JP2023147927A - Manufacturing method for chip-type electronic component - Google Patents

Abstract

To provide a manufacturing method for a chip-type electronic component that allows a spacer to be formed in a desired position with high precision.SOLUTION: A manufacturing method for a chip-type electronic component in which a spacer is provided on the surface of an external electrode of an electronic component body having a plurality of external electrodes protruding outward with respect to a main body includes a step (S1) of preparing the electronic component body, a step (S2) of holding the electronic component body such that the plurality of external electrodes are exposed on the same side of the main body, a step (S3) of supplying metal paste into a plurality of recesses of an intaglio plate having the plurality of recesses, and a step (S4) of transferring the metal paste to the plurality of external electrodes by bringing the held electronic component body close to the intaglio plate and bringing each of the plurality of external electrodes exposed on the same side of the main body into contact with the metal paste in the plurality of recesses of the intaglio plate.SELECTED DRAWING: Figure 4

Description

The present invention relates to a method for manufacturing chip-type electronic components.

2. Description of the Related Art Techniques for mounting chip-type electronic components such as multilayer ceramic capacitors on a mounting board via spacers are known. The spacer is provided, for example, in order to suppress a sound called "squeak" caused by the chip-type electronic component deforming the substrate when voltage is applied to the chip-type electronic component.

Patent Document 1 discloses a chip-type electronic component including a spacer whose main component is an intermetallic compound containing at least one high-melting point metal selected from Cu and Ni and Sn as a low-melting point metal. . The spacer of this chip-type electronic component is said to have sufficient heat resistance to not melt even at the temperature during soldering.

International Publication No. 2018/101405

Patent Document 1 describes that a spacer is formed by applying a metal paste by screen printing, a dispensing method, or the like. Although the dispensing method allows spacers to be formed with high precision, productivity is low.

On the other hand, when forming spacers by screen printing, the productivity is higher than that by the dispensing method, but there is a possibility that the formed spacers may be misaligned. That is, as shown in FIG. 10, a plurality of spacers are formed at once by applying metal paste 202 onto a mask 200 having a plurality of holes 201 and transferring the metal paste 202 onto a substrate 204 with a squeegee 203. However, highly accurate alignment is required. Therefore, the spacer may be formed at a position different from the desired position.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method for manufacturing a chip-type electronic component that allows spacers to be formed at desired positions with high precision.

The method for manufacturing a chip-type electronic component of the present invention includes:
A method for manufacturing a chip-type electronic component in which a spacer is provided on the surface of the external electrode of an electronic component body having a plurality of external electrodes protruding outward with respect to the main body, the method comprising:
a step of preparing the electronic component body;
holding the electronic component main body so that the plurality of external electrodes are exposed on the same side of the main body;
supplying a metal paste into the recesses of an intaglio plate having a plurality of recesses;
By bringing the held electronic component main body close to the intaglio plate and bringing each of the plurality of external electrodes exposed on the same side of the main body portion into contact with the metal paste in the plurality of recesses of the intaglio plate. , transferring the metal paste to a plurality of the external electrodes;
It is characterized by having the following.

According to the method for manufacturing a chip-type electronic component of the present invention, an electronic component main body held such that a plurality of external electrodes are exposed on the same side of the main body is brought close to an intaglio plate in which metal paste is supplied in the recessed part, Since each of the exposed external electrodes is transferred by contacting the metal paste in the plurality of recesses, spacers can be formed on the surfaces of the plurality of external electrodes with high precision. In other words, when the plurality of external electrodes protruding outward are brought into contact with the metal paste in the recesses of the intaglio, the metal paste does not come into contact with the main body whose surface is located on the inside with respect to the plurality of external electrodes. , metal paste can be prevented from adhering to the main body. Furthermore, since the spacers are formed on the surfaces of the plurality of external electrodes by transferring the metal paste, highly accurate positioning such as screen printing using a mask is not necessary.

