JP2023122466A - 熱伝導性シリコーン組成物および該組成物を用いた熱伝導性硬化物の製造方法 - Google Patents

熱伝導性シリコーン組成物および該組成物を用いた熱伝導性硬化物の製造方法 Download PDF

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Publication number
JP2023122466A
JP2023122466A JP2022026196A JP2022026196A JP2023122466A JP 2023122466 A JP2023122466 A JP 2023122466A JP 2022026196 A JP2022026196 A JP 2022026196A JP 2022026196 A JP2022026196 A JP 2022026196A JP 2023122466 A JP2023122466 A JP 2023122466A
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Japan
Prior art keywords
component
mass
thermally conductive
mpa
parts
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JP2022026196A
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Japanese (ja)
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JP2023122466A5 (https=
Inventor
和哉 酒井
Kazuya Sakai
百合菜 佐藤
Yurina Sato
俊介 山田
Shunsuke Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacker Asahikasei Silicone Co Ltd
Original Assignee
Wacker Asahikasei Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Wacker Asahikasei Silicone Co Ltd filed Critical Wacker Asahikasei Silicone Co Ltd
Priority to JP2022026196A priority Critical patent/JP2023122466A/ja
Priority to KR1020247030061A priority patent/KR20240144382A/ko
Priority to CN202380022827.XA priority patent/CN118742608A/zh
Priority to EP23701343.8A priority patent/EP4482899A1/en
Priority to PCT/EP2023/051128 priority patent/WO2023160907A1/en
Priority to US18/836,761 priority patent/US20250145877A1/en
Publication of JP2023122466A publication Critical patent/JP2023122466A/ja
Publication of JP2023122466A5 publication Critical patent/JP2023122466A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022026196A 2022-02-22 2022-02-22 熱伝導性シリコーン組成物および該組成物を用いた熱伝導性硬化物の製造方法 Pending JP2023122466A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022026196A JP2023122466A (ja) 2022-02-22 2022-02-22 熱伝導性シリコーン組成物および該組成物を用いた熱伝導性硬化物の製造方法
KR1020247030061A KR20240144382A (ko) 2022-02-22 2023-01-18 열전도성 실리콘 조성물 및 상기 조성물을 사용하는 열전도성 경화물의 제조 방법
CN202380022827.XA CN118742608A (zh) 2022-02-22 2023-01-18 导热硅酮组合物及使用该组合物生产导热固化产品的方法
EP23701343.8A EP4482899A1 (en) 2022-02-22 2023-01-18 Thermally conductive silicone composition and method for producing thermally conductive cured product using the composition
PCT/EP2023/051128 WO2023160907A1 (en) 2022-02-22 2023-01-18 Thermally conductive silicone composition and method for producing thermally conductive cured product using the composition
US18/836,761 US20250145877A1 (en) 2022-02-22 2023-01-18 Thermally conductive silicone composition and method for producing thermally conductive cured product using the composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022026196A JP2023122466A (ja) 2022-02-22 2022-02-22 熱伝導性シリコーン組成物および該組成物を用いた熱伝導性硬化物の製造方法

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JP2023122466A true JP2023122466A (ja) 2023-09-01
JP2023122466A5 JP2023122466A5 (https=) 2024-09-10

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JP2022026196A Pending JP2023122466A (ja) 2022-02-22 2022-02-22 熱伝導性シリコーン組成物および該組成物を用いた熱伝導性硬化物の製造方法

Country Status (6)

Country Link
US (1) US20250145877A1 (https=)
EP (1) EP4482899A1 (https=)
JP (1) JP2023122466A (https=)
KR (1) KR20240144382A (https=)
CN (1) CN118742608A (https=)
WO (1) WO2023160907A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025166825A1 (en) * 2024-02-09 2025-08-14 Wacker Chemie Ag A polysiloxane composition
CN119039789B (zh) * 2024-08-30 2025-09-26 北京康美特科技股份有限公司 一种导热硅橡胶及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010100714A (ja) * 2008-10-23 2010-05-06 Shin-Etsu Chemical Co Ltd 液状シリコーンゴムベースコンパウンドの製造方法及び液状シリコーンゴム組成物
JP2016053140A (ja) * 2014-09-04 2016-04-14 信越化学工業株式会社 シリコーン組成物
WO2019138991A1 (ja) * 2018-01-15 2019-07-18 信越化学工業株式会社 シリコーン組成物
WO2020075411A1 (ja) * 2018-10-12 2020-04-16 信越化学工業株式会社 付加硬化型シリコーン組成物及びその製造方法
WO2020084899A1 (ja) * 2018-10-22 2020-04-30 信越化学工業株式会社 付加硬化型シリコーン組成物
WO2020137086A1 (ja) * 2018-12-25 2020-07-02 富士高分子工業株式会社 熱伝導組成物及びこれを用いた熱伝導性シート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4676671B2 (ja) * 2002-11-21 2011-04-27 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー組成物
KR102625362B1 (ko) * 2017-07-24 2024-01-18 다우 도레이 캄파니 리미티드 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체
WO2020013910A1 (en) 2018-07-12 2020-01-16 Applied Materials, Inc Constraint programming using block-based workflows
KR102952088B1 (ko) * 2019-03-29 2026-04-15 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
JP7082959B2 (ja) 2019-07-30 2022-06-09 富士高分子工業株式会社 熱伝導性組成物及びその製造方法
CN112980196A (zh) 2019-12-18 2021-06-18 富士高分子工业株式会社 导热性组合物、导热性片材及其制造方法
JP2021117302A (ja) 2020-01-23 2021-08-10 トヨタ自動車株式会社 エージェントシステム、エージェントサーバおよびエージェントプログラム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010100714A (ja) * 2008-10-23 2010-05-06 Shin-Etsu Chemical Co Ltd 液状シリコーンゴムベースコンパウンドの製造方法及び液状シリコーンゴム組成物
JP2016053140A (ja) * 2014-09-04 2016-04-14 信越化学工業株式会社 シリコーン組成物
WO2019138991A1 (ja) * 2018-01-15 2019-07-18 信越化学工業株式会社 シリコーン組成物
WO2020075411A1 (ja) * 2018-10-12 2020-04-16 信越化学工業株式会社 付加硬化型シリコーン組成物及びその製造方法
WO2020084899A1 (ja) * 2018-10-22 2020-04-30 信越化学工業株式会社 付加硬化型シリコーン組成物
WO2020137086A1 (ja) * 2018-12-25 2020-07-02 富士高分子工業株式会社 熱伝導組成物及びこれを用いた熱伝導性シート

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Publication number Publication date
US20250145877A1 (en) 2025-05-08
EP4482899A1 (en) 2025-01-01
WO2023160907A1 (en) 2023-08-31
KR20240144382A (ko) 2024-10-02
CN118742608A (zh) 2024-10-01

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