JP2023124334A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2023124334A
JP2023124334A JP2022028040A JP2022028040A JP2023124334A JP 2023124334 A JP2023124334 A JP 2023124334A JP 2022028040 A JP2022028040 A JP 2022028040A JP 2022028040 A JP2022028040 A JP 2022028040A JP 2023124334 A JP2023124334 A JP 2023124334A
Authority
JP
Japan
Prior art keywords
film
semiconductor device
passivation film
cap
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022028040A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023124334A5 (https=
Inventor
照弘 桑島
Teruhiro Kuwajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2022028040A priority Critical patent/JP2023124334A/ja
Priority to US17/993,350 priority patent/US20230275051A1/en
Publication of JP2023124334A publication Critical patent/JP2023124334A/ja
Publication of JP2023124334A5 publication Critical patent/JP2023124334A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP2022028040A 2022-02-25 2022-02-25 半導体装置 Pending JP2023124334A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022028040A JP2023124334A (ja) 2022-02-25 2022-02-25 半導体装置
US17/993,350 US20230275051A1 (en) 2022-02-25 2022-11-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022028040A JP2023124334A (ja) 2022-02-25 2022-02-25 半導体装置

Publications (2)

Publication Number Publication Date
JP2023124334A true JP2023124334A (ja) 2023-09-06
JP2023124334A5 JP2023124334A5 (https=) 2024-07-24

Family

ID=87761231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022028040A Pending JP2023124334A (ja) 2022-02-25 2022-02-25 半導体装置

Country Status (2)

Country Link
US (1) US20230275051A1 (https=)
JP (1) JP2023124334A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230317648A1 (en) * 2022-03-04 2023-10-05 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor Devices and Methods of Manufacture

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283042A (ja) * 1987-05-14 1988-11-18 Fuji Electric Co Ltd 半導体素子
JPH03153049A (ja) * 1989-11-10 1991-07-01 Fujitsu Ltd 半導体装置
JP2014187073A (ja) * 2013-03-21 2014-10-02 Renesas Electronics Corp 半導体装置およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283042A (ja) * 1987-05-14 1988-11-18 Fuji Electric Co Ltd 半導体素子
JPH03153049A (ja) * 1989-11-10 1991-07-01 Fujitsu Ltd 半導体装置
JP2014187073A (ja) * 2013-03-21 2014-10-02 Renesas Electronics Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
US20230275051A1 (en) 2023-08-31

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