FIG. 1 is a perspective view schematically showing the structure of a multilayer ceramic capacitor that is an example of an electronic component main body. FIG. 2 is a cross-sectional view schematically showing the structure of the multilayer ceramic capacitor shown in FIG. 1 taken along line II-II. FIG. 2 is a cross-sectional view schematically showing the structure of the multilayer ceramic capacitor shown in FIG. 1 taken along line III-III. It is a flowchart for explaining a manufacturing method of a chip type electronic component in one embodiment. (a) is a diagram for explaining the process of holding the electronic component body, (b) is a diagram for explaining the process of supplying the metal paste into the recessed part of the intaglio, and (c) is the diagram for explaining the process of holding the electronic component body. (d) is a diagram showing a state in which the electronic component body is brought close to the intaglio and each of the plurality of external electrodes is in contact with the metal paste in the plurality of recesses of the intaglio. The figure showing the held state, (e) is a figure showing how the electronic component main body is pulled up. (a) is a plan view schematically showing an intaglio plate having a groove-shaped recess, (b) is a plan view schematically showing an intaglio plate having a circular box-shaped recess in plan view, and (c) FIG. 2 is a plan view schematically showing an intaglio plate having an oval box-shaped recess when viewed from above. FIG. 3 is a diagram schematically showing the metal paste transferred to the plurality of external electrodes when the step of transferring the metal paste to the plurality of external electrodes is performed multiple times. FIG. 1 is a perspective view schematically showing an example of a chip-type electronic component manufactured by a method for manufacturing a chip-type electronic component in an embodiment. FIG. 3 is a side view schematically showing a state in which the main body of the chip-type electronic component is placed at a high position away from the substrate by a spacer, and another electronic component is mounted below the main body. FIG. 2 is a diagram for explaining a conventional method of forming spacers by screen printing using a mask having a plurality of holes.

Embodiments of the present invention will be shown below, and features of the present invention will be specifically explained.

The method for manufacturing a chip-type electronic component of the present invention is a method for manufacturing a chip-type electronic component in which a spacer is provided on the surface of an external electrode of an electronic component body having a plurality of external electrodes protruding outward with respect to the main body. . First, the structure of the electronic component body on which the spacer is provided will be briefly explained, and then the method for manufacturing the chip-type electronic component will be explained in detail.

Here, as an example of an electronic component body, the structure of a multilayer ceramic capacitor, which is a multilayer ceramic electronic component, will be described. In that case, the chip-type electronic component manufactured by the method for manufacturing a chip-type electronic component of the present invention is also a multilayer ceramic capacitor. However, the main body of the electronic component is not limited to a multilayer ceramic capacitor, and if it is a chip-type electronic component that has multiple external electrodes protruding outward from the main body, such as a thermistor or inductor, There are no restrictions.

(electronic component body)
FIG. 1 is a perspective view schematically showing the configuration of a multilayer ceramic capacitor 10X, which is an example of the electronic component main body 10. FIG. 2 is a cross-sectional view schematically showing the structure of the multilayer ceramic capacitor 10X shown in FIG. 1 taken along line II-II. FIG. 3 is a cross-sectional view schematically showing the structure of the multilayer ceramic capacitor 10X shown in FIG. 1 taken along line III-III.

The multilayer ceramic capacitor 10X has a rectangular parallelepiped shape as a whole, and includes a main body 11 and a plurality of external electrodes protruding outward from the main body 11. In this embodiment, the plurality of external electrodes include a first external electrode 14a and a second external electrode 14b.

Here, the direction in which the dielectric layer 12 and internal electrodes 13a and 13b, which will be described later, are stacked is defined as the stacking direction T of the multilayer ceramic capacitor 10X, and the direction in which the pair of external electrodes 14a and 14b face each other is defined as the length direction. A direction perpendicular to both the length direction L and the stacking direction T is defined as the width direction W. Any two directions among the length direction L, the stacking direction T, and the width direction W are directions orthogonal to each other. Note that the stacking direction T is sometimes referred to as the thickness direction.

The size of the multilayer ceramic capacitor 10X is arbitrary, but for example, the dimensions in the length direction L, width direction W, and stacking direction T are 1.0 mm, 0.5 mm, and 0.5 mm, respectively, and are large. The sizes are, for example, 3.2 mm, 2.5 mm, and 2.5 mm.

The main body portion 11 has a rectangular parallelepiped shape, and has a first end surface 15a and a second end surface 15b facing each other in the length direction L, and a first main surface 16a and a second end surface facing each other in the stacking direction T. It has a main surface 16b, and a first side surface 17a and a second side surface 17b facing each other in the width direction W. Note that the "rectangular parallelepiped shape" includes not only a rectangular parallelepiped but also a rectangular parallelepiped with rounded corners and ridges.

