TW202404131A - Display body and sheet for optical semiconductor device encapsulation - Google Patents

Abstract

The invention provides a display body which is not easy to generate uneven brightness and has high brightness. The display body includes a substrate, a plurality of optical semiconductor elements disposed on the substrate, and a sealing resin layer sealing the plurality of optical semiconductor elements. The sealing resin layer includes a colored layer and a non-colored layer. LA is the distance from the surface of the substrate to an end TA on the front surface side of the center of gravity of the optical semiconductor element; lC is the distance from the surface of the substrate to an end TC on the front surface side of the colored layer on a perpendicular line with respect to the surface of the substrate, the end TC passing through the midpoint between the center of gravity of the optical semiconductor element and the center of gravity of an optical semiconductor element adjacent to the optical semiconductor element in the same pixel; the display body satisfies the following formula (1): LC ≤ LA + LA-Ctan [Theta] (1), where LA-C is the distance from a perpendicular line with respect to the substrate surface passing through the end TA to a perpendicular line with respect to the substrate surface passing through the end TC, and [Theta] DEG is the angle of the elevation angle when viewed from the end toward the perpendicular line.

Description

Sheet for sealing displays and optical semiconductor elements

The present invention relates to a display body and a sheet for sealing optical semiconductor elements. More specifically, the present invention relates to, for example, a display body formed by sealing an optical semiconductor element of a self-luminous display device, and a sheet suitable for sealing the optical semiconductor element.

In recent years, as next-generation display devices, self-luminous display devices, represented by mini/micro LED displays (Mini/Micro Light Emitting Diode Displays), have been invented. The basic structure of a mini/micro LED display device is to use a substrate with a large number of tiny optical semiconductor elements (LED chips) arranged at a high density as a display panel, seal the optical semiconductor elements with a sealing material, and laminated with resin on the outermost surface Covering components such as membrane or glass plate.

In a display body including a self-luminous display device such as a mini/micro LED display device, wiring (metal wiring) of metal and metal oxides such as ITO (Indium Tin Oxides) is arranged on a substrate serving as a display panel. This type of display device has a problem that, for example, the off-light light is reflected by the metal wiring and the like, resulting in poor aesthetics of the screen and poor design. Therefore, a technology for using an anti-reflection layer to prevent reflection from metal wiring is adopted as a sealing material for sealing optical semiconductor elements.

In addition, a display using a self-luminous display device has a problem of uneven brightness (brightness unevenness) caused by the light source of the optical semiconductor element. If uneven brightness occurs, a "color shift" phenomenon will occur, that is, the color will change when viewed from the front of the monitor and when viewed from an oblique field of view.

As an adhesive sheet that can suppress brightness unevenness, Patent Document 1 discloses an adhesive sheet that is a laminate of a colored adhesive layer and a colorless adhesive layer, and is arranged so that the colorless adhesive layer is in contact with an optical semiconductor element. . As can be seen from the description, when the above-mentioned adhesive sheet comes into contact with the concave and convex shapes formed by the substrate and the optical semiconductor element provided on the substrate and follows the concave and convex shapes, the colorless adhesive layer comes into contact with the concavities and convexities, thereby forming a colorless adhesive layer. The unevenness of the adhesive layer is absorbed to a certain extent, so the compression or deformation of the colored adhesive layer is suppressed, thereby suppressing uneven transmittance of the adhesive layer and thus suppressing uneven brightness. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2020-169262

[Problem to be solved by the invention]

However, although the adhesive sheet with the colored adhesive layer can be expected to prevent reflection caused by metal wiring or suppress uneven brightness after sealing the optical semiconductor element, it will prevent the light emitted by the optical semiconductor element from transmitting in the oblique direction of the front. , as a result, there is a problem that the front brightness of the display body decreases. If the front brightness decreases, power consumption will increase in order to increase the brightness. Therefore, a display body that is less prone to brightness unevenness and has higher brightness is required.

The present invention was developed in view of the above-mentioned facts, and its purpose is to provide a display that is less prone to uneven brightness and has higher brightness. Furthermore, another object of the present invention is to provide a semiconductor element sealing sheet that can produce a display with high brightness that is less prone to brightness unevenness by sealing optical semiconductor elements. [Technical means to solve problems]

The inventors of the present invention conducted intensive research to achieve the above object and found that if a display has a structure in which a plurality of optical semiconductor elements are arranged on a substrate through a sealing resin layer including a colored layer and a non-colored layer In the sealed state, the height of the front-side end of the coloring layer in the center between the two closest optical semiconductor elements is less than a certain height relative to the height of the front-side end of the optical semiconductor element; it is not easy to Uneven brightness occurs and the brightness is high. The present invention was completed based on these findings.

That is, the present invention provides a display including a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements, and the sealing resin layer includes a colored layer and a non-colored layer. Layer, let the distance from the surface of the above-mentioned substrate to the end _TA on the front side of the center of gravity of the first optical semiconductor element be L _A , The distance between the ends _TC is L _C , and the above-mentioned vertical line passes through the midpoint of the center of gravity of the above-mentioned first optical semiconductor element and the center of gravity of the second optical semiconductor element adjacent to the above-mentioned first optical semiconductor element in the same pixel, Let the distance from a perpendicular line passing through the end _TA and relative to the surface of the substrate to a _{perpendicular} line passing through the end _TC and relative to the surface of the substrate be L _AC . _C and when the angle of elevation relative to the vertical line of the substrate surface is θ°, the following equation (1) is satisfied: L _C ≦L _A + L _AC tanθ (1).

In the above display body, the sealing resin layer that seals the optical semiconductor element includes the colored layer, thereby preventing reflection of light caused by metal wiring and the like provided on the substrate. Furthermore, the distance L _C , which is the height of the front-side end of the coloring layer in the center between the closest optical semiconductor elements, is higher L _AC tanθ than the distance L _A which is the height of the front-side end of the center of gravity of the optical semiconductor element. Below the position, the above distance L _C can be made sufficiently low corresponding to the distance between the optical semiconductor elements, so that the above colored layer will not easily prevent the light emitted by the optical semiconductor elements from transmitting in the oblique direction of the front, so that the light can be spread over a sufficiently wide area The visual field is transmitted through, which can improve the front brightness of the display.

The sealing resin layer preferably includes the colored layer and the non-colored layer in order from the optical semiconductor element side. By having this structure, even if the colored layer has an uneven shape, the surface of the colored layer can be prevented from being exposed to the surface of the sealing resin layer on the front side (the side opposite to the optical semiconductor element), and the surface of the sealing resin layer on the front side can be prevented from being exposed. It is easy to become a flat surface, so that diffuse reflection of external light is less likely to occur, and the aesthetics of the display body is improved both when it is turned off and when it is illuminated.

The sealing resin layer preferably includes a diffusion functional layer. By having such a structure, the light emitted by the optical semiconductor element can be diffused in the diffusion functional layer, thereby further improving the front brightness.

The sealing resin layer preferably includes the diffusion functional layer, the colored layer and the non-colored layer in order from the optical semiconductor element side. By having such a structure, the front brightness can be further improved, and the aesthetics of the display body can be further improved both when it is turned off and when it is lit.

The display body preferably includes a self-luminous display device.

The above-mentioned display body is preferably an image display device.

In the above-mentioned display, the height of the above-mentioned optical semiconductor element on the above-mentioned substrate is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer has more excellent ability to follow the uneven shape.

Furthermore, the present invention provides a sheet for sealing optical semiconductor elements, which is a sheet for sealing a plurality of optical semiconductor elements arranged on a substrate, and the sheet is provided with a sealing resin including a colored layer and a non-colored layer. layer, after sealing the plurality of optical semiconductor elements with the sealing resin layer to form the sealing resin layer, let the distance from the surface of the substrate to the end _TA on the front side of the center of gravity of the first optical semiconductor element be L _A. Let L _C be the distance from the surface of the substrate to the end _TC on the front side of the colored layer with respect to a perpendicular line to the surface of the substrate, which passes through the sum of the center of gravity of the first optical semiconductor element and the above-mentioned third optical semiconductor element. The midpoint of the center of gravity of an optical semiconductor element of an adjacent second optical semiconductor element in the same pixel is from a vertical line passing through the end _TA and relative to the substrate surface to a vertical line passing through the end _TC and relative to the substrate surface. When the distance from the perpendicular line is L _AC and the angle of elevation from the end _TA to the vertical line passing through the end _TC and looking upward with respect to the substrate surface is θ°, the following formula (1) can be satisfied : L _C ≦L _A +L _AC tanθ (1).

The sealing resin layer preferably includes a diffusion functional layer.

The sealing resin layer preferably includes the diffusion functional layer, the colored layer, and the non-colored layer in this order. [Effects of the invention]

According to the display of the present invention, uneven brightness caused by the light emitted by the optical semiconductor element is less likely to occur, and the brightness is higher. Therefore, the above-mentioned display body can be viewed with the same color from a wide viewing angle in which color shift is unlikely to occur. In addition, the above-mentioned display body is bright and has good aesthetics even if the power consumption is not increased. Furthermore, according to the optical semiconductor element sealing sheet of the present invention, by sealing the optical semiconductor element, it is possible to provide a display body that is less prone to uneven brightness and has higher brightness.

