CN116805640A - Display and optical semiconductor element sealing sheet - Google Patents
Display and optical semiconductor element sealing sheet Download PDFInfo
- Publication number
- CN116805640A CN116805640A CN202310287798.1A CN202310287798A CN116805640A CN 116805640 A CN116805640 A CN 116805640A CN 202310287798 A CN202310287798 A CN 202310287798A CN 116805640 A CN116805640 A CN 116805640A
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- China
- Prior art keywords
- optical semiconductor
- semiconductor element
- layer
- substrate
- sealing resin
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Abstract
The invention provides a display body with high brightness, which is not easy to generate uneven brightness. The display body includes a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer sealing the plurality of optical semiconductor elements. The sealing resin layer includes a coloring layer and a non-coloring layer. An end T of the optical semiconductor element from the substrate surface to the front side of the gravity center A The distance to the point is L A An end portion T on the front side of the coloring layer on a vertical line with respect to the substrate surface from the substrate surface to a midpoint between the center of gravity of the optical semiconductor element and the center of gravity of the optical semiconductor element adjacent to the same pixel as the optical semiconductor element C The distance to the point is L C Will pass through the end T A Is perpendicular to the substrate surface and passes through the end T C The distance from the perpendicular to the substrate surface is L A－C When the angle of elevation angle is θ° when viewed from the end to the vertical, the display satisfies the following expression (1), L C ≤L A +L A－C tanθ(1)。
Description
Technical Field
The present invention relates to a display body and an optical semiconductor element sealing sheet. More specifically, the present invention relates to a display body in which an optical semiconductor element of a self-luminous display device is sealed, and a sheet suitable for sealing the optical semiconductor element, for example.
Background
In recent years, as a new generation display device, a self-luminous display device typified by a Mini/micro LED display device (Mini/Micro Light Emitting Diode Display) has been designed. As a basic configuration of a mini/micro LED display device, a substrate in which a large number of micro optical semiconductor elements (LED chips) are densely arranged is used as a display panel, the optical semiconductor elements are sealed with a sealing material, and a cover member such as a resin film or a glass plate is laminated on the outermost layer.
In a display body including a self-luminous display device such as a mini/micro LED display device, wiring (metal wiring) of a metal oxide such as metal or ITO is arranged on a substrate of a display panel. Such a display device has the following problems, for example: when the light is turned off, the light is reflected by the metal wiring or the like, and the appearance of the screen is deteriorated. Therefore, as a sealing material for sealing the optical semiconductor element, a technique using an antireflection layer for preventing reflection by a metal wiring is adopted.
In addition, in a display using a self-luminous display device, there is a problem that uneven brightness (uneven brightness) occurs due to a light source of an optical semiconductor element. When the luminance unevenness occurs, a phenomenon such as "color shift" in which the color tone changes occurs when viewed from the front of the display or when viewed from an oblique view.
Patent document 1 discloses an adhesive sheet that is a laminate of a colored adhesive layer and a colorless adhesive layer, and is provided so that the colorless adhesive layer is in contact with an optical semiconductor element, as an adhesive sheet capable of suppressing luminance unevenness. According to the adhesive sheet, the colorless adhesive layer contacts the irregularities when the adhesive sheet contacts and follows the irregularities formed by the substrate and the optical semiconductor element provided on the substrate, and the irregularities are absorbed to some extent by the colorless adhesive layer, so that the colored adhesive layer can be suppressed from being compressed or deformed, thereby suppressing the transmittance unevenness in the adhesive layer, and suppressing the luminance unevenness.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2020-169262
Disclosure of Invention
Problems to be solved by the invention
However, the adhesive sheet provided with the colored adhesive layer has the following problems, although the adhesive sheet can be expected to have the effect of preventing reflection by metal wiring or suppressing luminance unevenness when sealing an optical semiconductor element: light emitted from the optical semiconductor element is prevented from being transmitted in the front oblique direction, and as a result, the front luminance of the display body is reduced. When the front luminance is lowered, the power consumption is increased in order to increase the luminance. Accordingly, a display body having high luminance is demanded, which is less likely to cause luminance unevenness.
The present invention has been made in view of these circumstances, and an object thereof is to provide a display body having high luminance, in which luminance unevenness is less likely to occur. Another object of the present invention is to provide a semiconductor element sealing sheet capable of manufacturing a display body having high luminance with less occurrence of luminance unevenness by sealing an optical semiconductor element.
Solution for solving the problem
As a result of intensive studies to achieve the above object, the present inventors have found that when a display having the following structure is used, luminance unevenness is less likely to occur and luminance is high, that is: in a state where a plurality of optical semiconductor elements arranged on a substrate are sealed with a sealing resin layer including a colored layer and a non-colored layer, the height of the front-side end portion of the colored layer located at the center portion between the closest two optical semiconductor elements is equal to or less than a certain height with respect to the height of the front-side end portion of the optical semiconductor element. The present invention has been completed based on the above findings.
That is, the present invention provides a display comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer sealing the plurality of optical semiconductor elements, wherein the sealing resin layer comprises a colored layer and a non-colored layer, and the end T of the first optical semiconductor element on the front side from the surface of the substrate A The distance to the point is L A An end portion T on the front side of the colored layer on a vertical line with respect to the surface of the substrate from the surface of the substrate to a midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element within the same pixel C The distance to the point is L C Will pass through the end T A Is perpendicular to the surface of the substrate and passes through the end T C The distance between the vertical line relative to the surface of the substrate is L A－C Will be from the end T A Toward through the end T C The angle of elevation angle of the substrate with respect to the vertical line is set to be θ°, and at this time, the following expression (1) is satisfied,
L C ≤L A +L A－C tanθ (1)。
in the display, the sealing resin layer for sealing the optical semiconductor element includes the colored layerAnd reflection of light by metal wiring or the like provided on the substrate can be prevented. And by making the height of the end of the coloring layer on the front side of the portion located in the center between the nearest optical semiconductor elements, that is, the distance L C Is the distance L which is the height of the end part of the optical semiconductor element on the front side than the center of gravity A High L A－C A position of tan θ or less, thereby a distance L C The colored layer is not likely to interfere with light emitted from the optical semiconductor element and transmits in the front oblique direction, and light can be transmitted sufficiently to a large field of view, thereby improving the front luminance of the display.
Preferably, the sealing resin layer includes the colored layer and the non-colored layer in this order from the optical semiconductor element side. With such a structure, even when the colored layer has a concave-convex shape, the colored layer surface is prevented from being exposed on the front side (the opposite side to the optical semiconductor element) of the sealing resin layer surface, and the front side sealing resin layer surface is easily flattened, so that diffuse reflection of external light is less likely to occur, and the appearance of the display is improved both when the display is turned off and when the display is lighted.
Preferably, the sealing resin layer includes a diffusion functional layer. By having such a structure, light emitted from the optical semiconductor element is diffused in the diffusion functional layer, and the front luminance can be further improved.
Preferably, the sealing resin layer includes the diffusion functional layer, the colored layer, and the non-colored layer in this order from the optical semiconductor element side. With such a structure, the front luminance can be further improved, and the appearance of the display body can be further improved both at the time of turning off and at the time of light emission.
Preferably, the display body includes a self-luminous display device.
Preferably, the display body is an image display device.
In the display device, the height of the optical semiconductor element on the substrate is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer has more excellent following property to the concave-convex shape.
The present invention also provides an optical semiconductor element sealing sheet for sealing a plurality of optical semiconductor elements arranged on a substrate, wherein the sheet comprises a sealing resin layer including a colored layer and a non-colored layer, and when the sealing resin layer is formed by sealing the plurality of optical semiconductor elements with the sealing resin layer, an end T of a first optical semiconductor element on a front side from a surface of the substrate to a center of gravity thereof is formed A The distance to the point is L A An end portion T on the front side of the colored layer on a vertical line with respect to the surface of the substrate from the surface of the substrate to a midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element within the same pixel C The distance to the point is L C Will pass through the end T A Is perpendicular to the surface of the substrate and passes through the end T C The distance between the vertical line relative to the surface of the substrate is L A－C Will be from the end T A Toward through the end T C The angle of elevation angle of the substrate with respect to the vertical line is set to be θ°, and at this time, the following expression (1) is satisfied,
L C ≤L A +L A－C tanθ (1)。
preferably, the sealing resin layer includes a diffusion functional layer.