As shown in FIGS. 2 and 3, the main body 11 includes a plurality of stacked dielectric layers 12 and a plurality of internal electrodes 13a and 13b. The internal electrodes 13a and 13b include a first internal electrode 13a and a second internal electrode 13b. More specifically, the main body portion 11 has a structure in which a plurality of first internal electrodes 13a and second internal electrodes 13b are alternately stacked with dielectric layers 12 in between in the stacking direction T.

The first internal electrode 13a and the second internal electrode 13b contain, for example, a metal such as Ni, Ag, Pd, Au, Cu, Ti, or Cr, or an alloy containing the above-mentioned metal as a main component. are doing. It is preferable that the first internal electrode 13a and the second internal electrode 13b contain the same ceramic material as the dielectric ceramic contained in the dielectric layer 12 as a common material.

The first internal electrode 13a is drawn out to the first end surface 15a of the main body portion 11. Further, the second internal electrode 13b is drawn out to the second end surface 15b of the main body portion 11.

In this embodiment, the first external electrode 14a is provided on the entire first end surface 15a of the main body portion 11, and extends from the first end surface 15a to the first main surface 16a and the second main surface. 16b, the first side surface 17a, and the second side surface 17b. The first external electrode 14a is electrically connected to the first internal electrode 13a exposed on the first end surface 15a.

In this embodiment, the second external electrode 14b is provided on the entire second end surface 15b of the main body portion 11, and extends from the second end surface 15b to the first main surface 16a and the second main surface. 16b, the first side surface 17a, and the second side surface 17b. The second external electrode 14b is electrically connected to the second internal electrode 13b exposed on the second end surface 15b.

As described above, the first external electrode 14a and the second external electrode 14b are each provided on the surface of the main body 11, and therefore protrude outward from the main body 11. In other words, the surfaces of the first external electrode 14a and the second external electrode 14b are located outside the surface of the main body portion 11.

The structures of the first external electrode 14a and the second external electrode 14b are arbitrary. In this embodiment, the first external electrode 14a and the second external electrode 14b each include a base electrode layer and a plating layer.

The base electrode layer includes, for example, metals such as Ni, Cu, Ag, Pd, Au, Ti, and Cr, or alloys containing these metals. The base electrode layer may contain a co-material made of the same or similar material as the material contained in the dielectric layer 12, or glass. When the base electrode layer contains a common material or glass, the content thereof is preferably 30% by volume or more and 70% by volume or less of the entire external electrode. The base electrode layer can be formed by applying a conductive paste to the surface of the main body portion 11 and baking it. The conductive paste can be applied by any method, for example, by dipping the main body 11 into the stored conductive paste.

The plating layer includes, for example, metals such as Cu, Ni, Ag, Pd, Ti, Cr, or Au, or alloys containing these metals as main components. The plating layer may be one layer or multiple layers. When a plurality of plating layers are used, for example, a two-layer structure including a Ni plating layer and a Sn plating layer is used.

Note that the configurations of the first external electrode 14a and the second external electrode 14b are not limited to the configuration described above, that is, the configuration consisting of a base electrode layer and a plating layer. For example, the first external electrode 14a and the second external electrode 14b may be plated electrodes made of plating, or may be sputtered electrodes formed by a sputtering method. As the material of the sputter electrode, for example, NiCr, NiCu, CuAgNi, etc. can be used. A plating layer may be formed on the sputter electrode.

The thickness of the first external electrode 14a and the second external electrode 14b is, for example, 3 μm or more and 30 μm or less. Among the surfaces of the first external electrode 14a and the second external electrode 14b, the size of the flat portion of the surface facing the mounting board is, for example, 0.5 mm x 0.3 mm or more.

(Method for manufacturing chip-type electronic components)
FIG. 4 is a flowchart for explaining a method for manufacturing a chip-type electronic component in one embodiment.

In step S1, an electronic component main body 10 on which a spacer is to be provided is prepared. The electronic component main body 10 can be manufactured by a known method.

