JP2023127537A - 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法 - Google Patents

情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法 Download PDF

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Publication number
JP2023127537A
JP2023127537A JP2022194728A JP2022194728A JP2023127537A JP 2023127537 A JP2023127537 A JP 2023127537A JP 2022194728 A JP2022194728 A JP 2022194728A JP 2022194728 A JP2022194728 A JP 2022194728A JP 2023127537 A JP2023127537 A JP 2023127537A
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JP
Japan
Prior art keywords
substrate
finishing
information
cleaning
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022194728A
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English (en)
Japanese (ja)
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JP2023127537A5 (enExample
Inventor
健一 武渕
Kenichi Takebuchi
賢一郎 斎藤
Kenichiro Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2022194728A priority Critical patent/JP2023127537A/ja
Priority to US18/841,820 priority patent/US20250173611A1/en
Priority to CN202380024431.9A priority patent/CN118830059A/zh
Priority to PCT/JP2023/005241 priority patent/WO2023166991A1/ja
Priority to KR1020247032020A priority patent/KR20240158923A/ko
Priority to TW112106430A priority patent/TW202348349A/zh
Publication of JP2023127537A publication Critical patent/JP2023127537A/ja
Publication of JP2023127537A5 publication Critical patent/JP2023127537A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/20—Ensemble learning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Data Mining & Analysis (AREA)
  • Mathematical Physics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Artificial Intelligence (AREA)
  • Medical Informatics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computing Systems (AREA)
  • Evolutionary Computation (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2022194728A 2022-03-01 2022-12-06 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法 Pending JP2023127537A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022194728A JP2023127537A (ja) 2022-03-01 2022-12-06 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
US18/841,820 US20250173611A1 (en) 2022-03-01 2023-02-15 Information processing apparatus, inference apparatus, machine-learning apparatus, information processing method, inference method, and machine-learning method
CN202380024431.9A CN118830059A (zh) 2022-03-01 2023-02-15 信息处理装置、推论装置、机器学习装置、信息处理方法、推论方法、及机器学习方法
PCT/JP2023/005241 WO2023166991A1 (ja) 2022-03-01 2023-02-15 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
KR1020247032020A KR20240158923A (ko) 2022-03-01 2023-02-15 정보 처리 장치, 추론 장치, 기계 학습 장치, 정보 처리 방법, 추론 방법 및 기계 학습 방법
TW112106430A TW202348349A (zh) 2022-03-01 2023-02-22 資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022031214 2022-03-01
JP2022031214 2022-03-01
JP2022194728A JP2023127537A (ja) 2022-03-01 2022-12-06 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法

Publications (2)

Publication Number Publication Date
JP2023127537A true JP2023127537A (ja) 2023-09-13
JP2023127537A5 JP2023127537A5 (enExample) 2025-11-13

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JP2022194728A Pending JP2023127537A (ja) 2022-03-01 2022-12-06 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法

Country Status (6)

Country Link
US (1) US20250173611A1 (enExample)
JP (1) JP2023127537A (enExample)
KR (1) KR20240158923A (enExample)
CN (1) CN118830059A (enExample)
TW (1) TW202348349A (enExample)
WO (1) WO2023166991A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025249225A1 (ja) * 2024-05-29 2025-12-04 東京エレクトロン株式会社 コンピュータプログラム、学習モデルの生成方法、情報処理方法及び情報処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07147264A (ja) 1993-11-22 1995-06-06 Tokyo Electron Ltd 搬送装置
JP2003156509A (ja) 2001-11-22 2003-05-30 Matsushita Electric Works Ltd 半導体加速度センサおよびその製造方法
KR20070055920A (ko) * 2005-11-28 2007-05-31 주식회사 하이닉스반도체 반도체 소자의 박막 형성 방법
JP7220573B2 (ja) * 2019-01-24 2023-02-10 株式会社荏原製作所 情報処理システム、情報処理方法、プログラム及び基板処理装置
JP2021132183A (ja) * 2020-02-21 2021-09-09 東京エレクトロン株式会社 情報処理装置、情報処理方法及びコンピュータ読み取り可能な記録媒体

Also Published As

Publication number Publication date
TW202348349A (zh) 2023-12-16
US20250173611A1 (en) 2025-05-29
CN118830059A (zh) 2024-10-22
KR20240158923A (ko) 2024-11-05
WO2023166991A1 (ja) 2023-09-07

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