Preferably, the sealing resin layer includes the diffusion functional layer, the colored layer, and the non-colored layer in this order.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the display of the present invention, uneven brightness and high brightness of light emitted from the light semiconductor element are less likely to occur. Therefore, the display is less likely to be color-shifted and can be visually recognized in the same color tone from a large visual field. The display is bright and beautiful without increasing power consumption. Further, according to the optical semiconductor element sealing sheet of the present invention, by sealing the optical semiconductor element, a display body having high luminance and less likely to cause luminance unevenness can be provided.
Drawings
Fig. 1 is a partial plan view of an optical member in which a plurality of optical semiconductor elements are arranged in units of pixels on a substrate.
Fig. 2 is a partial cross-sectional view showing an embodiment of the display body of the present invention.
Fig. 3 is a partially enlarged view of the display body shown in fig. 2.
Fig. 4 is a partial cross-sectional view showing a case where the optical semiconductor element of the display body shown in fig. 2 emits light.
Fig. 5 is a partial cross-sectional view showing a case where an optical semiconductor element of a conventional display emits light.
Fig. 6 is a partial cross-sectional view showing another embodiment of the display body of the present invention.
Fig. 7 is a partial cross-sectional view showing still another embodiment of the display body of the present invention.
Fig. 8 is a partial cross-sectional view showing still another embodiment of the display body of the present invention.
Fig. 9 is a cross-sectional view showing an embodiment of the optical semiconductor element sealing sheet of the present invention.
Fig. 10 is a partial cross-sectional view showing a process of sealing an optical semiconductor element using the optical semiconductor element sealing sheet shown in fig. 9.
Description of the reference numerals
1. A display body; 2. a substrate; 3a to 3f, optical semiconductor elements; 31. a support body; 3. 3', pixels; 4. a sealing resin layer; 41. a coloring layer; 42. a non-colored layer; 43. a diffusion functional layer (non-colored layer); 5. a base material portion; 6. a release liner; 7. a sealing resin layer; 71. a coloring layer; 72. a non-colored layer; 10. an optical semiconductor element sealing sheet; 11. an optical member.
Detailed Description
[ display body ]
The display body of the present invention includes at least a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer sealing the plurality of optical semiconductor elements. The display is a device for displaying information by using light emitted from the optical semiconductor element.
Examples of the optical semiconductor element include Light Emitting Diodes (LEDs) such as blue light emitting diodes, green light emitting diodes, red light emitting diodes, and ultraviolet light emitting diodes.
The plurality of optical semiconductor elements are arranged in 1 pixel (pixel) on the substrate, and the plurality of pixels are arranged. That is, a plurality of the optical semiconductor elements are arranged for each pixel including a plurality of the optical semiconductor elements. Fig. 1 is a partial plan view of an optical member in which a plurality of optical semiconductor elements are arranged for each pixel on a substrate. In the optical member 11 shown in fig. 1, 3 optical semiconductor elements 3a to 3c are arranged on the substrate 2 so as to be close to each other, and 1 pixel (pixel 3) is formed by the 3 optical semiconductor elements 3a to 3 c. The 3 optical semiconductor elements 3d to 3f are arranged on the substrate 2 so as to be close to each other, and 1 pixel (pixel 3') is formed by the 3 optical semiconductor elements 3d to 3 f. Then, a plurality of pixels such as the pixel 3 and the pixel 3' are arranged on the substrate 2.
The display body of the present invention has a concave-convex shape formed by a substrate and optical semiconductor elements, wherein the surface of the substrate, which is located between the two optical semiconductor elements closest to each other and in which the optical semiconductor elements are not arranged, is defined as a concave portion and the optical semiconductor elements are defined as convex portions.
The height of the optical semiconductor element on the substrate (the height from the substrate surface to the end of the front surface of the optical semiconductor element; corresponding to L described below A . ) Preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer has more excellent following property to the concave-convex shape.
Preferably, the sealing resin layer is in contact with the plurality of optical semiconductor elements and follows the concave-convex shape. The sealing resin layer preferably seals the plurality of optical semiconductor elements at once. In the present specification, "sealing the optical semiconductor element" means embedding at least a part of the optical semiconductor element into the sealing resin layer or covering the optical semiconductor element by following the sealing resin layer.
The sealing resin layer includes at least a coloring layer and a non-coloring layer. In the sealing resin layer, the colored layer and the non-colored layer may be directly laminated or may be laminated with other layers interposed therebetween. The sealing resin layer may seal the optical semiconductor element so that the colored layer side becomes the optical semiconductor element side, or may seal the optical semiconductor element so that the non-colored layer side becomes the optical semiconductor element side.
Any one of the plurality of optical semiconductor elements is set as a first optical semiconductor element. The optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is a second optical semiconductor element. An end portion T on the front side of the gravity center of the first optical semiconductor element from the surface of the substrate A The distance to the point is L A . An end portion T on the front side of the colored layer on a vertical line with respect to the surface of the substrate from the surface of the substrate to a midpoint passing between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element C The distance to the point is L C . Will pass through the end T A Is perpendicular to the surface of the substrate and passes through the end T C The distance between the vertical line and the surface of the substrate is L A－C . And from the end T A To pass through the end T C The angle of elevation angle of the substrate with respect to the vertical line is set to θ °. In this case, the display of the present invention satisfies the following expression (1).
L C ≤L A +L A－C tanθ (1)
In the display, the sealing resin layer sealing the optical semiconductor element includes the colored layer, so that reflection of light by a metal wiring or the like provided on a substrate can be prevented. And by making the coloring layer located closest to the light Distance L, which is the height of the front end of the central portion between the semiconductor elements C Is the distance L which is the height of the end part of the optical semiconductor element on the front side than the center of gravity A High L A－C A position of tan θ or less, thereby a distance L C The colored layer is not likely to interfere with light emitted from the optical semiconductor element and transmits in the front oblique direction, and light can be transmitted sufficiently to a large field of view, thereby improving the front luminance of the display.
In the present specification, the "front face" means a side on which the display body is visually recognized, and is, for example, upward in fig. 2 described later.
(first embodiment)
The display of the present invention will be described with reference to the display shown in fig. 2 as one embodiment of the present invention. The display 1 shown in fig. 2 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, a sealing resin layer 4 for sealing the optical semiconductor elements 3a to 3c together, and a base material portion 5 bonded to a surface of the sealing resin layer 4 on the side opposite to the side on which the optical semiconductor elements 3a to 3c are located. Fig. 2 is an enlarged view of a vertical plane cross section through the center of gravity of the optical semiconductor elements 3a to 3c with respect to the substrate 2.
The optical semiconductor elements 3a to 3c are each fixed to one substrate 2 via a support 31. The display 1 has a concave-convex shape formed by the substrate 2 and the optical semiconductor elements 3a to 3c, wherein the surface of the substrate 2 in the region between the optical semiconductor elements 3a to 3c where no optical semiconductor element is arranged is defined as a concave portion N, and the optical semiconductor elements 3a to 3c are defined as convex portions P.
The optical semiconductor elements 3a to 3c in fig. 2 are the optical semiconductor elements 3a to 3c shown in fig. 1, and the optical semiconductor elements 3a to 3c are located in the same pixel 3. For example, the optical semiconductor element 3a is a first optical semiconductor element, and the optical semiconductor element 3b is a second optical semiconductor element adjacent to the optical semiconductor element 3 a.
As shown in fig. 2, the sealing resin layer 4 contacts the plurality of optical semiconductor elements 3a to 3c and follows the concave-convex shape, thereby sealing the plurality of optical semiconductor elements 3a to 3c at once.
The sealing resin layer 4 is formed by directly laminating the colored layer 41 and the non-colored layer 42, and seals the optical semiconductor elements 3a to 3c so that the colored layer 41 side becomes the optical semiconductor elements 3a to 3c side. The colored layer 41 in contact with the optical semiconductor elements 3a to 3c follows the above-described uneven shape, and in the display body 1, the colored layer 41 also has the uneven shape. On the other hand, one surface of the non-colored layer 42 follows the concave-convex shape of the colored layer 41 and has a concave-convex shape complementary to the concave-convex shape of the colored layer 41, and the other surface is flat (planar). The non-colored layer 42 may be a diffusion functional layer described later, or may be a non-diffusion functional layer.
