JP2023118616A - Barrier substrate, laminate, laminate for packaging material and package - Google Patents

Abstract

To improve the gas barrier properties of a barrier substrate suitable for e.g. a laminate.SOLUTION: A barrier substrate has an unstretched resin substrate having at least a polypropylene resin layer and a gas barrier resin layer, and a vapor-deposition film provided on the gas barrier resin layer. The resin substrate is formed by the co-extrusion inflation method.SELECTED DRAWING: None

Description

TECHNICAL FIELD The present disclosure relates to barrier substrates, laminates, laminates for packaging materials, and packaging containers.

Conventionally, a resin film made of a resin material has been used as a packaging material. For example, a resin film made of polyolefin is widely used as a packaging material because it has moderate flexibility and transparency and excellent heat-sealing properties.

A resin film made of polyolefin is usually inferior in terms of strength and heat resistance, so it cannot be used as a base material, and is used by laminating it with a resin film made of polyester, polyamide, or the like. Therefore, a typical packaging container is composed of a laminated film in which the base material and the sealant layer are made of different materials (for example, Patent Document 1).

In recent years, along with the increasing demand for building a recycling-oriented society, there is a demand for packaging materials with high recyclability. However, conventional packaging containers are composed of different types of resin materials, and it is difficult to separate them by resin material, so the current situation is that they are not actively recycled.

JP 2009-202519 A

The present inventors are considering using a stretched polyolefin film as a substrate instead of a conventional resin film made of polyester or polyamide, etc., and combining the substrate with a sealant layer made of polyolefin. did. With such a configuration, both the base material and the sealant layer are made of polyolefin, so the recyclability of the packaging material can be improved. However, such a structure does not have sufficient gas barrier properties.

Accordingly, the present inventors have studied a laminate provided with a barrier substrate having a polyolefin resin layer and a deposited film between the substrate and the sealant layer. However, even with such a configuration, the gas barrier property was still insufficient.

One of the problems to be solved by the present disclosure is to improve the gas barrier property of a barrier substrate that can be suitably used in, for example, the laminate.

The barrier substrate of the present disclosure includes at least an unstretched resin substrate having at least a polyolefin resin layer and a gas-barrier resin layer, and a vapor-deposited film provided on the gas-barrier resin layer, the resin substrate comprising: It is formed into a film by a co-extrusion inflation method.

According to the present disclosure, it is possible to improve the gas barrier properties of a barrier substrate that can be suitably used in the laminate, for example.

FIG. 1 is a schematic cross-sectional view showing one embodiment of a barrier substrate. FIG. 2 is a schematic cross-sectional view showing one embodiment of the barrier substrate. FIG. 3 is a schematic cross-sectional view showing one embodiment of the laminate. FIG. 4 is a schematic cross-sectional view showing one embodiment of the laminate. FIG. 5 is a schematic cross-sectional view showing one embodiment of the laminate. FIG. 6 is a perspective view showing one embodiment of the packaging container. FIG. 7 is a perspective view showing one embodiment of the packaging container.

Hereinafter, embodiments of the present disclosure will be described in detail. This disclosure may be embodied in many different forms and should not be construed as limited to the description of the illustrative embodiments below. In order to make the description clearer, the drawings may schematically represent the width, thickness, shape, etc. of each layer compared to the embodiment, but this is only an example and does not limit the interpretation of the present disclosure. . In this specification and each figure, elements similar to those already described with respect to previous figures may be denoted by the same reference numerals, and detailed description thereof may be omitted as appropriate.

In the following description, each component appearing (e.g., polyolefins such as polypropylene and polyethylene, α-olefins, resin materials, gas barrier resins, additives, metals and inorganic oxides) may be used alone. More than seeds may be used.

[Barrier substrate]
The barrier base material of the present disclosure includes at least an unstretched resin base material and a deposited film. The resin substrate includes at least a polyolefin resin layer and a gas barrier resin layer. With such a configuration, for example, the strength, oxygen barrier properties, and water vapor barrier properties of the barrier substrate can be improved. The resin substrate may further include an adhesive resin layer between the polyolefin resin layer and the gas barrier resin layer. Thereby, for example, the adhesion between these layers can be further improved.

The vapor deposition film is provided on the gas barrier resin layer of the resin substrate.
In one embodiment, the barrier substrate of the present disclosure includes a polyolefin resin layer, optionally an adhesive resin layer, a gas barrier resin layer, and a deposited film in this order in the thickness direction.

The barrier substrate 10 shown in FIG. 1 includes an unstretched resin substrate 11 having a polyolefin resin layer 12 and a gas-barrier resin layer 14, and a deposited film 15. As shown in FIG. In the barrier substrate 10 shown in FIG. 2 , an unstretched resin substrate 11 has an adhesive resin layer 13 between a polyolefin resin layer 12 and a gas barrier resin layer 14 .

The resin substrate is an unstretched resin substrate, preferably an unstretched coextruded resin substrate formed by a coextrusion inflation method, and each layer constituting the resin substrate is a coextruded resin layer. be.

The co-extrusion inflation method includes an air-cooled inflation method and a water-cooled inflation method. The air-cooled inflation method is preferable, and the upward air-cooled inflation method is more preferable, because the film formation speed is high and a wide film can be formed.

Melt extruders used in the coextrusion inflation method include, for example, single screw extruders, twin screw extruders, vent extruders and tandem extruders. Since the resin substrate has a multi-layer structure, a multi-layer annular die and multiple melt extruders are used.

One embodiment of the co-extrusion inflation method is described below.
First, after drying the materials constituting each layer, they are supplied to a melt extruder heated to a temperature above the melting point (Tm) to Tm + 100 ° C., melted, and Extrude into a cylinder. At this time, air is sent from below into the cylindrical molten resin to expand the diameter of the cylinder to a predetermined size, and cooling air is sent outside the cylinder from below. This expanded cylindrical body is called a bubble. Subsequently, the bubble is folded into a film by means of guide plates and pinch rolls and wound up in a winding section. The folded film may be wound as it is in a cylindrical shape, or both ends of the cylinder may be removed by a slitter or the like, cut into two films, and then each film may be wound. Thereby, an unstretched resin base material can be molded.

The thickness of the resin substrate is preferably 6 μm or more and 110 μm or less, more preferably 12 μm or more and 60 μm or less. When the thickness is at least the lower limit value, for example, the recyclability of the packaging container can be improved. When the thickness is equal to or less than the upper limit, for example, the processability of the barrier substrate can be improved.

<Polyolefin resin layer>
In one embodiment, the polyolefin resin layer contains polyolefin as a main component, that is, in a range of more than 50% by mass. Polyolefins include, for example, polypropylene, polyethylene and polymethylpentene. As the polyolefin resin layer, a polypropylene resin layer and a polyethylene resin layer are preferable.

The melt flow rate (MFR) of the polyolefin is preferably 0.1 g/10 min or more and 50 g/10 min or less, more preferably 0.2 g/10 min or more and 30 g/10 min or less, from the viewpoint of film formability and processability. , more preferably 0.5 g/10 min or more and 10 g/10 min or less. In the present disclosure, the MFR of polyolefin is measured by A method under the condition of a load of 2.16 kg according to JIS K7210. The MFR measurement temperature is set according to the melting point of the polyolefin, etc. For example, it is 190° C. for polyethylene and 230° C. for polypropylene.

The resin substrate is preferably made by a coextrusion inflation method. Therefore, the MFR of the polyolefin is particularly preferably 0.2 g/10 min or more and 5.0 g/10 min or less, or 0.2 g/10 min or more and 2.0 g/10 min or less. When the MFR is at least the lower limit, for example, the processability of the barrier substrate can be improved. When the MFR is equal to or lower than the upper limit, for example, film formability can be improved.

The polyolefin content in the polyolefin resin layer is preferably more than 50% by mass, more preferably 80% by mass or more, still more preferably 85% by mass or more, even more preferably 90% by mass or more, and particularly preferably 95% by mass. That's it.

The polyolefin resin layer may contain resin materials other than polyolefin. Examples of such resin materials include (meth)acrylic resins, vinyl resins, cellulose resins, polyamides, polyesters and ionomer resins.

The polyolefin resin layer may contain additives. Examples of additives include cross-linking agents, antioxidants, anti-blocking agents, slip agents, UV absorbers, light stabilizers, fillers, reinforcing agents, antistatic agents, compatibilizers, pigments and modifiers. resins for

In one embodiment, the polyolefin resin layer may be surface-treated. Thereby, for example, the adhesion between the polyolefin resin layer and other layers can be improved. Examples of surface treatment methods include physical treatments such as corona discharge treatment, ozone treatment, low-temperature plasma treatment using oxygen gas and/or nitrogen gas, glow discharge treatment; and oxidation treatment using chemicals. Chemical treatment can be mentioned.
An easy-adhesion layer may be provided on the surface of the polyolefin resin layer.

The polyolefin resin layer may have a single layer structure or a multilayer structure. When the polyolefin resin layer has a multi-layer structure, the number of layers of the polyolefin resin layer is, for example, 2 or more and 7 or less, preferably 3 or more and 5 or less.

The thickness of the polyolefin resin layer is preferably 5 μm or more and 100 μm or less, more preferably 10 μm or more and 50 μm or less. When the polyolefin resin layer has a multilayer structure, the total thickness is preferably within the above range. When the thickness is at least the lower limit, for example, the strength, heat resistance and recyclability of the barrier substrate can be improved. When the thickness is equal to or less than the upper limit, for example, the processability of the barrier substrate can be improved.

(Polypropylene resin layer)
The polypropylene resin layer, in one embodiment, contains polypropylene as a main component, that is, in a range of more than 50% by mass. By providing the barrier substrate of the present disclosure with a polypropylene resin layer, for example, the oil resistance of a packaging container produced using the barrier substrate can be improved.

The polypropylene may be a propylene homopolymer (homopolypropylene), a propylene random copolymer (random polypropylene) or a propylene block copolymer (block polypropylene), or a mixture of two or more selected from these. As the polypropylene, biomass-derived polypropylene, mechanically recycled or chemically recycled polypropylene may be used from the viewpoint of reducing the environmental load.

A propylene homopolymer is a polymer of propylene only. A propylene random copolymer is a random copolymer of propylene and an α-olefin other than propylene. A propylene block copolymer is a copolymer having a polymer block composed of propylene and a polymer block composed of an α-olefin other than propylene.

Examples of α-olefins other than propylene include α-olefins having 2 to 20 carbon atoms, specifically ethylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1- Decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, 3-methyl-1-butene, 4-methyl-1-pentene and 6-methyl-1-heptene.

Among polypropylenes, propylene random copolymers are preferably used from the viewpoint of transparency. When the rigidity and heat resistance of the packaging container are important, it is preferable to use a propylene homopolymer. A propylene block copolymer is preferably used when the impact resistance of the packaging container is important.

Density of polypropylene is, for example, 0.88 g/cm ³ or more and 0.92 g/cm ³ or less. In the present disclosure, density is measured according to JIS K7112, particularly D method (density gradient tube method, 23°C).

