KR20230020354A - Optical laminate - Google Patents

Abstract

Provided is an optical laminate which is a laminate used by being laminated on an optical semiconductor device and considers environment. An optical laminate (1) is an optical laminate comprising a surface treatment layer (4), a base part (2), and adhesive layers (3a, 3b) provided on at least one surface of the base part (2) and used by being laminated on an optical semiconductor device (7). When the optical laminate (1) is laminated on the optical semiconductor element (7), the base layer (2) is positioned on a side of the optical semiconductor element (7) with respect to the surface treatment layer (4). The surface treatment layer (4) is a layer that imparts antireflection and/or antiglare properties to the optical laminate (1). The base part (2) has a base layer with biomass of 30 % or greater.

Description

Optical laminate {OPTICAL LAMINATE}

The present invention relates to an optical laminate. More specifically, it relates to an optical laminate used by laminating on an optical semiconductor element.

For example, it is known that a backlight used in a liquid crystal display device has a structure in which a plurality of LEDs are arranged on a substrate and the plurality of LEDs are sealed with a sealing resin. As a method of collectively sealing the plurality of LEDs using the sealing resin, a method of using a sealing sheet having a sealing layer for sealing the LEDs by overlapping an area where the plurality of LEDs are arranged is known ( For example, see Patent Document 1).

International Publication No. 2019/225761

In recent years, the global sustainable development goals "SDGs" have been cited, and as a means of achieving them, the problem-solving process "ESG" ("Environmental", "Social", "Governance") ) is attracting attention. For this reason, in corporate management and growth, consideration from the three viewpoints of environment, society, and governance is required, and ESG has recently been recognized as a corporate social responsibility.

The present invention has been devised based on such circumstances, and its object is to provide an environmentally friendly optical laminate, which is a laminate used by laminating an optical semiconductor element.

As a result of intensive studies to achieve the above object, the present inventors have a specific laminated structure and according to an optical laminate using a substrate layer having a high biomass degree in the substrate portion, it is a laminate used by laminating on an optical semiconductor element. , it was found that an environmentally friendly optical laminate can be obtained. The present invention was completed based on these findings.

That is, the present invention is an optical laminate comprising a surface treatment layer, a substrate portion, and an adhesive layer provided on at least one surface of the substrate portion, and used by laminating on an optical semiconductor element,

When the optical laminate is laminated on the optical semiconductor element, the substrate portion is located on the optical semiconductor element side with respect to the surface treatment layer,

The surface treatment layer is a layer that imparts antireflection and/or antiglare properties to the optical laminate,

The substrate portion provides an optical laminate having a substrate layer having a biomass of 30% or more.

As described above, the optical laminate includes a substrate portion having a substrate layer having a biomass of 30% or more. Thereby, the said optical laminated body can be considered environment-friendly.

The base layer is preferably composed of a polycarbonate-based resin. When the substrate layer is a polycarbonate substrate, the rigidity of the substrate portion is high, and the handleability of the optical laminate is excellent. In addition, it is relatively easy to obtain a substrate layer containing 30% or more of biomass.

The tensile modulus of elasticity of the base layer is preferably 1.5 to 3.5 GPa. When the tensile modulus is 1.5 GPa or more, the substrate layer has an appropriate hardness, and in a state where the optical laminate is bonded to an optical semiconductor element, the shape of the optical semiconductor element is difficult to appear on the surface, and the smoothness of the surface is excellent. When the tensile modulus is 3.5 GPa or less, the substrate layer has appropriate flexibility, and the optical laminate is excellent in followability to irregularities when the optical semiconductor element is convex and the gap between a plurality of optical semiconductor elements is concave. And the embedding of the optical semiconductor element is excellent.

The refractive index of the base layer is preferably 1.43 to 1.55. When the refractive index is within the above range, the difference in refractive index with the other layers constituting the optical layered body tends to be small, and the reflectance at the interface is reduced, so that the visibility of the optical semiconductor device is excellent and color cast is difficult to occur. can do.

Moreover, this invention provides the optical semiconductor device provided with the board|substrate, the optical semiconductor element arrange|positioned on the said board|substrate, and the said optical laminated body laminated|stacked on the said optical semiconductor element. Such an optical semiconductor device can be considered environment-friendly by providing a base material portion having a base material layer having a biomass of 30% or more.

The optical semiconductor device may be a self-luminous display device.

Further, the present invention provides an image display device including the self-emissive display device.

The optical laminate of the present invention can be considered environmentally friendly. For this reason, it can contribute to achievement of SDGs by using the said optical laminated body.

1 is a cross-sectional view showing an embodiment of an optical laminate of the present invention.
FIG. 2 is a sectional view of an optical semiconductor device using the optical laminate shown in FIG. 1 .
Fig. 3 is an external view showing an embodiment of an optical semiconductor device produced by tiling the optical semiconductor device shown in Fig. 2;
Fig. 4 is a cross-sectional view showing a state of a lamination step in an embodiment of a method for manufacturing an optical semiconductor device.
FIG. 5 shows a cross-sectional view of a laminate obtained after the lamination process shown in FIG. 4 .
Fig. 6 shows a cross-sectional view of a laminate obtained by subjecting the laminate shown in Fig. 5 to a curing step.
Fig. 7 is a cross-sectional view showing a dicing position in a dicing process of the laminate shown in Fig. 6;

[Optical laminate]

The optical layered body of the present invention includes at least a surface treatment layer, a substrate portion, and an adhesive layer provided on at least one surface of the substrate portion. The optical laminate of the present invention is used by laminating on an optical semiconductor element.

When the optical layered body is laminated on the optical semiconductor element, the substrate portion is located on the optical semiconductor element side with respect to the surface treatment layer. That is, when the said optical laminated body is laminated|stacked on the said optical semiconductor element, the structure which the surface treatment layer, the base material part, and the optical semiconductor element laminated|stacked in this order is taken.

[Surface treatment layer / base material / pressure-sensitive adhesive layer], [surface treatment layer / pressure-sensitive adhesive layer / base material], [surface treatment layer / pressure-sensitive adhesive layer/base material/pressure-sensitive adhesive layer] and the like. The optical laminate preferably has a structure in which the surface treatment layer, the base material portion, and the pressure-sensitive adhesive layer are laminated in this order.

The optical layered body of the present invention may include a release liner in addition to the surface treatment layer, the base material portion, and the pressure-sensitive adhesive layer. A release liner is used as a protective material for the optical laminate, and is peeled off during use of the optical laminate. The said peeling liner is used by being bonded to the adhesive layer located on the surface of the said optical laminated body, for example, and it peels at the time of use of an optical laminated body. In addition, the peeling liner does not necessarily need to be provided.

Moreover, the optical layered body of this invention may equip the surface (for example, the surface of the said surface treatment layer) of the said optical layered body with the surface protection film. The surface of the optical laminate (for example, the surface of the surface treatment layer) may be protected until use. In addition, a surface protection film does not necessarily need to be provided.

Hereinafter, one embodiment of the optical laminate of the present invention will be described. 1 is a cross-sectional view showing an embodiment of an optical laminate of the present invention. As shown in FIG. 1, the optical layered body 1 can be used by laminating one or more optical semiconductor elements disposed on a substrate, and includes a substrate portion 2, an adhesive layer 3, and a surface treatment layer. (4) and a release liner (5). The pressure-sensitive adhesive layer 3 is composed of one pressure-sensitive adhesive layer 3a and the other pressure-sensitive adhesive layer 3b provided on both surfaces of the substrate portion 2 . One pressure-sensitive adhesive layer (the pressure-sensitive adhesive layer on the side laminated on the optical semiconductor element) 3a is composed of a first pressure-sensitive adhesive layer 31 and a second pressure-sensitive adhesive layer 32 . The other pressure-sensitive adhesive layer 3b is for bonding the substrate portion 2 and the surface treatment layer 4, and is composed of the third pressure-sensitive adhesive layer 33. The surface treatment layer 4 is provided on the other surface of the substrate portion 2 and is provided on the surface of the optical laminate 1 . The peeling liner 5 is affixed to the surface of the pressure-sensitive adhesive layer 3, specifically, the second pressure-sensitive adhesive layer 32 (the surface on the opposite side to the side having the substrate portion 2). In other words, the optical layered body 1 includes the surface treatment layer 4, one pressure-sensitive adhesive layer 3a, the base material portion 2, the other pressure-sensitive adhesive layer 3b, and the release liner 5 in this order. provide

(Ministry of Finance)

The base member serves as a support in the optical layered body, and by including the base member, the optical layered body is excellent in handleability. In addition, the base material layer used for the base material part is a part to be affixed to the substrate provided with the optical semiconductor element together with the pressure-sensitive adhesive layer when laminating the optical laminate on the optical semiconductor element, and at the time of use of the optical laminate (at the time of sticking) A peeling liner that peels off and a surface protection film that only protects the surface of the substrate portion are not included in the "substrate portion".

