JP2023150112A - Organic el display device and manufacturing method thereof - Google Patents

Abstract

To provide an organic EL display device that can achieve high brightness while suppressing a decrease in aperture ratio.SOLUTION: An organic EL display device includes a substrate, a plurality of pixels located on the substrate, a first partition wall that partitions each of the plurality of pixels, and a second partition wall located in a display area where the plurality of pixels are located and higher than the first partition wall. A first pixel included in the plurality of pixels includes a first electrode, an organic light emitting layer located on the first electrode, and a second electrode located on the organic light emitting layer, and the first partition wall exhibits liquid repellency, and the bottom surface of the second partition wall is in contact with at least one of the substrate and the first electrode.SELECTED DRAWING: Figure 2

Description

The present invention relates to an organic EL display device and a manufacturing method thereof.

An example of a display device is an organic EL display device using an organic EL material (EL: Electro-Luminescence) as a light-emitting substance. For example, Patent Document 1 listed below discloses an organic EL element in which an organic light emitting layer is formed by a letterpress printing method, and each pixel included in the organic EL element is partitioned by partition walls. In addition, in Patent Document 1 listed below, a second partition wall is provided in the center between the pixels partitioned by the partition wall. This creates a pool of ink in the organic light-emitting layer that has flowed out of the pixel.

Japanese Patent Application Publication No. 2013-105694

In Patent Document 1, an excessive amount of material contained in the organic light emitting layer may leak into the ink reservoir. In this case, there is a possibility that the organic EL element will not emit light properly.

An object of one aspect of the present invention is to provide an organic EL display device and manufacture thereof that can keep materials contained in an organic light emitting layer in a predetermined area even when a wet method is used to form the organic light emitting layer. The purpose is to provide a method.

An organic EL display device according to one aspect of the present invention includes a substrate, a plurality of pixels located on the substrate, a first partition wall that partitions each of the plurality of pixels, and a display area in which the plurality of pixels are located. , a second partition wall higher than the first partition wall, and a first pixel included in the plurality of pixels includes a first electrode, an organic light emitting layer located on the first electrode, and a first pixel located on the organic light emitting layer. and a second electrode, the first partition exhibits liquid repellency, and the bottom surface of the second partition is in contact with at least one of the substrate and the first electrode.

In this organic EL display device, each of the plurality of pixels is partitioned by a first partition. Thereby, the area where each pixel is arranged is defined by the first partition wall. Here, the first partition wall exhibits liquid repellency. Therefore, by forming at least a part of the material included in the organic light-emitting layer in the above region using a wet method, the material can be kept within the above region without providing the first partition wall at a high height. Additionally, the bottom surface of the second partition is in contact with at least one of the substrate and the first electrode. In this case, the second partition wall is less likely to peel off from the substrate, compared to the case where the bottom surface contacts only the first partition wall. Therefore, even if the first partition wall exhibits liquid repellency is formed, the second partition wall can be formed with high reliability.

A second pixel included in the plurality of pixels is adjacent to the first pixel in the first direction, and the second pixel includes a first electrode, another organic light emitting layer located on the first electrode, and another organic light emitting layer located on the first electrode. another second electrode located on the organic light emitting layer, and a bottom surface of a first portion of the first partition located between the first pixel and the second pixel in the first direction; The bottom surface of the second portion located between the first pixel and the second pixel in the first direction may be in contact with the first electrode. In this case, the second partition wall can be formed with higher reliability.

A second pixel included in the plurality of pixels is adjacent to the first pixel in the first direction, and the second pixel has a first electrode and another organic light emitting layer located on the first electrode. another second electrode located on the organic light-emitting layer of the first partition; The bottom surface of the second portion located between the first pixel and the second pixel in the first direction may be in contact with the base film located on the first electrode. In this case, the second partition wall can be formed with higher reliability.

In the display area, the second partition wall may extend from one end to the other end in a second direction intersecting the first direction. In this case, each second electrode in the display area can be suitably divided by the second partition. Further, the second partition wall viewed from the second direction may have an overhang shape. In this case, each second electrode in the display area can be more suitably divided by the second partition.