From the viewpoint of heat resistance, the melting point (Tm) of polypropylene is, for example, 120° C. or higher and 170° C. or lower, preferably 125° C. or higher and 170° C. or lower, more preferably 140° C. or higher and 170° C. or lower. In the present disclosure, Tm is obtained by differential scanning calorimetry (DSC) according to JIS K7121.

The content of polypropylene in the polypropylene resin layer is preferably more than 50% by mass, more preferably 80% by mass or more, still more preferably 85% by mass or more, even more preferably 90% by mass or more, particularly preferably 95% by mass. That's it.

The polypropylene resin layer may have a single layer structure or a multilayer structure.
When the polypropylene resin layer has a multilayer structure, the number of layers of the polypropylene resin layer is, for example, 2 or more and 7 or less, preferably 3 or more and 5 or less. The polypropylene resin layer, in one embodiment, comprises a first layer composed of random polypropylene, a second layer composed of random polypropylene, and a third layer composed of random polypropylene. Here, the first layer faces the gas barrier resin layer side.

The ratio of the thickness of the first layer to the total thickness of the polypropylene resin layer is preferably 30% or more and 70% or less, more preferably 35% or more and 65% or less, and still more preferably 40% or more and 60% or less. .
The ratio of the thickness of the second layer to the total thickness of the polypropylene resin layer is preferably 10% or more and 50% or less, more preferably 15% or more and 45% or less, and still more preferably 20% or more and 40% or less. .
The ratio of the thickness of the third layer to the total thickness of the polypropylene resin layer is preferably 5% or more and 35% or less, more preferably 10% or more and 30% or less, and still more preferably 15% or more and 25% or less. .

(Polyethylene resin layer)
In one embodiment, the polyethylene resin layer contains polyethylene as a main component, that is, in a range of more than 50% by mass. In the present disclosure, polyethylene refers to a polymer containing 50 mol % or more of ethylene-derived structural units in all repeating structural units. In this polymer, the content of ethylene-derived structural units is preferably 70 mol % or more, more preferably 80 mol % or more, still more preferably 90 mol % or more, and particularly preferably 95 mol % or more. The content ratio can be measured by the NMR method.

Polyethylene may be an ethylene homopolymer or a copolymer of ethylene and an ethylenically unsaturated monomer other than ethylene. Examples of ethylenically unsaturated monomers other than ethylene include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, and 1-octadecene. , 1-eicosene, 3-methyl-1-butene, 4-methyl-1-pentene and 6-methyl-1-heptene, α-olefins having 2 to 20 carbon atoms; vinyls such as vinyl acetate and vinyl propionate monomers; and (meth)acrylic acid esters such as methyl (meth)acrylate and ethyl (meth)acrylate.

Polyethylene includes, for example, high density polyethylene, medium density polyethylene, low density polyethylene, linear low density polyethylene and ultra low density polyethylene. From the viewpoint of the strength and heat resistance of the barrier substrate, high-density polyethylene and medium-density polyethylene are preferred. Linear low-density polyethylene and medium-density polyethylene are preferred from the viewpoint of film-forming processability of the barrier substrate. As the polyethylene, biomass-derived polyethylene, or mechanically recycled or chemically recycled polyethylene may be used from the viewpoint of reducing the environmental load.

In the present disclosure, the density of the polyethylene is as follows.
The density of high density polyethylene is preferably greater than 0.945 g/ ^cm3 . The upper density limit of high-density polyethylene is, for example, 0.965 g/cm ³ . The density of medium density polyethylene is preferably greater than 0.930 g/cm ³ and less than or equal to 0.945 g/cm ³ . The density of the low density polyethylene is preferably greater than 0.900 g/cm ³ and less than or equal to 0.930 g/cm ³ . The density of the linear low-density polyethylene is preferably greater than 0.900 g/cm ³ and less than or equal to 0.930 g/cm ³ . The density of the ultra-low density polyethylene is preferably 0.900 g/cm ³ or less. The lower limit of the density of ultra-low density polyethylene is, for example, 0.860 g/cm ³ . In the present disclosure, the density is measured according to JIS K7112, particularly D method (density gradient tube method, 23°C).

Low-density polyethylene is usually polyethylene obtained by polymerizing ethylene by a high-pressure polymerization method (high-pressure low-density polyethylene). Linear low-density polyethylene is usually polyethylene obtained by polymerizing ethylene and a small amount of α-olefin by a polymerization method using a multi-site catalyst such as a Ziegler-Natta catalyst or a single-site catalyst such as a metallocene catalyst.

From the viewpoint of heat resistance, the melting point (Tm) of polyethylene is preferably 100° C. or higher and 140° C. or lower, more preferably 105° C. or higher and 140° C. or lower, still more preferably 110° C. or higher and 140° C. or lower. In the present disclosure, Tm is obtained by differential scanning calorimetry (DSC) according to JIS K7121.

Polyethylenes with different densities or branches can be obtained by appropriately selecting the polymerization method. For example, using a multi-site catalyst such as a Ziegler-Natta catalyst or a single-site catalyst such as a metallocene catalyst as a polymerization catalyst, one-stage polymerization is performed by any of gas phase polymerization, slurry polymerization, solution polymerization and high-pressure ion polymerization. Alternatively, it is preferable to carry out the polymerization in two or more stages.

The content of polyethylene in the polyethylene resin layer is preferably more than 50% by mass, more preferably 80% by mass or more, still more preferably 85% by mass or more, still more preferably 90% by mass or more, and particularly preferably 95% by mass. That's it.

The polyethylene resin layer may have a single layer structure or a multilayer structure. When the polyethylene resin layer has a multilayer structure, the number of layers of the polyethylene resin layer is, for example, 2 to 7 layers, preferably 3 to 5 layers. In one embodiment, the polyethylene resin layer is composed of a first layer composed of linear low-density polyethylene, a second layer composed of linear low-density polyethylene and medium-density polyethylene, and a medium-density polyethylene. and a third layer composed of: Thereby, for example, the balance between interlayer strength and heat resistance can be improved. Here, the first layer faces the gas barrier resin layer side.

The ratio of the thickness of the first layer to the total thickness of the polyethylene resin layer is preferably 30% or more and 70% or less, more preferably 35% or more and 65% or less, and still more preferably 40% or more and 60% or less. .
The ratio of the thickness of the second layer to the total thickness of the polyethylene resin layer is preferably 10% or more and 50% or less, more preferably 15% or more and 45% or less, and still more preferably 20% or more and 40% or less. .
The ratio of the thickness of the third layer to the total thickness of the polyethylene resin layer is preferably 5% or more and 35% or less, more preferably 10% or more and 30% or less, and still more preferably 15% or more and 25% or less. .

<Print layer>
The barrier substrate of the present disclosure may have a printed layer on the surface of the polyolefin resin layer. Images formed in the printed layer include, for example, letters, patterns, symbols, and combinations thereof. The printed layer may be formed using, for example, biomass-derived ink. Thereby, for example, the environmental load can be further reduced.

Examples of methods for forming the printed layer include conventionally known printing methods such as gravure printing, offset printing, and flexographic printing. Among these, the flexographic printing method is preferable from the viewpoint of reducing the environmental load.

<Gas barrier resin layer>
The barrier base material of the present disclosure includes a gas barrier resin layer between the polyolefin resin layer and the deposited film. With such a configuration, for example, the adhesiveness of the deposited film can be improved, and the gas barrier properties can also be improved.
The gas-barrier resin layer usually forms a surface layer on one side of the resin substrate.

The gas barrier resin layer contains a gas barrier resin. Examples of gas barrier resins include polyamides such as nylon 6, nylon 6,6 and polymetaxylylene adipamide, ethylene-vinyl alcohol copolymers, polyvinyl alcohol, polyacrylonitrile, polyesters, polyurethanes, and (meth)acrylic resins. is mentioned. Among these, polyamides and ethylene-vinyl alcohol copolymers are preferred from the viewpoint of oxygen barrier properties and water vapor barrier properties.

Polyamides include, for example, aliphatic polyamides and semi-aromatic polyamides. As the polyamide, an aliphatic polyamide is preferable, and a crystalline aliphatic polyamide is more preferable.

Aliphatic polyamides include, for example, aliphatic homopolyamides and aliphatic copolyamides. In the following examples, polyamide is also described as "PA".

Specific examples of aliphatic homopolyamides include polycaprolactam (PA6), polyenantholactam (PA7), polyundecanelactam (PA11), polylauryllactam (PA12), polyhexamethyleneadipamide (PA66), poly Tetramethylene Dodecamide (PA412), Polypentamethylene Azelamide (PA59), Polypentamethylene Sebacamide (PA510), Polypentamethylene Dodecamide (PA512), Polyhexamethylene Azelamide (PA69), Polyhexamethylene Sebacamide polyhexamethylene dodecamide (PA612), polynonamethylene adipamide (PA96), polynonamethylene azelamide (PA99), polynonamethylene sebacamide (PA910), polynonamethylene dodecamide (PA912) ), polydecamethyleneadipamide (PA106), polydecamethyleneazelamide (PA109), polydecamethylenedecamide (PA1010), polydecamethylenedodecamide (PA1012), polydodecamethyleneadipamide (PA126), poly Dodecamethyleneazelamide (PA129), Polydodecamethylenesebacamide (PA1210) and Polydodecamethylenedodecamide (PA1212).

Specific examples of aliphatic copolyamides include caprolactam/hexamethylenediaminoadipic acid copolymer (PA6/66), caprolactam/hexamethylenediaminoazelaic acid copolymer (PA6/69), caprolactam/hexamethylenediamino Sebacic acid copolymer (PA6/610), caprolactam/hexamethylenediaminoundecanoic acid copolymer (PA6/611), caprolactam/hexamethylenediaminododecanoic acid copolymer (PA6/612), caprolactam/aminoundecanoic acid copolymer coalescence (PA6/11), caprolactam/lauryllactam copolymer (PA6/12), caprolactam/hexamethylenediaminoadipic acid/lauryllactam copolymer (PA6/66/12), caprolactam/hexamethylenediaminoadipic acid/hexa Methylenediaminosebacic acid copolymer (PA6/66/610), caprolactam/hexamethylenediaminoadipic acid/hexamethylenediaminododecanedicarboxylic acid copolymer (PA6/66/612).

The relative viscosity of the aliphatic polyamide is preferably 1.5 to 5.0, more preferably 2.0 to 5.0, still more preferably 2.5 to 4.5. The relative viscosity of aliphatic polyamide is measured at 25° C. by dissolving 1 g of polyamide in 100 mL of 96% concentrated sulfuric acid in accordance with JIS K6920.

A semi-aromatic polyamide is a polyamide having a structural unit derived from an aromatic diamine and a structural unit derived from an aliphatic dicarboxylic acid, or a structural unit derived from an aliphatic diamine and an aromatic dicarboxylic acid. It is a polyamide having a structural unit. Examples thereof include polyamides composed of aromatic diamines and aliphatic dicarboxylic acids, and polyamides composed of aliphatic diamines and aromatic dicarboxylic acids.