The said base material part has at least the base material layer whose biomass is also 30% or more. In addition, in this specification, the base material layer whose biomass is also 30% or more may be called a "biomass base material layer." The base material portion may be a single layer or may be a multi-layer structure having the same or different composition or thickness. In the case where the substrate portion is composed of a plurality of substrate layers, the plurality of substrate layers may be composed of only a biomass substrate layer, or may be composed of a biomass substrate layer and other substrate layers.

The said optical layered body can be considered environment-friendly by having a biomass base material layer as a base material part. The degree of biomass of the biomass substrate layer is calculated as a mass ratio of components derived from biomass to the total amount (100% by mass) of resin components constituting the biomass substrate layer.

The tensile modulus of elasticity of the biomass base layer is preferably 1.5 to 3.5 GPa, and more preferably 2 to 3.3 GPa. When the tensile modulus is 1.5 GPa or more, the biomass substrate layer has an appropriate hardness, and in a state in which the optical laminate is bonded to the optical semiconductor element, the shape of the optical semiconductor element is difficult to appear on the surface, and the smoothness of the surface is excellent. do. If the tensile modulus is 3.5 GPa or less, the substrate layer has appropriate flexibility, and the optical laminate is excellent in followability to unevenness when an optical semiconductor element is a convex portion and a gap between a plurality of optical semiconductor elements is a concave portion. And the embedding of the optical semiconductor element is excellent.

The refractive index of the biomass substrate layer is preferably 1.43 to 1.55, more preferably 1.48 to 1.53. When the refractive index is within the above range, the difference in refractive index with other layers constituting the optical laminate (for example, substrate layers other than the biomass substrate layer constituting the substrate portion, the pressure-sensitive adhesive layer, etc.) tends to decrease. There is, and the reflectance at the interface is reduced, and the visibility of the optical semiconductor device is excellent, and color cast can be made difficult to occur.

The phase difference of the biomass substrate layer is preferably 20 nm or less, more preferably 15 nm or less, still more preferably 10 nm or less. When a substrate layer having a large phase difference is used, when light polarized by multiple reflection passes through, a rainbow-like nonuniformity tends to be visually recognized. On the other hand, when the phase difference is 20 nm or less (particularly 10 nm or less), even when polarized light passes through, occurrence of rainbow-like non-uniformity is suppressed, and visibility when applied to an image display device is excellent.

The frontal reflectance of the biomass substrate layer is preferably 5% or less, more preferably 4.8% or less, still more preferably 4.5% or less. If the frontal reflectance is 5% or less, color cast is unlikely to occur when the optical laminate is applied to an image display device, the image quality is stable even when the screen is viewed from any direction, and the image display device with improved visibility can be provided.

The breaking elongation of the biomass substrate layer is preferably 2% or more, more preferably 2.5% or more, still more preferably 3% or more. When the elongation at break is 2% or more, the optical layered body has excellent conformability to irregularities formed by optical semiconductor elements, and excellent embedding of optical semiconductor elements. The elongation at break is, for example, 100% or less.

Examples of the substrate layers constituting the substrate portion (the biomass substrate layer and the other substrate layers) include glass and plastic substrates (particularly, plastic films). Examples of the resin constituting the plastic substrate include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, homopolyprolene, polybutene, and polypropylene. Methylpentene, ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cyclic olefin polymer , polyolefin resins such as ethylene-butene copolymers and ethylene-hexene copolymers; Polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); polycarbonate-based resins; polyimide-based resin; polyether ether ketone; polyetherimide; polyamides such as aramid and wholly aromatic polyamide; polyphenylsulfide; fluororesin; polyvinyl chloride; polyvinylidene chloride; cellulosic resins such as triacetyl cellulose (TAC); silicone resin; acrylic resins such as polymethyl methacrylate (PMMA); polysulfone; polyarylate; Polyvinyl acetate etc. are mentioned. As for the said resin, only 1 type may be used and 2 or more types may be used.

The biomass substrate layer is preferably a layer composed of a polycarbonate-based resin, that is, a polycarbonate substrate. When the biomass substrate layer is a polycarbonate substrate, the rigidity of the substrate portion is high, and the handleability of the optical laminate is more excellent. In addition, it is relatively easy to obtain a substrate layer containing 30% or more of biomass.

Examples of the polycarbonate-based resin obtained by a phosgene method in which a dihydroxy compound and phosgene are reacted or a transesterification method in which a dihydroxy compound and a carbonic acid ester such as diphenyl carbonate are reacted are reacted. As for the said polycarbonate-type resin, only 1 type may be used, and 2 or more types may be used.

As said dihydroxy compound, the well-known or usual thing used as the dihydroxy compound which comprises polycarbonate-type resin is mentioned. When the biomass substrate layer is a polycarbonate substrate, the polycarbonate-based resin constituting the polycarbonate substrate has an isosorbide-derived structural unit as the dihydroxy compound-derived structural unit. it is desirable Since isosorbide can be produced using plant-derived sorbitol, a polycarbonate-based resin having a high biomass degree can be easily produced. In addition, UV resistance is excellent compared to the case of a normal polycarbonate-based resin using a dihydroxydiaryl compound. In addition, since it tends to be amorphous, it is superior in concavo-convex followability compared to crystalline resins such as PET.

As said dihydroxy compound, you may contain other dihydroxy compounds other than isosorbide. As said other dihydroxy compound, the dihydroxy compound which has a cyclic skeleton, such as a dihydroxydiaryl compound and a dihydroxy alicyclic hydrocarbon compound, is mentioned, for example.

As said other dihydroxy compound, a dihydroxy alicyclic hydrocarbon compound is preferable especially, and tricyclo [5.2.1.0 ^2,6 ] decane dimethanol is more preferable.

The thickness of the biomass substrate layer is preferably 5 to 300 μm, more preferably 20 to 150 μm. When the said thickness is 5 micrometers or more, the supportability and handleability of an optical laminated body improve more. If the said thickness is 300 micrometers or less, the thickness of an optical half layered body can be made thin, and an optical semiconductor device can be made thinner.

The surface of the substrate portion on the side provided with the pressure-sensitive adhesive layer is subjected to, for example, corona discharge treatment, plasma treatment, sand mat treatment, ozone exposure treatment, and flame exposure for the purpose of enhancing adhesion to the pressure-sensitive adhesive layer, retention, and the like. physical treatment such as treatment, high-voltage electric shock exposure treatment, ionizing radiation treatment; chemical treatment such as chromic acid treatment; Surface treatment such as adhesion facilitating treatment by a coating agent (undercoat agent) may be performed. It is preferable that the surface treatment for improving adhesiveness is given to the whole surface of the adhesive layer side in a base material part.

The thickness of the substrate portion is preferably 5 μm or more, and more preferably 10 μm or more, from the viewpoint of functioning as a support and excellent surface scratch resistance. The thickness of the substrate portion is preferably 300 μm or less, more preferably 200 μm or less, from the viewpoint of more excellent transparency.

(Adhesive layer)

The pressure-sensitive adhesive layer is provided on at least one surface of the substrate portion. When the pressure-sensitive adhesive layer is provided on both surfaces of the substrate portion, the pressure-sensitive adhesive layers on both surfaces may be the same or may be pressure-sensitive adhesive layers having different compositions, thicknesses, and the like. Further, the pressure-sensitive adhesive layer provided on at least one surface of the substrate portion may be a single layer or a multi-layer structure having different compositions, thicknesses, and the like.

It is preferable to equip the said adhesive layer with respect to the said base material part at least on the optical-semiconductor element and laminated|stacked side (namely, the side opposite to the side provided with the surface treatment layer). By having such a structure, it can bond to an optical semiconductor element using the said adhesive layer. Moreover, an optical semiconductor element can be sealed with the said adhesive layer by directly bonding the said adhesive layer to an optical semiconductor element.

Moreover, you may equip the said adhesive layer with respect to the said base material part on the side provided with the said surface treatment layer (namely, the side opposite to the side laminated|stacked with an optical semiconductor element). When the surface treatment layer is a surface treatment laminate described later, the substrate portion and the surface treatment laminate may be bonded via the pressure-sensitive adhesive layer.

