIG. The overflow tank 12 is provided around the upper edge of the processing tank 11 and collects the SPM liquid overflowing from the processing tank 11 . Here, the SPM liquid corresponds to the "mixed liquid" of the invention, and the overflow tank 12 corresponds to the "outer tank" of the invention.

The processing tank 11 and the overflow tank 12 are circulated and connected by a circulation pipe 13 . One end of the circulation pipe 13 extends from the top to the bottom of the overflow bath 12 , and the other end of the circulation pipe 13 is connected to SPM liquid supply pipes 141 and 142 placed at the bottom of the processing bath 11 . In the circulation pipe 13, an in-line heater 16, a filter 17, and a control valve 18 are connected from an SPM liquid feed pump 15 provided on the overflow tank 12 side toward the processing tank 11 side, that is, toward the downstream side of the processing liquid. are arranged in order. Here, the circulation pipe 13 corresponds to the "circulation path" of the present invention, the SPM liquid transfer pump 15 corresponds to the "mixed liquid transfer pump" of the present invention, and the in-line heater 16 corresponds to the "heating section" of the present invention. corresponds to

The SPM liquid feed pump 15 pressure-feeds the SPM liquid through the circulation pipe 13 . The in-line heater 16 heats the SPM liquid flowing through the circulation pipe 13 and adjusts the temperature to a processing temperature (for example, approximately 120° C. to 140° C.). The filter 17 filters and removes foreign matter such as particles in the SPM liquid flowing through the circulation pipe 13 . The control valve 18 controls circulation of the processing liquid in the circulation pipe 13 . When the SPM liquid transfer pump 15 is turned on, the SPM liquid stored in the overflow tank 12 is sucked into the circulation pipe 13, subjected to temperature control by the in-line heater 16 and filtration by the filter 17, and sent to the processing tank 11. .

One end of a sulfuric acid supply pipe 20 for supplying sulfuric acid from a sulfuric acid supply unit 19 to the treatment tank 11 is arranged in the treatment tank 11 . Sulfuric acid is stored in the sulfuric acid supply unit 19 . The sulfuric acid supply pipe 20 is provided with a control valve 21 for controlling the supply of sulfuric acid from the sulfuric acid supply section 19 to the treatment tank 11 .

One end of a hydrogen peroxide water supply pipe 23 for supplying hydrogen peroxide water from a hydrogen peroxide water supply unit 22 to the processing tank 11 is arranged in the processing tank 11 . A hydrogen peroxide solution is stored in the hydrogen peroxide solution supply unit 22 . A control valve 24 for controlling the supply of the hydrogen peroxide solution from the hydrogen peroxide solution supply unit 22 to the treatment tank 11 is provided in the hydrogen peroxide solution supply pipe 23 .

The overflow tank 12 has a discharge port 26a (indicated by a circle in FIG. 1) provided at one end of a hydrogen peroxide solution replenishment pipe 26 for replenishing the overflow tank 12 with hydrogen peroxide solution from the hydrogen peroxide solution storage tank 25. ) are placed. A hydrogen peroxide solution is stored in the hydrogen peroxide solution storage tank 25 . The hydrogen peroxide solution replenishing pipe 26 is provided with a control valve 27 for controlling the supply of the hydrogen peroxide solution from the hydrogen peroxide solution storage tank 25 to the overflow tank 12 . The hydrogen peroxide water storage tank 25 replenishes the SPM liquid flowing through the circulation pipe 13 with hydrogen peroxide water. Here, the hydrogen peroxide solution storage tank 25 and the hydrogen peroxide solution replenishment pipe 26 correspond to the "hydrogen peroxide solution replenishment part" of the present invention.

Here, the discharge port 26a of the hydrogen peroxide solution replenishment pipe 26 is arranged near the suction port 13a (indicated by a circle in FIG. 1) which is one end of the circulation pipe 13 . The vicinity of the suction port 13a of the circulation pipe 13 is the area where the suction port 13a is sucked by the suction operation of the SPM liquid feeding pump 15, in other words, the area around the suction port 13a. On the other hand, it is a region where the pressure becomes negative and a pressure difference occurs. Although the specific range in the vicinity differs depending on the capability of the SPM liquid feed pump 15, it is, for example, a range with a radius of about 100 mm from the suction port 13a. By arranging the discharge port 26a of the hydrogen peroxide solution replenishing pipe 26 in the vicinity of the suction port 13a that is one end of the circulation pipe 13 in this way, A hydrogen peroxide solution is added to the SPM liquid. In this way, the SPM solution replenished with the hydrogen peroxide solution near the suction port 13a of the circulation pipe 13 is discharged into the processing tank 11 after about 10 to about 20 seconds in a state in which the activity of caro's acid generated by the reaction of the SPM solution is high. to reach