[display body] The display of the present invention at least includes a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements. The above display system is a device used to display information through light emitted by optical semiconductor elements.

Examples of the optical semiconductor element include light-emitting diodes (LEDs) such as blue light-emitting diodes, green light-emitting diodes, red light-emitting diodes, and ultraviolet light-emitting diodes.

On the above-mentioned substrate, the plurality of optical semiconductor elements are arranged in one pixel, and a plurality of the above-mentioned pixels are arranged. That is, a plurality of the plurality of optical semiconductor elements are arranged in each pixel including the plurality of optical semiconductor elements. FIG. 1 shows a partial top view of an optical component in which a plurality of optical semiconductor elements are arranged in each pixel on a substrate. In the optical member 11 shown in FIG. 1 , three optical semiconductor elements 3 a to 3 c are arranged in close proximity on the substrate 2 , and one pixel (pixel 3 ) is formed by the three optical semiconductor elements 3 a to 3 c. Furthermore, three optical semiconductor elements 3d to 3f are arranged in close proximity on the substrate 2, and one pixel (pixel 3') is formed from the three optical semiconductor elements 3d to 3f. Furthermore, a plurality of pixels are arranged on the substrate 2 according to the pixel 3, the pixel 3', and the like.

The display body of the present invention has an uneven shape, with the surface of the substrate in the area where the optical semiconductor element is not arranged between the two closest optical semiconductor elements being the concave part, and the optical semiconductor element being the convex part. The substrate and the optical semiconductor Component formation.

The height of the optical semiconductor element on the above-mentioned substrate (the height from the surface of the substrate to the end of the front side of the optical semiconductor element. Equivalent to the following L _A ) is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer has more excellent ability to follow the uneven shape.

The sealing resin layer is preferably in contact with the plurality of optical semiconductor elements and follows the uneven shape. Furthermore, the sealing resin layer preferably seals the plurality of optical semiconductor elements at once. In addition, in this specification, "sealing the optical semiconductor element" means embedding at least part of the optical semiconductor element in the sealing resin layer, or covering it by following the sealing resin layer.

The sealing resin layer includes at least a colored layer and a non-colored layer. In the sealing resin layer, the colored layer and the non-colored layer may be directly laminated, or may be laminated via another layer. The sealing resin layer can seal the optical semiconductor element such that the colored layer side becomes the optical semiconductor element side, and can also seal the optical semiconductor element such that the non-colored layer side becomes the optical semiconductor element side.

Let any one of the plurality of optical semiconductor elements described above be a first optical semiconductor element. The optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is set as the second optical semiconductor element. Let the distance from the surface of the substrate to the end _TA on the front side of the center of gravity of the first optical semiconductor element be L _A . Let L _C be the distance from the surface of the substrate to the end _TC on the front side of the colored layer with respect to a perpendicular line passing through the center of gravity of the first optical semiconductor element and the second optical semiconductor element on the surface of the substrate. The center point of the component. Let the distance from a perpendicular line passing through the end _TA and relative to the substrate surface to a perpendicular line passing through the end _TC and relative to the substrate surface be L _AC . Furthermore, let the angle of elevation from the end _TA to the vertical line passing through the end _TC and looking upward with respect to the surface of the substrate be θ°. At this time, the display body of the present invention satisfies the following formula (1): L _C ≦L _A + L _AC tanθ (1).

In the above display body, the sealing resin layer that seals the optical semiconductor element includes the colored layer, thereby preventing reflection of light caused by metal wiring and the like provided on the substrate. Furthermore, the distance L _C , which is the height of the front-side end of the coloring layer in the center between the closest optical semiconductor elements, is higher L _AC tanθ than the distance L _A which is the height of the front-side end of the center of gravity of the optical semiconductor element. Below the position, the above distance L _C can be made sufficiently low corresponding to the distance between the optical semiconductor elements, so that the above colored layer will not easily prevent the light emitted by the optical semiconductor elements from transmitting in the oblique direction of the front, so that the light can be spread over a sufficiently wide area The visual field is transmitted through, which can improve the front brightness of the display.

In addition, in this specification, the so-called "front" refers to the side of the visual display body, for example, the upward direction in FIG. 2 below.

(first embodiment) The display body of the present invention will be described using the display body shown in FIG. 2 as one embodiment. The display 1 shown in FIG. 2 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, a sealing resin layer 4 that seals the optical semiconductor elements 3a to 3c at once, and a sealing resin layer 4 bonded to the sealing element 3a to 3c. The base material portion 5 of the surface of the resin layer 4 is opposite to the side of the optical semiconductor elements 3a to 3c. FIG. 2 is an enlarged view of a vertical cross-section that passes through the center of gravity of the optical semiconductor elements 3 a to 3 c and is perpendicular to the substrate 2 .

The optical semiconductor elements 3a to 3c are all fixed on one substrate 2 via a support 31. The display body 1 has an uneven shape, with the surface of the substrate 2 in the area where the optical semiconductor elements are not arranged between the optical semiconductor elements 3a to 3c being the concave portion N, and the optical semiconductor elements 3a to 3c being the convex portion P, and the substrate 2 and optical semiconductor elements 3a to 3c are formed.

The optical semiconductor elements 3a to 3c in FIG. 2 are the optical semiconductor elements 3a to 3c shown in FIG. 1, and the optical semiconductor elements 3a to 3c are located in the same pixel 3. For example, the optical semiconductor element 3a is a first optical semiconductor element, and the optical semiconductor element 3b is a second optical semiconductor element adjacent to the optical semiconductor element 3a.

As shown in FIG. 2 , the sealing resin layer 4 comes into contact with the plurality of optical semiconductor elements 3a to 3c and follows the uneven shape, thereby sealing the plurality of optical semiconductor elements 3a to 3c at once.

The sealing resin layer 4 is composed of a colored layer 41 and a non-colored layer 42 directly laminated, and seals the optical semiconductor elements 3a to 3c so that the colored layer 41 side becomes the optical semiconductor element 3a to 3c side. The colored layer 41 in contact with the optical semiconductor elements 3a to 3c follows the above-mentioned uneven shape, so that in the display body 1, the colored layer 41 also has an uneven shape. On the other hand, one side of the non-colored layer 42 follows the uneven shape of the colored layer 41 and has an uneven shape opposite to the uneven shape of the colored layer 41, and the other side is a plane (flat surface). Furthermore, the non-colored layer 42 may be a diffusion functional layer described below or a non-diffusion functional layer.

That is, the sealing resin layer 4 includes the colored layer 41 and the non-colored layer 42 in order from the optical semiconductor element side 3a to 3c. Furthermore, the sealing resin layer 4 seals the optical semiconductor elements 3a to 3c so that the colored layer 41 comes into contact with the optical semiconductor elements 3a to 3c.

FIG. 3 shows a partial enlarged view of the vicinity between the optical semiconductor elements 3 a and 3 b of the display 1 shown in FIG. 2 . As shown in FIG. 3 , in the display 1 , the distance from the surface of the substrate 2 to the end _TA on the front side of the center of gravity GA of the optical semiconductor element 3 a is _{L A .} L _A corresponds to the height of the optical semiconductor element 3a. The end TA is an intersection point of a perpendicular line _PA passing through the center of gravity _{G A} with respect to the surface of the substrate 2 and the front side surface of the optical semiconductor element 3a. Let C be the midpoint between the center of gravity GA of the optical semiconductor element _3a and the center of gravity _GB of the optical semiconductor element 3b. Let the perpendicular line passing through the midpoint C and relative to the surface of the substrate 2 be the perpendicular line _PC . Let the distance _{TC from the end TC on} the front side of the colored layer 41 of the vertical line PC be _LC . The end _TC is the intersection point of the vertical line _PC and the front side interface of the colored layer 41, which is equivalent to the height from the surface of the substrate 2 at the midpoint C to the front side interface of the colored layer 41. The end T _C can be located on the side of the substrate 2 relative to the midpoint C (the lower side in the figure), or it can be located on the front side (the upper side in the figure). Let the distance from the vertical line P _A to the vertical line _PC be L _AC . The vertical line P _A is parallel to the vertical line _PC . Furthermore, when the angle of elevation viewed from the end _TA toward the vertical line P _C is θ°, the display body 1 satisfies the above formula (1). In Fig. 3, T is used to represent a point on the vertical line _PC located at a height L _A + L _AC tanθ from the surface of the substrate 2.

