CN116805638A

CN116805638A - Display and optical semiconductor element sealing sheet

Info

Publication number: CN116805638A
Application number: CN202310287788.8A
Authority: CN
Inventors: 田中俊平; 仲野武史; 浅井量子; 植野大树; 长束尚辉
Original assignee: Nitto Denko Corp
Current assignee: Nitto Denko Corp
Priority date: 2022-03-25
Filing date: 2023-03-23
Publication date: 2023-09-26
Also published as: TW202347831A; JP2023142481A; KR20230140501A

Abstract

The invention provides a display body which is not easy to generate color cast and is not easy to cause diffuse reflection of external light. The display body includes a substrate, an optical semiconductor element, and a sealing resin layer for sealing the optical semiconductor element. The sealing resin layer includes a non-colored layer, a colored layer, and a non-colored layer. In a vertical plane section passing through the center of gravity of the optical semiconductor elements (3 a, 3 b), a vertical line (P _A ) An intersection point between the front surface side interface of the non-colored layer (41) and a perpendicular line (P) _C ) A straight line passing through the perpendicular line (P) is not parallel to the substrate surface at the intersection point between the front surface side interface of the non-colored layer (41) _A ) An intersection point with the front surface side interface of the coloring layer (42) and a perpendicular line (P) _C ) A straight line passing through the perpendicular line (P) is not parallel to the substrate surface at the intersection point between the front surface side interface of the colored layer (42) _A ) An intersection point between the front surface side interface of the non-colored layer (43) and a perpendicular line (P) _C ) A straight line at the intersection between the front-side interface of the non-colored layer (43) is parallel to the substrate surface.

Description

Display and optical semiconductor element sealing sheet

Technical Field

The present invention relates to a display body and an optical semiconductor element sealing sheet. More specifically, the present invention relates to a display body in which an optical semiconductor element of a self-luminous display device is sealed, and a sheet suitable for sealing the optical semiconductor element, for example.

Background

In recent years, as a new generation display device, a self-luminous display device typified by a Mini/micro LED display device (Mini/Micro Light Emitting Diode Display) has been designed. As a basic configuration of a mini/micro LED display device, a substrate in which a large number of micro optical semiconductor elements (LED chips) are densely arranged is used as a display panel, the optical semiconductor elements are sealed with a sealing material, and a cover member such as a resin film or a glass plate is laminated on the outermost layer.

In a display body including a self-luminous display device such as a mini/micro LED display device, wiring (metal wiring) of a metal oxide such as metal or ITO is arranged on a substrate of a display panel. Such a display device has the following problems, for example: when the lamp is not lighted, light is reflected by the metal wiring or the like, and the appearance of the screen is deteriorated. Therefore, as a sealing material for sealing the optical semiconductor element, a technique using an antireflection layer for preventing reflection by a metal wiring is adopted.

In addition, in a display using a self-luminous display device, there is a problem that uneven brightness (uneven brightness) occurs due to a light source of an optical semiconductor element. When the luminance unevenness occurs, a phenomenon such as "color shift" in which the color tone changes occurs when viewed from the front of the display or when viewed from an oblique view.

Patent document 1 discloses an adhesive sheet that is a laminate of a colored adhesive layer and a colorless adhesive layer, and is provided so that the colorless adhesive layer is in contact with an optical semiconductor element, as an adhesive sheet capable of suppressing luminance unevenness. According to the adhesive sheet, the colorless adhesive layer contacts the irregularities when the adhesive sheet contacts and follows the irregularities formed by the substrate and the optical semiconductor element provided on the substrate, and the irregularities are absorbed to some extent by the colorless adhesive layer, so that the colored adhesive layer can be suppressed from being compressed or deformed, thereby suppressing the transmittance unevenness in the adhesive layer, and suppressing the luminance unevenness.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open No. 2020-169262

Disclosure of Invention

Problems to be solved by the invention

However, the adhesive sheet provided with the colored adhesive layer has the following problems: the colored adhesive layer cannot sufficiently absorb light emitted from the side surface of the optical semiconductor element, and the adjacent optical semiconductor elements have strong interference with each other, and color shift is likely to occur. In addition, in the conventional display, diffuse reflection of external light occurs on the surface of the adhesive sheet, which may deteriorate the appearance of the display when the display is lit or when the display is unlit, or may cause poor sealing properties of the optical semiconductor element, which may cause a gap between the substrate provided with the optical semiconductor element and the adhesive sheet. If the gap is present, the optical semiconductor element and the adhesive sheet may peel off at high temperature. Therefore, a display body which is less likely to cause color shift, less likely to cause diffuse reflection of external light, and excellent in sealing property of an optical semiconductor element has been demanded.

The present invention has been made in view of these circumstances, and an object thereof is to provide a display body which is less likely to cause color shift, less likely to cause diffuse reflection of external light, and excellent in sealing property of an optical semiconductor element. Another object of the present invention is to provide a sheet for sealing an optical semiconductor element, which is capable of producing a display body having excellent sealing properties of the optical semiconductor element, in which color shift is less likely to occur, diffuse reflection of external light is less likely to occur, and the optical semiconductor element is sealed.

Solution for solving the problem

As a result of intensive studies to achieve the above object, the present inventors have found that, in a state where a plurality of optical semiconductor elements arranged on a substrate are sealed with a sealing resin layer including a non-colored layer and a colored layer, when a display body is used in which a front surface side interface of a first sealing layer that contacts the optical semiconductor elements and a front surface side interface of a second sealing layer that is laminated on the front surface side are curved surfaces, and a front surface side interface of a third sealing layer that is laminated on the second sealing layer is planar, color shift is less likely to occur, diffuse reflection of external light is less likely to occur, and sealing properties of the optical semiconductor elements are excellent. The present invention has been completed based on the above findings.

That is, the present invention provides a display comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer sealing the plurality of optical semiconductor elements, wherein the sealing resin layer comprises a first sealing layer in contact with the optical semiconductor elements, a second sealing layer directly laminated on the first sealing layer, and a third sealing layer directly laminated on the second sealing layer, one of the first sealing layer and the second sealing layer is a colored layer, the other is a non-colored layer, and a perpendicular to a surface of the substrate through a center of gravity of the first optical semiconductor element and a center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element within the same pixel is set as a perpendicular line P _A A perpendicular line passing through a midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element with respect to the surface of the substrate is set as a perpendicular line P _C At this time, the perpendicular line P passes through _A With the front side of the first sealing layer Intersection point between interfaces and the perpendicular P _C A straight line L1 passing through the perpendicular line P is not parallel to the surface of the substrate at the intersection point between the front surface side interface of the first sealing layer _A An intersection point with the front-side interface of the second sealing layer and the perpendicular line P _C A straight line L2 passing through the perpendicular line P is not parallel to the surface of the substrate at the intersection point between the front surface side interface of the second sealing layer _A An intersection point with the front-side interface of the third sealing layer and the perpendicular line P _C A straight line L3 of an intersection point with the front-side interface of the third sealing layer is parallel to the surface of the substrate.

In the display, the sealing resin layer sealing the optical semiconductor element includes the colored layer, so that reflection of light by a metal wiring or the like provided on a substrate can be prevented. The fact that the straight lines L1 and L2 are not parallel to the surface of the substrate means that both the interface on the front side of the colored layer and the interface on the front side of the non-colored layer have a concave-convex shape that is convex on the optical semiconductor element and concave between the nearest optical semiconductor elements. In this case, both the substrate-side and front-side interfaces of the colored layer have the concave-convex shape, and the interface of the colored layer on the substrate side of the portion located in the concave portion is located sufficiently close to the substrate, whereby the transmission of light in the side direction emitted from the optical semiconductor element is blocked by the portion located in the concave portion of the colored layer, the light emitted from the respective optical semiconductor elements is less likely to interfere with each other, and color shift can be suppressed. The colored layer and the non-colored layer have excellent following properties with respect to the concave-convex shape having the optical semiconductor element as a convex portion and the surface of the substrate between the adjacent optical semiconductor elements as a concave portion, and the optical semiconductor element has excellent sealing properties. The straight line L3 is parallel to the surface of the substrate, and means that the interface on the front side of the third sealing layer located on the front side of the colored layer and the non-colored layer is flat. By flattening the surface of the third sealing layer, the surface of the sealing resin layer is easily flattened, and diffuse reflection of external light is less likely to occur, thereby improving the appearance of the display both when lit and when unlit.

Preferably, in the vertical plane cross section, the first sealing layer is in contact with a surface of the substrate between the first optical semiconductor element and the second optical semiconductor element in a range of 50% or more. With such a structure, the first sealing layer has excellent conformability to the concave-convex shape formed by the optical semiconductor element and the substrate surface, and the optical semiconductor element has more excellent sealing property.