By arranging the discharge port 26a of the hydrogen peroxide solution replenishing pipe 26 in the vicinity of the suction port 13a of the circulation pipe 13 in this way, the hydrogen peroxide solution is diluted with the SPM solution in the overflow tank 12, and The SPM liquid flowing through the circulation pipe 13 can be replenished. Therefore, a highly active SPM liquid can be generated, and the ability to clean the substrates W in the processing bath 11 is also improved.

The hydrogen peroxide water storage tank 25 may be provided in the substrate processing apparatus 1 or may be provided as equipment for each facility. Also, a flow meter may be provided downstream of the control valve 27 .

One end of a sulfuric acid replenishing pipe 29 for supplying sulfuric acid from a sulfuric acid replenishing unit 28 to the processing bath 11 is arranged in the processing bath 11 . Sulfuric acid is stored in the sulfuric acid replenishing unit 28 . The sulfuric acid replenishing pipe 29 is provided with a control valve 30 for controlling replenishment of sulfuric acid from the sulfuric acid replenishing unit 28 to the processing bath 11 .

The substrate W is held in an upright posture by holding rods 312 , 313 , and 314 provided on the lower portion of the main body plate 311 of the substrate holding portion 31 . The elevating unit 32 moves the substrate holder 31 up and down between a processing position where the substrate W is immersed in the processing liquid inside the processing tank 11 shown in FIG. 1 and a standby position above the processing tank 11 .

The SPM liquid feed pump 15, the in-line heater 16, the filter 17, the control valve 18, the control valve 21, the control valve 24, the control valve 27, the control valve 30, and the lifting unit 32 described above are integrally controlled by the control unit 33. . The control unit 33 can be configured by a computer having a processor such as a CPU, a main storage device such as RAM and ROM, and an auxiliary storage device such as EPROM. Various programs, various tables, etc. are stored in the auxiliary storage device, and the programs stored therein are loaded into the work area of the main storage device and executed, and each component is controlled through the execution of the program. , it is possible to realize each function that meets a predetermined purpose, as will be described later.

(Substrate processing method)
A substrate processing method according to the first embodiment will be described below with reference to the flowchart of FIG.
A state in which the SPM liquid in the processing tank 11 has been discarded and is empty will be described as an initial state.

First, the SPM liquid L is supplied to the processing tank 11 (step S1). Specifically, the control unit 33 controls the control valve 24 to supply the hydrogen peroxide solution from the hydrogen peroxide solution supply unit 22 to the treatment tank 11 through the hydrogen peroxide solution supply pipe 23 . Similarly, the control unit 33 controls the control valve 21 to supply sulfuric acid from the sulfuric acid supply unit 19 to the processing bath 11 through the sulfuric acid supply pipe 20 . The SPM liquid L generated in the processing bath 11 in this way is stored in the processing bath 11 and also overflows from the processing bath 11 and is also stored in the overflow bath 12 .

When a predetermined amount is stored in the processing tank 11 and the overflow tank 12, the controller 33 turns on the SPM liquid feeding pump 15, and the SPM liquid circulates through the processing tank 11, the overflow tank 12, and the circulation pipe 13 (step S2). . At this time, the controller 33 turns on the in-line heater 16 to control the temperature of the SPM liquid flowing through the circulation pipe 13 to 120.degree. C. to 140.degree.

With the liquid feed pump 15 turned on and the in-line heater 16 turned on, the control unit 33 controls the control valve 27 to convert the hydrogen peroxide water stored in the hydrogen peroxide water storage tank 25 into hydrogen peroxide water. It is replenished through the replenishment pipe 26 (step S3). Further, the control unit 33 controls the control valve 30 as necessary to replenish sulfuric acid from the sulfuric acid replenishing unit 28 through the sulfuric acid replenishing pipe 29 .

When the SPM liquid is adjusted to a predetermined temperature, the control unit 33 controls the elevating unit 32 to lower the substrate holding unit 31 from the standby position to the processing position, thereby transferring the plurality of substrates W into the processing bath 11. It is immersed in the stored SPM liquid L (step S4).