That is, the sealing resin layer 4 includes a colored layer 41 and a non-colored layer 42 in this order from the optical semiconductor element 3a side to the optical semiconductor element 3c side. The sealing resin layer 4 seals the optical semiconductor elements 3a to 3c so that the colored layer 41 contacts the optical semiconductor elements 3a to 3c.
Fig. 3 shows a partial enlarged view of the vicinity between the optical semiconductor element 3a and the optical semiconductor element 3b of the display body 1 shown in fig. 2. As shown in fig. 3, in the display 1, the gravity center G of the optical semiconductor element 3a is from the surface of the substrate 2 A End T on the front side A The distance to the point is L A 。L A Corresponding to the height of the optical semiconductor element 3 a. End T A Through the centre of gravity G A Perpendicular P to the surface of the substrate 2 A An intersection with the front surface of the optical semiconductor element 3 a. Center of gravity G of the optical semiconductor element 3a A Center of gravity G with the optical semiconductor element 3b B The midpoint between them is designated as C. The vertical line passing through the midpoint C with respect to the surface of the substrate 2 is set as a vertical line P C . Will be perpendicular to the surface of the substrate 2 C The front end T of the upper coloring layer 41 C The distance to the point is L C . End T C Is a vertical line P C The intersection with the front surface side interface of the colored layer 41 corresponds to the height from the surface of the substrate 2 to the front surface side interface of the colored layer 41 at the midpoint C. End T C May be located closer to the substrate 2 than the midpoint C (lower side of the drawing)May be located on the front side (upper side in the drawing) from the midpoint C. Will be perpendicular P A To the vertical line P C Distance of (2) is set to L A－C . Vertical line P A And a perpendicular P C Parallel. And will be from end T A To the vertical line P C The angle of elevation angle at the time of observation is set to θ °, and at this time, the display body 1 satisfies the above equation (1). In fig. 3, a vertical line P is denoted by T C At a height L from the surface of the substrate 2 A +L A－C Points of the position of tan θ.
In the display 1, the sealing resin layer 4 sealing the optical semiconductor elements 3a to 3c includes the colored layer 41, so that reflection of light by metal wiring or the like on the substrate 2 can be suppressed. Further, the end portion T of the coloring layer 41 on the front side of the portion located at the center portion between the nearest optical semiconductor element 3a and the optical semiconductor element 3b is made to be C The height of (i.e. distance L) C A gravity center G of the specific optical semiconductor element 3a A End T on the front side A The height of (1), L A High L A－C A position of tan θ or less, thereby a distance L C The coloring layer 41 is sufficiently low according to the distance between the optical semiconductor element 3a and the optical semiconductor element 3b, and is not likely to prevent light emitted from the optical semiconductor element 3a from being transmitted in the upper oblique direction (i.e., the front oblique direction), so that light can be sufficiently transmitted in a large field of view, and the front luminance of the display 1 can be improved.
In fig. 3, the case where the optical semiconductor element 3a located at one end in the pixel satisfies the above formula (1) is described, but in addition to or instead of this case, the optical semiconductor element such as the optical semiconductor element 3b and the like may be a first optical semiconductor element, the optical semiconductor element such as the optical semiconductor element 3a and/or the optical semiconductor element 3c and the like adjacent to the optical semiconductor element in the pixel may be a second optical semiconductor element, and the above formula (1) may be satisfied when the optical semiconductor element located at the other end in the pixel such as the optical semiconductor element 3c and the like is a first optical semiconductor element, and the optical semiconductor element such as the optical semiconductor element 3b and the like adjacent to the optical semiconductor element located at the other end in the pixel is a second optical semiconductor element, and the above formula (1) may be satisfied.
It is preferable that the relationship between all the optical semiconductor elements in the same pixel and all the nearest optical semiconductor elements satisfies the above expression (1). In this case, for example, the colored layer 41 is unlikely to interfere with the light emitted from all the optical semiconductor elements 3a to 3c in the same pixel shown in fig. 2 to be transmitted in the front oblique direction, so that the light can be sufficiently transmitted to a large field of view, and the front luminance of the display 1 can be further improved.
Specifically, when all the optical semiconductor elements in the same pixel in the display satisfy the above expression (1), as shown in fig. 4, the light F emitted from the optical semiconductor elements 3a to 3c and directed to the front surface is excluded A 、F B And F C In addition, light R emitted from the optical semiconductor elements 3a to 3c and directed obliquely to the right of the front surface A 、R B And R is C And light L emitted from the optical semiconductor elements 3a to 3c and directed obliquely to the front left A 、L B And L C The transmission of (c) is not hindered by the colored layer 41, and therefore the luminance of the front surface of the display body becomes high. Thus, light emitted from the optical semiconductor element can be sufficiently transmitted to the front surface of the display body with a large field of view, and uneven brightness can be suppressed.
On the other hand, fig. 5 shows an embodiment of a conventional display body. In the display shown in fig. 5, the non-colored layer 42 and the colored layer 41 are provided in this order from the optical semiconductor element side, and the front-side interface of the colored layer 41 between the optical semiconductor element 3a and the optical semiconductor element 3b is located further toward the front side than the front-side end portions of the optical semiconductor elements 3a to 3c, which does not satisfy the above formula (1). In the display shown in fig. 5, light R emitted from the optical semiconductor elements 3a to 3c and directed obliquely to the right of the front surface A 、R B And R is C And light L emitted from the optical semiconductor elements 3a to 3c and directed obliquely to the front left A 、L B And L C The transmission of the light emitted from the optical semiconductor element is blocked by the colored layer 41, and therefore the brightness of the front surface of the display is low, and the light emitted from the optical semiconductor element cannot be directed to the front surface of the display with a large field of viewAnd is sufficiently transmitted, there is a possibility that brightness unevenness occurs. In the embodiment shown in fig. 5, when the thickness of the colored layer 41 is made thicker, the light F emitted from the optical semiconductor elements 3a to 3c A ～F C When the thickness of the colored layer 41 is made thinner, the antireflection capability required for the colored layer 41 is reduced. On the other hand, in the display of the present invention satisfying the above expression (1), the front luminance level, the luminance unevenness preventing capability, and the antireflection capability can all be made excellent.
In this way, by making the display of the present invention satisfy the above formula (1), the height of the colored layer between the optical semiconductor elements is sufficiently low in accordance with the distance between the optical semiconductor elements, and the colored layer is unlikely to prevent light emitted from the optical semiconductor elements from transmitting in the front oblique direction, so that light can be transmitted sufficiently in a large field of view, uneven brightness can be suppressed, and the front brightness of the display can be improved.
The value of θ is not particularly limited, and can be appropriately set according to the field of view in which the luminance unevenness of the display body should be suppressed. θ is, for example, 0 ° or more and less than 90 °, preferably 45 ° or less, more preferably 30 ° or less, and may be 25 ° or less or 20 ° or less, particularly preferably 15 ° or less. When θ is within the above range, luminance unevenness can be suppressed in a large field of view. Therefore, in the above formula (1), θ is preferably 45 °, 30 °, 25 °, 20 °, or 15 ° (in this case, L may be 0 ° C ≤L A )。
The center of gravity of the optical semiconductor element (center of gravity G of the optical semiconductor element 3a of fig. 3) A Center of gravity G of the optical semiconductor element 3b B Etc.) is determined by the three-dimensional shape of the optical semiconductor element. The three-dimensional shape of the optical semiconductor element is not particularly limited, and examples thereof include a square column such as a cube or a cuboid, a prism table, a cylinder, a round table, and a shape in which an upper portion thereof is formed as a dome. The center of gravity in the case where the three-dimensional shape of the optical semiconductor element is a square column is the center of the optical semiconductor element.
The display 1 may not include the base material portion 5. The number of the optical semiconductor elements in 1 pixel is not particularly limited, and may be 3.
(second embodiment)
Fig. 6 shows another embodiment (second embodiment) of the display body of the present invention. As in fig. 2, the display 1 shown in fig. 6 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, a sealing resin layer 4 for sealing the optical semiconductor elements 3a to 3c together, and a base material portion 5 bonded to a surface of the sealing resin layer 4 on the side opposite to the side on which the optical semiconductor elements 3a to 3c are located.
In the display 1 shown in fig. 6, as the sealing resin layer 4, a layer in which a layer (diffusion function layer) 43 that exhibits a diffusion function of light is interposed between the colored layer 41 and the non-colored layer 42 is used. That is, the sealing resin layer 4 is formed by stacking the colored layer 41, the diffusion functional layer 43, and the non-colored layer 42 in this order, and the sealing resin layer 4 seals the optical semiconductor elements 3a to 3c so that the colored layer 41 side is the optical semiconductor elements 3a to 3c side and the colored layer 41 contacts the optical semiconductor elements 3a to 3c.