Preferably, the first sealing layer is the non-colored layer, and the second sealing layer is the colored layer. With such a structure, the front luminance can be improved.

Preferably, the first sealing layer is a diffusion functional layer. By having such a structure, light emitted from the optical semiconductor element in the lateral direction is diffused in the diffusion functional layer, and the front luminance can be improved.

Preferably, the display body includes a self-luminous display device.

Preferably, the display body is an image display device.

The present invention also provides an optical semiconductor element sealing sheet for sealing a plurality of optical semiconductor elements disposed on a substrate, wherein the sheet includes a sealing resin layer including a first sealing layer, a second sealing layer directly laminated to the first sealing layer, and a third sealing layer directly laminated to the second sealing layer, one of the first sealing layer and the second sealing layer is a colored layer, and the other is a non-colored layer, and when the sealing resin layer is formed by sealing the plurality of optical semiconductor elements with the sealing resin layer so that the first sealing layer contacts the plurality of optical semiconductor elements, a vertical plane with respect to a vertical line passing through the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element within the same pixel is set to P in a cross section with respect to the surface of the substrate _A Will pass through the center of gravity of the first optical semiconductor element and the second optical semiconductor elementIs set as a vertical line P with respect to a vertical line of the center of gravity between the centers of gravity of the substrates _C At this time, the following configuration can be formed: through the perpendicular P _A An intersection point with the front-side interface of the first sealing layer and the perpendicular line P _C A straight line L1 passing through the perpendicular line P is not parallel to the surface of the substrate at the intersection point between the front surface side interface of the first sealing layer _A An intersection point with the front-side interface of the second sealing layer and the perpendicular line P _C A straight line L2 passing through the perpendicular line P is not parallel to the surface of the substrate at the intersection point between the front surface side interface of the second sealing layer _A An intersection point with the front-side interface of the third sealing layer and the perpendicular line P _C A straight line L3 of an intersection point with the front-side interface of the third sealing layer is parallel to the surface of the substrate.

Preferably, the first sealing layer is the non-colored layer, and the second sealing layer is the colored layer.

Preferably, the first sealing layer is a diffusion functional layer.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the display of the present invention, color shift due to light emitted from the optical semiconductor element is less likely to occur, diffuse reflection of external light is less likely to occur, and the sealing property of the optical semiconductor element is excellent. Therefore, the display can be visually recognized in the same color tone from a large visual field. In addition, the appearance of the display body is good at the time of lighting and at the time of non-lighting. In addition, even at high temperature, the optical semiconductor element and the sealing resin layer are not liable to peel off, and the heat-resistant reliability is excellent. Further, according to the optical semiconductor element sealing sheet of the present invention, by sealing the optical semiconductor element, it is possible to provide a display body which is less likely to cause color shift, less likely to cause diffuse reflection of external light, and excellent in sealing property of the optical semiconductor element.

Drawings

Fig. 1 is a partial plan view of an optical member in which a plurality of optical semiconductor elements are arranged in units of pixels on a substrate.

Fig. 2 is a partial cross-sectional view showing an embodiment of the display body of the present invention.

Fig. 3 is a partially enlarged view of the display body shown in fig. 2.

Fig. 4 is a partial cross-sectional view showing a case where the optical semiconductor element of the display body shown in fig. 2 emits light.

Fig. 5 is a partial cross-sectional view showing a case where an optical semiconductor element of a conventional display emits light.

Fig. 6 is a partial cross-sectional view showing another embodiment of the display body of the present invention.

Fig. 7 is a cross-sectional view showing an embodiment of the optical semiconductor element sealing sheet of the present invention.

Fig. 8 is a partial cross-sectional view showing a process of sealing an optical semiconductor element using the optical semiconductor element sealing sheet shown in fig. 7.

Description of the reference numerals

1. A display body; 2. a substrate; 3a to 3f, optical semiconductor elements; 31. a support body; 3. 3', pixels; 4. a sealing resin layer; 41. a non-colored layer; 42. a coloring layer; 43. a non-colored layer; 5. a base material portion; 6. a release liner; 7. a sealing resin layer; 71. a non-colored layer; 72. a coloring layer; 73. a non-colored layer; 10. an optical semiconductor element sealing sheet; 11. an optical member.

Detailed Description

[ display body ]

The display body of the present invention includes at least a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer sealing the plurality of optical semiconductor elements. The display is a device for displaying information by using light emitted from the optical semiconductor element.

Examples of the optical semiconductor element include Light Emitting Diodes (LEDs) such as blue light emitting diodes, green light emitting diodes, red light emitting diodes, and ultraviolet light emitting diodes.

The plurality of optical semiconductor elements are arranged in 1 pixel (pixel) on the substrate, and the plurality of pixels are arranged. That is, a plurality of the optical semiconductor elements are arranged for each pixel including a plurality of the optical semiconductor elements. Fig. 1 is a partial plan view of an optical member in which a plurality of optical semiconductor elements are arranged for each pixel on a substrate. In the optical member 11 shown in fig. 1, 3 optical semiconductor elements 3a to 3c are arranged on the substrate 2 so as to be close to each other, and 1 pixel (pixel 3) is formed by the 3 optical semiconductor elements 3a to 3 c. The 3 optical semiconductor elements 3d to 3f are arranged on the substrate 2 so as to be close to each other, and 1 pixel (pixel 3') is formed by the 3 optical semiconductor elements 3d to 3 f. Then, a plurality of pixels such as the pixel 3 and the pixel 3' are arranged on the substrate 2.

The display body of the present invention has a concave-convex shape formed by a substrate and optical semiconductor elements, wherein the surface of the substrate, which is located between the two optical semiconductor elements and in which the optical semiconductor elements are not arranged, is defined as a concave portion and the optical semiconductor elements are defined as convex portions.

The height of the optical semiconductor element on the substrate (the height from the substrate surface to the end on the front surface side of the optical semiconductor element) is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer has more excellent following property to the concave-convex shape.

The sealing resin layer is in contact with the plurality of optical semiconductor elements and follows the concave-convex shape. The sealing resin layer preferably seals the plurality of optical semiconductor elements at once. In the present specification, "sealing the optical semiconductor element" means embedding at least a part of the optical semiconductor element into the sealing resin layer or covering the optical semiconductor element by following the sealing resin layer.

The sealing resin layer includes at least a first sealing layer in contact with the optical semiconductor element, a second sealing layer directly laminated on the first sealing layer, and a third sealing layer directly laminated on the second sealing layer. The sealing resin layer may include layers other than the first sealing layer, the second sealing layer, and the third sealing layer. The total number of layers constituting the sealing resin layer may be 3 or more layers including the first sealing layer, the second sealing layer, and the third sealing layer, or may be 4 or more layers. The total number of the layers is, for example, 10 layers or less, and may be 5 layers or less or 4 layers or less from the viewpoint of making the thickness of the display body thin.

In the sealing resin layer, one of the first sealing layer and the second sealing layer is a colored layer, and the other is a non-colored layer. The third sealing layer may be a colored layer or a non-colored layer. The first sealing layer, the second sealing layer, and the third sealing layer are each preferably a resin layer made of a resin.

Any one of the plurality of optical semiconductor elements is set as a first optical semiconductor element. The optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is a second optical semiconductor element. In a vertical plane section with respect to the surface of the substrate passing through the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element, a vertical line passing through the center of gravity of the first optical semiconductor element with respect to the surface of the substrate is set as a vertical line P _A . A midpoint between a center of gravity passing through the first optical semiconductor element and a center of gravity passing through the second optical semiconductor element is defined as a midpoint C. A perpendicular line passing through the midpoint C and relative to the surface of the substrate is set as a perpendicular line P _C . And, passing through the perpendicular line P _A An intersection point with the front surface side interface of the first sealing layer and the perpendicular line P _C A straight line L1 passing through the perpendicular line P is not parallel to the surface of the substrate at the intersection point between the front surface side interface of the first sealing layer _A An intersection point with the front surface side interface of the second sealing layer and the perpendicular line P _C A straight line L2 passing through the perpendicular line P is not parallel to the surface of the substrate at the intersection point between the front surface side interface of the second sealing layer _A An intersection point with the front surface side interface of the third sealing layer and the perpendicular line P _C A straight line L3 intersecting the front surface side interface of the third seal layer is parallel to the surface of the substrate.