In step S2 following step S1, the electronic component main body 10 is held so that the plurality of external electrodes 14a, 14b are exposed on the same side of the main body 11 (FIG. 5(a)). The electronic component main body 10 can be held by any method. As an example, as shown in FIG. 5A, the electronic component main body 10 is adhesively held by an adhesive substrate 20 whose holding surface 20a is adhesive. As described above, since the first external electrode 14a and the second external electrode 14b protrude outward from the main body 11, the holding surface 20a of the adhesive substrate 20 It adheres to the second external electrode 14b.

Here, "the same surface side of the main body part 11" refers to one of the surfaces of the main body part 11, and particularly refers to the side on which spacers are provided on the surfaces of the plurality of external electrodes 14a and 14b. . In FIG. 5A, a plurality of external electrodes 14a and 14b are exposed on the first main surface 16a side of the main body section 11, and the second main surface 16b side of the main body section 11 is held by the adhesive substrate 20. It shows the condition.

Note that the electronic component main body 10 can be held by a method using suction, magnetic force, etc., in addition to the above-mentioned adhesive. The holding surface of the holding jig that holds the electronic component main body 10 may be a flat surface or a rotatable roll surface. The holding jig having a roll surface can continuously supply a plurality of held electronic component bodies 10 onto an intaglio plate to be described later.

The holding jig preferably holds a plurality of electronic component bodies 10. In that case, for all electronic component bodies 10 held by the holding jig, the distances from the holding jig to the surfaces of the plurality of external electrodes 14a, 14b on which the spacers are provided need to be approximately the same. By holding the plurality of electronic component bodies 10 by the holding jig, it becomes possible to provide spacers to the plurality of electronic component bodies 10 at once, thereby improving productivity.

When the holding jig holds a plurality of electronic component bodies 10, the plurality of held electronic component bodies 10 may be arranged in a matrix shape or the like, or may be arranged randomly. When holding a plurality of electronic component bodies 10 with a holding jig, the holding jig may hold the plurality of electronic component bodies 10 at once, or may pick up and hold them one by one. .

In step S3 following step S2, metal paste 40 is supplied into the plurality of recesses 31 of the intaglio plate 30 having a plurality of recesses 31 (FIG. 5(b)).

The intaglio plate 30 is, for example, a flat plate having a flat surface or a roll plate having a roll surface. When the intaglio 30 is a rectangular flat plate, the size is, for example, 10 mm x 10 mm or more and 1000 mm x 1000 mm or less. Further, when the intaglio plate 30 is a roll plate, the width of the roll surface is, for example, 10 mm or more and 1000 mm or less. However, the intaglio plate 30 may be other than a flat plate or a roll plate, and the size is not limited to the above size.

The intaglio plate 30 is made of a material with at least a hard surface. The entire intaglio plate 30 may be made of a hard material. The hard material means, for example, a metal material having a tensile modulus of 30 GPa or more, and is, for example, at least one of stainless steel, aluminum, iron, and steel. The intaglio 30 has, for example, a rectangular shape in plan view. However, the shape of the intaglio 30 in plan view is not limited to a rectangle.

The recess 31 has one of a groove-like shape and a box-like shape. The groove-like shape is a groove having a pair of opposing side surfaces and extending in one direction. The groove may have a linear shape, or may have a shape other than a straight line, for example, a meandering shape extending in one direction. There is no particular restriction on the direction in which the groove extends, and it can be in any direction. The width of the groove is, for example, 50 μm or more and 100 μm or less.

The box-like shape is the shape of a box surrounded by a bottom and side surfaces. The shape of the box when viewed in a direction perpendicular to the bottom surface of the box can be any shape such as a rectangle, circle, oval, triangle, or hexagon. Moreover, the intaglio plate 30 may have a plurality of recesses 31 having different shapes. When the shape of the box when viewed in the direction perpendicular to the bottom surface of the box constituting the recess 31 is rectangular, the size of one side constituting the rectangle is, for example, 50 μm or more and 300 μm or less.

FIG. 6A is a plan view schematically showing an intaglio plate 30 having a plurality of groove-shaped recesses 31. In the example shown in FIG. 6A, the intaglio plate 30 is provided with a plurality of groove-shaped recesses 31 arranged in stripes at predetermined intervals. The depth of the groove-shaped recess 31 can be set to any desired depth, and is, for example, 10 μm or more and 300 μm or less.