Examples of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer include, but are not particularly limited to, acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives (natural rubber, synthetic rubber, mixtures thereof, etc.), silicone-based pressure-sensitive adhesives, polyester-based pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, and polyether-based pressure-sensitive adhesives. adhesives, polyamide-based adhesives, fluorine-based adhesives, and the like. Among them, as the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer, an acrylic pressure-sensitive adhesive is preferable from the viewpoint of excellent transparency, adhesion, weather resistance, cost, and ease of design of the pressure-sensitive adhesive. The pressure-sensitive adhesive layer is preferably an acrylic pressure-sensitive adhesive layer composed of an acrylic pressure-sensitive adhesive. The said adhesive may use only 1 type, and may use 2 or more types.

When the pressure-sensitive adhesive layer is composed of a multilayer on the surface of the substrate portion on the side on which the optical laminate is laminated, the pressure-sensitive adhesive layer includes a pressure-sensitive adhesive layer having curability (curable pressure-sensitive adhesive layer) and a pressure-sensitive adhesive layer having no curability (non-curable pressure-sensitive adhesive layer). It is preferable to have an adhesive layer). Examples of the curable pressure-sensitive adhesive layer include a pressure-sensitive adhesive layer having a property to be cured by irradiation with radiation (radiation-curable pressure-sensitive adhesive layer) and a pressure-sensitive adhesive layer having a property to be cured by heat (thermosetting pressure-sensitive adhesive layer). Examples of the radiation include active energy rays such as electron beams, ultraviolet rays, α rays, β rays, γ rays, and X rays. Especially, ultraviolet rays are preferable.

The non-curing pressure-sensitive adhesive layer is preferably located on the surface of the optical laminate on the optical semiconductor element side (when a release liner is provided, the surface of the laminate excluding the release liner) when laminated on the optical laminate. For example, in the optical laminate 1 shown in FIG. 1, the pressure-sensitive adhesive layer 3a is composed of a first pressure-sensitive adhesive layer 31 that is a curable pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer 32 that is a non-curable pressure-sensitive adhesive layer. . The second pressure-sensitive adhesive layer 32 is located on the surface of the optical laminate 1 opposite to the surface treatment layer 4 except for the release liner 5 .

When the non-curable pressure-sensitive adhesive layer is located on the surface, the optical layered body is used as a sheet for encapsulating optical semiconductor elements described later, and when the sheet for encapsulating optical semiconductor elements seals optical semiconductor elements, the non-curable pressure-sensitive adhesive layer The adhesion to the optical semiconductor element and the substrate is excellent, and the sealing property of the optical semiconductor element is excellent. After sealing, the curable pressure-sensitive adhesive layer is cured by irradiation with radiation or the like, and the adhesiveness of the side surface of the sheet for sealing is reduced. As a result, adhesion between the pressure-sensitive adhesive layers in adjacent optical semiconductor devices in a tiling state is low, and when separating adjacent optical semiconductor devices, sheet defect or adhesion of adjacent optical semiconductor device sheets is difficult to occur. Moreover, when dicing after laminating|stacking an optical laminated body on an optical semiconductor element and producing an optical semiconductor device, stickiness of a dicing part can be suppressed, and an optical semiconductor device with good image quality can be produced.

The pressure-sensitive adhesive layer may include a layer containing a coloring agent. With such a structure, when the optical semiconductor device is tiled and applied to a display, when the optical semiconductor device is used, color mixing of light emitted by each optical semiconductor element is suppressed, contrast is improved, and the optical semiconductor device is incompatible. When in use, reflection by metal wiring or the like can be prevented to improve the image quality of the display. The layer containing the said coloring agent may have only one layer, and may have two or more layers. For example, the layer containing the coloring agent may be any of the curable pressure-sensitive adhesive layer and the non-curable pressure-sensitive adhesive layer, or may be both.

As the coloring agent, a black colorant is preferable. As the black colorant, known or commonly used colorants (pigments, dyes, etc.) for exhibiting black color can be used. As for the black colorant, only 1 type may be used, and 2 or more types may be used. In addition, a colorant that functions as a black colorant by combining a colorant exhibiting a color other than black may be used.

The thickness of the pressure-sensitive adhesive layer (total thickness of the pressure-sensitive adhesive layer on one side of the substrate portion) is preferably 20 to 800 μm, more preferably 30 to 700 μm, still more preferably 50 to 600 μm. When the said thickness is 20 micrometers or more, the adhesiveness of a base material part and an adherend is more excellent. If the said thickness is 800 micrometers or less, the thickness of an adhesive layer can be made thin, and an optical semiconductor device can be made thinner.

The refractive index of the pressure-sensitive adhesive layer (each layer) is preferably 1.40 to 1.55, more preferably 1.43 to 1.53. When the refractive index is within the above range, the difference in refractive index with other layers constituting the optical laminate (for example, other layers constituting the substrate portion such as the biomass substrate layer) tends to decrease, and at the interface The reflectance can be reduced, the visibility of the optical semiconductor device is excellent, and color cast can be made difficult to occur. In addition, the refractive index of the said adhesive layer is a value in the use state of an optical laminated body, and when the said adhesive layer contains a curable adhesive layer, it is a value in the state in which the curable adhesive layer was hardened.

The refractive index of the pressure-sensitive adhesive layer can be adjusted by the type or composition of resin components such as a base polymer or the content of additives such as fillers. However, when adjusting with an additive such as a filler, even if the refractive index can be adjusted, other optical properties (for example, haze) may be affected in some cases, and the optical application is a laminate, and overall adjustment becomes very complicated. There are cases. On the other hand, when adjusting the type or composition of the resin component, means for selecting a combination of monomer components constituting the resin can be cited. As the monomer component, when a component having a conjugated ring is used, the refractive index tends to be high, and silicon or fluorine components tend to have a low refractive index. For example, as a method of increasing the refractive index, a method of copolymerizing a monomer component containing an aromatic ring and having a relatively high refractive index, or conversely, as a method of reducing the refractive index, a component containing a fluorine-containing monomer and having a relatively low refractive index It is possible to adjust by copolymerizing. In this case, compared to the case of adjustment with additives such as fillers, the influence on other optical properties (haze, etc.) is relatively small, and overall adjustment is not difficult in some cases as a laminate for optical use.

(surface treatment layer)

The surface treatment layer is a layer that imparts antireflection properties and/or antiglare properties to the optical laminate. The surface treatment layer is provided on the side opposite to the optical semiconductor element with respect to the substrate portion when the optical laminate is laminated on the optical semiconductor element. By providing the said surface treatment layer, when the said optical semiconductor device is applied to a display, the gloss of a display and reflection of light can be suppressed, and the image quality of a display can be improved. As the layer imparting the antiglare properties, an antiglare treatment layer may be mentioned. As the layer imparting the antireflection property, an antireflection treatment layer is exemplified. When the surface treatment layer is a layer imparting antireflection and antiglare properties, the antiglare treatment layer and the antireflection treatment layer may be a single layer or may be different layers.

The surface treatment layer is an antiglare treatment layer and/or an antireflection treatment layer, and the layer may be a layer provided on the surface of at least one of the layers constituting the optical laminate, such as the substrate portion and the pressure-sensitive adhesive layer. Such a surface treatment layer is formed by subjecting an antiglare treatment and/or an antireflection treatment to the surface of the layer constituting the optical laminate (for example, the surface of the biomass substrate layer). Antiglare treatment and antireflection treatment can be carried out by known or common methods, respectively.

The surface treatment layer is preferably a surface treatment laminate comprising an optical film and an antiglare treatment layer and/or an antireflection treatment layer provided on one surface of the optical film. Optical films such as polarizing plates generally tend to have poor supportability or handling properties, and advantages of both can be utilized by using in combination with the biomass substrate layer. In addition, by using the surface treatment laminate, the optical laminate can be applied to an optical member as it is. Examples of the optical film or surface-treated laminate include an antireflection (AR) film, a polarizing plate, and a retardation plate.

The refractive index of the surface treatment layer is preferably 1.40 to 1.55, more preferably 1.43 to 1.53. When the refractive index is within the above range, the difference in refractive index with other layers constituting the optical laminate (for example, other layers constituting the substrate portion such as the biomass substrate layer) tends to decrease, and at the interface The reflectance can be reduced, the visibility of the optical semiconductor device is excellent, and color cast can be made difficult to occur. In addition, when the surface treatment layer is a surface treatment laminate comprising an optical film, the refractive index of the surface treatment laminate is used as the refractive index of the surface treatment layer.