Further, although the straight lines L1 and L2 are not parallel to the surface of the substrate, this means that the straight lines L1 and L2 each form an angle of 5 ° or more with the surface of the substrate. In addition, although the straight line L3 is parallel to the surface of the substrate, this includes not only a case where the straight line L3 is completely parallel to the surface of the substrate, but also a case where the angle formed by the straight line L3 and the surface of the substrate is less than 5 °.

In the display, the sealing resin layer sealing the optical semiconductor element includes the colored layer, so that reflection of light by a metal wiring or the like provided on a substrate can be prevented. The fact that the straight lines L1 and L2 are not parallel to the surface of the substrate means that both the interface on the front side of the colored layer and the interface on the front side of the non-colored layer have a concave-convex shape that is convex on the optical semiconductor element and concave between the nearest optical semiconductor elements. In this case, both the substrate-side and front-side interfaces of the colored layer have the concave-convex shape, and the interface of the colored layer on the substrate side of the portion located in the concave portion is located sufficiently close to the substrate, whereby the transmission of light in the side direction emitted from the optical semiconductor element is blocked by the colored layer at the concave portion, so that the light emitted from the respective optical semiconductor elements is less likely to interfere with each other, and color shift can be suppressed. The colored layer and the non-colored layer have excellent following properties with respect to the concave-convex shape having the optical semiconductor element as a convex portion and the surface of the substrate between the adjacent optical semiconductor elements as a concave portion, and the optical semiconductor element has excellent sealing properties. The straight line L3 is parallel to the surface of the substrate, and means that the interface on the front side of the third sealing layer located on the front side of the colored layer and the non-colored layer is flat. By flattening the surface of the third sealing layer, the surface of the sealing resin layer is easily flattened, and diffuse reflection of external light is less likely to occur, thereby improving the appearance of the display both when lit and when unlit.

In the present specification, the "front face" means a side on which the display body is visually recognized, and is, for example, upward in fig. 2 described later.

Preferably, the straight line L2 is parallel to the surface of the substrate, compared to the straight line L1. That is, the angle between the straight line L2 and the surface of the substrate is preferably smaller than the angle between the straight line L1 and the surface of the substrate. With such a structure, the following tends to occur: the thickness of the colored layer and the thickness of the non-colored layer between the first optical semiconductor element and the second optical semiconductor element are relatively thick, and the thickness of the colored layer and the thickness of the non-colored layer on the front side of the first optical semiconductor element are relatively thin. Therefore, light emitted from the optical semiconductor element toward the front side is likely to be transmitted through the colored layer to increase the luminance, and light emitted from the optical semiconductor element toward the side surface is likely to be absorbed by the colored layer, so that color shift can be further suppressed.

In the vertical plane section, the vertical line P _A The distance from the surface of the substrate to the interface on the front side of the first sealing layer is preferably longer than the perpendicular line P _C The distance from the surface of the substrate to the interface on the front side of the first sealing layer. In addition, perpendicular P _A The distance from the surface of the substrate to the interface on the front side of the second sealing layer is preferably longer than the perpendicular line P _C A distance from the surface of the substrate to the interface on the front side of the second sealing layer. In this case, the light emitted from the optical semiconductor elements is not likely to interfere with each other, and color shift can be further suppressed by blocking the transmission of light in the side direction from the optical semiconductor elements by the portions of the colored layer located in the concave portions.

In the vertical plane section, the vertical line P _A The thickness of the upper coloring layer (coloring layer as the first sealing layer or the second sealing layer) is preferably thinner than the perpendicular line P _C Thickness of the upper colored layer (colored layer as the first seal layer or the second seal layer). With such a structure, the following tends to occur: the thickness of the colored layer and the thickness of the non-colored layer between the first optical semiconductor element and the second optical semiconductor element are relatively thick, and the thickness of the colored layer and the thickness of the non-colored layer on the front side of the first optical semiconductor element are relatively thin. Therefore, light emitted from the optical semiconductor element toward the front side is likely to pass through the colored layer to increase the luminance, and light emitted from the optical semiconductor element toward the side surface is likely to be absorbed by the colored layer, so that color shift can be further suppressed. In addition, the straight lines 1 and 2 are not parallel to the surface of the substrate, and a substrate having a uniform thickness can be used The optical semiconductor element sealing sheet having the colored layer can be easily manufactured into a display having such a structure.

In the vertical plane section, the vertical line P _A The distance from the surface of the substrate to the front end of the first optical semiconductor element is preferably longer than the vertical line P _C The distance from the surface of the substrate to the interface on the front side of the first sealing layer. In addition, perpendicular P _A The distance from the surface of the substrate to the front end of the first optical semiconductor element is preferably longer than the vertical line P _C A distance from the surface of the substrate to the interface on the front side of the second sealing layer. In this case, the light emitted from the optical semiconductor elements is not likely to interfere with each other, and color shift can be further suppressed by blocking the transmission of light in the side direction from the optical semiconductor elements by the portions of the colored layer located in the concave portions.

The display of the present invention will be described with reference to the display shown in fig. 2 as one embodiment of the present invention. The display 1 shown in fig. 2 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, a sealing resin layer 4 for sealing the optical semiconductor elements 3a to 3c together, and a base material portion 5 bonded to a surface of the sealing resin layer 4 on the side opposite to the side on which the optical semiconductor elements 3a to 3c are located. Fig. 2 is an enlarged view of a vertical plane cross section through the center of gravity of the optical semiconductor elements 3a to 3c with respect to the substrate 2.

The optical semiconductor elements 3a to 3c are each fixed to one substrate 2 via a support 31. The display 1 has a concave-convex shape formed by the substrate 2 and the optical semiconductor elements 3a to 3c, the surface of the substrate 2 in the region between the optical semiconductor elements 3a to 3c where no optical semiconductor element is arranged is defined as a concave portion N, and the optical semiconductor elements 3a to 3c are defined as convex portions P.

The optical semiconductor elements 3a to 3c in fig. 2 are the optical semiconductor elements 3a to 3c shown in fig. 1, and the optical semiconductor elements 3a to 3c are located in the same pixel 3. For example, the optical semiconductor element 3a is a first optical semiconductor element, and the optical semiconductor element 3b is a second optical semiconductor element adjacent to the optical semiconductor element 3 a.

As shown in fig. 2, the sealing resin layer 4 contacts the plurality of optical semiconductor elements 3a to 3c and follows the concave-convex shape, thereby sealing the plurality of optical semiconductor elements 3a to 3c at once.

The sealing resin layer 4 is formed by directly laminating the non-colored layer 41, the colored layer 42, and the non-colored layer 43 in this order, and seals the optical semiconductor elements 3a to 3c so that the non-colored layer 41 side becomes the optical semiconductor elements 3a to 3c side. The non-colored layer 41 is a first seal layer, the colored layer 42 is a second seal layer, and the non-colored layer 43 is a third seal layer.

The non-colored layer 41 in contact with the optical semiconductor elements 3a to 3c follows the above-described uneven shape, and in the display 1, the non-colored layer 41 and the colored layer 42 also have the uneven shape. On the other hand, one surface of the non-colored layer 43 has an uneven shape complementary to the uneven shape of the colored layer 42 by following the uneven shape of the colored layer 42, and the other surface of the non-colored layer 43 is flat (planar). The non-colored layer 41 and the non-colored layer 43 may be diffusion functional layers described later or non-diffusion functional layers, respectively.

When the non-colored layer 41 is a diffusion functional layer, the sealing resin layer 4 includes a diffusion functional layer, a colored layer, and a non-colored layer (particularly, a non-diffusion functional layer) in this order from the optical semiconductor element side. In this case, the light emitted from the optical semiconductor element in the lateral direction is diffused in the diffusion functional layer, and the front luminance can be improved.

Fig. 3 shows a partial enlarged view of the vicinity between the optical semiconductor element 3a and the optical semiconductor element 3b of the display body 1 shown in fig. 2. As shown in fig. 3, in the display body 1, the center of gravity G of the optical semiconductor element 3a passes _A Is a perpendicular P with respect to the surface of the substrate 2 _A . Center of gravity G of the optical semiconductor element 3a _A Center of gravity G with the optical semiconductor element 3b _B The midpoint between is midpoint C. The perpendicular to the surface of the substrate 2 passing through the midpoint C is the perpendicular P _C . Vertical line P _A The intersection point with the front-side interface of the non-colored layer 41 as the first sealing layer is T _A1 . Vertical line P _A An intersection point with the front-side interface of the colored layer 42 as the second sealing layer is T _A2 . Vertical line P _A The intersection point with the front-side interface of the non-coloring layer 43 as the third sealing layer is T _A3 . Vertical line P _C The intersection point with the front-side interface of the non-colored layer 41 as the first sealing layer is T _C1 . Vertical line P _C An intersection point with the front-side interface of the colored layer 42 as the second sealing layer is T _C2 . Vertical line P _C The intersection point with the front-side interface of the non-coloring layer 43 as the third sealing layer is T _C3 . Through T _A1 And T _C1 Is a straight line L1 passing through T _A2 And T _C2 Is a straight line L2 passing through T _A3 And T _C3 Is a straight line L3. When the surface of the substrate 2 is set to be the base line B, the straight line L1 is not parallel to the base line B, the straight line L2 is not parallel to the base line B, and the straight line L3 is parallel to the base line B in the display 1. Vertical line P _A From the surface of the substrate 2 to T _A1 The distance is longer than the vertical line P _C From the surface of the substrate 2 to T _C1 Distance to the vertical line P _A From the surface of the substrate 2 to T _A2 The distance is longer than the vertical line P _C From the surface of the substrate 2 to T _C2 Distance to the end. The angle between the line L2 and the base line B is smaller than the angle between the line L1 and the base line B.

