TW202406807A - Cover tape for packaging electronic components and electronic component package - Google Patents

Cover tape for packaging electronic components and electronic component package Download PDF

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Publication number
TW202406807A
TW202406807A TW112112165A TW112112165A TW202406807A TW 202406807 A TW202406807 A TW 202406807A TW 112112165 A TW112112165 A TW 112112165A TW 112112165 A TW112112165 A TW 112112165A TW 202406807 A TW202406807 A TW 202406807A
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cover tape
packaging
tape
layer
electronic parts
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TW112112165A
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Chinese (zh)
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阿部皓基
上村祥司
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日商住友電木股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38Packaging materials of special type or form
    • B65D65/40Applications of laminates for particular packaging purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00Packages comprising articles attached to cards, sheets or webs
    • B65D73/02Articles, e.g. small electrical components, attached to webs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10Container closures formed after filling
    • B65D77/20Container closures formed after filling by applying separate lids or covers, i.e. flexible membrane or foil-like covers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Wrappers (AREA)
  • Laminated Bodies (AREA)

Abstract

This cover tape for packaging an electronic component has a long shape having a width of 3 mm or less, and exhibits a breaking strength of 10 N or more as measured in accordance with JIS K 6734. In addition, this electronic component packaging body comprises: a carrier tape in which an electronic component is stored; and the aforementioned cover tape for packaging the electronic component, which is bonded to the carrier tape so as to seal the electronic component.

Description

電子零件包裝用蓋帶及電子零件包裝體Cover tape for electronic parts packaging and electronic parts packaging body

本發明關於一種電子零件包裝用蓋帶(Cover tape)及電子零件包裝體。The present invention relates to a cover tape for packaging electronic parts and an electronic parts packaging body.

在運輸、保管電子零件等時,有時使用載體帶(carrier tape)及蓋帶。 具體而言,首先,將電子零件(半導體晶片等)放入形成於載體帶之凹部,其後,將蓋帶熱封於載體帶的頂面,從而封裝電子零件。將藉此得到之封裝電子零件之載體帶-蓋帶複合體捲繞在捲軸上進行運輸/保管。 When transporting and storing electronic components, etc., carrier tape and cover tape are sometimes used. Specifically, first, electronic components (semiconductor wafers, etc.) are placed in the recessed portion formed in the carrier tape, and then the cover tape is heat-sealed on the top surface of the carrier tape to package the electronic components. The thus-obtained carrier tape-cover tape composite for encapsulating electronic components is wound on a reel for transportation and storage.

作為電子零件包裝用的蓋帶的先前技術,例如,有以下的專利文獻1~3等。 [先前技術文獻] [專利文獻] As a prior art of a cover tape for packaging electronic components, there are, for example, the following Patent Documents 1 to 3 and the like. [Prior technical literature] [Patent Document]

[專利文獻1]日本特表2003-508253號公報 [專利文獻2]日本特開2007-45513號公報 [專利文獻3]日本特開2017-171393號公報 [Patent Document 1] Japanese Patent Publication No. 2003-508253 [Patent Document 2] Japanese Patent Application Publication No. 2007-45513 [Patent Document 3] Japanese Patent Application Laid-Open No. 2017-171393

[發明所欲解決之課題][Problem to be solved by the invention]

成為蓋帶的包裝對象之電子零件存在各式各樣的大小。 在近年來的電子零件的小型化的趨勢中,例如考慮使用蓋帶來包裝1005(1.0mm×0.5mm)尺寸以下,具體而言0603(0.6mm×0.3mm)尺寸以下,更具體而言0402(0.4mm×0.2mm)尺寸以下的小型電子零件。 然而,依據本發明的發明人等的見解,迄今為止,適用於小型電子零件的包裝之蓋帶的開發尚不充分。亦即,針對適用於小型電子零件的包裝之蓋帶還存在改良的空間。 Electronic parts packaged with cover tapes come in various sizes. In the trend of miniaturization of electronic parts in recent years, for example, it is considered to use cover tape to package 1005 (1.0mm × 0.5mm) size or less, specifically 0603 (0.6mm × 0.3mm) size or less, more specifically 0402 Small electronic components below (0.4mm×0.2mm) size. However, according to the findings of the inventors of the present invention, the development of cover tapes suitable for packaging of small electronic parts has not been sufficient so far. In other words, there is still room for improvement in cover tapes suitable for packaging small electronic parts.

本發明係鑑於這種情況而完成的。本發明的目的之一在於提供一種適用於小型電子零件的包裝之蓋帶。 [解決課題之技術手段] The present invention was completed in view of this situation. One object of the present invention is to provide a cover tape suitable for packaging small electronic parts. [Technical means to solve the problem]

本發明的發明人等完成了以下提供之發明,從而解決了上述課題。The inventors of the present invention completed the invention provided below and solved the above-mentioned problems.

依據本發明,提供一種電子零件包裝用蓋帶, 其為寬度為3mm以下的長條狀, 按照JIS K 6734測得之斷裂強度為10N以上。 According to the present invention, a cover tape for packaging electronic parts is provided, It is in the shape of a long strip with a width of less than 3 mm. The breaking strength measured in accordance with JIS K 6734 is 10N or more.

又,依據本發明,提供一種電子零件包裝體,其具備: 載體帶,儲存電子零件;及上述電子零件包裝用蓋帶,接著於前述載體帶以密封前述電子零件。 [發明之效果] Furthermore, according to the present invention, an electronic component packaging body is provided, which is provided with: A carrier tape is used to store electronic components; and a cover tape for packaging the electronic components is used to seal the electronic components on the carrier tape. [Effects of the invention]

依據本發明,提供一種適用於小型電子零件的包裝之電子零件包裝用蓋帶。According to the present invention, a cover tape for packaging electronic parts suitable for packaging small electronic parts is provided.

以下,參照圖式,對本發明的實施態樣進行詳細說明。 在所有圖式中,對相同的構成要素標註相同的符號,並適當省略說明。 為了避免繁瑣,存在以下兩種情況:(i)在同一圖式內存在複數個同一構成要素的情況下,僅對其一標註符號,不對所有標註符號;或(ii)尤其在圖2以後,對與圖1相同的構成要素不重新標註符號。 所有圖式僅供說明用。圖式中的各構件的形狀或尺寸比等不一定與現實的物品相對應。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all drawings, the same components are denoted by the same symbols, and descriptions are appropriately omitted. In order to avoid tediousness, there are two situations: (i) when there are multiple identical components in the same diagram, only label one of them and not all of them; or (ii) especially after Figure 2, The same components as in Figure 1 will not be relabeled with symbols. All figures are for illustrative purposes only. The shapes, size ratios, etc. of each member in the drawings do not necessarily correspond to actual items.

在本說明書中,只要沒有特別指定,則數值範圍的說明中的所謂「X~Y」的標記係表示X以上且Y以下。例如,「1~5質量%」係指「1質量%以上且5質量%以下」。In this specification, unless otherwise specified, the symbols "X to Y" in the description of the numerical range mean X or more and Y or less. For example, "1 to 5% by mass" means "1 to 5% by mass".