In the optical laminate 1 shown in FIG. 1, the surface treatment layer 4 is composed of an optical film 41 and an antiglare/antireflection treatment layer 42 provided on the surface of the optical film 41. It is a surface-treated laminate. The optical film 41 in the surface treatment layer 4 and the substrate portion 2 are bonded together via the third pressure sensitive adhesive layer 33 .

(release liner)

The release liner is an element for covering and protecting the surface of the pressure-sensitive adhesive layer located on the optical semiconductor element side of the base material when laminating the optical laminate on the optical semiconductor element, and is an optical semiconductor on a substrate on which an optical semiconductor element is disposed. When bonding an element, it peels from the said laminated body.

Examples of the release liner include polyethylene terephthalate (PET) films, polyethylene films, polypropylene films, plastic films and papers surface-coated with release agents such as fluorine-based release agents and long-chain alkyl acrylate-based release agents.

The release liner has a thickness of, for example, 10 to 200 μm, preferably 15 to 150 μm, and more preferably 20 to 100 μm. When the thickness is 10 μm or more, it is difficult to break by incision during processing of the release liner. When the thickness is 200 µm or less, the release liner is more easily peeled off from the pressure-sensitive adhesive layer during use.

(optical laminate)

In the optical laminate, the refractive index difference between the biomass base layer and the layer adjacent to the biomass base layer is preferably 0.05 or less, more preferably 0.04 or less, still more preferably 0.03 or less. When the refractive index difference is 0.05 or less, when the optical laminate is applied to an image display device, interlayer reflection between the biomass base layer and the layer adjacent to the biomass base layer is reduced, and as a result, the reflectance between the layers is reduced. By this reduction, the light extraction efficiency of the optical semiconductor element is excellent, and color cast can be suppressed. In addition, it is preferable that the difference in refractive index between at least one of the two layers adjacent to the biomass base layer and the biomass base layer is within the above range, and it is particularly preferable that the difference in refractive index between both layers and the biomass base layer is within the above range. do. In addition, the refractive index of the said adjacent layer is a value in the use state of an optical laminated body, and when the said adjacent layer is a layer (curable layer) which has curability, such as a curable adhesive layer, the said curable layer is hardened state is the value in

The difference in refractive index between the biomass substrate layer and at least one other layer included in the optical laminate is preferably 0.05 or less, more preferably 0.04 or less, still more preferably 0.03 or less. When the refractive index difference is 0.05 or less, when the optical laminate is applied to an image display device, reflection of light is reduced between the biomass substrate layer and the other layer, and as a result, the reflectance between the layers is reduced. By becoming, the light extraction efficiency of an optical semiconductor element is excellent, and color cast can be suppressed. In addition, it is preferable that the difference in refractive index between the biomass substrate layer and all other layers included in the optical laminate is within the above range. The refractive index of the other layer is a value in the state of use of the optical laminate, and when the other layer is a layer (curable layer) having curability such as a curable pressure-sensitive adhesive layer, the curable layer is in a cured state. is the value of

The difference in refractive index between the biomass substrate layer and the pressure-sensitive adhesive layer is preferably 0.10 or less, more preferably 0.07 or less, still more preferably 0.05 or less. When the said refractive index difference is 0.10 or less, when the said optical laminated body is applied to an image display apparatus, the reflection of light is reduced between a biomass base material layer and an adhesive layer, and as a result, the reflectance between the said layers is reduced, and light The light extraction efficiency of the semiconductor element is excellent, and color cast can be suppressed. In addition, when a plurality of the pressure-sensitive adhesive layers are provided, the difference in refractive index between the biomass base layer and at least one pressure-sensitive adhesive layer is within the above range, and the difference in refractive index between the biomass base layer and all the pressure-sensitive adhesive layers in the optical laminate is the above It is desirable to be within the range. In addition, the refractive index of the said adhesive layer is a value in the use state of an optical laminated body, and when the said adhesive layer contains a curable adhesive layer, it is a value in the state in which the curable adhesive layer was hardened.

The difference in refractive index between the biomass substrate layer and the surface treatment layer is preferably 0.10 or less, more preferably 0.07 or less, still more preferably 0.05 or less. When the said refractive index difference is 0.10 or less, when the said optical laminated body is applied to an image display apparatus, the reflection of light is reduced between a biomass base material layer and a surface treatment layer, and as a result, the reflectance between said layers is reduced, and light The light extraction efficiency of the semiconductor element is excellent, and color cast can be suppressed. In addition, when the surface treatment layer is a surface treatment laminate comprising an optical film, the refractive index of the surface treatment laminate is used as the refractive index of the surface treatment layer.

In the optical laminate, the ratio of the luminance (45° luminance) measured from an inclination of 45° with respect to the vertical direction of the front side to the luminance (front luminance) measured from the vertical direction of the front side [45° luminance/front luminance] is preferably 0.95 or more (for example, 0.95 to 1.0), more preferably 0.97 or more, still more preferably 0.98 or more. When the ratio is 0.95 or more, when the optical layered body is applied to an image display device, an image display device that is bright when viewed from any direction and has a high quality can be provided. In addition, the said ratio is a value in the use state of an optical laminated body, and, for example, when the said optical laminated body is provided with a curable layer, it is a value in the state in which the said layer was hardened.

The optical layered body preferably has a frontal reflectance of 3.2% or less when measured by bonding a surface on the side provided with the base material portion to the side provided with the surface treatment layer to a sheet having a frontal reflectance of 40.34%. , more preferably 3.1% or less. When the front reflectance is 3.2% or less, when the optical laminate is applied to an image display device, reduction in visibility due to reflection of external light or projection of an image can be prevented, and an image display device with adjusted image quality can be provided. In addition, the said frontal reflectance is a value in the use state of an optical laminated body, and, for example, when the said optical laminated body is provided with a curable layer, it is a value in the state in which the said layer was hardened.

One Embodiment of the manufacturing method of the optical laminated body of this invention is described. For example, the optical layered body 1 shown in FIG. 1 can be manufactured by the following method. First, the first pressure-sensitive adhesive layer 31 is formed on the biomass substrate layer constituting the substrate portion 2 . The first pressure-sensitive adhesive layer 31 is formed by applying the pressure-sensitive adhesive composition forming the first pressure-sensitive adhesive layer 31 to one side of the base material (biomass base material layer) 2 to form the pressure-sensitive adhesive composition layer, and then heating. It can be produced by performing hardening, such as desolvation or thermal curing, and solidifying the said adhesive composition layer. When the thickness of the first pressure sensitive adhesive layer 31 is increased, the first pressure sensitive adhesive layer prepared in the same manner may be superimposed on the first pressure sensitive adhesive layer formed on the substrate portion 2 on the release treatment surface of the separate release liner.

Any form may be sufficient as the adhesive composition which forms the said 1st adhesive layer. For example, an emulsion type, a solvent type (solution type), a heat melting type (hot melt type), etc. may be sufficient as an adhesive composition. Especially, the solvent type is preferable from the point which the adhesive layer excellent in productivity is easy to obtain.

On the other hand, the second pressure-sensitive adhesive layer 32 is formed on the release-treated surface of the release liner 5 prepared separately. The second pressure-sensitive adhesive layer 32 is formed by applying the pressure-sensitive adhesive composition forming the second pressure-sensitive adhesive layer 32 onto the release treated surface of the release liner 5 to form the pressure-sensitive adhesive composition layer, followed by desolvation or curing by heating. It can be produced by performing and solidifying the said adhesive composition layer. Then, the second pressure sensitive adhesive layer is laminated on the first pressure sensitive adhesive layer. In this way, a laminate having a configuration of [substrate portion 2/first pressure sensitive adhesive layer 31/second pressure sensitive adhesive layer 32/release liner 5] is obtained.

Any form may be sufficient as the adhesive composition which forms the said 2nd adhesive layer. For example, the adhesive composition may be an emulsion type, a solvent type (solution type), an active energy ray curing type, a heat melting type (hot melt type), or the like. Especially, the adhesive composition of a solvent type and an active energy ray hardening type is preferable at the point which an adhesive layer excellent in productivity is easy to obtain.

