TW202406807A - Cover tape for packaging electronic components and electronic component package - Google Patents

Abstract

This cover tape for packaging an electronic component has a long shape having a width of 3 mm or less, and exhibits a breaking strength of 10 N or more as measured in accordance with JIS K 6734. In addition, this electronic component packaging body comprises: a carrier tape in which an electronic component is stored; and the aforementioned cover tape for packaging the electronic component, which is bonded to the carrier tape so as to seal the electronic component.

Description

Cover tape for electronic parts packaging and electronic parts packaging body

The present invention relates to a cover tape for packaging electronic parts and an electronic parts packaging body.

When transporting and storing electronic components, etc., carrier tape and cover tape are sometimes used. Specifically, first, electronic components (semiconductor wafers, etc.) are placed in the recessed portion formed in the carrier tape, and then the cover tape is heat-sealed on the top surface of the carrier tape to package the electronic components. The thus-obtained carrier tape-cover tape composite for encapsulating electronic components is wound on a reel for transportation and storage.

As a prior art of a cover tape for packaging electronic components, there are, for example, the following Patent Documents 1 to 3 and the like. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Publication No. 2003-508253 [Patent Document 2] Japanese Patent Application Publication No. 2007-45513 [Patent Document 3] Japanese Patent Application Laid-Open No. 2017-171393

[Problem to be solved by the invention]

Electronic parts packaged with cover tapes come in various sizes. In the trend of miniaturization of electronic parts in recent years, for example, it is considered to use cover tape to package 1005 (1.0mm × 0.5mm) size or less, specifically 0603 (0.6mm × 0.3mm) size or less, more specifically 0402 Small electronic components below (0.4mm×0.2mm) size. However, according to the findings of the inventors of the present invention, the development of cover tapes suitable for packaging of small electronic parts has not been sufficient so far. In other words, there is still room for improvement in cover tapes suitable for packaging small electronic parts.

The present invention was completed in view of this situation. One object of the present invention is to provide a cover tape suitable for packaging small electronic parts. [Technical means to solve the problem]

The inventors of the present invention completed the invention provided below and solved the above-mentioned problems.

According to the present invention, a cover tape for packaging electronic parts is provided, It is in the shape of a long strip with a width of less than 3 mm. The breaking strength measured in accordance with JIS K 6734 is 10N or more.

Furthermore, according to the present invention, an electronic component packaging body is provided, which is provided with: A carrier tape is used to store electronic components; and a cover tape for packaging the electronic components is used to seal the electronic components on the carrier tape. [Effects of the invention]

According to the present invention, a cover tape for packaging electronic parts suitable for packaging small electronic parts is provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all drawings, the same components are denoted by the same symbols, and descriptions are appropriately omitted. In order to avoid tediousness, there are two situations: (i) when there are multiple identical components in the same diagram, only label one of them and not all of them; or (ii) especially after Figure 2, The same components as in Figure 1 will not be relabeled with symbols. All figures are for illustrative purposes only. The shapes, size ratios, etc. of each member in the drawings do not necessarily correspond to actual items.

In this specification, unless otherwise specified, the symbols "X to Y" in the description of the numerical range mean X or more and Y or less. For example, "1 to 5% by mass" means "1 to 5% by mass".

＜Cover tape＞ FIG. 1 schematically shows an example of a cover tape for electronic component packaging (also simply referred to as a "cover tape") according to this embodiment. The cover tape preferably includes a base material layer 1 and a sealant layer 3 present on one side of the base material layer 1 . Furthermore, the cover tape can include the intermediate layer 2 between the base material layer 1 and the sealant layer 3 . In Figure 1, this intermediate layer 2 is clearly shown. The sealant layer 3 is generally present on the outermost surface of the cover tape. The sealant layer 3 is generally provided on the entire surface of one side of the base material layer 1 . In other words, the sealant layer 3 generally has substantially the same width and length as the base material layer 1 and exists on one side of the base material layer 1 without cracking or disconnection. Typically, the sealant layer 3 of the cover tape is bonded to the carrier tape. In other words, the bottom side of the cover tape shown in Figure 1 is generally connected to the carrier tape. The cover band is in the shape of a long strip.

The width of the cover tape (indicated by symbol W in Figure 1) is 3 mm or less, preferably 2.4 to 3 mm, more preferably 2.5 to 3 mm. Moreover, the breaking strength of the cover tape measured in accordance with JIS K 6734 is 10N or more, preferably 10 to 30N, more preferably 12 to 25N.