Semi-aromatic polyamides include, for example, polyhexamethylene terephthalamide (PA6T), polyhexamethylene isophthalamide (PA6I), polynonamethylene terephthalamide (PA9T), polyhexamethylene adipamide/polyhexamethylene terephthalamide copolymer, coalescence (PA66/6T), polyhexamethylene adipamide/polyhexamethylene isophthalamide copolymer (PA66/6I), polyhexamethylene terephthalamide/polycaproamide copolymer (PA6T/6), polyhexamethylene isophthalate amide/polycaproamide copolymer (PA6I/6), polyhexamethylene terephthalamide/polydodecanamide copolymer (PA6T/12), polyhexamethylene isophthalamide/polyhexamethylene terephthalamide copolymer (PA6I/6T), Polyhexamethylene terephthalamide/poly(2-methylpentamethylene terephthalamide) copolymer (PA6T/M5T), polyhexamethylene adipamide/polyhexamethylene terephthalamide/polyhexamethylene isophthalamide copolymer (PA66/6T /6I), polyhexamethyleneadipamide/polycaproamide/polyhexamethyleneisophthalamide copolymer (PA66/6/6I) and polymetaxylyleneadipamide (PAMXD6).

The melt volume rate (MVR) of the semi-aromatic polyamide is preferably 5 cm ³ /10 min or more and 200 cm ³ /10 min or less, more preferably 10 cm ³ /10 min or more and 100 cm ³ /10 min or less. MVR is measured at a temperature of 275° C. and a load of 5 kg according to ISO1133.

In one embodiment, the gas barrier resin layer contains crystalline aliphatic polyamide. Crystalline aliphatic polyamides include, for example, PA6, PA11, PA12, PA66, PA610, PA612, PA6/66 and PA6/66/12.

The melting point (Tm) of the crystalline aliphatic polyamide is preferably 180° C. or higher and 300° C. or lower, more preferably 180° C. or higher and 250° C. or lower, still more preferably 180° C. or higher and 230° C. or lower.

In the ethylene-vinyl alcohol copolymer (EVOH), the content ratio of structural units derived from ethylene (ethylene content ratio) is preferably 20 mol% or more and 60 mol% or less, more preferably 25 mol% or more and 50 mol% or less. be. When the ethylene content is at least the lower limit, for example, the processability of the barrier substrate can be improved. When the ethylene content is equal to or lower than the upper limit, for example, the oxygen barrier properties and water vapor barrier properties of the barrier substrate can be improved. The ethylene content is measured by the NMR method.

The melting point (Tm) of EVOH is preferably 130° C. or higher and 200° C. or lower, more preferably 140° C. or higher and 195° C. or lower, and still more preferably 150° C. or higher and 190° C. or lower.

The melt flow rate (MFR) of EVOH is preferably 0.1 g/10 min or more and 30 g/10 min or less, more preferably 0.3 g/10 min or more and 20 g/10 min or less, from the viewpoint of film formability and processability. , more preferably 0.5 g/10 min or more and 10 g/10 min or less, and particularly preferably 0.5 g/10 min or more and 5.0 g/10 min or less. The MFR of EVOH is measured according to ASTM D1238 under conditions of a temperature of 190° C. and a load of 2.16 kg, but the measurement temperature may be 210° C. depending on the melting point of EVOH.

The difference between the melting point of the gas barrier resin contained in the gas barrier resin layer and the melting point of polypropylene contained in the polypropylene resin layer or the melting point of polyethylene contained in the polyethylene resin layer is preferably 100° C. or less, more preferably 80° C. or less. , and more preferably 70° C. or less. When the difference is equal to or less than the upper limit, for example, the film formability of the resin substrate can be improved.

The content of the gas barrier resin in the gas barrier resin layer is preferably 50% by mass or more, more preferably 75% by mass or more, and still more preferably 80% by mass or more, 85% by mass or more, or 90% by mass or more. Thereby, for example, the oxygen barrier property and water vapor barrier property of the barrier substrate can be improved.

The gas barrier resin layer may contain additives. Additives include, for example, crosslinkers, antioxidants, antiblocking agents, slip agents, UV absorbers, light stabilizers, fillers, reinforcing agents, antistatic agents and pigments.

The thickness of the gas barrier resin layer is preferably 0.5 μm or more and 10 μm or less, more preferably 1.0 μm or more and 5.0 μm or less, still more preferably 1.0 μm or more and 3.0 μm or less. When the thickness is at least the lower limit, for example, the oxygen barrier properties and water vapor barrier properties of the barrier substrate can be improved. When the thickness is equal to or less than the upper limit, for example, the recyclability of the barrier substrate can be improved.

In one embodiment, the thickness of the gas barrier resin layer is preferably smaller than the thickness of the polyolefin resin layer. Thereby, for example, the recyclability of the barrier substrate can be improved. The thickness of the gas-barrier resin layer is preferably 5 μm or more, more preferably 10 μm or more, less than the thickness of the polyolefin resin layer.

In conventional barrier substrates, in order to obtain high gas barrier properties, a gas barrier resin layer is arranged between polyolefin resin layers, and the thickness of the gas barrier resin layer is increased. A die and multiple melt extruder configuration was sometimes designed. The present inventors have studied a design in which the thickness of the gas barrier resin layer is small from the viewpoint of monomaterialization. In this case, gas barrier properties may not be sufficient. As a result of further investigation on this point, the present inventors provided a gas-barrier resin layer as an outer layer instead of an intermediate layer in an unstretched resin base material formed by a coextrusion inflation method. When a vapor deposition film was provided, it was found that the gas barrier property was greatly improved. With such a configuration, the gas barrier properties can be improved, and the gas barrier resin layer can be made thinner, so the polyolefin content can be increased, which is preferable in terms of monomaterialization.

<Adhesive resin layer>
The resin substrate may have an adhesive resin layer between the polyolefin resin layer and the gas barrier resin layer. Thereby, for example, the adhesion between the polyolefin resin layer and the gas barrier resin layer can be improved.

The adhesive resin layer contains a resin material. Examples of resin materials include polyolefins, modified polyolefins, vinyl resins, polyethers, polyesters, polyamides, polyurethanes, silicone resins, epoxy resins, and phenolic resins. Among these, polyolefins and modified polyolefins are preferable, and modified polyolefins such as acid-modified polyolefins are more preferable from the viewpoint of recyclability and adhesion.

Modified polyolefins include, for example, modified polyolefins, especially graft modified polyolefins, with unsaturated carboxylic acids such as maleic acid and fumaric acid, or their acid anhydrides, esters or metal salts. Among resin materials, modified polyolefin is preferable from the viewpoint of obtaining a structure suitable for monomaterial packaging materials.

The melt flow rate (MFR) of the modified polyolefin is preferably 0.1 g/10 min or more and 50 g/10 min or less, more preferably 0.3 g/10 min or more and 30 g/10 min, from the viewpoint of film formability and processability. Below, it is more preferably 0.5 g/10 min or more and 10 g/10 min or less, and particularly preferably 0.5 g/10 min or more and 5.0 g/10 min or less. The MFR of the modified polyolefin is measured according to ASTM D1238 under conditions of a temperature of 190° C. and a load of 2.16 kg, but the measurement temperature may be changed according to the melting point of the modified polyolefin.

The adhesive resin layer may contain the above additives.

The thickness of the adhesive resin layer is preferably 0.5 μm or more and 10 μm or less, more preferably 1.0 μm or more and 7.0 μm or less. When the thickness is at least the lower limit, for example, the adhesion can be improved. When the thickness is equal to or less than the upper limit, for example, the recyclability of the barrier substrate can be improved.

The resin substrate, in one embodiment, is an unstretched coextruded resin film. In one embodiment, the resin base material includes a material that forms the polyolefin resin layer, a material that forms the adhesive resin layer when the resin base material has an adhesive resin layer, and a material that forms the gas barrier resin layer. is an unstretched resin film obtained by co-extrusion film formation by a co-extrusion inflation method.

<Deposited film>
The barrier substrate of the present disclosure has a vapor deposition film on the gas barrier resin layer of the resin substrate. In one embodiment, the barrier substrate of the present disclosure has a deposited film on the surface of the gas barrier resin layer of the resin substrate. By providing a deposited film on the gas barrier resin layer, for example, the gas barrier properties of the barrier substrate of the present disclosure, specifically, oxygen barrier properties and water vapor barrier properties can be improved. Also, if the vapor deposition film is a metal vapor deposition film, the brightness can be improved. A packaging container produced using a barrier base material can suppress a decrease in mass of contents filled in the packaging container.

Deposited films include, for example, metals such as aluminum, chromium, tin, nickel, copper, silver, gold and platinum; or aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, zirconium oxide, titanium oxide, boron oxide, hafnium oxide, It is composed of inorganic oxides such as barium oxide and silicon carbide oxide (carbon-containing silicon oxide). Among these, an aluminum vapor deposition film, an aluminum oxide (alumina) vapor deposition film, a silicon oxide (silica) vapor deposition film, or a silicon oxide carbide vapor deposition film is preferable.

The thickness of the deposited film is preferably 1 nm or more and 150 nm or less, more preferably 5 nm or more and 100 nm or less, and still more preferably 10 nm or more and 80 nm or less. When the thickness is at least the lower limit, for example, the oxygen barrier properties and water vapor barrier properties of the barrier substrate can be improved. When the thickness is equal to or less than the upper limit, for example, the occurrence of cracks in the deposited film can be suppressed, and the recyclability of the packaging container can be improved.

When the vapor deposited film is an aluminum vapor deposited film, the optical density (OD value) of the aluminum vapor deposited film is preferably 2.0 or more and 3.5 or less. Thereby, for example, the oxygen barrier property and the water vapor barrier property can be improved while maintaining the productivity of the barrier substrate. The OD value can be measured according to JIS K7361.

The surface of the deposited film is preferably subjected to the surface treatment described above. As a result, for example, adhesion between the deposited film and adjacent layers can be improved.

Examples of methods for forming a deposited film include physical vapor deposition methods (physical vapor deposition methods, PVD methods) such as vacuum deposition methods, sputtering methods and ion plating methods, plasma chemical vapor deposition methods, and thermal chemical vapor deposition methods. A chemical vapor deposition method (Chemical Vapor Deposition method, CVD method) such as a growth method and a photochemical vapor deposition method can be used. The deposited film may be a composite film including two or more layers of different deposited films, which is formed using both physical vapor deposition and chemical vapor deposition.

The degree of vacuum in the vapor deposition chamber is preferably about 10 ^-2 to 10 ^-8 mbar before introducing oxygen, and about 10 ^-1 to 10 ^-6 mbar after introducing oxygen. The amount of oxygen to be introduced varies depending on the size of the vapor deposition machine. Inert gases such as argon gas, helium gas and nitrogen gas may be used as a carrier gas for oxygen to be introduced as long as there is no problem. The conveying speed of the target film on which the vapor deposition film is formed is, for example, 10 m/min or more and 800 m/min or less.

