JP2023142485A - Display body and sheet for sealing optical semiconductor element - Google Patents

Abstract

To provide a display body which hardly causes brightness unevenness and has high brightness.SOLUTION: A display body 1 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and a sealing resin layer 4 for sealing the plurality of optical semiconductor elements 3a to 3c. The sealing resin layer 4 includes a diffusion function layer 41 and a non-diffusion function layer 42. When a distance between the surface of the substrate 2 and an end TA on a front side of a center GA of gravity of the optical semiconductor element 3a is represented by LA, a distance between the surface of the substrate 2 and an end TC on a front side of the diffusion function layer 41 in a vertical line PC relative to the surface of the substrate 2 passing through a middle point C of the center GA of gravity of the optical semiconductor element 3a, and a center GB of gravity of the adjacent optical semiconductor element 3b in the same pixel 3 as the optical semiconductor element 3a is represented by LC, a distance between a vertical line PA relative to the surface of the substrate 2 passing through the end TA and the vertical line PC relative to the surface of the substrate 2 passing through the end TC is represented by LA-C, and an angle of an elevation angle from the end TA to the vertical line PC is represented by θ°, the display body satisfies the following expression (1): LC≤LA+LA-Ctanθ.SELECTED DRAWING: Figure 2

Description

The present invention relates to a display body and a sheet for sealing optical semiconductor elements. More specifically, the present invention relates to a display body in which an optical semiconductor element of, for example, a self-luminous display device is sealed, and a sheet suitable for use in sealing the optical semiconductor element.

In recent years, self-luminous display devices typified by mini/micro LED display devices (Mini/Micro Light Emitting Diode Displays) have been devised as next-generation display devices. The basic configuration of mini/micro LED display devices is to use a substrate on which many minute optical semiconductor elements (LED chips) are arranged at high density as a display panel, and the optical semiconductor elements are sealed with a sealing material. , a cover member such as a resin film or a glass plate is laminated on the outermost layer.

In a display body including a self-luminous display device such as a mini/micro LED display device, wiring (metal wiring) made of metal or a metal oxide such as ITO is arranged on a substrate of a display panel. Such display devices have a problem in that, for example, when the lights are turned off, light is reflected by the metal wiring and the like, resulting in poor screen appearance and poor design. For this reason, a technique has been adopted that uses an antireflection layer to prevent reflection from metal wiring as a sealing material for sealing an optical semiconductor element.

Furthermore, displays using self-luminous display devices have a problem in that uneven brightness (luminance unevenness) occurs due to the light source of the optical semiconductor element. When brightness unevenness occurs, a phenomenon called "color shift" occurs, in which the color tone changes when the display is viewed from the front and when viewed from an oblique viewing angle.

Patent Document 1 describes a laminate of a colored adhesive layer and a colorless adhesive layer as an adhesive sheet capable of suppressing brightness unevenness, and the colorless adhesive layer is positioned so as to be in contact with an optical semiconductor element. A pressure-sensitive adhesive sheet is disclosed. According to the above-mentioned adhesive sheet, when the colorless adhesive layer contacts and follows the uneven shape formed by the substrate and the optical semiconductor element installed on the substrate, the colorless adhesive layer comes into contact with the unevenness, and the colorless adhesive layer Since the unevenness is absorbed to some extent by the layer, the colored adhesive layer is prevented from being compressed or deformed, thereby suppressing uneven transmittance in the adhesive layer and suppressing uneven brightness. Are listed.

JP2020-169262A

However, although adhesive sheets with colored adhesive layers are expected to have the effect of preventing reflections from metal wiring and suppressing uneven brightness when optical semiconductor elements are sealed, This impedes transmission in diagonal directions, resulting in a problem in that the front brightness of the display decreases. When front brightness decreases, power consumption increases to increase brightness. Therefore, there is a need for a display body that has high brightness while being less likely to cause uneven brightness.

The present invention was conceived under these circumstances, and its purpose is to provide a display body that is less likely to cause uneven brightness and has high brightness. Another object of the present invention is to provide a sheet for encapsulating a semiconductor element that is less likely to cause uneven brightness and can produce a display body with high brightness by encapsulating an optical semiconductor element.

As a result of intensive studies to achieve the above object, the present inventors found that in a state in which a plurality of optical semiconductor elements arranged on a substrate are sealed with a sealing resin layer including a diffusion functional layer and a non-diffusion functional layer, A structure in which the height of the front end of the diffusion functional layer in the center between two nearest optical semiconductor elements is less than a certain height with respect to the height of the front end of the optical semiconductor element. It has been found that the display body having the present invention is less likely to have uneven brightness and has high brightness. The present invention was completed based on these findings.

That is, the present invention is a display body comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements,
The sealing resin layer includes a diffusion functional layer and a non-diffusion functional layer,
The distance from the substrate surface to the front end T _A of the center of gravity of the first optical semiconductor element is L _A ,
A line perpendicular to the substrate surface passes from the substrate surface to the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel. The distance to the front end T _C of the diffusion functional layer is L _C ,
The distance from the perpendicular to the substrate passing through the end T _A to the perpendicular to the substrate passing through the end T _C is L _AC ,
Provided is a display that satisfies the following formula (1), where the angle of elevation from the end T _A to the perpendicular to the substrate passing through the end T _C is θ°.
L _C ≦L _A +L _AC tanθ (1)

In the display, the sealing resin layer that seals the optical semiconductor element includes the diffusion functional layer, so that the light emitted by the optical semiconductor element is diffused in the diffusion functional layer, thereby increasing front brightness. In addition, brightness unevenness can be further suppressed. The distance L _C , which is the height of the front end of the diffusion functional layer at the center between the nearest optical semiconductor elements, is the distance L _A , which is the height of the front end of the center of gravity of the optical semiconductor element. By being below a position higher than L _AC tan θ, it is sufficiently low depending on the distance between the optical semiconductor elements, and the light emitted by the optical semiconductor elements, for example, the light emitted from the side in addition to the light emitted from the front, is absorbed by the diffusion functional layer. can be sufficiently diffused, light can be transmitted over a sufficiently wide field of view, uneven brightness can be suppressed, and the front brightness of the display can be increased.

The height of the optical semiconductor element on the substrate is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer has excellent followability to the uneven shape formed by the optical semiconductor element and the substrate surface.

It is preferable that the above-mentioned diffusion functional layer has adhesiveness. With such a configuration, the sealing resin layer can easily seal the optical semiconductor element, and also has excellent adhesion between each layer, resulting in more excellent sealing properties of the optical semiconductor element.

Preferably, the display body includes a self-luminous display device.

It is preferable that the display body is an image display device.

The present invention also provides a sheet for sealing a plurality of optical semiconductor elements arranged on a substrate, comprising:
The sheet includes a sealing resin layer including a diffusion functional layer and a non-diffusion functional layer,
When a sealing resin layer is formed by sealing the plurality of optical semiconductor elements with the sealing resin layer,
The distance from the substrate surface to the front end T _A of the center of gravity of the first optical semiconductor element is L _A ,
A line perpendicular to the substrate surface passes from the substrate surface to the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel. The distance to the front end T _C of the diffusion functional layer is L _C ,
The distance from the perpendicular to the substrate passing through the end T _A to the perpendicular to the substrate passing through the end T _C is L _AC ,
Provided is a sheet for encapsulating an optical semiconductor element that can satisfy the following formula (1), where the angle of elevation from the end T _A to the perpendicular to the substrate passing through the end T _C is θ°.
L _C ≦L _A +L _AC tanθ (1)

It is preferable that the above-mentioned diffusion functional layer has adhesiveness.

According to the display of the present invention, brightness unevenness due to light emitted by the optical semiconductor element is less likely to occur, and the brightness is high. Therefore, in the display, color shift is unlikely to occur and the display can be viewed with the same color from a wide field of view. Further, the display body is bright and has a good appearance without increasing power consumption. Moreover, according to the sheet for encapsulating an optical semiconductor element of the present invention, by sealing the optical semiconductor element, it is possible to provide a display body with high brightness and less chance of uneven brightness.

