JP2023142477A - Display body and sheet for sealing optical semiconductor element - Google Patents

Abstract

To provide a display body which hardly causes a color shaft and has high brightness.SOLUTION: A display body 1 includes a sealing resin layer 4 for sealing a plurality of optical semiconductor elements 3a to 3f arranged on a substrate 2. The sealing resin layer 4 has a colored layer 42 and a non-colored layer 43 in this order from the side of the optical semiconductor elements. In a cross section of a vertical surface relative to the surface of the substrate 2 passing through a center GC of gravity of the optical semiconductor element 3c at a terminal of a pixel 3 and a center GD of gravity of the optical semiconductor element 3d in a pixel 3', a straight line in a front face direction at an angle 15° from a line 1L1 passing through the center GC of gravity is represented by a line 2L2, a straight line in a front face direction at an angle 90° from the line 1L1 passing through the center GC of gravity is represented by a line 3L3, a superposing distance D1 of the line 2L2 and the colored layer 42 and a superposing distance D2 of the line 3L3 and the colored layer 42 satisfy D1>D2, and a distance D3 to an end TA of the optical semiconductor element 3c and thickness D4 of the colored layer 42 at a middle point C of the center GC of gravity and the center GD of gravity from the substrate satisfy D3>D4.SELECTED DRAWING: Figure 2

Description

The present invention relates to a display body and a sheet for sealing optical semiconductor elements. More specifically, the present invention relates to a display body in which an optical semiconductor element of, for example, a self-luminous display device is sealed, and a sheet suitable for use in sealing the optical semiconductor element.

In recent years, self-luminous display devices typified by mini/micro LED display devices (Mini/Micro Light Emitting Diode Displays) have been devised as next-generation display devices. The basic configuration of mini/micro LED display devices is to use a substrate on which many minute optical semiconductor elements (LED chips) are arranged at high density as a display panel, and the optical semiconductor elements are sealed with a sealing material. , a cover member such as a resin film or a glass plate is laminated on the outermost layer.

In a display body including a self-luminous display device such as a mini/micro LED display device, wiring (metal wiring) made of metal or a metal oxide such as ITO is arranged on a substrate of a display panel. Such display devices have a problem in that, for example, when the lights are turned off, light is reflected by the metal wiring and the like, resulting in poor screen appearance and poor design. For this reason, a technique has been adopted that uses an antireflection layer to prevent reflection from metal wiring as a sealing material for sealing an optical semiconductor element.

Furthermore, displays using self-luminous display devices have a problem in that uneven brightness (luminance unevenness) occurs due to the light source of the optical semiconductor element. When brightness unevenness occurs, a phenomenon called "color shift" occurs, in which the color tone changes when the display is viewed from the front and when viewed from an oblique viewing angle.

Patent Document 1 describes a laminate of a colored adhesive layer and a colorless adhesive layer as an adhesive sheet capable of suppressing brightness unevenness, and the colorless adhesive layer is positioned so as to be in contact with an optical semiconductor element. A pressure-sensitive adhesive sheet is disclosed. According to the above-mentioned adhesive sheet, when the colorless adhesive layer contacts and follows the uneven shape formed by the substrate and the optical semiconductor element installed on the substrate, the colorless adhesive layer comes into contact with the unevenness, and the colorless adhesive layer Since the unevenness is absorbed to some extent by the layer, the colored adhesive layer is prevented from being compressed or deformed, thereby suppressing uneven transmittance in the adhesive layer and suppressing uneven brightness. Are listed.

JP2020-169262A

However, although adhesive sheets equipped with a colored adhesive layer are expected to have the effect of preventing reflections from metal wiring and suppressing uneven brightness when encapsulating optical semiconductor elements, they do not allow the transmission of light emitted by optical semiconductor elements. There has been a problem in that the brightness of the display is reduced, and as a result, the front brightness of the display is reduced. When front brightness decreases, power consumption increases to increase brightness. In addition, in the adhesive sheet of Patent Document 1, the colored adhesive layer cannot sufficiently absorb the light emitted from the side surface of the optical semiconductor element, and there is strong interference between the lights emitted by adjacent optical semiconductor elements, resulting in color shift. There was a problem in that it was easy for this to occur. Therefore, there is a need for a display body that is less likely to cause color shift and has high brightness.

The present invention was devised under these circumstances, and its purpose is to provide a display body that is less likely to cause color shift and has high brightness. Another object of the present invention is to provide a sheet for encapsulating an optical semiconductor element, which makes it possible to produce a display body that is less likely to cause color shift and has high brightness by encapsulating the optical semiconductor element.

As a result of intensive studies to achieve the above object, the present inventors sealed a plurality of optical semiconductor elements arranged on a substrate with a sealing resin layer including a colored layer and a non-colored layer from the optical semiconductor element side. In the state, the distance of the colored layer at a specific angle on the side of another adjacent pixel of the optical semiconductor element at the end of the pixel and the distance of the colored layer on the front side of the optical semiconductor element have a specific relationship, In addition, it has been found that a display having a specific relationship between the height of the optical semiconductor element and the thickness of the colored layer between pixels is less likely to cause color shift and has high brightness. The present invention was completed based on these findings.

That is, the present invention is a display body comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements,
A plurality of the above-mentioned plurality of optical semiconductor elements are arranged for each pixel including a plurality of optical semiconductor elements,
The sealing resin layer has a colored layer and a non-colored layer in this order from the optical semiconductor element side,
The center of gravity of the first optical semiconductor element located at the end of the first pixel, and the second light located at the end of the second pixel adjacent to the first pixel on the side of the first optical semiconductor element. In a cross section perpendicular to the substrate surface passing through the center of gravity of the semiconductor element,
Baseline the above board surface,
Line 1 is a straight line that is parallel to the base line and passes through the center of gravity of the first optical semiconductor element.
Line 2 is a straight line passing through the center of gravity of the first optical semiconductor element and extending at an angle of 15° from line 1 in the front direction.
When line 3 is a straight line passing through the center of gravity of the first optical semiconductor element and extending at an angle of 90° from line 1 in the front direction,
The distance D1 where the line 2 and the colored layer overlap, and the distance D2 where the line 3 and the colored layer overlap satisfy the following formula (1),
The distance D3 from the substrate surface to the front end of the first optical semiconductor element, and the coloring at the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element. The layer thickness D4 provides a display that satisfies the following formula (2).
D1>D2 (1)
D3>D4 (2)

In the display, the sealing resin layer that seals the optical semiconductor element includes the colored layer, thereby making it possible to prevent light from being reflected by metal wiring provided on the substrate. The distance D1 corresponds to the thickness of the colored layer diagonally at 75 degrees with respect to the front direction of the optical semiconductor element, and the distance D2 corresponds to the thickness of the colored layer located in the front direction of the optical semiconductor element. The fact that the distance D1 is larger than the distance D2 means that the transmittance of light emitted from the optical semiconductor element in the front direction is higher than the transmittance of light in the 75° diagonal direction on the side of the adjacent pixel. Moreover, the distance D3 corresponds to the height of the optical semiconductor element installed on the substrate, and the distance D4 corresponds to the thickness of the colored layer between pixels. The fact that the distance D3 is larger than the thickness D4 means that while suppressing the interference between the lights emitted by the optical semiconductor elements between pixels, it is possible to appropriately transmit the light emitted from the optical semiconductor elements in the oblique direction to the front. Brightness increases. Therefore, in a display that satisfies D1>D2 and D3>D4, the light emitted by the optical semiconductor element has excellent transmittance in the front direction (for example, 150° field of view), but has low transmittance in the side direction. The display body is less prone to color shift and has high front brightness.

The sealing resin layer preferably includes a diffusion functional layer on the optical semiconductor element side of the colored layer. With such a configuration, the light emitted by the optical semiconductor element in the side direction can be diffused in the diffusion function layer, and the front brightness can be further increased.

Preferably, the display body includes a self-luminous display device.

It is preferable that the display body is an image display device.