<蓋帶> 圖1示意性表示本實施態樣的電子零件包裝用蓋帶(亦簡單標記為「蓋帶」)的一例。 蓋帶較佳具備基材層1和存在於該基材層1的單面側之密封劑層3。又,蓋帶能夠在基材層1與密封劑層3之間具備中間層2。圖1中,明確地示出該中間層2。 密封劑層3一般存在於蓋帶的最表面。 密封劑層3一般設置於基材層1的單面側之整個面。換言之,密封劑層3一般以與基材層1大致相同的寬度和長度,無斷裂或分斷地存在於基材層1的單面側。 一般,蓋帶的密封劑層3與載體帶接著。換言之,一般圖1所示之蓋帶中的底面側與載體帶接著。 蓋帶為長條狀。 <Cover tape> FIG. 1 schematically shows an example of a cover tape for electronic component packaging (also simply referred to as a "cover tape") according to this embodiment. The cover tape preferably includes a base material layer 1 and a sealant layer 3 present on one side of the base material layer 1 . Furthermore, the cover tape can include the intermediate layer 2 between the base material layer 1 and the sealant layer 3 . In Figure 1, this intermediate layer 2 is clearly shown. The sealant layer 3 is generally present on the outermost surface of the cover tape. The sealant layer 3 is generally provided on the entire surface of one side of the base material layer 1 . In other words, the sealant layer 3 generally has substantially the same width and length as the base material layer 1 and exists on one side of the base material layer 1 without cracking or disconnection. Typically, the sealant layer 3 of the cover tape is bonded to the carrier tape. In other words, the bottom side of the cover tape shown in Figure 1 is generally connected to the carrier tape. The cover band is in the shape of a long strip.

蓋帶的寬度(圖1中,用記號W記載)為3mm以下,較佳為2.4~3mm,更佳為2.5~3mm。 又,蓋帶的按照JIS K 6734測得之斷裂強度為10N以上,較佳為10~30N,更佳為12~25N。 The width of the cover tape (indicated by symbol W in Figure 1) is 3 mm or less, preferably 2.4 to 3 mm, more preferably 2.5 to 3 mm. Moreover, the breaking strength of the cover tape measured in accordance with JIS K 6734 is 10N or more, preferably 10 to 30N, more preferably 12 to 25N.

藉由寬度為3mm以下,本實施態樣的蓋帶容易接著於用於容納小型電子零件的窄幅的載體帶。 另一方面,在蓋帶的寬度較小的情況下,在使用電子零件時,從載體帶剝離蓋帶時,存在蓋帶容易破裂的可能性。為了降低該可能性,在本實施態樣中,以按照JIS K 6734測得之斷裂強度成為10N以上之方式設計了蓋帶。 如上所述,本實施態樣的蓋帶適用於小型電子零件的包裝。 Since the width is 3 mm or less, the cover tape according to this embodiment can be easily attached to a narrow carrier tape for accommodating small electronic components. On the other hand, when the width of the cover tape is small, there is a possibility that the cover tape is easily broken when the cover tape is peeled off from the carrier tape when using electronic components. In order to reduce this possibility, in this embodiment, the cover tape is designed so that the breaking strength measured in accordance with JIS K 6734 is 10N or more. As described above, the cover tape according to this embodiment is suitable for packaging small electronic components.

為了慎重起見而事先作為補充,按照JIS K 6734測得之斷裂強度一般係測量對象的膠帶的「每單位截面積」的強度。然而,在本實施態樣中,作為與蓋帶本身的不易斷裂程度相關的指標,確定了蓋帶本身的斷裂強度為10N以上,而不是每單位截面積。As a supplement for caution, the breaking strength measured in accordance with JIS K 6734 is generally the strength "per unit cross-sectional area" of the tape being measured. However, in this embodiment, as an index related to the degree of resistance to breakage of the cover tape itself, it is determined that the breaking strength of the cover tape itself is 10N or more, not per unit cross-sectional area.

順帶一提,為了使按照JIS K 6734測得之斷裂強度成為10N以上,適當地選擇構成蓋帶之材料或層構成為較佳。詳細內容將在以下進行說明,例如可以舉出選擇適當的材料作為基材層或中間層的材料或適當地調整該等層的厚度。Incidentally, in order to achieve a breaking strength of 10N or more measured in accordance with JIS K 6734, it is best to appropriately select the material or layer structure constituting the cover tape. Details will be described below, and examples include selecting appropriate materials for the base material layer or the intermediate layer or appropriately adjusting the thickness of these layers.

繼續與本實施態樣的蓋帶相關的說明。The description of the cover tape of this embodiment is continued.

[基材層1] 關於構成基材層1之材料,並沒有特別限定。典型地,具有在製作蓋帶時、將蓋帶接著於載體帶時、在安裝步驟中剝離蓋帶時、施加外力時等能夠充分耐受之程度的機械強度之材料為較佳。又,具有能夠耐受將蓋帶接著於載體帶時的熱之程度的耐熱性之材料為較佳。 從加工容易性的方面而言,構成基材層1之材料的形態係薄膜狀為較佳。 [Substrate layer 1] The material constituting the base material layer 1 is not particularly limited. Typically, a material with sufficient mechanical strength to withstand when making the cover tape, attaching the cover tape to the carrier tape, peeling off the cover tape in the installation step, applying external force, etc. is preferred. Moreover, it is preferable that the material has heat resistance to the extent that it can withstand the heat generated when the cover tape is attached to the carrier tape. From the viewpoint of ease of processing, the material constituting the base material layer 1 is preferably in the form of a film.

作為構成基材層1之材料的具體例,可以舉出聚酯樹脂、尼龍樹脂、聚烯烴樹脂、聚丙烯酸酯樹脂、聚甲基丙烯酸酯樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、ABS樹脂等。Specific examples of the material constituting the base material layer 1 include polyester resin, nylon resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, and ABS. Resin etc.

作為聚酯樹脂的具體例,能夠舉出聚對酞酸乙二酯(PET)、聚對酞酸丁二酯(PBT)等。其中,從成本或強度的平衡的方面而言,聚對酞酸乙二酯為較佳。 作為尼龍樹脂的具體例,能夠舉出尼龍6、尼龍66等。 作為聚烯烴樹脂的具體例,能夠舉出聚乙烯、聚丙烯等。 Specific examples of the polyester resin include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and the like. Among them, polyethylene terephthalate is preferable from the viewpoint of balance between cost and strength. Specific examples of nylon resin include nylon 6, nylon 66, and the like. Specific examples of polyolefin resins include polyethylene, polypropylene, and the like.

從提高斷裂強度或使其不易斷裂之觀點而言,基材層包含選自包括尼龍樹脂、聚酯樹脂及聚丙烯樹脂之群組中的至少任一種為較佳。尤其,基材層包含尼龍樹脂為較佳。如後述的實施例所示那樣,藉由基材層包含尼龍樹脂,而更能夠抑制斷裂。From the viewpoint of improving the breaking strength or making it less likely to break, the base material layer preferably contains at least one selected from the group consisting of nylon resin, polyester resin, and polypropylene resin. In particular, it is preferable that the base material layer contains nylon resin. As shown in Examples described later, when the base material layer contains nylon resin, breakage can be further suppressed.

基材層1可以僅為1層,亦可以為2層以上。例如,基材層1可以由積層上述之材料而成之多層薄膜來形成。The base material layer 1 may be only one layer, or may be two or more layers. For example, the base material layer 1 can be formed of a multilayer film in which the above-mentioned materials are laminated.

