JP2023142481A - Display body and sheet for sealing optical semiconductor element - Google Patents

Abstract

To provide a display body which hardly causes a color shift and hardly causes irregular reflection of external light.SOLUTION: A display body 1 includes a substrate 2, optical semiconductor elements 3a to 3c, and a sealing resin layer 4 for sealing the plurality of optical semiconductor elements. The sealing resin layer 4 includes a non-colored layer 41, a colored layer 42 and a non-colored layer 43. In a cross section of a vertical surface passing through a center GA of gravity of the optical semiconductor element 3a and a center GB of gravity of the optical semiconductor element 3b, a straight line L1 passing through an intersection TA1 between a vertical line PA and an interface on a front side of the non-colored layer 41, and an intersection TC1 between a vertical line PC passing through a middle point C of the center GA of gravity and the center GB of gravity, and the interface on a front side of the colored layer 41 is not parallel with the surface of the substrate 2, a straight line L2 passing through an intersection TA2 between the vertical line PA and an interface on a front side of the colored layer 42, and an intersection TC2 between the vertical line PC and the interface on a front side of the colored layer 42 is not parallel with the surface of the substrate 2, and a straight line L3 passing through an intersection TA3 between the vertical line PA and an interface on a front side of the non-colored layer 43, and an intersection TC3 between the vertical line PC and the interface on a front side of the non-colored layer 43 is parallel with the surface of the substrate 2.SELECTED DRAWING: Figure 2

Description

The present invention relates to a display body and a sheet for sealing optical semiconductor elements. More specifically, the present invention relates to a display body in which an optical semiconductor element of, for example, a self-luminous display device is sealed, and a sheet suitable for use in sealing the optical semiconductor element.

In recent years, self-luminous display devices typified by mini/micro LED display devices (Mini/Micro Light Emitting Diode Displays) have been devised as next-generation display devices. The basic configuration of mini/micro LED display devices is to use a substrate on which many minute optical semiconductor elements (LED chips) are arranged at high density as a display panel, and the optical semiconductor elements are sealed with a sealing material. , a cover member such as a resin film or a glass plate is laminated on the outermost layer.

In a display body including a self-luminous display device such as a mini/micro LED display device, wiring (metal wiring) made of metal or a metal oxide such as ITO is arranged on a substrate of a display panel. Such a display device has a problem in that, for example, when the display is not lit, light is reflected by the metal wiring and the like, resulting in poor screen appearance and poor design. For this reason, a technique has been adopted that uses an antireflection layer to prevent reflection from metal wiring as a sealing material for sealing an optical semiconductor element.

Furthermore, displays using self-luminous display devices have a problem in that uneven brightness (luminance unevenness) occurs due to the light source of the optical semiconductor element. When brightness unevenness occurs, a phenomenon called "color shift" occurs, in which the color tone changes when the display is viewed from the front and when viewed from an oblique viewing angle.

Patent Document 1 describes a laminate of a colored adhesive layer and a colorless adhesive layer as an adhesive sheet capable of suppressing brightness unevenness, and the colorless adhesive layer is positioned so as to be in contact with an optical semiconductor element. A pressure-sensitive adhesive sheet is disclosed. According to the above-mentioned adhesive sheet, when the colorless adhesive layer contacts and follows the uneven shape formed by the substrate and the optical semiconductor element installed on the substrate, the colorless adhesive layer comes into contact with the unevenness, and the colorless adhesive layer Since the unevenness is absorbed to some extent by the layer, the colored adhesive layer is prevented from being compressed or deformed, thereby suppressing uneven transmittance in the adhesive layer and suppressing uneven brightness. Are listed.

JP2020-169262A

However, in adhesive sheets provided with a colored adhesive layer, the colored adhesive layer cannot sufficiently absorb light emitted from the side surface of an optical semiconductor element, and there is strong interference between light emitted from adjacent optical semiconductor elements. There was a problem that color shift was likely to occur. In addition, with conventional displays, external light is diffusely reflected on the surface of the adhesive sheet, resulting in poor visibility when the display is lit and off, and the sealing properties of the optical semiconductor elements are poor, resulting in the optical semiconductor elements being damaged. In some cases, a gap was created between the installed substrate and the adhesive sheet. If the above-mentioned gap exists, there is a risk that the optical semiconductor element and the adhesive sheet will peel off at high temperatures. Therefore, there is a need for a display body that is less likely to cause color shift, less likely to cause diffuse reflection of external light, and which has excellent sealing properties for optical semiconductor elements.

The present invention was conceived under these circumstances, and its purpose is to provide a display material that is less likely to cause color shift, less likely to cause diffuse reflection of external light, and which has excellent sealing properties for optical semiconductor elements. Our goal is to provide the following. Another object of the present invention is that by sealing an optical semiconductor element, it is possible to produce a display body that is less likely to cause color shift, less likely to cause diffuse reflection of external light, and has excellent sealing properties for the optical semiconductor element. An object of the present invention is to provide a sheet for encapsulating semiconductor elements.

As a result of intensive studies to achieve the above object, the present inventors discovered that optical semiconductor The front side interface of the first sealing layer that contacts the element and the front side interface of the second sealing layer laminated on the front side thereof are curved surfaces, and the front side interface of the third sealing layer laminated on the second sealing layer is a curved surface. It has been found that a display body with a flat side interface is less likely to cause color shift, less likely to cause diffuse reflection of external light, and has excellent sealing properties for optical semiconductor elements. The present invention was completed based on these findings.

That is, the present invention is a display body comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements,
The sealing resin layer includes a first sealing layer in contact with the optical semiconductor element, a second sealing layer directly laminated on the first sealing layer, and a second sealing layer laminated directly on the second sealing layer. and a third sealing layer,
One of the first sealing layer and the second sealing layer is a colored layer, and the other is a non-colored layer,
In a cross section perpendicular to the substrate surface passing through the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel,
A perpendicular line to the substrate surface passing through the center of gravity of the first optical semiconductor element is a perpendicular line P _A ,
When a perpendicular line to the substrate surface passing through the midpoint of the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element is a perpendicular line P _C ,
A straight line L1 passing through the intersection of the perpendicular line P _A and the front side interface of the first sealing layer and the intersection of the perpendicular line P _C and the front side interface of the first sealing layer is relative to the substrate surface. are non-parallel,
A straight line L2 passing through the intersection of the perpendicular line P _A and the front side interface of the second sealing layer and the intersection of the perpendicular line P _C and the front side interface of the second sealing layer is are non-parallel,
A straight line L3 passing through the intersection between the perpendicular line P _A and the front side interface of the third sealing layer and the intersection between the perpendicular line P _C and the front side interface of the third sealing layer is and parallel to each other.

In the display, the sealing resin layer that seals the optical semiconductor element includes the colored layer, thereby making it possible to prevent light from being reflected by metal wiring provided on the substrate. The fact that the straight line L1 and the straight line L2 are non-parallel to the substrate surface means that the front-side interfaces of the colored layer and the non-colored layer are both convex on the optical semiconductor element, and concave between the nearest optical semiconductor elements. This means that it has an uneven shape. In this case, both the substrate-side and front-side interfaces of the colored layer have the above-described uneven shape, and the substrate-side interface of the colored layer in the recessed portion is located sufficiently close to the substrate, so that the optical semiconductor element emits light. Transmission of light in the side direction is prevented by the colored layer in the concave portion, making it difficult for the light emitted by each optical semiconductor element to interfere with each other, and color shift is suppressed. Furthermore, the colored layer and the non-colored layer have excellent conformability to an uneven shape in which the optical semiconductor element is a convex part and the substrate surface between adjacent optical semiconductor elements is a concave part, and are excellent in sealing properties of the optical semiconductor element. The straight line L3 being parallel to the substrate surface means that the interface on the front side of the third sealing layer located on the front side of the colored layer and the non-colored layer is flat. Since the surface of the third sealing layer is flat, the surface of the sealing resin layer tends to be flat, making it difficult for diffuse reflection of external light to occur, and improving the appearance of the display both when the display is lit and when it is not lit.

It is preferable that the first sealing layer contacts the surface of the substrate between the first and second optical semiconductor elements by 50% or more in the vertical cross section. With such a configuration, the first sealing layer has excellent followability to the uneven shape formed on the surface of the optical semiconductor element and the substrate, and has excellent sealing performance of the optical semiconductor element.

It is preferable that the first sealing layer is the non-colored layer, and the second sealing layer is the colored layer. With such a configuration, front brightness can be increased.

It is preferable that the first sealing layer is a diffusion functional layer. With such a configuration, the light emitted by the optical semiconductor element in the side direction can be diffused in the diffusion function layer, and the front brightness can be increased.

Preferably, the display body includes a self-luminous display device.

It is preferable that the display body is an image display device.