The present invention also provides a sheet for sealing a plurality of optical semiconductor elements arranged on a substrate for each pixel including a plurality of optical semiconductor elements,
The sheet includes a sealing resin layer including a colored layer and a non-colored layer,
When forming a sealing resin layer by sealing the plurality of optical semiconductor elements with the sealing resin layer so that the colored layer side faces the optical semiconductor element side,
The center of gravity of the first optical semiconductor element located at the end of the first pixel, and the second light located at the end of the second pixel adjacent to the first pixel on the side of the first optical semiconductor element. In a cross section perpendicular to the substrate surface passing through the center of gravity of the semiconductor element,
Baseline the above board surface,
Line 1 is a straight line that is parallel to the base line and passes through the center of gravity of the first optical semiconductor element.
Line 2 is a straight line passing through the center of gravity of the first optical semiconductor element and extending at an angle of 15° from line 1 in the front direction.
When line 3 is a straight line passing through the center of gravity of the first optical semiconductor element and extending at an angle of 90° from line 1 in the front direction,
The distance D1 where the line 2 and the colored layer overlap, and the distance D2 where the line 3 and the colored layer overlap may satisfy the following formula (1),
The distance D3 from the substrate surface to the front end of the first optical semiconductor element, and the coloring at the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element. The layer thickness D4 provides an optical semiconductor element sealing sheet that can satisfy the following formula (2).
D1>D2 (1)
D3>D4 (2)

It is preferable that the sealing resin layer includes a diffusion functional layer on the opposite side of the colored layer to the non-colored layer.

According to the display of the present invention, color shift due to light emitted by the optical semiconductor element is unlikely to occur, and the brightness is high. Therefore, the display body can be visually recognized with the same color tone from a wide field of view. Further, the display body is bright and has a good appearance without increasing power consumption. Moreover, according to the sheet for encapsulating an optical semiconductor element of the present invention, by sealing an optical semiconductor element, it is possible to provide a display body that is less likely to cause color shift and has high brightness.

FIG. 2 is a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged in units of pixels on a substrate. 1 is a partial sectional view showing an embodiment of a display body of the present invention. 3 is a partially enlarged view of the display body shown in FIG. 2. FIG. FIG. 3 is a partial cross-sectional view showing how the optical semiconductor element of the display shown in FIG. 2 emits light. FIG. 2 is a partial cross-sectional view showing how an optical semiconductor element of a conventional display emits light. It is a partial sectional view showing another embodiment of the display of the present invention. FIG. 7 is a partial cross-sectional view showing still another embodiment of the display body of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows one Embodiment of the sheet for optical semiconductor element sealing of this invention. FIG. 9 is a partial cross-sectional view showing a process of sealing an optical semiconductor element using the optical semiconductor element sealing sheet shown in FIG. 8;

[Display]
The display of the present invention includes at least a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements. The display body is a device for displaying information using light emitted by an optical semiconductor element.

Examples of the optical semiconductor device include light emitting diodes (LEDs) such as blue light emitting diodes, green light emitting diodes, red light emitting diodes, and ultraviolet light emitting diodes.

On the substrate, the plurality of optical semiconductor elements are arranged in one pixel, and a plurality of the pixels are arranged. That is, a plurality of the above-mentioned optical semiconductor elements are arranged for each pixel including a plurality of optical semiconductor elements. FIG. 1 shows a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged for each pixel on a substrate. In the optical member 11 shown in FIG. 1, three optical semiconductor elements 3a to 3c are arranged close to each other on a substrate 2, and one pixel (pixel 3) is formed by the three optical semiconductor elements 3a to 3c. ing. Furthermore, three optical semiconductor elements 3d to 3f are arranged close to each other on the substrate 2, and the three optical semiconductor elements 3d to 3f form one pixel (pixel 3'). A plurality of pixels, such as pixel 3 and pixel 3', are arranged on the substrate 2.

The display body of the present invention has an uneven shape formed by the substrate and the optical semiconductor element, with the substrate surface in the area where the optical semiconductor element is not arranged between two optical semiconductor elements as a concave part and the optical semiconductor element as a convex part. has.

The height of the optical semiconductor element on the substrate (height from the substrate surface to the front end of the optical semiconductor element) is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer has better followability with respect to the uneven shape.

It is preferable that the sealing resin layer contacts the plurality of optical semiconductor elements and follows the uneven shape. Further, it is preferable that the sealing resin layer seals the plurality of optical semiconductor elements at once. In this specification, "sealing the optical semiconductor element" refers to embedding at least a portion of the optical semiconductor element in a sealing resin layer, or following and covering it with the sealing resin layer. say.

The sealing resin layer includes at least a colored layer and a non-colored layer, and has the colored layer and the non-colored layer in this order from the optical semiconductor element side. In the sealing resin layer, the colored layer and the non-colored layer may be directly laminated or may be laminated with another layer interposed therebetween.

The center of gravity of the first optical semiconductor element located at the end of the first pixel installed on the substrate, and the end of the first optical semiconductor element side of the second pixel adjacent to the first pixel. In a cross section perpendicular to the substrate surface that passes through the center of gravity of the second optical semiconductor element located therein, the substrate surface is taken as a baseline. Line 1 is a straight line that is parallel to the base line and passes through the center of gravity of the first optical semiconductor element. Line 2 is a straight line passing through the center of gravity of the first optical semiconductor element and extending at an angle of 15 degrees from line 1 in the front direction. Line 3 is a straight line passing through the center of gravity of the first optical semiconductor element and extending at an angle of 90° from line 1 in the front direction. Then, when the distance at which the line 2 and the colored layer overlap is D1, and the distance at which the line 3 and the colored layer overlap is D2, the display of the present invention calculates the following formula (1) for D1 and D2. Fulfill. Further, the distance from the substrate surface to the front end of the first optical semiconductor element is D3, and the distance at the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element is When the thickness of the colored layer is D4, the display of the present invention satisfies the following formula (2) for D3 and D4.
D1>D2 (1)
D3>D4 (2)

In the display, the sealing resin layer that seals the optical semiconductor element includes the colored layer, thereby making it possible to prevent light from being reflected by metal wiring provided on the substrate. The distance D1 corresponds to the thickness of the colored layer diagonally at 75 degrees with respect to the front direction of the optical semiconductor element, and the distance D2 corresponds to the thickness of the colored layer located in the front direction of the optical semiconductor element. The fact that the distance D1 is larger than the distance D2 means that the transmittance of light emitted from the optical semiconductor element in the front direction is higher than the transmittance of light in the 75° diagonal direction on the side of the adjacent pixel. Moreover, the distance D3 corresponds to the height of the optical semiconductor element installed on the substrate, and the distance D4 corresponds to the thickness of the colored layer between pixels. The fact that the distance D3 is larger than the distance D4 means that while suppressing the interference between the lights emitted by the optical semiconductor elements between pixels, it is possible to appropriately transmit the light emitted from the optical semiconductor elements in the front oblique direction, and the front brightness becomes higher. Therefore, in a display that satisfies D1>D2 and D3>D4, the light emitted by the optical semiconductor element has excellent transmittance in the front direction (for example, 150° field of view), but has low transmittance in the side direction. The display body is less prone to color shift and has high front brightness.

Note that in this specification, the "front" refers to the side from which the display body is viewed, and for example, in FIG. 2, which will be described later, is the upward direction.

The display of the present invention will be explained using the display shown in FIG. 2, which is one embodiment thereof. The display body 1 shown in FIG. 2 includes a substrate 2, a plurality of optical semiconductor elements 3b, 3c, 3d, and 3e arranged on the substrate 2, and a seal that collectively seals these optical semiconductor elements 3b to 3e. It includes a sealing resin layer 4 and a base member 5 bonded to the surface of the sealing resin layer 4 on the side opposite to the optical semiconductor elements 3b to 3e side. FIG. 2 is an enlarged view of a cross section perpendicular to the substrate 2 passing through the centers of gravity of the optical semiconductor elements 3b to 3e.

The optical semiconductor elements 3b to 3e are each fixed on one substrate 2 by a support 31. The display body 1 includes a substrate 2 and an optical semiconductor element, with a concave portion N formed on the surface of the substrate 2 in an area where no optical semiconductor element is arranged between the optical semiconductor elements 3b to 3e, and a convex portion P formed on the optical semiconductor elements 3b to 3e. It has an uneven shape formed by 3b to 3e.