In the display 1, the sealing resin layer 4 sealing the optical semiconductor elements 3a to 3c includes the colored layer 42, so that reflection of light by metal wiring or the like provided on the substrate 2 can be prevented. The fact that the straight lines L1 and L2 are not parallel to the surface of the substrate 2 means that the interface between the colored layer 42 and the non-colored layer 41 on the front side has a concave-convex shape protruding on the optical semiconductor element 3a and recessed between the nearest optical semiconductor element 3a and the optical semiconductor element 3 b. In this case, both the substrate-side and front-side interfaces of the colored layer 42 have the concave-convex shape, and the substrate-side interface of the portion of the colored layer 42 located in the concave portion is located sufficiently close to the substrate 2, whereby the transmission of light in the side direction emitted from the optical semiconductor element 3a is blocked by the portion of the colored layer 42 located in the concave portion, the light emitted from the respective optical semiconductor elements 3a, 3b is less likely to interfere with each other, and color shift can be suppressed. The colored layer 42 and the non-colored layer 41 have excellent following properties with respect to the concave-convex shape having the optical semiconductor element 3a as a convex portion and the surface of the substrate 2 between the adjacent optical semiconductor element 3a and optical semiconductor element 3b as a concave portion, and the optical semiconductor element 3a has excellent sealing properties. The straight line L3 is parallel to the surface of the substrate 2, and means that the interface on the front side of the non-colored layer 43, which is the third sealing layer located on the front side of the colored layer 42 and the non-colored layer 41, is flat. By flattening the surface of the non-colored layer 43, the surface of the sealing resin layer 4 is easily flattened, and diffuse reflection of external light is less likely to occur, thereby improving the appearance of the display 1 both when lit and when unlit.

In the relationship between all the optical semiconductor elements in the same pixel and all the adjacent optical semiconductor elements, it is preferable that the straight lines L1 and L2 are not parallel to the surface of the substrate, and the straight line L3 is parallel to the surface of the substrate. In this case, for example, light emitted in the lateral direction from all the optical semiconductor elements 3a to 3c in the same pixel shown in fig. 2 is easily absorbed by the colored layer 42, and is less likely to be transmitted, and color shift is less likely to occur.

Specifically, as shown in fig. 4, light F emitted from the optical semiconductor elements 3a to 3c in the front direction _A 、F _B And F _C And mainly exhibits the front luminance of the display body 1. Light L emitted from the optical semiconductor elements 3a to 3c and directed sideways _A 、R _A 、L _B 、R _B 、L _C And R is _C The transmission of the light emitted from the optical semiconductor elements 3a to 3c is blocked by the colored layer 42, so that the light is not likely to interfere with each other, and color shift can be suppressed. Since the external light entering the display body 1 from the sealing resin layer 4 side is reflected by the flat non-colored layer 43, diffuse reflection is less likely to occur, and the appearance of the display body 1 is improved both at the time of lighting and at the time of non-lighting. In addition, the non-colored layer 41 is easily adhered to the side surfaces of the substrate 2 and the optical semiconductor elements 3a to 3c, and a gap is less likely to be generated between the non-colored layer 41 and the substrate 2 and the optical semiconductor elements 3a to 3 c.

On the other hand, shown in FIG. 5One embodiment of a conventional display body. In the display shown in fig. 5, the front-side interface of the non-colored layer 41 and the front-side interface of the colored layer 42 are flat, and therefore, the straight lines L1 and L2 are parallel to the surface of the substrate 2. Light L emitted from the optical semiconductor elements 3a to 3c and directed sideways _A 、R _A 、L _B 、R _B 、L _C And R is _C The transmission of the light emitted from the optical semiconductor elements 3a to 3c is not easily blocked by the colored layer 42, and thus color shift is easily generated. Further, since the front side interface of the non-colored layer 41 as the first sealing layer and the front side interface of the colored layer 42 as the second sealing layer are parallel to the surface of the substrate, the non-colored layer 41 and the colored layer 42 are not sufficiently compressed in a state in which the optical semiconductor elements 3a to 3c are sealed, and gaps H are easily generated between the side surfaces of the optical semiconductor elements 3a to 3c and the sealing resin layer 4 and between the surface of the substrate 2 and the sealing resin layer 4. In the embodiment shown in fig. 5, when the thickness of the colored layer 42 is made thicker, the light F emitted from the optical semiconductor elements 3a to 3c _A ～F _C The light quantity of (2) decreases. When the thickness of the coloring layer 42 is made thin, the transmittance of light in the front oblique direction increases, and color shift is more likely to occur. In contrast, in the display according to the present invention, the front luminance, the color shift preventing ability, the ability to prevent diffuse reflection of external light, and the sealing property of the optical semiconductor element can all be improved.

Further, by making the straight lines L1 and L2 not parallel to the surface of the substrate, for example, the sealing resin layer can be formed such that the thickness of the portion of the colored layer located in the recess of the substrate surface between the optical semiconductor elements is made thicker, and the thickness of the colored layer on the front surface of the optical semiconductor element is made thinner, whereby the degree of freedom in design can be improved. In this case, the light emitted from the optical semiconductor element in the front direction is less likely to be blocked by the colored layer, so that the front luminance is excellent, and the light emitted from the optical semiconductor element in the side direction is blocked by the colored layer, so that the occurrence of color shift can be prevented.

The center of gravity of the optical semiconductor element is determined by the three-dimensional shape of the optical semiconductor element. The three-dimensional shape of the optical semiconductor element is not particularly limited, and examples thereof include a square column such as a cube or a cuboid, a prism table, a cylinder, a round table, and a shape in which an upper portion thereof is formed as a dome. The center of gravity in the case where the three-dimensional shape of the optical semiconductor element is a square column is the center of the optical semiconductor element.

The display 1 may not include the base material portion 5. The number of the optical semiconductor elements in 1 pixel is not particularly limited, and may be 3.

Another embodiment of the display of the present invention is shown in fig. 6. In the display 1 shown in fig. 6, the first sealing layer is a colored layer 42, and the second sealing layer is a non-colored layer 41. That is, in the display body 1 shown in fig. 6, the positional relationship between the non-colored layer 41 and the colored layer 42 in the display body 1 shown in fig. 2 is exchanged. Otherwise, the display 1 shown in fig. 2 is identical.

The cross-sectional views of the display body shown in fig. 2 to 6 can be obtained, for example, as follows: in a state where the display body is cooled, the cross section can be exposed by cutting the display body perpendicularly to the substrate surface so as to pass through the centers of gravity of the plurality of optical semiconductor elements. By cooling the display body, it is possible to suppress melting and deformation of the sealing resin layer due to heat generated during cutting. The cutting can be performed using a known or conventional cutting device such as laser beam irradiation or ion beam irradiation. After cutting, the exposed cross section may be milled to expose a cross section having a lower degree of deformation. The temperature at the time of cooling can be set appropriately within a range in which the degree of deformation of the sealing resin layer and cracking of the display body are suppressed.

< sealing resin layer >)

The sealing resin layer includes at least the colored layer and the non-colored layer. Each of the layers (the colored layer and the non-colored layer) constituting the sealing resin layer may be a single layer or may be a plurality of layers having the same or different compositions. When the colored layer and the non-colored layer include a plurality of layers, the plurality of layers may be stacked in contact with each other or may be stacked with a space therebetween (for example, two colored layers are stacked with 1 non-colored layer interposed therebetween). In the case where the sealing resin layer has a plurality of layers including 1 or more colored layers and 1 or more non-colored layers, the combination of at least 1 colored layer and at least 1 non-colored layer may be any combination of the first sealing layer and the second sealing layer.