Since the width is 3 mm or less, the cover tape according to this embodiment can be easily attached to a narrow carrier tape for accommodating small electronic components. On the other hand, when the width of the cover tape is small, there is a possibility that the cover tape is easily broken when the cover tape is peeled off from the carrier tape when using electronic components. In order to reduce this possibility, in this embodiment, the cover tape is designed so that the breaking strength measured in accordance with JIS K 6734 is 10N or more. As described above, the cover tape according to this embodiment is suitable for packaging small electronic components.

As a supplement for caution, the breaking strength measured in accordance with JIS K 6734 is generally the strength "per unit cross-sectional area" of the tape being measured. However, in this embodiment, as an index related to the degree of resistance to breakage of the cover tape itself, it is determined that the breaking strength of the cover tape itself is 10N or more, not per unit cross-sectional area.

Incidentally, in order to achieve a breaking strength of 10N or more measured in accordance with JIS K 6734, it is best to appropriately select the material or layer structure constituting the cover tape. Details will be described below, and examples include selecting appropriate materials for the base material layer or the intermediate layer or appropriately adjusting the thickness of these layers.

The description of the cover tape of this embodiment is continued.

[Substrate layer 1] The material constituting the base material layer 1 is not particularly limited. Typically, a material with sufficient mechanical strength to withstand when making the cover tape, attaching the cover tape to the carrier tape, peeling off the cover tape in the installation step, applying external force, etc. is preferred. Moreover, it is preferable that the material has heat resistance to the extent that it can withstand the heat generated when the cover tape is attached to the carrier tape. From the viewpoint of ease of processing, the material constituting the base material layer 1 is preferably in the form of a film.

Specific examples of the material constituting the base material layer 1 include polyester resin, nylon resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, and ABS. Resin etc.

Specific examples of the polyester resin include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and the like. Among them, polyethylene terephthalate is preferable from the viewpoint of balance between cost and strength. Specific examples of nylon resin include nylon 6, nylon 66, and the like. Specific examples of polyolefin resins include polyethylene, polypropylene, and the like.

From the viewpoint of improving the breaking strength or making it less likely to break, the base material layer preferably contains at least one selected from the group consisting of nylon resin, polyester resin, and polypropylene resin. In particular, it is preferable that the base material layer contains nylon resin. As shown in Examples described later, when the base material layer contains nylon resin, breakage can be further suppressed.

The base material layer 1 may be only one layer, or may be two or more layers. For example, the base material layer 1 can be formed of a multilayer film in which the above-mentioned materials are laminated.

As a preferred example, the base material layer includes at least two layers: a layer containing nylon resin and a layer containing polyester resin. In this case, it is preferable to make the layer containing polyester resin the outermost layer of the cover tape. By using polyester resin, breaking strength or heat resistance can be improved. Polyester resin resists the external force when peeling off the cover tape or the heat of the sealing pliers, so it is suitable for the outermost layer. The heat resistance of nylon resin is not as high as that of polyester resin, but it has appropriate flexibility and high breaking strength. Therefore, heat or pressure from the sealing jaw can be appropriately transferred to the intermediate layer or sealant layer. This means that the cover tape can be bonded to the carrier tape in a shorter heating time. In addition, nylon resin is resistant to external force during peeling. By combining a polyester resin with particularly high heat resistance and a nylon resin that can appropriately transmit heat or pressure from the sealing jaws to the intermediate layer or sealant layer, it is possible to shorten the length of the seal while suppressing deformation due to heat. The cover tape is attached to the carrier tape during the heating time. This is a preferable characteristic in "packaging of small electronic components where the deformation of the carrier tape bag due to heat is likely to cause mounting failure."

As another preferred example, the base material layer may be laminated with polyethylene resins with different densities. Specifically, the base material layer is a laminate of two or more layers (i) a layer containing high-density polyethylene and (ii) a layer containing linear low-density polyethylene and/or low-density polyethylene. For better. By laminated polyethylene resins with different densities as the base material layer, the rigidity of the film can sometimes be adjusted to control the processability during lamination.