FIG. 2 is a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged in units of pixels on a substrate. 1 is a partial sectional view showing an embodiment of a display body of the present invention. 3 is a partially enlarged view of the display body shown in FIG. 2. FIG. FIG. 3 is a partial cross-sectional view showing how the optical semiconductor element of the display shown in FIG. 2 emits light. FIG. 2 is a partial cross-sectional view showing how an optical semiconductor element of a conventional display emits light. It is a partial sectional view showing another embodiment of the display of the present invention. FIG. 7 is a partial cross-sectional view showing still another embodiment of the display body of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows one Embodiment of the sheet for optical semiconductor element sealing of this invention. FIG. 9 is a partial cross-sectional view showing a process of sealing an optical semiconductor element using the optical semiconductor element sealing sheet shown in FIG. 8;

[Display]
The display of the present invention includes at least a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements. The display body is a device for displaying information using light emitted by an optical semiconductor element.

Examples of the optical semiconductor device include light emitting diodes (LEDs) such as blue light emitting diodes, green light emitting diodes, red light emitting diodes, and ultraviolet light emitting diodes.

On the substrate, the plurality of optical semiconductor elements are arranged in one pixel, and a plurality of the pixels are arranged. That is, a plurality of the above-mentioned optical semiconductor elements are arranged for each pixel including a plurality of optical semiconductor elements. FIG. 1 shows a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged for each pixel on a substrate. In the optical member 11 shown in FIG. 1, three optical semiconductor elements 3a to 3c are arranged close to each other on a substrate 2, and one pixel (pixel 3) is formed by the three optical semiconductor elements 3a to 3c. ing. Furthermore, three optical semiconductor elements 3d to 3f are arranged close to each other on the substrate 2, and the three optical semiconductor elements 3d to 3f form one pixel (pixel 3'). A plurality of pixels, such as pixel 3 and pixel 3', are arranged on the substrate 2.

The display body of the present invention is formed of a substrate and an optical semiconductor element, with a concave portion on the surface of the substrate and a convex portion on the optical semiconductor element in an area where the optical semiconductor element is not placed between two closest optical semiconductor elements. It has an uneven shape.

The height of the optical semiconductor element on the substrate (the height from the substrate surface to the front end of the optical semiconductor element, which corresponds to _LA described later) is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer has better followability with respect to the uneven shape.

It is preferable that the sealing resin layer contacts the plurality of optical semiconductor elements and follows the uneven shape. Further, it is preferable that the sealing resin layer seals the plurality of optical semiconductor elements at once. In this specification, "sealing the optical semiconductor element" refers to embedding at least a portion of the optical semiconductor element in a sealing resin layer, or following and covering it with the sealing resin layer. say.

The sealing resin layer includes at least a diffusion functional layer and a non-diffusion functional layer. In the sealing resin layer, the diffusion functional layer and the non-diffusion functional layer may be directly laminated, or may be laminated via another layer. The sealing resin layer may seal the optical semiconductor element so that the diffusion functional layer side faces the optical semiconductor element side, or the optical semiconductor element so that the non-diffusion functional layer side faces the optical semiconductor element side. may be sealed.

Any one of the plurality of optical semiconductor elements is defined as a first optical semiconductor element. An optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is referred to as a second optical semiconductor element. Let L _A be the distance from the substrate surface to the front end T _A of the center of gravity of the first optical semiconductor element. From the substrate surface to the front end T _C of the diffusion functional layer in a line perpendicular to the substrate surface passing through the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element. Let the distance be L _C. Let L _AC be the distance from a line perpendicular to the substrate surface passing through the end T _A to a line perpendicular to the substrate surface passing through the end T _C . The angle of elevation from the end T _A to the perpendicular to the substrate surface passing through the end T _C is θ°. At this time, the display of the present invention satisfies the following formula (1).
L _C ≦L _A +L _AC tanθ (1)

In the display, the sealing resin layer that seals the optical semiconductor element includes the diffusion functional layer, so that the light emitted by the optical semiconductor element is diffused in the diffusion functional layer, thereby increasing front brightness. In addition, brightness unevenness can be further suppressed. The distance L _C , which is the height of the front end of the diffusion functional layer at the center between the nearest optical semiconductor elements, is the distance L _A , which is the height of the front end of the center of gravity of the optical semiconductor element. By being below a position higher than L _AC tan θ, it is sufficiently low depending on the distance between the optical semiconductor elements, and the light emitted by the optical semiconductor elements, for example, the light emitted from the side in addition to the light emitted from the front, is absorbed by the diffusion functional layer. can be sufficiently diffused, light can be transmitted over a sufficiently wide field of view, uneven brightness can be suppressed, and the front brightness of the display can be increased.

Note that in this specification, the "front" refers to the side from which the display body is viewed, and for example, in FIG. 2, which will be described later, is the upward direction.

(First embodiment)
The display of the present invention will be explained using the display shown in FIG. 2, which is one embodiment thereof. The display body 1 shown in FIG. 2 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and a sealing resin layer 4 that collectively seals these optical semiconductor elements 3a to 3c. , and a base material portion 5 bonded to the surface of the sealing resin layer 4 on the side opposite to the optical semiconductor elements 3a to 3c side. FIG. 2 is an enlarged view of a cross section perpendicular to the substrate 2 passing through the centers of gravity of the optical semiconductor elements 3a to 3c.

The optical semiconductor elements 3a to 3c are each fixed on one substrate 2 by a support 31. The display body 1 includes a substrate 2 and an optical semiconductor element, with a concave portion N formed on the surface of the substrate 2 in an area where no optical semiconductor element is arranged between the optical semiconductor elements 3a to 3c, and a convex portion P formed on the optical semiconductor elements 3a to 3c. It has an uneven shape formed by 3a to 3c.

The optical semiconductor elements 3a to 3c in FIG. 2 are the optical semiconductor elements 3a to 3c shown in FIG. 1, and the optical semiconductor elements 3a to 3c are located within the same pixel 3. For example, the optical semiconductor element 3a is a first optical semiconductor element, and the optical semiconductor element 3b is a second optical semiconductor element adjacent to the optical semiconductor element 3a.

As shown in FIG. 2, the sealing resin layer 4 contacts the plurality of optical semiconductor elements 3a to 3c, follows the above-mentioned uneven shape, and seals the plurality of optical semiconductor elements 3a to 3c all at once. .

The sealing resin layer 4 is constructed by directly laminating a diffusion functional layer 41 and a non-diffusion functional layer 42, and the optical semiconductor elements 3a to 3c are stacked so that the diffusion functional layer 41 side is the optical semiconductor elements 3a to 3c side. It's sealed. The diffusion function layer 41 in contact with the optical semiconductor elements 3a to 3c follows the above-mentioned uneven shape, and the diffusion function layer 41 in the display body 1 also has an uneven shape. On the other hand, one surface of the non-diffusion functional layer 42 has an uneven shape that is opposite to the uneven shape of the diffusion functional layer 41 by following the uneven shape of the diffusion functional layer 41, and the other surface is flat. It has become.

That is, the sealing resin layer 4 includes a diffusion functional layer 41 and a non-diffusion functional layer 42 in this order from the optical semiconductor element side 3a to 3c. Further, the sealing resin layer 4 seals the optical semiconductor elements 3a to 3c such that the diffusion function layer 41 contacts the optical semiconductor elements 3a to 3c.