FIG. 6(b) is a plan view schematically showing an intaglio plate 30 having a plurality of circular box-shaped recesses 31 when viewed from above. The depth of the recess 31 can be set to any desired depth, and is, for example, 10 μm or more and 300 μm or less.

FIG. 6C is a plan view schematically showing an intaglio plate 30 having a plurality of oval box-shaped recesses 31 when viewed from above. The depth of the recess 31 can be set to any desired depth, and is, for example, 10 μm or more and 300 μm or less.

In FIGS. 6A to 6C, the electronic component body 10 is shown superimposed on the intaglio 30 so that the relative size relationship between the recess 31 of the intaglio 30 and the electronic component body 10 can be seen. As will be described later, after supplying the metal paste 40 into the recesses 31 of the intaglio 30, each of the plurality of external electrodes 14a, 14b exposed on the same surface side of the main body 11 is connected to the plurality of recesses 31 of the intaglio 30. By contacting the metal paste 40 inside, the metal paste 40 is transferred to the plurality of external electrodes 14a and 14b. That is, the plurality of recesses 31 are provided in the intaglio 30 so that when the electronic component main body 10 is placed on the intaglio 30, each of the plurality of external electrodes 14a, 14b overlaps with the plurality of recesses 31 ( (See Figures 6(a) to (c)).

The metal paste 40 is used to form a spacer, and is mainly composed of an intermetallic compound containing at least one kind of high melting point metal selected from Cu and Ni, and Sn as a low melting point metal. As an example, 31.5 wt% of Cu-10 wt% Ni powder with D50 of 5 μm, 58.5 wt% of solder powder with the composition of Sn-3 wt% Ag-0.5 wt% Cu with D50 of 5 μm, and 10 wt% of flux. The material containing the metal is used as the metal paste 40. The viscosity of the metal paste 40 is from 100,000 mPa·s to 1,000,000 mPa·s at ^a shear rate of 0.1 s ⁻¹ and from 10,000 mPa·s to 100,000 mPa·s at a shear rate of 1 s −1 . However, the material and characteristics of the metal paste 40 are not limited to those described above.

The metal paste 40 can be supplied onto the intaglio 30 by any method. After the metal paste 40 is supplied onto the intaglio 30, the metal paste 40 on the intaglio 30 is scraped off with a squeegee 32, for example, as shown in FIG. 5(b). The scraping portion of the squeegee 32 is made of, for example, rubber with a hardness of 50 or more and 70 or less. However, the material of the scraping portion of the squeegee 32 is not limited to rubber, and may be metal. Thereby, the metal paste 40 is supplied only into the plurality of recesses 31 of the intaglio 30. That is, the metal paste 40 is supplied into the plurality of recesses 31 of the intaglio 30 up to the height of the surface of the intaglio 30, and the metal paste 40 is supplied to the positions on the surface of the intaglio 30 where the recesses 31 are not provided. , the metal paste 40 is removed and no longer exists.

Note that the step S3 may be performed before the step S2.

In step S4 following step S3, the held electronic component main body 10 is brought close to the intaglio plate 30, and each of the plurality of external electrodes 14a and 14b exposed on the same side of the main body part 11 is connected to the plurality of recesses 31 of the intaglio plate 30. By contacting the metal paste 40 inside, the metal paste 40 is transferred to the plurality of external electrodes 14a, 14b.

To explain with reference to FIG. 5, first, as shown in FIG. 5(c), the electronic component main body 10 held by the adhesive substrate 20 is brought close to the intaglio 30, and the electronic component main body 10 is exposed on the same side of the main body 11. Each of the plurality of external electrodes 14a and 14b is brought into contact with the metal paste 40 supplied into the plurality of recesses 31 of the intaglio plate 30. The speed at which the main body portion 11 is brought close to the intaglio 30 is, for example, 0.1 mm/s or more and 100 mm/s or less. Here, the surfaces of the plurality of external electrodes 14a and 14b exposed on the same side of the main body 11 are brought into contact with the surface of the intaglio 30, and are further pushed in by a predetermined distance. The predetermined distance is, for example, 0.3 mm. As a result, the metal paste 40 in the plurality of recesses 31 of the intaglio plate 30 comes into contact with the surfaces of the plurality of external electrodes 14a and 14b exposed on the same side of the main body part 11.