In the display body 1 , the sealing resin layer 4 that seals the optical semiconductor elements 3 a to 3 c includes the colored layer 41 , thereby suppressing reflection of light caused by metal wiring and the like on the substrate 2 . Furthermore, the height, that is, the distance L _C of the front-side end T _C of the colored layer 41 in the center between the closest optical semiconductor elements 3 a and 3 b is smaller than the front-side end T C of the center of gravity G _A of the optical semiconductor element 3 a The height of _A is equal to or lower than the position where L _A is higher than L _AC tanθ, so that the distance L _C can be sufficiently low corresponding to the distance between the optical semiconductor elements 3a and 3b, so that the colored layer 41 will not easily interfere with the light emitted by the optical semiconductor element 3a. The light is transmitted in the upper oblique direction (ie, the front oblique direction), so that the light can be transmitted in a sufficiently wide field of view, and the front brightness of the display 1 can be improved.

Furthermore, FIG. 3 illustrates the case where the optical semiconductor element 3a located at one end of the pixel satisfies the above formula (1). However, in addition to or instead of this case, the optical semiconductor element 3a may be The optical semiconductor element located inside the pixel such as the element 3b is a first optical semiconductor element, and the optical semiconductor element 3a and/or the optical semiconductor element 3c adjacent to the optical semiconductor element inside the pixel is a second optical semiconductor element. In the case of an element that satisfies the above formula (1), it is also possible to set the optical semiconductor element 3c and the like located at the other end of the pixel as the first optical semiconductor element, and to combine the optical semiconductor element 3b and the like located at the other end of the pixel. When the optical semiconductor element adjacent to the optical semiconductor element at the other end is the second optical semiconductor element, the above formula (1) is satisfied.

In addition, for all optical semiconductor elements located in the same pixel, it is preferable that the relationship between each optical semiconductor element and the closest optical semiconductor element satisfies the above formula (1). In this case, the colored layer 41 is less likely to prevent the light emitted from all the optical semiconductor elements 3a to 3c in the same pixel as shown in FIG. 2 from transmitting in the front oblique direction, so that the light can be transmitted in a sufficiently wide field of view. The front brightness of the display 1 is further improved.

Specifically, when all the optical semiconductor elements in the same pixel of the display satisfy the above formula (1), as shown in Figure 4, except for the front-facing light F _A and F emitted by the optical semiconductor elements 3a to 3c In addition to _B and F _C , the light _RA , _RB and R _C emitted by the optical semiconductor elements 3a to 3c are directed diagonally to the right of the front, and the light L _A emitted from the optical semiconductor elements 3a to 3c are diagonally directed to the left of the front. The transmission of , _LB and _LC is not hindered by the colored layer 41 , so the front brightness of the display increases. Thereby, the light emitted by the optical semiconductor element can be fully transmitted to the front of the display body in a wide field of view, thereby suppressing uneven brightness.

On the other hand, an embodiment of the previous display body is shown in FIG. 5 . The display shown in FIG. 5 has a non-colored layer 42 and a colored layer 41 in order from the optical semiconductor element side. The front-side interface of the colored layer 41 between the optical semiconductor elements 3a and 3b is located between the optical semiconductor elements 3a to 3c. The end on the front side is far away from the front side and does not satisfy the above formula (1). In the display shown in Figure 5, the light _RA , _RB , and R _C emitted by the optical semiconductor elements 3a to 3c are directed obliquely to the right of the front, and the light emitted by the optical semiconductor elements 3a to 3c are directed obliquely to the left of the front. The transmission of light L _A , _LB and _LC is blocked by the colored layer 41 , so the front brightness of the display is low. In addition, the light emitted by the optical semiconductor element cannot be fully transmitted to the front of the display in a wide field of view, thus causing brightness problems. The risk of unevenness. Furthermore, in the aspect shown in FIG. 5 , if the thickness of the colored layer 41 is made thicker, the amount of light F _A to F _C emitted by the optical semiconductor elements 3 a to 3 c decreases. If it is thinner, the anti-reflective ability required for the colored layer 41 will be reduced. On the other hand, if the display body of the present invention satisfies the above formula (1), it is possible to improve front brightness, prevent brightness unevenness, and have excellent anti-reflection capabilities.

In this way, by satisfying the above formula (1), the display body of the present invention can make the height of the colored layer between the optical semiconductor elements sufficiently low corresponding to the distance between the optical semiconductor elements, so that the colored layer does not easily interfere with the light emitted by the optical semiconductor elements. The light is transmitted in the oblique direction of the front, thereby allowing the light to pass through a sufficiently wide field of view, suppressing uneven brightness, and improving the front brightness of the display.

The value of θ is not particularly limited and can be appropriately set according to the visual field in which uneven brightness of the display should be suppressed. θ is, for example, 0° or more and less than 90°, preferably 45° or less, more preferably 30° or less, and may be 25° or less or 20° or less, particularly preferably 15° or less. When θ is within the above range, uneven brightness can be suppressed over a wide visual field. Therefore, in the above formula (1), θ is preferably 45°, 30°, 25°, 20° or 15°, or may be 0° (in this case, L _C ≦ L _A ).

The center of gravity of the optical semiconductor element (the center of gravity _GA of the optical semiconductor element 3a in Figure 3, the center of gravity _GB of the optical semiconductor element 3b, etc.) is determined by the three-dimensional shape of the optical semiconductor element. The three-dimensional shape of the optical semiconductor element is not particularly limited, and examples thereof include corner prisms such as cubes and rectangular parallelepipeds, pyramids, cylinders, truncated cones, and shapes in which the upper part is dome-shaped. When the three-dimensional shape of the optical semiconductor element is a right-angled prism, the center of gravity is the center of the optical semiconductor element.

Furthermore, the display body 1 does not need to include the base material portion 5 . In addition, the number of optical semiconductor elements in one pixel is not particularly limited and does not need to be three.

(Second Embodiment) Another embodiment (second embodiment) of the display of the present invention is shown in FIG. 6 . The display 1 shown in FIG. 6 is provided with a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and a sealing resin layer 4 for sealing the optical semiconductor elements 3a to 3c at once, as in FIG. 2. , and the base material portion 5 bonded to the surface of the sealing resin layer 4 opposite to the side of the optical semiconductor elements 3a to 3c.

The display 1 shown in FIG. 6 uses a sealing resin layer 4 in which a layer (diffusion functional layer) 43 that functions to diffuse light is interposed between the colored layer 41 and the non-colored layer 42. That is, the sealing resin layer 4 is composed of the colored layer 41, the diffusion functional layer 43 and the non-colored layer 42 which are laminated in this order so that the colored layer 41 side becomes the side of the optical semiconductor elements 3a to 3c, and the colored layer 41 and the non-colored layer 42 are laminated in this order. The optical semiconductor elements 3a to 3c are sealed in such a manner that the optical semiconductor elements 3a to 3c are in contact with each other.

The colored layer 41 in contact with the optical semiconductor elements 3a to 3c follows the uneven shape, so that in the display body 1, the colored layer 41 also has an uneven shape. One side of the diffusion function layer 43 follows the uneven shape of the colored layer 41 and has an uneven shape opposite to the uneven shape of the colored layer 41, and the other side is flat. Both sides of the non-colored layer 42 connected to the diffusion functional layer 43 are flat. The display 1 shown in FIG. 6 also satisfies the above formula (1). Others are the same as the display 1 shown in Figure 2 .

(Third Embodiment) Another embodiment (third embodiment) of the display of the present invention is shown in FIG. 7 . The display 1 shown in FIG. 7 is provided with a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and a sealing resin layer 4 that seals the optical semiconductor elements 3a to 3c at once, as in FIG. 2. , and the base material portion 5 bonded to the surface of the sealing resin layer 4 opposite to the side of the optical semiconductor elements 3a to 3c.

In the display 1 shown in FIG. 7 , the sealing resin layer 4 is composed of a diffusion functional layer 43 , a colored layer 41 and a non-colored layer 42 laminated in this order, so that the diffusion functional layer 43 side becomes the side of the optical semiconductor elements 3 a to 3 c In addition, the optical semiconductor elements 3a to 3c are sealed so that the diffusion functional layer 43 is in contact with the optical semiconductor elements 3a to 3c. In this way, when the sealing resin layer has a diffusion functional layer, a colored layer and a non-colored layer (especially a non-diffusion functional layer) in order from the side of the optical semiconductor element, the light emitted from the optical semiconductor element in the side direction will be emitted before it enters the colored layer. Diffused in the diffusion functional layer, the front brightness is further improved.

The diffusion functional layer 43 in contact with the optical semiconductor elements 3a to 3c follows the uneven shape, so that in the display body 1, the diffusion functional layer 43 also has an uneven shape. One side of the colored layer 41 follows the uneven shape of the diffusion functional layer 43 and has an uneven shape opposite to the uneven shape of the diffusion functional layer 43, and the other side is flat. Both surfaces of the non-colored layer 42 connected to the colored layer 41 are flat. The display 1 shown in Fig. 7 also satisfies the above formula (1). Others are the same as the display 1 shown in Figure 2 .

(Fourth Embodiment) Another embodiment (the fourth embodiment) of the display of the present invention is shown in FIG. 8 . The display 1 shown in FIG. 8 is provided with a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and a sealing resin layer 4 for sealing the optical semiconductor elements 3a to 3c at once, as in FIG. 2. , and the base material portion 5 bonded to the surface of the sealing resin layer 4 opposite to the side of the optical semiconductor elements 3a to 3c.