FIG. 3 shows a partially enlarged view of the area between the optical semiconductor elements 3a and 3b of the display body 1 shown in FIG. 2. As shown in FIG. 3, in the display 1, the distance from the surface of the substrate 2 to the end T _A on the front side of the center of gravity G _A of the optical semiconductor element 3a is defined as L _A . L _A corresponds to the height of the optical semiconductor element 3a. A perpendicular line to the surface of the substrate 2 passing through the center of gravity G _A of the optical semiconductor element 3a is defined as a perpendicular line P _A . The end T _A is the intersection of a perpendicular line P _A passing through the center of gravity G _A to the surface of the substrate 2 and the front surface of the optical semiconductor element 3 a. Let C be the midpoint between the center of gravity G _A of the optical semiconductor element 3a and the center of gravity G _B of the optical semiconductor element 3b. A perpendicular line passing through the midpoint C to the surface of the substrate 2 is defined as a perpendicular line P _C . The distance from the perpendicular line P _C to the front end T _C of the diffusion functional layer 41 is defined as L _C. The end portion T _C is the intersection of the perpendicular line P _C and the front-side interface of the diffusion functional layer 21, and corresponds to the height from the surface of the substrate 2 at the midpoint C to the front-side interface of the diffusion functional layer 21. The end portion T _C may be located closer to the substrate 2 (lower side in the drawing) than the midpoint C, or may be located on the front side (upper side in the drawing). Let L _AC be the distance from perpendicular line P _A to perpendicular line P _C. Perpendicular line P _A and perpendicular line P _C are parallel. When the angle of elevation from the end T _A to the perpendicular P _C is θ°, the display 1 satisfies the above formula (1). In FIG. 3, a point at a height of L _A +L _AC tanθ from the surface of the substrate 2 on the perpendicular line P _C is indicated by T.

In the display body 1, the sealing resin layer 4 that seals the optical semiconductor elements 3a to 3c includes the diffusion function layer 41, so that the light emitted by the optical semiconductor elements 3a to 3c is diffused in the diffusion function layer 41, and the front Brightness can be made higher, and brightness unevenness can be further suppressed. The distance L _C , which is the height of the front end T _C of the diffusion functional layer 41 at the center between the nearest optical semiconductor elements 3a and 3b, is the front end of the center of gravity G _A of the optical semiconductor element 3a. By being below the position L _AC tan θ higher than the distance L _A which is the height of the portion T _A , it is sufficiently low according to the distance between the optical semiconductor elements 3a and 3b, and the light emitted by the optical semiconductor element 3a, for example, from the front. The diffusion function layer 41 can sufficiently diffuse the light emitted from the side as well as the light emitted from the side, and the light can be transmitted over a sufficiently wide field of view, suppressing brightness unevenness, and reducing the front brightness of the display 1. can be made higher.

In FIG. 3, a case has been described in which the optical semiconductor element 3a located at one end of the pixel satisfies the above formula (1), but in addition to or in place of this case, the optical semiconductor element 3a located at one end of the pixel When the semiconductor element is the first optical semiconductor element and the optical semiconductor element adjacent to the optical semiconductor element inside the pixel such as the optical semiconductor element 3a and/or the optical semiconductor element 3c is the second optical semiconductor element, the above formula ( 1) may be satisfied, and the optical semiconductor element located at the other end of the pixel, such as the optical semiconductor element 3c, is the first optical semiconductor element, and the optical semiconductor element located at the other end of the pixel, such as the optical semiconductor element 3b, The above formula (1) may be satisfied when an optical semiconductor element adjacent to the element is used as a second optical semiconductor element.

Furthermore, it is preferable that the above formula (1) be satisfied for all optical semiconductor elements in the same pixel in relation to all adjacent optical semiconductor elements. In this case, for example, the diffusion functional layer 41 can sufficiently diffuse the light emitted by all the optical semiconductor elements 3a to 3c in the same pixel shown in FIG. 2, for example, the light emitted from the side in addition to the light emitted from the front. Light can be transmitted over a sufficiently wide field of view, uneven brightness can be suppressed, and the front brightness of the display 1 can be further increased.

Specifically, as shown in FIG. 4, in addition to the frontal lights F _A , F _B , and F _C emitted by the optical semiconductor elements 3a to 3c, the side light L emitted by the optical semiconductor elements 3a to 3c. _A , R _A , L _B , R _B , L _C , and R _C are diffused within the diffusion functional layer 41, and more light is emitted in the front direction and diagonal direction, and the light is uniformly and efficiently emitted toward the front side. Ru. This allows light to be transmitted over a sufficiently wide field of view, suppressing uneven brightness, and increasing the front brightness of the display.

On the other hand, FIG. 5 shows an embodiment of a conventional display body. The display shown in FIG. 5 includes a non-diffusing functional layer 42 and a diffusing functional layer 41 in order from the optical semiconductor element side, and the front side interface of the diffusing functional layer 41 between the optical semiconductor elements 3a and 3b is arranged between the optical semiconductor elements 3a and 3b. 3c, and does not satisfy the above formula (1). In the display shown in FIG. 5, side lights L _A , R _A , L _B , R _B , L _C , and _RC emitted by the optical semiconductor elements 3 a to 3 c are emitted into the non-diffusion functional layer 42 . Therefore, the light is not diffused, and there is little light in the front direction and diagonal direction. Therefore, the brightness in front of the display is low, and the light emitted by the optical semiconductor element cannot be sufficiently transmitted to the front of the display over a wide field of view, which may cause uneven brightness. On the other hand, if the display body of the present invention satisfies the above formula (1), it can have high front brightness and excellent suppression of brightness unevenness.

In this way, the display of the present invention satisfies the above formula (1), so that the height of the diffusion function layer between the optical semiconductor elements is sufficiently low according to the distance between the optical semiconductor elements, and the optical semiconductor elements are Light emitted in the side direction is easily diffused in the front direction and oblique front direction, and the light can be transmitted over a sufficiently wide field of view, suppressing brightness unevenness and increasing the front brightness of the display.

The value of θ is not particularly limited, and is appropriately set depending on the field of view in which uneven brightness of the display body is to be suppressed. θ is, for example, 0° or more and less than 90°, preferably 45° or less, more preferably 30° or less, and may be 25° or less or 20° or less, particularly preferably 15° or less. When θ is within the above range, brightness unevenness is suppressed over a wide field of view. Therefore, in the above formula (1), θ is preferably 45°, 30°, 25°, 20°, or 15°, and may be 0° (in this case, L _C ≦L _A ).

The center of gravity of the optical semiconductor element (the center of gravity G _A of the optical semiconductor element 3a in FIG. 3, the center of gravity G _B of the optical semiconductor element 3b, etc.) is determined by the three-dimensional shape of the optical semiconductor element. The three-dimensional shape of the optical semiconductor element is not particularly limited, and examples include prismatic shapes such as cubes and rectangular parallelepipeds, truncated pyramids, cylinders, truncated cones, and shapes with dome-shaped upper portions. When the three-dimensional shape of the optical semiconductor element is a regular prism, the center of gravity is the center of the optical semiconductor element.

Note that the display body 1 does not need to include the base material portion 5. Furthermore, the number of optical semiconductor elements within one pixel does not have to be three and is not particularly limited.

(Second embodiment)
Another embodiment (second embodiment) of the display body of the present invention is shown in FIG. Similar to FIG. 2, the display body 1 shown in FIG. 6 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and the optical semiconductor elements 3a to 3c are sealed together. It includes a sealing resin layer 4 and a base member 5 bonded to the surface of the sealing resin layer 4 on the side opposite to the optical semiconductor elements 3a to 3c side.

In the display body 1 shown in FIG. 6, the sealing resin layer 4 is composed of a non-diffusion functional layer 43, a diffusion functional layer 41, and a non-diffusion functional layer 42 stacked in order from the optical semiconductor elements 3a to 3c side. The optical semiconductor elements 3a to 3c are sealed such that the non-diffusion functional layer 43 side is on the optical semiconductor elements 3a to 3c side, and the non-diffusion functional layer 43 is in contact with the optical semiconductor elements 3a to 3c. .