The colored layer 41 in contact with the optical semiconductor elements 3a to 3c follows the concave-convex shape, and in the display body 1, the colored layer 41 also has the concave-convex shape. One surface of the diffusion functional layer 43 follows the concave-convex shape of the colored layer 41 and has a concave-convex shape complementary to the concave-convex shape of the colored layer 41, and the other surface is a plane. The two surfaces of the non-colored layer 42 that are in contact with the diffusion functional layer 43 are flat surfaces. The display body 1 shown in fig. 6 also satisfies the above formula (1). Otherwise, the display 1 shown in fig. 2 is identical.
(third embodiment)
Fig. 7 shows a display body according to still another embodiment (third embodiment) of the present invention. As in fig. 2, the display 1 shown in fig. 7 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, a sealing resin layer 4 for sealing the optical semiconductor elements 3a to 3c together, and a base material portion 5 bonded to a surface of the sealing resin layer 4 on the side opposite to the side on which the optical semiconductor elements 3a to 3c are located.
In the display 1 shown in fig. 7, the sealing resin layer 4 is formed by stacking the diffusion functional layer 43, the colored layer 41, and the non-colored layer 42 in this order, and the sealing resin layer 4 seals the optical semiconductor elements 3a to 3c so that the diffusion functional layer 43 side is the optical semiconductor elements 3a to 3c side and the diffusion functional layer 43 contacts the optical semiconductor elements 3a to 3c. In this way, when the sealing resin layer includes a diffusion functional layer, a colored layer, and a non-colored layer (particularly, a non-diffusion functional layer) in this order from the optical semiconductor element side, light emitted from the optical semiconductor element in the lateral direction or the like diffuses in the diffusion functional layer before entering the colored layer, and the front luminance is further improved.
The diffusion functional layer 43 in contact with the optical semiconductor elements 3a to 3c follows the concave-convex shape, and in the display body 1, the diffusion functional layer 43 also has the concave-convex shape. One surface of the coloring layer 41 follows the concave-convex shape of the diffusion functional layer 43 and has a concave-convex shape complementary to the concave-convex shape of the diffusion functional layer 43, and the other surface is a plane surface. The two surfaces of the non-colored layer 42 that are in contact with the colored layer 41 become flat surfaces. The display body 1 shown in fig. 7 also satisfies the above formula (1). Otherwise, the display 1 shown in fig. 2 is identical.
(fourth embodiment)
Fig. 8 shows still another embodiment (fourth embodiment) of the display body of the present invention. As in fig. 2, the display 1 shown in fig. 8 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, a sealing resin layer 4 for sealing the optical semiconductor elements 3a to 3c together, and a base material portion 5 bonded to a surface of the sealing resin layer 4 on the side opposite to the side on which the optical semiconductor elements 3a to 3c are located.
In the display 1 shown in fig. 8, as in the display 1 shown in fig. 7, the sealing resin layer 4 is formed by stacking the diffusion functional layer 43, the coloring layer 41, and the non-coloring layer 42 in this order, and seals the optical semiconductor elements 3a to 3c so that the diffusion functional layer 43 side is the optical semiconductor elements 3a to 3c side and the diffusion functional layer 43 contacts the optical semiconductor elements 3a to 3c. The diffusion functional layer 43 in contact with the optical semiconductor elements 3a to 3c follows the concave-convex shape, and in the display body 1, the diffusion functional layer 43 also has the concave-convex shape. The colored layer 41 follows the concave-convex shape of the diffusion functional layer 43 and has concave-convex shapes on both surfaces that are complementary to the concave-convex shape of the diffusion functional layer 43. One surface of the non-colored layer 42 in contact with the colored layer 41 follows the concave-convex shape of the colored layer 41 and has a concave-convex shape complementary to the concave-convex shape of the colored layer 41, and the other surface is a plane. The display body 1 shown in fig. 8 also satisfies the above formula (1). Otherwise, the display 1 shown in fig. 7 is the same.
The cross-sectional views of the display body shown in fig. 2 to 8 can be obtained, for example, as follows: in a state where the display body is cooled, the cross section can be exposed by cutting the display body perpendicularly to the substrate surface so as to pass through the centers of gravity of the plurality of optical semiconductor elements. By cooling the display body, it is possible to suppress melting and deformation of the sealing resin layer due to heat generated during cutting. The cutting can be performed using a known or conventional cutting device such as laser beam irradiation or ion beam irradiation. After cutting, the exposed cross section may be milled to expose a cross section having a lower degree of deformation. The temperature at the time of cooling can be set appropriately within a range in which the degree of deformation of the sealing resin layer and cracking of the display body are suppressed.
< sealing resin layer >)
The sealing resin layer includes at least the colored layer and the non-colored layer. Each of the layers (the colored layer and the non-colored layer) constituting the sealing resin layer may be a single layer or may be a plurality of layers having the same or different compositions. When the colored layer and the non-colored layer include a plurality of layers, the plurality of layers may be stacked in contact with each other or may be stacked with a space therebetween (for example, two colored layers are stacked with 1 non-colored layer interposed therebetween). The total number of layers constituting the sealing resin layer may be 2 or more, or 3 or more, including the colored layer and the non-colored layer. The total number of layers may be, for example, 10 or less, or 5 or less or 4 or less from the viewpoint of reducing the thickness of the display.
In the display according to the present invention, it is preferable that the sealing resin layer includes the colored layer and the non-colored layer in this order from the optical semiconductor element side. With such a structure, the surface of the colored layer having the uneven shape is prevented from being exposed on the surface of the sealing resin layer on the front side (the side opposite to the side on which the optical semiconductor element is located), and the surface of the sealing resin layer on the front side is easily flattened, and the diffuse reflection of external light is less likely to occur, thereby improving the appearance of the display both at the time of extinction and at the time of light emission. In the display 1 shown in fig. 2, 3, and 6 to 8, the sealing resin layer 4 includes a colored layer 41 and a non-colored layer 42 in this order from the optical semiconductor elements 3a to 3c side.
The sealing resin layer preferably includes a diffusion functional layer. With such a structure, light emitted from the optical semiconductor element can be diffused in the diffusion functional layer, and the front luminance can be further improved. The diffusion functional layer is preferably a layer which is a non-colored layer in the present specification. In fig. 2 and 3, the non-colored layer 42 may be a diffusion functional layer or a non-diffusion functional layer. In fig. 6 to 8, the sealing resin layer 4 includes a diffusion functional layer 43.
In the case where the sealing resin layer includes the diffusion functional layer, the sealing resin layer preferably includes the diffusion functional layer, the colored layer, and the non-colored layer in this order from the optical semiconductor element side. The non-colored layer may be any one of a diffusion functional layer and a non-diffusion functional layer. With such a structure, the front luminance can be further improved, and the appearance of the display body can be further improved both at the time of turning off and at the time of light emission. In fig. 7 and 8, the sealing resin layer 4 includes a diffusion functional layer 43, a colored layer 41, and a non-colored layer 42 in this order from the optical semiconductor elements 3a to 3c side. The non-colored layer 42 may be a diffusion functional layer or a non-diffusion functional layer.
In the display of the present invention, at least one surface of the colored layer (particularly, the surface on the optical semiconductor element side) preferably has a concave-convex shape following the concave-convex shape. In this case, the display of the present invention easily satisfies the above formula (1). The front surface of the colored layer may have a concave-convex shape following the concave-convex shape. In the display 1 shown in fig. 2, 3, 6, and 8, both surfaces of the colored layer 41 on the front surface side and the optical semiconductor element side have a concave-convex shape. In the display 1 shown in fig. 7, only the surface on the optical semiconductor element side has a concave-convex shape, and the surface on the front side is flat.
In the display of the present invention, it is preferable that the front side of the non-colored layer located on the front side of the colored layer is flat. In this case, diffuse reflection of external light is less likely to occur on the surface of the sealing resin layer, and the appearance of the display is improved both when the display is turned off and when the display emits light. In the display 1 shown in fig. 2, 3, and 6 to 8, the front side of the non-colored layer 42 is flat.