On the other hand, a laminate of the surface treatment layer 4 and the third pressure sensitive adhesive layer 33 is produced. Specifically, for example, on the release-treated surface of a separately prepared release liner, the third adhesive layer 33 is formed in the same way as the second adhesive layer 32, and then subjected to antireflection treatment and/or antiglare treatment. It can be produced by bonding the untreated surface of the surface treatment layer 4, which is an optical film, onto the third pressure-sensitive adhesive layer 33. Then, the peeling liner is peeled off to expose the third pressure sensitive adhesive layer 33 and bonded to the surface of the substrate portion 2 of the laminate on which the first pressure sensitive adhesive layer 31 is not formed. As a method for applying the pressure-sensitive adhesive composition, known or conventional coating methods can be employed, and examples thereof include roll coating, screen coating, and gravure coating. In addition, lamination of various layers can be performed using a well-known roller or laminator. In this way, the optical laminate 1 shown in FIG. 1 can be produced.

In addition, the optical layered body 1 is not limited to the method described above, and the substrate portion 2 and the surface treatment layer 4 are laminated with the adhesive layer 33 interposed therebetween, and then the substrate portion 2 is exposed. The first pressure sensitive adhesive layer 31 and the second pressure sensitive adhesive layer 32 may be appropriately combined and sequentially stacked on the surface to be produced.

The optical layered body of the present invention is directly or indirectly laminated and used for an optical semiconductor element. The optical laminate of the present invention is preferably used by laminating it on a substrate on which an optical semiconductor element is disposed. The optical layered body of the present invention is preferably a sheet for sealing one or more optical semiconductor elements disposed on a substrate (sometimes referred to as a "sheet for optical semiconductor element sealing"). In addition, in this specification, "sealing an optical semiconductor element" means to embed at least one part of an optical semiconductor element in the adhesive layer provided with an optical laminated body.

Using the optical laminate of the present invention, an optical semiconductor device can be obtained by bonding the optical laminate of the present invention on a substrate on which an optical semiconductor element is arranged. When the optical layered product of the present invention is an optical semiconductor element encapsulating sheet, the optical semiconductor element encapsulating sheet is formed on a substrate on which an optical semiconductor element is disposed, with an adhesive layer in the optical semiconductor element encapsulating sheet or another adhesive layer interposed therebetween. An optical semiconductor device can be obtained by bonding and sealing an optical semiconductor element with the said adhesive layer.

In the case where the optical semiconductor element encapsulating sheet has an adhesive layer on the side opposite to the surface treatment layer side of the substrate portion, specifically, first, the release liner is peeled off from the optical semiconductor element encapsulating sheet to expose the adhesive layer surface. And the exposed surface of the said sheet|seat for optical-semiconductor element sealing on the board|substrate surface on which the optical semiconductor element was arrange|positioned of the optical member provided with a board|substrate and the optical semiconductor element (preferably a plurality of optical semiconductor elements) arrange|positioned on the said board|substrate. The surface of the phosphorus pressure-sensitive adhesive layer is bonded together, and when the optical member includes a plurality of optical semiconductor elements, the gaps between the plurality of optical semiconductor elements are further arranged so that the pressure-sensitive adhesive layer fills the plurality of optical semiconductor elements, and the plurality of optical semiconductor elements are collectively sealed. do. In this way, an optical semiconductor element can be sealed using the said sheet|seat for optical semiconductor device sealing. Moreover, you may seal an optical semiconductor element by bonding together, using the said sheet|seat for optical semiconductor device sealing, in a reduced-pressure environment or pressurizing. As such a method, the method disclosed in Unexamined-Japanese-Patent No. 2016-29689 or Unexamined-Japanese-Patent No. 6-97268 is mentioned, for example.

[Optical Semiconductor Device]

An optical semiconductor device can be produced using the optical laminate of the present invention. An optical semiconductor device manufactured using the optical laminate of the present invention comprises a substrate, an optical semiconductor element disposed on the substrate, and an optical laminate of the present invention laminated on the optical semiconductor element. When the said optical laminated body is equipped with a curable adhesive layer, the said adhesive layer in the said optical semiconductor device may be hardened. When the optical layered body of the present invention is a sheet for sealing an optical semiconductor element, the pressure-sensitive adhesive layer seals the optical semiconductor element.

As said optical semiconductor element, light emitting diodes (LED), such as a blue light emitting diode, a green light emitting diode, a red light emitting diode, and an ultraviolet light emitting diode, are mentioned, for example.

In the optical semiconductor device, when the optical layered body is the optical semiconductor element encapsulating sheet, it is preferable that the optical semiconductor element encapsulating sheet encapsulates a plurality of optical semiconductor elements collectively.

In FIG. 2, one Embodiment of the optical semiconductor device using the optical laminated body 1 shown in FIG. 1 is shown. The optical semiconductor device 10 shown in FIG. 2 includes a substrate 6, a plurality of optical semiconductor elements 7 arranged on one surface of the substrate 6, and optical sealing of the optical semiconductor element 7. A cured product 1' of the laminate is provided. The cured product 1' of the optical laminate is a cured sealing layer ( 31') was formed. The plurality of optical semiconductor elements 7 are collectively sealed by the curing and sealing portion 31' and the second pressure-sensitive adhesive layer 32. The second pressure-sensitive adhesive layer 32 adheres to the optical semiconductor element 7 and the substrate 6 by following the concavo-convex shape formed by the plurality of optical semiconductor elements 7, and embeds the optical semiconductor element 7.

In the optical semiconductor device 10 shown in FIG. 2 , the optical semiconductor element 7 is completely embedded and sealed in the second pressure-sensitive adhesive layer 32, and is further sealed by the curing and sealing layer 31'. Indirectly sealed. The optical semiconductor device is not limited to this aspect, and a part of the optical semiconductor element 7 protrudes from the second pressure-sensitive adhesive layer 32, and the part is embedded in the curing and sealing layer 31'. An aspect in which the optical semiconductor element 7 is completely embedded and sealed by the two pressure-sensitive adhesive layer 32 and the curing and sealing layer 31' may be used.

As mentioned above, the said optical semiconductor device is equipped with the biomass base material layer as a base material layer in an optical laminated body. For this reason, the said optical semiconductor device has a high degree of biomass, and becomes a thing in consideration of the environment.

As for the said optical semiconductor device, what each optical semiconductor device tiled may be sufficient as it. That is, as for the said optical semiconductor device, the some optical semiconductor device arrange|positioned in tile shape in the planar direction may be sufficient as it.

An embodiment of the optical semiconductor device produced by arranging a plurality of optical semiconductor devices in FIG. 3 is shown. In the optical semiconductor device 20 shown in FIG. 3 , a plurality of optical semiconductor devices 10 are arranged in a tile shape (tiling) in a planar direction in a total of 16 pieces, 4 in the vertical direction and 4 in the lateral direction. At the boundary 20a between two adjacent optical semiconductor devices 10, the optical semiconductor devices 10 are adjacent to each other, but they can be easily separated, resulting in a defect on the side surface of the optical laminate or an adjacent optical semiconductor device. From one side of the device to the other, adhesion of the resin missing in the side surface of the optical layered body is unlikely to occur.

It is preferable that the said optical semiconductor device is a backlight of a liquid crystal screen, and it is especially preferable that it is an all-surface direct type backlight. Further, by combining the backlight and the display panel, an image display device can be obtained. The optical semiconductor element in case the said optical semiconductor device is a backlight of a liquid crystal screen is an LED element. For example, in the backlight, a metal wiring layer for sending a light emission control signal to each LED element is laminated on the substrate. Each LED element emitting light of each color of red (R), green (G), and blue (B) is alternately arranged on a substrate of a display panel with a metal wiring layer interposed therebetween. The metal wiring layer is formed of a metal such as copper, reflects the light emission of each LED element, and reduces the visibility of the image. In addition, the light emitted from each LED element of each color of RGB is mixed in color, and the contrast is lowered.

Moreover, it is preferable that the said optical semiconductor device is a self-emission type display device. In addition, an image display device can be obtained by combining the self-luminous display device and a display panel as necessary. An optical semiconductor element in the case where the optical semiconductor device is a self-luminous display device is an LED element. Examples of the self-luminous display device include an organic electroluminescent (organic EL) display device and the backlight. For example, in the self-emissive type display device, a metal wiring layer for sending an emission control signal to each LED element is laminated on the substrate. Each LED element emitting light of each color of red (R), green (G), and blue (B) is alternately arranged on a substrate through a metal wiring layer. The metal wiring layer is formed of a metal such as copper, and displays each color by adjusting the degree of light emission of each LED element.

The optical laminate of the present invention can be used for an optical semiconductor device that is bent and used, for example, an optical semiconductor device having a bendable image display device (flexible display) (particularly, a foldable image display device (foldable display)). . Specifically, it can be used for a foldable backlight and a foldable self-emission type display device.