The base material layer 1 may or may not contain additives such as lubricants. The film used to form the base material layer 1 may be an unstretched film or a film stretched in a uniaxial direction or a biaxial direction. From the viewpoint of further improving the mechanical strength of the cover tape, a film stretched in a uniaxial direction or a biaxial direction is preferred.

The thickness of the base material layer 1 is not particularly limited. The thickness of the base material layer 1 is preferably 3 μm or more, more preferably 5 μm or more. In addition, the thickness of the base material layer 1 is preferably 30 μm or less, more preferably 25 μm or less. Since the thickness of the base material layer 1 is 30 μm or less, the rigidity of the cover tape will not become too high. Thereby, even when torsional stress is applied to the sealed carrier tape, the cover tape can easily follow the deformation of the carrier tape. Therefore, accidental peeling of the cover tape from the carrier tape can be suppressed. When the thickness of the base material layer 1 is 3 μm or more, the mechanical strength of the cover tape can be sufficiently improved. Therefore, for example, even when the cover tape is peeled off from the carrier tape at high speed, breakage of the cover tape can be suppressed.

[Intermediate Layer 2] When the cover tape has the intermediate layer 2, the cushioning properties, impact resistance, etc. of the cover tape can be improved. Examples of the material forming the intermediate layer 2 include olefin resin, styrene resin, cyclic olefin resin, and the like. Among them, from the viewpoint of improving the cushioning properties of the entire cover tape, olefin-based resin is preferred. Examples of olefin-based resins include polyethylene, polypropylene, and the like, with polyethylene being preferred. Especially in terms of cushioning properties, low-density polyethylene (LDPE) or linear low-density polyethylene (L-LDPE) is more preferable. In this embodiment, the middle layer 2 is preferably composed of linear low-density polyethylene. The details are not yet clear, but it is possible that the appropriate cushioning properties of linear low-density polyethylene match the cover tape of this embodiment with a width of 3 mm or less. Here, based on the density of polyethylene called "linear low-density polyethylene" and circulating in the market, in this specification, linear low-density polyethylene with a density of 0.880g/ ^cm3 or more and less than 0.930g/ ^cm3 is used. The chain polyethylene is linear low-density polyethylene. The intermediate layer 2 may be composed only of (i) linear low-density polyethylene, or may be composed of (ii) linear low-density polyethylene and other polyethylene such as low-density polyethylene or high-density polyethylene. Regarding (ii), more specifically, the following aspect can be cited: (ii-1) The intermediate layer 2 is composed of a multilayer structure including a layer made of linear low-density polyethylene and a layer made of other polyethylene. Aspect; and (ii-2) The intermediate layer 2 has an aspect (single layer or multi-layer) of a layer composed of a mixture of linear low-density polyethylene and other polyethylene, etc. By studying the structure of the intermediate layer 2, it is sometimes possible to suppress "curling" during the production of the cover tape and control the strength of the cover tape.

From another point of view, by using a material with a small dimensional change rate during heating as the intermediate layer 2, it is possible to suppress the cover tape from "floating" from the carrier tape. As a result, very small parts are prevented from entering the floating portion. Specifically, by having the following characteristics of the middle layer, the cover tape can be more suitable for packaging small electronic parts.

When the size of the intermediate layer at 23°C is set to T ₀ and the size after heating at 80°C for 2 hours is set to T ₁ , the flow direction (Machine Direction, MD) of the intermediate layer represented by the following formula (1) The dimensional change rate in the ) direction is, for example, -4 to 4%, preferably -3 to 3%, and the dimensional change rate in the width direction ((Transverse Direction, TD) direction) is, for example, 0 to 2%, preferably 0.1 ~1%. Dimensional change rate (%) = {(T ₀ -T ₁ )/T ₀ }×100 Formula (1)

The intermediate layer 2 may be only one layer, or may be two or more layers. For example, the intermediate layer 2 may be formed of a multi-layered film in which the above-mentioned materials are laminated. The intermediate layer 2 may or may not contain various additives. When an intermediate layer is provided, from the viewpoint of improving the cushioning properties of the entire cover tape, its thickness is preferably 10 to 55 μm, more preferably 15 to 50 μm, and further preferably 20 to 45 μm.

[Sealant Layer 3] The material constituting the sealant layer 3 is not particularly limited. The sealant layer 3 may be made of a material that can be bonded to the carrier tape by applying heat.