作為較佳的例子,基材層包括包含尼龍樹脂之層和包含聚酯樹脂之層這至少2層。此時,使包含聚酯樹脂之層成為蓋帶的最外層為較佳。 藉由使用聚酯樹脂,能夠提高斷裂強度或耐熱性。聚酯樹脂耐受剝離蓋帶時的外力或密封鉗的熱,因此適用於最外層。 尼龍樹脂的耐熱性沒有聚酯樹脂高,但具有適當的柔軟性,並且斷裂強度高。因此,能夠將來自密封鉗的熱或壓力適當地傳遞到中間層或密封劑層。這係指,能夠在更短的加熱時間內將蓋帶接著於載體帶。又,尼龍樹脂還耐受剝離時的外力。 藉由組合耐熱性尤其高的聚酯樹脂和能夠將來自密封鉗的熱或壓力適當地傳遞到中間層或密封劑層的尼龍樹脂,而能夠在抑制由熱引起的變形的同時,在更短的加熱時間內將蓋帶接著於載體帶。這在「由熱引起的載體帶的袋變形容易導致安裝不良之小型電子零件的包裝」中係較佳的特性。 As a preferred example, the base material layer includes at least two layers: a layer containing nylon resin and a layer containing polyester resin. In this case, it is preferable to make the layer containing polyester resin the outermost layer of the cover tape. By using polyester resin, breaking strength or heat resistance can be improved. Polyester resin resists the external force when peeling off the cover tape or the heat of the sealing pliers, so it is suitable for the outermost layer. The heat resistance of nylon resin is not as high as that of polyester resin, but it has appropriate flexibility and high breaking strength. Therefore, heat or pressure from the sealing jaw can be appropriately transferred to the intermediate layer or sealant layer. This means that the cover tape can be bonded to the carrier tape in a shorter heating time. In addition, nylon resin is resistant to external force during peeling. By combining a polyester resin with particularly high heat resistance and a nylon resin that can appropriately transmit heat or pressure from the sealing jaws to the intermediate layer or sealant layer, it is possible to shorten the length of the seal while suppressing deformation due to heat. The cover tape is attached to the carrier tape during the heating time. This is a preferable characteristic in "packaging of small electronic components where the deformation of the carrier tape bag due to heat is likely to cause mounting failure."

作為另一較佳的例子,基材層可以係由密度不同的聚乙烯樹脂積層而成者。具體而言,基材層係由(i)包含高密度聚乙烯之層和(ii)包含直鏈狀低密度聚乙烯和/或低密度聚乙烯之層之這2層以上所積層而成者為較佳。藉由將基材層設為由密度不同的聚乙烯樹脂積層而成者,有時能夠調整薄膜的剛性,來控制層壓時的加工性。As another preferred example, the base material layer may be laminated with polyethylene resins with different densities. Specifically, the base material layer is a laminate of two or more layers (i) a layer containing high-density polyethylene and (ii) a layer containing linear low-density polyethylene and/or low-density polyethylene. For better. By laminated polyethylene resins with different densities as the base material layer, the rigidity of the film can sometimes be adjusted to control the processability during lamination.

基材層1可以包含潤滑劑等添加劑,亦可以不包含。 用於形成基材層1之薄膜可以為未拉伸薄膜,亦可以為沿單軸方向或雙軸方向拉伸之薄膜。從進一步提高蓋帶的機械強度之觀點而言,沿單軸方向或雙軸方向拉伸之薄膜為較佳。 The base material layer 1 may or may not contain additives such as lubricants. The film used to form the base material layer 1 may be an unstretched film or a film stretched in a uniaxial direction or a biaxial direction. From the viewpoint of further improving the mechanical strength of the cover tape, a film stretched in a uniaxial direction or a biaxial direction is preferred.

關於基材層1的厚度,並沒有特別限定。基材層1的厚度較佳為3μm以上,更佳為5μm以上。又,基材層1的厚度較佳為30μm以下,更佳為25μm以下。 藉由基材層1的厚度為30μm以下,蓋帶的剛性不會變得過高。藉此,即使對密封後的載體帶施加扭轉應力的情況下,蓋帶亦容易追隨載體帶的變形。因此,能夠抑制蓋帶從載體帶意外剝離的情況。 藉由基材層1的厚度為3μm以上,能夠使蓋帶的機械強度足夠良好。因此,例如即使從載體帶高速剝離蓋帶的情況下,亦能夠抑制蓋帶斷裂的情況。 The thickness of the base material layer 1 is not particularly limited. The thickness of the base material layer 1 is preferably 3 μm or more, more preferably 5 μm or more. In addition, the thickness of the base material layer 1 is preferably 30 μm or less, more preferably 25 μm or less. Since the thickness of the base material layer 1 is 30 μm or less, the rigidity of the cover tape will not become too high. Thereby, even when torsional stress is applied to the sealed carrier tape, the cover tape can easily follow the deformation of the carrier tape. Therefore, accidental peeling of the cover tape from the carrier tape can be suppressed. When the thickness of the base material layer 1 is 3 μm or more, the mechanical strength of the cover tape can be sufficiently improved. Therefore, for example, even when the cover tape is peeled off from the carrier tape at high speed, breakage of the cover tape can be suppressed.

[中間層2] 藉由蓋帶具有中間層2,能夠提高蓋帶的緩衝性、耐衝擊性等。 作為形成中間層2之材料,可以舉出烯烴系樹脂、苯乙烯系樹脂、環狀烯烴系樹脂等。其中,從提高蓋帶整體的緩衝性之觀點而言,烯烴系樹脂為較佳。 作為烯烴系樹脂,可以舉出聚乙烯、聚丙烯等,聚乙烯為較佳。尤其從緩衝性的方面而言,低密度聚乙烯(LDPE)或直鏈狀低密度聚乙烯(L-LDPE)為更佳。 在本實施態樣中,中間層2尤其包含直鏈狀低密度聚乙烯為較佳。詳細情況尚不明確,但可能是直鏈狀低密度聚乙烯的適當的緩衝性與寬度為3mm以下的本實施態樣的蓋帶相匹配。在此,基於稱之為「直鏈狀低密度聚乙烯」並在市場中流通的聚乙烯的密度,在本說明書中,將密度為0.880g/cm 3以上且小於0.930g/cm 3的直鏈狀聚乙烯設為直鏈狀低密度聚乙烯。 中間層2可以僅由(i)直鏈狀低密度聚乙烯構成,亦可以由(ii)直鏈狀低密度聚乙烯和低密度聚乙烯或高密度聚乙烯等其他聚乙烯構成。對於(ii),更具體而言,能夠舉出如下態樣:(ii-1)中間層2係具備由直鏈狀低密度聚乙烯構成之層和由其他聚乙烯構成之層之多層構成的態樣;及(ii-2)中間層2具備由直鏈狀低密度聚乙烯和其他聚乙烯的混合物構成之層之態樣(單層或多層)等。 藉由鑽研中間層2的構成,有時能夠抑制製造蓋帶時的「捲曲」,控制蓋帶的強度。 [Intermediate Layer 2] When the cover tape has the intermediate layer 2, the cushioning properties, impact resistance, etc. of the cover tape can be improved. Examples of the material forming the intermediate layer 2 include olefin resin, styrene resin, cyclic olefin resin, and the like. Among them, from the viewpoint of improving the cushioning properties of the entire cover tape, olefin-based resin is preferred. Examples of olefin-based resins include polyethylene, polypropylene, and the like, with polyethylene being preferred. Especially in terms of cushioning properties, low-density polyethylene (LDPE) or linear low-density polyethylene (L-LDPE) is more preferable. In this embodiment, the middle layer 2 is preferably composed of linear low-density polyethylene. The details are not yet clear, but it is possible that the appropriate cushioning properties of linear low-density polyethylene match the cover tape of this embodiment with a width of 3 mm or less. Here, based on the density of polyethylene called "linear low-density polyethylene" and circulating in the market, in this specification, linear low-density polyethylene with a density of 0.880g/ cm3 or more and less than 0.930g/ cm3 is used. The chain polyethylene is linear low-density polyethylene. The intermediate layer 2 may be composed only of (i) linear low-density polyethylene, or may be composed of (ii) linear low-density polyethylene and other polyethylene such as low-density polyethylene or high-density polyethylene. Regarding (ii), more specifically, the following aspect can be cited: (ii-1) The intermediate layer 2 is composed of a multilayer structure including a layer made of linear low-density polyethylene and a layer made of other polyethylene. Aspect; and (ii-2) The intermediate layer 2 has an aspect (single layer or multi-layer) of a layer composed of a mixture of linear low-density polyethylene and other polyethylene, etc. By studying the structure of the intermediate layer 2, it is sometimes possible to suppress "curling" during the production of the cover tape and control the strength of the cover tape.