At this time, as shown in FIG. 5(c), the surface of the main body 11 located inside the surfaces of the plurality of external electrodes 14a and 14b does not contact the intaglio 30, so the metal paste is applied to the surface of the main body 11. does not adhere. In particular, in this embodiment, since the intaglio 30 is made of a hard material at least on its surface, even if the electronic component main body 10 contacts the surface of the intaglio 30 and is further pushed in a little, the surface of the intaglio 30 remains elastic. No deformation or plastic deformation. Therefore, adhesion of the metal paste 40 to the surface of the main body portion 11 can be further suppressed.

Subsequently, as shown in FIG. 5(d), the main body 11 held by the adhesive substrate 20 is held a little apart from the surface of the intaglio 30, for example, by 0.3 mm. The holding time is, for example, 3 seconds or more and 30 seconds or less. As a result, as shown in FIG. 5(d), the metal paste 40 attached to the surfaces of the plurality of external electrodes 14a, 14b spreads to a position that does not face the recess 31 among the surfaces of the plurality of external electrodes 14a, 14b. The metal paste 40 also adheres.

Note that with the electronic component main body 10 held by the adhesive substrate 20 in contact with the surface of the intaglio 30 or slightly away from the surface of the intaglio 30, the electronic component main body 10 is moved in a direction parallel to the surface of the intaglio 30. 10 may be made to swing. By rocking the electronic component main body 10, it is possible to promote the spread of the metal paste 40 attached to the surfaces of the plurality of external electrodes 14a, 14b, and more effectively spread the metal paste 40 adhering to the surfaces of the plurality of external electrodes 14a, 14b. The metal paste 40 can be attached to a position that does not face the recess 31 .

Finally, as shown in FIG. 5(e), the electronic component main body 10 held by the adhesive substrate 20 is pulled up. The speed at which the electronic component main body 10 is pulled up is, for example, 0.1 mm/s or more and 100 mm/s or less. As a result, the metal paste 40 is transferred to the plurality of external electrodes 14a and 14b.

Here, the step of transferring the metal paste 40 onto the plurality of external electrodes 14a, 14b may be performed multiple times. By performing the step of transferring the metal paste 40 to the plurality of external electrodes 14a, 14b multiple times, the thickness of the metal paste 40 attached to the plurality of external electrodes 14a, 14b can be increased, as shown in FIG. . Thereby, the height of the spacer provided on the surface of the plurality of external electrodes 14a, 14b can be increased. That is, by performing the step of transferring the metal paste 40 to the plurality of external electrodes 14a, 14b multiple times, the height of the spacer provided on the surface of the plurality of external electrodes 14a, 14b can be adjusted to an arbitrary height. It becomes possible. When the step of transferring the metal paste 40 to the plurality of external electrodes 14a, 14b is performed multiple times, at least one of drying and curing is performed on the transferred metal paste 40 each time the transfer is performed. You can do it like this.

Note that when a spacer is provided on a substrate or an external electrode of a chip-type electronic component by a method such as screen printing, the shape may be distorted due to the rheology of the metal paste or its own weight. However, in the method for manufacturing a chip-type electronic component in this embodiment, when the step of transferring the metal paste 40 to the plurality of external electrodes 14a, 14b is performed multiple times, the weight of the newly attached metal paste 40 is larger than the spacer. Since it acts in the direction of increasing height, deformation of the metal paste 40 can be suppressed.

In step S5 following step S4, at least one of drying and curing is performed on the metal paste 40 transferred to the plurality of external electrodes 14a and 14b. Drying can be performed, for example, by applying hot air or heating. The temperature of the hot air when hot air is applied and the heating temperature when heating are, for example, 100°C or more and 300°C or less. The metal paste 40 can be hardened by, for example, irradiation with infrared rays, irradiation with ultraviolet rays, irradiation with gamma rays, exposure to running water, or the like. The metal paste 40 that has been subjected to at least one of drying and curing becomes a spacer. Note that since the spacer has a shape that protrudes further outward with respect to the plurality of external electrodes 14a and 14b, it can also be called a protruding electrode.

Through the above steps, a chip type electronic component is manufactured in which spacers are provided on the surfaces of the plurality of external electrodes 14a, 14b of the electronic component main body 10, which has a plurality of external electrodes 14a, 14b protruding outward with respect to the main body 11. be done.