The non-diffusion functional layer 43 in contact with the optical semiconductor elements 3a to 3c follows the above-mentioned uneven shape, and one surface of the diffusion functional layer 41 follows the uneven shape of the non-diffusion functional layer 43, so that the non-diffusion functional layer 43 becomes a non-diffusion functional layer. It has a concavo-convex shape opposite to that of 43, and the other surface is flat. Both surfaces of the non-diffusion functional layer 42 in contact with the diffusion functional layer 41 are flat. The display body 1 shown in FIG. 6 also satisfies the above formula (1). Others are the same as the display body 1 shown in FIG.

(Third embodiment)
Another embodiment (third embodiment) of the display body of the present invention is shown in FIG. Similar to FIG. 2, the display body 1 shown in FIG. 7 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and a plurality of optical semiconductor elements 3a to 3c that are sealed together. It includes a sealing resin layer 4 and a base member 5 bonded to the surface of the sealing resin layer 4 on the side opposite to the optical semiconductor elements 3a to 3c side.

In the display body 1 shown in FIG. 7, the sealing resin layer 4 is composed of a diffusion functional layer 41, a colored layer 44, and a non-diffusion functional layer 42 stacked in order from the optical semiconductor elements 3a to 3c side. The optical semiconductor elements 3a to 3c are sealed such that the diffusion functional layer 41 side is on the optical semiconductor elements 3a to 3c side, and the diffusion functional layer 41 is in contact with the optical semiconductor elements 3a to 3c.

The diffusion function layer 41 in contact with the optical semiconductor elements 3a to 3c follows the uneven shape, and the diffusion function layer 41 in the display body 1 also has an uneven shape. The colored layer 44 has one surface that follows the uneven shape of the diffusion functional layer 41 and has an uneven shape that is opposite to the uneven shape of the diffusion functional layer 41, and the other surface is a flat surface. Both surfaces of the diffusion functional layer 42 in contact with the colored layer 44 are flat. The display body 1 shown in FIG. 7 also satisfies the above formula (1). Others are the same as the display body 1 shown in FIG.

The cross-sectional views of the display body shown in FIGS. 2 to 7 are obtained by, for example, cutting the display body in a cooled state perpendicularly to the substrate surface so as to pass through the center of gravity of a plurality of optical semiconductor elements to expose the cross section. You can get it. By cooling the display, it is possible to prevent the sealing resin layer from melting or deforming due to the heat generated during cutting. The cutting can be performed using a known or commonly used cutting device such as laser beam irradiation or ion beam irradiation. Further, after cutting, the exposed cross section may be milled to expose a cross section with a lower degree of deformation. The temperature during cooling is appropriately set within a range that suppresses the degree of deformation of the sealing resin layer and cracking of the display body.

<Sealing resin layer>
The sealing resin layer includes at least the diffusion functional layer and the non-diffusion functional layer. Each of the layers constituting the sealing resin layer (the diffusion functional layer, the non-diffusion functional layer, etc.) may be a single layer within the sealing resin layer, or may be a multilayer layer having the same or different compositions. It may be. When multiple diffusion functional layers and non-diffusion functional layers are included, the multiple layers may be laminated in contact with each other, or may be laminated in isolation. Further, the total number of layers constituting the sealing resin layer is two or more including the diffusion functional layer and the non-diffusion functional layer, and may be three or more. The total number of the layers is, for example, 10 or less, and may be 5 or less, or 4 or less, from the viewpoint of reducing the thickness of the display body.

In the display of the present invention, the sealing resin layer preferably includes the diffusion functional layer and the non-diffusion functional layer in this order from the optical semiconductor element side. By having such a configuration, the surface of the diffusion functional layer having an uneven shape is prevented from being exposed to the surface of the sealing resin layer on the front side (the side opposite to the optical semiconductor element side), and the sealing on the front side is prevented. The surface of the resin layer tends to be flat, making it difficult for diffuse reflection of external light to occur, and improving the appearance of the display both when the lights are off and when the lights are on. In the display body 1 shown in FIGS. 2, 6, and 7, the sealing resin layer 4 includes a diffusion functional layer 41 and a non-diffusion functional layer 42 in this order from the optical semiconductor elements 3a to 3c side.

The sealing resin layer may include a colored layer. When a colored layer is included, reflection of light from metal wiring provided on the substrate can be prevented. In the display body 1 shown in FIG. 7, the sealing resin layer 4 includes a colored layer 44.

When the sealing resin layer includes the colored layer, the sealing resin layer preferably includes the diffusion functional layer, the colored layer, and the non-diffusion functional layer in this order from the optical semiconductor element side. . By having such a configuration, it is possible to further improve the appearance of the display body both when the display is not lit and when it is lit, while increasing the front luminance and further suppressing unevenness in luminance.

In the display of the present invention, it is preferable that at least one surface (particularly the surface facing the optical semiconductor element) of the diffusion functional layer has an uneven shape that follows the above-mentioned uneven shape. In this case, the display of the present invention easily satisfies the above formula (1). Further, the front side surface of the diffusion function layer may have an uneven shape that follows the above-mentioned uneven shape. In the display body 1 shown in FIGS. 2 and 7, the diffusion functional layer 41 has an uneven shape on both the front side and the optical semiconductor element side. In the display 1 shown in FIG. 6, the diffusion functional layer 41 has an uneven shape only on the surface facing the optical semiconductor element, and the surface on the front side is flat.

In the display of the present invention, it is preferable that the non-diffusion functional layer located on the front side of the diffusion functional layer has a flat surface. In this case, diffuse reflection of external light is less likely to occur on the surface of the sealing resin layer, and the appearance of the display body is improved both when not lit and when lit. In the display body 1 shown in FIGS. 2, 6, and 7, the front side of the non-diffusion functional layer 42 is flat.

When the display of the present invention includes the colored layer, it is preferable that at least one surface (particularly the surface facing the optical semiconductor element) of the colored layer has an uneven shape that follows the uneven shape. In this case, the front brightness becomes higher. In the display body 1 shown in FIG. 7, the colored layer 44 has an uneven shape only on the surface on the optical semiconductor element side, and the surface on the front side is flat.

In the display of the present invention, the non-diffusion functional layer may be provided closer to the optical semiconductor element than the diffusion functional layer. That is, the sealing resin layer may include the non-diffusion functional layer and the diffusion functional layer in this order from the optical semiconductor element side. Further, when the non-diffusion functional layer is provided closer to the optical semiconductor element than the diffusion functional layer, it is preferable that both surfaces of the non-diffusion functional layer have an uneven shape that follows the uneven shape. With such a configuration, the diffusion functional layer tends to have an uneven shape. In the display body 1 shown in FIG. 6, the sealing resin layer 4 includes a non-diffusion functional layer 43 and a diffusion functional layer 41 in this order from the optical semiconductor elements 3a to 3c side, and both surfaces of the non-diffusion functional layer 43 have the above-mentioned uneven shape. It has an uneven shape that follows.

Each layer constituting the sealing resin layer may or may not have adhesiveness independently. Among these, it is preferable to have adhesiveness. With such a configuration, the sealing resin layer can easily seal the optical semiconductor element, and also has excellent adhesion between each layer, resulting in more excellent sealing properties of the optical semiconductor element. In particular, it is preferable that at least the layer that contacts the optical semiconductor element has adhesiveness. With such a configuration, the sealing resin layer has excellent followability and embeddability of the optical semiconductor element. As a result, the design is excellent even when the height difference due to the optical semiconductor element is high. Note that the layers other than the layer that contacts the optical semiconductor element do not need to have adhesiveness. In this case, adhesion between adjacent encapsulating resin layers is low in the tiling state, and adjacent small-sized laminates (laminates in which optical semiconductor elements placed on a substrate are encapsulated by encapsulating resin layers) When separating them, damage to the sealing resin layer and adhesion of adjacent sealing resin layers is less likely to occur.

(diffusion functional layer)
The above-mentioned diffusion functional layer is a layer whose purpose is to diffuse light. The diffusion functional layer is preferably a resin layer made of resin.