The control unit 33 supplies the SPM liquid L from the SPM liquid supply pipes 141 and 142 arranged at the bottom of the processing tank 11, and circulates the SPM liquid L through the processing tank 11, the overflow tank 12 and the circulation pipe 13. Then, the substrate W held by the substrate holding part 31 is washed (step S5).

After the cleaning is completed, the controller 33 controls the elevating unit 32 to raise the substrate holder 31 from the processing position to the standby position, and transfers the cleaned substrate W to the transport robot (step S6).

In the flowchart of FIG. 2, the process ends at step S6 for the sake of explanation, but in reality, the process returns to step S3, and when the hydrogen peroxide solution is replenished as necessary, the process proceeds to step S4 to proceed to the next substrate. A W wash is performed and the process is repeated.

Here, the hydrogen peroxide solution is replenished before the substrate holder 31 is lowered from the standby position to the processing position in step S4, but the hydrogen peroxide solution is replenished between steps S4 and S5. The timing of replenishing the hydrogen peroxide solution is not limited to this.

<Example 2>
A second embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 3 is a block diagram showing a schematic configuration of the substrate processing apparatus 2 according to the second embodiment. Configurations similar to those of the first embodiment are denoted by similar reference numerals, and detailed description thereof is omitted.

The substrate processing apparatus 2 according to the second embodiment is provided with a hydrogen peroxide solution feeding pump 34 for feeding the hydrogen peroxide solution stored in the hydrogen peroxide solution storage tank 25 to the hydrogen peroxide solution replenishment pipe 26 . . Here, the hydrogen peroxide solution storage tank 25, the hydrogen peroxide solution replenishment pipe 26, and the hydrogen peroxide solution supply pump 34 correspond to the "hydrogen peroxide solution replenishment unit" of the present invention.
The configuration of the substrate processing apparatus 2 is the same as that of the substrate processing apparatus 1 according to the first embodiment, except for the hydrogen peroxide water supply pump 34 . Also, the cleaning process of the substrate W in the substrate processing apparatus 2 is basically the same as that in the substrate processing apparatus 1 .

A substrate processing method unique to the substrate processing apparatus 2 will be described below with reference to the flowchart shown in FIG. FIG. 4 shows details of the process of replenishing the hydrogen peroxide solution (step S3) in the overall substrate processing method shown in FIG.
In the substrate processing apparatus 2 , the mutual suction timing of the SPM liquid feeding pump 15 and the hydrogen peroxide water feeding pump 34 is controlled by the control section 33 .

First, the hydrogen peroxide solution is sucked from the hydrogen peroxide solution storage tank 25 under the control of the hydrogen peroxide solution feeding pump 34 and the control valve 27, and is discharged into the overflow tank 12 from the discharge port 26a of the hydrogen peroxide solution replenishment pipe 26. to discharge hydrogen peroxide water (step S31).

Then, the SPM liquid in the overflow tank 12 is sucked from the suction port 13a of the circulation pipe 13 by the suction operation of the SPM liquid feeding pump 15 (step S32).

That is, before starting the suction operation of sucking the SPM liquid in the overflow tank 12 from the suction port 13 a of the circulation pipe 13 by the suction operation of the SPM liquid transfer pump 15 , hydrogen peroxide is The hydrogen peroxide solution is sucked from the water storage tank 25 and discharged into the overflow tank 12 from the discharge port 26 a of the hydrogen peroxide solution replenishment pipe 26 .

By doing so, the SPM solution is replenished with hydrogen peroxide solution before the concentration of hydrogen peroxide solution decreases due to dilution or decomposition of hydrogen peroxide solution, and the circulation pipe can 13
The SPM liquid can be sent to the processing tank 11 through the . Therefore, the ability to clean the substrates W in the processing bath 11 is improved.

Although FIG. 4 shows the operation of the hydrogen peroxide water supply pump 34 and the SPM liquid supply pump 15 only once, these processes are repeated as necessary.

<Example 3>
Embodiment 3 of the present invention will be described in detail below with reference to the drawings. FIG. 5 is a block diagram showing a schematic configuration of the substrate processing apparatus 3 according to the second embodiment. Configurations similar to those of the first embodiment are denoted by similar reference numerals, and detailed description thereof is omitted.