A portion of the first partition may overlap the second partition. In this case, the area occupied by pixels in the display area can be increased.

The first partition wall and the second partition wall may be in contact with each other. In this case, the area occupied by pixels in the display area can be increased.

A method for manufacturing an organic EL display device according to another aspect of the present invention includes a step of forming a first electrode on a substrate, a first opening for exposing a part of the first electrode, and a first opening for exposing a part of the first electrode. a step of forming a first partition having a different second opening, a step of forming a second partition in the second opening, a step of forming an organic layer in the first opening by a wet method, and a step of forming an organic layer in the first opening. forming a light-emitting layer thereon; and forming a second electrode on the light-emitting layer; the first partition wall exhibits liquid repellency; in contact with at least one side of the

In this method of manufacturing an organic EL display device, an organic layer is formed as a wet layer within the first opening of the first partition. Here, the first partition wall exhibits liquid repellency. Therefore, the organic layer can be kept within the first opening. Additionally, the bottom surface of the second partition is in contact with at least one of the substrate and the first electrode. In this case, the second partition wall is less likely to peel off from the substrate, compared to the case where the bottom surface contacts only the first partition wall. Therefore, even if the first partition wall exhibits liquid repellency is formed, the second partition wall can be formed with high reliability.

According to the present invention, there is provided an organic EL display device and a method for manufacturing the same, in which the material contained in the organic light emitting layer can be kept in a predetermined region even when a wet method is used when forming the organic light emitting layer. can.

FIG. 1 is a schematic perspective view of an organic EL display device according to an embodiment. 2(a) is a schematic plan view of a main part of the display area, and FIG. 2(b) is a schematic end view taken along line AA in FIG. 2(a). FIG. 3 is a schematic end view taken along line BB in FIG. 2(a). FIGS. 4A and 4B are schematic cross-sectional views for explaining a method of manufacturing the display area. FIG. 5(a) is a schematic plan view for explaining the manufacturing method of the display area, and FIG. 5(b) is a schematic end view taken along line CC in FIG. 5(a). 5(c) is a schematic end view taken along line DD in FIG. 5(a). FIGS. 6(a) to 6(c) are schematic cross-sectional views for explaining the method of manufacturing the display area. FIGS. 7A and 7B are schematic cross-sectional views for explaining a method of manufacturing the display area. FIG. 8 is a schematic end view showing a first partition wall and a second partition wall according to a comparative example. FIG. 9(a) is a schematic end view of main parts of an organic EL display device according to a first modification, and FIG. 9(b) is a schematic end view of main parts of an organic EL display device according to a second modification. be.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same elements or elements having the same function will be denoted by the same reference numerals, and redundant description will be omitted.

First, the outline of the configuration of the organic EL display device according to this embodiment will be explained with reference to FIG. 1. FIG. 1 is a schematic perspective view of an organic EL display device according to this embodiment. The organic EL display device 1 shown in FIG. 1 is a passive matrix type display device. The organic EL display device 1 includes a first substrate 2 and a second substrate 3, a display area 4, a wiring section 5, an integrated circuit 6, an FPC 7 (flexible printed circuit), and a protective resin 8, which are stacked on each other. Equipped with In the following, the direction in which the first substrate 2 and the second substrate 3 are stacked on each other will be described as a "stacking direction (third direction D3)". The stacking direction corresponds to the thickness direction of the first substrate 2 and the second substrate 3. In addition, hereinafter, a direction perpendicular to the stacking direction will be referred to as a horizontal direction, a predetermined direction in the horizontal direction will be referred to as a first direction D1, and a direction intersecting or orthogonal to the first direction D1 will be referred to as a second direction D2.

The first substrate 2 is a substrate that functions as a sealing substrate, and is opposed to the second substrate 3. The first substrate 2 is bonded to the second substrate 3 via, for example, a frame-shaped sealing layer (not shown). This sealing layer contains, for example, an ultraviolet curing resin exhibiting adhesive properties, and may further contain a spacer or the like. The first substrate 2 has, for example, a substantially rectangular shape in plan view. In this embodiment, in plan view, the lateral direction of the first substrate 2 extends in the first direction D1, and the longitudinal direction of the first substrate 2 extends in the second direction D2. The first substrate 2 is, for example, a glass substrate, a ceramic substrate, a metal substrate, or a flexible substrate (for example, a plastic substrate).