The optical semiconductor elements 3b and 3c in FIG. 2 are the optical semiconductor elements 3b and 3c shown in FIG. 1, and the optical semiconductor elements 3a to 3c are located within the same pixel 3. Further, the optical semiconductor elements 3d and 3e in FIG. 2 are the optical semiconductor elements 3d and 3e shown in FIG. 1, and the optical semiconductor elements 3d to 3f are located within the same pixel 3'. Pixel 3 and pixel 3' are adjacent pixels; if pixel 3 is the first pixel, then pixel 3' is the second pixel. The optical semiconductor element 3c is a first optical semiconductor element located at the end of the pixel 3, and the optical semiconductor element 3d is a second optical semiconductor element located at the end of the pixel 3' and adjacent to the optical semiconductor element 3c. It is an optical semiconductor device.

As shown in FIG. 2, the sealing resin layer 4 contacts the plurality of optical semiconductor elements 3b to 3e, follows the above-mentioned uneven shape, and seals the plurality of optical semiconductor elements 3b to 3e at once. .

The sealing resin layer 4 is constructed by directly laminating a non-colored layer 41, a colored layer 42, and a non-colored layer 43 in this order, with the non-colored layer 41 side facing the optical semiconductor elements 3b to 3e. Optical semiconductor elements 3b to 3e are sealed. The non-colored layer 41 in contact with the optical semiconductor elements 3b to 3e follows the above-described uneven shape, and the non-colored layer 41 and the colored layer 42 in the display body 1 also have an uneven shape. On the other hand, one surface of the non-colored layer 43 has an uneven shape that is opposite to the uneven shape of the colored layer 42 by following the uneven shape of the colored layer 42, and the other surface is flat. . Note that the non-colored layer 41 and the non-colored layer 43 may each independently be a diffusion functional layer, which will be described later, or a non-diffusion functional layer.

FIG. 3 shows an enlarged view of the vicinity between the optical semiconductor elements 3c and 3d of the display body 1 shown in FIG. 2. In the display 1 shown in FIG. 3, the surface of the substrate 2 is a baseline B, and a straight line that is parallel to the baseline B and passes through the center of gravity G _C of the first optical semiconductor element 3c is a line 1L1. A straight line passing through the center of gravity _GC of the first optical semiconductor element 3c and extending at an angle of 15° from the line 1L1 in the front direction is a line 2L2. A straight line passing through the center of gravity _GC of the first optical semiconductor element 3c and extending at an angle of 90° from the line 1L1 in the front direction is a line 3L3. The line 3L3 is a perpendicular line to the baseline B passing through the center of gravity _GC . That is, θ ₁ shown in FIG. 3 is 15°, and θ ₂ is 90°. The distance at which the line 2L2 and the colored layer 42 overlap is D1, and the distance at which the line 3L3 and the colored layer 42 overlap is D2. Further, the front end of the optical semiconductor element 3c is T _A . T _A is the portion of the optical semiconductor element 3c that is located closest to the front side. The midpoint between the center of gravity G _C of the optical semiconductor element 3c and the center of gravity G _D of the optical semiconductor element 3d is C. The distance from the surface of the substrate 2 to T _A is D3, and the thickness of the colored layer 42 at the midpoint C is D4. In the display body 1, D1 and D2 satisfy D1>D2, and D3 and D4 satisfy D3>D4.

In the display body 1, since the sealing resin layer 4 includes the colored layer 42, reflection of light from metal wiring provided on the substrate 2 can be prevented. Since D1 and D2 satisfy D1>D2, the transmittance of light in the front direction is higher than the transmittance of light in the 75° diagonal direction on the adjacent pixel side, which is emitted by the optical semiconductor element 3c. Furthermore, by satisfying D3>D4, D3 and D4 suppress interference between the lights emitted by the optical semiconductor elements 3c and 3d, while appropriately transmitting the light emitted from the optical semiconductor element 3c in the front oblique direction. This increases front brightness. For this reason, the light emitted by the optical semiconductor element has excellent transmittance in the front direction and low transmittance in the side direction, and the display body is less likely to undergo color shift and has high front brightness.

In addition, in FIG. 3, the case where the optical semiconductor element 3c at the edge of the pixel satisfies the above formulas (1) and (2) has been explained, but together with or instead of the optical semiconductor element 3c, the optical semiconductor element 3c at the edge of the adjacent pixel The located optical semiconductor element 3d may satisfy the above formulas (1) and (2).

Specifically, as shown in FIG. 4, the transmittance of the front light F _A emitted by the optical semiconductor element 3c and the front light F _B emitted by the optical semiconductor element 3d is excellent, and the front brightness is high. On the other hand, the transmission of rightward light R _A and leftward light L _A emitted by the optical semiconductor element 3c, as well as rightward light R _B and leftward light L _B emitted by the optical semiconductor element 3d, is colored. Being obstructed by the layer 42 makes it difficult for the light emitted by the optical semiconductor elements 3c and 3d in adjacent pixels to interfere with each other, and color shift is suppressed.

On the other hand, FIG. 5 shows an embodiment of a conventional display body. In the display shown in FIG. 5, the thickness of the colored layer 42 between the optical semiconductor elements 3c and 3d is higher than the height of the optical semiconductor element 3c, and D3<D4. The light R _A to the right and the light LA to the left emitted by the optical semiconductor element 3c, and the light R _B to the right and the light L _B to the _left emitted by the optical semiconductor element 3d are transmitted through the colored layer 42. Since the light emitted by the optical semiconductor elements 3c and 3d in adjacent pixels interfere with each other, a color shift is likely to occur. In addition, the light emitted by the optical semiconductor elements 3c and 3d in an oblique front direction is difficult to pass through the colored layer 42, and the front brightness is likely to be insufficient. Note that in the embodiment shown in FIG. 5, when the thickness of the colored layer 42 is increased, the amount of light F _A and F _B emitted by the optical semiconductor elements 3c and 3d decreases. Furthermore, when the thickness of the colored layer 42 is made thinner, the transmittance of light in the diagonal front direction increases, making color shift more likely to occur. In contrast, the display body of the present invention can provide excellent front brightness, prevention of color shift, and antireflection ability.

As described above, in the display body of the present invention, D1 and D2 satisfy D1>D2, and D3 and D4 satisfy D3>D4, so that the light emitted by the optical semiconductor element has excellent transparency in the front direction, and Transmittance in the side direction is kept low, color shift is less likely to occur, and front brightness is high.

The center of gravity of the optical semiconductor element is determined by the three-dimensional shape of the optical semiconductor element. The three-dimensional shape of the optical semiconductor element is not particularly limited, and examples include prismatic shapes such as cubes and rectangular parallelepipeds, truncated pyramids, cylinders, truncated cones, and shapes with dome-shaped upper portions. When the three-dimensional shape of the optical semiconductor element is a regular prism, the center of gravity is the center of the optical semiconductor element.

Note that the display body 1 does not need to include the base material portion 5. Furthermore, the number of optical semiconductor elements within one pixel does not have to be three and is not particularly limited.

Another embodiment of the display of the present invention is shown in FIG. The display 1 shown in FIG. 6 is the same as the display 1 shown in FIG. 2 except that it does not include the non-colored layer 41. Specifically, in the display body 1 shown in FIG. 6, the sealing resin layer 4 is constructed by directly laminating a colored layer 42 and a non-colored layer 43 in this order from the optical semiconductor elements 3b to 3e side. The optical semiconductor elements 3b to 3e are sealed such that the colored layer 42 side faces the optical semiconductor elements 3b to 3e. The colored layer 42 in contact with the optical semiconductor elements 3b to 3e follows the uneven shape described above, and one surface of the non-colored layer 43 follows the uneven shape of the colored layer 42, so that the uneven shape of the colored layer 42 is different from that of the colored layer 42. It has an opposite uneven shape, and the other surface is flat. The display body 1 shown in FIG. 6 satisfies the above formulas (1) and (2). Note that the non-colored layer 43 may be a diffusion functional layer, which will be described later, or a non-diffusion functional layer. In this manner, the display of the present invention does not need to include a non-colored layer closer to the optical semiconductor element than the colored layer.