作為另一觀點,藉由使用加熱時的尺寸變化率小者作為中間層2,能夠抑制蓋帶從載體帶「浮起」。其結果,抑制了極小零件進入到浮起部分。具體而言,藉由中間層具有以下所說明之特性,能夠使蓋帶更加適用於小型電子零件的包裝。From another point of view, by using a material with a small dimensional change rate during heating as the intermediate layer 2, it is possible to suppress the cover tape from "floating" from the carrier tape. As a result, very small parts are prevented from entering the floating portion. Specifically, by having the following characteristics of the middle layer, the cover tape can be more suitable for packaging small electronic parts.

將中間層之在23℃時的尺寸設為T 0,以80℃加熱2小時之後的尺寸設為T 1時,以下的式(1)所表示之中間層之流動方向((Machine Direction,MD)方向)的尺寸變化率例如為-4~4%,較佳為-3~3%,寬度方向((Transverse Direction,TD)方向)的尺寸變化率例如為0~2%,較佳為0.1~1%。 尺寸變化率(%)={(T 0-T 1)/T 0}×100   式(1) When the size of the intermediate layer at 23°C is set to T 0 and the size after heating at 80°C for 2 hours is set to T 1 , the flow direction (Machine Direction, MD) of the intermediate layer represented by the following formula (1) The dimensional change rate in the ) direction is, for example, -4 to 4%, preferably -3 to 3%, and the dimensional change rate in the width direction ((Transverse Direction, TD) direction) is, for example, 0 to 2%, preferably 0.1 ~1%. Dimensional change rate (%) = {(T 0 -T 1 )/T 0 }×100 Formula (1)

中間層2可以僅為1層,亦可以為2層以上。例如,中間層2可以由積層上述之材料而成之多層薄膜來形成。 中間層2可以包含各種添加劑,亦可以不包含。 設置中間層的情況下,從提高蓋帶整體的緩衝性之觀點而言,其厚度較佳為10~55μm,更佳為15~50μm,進一步較佳為20~45μm。 The intermediate layer 2 may be only one layer, or may be two or more layers. For example, the intermediate layer 2 may be formed of a multi-layered film in which the above-mentioned materials are laminated. The intermediate layer 2 may or may not contain various additives. When an intermediate layer is provided, from the viewpoint of improving the cushioning properties of the entire cover tape, its thickness is preferably 10 to 55 μm, more preferably 15 to 50 μm, and further preferably 20 to 45 μm.

[密封劑層3] 關於構成密封劑層3之材料,並沒有特別限定。密封劑層3由藉由施加熱而能夠與載體帶接著的材料構成即可。 [Sealant Layer 3] The material constituting the sealant layer 3 is not particularly limited. The sealant layer 3 may be made of a material that can be bonded to the carrier tape by applying heat.

作為用於構成密封劑層3的材料的具體例,可以舉出(甲基)丙烯酸系樹脂、苯乙烯系樹脂、烯烴系樹脂、胺基甲酸酯系樹脂、酯系樹脂、該等共聚物等。其中,從可以得到對載體帶的良好的熱封性的觀點而言,包含苯乙烯系樹脂、(甲基)丙烯酸系樹脂及酯系樹脂中的至少1種以上為較佳。尤其在本實施態樣中,併用苯乙烯系樹脂和(甲基)丙烯酸系樹脂為較佳。Specific examples of the material constituting the sealant layer 3 include (meth)acrylic resin, styrene resin, olefin resin, urethane resin, ester resin, and copolymers thereof. wait. Among them, it is preferable to include at least one type of styrene-based resin, (meth)acrylic resin, and ester-based resin from the viewpoint of obtaining good heat sealability to the carrier tape. Especially in this embodiment, it is preferable to use a styrenic resin and a (meth)acrylic resin together.

從降低密封劑層3的表面電阻值來抑制剝離時的靜電產生,並保持密封性的觀點而言,密封劑層3能夠進而包含抗靜電劑。在密封劑層3中,較佳為在樹脂中溶解或分散有抗靜電劑。The sealant layer 3 may further contain an antistatic agent from the viewpoint of reducing the surface resistance value of the sealant layer 3 to suppress generation of static electricity during peeling and maintaining sealing properties. In the sealant layer 3, it is preferable that an antistatic agent is dissolved or dispersed in the resin.

作為抗靜電劑,例如能夠舉出(i)粒子狀的金屬含有物質或(ii)導電性高分子等。作為抗靜電劑的具體例,可以舉出摻雜銻的氧化錫、摻雜磷的氧化錫、摻雜氟的氧化錫等的金屬氧化物粒子、導電性高分子、奈米碳管等。依據與樹脂的良好的相溶性等,以抗靜電劑包含由摻雜銻的氧化錫(ATO)、摻雜磷的氧化錫、摻雜氟的氧化錫及導電性高分子組成之群組中的1種以上為較佳。 作為導電性高分子,能夠較佳地舉出聚噻吩或聚噻吩衍生物。更具體而言,可以舉出聚噻吩、聚(3,4)-乙烯二氧基噻吩、聚(3-噻吩-β-乙磺酸)等。其中,從進一步保持良好的抗靜電性和密封性的觀點而言,聚3,4-乙烯二氧基噻吩或其衍生物為較佳。 Examples of the antistatic agent include (i) particulate metal-containing substances, (ii) conductive polymers, and the like. Specific examples of the antistatic agent include metal oxide particles such as antimony-doped tin oxide, phosphorus-doped tin oxide, and fluorine-doped tin oxide, conductive polymers, carbon nanotubes, and the like. Based on good compatibility with resin, etc., antistatic agents include antimony-doped tin oxide (ATO), phosphorus-doped tin oxide, fluorine-doped tin oxide, and conductive polymers. One or more types are preferred. Preferred examples of conductive polymers include polythiophene and polythiophene derivatives. More specific examples include polythiophene, poly(3,4)-ethylenedioxythiophene, poly(3-thiophene-β-ethanesulfonic acid), and the like. Among these, poly3,4-ethylenedioxythiophene or its derivatives are preferred from the viewpoint of further maintaining good antistatic properties and sealing properties.

作為其他添加劑,密封劑層3可以包含用於使抗靜電劑的分散性良好的分散劑、二氧化矽溶膠、調平劑、助導電劑等。As other additives, the sealant layer 3 may contain a dispersant, a silica sol, a leveling agent, a conductive aid, etc. for improving the dispersibility of the antistatic agent.

從較佳地進行密封作業和剝離作業的觀點而言,密封劑層3的厚度係0.02~20μm為較佳,0.03~15μm為更佳。From the viewpoint of optimally performing the sealing operation and the peeling operation, the thickness of the sealant layer 3 is preferably 0.02 to 20 μm, and more preferably 0.03 to 15 μm.