According to the method for manufacturing a chip-type electronic component in this embodiment, the electronic component main body 10 held so that the plurality of external electrodes 14a and 14b are exposed on the same side of the main body 11 is placed in the recess 31 using the metal paste 40. The plurality of exposed external electrodes 14a, 14b are transferred by bringing them close to the intaglio 30 supplied with the metal paste 40 in the plurality of recesses 31, so that the plurality of external electrodes 14a, 14b are transferred. It is possible to form spacers with high precision on the surface of. That is, when the plurality of external electrodes 14a, 14b protruding outward are brought into contact with the metal paste 40 in the recess 31 of the intaglio 30, the main body portion whose surface is located inside with respect to the plurality of external electrodes 14a, 14b. Since the metal paste 40 does not come into contact with the main body portion 11, it is possible to suppress the metal paste 40 from adhering to the main body portion 11.

Furthermore, since each of the plurality of external electrodes 14a and 14b is transferred by contacting the metal paste 40 in the plurality of recesses 31, compared to the case where the transfer is performed by contacting the metal paste in one recess 31, The amount of metal paste 40 to be transferred can be stabilized. Thereby, it is possible to suppress variations in quality of the formed spacers, and it is possible to manufacture high-quality chip-type electronic components.

In addition, since spacers are formed on the surfaces of the plurality of external electrodes 14a and 14b by transferring the metal paste 40, productivity is higher than that of the dispensing method, and high-precision positioning is possible using screen printing using a mask. There is no need for alignment. Therefore, the method for manufacturing a chip-type electronic component in this embodiment has higher productivity than the conventional dispensing method and screen printing method.

Here, in the conventional mounting method of providing multiple spacers on the mounting board and placing chip-type electronic components on the spacers, when the number of chip-type electronic components to be mounted is small, There will be spacers that are not used.

In contrast, in the method for manufacturing a chip-type electronic component according to the present embodiment, spacers are provided directly on the plurality of external electrodes 14a, 14b of the chip-type electronic component to be mounted, so that unnecessary spacers are not generated.

Furthermore, when a spacer is provided on the external electrode of a chip-type electronic component using the conventional screen printing method, metal paste may also adhere to the main body 11 due to positional deviation. In the component manufacturing method, as described above, adhesion of the metal paste 40 to the main body portion 11 can be suppressed.

Furthermore, when providing spacers using the conventional screen printing method, the height of the spacers is uniquely determined by the thickness of the mask. Therefore, it is not possible to provide a spacer whose height is lower than the mask thickness at the thinning limit, and it is impossible to provide a spacer whose height is higher than the mask thickness at the thickening limit. Further, in the dispensing method, it is possible to adjust the height of the spacer by adjusting the viscosity of the metal paste, but it is difficult to adjust the viscosity of the metal paste to a desired viscosity.

In contrast, in the method for manufacturing a chip-type electronic component according to the present embodiment, the shape, size, and depth of the recesses 31, the spacing between adjacent recesses 31, and the number of external electrodes 14a and 14b are adjusted using the metal inside the recesses 31. By adjusting the number of times the spacer is brought into contact with the paste 40, etc., the height of the spacer can be easily adjusted to an arbitrary height.

Further, in the method for manufacturing a chip-type electronic component according to the present embodiment, as described above, each of the plurality of external electrodes 14a, 14b is brought into contact with the metal paste 40 in the plurality of recesses 31 of the intaglio 30, and the metal paste is Since the transfer is performed by the stretching phenomenon of 40, it is possible to form a protruding spacer instead of a planar spacer. The protruding spacer can be formed by adjusting the pulling speed during transfer of the metal paste 40, the number of times of transfer, paste rheology such as the viscosity of the metal paste 40, and the like. The height of the protruding spacer is, for example, 30 μm or more and 120 μm or less. Furthermore, when the spacer has a shape such as a prism or a pyramid, the length of one side of the portion of the spacer in contact with the plurality of external electrodes 14a, 14 is, for example, 0.3 mm or more.