The present invention also provides a sheet for sealing a plurality of optical semiconductor elements arranged on a substrate, comprising:
The sheet includes a first sealing layer, a second sealing layer directly laminated on the first sealing layer, and a third sealing layer directly laminated on the second sealing layer. Equipped with a resin layer for
One of the first sealing layer and the second sealing layer is a colored layer, and the other is a non-colored layer,
When forming a sealing resin layer by sealing the plurality of optical semiconductor elements with the sealing resin layer so that the first sealing layer contacts the plurality of optical semiconductor elements,
In a cross section perpendicular to the substrate surface passing through the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel,
A perpendicular line to the substrate surface passing through the center of gravity of the first optical semiconductor element is a perpendicular line P _A ,
When a perpendicular line to the substrate surface passing through the midpoint of the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element is a perpendicular line P _C ,
A straight line L1 passing through the intersection of the perpendicular line P _A and the front side interface of the first sealing layer and the intersection of the perpendicular line P _C and the front side interface of the first sealing layer is relative to the substrate surface. are non-parallel,
A straight line L2 passing through the intersection of the perpendicular line P _A and the front side interface of the second sealing layer and the intersection of the perpendicular line P _C and the front side interface of the second sealing layer is are non-parallel,
A straight line L3 passing through the intersection between the perpendicular line P _A and the front side interface of the third sealing layer and the intersection between the perpendicular line P _C and the front side interface of the third sealing layer is Provided is a sheet for encapsulating an optical semiconductor element that can form a parallel structure.

It is preferable that the first sealing layer is the non-colored layer, and the second sealing layer is the colored layer.

It is preferable that the first sealing layer is a diffusion functional layer.

According to the display of the present invention, color shift due to light emitted by the optical semiconductor element is less likely to occur, diffuse reflection of external light is less likely to occur, and the sealing performance of the optical semiconductor element is excellent. Therefore, the display body can be visually recognized with the same color tone from a wide field of view. In addition, the display body looks good both when lit and when not lit. Furthermore, even at high temperatures, the optical semiconductor element and the sealing resin layer do not easily separate, resulting in excellent heat resistance and reliability. Furthermore, according to the optical semiconductor element sealing sheet of the present invention, by sealing the optical semiconductor element, color shift is less likely to occur, diffused reflection of external light is less likely to occur, and display with excellent sealing properties of the optical semiconductor element is achieved. You can donate your body.

FIG. 2 is a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged in units of pixels on a substrate. 1 is a partial sectional view showing an embodiment of a display body of the present invention. 3 is a partially enlarged view of the display body shown in FIG. 2. FIG. FIG. 3 is a partial cross-sectional view showing how the optical semiconductor element of the display shown in FIG. 2 emits light. FIG. 2 is a partial cross-sectional view showing how an optical semiconductor element of a conventional display emits light. It is a partial sectional view showing another embodiment of the display of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows one Embodiment of the sheet for optical semiconductor element sealing of this invention. 8 is a partial cross-sectional view showing a process of sealing an optical semiconductor element using the optical semiconductor element sealing sheet shown in FIG. 7. FIG.

[Display]
The display of the present invention includes at least a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements. The display body is a device for displaying information using light emitted by an optical semiconductor element.

Examples of the optical semiconductor device include light emitting diodes (LEDs) such as blue light emitting diodes, green light emitting diodes, red light emitting diodes, and ultraviolet light emitting diodes.

On the substrate, the plurality of optical semiconductor elements are arranged in one pixel, and a plurality of the pixels are arranged. That is, a plurality of the above-mentioned optical semiconductor elements are arranged for each pixel including a plurality of optical semiconductor elements. FIG. 1 shows a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged for each pixel on a substrate. In the optical member 11 shown in FIG. 1, three optical semiconductor elements 3a to 3c are arranged close to each other on a substrate 2, and one pixel (pixel 3) is formed by the three optical semiconductor elements 3a to 3c. ing. Furthermore, three optical semiconductor elements 3d to 3f are arranged close to each other on the substrate 2, and the three optical semiconductor elements 3d to 3f form one pixel (pixel 3'). A plurality of pixels, such as pixel 3 and pixel 3', are arranged on the substrate 2.

The display body of the present invention has an uneven shape formed by the substrate and the optical semiconductor element, with the substrate surface in the area where the optical semiconductor element is not arranged between two optical semiconductor elements as a concave part and the optical semiconductor element as a convex part. has.

The height of the optical semiconductor element on the substrate (height from the substrate surface to the front end of the optical semiconductor element) is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer has better followability with respect to the uneven shape.

The sealing resin layer contacts the plurality of optical semiconductor elements and follows the uneven shape. Further, it is preferable that the sealing resin layer seals the plurality of optical semiconductor elements at once. In this specification, "sealing the optical semiconductor element" refers to embedding at least a portion of the optical semiconductor element in a sealing resin layer, or following and covering it with the sealing resin layer. say.

The sealing resin layer includes a first sealing layer in contact with the optical semiconductor element, a second sealing layer directly laminated on the first sealing layer, and a second sealing layer laminated directly on the second sealing layer. and a third sealing layer. Further, the sealing resin layer may include layers other than the first sealing layer, the second sealing layer, and the third sealing layer. Further, the total number of layers constituting the sealing resin layer is 3 or more including the first sealing layer, the second sealing layer, and the third sealing layer, and may be 4 or more. . The total number of the layers is, for example, 10 or less, and may be 5 or less, or 4 or less, from the viewpoint of reducing the thickness of the display body.

In the sealing resin layer, one of the first sealing layer and the second sealing layer is a colored layer, and the other is a non-colored layer. The third sealing layer may be a colored layer or a non-colored layer. Moreover, it is preferable that the first sealing layer, the second sealing layer, and the third sealing layer are each resin layers made of resin.

Any one of the plurality of optical semiconductor elements is defined as a first optical semiconductor element. An optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is referred to as a second optical semiconductor element. In a cross section perpendicular to the substrate surface that passes through the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element, a line perpendicular to the substrate surface that passes through the center of gravity of the first optical semiconductor element is defined as Let the perpendicular line be P _A. The midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element is defined as a midpoint C. A perpendicular line to the substrate surface passing through the midpoint C is defined as a perpendicular line P _C . A straight line L1 passing through the intersection of the perpendicular line P _A and the front side interface of the first sealing layer and the intersection of the perpendicular line P _C and the front side interface of the first sealing layer is the surface of the substrate. _A straight line that is non- _parallel to L2 is non-parallel to the substrate surface, and is the intersection of the perpendicular line P _A and the front side interface of the third sealing layer, and the intersection of the perpendicular line P _C and the front side interface of the third sealing layer. A straight line L3 passing through the intersection with is parallel to the surface of the substrate.

Note that the straight line L1 and the straight line L2 are non-parallel to the substrate surface, which means that the straight line L1 and the straight line L2 each make an angle of 5° or more with the substrate surface. Also, the straight line L3 is parallel to the substrate surface, but this is true not only when the straight line L3 is completely parallel to the substrate surface, but also when the angle between the straight line L3 and the substrate surface is less than 5°. including.

In the display, the sealing resin layer that seals the optical semiconductor element includes the colored layer, thereby making it possible to prevent light from being reflected by metal wiring provided on the substrate. The fact that the straight line L1 and the straight line L2 are non-parallel to the substrate surface means that the front-side interfaces of the colored layer and the non-colored layer are both convex on the optical semiconductor element, and concave between the nearest optical semiconductor elements. This means that it has an uneven shape. In this case, both the substrate-side and front-side interfaces of the colored layer have the above-described uneven shape, and the substrate-side interface of the colored layer in the recessed portion is located sufficiently close to the substrate, so that the optical semiconductor element emits light. Transmission of light in the side direction is prevented by the colored layer in the concave portion, making it difficult for the light emitted by each optical semiconductor element to interfere with each other, and color shift is suppressed. Furthermore, the colored layer and the non-colored layer have excellent conformability to an uneven shape in which the optical semiconductor element is a convex part and the substrate surface between adjacent optical semiconductor elements is a concave part, and are excellent in sealing properties of the optical semiconductor element. The straight line L3 being parallel to the substrate surface means that the interface on the front side of the third sealing layer located on the front side of the colored layer and the non-colored layer is flat. Since the surface of the third sealing layer is flat, the surface of the sealing resin layer tends to be flat, making it difficult for diffuse reflection of external light to occur, and improving the appearance of the display both when the display is lit and when it is not lit.

Note that in this specification, the "front" refers to the side from which the display body is viewed, and for example, in FIG. 2, which will be described later, is the upward direction.