[其他層] 蓋帶亦可以具備基材層1、中間層2及密封劑層3以外的追加層。 作為追加層,例如,能夠舉出將2個層接著而成的接著層。 [Other layers] The cover tape may include additional layers other than the base material layer 1 , the intermediate layer 2 , and the sealant layer 3 . Examples of the additional layer include an adhesive layer formed by bonding two layers.

[整體厚度] 從確保薄膜強度和操作性的平衡的觀點而言,蓋帶的厚度係25~80μm為較佳,35~70μm為更佳。 [Overall thickness] From the viewpoint of ensuring a balance between film strength and workability, the thickness of the cover tape is preferably 25 to 80 μm, and more preferably 35 to 70 μm.

<電子零件包裝體/包裝對象的電子零件> 依據上述的蓋帶和在凹部容納有電子零件之載體帶,能夠得到電子零件包裝體。參照圖2,對此進行說明。 <Electronic component packaging/electronic components to be packaged> According to the above-mentioned cover tape and the carrier tape in which electronic components are accommodated in the recessed portion, an electronic component package can be obtained. This will be described with reference to Figure 2 .

在圖2中,蓋帶10用作配合電子零件的形狀而連續設置有凹狀的袋21之帶狀的載體帶20的蓋材料。 具體而言,蓋帶10接著(一般熱封)於載體帶20的表面,以覆蓋載體帶20的袋21的整個開口部。再者,以下,將接著蓋帶10和載體帶20而得到的結構體稱為電子零件包裝體100。 In FIG. 2 , the cover tape 10 is used as a cover material for a belt-shaped carrier tape 20 in which concave bags 21 are continuously provided in accordance with the shape of the electronic components. Specifically, the cover tape 10 is then (usually heat-sealed) on the surface of the carrier tape 20 to cover the entire opening of the bag 21 of the carrier tape 20 . In addition, below, the structure obtained by joining the cover tape 10 and the carrier tape 20 is called the electronic component package 100.

電子零件包裝體100例如能夠藉由以下的順序來製作。 首先,將電子零件容納於載體帶20的袋21內。 接著,藉由熱封法將蓋帶10接著於載體帶20的表面,以覆蓋載體帶20的袋21的整個開口部。此時,使蓋帶10中的密封劑層3與載體帶20接觸(亦即,進行熱封,以使圖2中的蓋帶10的「背面」成為密封劑層3)。藉此,可以得到密封容納電子零件之結構體(電子零件包裝體100)。 關於熱封的具體操作方法或條件,只要蓋帶10充分牢固地接著於載體帶20,則並沒有特別限定。典型地,能夠使用公知的帶裝機,在溫度100~240℃、荷重0.1~10kgf、時間0.0001~1秒的範圍內進行。 The electronic component package 100 can be produced by the following procedures, for example. First, the electronic components are accommodated in the pocket 21 of the carrier tape 20 . Next, the cover tape 10 is adhered to the surface of the carrier tape 20 by a heat sealing method to cover the entire opening of the bag 21 of the carrier tape 20 . At this time, the sealant layer 3 in the cover tape 10 is brought into contact with the carrier tape 20 (that is, heat sealing is performed so that the "back surface" of the cover tape 10 in FIG. 2 becomes the sealant layer 3). Thereby, a structure (electronic component packaging body 100) that sealily accommodates electronic components can be obtained. The specific operation method or conditions of heat sealing are not particularly limited as long as the cover tape 10 is sufficiently firmly adhered to the carrier tape 20 . Typically, a well-known tape loading machine can be used, and the temperature range is 100 to 240°C, the load is 0.1 to 10kgf, and the time is in the range of 0.0001 to 1 second.

載體帶20的材料只要能夠藉由熱封而接著蓋帶10,則並沒有特別限定。一般為樹脂製或紙製,較佳為樹脂製。 作為一例,載體帶20由包含聚苯乙烯樹脂之材料、包含聚碳酸酯樹脂之材料、包含聚對酞酸乙二酯樹脂之材料等構成。 The material of the carrier tape 20 is not particularly limited as long as it can be adhered to the cover tape 10 by heat sealing. It is generally made of resin or paper, preferably resin. As an example, the carrier tape 20 is made of a material containing polystyrene resin, a material containing polycarbonate resin, a material containing polyethylene terephthalate resin, or the like.

電子零件包裝體100例如捲繞在捲軸上,其後,輸送到將電子零件安裝於電子電路基板等之作業區域。捲軸的材料能夠係金屬製、紙製、塑膠製等。The electronic component package 100 is wound on a reel, for example, and then transported to an operation area where electronic components are mounted on an electronic circuit board or the like. The material of the scroll can be made of metal, paper, plastic, etc.

電子零件包裝體100被輸送到作業區域之後,將蓋帶10從載體帶20剝離,取出所容納之電子零件。After the electronic component package 100 is transported to the work area, the cover tape 10 is peeled off from the carrier tape 20 and the contained electronic components are taken out.

如上所述,在本實施態樣中,在電子零件包裝體100內包裝小型電子零件為較佳。換言之,上述的蓋帶尤其適用於小型電子零件的包裝。 若對電子零件的尺寸具體地進行記載,則例如為1005(1.0mm×0.5mm)尺寸以下,較佳為0603(0.6mm×0.3mm)尺寸以下,更佳為0402(0.4mm×0.2mm)尺寸以下。 As described above, in this embodiment, it is preferable to package small electronic components in the electronic component packaging body 100 . In other words, the above-mentioned cover tape is particularly suitable for packaging small electronic parts. If the dimensions of the electronic components are specifically described, for example, they are 1005 (1.0mm×0.5mm) or less, preferably 0603 (0.6mm×0.3mm) or less, more preferably 0402 (0.4mm×0.2mm). size below.

關於電子零件的種類,並沒有特別限定。能夠舉出半導體晶片、電晶體、二極體、電容器、壓電元件、光學元件、LED相關構件、連接器、電極等用於製造電氣・電子機器之所有零件。The types of electronic components are not particularly limited. Examples include semiconductor wafers, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related components, connectors, electrodes, and other parts used in the manufacture of electrical and electronic equipment.

以上,對本發明的實施態樣進行了敘述,但該等僅為本發明的例示,能夠採用除了上述以外的各種構成。又,本發明不限定於上述的實施態樣,能夠實現本發明的目的之範圍內的變形、改良等亦包含在本發明中。 [實施例] The embodiments of the present invention have been described above. However, these are merely illustrations of the present invention, and various configurations other than those described above can be adopted. In addition, the present invention is not limited to the above-described embodiments, and modifications, improvements, etc. within the scope that can achieve the object of the present invention are also included in the present invention. [Example]

基於實施例及比較例,對本發明的實施態樣進行詳細說明。為了慎重起見而事先說明,但本發明不僅限定於實施例。Based on Examples and Comparative Examples, embodiments of the present invention will be described in detail. Although it is explained in advance for the sake of caution, the present invention is not limited to the Examples.

首先,描述用於形成密封劑層之材料。 (A)苯乙烯系樹脂 苯乙烯-丁二烯共聚物:旭化成公司製,「Tuftec H1517」(苯乙烯含有率(PS比率):43%,MFR(230℃,2.16kg):3g/10分) (B)聚(甲基)丙烯酸衍生物 DIC公司製「A450A」 (C-1)抗靜電劑 摻雜銻的氧化錫(三菱綜合材料公司製「T-1」) First, materials used to form the sealant layer are described. (A) Styrenic resin Styrene-butadiene copolymer: Asahi Kasei Co., Ltd., "Tuftec H1517" (styrene content (PS ratio): 43%, MFR (230°C, 2.16kg): 3g/10 minutes) (B) Poly(meth)acrylic acid derivatives Made by DIC Corporation "A450A" (C-1) Antistatic agent Antimony-doped tin oxide ("T-1" manufactured by Mitsubishi Materials Corporation)

<實施例1> 在實施例1中,製造了具備PET薄膜和尼龍薄膜的2層構成的基材層、中間層及密封劑層之蓋帶。具體的製造順序如下所述。 <Example 1> In Example 1, a cover tape including a base material layer, an intermediate layer, and a sealant layer composed of two layers of a PET film and a nylon film was produced. The specific manufacturing sequence is as follows.