In the display of the present invention, the non-colored layer may be provided on the optical semiconductor element side of the colored layer. That is, the sealing resin layer may include the non-colored layer and the colored layer in this order from the optical semiconductor element side. In the case where the non-colored layer is provided on the optical semiconductor element side of the colored layer, both surfaces of the non-colored layer preferably have a concave-convex shape following the concave-convex shape. When having such a structure, the colored layer easily has a concave-convex shape. In the display 1 shown in fig. 7 and 8, the sealing resin layer 4 includes a diffusion functional layer 43 and a coloring layer 41 as non-coloring layers in this order from the optical semiconductor elements 3a to 3c side, and both surfaces of the diffusion functional layer 43 have concave-convex shapes following the concave-convex shapes.
Each of the layers (the colored layer and the non-colored layer) constituting the sealing resin layer may or may not have an adhesive property, independently. Among them, the adhesive property is preferable. With such a structure, the sealing resin layer can easily seal the optical semiconductor element, and the sealing property of the optical semiconductor element is further improved because the adhesion between the layers is excellent. It is particularly preferable that at least the layer in contact with the optical semiconductor element has adhesion. With such a structure, the sealing resin layer is excellent in following property and landfill property with respect to the optical semiconductor element. As a result, the optical semiconductor device has excellent appearance even when the difference in height due to the optical semiconductor device is large. In addition, the layers other than the layer in contact with the optical semiconductor element may not have adhesiveness. In this case, the adhesion between the adjacent sealing resin layers in the flat state is low, and when the adjacent small-sized laminate (laminate in which the sealing resin layers seal the optical semiconductor elements arranged on the substrate) is pulled apart from each other, chipping of the sealing resin layer and adhesion of the adjacent sealing resin layers are less likely to occur.
(colored layer)
The colored layer in the display of the present invention is a layer in the display for the purpose of preventing reflection of light by a metal wiring or the like provided on a substrate. The coloring layer at least contains a colorant. The colored layer is preferably a resin layer made of a resin. The colorant may be a dye or a pigment as long as it is soluble or dispersible in the colored layer. Dyes are preferred from the viewpoint that low haze can be achieved even with a small amount of addition, no sedimentation is possible as in pigments, and uniform distribution is easy. In addition, pigments are also preferred in terms of high color rendering properties even when added in small amounts. When pigments are used as colorants, it is preferred that the conductivity be low or not. The colorant may be used alone or in combination of two or more.
The colorant is preferably a black colorant. The black-based colorant may be any known or customary colorant (pigment, dye, etc.) for exhibiting black color, and examples thereof include carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, pine black, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (nonmagnetic ferrite, magnetic ferrite, etc.), magnetite (magnetite), chromium oxide, iron oxide, molybdenum disulfide, chromium complex, anthraquinone-based colorant, zirconium nitride, etc. Further, a colorant that is combined and mixed to exhibit a color other than black may be used and functions as a black-based colorant.
The content ratio of the colorant in the colored layer is preferably 0.2 mass% or more, more preferably 0.4 mass% or more, based on 100 mass% of the total amount of the colored layer, from the viewpoint of imparting an appropriate antireflection capability to the display. The content of the colorant is, for example, 10 mass% or less, preferably 5 mass% or less, and more preferably 3 mass% or less. The content ratio may be appropriately set according to the type of the colorant, the color tone of the display, the light transmittance, and the like. The colorant may be added to the composition in the form of a solution or dispersion dissolved or dispersed in a suitable solvent.
The haze value (initial haze value) of the colored layer is not particularly limited, but is preferably 50% or less, more preferably 40% or less, further preferably 30% or less, and particularly preferably 20% or less from the viewpoint of ensuring the front luminance and the visibility of the display. In order to efficiently reduce the luminance unevenness of the display, the haze value of the colored layer is preferably 1% or more, more preferably 3% or more, still more preferably 5% or more, particularly preferably 8% or more, and may be 10% or more. The haze value is a value of a thickest portion of the colored layer in the display.
The total light transmittance of the colored layer is not particularly limited, but is preferably 40% or less, more preferably 30% or less, further preferably 25% or less, and particularly preferably 20% or less, from the viewpoint of further improving the function of preventing reflection of metal wiring or the like in the display. Further, from the viewpoint of ensuring the brightness of the display, the total light transmittance of the colored layer is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.5% or more, particularly preferably 2% or more, and may be 2.5% or more, or 3% or more. The total light transmittance is a value of the thickest portion of the colored layer in the display body.
The haze value and the total light transmittance of the colored layer are each a single-layer value, which can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, type of colorant, blending amount, and the like.
(non-colored layer)
The non-colored layer is a layer different from the colored layer, and is a layer that does not aim to prevent reflection of light by a metal wiring or the like provided on a substrate in a display. The non-colored layer may be a colorless layer or may be slightly colored. The non-colored layer may be, for example, a diffusion functional layer for the purpose of diffusing light, or may be a non-diffusion functional layer for the purpose of not diffusing light. The non-colored layer may be transparent or non-transparent. The non-colored layer is preferably a resin layer made of a resin.
The content ratio of the colorant in the non-colored layer is preferably less than 0.2 mass%, more preferably less than 0.1 mass%, still more preferably less than 0.05 mass%, and may be less than 0.01 mass% or less than 0.005 mass% relative to 100 mass% of the total non-colored layer.
The total light transmittance of the non-colored layer is not particularly limited, but is preferably 40% or more, more preferably 60% or more, still more preferably 70% or more, and particularly preferably 80% or more from the viewpoint of securing the brightness of the display. The upper limit of the total light transmittance of the non-colored layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is a value of the thickest part of the non-colored layer in the display body.
The total light transmittance of the non-colored layer is a single-layer value, which can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, and the like of the non-colored layer.
The diffusion functional layer is a layer for diffusing light. When the sealing resin layer has the diffusion functional layer, light emitted from the optical semiconductor element diffuses in the diffusion functional layer, and for example, light emitted from the side surface of the optical semiconductor element is released in the front direction of the display body, and the front luminance of the display body is improved. The diffusion functional layer is preferably a resin layer made of a resin. The diffusion functional layer is not limited, and preferably contains light diffusing fine particles. That is, the diffusion functional layer preferably contains light diffusing fine particles dispersed in a resin layer. The light diffusing fine particles may be used alone or in combination of two or more.
The light diffusing fine particles have an appropriate refractive index difference from the resin constituting the diffusion functional layer, and impart diffusion performance to the diffusion functional layer. Examples of the light diffusing fine particles include inorganic fine particles and polymer fine particles. Examples of the material of the inorganic fine particles include silica, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxide. Examples of the material of the polymer microparticles include silicone resins, acrylic resins (for example, a polymethacrylate resin such as polymethyl methacrylate), polystyrene resins, polyurethane resins, melamine resins, polyethylene resins, and epoxy resins.
The polymer fine particles are preferably fine particles made of silicone resin. The inorganic fine particles are preferably fine particles composed of a metal oxide. The metal oxide is preferably titanium oxide or barium titanate, more preferably titanium oxide. With such a structure, the diffusion functional layer is more excellent in light diffusibility and further suppressed in luminance unevenness.
The shape of the light diffusing fine particles is not particularly limited, and may be, for example, spherical, flat, or irregular.
The average particle diameter of the light diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, still more preferably 0.2 μm or more, and particularly preferably 0.25 μm or more, from the viewpoint of imparting an appropriate light diffusing property. In addition, the average particle diameter of the light diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, and even more preferably 8 μm or less, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image. The average particle diameter can be measured, for example, using a coulter counter.
The refractive index of the light diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, still more preferably 1.3 to 4, and particularly preferably 1.35 to 3.
From the viewpoint of reducing luminance unevenness of the display body more efficiently, the absolute value of the refractive index difference between the light-diffusing fine particles and the resin constituting the diffusion functional layer (the resin layer excluding the light-diffusing fine particles in the diffusion functional layer) is preferably 0.001 or more, more preferably 0.01 or more, still more preferably 0.02 or more, particularly preferably 0.03 or more, and also may be 0.04 or more, or 0.05 or more. In addition, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the absolute value of the refractive index difference between the light diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, and still more preferably 3 or less.
The content of the light diffusing fine particles in the diffusion functional layer is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, still more preferably 0.1 parts by mass or more, and particularly preferably 0.15 parts by mass or more, relative to 100 parts by mass of the resin constituting the diffusion functional layer, from the viewpoint of imparting an appropriate light diffusing property to the sealing resin layer. Further, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the content of the light diffusing fine particles is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, relative to 100 parts by mass of the resin constituting the diffusion functional layer.