The vapor deposition film may be a single layer formed by one vapor deposition process, or may be a multilayer film formed by multiple vapor deposition processes. When the deposited film is multilayered, each layer may be composed of the same component or may be composed of different components. Each layer may be formed by the same method or by different methods.

<Barrier coat layer>
In one embodiment, the barrier substrate of the present disclosure may further include a barrier coat layer on the deposited film. That is, the barrier substrate may further include a barrier coat layer on the surface of the vapor-deposited film opposite to the polyolefin resin layer side. Thereby, for example, the oxygen barrier property and water vapor barrier property of the barrier substrate can be improved. Further, for example, when the vapor deposition film is composed of inorganic oxides such as aluminum oxide and silicon oxide, the generation of cracks in the vapor deposition film can be effectively suppressed.

In one embodiment, the barrier coat layer contains a gas barrier resin. Gas barrier resins include, for example, ethylene-vinyl alcohol copolymer, polyvinyl alcohol, polyacrylonitrile, polyester, polyamides such as nylon 6, nylon 6,6 and poly-metaxylylene adipamide, polyurethanes, and (meth)acrylic resins. is mentioned.

The content of the gas barrier resin in the barrier coat layer is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more. With such a configuration, for example, the gas barrier properties of the barrier coat layer can be improved.
The barrier coat layer may contain the above additives.

The thickness of the barrier coat layer containing the gas barrier resin is preferably 0.01 μm or more and 10 μm or less, more preferably 0.1 μm or more and 5.0 μm or less. When the thickness is at least the lower limit, for example, gas barrier properties can be improved. When the thickness is equal to or less than the upper limit, for example, the processability of the barrier substrate and the recyclability of the packaging container can be improved.

The barrier coat layer can be formed, for example, by applying and drying a coating liquid obtained by dissolving or dispersing a material such as a gas barrier resin in water or a suitable organic solvent.

In another embodiment, the barrier coat layer is prepared by mixing a metal alkoxide, a water-soluble polymer, and optionally a silane coupling agent, and optionally adding water, an organic solvent, and a sol-gel catalyst. It is a gas barrier coating film formed by applying the obtained gas barrier composition on a deposited film and drying it. The gas barrier coating film contains a hydrolyzed polycondensate obtained by hydrolyzing and polycondensing the metal alkoxide or the like by a sol-gel method. By providing such a barrier coat layer on the vapor deposition film, it is possible to effectively suppress the occurrence of cracks in the vapor deposition film when the vapor deposition film is composed of an inorganic oxide.

A metal alkoxide is represented by Formula (1), for example.
^{R1nM (} _OR2 ) _m (1)
In formula (1), R ¹ and R ² each independently represent an organic group having 1 to 8 carbon atoms, M represents a metal atom, n represents an integer of 0 or more, and m is an integer of 1 or more. and n+m represents the valence of M.

Examples of organic groups for R ¹ and R ² include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, t-butyl group, n-hexyl group and Examples thereof include alkyl groups having 1 to 8 carbon atoms such as n-octyl group.
Metal atom M is, for example, silicon, zirconium, titanium or aluminum.

Examples of metal alkoxides include alkoxysilanes such as tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, and tetrabutoxysilane.

Examples of water-soluble polymers include hydroxyl group-containing polymers such as polyvinyl alcohol and ethylene-vinyl alcohol copolymers. Either one of polyvinyl alcohol and ethylene-vinyl alcohol copolymer may be used, or both may be used in combination, depending on desired physical properties such as oxygen barrier properties, water vapor barrier properties, water resistance, and weather resistance. Alternatively, a gas barrier coating film obtained using polyvinyl alcohol and a gas barrier coating film obtained using an ethylene-vinyl alcohol copolymer may be laminated. The amount of the water-soluble polymer used is preferably 5 parts by mass or more and 500 parts by mass or less with respect to 100 parts by mass of the metal alkoxide.

As the silane coupling agent, known organic reactive group-containing organoalkoxysilanes can be used, and organoalkoxysilanes having an epoxy group are preferred, such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxy Propylmethyldiethoxysilane and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane are included. The amount of the silane coupling agent used is preferably 1 part by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the metal alkoxide.

The gas barrier composition may contain water in a proportion of preferably 0.1 mol or more and 100 mol or less, more preferably 0.5 mol or more and 60 mol or less, relative to 1 mol of the metal alkoxide. By making the water content equal to or higher than the lower limit, for example, the oxygen barrier properties and water vapor barrier properties of the barrier substrate can be improved. By making the water content equal to or less than the upper limit, for example, the hydrolysis reaction can be carried out quickly.

The gas barrier composition may contain an organic solvent. Organic solvents include, for example, methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol and n-butyl alcohol.

As the sol-gel process catalyst, an acid or amine compound is preferable.
Acids include, for example, mineral acids such as sulfuric acid, hydrochloric acid and nitric acid; and organic acids such as acetic acid and tartaric acid. The amount of the acid to be used is preferably 0.001 mol or more and 0.05 mol or less per 1 mol of the total molar amount of the metal alkoxide and the alkoxide portion (for example, silicate portion) of the silane coupling agent.

As the amine compound, tertiary amines that are substantially insoluble in water and soluble in organic solvents are suitable, such as N,N-dimethylbenzylamine, tripropylamine, tributylamine and tripentylamine. Amines are mentioned. The amount of the amine compound used is preferably 0.01 parts by mass or more and 1.0 parts by mass or less, more preferably 0.03 parts by mass or more, relative to 100 parts by mass of the total amount of the metal alkoxide and the silane coupling agent. It is 0.3 parts by mass or less.

Examples of the method of applying the gas barrier composition include application means such as roll coating such as gravure roll coater, spray coating, spin coating, dipping, brush, bar coating and applicator.

An embodiment of a method for forming a gas barrier coating film will be described below.
A gas barrier composition is prepared by mixing a metal alkoxide, a water-soluble polymer, a sol-gel catalyst, water, an organic solvent, and optionally a silane coupling agent. A polycondensation reaction proceeds gradually in the composition. The above composition is applied onto the vapor-deposited film by a conventional method and dried. This drying further promotes polycondensation of the metal alkoxide and the water-soluble polymer (and the silane coupling agent if the composition contains a silane coupling agent) to form a composite polymer layer. The above operation may be repeated to laminate a plurality of composite polymer layers. For example, the applied composition is heated at a temperature of preferably 20° C. to 150° C., more preferably 50° C. to 120° C., still more preferably 70° C. to 100° C. for 1 second to 10 minutes. Thereby, a gas barrier coating film can be formed.

The thickness of the gas barrier coating film is preferably 0.01 μm or more and 100 μm or less, more preferably 0.1 μm or more and 50 μm or less, and still more preferably 0.1 μm or more and 5.0 μm or less. As a result, for example, the gas barrier property can be improved, the occurrence of cracks in the deposited film made of the inorganic oxide can be suppressed, and the recyclability and workability of the packaging container can be improved.

[Laminate]
The laminate of the present disclosure has at least
a polyolefin resin base material;
a barrier substrate;
and a sealant layer in this order in the thickness direction.
The laminate of the present disclosure is suitable for packaging materials.

The polyolefin resin substrate is a stretched substrate, that is, a stretched substrate.
The details of the barrier substrate are as described above.
The sealant layer is a resin layer containing polyolefin.

In one embodiment, the resin constituting the polyolefin resin base material, the resin constituting the polyolefin resin layer of the barrier base material, and the resin constituting the sealant layer are all polyolefin as main components, so that, for example, the laminate Recyclability can be improved.

The laminate 1 shown in FIG. 3 includes a polyolefin resin substrate 20, an adhesive layer 40A, a barrier substrate 10, an adhesive layer 40B, and a sealant layer 30 in this order in the thickness direction. The barrier base material 10 includes an unstretched resin base material 11 having a polyolefin resin layer 12 and a gas barrier resin layer 14 and a deposited film 15 . In this example, the polyolefin resin layer 12 is in contact with the adhesive layer 40B, and the deposited film 15 is in contact with the adhesive layer 40A. In one embodiment, the laminate 1 further includes a printed layer (not shown) on the polyolefin resin substrate 20 . The printed layer is usually formed on the surface of the polyolefin resin substrate 20 on the side of the sealant layer 30 .

In the laminate 1 shown in FIG. 4 , an unstretched resin base material 11 has an adhesive resin layer 13 between a polyolefin resin layer 12 and a gas barrier resin layer 14 .

The laminate of the present disclosure comprises at least three elements: a polyolefin resin substrate, a barrier substrate and a sealant layer. The laminate of the present disclosure exhibits superior gas barrier properties (especially oxygen barrier properties and water vapor barrier properties) compared to laminates comprising two elements, a barrier substrate and a sealant layer. In addition, the layered product having such a structure appropriately protects the vapor-deposited film when subjected to heat treatment or the like, and further exhibits high gas barrier properties.

The content of polyolefin (specifically polypropylene or polyethylene) in the entire laminate of the present disclosure is preferably 80% by mass or more, more preferably 85% by mass or more, still more preferably 88% by mass or more, and particularly preferably 90% by mass. % or more. Thereby, for example, a monomaterial packaging container can be produced using a laminate, and the recyclability of the packaging container can be improved. Although the upper limit of the polyolefin content is not particularly limited, it may be, for example, 99% by mass or 95% by mass. The content ratio of polyolefin in the laminate means the ratio of the content of polyolefin to the sum of the content of the resin material in each layer constituting the laminate.

<Polyolefin resin substrate>
In one embodiment, the polyolefin resin base material contains polyolefin as a main component, that is, in a range of more than 50% by mass. Polyolefins include, for example, polypropylene, polyethylene and polymethylpentene. As the polyolefin resin base material, a polypropylene resin base material and a polyethylene resin base material are preferable.

The MFR of the polyolefin is preferably 0.1 g/10 min or more and 50 g/10 min or less, more preferably 0.2 g/10 min or more and 30 g/10 min or less, still more preferably 0, from the viewpoint of film formability and processability. 5 g/10 minutes or more and 10 g/10 minutes or less.

The polyolefin content in the polyolefin resin substrate is preferably greater than 50% by mass, more preferably 80% by mass or more, still more preferably 85% by mass or more, even more preferably 90% by mass or more, and particularly preferably 95% by mass. % or more.

The polyolefin resin substrate may contain resin materials other than polyolefin. Examples of such resin materials include (meth)acrylic resins, vinyl resins, cellulose resins, polyamides, polyesters and ionomer resins.

The polyolefin resin substrate may contain the above additives.

The polyolefin resin base material is a base material that has been stretched. Thereby, for example, the strength, heat resistance and transparency of the substrate can be improved. The stretching treatment may be uniaxial stretching or biaxial stretching.