The second substrate 3 is an element substrate on which a display area 4 and a wiring section 5 are provided. The second substrate 3 has, for example, a substantially rectangular shape in plan view. The second substrate 3 is, for example, a glass substrate or a flexible substrate (such as a plastic substrate), and exhibits light-transmitting properties. In plan view, the short sides of the second substrate 3 are substantially the same as the short sides of the first substrate 2, and the long sides of the second substrate 3 are longer than the long sides of the first substrate 2. Therefore, when one short side of the first substrate 2 and one short side of the second substrate 3 are combined, a part of the second substrate 3 is exposed from the first substrate 2. Note that "substantially the same" in this embodiment does not mean only complete sameness, but is a concept that includes some error (for example, about several percent at most).

The display area 4 is an area that generates light when current is supplied, and is provided on the second substrate 3. The display area 4 is provided in a sealed space surrounded and sealed by the first substrate 2, the second substrate 3, and the sealing layer. A desiccant or the like may be provided in this sealed space. Details of the display area 4 will be described later.

The wiring section 5 is a portion including a plurality of routing wirings. Although not shown, the wiring section 5 includes, for example, a wiring that connects the display area 4 and the integrated circuit 6, a wiring that connects the integrated circuit 6 and the FPC 7, and the like. These routing wirings include, for example, a molybdenum alloy layer, an aluminum alloy layer, and a molybdenum alloy layer stacked in this order. The wiring portion 5 may be provided with a barrier film for protecting the above-mentioned routing wiring. This barrier film is, for example, an insulating film such as a silicon oxide film or a silicon nitride film.

The integrated circuit 6 is a drive circuit that controls whether or not each pixel in the display area 4 emits light. The integrated circuit 6 is mounted on a region of the second substrate 3 exposed from the first substrate 2 and is connected to the wiring section 5 . The integrated circuit 6 is, for example, an IC chip. The number of integrated circuits 6 in the organic EL display device 1 may be one or more.

The FPC 7 is a wiring that connects the organic EL display device 1 and an external device. The FPC 7 is formed using, for example, a flexible plastic substrate. External devices connected to the FPC 7 include, for example, a power supply and a current control circuit.

The protective resin 8 is a resin provided to protect the wiring section 5 and the integrated circuit 6 located outside the sealed space. The protective resin 8 is, for example, various curable resins.

Next, details of the display area 4 will be explained with reference to FIG. 2. 2(a) is a schematic plan view of a main part of the display area, and FIG. 2(b) is a schematic end view taken along line AA in FIG. 2(a). FIG. 3 is a schematic end view taken along line BB in FIG. 2(b). Note that the first substrate 2 is omitted in each of FIGS. 2(a), 2(b), and 3. As shown in FIG. 2(a), the display area 4 includes a plurality of anode rays 11 extending along a first direction D1, a plurality of cathode rays 12 extending along a second direction D2, A first partition wall 13 and a second partition wall 14 are located.

In the display area 4, a portion of the anode ray 11 and a portion of the cathode ray 12 overlap each other. Specifically, a portion of the anode ray 11 is located between the second substrate 3 and a portion of the cathode ray 12 in the third direction D3. A pixel P is provided at a position where the anode line 11 and the cathode line 12 intersect. Therefore, the plurality of pixels P located in the display area 4 are arranged in a matrix on the second substrate 3.

As shown in FIG. 2(b), each pixel P has a part of the anode ray 11, an organic light emitting layer 21 located on the part, and a cathode ray 12 located on the organic light emitting layer 21. . Among the two pixels P shown in FIG. 2(b), one is defined as a first pixel P1, and the other is defined as a second pixel P2. The first pixel P1 and the second pixel P2 are arranged along the first direction D1 and have a common anode line 11. On the other hand, the organic light emitting layer 21 and cathode rays 12 included in the first pixel P1 are different from the organic light emitting layer 21 and cathode rays 12 included in the second pixel P2. Note that among the plurality of pixels P, the pixels arranged in a row along the second direction D2 have a common cathode ray 12 and have mutually different anode rays 11.