It is preferable that the straight line L2 is closer to parallel to the substrate surface than the straight line L3. That is, the angle between the straight line L2 and the substrate surface is preferably smaller than the angle between the straight line L3 and the substrate surface. With such a configuration, the thickness of the colored layer and the non-colored layer between the first and second optical semiconductor elements is relatively thick, and the thickness of the colored layer and the non-colored layer on the front side of the first optical semiconductor element is relatively thick. The thickness tends to be relatively thin. Therefore, the light emitted by the optical semiconductor element toward the front side easily passes through the colored layer, and the brightness becomes high, and the light emitted from the optical semiconductor element toward the side surface is easily absorbed by the colored layer, and color shift is further suppressed.

In the above vertical cross section, the distance from the substrate surface on the perpendicular line P _A to the interface on the front side of the first sealing layer is longer than the distance from the substrate surface on the perpendicular line P _C to the interface on the front side of the first sealing layer. Preferably long. Further, the distance from the substrate surface on the perpendicular line P _A to the interface on the front side of the second sealing layer is preferably longer than the distance from the substrate surface on the perpendicular line P _C to the interface on the front side of the second sealing layer. . In this case, the light emitted from the optical semiconductor element in the side direction is prevented from being transmitted by the colored layer in the recess, and the light emitted from each optical semiconductor element is less likely to interfere with each other, and color shift is further suppressed.

In the above vertical cross section, the thickness of the colored layer (first sealing layer or second sealing layer) on perpendicular P _A is the same as the thickness of the colored layer (first sealing layer or second sealing layer) on perpendicular P _C. It is preferably thinner than the thickness of the second sealing layer (colored layer). With such a configuration, the thickness of the colored layer and the non-colored layer between the first and second optical semiconductor elements is relatively thick, and the thickness of the colored layer and the non-colored layer on the front side of the first optical semiconductor element is relatively thick. The thickness tends to be relatively thin. Therefore, the light emitted by the optical semiconductor element toward the front side easily passes through the colored layer, and the brightness becomes high, and the light emitted from the optical semiconductor element toward the side surface is easily absorbed by the colored layer, and color shift is further suppressed. In addition, a display body having such a configuration in which the straight line 1 and the straight line 2 are non-parallel to the surface of the substrate is manufactured by using a sheet for encapsulating an optical semiconductor element having a colored layer having a uniform thickness. It can be easily produced.

In the above vertical cross section, the distance from the substrate surface on the perpendicular line P _A to the front end of the first optical semiconductor element is the distance from the substrate surface on the perpendicular line P _C to the interface on the front side of the first sealing layer. It is preferable that it is longer than the distance. Further, the distance from the substrate surface on the perpendicular line P _A to the front end of the first optical semiconductor element is longer than the distance from the substrate surface on the perpendicular line P _C to the interface on the front side of the second sealing layer. It is preferable. In this case, the light emitted from the optical semiconductor element in the side direction is prevented from being transmitted by the colored layer in the recess, and the light emitted from each optical semiconductor element is less likely to interfere with each other, and color shift is further suppressed.

The display of the present invention will be explained using the display shown in FIG. 2, which is one embodiment thereof. The display body 1 shown in FIG. 2 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and a sealing resin layer 4 that collectively seals these optical semiconductor elements 3a to 3c. , and a base material portion 5 bonded to the surface of the sealing resin layer 4 on the side opposite to the optical semiconductor elements 3a to 3c side. FIG. 2 is an enlarged view of a cross section perpendicular to the substrate 2 passing through the centers of gravity of the optical semiconductor elements 3a to 3c.

The optical semiconductor elements 3a to 3c are each fixed on one substrate 2 by a support 31. The display body 1 includes a substrate 2 and an optical semiconductor element, with a concave portion N formed on the surface of the substrate 2 in an area where no optical semiconductor element is arranged between the optical semiconductor elements 3a to 3c, and a convex portion P formed on the optical semiconductor elements 3a to 3c. It has an uneven shape formed by 3a to 3c.

The optical semiconductor elements 3a to 3c in FIG. 2 are the optical semiconductor elements 3a to 3c shown in FIG. 1, and the optical semiconductor elements 3a to 3c are located within the same pixel 3. For example, the optical semiconductor element 3a is a first optical semiconductor element, and the optical semiconductor element 3b is a second optical semiconductor element adjacent to the optical semiconductor element 3a.

As shown in FIG. 2, the sealing resin layer 4 contacts the plurality of optical semiconductor elements 3a to 3c, follows the above-mentioned uneven shape, and seals the plurality of optical semiconductor elements 3a to 3c all at once. .

The sealing resin layer 4 is constructed by directly laminating a non-colored layer 41, a colored layer 42, and a non-colored layer 43 in this order, with the non-colored layer 41 side facing the optical semiconductor elements 3a to 3c. The optical semiconductor elements 3a to 3c are sealed. The non-colored layer 41 is a first sealing layer, the colored layer 42 is a second sealing layer, and the non-colored layer 43 is a third sealing layer.

The non-colored layer 41 in contact with the optical semiconductor elements 3a to 3c follows the above-described uneven shape, and the non-colored layer 41 and the colored layer 42 in the display body 1 also have an uneven shape. On the other hand, one surface of the non-colored layer 43 has an uneven shape that is opposite to the uneven shape of the colored layer 42 by following the uneven shape of the colored layer 42, and the other surface is flat. . Note that the non-colored layer 41 and the non-colored layer 43 may each independently be a diffusion functional layer, which will be described later, or a non-diffusion functional layer.

When the non-colored layer 41 is a diffusion functional layer, the sealing resin layer 4 includes a diffusion functional layer, a colored layer, and a non-colored layer (particularly a non-diffusion functional layer) in this order from the optical semiconductor element side. . In this case, the light emitted by the optical semiconductor element in the side direction can be diffused in the diffusion function layer, and the front brightness can be increased.

FIG. 3 shows a partially enlarged view of the area between the optical semiconductor elements 3a and 3b of the display body 1 shown in FIG. 2. As shown in FIG. 3, in the display body 1, a perpendicular line _PA to the surface of the substrate 2 passes through the center of gravity G _A of the optical semiconductor element 3a. The midpoint between the center of gravity G _A of the optical semiconductor element 3a and the center of gravity G _B of the optical semiconductor element 3b is the midpoint C. A line perpendicular to the surface of the substrate 2 passing through the midpoint C is a perpendicular line P _C . The intersection of the perpendicular P _A and the front side interface of the non-colored layer 41, which is the first sealing layer, is T _A1 . The intersection of the perpendicular P _A and the front side interface of the colored layer 42, which is the second sealing layer, is T _A2 . The intersection of the perpendicular P _A and the front side interface of the non-colored layer 43, which is the third sealing layer, is T _A3 . The intersection of the perpendicular P _C and the front side interface of the non-colored layer 41, which is the first sealing layer, is T _C1 . The intersection of the perpendicular P _C and the front side interface of the colored layer 42, which is the second sealing layer, is T _C2 . The intersection of the perpendicular P _C and the front side interface of the non-colored layer 43, which is the third sealing layer, is T _C3 . The straight line passing through T _A1 and T _C1 is the straight line L1, the straight line passing through T _A2 and T _C2 is the straight line L2, and the straight line passing through T _A3 and T _C3 is the straight line L3. When the surface of the substrate 2 is the baseline B, in the display 1, the straight line L1 is non-parallel to the baseline B, the straight line L2 is non-parallel, and the straight line L3 is parallel. The distance from the surface of the substrate 2 on the perpendicular line P _A to T _A1 is longer than the distance from the surface of the substrate 2 on the perpendicular line P _C to T C1, and the distance from the surface of the substrate ₂ on the perpendicular line P A to T _A2 is longer than the distance from the surface of the substrate 2 on the perpendicular line P A to T _A2 It is longer than the distance from the surface of the substrate 2 on _C to T _C2 . Further, the angle between the straight line L2 and the baseline B is smaller than the angle between the straight line L3 and the baseline B.

In the display body 1, since the sealing resin layer 4 that seals the optical semiconductor elements 3a to 3c includes the colored layer 42, it is possible to prevent light from being reflected by metal wiring provided on the substrate 2. The fact that the straight line L1 and the straight line L2 are non-parallel to the surface of the substrate 2 means that the front-side interfaces of the colored layer 42 and the non-colored layer 41 are both convex on the optical semiconductor element 3a, and the nearest optical semiconductor This means that it has an uneven shape that is concave between the elements 3a and 3b. In this case, both the substrate-side and front-side interfaces of the colored layer 42 have the above-mentioned uneven shape, and the substrate-side interface of the colored layer 42 in the recessed portion is located sufficiently close to the substrate 2, so that the optical semiconductor Transmission of the light in the side direction emitted by the element 3a is prevented by the colored layer 42 in the concave portion, making it difficult for the light emitted by the optical semiconductor elements 3a and 3b to interfere with each other, and color shift is suppressed. Moreover, the colored layer 42 and the non-colored layer 41 have excellent followability to an uneven shape in which the optical semiconductor element 3a is a convex part and the surface of the substrate 2 between adjacent optical semiconductor elements 3a and 3b is a concave part. Excellent sealing properties. The fact that the straight line L3 is parallel to the surface of the substrate 2 means that the interface on the front side of the non-colored layer 43, which is the third sealing layer located on the front side of the colored layer 42 and the non-colored layer 41, is flat. It means that. Since the surface of the non-colored layer 43 is flat, the surface of the sealing resin layer 4 tends to be flat, making it difficult for diffuse reflection of external light to occur, and improving the appearance of the display 1 both when lit and when not lit.