Still another embodiment of the display body of the present invention is shown in FIG. The display 1 shown in FIG. 7 is similar to the display 1 shown in FIG. 2 except that the front side interface of the colored layer 42 is flat. Specifically, in the display body 1 shown in FIG. 7, the sealing resin layer 4 is formed by directly laminating a non-colored layer 41, a colored layer 42, and a non-colored layer 43 in this order from the optical semiconductor elements 3b to 3e side. The optical semiconductor elements 3b to 3e are sealed such that the non-colored layer 41 side faces the optical semiconductor elements 3b to 3e. The non-colored layer 41 in contact with the optical semiconductor elements 3b to 3e follows the above-mentioned uneven shape, and the colored layer 42 in the display body 1 also has an uneven shape. On the other hand, one surface of the colored layer 42 has an uneven shape that is opposite to the uneven shape of the non-colored layer 41 by following the uneven shape of the non-colored layer 41, and the other surface is flat. There is. Both sides of the non-colored layer 43 are flat. The display body 1 shown in FIG. 7 satisfies the above formulas (1) and (2). Note that the non-colored layer 41 and the non-colored layer 43 may each independently be a diffusion functional layer, which will be described later, or a non-diffusion functional layer.

In the vertical cross section, D3 is longer than the distance from the substrate surface to the substrate-side interface of the colored layer in a perpendicular line to the substrate surface passing through the midpoints of the first optical semiconductor element and the second optical semiconductor element. Preferably long. In this case, the substrate-side interface of the colored layer is likely to be located close to the substrate on the side of the optical semiconductor element, and the light emitted from the optical semiconductor element in the side direction is absorbed by the colored layer, suppressing the transmittance and causing color shift. is less likely to occur. In the display body 1 shown in FIGS. 2, 6, and 7, a line perpendicular to the substrate surface passing through the midpoints of the first optical semiconductor element and the second optical semiconductor element extends from the substrate surface to the substrate side interface of the colored layer. longer than the distance.

In the vertical cross section, D3 is longer than the distance from the substrate surface to the front interface of the colored layer in a perpendicular to the substrate surface passing through the midpoints of the first optical semiconductor element and the second optical semiconductor element. Preferably long. In this case, the light emitted from the optical semiconductor element in the side direction is absorbed by the colored layer, the transmittance is kept low, and color shift is less likely to occur. In the display body 1 shown in FIGS. 2 and 6, the distance from the substrate surface to the front interface of the colored layer in a perpendicular line to the substrate surface passing through the midpoint of the first optical semiconductor element and the second optical semiconductor element. longer than

The cross-sectional views of the display body shown in FIGS. 2 to 7 are obtained by, for example, cutting the display body in a cooled state perpendicularly to the substrate surface so as to pass through the center of gravity of a plurality of optical semiconductor elements to expose the cross section. You can get it. By cooling the display, it is possible to prevent the sealing resin layer from melting or deforming due to the heat generated during cutting. The cutting can be performed using a known or commonly used cutting device such as laser beam irradiation or ion beam irradiation. Further, after cutting, the exposed cross section may be milled to expose a cross section with a lower degree of deformation. The temperature during cooling is appropriately set within a range that suppresses the degree of deformation of the sealing resin layer and cracking of the display body.

<Sealing resin layer>
The sealing resin layer includes at least the colored layer and the non-colored layer. Each layer (the colored layer and the non-colored layer) constituting the sealing resin layer may be a single layer in the sealing resin layer, or may be a multilayer having the same or different compositions. Good too. When multiple colored layers and non-colored layers are included, the multiple layers may be laminated in contact with each other, or they may be laminated separately (for example, two colored layers are laminated with one non-colored layer interposed therebetween). You can leave it there. When the sealing resin layer includes one or more colored layers and non-colored layers, the combination of at least one colored layer and non-colored layer includes the colored layer and the non-colored layer in this order from the optical semiconductor element side. , and for these colored layers and non-colored layers, D1>D2 and D3>D4 may be satisfied. Further, the total number of layers constituting the sealing resin layer is two or more including the colored layer and the non-colored layer, and may be three or more. The total number of the layers is, for example, 10 or less, and may be 5 or less, or 4 or less, from the viewpoint of reducing the thickness of the display body.

Preferably, the sealing resin layer includes a diffusion functional layer. With such a configuration, the light emitted by the optical semiconductor element can be diffused in the diffusion function layer, and the front brightness can be further increased. It is preferable that the above-mentioned diffusion functional layer corresponds to a non-colored layer in this specification. In FIG. 2, the non-colored layer 41 is preferably a diffusion functional layer. In FIGS. 2, 6, and 7, the non-colored layer 43 may be a diffusion functional layer or a non-diffusion functional layer.

When the sealing resin layer includes the diffusion functional layer, the sealing resin layer preferably includes the diffusion functional layer, the colored layer, and the non-colored layer in this order from the optical semiconductor element side. The non-colored layer may be either a diffusion functional layer or a non-diffusion functional layer. By having such a configuration, it is possible to further improve the appearance of the display body both when the lights are off and when the lights are on, while increasing the front brightness. 2 and 7, the sealing resin layer 4 includes a non-colored layer 41, a colored layer 42, and a non-colored layer 43, which are diffusion functional layers, in this order from the optical semiconductor element side. The non-colored layer 43 may be a diffusion functional layer or a non-diffusion functional layer.

In the display of the present invention, it is preferable that at least one surface (particularly the surface facing the optical semiconductor element) of the colored layer has an uneven shape that follows the above-mentioned uneven shape. In this case, the display of the present invention easily satisfies the above formulas (1) and (2). Further, the colored layer may have a front surface having an uneven shape that follows the above uneven shape. In the display body 1 shown in FIGS. 2 and 6, the colored layer 42 has an uneven shape on both sides of the front side and the optical semiconductor element side. In the display 1 shown in FIG. 7, the colored layer 42 has an uneven shape on the front side.

In the display of the present invention, it is preferable that the non-colored layer located on the front side of the colored layer has a flat surface on the front side. In this case, diffuse reflection of external light is less likely to occur on the surface of the sealing resin layer, and the appearance of the display body is improved both when the lights are off and when the lights are on. In the display body 1 shown in FIGS. 2, 6, and 7, the front side of the non-colored layer 43 is flat.

In the display of the present invention, the non-colored layer may be provided closer to the optical semiconductor element than the colored layer. That is, the sealing resin layer may include the non-colored layer and the colored layer in this order from the optical semiconductor element side. Further, when the non-colored layer is provided closer to the optical semiconductor element than the colored layer, it is preferable that both surfaces of the non-colored layer have an uneven shape that follows the uneven shape. With such a configuration, the colored layer tends to have an uneven shape. In the display body 1 shown in FIGS. 2 and 7, the sealing resin layer 4 includes a non-colored layer 41 and a colored layer 42 in this order from the optical semiconductor elements 3b to 3e side, and the non-colored layer 41 has the above-mentioned irregularities on both sides. It has an uneven shape that follows the shape.

The non-colored layer provided closer to the optical semiconductor element than the colored layer is preferably a diffusion functional layer. With such a configuration, the light emitted by the optical semiconductor element in the side direction can be diffused in the diffusion function layer, and the front brightness can be further increased.

Each layer (the colored layer and the non-colored layer) constituting the sealing resin layer may or may not have adhesiveness independently. Among these, it is preferable to have adhesiveness. With such a configuration, the sealing resin layer can easily seal the optical semiconductor element, and also has excellent adhesion between each layer, resulting in more excellent sealing properties of the optical semiconductor element. In particular, it is preferable that at least the layer that contacts the optical semiconductor element has adhesiveness. With such a configuration, the sealing resin layer has excellent followability and embeddability of the optical semiconductor element. As a result, the design is excellent even when the height difference due to the optical semiconductor element is high. Note that the layers other than the layer that contacts the optical semiconductor element do not need to have adhesiveness. In this case, adhesion between adjacent encapsulating resin layers is low in the tiling state, and adjacent small-sized laminates (laminates in which optical semiconductor elements placed on a substrate are encapsulated by encapsulating resin layers) When separating them, damage to the sealing resin layer and adhesion of adjacent sealing resin layers is less likely to occur.

(colored layer)
The colored layer in the display of the present invention is a layer whose purpose is to prevent reflection of light from metal wiring provided on a substrate in the display. The colored layer contains at least a colorant. The colored layer is preferably a resin layer made of resin. The coloring agent may be a dye or a pigment as long as it can be dissolved or dispersed in the colored layer. Dyes are preferred because they can achieve low haze even when added in small amounts, and are easy to distribute uniformly without settling unlike pigments. Pigments are also preferred because they provide high color development even when added in small amounts. If a pigment is used as a coloring agent, it is preferably one with low or no electrical conductivity. The above coloring agents may be used alone or in combination of two or more.