FIG. 8 is a diagram schematically showing an example of a chip-type electronic component 100 manufactured by the method for manufacturing a chip-type electronic component in this embodiment. In the chip type electronic component 100 shown in FIG. 8, the spacer 50 provided on the surfaces of the first external electrode 14a and the second external electrode 14b has a cylindrical shape. However, the spacer 50 can have any shape, such as a prism, a cone, or a pyramid, as long as it can be formed by the above-described manufacturing method. For example, the spacer 50 may have a shape such that the cross-sectional area of the spacer 50 when cut along a plane parallel to the first main surface 16a of the main body 11 gradually decreases as it moves away from the main body 11.

Spacer 50 can be provided for any purpose. For example, the purpose may be to suppress the sound called "squeak" that occurs when a voltage is applied to the chip-type electronic component 100 mounted on the board, or to effectively utilize the space in the height direction perpendicular to the board. It may be for the purpose.

FIG. 9 is a side view schematically showing a state in which the main body 11 is placed at a high position away from the substrate 60 by the spacer 50, and another electronic component 70 is mounted below the main body 11. Chip-type electronic component 100 and another electronic component 70 are each mounted on land electrodes 61 on substrate 60 via solder 62. With this arrangement, more electronic components can be mounted on the board 60.

The present invention is not limited to the above embodiments, and various applications and modifications can be made within the scope of the present invention. For example, the first external electrode 14a of the electronic component main body 10 is provided on the entire first end surface 15a of the main body portion 11, and extends from the first end surface 15a to the first main surface 16a and the second external electrode 14a. Although it has been described that it is provided so as to wrap around the main surface 16b, the first side surface 17a, and the second side surface 17b, the entire first end surface 15a, the first main surface 16a, and the second The structure may be such that it is provided on a part of at least one of the main surfaces 16b. The same applies to the second external electrode 14b.

Further, the first external electrode 14a may be provided only on a part of at least one of the first main surface 16a and the second main surface 16b. In that case, the main body portion 11 may be provided with a via conductor electrically connected to the plurality of first internal electrodes 13a, and the via conductor and the first external electrode 14a may be electrically connected. The same applies to the second external electrode 14b.

Alternatively, the first external electrode 14a and the second external electrode 14b may not be provided only on the surface of the main body portion 11 that faces the surface on which the spacer is provided.

10 Electronic component main body 10X Multilayer ceramic capacitor 11 Main body part 12 Dielectric layer 13a First internal electrode 13b Second internal electrode 14a First external electrode 14b Second external electrode 20 Adhesive substrate 30 Intaglio 31 Recess 32 Squeegee 40 Metal paste 50 Spacer 60 Substrate 61 Land electrode 62 Solder 100 Chip type electronic component

Claims (7)

A method for manufacturing a chip-type electronic component in which a spacer is provided on the surface of the external electrode of an electronic component body having a plurality of external electrodes protruding outward with respect to the main body, the method comprising:
a step of preparing the electronic component body;
holding the electronic component main body so that the plurality of external electrodes are exposed on the same side of the main body;
Supplying a metal paste into the plurality of recesses of an intaglio plate having a plurality of recesses;
By bringing the held electronic component main body close to the intaglio plate and bringing each of the plurality of external electrodes exposed on the same side of the main body portion into contact with the metal paste in the plurality of recesses of the intaglio plate. , transferring the metal paste to a plurality of the external electrodes;
A method for manufacturing a chip-type electronic component, comprising: 2. The method of manufacturing a chip-type electronic component according to claim 1, wherein the step of transferring the metal paste onto a plurality of the external electrodes is performed multiple times. The step of transferring the metal paste to the plurality of external electrodes includes a process of shaking the electronic component body after bringing each of the plurality of external electrodes into contact with the metal paste. The method for manufacturing a chip-type electronic component according to claim 1 or 2. 4. The method for manufacturing a chip-type electronic component according to claim 1, wherein the recess has one of a groove-like shape and a box-like shape. 5. The method for manufacturing a chip-type electronic component according to claim 1, wherein the intaglio plate is made of a material having at least a hard surface. 6. The method for manufacturing a chip-type electronic component according to claim 5, wherein the hard material is at least one of stainless steel, aluminum, iron, and steel. The chip mold according to any one of claims 1 to 6, further comprising the step of subjecting the metal paste transferred to the external electrode to at least one of drying and curing. Method of manufacturing electronic components.

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