The organic light-emitting layer 21 is a layer that includes at least a light-emitting layer containing a light-emitting material. The organic light emitting layer 21 has substantially the same shape as the corresponding cathode ray 12 in plan view. That is, the organic light emitting layer 21 has a substantially linear shape along the second direction D2 in plan view, and the width of the organic light emitting layer 21 is substantially the same as the width of the cathode ray 12. In addition to the light emitting layer, the organic light emitting layer 21 may include other organic layers (for example, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, etc.). The light-emitting material contained in the light-emitting layer may be a low-molecular organic compound or a high-molecular organic compound. As the luminescent material, a fluorescent material or a phosphorescent material may be used. The electron injection layer, the electron transport layer, the hole transport layer, and the hole injection layer each contain an organic material. For example, the hole transport layer contains α-NPD, which is a low molecular organic compound that exhibits hole transport properties, and the electron transport layer contains Alq ₃ , which is a low molecular organic compound that exhibits electron transport properties. The thickness of the organic light emitting layer 21 is, for example, 100 nm or more and 300 nm or less.

At least one of the layers included in the organic light emitting layer 21 is formed by a wet method. Examples of the wet method include an inkjet method, a spin coating method, a spray coating method, and a doctor blade method. In this embodiment, at least some of the other organic layers included in the organic light emitting layer 21 (for example, the hole injection layer) are formed by a wet method.

The plurality of anode wires 11 are transparent conductors having a linear shape in a plan view, and function as the first electrodes of the pixels P. The plurality of anode wires 11 are arranged in stripes on the second substrate 3. The anode wire 11 is formed of a conductive material exhibiting light-transmitting properties, such as ITO (indium tin oxide) and IZO (indium zinc oxide). The thickness of each anode wire 11 is, for example, 10 nm or more and 200 nm or less. The width of each anode wire 11 along the second direction D2 is, for example, 20 μm or more and 500 μm or less. The interval between adjacent anode wires 11 along the second direction D2 is, for example, 10 μm or more and 100 μm or less.

The plurality of cathode rays 12 are conductors having a linear shape in plan view, and function as the second electrodes of the pixels P. The plurality of cathode rays 12 are arranged in stripes on the second substrate 3. The cathode wire 12 is made of a conductive material such as aluminum or silver. The conductive material may include an alkaline earth metal (magnesium, calcium, etc.), or may include a conductive material exhibiting translucency, such as IZO or ITO. That is, the cathode ray 12 may exhibit translucency. The cathode ray 12 is formed by, for example, a PVD method. The thickness of each cathode ray 12 is, for example, 50 nm or more and 300 nm or less. The width of each cathode ray 12 along the first direction D1 is, for example, 20 μm or more and 1000 μm or less. The width of the cathode ray 12 may be greater than or equal to the width of the anode ray 11. The interval between adjacent cathode rays 12 along the first direction D1 is, for example, 5 μm or more and 50 μm or less.

The first partition wall 13 is an insulating member that partitions each of the plurality of pixels P located in the display area 4, and has a plurality of openings 13a and a plurality of openings 13b. The opening 13a is a portion (first opening) that exposes a part of the anode wire 11, and has a substantially rectangular shape in plan view. Each opening 13a overlaps a location where the anode ray 11 and the cathode ray 12 intersect. Therefore, the positions where the plurality of openings 13a are provided in the first partition 13 correspond to the positions where the pixels P are provided. Each opening 13b is a portion (second opening) that exposes a part of the second substrate 3, and is a groove extending along the second direction D2. Each opening 13b is located between two adjacent pixels P in the first direction D1. The width of the opening 13b along the first direction D1 is, for example, 5 μm or more and 50 μm or less. In the present embodiment, in the display area 4, each opening 13b extends from one end to the other end in the second direction D2. In the opening 13b, the second substrate 3 or the anode wire 11 is exposed. Note that in this embodiment, the first partition wall 13 is a single member, but is not limited to this. For example, the first partition wall 13 may have a plurality of parts separated by each opening 13b.