In the display of the present invention, it is preferable that the first sealing layer is a non-colored layer and the second sealing layer is a colored layer. With such a structure, the front luminance can be improved. In the display 1 shown in fig. 2, the first sealing layer is a non-colored layer 41, and the second sealing layer is a colored layer 42.

The third sealing layer may be any one of a colored layer and a non-colored layer, but is preferably a non-colored layer. In this case, the third sealing layer may be any one of a diffusion functional layer and a non-diffusion functional layer, but from the viewpoint that the straight line L3 becomes parallel to the surface of the substrate, the third sealing layer is preferably a non-diffusion functional layer.

The sealing resin layer preferably includes a diffusion functional layer. By having such a structure, light emitted from the optical semiconductor element is diffused in the diffusion functional layer, and the front luminance can be further improved. The diffusion functional layer is preferably a layer which is a non-colored layer in the present specification.

In the case where the sealing resin layer includes the diffusion functional layer, it is preferable that the non-colored layer as the first sealing layer or the second sealing layer is a diffusion functional layer even among the sealing resin layers. With such a structure, the front luminance can be further improved, and the appearance of the display can be further improved both when the display is lit and when the display is unlit.

In the vertical plane cross section, the first sealing layer is preferably in contact with the surface of the substrate between the first optical semiconductor element and the second optical semiconductor element in a range of 50% or more (preferably 60% or more, more preferably 80% or more, still more preferably 90% or more) with respect to 100% of the total length of the surface of the substrate between the first optical semiconductor element and the second optical semiconductor element (region where the two optical semiconductor elements are not provided). With such a structure, the first sealing layer has excellent following properties with respect to the concave-convex shape formed by the optical semiconductor element and the substrate surface, and the sealing property of the optical semiconductor element is further excellent. In addition, it is preferable that the first sealing layer is in contact with the surface of the substrate between the first and second optical semiconductor elements in a range of 50% or more between all the optical semiconductor elements in the same pixel.

Each layer constituting the sealing resin layer may or may not have an adhesive property independently. Among them, the adhesive property is preferable. With such a structure, the sealing resin layer can easily seal the optical semiconductor element, and the sealing property of the optical semiconductor element is further improved because the adhesion between the layers is excellent. It is particularly preferable that at least the first sealing layer in contact with the optical semiconductor element has adhesion. With such a structure, the sealing resin layer is excellent in following property and landfill property with respect to the optical semiconductor element. As a result, the optical semiconductor device has excellent appearance even when the difference in height due to the optical semiconductor device is large. In addition, the layers other than the layer in contact with the optical semiconductor element may not have adhesiveness. In this case, the adhesion between the adjacent sealing resin layers in the flat state is low, and when the adjacent small-sized laminate (laminate in which the sealing resin layers seal the optical semiconductor element disposed on the substrate) is pulled apart from each other, chipping of the sealing resin layer and adhesion of the adjacent sealing resin layers are less likely to occur.

(colored layer)

The colored layer in the display of the present invention is a layer in the display for the purpose of preventing reflection of light by a metal wiring or the like provided on a substrate. The coloring layer at least contains a colorant. The colored layer is preferably a resin layer made of a resin. The colorant may be a dye or a pigment as long as it is soluble or dispersible in the colored layer. Dyes are preferred from the viewpoint that low haze can be achieved even with a small amount of addition, no sedimentation is possible as in pigments, and uniform distribution is easy. In addition, pigments are also preferred in terms of high color rendering properties even when added in small amounts. When pigments are used as colorants, it is preferred that the conductivity be low or not. The colorant may be used alone or in combination of two or more.

The colorant is preferably a black colorant. The black-based colorant may be any known or customary colorant (pigment, dye, etc.) for exhibiting black color, and examples thereof include carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, pine black, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (nonmagnetic ferrite, magnetic ferrite, etc.), magnetite (magnetite), chromium oxide, iron oxide, molybdenum disulfide, chromium complex, anthraquinone-based colorant, zirconium nitride, etc. Further, a colorant that is combined and mixed to exhibit a color other than black may be used and functions as a black-based colorant.

The content ratio of the colorant in the colored layer is preferably 0.2 mass% or more, more preferably 0.4 mass% or more, based on 100 mass% of the total amount of the colored layer, from the viewpoint of imparting an appropriate antireflection capability to the display. The content of the colorant is, for example, 10 mass% or less, preferably 5 mass% or less, and more preferably 3 mass% or less. The content ratio may be appropriately set according to the type of the colorant, the color tone of the display, the light transmittance, and the like. The colorant may be added to the composition in the form of a solution or dispersion dissolved or dispersed in a suitable solvent.

The haze value (initial haze value) of the colored layer is not particularly limited, but is preferably 50% or less, more preferably 40% or less, further preferably 30% or less, and particularly preferably 20% or less from the viewpoint of ensuring the front luminance and the visibility of the display. In order to efficiently reduce the luminance unevenness of the display, the haze value of the colored layer is preferably 1% or more, more preferably 3% or more, still more preferably 5% or more, particularly preferably 8% or more, and may be 10% or more. The haze value is a value of a thickest portion of the colored layer in the display.

The total light transmittance of the colored layer is not particularly limited, but is preferably 40% or less, more preferably 30% or less, further preferably 25% or less, and particularly preferably 20% or less, from the viewpoint of further improving the function of preventing reflection of metal wiring or the like in the display. Further, from the viewpoint of ensuring the brightness of the display, the total light transmittance of the colored layer is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.5% or more, particularly preferably 2% or more, and may be 2.5% or more, or 3% or more. The total light transmittance is a value of the thickest portion of the colored layer in the display body.

The haze value and the total light transmittance of the colored layer are each a single-layer value, which can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, type of colorant, blending amount, and the like.

(non-colored layer)

The non-colored layer is a layer different from the colored layer, and is a layer that does not aim to prevent reflection of light by a metal wiring or the like provided on a substrate in a display. The non-colored layer may be a colorless layer or may be slightly colored. The non-colored layer may be, for example, a diffusion functional layer for the purpose of diffusing light, or may be a non-diffusion functional layer for the purpose of not diffusing light. The non-colored layer may be transparent or non-transparent. The non-colored layer is preferably a resin layer made of a resin.

The content ratio of the colorant in the non-colored layer is preferably less than 0.2 mass%, more preferably less than 0.1 mass%, still more preferably less than 0.05 mass%, and may be less than 0.01 mass% or less than 0.005 mass% relative to 100 mass% of the total non-colored layer.

The total light transmittance of the non-colored layer is not particularly limited, but is preferably 40% or more, more preferably 60% or more, still more preferably 70% or more, and particularly preferably 80% or more from the viewpoint of securing the brightness of the display. The upper limit of the total light transmittance of the non-colored layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is a value of the thickest part of the non-colored layer in the display body.

The total light transmittance of the non-colored layer is a single-layer value, which can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, and the like of the non-colored layer.

The diffusion functional layer is a layer for diffusing light. When the sealing resin layer has the diffusion functional layer, light emitted from the optical semiconductor element diffuses in the diffusion functional layer, and for example, light emitted from the side surface of the optical semiconductor element is released in the front direction of the display body, and the front luminance of the display body is improved. The diffusion functional layer is preferably a resin layer made of a resin. The diffusion functional layer is not limited, and preferably contains light diffusing fine particles. That is, the diffusion functional layer preferably contains light diffusing fine particles dispersed in a resin layer. The light diffusing fine particles may be used alone or in combination of two or more.

The light diffusing fine particles have an appropriate refractive index difference from the resin constituting the diffusion functional layer, and impart diffusion performance to the diffusion functional layer. Examples of the light diffusing fine particles include inorganic fine particles and polymer fine particles. Examples of the material of the inorganic fine particles include silica, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxide. Examples of the material of the polymer microparticles include silicone resins, acrylic resins (for example, a polymethacrylate resin such as polymethyl methacrylate), polystyrene resins, polyurethane resins, melamine resins, polyethylene resins, and epoxy resins.

The polymer fine particles are preferably fine particles made of silicone resin. The inorganic fine particles are preferably fine particles composed of a metal oxide. The metal oxide is preferably titanium oxide or barium titanate, more preferably titanium oxide. With such a structure, the diffusion functional layer is more excellent in light diffusibility and further suppressed in luminance unevenness.

The shape of the light diffusing fine particles is not particularly limited, and may be, for example, spherical, flat, or irregular.

The average particle diameter of the light diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, still more preferably 0.2 μm or more, and particularly preferably 0.25 μm or more, from the viewpoint of imparting an appropriate light diffusing property. In addition, the average particle diameter of the light diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, and even more preferably 8 μm or less, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image. The average particle diameter can be measured, for example, using a coulter counter.