In the display 1 shown in FIG. 8 , the sealing resin layer 4 is composed of a diffusion functional layer 43 , a colored layer 41 and a non-colored layer 42 laminated in this order, similar to the display 1 shown in FIG. 7 . The side 43 becomes the side of the optical semiconductor elements 3a to 3c, and the optical semiconductor elements 3a to 3c are sealed so that the diffusion functional layer 43 is in contact with the optical semiconductor elements 3a to 3c. The diffusion functional layer 43 in contact with the optical semiconductor elements 3a to 3c follows the uneven shape, so that in the display body 1, the diffusion functional layer 43 also has an uneven shape. The colored layer 41 follows the concave and convex shape of the diffusion functional layer 43 so that both surfaces have concave and convex shapes opposite to the concave and convex shapes of the diffusion functional layer 43 . One side of the non-colored layer 42 connected to the colored layer 41 follows the uneven shape of the colored layer 41 and has an uneven shape opposite to the uneven shape of the colored layer 41, and the other side is flat. The display 1 shown in FIG. 8 also satisfies the above formula (1). Others are the same as the display 1 shown in Figure 7 .

The cross-sectional views of the display shown in FIGS. 2 to 8 can be obtained, for example, by cutting the display through the center of gravity of the plurality of optical semiconductor elements and perpendicularly to the substrate surface in a cooled state, thereby exposing the cross-section. . By cooling the display body, the heat generated during cutting can be suppressed from melting or deforming the sealing resin layer. Cutting can be performed using known or conventional cutting devices such as laser beam irradiation and ion beam irradiation. Furthermore, after cutting, the exposed section can also be ground to expose a section with a lower degree of deformation. The temperature during cooling can be appropriately set within a range that suppresses the degree of deformation of the sealing resin layer and the cracking of the display body.

＜Sealing resin layer＞ The sealing resin layer includes at least the colored layer and the non-colored layer. Each of the layers constituting the sealing resin layer (the colored layer and the non-colored layer) within the sealing resin layer may be a single layer or a plurality of layers having the same or different compositions. When a plurality of colored layers or non-colored layers are included, the plurality of layers may be laminated in contact with one another or laminated in isolation (for example, two colored layers may be laminated with one non-colored layer interposed therebetween). Moreover, the total number of layers constituting the sealing resin layer is 2 or more layers including the above-mentioned colored layer and the above-mentioned non-colored layer, and may be 3 or more layers. From the viewpoint of thinning the display body, the total number of the above-described layers is, for example, 10 layers or less, 5 layers or less, or 4 layers or less.

In the display of the present invention, the sealing resin layer preferably includes the colored layer and the non-colored layer in order from the optical semiconductor element side. By having such a structure, the surface of the colored layer having an uneven shape can be prevented from being exposed on the surface of the sealing resin layer on the front side (the side opposite to the side of the optical semiconductor element), and the surface of the sealing resin layer on the front side can easily become a flat surface. Therefore, diffuse reflection of external light is less likely to occur, and the aesthetics of the display body is improved in both cases when it is turned off and when it is illuminated. In the display 1 shown in FIGS. 2, 3, 6 to 8, the sealing resin layer 4 includes a colored layer 41 and a non-colored layer 42 in order from the side of the optical semiconductor elements 3a to 3c.

The sealing resin layer preferably includes a diffusion functional layer. By having such a structure, the light emitted by the optical semiconductor element can be diffused in the diffusion functional layer, thereby further improving the front brightness. The diffusion functional layer is preferably a layer equivalent to the non-colored layer in this specification. In Figures 2 and 3, the non-colored layer 42 can be a diffusion functional layer or a non-diffusion functional layer. In FIGS. 6 to 8 , the sealing resin layer 4 includes a diffusion functional layer 43 .

When the sealing resin layer includes the diffusion functional layer, the sealing resin layer preferably includes the diffusion functional layer, the colored layer, and the non-colored layer in order from the optical semiconductor element side. The non-colored layer may be any one of a diffusion functional layer and a non-diffusion functional layer. By having such a structure, the front brightness can be further improved, and the aesthetics of the display body can be further improved both when it is turned off and when it is lit. In FIGS. 7 and 8 , the sealing resin layer 4 includes a diffusion functional layer 43 , a colored layer 41 and a non-colored layer 42 in order from the side of the optical semiconductor elements 3 a to 3 c. The non-colored layer 42 may be a diffusion functional layer or a non-diffusion functional layer.

In the display of the present invention, it is preferable that at least one surface of the colored layer (especially the surface on the side of the optical semiconductor element) has an uneven shape following the uneven shape. In this case, the display body of the present invention easily satisfies the above formula (1). Moreover, the said colored layer may have the uneven|corrugated shape which follows the said uneven|corrugated shape on the front side. In the display 1 shown in FIGS. 2, 3, 6, and 8, both the front side and the optical semiconductor element side of the colored layer 41 have uneven shapes. The display body 1 shown in FIG. 7 has an uneven shape only on the surface on the side of the optical semiconductor element, and the surface on the front side is a flat surface.

In the display of the present invention, the non-colored layer located on the front side of the colored layer preferably has a flat surface (flat surface) on the front side. In this case, the surface of the above-mentioned sealing resin layer is less likely to cause diffuse reflection of external light, and the aesthetics of the display body is improved in both cases when it is turned off and when it is illuminated. In the display 1 shown in FIGS. 2, 3, 6 to 8, the front side of the non-colored layer 42 is a flat surface.

In the display of the present invention, the non-colored layer may be disposed closer to the optical semiconductor element than the colored layer. That is, the sealing resin layer may include the non-colored layer and the colored layer in order from the optical semiconductor element side. Furthermore, when the non-colored layer is disposed closer to the optical semiconductor element than the colored layer, it is preferable that both surfaces of the non-colored layer have an uneven shape following the uneven shape. With such a structure, the colored layer can easily have an uneven shape. In the display 1 shown in FIGS. 7 and 8 , the sealing resin layer 4 has a diffusion functional layer 43 as a non-colored layer and a colored layer 41 in order from the side of the optical semiconductor elements 3a to 3c, and both sides of the diffusion functional layer 43 are It has a concave and convex shape following the above concave and convex shape.

Each layer (the above-mentioned colored layer and the above-mentioned non-colored layer) constituting the above-mentioned sealing resin layer may independently have adhesiveness or may not have adhesiveness. Among them, those having adhesive properties are preferred. By having such a structure, the sealing resin layer can easily seal the optical semiconductor element, and the adhesiveness between each layer is excellent, and the sealing property of the optical semiconductor element is further excellent. In particular, it is preferable that at least the layer in contact with the optical semiconductor element has adhesiveness. By having such a structure, the optical semiconductor element in the sealing resin layer has excellent followability and embedding properties. As a result, even if the step difference caused by the optical semiconductor element is high, the designability is excellent. Furthermore, layers other than the layer in contact with the optical semiconductor element may not have adhesive properties. In this case, the adhesion between the adjacent sealing resin layers in the collaged state is low, and the adjacent small-sized laminated bodies (the laminated body formed by sealing the optical semiconductor element arranged on the substrate with the sealing resin layer) are pulled together. When separated, it is difficult to cause damage to the sealing resin layer and adhesion of the adjacent sealing resin layer.

(shading layer) The colored layer in the display of the present invention is a layer for the purpose of preventing reflection of light caused by metal wiring and the like provided on the substrate in the display. The above-mentioned colored layer contains at least a colorant. The colored layer is preferably a resin layer made of resin. The above-mentioned colorant only needs to be dissolved or dispersed in the above-mentioned colored layer, and may be a dye or a pigment. A dye is preferable from the viewpoint that low haze can be achieved even with a small amount of addition, and it is easy to distribute uniformly without settling like a pigment. In addition, from the viewpoint that high color expression can be achieved even with a small amount of addition, pigments are preferred. When a pigment is used as a colorant, it is preferably one with low conductivity or no conductivity. Only one type of colorant may be used, or two or more types may be used.

As the colorant, a black colorant is preferred. As the black colorant, well-known or customary colorants (pigments, dyes, etc.) used to express black can be used. For example, carbon black (furnace black, chimney black, acetylene black, thermal black, lamp black, etc.) Pine smoke, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (non-magnetic ferrite, magnetic ferrite, etc.), magnetite , Chromium oxide, iron oxide, molybdenum disulfide, chromium complex, anthraquinone colorants, zirconium nitride, etc. Furthermore, a colorant that functions as a black colorant by combining and blending colorants exhibiting colors other than black may be used.

The content ratio of the colorant in the above-mentioned colored layer is preferably 0.2 mass% or more, and more preferably 0.4 mass% with respect to 100 mass% of the total amount of the colored layer, from the perspective of imparting appropriate anti-reflective ability to the display. above. Moreover, the content ratio of the said coloring agent is, for example, 10 mass % or less, Preferably it is 5 mass % or less, More preferably, it is 3 mass % or less. The above-mentioned content ratio can be appropriately set depending on the type of colorant, the color tone and light transmittance of the display, and the like. The colorant can also be added to the composition as a solution or dispersion dissolved or dispersed in a suitable solvent.