The stretching ratio in the case of stretching in the longitudinal direction (flow direction of the base material, MD direction) is preferably 2 to 10 times, more preferably 3 to 7 times. The stretching ratio in the case of stretching in the transverse direction (direction perpendicular to the MD direction, TD direction) is preferably 2 to 10 times, more preferably 3 to 7 times. By setting the draw ratio to 2 times or more, for example, the strength, heat resistance and transparency of the polyolefin resin base material can be improved, and the printability of the polyolefin resin base material can be improved. From the viewpoint of the breaking limit of the polyolefin resin base material, the draw ratio is preferably 10 times or less.

The polyolefin resin base material can be produced, for example, by forming a film from polyolefin or a resin composition thereof by a T-die method, an inflation method, or the like, and then stretching the film. According to the inflation method, film formation and stretching can be performed simultaneously.

In one embodiment, the polyolefin resin substrate may be subjected to the surface treatment described above. Thereby, for example, the adhesion between the polyolefin resin substrate and other layers can be improved.
An easy-adhesion layer may be provided on the surface of the polyolefin resin substrate.

The haze value of the polyolefin resin substrate is preferably 25% or less, more preferably 15% or less, still more preferably 10% or less. A smaller haze value is more preferable, but in one embodiment, the lower limit may be 0.1% or 1%. The haze value of the substrate is measured according to JIS K7136.

The polyolefin resin substrate may have a single layer structure or a multilayer structure.
The thickness of the polyolefin resin substrate is preferably 5 μm or more and 300 μm or less, more preferably 8 μm or more and 100 μm or less, still more preferably 10 μm or more and 50 μm or less. When the thickness is at least the lower limit, for example, the strength and heat resistance of the laminate can be improved. When the thickness is equal to or less than the upper limit, for example, the workability of the laminate can be improved.

(Polypropylene resin base material)
In one embodiment, the polypropylene resin base material contains polypropylene as a main component, that is, in a range of more than 50% by mass. By including a polypropylene resin base material in the laminate of the present disclosure, for example, the oil resistance of a packaging container produced using the laminate can be improved.

The polypropylene may be a propylene homopolymer, a propylene random copolymer or a propylene block copolymer, or a mixture of two or more selected from these. As the polypropylene, biomass-derived polypropylene, mechanically recycled or chemically recycled polypropylene may be used from the viewpoint of reducing the environmental load. These details are as described above.

Among polypropylenes, propylene homopolymer or propylene random copolymer is preferably used from the viewpoint of transparency. When the rigidity and heat resistance of the packaging container are important, it is preferable to use a propylene homopolymer. When the impact resistance of the packaging container is important, it is preferable to use a propylene random copolymer.

From the viewpoint of heat resistance, the melting point (Tm) of polypropylene is, for example, 120° C. or higher and 170° C. or lower, preferably 130° C. or higher and 170° C. or lower, more preferably 150° C. or higher and 170° C. or lower.

The content of polypropylene in the polypropylene resin substrate is preferably more than 50% by mass, more preferably 80% by mass or more, still more preferably 85% by mass or more, even more preferably 90% by mass or more, particularly preferably 95% by mass. % or more. With such a configuration, for example, the recyclability of the laminate can be improved.
The polypropylene resin substrate may have a single layer structure or a multilayer structure.

(Polyethylene resin base material)
In one embodiment, the polyethylene resin base material contains polyethylene as a main component, that is, in a range of more than 50% by mass.
Details of the polyethylene are as described above.
Polyethylene includes, for example, high density polyethylene, medium density polyethylene, low density polyethylene, linear low density polyethylene and ultra low density polyethylene. From the viewpoint of the strength and heat resistance of the polyethylene resin substrate, high-density polyethylene and medium-density polyethylene are preferred. As the polyethylene, biomass-derived polyethylene, or mechanically recycled or chemically recycled polyethylene may be used from the viewpoint of reducing the environmental load.

From the viewpoint of heat resistance, the melting point (Tm) of polyethylene is preferably 100° C. or higher and 140° C. or lower, more preferably 105° C. or higher and 140° C. or lower, still more preferably 110° C. or higher and 140° C. or lower.

The content of polyethylene in the polyethylene resin substrate is preferably more than 50% by mass, more preferably 80% by mass or more, still more preferably 85% by mass or more, even more preferably 90% by mass or more, and particularly preferably 95% by mass. % or more. With such a configuration, for example, the recyclability of the laminate can be improved.

The polyethylene resin substrate, in one embodiment, is a uniaxially stretched film, more specifically, a uniaxially stretched film stretched in the longitudinal direction (MD).

The polyethylene resin substrate may have a single layer structure or a multilayer structure. Hereinafter, a polyethylene resin substrate having a multilayer structure is also referred to as a "stretched multilayer PE substrate". A stretched multilayer PE base material is preferable from the viewpoint that its strength, heat resistance and stretchability can be improved.

In the stretched multilayer PE base material, the density of polyethylene constituting each layer may be the same or different. For example, a stretched multilayer PE substrate may have a gradient in the density of each layer (density gradient). By providing a density gradient in the stretched multilayer PE substrate, for example, its strength, heat resistance and stretchability can be improved.

A stretched multilayer PE substrate has a multilayer structure of two or more layers. In one embodiment, the number of layers of the stretched multilayer PE substrate is 2 or more and 7 or less, such as 3 or more and 7 or less, or 3 or more and 5 or less. The number of layers of the stretched multilayer PE substrate is preferably odd, for example 3, 5 or 7 layers. When the stretched multilayer PE base material has a multilayer structure, the balance of rigidity, strength, heat resistance, printability and stretchability of the base material can be improved. Each layer of the oriented multilayer PE substrate is also preferably composed of polyethylene.

The stretched multilayer PE base material can be produced, for example, by film-forming a plurality of resin materials or resin compositions by an inflation method or a T-die method to form a laminate, and stretching the obtained laminate. The stretching treatment can improve the transparency, rigidity, strength and heat resistance of the base material, and the base material can be suitably used as, for example, a base material for packaging materials.

In one embodiment, the stretched multilayer PE substrate is obtained by stretching a laminate (precursor) having a multilayer structure. Specifically, the resin materials constituting each layer can be co-extruded into a tubular shape to form a film, thereby producing a laminate. Alternatively, a laminate can be produced by co-extrusion of the resin materials constituting each layer into a tubular shape, and then pressing the opposing layers together with a rubber roll or the like. By manufacturing a laminate by such a method, the number of defective products can be significantly reduced, and production efficiency can be improved.

When producing a stretched multilayer PE base material by the T-die method, the melt flow rate (MFR) of polyethylene constituting each layer is preferably 3.0 g from the viewpoint of film formability and processability of the stretched multilayer PE base material. /10 minutes or more and 20 g/10 minutes or less.

When the stretched multilayer PE base material is produced by the inflation method, the MFR of the polyethylene constituting each layer is preferably 0.2 g/10 min or more from the viewpoint of the film formability and processability of the stretched multilayer PE base material. It is 0 g/10 minutes or less.

A stretched multilayer PE base material is obtained, for example, by stretching the laminate described above. Preferred draw ratios are as described above. In addition, in the inflation film forming machine, the laminate can also be stretched. As a result, a stretched multilayer PE base material can be produced, and production efficiency can be further improved.

Several examples of embodiments of stretched multilayer PE substrates are described below. Hereinafter, a layer having a polyethylene content of 80% by mass or more is referred to as a "polyethylene layer". For example, a layer containing 80% by mass or more of high-density polyethylene is referred to as a "high-density polyethylene layer".

The oriented multilayer PE substrate of the first embodiment comprises a medium density polyethylene layer, a high density polyethylene layer, a blend layer of medium density polyethylene and high density polyethylene, a high density polyethylene layer, and a medium density polyethylene layer, Prepared in this order in the thickness direction. With such a configuration, for example, the printability of the base material can be improved, the strength and heat resistance can be improved, and the stretchability of the pre-stretching laminate can be improved.

In the blend layer of medium density polyethylene and high density polyethylene, the mass ratio of medium density polyethylene to high density polyethylene (medium density polyethylene/high density polyethylene) is preferably 0.25 or more and 4 or less, more preferably 0.4. 2.4 or less.

The stretched multilayer PE substrate of the second embodiment comprises a medium density polyethylene layer, a medium density polyethylene layer, a blend layer of medium density polyethylene and linear low density polyethylene, a medium density polyethylene layer, and a medium density polyethylene layer. and are provided in this order in the thickness direction. With such a configuration, for example, the printability of the base material can be improved, the strength and heat resistance can be improved, and the stretchability of the pre-stretching laminate can be improved.

In the blend layer of medium density polyethylene and linear low density polyethylene, the mass ratio of medium density polyethylene to linear low density polyethylene (medium density polyethylene/linear low density polyethylene) is preferably 0.25 or more. 4 or less, more preferably 0.4 or more and 2.4 or less.

The oriented multi-layer PE substrate of the third embodiment includes a blend layer of medium density polyethylene and high density polyethylene, a blend layer of medium density polyethylene and linear low density polyethylene, a linear low density polyethylene layer, a medium A blend layer of density polyethylene and linear low density polyethylene and a blend layer of medium density polyethylene and high density polyethylene are provided in this order in the thickness direction. With such a configuration, for example, the printability of the base material can be improved, the strength and heat resistance can be improved, and the stretchability of the pre-stretching laminate can be improved. In the stretched multilayer PE substrate of the third embodiment, a blend layer of medium density polyethylene and linear low density polyethylene may be used instead of the linear low density polyethylene layer.

In the blend layer of medium density polyethylene and high density polyethylene, the mass ratio of medium density polyethylene to high density polyethylene (medium density polyethylene/high density polyethylene) is independently preferably 0.25 or more and 4 or less, more preferably is 0.4 or more and 2.4 or less.

In the blend layer of medium density polyethylene and linear low density polyethylene, the mass ratio of medium density polyethylene to linear low density polyethylene (medium density polyethylene/linear low density polyethylene) is preferably 0.25 or more. 4 or less, more preferably 0.4 or more and 2.4 or less.

The stretched multilayer PE substrate of the fourth embodiment comprises a blend layer of high density polyethylene and medium density polyethylene, a layer of medium density polyethylene, a blend layer of linear low density polyethylene and medium density polyethylene, and a layer of medium density polyethylene. and a blend layer of high-density polyethylene and medium-density polyethylene in this order in the thickness direction. With such a configuration, for example, the printability of the base material can be improved, the strength and heat resistance can be improved, and the stretchability of the pre-stretching laminate can be improved.

The mass ratio of medium density polyethylene to high density polyethylene (medium density polyethylene/high density polyethylene) in the blend layer of high density polyethylene and medium density polyethylene is independently preferably 0.25 or more and 4 or less, more preferably is 0.4 or more and 2.4 or less.

The mass ratio of linear low density polyethylene to medium density polyethylene (linear low density polyethylene/medium density polyethylene) in the blend layer of linear low density polyethylene and medium density polyethylene is preferably 0.25 or more. Below, it is more preferably 0.4 or more and 2.4 or less.