The bottom surface 13c of the first partition 13 contacts at least one of the second substrate 3 and the anode wire 11. For example, as shown in FIG. 2(b), a portion 13d (first portion) of the first partition 13 located between the first pixel P1 and the second pixel P2 adjacent in the first direction D1. The bottom surface 13c is in contact with the anode wire 11. Further, as shown in FIG. 3 , a bottom surface 13 c included in a portion of the first partition wall 13 located between two adjacent pixels P in the second direction D2 is in contact with the second substrate 3 . The thickness (maximum thickness) of the first partition 13 is, for example, 0.5 μm or more and 3.0 μm or less. When the thickness of the first partition wall 13 is 0.5 μm or more, even if a small amount of liquid is dropped in the area where the pixel P is provided, the liquid is less likely to leak from the area. Note that the small amount of liquid corresponds to, for example, an amount of liquid that can form a thin film having a thickness of 100 nm or less in the above region.

The first partition wall 13 exhibits liquid repellency. With this, for example, when a small amount of liquid is dropped in a region where a pixel P is provided, the liquid is less likely to leak from the region. In this embodiment, when propylene glycol monomethyl ether acetate (PGMEA) is dropped onto the surface of the first partition wall 13, if the angle (contact angle) between the surface and the PGMEA is at least 30°, It can be said that the partition wall 13 exhibits liquid repellency. From the viewpoint of preventing leakage of a small amount of liquid by the first partition wall 13, the first partition wall 13 may exhibit liquid repellency when the contact angle is 35° or more or 40° or more. The first partition wall 13 includes, for example, a positive type or negative type photosensitive resin.

The second partition wall 14 is an element separator for forming the cathode rays 12 and the organic light emitting layer 21 having a desired shape. The second partition wall 14 is an insulating member formed within the opening 13b of the first partition wall 13, and extends along the second direction D2. The second partition wall 14 has a substantially linear shape in plan view, and has an overhang shape (for example, an inverted tapered shape) when viewed from the second direction D2. The second partition wall 14 is higher than the first partition wall 13, and has a height of, for example, 1.0 μm or more. The second partition wall 14 extends in the display area 4 from one end to the other end in the second direction D2. The bottom surface 14a of the second partition 14 is in contact with at least one of the second substrate 3 and the anode wire 11. For example, as shown in FIG. 2(b), a portion 14b (second portion) of the second partition wall 14 located between the first pixel P1 and the second pixel P2 adjacent in the first direction D1. The bottom surface 14a is in contact with the anode wire 11. Further, as shown in FIG. 3 , a bottom surface 14 a included in a portion of the second partition wall 14 located between two adjacent pixels P in the second direction D2 is in contact with the second substrate 3 . The second partition 14 includes, for example, a negative photosensitive resin that is an organic material.

Next, an example of a method for manufacturing the display area of the organic EL display device according to this embodiment will be described with reference to FIGS. 4 to 7. FIGS. 4A and 4B are schematic cross-sectional views for explaining a method of manufacturing the display area. FIG. 5(a) is a schematic plan view for explaining the manufacturing method of the display area, and FIG. 5(b) is a schematic end view taken along line CC in FIG. 5(a). 5(c) is a schematic end view taken along line DD in FIG. 5(a). FIGS. 6(a) to 6(c) are schematic cross-sectional views for explaining the method of manufacturing the display area. FIGS. 7A and 7B are schematic cross-sectional views for explaining a method of manufacturing the display area. In the following, manufacturing of the wiring section 5, integrated circuit 6, FPC 7, and protective resin 8 will be omitted.

First, as shown in FIG. 4(a), the second substrate 3 is prepared (first step). Next, as shown in FIG. 4(a), an anode wire 11 is formed on the second substrate 3 (second step). The anode wire 11 is formed by patterning a transparent conductive film formed on the second substrate 3 by, for example, a PVD method (physical vapor deposition method) such as a vacuum evaporation method or a sputtering method. Therefore, although not shown, a part of the second substrate 3 is exposed from the anode wire 11 (see FIG. 2(a)).