Furthermore, regarding all the optical semiconductor elements in the same pixel, in relation to all adjacent optical semiconductor elements, the straight line L1 and the straight line L2 are non-parallel to the substrate surface, and the straight line L3 is parallel to the substrate surface. It is preferable that they be parallel to each other. In this case, for example, the light emitted by all the optical semiconductor elements 3a to 3c in the same pixel shown in FIG. 2 in the lateral direction is absorbed by the colored layer 42 and is less likely to be transmitted, making it more difficult for color shifts to occur.

Specifically, as shown in FIG. 4, the front brightness of the display body 1 is mainly exhibited by the front-direction lights F _A , F _B , and F _C emitted by the optical semiconductor elements 3a to 3c. Transmission of the lights L _A , R _A , L _B , R _B , L _C , and R _C emitted from the optical semiconductor elements 3 a to 3 c to the side surfaces is blocked by the colored layer 42, so that the optical semiconductor elements 3 a to 3 c are Emitted light is less likely to interfere with each other, and color shifts are suppressed. Since external light that enters the display body 1 from the sealing resin layer 4 side is reflected by the flat non-colored layer 43, diffused reflection is less likely to occur, and the appearance of the display body 1 is improved both when lit and when not lit. do. Further, the non-colored layer 41 easily adheres to the side surfaces of the substrate 2 and the optical semiconductor elements 3a to 3c, and gaps are unlikely to be formed between the non-colored layer 41 and the substrate 2 and the optical semiconductor elements 3a to 3c.

On the other hand, FIG. 5 shows an embodiment of a conventional display body. In the display shown in FIG. 5, the front interface of the non-colored layer 41 and the front interface of the colored layer 42 are flat, so the straight line L1 and the straight line L2 are parallel to the surface of the substrate 2. Transmission of the lights L _A , R _A , L _B , R _B , L _C , and R _C to the side surfaces emitted by the optical semiconductor elements 3 a to 3 c is hardly hindered by the colored layer 42, and the light emitted by the optical semiconductor elements 3 a to 3 c, respectively. Color shifts tend to occur because the lights interfere with each other. Furthermore, since the front interface between the non-colored layer 41 as the first sealing layer and the colored layer 42 as the second sealing layer is parallel to the substrate surface, the optical semiconductor elements 3a to 3c are sealed. In this case, compression of the non-colored layer 41 and the colored layer 42 is insufficient, and gaps H tend to occur between the side surfaces of the optical semiconductor elements 3a to 3c and the surface of the substrate 2 and the sealing resin layer 4. Note that in the embodiment shown in FIG. 5, when the thickness of the colored layer 42 is increased, the amount of light F _A to F _C emitted by the optical semiconductor elements 3a to 3c decreases. Furthermore, when the thickness of the colored layer 42 is made thinner, the transmittance of light in the diagonal front direction increases, making color shift more likely to occur. In contrast, the display body of the present invention has excellent front brightness, prevention of color shift, difficulty in causing diffuse reflection of external light, and sealing properties of optical semiconductor elements. I can do it.

Furthermore, since the straight line L1 and the straight line L2 are non-parallel to the substrate surface, for example, the thickness of the colored layer in the recessed part of the substrate surface between the optical semiconductor elements can be increased, and at the same time, the thickness of the colored layer in front of the optical semiconductor element can be increased. The degree of freedom in design can be increased, such as by being able to configure the sealing resin layer so as to reduce the thickness. In this case, the transmission of light in the front direction emitted by the optical semiconductor element is not easily obstructed by the colored layer, resulting in excellent front brightness, and at the same time, the transmission of light in the side direction, emitted by the optical semiconductor element, is blocked by the colored layer, resulting in a color shift. can be prevented from occurring.

The center of gravity of the optical semiconductor element is determined by the three-dimensional shape of the optical semiconductor element. The three-dimensional shape of the optical semiconductor element is not particularly limited, and examples include prismatic shapes such as cubes and rectangular parallelepipeds, truncated pyramids, cylinders, truncated cones, and shapes with dome-shaped upper portions. When the three-dimensional shape of the optical semiconductor element is a regular prism, the center of gravity is the center of the optical semiconductor element.

Note that the display body 1 does not need to include the base material portion 5. Furthermore, the number of optical semiconductor elements within one pixel does not have to be three and is not particularly limited.

Another embodiment of the display of the present invention is shown in FIG. In the display 1 shown in FIG. 6, the first sealing layer is the colored layer 42, and the second sealing layer is the non-colored layer 41. That is, in the display 1 shown in FIG. 6, the positional relationship of the non-colored layer 41 and the colored layer 42 is reversed in the display 1 shown in FIG. Others are the same as the display body 1 shown in FIG.

The cross-sectional views of the display body shown in FIGS. 2 to 6 are, for example, obtained by cutting the display body in a cooled state perpendicularly to the substrate surface so as to pass through the center of gravity of a plurality of optical semiconductor elements to expose the cross section. You can get it. By cooling the display, it is possible to prevent the sealing resin layer from melting or deforming due to the heat generated during cutting. The cutting can be performed using a known or commonly used cutting device such as laser beam irradiation or ion beam irradiation. Further, after cutting, the exposed cross section may be milled to expose a cross section with a lower degree of deformation. The temperature during cooling is appropriately set within a range that suppresses the degree of deformation of the sealing resin layer and cracking of the display body.

<Sealing resin layer>
The sealing resin layer includes at least the colored layer and the non-colored layer. Each layer (the colored layer and the non-colored layer) constituting the sealing resin layer may be a single layer in the sealing resin layer, or may be a multilayer having the same or different compositions. Good too. When multiple colored layers and non-colored layers are included, the multiple layers may be laminated in contact with each other, or they may be laminated separately (for example, two colored layers are laminated with one non-colored layer interposed therebetween). You can leave it there. When the sealing resin layer includes one or more colored layers and non-colored layers, if the combination of at least one colored layer and non-colored layer is a combination of a first sealing layer and a second sealing layer. good.

In the display of the present invention, it is preferable that the first sealing layer is a non-colored layer and the second sealing layer is a colored layer. With such a configuration, front brightness can be increased. In the display 1 shown in FIG. 2, the first sealing layer is a non-colored layer 41, and the second sealing layer is a colored layer 42.

The third sealing layer may be either a colored layer or a non-colored layer, but is preferably a non-colored layer. In this case, the third sealing layer may be either a diffusion functional layer or a non-diffusion functional layer, but from the viewpoint that the straight line L3 is likely to be parallel to the substrate surface, it must be a non-diffusion functional layer. is preferred.

Preferably, the sealing resin layer includes a diffusion functional layer. With such a configuration, the light emitted by the optical semiconductor element can be diffused in the diffusion function layer, and the front brightness can be further increased. It is preferable that the above-mentioned diffusion functional layer corresponds to a non-colored layer in this specification.

When the sealing resin layer includes the diffusion functional layer, the non-colored layer of the sealing resin layer, which is the first sealing layer or the second sealing layer, is preferably a diffusion functional layer. By having such a configuration, it is possible to further improve the appearance of the display body both when the display is lit and when it is not lit, while increasing the front luminance.

In the vertical cross section, the first sealing layer has the above-mentioned sealing layer with respect to 100% of the total length of the substrate surface between the first and second optical semiconductor elements (the area where both optical semiconductor elements are not installed). It is preferable that 50% or more (preferably 60% or more, more preferably 80% or more, still more preferably 90% or more) contact with the substrate surface between the first and second optical semiconductor elements. With such a configuration, the first sealing layer has excellent followability to the uneven shape formed on the surface of the optical semiconductor element and the substrate, and has excellent sealing performance of the optical semiconductor element. Moreover, it is preferable that the first sealing layer contacts 50% or more of the substrate surface between the first and second optical semiconductor elements among all the optical semiconductor elements in the same pixel.