The haze value (initial haze value) of the above-mentioned colored layer is not particularly limited. From the viewpoint of ensuring front brightness and visibility of the display, it is preferably 50% or less, more preferably 40% or less, and still more preferably The best value is less than 30%, and the best value is less than 20%. In addition, from the viewpoint of efficiently reducing brightness unevenness of the display, the haze value of the colored layer is preferably 1% or more, more preferably 3% or more, further preferably 5% or more, and particularly preferably 8%. % or more, or more than 10%. The above-mentioned haze value is the value of the thickest part of the above-mentioned colored layer in the above-mentioned display body.

The total light transmittance of the above-mentioned colored layer is not particularly limited, but from the viewpoint of further improving the function of preventing reflection caused by metal wiring, etc. of the display and the contrast, it is preferably 40% or less, more preferably 30% or less. More preferably, it is 25% or less, and particularly preferably, it is 20% or less. In addition, from the viewpoint of ensuring the brightness of the display, the total light transmittance of the above-mentioned colored layer is preferably 0.5% or more, more preferably 1% or more, further more preferably 1.5% or more, and particularly preferably 2% or more. It can also be more than 2.5% or more than 3%. The above-mentioned total light transmittance is the value of the thickest part of the above-mentioned colored layer in the above-mentioned display body.

The haze value and total light transmittance of the above-mentioned colored layer are the values of a single layer. They can be measured using the methods specified by JIS K7136 and JIS K7361-1, and can be determined according to the type, thickness, type and amount of colorant. Wait to control.

(non-shading layer) The above-mentioned non-colored layer is a layer different from the above-mentioned colored layer, and is not a layer intended to prevent reflection of light caused by metal wiring or the like provided on the substrate in the display body. The above-mentioned non-colored layer may be a colorless layer or may be slightly colored. Furthermore, the non-colored layer may be, for example, a diffusion functional layer whose purpose is to diffuse light, or a non-diffusion functional layer whose purpose is not to diffuse light. The above-mentioned non-colored layer may be transparent or opaque. The above-mentioned non-colored layer is preferably a resin layer composed of resin.

The content ratio of the colorant in the non-colored layer is preferably less than 0.2 mass %, more preferably less than 0.1 mass %, and still more preferably less than 0.05 mass % relative to 100 mass % of the total amount of the non-colored layer. %, or less than 0.01 mass % or less than 0.005 mass %.

The total light transmittance of the above-mentioned non-colored layer is not particularly limited, but from the viewpoint of ensuring the brightness of the display, it is preferably 40% or more, more preferably 60% or more, further preferably 70% or more, and particularly preferably More than 80%. In addition, the upper limit of the total light transmittance of the non-colored layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The above-mentioned total light transmittance is the value of the thickest part of the above-mentioned non-colored layer in the above-mentioned display body.

The total light transmittance of the above-mentioned non-colored layer is the value of a single layer, which can be measured by the method specified by JIS K7136 and JIS K7361-1, and can be controlled according to the type and thickness of the non-colored layer.

The above-mentioned diffusion functional layer is a layer for the purpose of diffusing light. If the above-mentioned sealing resin layer has the above-mentioned diffusion functional layer, the light emitted from the optical semiconductor element is diffused in the diffusion functional layer. For example, the light emitted from the side of the optical semiconductor element is released toward the front direction of the display body, thereby improving the front brightness of the display body. improve. The above-mentioned diffusion functional layer is preferably a resin layer made of resin. The above-mentioned diffusion function layer preferably contains light-diffusing fine particles, but it is not limited thereto. That is, it is preferable that the said diffusion functional layer contains light diffusing microparticles dispersed in a resin layer. Only one type of the above-mentioned light diffusing fine particles may be used, or two or more types may be used.

The above-mentioned light-diffusing fine particles have an appropriate refractive index difference with respect to the resin constituting the diffusion functional layer, and provide diffusion properties to the diffusion functional layer. Examples of light-diffusing fine particles include inorganic fine particles, polymer fine particles, and the like. Examples of the material of the inorganic fine particles include silicon oxide, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxides. Examples of the material of the polymer fine particles include silicone resin, acrylic resin (for example, including polymethacrylate resin such as polymethyl methacrylate), polystyrene resin, polyurethane resin, melamine resin, and polyethylene. Resin, epoxy resin, etc.

As the above-mentioned polymer fine particles, fine particles composed of silicone resin are preferred. Furthermore, as the above-mentioned inorganic fine particles, fine particles composed of metal oxides are preferred. As the above-mentioned metal oxide, titanium oxide and barium titanate are preferred, and titanium oxide is more preferred. By having such a structure, the light diffusivity of the diffusion functional layer is further improved, and brightness unevenness is further suppressed.

The shape of the light-diffusing fine particles is not particularly limited, and may be, for example, spherical, flat, or irregular.

From the viewpoint of imparting appropriate light diffusion performance, the average particle diameter of the light-diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, further preferably 0.2 μm or more, and particularly preferably 0.25 μm or more. In addition, from the viewpoint of preventing the haze value from being too high and displaying a high-definition image, the average particle diameter of the light-diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, and still more preferably 8 μm. the following. The average particle diameter can be measured using a Coulter counter, for example.

The refractive index of the light-diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, still more preferably 1.3 to 4, and particularly preferably 1.35 to 3.

The absolute value of the difference in refractive index between the above-mentioned light-diffusing fine particles and the resin constituting the diffusion functional layer (the resin layer in the diffusion functional layer other than the light-diffusing fine particles) can more efficiently reduce the uneven brightness of the display. It is preferably 0.001 or more, more preferably 0.01 or more, still more preferably 0.02 or more, particularly preferably 0.03 or more, and may be 0.04 or more or 0.05 or more. Furthermore, from the viewpoint of preventing the haze value from being too high and displaying a high-definition image, the absolute value of the difference in refractive index between the light-diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, and still more preferably is 3 or less.

From the viewpoint of imparting appropriate light diffusion performance to the sealing resin layer, the content of the light-diffusing fine particles in the diffusion functional layer is preferably 0.01 parts by mass or more relative to 100 parts by mass of the resin constituting the diffusion functional layer, and more preferably 0.01 parts by mass or more. Preferably it is 0.05 part by mass or more, more preferably it is 0.1 part by mass or more, and particularly preferably it is 0.15 part by mass or more. In addition, from the viewpoint of preventing the haze value from being too high and displaying a high-definition image, the content of the light-diffusing fine particles is preferably 80 parts by mass or less based on 100 parts by mass of the resin constituting the diffusion functional layer, and more preferably It is 70 parts by mass or less.

The haze value (initial haze value) of the diffusion functional layer is not particularly limited, but from the viewpoint of efficiently reducing brightness unevenness, it is preferably 30% or more, more preferably 40% or more, and even more preferably 50%. % or more, particularly preferably 60% or more, it can also be 70% or more, 80% or more, 90% or more, 95% or more, or 97% or more. Furthermore, when it is about 99.9%, the brightness unevenness improvement effect is more excellent. So I thought it was good. Furthermore, the upper limit of the haze value of the diffusion functional layer is not particularly limited, that is, it can also be 100%. The above-mentioned haze value is the value of the thickest part of the above-mentioned diffusion functional layer in the above-mentioned display body.

The total light transmittance of the diffusion function layer is not particularly limited. From the viewpoint of ensuring brightness, it is preferably 40% or more, more preferably 60% or more, further preferably 70% or more, and particularly preferably 80% or more. . In addition, the upper limit of the total light transmittance of the diffusion functional layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The above-mentioned total light transmittance is the value of the thickest part of the above-mentioned diffusion functional layer in the above-mentioned display body.

The haze value and total light transmittance of the above-mentioned diffusion functional layer are the values of a single layer. They can be measured using the methods specified by JIS K7136 and JIS K7361-1, and can be determined according to the type and thickness of the diffusion functional layer, light diffusion Control the type and dosage of micro-particles.

The haze value (initial haze value) of the above-mentioned non-diffusion functional layer is not particularly limited. From the viewpoint of achieving excellent brightness of the display, it is preferably less than 30%, more preferably less than 10%, and still more preferably It is less than 5%, preferably less than 1%, and can also be less than 0.5%. Furthermore, the lower limit of the haze value of the non-diffusion functional layer is not particularly limited. The above-mentioned haze value is the value of the thickest part of the above-mentioned non-diffusion functional layer in the above-mentioned display body.

The total light transmittance of the above-mentioned non-diffusion functional layer is not particularly limited. From the perspective of ensuring the brightness of the display, it is preferably 60% or more, more preferably 70% or more, further preferably 80% or more, and particularly preferably is more than 90%. In addition, the upper limit of the total light transmittance of the non-diffusion functional layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The above-mentioned total light transmittance is the value of the thickest part of the above-mentioned non-diffusion functional layer in the above-mentioned display body.