Next, as shown in FIGS. 5A to 5C, a first partition wall 13 having openings 13a and 13b is formed on the second substrate 3 (third step). The first partition wall 13 is formed by, for example, photolithography, and exhibits liquid repellency. As shown in FIGS. 5(b) and 5(c), a part of the bottom surface 13c of the first partition 13 is in contact with the anode wire 11, and another part of the bottom surface 13c of the first partition 13 is in contact with the second substrate 3. come into contact with

Next, as shown in FIG. 6A, a resin layer 31 is formed to cover at least the anode wire 11 and the first partition wall 13 (fourth step). Although not shown, the resin layer 31 also covers the portions of the second substrate 3 that are exposed from the anode wires 11 and the first partition walls 13 . The resin layer 31 is made of, for example, a negative photosensitive resin, and is formed by various wet methods.

Next, as shown in FIG. 6(b), the resin layer 31 is patterned to form the second partition 14 in the opening 13b (fifth step). As described above, within the opening 13b, the bottom surface 14a of the second partition 14 contacts at least one of the second substrate 3 and the anode wire 11. Further, the first partition wall 13 and the portion of the anode wire 11 that overlaps with the opening 13a are exposed.

Next, as shown in FIG. 6(c), the liquid L is dropped into the opening 13a (sixth step). In this embodiment, a liquid L (organic solvent) containing a hole injection material is selectively dropped into the opening 13a by an inkjet method. Subsequently, by drying the liquid L, an organic layer 32 is formed by a wet method, as shown in FIG. 7(a). Next, as shown in FIG. 7(b), an organic light emitting layer 21 is formed (seventh step). In the seventh step, the organic light emitting layer 21 is formed by forming at least a light emitting layer (not shown) on the organic layer 32 shown in FIG. 7(a). In addition to the light emitting layer, another organic layer may be formed on the organic layer 32. At least one of the light-emitting layer and another organic layer may be formed by a wet method or a dry method. Examples of the dry method include a vacuum evaporation method.

Next, as shown in FIG. 7(c), cathode rays 12 are formed on the organic light emitting layer 21 having the light emitting layer (eighth step). By using the second partition 14, the cathode rays 12 are formed in stripes and located on the organic light emitting layer 21. As described above, within each opening 13a, the anode ray 11, the organic light emitting layer 21, and the cathode ray 12 overlap with each other. As a result, a plurality of pixels P are formed in the display area 4.

According to the organic EL display device 1 according to the present embodiment described above, each of the plurality of pixels P is partitioned by the first partition wall 13. As a result, the region where each pixel P is arranged (that is, the opening 13a) is defined by the first partition 13. Here, the first partition wall 13 exhibits liquid repellency. Therefore, by forming at least a part of the material included in the organic light-emitting layer 21 in the above region using a wet method, the material can be kept within the above region without the need to provide the first partition wall 13 at a high height. . In addition, the bottom surface 14a of the second partition 14 is in contact with at least one of the second substrate 3 and the anode wire 11. In this case, the second partition 14 is less likely to peel off from the second substrate 3, compared to the case where the bottom surface 14a contacts only the first partition 13. Therefore, even when the first partition wall 13 exhibiting liquid repellency is formed, the second partition wall 14 can be formed with high reliability.

Here, in this embodiment, the reason why the second partition 14 is difficult to peel off from the second substrate 3 will be explained with reference to FIG. 8. FIG. 8 is a schematic end view showing a first partition wall and a second partition wall according to a comparative example. As shown in FIG. 8, only the opening 113a is formed in the first partition 113, and the second partition 114 is formed on the first partition 113. Here, when the first partition 113 exhibits liquid repellency because a wet method is used to form the organic light emitting layer, the first partition 113 is liquid repellent to the organic material that is the material of the second partition 114. shows. In this case, the first partition wall 113 and the second partition wall 114 are difficult to adhere to each other, and the second partition wall 114 is easily peeled off from the second substrate 3. In this case, there is a possibility that the organic light-emitting layer and cathode rays that will be formed later will not be separated by the second partition wall 114. On the other hand, in this embodiment, as described above, the bottom surface 14a of the second partition 14 is in contact with at least one of the second substrate 3 and the anode wire 11. Therefore, it can be seen that the second partition wall 14 is less likely to be peeled off from the second substrate 3 compared to the above comparative example.