Each layer constituting the sealing resin layer may or may not have adhesiveness independently. Among these, it is preferable to have adhesiveness. With such a configuration, the sealing resin layer can easily seal the optical semiconductor element, and also has excellent adhesion between each layer, resulting in more excellent sealing properties of the optical semiconductor element. In particular, it is preferable that at least the first sealing layer that contacts the optical semiconductor element has adhesiveness. With such a configuration, the sealing resin layer has excellent followability and embeddability of the optical semiconductor element. As a result, the design is excellent even when the height difference due to the optical semiconductor element is high. Note that the layers other than the layer that contacts the optical semiconductor element do not need to have adhesiveness. In this case, adhesion between adjacent encapsulating resin layers is low in the tiling state, and adjacent small-sized laminates (laminates in which optical semiconductor elements placed on a substrate are encapsulated by encapsulating resin layers) When separating them, damage to the sealing resin layer and adhesion of adjacent sealing resin layers is less likely to occur.

(colored layer)
The colored layer in the display of the present invention is a layer whose purpose is to prevent reflection of light from metal wiring provided on a substrate in the display. The colored layer contains at least a colorant. The colored layer is preferably a resin layer made of resin. The coloring agent may be a dye or a pigment as long as it can be dissolved or dispersed in the colored layer. Dyes are preferred because they can achieve low haze even when added in small amounts, and are easy to distribute uniformly without settling unlike pigments. Pigments are also preferred because they provide high color development even when added in small amounts. If a pigment is used as a coloring agent, it is preferably one with low or no electrical conductivity. The above coloring agents may be used alone or in combination of two or more.

As the colorant, a black colorant is preferable. As the black colorant, known or commonly used colorants (pigments, dyes, etc.) for producing a black color can be used. For example, carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, etc.) can be used. , pine smoke, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (non-magnetic ferrite, magnetic ferrite, etc.), magnetite, chromium oxide, iron oxide, molybdenum disulfide , chromium complexes, anthraquinone colorants, zirconium nitride, etc. Further, a colorant that functions as a black colorant by combining a colorant exhibiting a color other than black may be used.

The content ratio of the colorant in the colored layer is preferably 0.2% by mass or more, more preferably 0.2% by mass or more, based on 100% by mass of the total amount of the colored layer, from the viewpoint of imparting appropriate antireflection ability to the display. .4% by mass or more. Further, the content of the colorant is, for example, 10% by mass or less, preferably 5% by mass or less, and more preferably 3% by mass or less. The content ratio may be appropriately set depending on the type of colorant, the color tone and light transmittance of the display body, and the like. The colorant may be added to the composition as a solution or dispersion dissolved or dispersed in a suitable solvent.

The haze value (initial haze value) of the colored layer is not particularly limited, but from the viewpoint of ensuring front brightness and visibility of the display, it is preferably 50% or less, more preferably 40% or less, still more preferably 30%. It is particularly preferably 20% or less. Further, the haze value of the colored layer is preferably 1% or more, more preferably 3% or more, still more preferably 5% or more, particularly preferably 8% or more, from the viewpoint of efficiently reducing brightness unevenness of the display body. and may be 10% or more. The haze value is the value at the thickest portion of the colored layer in the display.

The total light transmittance of the colored layer is not particularly limited, but from the viewpoint of further improving the antireflection function and contrast of metal wiring in the display, it is preferably 40% or less, more preferably 30% or less, and even more preferably is 25% or less, particularly preferably 20% or less. Further, the total light transmittance of the colored layer is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.5% or more, from the viewpoint of ensuring the brightness of the display body. Particularly preferably, it is 2% or more, and may be 2.5% or more, or 3% or more. The total light transmittance is the value at the thickest portion of the colored layer in the display.

The haze value and total light transmittance of the above-mentioned colored layer are the values of a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1. It can be controlled by the amount etc.

(Non-colored layer)
The above-mentioned non-colored layer is a layer different from the above-mentioned colored layer, and is a layer that is not intended to prevent reflection of light from metal wiring or the like provided on a substrate in a display body. The non-colored layer may be a colorless layer or may be slightly colored. Further, the above-mentioned non-colored layer may be, for example, a diffusion functional layer whose purpose is to exhibit a function of diffusing light, or a non-diffusion functional layer whose purpose is not to exhibit a function of diffusing light. It's okay. The non-colored layer may be transparent or non-transparent. The non-colored layer is preferably a resin layer made of resin.

The content of the colorant in the non-colored layer is preferably less than 0.2% by weight, more preferably less than 0.1% by weight, and even more preferably 0.05% by weight, based on 100% by weight of the total amount of the non-colored layer. %, and may be less than 0.01% by weight or less than 0.005% by weight.

The total light transmittance of the non-colored layer is not particularly limited, but from the viewpoint of ensuring the brightness of the display, it is preferably 40% or more, more preferably 60% or more, still more preferably 70% or more, particularly preferably It is 80% or more. Further, the upper limit of the total light transmittance of the non-colored layer is not particularly limited, but may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest portion of the non-colored layer in the display.

The total light transmittance of the above-mentioned non-colored layer is the value of a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1, and can be controlled by the type and thickness of the non-colored layer. .

The above-mentioned diffusion functional layer is a layer whose purpose is to diffuse light. When the sealing resin layer has the diffusion functional layer, light emitted from the optical semiconductor element is diffused in the diffusion functional layer, and for example, light emitted from the side surface of the optical semiconductor element is emitted toward the front of the display, The front brightness of the display body is improved. The diffusion functional layer is preferably a resin layer made of resin. The above-mentioned diffusion functional layer preferably includes, but is not limited to, light-diffusing fine particles. That is, the above-mentioned diffusion functional layer preferably contains light-diffusing fine particles dispersed in the resin layer. The above-mentioned light-diffusing fine particles may be used alone or in combination of two or more.

The light-diffusing fine particles have an appropriate refractive index difference with the resin constituting the diffusion functional layer, and impart diffusion performance to the diffusion functional layer. Examples of the light-diffusing fine particles include inorganic fine particles and polymer fine particles. Examples of the material for the inorganic fine particles include silica, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxides. Examples of the material of the polymer fine particles include silicone resin, acrylic resin (including polymethacrylate resin such as polymethyl methacrylate), polystyrene resin, polyurethane resin, melamine resin, polyethylene resin, and epoxy resin. .

As the polymer fine particles, fine particles made of silicone resin are preferable. Further, as the inorganic fine particles, fine particles made of metal oxide are preferable. As the metal oxide, titanium oxide and barium titanate are preferable, and titanium oxide is more preferable. By having such a configuration, the light diffusing property of the above-mentioned diffusion functional layer is more excellent, and brightness unevenness is further suppressed.

The shape of the light-diffusing fine particles is not particularly limited, and may be, for example, perfectly spherical, flat, or irregularly shaped.

The average particle diameter of the light-diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, even more preferably 0.2 μm or more, particularly preferably 0. .25 μm or more. Furthermore, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the average particle diameter of the light-diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, and still more preferably 8 μm or less. It is. The average particle diameter can be measured using, for example, a Coulter counter.

The refractive index of the light-diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, even more preferably 1.3 to 4, particularly preferably 1.35 to 3.

The absolute value of the difference in refractive index between the light-diffusing fine particles and the resin constituting the diffusion functional layer (the resin layer excluding the light-diffusing fine particles in the diffusion functional layer) more efficiently reduces uneven brightness of the display. From the viewpoint, it is preferably 0.001 or more, more preferably 0.01 or more, even more preferably 0.02 or more, particularly preferably 0.03 or more, even if it is 0.04 or more, or 0.05 or more. good. Further, the absolute value of the refractive index difference between the light-diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image. More preferably, it is 3 or less.

From the viewpoint of imparting appropriate light diffusion performance to the sealing resin layer, the content of the light diffusing fine particles in the diffusion functional layer is 0.01 parts by mass based on 100 parts by mass of the resin constituting the diffusion functional layer. The amount is preferably at least 0.05 parts by mass, more preferably at least 0.1 parts by mass, particularly preferably at least 0.15 parts by mass. In addition, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the content of the light-diffusing fine particles is 80 parts by mass or less based on 100 parts by mass of the resin constituting the diffusion functional layer. is preferable, and more preferably 70 parts by mass or less.

The haze value (initial haze value) of the diffusion functional layer is not particularly limited, but from the viewpoint of efficiently reducing uneven brightness, it is preferably 30% or more, more preferably 40% or more, even more preferably 50% or more, Particularly preferably, it is 60% or more, and may be 70% or more, 80% or more, 90% or more, 95% or more, 97% or more, and moreover, a value around 99.9% is more excellent in the brightness unevenness improving effect. preferable. Note that the upper limit of the haze value of the diffusion functional layer is not particularly limited, and may be 100%. The haze value is the value at the thickest portion of the diffusion functional layer in the display.