The haze value and total light transmittance of the above-mentioned non-diffusion functional layer are the values of a single layer. They can be measured using the methods specified by JIS K7136 and JIS K7361-1, and can be measured according to the type and thickness of the non-diffusion functional layer. to control.

From the viewpoint of excellent brightness of the display, the content of the colorant and/or light-diffusing fine particles in the non-diffusion functional layer is preferably less than 0.01 parts by mass relative to 100 parts by mass of the resin constituting the non-diffusion functional layer. parts, preferably less than 0.005 parts by mass.

(resin layer) When the above-mentioned colored layer and the above-mentioned non-colored layer are the above-mentioned resin layers, the resin constituting the above-mentioned resin layer may be a well-known or commonly used resin, for example, an acrylic resin or a urethane acrylate resin may be mentioned. , urethane resin, rubber resin, epoxy resin, epoxy acrylate resin, oxetane resin, silicone resin, silicone acrylic resin, polyester resin, polyether Resins (polyvinyl ether, etc.), polyamide resins, fluorine resins, vinyl acetate/vinyl chloride copolymers, modified polyolefins, etc. Only one type of the above-mentioned resin may be used, or two or more types may be used. The resins of each layer constituting the above-mentioned sealing resin layer may be the same as each other or may be different from each other.

When the resin layer is an adhesive layer (adhesive layer), a well-known or commonly used pressure-sensitive adhesive can be used as the resin. Examples of the adhesive include acrylic adhesives, rubber adhesives (natural rubber adhesives, synthetic rubber adhesives, mixtures thereof, etc.), silicone adhesives, polyester adhesives, and urethane adhesives. Acid ester adhesives, polyether adhesives, polyamide adhesives, fluorine adhesives, etc. Only one type of the above-mentioned adhesive may be used, or two or more types may be used.

The above-mentioned layers of the above-mentioned resin layer may also contain other components than the above-mentioned components within the range that does not impair the effects of the present invention. Examples of the other components mentioned above include hardeners, cross-linking accelerators, adhesion-imparting resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), oligomers, anti-aging agents, and fillers (metallic resins). powder, organic filler, inorganic filler, etc.), antioxidants, plasticizers, softeners, surfactants, antistatic agents, surface lubricants, leveling agents, light stabilizers, UV absorbers, polymerization inhibitors, particles Shapes, foils, etc. Only one type of the above-mentioned other components may be used, or two or more types may be used.

As the laminated structure of the above-mentioned sealing resin layer, in addition to the structures shown in the drawings, that is, [colored layer/diffusion functional layer], [colored layer/non-diffusion functional layer], [colored layer/diffusion functional layer/non-diffusion functional layer] , in addition to [diffusion functional layer/colored layer/non-diffusion functional layer], [non-diffusion functional layer/colored layer], [diffusion functional layer/colored layer], [non-diffusion functional layer/colored layer/diffusion function] may also be exemplified layer], [diffusion functional layer/coloring layer/diffusion functional layer], [non-diffusion functional layer/diffusion functional layer/coloring layer], [diffusion functional layer/non-diffusion functional layer/coloring layer], [diffusion functional layer/diffusion Functional layer/colored layer], [diffusion functional layer/colored layer/colored layer] (the above are all laminated sequentially from the optical semiconductor element side), etc.

＜Substrate Department＞ The display body of the present invention may or may not have a base material part. If the above-mentioned base material part is arranged on the front side of the sealing resin layer in the above-mentioned display body, the surface of the sealing resin layer can be made flat, so that diffuse reflection of light is less likely to occur. The aesthetics are improved. Furthermore, by forming the following anti-glare layer or anti-reflective layer on the above-mentioned base material portion, anti-glare properties or anti-reflective properties can be provided to the display body. In addition, it serves as a support for the sealing resin layer in the sheet for sealing optical semiconductor elements described below. Therefore, by providing the above-mentioned base material portion, the sheet for sealing optical semiconductor elements has excellent structural properties.

The above-mentioned base material part may be a single layer, or may be a plurality of identical layers, or a plurality of layers having different compositions, thicknesses, etc. When the above-mentioned base material part is composed of a plurality of layers, each layer may also be bonded by other layers such as an adhesive layer. Furthermore, the base material layer used in the base material part is attached to the part of the substrate equipped with the optical semiconductor element together with the sealing resin layer, and will be peeled off when the optical semiconductor element sealing sheet is used (when attached) The release liner and the surface protective film that only protect the surface of the base material are not included in the "base material part".

Examples of the base material layer constituting the base material portion include glass, plastic base materials (especially plastic films), and the like. Examples of the resin constituting the plastic base material include low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra-low density polyethylene, random copolymerized polypropylene, and block polyethylene. Copolymer polypropylene, homopolymer polypropylene, polybutene, polymethylpentene, ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylate (random, alternating) copolymer, Polyolefin resins such as ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cyclic olefin polymer, ethylene-butene copolymer, ethylene-hexene copolymer; polyurethane; polyethylene terephthalate Diester (PET), polyethylene naphthalate, polybutylene terephthalate (PBT) and other polyesters; polycarbonate; polyimide-based resin; polyetherketone; polyetherimide; Polyamides such as aromatic polyamide and fully aromatic polyamide; polyphenylene sulfide; fluororesin; polyvinyl chloride; polyvinylidene chloride; cellulose resins such as triacetyl cellulose (TAC); silicone Resin; acrylic resins such as polymethylmethacrylate (PMMA); polypropylene; polyarylate; polyvinyl acetate, etc. Only one type of the above-mentioned resin may be used, or two or more types may be used. The above-mentioned base material layer may also be various optical films such as anti-reflection (AR) films, polarizing plates, and phase difference plates.

The thickness of the above-mentioned plastic film is preferably 20-300 μm, more preferably 40-250 μm. When the thickness is 20 μm or more, the supportability and handleability of the optical semiconductor element sealing sheet are further improved. When the thickness is 300 μm or less, the display body can be made thinner.

The surface of the base material portion on the side provided with the sealing resin layer may be subjected to, for example, corona discharge treatment, plasma treatment, frosting treatment, ozone exposure treatment, etc., in order to improve the adhesion, retention, etc. with the sealing resin layer. Physical treatments such as flame exposure treatment, high-voltage electric shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; and surface treatments such as easy-adhesion treatment using a coating agent (primer). Surface treatment for improving adhesion is preferably performed on the entire surface of the base material portion on the sealing resin layer side.

The thickness of the base material portion is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of excellent function as a support and excellent surface scratch resistance. From the viewpoint of more excellent transparency, the thickness of the base material portion is preferably 300 μm or less, more preferably 250 μm or less.

＜Display body＞ The above-mentioned display may also include a layer with anti-glare properties and/or anti-reflective properties. By having such a structure, the gloss and light reflection of the display body can be suppressed, thereby improving the aesthetics. Examples of the layer having the above-mentioned anti-glare properties include an anti-glare treatment layer. Examples of the layer having the above-mentioned anti-reflection properties include an anti-reflection treatment layer. Both anti-glare treatment and anti-reflection treatment can be implemented using known or even customary methods. The layer having the anti-glare properties and the layer having the anti-reflective properties may be the same layer, or they may be different layers. The layer having the above-mentioned anti-glare and/or anti-reflective properties may include only one layer, or may include two or more layers.

The haze value (initial haze value) of the above-mentioned sealing resin layer or the laminate having the above-mentioned sealing resin layer and the above-mentioned base material portion as both end surfaces is not particularly limited, as long as the self-brightness unevenness suppression effect and designability are more excellent. From a viewpoint, the optimum is 80% or more, the more optimum is 85% or more, the further optimum is 90% or more, and the particularly optimum is 95% or more. Furthermore, the upper limit of the haze value is not particularly limited.

The total light transmittance of the above-mentioned sealing resin layer or the laminate having the above-mentioned sealing resin layer and the above-mentioned base material portion as both end surfaces is not particularly limited, but is determined from the viewpoint of further improving the function of preventing reflection caused by metal wiring, etc., and the contrast ratio. In other words, it is preferably 40% or less, more preferably 30% or less, and still more preferably 20% or less. In addition, the above-mentioned total light transmittance is preferably 0.5% or more from the viewpoint of ensuring brightness.

The above-mentioned haze value and total light transmittance can be measured using the methods specified in JIS K7136 and JIS K7361-1, and can be measured based on the lamination order, type, thickness, etc. of the layers constituting the above-mentioned sealing resin layer and the above-mentioned base material part. to control.

The thickness of the above-mentioned sealing resin layer or the laminate having the above-mentioned sealing resin layer and the above-mentioned base material portion as both end surfaces is from the viewpoint of improving the function of preventing reflection caused by metal wiring, etc., and contrast, and more effectively reducing color migration. , preferably 10 to 600 μm, more preferably 20 to 550 μm, still more preferably 30 to 500 μm, still more preferably 40 to 450 μm, particularly preferably 50 to 400 μm. In addition, the release liner is not included in the above-mentioned thickness.