首先,準備了厚度12μm的雙軸拉伸聚酯薄膜(東洋紡股份有限公司,商品名:T6140)。對該單面塗布層壓劑(三井化學股份有限公司,TAKELAC A-520),藉由乾式層壓法積層了厚度12μm的雙軸拉伸尼龍薄膜(科隆工業公司,商品名:NT02)。藉此得到了2層構成的基材層。 接著,在基材層的雙軸拉伸尼龍薄膜側塗布層壓劑(三井化學股份有限公司製,TAKELAC A-520),藉由乾式層壓法積層厚度30μm的聚乙烯薄膜(TAMAPOLY股份有限公司製,商品名:SE605M),形成了中間層。 其後,在中間層側的露出面上,藉由凹版塗布法塗布了包含摻雜銻之氧化錫之塗布液。作為塗布液,使用了將60質量%的(C-1)抗靜電劑、24質量%的(B)聚(甲基)丙烯酸衍生物及16質量%的(A)苯乙烯系樹脂均勻地混合而成者。藉此形成了厚度0.5μm的密封劑層。藉此得到了具備基材層、中間層及密封劑層之積層體。 將所得到之積層體切割成寬度2.6mm,得到了長條狀的蓋帶。 First, a biaxially stretched polyester film with a thickness of 12 μm (Toyobo Co., Ltd., trade name: T6140) was prepared. This single-sided coating laminating agent (Mitsui Chemicals Co., Ltd., TAKELAC A-520) was laminated with a 12-μm-thick biaxially stretched nylon film (Koelon Industrial Co., Ltd., trade name: NT02) by a dry lamination method. In this way, a base material layer composed of two layers was obtained. Next, a laminating agent (TAKELAC A-520, manufactured by Mitsui Chemicals Co., Ltd.) was applied to the biaxially stretched nylon film side of the base layer, and a polyethylene film (TAMAPOLY Co., Ltd.) with a thickness of 30 μm was laminated by a dry lamination method. Made in China, trade name: SE605M), forming the middle layer. Thereafter, a coating liquid containing antimony-doped tin oxide was applied to the exposed surface on the intermediate layer side by a gravure coating method. As a coating liquid, 60 mass % (C-1) antistatic agent, 24 mass % (B) poly(meth)acrylic acid derivative and 16 mass % (A) styrene resin were uniformly mixed. The one who becomes. Thereby, a sealant layer with a thickness of 0.5 μm was formed. Thereby, a laminated body including a base material layer, an intermediate layer, and a sealant layer was obtained. The obtained laminated body was cut into a width of 2.6 mm, and a long cover tape was obtained.

<實施例2> 代替厚度12μm的雙軸拉伸尼龍薄膜(科隆工業公司,商品名:NT02),使用了厚度15μm的雙軸拉伸尼龍薄膜(東洋紡股份有限公司,商品名:N1202),除此以外,以與實施例1相同的方式,得到了蓋帶。 <Example 2> A biaxially stretched nylon film with a thickness of 15 μm (Toyobo Co., Ltd., trade name: N1202) was used instead of a biaxially stretched nylon film with a thickness of 12 μm (Koeln Industrial Co., Ltd., trade name: NT02). In the same manner as Example 1, a cover tape was obtained.

<實施例3> 代替厚度30μm的聚乙烯薄膜(TAMAPOLY股份有限公司製,商品名:SE605M),使用了厚度25μm的聚乙烯薄膜(和光股份有限公司:LM-015),除此以外,以與實施例1相同的方式,得到了蓋帶。 <Example 3> The same procedure as in Example 1 was performed except that a polyethylene film with a thickness of 25 μm (Wako Co., Ltd.: LM-015) was used instead of a polyethylene film with a thickness of 30 μm (manufactured by TAMAPOLY Co., Ltd., trade name: SE605M). way, got the cover tape.

<實施例4> 代替厚度30μm的聚乙烯薄膜(TAMAPOLY股份有限公司製,商品名:SE605M),使用了厚度40μm的聚乙烯薄膜(TAMAPOLY股份有限公司製,商品名:SE605M),除此以外,以與實施例1相同的方式,得到了蓋帶。 <Example 4> The same procedure as Example 1 was used except that a polyethylene film with a thickness of 40 μm (manufactured by TAMAPOLY Co., Ltd., trade name: SE605M) was used instead of a 30 μm-thick polyethylene film (manufactured by TAMAPOLY Co., Ltd., trade name: SE605M). In the same way, the cover tape was obtained.

<實施例5> 代替厚度30μm的聚乙烯薄膜(TAMAPOLY股份有限公司製,商品名:SE605M),使用了厚度30μm的積層聚乙烯薄膜,除此以外,以與實施例1相同的方式,得到了蓋帶。 這裏所使用之積層薄膜係直鏈狀低密度聚乙烯/高密度聚乙烯/直鏈狀低密度聚乙烯的層構成,各層的厚度為10μm,總厚度為30μm。直鏈狀低密度聚乙烯係宇部丸善公司:UMERIT 0540F,高密度聚乙烯係日本聚乙烯公司:Novatec HF111K。又,這裡所使用之積層薄膜係使用共擠出吹脹(inflation)成形機以擠出溫度200℃藉由積層擠出而製造者。 <Example 5> A cover tape was obtained in the same manner as in Example 1 except that a laminated polyethylene film with a thickness of 30 μm was used instead of a 30 μm-thick polyethylene film (manufactured by TAMAPOLY Co., Ltd., trade name: SE605M). The laminated film used here is composed of layers of linear low-density polyethylene/high-density polyethylene/linear low-density polyethylene. The thickness of each layer is 10 μm, and the total thickness is 30 μm. Linear low-density polyethylene Ube Maruzen Co., Ltd.: UMERIT 0540F, high-density polyethylene Japan Polyethylene Co.: Novatec HF111K. In addition, the laminated film used here is produced by lamination extrusion using a co-extrusion inflation molding machine at an extrusion temperature of 200°C.

<實施例6> 將基材層設為厚度20μm的雙軸拉伸聚對酞酸丁二酯(興人薄膜與化學股份有限公司製,BOBLET ST)的單層,除此以外,以與實施例1相同的方式,得到了蓋帶。 <Example 6> The same procedure as in Example 1 was performed except that the base material layer was a single layer of biaxially stretched polybutylene terephthalate (BOBLET ST manufactured by Kojin Films & Chemicals Co., Ltd.) with a thickness of 20 μm. , got the cover tape.

<實施例7> 將基材層設為厚度25μm的雙軸拉伸聚對酞酸乙二酯(二村化學股份有限公司,FE2301)的單層,除此以外,以與實施例1相同的方式,得到了蓋帶。 <Example 7> A cover tape was obtained in the same manner as in Example 1, except that the base material layer was a single layer of biaxially stretched polyethylene terephthalate (FE2301 from Futura Chemical Co., Ltd.) with a thickness of 25 μm. .

