JP2023153139A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2023153139A5 JP2023153139A5 JP2023118209A JP2023118209A JP2023153139A5 JP 2023153139 A5 JP2023153139 A5 JP 2023153139A5 JP 2023118209 A JP2023118209 A JP 2023118209A JP 2023118209 A JP2023118209 A JP 2023118209A JP 2023153139 A5 JP2023153139 A5 JP 2023153139A5
- Authority
- JP
- Japan
- Prior art keywords
- packaging
- cover tape
- electronic component
- electronic components
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229920001684 low density polyethylene Polymers 0.000 claims description 2
- 239000004702 low-density polyethylene Substances 0.000 claims description 2
- -1 polybutylene terephthalate Polymers 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229920001707 polybutylene terephthalate Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000004677 Nylon Substances 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
Description
以上、本発明の実施形態について述べたが、これらは本発明の例示であり、上記以外の様々な構成を採用することができる。また、本発明は上述の実施形態に限定されるものではなく、本発明の目的を達成できる範囲での変形、改良等は本発明に含まれる。
以下、参考形態の例を付記する。
１．
幅が３ｍｍ以下の長尺状であり、
ＪＩＳ Ｋ ６７３４に従い測定される破断強度が１０Ｎ以上である、電子部品包装用カバーテープ。
２．
１．に記載の電子部品包装用カバーテープであって、
１００５サイズ以下の電子部品の包装に用いられる、電子部品包装用カバーテープ。
３．
１．または２．に記載の電子部品包装用カバーテープであって、
少なくとも、基材層と、中間層と、シーラント層と、をこの順に備える、電子部品包装用カバーテープ。
４．
３．に記載の電子部品包装用カバーテープであって、
前記基材層は、ナイロン樹脂、ポリエステル樹脂およびポリプロピレン樹脂からなる群より選ばれる少なくともいずれかを含む、電子部品包装用カバーテープ。
５．
３．または４．に記載の電子部品包装用カバーテープであって、
前記基材層は、ナイロン樹脂を含む、電子部品包装用カバーテープ。
６．
３．～５．のいずれか１つに記載の電子部品包装用カバーテープであって、
前記基材層は、ナイロン樹脂を含む層と、ポリエステル樹脂を含む層と、の少なくとも２層を含む、電子部品包装用カバーテープ。
７．
３．～６．のいずれか１つに記載の電子部品包装用カバーテープであって、
前記中間層が、低密度ポリエチレンを含む、電子部品包装用カバーテープ。
８．
３．～７．のいずれか１つに記載の電子部品包装用カバーテープであって、
前記中間層の、２３℃における寸法をＴ
０
とし、８０℃で２時間加熱した後の寸法をＴ
１
としたとき、以下の式（１）で表される、前記中間層の流れ方向（ＭＤ方向）の寸法変化率が－４～４％であり、幅方向（ＴＤ方向）の寸法変化率が０～２％である、電子部品包装用カバーテープ。
寸法変化率（％）＝｛（Ｔ
０
－Ｔ
１
）／Ｔ
０
｝×１００ 式（１）
９．
電子部品が格納されたキャリアテープと、前記電子部品を封止するように前記キャリアテープに接着された１．～８．のいずれか一つに記載の電子部品包装用カバーテープと、を備える電子部品包装体。
１０．
９．に記載の電子部品包装体であって、
前記電子部品が、０４０２サイズ以下の電子部品である、電子部品包装体。
Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various configurations other than those described above can be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and the present invention includes modifications, improvements, etc. within a range that can achieve the purpose of the present invention.
Below, examples of reference forms will be added.
1.
It is elongated with a width of 3 mm or less,
A cover tape for packaging electronic components, which has a breaking strength of 10 N or more as measured in accordance with JIS K 6734.
2.
1. The cover tape for electronic component packaging described in
A cover tape for packaging electronic parts used for packaging electronic parts of size 1005 or smaller.
3.
1. or 2. The cover tape for electronic component packaging described in
A cover tape for packaging electronic components, comprising at least a base layer, an intermediate layer, and a sealant layer in this order.
4.
3. The cover tape for electronic component packaging described in
A cover tape for packaging electronic components, wherein the base layer includes at least one selected from the group consisting of nylon resin, polyester resin, and polypropylene resin.
5.
3. or 4. The cover tape for electronic component packaging described in
A cover tape for packaging electronic components, wherein the base layer contains a nylon resin.