In the substrate processing apparatus 3 according to the third embodiment, the hydrogen peroxide solution replenishment pipe 26 for replenishing the SPM solution with the hydrogen peroxide solution from the hydrogen peroxide solution storage tank 25 is connected to the suction port 13a of the circulation pipe 13 and the SPM solution feed. It is connected to the portion 13b between the pump 15 and the pump 15. Thus, by connecting the hydrogen peroxide solution replenishing pipe 26 to the portion 13b between the suction port 13a of the circulation pipe 13 and the SPM liquid feeding pump 15, the SPM liquid feeding pump 15 in the circulation pipe 13 The SPM liquid present on the upstream side, that is, on the upstream side of the in-line heater 16 is replenished with the hydrogen peroxide solution.

In this way, the hydrogen peroxide solution is replenished in the region where the SPM solution has a negative pressure in the circulation pipe 13 on the upstream side of the SPM solution feeding pump 15, so that the hydrogen peroxide solution efficiently converts to the SPM solution. Since the SPM liquid is mixed and the concentration does not decrease, the SPM liquid having a high concentration of hydrogen peroxide can be supplied to the processing tank 11 . Therefore, the activation of the SPM liquid L is promoted, and the ability to clean the substrates W in the processing tank 11 is improved.

In the substrate processing apparatus 3 according to the third embodiment, similarly to the substrate processing apparatus 2 according to the second embodiment, the hydrogen peroxide solution is sent from the hydrogen peroxide solution storage tank 25 to the hydrogen peroxide solution replenishment pipe 26. A hydrogen peroxide solution feeding pump 34 may be provided.

<Example 4>
A fourth embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 6 is a block diagram showing a schematic configuration of a substrate processing apparatus 4 according to the third embodiment. Configurations similar to those of the first and second embodiments are denoted by similar reference numerals, and detailed descriptions thereof are omitted.

In the substrate processing apparatus 4 according to the fourth embodiment, the hydrogen peroxide solution replenishing pipe 26 for replenishing the SPM solution with the hydrogen peroxide solution from the hydrogen peroxide solution storage tank 25 is in-line with the SPM solution feeding pump 15 of the circulation pipe 13 . It is connected to the portion 13c between the heater 16 and the heater 16 . Thus, by connecting the hydrogen peroxide solution replenishing pipe 26 to the portion 13c of the circulation pipe 13 between the SPM liquid feeding pump 15 and the inline heater 16, A hydrogen peroxide solution is added to the existing SPM liquid.

In this way, since the hydrogen peroxide solution is added to the SPM solution before being heated by the in-line heater 16, it is possible to suppress the decrease in the concentration due to the decomposition of the hydrogen peroxide solution. An SPM liquid having a high concentration of hydrogen oxide water can be sent to the processing tank 11 . In this manner, the concentration of the hydrogen peroxide solution is high and the highly active SPM liquid L can be prepared, so that the ability to clean the substrates W in the processing bath 11 is improved.

In the substrate processing apparatus 3 according to the third embodiment, similarly to the substrate processing apparatus 2 according to the second embodiment, the hydrogen peroxide solution is sent from the hydrogen peroxide solution storage tank 25 to the hydrogen peroxide solution replenishment pipe 26. A hydrogen peroxide solution feeding pump 34 may be provided.

<Example 5>
(substrate processing system)
FIG. 7 is a plan view showing an outline of the overall configuration of a substrate processing system 100 to which the substrate processing apparatus according to this embodiment is applied. A substrate processing system 100 is a system including the substrate processing apparatuses according to the first to fourth embodiments described above.

The substrate processing system 100 is a batch-type apparatus that processes a plurality of substrates W collectively. The substrate processing system 100 includes a load port LP for transporting a carrier C containing disc-shaped substrates W such as semiconductor wafers, and processing the substrates W transported from the load port LP with a processing liquid such as a chemical liquid or a rinse liquid. , a plurality of transport robots that transport substrates W between the load port LP and the processing units 102 , and a controller 103 that controls the substrate processing system 100 .