<比較例1> 將基材層設為厚度12μm的雙軸拉伸聚對酞酸乙二酯(東洋紡股份有限公司,商品名:T6140)的單層,除此以外,以與實施例1相同的方式,得到了蓋帶。 <Comparative example 1> Except that the base material layer was a single layer of biaxially stretched polyethylene terephthalate (Toyobo Co., Ltd., trade name: T6140) with a thickness of 12 μm, it was obtained in the same manner as in Example 1. Cover tape.

<比較例2> 將基材層設為厚度16μm的雙軸拉伸聚對酞酸乙二酯(東洋紡股份有限公司,商品名:E7415)的單層,除此以外,以與實施例1相同的方式,得到了蓋帶。 <Comparative example 2> Except that the base material layer was a single layer of biaxially stretched polyethylene terephthalate (Toyobo Co., Ltd., trade name: E7415) with a thickness of 16 μm, it was obtained in the same manner as in Example 1. Cover tape.

<斷裂強度的測量> 遵照JIS K 6734,測量了各實施例及比較例的蓋帶的斷裂強度。對於測量,使用島津公司的自動立體測圖儀(autograph),針對切成2.6mm寬度的蓋帶,在拉伸強度50mm/min的條件下,進行了拉伸試驗。然後,求出斷裂時的荷重作為斷裂強度。 <Measurement of breaking strength> In accordance with JIS K 6734, the breaking strength of the cover tapes of each example and comparative example was measured. For measurement, a tensile test was conducted using Shimadzu's autograph on a cover tape cut into a width of 2.6 mm at a tensile strength of 50 mm/min. Then, the load at breakage was determined as the breakage strength.

<中間層的尺寸變化率的測量> 將作為上述中間層的聚乙烯薄膜,在23℃、相對濕度50%的環境下,切出400mm見方。將該試驗薄膜的尺寸設為T 0。將試驗薄膜在設定為80℃之烘箱中加熱2小時之後,取出該薄膜,分別測量對應於流動方向及寬度方向之方向的尺寸,並設為T 1。按照以下的式(1)算出了各方向中的尺寸變化率。 尺寸變化率(%)=[(T 0-T 1)/T 0]×100   式(1) <Measurement of Dimensional Change Rate of Intermediate Layer> The polyethylene film as the above-mentioned intermediate layer was cut into a 400 mm square piece in an environment of 23° C. and 50% relative humidity. Let the size of this test film be T 0 . After heating the test film in an oven set at 80° C. for 2 hours, the film was taken out, and the dimensions corresponding to the flow direction and width direction were measured, and set as T 1 . The dimensional change rate in each direction was calculated according to the following equation (1). Dimensional change rate (%) = [(T 0 -T 1 )/T 0 ]×100 Formula (1)

<使用帶式送料器(Tape Feeder)的斷裂評價> 以以下順序進行了評價。 (1)使用帶裝機,將所得到之評價用蓋帶(2.6mm寬度)的密封劑層側的密封面,在170℃、4kgf、0.005秒的條件下,熱封於4mm寬度的聚苯乙烯樹脂製載體帶的表面,製作了帶狀的包裝體。 (2)使用帶式送料器(松下電器公司製,產品名:智慧型帶式送料器(Intelligent Tape Feeder)),在輸送速度(剝離速度):2400mm/min、剝離角度:約170°的條件下,從載體帶連續剝離了評價用蓋帶。然後,評價了當所剝離之蓋帶夾在帶式送料器內的2個齒輪之間時,是否會斷裂。在後述的表中,將未斷裂的情況記載為良好,將斷裂之情況記載為不良。 <Fracture evaluation using tape feeder> Evaluation was performed in the following order. (1) Using a tape mounting machine, heat seal the sealing surface of the sealant layer side of the obtained evaluation cover tape (2.6mm width) to 4mm wide polystyrene under the conditions of 170°C, 4kgf, 0.005 seconds. A tape-shaped packaging body is produced on the surface of the resin carrier tape. (2) Use a tape feeder (manufactured by Panasonic Electric Co., Ltd., product name: Intelligent Tape Feeder), under the conditions of conveying speed (peeling speed): 2400mm/min, peeling angle: about 170° , the evaluation cover tape was continuously peeled off from the carrier tape. Then, it was evaluated whether the peeled cover tape would break when sandwiched between two gears in a tape feeder. In the table to be described later, the case of not breaking is described as good, and the case of breaking is described as poor.

<蓋帶的浮起評價> (1)使用帶裝機,將所得到之評價用蓋帶(2.6mm寬度)的密封劑層側的密封面,在170℃、4kgf、0.005秒的條件下,熱封於4mm寬度的聚苯乙烯樹脂製載體帶的表面,製作了帶狀的包裝體。 (2)切割包裝體並用顯微鏡觀察截面,測量了蓋帶的浮起量。所謂浮起量,係圖3中的x的大小。 <Evaluation of Lifting of Cover Tape> (1) Using a tape mounting machine, heat seal the sealing surface of the sealant layer side of the obtained evaluation cover tape (2.6mm width) to 4mm wide polystyrene under the conditions of 170°C, 4kgf, 0.005 seconds. A tape-shaped packaging body is produced on the surface of the resin carrier tape. (2) The packaging body was cut, the cross section was observed with a microscope, and the lifting amount of the cover tape was measured. The so-called floating amount refers to the size of x in Figure 3.

<剝離強度的評價> (1)使用帶裝機,將所得到之評價用蓋帶(2.6mm寬度)的密封劑層側的密封面,在170℃、4kgf、0.005秒的條件下,熱封於4mm寬度的聚苯乙烯樹脂製載體帶的表面,製作了帶狀的包裝體。 (2)使用所得到之樣品,測量了電子零件包裝用蓋帶對於上述聚苯乙烯樹脂製載體帶之剝離強度(單位:gf)。關於剝離強度的測量,使用剝離試驗機(EPI公司製「PTS-5000」),在剝離速度300mm/min、剝離角度170°、測量溫度25℃的條件下進行。 <Evaluation of peel strength> (1) Using a tape mounting machine, heat seal the sealing surface of the sealant layer side of the obtained evaluation cover tape (2.6mm width) to 4mm wide polystyrene under the conditions of 170°C, 4kgf, 0.005 seconds. A tape-shaped packaging body is produced on the surface of the resin carrier tape. (2) Using the obtained sample, the peel strength (unit: gf) of the cover tape for packaging electronic parts to the above-mentioned polystyrene resin carrier tape was measured. Peel strength was measured using a peel testing machine ("PTS-5000" manufactured by EPI Corporation) under conditions of peeling speed of 300 mm/min, peeling angle of 170°, and measurement temperature of 25°C.

將上述的各結果匯總並示於表1。Each of the above results is summarized and shown in Table 1.