The refractive index of the light diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, still more preferably 1.3 to 4, and particularly preferably 1.35 to 3.

From the viewpoint of reducing luminance unevenness of the display body more efficiently, the absolute value of the refractive index difference between the light-diffusing fine particles and the resin constituting the diffusion functional layer (the resin layer excluding the light-diffusing fine particles in the diffusion functional layer) is preferably 0.001 or more, more preferably 0.01 or more, still more preferably 0.02 or more, particularly preferably 0.03 or more, and also may be 0.04 or more, or 0.05 or more. In addition, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the absolute value of the refractive index difference between the light diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, and still more preferably 3 or less.

The content of the light diffusing fine particles in the diffusion functional layer is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, still more preferably 0.1 parts by mass or more, and particularly preferably 0.15 parts by mass or more, relative to 100 parts by mass of the resin constituting the diffusion functional layer, from the viewpoint of imparting an appropriate light diffusing property to the sealing resin layer. Further, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the content of the light diffusing fine particles is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, relative to 100 parts by mass of the resin constituting the diffusion functional layer.

The haze value (initial haze value) of the diffusion functional layer is not particularly limited, but is preferably 30% or more, more preferably 40% or more, further preferably 50% or more, particularly preferably 60% or more, and may be 70% or more, 80% or more, 90% or more, 95% or more, 97% or more, and further, the effect of improving the luminance unevenness of the haze value in the vicinity of 99.9% is more excellent, from the viewpoint of efficiently reducing the luminance unevenness. The upper limit of the haze value of the diffusion functional layer is not particularly limited, and may be 100%. The haze value is a value of the thickest portion of the diffusion functional layer in the display body.

The total light transmittance of the diffusion functional layer is not particularly limited, but is preferably 40% or more, more preferably 60% or more, still more preferably 70% or more, and particularly preferably 80% or more from the viewpoint of securing brightness. The upper limit of the total light transmittance of the diffusion functional layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is a value of the thickest portion of the diffusion functional layer in the display body.

The haze value and the total light transmittance of the diffusion functional layer are each a single-layer value, and can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, type of light diffusing fine particles, the amount of blending, and the like of the diffusion functional layer.

The haze value (initial haze value) of the non-diffusion functional layer is not particularly limited, but is preferably less than 30%, more preferably 10% or less, further preferably 5% or less, particularly preferably 1% or less, and may be 0.5% or less, from the viewpoint of making the brightness of the display excellent. The lower limit of the haze value of the non-diffusion functional layer is not particularly limited. The haze value is a value of the thickest portion of the non-diffusion functional layer in the display body.

The total light transmittance of the non-diffusion functional layer is not particularly limited, but is preferably 60% or more, more preferably 70% or more, still more preferably 80% or more, and particularly preferably 90% or more from the viewpoint of securing the luminance of the display. The upper limit of the total light transmittance of the non-diffusion functional layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is a value of the thickest portion of the non-diffusion functional layer in the display body.

The haze value and the total light transmittance of the non-diffusion functional layer are each a single layer, and can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, and the like of the non-diffusion functional layer.

The content of the colorant and/or the light-diffusing fine particles in the non-diffusion functional layer is preferably less than 0.01 parts by mass, more preferably less than 0.005 parts by mass, relative to 100 parts by mass of the resin constituting the non-diffusion functional layer, from the viewpoint of making the display excellent in brightness.

(resin layer)

Examples of the resin constituting the resin layer include known or conventional resins, such as acrylic resins, urethane acrylate resins, urethane resins, rubber resins, epoxy acrylate resins, oxetane resins, silicone acrylic resins, polyester resins, polyether resins (such as polyvinyl ether), polyamide resins, fluorine resins, vinyl acetate/vinyl chloride copolymers, and modified polyolefins. The resin may be used alone or in combination of two or more. The resins constituting the respective layers of the sealing resin layer may be the same or different from each other.

In the case where the resin layer is a layer having an adhesive property (adhesive layer), a known or conventional pressure-sensitive adhesive can be used as the resin. Examples of the adhesive include acrylic adhesives, rubber adhesives (natural rubber adhesives, synthetic rubber adhesives, and mixed systems thereof), silicone adhesives, polyester adhesives, urethane adhesives, polyether adhesives, polyamide adhesives, and fluorine adhesives. The binder may be used alone or in combination of two or more.

The resin layer may contain other components than the above components in the respective layers within a range that does not impair the effects of the present invention. Examples of the other components include a curing agent, a crosslinking accelerator, a tackifying resin (rosin derivative, polyterpene resin, petroleum resin, oil-soluble phenol, etc.), an oligomer, an anti-aging agent, a filler (metal powder, organic filler, inorganic filler, etc.), an antioxidant, a plasticizer, a softener, a surfactant, an antistatic agent, a surface lubricant, a leveling agent, a light stabilizer, an ultraviolet absorber, a polymerization inhibitor, a particulate matter, a foil-like matter, and the like. The other components may be used alone or in combination of two or more.

The laminated structure of the sealing resin layer includes [ diffusion functional layer/coloring layer/non-diffusion functional layer ], [ non-diffusion functional layer/coloring layer/diffusion functional layer ], [ diffusion functional layer/coloring layer/non-diffusion functional layer ], [ coloring layer/diffusion functional layer/non-diffusion functional layer ], [ coloring layer/non-diffusion functional layer/diffusion functional layer ], [ coloring layer/non-diffusion functional layer ], [ diffusion functional layer/coloring layer ], [ coloring layer/diffusion functional layer/coloring layer ], [ coloring layer/non-diffusion functional layer/coloring layer ] (which are provided in order from the optical semiconductor element side), and the like.

< base material portion >)

The display of the present invention may or may not include a base material portion. When the base material portion is provided on the front side of the sealing resin layer in the display body, the surface of the sealing resin layer can be made flatter, and therefore diffuse reflection of light is less likely to occur, and the appearance of the display body is improved in both the case of lighting and the case of non-lighting. Further, by forming an antiglare layer and an antireflection layer described later on the base material portion, antiglare property and antireflection property can be imparted to the display. Further, the support body serving as a sealing resin layer in the optical semiconductor element sealing sheet described later is provided with the base material portion, and thus the optical semiconductor element sealing sheet is excellent in handling properties.

The base material portion may be a single layer or may be a plurality of layers having the same composition or different thicknesses. When the base material portion is a plurality of layers, the layers may be bonded by other layers such as an adhesive layer. The base material layer used in the base material portion is a portion to be adhered together with the sealing resin layer to the substrate provided with the optical semiconductor element, and the release liner to be peeled off at the time of use (at the time of adhesion) of the optical semiconductor element sealing sheet and the surface protection film for protecting only the surface of the base material portion are not included in the "base material portion".

Examples of the substrate layer constituting the substrate portion include glass, a plastic substrate (particularly, a plastic film), and the like. Examples of the resin constituting the plastic base material include: polyolefin resins such as low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homo-polypropylene, polybutene, polymethylpentene, ionomer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cyclic olefin polymer, ethylene-butene copolymer, ethylene-hexene copolymer; polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, polybutylene terephthalate (PBT), and the like; a polycarbonate; polyimide resin; polyether ether ketone; a polyetherimide; polyamides such as aramid and wholly aromatic polyamide; polyphenylene sulfide; a fluororesin; polyvinyl chloride; polyvinylidene chloride; cellulose resins such as triacetyl cellulose (TAC); a silicone resin; acrylic resins such as polymethyl methacrylate (PMMA); polysulfone; polyarylate; polyvinyl acetate, and the like. The resin may be used alone or in combination of two or more. The base material layer may be various optical films such as an Antireflection (AR) film, a polarizing plate, and a retardation plate.

The thickness of the plastic film is preferably 20 to 300. Mu.m, more preferably 40 to 250. Mu.m. When the thickness is 20 μm or more, the supporting property and handling property of the optical semiconductor element sealing sheet are further improved. When the thickness is 300 μm or less, the display can be further thinned.

For the purpose of improving the adhesion to the sealing resin layer, the holding property, and the like, the surface of the substrate portion on the side provided with the sealing resin layer may be subjected to physical treatments such as corona discharge treatment, plasma treatment, blasting treatment, ozone exposure treatment, flame exposure treatment, high-voltage shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; surface treatment such as easy adhesion treatment by a coating agent (primer). The surface treatment for improving the adhesion is preferably performed on the entire surface of the base material portion on the sealing resin layer side.

The thickness of the base material portion is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of excellent functions as a support and scratch resistance of the surface. The thickness of the base material portion is preferably 300 μm or less, more preferably 250 μm or less, from the viewpoint of further excellent transparency.