The oriented multilayer PE substrate of the fifth embodiment contains a first layer containing medium density polyethylene and high density polyethylene, a second layer containing high density polyethylene, and linear low density polyethylene. A third layer, a fourth layer containing high density polyethylene, and a fifth layer containing medium density polyethylene and high density polyethylene are provided in this order in the thickness direction.

The oriented multilayer PE substrate of the sixth embodiment comprises a first layer containing medium density polyethylene and high density polyethylene, a second layer containing medium density polyethylene and linear low density polyethylene, a linear A third layer containing low density polyethylene, a fourth layer containing high density polyethylene, and a fifth layer containing medium density polyethylene and high density polyethylene are provided in this order in the thickness direction.

When printing an image on a base material, the base material may be subjected to surface treatment such as corona discharge treatment as a pretreatment. A layer containing medium-density polyethylene tends to have higher durability to surface treatment than a layer containing only high-density polyethylene as polyethylene. Therefore, a layer containing medium density polyethylene has excellent ink adhesion during printing after surface treatment. Layers containing medium density polyethylene and high density polyethylene also have the necessary heat resistance during printing and heat sealing. In addition, the layer containing medium-density polyethylene contributes to improving the stretchability of the laminate, which is the precursor of the stretched multilayer PE substrate.

The mass ratio of medium density polyethylene to high density polyethylene (medium density polyethylene/high density polyethylene) in the first layer and the fifth layer is preferably 1.1 or more and 5 or less, more preferably 1. 0.5 or more and 3 or less. This can further improve the balance between ink adhesion and heat resistance.

The total content of medium-density polyethylene and high-density polyethylene in the first layer and the fifth layer is preferably 80% by mass or more, more preferably 90% by mass or more, and still more preferably 95% by mass or more. is. This can further improve the ink adhesion and heat resistance of the substrate.

In the fifth embodiment, the second layer and the fourth layer each contribute to improving the heat resistance of the substrate. That is, the heat resistance of the substrate can be further improved by including high-density polyethylene in the second layer and the fourth layer in addition to the first layer and the fifth layer.

The second layer and the fourth layer in the fifth embodiment may each independently further contain low density polyethylene. As a result, the balance of heat resistance, rigidity and workability of the substrate can be further improved.

In the fifth embodiment, the mass ratio of high-density polyethylene to low-density polyethylene (high-density polyethylene/low-density polyethylene) in the second layer and the fourth layer is independently preferably 1 or more and 4 or less, It is more preferably 1.5 or more and 3 or less. As a result, the balance of heat resistance, rigidity and workability of the substrate can be further improved.

In the fifth embodiment, the content of high-density polyethylene in the second layer and the fourth layer is preferably more than 50% by mass, more preferably 55% by mass or more, and still more preferably 60% by mass. That's it. Thereby, the heat resistance of the substrate can be further improved.

In the fifth embodiment, the total content of high-density polyethylene and low-density polyethylene in the second layer and the fourth layer is independently preferably 80% by mass or more, more preferably 90% by mass or more, and further Preferably, it is 95% by mass or more. As a result, the balance of heat resistance, rigidity and workability of the substrate can be further improved.

In a sixth embodiment, the second layer contains medium density polyethylene and linear low density polyethylene. The second layer contributes to improving the interlaminar strength of the multilayer substrate. By providing the second layer between the third layer and the first layer, the density difference between the layers can be reduced. Thereby, the interlayer strength can be improved, and the occurrence of delamination can be suppressed.

In the sixth embodiment, the mass ratio of medium density polyethylene to linear low density polyethylene (medium density polyethylene/linear low density polyethylene) in the second layer is preferably 1.1 or more and 5 or less, and more It is preferably 1.5 or more and 3 or less. Thereby, the balance between interlayer strength, heat resistance, rigidity and workability of the multilayer base material can be further improved.

In the sixth embodiment, the total content of medium density polyethylene and linear low density polyethylene in the second layer is preferably 80% by mass or more, more preferably 90% by mass or more, and still more preferably 95% by mass or more. is. Thereby, the balance between interlayer strength, heat resistance, rigidity and workability of the multilayer base material can be further improved.

The fourth layer in the sixth embodiment contributes to improving the heat resistance of the substrate. That is, by including high-density polyethylene in the fourth layer in addition to the first layer and the fifth layer, the heat resistance of the substrate can be further improved.

In the sixth embodiment, the content of high-density polyethylene in the fourth layer is preferably 80% by mass or more, more preferably 90% by mass or more, and even more preferably 95% by mass or more. Thereby, the heat resistance of the multilayer substrate can be further improved.

The thickness of each of the second layer and the fourth layer is preferably 0.5 μm or more and 15 μm or less, more preferably 1 μm or more and 10 μm or less, and still more preferably 1 μm or more and 8 μm or less. Thereby, the heat resistance of the substrate can be further improved.

The third layer contributes to improving the stretchability of the laminate, which is the precursor of the stretched multilayer PE substrate.
The third layer may further contain low density polyethylene.

The content of linear low-density polyethylene in the third layer is preferably more than 50% by mass, more preferably 60% by mass or more, still more preferably 70% by mass or more, still more preferably 80% by mass or more, 90% by mass % or more, or 95% by mass or more. This can further improve the balance between heat resistance, rigidity and stretchability.

When the third layer contains low-density polyethylene, the content of low-density polyethylene is preferably less than 50% by mass, more preferably 5% to 40% by mass, and still more preferably 10% to 30% by mass. It is below.

In the sixth embodiment the third layer may further contain medium density polyethylene. In this case, the mass ratio of medium density polyethylene to linear low density polyethylene (medium density polyethylene/linear low density polyethylene) in the third layer is preferably 0.25 or more and 4 or less, more preferably 0 .4 or more and 2.4 or less. Thereby, the balance between interlayer strength and stretchability can be further improved. The total content of medium density polyethylene and linear low density polyethylene in the third layer is preferably 80% by mass or more, more preferably 90% by mass or more, and still more preferably 95% by mass or more. This can further improve the balance between heat resistance, rigidity and stretchability.

The thickness of the third layer is preferably 1 μm or more and 50 μm or less, more preferably 2 μm or more and 40 μm or less, and still more preferably 5 μm or more and 30 μm or less. This can further improve the balance between heat resistance, rigidity and stretchability.

The ratio of the total thickness of the second layer and the fourth layer to the thickness of the third layer (total thickness of the second layer and the fourth layer/thickness of the third layer) is preferably 0.1 or more and 10 or less, more preferably 0.2 or more and 5 or less, and still more preferably 0.5 or more and 2 or less. Thereby, the rigidity, strength and heat resistance of the substrate can be further improved.

In the stretched multilayer PE substrates of the first to sixth embodiments, the thickness of each of the two surface resin layers is preferably 0.5 μm or more and 10 μm or less, more preferably 1 μm or more and 8 μm or less, and further It is preferably 1 μm or more and 5 μm or less. Thereby, for example, the heat resistance and printability of the substrate can be further improved. For the stretched multilayer PE substrates of the fifth and sixth embodiments, the two surface resin layers are the first layer and the fifth layer in one embodiment.

In the stretched multilayer PE substrates of the first to sixth embodiments, the thickness of each of the two surface resin layers is preferably smaller than the total thickness of the inner three layers (multilayer intermediate layer). The ratio of the thickness of each of the two surface resin layers to the total thickness of the multilayer intermediate layer (surface resin layer/multilayer intermediate layer) is preferably from 0.05 to 0.8, more preferably from 0.1 to 0. 0.7 or less, more preferably 0.1 or more and 0.4 or less. Thereby, for example, the rigidity, strength and heat resistance of the substrate can be further improved. For the stretched multilayer PE substrates of the fifth and sixth embodiments, the multilayer interlayers are in one embodiment the second to fourth layers.

The stretched multilayer PE substrate of the seventh embodiment comprises a high density polyethylene layer and a medium density polyethylene layer in this order in the thickness direction. By using a high-density polyethylene layer as the surface resin layer of the substrate, for example, the strength and heat resistance of the substrate can be improved. By including the medium-density polyethylene layer in the base material, for example, the stretching aptitude of the pre-stretching laminate can be improved.

The stretched multilayer PE substrate of the eighth embodiment comprises a high density polyethylene layer, a medium density polyethylene layer and a high density polyethylene layer in this order in the thickness direction. With such a configuration, for example, the strength and heat resistance of the base material can be improved, the occurrence of curling in the base material can be suppressed, and the stretching aptitude of the unstretched laminate can be improved.

In the stretched multilayer PE substrates of the seventh and eighth embodiments, the thickness of the high-density polyethylene layer is preferably equal to or less than the thickness of the medium-density polyethylene layer. The ratio of the thickness of the high-density polyethylene layer to the thickness of the medium-density polyethylene layer is preferably 0.1 or more and 1 or less, more preferably 0.2 or more and 0.5 or less.

The oriented multilayer PE substrate of the ninth embodiment includes a high density polyethylene layer, a medium density polyethylene layer, a low density polyethylene layer, a linear low density polyethylene layer or an ultra low density polyethylene layer (for simplicity of description, These three layers are collectively described as "a low-density polyethylene layer, etc."), a medium-density polyethylene layer, and a high-density polyethylene layer in this order in the thickness direction. With such a configuration, for example, the stretching aptitude of the laminate before stretching can be improved, the strength and heat resistance of the substrate can be improved, and the occurrence of curling in the substrate can be suppressed.

In the oriented multilayer PE substrate of the ninth embodiment, the thickness of the high density polyethylene layer is preferably less than or equal to the thickness of the medium density polyethylene layer. The ratio of the thickness of the high-density polyethylene layer to the thickness of the medium-density polyethylene layer is preferably 0.1 or more and 1 or less, more preferably 0.2 or more and 0.5 or less.

In the stretched multilayer PE base material of the ninth embodiment, the thickness of the high-density polyethylene layer is preferably equal to or greater than the thickness of the low-density polyethylene layer and the like. The ratio of the thickness of the high density polyethylene layer to the thickness of the low density polyethylene layer is preferably 1 or more and 4 or less, more preferably 1 or more and 2 or less.

As the oriented multilayer PE substrate of another embodiment, a high density polyethylene layer, a high density polyethylene layer, a blend layer of medium density polyethylene and high density polyethylene, a high density polyethylene layer, and a high density polyethylene are combined into a thickness of A substrate provided in this order in the direction; a medium density polyethylene layer, a high density polyethylene layer, a linear low density polyethylene layer, a high density polyethylene layer, and a medium density polyethylene layer in this order in the thickness direction. Materials are also included.

In addition, a high-density polyethylene layer, a blend layer of high-density polyethylene and medium-density polyethylene, a low-density polyethylene layer, etc., a blend layer of high-density polyethylene and medium-density polyethylene, and a high-density polyethylene layer are arranged in the thickness direction. Substrates provided in this order are also included.