The haze value (initial haze value) of the diffusion functional layer is not particularly limited, but is preferably 30% or more, more preferably 40% or more, further preferably 50% or more, particularly preferably 60% or more, and may be 70% or more, 80% or more, 90% or more, 95% or more, 97% or more, and further, the effect of improving the luminance unevenness of the haze value in the vicinity of 99.9% is more excellent, from the viewpoint of efficiently reducing the luminance unevenness. The upper limit of the haze value of the diffusion functional layer is not particularly limited, and may be 100%. The haze value is a value of the thickest portion of the diffusion functional layer in the display body.
The total light transmittance of the diffusion functional layer is not particularly limited, but is preferably 40% or more, more preferably 60% or more, still more preferably 70% or more, and particularly preferably 80% or more from the viewpoint of securing brightness. The upper limit of the total light transmittance of the diffusion functional layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is a value of the thickest portion of the diffusion functional layer in the display body.
The haze value and the total light transmittance of the diffusion functional layer are each a single-layer value, and can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, type of light diffusing fine particles, the amount of blending, and the like of the diffusion functional layer.
The haze value (initial haze value) of the non-diffusion functional layer is not particularly limited, but is preferably less than 30%, more preferably 10% or less, further preferably 5% or less, particularly preferably 1% or less, and may be 0.5% or less, from the viewpoint of making the brightness of the display excellent. The lower limit of the haze value of the non-diffusion functional layer is not particularly limited. The haze value is a value of the thickest portion of the non-diffusion functional layer in the display body.
The total light transmittance of the non-diffusion functional layer is not particularly limited, but is preferably 60% or more, more preferably 70% or more, still more preferably 80% or more, and particularly preferably 90% or more from the viewpoint of securing the luminance of the display. The upper limit of the total light transmittance of the non-diffusion functional layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The total light transmittance is a value of the thickest portion of the non-diffusion functional layer in the display body.
The haze value and the total light transmittance of the non-diffusion functional layer are each a single layer, and can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, and the like of the non-diffusion functional layer.
The content of the colorant and/or the light-diffusing fine particles in the non-diffusion functional layer is preferably less than 0.01 parts by mass, more preferably less than 0.005 parts by mass, relative to 100 parts by mass of the resin constituting the non-diffusion functional layer, from the viewpoint of making the display excellent in brightness.
(resin layer)
In the case where the colored layer and the non-colored layer are the resin layers, the resin constituting the resin layers may be any known or conventionally used resin, and examples thereof include acrylic resins, urethane acrylate resins, urethane resins, rubber resins, epoxy acrylate resins, oxetane resins, silicone acrylic resins, polyester resins, polyether resins (such as polyvinyl ether), polyamide resins, fluorine resins, vinyl acetate/vinyl chloride copolymers, and modified polyolefins. The resin may be used alone or in combination of two or more. The resins constituting the respective layers of the sealing resin layer may be the same or different from each other.
In the case where the resin layer is a layer having an adhesive property (adhesive layer), a known or conventional pressure-sensitive adhesive can be used as the resin. Examples of the adhesive include acrylic adhesives, rubber adhesives (natural rubber adhesives, synthetic rubber adhesives, and mixed systems thereof), silicone adhesives, polyester adhesives, urethane adhesives, polyether adhesives, polyamide adhesives, and fluorine adhesives. The binder may be used alone or in combination of two or more.
The resin layer may contain other components than the above components in the respective layers within a range that does not impair the effects of the present invention. Examples of the other components include a curing agent, a crosslinking accelerator, a tackifying resin (rosin derivative, polyterpene resin, petroleum resin, oil-soluble phenol, etc.), an oligomer, an anti-aging agent, a filler (metal powder, organic filler, inorganic filler, etc.), an antioxidant, a plasticizer, a softener, a surfactant, an antistatic agent, a surface lubricant, a leveling agent, a light stabilizer, an ultraviolet absorber, a polymerization inhibitor, a particulate matter, a foil-like matter, and the like. The other components may be used alone or in combination of two or more.
Examples of the laminated structure of the sealing resin layer include structures other than the structures shown in the drawings, that is, [ non-diffusion functional layer/coloring layer ], [ non-diffusion functional layer/coloring layer/diffusion functional layer ], [ non-diffusion functional layer/coloring layer ], [ diffusion functional layer/non-diffusion functional layer/coloring layer ], [ diffusion functional layer/coloring layer ] (which are provided in order from the optical semiconductor element side), and the like.
< base material portion >)
The display of the present invention may or may not include a base material portion. When the base material portion is provided on the front side of the sealing resin layer in the display body, the sealing resin layer surface can be made flat, and therefore diffuse reflection of light is less likely to occur, and the display body is improved in appearance both when the display body is turned off and when the display body emits light. Further, by forming an antiglare layer and an antireflection layer described later on the base material portion, antiglare property and antireflection property can be imparted to the display. Further, the support body serving as a sealing resin layer in the optical semiconductor element sealing sheet described later is provided with the base material portion, and thus the optical semiconductor element sealing sheet is excellent in handling properties.
The base material portion may be a single layer or may be a plurality of layers having the same composition or different thicknesses. When the base material portion is a plurality of layers, the layers may be bonded by other layers such as an adhesive layer. The base material layer used in the base material portion is a portion to be adhered together with the sealing resin layer to the substrate provided with the optical semiconductor element, and the release liner to be peeled off at the time of use (at the time of adhesion) of the optical semiconductor element sealing sheet and the surface protection film for protecting only the surface of the base material portion are not included in the "base material portion".
Examples of the substrate layer constituting the substrate portion include glass, a plastic substrate (particularly, a plastic film), and the like. Examples of the resin constituting the plastic base material include: polyolefin resins such as low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homo-polypropylene, polybutene, polymethylpentene, ionomer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cyclic olefin polymer, ethylene-butene copolymer, ethylene-hexene copolymer; polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, polybutylene terephthalate (PBT), and the like; a polycarbonate; polyimide resin; polyether ether ketone; a polyetherimide; polyamides such as aramid and wholly aromatic polyamide; polyphenylene sulfide; a fluororesin; polyvinyl chloride; polyvinylidene chloride; cellulose resins such as triacetyl cellulose (TAC); a silicone resin; acrylic resins such as polymethyl methacrylate (PMMA); polysulfone; polyarylate; polyvinyl acetate, and the like. The resin may be used alone or in combination of two or more. The base material layer may be various optical films such as an Antireflection (AR) film, a polarizing plate, and a retardation plate.
The thickness of the plastic film is preferably 20 to 300. Mu.m, more preferably 40 to 250. Mu.m. When the thickness is 20 μm or more, the supporting property and handling property of the optical semiconductor element sealing sheet are further improved. When the thickness is 300 μm or less, the display can be further thinned.
For the purpose of improving the adhesion to the sealing resin layer, the holding property, and the like, the surface of the substrate portion on the side provided with the sealing resin layer may be subjected to physical treatments such as corona discharge treatment, plasma treatment, blasting treatment, ozone exposure treatment, flame exposure treatment, high-voltage shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; surface treatment such as easy adhesion treatment by a coating agent (primer). The surface treatment for improving the adhesion is preferably performed on the entire surface of the base material portion on the sealing resin layer side.
The thickness of the base material portion is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of excellent functions as a support and scratch resistance of the surface. The thickness of the base material portion is preferably 300 μm or less, more preferably 250 μm or less, from the viewpoint of further excellent transparency.
< display body >)
The display may have a layer having antiglare property and/or antireflection property. With such a structure, the gloss and reflection of light of the display can be suppressed, and the appearance can be improved. Examples of the antiglare layer include an antiglare layer. The antireflective layer may be an antireflective layer. The antiglare treatment and the antireflection treatment can be carried out by known or conventional methods, respectively. The antiglare layer and the antireflection layer may be the same layer or may be different layers. The antiglare and/or antireflection layer may be provided in one layer or two or more layers.
The haze value (initial haze value) of the sealing resin layer or the laminate having both end surfaces of the sealing resin layer and the base material portion is not particularly limited, but is preferably 80% or more, more preferably 85% or more, still more preferably 90% or more, and particularly preferably 95% or more, from the viewpoint of making the effect of suppressing luminance unevenness and the appearance more excellent. The upper limit of the haze value is not particularly limited.