Furthermore, the display body of the present invention preferably includes a self-luminous display device. Furthermore, by combining the above-described self-luminous display device with a display panel as necessary, a display body as an image display device can be formed. At this time, the optical semiconductor element is an LED element. Examples of the self-luminous display device include an LED display, a backlight, an organic electroluminescence (organic EL) display device, and the like. The above-mentioned backlight is particularly preferably a full-surface direct-lit backlight. The backlight includes, for example, the substrate and a laminated body including a plurality of optical semiconductor elements arranged on the substrate as at least a part of the structural member. For example, in the self-luminous display device described above, a metal wiring layer for transmitting light emission control signals to each LED element is laminated on the substrate. LED elements emitting red (R), green (G), and blue (B) colors of light are alternately arranged on the substrate via metal wiring layers. The metal wiring layer is made of metal such as copper, and adjusts the luminescence level of each LED element to display various colors.

The display body of the present invention can also be a display body that is bent and used, such as a bendable image display device (flexible display) (especially a foldable image display device (foldable display)). Specific examples include a display body equipped with a foldable backlight, a display body equipped with a foldable self-luminous display device, and the like.

In the display of the present invention, the optical semiconductor element in the sealing resin layer has excellent followability and embedding properties. Therefore, the optical semiconductor element may also be a mini LED element or a micro LED element.

According to the display of the present invention, uneven brightness caused by the light emitted by the optical semiconductor element is less likely to occur, and the brightness is higher. Therefore, the above-mentioned display body can be viewed with the same color from a wide viewing angle in which color shift is unlikely to occur. In addition, the above-mentioned display body is bright and has good aesthetics even if the power consumption is not increased. Furthermore, according to the display of the present invention, reflection of light due to metal wiring and the like on the substrate is suppressed, and the appearance is good when the optical semiconductor element is not lit.

[Manufacturing method of display body] The display of the present invention can be manufactured by bonding an optical semiconductor element sealing sheet having a sealing resin layer to a substrate on which the optical semiconductor element is arranged, and sealing the optical semiconductor element through the sealing resin layer. seal.

(Sheet for optical semiconductor element sealing) The above-mentioned optical semiconductor element sealing sheet is a sheet used to seal a plurality of optical semiconductor elements arranged on a substrate. The optical semiconductor element sealing sheet is a sheet that satisfies the above formula (1) when the plurality of optical semiconductor elements are sealed with the sealing resin layer to form the sealing resin layer. According to the optical semiconductor element sealing sheet of the present invention, by sealing the optical semiconductor element, it is possible to provide a display body that is less prone to uneven brightness and has higher brightness.

The optical semiconductor element sealing sheet includes at least a sealing resin layer including a colored layer and a non-colored layer. The sealing resin layer may form the sealing resin layer in the display of the present invention. Specifically, the colored layer in the sealing resin layer can form the colored layer in the display of the present invention, and the non-colored layer in the sealing resin layer can form the colored layer in the display of the present invention. The above-mentioned non-colored layer. Specifically, the above-mentioned colored layer in the above-mentioned sealing resin layer may have a composition (components and their blending ratios), physical properties (haze, total light transmittance, etc.) and the above-mentioned colored layer in the display of the present invention. The same layer may be a layer that hardens to become the above-mentioned colored layer in the display of the present invention. In addition, the non-colored layer in the sealing resin layer may have a composition (components and their blending ratios), physical properties (haze, total light transmittance, etc.) and the non-colored layer in the display of the present invention. The same layer may also be a layer that becomes the non-colored layer in the display of the present invention by hardening.

The sealing resin layer can be appropriately designed according to the structure of the sealing resin layer in the display of the present invention. For example, when the display of the present invention includes the diffusion functional layer, the sealing resin layer in the optical semiconductor element sealing sheet includes the diffusion functional layer. The diffusion functional layer in the sealing resin layer may have the same composition (components and blending ratios thereof) and physical properties (haze, total light transmittance, etc.) as the diffusion functional layer in the display of the present invention. The layer may be a layer that becomes the above-mentioned diffusion functional layer in the display of the present invention by hardening. Moreover, it is preferable that the said sealing resin layer has the said diffusion functional layer, the said colored layer, and the said non-colored layer in this order.

Each layer (the above-mentioned colored layer and the above-mentioned non-colored layer) constituting the sealing resin layer may independently have adhesiveness and/or adhesiveness, or may not have adhesiveness and/or adhesiveness. Among them, those having adhesiveness and/or adhesiveness are preferred. By having such a structure, the sealing resin layer can be easily bonded to the substrate and the optical semiconductor element, and the adhesiveness between the layers is excellent, so that the sealing property of the optical semiconductor element is even more excellent. In particular, it is preferable that at least the layer in contact with the optical semiconductor element has adhesiveness and/or adhesiveness. By having such a structure, the sealing resin layer has excellent followability and embedding properties of the optical semiconductor element. As a result, even if the step difference caused by the optical semiconductor element is high, the designability is excellent.

Each layer (the above-mentioned colored layer and the above-mentioned non-colored layer) constituting the above-mentioned sealing resin layer may be independently a resin layer (radiation curable resin layer) that has the property of being cured by radiation irradiation, or may not have any properties. A resin layer that can be hardened by radiation (radiation non-hardening resin layer). Examples of the radiation include electron beams, ultraviolet rays, alpha rays, beta rays, gamma rays, and X-rays. When the above-mentioned colored layer is a radiation-curable resin layer, the above-mentioned colorant contained in the above-mentioned colored layer is preferably one that absorbs visible light and has light transmittance of a wavelength that can harden the above-mentioned radiation-curable resin layer.

The above-mentioned optical semiconductor element sealing sheet may include the above-mentioned base material part. When the base material part is provided, the sealing resin layer may be disposed on at least one side of the base material part. The surface of the sealing resin layer that is in contact with the base material portion is a surface opposite to the side of the sealing resin layer that is in contact with the optical semiconductor element. When the above-mentioned optical semiconductor element sealing sheet has the above-mentioned base material part, the above-mentioned optical semiconductor element sealing sheet is bonded to the optical semiconductor element and the substrate together with the above-mentioned base material part, so that the above-mentioned optical semiconductor element sealing sheet The base material part in the material becomes the base material part in the display body of the present invention.

Furthermore, the sealing resin layer may be formed on the release-treated surface of the release liner. When the optical semiconductor element sealing sheet is formed on the release liner, the side of the sealing resin layer in contact with the optical semiconductor element becomes the side in contact with the release liner. When the base material portion is not provided, both surfaces of the sealing resin layer may be in contact with the release liner. The release liner can be used as a protective material for the sheet for sealing the optical semiconductor element, and will be peeled off when the optical semiconductor element is sealed. Furthermore, the base material part and the release liner do not need to be provided.

The release liner is an element used to cover and protect the surface of the optical semiconductor element sealing sheet. When the optical semiconductor element sealing sheet is bonded to a substrate on which the optical semiconductor element is arranged, the optical semiconductor element sealing sheet will be peeled off from the sheet. .

Examples of the release liner include a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, and a release liner formed by a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate release agent. Surface-coated plastic film, paper, etc.

The thickness of the release liner is, for example, 10 to 200 μm, preferably 15 to 150 μm, and more preferably 20 to 100 μm. When the thickness is 10 μm or more, the release liner is less likely to be broken due to cutting during processing. When the thickness is 200 μm or less, the release liner can be more easily peeled off from the optical semiconductor element sealing sheet during use.

One embodiment of the optical semiconductor element sealing sheet will be described using FIG. 9 . FIG. 9 is a cross-sectional view of the optical semiconductor element sealing sheet capable of forming the display shown in FIG. 2 . As shown in FIG. 9 , the optical semiconductor element sealing sheet 10 can be used to seal one or more optical semiconductor elements arranged on a substrate, and includes a base material part 5 and a sealing resin layer 7 formed on the base material part 5 . The sealing resin layer 7 is formed of a laminate of a colored layer 71 and a non-colored layer 72 . The colored layer 71 and the non-colored layer 72 both have adhesive properties and are directly laminated with each other. The release liner 6 is attached to the surface of the colored layer 71 of the sealing resin layer 7 , and the base material part 5 is attached to the surface of the non-colored layer 72 .

(Sealing step) The method for manufacturing the display of the present invention using the above-mentioned sheet for sealing optical semiconductor elements includes a sealing step of bonding the above-mentioned sheet for sealing optical semiconductor elements to a substrate on which the optical semiconductor elements are arranged. The resin layer seals the optical semiconductor element. In the above-mentioned sealing step, specifically, first, the release liner is peeled off from the above-mentioned optical semiconductor element sealing sheet to expose the sealing resin layer. Then, the exposed surface of the optical semiconductor element sealing sheet, that is, the sealing resin layer is bonded to a laminate (optical layer) including a substrate and optical semiconductor elements (preferably a plurality of optical semiconductor elements) arranged on the substrate. When the above-mentioned laminated body has a plurality of optical semiconductor elements on a substrate surface on which an optical semiconductor element is arranged, the sealing resin layer is further arranged so that the gaps between the plurality of optical semiconductor elements are filled, and the plurality of optical semiconductor elements are Optical semiconductor components are sealed in one go. Specifically, as shown in FIG. 10 , the colored layer 71 of the optical semiconductor element sealing sheet 10 from which the release liner 6 has been peeled is placed so as to face the surface of the substrate 2 on which the optical semiconductor elements 3 a to 3 c are arranged. In the arrangement, the optical semiconductor element sealing sheet 10 is bonded to the surface of the substrate 2 on which the optical semiconductor elements 3 a to 3 c are arranged, and the optical semiconductor elements 3 a to 3 c are embedded in the sealing resin layer 7 .