Specific examples of the material constituting the sealant layer 3 include (meth)acrylic resin, styrene resin, olefin resin, urethane resin, ester resin, and copolymers thereof. wait. Among them, it is preferable to include at least one type of styrene-based resin, (meth)acrylic resin, and ester-based resin from the viewpoint of obtaining good heat sealability to the carrier tape. Especially in this embodiment, it is preferable to use a styrenic resin and a (meth)acrylic resin together.

The sealant layer 3 may further contain an antistatic agent from the viewpoint of reducing the surface resistance value of the sealant layer 3 to suppress generation of static electricity during peeling and maintaining sealing properties. In the sealant layer 3, it is preferable that an antistatic agent is dissolved or dispersed in the resin.

Examples of the antistatic agent include (i) particulate metal-containing substances, (ii) conductive polymers, and the like. Specific examples of the antistatic agent include metal oxide particles such as antimony-doped tin oxide, phosphorus-doped tin oxide, and fluorine-doped tin oxide, conductive polymers, carbon nanotubes, and the like. Based on good compatibility with resin, etc., antistatic agents include antimony-doped tin oxide (ATO), phosphorus-doped tin oxide, fluorine-doped tin oxide, and conductive polymers. One or more types are preferred. Preferred examples of conductive polymers include polythiophene and polythiophene derivatives. More specific examples include polythiophene, poly(3,4)-ethylenedioxythiophene, poly(3-thiophene-β-ethanesulfonic acid), and the like. Among these, poly3,4-ethylenedioxythiophene or its derivatives are preferred from the viewpoint of further maintaining good antistatic properties and sealing properties.

As other additives, the sealant layer 3 may contain a dispersant, a silica sol, a leveling agent, a conductive aid, etc. for improving the dispersibility of the antistatic agent.

From the viewpoint of optimally performing the sealing operation and the peeling operation, the thickness of the sealant layer 3 is preferably 0.02 to 20 μm, and more preferably 0.03 to 15 μm.

[Other layers] The cover tape may include additional layers other than the base material layer 1 , the intermediate layer 2 , and the sealant layer 3 . Examples of the additional layer include an adhesive layer formed by bonding two layers.

[Overall thickness] From the viewpoint of ensuring a balance between film strength and workability, the thickness of the cover tape is preferably 25 to 80 μm, and more preferably 35 to 70 μm.

＜Electronic component packaging/electronic components to be packaged＞ According to the above-mentioned cover tape and the carrier tape in which electronic components are accommodated in the recessed portion, an electronic component package can be obtained. This will be described with reference to Figure 2 .

In FIG. 2 , the cover tape 10 is used as a cover material for a belt-shaped carrier tape 20 in which concave bags 21 are continuously provided in accordance with the shape of the electronic components. Specifically, the cover tape 10 is then (usually heat-sealed) on the surface of the carrier tape 20 to cover the entire opening of the bag 21 of the carrier tape 20 . In addition, below, the structure obtained by joining the cover tape 10 and the carrier tape 20 is called the electronic component package 100.

The electronic component package 100 can be produced by the following procedures, for example. First, the electronic components are accommodated in the pocket 21 of the carrier tape 20 . Next, the cover tape 10 is adhered to the surface of the carrier tape 20 by a heat sealing method to cover the entire opening of the bag 21 of the carrier tape 20 . At this time, the sealant layer 3 in the cover tape 10 is brought into contact with the carrier tape 20 (that is, heat sealing is performed so that the "back surface" of the cover tape 10 in FIG. 2 becomes the sealant layer 3). Thereby, a structure (electronic component packaging body 100) that sealily accommodates electronic components can be obtained. The specific operation method or conditions of heat sealing are not particularly limited as long as the cover tape 10 is sufficiently firmly adhered to the carrier tape 20 . Typically, a well-known tape loading machine can be used, and the temperature range is 100 to 240°C, the load is 0.1 to 10kgf, and the time is in the range of 0.0001 to 1 second.

The material of the carrier tape 20 is not particularly limited as long as it can be adhered to the cover tape 10 by heat sealing. It is generally made of resin or paper, preferably resin. As an example, the carrier tape 20 is made of a material containing polystyrene resin, a material containing polycarbonate resin, a material containing polyethylene terephthalate resin, or the like.

The electronic component package 100 is wound on a reel, for example, and then transported to an operation area where electronic components are mounted on an electronic circuit board or the like. The material of the scroll can be made of metal, paper, plastic, etc.