The processing unit 102 includes a first chemical treatment bath 104 storing a first chemical solution in which the plurality of substrates W are immersed, and a first rinse treatment bath 105 storing a first rinse solution in which the plurality of substrates W are immersed. , a second chemical solution processing tank 106 storing a second chemical solution in which the plurality of substrates W are immersed, and a second rinse processing bath 107 storing a second rinsing solution in which the plurality of substrates W are immersed. . The processing unit 102 further includes a drying processing bath 108 for drying the plurality of substrates W. As shown in FIG. The first chemical processing bath 104 and the second chemical processing bath 106 of the substrate processing system 100 can be configured by the substrate processing apparatuses 1, 2, 3, or 4 according to the above-described embodiments. By configuring the substrate processing system 100 in this way, the ability to clean the substrate W is improved.
The configuration of the substrate processing system provided with the substrate processing apparatuses 1, 2, 3, or 4 according to the above embodiments is not limited to that described above.

Here, the first chemical liquid and the second chemical liquid are SPM liquids. The first rinse and second rinse are, for example, pure water (deionized water). The first rinse liquid and the second rinse liquid may be rinse liquids other than pure water. The first rinse and the second rinse may be different types of rinse.

A plurality of transport robots transport carriers C between the load port LP and the processing unit 102. A carrier transport device 109 accommodating the plurality of carriers C and a carrier C held by the carrier transport device 109 It includes an attitude changing robot 110 that carries in and out a plurality of substrates W and changes the attitude of the substrates W between a horizontal attitude and a vertical attitude. The posture changing robot 110 performs a batch assembly operation to form one batch with a plurality of substrates W picked up from a plurality of carriers C, and a batch operation to accommodate a plurality of substrates W included in one batch in a plurality of carriers C. release operation.

The plurality of transport robots further includes a main transport robot 111 that transports a plurality of substrates W between the posture changing robot 110 and the processing unit 102 and a plurality of substrates W that are transported between the main transport robot 111 and the processing unit 102 . and a plurality of sub-transport robots 112 that transport W. The plurality of sub-transport robots 112 includes a first sub-transport robot 112A that transports a plurality of substrates W between the first chemical processing bath 104 and the first rinse processing bath 105; and a second sub-transfer robot 112B that transfers a plurality of substrates W to and from the rinsing bath 107 .

The main transport robot 111 receives one batch of substrates W consisting of a plurality of (for example, 50) substrates W from the posture changing robot 110 . The main transport robot 111 passes the batch of substrates W received from the attitude changing robot 110 to the first sub-transfer robot 112A and the second sub-transfer robot 112B, and holds them in the first sub-transfer robot 112A and the second sub-transfer robot 112B. A batch of substrates W is received. The main transport robot 111 further
A batch of substrates W is transferred to the drying treatment tank 108 .

The first sub-transfer robot 112A transfers a batch of substrates W received from the main transfer robot 111 between the first chemical treatment tank 104 and the first rinse treatment tank 105, It is immersed in one chemical solution or the first rinse solution in the first rinse treatment bath 105 . Similarly, the second sub-transfer robot 112B transfers one batch of substrates W received from the main transfer robot 111 between the second chemical treatment tank 106 and the second rinse treatment tank 107, and the second chemical treatment tank 106 or the second rinsing solution in the second rinsing bath 107 .

DESCRIPTION OF SYMBOLS 1,2,3,4... Substrate processing apparatus 11... Processing tank 12... Overflow tank 13... Circulation pipe 13a... Suction port 15... SPM liquid sending pump 16... In-line Heater 25 Hydrogen peroxide water storage tank 26 Hydrogen peroxide water replenishment pipe 26a Discharge port 33 Control unit 34 Hydrogen peroxide water feeding pump L SPM liquid W: Substrate

Claims (7)