The diffusion functional layer is preferably a non-colored layer different from the colored layer. The above-mentioned non-colored layer is a layer that is not intended to prevent light reflection from metal wiring provided on a substrate in a display body. The non-colored layer may be a colorless layer or may be slightly colored.

The content of the colorant in the diffusion functional layer is preferably less than 0.2% by mass, more preferably less than 0.1% by mass, and even more preferably 0.05% by mass, based on the total amount of the diffusion functional layer 100% by mass. %, and may be less than 0.01% by weight or less than 0.005% by weight.

The above-mentioned diffusion functional layer preferably includes, but is not limited to, light-diffusing fine particles. That is, the above-mentioned diffusion functional layer preferably contains light-diffusing fine particles dispersed in the resin layer. The above-mentioned light-diffusing fine particles may be used alone or in combination of two or more.

The light-diffusing fine particles have an appropriate refractive index difference with the resin constituting the diffusion functional layer, and impart diffusion performance to the diffusion functional layer. Examples of the light-diffusing fine particles include inorganic fine particles and polymer fine particles. Examples of the material for the inorganic fine particles include silica, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxides. Examples of the material of the polymer fine particles include silicone resin, acrylic resin (including polymethacrylate resin such as polymethyl methacrylate), polystyrene resin, polyurethane resin, melamine resin, polyethylene resin, and epoxy resin. .

As the polymer fine particles, fine particles made of silicone resin are preferable. Further, as the inorganic fine particles, fine particles made of metal oxide are preferable. As the metal oxide, titanium oxide and barium titanate are preferable, and titanium oxide is more preferable. By having such a configuration, the light diffusing property of the above-mentioned diffusion functional layer is more excellent, and brightness unevenness is further suppressed.

The shape of the light-diffusing fine particles is not particularly limited, and may be, for example, perfectly spherical, flat, or irregularly shaped.

The average particle diameter of the light-diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, even more preferably 0.2 μm or more, particularly preferably 0. .25 μm or more. Furthermore, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the average particle diameter of the light-diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, and still more preferably 8 μm or less. It is. The average particle diameter can be measured using, for example, a Coulter counter.

The refractive index of the light-diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, even more preferably 1.3 to 4, particularly preferably 1.35 to 3.

The absolute value of the difference in refractive index between the light-diffusing fine particles and the resin constituting the diffusion functional layer (the resin layer excluding the light-diffusing fine particles in the diffusion functional layer) more efficiently reduces uneven brightness of the display. From the viewpoint, it is preferably 0.001 or more, more preferably 0.01 or more, even more preferably 0.02 or more, particularly preferably 0.03 or more, even if it is 0.04 or more, or 0.05 or more. good. Further, the absolute value of the refractive index difference between the light-diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image. More preferably, it is 3 or less.

From the viewpoint of imparting appropriate light diffusion performance to the sealing resin layer, the content of the light diffusing fine particles in the diffusion functional layer is 0.01 parts by mass based on 100 parts by mass of the resin constituting the diffusion functional layer. The amount is preferably at least 0.05 parts by mass, more preferably at least 0.1 parts by mass, particularly preferably at least 0.15 parts by mass. In addition, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the content of the light-diffusing fine particles is 80 parts by mass or less based on 100 parts by mass of the resin constituting the diffusion functional layer. is preferable, and more preferably 70 parts by mass or less.

The haze value (initial haze value) of the diffusion functional layer is not particularly limited, but from the viewpoint of efficiently reducing uneven brightness, it is preferably 30% or more, more preferably 40% or more, even more preferably 50% or more, Particularly preferably, it is 60% or more, and may be 70% or more, 80% or more, 90% or more, 95% or more, 97% or more, and moreover, a value around 99.9% is more excellent in the brightness unevenness improving effect. preferable. Note that the upper limit of the haze value of the diffusion functional layer is not particularly limited, and may be 100%. The haze value is the value at the thickest portion of the diffusion functional layer in the display.

The total light transmittance of the diffusion functional layer is not particularly limited, but from the viewpoint of ensuring brightness, it is preferably 40% or more, more preferably 60% or more, even more preferably 70% or more, particularly preferably 80% or more. It is. Further, the upper limit of the total light transmittance of the diffusion functional layer is not particularly limited, but may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest portion of the diffusion functional layer in the display.

The haze value and total light transmittance of the above-mentioned diffusion functional layer are the values of a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1. It can be controlled by the type and amount of diffusible particles.

(Non-diffusion functional layer)
The non-diffusion functional layer is a layer that is not intended to diffuse light. The non-diffusion functional layer is preferably a resin layer made of resin. The non-diffusion functional layer is preferably the non-colored layer.

The content ratio of the colorant in the non-diffusion functional layer is preferably less than 0.2% by mass, more preferably less than 0.1% by mass, still more preferably 0.2% by mass, based on the total amount of the non-diffusion functional layer 100% by mass. 05% by weight, and may be less than 0.01% by weight or less than 0.005% by weight.

The haze value (initial haze value) of the non-diffusion functional layer is not particularly limited, but from the viewpoint of improving the brightness of the display, it is preferably less than 30%, more preferably 10% or less, and even more preferably 5%. % or less, particularly preferably 1% or less, and may be 0.5% or less. Note that the lower limit of the haze value of the non-diffusion functional layer is not particularly limited. The haze value is the value at the thickest portion of the non-diffusion functional layer in the display body.

The total light transmittance of the non-diffusing functional layer is not particularly limited, but from the viewpoint of ensuring the brightness of the display, it is preferably 60% or more, more preferably 70% or more, still more preferably 80% or more, and particularly preferably is 90% or more. Further, the upper limit of the total light transmittance of the non-diffusing functional layer is not particularly limited, but may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest portion of the non-diffusion functional layer in the display.

The haze value and total light transmittance of the above-mentioned non-diffusing functional layer are the values of a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1, and may vary depending on the type and thickness of the non-diffusing functional layer. It can be controlled by etc.

The content of the colorant and/or light-diffusing fine particles in the non-diffusing functional layer is set to 0 parts by mass based on 100 parts by mass of the resin constituting the non-diffusing functional layer, from the viewpoint of improving the brightness of the display. It is preferably less than .01 parts by weight, more preferably less than 0.005 parts by weight.

(colored layer)
The colored layer is a layer whose purpose is to prevent light from being reflected by metal wiring provided on a substrate in a display body. The colored layer contains at least a colorant. The colored layer is preferably a resin layer made of resin. The coloring agent may be a dye or a pigment as long as it can be dissolved or dispersed in the colored layer. Dyes are preferred because they can achieve low haze even when added in small amounts, and are easy to distribute uniformly without settling unlike pigments. Pigments are also preferred because they provide high color development even when added in small amounts. If a pigment is used as a coloring agent, it is preferably one with low or no electrical conductivity. The above coloring agents may be used alone or in combination of two or more.

As the colorant, a black colorant is preferable. As the black colorant, known or commonly used colorants (pigments, dyes, etc.) for producing a black color can be used. For example, carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, etc.) can be used. , pine smoke, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (non-magnetic ferrite, magnetic ferrite, etc.), magnetite, chromium oxide, iron oxide, molybdenum disulfide , chromium complexes, anthraquinone colorants, zirconium nitride, etc. Further, a colorant that functions as a black colorant by combining a colorant exhibiting a color other than black may be used.

The content ratio of the colorant in the colored layer is preferably 0.2% by mass or more, more preferably 0.2% by mass or more, based on 100% by mass of the total amount of the colored layer, from the viewpoint of imparting appropriate antireflection ability to the display. .4% by mass or more. Further, the content of the colorant is, for example, 10% by mass or less, preferably 5% by mass or less, and more preferably 3% by mass or less. The content ratio may be appropriately set depending on the type of colorant, the color tone and light transmittance of the display body, and the like. The colorant may be added to the composition as a solution or dispersion dissolved or dispersed in a suitable solvent.