After the electronic component package 100 is transported to the work area, the cover tape 10 is peeled off from the carrier tape 20 and the contained electronic components are taken out.

As described above, in this embodiment, it is preferable to package small electronic components in the electronic component packaging body 100 . In other words, the above-mentioned cover tape is particularly suitable for packaging small electronic parts. If the dimensions of the electronic components are specifically described, for example, they are 1005 (1.0mm×0.5mm) or less, preferably 0603 (0.6mm×0.3mm) or less, more preferably 0402 (0.4mm×0.2mm). size below.

The types of electronic components are not particularly limited. Examples include semiconductor wafers, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related components, connectors, electrodes, and other parts used in the manufacture of electrical and electronic equipment.

The embodiments of the present invention have been described above. However, these are merely illustrations of the present invention, and various configurations other than those described above can be adopted. In addition, the present invention is not limited to the above-described embodiments, and modifications, improvements, etc. within the scope that can achieve the object of the present invention are also included in the present invention. [Example]

Based on Examples and Comparative Examples, embodiments of the present invention will be described in detail. Although it is explained in advance for the sake of caution, the present invention is not limited to the Examples.

First, materials used to form the sealant layer are described. (A) Styrenic resin Styrene-butadiene copolymer: Asahi Kasei Co., Ltd., "Tuftec H1517" (styrene content (PS ratio): 43%, MFR (230°C, 2.16kg): 3g/10 minutes) (B) Poly(meth)acrylic acid derivatives Made by DIC Corporation "A450A" (C-1) Antistatic agent Antimony-doped tin oxide ("T-1" manufactured by Mitsubishi Materials Corporation)

<Example 1> In Example 1, a cover tape including a base material layer, an intermediate layer, and a sealant layer composed of two layers of a PET film and a nylon film was produced. The specific manufacturing sequence is as follows.

First, a biaxially stretched polyester film with a thickness of 12 μm (Toyobo Co., Ltd., trade name: T6140) was prepared. This single-sided coating laminating agent (Mitsui Chemicals Co., Ltd., TAKELAC A-520) was laminated with a 12-μm-thick biaxially stretched nylon film (Koelon Industrial Co., Ltd., trade name: NT02) by a dry lamination method. In this way, a base material layer composed of two layers was obtained. Next, a laminating agent (TAKELAC A-520, manufactured by Mitsui Chemicals Co., Ltd.) was applied to the biaxially stretched nylon film side of the base layer, and a polyethylene film (TAMAPOLY Co., Ltd.) with a thickness of 30 μm was laminated by a dry lamination method. Made in China, trade name: SE605M), forming the middle layer. Thereafter, a coating liquid containing antimony-doped tin oxide was applied to the exposed surface on the intermediate layer side by a gravure coating method. As a coating liquid, 60 mass % (C-1) antistatic agent, 24 mass % (B) poly(meth)acrylic acid derivative and 16 mass % (A) styrene resin were uniformly mixed. The one who becomes. Thereby, a sealant layer with a thickness of 0.5 μm was formed. Thereby, a laminated body including a base material layer, an intermediate layer, and a sealant layer was obtained. The obtained laminated body was cut into a width of 2.6 mm, and a long cover tape was obtained.

<Example 2> A biaxially stretched nylon film with a thickness of 15 μm (Toyobo Co., Ltd., trade name: N1202) was used instead of a biaxially stretched nylon film with a thickness of 12 μm (Koeln Industrial Co., Ltd., trade name: NT02). In the same manner as Example 1, a cover tape was obtained.

<Example 3> The same procedure as in Example 1 was performed except that a polyethylene film with a thickness of 25 μm (Wako Co., Ltd.: LM-015) was used instead of a polyethylene film with a thickness of 30 μm (manufactured by TAMAPOLY Co., Ltd., trade name: SE605M). way, got the cover tape.

<Example 4> The same procedure as Example 1 was used except that a polyethylene film with a thickness of 40 μm (manufactured by TAMAPOLY Co., Ltd., trade name: SE605M) was used instead of a 30 μm-thick polyethylene film (manufactured by TAMAPOLY Co., Ltd., trade name: SE605M). In the same way, the cover tape was obtained.