As the colorant, a black colorant is preferable. As the black colorant, known or commonly used colorants (pigments, dyes, etc.) for producing a black color can be used. For example, carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, etc.) can be used. , pine smoke, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (non-magnetic ferrite, magnetic ferrite, etc.), magnetite, chromium oxide, iron oxide, molybdenum disulfide , chromium complexes, anthraquinone colorants, zirconium nitride, etc. Further, a colorant that functions as a black colorant by combining a colorant exhibiting a color other than black may be used.

The content ratio of the colorant in the colored layer is preferably 0.2% by mass or more, more preferably 0.2% by mass or more, based on 100% by mass of the total amount of the colored layer, from the viewpoint of imparting appropriate antireflection ability to the display. .4% by mass or more. Further, the content of the colorant is, for example, 10% by mass or less, preferably 5% by mass or less, and more preferably 3% by mass or less. The content ratio may be appropriately set depending on the type of colorant, the color tone and light transmittance of the display body, and the like. The colorant may be added to the composition as a solution or dispersion dissolved or dispersed in a suitable solvent.

The haze value (initial haze value) of the colored layer is not particularly limited, but from the viewpoint of ensuring front brightness and visibility of the display, it is preferably 50% or less, more preferably 40% or less, still more preferably 30%. It is particularly preferably 20% or less. Further, the haze value of the colored layer is preferably 1% or more, more preferably 3% or more, still more preferably 5% or more, particularly preferably 8% or more, from the viewpoint of efficiently reducing brightness unevenness of the display body. and may be 10% or more. The haze value is the value at the thickest portion of the colored layer in the display.

The total light transmittance of the colored layer is not particularly limited, but from the viewpoint of further improving the antireflection function and contrast of metal wiring in the display, it is preferably 40% or less, more preferably 30% or less, and even more preferably is 25% or less, particularly preferably 20% or less. Further, the total light transmittance of the colored layer is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.5% or more, from the viewpoint of ensuring the brightness of the display body. Particularly preferably, it is 2% or more, and may be 2.5% or more, or 3% or more. The total light transmittance is the value at the thickest portion of the colored layer in the display.

The haze value and total light transmittance of the above-mentioned colored layer are the values of a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1. It can be controlled by the amount etc.

(Non-colored layer)
The above-mentioned non-colored layer is a layer different from the above-mentioned colored layer, and is a layer that is not intended to prevent reflection of light from metal wiring or the like provided on a substrate in a display body. The non-colored layer may be a colorless layer or may be slightly colored. Further, the above-mentioned non-colored layer may be, for example, a diffusion functional layer whose purpose is to exhibit a function of diffusing light, or a non-diffusion functional layer whose purpose is not to exhibit a function of diffusing light. It's okay. The non-colored layer may be transparent or non-transparent. The non-colored layer is preferably a resin layer made of resin.

The content of the colorant in the non-colored layer is preferably less than 0.2% by weight, more preferably less than 0.1% by weight, and even more preferably 0.05% by weight, based on 100% by weight of the total amount of the non-colored layer. %, and may be less than 0.01% by weight or less than 0.005% by weight.

The total light transmittance of the non-colored layer is not particularly limited, but from the viewpoint of ensuring the brightness of the display, it is preferably 40% or more, more preferably 60% or more, still more preferably 70% or more, particularly preferably It is 80% or more. Further, the upper limit of the total light transmittance of the non-colored layer is not particularly limited, but may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest portion of the non-colored layer in the display.

The total light transmittance of the above-mentioned non-colored layer is the value of a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1, and can be controlled by the type and thickness of the non-colored layer. .

The above-mentioned diffusion functional layer is a layer whose purpose is to diffuse light. When the sealing resin layer has the diffusion functional layer, light emitted from the optical semiconductor element is diffused in the diffusion functional layer, and for example, light emitted from the side surface of the optical semiconductor element is emitted toward the front of the display, The front brightness of the display body is improved. The diffusion functional layer is preferably a resin layer made of resin. The above-mentioned diffusion functional layer preferably includes, but is not limited to, light-diffusing fine particles. That is, the above-mentioned diffusion functional layer preferably contains light-diffusing fine particles dispersed in the resin layer. The above-mentioned light-diffusing fine particles may be used alone or in combination of two or more.

The light-diffusing fine particles have an appropriate refractive index difference with the resin constituting the diffusion functional layer, and impart diffusion performance to the diffusion functional layer. Examples of the light-diffusing fine particles include inorganic fine particles and polymer fine particles. Examples of the material for the inorganic fine particles include silica, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxides. Examples of the material of the polymer fine particles include silicone resin, acrylic resin (including polymethacrylate resin such as polymethyl methacrylate), polystyrene resin, polyurethane resin, melamine resin, polyethylene resin, and epoxy resin. .

As the polymer fine particles, fine particles made of silicone resin are preferable. Further, as the inorganic fine particles, fine particles made of metal oxide are preferable. As the metal oxide, titanium oxide and barium titanate are preferable, and titanium oxide is more preferable. By having such a configuration, the light diffusing property of the above-mentioned diffusion functional layer is more excellent, and brightness unevenness is further suppressed.

The shape of the light-diffusing fine particles is not particularly limited, and may be, for example, perfectly spherical, flat, or irregularly shaped.

The average particle diameter of the light-diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, even more preferably 0.2 μm or more, particularly preferably 0. .25 μm or more. Furthermore, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the average particle diameter of the light-diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, and still more preferably 8 μm or less. It is. The average particle diameter can be measured using, for example, a Coulter counter.

The refractive index of the light-diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, even more preferably 1.3 to 4, particularly preferably 1.35 to 3.

The absolute value of the difference in refractive index between the light-diffusing fine particles and the resin constituting the diffusion functional layer (the resin layer excluding the light-diffusing fine particles in the diffusion functional layer) more efficiently reduces uneven brightness of the display. From the viewpoint, it is preferably 0.001 or more, more preferably 0.01 or more, even more preferably 0.02 or more, particularly preferably 0.03 or more, even if it is 0.04 or more, or 0.05 or more. good. Further, the absolute value of the refractive index difference between the light-diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image. More preferably, it is 3 or less.

From the viewpoint of imparting appropriate light diffusion performance to the sealing resin layer, the content of the light diffusing fine particles in the diffusion functional layer is 0.01 parts by mass based on 100 parts by mass of the resin constituting the diffusion functional layer. The amount is preferably at least 0.05 parts by mass, more preferably at least 0.1 parts by mass, particularly preferably at least 0.15 parts by mass. In addition, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the content of the light-diffusing fine particles is 80 parts by mass or less based on 100 parts by mass of the resin constituting the diffusion functional layer. is preferable, and more preferably 70 parts by mass or less.

The haze value (initial haze value) of the diffusion functional layer is not particularly limited, but from the viewpoint of efficiently reducing uneven brightness, it is preferably 30% or more, more preferably 40% or more, even more preferably 50% or more, Particularly preferably, it is 60% or more, and may be 70% or more, 80% or more, 90% or more, 95% or more, 97% or more, and moreover, a value around 99.9% is more excellent in the brightness unevenness improving effect. preferable. Note that the upper limit of the haze value of the diffusion functional layer is not particularly limited, and may be 100%. The haze value is the value at the thickest portion of the diffusion functional layer in the display.

The total light transmittance of the diffusion functional layer is not particularly limited, but from the viewpoint of ensuring brightness, it is preferably 40% or more, more preferably 60% or more, even more preferably 70% or more, particularly preferably 80% or more. It is. Further, the upper limit of the total light transmittance of the diffusion functional layer is not particularly limited, but may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest portion of the diffusion functional layer in the display.

The haze value and total light transmittance of the above-mentioned diffusion functional layer are the values of a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1. It can be controlled by the type and amount of diffusible particles.

The haze value (initial haze value) of the non-diffusion functional layer is not particularly limited, but from the viewpoint of improving the brightness of the display, it is preferably less than 30%, more preferably 10% or less, and even more preferably 5%. % or less, particularly preferably 1% or less, and may be 0.5% or less. Note that the lower limit of the haze value of the non-diffusion functional layer is not particularly limited. The haze value is the value at the thickest portion of the non-diffusion functional layer in the display body.