The optical layered body of the present invention can be suitably used either when the optical semiconductor device is a mini LED display device or a micro LED display device.

[Method for Manufacturing Optical Semiconductor Device]

The said optical semiconductor device can be manufactured by the manufacturing method provided with the process (lamination process) of laminating|stacking the said optical laminated body to the said optical semiconductor element provided on the said board|substrate, for example. In the case where the optical layered body is the semiconductor element sealing sheet, the manufacturing method may bond the semiconductor element sealing sheet to the optical semiconductor element in the lamination step and embed the optical semiconductor element with the pressure-sensitive adhesive layer. do.

When the optical laminate has a curable pressure-sensitive adhesive layer, the manufacturing method includes the substrate obtained through the lamination step, an optical semiconductor element disposed on the substrate, and the optical laminate laminated on the optical semiconductor element. With respect to the laminated body to do, you may further include the process (hardening process) of hardening the said curable adhesive layer and obtaining the said hardened|cured material. The said manufacturing method may further include the process (dicing process) which dices the said laminated body obtained through the said lamination process and the said hardening process, and obtains an optical semiconductor device. Moreover, the said manufacturing method may further be equipped with the tiling process of arranging so that the some optical semiconductor device obtained at the said dicing process may be contacted in a plane direction. Hereinafter, the manufacturing method of the optical semiconductor device 10 shown in FIG. 2 and the optical semiconductor device 20 shown in FIG. 3 is demonstrated taking into consideration suitably.

(lamination process)

In the lamination step, the optical laminate is bonded to and laminated on a substrate on which an optical semiconductor element is disposed, and the optical semiconductor element is preferably embedded in the pressure-sensitive adhesive layer. Specifically, in the lamination step, as shown in FIG. 4 , the pressure-sensitive adhesive layer 3a of the optical laminate 1 from which the release liner 5 was peeled was applied to the optical semiconductor element 7 of the substrate 6. is disposed so as to face the surface on which the optical laminate 1 is disposed, and the optical laminate 1 is bonded to the surface of the substrate 6 on which the optical semiconductor element 7 is disposed, and the optical semiconductor element 7 is formed as shown in FIG. It is embedded in the second pressure-sensitive adhesive layer 32 . For the purpose of matching the size by cutting off the end in the dicing process, as shown in FIG. 4, the substrate 6 used for bonding is the substrate 6 in the optical semiconductor device 10 shown in FIG. ), and the optical semiconductor element 7 is not arrange|positioned near the edge part of the board|substrate 6. Further, the optical layered body 1 to be bonded extends wider in the plane direction than the substrate 6 used for bonding. That is, the area of the surface of the optical laminate 1 facing the substrate 6 bonded in the lamination step is the area of the surface of the substrate 6 bonded facing the optical laminate 1 in the lamination step. bigger than

The temperature at the time of the said bonding is within the range of room temperature - 150 degreeC, for example. In addition, you may reduce pressure or pressurize at the time of the said bonding. It can suppress that a space|gap is formed between an adhesive layer and a board|substrate or an optical semiconductor element by pressure reduction or pressurization. In the above lamination step, it is preferable to bond the optical layered body under reduced pressure and then pressurize it. The pressure in the case of reducing pressure is, for example, 1 to 100 Pa, and the pressure reduction time is, for example, 5 to 600 seconds. In addition, the pressure in the case of pressurizing is 0.05-0.5 Mpa, for example, and the pressure reduction time is 5-600 second, for example.

(curing process)

In the said hardening process, hardening is performed according to the kind of hardenability of a curable adhesive layer. Heating is performed when the pressure-sensitive adhesive layer has thermosetting properties, and radiation irradiation is performed when the pressure-sensitive adhesive layer has radiation curing properties. In the curing step, a laminate in which the optical laminate is bonded to the substrate on which the optical semiconductor element is disposed (for example, the laminate obtained in the laminate step) is heated or irradiated with radiation to form the pressure-sensitive adhesive layer. harden In the curing step, specifically, as shown in FIG. 6, the first pressure-sensitive adhesive layer 31 is cured to form a cured sealing layer 3', and a cured product 1' of the optical laminate is obtained. lose The temperature at the time of the said heating is in the range of 80-200 degreeC, for example, and heating time is 1 minute - 24 hours, for example. As the radiation, electron beams, ultraviolet rays, α rays, β rays, γ rays, X rays, and the like are exemplified as described above. Especially, ultraviolet rays are preferable. The temperature during irradiation is, for example, in the range of room temperature to 100°C, and the irradiation time is, for example, 1 minute to 1 hour.

(dicing process)

In the dicing process, the laminated body that has passed through the lamination process or the curing process is diced. Here, in the laminate applied to the dicing step, the cured product 1' of the optical laminate and the substrate 6 extend wider in the plane direction than the finally obtained optical semiconductor device 10, as described above. has been And, in the said dicing process, the hardened|cured material of an optical laminate and the side end part of a board|substrate are diced and removed. Specifically, dicing is performed at the position of the chain line shown in Fig. 7, and the side end is removed. The dicing can be performed by a known or common method, for example, a method using a dicing blade or laser irradiation. In this way, the optical semiconductor device 10 shown in FIG. 2 can be manufactured, for example.

(Tiling process)

In the tiling step, tiling is performed by arranging a plurality of optical semiconductor devices obtained in the dicing step so as to be in contact with each other in the plane direction. In this way, the optical semiconductor device 20 shown in FIG. 3 can be manufactured, for example.

Example

The present invention will be explained in more detail by way of examples below, but the present invention is not limited by these examples at all.

Example 1

<Anti-reflection layer/Anti-glare layer/TAC film>

(Anti-glare layer)

As the resin contained in the material for forming the anti-glare layer, 40 parts by mass of an ultraviolet curable urethane acrylate resin (trade name "NK Oligo UA-53H-80BK", manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and pentaerythritol triacrylate as main components A diluted solution of a composition for an optical adjustment layer containing 57.5 parts by mass of polyfunctional acrylate (trade name "Biscott #300", manufactured by Osaka Yuki Chemical Industry Co., Ltd.), zirconia particles, and an ultraviolet curable resin (trade name "Obster Z7540", JSR Corporation) 2.5 parts by mass, silicon particles (trade name "Tospearl 130ND", manufactured by Momentive Performance Materials Japan Kodokaisha) 2.8 parts by mass, and synthetic smectite which is organic clay as a thixotropy imparting agent (trade name "Smekuton SAN ", Kunimine Kogyo Co., Ltd.) 2.5 parts by mass, a photopolymerization initiator (trade name "OMNIRAD907", manufactured by BASF) 3 parts by mass, and fine particles of crosslinked acrylic styrene copolymer resin (trade name "SSX-103DXE", manufactured by Sekisui Chemical Co., Ltd. 6.5 parts by mass of teacher) and 0.1 part by mass of a leveling agent (trade name "LE-303", manufactured by Kyoeisha Chemical Co., Ltd.) were mixed. In addition, the said organic clay was used after being diluted so that solid content might become 6 mass % with toluene. This mixture was diluted with a toluene/cyclopentanone mixed solvent (mass ratio 64/36) so that the solid content concentration was 38% by mass, and an anti-glare layer forming material (coating liquid) was prepared using an ultrasonic disperser.

A transparent plastic film (triacetyl cellulose (TAC) film, trade name "TJ40UL", manufactured by Fujifilm Corporation, thickness: 40 µm) was prepared. On one side of the transparent plastic film, the material for forming the anti-glare layer was applied using a wire bar to form a coating film. Subsequently, the coating film was dried by heating at 95°C for 1 minute. Thereafter, a high-pressure mercury lamp was used to irradiate ultraviolet light with a cumulative light intensity of 300 mJ/cm 2 , and the coating film was cured to produce a TAC film having a 6.5 μm-thick anti-glare layer on the surface.