At least one layer selected from the layers constituting the stretched multilayer PE substrate may contain a slip agent. Thereby, for example, the workability of the substrate can be improved. For example, in the stretched multilayer PE substrates of the fifth and sixth embodiments described above, the third layer may contain a slip agent, and all of the first to fifth layers contain a slip agent. good too.

Slip agents include, for example, amide lubricants, fatty acid esters such as glycerin fatty acid esters, hydrocarbon waxes, higher fatty acid waxes, metallic soaps, hydrophilic silicones, silicone-modified (meth)acrylic resins, silicone-modified epoxy resins, and silicones. modified polyethers, silicone-modified polyesters, block-type silicone (meth)acrylic copolymers, polyglycerol-modified silicones and paraffins. Among slip agents, amide-based lubricants are preferred. Examples of amide lubricants include saturated fatty acid amides, unsaturated fatty acid amides, substituted amides, methylolamides, saturated fatty acid bisamides, unsaturated fatty acid bisamides, fatty acid ester amides and aromatic bisamides. Among these, unsaturated fatty acid amides are preferred, and erucic acid amides are more preferred.

In the stretched multilayer PE substrate, the content of the slip agent in the layer containing the slip agent may be, for example, 0.01% by mass or more and 3% by mass or less, or may be 0.03% by mass or more and 1% by mass or less. Thereby, the workability of the substrate can be further improved.

<Print layer>
The laminate of the present disclosure may have a printed layer on the surface of the polyolefin resin substrate. Images formed in the printed layer include, for example, letters, patterns, symbols, and combinations thereof. The printed layer may be formed using, for example, biomass-derived ink. Thereby, for example, the environmental load can be further reduced. The method for forming the printed layer is as described above.

The printed layer may be formed on any surface of the polyolefin resin substrate. The printed layer is preferably formed on the surface of the polyolefin resin substrate facing the sealant layer, because contact between the printed layer and the outside air can be suppressed, and deterioration of the printed layer over time can be suppressed.

<Barrier substrate>
The laminate of the present disclosure includes the barrier substrate described above. Since the details of the barrier substrate are as described above, the description in this section is omitted. The barrier substrate is preferably arranged so that the deposited film faces the polyolefin resin substrate side and the polyolefin resin layer faces the sealant layer side.

<Sealant layer>
A laminate of the present disclosure comprises a sealant layer.
The sealant layer is a resin layer containing polyolefin. The sealant layer is made of the same resin material as the polyolefin resin substrate and the polyolefin resin layer, that is, polyolefin. As a result, the packaging container can be made of a monomaterial. After recovering the used packaging container, there is no need to separate the base material and the sealant layer, and the recyclability of the packaging container can be improved.

Among polyolefins, polyethylene and polypropylene are preferred.

The MFR of the polyolefin constituting the sealant layer is preferably 0.1 g/10 min or more and 50 g/10 min or less, more preferably 0.3 g/10 min or more and 30 g/10 min or less, from the viewpoint of film formability and processability. , more preferably 0.5 g/10 minutes or more and 20 g/10 minutes or less.

When the sealant layer is produced by the T-die method, the MFR of the polyolefin is preferably 5.0 g/10 minutes or more and 20 g/10 minutes or less. When the MFR is at least the lower limit, for example, the workability of the sealant layer can be improved. When the MFR is equal to or less than the upper limit, for example, breakage of the sealant layer can be suppressed.

When the sealant layer is produced by the inflation method, the MFR of the polyolefin is preferably 0.5 g/10 minutes or more and 5.0 g/10 minutes or less. When the MFR is at least the lower limit, for example, the workability of the sealant layer can be improved. When the MFR is equal to or lower than the upper limit, for example, film formability can be improved.

The polyolefin content in the sealant layer is preferably more than 50% by mass, more preferably 70% by mass or more, and even more preferably 75% by mass or more. Thereby, for example, the recyclability of the packaging container can be improved.

The sealant layer may contain the above additives.

The thickness of the sealant layer is preferably 5 μm or more and 100 μm or less, more preferably 10 μm or more and 50 μm or less. When the sealant layer has a multilayer structure, the total thickness is preferably within the above range. When the thickness is at least the lower limit, for example, the heat sealability of the sealant layer and the recyclability of the packaging container can be improved. When the thickness is equal to or less than the upper limit, for example, the workability of the laminate can be improved.

From the viewpoint of heat sealability, the sealant layer is preferably an unstretched resin film, more preferably an unstretched coextruded resin film, and each layer constituting the sealant layer is a coextruded resin layer. The resin film can be produced by using, for example, a casting method, a T-die method, an inflation method, or the like.

For example, an unstretched resin film corresponding to the sealant layer may optionally be laminated on the barrier substrate via an adhesive layer, and the polyolefin or its resin composition is melt-extruded onto the barrier substrate. A sealant layer may be formed thereby. Examples of the adhesive layer include an adhesive layer to be described later.

The sealant layer, in one embodiment, is a resin layer containing polyethylene as a main component, that is, in a range of more than 50% by mass. Examples of polyethylene include high-density polyethylene, medium-density polyethylene, low-density polyethylene, linear low-density polyethylene, and ultra-low-density polyethylene. and ultra low density polyethylene are preferred. From the viewpoint of reducing environmental load, biomass-derived polyethylene and/or recycled polyethylene may be used.

The melting point (Tm) of polyethylene constituting the sealant layer is preferably 90° C. or higher and 140° C. or lower, more preferably 90° C. or higher and 130° C. or lower, from the viewpoint of the balance between heat resistance and heat sealability.

The content of polyethylene in the sealant layer is preferably more than 50% by mass, more preferably 80% by mass or more, still more preferably 90% by mass or more, and even more preferably 92% by mass or more. Thereby, for example, the recyclability of the packaging container can be improved.

The sealant layer, in one embodiment, is a resin layer containing polypropylene as a main component, that is, in a range of more than 50% by mass. By configuring the sealant layer with polypropylene, the oil resistance of the packaging container produced using the laminate can also be improved.

Polypropylene includes, for example, propylene homopolymers, propylene random copolymers such as propylene-α-olefin random copolymers, and propylene block copolymers such as propylene-α-olefin block copolymers. Details of the α-olefin are as described above. From the viewpoint of reducing environmental load, biomass-derived polypropylene and/or recycled polypropylene may be used.

The density of polypropylene is, for example, 0.88 g/cm ³ or more and 0.92 g/cm ³ or less from the viewpoint of heat sealability. In the present disclosure, density is measured according to JIS K7112, particularly D method (density gradient tube method, 23°C).

The melting point (Tm) of the polypropylene constituting the sealant layer is, for example, 120° C. or higher and 160° C. or lower, preferably 125° C. or higher and 155° C. or lower, more preferably 130° C. or higher and 150° C. or lower, from the viewpoint of the balance between heat resistance and heat sealability. It is below.

The content of polypropylene in the sealant layer is preferably more than 50% by mass, more preferably 70% by mass or more, and still more preferably 75% by mass or more. Thereby, for example, the recyclability of the packaging container can be improved.

The sealant layer may contain a heat-seal modifier from the viewpoint of improving low-temperature heat-sealability. The heat seal modifier is not particularly limited as long as it is a component having excellent compatibility with the polyolefin that constitutes the sealant layer. Ultra-low density polyethylene may also be used.

The melting point (Tm) of the olefinic copolymer used as the heat seal modifier is preferably 115° C. or lower, more preferably 110° C. or lower, and even more preferably 105° C. or lower, from the viewpoint of improving heat sealability. Although the lower limit of Tm is not particularly limited, it is, for example, 50°C, 60°C or 70°C.

The olefinic copolymer is not particularly limited as long as it is compatible with polyolefin and has a low melting point, and examples thereof include olefinic elastomers and olefinic plastomers.

Olefinic elastomers include, for example, ethylene-α-olefin copolymers. Examples of α-olefins include α-olefins having 4 to 8 carbon atoms such as 1-butene, 1-hexene, 1-octene and 4-methyl-1-pentene.

Plastomer is a term for elastomers (polymers that have the property of deforming in response to the external force applied and quickly recovering to their original shape when the external force is removed), and is similar to elastomers. It is a polymer that easily deforms plastically without exhibiting significant elastic deformation.

Olefinic plastomers include, for example, polyethylene plastomers. A polyethylene plastomer is, for example, a polyethylene obtained by copolymerizing ethylene and an α-olefin using a single-site catalyst such as a metallocene catalyst. As α-olefins, α-olefins having 4 to 8 carbon atoms such as 1-butene, 1-hexene, 1-octene and 4-methyl-1-pentene are preferable. Specific examples of polyethylene plastomers include ethylene-1-butene copolymers, ethylene-1-hexene copolymers and ethylene-1-octene copolymers.

The density of the olefinic copolymer is preferably 0.850 g/cm ³ or more and 0.920 g/cm ³ or less, more preferably 0.860 g/cm ³ or more and 0.915 g/cm ³ or less, and still more preferably 0.870 g/cm 3 or more. ³ or more and 0.910 g/cm ³ or less.

The MFR of the olefin-based copolymer is preferably 0.2 g/10 min or more and 20 g/10 min or less, more preferably 0.3 g/10 min or more and 15 g/10 min or less, and still more preferably, from the viewpoint of film formability and processability. is 0.5 g/10 minutes or more and 10 g/10 minutes or less. The MFR of the olefinic copolymer is measured according to ASTM D1238 under conditions of a temperature of 190°C and a load of 2.16 kg.

The content of the heat seal modifier in the entire sealant layer containing polypropylene as a main component is preferably 5% by mass or more and 40% by mass or less, more preferably 10% by mass or more and 30% by mass or less. Thereby, for example, suitable heat sealability can be imparted to the sealant layer.

The content of the heat seal modifier in the entire sealant layer containing polyethylene as a main component is preferably 1% by mass or more and 20% by mass or less, more preferably 2% by mass or more and 15% by mass or less. Thereby, for example, suitable heat sealability can be imparted to the sealant layer.

The sealant layer may have a single layer structure or a multilayer structure.
A sealant layer having a multilayer structure, in one embodiment, comprises a first sealant layer containing a polyolefin and a second sealant layer containing a polyolefin and a heat seal modifier. Here, the sealant layers are positioned such that the first sealant layer is closer to the barrier substrate than the second sealant layer. With such a configuration, for example, both low-temperature heat-sealability and workability can be achieved. The first sealant layer may have a multilayer structure. In one embodiment, the number of layers in the multilayer structure is 3 or more and 5 or less.

The content of polyolefin in the first sealant layer is preferably 80% by mass or more, more preferably 85% by mass or more, still more preferably 90% by mass or more, and particularly preferably 95% by mass or more.

The content of the heat seal modifier in the second sealant layer is preferably 10% by mass or more and 55% by mass or less, more preferably 20% by mass or more and 50% by mass or less. When the content is at least the lower limit, for example, the heat sealability of the second sealant layer can be improved. When the content is equal to or less than the upper limit, for example, the recyclability of the laminate can be improved. The polyolefin content in the second sealant layer is preferably 45% by mass or more and 90% by mass or less, more preferably 50% by mass or more and 80% by mass or less.