The haze value (initial haze value) of the colored layer is not particularly limited, but from the viewpoint of ensuring front brightness and visibility of the display, it is preferably 50% or less, more preferably 40% or less, still more preferably 30%. It is particularly preferably 20% or less. Further, the haze value of the colored layer is preferably 1% or more, more preferably 3% or more, still more preferably 5% or more, particularly preferably 8% or more, from the viewpoint of efficiently reducing brightness unevenness of the display body. and may be 10% or more. The haze value is the value at the thickest portion of the colored layer in the display.

The total light transmittance of the colored layer is not particularly limited, but from the viewpoint of further improving the antireflection function and contrast of metal wiring in the display, it is preferably 40% or less, more preferably 30% or less, and even more preferably is 25% or less, particularly preferably 20% or less. Further, the total light transmittance of the colored layer is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.5% or more, from the viewpoint of ensuring the brightness of the display body. Particularly preferably, it is 2% or more, and may be 2.5% or more, or 3% or more. The total light transmittance is the value at the thickest portion of the colored layer in the display.

The haze value and total light transmittance of the above-mentioned colored layer are the values of a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1. It can be controlled by the amount etc.

(resin layer)
When each layer is the resin layer, examples of the resin constituting the resin layer include known or commonly used resins, such as acrylic resins, urethane acrylate resins, urethane resins, rubber resins, and epoxy resins. Resin, epoxy acrylate resin, oxetane resin, silicone resin, silicone acrylic resin, polyester resin, polyether resin (polyvinyl ether, etc.), polyamide resin, fluorine resin, vinyl acetate/vinyl chloride copolymer, modified polyolefin Examples include. The above resins may be used alone or in combination of two or more. The resins constituting each layer of the sealing resin layer may be the same or different.

When the resin layer is an adhesive layer (adhesive layer), a known or commonly used pressure-sensitive adhesive can be used as the resin. Examples of the above-mentioned adhesives include acrylic adhesives, rubber adhesives (natural rubber-based, synthetic rubber-based, mixtures thereof, etc.), silicone-based adhesives, polyester-based adhesives, urethane-based adhesives, and polyether. Examples include adhesives such as adhesives based on polyamide, polyamide adhesives, and fluorine adhesives. The above adhesives may be used alone or in combination of two or more.

The resin layer may contain other components other than the above-mentioned components as long as the effects of the present invention are not impaired in each layer. Other ingredients listed above include curing agents, crosslinking accelerators, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), oligomers, anti-aging agents, fillers (metal powders, organic fillers, inorganic fillers, etc.), antioxidants, plasticizers, softeners, surfactants, antistatic agents, surface lubricants, leveling agents, light stabilizers, ultraviolet absorbers, polymerization inhibitors, granular materials, foil-like materials, etc. Can be mentioned. The above-mentioned other components may be used alone or in combination of two or more.

The laminated structure of the above sealing resin layer includes [diffusion functional layer/non-diffusion functional layer], [non-diffusion functional layer/diffusion functional layer], [non-diffusion functional layer/diffusion functional layer/non-diffusion functional layer] ( , in order from the optical semiconductor element side). When the sealing resin layer includes the colored layer, the colored layer can be laminated at any location in the laminated structure. When the sealing resin layer includes the colored layer, the laminated structure includes [colored layer/diffusion functional layer/non-diffusion functional layer], [diffusion functional layer/colored layer/non-diffusion functional layer], and [non-diffusion functional layer]. layer / colored layer / diffusion functional layer], [non-diffusion functional layer / diffusion functional layer / colored layer], [diffusion functional layer / non-diffusion functional layer / colored layer], [colored layer / diffusion functional layer / colored layer / non-diffusion functional layer] diffusion functional layer] (in order from the optical semiconductor element side).

<Base material part>
The display body of the present invention may or may not include a base material portion. When the base material part is provided on the front side of the sealing resin layer in the display body, the surface of the sealing resin layer can be made flat, which makes it difficult to cause diffused reflection of light, and when the display is not lit and lit. The appearance of the display body is improved in both cases. Further, by forming an anti-glare layer or an anti-reflection layer, which will be described later, on the base material portion, anti-glare properties and anti-reflection properties can be imparted to the display body. In addition, it serves as a support for a sealing resin layer in a sheet for encapsulating an optical semiconductor element, which will be described later, and by providing the above-mentioned base material portion, the sheet for encapsulating an optical semiconductor element has excellent handling properties.

The base material portion may be a single layer, or may be a multilayer having the same or different compositions, thicknesses, etc. When the base material part is multi-layered, each layer may be bonded together by another layer such as an adhesive layer. Note that the base material layer used for the base material part is a part that is attached to the substrate containing the optical semiconductor element together with the sealing resin layer, and is peeled off when the optical semiconductor element sealing sheet is used (at the time of attachment). A "base material" does not include a release liner or a surface protection film that merely protects the surface of the base material.

Examples of the base layer constituting the base portion include glass and plastic base materials (especially plastic films). Examples of the resin constituting the plastic base material include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, and homopolyprolene. , polybutene, polymethylpentene, ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene- Polyolefin resins such as propylene copolymers, cyclic olefin polymers, ethylene-butene copolymers, and ethylene-hexene copolymers; polyurethanes; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); Polycarbonate; Polyimide resin; Polyetheretherketone; Polyetherimide; Polyamide such as aramid and wholly aromatic polyamide; Polyphenylsulfide; Fluororesin; Polyvinyl chloride; Polyvinylidene chloride; Cellulose resin such as triacetylcellulose (TAC) ; silicone resin; acrylic resin such as polymethyl methacrylate (PMMA); polysulfone; polyarylate; polyvinyl acetate. The above resins may be used alone or in combination of two or more. The base material layer may be various optical films such as an antireflection (AR) film, a polarizing plate, and a retardation plate.

The thickness of the plastic film is preferably 20 to 300 μm, more preferably 40 to 250 μm. When the thickness is 20 μm or more, the supportability and handleability of the sheet for encapsulating an optical semiconductor device are further improved. When the thickness is 250 μm or less, the display body can be made thinner.

The surface of the base material on the side where the sealing resin layer is provided may be subjected to, for example, corona discharge treatment, plasma treatment, sand mat treatment, ozone exposure, etc., for the purpose of improving adhesion and retention with the sealing resin layer. Physical treatments such as treatment, flame exposure treatment, high-voltage electric shock treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; surface treatments such as easy-adhesion treatment using a coating agent (undercoat). . The surface treatment for improving adhesion is preferably applied to the entire surface of the base portion on the side of the sealing resin layer.

The thickness of the base material portion is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of excellent support function and surface scratch resistance. The thickness of the base material portion is preferably 300 μm or less, more preferably 250 μm or less, from the viewpoint of better transparency.

<Display body>
The display body may include a layer having anti-glare and/or anti-reflection properties. By having such a configuration, it is possible to suppress the gloss and light reflection of the display body and improve the appearance. Examples of the layer having anti-glare properties include an anti-glare treated layer. Examples of the layer having antireflection properties include an antireflection treated layer. The anti-glare treatment and the anti-reflection treatment can be carried out using known or commonly used methods. The layer having anti-glare properties and the layer having anti-reflection properties may be the same layer or may be different layers. The layer having anti-glare properties and/or anti-reflection properties may have only one layer, or may have two or more layers.

The haze value (initial haze value) of the sealing resin layer or the laminate having both end faces of the sealing resin layer and the base material part is not particularly limited, but it is effective for suppressing brightness unevenness and for design. From the viewpoint of making it more excellent, it is preferably 80% or more, more preferably 85% or more, still more preferably 90% or more, particularly preferably 95% or more. Note that the upper limit of the haze value is not particularly limited.

The total light transmittance of the sealing resin layer or the laminate having both end faces of the sealing resin layer and the base material part is not particularly limited, but it can further improve the anti-reflection function and contrast of metal wiring etc. From this viewpoint, it is preferably 40% or less, more preferably 30% or less, and even more preferably 20% or less. Further, the total light transmittance is preferably 0.5% or more from the viewpoint of ensuring brightness.