The total light transmittance of the sealing resin layer or the laminate having the sealing resin layer and the base material portion at both end surfaces is not particularly limited, but is preferably 40% or less, more preferably 30% or less, and even more preferably 20% or less, from the viewpoint of further improving the function of preventing reflection of metal wiring or the like and the contrast. From the viewpoint of securing brightness, the total light transmittance is preferably 0.5% or more.
The haze value and the total light transmittance can be measured by the methods defined in JIS K7136 and JIS K7361-1, respectively, and can be controlled by the lamination order, type, thickness, and the like of the layers constituting the sealing resin layer and the base material portion.
The thickness of the sealing resin layer or the laminate having both end surfaces of the sealing resin layer and the base material portion is preferably 10 to 600 μm, more preferably 20 to 550 μm, still more preferably 30 to 500 μm, still more preferably 40 to 450 μm, and particularly preferably 50 to 400 μm, from the viewpoints of improving the function of preventing reflection of metal wiring or the like, improving contrast, and reducing color shift more efficiently. In addition, the release liner is not included in the above thickness.
The display of the present invention preferably includes a self-luminous display device. The self-luminous display device can be combined with a display panel as needed to form a display body as an image display device. The optical semiconductor element in this case is an LED element. Examples of the self-luminous display device include an LED display, a backlight, and an organic electroluminescence (organic EL) display device. The backlight is particularly preferably a full-surface direct type backlight. The backlight includes, for example, a laminate including the substrate and a plurality of optical semiconductor elements disposed on the substrate as at least a part of a constituent member. For example, in the self-luminous display device, a metal wiring layer for transmitting a light emission control signal to each LED element is laminated on the substrate. The LED elements that emit light of red (R), green (G), and blue (B) are alternately arranged on the substrate with a metal wiring layer interposed therebetween. The metal wiring layer is made of a metal such as copper, and displays each color by adjusting the light emission degree of each LED element.
The display body of the present invention is a bendable display body, and may be, for example, a bendable image display device (flexible display) (particularly, a foldable image display device (foldable display)). Specifically, a display having a foldable backlight, a display having a foldable self-luminous display device, and the like are exemplified.
In the display of the present invention, the sealing resin layer has excellent followability and landfill property of the optical semiconductor element, and therefore the optical semiconductor element may be a mini LED element or a micro LED element.
According to the display of the present invention, uneven brightness and high brightness of light emitted from the light semiconductor element are less likely to occur. Therefore, the display is less likely to be color-shifted and can be visually recognized in the same color tone from a large visual field. The display is bright and beautiful without increasing power consumption. Further, according to the display of the present invention, reflection of light by a metal wiring or the like on a substrate can be suppressed, and the appearance of the optical semiconductor element is good when the optical semiconductor element is not lighted.
[ method for manufacturing display body ]
The display of the present invention can be manufactured by bonding an optical semiconductor element sealing sheet having a sealing resin layer to a substrate on which an optical semiconductor element is arranged, and sealing the optical semiconductor element with the sealing resin layer.
(sheet for sealing optical semiconductor element)
The optical semiconductor element sealing sheet is a sheet for sealing a plurality of optical semiconductor elements arranged on a substrate. The optical semiconductor element sealing sheet is a sheet capable of satisfying the above formula (1) when the sealing resin layer is used to seal the plurality of optical semiconductor elements to form the sealing resin layer. According to the optical semiconductor element sealing sheet of the present invention, by sealing the optical semiconductor element, a display body having high luminance and less likely to cause luminance unevenness can be provided.
The optical semiconductor element sealing sheet includes at least a sealing resin layer including a colored layer and a non-colored layer. The sealing resin layer is a layer capable of forming the sealing resin layer in the display of the present invention. Specifically, the colored layer in the sealing resin layer is a layer capable of forming the colored layer in the display of the present invention, and the non-colored layer in the sealing resin layer is a layer capable of forming the non-colored layer in the display of the present invention. Specifically, the colored layer in the sealing resin layer may be a layer having the same composition (constituent components and blending ratio thereof) and physical properties (haze, total light transmittance, etc.) as the colored layer in the display of the present invention, or may be a layer which becomes the colored layer in the display of the present invention by curing. The non-colored layer in the sealing resin layer may be a layer having the same composition (constituent components and blending ratio thereof) and physical properties (haze, total light transmittance, etc.) as the non-colored layer in the display of the present invention, or may be a layer which becomes the non-colored layer in the display of the present invention by curing.
The sealing resin layer is appropriately designed according to the structure of the sealing resin layer in the display of the present invention. For example, in the case where the display of the present invention includes the diffusion functional layer, the sealing resin layer in the optical semiconductor element sealing sheet includes the diffusion functional layer. The diffusion functional layer in the sealing resin layer may be a layer having the same composition (constituent components and their blending ratio) and physical properties (haze, total light transmittance, etc.) as the diffusion functional layer in the display of the present invention, or may be a layer which becomes the diffusion functional layer in the display of the present invention by curing. The sealing resin layer preferably includes the diffusion functional layer, the colored layer, and the non-colored layer in this order.
Each of the layers (the colored layer and the non-colored layer) constituting the sealing resin layer may or may not have an adhesive property and/or an adhesive property, independently. Among them, adhesion and/or adhesiveness are preferable. With such a structure, the sealing resin layer can be easily bonded to the substrate and the optical semiconductor element, and the sealing property of the optical semiconductor element is further improved because the adhesion between the layers is excellent. In particular, it is preferable that at least the layer in contact with the optical semiconductor element has adhesion and/or adhesiveness. With such a structure, the sealing resin layer is excellent in following property and landfill property with respect to the optical semiconductor element. As a result, the optical semiconductor device has excellent appearance even when the difference in height due to the optical semiconductor device is large.
Each of the layers (the colored layer and the non-colored layer) constituting the sealing resin layer may be a resin layer (radiation curable resin layer) having a property of being cured by radiation irradiation, or may be a resin layer (non-radiation curable resin layer) not having a property of being cured by radiation irradiation. Examples of the radiation include electron beam, ultraviolet ray, α ray, β ray, γ ray, and X ray. In the case where the colored layer is a radiation curable resin layer, the colorant that the colored layer can contain is preferably a colorant that absorbs visible light and has a transmittance of light having a wavelength at which the radiation curable resin layer can be cured.
The optical semiconductor element sealing sheet may further include the base material portion. In the case of the substrate portion, the sealing resin layer may be provided on at least one surface of the substrate portion. The surface of the sealing resin layer that contacts the base material portion is a surface opposite to the side of the sealing resin layer that contacts the optical semiconductor element. When the optical semiconductor element sealing sheet includes the base material portion, the optical semiconductor element sealing sheet is bonded to the optical semiconductor element and the substrate together with the base material portion, and the base material portion in the optical semiconductor element sealing sheet serves as the base material portion in the display body of the present invention.
The sealing resin layer may be formed on a release treated surface of a release liner. When the optical semiconductor element sealing sheet is formed on the release liner, the side of the sealing resin layer in contact with the optical semiconductor element is the side in contact with the release liner. In the case where the base material portion is not provided, both surfaces of the sealing resin layer may be the sides in contact with the release liner. The release liner is used as a protective material for the optical semiconductor element sealing sheet, and is peeled off when sealing an optical semiconductor element. In addition, the base material portion and the release liner may not be provided.
The release liner is a component for protecting the surface of the optical semiconductor element sealing sheet, and is peeled off from the optical semiconductor element sealing sheet when the sheet is bonded to a substrate on which the optical semiconductor element is disposed.
Examples of the release liner include polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, plastic film surface-coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent, and papers.
The thickness of the release liner is, for example, 10 to 200. Mu.m, preferably 15 to 150. Mu.m, more preferably 20 to 100. Mu.m. When the thickness is 10 μm or more, breakage due to slitting is less likely to occur during processing of the release liner. When the thickness is 200 μm or less, the release liner is more easily peeled from the optical semiconductor element sealing sheet at the time of use.