The temperature during the above-mentioned bonding is, for example, in the range of room temperature to 110°C. In addition, during the above-mentioned bonding, the pressure may be reduced or pressurized. By reducing or increasing pressure, the formation of gaps between the sealing resin layer and the substrate or optical semiconductor element can be suppressed. Moreover, in the above-mentioned sealing step, it is preferable to bond the optical semiconductor element sealing sheets together under reduced pressure first, and then pressurize again. The pressure during decompression is, for example, 1 to 100 Pa, and the decompression time is, for example, 5 to 600 seconds. Moreover, the pressure during pressurization is, for example, 0.05 to 0.5 MPa, and the pressurization time is, for example, 5 to 600 seconds.

By appropriately setting the thickness of the colored layer in the sealing resin layer, the temperature and pressure during lamination, etc., it is possible to adjust the followability of the colored layer in the resulting display to the optical semiconductor element and the recessed portions in the uneven shape. And the thickness of the colored layer in each area of the convex part. Thereby, the obtained display can be in a form that satisfies the above formula (1).

(Radiation irradiation step) When the sealing resin layer includes a radiation curable resin layer, the manufacturing method may further include a radiation irradiation step of irradiating the substrate, an optical semiconductor element disposed on the substrate, and applying the light The laminated body of the optical semiconductor element sealing sheet for semiconductor element sealing is irradiated with radiation to harden the radiation curable resin layer to form a cured material layer. Examples of the radiation include, as mentioned above, electron beams, ultraviolet rays, α-rays, β-rays, γ-rays, X-rays, and the like. Among them, ultraviolet rays are preferred. The temperature during radiation irradiation is, for example, in the range of room temperature to 100°C, and the irradiation time is, for example, 1 minute to 1 hour.

(cutting step) The manufacturing method may further include a cutting step of cutting a laminate including the substrate, the optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet that seals the optical semiconductor element. Regarding the above-mentioned laminated body, the above-mentioned cutting step may also be performed on the laminated body that has undergone the above-mentioned radiation irradiation step. When the above-mentioned laminated body has a cured material layer obtained by curing the radiation-curable resin layer by the above-mentioned radiation irradiation, in the above-mentioned cutting step, the cured material layer of the optical semiconductor element sealing sheet and the side end portion of the substrate are cut And remove them. This allows the surface of the hardened material layer, which is sufficiently hardened and has low adhesiveness, to be exposed on the side. The above-mentioned cutting can be performed by a known or even conventional method, for example, by using a cutting knife or laser irradiation.

(Collage steps) The above-mentioned manufacturing method may further include a collage step in which the plurality of display bodies obtained in the above-mentioned cutting step are arranged in contact along the plane direction. In the above-mentioned collage step, the plurality of laminated bodies obtained in the above-mentioned cutting step are arranged in contact with each other along the plane direction to perform collage. In this way, a larger display can be produced.

By operating as described above, the display body of the present invention can be produced. When the sealing resin layer 7 in the optical semiconductor element sealing sheet 10 does not have a radiation curable resin layer, the sealing resin layer 7 becomes the sealing resin layer 4 in the display 1 . On the other hand, in the optical semiconductor element sealing sheet 10, when the sealing resin layer 7 has a radiation curable resin layer, for example, when the non-colored layer 72 is a radiation curable resin layer, by making the non-colored layer 72 hardens to form a non-colored layer 42, which becomes the sealing resin layer 4.

1: Display body 2: Substrate 3, 3': Pixels 3a to 3f: Optical semiconductor element 4: Sealing resin layer 5: Base material part 6: Release liner 7: Sealing resin layer 10: Optical semiconductor element sealing sheet 11: Optical member 31: Support 41: Colored layer 42: Non-colored layer 43: Diffusion functional layer (non-colored layer) 71: Colored layer 72: Non-colored layer C: Midpoint F _A , F _B , F _C , L _A , L _B , L _C , R _A , R _B , R _C : light G _A , G _B : center of gravity L _A , L _AC : distance L _AC tanθ: height N: concave part P: convex part P _A , P _C : Vertical line T: point T _A , T _C : end θ: angle

FIG. 1 is a partial top view of an optical component in which a plurality of optical semiconductor elements are arranged on a substrate in units of pixels. FIG. 2 is a partial cross-sectional view showing one embodiment of the display body of the present invention. Figure 3 is a partial enlarged view of the display body shown in Figure 2. FIG. 4 is a partial cross-sectional view showing how the optical semiconductor element of the display shown in FIG. 2 emits light. FIG. 5 is a partial cross-sectional view showing how the optical semiconductor element of the conventional display emits light. FIG. 6 is a partial cross-sectional view showing another embodiment of the display body of the present invention. FIG. 7 is a partial cross-sectional view showing yet another embodiment of the display body of the present invention. FIG. 8 is a partial cross-sectional view showing yet another embodiment of the display body of the present invention. FIG. 9 is a cross-sectional view showing one embodiment of the optical semiconductor element sealing sheet of the present invention. FIG. 10 is a partial cross-sectional view showing a step of sealing an optical semiconductor element using the optical semiconductor element sealing sheet shown in FIG. 9 .

1:Display body

2:Substrate

3a, 3b, 3c: Optical semiconductor components

4:Sealing resin layer

5:Substrate Department

31:Support

41: Shading layer

42:Non-shading layer

N: concave part

P: convex part

Claims (10)

A display body comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer for sealing the plurality of optical semiconductor elements, wherein the sealing resin layer includes a colored layer and a non-colored layer, and the substrate is provided The distance from the surface to the front-side end _TA of the center of gravity of the first optical semiconductor element is L _A , and the distance from the surface of the above-mentioned substrate to the front-side end _TC of the above-mentioned colored layer relative to the perpendicular line to the above-mentioned substrate surface The distance is set to L _C , and the above-mentioned vertical line is the midpoint passing through the center of gravity of the above-mentioned first optical semiconductor element and the center of gravity of the second optical semiconductor element adjacent to the above-mentioned first optical semiconductor element in the same pixel, and will pass through the above-mentioned end portion Let the distance from the perpendicular line _TA and relative to the surface of the substrate to the perpendicular line passing through the end _TC and relative to the surface of the substrate be L _AC , and the distance from the end _TA to the perpendicular line passing through the end _TC and relative to the When the angle of elevation of the vertical line looking up from the surface of the substrate is θ°, the following equation (1) is satisfied: L _C ≦L _A + L _AC tanθ (1). The display according to claim 1, wherein the sealing resin layer includes the colored layer and the non-colored layer in order from the optical semiconductor element side. The display of claim 1, wherein the sealing resin layer includes a diffusion functional layer. The display body according to claim 3, wherein the sealing resin layer includes the diffusion functional layer, the colored layer and the non-colored layer in order from the side of the optical semiconductor element. The display body according to any one of claims 1 to 4 is provided with a self-luminous display device. The display body of any one of claims 1 to 4 is an image display device. The display according to any one of claims 1 to 5, wherein the height of the optical semiconductor element on the substrate is 500 μm or less. A sheet for sealing optical semiconductor elements, which is a sheet used to seal a plurality of optical semiconductor elements arranged on a substrate, and the sheet is provided with a sealing resin layer including a colored layer and a non-colored layer. By the above-mentioned The sealing resin layer seals the plurality of optical semiconductor elements to form the sealing resin layer. Let the distance from the surface of the substrate to the end _TA on the front side of the center of gravity of the first optical semiconductor element be L _A . Let L _C be the distance from the surface to the end _TC on the front side of the colored layer with respect to the perpendicular line to the substrate surface, which passes through the center of gravity of the first optical semiconductor element and the first optical semiconductor element at The midpoint of the center of gravity of adjacent second optical semiconductor elements in the same pixel is the distance from a perpendicular line passing through the end _TA and relative to the substrate surface to a perpendicular line passing through the end _TC and relative to the substrate surface. is L _AC , and when the angle of elevation from the end _TA to the vertical line passing through the end _TC and looking upward with respect to the surface of the substrate is θ°, the following equation (1) can be satisfied: L _C ≦L _A + L _AC tanθ (1). The sheet for sealing optical semiconductor elements according to claim 8, wherein the sealing resin layer includes a diffusion functional layer. The sheet for sealing optical semiconductor elements according to claim 9, wherein the sealing resin layer includes the diffusion functional layer, the colored layer, and the non-colored layer in this order.