The total light transmittance of the non-diffusing functional layer is not particularly limited, but from the viewpoint of ensuring the brightness of the display, it is preferably 60% or more, more preferably 70% or more, still more preferably 80% or more, and particularly preferably is 90% or more. Further, the upper limit of the total light transmittance of the non-diffusing functional layer is not particularly limited, but may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest portion of the non-diffusion functional layer in the display.

The haze value and total light transmittance of the above-mentioned non-diffusing functional layer are the values of a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1, and may vary depending on the type and thickness of the non-diffusing functional layer. It can be controlled by etc.

The content of the colorant and/or light-diffusing fine particles in the non-diffusing functional layer is set to 0 parts by mass based on 100 parts by mass of the resin constituting the non-diffusing functional layer, from the viewpoint of improving the brightness of the display. It is preferably less than .01 parts by weight, more preferably less than 0.005 parts by weight.

(resin layer)
When the colored layer and the non-colored layer are the resin layers, examples of the resin constituting the resin layer include known or commonly used resins, such as acrylic resins, urethane acrylate resins, urethane resins, Rubber resin, epoxy resin, epoxy acrylate resin, oxetane resin, silicone resin, silicone acrylic resin, polyester resin, polyether resin (polyvinyl ether, etc.), polyamide resin, fluorine resin, vinyl acetate/ Examples include vinyl chloride copolymers and modified polyolefins. The above resins may be used alone or in combination of two or more. The resins constituting each layer of the sealing resin layer may be the same or different.

When the resin layer is an adhesive layer (adhesive layer), a known or commonly used pressure-sensitive adhesive can be used as the resin. Examples of the above-mentioned adhesives include acrylic adhesives, rubber adhesives (natural rubber-based, synthetic rubber-based, mixtures thereof, etc.), silicone-based adhesives, polyester-based adhesives, urethane-based adhesives, and polyether. Examples include adhesives such as adhesives based on polyamide, polyamide adhesives, and fluorine adhesives. The above adhesives may be used alone or in combination of two or more.

The resin layer may contain other components other than the above-mentioned components as long as the effects of the present invention are not impaired in each layer. Other ingredients listed above include curing agents, crosslinking accelerators, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), oligomers, anti-aging agents, fillers (metal powders, organic fillers, inorganic fillers, etc.), antioxidants, plasticizers, softeners, surfactants, antistatic agents, surface lubricants, leveling agents, light stabilizers, ultraviolet absorbers, polymerization inhibitors, granular materials, foil-like materials, etc. Can be mentioned. The above-mentioned other components may be used alone or in combination of two or more.

The laminated structure of the above sealing resin layer includes [colored layer/diffusion functional layer], [colored layer/non-diffusion functional layer], [colored layer/diffusion functional layer/non-diffusion functional layer], and [colored layer/non-diffusion functional layer]. Functional layer/Diffusion function layer], [Diffusion function layer/Colored layer/Non-diffusion function layer], [Non-diffusion function layer/Colored layer/Diffusion function layer], [Diffusion function layer/Colored layer/Diffusion function layer], [Diffusion function layer/Colored layer/Diffusion function layer] Non-diffusion functional layer/colored layer/non-diffusion functional layer] (in order from the optical semiconductor element side).

<Base material part>
The display body of the present invention may or may not include a base material portion. When the base material part is provided on the front side of the sealing resin layer in the display body, the surface of the sealing resin layer can be made flat, which makes it difficult to cause diffused reflection of light, and when the light is turned off and when the light is emitted. In both cases, the appearance of the display body is improved. Further, by forming an anti-glare layer or an anti-reflection layer, which will be described later, on the base material portion, anti-glare properties and anti-reflection properties can be imparted to the display body. In addition, it serves as a support for a sealing resin layer in a sheet for encapsulating an optical semiconductor element, which will be described later, and by providing the above-mentioned base material portion, the sheet for encapsulating an optical semiconductor element has excellent handling properties.

The base material portion may be a single layer, or may be a multilayer having the same or different compositions, thicknesses, etc. When the base material part is multi-layered, each layer may be bonded together by another layer such as an adhesive layer. Note that the base material layer used for the base material part is a part that is attached to the substrate containing the optical semiconductor element together with the sealing resin layer, and is peeled off when the optical semiconductor element sealing sheet is used (at the time of attachment). A "base material" does not include a release liner or a surface protection film that merely protects the surface of the base material.

Examples of the base layer constituting the base portion include glass and plastic base materials (especially plastic films). Examples of the resin constituting the plastic base material include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, and homopolyprolene. , polybutene, polymethylpentene, ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene- Polyolefin resins such as propylene copolymers, cyclic olefin polymers, ethylene-butene copolymers, and ethylene-hexene copolymers; polyurethanes; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); Polycarbonate; Polyimide resin; Polyetheretherketone; Polyetherimide; Polyamide such as aramid and wholly aromatic polyamide; Polyphenylsulfide; Fluororesin; Polyvinyl chloride; Polyvinylidene chloride; Cellulose resin such as triacetylcellulose (TAC) ; silicone resin; acrylic resin such as polymethyl methacrylate (PMMA); polysulfone; polyarylate; polyvinyl acetate. The above resins may be used alone or in combination of two or more. The base material layer may be various optical films such as an antireflection (AR) film, a polarizing plate, and a retardation plate.

The thickness of the plastic film is preferably 20 to 300 μm, more preferably 40 to 250 μm. When the thickness is 20 μm or more, the supportability and handleability of the sheet for encapsulating an optical semiconductor device are further improved. When the thickness is 300 μm or less, the display body can be made thinner.

The surface of the base material on the side where the sealing resin layer is provided may be subjected to, for example, corona discharge treatment, plasma treatment, sand mat treatment, ozone exposure, etc., for the purpose of improving adhesion and retention with the sealing resin layer. Physical treatments such as treatment, flame exposure treatment, high-voltage electric shock treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; surface treatments such as easy-adhesion treatment using a coating agent (undercoat). . The surface treatment for improving adhesion is preferably applied to the entire surface of the base portion on the side of the sealing resin layer.

The thickness of the base material portion is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of excellent support function and surface scratch resistance. The thickness of the base material portion is preferably 300 μm or less, more preferably 250 μm or less, from the viewpoint of better transparency.

<Display body>
The display body may include a layer having anti-glare and/or anti-reflection properties. By having such a configuration, it is possible to suppress the gloss and light reflection of the display body and improve the appearance. Examples of the layer having anti-glare properties include an anti-glare treated layer. Examples of the layer having antireflection properties include an antireflection treated layer. The anti-glare treatment and the anti-reflection treatment can be carried out using known or commonly used methods. The layer having anti-glare properties and the layer having anti-reflection properties may be the same layer or may be different layers. The layer having anti-glare properties and/or anti-reflection properties may have only one layer, or may have two or more layers.

The haze value (initial haze value) of the sealing resin layer or the laminate having both end faces of the sealing resin layer and the base material part is not particularly limited, but it is effective for suppressing brightness unevenness and for design. From the viewpoint of making it more excellent, it is preferably 80% or more, more preferably 85% or more, still more preferably 90% or more, particularly preferably 95% or more. Note that the upper limit of the haze value is not particularly limited.

The total light transmittance of the sealing resin layer or the laminate having both end faces of the sealing resin layer and the base material part is not particularly limited, but it can further improve the anti-reflection function and contrast of metal wiring etc. From this viewpoint, it is preferably 40% or less, more preferably 30% or less, and even more preferably 20% or less. Further, the total light transmittance is preferably 0.5% or more from the viewpoint of ensuring brightness.

The above haze value and total light transmittance can be measured by the methods specified in JIS K7136 and JIS K7361-1, respectively, and depend on the stacking order, type, and thickness of each layer constituting the sealing resin layer and the base material part. It can be controlled by

The thickness of the encapsulation resin layer or the laminate having both end faces of the encapsulation resin layer and the base material part is determined to improve the anti-reflection function and contrast of metal wiring, while also making color shift more efficient. From the viewpoint of reducing the thickness, it is preferably 10 to 600 μm, more preferably 20 to 550 μm, even more preferably 30 to 500 μm, still more preferably 40 to 450 μm, and particularly preferably 50 to 400 μm. Note that the release liner is not included in the above thickness.