The above haze value and total light transmittance can be measured by the methods specified in JIS K7136 and JIS K7361-1, respectively, and depend on the stacking order, type, and thickness of each layer constituting the sealing resin layer and the base material part. It can be controlled by

The thickness of the encapsulation resin layer or the laminate having both end faces of the encapsulation resin layer and the base material part is determined to improve the anti-reflection function and contrast of metal wiring, while also making color shift more efficient. From the viewpoint of reducing the thickness, it is preferably 10 to 600 μm, more preferably 20 to 550 μm, even more preferably 30 to 500 μm, still more preferably 40 to 450 μm, and particularly preferably 50 to 400 μm. Note that the release liner is not included in the above thickness.

Moreover, it is preferable that the display body of the present invention includes a self-luminous display device. Further, by combining the above self-luminous display device and a display panel as necessary, a display body that is an image display device can be obtained. The optical semiconductor element in this case is an LED element. Examples of the self-luminous display device include an LED display, a backlight, an organic electroluminescence (organic EL) display device, and the like. It is particularly preferable that the backlight is a full-surface direct type backlight. The backlight includes, for example, a laminate including the substrate and a plurality of optical semiconductor elements arranged on the substrate as at least a part of its constituent members. For example, in the self-luminous display device, a metal wiring layer for sending a light emission control signal to each LED element is laminated on the substrate. LED elements that emit light of red (R), green (G), and blue (B) colors are alternately arranged on a substrate with metal wiring layers interposed therebetween. The metal wiring layer is made of metal such as copper, and displays each color by adjusting the degree of light emission of each LED element.

The display of the present invention may be a display that is used by being folded, for example, a foldable image display device (flexible display) (particularly a foldable image display device (foldable display)). Specifically, examples include a display body equipped with a foldable backlight, a display body equipped with a foldable self-luminous display device, and the like.

In the display of the present invention, since the sealing resin layer has excellent followability and embeddability of the optical semiconductor element, the optical semiconductor element may be a mini LED element or a micro LED element.

According to the display of the present invention, brightness unevenness due to light emitted by the optical semiconductor element is less likely to occur, and the brightness is high. Therefore, in the display, color shift is unlikely to occur and the display can be viewed with the same color from a wide field of view. Further, the display body is bright and has a good appearance without increasing power consumption.

[Method for manufacturing display body]
The display body of the present invention can be obtained by bonding a sheet for encapsulating an optical semiconductor element having a resin layer for sealing to a substrate on which an optical semiconductor element is arranged, and sealing the optical semiconductor element with the resin layer for sealing. can be manufactured.

(Sheet for encapsulating optical semiconductor elements)
The optical semiconductor element sealing sheet is a sheet for sealing a plurality of optical semiconductor elements arranged on a substrate. The optical semiconductor element sealing sheet includes at least a sealing resin layer including a diffusion functional layer and a non-diffusion functional layer. The optical semiconductor element sealing sheet is a sheet that can satisfy the above formula (1) when a sealing resin layer is formed by sealing the plurality of optical semiconductor elements with the sealing resin layer. According to the sheet for encapsulating an optical semiconductor element of the present invention, by encapsulating an optical semiconductor element, it is possible to provide a display body that is less likely to have uneven brightness and has high brightness.

The optical semiconductor element sealing sheet includes at least a sealing resin layer including a diffusion functional layer and a non-diffusion functional layer. The sealing resin layer is a layer that can form the sealing resin layer in the display of the present invention. Specifically, the diffusion functional layer in the sealing resin layer is a layer that can form the diffusion functional layer in the display of the present invention, and the non-diffusion functional layer in the sealing resin layer is a layer that can form the diffusion functional layer in the display of the present invention. This layer can form the non-diffusion functional layer in the display of the present invention. Specifically, the diffusion functional layer in the sealing resin layer has a composition (constituent components and their blending ratios) and physical properties (haze, total light transmittance, etc.) of the diffusion functional layer in the display of the present invention. ) may be the same layer, or may be a layer that becomes the above-mentioned diffusion functional layer in the display of the present invention upon curing. In addition, the non-diffusion functional layer in the sealing resin layer has a composition (constituent components and their blending ratio) and physical properties (haze, total light transmittance, etc.) of the non-diffusion functional layer in the display body of the present invention. may be the same layer, or may be a layer that becomes the non-diffusion functional layer in the display of the present invention upon curing.

The sealing resin layer is appropriately designed depending on the structure of the sealing resin layer in the display of the present invention. For example, when the display of the present invention includes the colored layer, the sealing resin layer in the optical semiconductor element sealing sheet includes the colored layer. The colored layer in the sealing resin layer is a layer having the same composition (constituent components and their proportions) and physical properties (haze, total light transmittance, etc.) as the colored layer in the display of the present invention. Alternatively, it may be a layer that becomes the colored layer in the display of the present invention upon curing. Further, it is preferable that the sealing resin layer includes the diffusion functional layer, the colored layer, and the non-diffusion functional layer in this order.

Each layer constituting the sealing resin layer may or may not have adhesiveness and/or adhesiveness independently. Among these, it is preferable to have adhesiveness and/or adhesiveness. With such a configuration, the sealing resin layer can be easily bonded to the substrate and the optical semiconductor element, and has excellent adhesion between each layer, resulting in better sealing performance of the optical semiconductor element. In particular, it is preferable that at least the layer that contacts the optical semiconductor element has adhesiveness and/or adhesiveness. By having such a configuration, the followability and embedding of the optical semiconductor element by the sealing resin layer are excellent. As a result, the design is excellent even when the height difference due to the optical semiconductor element is high.

Each of the layers constituting the sealing resin layer may be independently a resin layer that has the property of being cured by radiation irradiation (radiation curable resin layer), or a resin that does not have the property of curing by radiation irradiation. It may be a layer (radiation non-curable resin layer). Examples of the radiation include electron beams, ultraviolet rays, α rays, β rays, γ rays, and X rays. When the colored layer is a radiation-curable resin layer, the colorant that may be included in the colored layer absorbs visible light and has transparency to light at a wavelength at which the radiation-curable resin layer can be cured. Preferably.

The optical semiconductor element sealing sheet may include the base material portion. When the base material section is provided, the sealing resin layer may be provided on at least one surface of the base material section. The surface of the sealing resin layer that comes into contact with the base material part is the surface opposite to the side where the sealing resin layer contacts the optical semiconductor element. When the optical semiconductor element sealing sheet includes the base material part, the optical semiconductor element sealing sheet is bonded to the optical semiconductor element and the substrate together with the base material part, and the optical semiconductor element sealing sheet is bonded to the optical semiconductor element and the substrate together with the optical semiconductor element sealing sheet, and The base material part becomes a base material part in the display body of the present invention.

Further, the sealing resin layer may be formed on the release-treated surface of the release liner. When the optical semiconductor element sealing sheet is formed on the release liner, the side of the sealing resin layer that contacts the optical semiconductor element is the side that contacts the release liner. When the base material portion is not provided, both surfaces of the sealing resin layer may be the side that contacts the release liner. The release liner is used as a protective material for the optical semiconductor element sealing sheet, and is peeled off when sealing the optical semiconductor element. Note that the base material portion and the release liner do not necessarily need to be provided.

The release liner is an element for covering and protecting the surface of the sheet for encapsulating an optical semiconductor element, and when the sheet for encapsulating an optical semiconductor element is attached to a substrate on which an optical semiconductor element is arranged, the sheet is be stripped from.

Examples of the above-mentioned release liner include polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, plastic films and papers whose surface is coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate release agent. It will be done.

The thickness of the release liner is, for example, 10 to 200 μm, preferably 15 to 150 μm, and more preferably 20 to 100 μm. When the thickness is 10 μm or more, the release liner is less likely to break due to cuts during processing. When the thickness is 200 μm or less, the release liner can be more easily peeled off from the optical semiconductor device sealing sheet during use.