< display body >)

The display may have a layer having antiglare property and/or antireflection property. With such a structure, the gloss and reflection of light of the display can be suppressed, and the appearance can be improved. Examples of the antiglare layer include an antiglare layer. The antireflective layer may be an antireflective layer. The antiglare treatment and the antireflection treatment can be carried out by known or conventional methods, respectively. The antiglare layer and the antireflection layer may be the same layer or may be different layers. The antiglare and/or antireflection layer may be provided in one layer or two or more layers.

The haze value (initial haze value) of the sealing resin layer or the laminate having both end surfaces of the sealing resin layer and the base material portion is not particularly limited, but is preferably 80% or more, more preferably 85% or more, still more preferably 90% or more, and particularly preferably 95% or more, from the viewpoint of making the effect of suppressing luminance unevenness and the appearance more excellent. The upper limit of the haze value is not particularly limited.

The total light transmittance of the sealing resin layer or the laminate having the sealing resin layer and the base material portion at both end surfaces is not particularly limited, but is preferably 40% or less, more preferably 30% or less, and even more preferably 20% or less, from the viewpoint of further improving the function of preventing reflection of metal wiring or the like and the contrast. From the viewpoint of securing brightness, the total light transmittance is preferably 0.5% or more.

The haze value and the total light transmittance can be measured by the methods defined in JIS K7136 and JIS K7361-1, respectively, and can be controlled by the lamination order, type, thickness, and the like of the layers constituting the sealing resin layer and the base material portion.

The thickness of the sealing resin layer or the laminate having both end surfaces of the sealing resin layer and the base material portion is preferably 10 to 600 μm, more preferably 20 to 550 μm, still more preferably 30 to 500 μm, still more preferably 40 to 450 μm, and particularly preferably 50 to 400 μm, from the viewpoints of improving the function of preventing reflection of metal wiring or the like, improving contrast, and reducing color shift more efficiently. In addition, the release liner is not included in the above thickness.

The display of the present invention preferably includes a self-luminous display device. The self-luminous display device can be combined with a display panel as needed to form a display body as an image display device. The optical semiconductor element in this case is an LED element. Examples of the self-luminous display device include an LED display, a backlight, and an organic electroluminescence (organic EL) display device. The backlight is particularly preferably a full-surface direct type backlight. The backlight includes, for example, a laminate including the substrate and a plurality of optical semiconductor elements disposed on the substrate as at least a part of a constituent member. For example, in the self-luminous display device, a metal wiring layer for transmitting a light emission control signal to each LED element is laminated on the substrate. The LED elements that emit light of red (R), green (G), and blue (B) are alternately arranged on the substrate with a metal wiring layer interposed therebetween. The metal wiring layer is made of a metal such as copper, and displays each color by adjusting the light emission degree of each LED element.

The display body of the present invention is a bendable display body, and may be, for example, a bendable image display device (flexible display) (particularly, a foldable image display device (foldable display)). Specifically, a display having a foldable backlight, a display having a foldable self-luminous display device, and the like are exemplified.

In the display of the present invention, the sealing resin layer has excellent followability and landfill property of the optical semiconductor element, and therefore the optical semiconductor element may be a mini LED element or a micro LED element.

According to the display of the present invention, color shift due to light emitted from the optical semiconductor element is less likely to occur, diffuse reflection of external light is less likely to occur, and the sealing property of the optical semiconductor element is excellent. Therefore, the display can be visually recognized in the same color tone from a large visual field. In addition, the appearance of the display body is good at the time of lighting and at the time of non-lighting. In addition, even at high temperature, the optical semiconductor element and the sealing resin layer are not liable to peel off, and the heat-resistant reliability is excellent.

[ method for manufacturing display body ]

The display of the present invention can be manufactured by bonding an optical semiconductor element sealing sheet having a sealing resin layer to a substrate on which an optical semiconductor element is arranged, and sealing the optical semiconductor element with the sealing resin layer.

(sheet for sealing optical semiconductor element)

The optical semiconductor element sealing sheet is a sheet for sealing a plurality of optical semiconductor elements arranged on a substrate. The optical semiconductor element sealing sheet includes a sealing resin layer including a first sealing layer, a second sealing layer directly laminated on the first sealing layer, and a third sealing layer directly laminated on the second sealing layer. One of the first sealing layer and the second sealing layer is a colored layer, and the other is a non-colored layer. The optical semiconductor element sealing sheet is a sheet which can be formed into a structure in which: when the sealing resin layer is formed by sealing the plurality of optical semiconductor elements with the sealing resin layer so that the first sealing layer is in contact with the plurality of optical semiconductor elements, the straight line L1 is not parallel to the surface of the substrate, the straight line L2 is not parallel to the surface of the substrate, and the straight line L3 is parallel to the surface of the substrate. According to the optical semiconductor element sealing sheet of the present invention, by sealing the optical semiconductor element, it is possible to provide a display body which is less likely to cause color shift, less likely to cause diffuse reflection of external light, and excellent in sealing property of the optical semiconductor element.

The sealing resin layer is a layer capable of forming the sealing resin layer in the display of the present invention. Specifically, the first sealing layer, the second sealing layer, and the third sealing layer in the sealing resin layer are layers capable of forming the first sealing layer, the second sealing layer, and the third sealing layer in the display according to the present invention, respectively. Specifically, the first sealing layer in the sealing resin layer may be a layer having the same composition (constituent components and blending ratio thereof) and physical properties (haze, total light transmittance, etc.) as the first sealing layer in the display of the present invention, or may be a layer which becomes the first sealing layer in the display of the present invention by curing. The second sealing layer in the sealing resin layer may be a layer having the same composition (constituent components and blending ratio thereof) and physical properties (haze, total light transmittance, etc.) as the second sealing layer in the display of the present invention, or may be a layer which becomes the second sealing layer in the display of the present invention by curing. The third sealing layer in the sealing resin layer may be a layer having the same composition (constituent components and blending ratio thereof) and physical properties (haze, total light transmittance, etc.) as the third sealing layer in the display of the present invention, or may be a layer which becomes the third sealing layer in the display of the present invention by curing.

Each layer constituting the sealing resin layer may or may not have an adhesive property and/or an adhesive property, independently of the other. Among them, adhesion and/or adhesiveness are preferable. With such a structure, the sealing resin layer can be easily bonded to the substrate and the optical semiconductor element, and the sealing property of the optical semiconductor element is further improved because the adhesion between the layers is excellent. In particular, it is preferable that at least the layer in contact with the optical semiconductor element has adhesion and/or adhesiveness. With such a structure, the sealing resin layer is excellent in following property and landfill property with respect to the optical semiconductor element. As a result, the optical semiconductor device has excellent appearance even when the difference in height due to the optical semiconductor device is large.

Each layer (the first sealing layer, the second sealing layer, the third sealing layer, and the like) constituting the sealing resin layer may be a resin layer (radiation curable resin layer) having a property of being cured by radiation irradiation, or may be a resin layer (non-radiation curable resin layer) having no property of being cured by radiation irradiation. Examples of the radiation include electron beam, ultraviolet ray, α ray, β ray, γ ray, and X ray. In the case where the colored layer is a radiation curable resin layer, the colorant that the colored layer can contain is not particularly limited, but is preferably a colorant that absorbs visible light and has a transmittance of light having a wavelength at which the radiation curable resin layer can be cured.

The optical semiconductor element sealing sheet may further include the base material portion. In the case of the substrate portion, the sealing resin layer may be provided on at least one surface of the substrate portion. The surface of the sealing resin layer that contacts the base material portion is a surface opposite to the side of the sealing resin layer that contacts the optical semiconductor element. When the optical semiconductor element sealing sheet includes the base material portion, the optical semiconductor element sealing sheet is bonded to the optical semiconductor element and the substrate together with the base material portion, and the base material portion in the optical semiconductor element sealing sheet serves as the base material portion in the display body of the present invention.

The sealing resin layer may be formed on a release treated surface of a release liner. When the optical semiconductor element sealing sheet is formed on the release liner, the side of the sealing resin layer in contact with the optical semiconductor element is the side in contact with the release liner. In the case where the base material portion is not provided, both surfaces of the sealing resin layer may be the sides in contact with the release liner. The release liner is used as a protective material for the optical semiconductor element sealing sheet, and is peeled off when sealing an optical semiconductor element. In addition, the base material portion and the release liner may not be provided.

The release liner is a component for protecting the surface of the optical semiconductor element sealing sheet, and is peeled off from the optical semiconductor element sealing sheet when the sheet is bonded to a substrate on which the optical semiconductor element is disposed.

Examples of the release liner include polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, plastic film surface-coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent, and papers.