The total light transmittance of the diffusion functional layer is not particularly limited, but from the viewpoint of ensuring brightness, it is preferably 40% or more, more preferably 60% or more, even more preferably 70% or more, particularly preferably 80% or more. It is. Further, the upper limit of the total light transmittance of the diffusion functional layer is not particularly limited, but may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest portion of the diffusion functional layer in the display.

The haze value and total light transmittance of the above-mentioned diffusion functional layer are the values of a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1. It can be controlled by the type and amount of diffusible particles.

The haze value (initial haze value) of the non-diffusion functional layer is not particularly limited, but from the viewpoint of improving the brightness of the display, it is preferably less than 30%, more preferably 10% or less, and even more preferably 5%. % or less, particularly preferably 1% or less, and may be 0.5% or less. Note that the lower limit of the haze value of the non-diffusion functional layer is not particularly limited. The haze value is the value at the thickest portion of the non-diffusion functional layer in the display body.

The total light transmittance of the non-diffusing functional layer is not particularly limited, but from the viewpoint of ensuring the brightness of the display, it is preferably 60% or more, more preferably 70% or more, still more preferably 80% or more, and particularly preferably is 90% or more. Further, the upper limit of the total light transmittance of the non-diffusing functional layer is not particularly limited, but may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest portion of the non-diffusion functional layer in the display.

The haze value and total light transmittance of the above-mentioned non-diffusing functional layer are the values of a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1, and may vary depending on the type and thickness of the non-diffusing functional layer. It can be controlled by etc.

The content of the colorant and/or light-diffusing fine particles in the non-diffusing functional layer is set to 0 parts by mass based on 100 parts by mass of the resin constituting the non-diffusing functional layer, from the viewpoint of improving the brightness of the display. It is preferably less than .01 parts by weight, more preferably less than 0.005 parts by weight.

(resin layer)
Examples of the resin constituting the resin layer include known or commonly used resins, such as acrylic resins, urethane acrylate resins, urethane resins, rubber resins, epoxy resins, epoxy acrylate resins, and oxetane resins. , silicone resins, silicone acrylic resins, polyester resins, polyether resins (such as polyvinyl ether), polyamide resins, fluororesins, vinyl acetate/vinyl chloride copolymers, and modified polyolefins. The above resins may be used alone or in combination of two or more. The resins constituting each layer of the sealing resin layer may be the same or different.

When the resin layer is an adhesive layer (adhesive layer), a known or commonly used pressure-sensitive adhesive can be used as the resin. Examples of the above-mentioned adhesives include acrylic adhesives, rubber adhesives (natural rubber-based, synthetic rubber-based, mixtures thereof, etc.), silicone-based adhesives, polyester-based adhesives, urethane-based adhesives, and polyether. Examples include adhesives such as adhesives based on polyamide, polyamide adhesives, and fluorine adhesives. The above adhesives may be used alone or in combination of two or more.

The resin layer may contain other components other than the above-mentioned components as long as the effects of the present invention are not impaired in each layer. Other ingredients listed above include curing agents, crosslinking accelerators, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), oligomers, anti-aging agents, fillers (metal powders, organic fillers, inorganic fillers, etc.), antioxidants, plasticizers, softeners, surfactants, antistatic agents, surface lubricants, leveling agents, light stabilizers, ultraviolet absorbers, polymerization inhibitors, granular materials, foil-like materials, etc. Can be mentioned. The above-mentioned other components may be used alone or in combination of two or more.

The laminated structure of the above sealing resin layer includes [diffusion functional layer/colored layer/non-diffusion functional layer], [non-diffusion functional layer/colored layer/diffusion functional layer], and [diffusion functional layer/colored layer/diffusion functional layer]. ], [Non-diffusion functional layer/Colored layer/Non-diffusion functional layer], [Colored layer/Diffusion functional layer/Non-diffusion functional layer], [Colored layer/Non-diffusion functional layer/Diffusion functional layer], [Colored layer/Diffusion Functional layer/Diffusion functional layer], [Colored layer/Non-diffusion functional layer/Non-diffusion functional layer], [Diffusion functional layer/Colored layer/Colored layer], [Non-diffusion functional layer/Colored layer/Colored layer], [Colored layer] layer/diffusion functional layer/colored layer], [colored layer/non-diffusion functional layer/colored layer] (in order from the optical semiconductor element side), and the like.

<Base material part>
The display body of the present invention may or may not include a base material portion. When the base material part is provided on the front side of the sealing resin layer in the display body, the surface of the sealing resin layer can be made flatter, which makes it less likely to cause diffused reflection of light, and can be used both when lit and when not lit. The appearance of the display body is improved at both times. Further, by forming an anti-glare layer or an anti-reflection layer, which will be described later, on the base material portion, anti-glare properties and anti-reflection properties can be imparted to the display body. In addition, it serves as a support for a sealing resin layer in a sheet for encapsulating an optical semiconductor element, which will be described later, and by providing the above-mentioned base material portion, the sheet for encapsulating an optical semiconductor element has excellent handling properties.

The base material portion may be a single layer, or may be a multilayer having the same or different compositions, thicknesses, etc. When the base material part is multi-layered, each layer may be bonded together by another layer such as an adhesive layer. Note that the base material layer used for the base material part is a part that is attached to the substrate containing the optical semiconductor element together with the sealing resin layer, and is peeled off when the optical semiconductor element sealing sheet is used (at the time of attachment). A "base material" does not include a release liner or a surface protection film that merely protects the surface of the base material.

Examples of the base layer constituting the base portion include glass and plastic base materials (especially plastic films). Examples of the resin constituting the plastic base material include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, and homopolyprolene. , polybutene, polymethylpentene, ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene- Polyolefin resins such as propylene copolymers, cyclic olefin polymers, ethylene-butene copolymers, and ethylene-hexene copolymers; polyurethanes; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); Polycarbonate; Polyimide resin; Polyetheretherketone; Polyetherimide; Polyamide such as aramid and wholly aromatic polyamide; Polyphenylsulfide; Fluororesin; Polyvinyl chloride; Polyvinylidene chloride; Cellulose resin such as triacetylcellulose (TAC) ; silicone resin; acrylic resin such as polymethyl methacrylate (PMMA); polysulfone; polyarylate; polyvinyl acetate. The above resins may be used alone or in combination of two or more. The base material layer may be various optical films such as an antireflection (AR) film, a polarizing plate, and a retardation plate.

The thickness of the plastic film is preferably 20 to 300 μm, more preferably 40 to 250 μm. When the thickness is 20 μm or more, the supportability and handleability of the sheet for encapsulating an optical semiconductor device are further improved. When the thickness is 300 μm or less, the display body can be made thinner.

The surface of the base material on the side where the sealing resin layer is provided may be subjected to, for example, corona discharge treatment, plasma treatment, sand mat treatment, ozone exposure, etc., for the purpose of improving adhesion and retention with the sealing resin layer. Physical treatments such as treatment, flame exposure treatment, high-voltage electric shock treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; surface treatments such as easy-adhesion treatment using a coating agent (undercoat). . The surface treatment for improving adhesion is preferably applied to the entire surface of the base portion on the side of the sealing resin layer.

The thickness of the base material portion is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of excellent support function and surface scratch resistance. The thickness of the base material portion is preferably 300 μm or less, more preferably 250 μm or less, from the viewpoint of better transparency.

<Display body>
The display body may include a layer having anti-glare and/or anti-reflection properties. By having such a configuration, it is possible to suppress the gloss and light reflection of the display body and improve the appearance. Examples of the layer having anti-glare properties include an anti-glare treated layer. Examples of the layer having antireflection properties include an antireflection treated layer. The anti-glare treatment and the anti-reflection treatment can be carried out using known or commonly used methods. The layer having anti-glare properties and the layer having anti-reflection properties may be the same layer or may be different layers. The layer having anti-glare properties and/or anti-reflection properties may have only one layer, or may have two or more layers.

The haze value (initial haze value) of the sealing resin layer or the laminate having both end faces of the sealing resin layer and the base material part is not particularly limited, but it is effective for suppressing brightness unevenness and for design. From the viewpoint of making it more excellent, it is preferably 80% or more, more preferably 85% or more, still more preferably 90% or more, particularly preferably 95% or more. Note that the upper limit of the haze value is not particularly limited.

The total light transmittance of the sealing resin layer or the laminate having both end faces of the sealing resin layer and the base material part is not particularly limited, but it can further improve the anti-reflection function and contrast of metal wiring etc. From this viewpoint, it is preferably 40% or less, more preferably 30% or less, and even more preferably 20% or less. Further, the total light transmittance is preferably 0.5% or more from the viewpoint of ensuring brightness.