6.
3. ~5. The cover tape for electronic component packaging according to any one of
A cover tape for packaging electronic components, wherein the base layer includes at least two layers: a layer containing nylon resin and a layer containing polyester resin.
7.
3. ~6. The cover tape for electronic component packaging according to any one of
A cover tape for packaging electronic components, wherein the intermediate layer contains low-density polyethylene.
8.
3. ~7. The cover tape for electronic component packaging according to any one of
When the dimension of the intermediate layer at 23°C is T0 , and the dimension after heating at 80°C for 2 hours is T1 , the flow direction (MD) of the intermediate layer is expressed by the following formula (1). A cover tape for packaging electronic components, which has a dimensional change rate of -4 to 4% in the width direction (TD direction) and a dimensional change rate of 0 to 2% in the width direction (TD direction).
Dimensional change rate (%) = {(T 0 - T 1 )/T 0 }×100 Formula (1)
9.
1. A carrier tape containing electronic components; and 1. Adhered to the carrier tape so as to seal the electronic components. ~8. An electronic component package comprising: the cover tape for electronic component packaging according to any one of the above.
10.
9. The electronic component package described in
An electronic component package, wherein the electronic component is an electronic component of 0402 size or less.
Claims (7)
ＪＩＳ Ｋ ６７３４に従い測定される破断強度が１０Ｎ以上であり、
少なくとも、基材層と、中間層と、シーラント層と、をこの順に備え、
前記基材層は、ポリブチレンテレフタレートを含む、電子部品包装用カバーテープ。 It is elongated with a width of 3 mm or less,
The breaking strength measured according to JIS K 6734 is 10N or more,
At least a base material layer, an intermediate layer, and a sealant layer, in this order,
A cover tape for packaging electronic components , wherein the base layer contains polybutylene terephthalate .
１００５サイズ以下の電子部品の包装に用いられる、電子部品包装用カバーテープ。 The cover tape for electronic component packaging according to claim 1,
A cover tape for packaging electronic parts used for packaging electronic parts of size 1005 or smaller.
前記中間層が、低密度ポリエチレンを含む、電子部品包装用カバーテープ。 The cover tape for electronic component packaging according to claim 1 or 2 ,
A cover tape for packaging electronic components, wherein the intermediate layer contains low-density polyethylene.
前記中間層の、２３℃における寸法をＴ０とし、８０℃で２時間加熱した後の寸法をＴ１としたとき、以下の式（１）で表される、前記中間層の流れ方向（ＭＤ方向）の寸法変化率が－４～４％であり、幅方向（ＴＤ方向）の寸法変化率が０～２％である、電子部品包装用カバーテープ。
寸法変化率（％）＝｛（Ｔ０－Ｔ１）／Ｔ０｝×１００ 式（１） The cover tape for packaging electronic components according to any one of claims 1 to 3 ,
When the dimension of the intermediate layer at 23°C is T0 , and the dimension after heating at 80°C for 2 hours is T1 , the flow direction (MD) of the intermediate layer is expressed by the following formula (1). A cover tape for packaging electronic components, which has a dimensional change rate of -4 to 4% in the width direction (TD direction) and a dimensional change rate of 0 to 2% in the width direction (TD direction).
Dimensional change rate (%) = {(T 0 - T 1 )/T 0 }×100 Formula (1)
樹脂製キャリアテープの表面にヒートシール法により接着して電子部品包装体を作製するために用いられる、電子部品包装用カバーテープ。A cover tape for electronic component packaging that is used to create electronic component packages by adhering to the surface of a resin carrier tape using a heat sealing method.