(antireflection layer)

100 parts by mass of a polyfunctional acrylate containing pentaerythritol triacrylate as a main component (trade name "Biscott #300", manufactured by Osaka Yuki Chemical Industry Co., Ltd.), and hollow nano-silica particles (trade name "Sullia 5320", Nikki Sho Kubai Kasei Co., Ltd.) 100 parts by mass, solid nano-silica particles (trade name "MIBK-ST", manufactured by Nissan Chemical Industries, Ltd., solid content 30 mass %, mass average particle diameter 10 nm) 40 parts by mass, and a fluorine element-containing additive (trade name " KY-1203", manufactured by Shin-Etsu Chemical Industry Co., Ltd.) 12 parts by mass, a photopolymerization initiator (trade name "OMNIRAD 907", manufactured by IGM.RESINS B.V) 5 parts by mass, and a photopolymerization initiator (trade name "OMNIRAD 2959", IGM.RESINS manufactured by B.V) 5 parts by mass were mixed. To this mixture, as a diluting solvent, a mixed solvent obtained by mixing methyl isobutyl ketone and propylene glycol monomethyl ether acetate at a mass ratio of 70:30 was added so that the total solid content was 1.5% by mass, and stirred to obtain an antireflection layer forming material. prepared.

The material for forming the antireflection layer was coated with a wire bar on the surface of the antiglare layer of the TAC film having the antiglare layer on its surface. The coated material for forming the antireflection layer was heated at 80° C. for 1 minute and dried to form a coating film. The coating film after drying was cured by irradiating ultraviolet light with a cumulative light amount of 300 mJ/cm 2 with a high-pressure mercury lamp. This cured the coating film to form an antireflection layer having a thickness of 0.1 μm. As described above, a surface treatment layer having a laminated structure of [antireflection layer/antiglare layer/TAC film] was produced.

<Anti-reflection layer/Anti-glare layer/TAC film/Binder adhesive layer>

As a monomer component, 69.7 parts by mass of 2-ethylhexyl acrylate, 10 parts by mass of 2-methoxyethyl acrylate, 13 parts by mass of 2-hydroxyethyl acrylate, 6 parts by mass of N-vinyl-2-pyrrolidone, N-hydroxy 1.3 parts by mass of ethyl acrylamide, 0.1 part by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator, and 200 parts by mass of ethyl acetate as a polymerization solvent were put into a separable flask and stirred for 1 hour, introducing nitrogen gas did In this way, after removing oxygen in the polymerization system, the temperature was raised to 63°C, the reaction was carried out for 10 hours, and ethyl acetate was added to obtain an acrylic polymer solution having a solid content concentration of 30% by mass. With respect to 100 parts by mass of the acrylic polymer, 0.2 parts by mass of an isocyanate-based crosslinking agent (trade name "Takenate D110N", manufactured by Mitsui Chemicals) as a crosslinking agent, γ-glycidoxypropyltrimethoxysilane (trade name "KBM") as a silane coupling agent, -403", manufactured by Shin-Etsu Chemical Industry Co., Ltd.) 0.15 parts by mass and 0.2 parts by mass of a polyol (trade name "EDP-300", manufactured by ADEKA) obtained by adding propylene oxide to ethylenediamine as a crosslinking accelerator, and an adhesive composition (solution ) was prepared. Next, the pressure-sensitive adhesive composition was applied onto the release-treated surface of a release liner (separator) (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) so that the thickness after drying was 25 µm, and held at 60°C for 1 minute and 155°C under normal pressure. It heat-dried for 1 minute, and obtained the double-sided adhesive sheet as a binder adhesive layer. Then, with respect to the untreated surface of the TAC film in the surface treatment layer obtained above, the adhesive surface of the binder pressure-sensitive adhesive layer was bonded together using a hand roller so that air bubbles did not enter. In this way, a laminate having a laminated structure of [antireflection layer/anti-glare layer/TAC film/binder pressure-sensitive adhesive layer/release liner] was produced.

<Polycarbonate film/UV-curable pressure-sensitive adhesive layer/non-curable pressure-sensitive adhesive layer>

(UV curable adhesive layer)

189.77 parts by mass of butyl acrylate acrylate, 38.04 parts by mass of cyclohexyl acrylate, 85.93 parts by mass of 2-hydroxyethyl acrylate, 0.94 parts by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator, and 379.31 parts by mass of methyl ethyl ketone as a polymerization solvent The mass part was placed in a 1L round bottom separable flask equipped with a separable cover, a separatory funnel, a thermometer, a nitrogen inlet tube, a Libby condenser, a vacuum seal, a stirring rod, and a stirring blade. While stirring, It was purged with nitrogen at room temperature for 6 hours. Thereafter, polymerization was carried out by holding at 65°C for 4 hours and at 75°C for 2 hours while stirring under an inflow of nitrogen to obtain a resin solution.

Then, the obtained resin solution was cooled to room temperature. Thereafter, 5.74 parts by mass of 2-isocyanatoethyl methacrylate (trade name "Karenz MOI", manufactured by Showa Denko) was added to the resin solution as a compound having a polymerizable carbon-carbon double bond. Further, 0.03 parts by mass of dibutyltin(IV) dilaurate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was added, and the mixture was stirred in an air atmosphere at 50°C for 24 hours to obtain a base polymer.

1.5 parts by mass of an isocyanate compound (trade name "Coronate L", manufactured by Tosoh Corporation, 75% by mass solid content) and 2,2-dimethoxy-1,2-diphenyl-1 with respect to 100 parts by mass of solid content of the obtained base polymer. -On (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) 1 part by mass was mixed. Toluene was used as a diluting solvent, and the solid content was adjusted to be 20 to 40% by mass to obtain an adhesive solution (1).

This pressure-sensitive adhesive solution (1) is made of a polycarbonate resin (trade name "DURABIO T7450A", manufactured by Mitsubishi Chemical Corporation) as a base material layer, and a polycarbonate film formed to a thickness of 70 µm by extrusion film formation is used, and the thickness after drying is It was applied on the substrate layer so as to have a thickness of 112.5 μm, and dried under normal pressure at 50° C. for 1 minute and at 125° C. for 5 minutes to form an ultraviolet curable pressure-sensitive adhesive layer (1). On the other hand, the pressure-sensitive adhesive solution (1) obtained above was applied onto the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) so that the thickness after drying was 112.5 µm, and held at 50 ° C. for 1 minute under normal pressure. It heated and dried at 125 degreeC for 5 minutes, and formed the ultraviolet curable adhesive layer (2).

Then, the adhesive layer surfaces of the ultraviolet curable adhesive layer (1) formed on the polycarbonate film and the ultraviolet curable adhesive layer (2) formed on the release liner were bonded to each other using a hand roller so that air bubbles did not enter, and one An ultraviolet curable pressure-sensitive adhesive layer was formed. The release liner was then peeled off. In this way, a laminate having a configuration of [polycarbonate film/ultraviolet curable pressure-sensitive adhesive layer] was produced.

(Non-curable pressure-sensitive adhesive layer)

189.77 parts by mass of butyl acrylate, 38.04 parts by mass of cyclohexyl acrylate, 85.93 parts by mass of 2-hydroxyethyl acrylate, 0.94 parts by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator, and 379.31 parts by mass of methyl ethyl ketone as a polymerization solvent The mass part was placed in a 1L round bottom separable flask equipped with a separable cover, a separatory funnel, a thermometer, a nitrogen inlet tube, a Libby condenser, a vacuum seal, a stirring rod, and a stirring blade. While stirring, It was purged with nitrogen at room temperature for 6 hours. Thereafter, polymerization was carried out by holding at 65°C for 4 hours and at 75°C for 2 hours while stirring under an inflow of nitrogen to obtain a resin solution.

To the obtained resin solution, 1.5 parts by mass of an isocyanate compound (trade name "Coronate L", manufactured by Tosoh Corporation, 75% by mass solid content) was mixed with respect to 100 parts by mass solid content of the base polymer. Toluene was used as a diluting solvent, and the solid content was adjusted to 20 to 40% by mass to obtain an adhesive solution (2).

This pressure-sensitive adhesive solution (2) was applied onto the release-treated surface of a release liner (trade name "MRF38", manufactured by Mitsubishi Chemical Corporation) so that the thickness after drying was 25 µm, and heat-dried at 125°C for 2 minutes under normal pressure to obtain a non-curing property. An adhesive layer was formed.

(Polycarbonate film / UV-curable pressure-sensitive adhesive layer / non-curable pressure-sensitive adhesive layer)

The non-curable pressure-sensitive adhesive layer was bonded to the ultraviolet curable pressure-sensitive adhesive layer surface of a laminate having a laminate structure of [polycarbonate film/ultraviolet curable pressure-sensitive adhesive layer] using a hand roller so as to prevent air bubbles from entering. In this way, a laminate having a laminated structure of [polycarbonate film/ultraviolet curable pressure sensitive adhesive layer/non-curable pressure sensitive adhesive layer/release liner] was produced.