The above haze value and total light transmittance can be measured by the methods specified in JIS K7136 and JIS K7361-1, respectively, and depend on the stacking order, type, and thickness of each layer constituting the sealing resin layer and the base material part. It can be controlled by

The thickness of the encapsulation resin layer or the laminate having both end faces of the encapsulation resin layer and the base material part is determined to improve the anti-reflection function and contrast of metal wiring, while also making color shift more efficient. From the viewpoint of reducing the thickness, it is preferably 10 to 600 μm, more preferably 20 to 550 μm, even more preferably 30 to 500 μm, still more preferably 40 to 450 μm, and particularly preferably 50 to 400 μm. Note that the release liner is not included in the above thickness.

Moreover, it is preferable that the display body of the present invention includes a self-luminous display device. Further, by combining the above self-luminous display device and a display panel as necessary, a display body that is an image display device can be obtained. The optical semiconductor element in this case is an LED element. Examples of the self-luminous display device include an LED display, a backlight, an organic electroluminescence (organic EL) display device, and the like. It is particularly preferable that the backlight is a full-surface direct type backlight. The backlight includes, for example, a laminate including the substrate and a plurality of optical semiconductor elements arranged on the substrate as at least a part of its constituent members. For example, in the self-luminous display device, a metal wiring layer for sending a light emission control signal to each LED element is laminated on the substrate. LED elements that emit light of red (R), green (G), and blue (B) colors are alternately arranged on a substrate with metal wiring layers interposed therebetween. The metal wiring layer is made of metal such as copper, and displays each color by adjusting the degree of light emission of each LED element.

The display of the present invention may be a display that is used by being folded, for example, a foldable image display device (flexible display) (particularly a foldable image display device (foldable display)). Specifically, examples include a display body equipped with a foldable backlight, a display body equipped with a foldable self-luminous display device, and the like.

In the display of the present invention, since the sealing resin layer has excellent followability and embeddability of the optical semiconductor element, the optical semiconductor element may be a mini LED element or a micro LED element.

According to the display of the present invention, color shift due to light emitted by the optical semiconductor element is less likely to occur, diffuse reflection of external light is less likely to occur, and the sealing performance of the optical semiconductor element is excellent. Therefore, the display body can be visually recognized with the same color tone from a wide field of view. In addition, the display body looks good both when lit and when not lit. Furthermore, even at high temperatures, the optical semiconductor element and the sealing resin layer do not easily separate, resulting in excellent heat resistance and reliability.

[Method for manufacturing display body]
The display body of the present invention can be obtained by bonding a sheet for encapsulating an optical semiconductor element having a resin layer for sealing to a substrate on which an optical semiconductor element is arranged, and sealing the optical semiconductor element with the resin layer for sealing. can be manufactured.

(Sheet for encapsulating optical semiconductor elements)
The optical semiconductor element sealing sheet is a sheet for sealing a plurality of optical semiconductor elements arranged on a substrate. The optical semiconductor element sealing sheet includes a first sealing layer, a second sealing layer directly laminated on the first sealing layer, and a third sealing layer directly laminated on the second sealing layer. The sealing resin layer includes a sealing resin layer. One of the first sealing layer and the second sealing layer is a colored layer, and the other is a non-colored layer. The optical semiconductor element sealing sheet seals the plurality of optical semiconductor elements with the sealing resin layer so that the first sealing layer contacts the plurality of optical semiconductor elements. When forming the layer, the straight line L1 is non-parallel to the substrate surface, the straight line L2 is non-parallel to the substrate surface, and the straight line L3 is parallel to the substrate surface. It is a sheet that can form a structure. According to the sheet for encapsulating optical semiconductor elements of the present invention, by sealing optical semiconductor elements, a display body that is less likely to cause color shift, less likely to cause diffuse reflection of external light, and has excellent sealing properties for optical semiconductor elements. can be provided.

The sealing resin layer is a layer that can form the sealing resin layer in the display of the present invention. Specifically, the first sealing layer, the second sealing layer, and the third sealing layer in the sealing resin layer are each the first sealing layer in the display of the present invention. , the second sealing layer, and the third sealing layer. Specifically, the first sealing layer in the sealing resin layer has a composition (components and their blending ratios) and physical properties (haze, overall The layers may have the same light transmittance (light transmittance, etc.), or may be a layer that becomes the first sealing layer in the display of the present invention upon curing. In addition, the second sealing layer in the sealing resin layer has a composition (constituent components and their blending ratio) and physical properties (haze, total light transmittance) and the second sealing layer in the display body of the present invention. etc.) may be the same layer, or may be a layer that becomes the second sealing layer in the display of the present invention upon curing. In addition, the third sealing layer in the sealing resin layer has a composition (constituent components and their blending ratio) and physical properties (haze, total light transmittance) and the third sealing layer in the display body of the present invention. etc.) may be the same layer, or may be a layer that becomes the third sealing layer in the display of the present invention upon curing.

Each layer constituting the sealing resin layer may or may not have adhesiveness and/or adhesiveness independently. Among these, it is preferable to have adhesiveness and/or adhesiveness. With such a configuration, the sealing resin layer can be easily bonded to the substrate and the optical semiconductor element, and has excellent adhesion between each layer, resulting in better sealing performance of the optical semiconductor element. In particular, it is preferable that at least the layer that contacts the optical semiconductor element has adhesiveness and/or adhesiveness. By having such a configuration, the followability and embedding of the optical semiconductor element by the sealing resin layer are excellent. As a result, the design is excellent even when the height difference due to the optical semiconductor element is high.

Each layer constituting the sealing resin layer (the first sealing layer, the second sealing layer, the third sealing layer, etc.) is each independently made of a resin that has the property of being cured by radiation irradiation. It may be a layer (radiation curable resin layer) or a resin layer that does not have the property of being cured by radiation irradiation (radiation non-curable resin layer). Examples of the radiation include electron beams, ultraviolet rays, α rays, β rays, γ rays, and X rays. When the colored layer is a radiation-curable resin layer, the colorant that may be included in the colored layer is not particularly limited, but the colorant absorbs visible light and has a wavelength at which the radiation-curable resin layer can be cured. It is preferable to use a material having a permeability of .

The optical semiconductor element sealing sheet may include the base material portion. When the base material section is provided, the sealing resin layer may be provided on at least one surface of the base material section. The surface of the sealing resin layer that comes into contact with the base material part is the surface opposite to the side where the sealing resin layer contacts the optical semiconductor element. When the optical semiconductor element sealing sheet includes the base material part, the optical semiconductor element sealing sheet is bonded to the optical semiconductor element and the substrate together with the base material part, and the optical semiconductor element sealing sheet is bonded to the optical semiconductor element and the substrate together with the optical semiconductor element sealing sheet, and The base material part becomes a base material part in the display body of the present invention.

Further, the sealing resin layer may be formed on the release-treated surface of the release liner. When the optical semiconductor element sealing sheet is formed on the release liner, the side of the sealing resin layer that contacts the optical semiconductor element is the side that contacts the release liner. When the base material portion is not provided, both surfaces of the sealing resin layer may be the side that contacts the release liner. The release liner is used as a protective material for the optical semiconductor element sealing sheet, and is peeled off when sealing the optical semiconductor element. Note that the base material portion and the release liner do not necessarily need to be provided.

The release liner is an element for covering and protecting the surface of the sheet for encapsulating an optical semiconductor element, and when the sheet for encapsulating an optical semiconductor element is attached to a substrate on which an optical semiconductor element is arranged, the sheet is be stripped from.

Examples of the above-mentioned release liner include polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, plastic films and papers whose surface is coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate release agent. It will be done.

The thickness of the release liner is, for example, 10 to 200 μm, preferably 15 to 150 μm, and more preferably 20 to 100 μm. When the thickness is 10 μm or more, the release liner is less likely to break due to cuts during processing. When the thickness is 200 μm or less, the release liner can be more easily peeled off from the optical semiconductor device sealing sheet during use.

An embodiment of the optical semiconductor element sealing sheet will be described using FIG. 7. FIG. 7 is a cross-sectional view of the optical semiconductor element sealing sheet capable of forming the display body shown in FIG. 2. As shown in FIG. 7, the optical semiconductor element sealing sheet 10 can be used to seal one or more optical semiconductor elements arranged on a substrate, and is a sheet that can be used to seal one or more optical semiconductor elements disposed on a substrate. A sealing resin layer 7 formed on the material portion 5 is provided. The sealing resin layer 7 is formed from a laminate of a non-colored layer 71 as a first sealing layer, a colored layer 72 as a second sealing layer, and a non-colored layer 73 as a third sealing layer. There is. The non-colored layer 71, the colored layer 72, and the non-colored layer 73 have adhesive properties and are directly stacked on each other. A release liner 6 is attached to the surface of the non-colored layer 71 of the sealing resin layer 7, and a base member 5 is attached to the surface of the non-colored layer 73.