[表1]    實施例 比較例 1 2 3 4 5 6 7 1 2 斷裂強度(N) (2.6mm寬度) 15 20 14 16 16 13 13 7 8 中間層的 MD方向的尺寸變化率(%) -2.5 -2.5 -2.6 -2.5 -2.8 -2.5 -2.5 -2.5 -2.5 中間層的 TD方向的尺寸變化率(%) +0.20 +0.20 +0.30 +0.20 +0.50 +0.20 +0.20 +0.20 +0.20 使用帶式送料器的 斷裂評價 良好 良好 良好 良好 良好 良好 良好 不良 不良 蓋帶的 浮起評價(μm) 21 17 20 20 18 17 17 22 21 剝離強度 (gf) 32 30 30 35 33 23 24 33 28 [Table 1] Example Comparative example 1 2 3 4 5 6 7 1 2 Breaking strength (N) (2.6mm width) 15 20 14 16 16 13 13 7 8 Dimensional change rate of the middle layer in the MD direction (%) -2.5 -2.5 -2.6 -2.5 -2.8 -2.5 -2.5 -2.5 -2.5 Dimensional change rate of the middle layer in the TD direction (%) +0.20 +0.20 +0.30 +0.20 +0.50 +0.20 +0.20 +0.20 +0.20 Fracture evaluation using tape feeders good good good good good good good bad bad Lift evaluation of cover tape (μm) twenty one 17 20 20 18 17 17 twenty two twenty one Peel strength (gf) 32 30 30 35 33 twenty three twenty four 33 28

實施例1~7的蓋帶的按照JIS K 6734測得之斷裂強度為10N以上。然後,在使用帶式送料器的斷裂評價中未產生斷裂。亦即,實施例1~7的蓋帶即使係窄幅亦不易斷裂,而可以說適用於小型電子零件的包裝。 又,在實施例1~7的蓋帶中,「浮起量」比較小。認為這是因為中間層的尺寸變化率比較小的關係。 又,在<剝離強度的評價>中,實施例1~5的蓋帶均表示30gf以上的數值,而顯示出比實施例6及實施例7的蓋帶更良好的剝離強度。認為這是因為基材層的不同的關係。 The cover tapes of Examples 1 to 7 had a breaking strength measured in accordance with JIS K 6734 of 10 N or more. Then, no breakage occurred in the breakage evaluation using a tape feeder. That is, the cover tapes of Examples 1 to 7 are not easily broken even if they are narrow in width, and can be said to be suitable for packaging small electronic components. In addition, in the cover tapes of Examples 1 to 7, the "floating amount" was relatively small. This is considered to be because the dimensional change rate of the intermediate layer is relatively small. Moreover, in <Evaluation of Peel Strength>, the cover tapes of Examples 1 to 5 all showed numerical values of 30 gf or more, and showed better peel strength than the cover tapes of Examples 6 and 7. This is considered to be due to the difference in the base material layer.

本申請主張基於2022年3月30日申請之日本申請特願2022-055535號之優先權,並將其揭示的全部內容編入本說明書中。This application claims priority based on Japanese Application No. 2022-055535 filed on March 30, 2022, and the entire disclosure of this application is incorporated into this specification.

1:基材層 2:中間層 3:密封劑層 10:蓋帶 20:載體帶 21:袋 100:電子零件包裝體 W:寬度 x:浮起量 1: Base material layer 2:Middle layer 3:Sealant layer 10: cover tape 20:Carrier tape 21:bag 100: Electronic parts packaging body W: Width x: floating amount

[圖1]係示意性表示本實施態樣的蓋帶(電子零件包裝用蓋帶)的一例之圖式。 [圖2]係表示將電子零件包裝用蓋帶接著(熱封)於載體帶之狀態的一例之圖式。 [圖3]係用於說明蓋帶的「浮起量」之圖式。 [Fig. 1] is a diagram schematically showing an example of the cover tape (cover tape for packaging electronic components) according to this embodiment. [Fig. 2] is a diagram showing an example of a state in which a cover tape for packaging electronic components is attached (heat-sealed) to a carrier tape. [Figure 3] is a diagram used to explain the "floating amount" of the cover tape.

1:基材層 1: Base material layer

2:中間層 2:Middle layer

3:密封劑層 3:Sealant layer

W:寬度 W: Width

Claims (10)

一種電子零件包裝用蓋帶,其為寬度為3mm以下的長條狀, 按照JIS K 6734測得之斷裂強度為10N以上。 A cover tape for packaging electronic parts, which is in the form of a long strip with a width of less than 3 mm. The breaking strength measured in accordance with JIS K 6734 is 10N or more. 如請求項1之電子零件包裝用蓋帶,其用於1005尺寸以下的電子零件的包裝。For example, the cover tape for electronic parts packaging in claim 1 is used for packaging electronic parts below 1005 size. 如請求項1或2之電子零件包裝用蓋帶,其至少依序具備基材層、中間層及密封劑層。For example, the cover tape for packaging electronic parts according to claim 1 or 2 must at least have a base material layer, an intermediate layer and a sealant layer in order. 如請求項3之電子零件包裝用蓋帶,其中, 該基材層包含選自包括尼龍樹脂、聚酯樹脂及聚丙烯樹脂之群組中的至少任一種。 For example, the cover tape for packaging electronic parts in claim 3, wherein, The base material layer includes at least any one selected from the group consisting of nylon resin, polyester resin and polypropylene resin. 如請求項3之電子零件包裝用蓋帶,其中, 該基材層包含尼龍樹脂。 For example, the cover tape for packaging electronic parts in claim 3, wherein, The base material layer contains nylon resin. 如請求項3之電子零件包裝用蓋帶,其中, 該基材層包括包含尼龍樹脂之層和包含聚酯樹脂之層的這至少2層。 For example, the cover tape for packaging electronic parts in claim 3, wherein, The base material layer includes at least two layers: a layer containing nylon resin and a layer containing polyester resin. 如請求項3之電子零件包裝用蓋帶,其中, 該中間層包含低密度聚乙烯。 For example, the cover tape for packaging electronic parts in claim 3, wherein, The middle layer contains low density polyethylene. 如請求項3之電子零件包裝用蓋帶,其中, 將該中間層之在23℃時的尺寸設為T 0,並以80℃加熱2小時之後的尺寸設為T 1時,在以下的式(1)所表示之該中間層之流動方向即MD方向的尺寸變化率為-4~4%,寬度方向即TD方向的尺寸變化率為0~2%, 尺寸變化率(%)={(T 0-T 1)/T 0}×100   式(1)。 For example, the cover tape for packaging electronic parts according to claim 3, wherein the size of the intermediate layer at 23°C is set to T 0 , and the size after heating at 80°C for 2 hours is set to T 1 , in the following formula: (1) The dimensional change rate expressed in the flow direction of the middle layer, that is, the MD direction, is -4 to 4%, and the dimensional change rate in the width direction, that is, the TD direction, is 0 to 2%. The dimensional change rate (%) = {( T 0 -T 1 )/T 0 }×100 Formula (1). 一種電子零件包裝體,其具備:載體帶,儲存電子零件;及請求項1或2之電子零件包裝用蓋帶,接著於該載體帶以密封該電子零件。An electronic component packaging body, which is provided with: a carrier tape to store electronic components; and a cover tape for packaging electronic components according to claim 1 or 2, and the electronic components are then sealed on the carrier tape. 如請求項9之電子零件包裝體,其中, 該電子零件為0402尺寸以下的電子零件。 Such as the electronic parts packaging body of claim 9, wherein, The electronic parts are electronic parts below 0402 size.
TW112112165A 2022-03-30 2023-03-30 Cover tape for packaging electronic components and electronic component package TW202406807A (en)

Applications Claiming Priority (2)

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JPH11105181A (en) * 1997-09-30 1999-04-20 Dainippon Printing Co Ltd Cover tape for packing electronic part
JP4001774B2 (en) * 2002-05-29 2007-10-31 日東電工株式会社 Carrier base for electronic component conveyance and electronic component conveyance body
EP2311749B1 (en) * 2008-08-12 2013-04-17 Sumitomo Bakelite Co., Ltd. Cover tape for electronic component packing body and electronic component packing body
JP2016182989A (en) * 2015-03-27 2016-10-20 住友ベークライト株式会社 Electronic component packaging cover tape, electronic component packaging material and electronic component packaging body
CN110770144B (en) * 2017-06-22 2021-10-26 住友电木株式会社 Cover tape and electronic component package
CN114728741A (en) * 2019-11-15 2022-07-08 住友电木株式会社 Cover tape and electronic component package
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