<Optical laminate (sheet for sealing optical semiconductor elements)>

The release liner is peeled off from the laminate having the laminated structure of [antireflection layer/anti-glare layer/TAC film/binder pressure-sensitive adhesive layer/release liner], and the exposed binder pressure-sensitive adhesive layer surface is replaced with [polycarbonate film/ultraviolet curable pressure-sensitive adhesive layer/ The polycarbonate film surface of the laminate having the laminate structure of [non-curable pressure-sensitive adhesive layer/release liner] was bonded using a hand roller so as not to allow air bubbles to enter. Thereafter, aging is performed at 50°C for 48 hours, and the layer configuration is [antireflection layer/anti-glare layer/TAC film/binder adhesive layer/polycarbonate film/ultraviolet curable adhesive layer/non-curable adhesive layer/release liner] An optical laminate (sheet for sealing optical semiconductor elements) of Example 1 was produced.

Example 2

As the substrate layer, a polycarbonate film made of a polycarbonate resin (trade name "DURABIO T7450A" (different lots), manufactured by Mitsubishi Chemical Corporation) having a thickness of 70 µm by extrusion film formation using the biomass diagram shown in Table 1 was used. And, the optical laminate of Example 2 (sheet for optical semiconductor element sealing ) was produced.

Example 3

As the substrate layer, a polycarbonate film made of a polycarbonate resin (trade name "DURABIO T7450A" (different lots), manufactured by Mitsubishi Chemical Corporation) having a thickness of 70 µm by extrusion film formation using the biomass diagram shown in Table 1 was used. Then, an optical laminate (sheet for optical semiconductor element encapsulation) of Example 4 was produced in the same manner as in Example 1, except that the components of the non-curable adhesive layer were adjusted and the refractive index was adjusted.

Comparative Example 1

Optical lamination of Comparative Example 1 in the same manner as in Example 1, except that a PET film (trade name "Diafoil T100-75S", manufactured by Mitsubishi Chemical Corporation, thickness 75 µm) was used instead of the polycarbonate film as the base layer. A body (sheet for encapsulating optical semiconductor elements) was produced.

Comparative Example 2

Optical lamination of Comparative Example 2 in the same manner as in Example 2, except that a PET film (trade name "Diafoil T100-75S", manufactured by Mitsubishi Chemical Corporation, thickness: 75 µm) was used instead of the polycarbonate film as the base layer. A body (sheet for encapsulating optical semiconductor elements) was produced.

Comparative Example 3

Optical lamination of Comparative Example 3 in the same manner as in Example 3, except that a PET film (trade name "diafoil T100-75S", manufactured by Mitsubishi Chemical Corporation, thickness 75 µm) was used instead of the polycarbonate film as the base layer. A body (sheet for encapsulating optical semiconductor elements) was produced.

<evaluation>

The following evaluation was performed about each layer which comprises the optical laminated body obtained by the Example and the comparative example, and the said optical laminated body. Results are shown in a table.

(1) Refractive index

For each surface treatment layer and substrate layer used or produced in Examples and Comparative Examples, the refractive index at 550 nm was measured using a refractive index measuring device (trade name "Prism Coupler Model 2010/M", manufactured by Metricon). did In addition, about the adhesive layer, the refractive index was measured using the Abbe refractometer (brand name "DR-M4", made by ATAGO) on conditions of a measurement wavelength of 589 nm and a measurement temperature of 25 degreeC. Regarding the ultraviolet curable pressure-sensitive adhesive layer, separately prepared a laminate in which the ultraviolet curable pressure-sensitive adhesive layer was sandwiched between two release liners, and subjected to ultraviolet light irradiation under the ultraviolet light irradiation conditions described in the frontal reflectance described later to cure the ultraviolet curable pressure-sensitive adhesive layer. It was measured for the pressure-sensitive adhesive layer.

(2) frontal reflectance

A metal wiring printed on an acrylic plate so that the front reflectance was 40.34% was used as a replacement for the organic EL device. Then, the peeling liner was peeled off from the optical laminate obtained in Examples and Comparative Examples to expose the pressure-sensitive adhesive layer, and the exposed pressure-sensitive adhesive layer was bonded to the organic EL device substitute, and further irradiated with ultraviolet rays under the following ultraviolet irradiation conditions, A test sample was prepared by curing the UV-curable pressure-sensitive adhesive layer. Then, frontal reflectance was measured on the surface of the test sample on the surface treatment layer side by a method according to JIS Z8722 using a spectrophotometer (trade name "CM2600D", manufactured by Konica Minolta Co., Ltd.).

<Ultraviolet irradiation conditions>

Ultraviolet irradiation device: trade name "UM810", manufactured by Nitto Seiki Co., Ltd.

Light source: high-pressure mercury lamp irradiation intensity: 50 mW/cm2 (measurement device: trade name "ultraviolet light meter UT-101", manufactured by Ushio Denki Co., Ltd.)

Irradiation time: 100 seconds

Accumulated light amount: 5000mJ/cm2

(3) Luminance

With respect to the test sample produced in the above (2), the luminance was measured using a viewing angle characteristic evaluation device (trade name "EZ-Contract160D", manufactured by ELDIM) from the surface of the surface treatment layer side in a state of lighting in white. From this measurement data, the average value of the data obtained by shifting the azimuth at 0° by 15° is the frontal luminance, and the average value of the data obtained by shifting the azimuth by 15° when the polar angle is 45° is taken as the 45° slope luminance, Calculated.

(4) Phase difference of base layer

Regarding the substrate layer used in Examples and Comparative Examples, the phase difference was measured in a 23°C environment using a trade name "AxoAcan" (manufactured by Axometrics).

(5) Frontal reflectance of base layer

The substrate layer used in Examples and Comparative Examples was bonded to a black acrylic plate, and for the surface of the substrate layer side, using a spectrophotometer (trade name "CM2600D", manufactured by Konica Minolta Co., Ltd.), frontal reflectance was measured by a method according to JIS Z8722 was measured.

(6) Tensile modulus and elongation at break of the substrate layer

After cutting the substrate layer used in Examples and Comparative Examples to a width of 1 cm × length of 13 cm, a tensile tester "Autograph ASG-50D type" (manufactured by Shimadzu Corporation) was used, and the tensile speed was 200 mm / min, the distance between chucks was 50 mm, and a tensile test was conducted at room temperature (23°C), and the tensile modulus was measured.

(7) color difference

With respect to the test sample prepared in the above (2), when the polar angle and the azimuth angle were shifted from the surface on the surface treatment layer side, it was confirmed whether or not irregularities in appearance could be visually recognized. When non-uniformity was not confirmed, ○, the case where there was no problem in quality although it was recognized was set as △, and the case where there was a problem in quality was set as ×.

As shown in Table 1, it was judged that the optical layered body (Example) of the present invention had a high degree of biomass and could be considered environmentally friendly. In addition, it was determined that the optical laminate had a low frontal reflectance, excellent color difference, and excellent performance as an optical laminate. On the other hand, it was judged that the optical layered body of the comparative example had a low degree of biomass and was inferior in performance as an optical layered body.

1: optical stack
1': cured product of optical laminate
2: Ministry of Finance
3: adhesive layer
3a, 3b: pressure-sensitive adhesive layer
31: first pressure-sensitive adhesive layer
31 ': hardened sealing layer
32: second adhesive layer
33: third adhesive layer
4: surface treatment layer
41: optical film
42: antiglare/antireflection treatment layer
5: release liner
6: substrate
7: optical semiconductor element
10, 20: optical semiconductor device

Claims (7)

An optical laminate comprising a surface treatment layer, a substrate portion, and an adhesive layer provided on at least one surface of the substrate portion, and used by laminating on an optical semiconductor element,
When the optical laminate is laminated on the optical semiconductor element, the substrate portion is located on the optical semiconductor element side with respect to the surface treatment layer,
The surface treatment layer is a layer that imparts antireflection and/or antiglare properties to the optical laminate,
The optical laminate having a substrate layer having a biomass of 30% or more. According to claim 1,
The base layer is an optical laminate composed of a polycarbonate-based resin. According to claim 1 or 2,
The optical laminate having a tensile modulus of elasticity of 1.5 to 3.5 GPa of the base layer. According to claim 1 or 2,
The refractive index of the base layer is 1.43 to 1.55 optical laminate. An optical semiconductor device comprising a substrate, an optical semiconductor element disposed on the substrate, and an optical laminate according to claim 1 or 2 laminated on the optical semiconductor element. According to claim 5,
An optical semiconductor device that is a self-luminous display device. An image display device comprising the self-emissive display device according to claim 6.

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