An embodiment of the optical semiconductor element sealing sheet will be described with reference to fig. 9. Fig. 9 is a cross-sectional view of the optical semiconductor element sealing sheet capable of forming the display body shown in fig. 2. As shown in fig. 9, the optical semiconductor element sealing sheet 10 can be used for sealing 1 or more optical semiconductor elements arranged on a substrate, and includes a base material portion 5 and a sealing resin layer 7 formed on the base material portion 5. The sealing resin layer 7 is formed of a laminate of a colored layer 71 and a non-colored layer 72. The colored layer 71 and the non-colored layer 72 each have adhesion and are directly laminated to each other. A release liner 6 is attached to the surface of the colored layer 71 of the sealing resin layer 7, and a base material portion 5 is attached to the surface of the non-colored layer 72.
(sealing Process)
The method for manufacturing the display of the present invention using the optical semiconductor element sealing sheet includes the following sealing steps: the optical semiconductor element sealing sheet is bonded to a substrate on which the optical semiconductor element is disposed, and the optical semiconductor element is sealed with a sealing resin layer. Specifically, in the sealing step, the release liner is peeled from the optical semiconductor element sealing sheet to expose the sealing resin layer. Then, when the laminate is provided with a plurality of optical semiconductor elements, the sealing resin layer is disposed so that the sealing resin layer fills gaps between the plurality of optical semiconductor elements, and the plurality of optical semiconductor elements are sealed together. Specifically, as shown in fig. 10, the colored layer 71 of the optical semiconductor element sealing sheet 10 from which the release liner 6 is peeled is disposed so as to face the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are disposed, the optical semiconductor element sealing sheet 10 is bonded to the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are disposed, and the optical semiconductor elements 3a to 3c are embedded in the sealing resin layer 7.
The temperature at the time of bonding is, for example, in the range of room temperature to 110 ℃. In addition, the pressure may be reduced or increased during the bonding. By the pressure reduction and the pressure increase, formation of a void between the sealing resin layer and the substrate or the optical semiconductor element can be suppressed. In the sealing step, it is preferable that the optical semiconductor element sealing sheet is bonded under reduced pressure and then pressurized. The pressure at the time of depressurization is, for example, 1 to 100Pa, and the depressurization time is, for example, 5 to 600 seconds. The pressure at the time of pressurization is, for example, 0.05 to 0.5MPa, and the pressurization time is, for example, 5 to 600 seconds.
By appropriately setting the thickness of the colored layer in the sealing resin layer, the temperature and pressure at the time of bonding, and the like, the following property of the colored layer in the obtained display body to the optical semiconductor element, and the thickness of the colored layer in each region of the concave and convex portions in the concave-convex shape can be adjusted. This can make the obtained display body satisfy the above expression (1).
(radiation irradiation step)
When the sealing resin layer includes a radiation curable resin layer, the manufacturing method may further include a radiation irradiation step of: and irradiating a laminate including the substrate, the optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element with radiation, and curing the radiation-curable resin layer to form a cured layer. Examples of the radiation include electron beam, ultraviolet ray, α ray, β ray, γ ray, and X ray as described above. Among them, ultraviolet rays are preferable. The temperature at the time of irradiation with the radiation is, for example, in the range of room temperature to 100℃and the irradiation time is, for example, 1 minute to 1 hour.
(cutting step)
The above manufacturing method may further include the following dicing step: cutting a laminate including the substrate, the optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element. As the laminate, a laminate subjected to the radiation irradiation step may be cut. When the laminate includes a cured product layer obtained by curing the radiation-curable resin layer by irradiation with the radiation, the cured product layer of the optical semiconductor element sealing sheet and the side end portion of the substrate are cut and removed in the dicing step. This makes it possible to expose the surface of the cured product layer, which is sufficiently cured and has low adhesion, on the side surface. The cutting can be performed by a known or conventional method, for example, by a method using a cutting blade or by irradiation with a laser.
(tiling step)
The above manufacturing method may further include a tiling step of: the plurality of display bodies obtained in the dicing step are arranged so as to be in contact with each other in the planar direction. In the tiling step, the plurality of laminated bodies obtained in the dicing step are aligned so as to be in contact with each other in the planar direction, and are tiled. In this way, 1 large display can be manufactured.
The display body of the present invention can be manufactured by operating as described above. In the optical semiconductor element sealing sheet 10, when the sealing resin layer 7 does not have a radiation-curable resin layer, the sealing resin layer 7 becomes the sealing resin layer 4 in the display 1. On the other hand, in the optical semiconductor element sealing sheet 10, when the sealing resin layer 7 has a radiation curable resin layer, for example, in the case where the non-colored layer 72 is a radiation curable resin layer, the non-colored layer 72 is cured to form the non-colored layer 42, thereby forming the sealing resin layer 4.
Claims (10)
1. A display body comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer sealing the plurality of optical semiconductor elements,
the sealing resin layer includes a coloring layer and a non-coloring layer,
an end T of the first optical semiconductor element from the surface of the substrate to the front side of the gravity center A The distance to the point is L A ，
An end portion T on the front side of the colored layer on a vertical line with respect to the surface of the substrate from the surface of the substrate to a midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element within the same pixel C The distance to the point is L C ，
Will pass through the end T A Is perpendicular to the surface of the substrate and passes through the end T C The distance between the vertical line relative to the surface of the substrate is L A－C ，
Will be from the end T A Toward through the end T C An angle of elevation angle of the substrate with respect to a perpendicular line to the surface of the substrate is set to θ°,
at this time, the following expression (1) is satisfied,
L C ≤L A +L A－C tanθ (1)。
2. the display body according to claim 1, wherein,
the sealing resin layer includes the colored layer and the non-colored layer in this order from the optical semiconductor element side.
3. The display body according to claim 1, wherein,
the sealing resin layer includes a diffusion functional layer.
4. The display body according to claim 3, wherein,
the sealing resin layer includes the diffusion functional layer, the colored layer, and the non-colored layer in this order from the optical semiconductor element side.
5. The display body according to any one of claims 1 to 4, wherein,
the display body is provided with a self-luminous display device.
6. The display body according to any one of claims 1 to 4, wherein,
the display body is an image display device.
7. The display body according to any one of claims 1 to 5, wherein,
The height of the optical semiconductor element on the substrate is 500 μm or less.
8. A sheet for sealing an optical semiconductor element, which is used for sealing a plurality of optical semiconductor elements arranged on a substrate, wherein,
the sheet comprises a sealing resin layer comprising a colored layer and a non-colored layer,
when the plurality of optical semiconductor elements are sealed with the sealing resin layer to form a sealing resin layer,
an end T of the first optical semiconductor element from the surface of the substrate to the front side of the gravity center A The distance to the point is L A ，
An end portion T on the front side of the colored layer on a vertical line with respect to the surface of the substrate from the surface of the substrate to a midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element within the same pixel C The distance to the point is L C ，
Will pass through the end T A Is perpendicular to the surface of the substrate and passes through the end T C The distance between the vertical line relative to the surface of the substrate is L A－C ，
Will be from the end T A Toward through the end T C An angle of elevation angle of the substrate with respect to a perpendicular line to the surface of the substrate is set to θ°,
At this time, the following expression (1) is satisfied,
L C ≤L A +L A－C tanθ (1)。
9. the sheet for sealing an optical semiconductor element according to claim 8, wherein,
the sealing resin layer includes a diffusion functional layer.
10. The sheet for sealing an optical semiconductor element according to claim 9, wherein,
the sealing resin layer includes the diffusion functional layer, the colored layer, and the non-colored layer in this order.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022049424A JP2023142484A (en) | 2022-03-25 | 2022-03-25 | Display body and sheet for sealing optical semiconductor element |
| JP2022-049424 | 2022-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116805640A true CN116805640A (en) | 2023-09-26 |
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ID=88078935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310287798.1A Pending CN116805640A (en) | 2022-03-25 | 2023-03-23 | Display and optical semiconductor element sealing sheet |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2023142484A (en) |
| KR (1) | KR20230139323A (en) |
| CN (1) | CN116805640A (en) |
| TW (1) | TW202404131A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6906560B2 (en) | 2019-04-03 | 2021-07-21 | リンテック株式会社 | Adhesive sheet and display |
-
2022
- 2022-03-25 JP JP2022049424A patent/JP2023142484A/en active Pending
-
2023
- 2023-03-21 KR KR1020230036351A patent/KR20230139323A/en unknown
- 2023-03-22 TW TW112110663A patent/TW202404131A/en unknown
- 2023-03-23 CN CN202310287798.1A patent/CN116805640A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023142484A (en) | 2023-10-05 |
| TW202404131A (en) | 2024-01-16 |
| KR20230139323A (en) | 2023-10-05 |
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