前記電子部品が、０４０２サイズ以下の電子部品である、電子部品包装体。 The electronic component package according to claim 6 ,
An electronic component package, wherein the electronic component is an electronic component of 0402 size or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023118209A JP2023153139A (en) | 2022-03-30 | 2023-07-20 | Cover tape for packaging electronic component, and electronic component packaging body |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022055535A JP2023147816A (en) | 2022-03-30 | 2022-03-30 | Cover tape for packaging electronic component, and electronic component packaging body |
| JP2023118209A JP2023153139A (en) | 2022-03-30 | 2023-07-20 | Cover tape for packaging electronic component, and electronic component packaging body |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022055535A Division JP2023147816A (en) | 2022-03-30 | 2022-03-30 | Cover tape for packaging electronic component, and electronic component packaging body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023153139A JP2023153139A (en) | 2023-10-17 |
| JP2023153139A5 true JP2023153139A5 (en) | 2023-12-14 |
Family
ID=88202028
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022055535A Pending JP2023147816A (en) | 2022-03-30 | 2022-03-30 | Cover tape for packaging electronic component, and electronic component packaging body |
| JP2023118209A Pending JP2023153139A (en) | 2022-03-30 | 2023-07-20 | Cover tape for packaging electronic component, and electronic component packaging body |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022055535A Pending JP2023147816A (en) | 2022-03-30 | 2022-03-30 | Cover tape for packaging electronic component, and electronic component packaging body |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP2023147816A (en) |
| TW (1) | TW202406807A (en) |
| WO (1) | WO2023190041A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11105181A (en) * | 1997-09-30 | 1999-04-20 | Dainippon Printing Co Ltd | Cover tape for packing electronic part |
| JP4001774B2 (en) * | 2002-05-29 | 2007-10-31 | 日東電工株式会社 | Carrier base for electronic component conveyance and electronic component conveyance body |
| CN102119108B (en) * | 2008-08-12 | 2012-07-04 | 住友电木株式会社 | Cover tape for packaging electronic part and electronic-part package |
| JP2016182989A (en) * | 2015-03-27 | 2016-10-20 | 住友ベークライト株式会社 | Electronic component packaging cover tape, electronic component packaging material and electronic component packaging body |
| JP6566149B2 (en) * | 2017-06-22 | 2019-08-28 | 住友ベークライト株式会社 | Cover tape and electronic component packaging |
| WO2021095638A1 (en) * | 2019-11-15 | 2021-05-20 | 住友ベークライト株式会社 | Cover tape and electronic part package |
| JP2021001028A (en) * | 2020-09-03 | 2021-01-07 | 大日本印刷株式会社 | Electronic component packaging cover tape and package |
-
2022
- 2022-03-30 JP JP2022055535A patent/JP2023147816A/en active Pending
-
2023
- 2023-03-23 WO PCT/JP2023/011528 patent/WO2023190041A1/en unknown
- 2023-03-30 TW TW112112165A patent/TW202406807A/en unknown
- 2023-07-20 JP JP2023118209A patent/JP2023153139A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018199821A (en) | Adhesive tape for encapsulating organic electronic arrangement | |
| MY156166A (en) | Cover tape for electronic component packing body and electronic component packing body | |
| JP2016505678A (en) | Adhesive tape containing getter material | |
| US20150108038A1 (en) | Tape and reel cover tape to improve die sticking issues | |
| TWI545012B (en) | Electronic component storage and carrying tape and its preparation method | |
| TW201505830A (en) | Cover tape for packaging electronic parts | |
| WO2013008744A1 (en) | Reel for adhesive tape, tape roll, packaging, use of reel as reel for adhesive tape for winding adhesive tape, and method for manufacturing reel for adhesive tape | |
| JP6117098B2 (en) | Cover tape | |
| JP2023153139A5 (en) | ||
| KR100890157B1 (en) | Flexible tube | |
| RU2017129456A (en) | METHOD FOR PRODUCING FLEXIBLE ORGANIC-INORGANIC LAMINATED MATERIALS | |
| CN208324406U (en) | A kind of electronic component packaging composite film | |
| JP2012250520A (en) | Laminated packaging material | |
| JP4028259B2 (en) | Gas barrier vapor deposition laminate | |
| JP6928924B2 (en) | Release film for process, its application, and manufacturing method of resin-sealed semiconductor using it | |
| TWI723093B (en) | Mold release film for manufacturing process, applications thereof and method of manufacturing resin-sealed semiconductor using the same | |
| JP2021024112A5 (en) | ||
| JP4156240B2 (en) | Heat-sealable material, laminate using the same, and packaging container | |
| CN102633065A (en) | Packaging piece | |
| US20020185409A1 (en) | Desiccant containing product carrier | |
| JP2020015207A (en) | Packaging bag | |
| TWI498257B (en) | A method for hermetically closing an air-tight bag for pellicle | |
| JP2006150981A (en) | Laminated material for easy tearable package, its manufacturing process and packing bag using it | |
| TWI823831B (en) | Mold release film for manufacturing process excellent in appearance, applications thereof and method of manufacturing resin-sealed semiconductor using the same | |
| JP5428184B2 (en) | Packaging material and packaging bag using the same |