Moreover, it is preferable that the display body of the present invention includes a self-luminous display device. Further, by combining the above self-luminous display device and a display panel as necessary, a display body that is an image display device can be obtained. The optical semiconductor element in this case is an LED element. Examples of the self-luminous display device include an LED display, a backlight, an organic electroluminescence (organic EL) display device, and the like. It is particularly preferable that the backlight is a full-surface direct type backlight. The backlight includes, for example, a laminate including the substrate and a plurality of optical semiconductor elements arranged on the substrate as at least a part of its constituent members. For example, in the self-luminous display device, a metal wiring layer for sending a light emission control signal to each LED element is laminated on the substrate. LED elements that emit light of red (R), green (G), and blue (B) colors are alternately arranged on a substrate with metal wiring layers interposed therebetween. The metal wiring layer is made of metal such as copper, and displays each color by adjusting the degree of light emission of each LED element.

The display of the present invention may be a display that is used by being folded, for example, a foldable image display device (flexible display) (particularly a foldable image display device (foldable display)). Specifically, examples include a display body equipped with a foldable backlight, a display body equipped with a foldable self-luminous display device, and the like.

In the display of the present invention, since the sealing resin layer has excellent followability and embeddability of the optical semiconductor element, the optical semiconductor element may be a mini LED element or a micro LED element.

According to the display of the present invention, color shift due to light emitted by the optical semiconductor element is unlikely to occur, and the brightness is high. Therefore, the display body can be visually recognized with the same color tone from a wide field of view. Further, the display body is bright and has a good appearance without increasing power consumption. Further, according to the display of the present invention, reflection of light by metal wiring on the substrate is suppressed, and the display looks good when the optical semiconductor element is not lit.

[Method for manufacturing display body]
The display body of the present invention can be obtained by bonding a sheet for encapsulating an optical semiconductor element having a resin layer for sealing to a substrate on which an optical semiconductor element is arranged, and sealing the optical semiconductor element with the resin layer for sealing. can be manufactured.

(Sheet for encapsulating optical semiconductor elements)
The optical semiconductor element sealing sheet is a sheet for sealing a plurality of optical semiconductor elements arranged on a substrate. The optical semiconductor element sealing sheet includes at least a sealing resin layer including a colored layer and a non-colored layer. The above-mentioned sheet for encapsulating optical semiconductor elements is provided when a plurality of optical semiconductor elements are sealed with the above-mentioned encapsulating resin layer so that the colored layer side faces the above-mentioned optical semiconductor element side to form a encapsulating resin layer. , is a sheet that can satisfy the above formulas (1) and (2). According to the sheet for encapsulating an optical semiconductor element of the present invention, by sealing an optical semiconductor element, it is possible to provide a display body that is less likely to cause color shift and has high brightness.

The optical semiconductor element sealing sheet includes at least a sealing resin layer including a colored layer and a non-colored layer. The sealing resin layer is a layer that can form the sealing resin layer in the display of the present invention. Specifically, the colored layer in the sealing resin layer is a layer that can form the colored layer in the display of the present invention, and the non-colored layer in the sealing resin layer is a layer that can form the colored layer in the display of the present invention. This is a layer that can form the above-mentioned non-colored layer in a display body. Specifically, the colored layer in the sealing resin layer has a composition (constituent components and their proportions) and physical properties (haze, total light transmittance, etc.) of the colored layer in the display of the present invention. It may be the same layer, or it may be a layer that becomes the colored layer in the display of the present invention upon curing. Furthermore, the non-colored layer in the sealing resin layer has the same composition (constituent components and their blending ratio) and physical properties (haze, total light transmittance, etc.) as the non-colored layer in the display of the present invention. It may be a layer that becomes the above-mentioned non-colored layer in the display of the present invention upon curing.

The sealing resin layer is appropriately designed depending on the structure of the sealing resin layer in the display of the present invention. For example, when the display of the present invention includes the diffusion function layer, the sealing resin layer in the optical semiconductor element sealing sheet includes the diffusion function layer. The diffusion functional layer in the sealing resin layer is a layer having the same composition (constituent components and their blending ratio) and physical properties (haze, total light transmittance, etc.) as the diffusion functional layer in the display of the present invention. Alternatively, it may be a layer that becomes the above-mentioned diffusion functional layer in the display of the present invention upon curing. Further, it is preferable that the sealing resin layer includes the diffusion function layer, the colored layer, and the non-colored layer in this order. Note that the diffusion functional layer is a layer corresponding to one of the colored layer and the non-colored layer.

Each layer (the colored layer and the non-colored layer) constituting the sealing resin layer may or may not have adhesiveness and/or adhesiveness, each independently. Among these, it is preferable to have adhesiveness and/or adhesiveness. With such a configuration, the sealing resin layer can be easily bonded to the substrate and the optical semiconductor element, and has excellent adhesion between each layer, resulting in better sealing performance of the optical semiconductor element. In particular, it is preferable that at least the layer that contacts the optical semiconductor element has adhesiveness and/or adhesiveness. By having such a configuration, the followability and embedding of the optical semiconductor element by the sealing resin layer are excellent. As a result, the design is excellent even when the height difference due to the optical semiconductor element is high.

Each layer constituting the sealing resin layer (the colored layer and the non-colored layer) may be independently a resin layer (radiation curable resin layer) that has the property of being cured by radiation irradiation, It may be a resin layer that does not have the property of being cured by radiation irradiation (radiation non-curable resin layer). Examples of the radiation include electron beams, ultraviolet rays, α rays, β rays, γ rays, and X rays. When the colored layer is a radiation-curable resin layer, the colorant that may be included in the colored layer absorbs visible light and has transparency to light at a wavelength at which the radiation-curable resin layer can be cured. Preferably.

The optical semiconductor element sealing sheet may include the base material portion. When the base material section is provided, the sealing resin layer may be provided on at least one surface of the base material section. The surface of the sealing resin layer that comes into contact with the base material part is the surface opposite to the side where the sealing resin layer contacts the optical semiconductor element. When the optical semiconductor element sealing sheet includes the base material part, the optical semiconductor element sealing sheet is bonded to the optical semiconductor element and the substrate together with the base material part, and the optical semiconductor element sealing sheet is bonded to the optical semiconductor element and the substrate together with the optical semiconductor element sealing sheet, and The base material part becomes a base material part in the display body of the present invention.

Further, the sealing resin layer may be formed on the release-treated surface of the release liner. When the optical semiconductor element sealing sheet is formed on the release liner, the side of the sealing resin layer that contacts the optical semiconductor element is the side that contacts the release liner. When the base material portion is not provided, both surfaces of the sealing resin layer may be the side that contacts the release liner. The release liner is used as a protective material for the optical semiconductor element sealing sheet, and is peeled off when sealing the optical semiconductor element. Note that the base material portion and the release liner do not necessarily need to be provided.

The release liner is an element for covering and protecting the surface of the sheet for encapsulating an optical semiconductor element, and when the sheet for encapsulating an optical semiconductor element is attached to a substrate on which an optical semiconductor element is arranged, the sheet is be stripped from.

Examples of the above-mentioned release liner include polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, plastic films and papers whose surface is coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate release agent. It will be done.

The thickness of the release liner is, for example, 10 to 200 μm, preferably 15 to 150 μm, and more preferably 20 to 100 μm. When the thickness is 10 μm or more, the release liner is less likely to break due to cuts during processing. When the thickness is 200 μm or less, the release liner can be more easily peeled off from the optical semiconductor device sealing sheet during use.

One embodiment of the optical semiconductor element sealing sheet will be described using FIG. 8. FIG. 8 is a cross-sectional view of the optical semiconductor element sealing sheet capable of forming the display shown in FIG. 2. As shown in FIG. 8, the optical semiconductor element sealing sheet 10 can be used for sealing one or more optical semiconductor elements arranged on a substrate, and is a sheet that can be used to seal one or more optical semiconductor elements arranged on a substrate. A sealing resin layer 7 formed on the material portion 5 is provided. The sealing resin layer 7 is formed from a laminate of a non-colored layer 71, a colored layer 72, and a non-colored layer 73. The non-colored layer 71, the colored layer 72, and the non-colored layer 73 have adhesive properties and are directly stacked on each other. A release liner 6 is attached to the surface of the non-colored layer 71 of the sealing resin layer 7, and a base member 5 is attached to the surface of the non-colored layer 73.