In the present embodiment, the second pixel P2 included in the plurality of pixels P is adjacent to the first pixel P1 in the first direction D1, and the second pixel P2 has a common anode line 11 with the first pixel P1. have Further, the second pixel P2 has an organic light emitting layer 21 different from the organic light emitting layer 21 included in the first pixel P1, and a cathode ray 12 located on the organic light emitting layer 21 and different from the organic light emitting layer 21 included in the first pixel P1. and cathode rays 12. In addition, the bottom surface 13c of the portion 13d of the first partition 13 located between the first pixel P1 and the second pixel P2 in the first direction D1, and the bottom surface 13c of the portion 13d of the second partition 14 located between the first pixel P1 and the second pixel P2 in the first direction D1 The bottom surface 14a of the portion 14b located between P1 and the second pixel P2 is in contact with the common anode line 11, respectively. Therefore, the second partition wall 14 can be formed with higher reliability.

In this embodiment, in the display area 4, the second partition 14 may extend from one end to the other end in the second direction D2. In this case, each cathode ray 12 in the display area 4 can be suitably divided by the second partition wall 14. Further, the second partition wall 14 when viewed from the second direction D2 may have an overhang shape. In this case, each cathode ray 12 in the display area 4 can be divided more suitably by the second partition wall 14.

Hereinafter, a modification of the above embodiment will be described with reference to FIG. 9. In the following description of the modification, description of parts that overlap with the above embodiment will be omitted.

FIG. 9A is a schematic end view of essential parts of an organic EL display device according to a first modification. As shown in FIG. 9A, the bottom surface 13c of the portion 13d of the first partition 13 located between the first pixel P1 and the second pixel P2 in the first direction D1 and the bottom surface 13c of the portion 13d of the second partition 14 The bottom surface 14a of the portion 14b located between the first pixel P1 and the second pixel P2 in the first direction D1 is in contact with the base film 41 located on the anode line 11, respectively. In other words, in the first modification, the base film 41 is located below the first partition wall 13 and the second partition wall 14 and above the anode wire 11. The base film 41 is an insulating film that is formed after the anode line 11 is formed and before the first partition 13 is formed. The base film 41 may be, for example, an organic insulating film such as a positive-type or negative-type photosensitive resin material, or an inorganic insulating film such as a silicon oxide film or a silicon nitride film. The thickness of the base film 41 is, for example, 50 nm or more and 3000 nm or less. A portion of the base film 41 is also provided within the opening 13a of the first partition 13. The part is provided at and near the edge of the opening 13a. On the other hand, the base film 41 completely covers the opening 13b of the first partition 13.

Also in the first modified example described above, the same effects as in the above embodiment are achieved. In addition, by forming the base film 41 to completely cover the opening 13b, short circuit between the anode wire 11 and the cathode wire 12 within the opening 13b can be effectively prevented.

When at least a portion of the layers included in the organic light emitting layer 21 is formed by a wet method, the thickness of the layer tends to be non-uniform. Particularly, in the above layer, the edge of the opening 13a and the portion located in the vicinity thereof tend to be thicker than other portions. On the other hand, in the first modification, a portion of the base film 41 is provided at and near the edge of the opening 13a, so that the thick film portion of the organic light emitting layer 21 in each pixel P can be excluded. Therefore, according to the first modification, the uneven light emission of each pixel P can be reduced.

FIG. 9B is a schematic end view of essential parts of an organic EL display device according to a second modification. As shown in FIG. 9(b), a portion of the first partition wall 13A overlaps the second partition wall 14, and the first partition wall 13A and the second partition wall 14 are in contact with each other. In addition, a base film 41 is formed as in the first modification. This second modification also provides the same effects as the first modification. Furthermore, the area occupied by the pixels P in the display area 4 (see FIG. 1) can be increased.