One embodiment of the optical semiconductor element sealing sheet will be described using FIG. 8. FIG. 8 is a cross-sectional view of the optical semiconductor element sealing sheet capable of forming the display shown in FIG. 2. As shown in FIG. 8, the optical semiconductor element sealing sheet 10 can be used for sealing one or more optical semiconductor elements arranged on a substrate, and is a sheet that can be used to seal one or more optical semiconductor elements arranged on a substrate. A sealing resin layer 7 formed on the material portion 5 is provided. The sealing resin layer 7 is formed from a laminate of a diffusion function layer 71 and a non-diffusion function layer 72. The diffusion functional layer 71 and the non-diffusion functional layer 72 have adhesive properties and are directly stacked on each other. A release liner 6 is attached to the surface of the diffusion function layer 71 of the sealing resin layer 7, and a base member 5 is attached to the surface of the non-diffusion function layer 72.

(Sealing process)
In the method of manufacturing a display body of the present invention using the above-mentioned sheet for encapsulating an optical semiconductor element, the above-mentioned sheet for encapsulating an optical semiconductor element is laminated to a substrate on which an optical semiconductor element is arranged, and a resin layer for sealing It has a sealing process of sealing the optical semiconductor element. Specifically, in the sealing step, first, the release liner is peeled off from the optical semiconductor element sealing sheet to expose the sealing resin layer. Then, in a laminate (such as an optical member) comprising a substrate and an optical semiconductor element (preferably a plurality of optical semiconductor elements) arranged on the substrate, the optical semiconductor is placed on the substrate surface on which the optical semiconductor element is arranged. The exposed surfaces of the encapsulation resin layers of the element encapsulation sheets are bonded together, and when the laminate includes a plurality of optical semiconductor elements, the encapsulation resin layer further fills the gaps between the plurality of optical semiconductor elements. The plurality of optical semiconductor elements are sealed together. Specifically, as shown in FIG. 9, the diffusion functional layer 71 of the optical semiconductor element sealing sheet 10 from which the release liner 6 has been peeled off is placed opposite to the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are arranged. The optical semiconductor element sealing sheet 10 is attached to the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are arranged, and the optical semiconductor elements 3a to 3c are embedded in the sealing resin layer 7.

The temperature during the above bonding is, for example, within the range of room temperature to 110°C. Further, during the above bonding, pressure may be reduced or increased. It is possible to suppress the formation of voids between the sealing resin layer and the substrate or the optical semiconductor element due to reduced pressure or increased pressure. Moreover, in the said sealing process, it is preferable to bond the optical semiconductor element sealing sheet together under reduced pressure, and to apply pressure after that. The pressure for reducing the pressure is, for example, 1 to 100 Pa, and the time for reducing the pressure is, for example, 5 to 600 seconds. Further, the pressure when pressurizing is, for example, 0.05 to 0.5 MPa, and the pressurizing time is, for example, 5 to 600 seconds.

By appropriately setting the thickness of the diffusion function layer in the sealing resin layer, the temperature and pressure during bonding, etc., the followability of the diffusion function layer to the optical semiconductor element in the resulting display body and the above-mentioned uneven shape can be adjusted. It is possible to adjust the thickness of the diffusion functional layer in each region of the concave portions and convex portions. Thereby, the display body obtained can have a form that satisfies the above formula (1).

(Radiation irradiation process)
When the sealing resin layer includes a radiation-curable resin layer, the manufacturing method further includes the substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element for sealing the optical semiconductor element. The method may include a radiation irradiation step of irradiating a laminate including an element sealing sheet with radiation to cure the radiation-curable resin layer to form a cured material layer. As mentioned above, examples of the radiation include electron beams, ultraviolet rays, α rays, β rays, γ rays, and X rays. Among these, ultraviolet light is preferred. The temperature during radiation irradiation is, for example, in the range from room temperature to 100° C., and the irradiation time is, for example, 1 minute to 1 hour.

(dicing process)
The manufacturing method further includes a dicing step of dicing a laminate including the substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element. may be provided. The above-mentioned laminate may be formed on a laminate that has undergone the above-mentioned radiation irradiation step. When the laminate includes a cured material layer in which the radiation-curable resin layer is cured by the radiation irradiation, in the dicing step, the cured material layer of the optical semiconductor element sealing sheet and the side edges of the substrate are diced. Remove. Thereby, the surface of the cured material layer, which has been sufficiently cured and whose tackiness has been reduced, can be exposed on the side surface. The above-mentioned dicing can be performed by a known or commonly used method, for example, by using a dicing blade or by laser irradiation.

(Tiling process)
The manufacturing method may further include a tiling step of arranging the plurality of display bodies obtained in the dicing step so as to be in contact with each other in a plane direction. In the tiling step, the plurality of laminates obtained in the dicing step are arranged and tiled so as to be in contact with each other in a planar direction. In this way, one large display can be produced.

The display body of the present invention can be manufactured in the manner described above. When the sealing resin layer 7 in the optical semiconductor element sealing sheet 10 does not have a radiation-curable resin layer, the sealing resin layer 7 becomes the sealing resin layer 4 in the display body 1 . On the other hand, when the sealing resin layer 7 in the optical semiconductor element sealing sheet 10 has a radiation-curable resin layer, for example, when the non-diffusion functional layer 72 is a radiation-curable resin layer, the non-diffusion functional layer 72 is cured. By doing so, a non-diffusion functional layer 42 is formed, which becomes the sealing resin layer 4.

1 Display body 2 Substrate 3a to 3f Optical semiconductor element 31 Support body 3, 3' pixels 4 Sealing resin layer 41 Diffusion functional layer 42, 43 Non-diffusion functional layer 44 Colored layer 5 Base material part 6 Release liner 7 Sealing resin Layer 71 Diffusion functional layer 72 Non-diffusion functional layer 10 Optical semiconductor element sealing sheet 11 Optical member

Claims (7)

A display body comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements,
The sealing resin layer includes a diffusion functional layer and a non-diffusion functional layer,
The distance from the substrate surface to the front end T _A of the center of gravity of the first optical semiconductor element is L _A ,
A line perpendicular to the substrate surface passes from the substrate surface to the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel. The distance to the front end T _C of the diffusion functional layer is L _C ,
The distance from the perpendicular to the substrate surface passing through the end T _A to the perpendicular to the substrate surface passing through the end T _C is L _AC ,
A display body that satisfies the following formula (1), where the angle of elevation from the end T _A to the perpendicular to the substrate surface passing through the end T _C is θ°.
L _C ≦L _A +L _AC tanθ (1) The display according to claim 1, wherein the height of the optical semiconductor element on the substrate is 500 μm or less. The display body according to claim 1 or 2, wherein the diffusion functional layer has adhesiveness. The display body according to any one of claims 1 to 3, comprising a self-luminous display device. The display body according to any one of claims 1 to 4, which is an image display device. A sheet for sealing a plurality of optical semiconductor elements arranged on a substrate, the sheet comprising:
The sheet includes a sealing resin layer including a diffusion functional layer and a non-diffusion functional layer,
When forming a sealing resin layer by sealing the plurality of optical semiconductor elements with the sealing resin layer,
The distance from the substrate surface to the front end T _A of the center of gravity of the first optical semiconductor element is L _A ,
A line perpendicular to the substrate surface passes from the substrate surface to the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel. The distance to the front end T _C of the diffusion functional layer is L _C ,
The distance from the perpendicular to the substrate surface passing through the end T _A to the perpendicular to the substrate surface passing through the end T _C is L _AC ,
An optical semiconductor element sealing sheet that can satisfy the following formula (1), where the angle of elevation from the end T _A to the perpendicular to the substrate surface passing through the end T _C is θ°.
L _C ≦L _A +L _AC tanθ (1) The sheet for encapsulating an optical semiconductor element according to claim 6, wherein the diffusion functional layer has adhesiveness.

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