In a substrate processing apparatus for processing substrates,
a processing bath for processing the substrate with a mixed solution containing sulfuric acid and hydrogen peroxide;
an outer tank for collecting the mixed liquid overflowing from the processing tank;
One end is circulatingly connected to the mixed solution recovered in the outer tank, the other end is circulatedly connected to the mixed solution stored in the processing tank, and the mixed solution is transferred from the outer tank to the processing tank. A circulation path that circulates toward
a heating unit arranged in the circulation path and heating the mixed liquid flowing through the circulation path;
a hydrogen peroxide solution storage tank for storing the hydrogen peroxide solution; and a peroxide solution having one end circulatingly connected to the hydrogen peroxide solution storage tank and having the other end connected to the mixed liquid recovered in the outer tank. a hydrogen peroxide water replenishment pipe and a hydrogen peroxide water pump for feeding the hydrogen peroxide water to the hydrogen peroxide water replenishment pipe; a hydrogen peroxide solution replenishing unit for replenishing the existing mixed solution or the mixed solution existing upstream of the heating unit in the circulation path with the hydrogen peroxide solution;
a mixed liquid sending pump provided in the circulation path for sending the mixed liquid collected in the outer tank toward the processing tank;
a control unit that controls the mixed liquid feeding pump and the hydrogen peroxide water feeding pump;
with
An area in the vicinity of the one end of the circulation path, where the pressure is lower than that of the surrounding area when the mixed liquid feeding pump sucks the mixed liquid in the outer tank from the one end of the circulation path. , placing the other end of the hydrogen peroxide solution replenishing pipe,
The control unit controls the mixed solution sending pump and the peroxide solution so that the hydrogen peroxide solution is replenished from the hydrogen peroxide solution replenishing unit before the suction operation of the mixed solution sending pump is started. A substrate processing apparatus, characterized by controlling a hydrogen water supply pump . In a substrate processing apparatus for processing substrates,
a processing bath for processing the substrate with a mixed solution containing sulfuric acid and hydrogen peroxide;
an outer tank for collecting the mixed liquid overflowing from the processing tank;
One end is circulatingly connected to the mixed solution recovered in the outer tank, the other end is circulatedly connected to the mixed solution stored in the processing tank, and the mixed solution is transferred from the outer tank to the processing tank. A circulation path that circulates toward
a heating unit arranged in the circulation path and heating the mixed liquid flowing through the circulation path;
a hydrogen peroxide solution storage tank for storing the hydrogen peroxide solution; A hydrogen peroxide solution replenishment pipe and a hydrogen peroxide solution sending pump for sending the hydrogen peroxide solution to the hydrogen peroxide solution replenishment pipe, and the vicinity of the one end of the circulation path in the outer tank a hydrogen peroxide solution replenishing unit that replenishes the hydrogen peroxide solution to the mixed solution existing in the circulation path or the mixed solution existing on the upstream side of the heating unit in the circulation path;
a mixed liquid sending pump provided in the circulation path for sending the mixed liquid collected in the outer tank toward the processing tank;
a control unit that controls the mixed liquid feeding pump and the hydrogen peroxide water feeding pump;
with
the other end of the hydrogen peroxide solution replenishing pipe is connected to the circulation path on the upstream side of the mixed solution sending pump;
The control unit controls the mixed solution sending pump and the peroxide solution so that the hydrogen peroxide solution is replenished from the hydrogen peroxide solution replenishing unit before the suction operation of the mixed solution sending pump is started. A substrate processing apparatus, characterized by controlling a hydrogen water supply pump. 3. The substrate processing apparatus according to claim 1, wherein the mixed liquid feeding pump is provided upstream of the heating unit in the circulation path. 3. The substrate processing apparatus according to claim 1, further comprising a sulfuric acid replenishing unit for replenishing said mixed solution in said processing bath with said sulfuric acid. A substrate processing system comprising the substrate processing apparatus according to claim 1 . A substrate processing method for processing a substrate,
a processing bath for processing the substrate with a mixed solution containing sulfuric acid and hydrogen peroxide;
an outer tank for collecting the mixed liquid overflowing from the processing tank;
One end is connected to the mixed liquid collected in the outer tank, the other end is connected in circulation to the mixed liquid stored in the processing tank, and the mixed liquid is directed from the outer tank to the processing tank. a circulation path that circulates through
a heating unit arranged in the circulation path and heating the mixed liquid flowing through the circulation path;
a mixed solution sending pump for sending the mixed solution collected in the outer tank toward the processing tank to the circulation path ;
A excess hydrogen peroxide solution for replenishing the mixed solution existing in the vicinity of the one end of the circulation path in the outer tank or the mixed solution existing upstream of the heating section in the circulation path with the hydrogen peroxide solution. a hydrogen peroxide solution replenishment unit, the hydrogen peroxide solution replenishment unit having a hydrogen peroxide solution sending pump for sending the hydrogen peroxide solution to be replenished;
In a substrate processing apparatus comprising
a step of sucking the mixed liquid by the mixed liquid feeding pump;
a step of sucking the hydrogen peroxide solution by the hydrogen peroxide solution sending pump before starting to suck the mixed solution by the mixed solution sending pump;
A substrate processing method comprising: 7. The substrate processing method according to claim 6, wherein the mixed liquid feeding pump is provided upstream of the heating section in the circulation path.

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