The organic EL display device and the manufacturing method thereof according to the present invention are not limited to the embodiment and each modification example described above, and various other modifications are possible. For example, the above embodiment and the above modification may be combined with each other. For example, by combining the above embodiment and the second modification, the base film may not be formed and a part of the first partition wall may overlap with the second partition wall, or the first partition wall and the second partition wall may overlap. The partition walls may be in contact with each other.

In the above embodiment and the above modification, the organic EL display device is a passive matrix type display device, but is not limited to this. The organic EL display device may be an active matrix type display device, a segment type display device, or the like.

In the embodiment and the modification described above, each substrate has a substantially rectangular shape in plan view, but the shape is not limited to this. Each substrate may have a polygonal shape, a substantially circular shape, or the like in plan view.

DESCRIPTION OF SYMBOLS 1... Organic EL display device, 2... First substrate, 3... Second substrate (substrate), 4... Display area, 5... Wiring part, 6... Integrated circuit, 7... FPC, 8... Protective resin, 11... Anode line , 12... Cathode ray, 13, 13A, 113... First partition, 13a... Opening (first opening), 13b... Opening (second opening), 13c... Bottom surface, 13d... Portion (first portion), DESCRIPTION OF SYMBOLS 14, 114...Second partition, 14a...Bottom surface, 14b...Part (second part), 21...Organic light emitting layer, 31...Resin layer, 32...Organic layer, 41...Underlayer film, P...Pixel, P1...First Pixel, P2...second pixel.

Claims (8)

A substrate and
a plurality of pixels located on the substrate;
a first partition wall that partitions each of the plurality of pixels;
a second partition wall located in a display area where the plurality of pixels are located and higher than the first partition wall;
Equipped with
A first pixel included in the plurality of pixels has a first electrode, an organic light emitting layer located on the first electrode, and a second electrode located on the organic light emitting layer,
The first partition wall exhibits liquid repellency,
a bottom surface of the second partition is in contact with at least one of the substrate and the first electrode;
Organic EL display device. A second pixel included in the plurality of pixels is adjacent to the first pixel in the first direction,
The second pixel includes the first electrode, another organic light emitting layer located on the first electrode, and another second electrode located on the another organic light emitting layer,
A bottom surface of a first portion of the first partition wall located between the first pixel and the second pixel in the first direction, and a bottom surface of a first portion of the second partition wall located between the first pixel and the second pixel in the first direction. 2. The organic EL display device according to claim 1, wherein a bottom surface of the second portion located between the second pixel and the first electrode is in contact with the first electrode. A second pixel included in the plurality of pixels is adjacent to the first pixel in the first direction,
The second pixel includes the first electrode, another organic light emitting layer located on the first electrode, and another second electrode located on the another organic light emitting layer,
A bottom surface of a first portion of the first partition wall located between the first pixel and the second pixel in the first direction, and a bottom surface of a first portion of the second partition wall located between the first pixel and the second pixel in the first direction. 2. The organic EL display device according to claim 1, wherein a bottom surface of the second portion located between the second pixel and the second pixel is in contact with a base film located on the first electrode. 4. The organic EL display device according to claim 2, wherein in the display area, the second partition wall extends from one end to the other end in a second direction intersecting the first direction. The organic EL display device according to claim 4, wherein the second partition wall has an overhang shape when viewed from the second direction. The organic EL display device according to claim 1, wherein a portion of the first partition wall overlaps the second partition wall. The organic EL display device according to claim 1, wherein the first partition wall and the second partition wall are in contact with each other. forming a first electrode on the substrate;
forming a first partition having a first opening that exposes a part of the first electrode and a second opening that is different from the first opening;
forming a second partition in the second opening;
forming an organic layer within the first opening by a wet method;
forming a light emitting layer on the organic layer;
forming a second electrode on the light emitting layer;
Equipped with
The first partition wall exhibits liquid repellency,
a bottom surface of the second partition is in contact with at least one of the substrate and the first electrode;
A method for manufacturing an organic EL display device.

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