(Sealing process)
In the method of manufacturing a display body of the present invention using the above-mentioned sheet for encapsulating an optical semiconductor element, the above-mentioned sheet for encapsulating an optical semiconductor element is laminated to a substrate on which an optical semiconductor element is arranged, and a resin layer for sealing It has a sealing process of sealing the optical semiconductor element. Specifically, in the sealing step, first, the release liner is peeled off from the optical semiconductor element sealing sheet to expose the sealing resin layer. Then, in a laminate (such as an optical member) comprising a substrate and an optical semiconductor element (preferably a plurality of optical semiconductor elements) arranged on the substrate, the optical semiconductor is placed on the substrate surface on which the optical semiconductor element is arranged. The exposed surfaces of the encapsulation resin layers of the element encapsulation sheets are bonded together, and when the laminate includes a plurality of optical semiconductor elements, the encapsulation resin layer further fills the gaps between the plurality of optical semiconductor elements. The plurality of optical semiconductor elements are sealed together. Specifically, as shown in FIG. 9, the non-colored layer 71 of the optical semiconductor element sealing sheet 10 from which the release liner 6 has been peeled off is placed opposite the surface of the substrate 2 on which the optical semiconductor elements 3a to 3f are arranged. The optical semiconductor element sealing sheet 10 is attached to the surface of the substrate 2 on which the optical semiconductor elements 3a to 3f are arranged, and the optical semiconductor elements 3a to 3f are embedded in the sealing resin layer 7.

The temperature during the above bonding is, for example, within the range of room temperature to 110°C. Further, during the above bonding, pressure may be reduced or increased. It is possible to suppress the formation of voids between the sealing resin layer and the substrate or the optical semiconductor element due to reduced pressure or increased pressure. Moreover, in the said sealing process, it is preferable to bond the optical semiconductor element sealing sheet together under reduced pressure, and to apply pressure after that. The pressure for reducing the pressure is, for example, 1 to 100 Pa, and the time for reducing the pressure is, for example, 5 to 600 seconds. Further, the pressure when pressurizing is, for example, 0.05 to 0.5 MPa, and the pressurizing time is, for example, 5 to 600 seconds.

By appropriately setting the thickness of the colored layer and non-colored layer in the above sealing resin layer, the temperature and pressure during bonding, etc., the thickness of the colored layer and non-colored layer in the resulting display body can be adjusted to the optical semiconductor element. It is possible to adjust the followability and the thickness of the colored layer and the thickness of the non-colored layer in each region of the concave and convex portions in the above-mentioned uneven shape. Thereby, the display body obtained can have a form that satisfies the above formulas (1) and (2).

(Radiation irradiation process)
When the sealing resin layer includes a radiation-curable resin layer, the manufacturing method further includes the substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element for sealing the optical semiconductor element. The method may include a radiation irradiation step of irradiating a laminate including an element sealing sheet with radiation to cure the radiation-curable resin layer to form a cured material layer. As mentioned above, examples of the radiation include electron beams, ultraviolet rays, α rays, β rays, γ rays, and X rays. Among these, ultraviolet light is preferred. The temperature during radiation irradiation is, for example, in the range from room temperature to 100° C., and the irradiation time is, for example, 1 minute to 1 hour.

(dicing process)
The manufacturing method further includes a dicing step of dicing a laminate including the substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element. may be provided. The above-mentioned laminate may be formed on a laminate that has undergone the above-mentioned radiation irradiation step. When the laminate includes a cured material layer in which the radiation-curable resin layer is cured by the radiation irradiation, in the dicing step, the cured material layer of the optical semiconductor element sealing sheet and the side edges of the substrate are diced. Remove. Thereby, the surface of the cured material layer, which has been sufficiently cured and whose tackiness has been reduced, can be exposed on the side surface. The above-mentioned dicing can be performed by a known or commonly used method, for example, by using a dicing blade or by laser irradiation.

(Tiling process)
The manufacturing method may further include a tiling step of arranging the plurality of display bodies obtained in the dicing step so as to be in contact with each other in a plane direction. In the tiling step, the plurality of laminates obtained in the dicing step are arranged and tiled so as to be in contact with each other in a planar direction. In this way, one large display can be produced.

The display body of the present invention can be manufactured in the manner described above. When the sealing resin layer 7 in the optical semiconductor element sealing sheet 10 does not have a radiation-curable resin layer, the sealing resin layer 7 becomes the sealing resin layer 4 in the display body 1 . On the other hand, in the optical semiconductor element sealing sheet 10, when the sealing resin layer 7 has a radiation-curable resin layer, for example, when the colored layer 72 and the non-colored layer 73 are radiation-curable resin layers, the colored layer 72 and the non-colored layer 73 are radiation-curable resin layers. By curing the non-colored layer 73, the colored layer 42 and the non-colored layer 43 are formed and become the sealing resin layer 4.

1 Display body 2 Substrate 3a to 3f Optical semiconductor element 31 Support body 3, 3' pixels 4 Sealing resin layer 41 Non-colored layer 42 Colored layer 43 Non-colored layer 5 Base material portion 6 Release liner 7 Sealing resin layer 71 Non-colored Colored layer 72 Colored layer 73 Non-colored layer 10 Optical semiconductor element sealing sheet 11 Optical member

Claims (6)

A display body comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements,
A plurality of the plurality of optical semiconductor elements are arranged for each pixel including a plurality of optical semiconductor elements,
The sealing resin layer has a colored layer and a non-colored layer in this order from the optical semiconductor element side,
The center of gravity of the first optical semiconductor element located at the end of the first pixel, and the second light located at the end of the second pixel adjacent to the first pixel on the side of the first optical semiconductor element. In a cross section perpendicular to the substrate surface passing through the center of gravity of the semiconductor element,
the substrate surface as a baseline,
Line 1 is a straight line that is parallel to the base line and passes through the center of gravity of the first optical semiconductor element.
A straight line passing through the center of gravity of the first optical semiconductor element and extending at an angle of 15° from the line 1 in the front direction is a line 2;
When line 3 is a straight line passing through the center of gravity of the first optical semiconductor element and extending at an angle of 90° from line 1 in the front direction,
The distance D1 where the line 2 and the colored layer overlap, and the distance D2 where the line 3 and the colored layer overlap satisfy the following formula (1),
The distance D3 from the substrate surface to the front end of the first optical semiconductor element, and the coloring at the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element. In the display body, the layer thickness D4 satisfies the following formula (2).
D1>D2 (1)
D3>D4 (2) The display body according to claim 1, wherein the sealing resin layer includes a diffusion functional layer on the optical semiconductor element side of the colored layer. The display body according to any one of claims 1 or 2, comprising a self-luminous display device. The display body according to any one of claims 1 to 3, which is an image display device. A sheet for sealing a plurality of optical semiconductor elements arranged for each pixel including a plurality of optical semiconductor elements on a substrate,
The sheet includes a sealing resin layer including a colored layer and a non-colored layer,
When forming a sealing resin layer by sealing the plurality of optical semiconductor elements with the sealing resin layer so that the colored layer side becomes the optical semiconductor element side,
The center of gravity of the first optical semiconductor element located at the end of the first pixel, and the second light located at the end of the second pixel adjacent to the first pixel on the side of the first optical semiconductor element. In a cross section perpendicular to the substrate surface passing through the center of gravity of the semiconductor element,
the substrate surface as a baseline,
Line 1 is a straight line that is parallel to the base line and passes through the center of gravity of the first optical semiconductor element.
A straight line passing through the center of gravity of the first optical semiconductor element and extending at an angle of 15° from the line 1 in the front direction is a line 2;
When line 3 is a straight line passing through the center of gravity of the first optical semiconductor element and extending at an angle of 90° from line 1 in the front direction,
The distance D1 where the line 2 and the colored layer overlap, and the distance D2 where the line 3 and the colored layer overlap may satisfy the following formula (1),
The distance D3 from the substrate surface to the front end of the first optical semiconductor element, and the coloring at the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element. The thickness D4 of the layer is a sheet for encapsulating an optical semiconductor element that can satisfy the following formula (2).
D1>D2 (1)
D3>D4 (2) The sheet for encapsulating an optical semiconductor element according to claim 5, wherein the encapsulating resin layer includes a diffusion functional layer on the opposite side of the colored layer to the non-colored layer.

Images