(Sealing process)
In the method of manufacturing a display body of the present invention using the above-mentioned sheet for encapsulating an optical semiconductor element, the above-mentioned sheet for encapsulating an optical semiconductor element is laminated to a substrate on which an optical semiconductor element is arranged, and a resin layer for sealing It has a sealing process of sealing the optical semiconductor element. Specifically, in the sealing step, first, the release liner is peeled off from the optical semiconductor element sealing sheet to expose the sealing resin layer. Then, in a laminate (such as an optical member) comprising a substrate and an optical semiconductor element (preferably a plurality of optical semiconductor elements) arranged on the substrate, the optical semiconductor is placed on the substrate surface on which the optical semiconductor element is arranged. The exposed surfaces of the encapsulation resin layers of the element encapsulation sheets are bonded together, and when the laminate includes a plurality of optical semiconductor elements, the encapsulation resin layer further fills the gaps between the plurality of optical semiconductor elements. The plurality of optical semiconductor elements are sealed together. Specifically, as shown in FIG. 8, the non-colored layer 71 of the optical semiconductor element sealing sheet 10 from which the release liner 6 has been peeled off is placed opposite the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are arranged. The optical semiconductor element sealing sheet 10 is attached to the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are arranged, and the optical semiconductor elements 3a to 3c are embedded in the sealing resin layer 7.

The temperature during the above bonding is, for example, within the range of room temperature to 110°C. Further, during the above bonding, pressure may be reduced or increased. It is possible to suppress the formation of voids between the sealing resin layer and the substrate or the optical semiconductor element due to reduced pressure or increased pressure. Moreover, in the said sealing process, it is preferable to bond the optical semiconductor element sealing sheet together under reduced pressure, and to apply pressure after that. The pressure for reducing the pressure is, for example, 1 to 100 Pa, and the time for reducing the pressure is, for example, 5 to 600 seconds. Further, the pressure when pressurizing is, for example, 0.05 to 0.5 MPa, and the pressurizing time is, for example, 5 to 600 seconds.

By appropriately setting the thicknesses of the first sealing layer, second sealing layer, and third sealing layer in the sealing resin layer, and the temperature and pressure during bonding, the resulting display body can be The conformability of the first sealing layer and the second sealing layer to the optical semiconductor element, and the first sealing layer, the second sealing layer, and the third sealing layer in each region of the concave and convex portions in the above-mentioned uneven shape. The thickness can be adjusted. Thereby, in the resulting display, the parallelism of the straight lines L1, L2, and L3 to the substrate surface can be controlled.

(Radiation irradiation process)
When the sealing resin layer includes a radiation-curable resin layer, the manufacturing method further includes the substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element for sealing the optical semiconductor element. The method may include a radiation irradiation step of irradiating a laminate including an element sealing sheet with radiation to cure the radiation-curable resin layer to form a cured material layer. As mentioned above, examples of the radiation include electron beams, ultraviolet rays, α rays, β rays, γ rays, and X rays. Among these, ultraviolet light is preferred. The temperature during radiation irradiation is, for example, in the range from room temperature to 100° C., and the irradiation time is, for example, 1 minute to 1 hour.

(dicing process)
The manufacturing method further includes a dicing step of dicing a laminate including the substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element. may be provided. The above-mentioned laminate may be formed on a laminate that has undergone the above-mentioned radiation irradiation step. When the laminate includes a cured material layer in which the radiation-curable resin layer is cured by the radiation irradiation, in the dicing step, the cured material layer of the optical semiconductor element sealing sheet and the side edges of the substrate are diced. Remove. Thereby, the surface of the cured material layer, which has been sufficiently cured and whose tackiness has been reduced, can be exposed on the side surface. The above-mentioned dicing can be performed by a known or commonly used method, for example, by using a dicing blade or by laser irradiation.

(Tiling process)
The manufacturing method may further include a tiling step of arranging the plurality of display bodies obtained in the dicing step so as to be in contact with each other in a plane direction. In the tiling step, the plurality of laminates obtained in the dicing step are arranged and tiled so as to be in contact with each other in a planar direction. In this way, one large display can be produced.

The display body of the present invention can be manufactured in the manner described above. When the sealing resin layer 7 in the optical semiconductor element sealing sheet 10 does not have a radiation-curable resin layer, the sealing resin layer 7 becomes the sealing resin layer 4 in the display body 1 . On the other hand, in the optical semiconductor element sealing sheet 10, when the sealing resin layer 7 has a radiation-curable resin layer, for example, when the colored layer 72 and the non-colored layer 73 are radiation-curable resin layers, the colored layer 72 and the non-colored layer 73 are radiation-curable resin layers. By curing the non-colored layer 73, the colored layer 42 and the non-colored layer 43 are formed and become the sealing resin layer 4.

1 Display body 2 Substrate 3a to 3f Optical semiconductor element 31 Support body 3, 3' pixels 4 Sealing resin layer 41 Non-colored layer 42 Colored layer 43 Non-colored layer 5 Base material portion 6 Release liner 7 Sealing resin layer 71 Non-colored Colored layer 72 Colored layer 73 Non-colored layer 10 Optical semiconductor element sealing sheet 11 Optical member

Claims (9)

A display body comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements,
The sealing resin layer includes a first sealing layer in contact with the optical semiconductor element, a second sealing layer directly laminated on the first sealing layer, and a second sealing layer laminated directly on the second sealing layer. and a third sealing layer,
One of the first sealing layer and the second sealing layer is a colored layer, and the other is a non-colored layer,
In a cross section perpendicular to the substrate surface passing through the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel,
A perpendicular line to the substrate surface passing through the center of gravity of the first optical semiconductor element is a perpendicular line P _A ,
When a perpendicular line to the substrate surface passing through the midpoint of the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element is a perpendicular line P _C ,
A straight line L1 passing through the intersection of the perpendicular line P _A and the front side interface of the first sealing layer and the intersection of the perpendicular line P _C and the front side interface of the first sealing layer is relative to the substrate surface. are non-parallel,
A straight line L2 passing through the intersection of the perpendicular line P _A and the front side interface of the second sealing layer and the intersection of the perpendicular line P _C and the front side interface of the second sealing layer is relative to the substrate surface. are non-parallel,
A straight line L3 passing through the intersection of the perpendicular line P _A and the front-side interface of the third sealing layer and the intersection of the perpendicular line P _C and the front-side interface of the third sealing layer is relative to the substrate surface. A display body that is parallel to each other. 2. The display according to claim 1, wherein the first sealing layer is in contact with the substrate surface between the first and second optical semiconductor elements by 50% or more in the vertical cross section. The display according to claim 1 or 2, wherein the first sealing layer is the non-colored layer, and the second sealing layer is the colored layer. The display according to any one of claims 1 to 3, wherein the first sealing layer is a diffusion functional layer. The display body according to any one of claims 1 to 4, comprising a self-luminous display device. The display body according to any one of claims 1 to 5, which is an image display device. A sheet for sealing a plurality of optical semiconductor elements arranged on a substrate, the sheet comprising:
The sheet includes a first sealing layer, a second sealing layer directly laminated on the first sealing layer, and a third sealing layer directly laminated on the second sealing layer. Equipped with a resin layer for
One of the first sealing layer and the second sealing layer is a colored layer, and the other is a non-colored layer,
When forming a sealing resin layer by sealing the plurality of optical semiconductor elements with the sealing resin layer so that the first sealing layer is in contact with the plurality of optical semiconductor elements,
In a cross section perpendicular to the substrate surface passing through the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel,
A perpendicular line to the substrate surface passing through the center of gravity of the first optical semiconductor element is a perpendicular line P _A ,
When a perpendicular line to the substrate surface passing through the midpoint of the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element is a perpendicular line P _C ,
A straight line L1 passing through the intersection of the perpendicular line P _A and the front side interface of the first sealing layer and the intersection of the perpendicular line P _C and the front side interface of the first sealing layer is relative to the substrate surface. are non-parallel,
A straight line L2 passing through the intersection of the perpendicular line P _A and the front side interface of the second sealing layer and the intersection of the perpendicular line P _C and the front side interface of the second sealing layer is relative to the substrate surface. are non-parallel,
A straight line L3 passing through the intersection of the perpendicular line P _A and the front-side interface of the third sealing layer and the intersection of the perpendicular line P _C and the front-side interface of the third sealing layer is relative to the substrate surface. A sheet for encapsulating optical semiconductor devices that can form a parallel structure. The sheet for encapsulating an optical semiconductor element according to claim 7, wherein the first sealing layer is the non-colored layer, and the second sealing layer is the colored layer. The sheet for encapsulating an optical semiconductor device according to claim 7 or 8, wherein the first encapsulating layer is a diffusion functional layer.

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