The thickness of the release liner is, for example, 10 to 200. Mu.m, preferably 15 to 150. Mu.m, more preferably 20 to 100. Mu.m. When the thickness is 10 μm or more, breakage due to slitting is less likely to occur during processing of the release liner. When the thickness is 200 μm or less, the release liner is more easily peeled from the optical semiconductor element sealing sheet at the time of use.

An embodiment of the optical semiconductor element sealing sheet will be described with reference to fig. 7. Fig. 7 is a cross-sectional view of the optical semiconductor element sealing sheet capable of forming the display body shown in fig. 2. As shown in fig. 7, the optical semiconductor element sealing sheet 10 can be used for sealing 1 or more optical semiconductor elements arranged on a substrate, and includes a base material portion 5 and a sealing resin layer 7 formed on the base material portion 5. The sealing resin layer 7 is formed of a laminate of a non-colored layer 71 as a first sealing layer, a colored layer 72 as a second sealing layer, and a non-colored layer 73 as a third sealing layer. The non-colored layer 71, the colored layer 72, and the non-colored layer 73 have adhesiveness and are directly laminated to each other. A release liner 6 is attached to the surface of the non-colored layer 71 of the sealing resin layer 7, and a base material portion 5 is attached to the surface of the non-colored layer 73.

(sealing Process)

The method for manufacturing the display of the present invention using the optical semiconductor element sealing sheet includes the following sealing steps: the optical semiconductor element sealing sheet is bonded to a substrate on which the optical semiconductor element is disposed, and the optical semiconductor element is sealed with a sealing resin layer. Specifically, in the sealing step, the release liner is peeled from the optical semiconductor element sealing sheet to expose the sealing resin layer. Then, when the laminate is provided with a plurality of optical semiconductor elements, the sealing resin layer is disposed so that the sealing resin layer fills gaps between the plurality of optical semiconductor elements, and the plurality of optical semiconductor elements are sealed together. Specifically, as shown in fig. 8, the non-colored layer 71 of the optical semiconductor element sealing sheet 10 from which the release liner 6 is peeled is disposed so as to face the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are disposed, the optical semiconductor element sealing sheet 10 is bonded to the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are disposed, and the optical semiconductor elements 3a to 3c are embedded in the sealing resin layer 7.

The temperature at the time of bonding is, for example, in the range of room temperature to 110 ℃. In addition, the pressure may be reduced or increased during the bonding. By the pressure reduction and the pressure increase, formation of a void between the sealing resin layer and the substrate or the optical semiconductor element can be suppressed. In the sealing step, it is preferable that the optical semiconductor element sealing sheet is bonded under reduced pressure and then pressurized. The pressure at the time of depressurization is, for example, 1 to 100Pa, and the depressurization time is, for example, 5 to 600 seconds. The pressure at the time of pressurization is, for example, 0.05 to 0.5MPa, and the pressurization time is, for example, 5 to 600 seconds.

By appropriately setting the thicknesses of the first sealing layer, the second sealing layer, and the third sealing layer in the sealing resin layer, the temperature and the pressure at the time of bonding, and the like, the following performance of the first sealing layer and the second sealing layer in the obtained display body with respect to the optical semiconductor element, and the thicknesses of the first sealing layer, the second sealing layer, and the third sealing layer in each region of the concave portion and the convex portion in the concave-convex shape can be adjusted. In this way, the parallelism of the straight lines L1, L2, and L3 with respect to the surface of the substrate can be controlled in the obtained display body.

(radiation irradiation step)

When the sealing resin layer includes a radiation curable resin layer, the manufacturing method may further include a radiation irradiation step of: and irradiating a laminate including the substrate, the optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element with radiation, and curing the radiation-curable resin layer to form a cured layer. Examples of the radiation include electron beam, ultraviolet ray, α ray, β ray, γ ray, and X ray as described above. Among them, ultraviolet rays are preferable. The temperature at the time of irradiation with the radiation is, for example, in the range of room temperature to 100℃and the irradiation time is, for example, 1 minute to 1 hour.

(cutting step)

The above manufacturing method may further include the following dicing step: cutting a laminate including the substrate, the optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element. As the laminate, a laminate subjected to the radiation irradiation step may be cut. When the laminate includes a cured product layer obtained by curing the radiation-curable resin layer by irradiation with the radiation, the cured product layer of the optical semiconductor element sealing sheet and the side end portion of the substrate are cut and removed in the dicing step. This makes it possible to expose the surface of the cured product layer, which is sufficiently cured and has low adhesion, on the side surface. The cutting can be performed by a known or conventional method, for example, by a method using a cutting blade or by irradiation with a laser.

(tiling step)

The above manufacturing method may further include a tiling step of: the plurality of display bodies obtained in the dicing step are arranged so as to be in contact with each other in the planar direction. In the tiling step, the plurality of laminated bodies obtained in the dicing step are aligned so as to be in contact with each other in the planar direction, and are tiled. In this way, 1 large display can be manufactured.

The display body of the present invention can be manufactured by operating as described above. In the optical semiconductor element sealing sheet 10, when the sealing resin layer 7 does not have a radiation-curable resin layer, the sealing resin layer 7 becomes the sealing resin layer 4 in the display 1. On the other hand, in the optical semiconductor element sealing sheet 10, when the sealing resin layer 7 has a radiation curable resin layer, for example, when the colored layer 72 and the non-colored layer 73 are radiation curable resin layers, the colored layer 72 and the non-colored layer 73 are cured to form the colored layer 42 and the non-colored layer 43, thereby forming the sealing resin layer 4.

Claims

1. A display body comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer sealing the plurality of optical semiconductor elements,

The sealing resin layer includes a first sealing layer in contact with the optical semiconductor element, a second sealing layer directly laminated on the first sealing layer, and a third sealing layer directly laminated on the second sealing layer,

one of the first sealing layer and the second sealing layer is a coloring layer, the other is a non-coloring layer,

in a vertical plane section with respect to the surface of the substrate through the center of gravity of a first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element within the same pixel,

setting a vertical line passing through the center of gravity of the first optical semiconductor element with respect to the surface of the substrate as a vertical line P _A ，

Setting a vertical line passing through a midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element with respect to the surface of the substrate as a vertical line P _C ，

At this time, the perpendicular P passes through _A And the front side interface of the first sealing layerIntersection point and the perpendicular P _C A straight line L1 of an intersection point with the front-side interface of the first sealing layer is not parallel with respect to the surface of the substrate,

through the perpendicular P _A An intersection point with the front-side interface of the second sealing layer and the perpendicular line P _C A straight line L2 of an intersection point with the front-side interface of the second sealing layer is not parallel with respect to the surface of the substrate,

through the perpendicular P _A An intersection point with the front-side interface of the third sealing layer and the perpendicular line P _C A straight line L3 of an intersection point with the front-side interface of the third sealing layer is parallel to the surface of the substrate.

2. The display body according to claim 1, wherein,

in the vertical plane cross section, the first sealing layer is in contact with the surface of the substrate between the first and second optical semiconductor elements in a range of 50% or more.

3. The display body according to claim 1, wherein,

the first sealing layer is the non-coloring layer, and the second sealing layer is the coloring layer.

4. The display body according to claim 1, wherein,

the first sealing layer is a diffusion functional layer.

5. The display body according to any one of claims 1 to 4, wherein,

the display body is provided with a self-luminous display device.

6. The display body according to any one of claims 1 to 4, wherein,

the display body is an image display device.

7. A sheet for sealing an optical semiconductor element, which is used for sealing a plurality of optical semiconductor elements arranged on a substrate, wherein,

The sheet comprises a sealing resin layer comprising a first sealing layer, a second sealing layer directly laminated to the first sealing layer, and a third sealing layer directly laminated to the second sealing layer,

when the plurality of optical semiconductor elements are sealed with the sealing resin layer so that the first sealing layer is in contact with the plurality of optical semiconductor elements to form a sealing resin layer,

At this time, the following configuration can be formed:

through the perpendicular P _A An intersection point with the front-side interface of the first sealing layer and the perpendicular line P _C A straight line L1 of an intersection point with the front-side interface of the first sealing layer is not parallel with respect to the surface of the substrate,

through the perpendicular P _A An intersection point with the front-side interface of the third sealing layer and the perpendicular line P _C And the third sealing layerThe straight line L3 of the intersection between the front-side interfaces of the substrate is parallel to the surface of the substrate.

8. The sheet for sealing an optical semiconductor element according to claim 7, wherein,

9. The sheet for sealing an optical semiconductor element according to claim 7 or 8, wherein,

the first sealing layer is a diffusion functional layer.