<Example 5> A cover tape was obtained in the same manner as in Example 1 except that a laminated polyethylene film with a thickness of 30 μm was used instead of a 30 μm-thick polyethylene film (manufactured by TAMAPOLY Co., Ltd., trade name: SE605M). The laminated film used here is composed of layers of linear low-density polyethylene/high-density polyethylene/linear low-density polyethylene. The thickness of each layer is 10 μm, and the total thickness is 30 μm. Linear low-density polyethylene Ube Maruzen Co., Ltd.: UMERIT 0540F, high-density polyethylene Japan Polyethylene Co.: Novatec HF111K. In addition, the laminated film used here is produced by lamination extrusion using a co-extrusion inflation molding machine at an extrusion temperature of 200°C.

<Example 6> The same procedure as in Example 1 was performed except that the base material layer was a single layer of biaxially stretched polybutylene terephthalate (BOBLET ST manufactured by Kojin Films & Chemicals Co., Ltd.) with a thickness of 20 μm. , got the cover tape.

<Example 7> A cover tape was obtained in the same manner as in Example 1, except that the base material layer was a single layer of biaxially stretched polyethylene terephthalate (FE2301 from Futura Chemical Co., Ltd.) with a thickness of 25 μm. .

＜Comparative example 1＞ Except that the base material layer was a single layer of biaxially stretched polyethylene terephthalate (Toyobo Co., Ltd., trade name: T6140) with a thickness of 12 μm, it was obtained in the same manner as in Example 1. Cover tape.

＜Comparative example 2＞ Except that the base material layer was a single layer of biaxially stretched polyethylene terephthalate (Toyobo Co., Ltd., trade name: E7415) with a thickness of 16 μm, it was obtained in the same manner as in Example 1. Cover tape.

＜Measurement of breaking strength＞ In accordance with JIS K 6734, the breaking strength of the cover tapes of each example and comparative example was measured. For measurement, a tensile test was conducted using Shimadzu's autograph on a cover tape cut into a width of 2.6 mm at a tensile strength of 50 mm/min. Then, the load at breakage was determined as the breakage strength.

<Measurement of Dimensional Change Rate of Intermediate Layer> The polyethylene film as the above-mentioned intermediate layer was cut into a 400 mm square piece in an environment of 23° C. and 50% relative humidity. Let the size of this test film be T ₀ . After heating the test film in an oven set at 80° C. for 2 hours, the film was taken out, and the dimensions corresponding to the flow direction and width direction were measured, and set as T ₁ . The dimensional change rate in each direction was calculated according to the following equation (1). Dimensional change rate (%) = [(T ₀ -T ₁ )/T ₀ ]×100 Formula (1)

＜Fracture evaluation using tape feeder＞ Evaluation was performed in the following order. (1) Using a tape mounting machine, heat seal the sealing surface of the sealant layer side of the obtained evaluation cover tape (2.6mm width) to 4mm wide polystyrene under the conditions of 170°C, 4kgf, 0.005 seconds. A tape-shaped packaging body is produced on the surface of the resin carrier tape. (2) Use a tape feeder (manufactured by Panasonic Electric Co., Ltd., product name: Intelligent Tape Feeder), under the conditions of conveying speed (peeling speed): 2400mm/min, peeling angle: about 170° , the evaluation cover tape was continuously peeled off from the carrier tape. Then, it was evaluated whether the peeled cover tape would break when sandwiched between two gears in a tape feeder. In the table to be described later, the case of not breaking is described as good, and the case of breaking is described as poor.

＜Evaluation of Lifting of Cover Tape＞ (1) Using a tape mounting machine, heat seal the sealing surface of the sealant layer side of the obtained evaluation cover tape (2.6mm width) to 4mm wide polystyrene under the conditions of 170°C, 4kgf, 0.005 seconds. A tape-shaped packaging body is produced on the surface of the resin carrier tape. (2) The packaging body was cut, the cross section was observed with a microscope, and the lifting amount of the cover tape was measured. The so-called floating amount refers to the size of x in Figure 3.

＜Evaluation of peel strength＞ (1) Using a tape mounting machine, heat seal the sealing surface of the sealant layer side of the obtained evaluation cover tape (2.6mm width) to 4mm wide polystyrene under the conditions of 170°C, 4kgf, 0.005 seconds. A tape-shaped packaging body is produced on the surface of the resin carrier tape. (2) Using the obtained sample, the peel strength (unit: gf) of the cover tape for packaging electronic parts to the above-mentioned polystyrene resin carrier tape was measured. Peel strength was measured using a peel testing machine ("PTS-5000" manufactured by EPI Corporation) under conditions of peeling speed of 300 mm/min, peeling angle of 170°, and measurement temperature of 25°C.

Each of the above results is summarized and shown in Table 1.

[Table 1] Example Comparative example 1 2 3 4 5 6 7 1 2 Breaking strength (N) (2.6mm width) 15 20 14 16 16 13 13 7 8 Dimensional change rate of the middle layer in the MD direction (%) -2.5 -2.5 -2.6 -2.5 -2.8 -2.5 -2.5 -2.5 -2.5 Dimensional change rate of the middle layer in the TD direction (%) +0.20 +0.20 +0.30 +0.20 +0.50 +0.20 +0.20 +0.20 +0.20 Fracture evaluation using tape feeders good good good good good good good bad bad Lift evaluation of cover tape (μm) twenty one 17 20 20 18 17 17 twenty two twenty one Peel strength (gf) 32 30 30 35 33 twenty three twenty four 33 28

The cover tapes of Examples 1 to 7 had a breaking strength measured in accordance with JIS K 6734 of 10 N or more. Then, no breakage occurred in the breakage evaluation using a tape feeder. That is, the cover tapes of Examples 1 to 7 are not easily broken even if they are narrow in width, and can be said to be suitable for packaging small electronic components. In addition, in the cover tapes of Examples 1 to 7, the "floating amount" was relatively small. This is considered to be because the dimensional change rate of the intermediate layer is relatively small. Moreover, in <Evaluation of Peel Strength>, the cover tapes of Examples 1 to 5 all showed numerical values of 30 gf or more, and showed better peel strength than the cover tapes of Examples 6 and 7. This is considered to be due to the difference in the base material layer.

This application claims priority based on Japanese Application No. 2022-055535 filed on March 30, 2022, and the entire disclosure of this application is incorporated into this specification.

1: Base material layer 2:Middle layer 3:Sealant layer 10: cover tape 20:Carrier tape 21:bag 100: Electronic parts packaging body W: Width x: floating amount

[Fig. 1] is a diagram schematically showing an example of the cover tape (cover tape for packaging electronic components) according to this embodiment. [Fig. 2] is a diagram showing an example of a state in which a cover tape for packaging electronic components is attached (heat-sealed) to a carrier tape. [Figure 3] is a diagram used to explain the "floating amount" of the cover tape.

1: Base material layer

2:Middle layer

3:Sealant layer

W: Width

Claims (10)

A cover tape for packaging electronic parts, which is in the form of a long strip with a width of less than 3 mm. The breaking strength measured in accordance with JIS K 6734 is 10N or more. For example, the cover tape for electronic parts packaging in claim 1 is used for packaging electronic parts below 1005 size. For example, the cover tape for packaging electronic parts according to claim 1 or 2 must at least have a base material layer, an intermediate layer and a sealant layer in order. For example, the cover tape for packaging electronic parts in claim 3, wherein, The base material layer includes at least any one selected from the group consisting of nylon resin, polyester resin and polypropylene resin. For example, the cover tape for packaging electronic parts in claim 3, wherein, The base material layer contains nylon resin. For example, the cover tape for packaging electronic parts in claim 3, wherein, The base material layer includes at least two layers: a layer containing nylon resin and a layer containing polyester resin. For example, the cover tape for packaging electronic parts in claim 3, wherein, The middle layer contains low density polyethylene. For example, the cover tape for packaging electronic parts according to claim 3, wherein the size of the intermediate layer at 23°C is set to T ₀ , and the size after heating at 80°C for 2 hours is set to T ₁ , in the following formula: (1) The dimensional change rate expressed in the flow direction of the middle layer, that is, the MD direction, is -4 to 4%, and the dimensional change rate in the width direction, that is, the TD direction, is 0 to 2%. The dimensional change rate (%) = {( T ₀ -T ₁ )/T ₀ ｝×100 Formula (1). An electronic component packaging body, which is provided with: a carrier tape to store electronic components; and a cover tape for packaging electronic components according to claim 1 or 2, and the electronic components are then sealed on the carrier tape. Such as the electronic parts packaging body of claim 9, wherein, The electronic parts are electronic parts below 0402 size.

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