The thickness of the first sealant layer is preferably 5 μm or more and 50 μm or less, more preferably 10 μm or more and 40 μm or less, and still more preferably 10 μm or more and 35 μm or less. When the thickness is at least the lower limit, for example, the recyclability of the laminate and the heat sealability of the first sealant layer can be improved. When the thickness is equal to or less than the upper limit, for example, the workability of the laminate can be improved.

The thickness of the second sealant layer is preferably 1 μm or more and 50 μm or less, more preferably 2 μm or more and 40 μm or less, and still more preferably 3 μm or more and 30 μm or less. When the thickness is at least the lower limit, for example, the heat sealability of the second sealant layer can be improved. When the thickness is equal to or less than the upper limit, for example, both recyclability and processability of the laminate can be achieved.

<Deposited film>
The laminate of the present disclosure may further include a vapor deposition film on the surface of the sealant layer facing the polyolefin resin substrate (see vapor deposition film 32 in FIG. 5). Thereby, for example, the gas barrier properties of the laminate can be further improved. The details of the deposited film are as described above, and the description thereof is omitted here.

<Adhesive layer>
The laminate of the present disclosure, in one embodiment, comprises a first adhesive layer between the polyolefin resin substrate and the barrier substrate. The laminate of the present disclosure, in one embodiment, comprises a second adhesive layer between the barrier substrate and the sealant layer. Thereby, for example, adhesion between these layers can be improved.

The adhesive layer is composed of an adhesive, and the adhesive may be a one-component curing adhesive, a two-component curing adhesive, or a non-curing adhesive. The adhesive may be a non-solvent type adhesive or a solvent type adhesive. The laminate of the present disclosure comprises at least three elements: a polyolefin resin substrate, a barrier substrate and a sealant layer. As a result, when a laminate is manufactured using an adhesive, the laminate can be manufactured without applying the adhesive directly onto the vapor deposition film, and deterioration of the vapor deposition film can be suppressed.

Examples of adhesives include polyether-based adhesives, polyester-based adhesives, silicone-based adhesives, epoxy-based adhesives, urethane-based adhesives, rubber-based adhesives, vinyl-based adhesives, olefin-based adhesives, and phenol-based adhesives. Adhesives are included. Among these, urethane-based adhesives are preferred, and two-liquid curing urethane-based adhesives are more preferred.

The thickness of the adhesive layer is, for example, 0.1 μm or more and 10 μm or less, preferably 0.2 μm or more and 8.0 μm or less, more preferably 0.5 μm or more and 6.0 μm or less, still more preferably 0.8 μm or more and 5.0 μm. It is below.

The adhesive layer is formed by, for example, a conventionally known method such as a direct gravure roll coating method, a gravure roll coating method, a kiss coating method, a reverse roll coating method, a fonten method and a transfer roll coating method. It can be formed by drying.

In one embodiment of the laminate of the present disclosure, a polyolefin resin base material, a barrier base material, and a resin film corresponding to a sealant layer are laminated by a non-solvent lamination method using a solvent-free adhesive. It may be produced by lamination by a dry lamination method using a solvent type adhesive.

[Packaging container]
The laminate of the present disclosure can be suitably used for packaging material applications.
Packaging materials are used to make packaging containers. A packaging material comprises the laminate of the present disclosure. A packaging container can be produced by using at least a packaging material comprising the laminate of the present disclosure.

The packaging container of the present disclosure comprises the laminate of the present disclosure. Packaging containers include, for example, packaging bags, tube containers, and containers with lids. A lidded container includes a container body having an accommodating portion, and a lid member joined (heat-sealed) to the container body so as to seal the accommodating portion.

Methods of heat sealing include, for example, bar sealing, rotary roll sealing, belt sealing, impulse sealing, high frequency sealing and ultrasonic sealing.

As packaging bags, for example, standing pouch type, side seal type, two side seal type, three side seal type, four side seal type, envelope pasted seal type, palm pasted seal type (pillow seal type), plaited seal type, flat bottom seal. There are various types of packaging bags such as type, square bottom seal type and gusset type.

The packaging container may be provided with an easy-open part. The easy-to-open portion includes, for example, a notch portion that serves as a starting point for tearing the packaging container, and a half-cut line formed by laser processing, a cutter, or the like as a path for tearing the packaging container.

The packaging container may be provided with a steam release mechanism. When the steam pressure inside the packaging container exceeds a predetermined value, the steam venting mechanism allows the inside of the packaging container to communicate with the outside to release the steam, and also prevents the steam from escaping at locations other than the steam venting mechanism. is configured as

The steam release mechanism includes, for example, a steam release seal portion protruding toward the inside of the packaging container from the side seal portion, and a non-sealed portion separated from the contents accommodating portion by the steam release seal portion. The unsealed portion communicates with the outside of the packaging container. The packaging container filled with contents and heat-sealed at the opening is heated using a microwave oven or the like. As a result, the internal pressure increases and the steam release seal portion is peeled off. The steam escapes to the outside of the packaging container through the peeled portion of the steam releasing seal portion and the non-sealed portion.

In one embodiment, the laminate of the present disclosure is folded in half so that the polyolefin resin base material is located outside and the sealant layer is located inside, and the ends and the like are heat-sealed to form a packaging bag. can be made. In another embodiment, a packaging bag can be produced by stacking a plurality of laminates of the present disclosure such that the sealant layers face each other and heat-sealing the ends and the like. The entire packaging bag may be composed of the laminate, or part of the packaging bag may be composed of the laminate. FIG. 6 shows an example of a packaging bag. In the figure, the hatched portion represents the heat-sealed portion.

In one embodiment, the laminate of the present disclosure is used as a lid material in a lidded container. A lidded container includes a container body having an accommodating portion, and a lid member joined (heat-sealed) to the container body so as to seal the accommodating portion. Here, the lid material, that is, the sealant layer of the laminate and the container body are heat-sealed. Examples of the shape of the container body include a cup shape and a bottomed cylindrical shape. The container body is made of, for example, polystyrene, polypropylene, polyethylene or paper.

Contents contained in packaging containers include, for example, liquids, solids, powders, and gels. The contents may be food or drink, or may be non-food or drink such as chemicals, cosmetics, and pharmaceuticals. After containing the contents in the packaging container, the packaging container can be sealed by heat-sealing the opening of the packaging container.

As specific examples of packaging bags, small bags and standing pouches will be described below.
A sachet is a small packaging bag, and is used to contain, for example, 1 g or more and 200 g or less of contents. Contents contained in the sachet include, for example, sauces, soy sauce, dressings, ketchup, syrups, cooking liquors, other liquid or viscous seasonings; liquid soups, powdered soups, fruit juices; spices; Beverages, jellied beverages, ready-to-eat foods, and other food and drink. The laminate of the present disclosure is suitable as a packaging material for producing small bags.

Standing pouches are used, for example, to contain contents of 50 g or more and 2000 g or less. Contents contained in the standing pouch include, for example, shampoo, rinse, conditioner, hand soap, body soap, fragrance, deodorant, deodorant, insect repellent, detergent; dressing, edible oil, mayonnaise, and others. Liquid or viscous seasonings; liquid beverages, jelly-like beverages, instant foods, other foods and drinks; and creams.

A standing pouch, in one embodiment, comprises a body (side sheets) and a bottom (bottom sheet). The side sheet and the bottom sheet may be composed of the same member or may be composed of different members. Since the bottom sheet retains the shape of the side sheets, the pouch can be made self-supporting and can be a standing pouch. A storage space for storing contents is formed in a region surrounded by the side sheet and the bottom sheet.

The standing pouch may be equipped with a vapor release mechanism. The steam release mechanism includes a steam release seal portion protruding toward the inside of the packaging container from the side seal portion, and a non-sealed portion separated from the contents accommodating portion by the steam release seal portion. The unsealed portion communicates with the outside of the packaging container.

In the standing pouch, only the body may be composed of the laminate of the present disclosure, only the bottom may be composed of the laminate of the present disclosure, or both the body and the bottom may be composed of the laminate of the present disclosure. may

In one embodiment, the side sheet can be formed by making a bag so that the sealant layer included in the laminate of the present disclosure is the innermost layer. In one embodiment, the side sheets can be formed by preparing two laminates of the present disclosure, stacking them so that the sealant layers face each other, and heat-sealing the side edges on both sides to form a bag. .

In another embodiment, the side sheets are prepared by preparing two laminates of the present disclosure, overlapping them with the sealant layers facing each other, and separating the laminates at the side edges on both sides of the overlapped laminate. , two laminates folded in a V shape with the sealant layer on the outside are inserted and heat-sealed. Such a method of manufacture results in a standing pouch having a body with side gussets. FIG. 7 shows an example of a standing pouch. In the figure, the hatched portion represents the heat-sealed portion.

In one embodiment, the bottom sheet can be formed by inserting the laminate of the present disclosure between the bottoms of the bag-made side sheets and heat sealing. More specifically, the bottom sheet can be formed by inserting a laminate folded in a V-shape so that the sealant layer is on the outside between the lower parts of the bag-made side sheets, and heat-sealing.

In one embodiment, two laminates are prepared, these are superimposed so that the sealant layers face each other, and then another laminate is folded in a V shape so that the sealant layer is on the outside. , is sandwiched between the lower portions of the laminates facing each other and heat-sealed to form a bottom portion. The body is then formed by heat sealing the two sides adjacent to the bottom. In this manner, an embodiment standing pouch can be formed.

The present disclosure relates to, for example, the following [1] to [11].
[1] At least an unstretched resin substrate having at least a polyolefin resin layer and a gas-barrier resin layer, and a vapor-deposited film provided on the gas-barrier resin layer, wherein the resin substrate is manufactured by a coextrusion inflation method. A barrier substrate formed by a film.
[2] The barrier substrate according to [1] above, wherein the polyolefin resin layer contains polypropylene or polyethylene as a main component.
[3] The gas barrier resin layer contains at least one gas barrier resin selected from polyamide, ethylene-vinyl alcohol copolymer, polyvinyl alcohol, polyacrylonitrile, polyester, polyurethane and (meth)acrylic resin. The barrier substrate according to [1] or [2].
[4] The barrier substrate according to any one of [1] to [3] above, wherein the resin substrate further comprises an adhesive resin layer between the polyolefin resin layer and the gas barrier resin layer.
[5] At least a polyolefin resin substrate, the barrier substrate according to any one of [1] to [4] above, and a sealant layer are provided in this order in the thickness direction, and the polyolefin resin substrate is stretched. A laminate in which the base material and the sealant layer are resin layers containing polyolefin.
[6] The laminate according to [4] or [5] above, wherein the sealant layer is an unstretched resin film.
[7] A first adhesive layer is provided between the polyolefin resin base material and the barrier base material, and a second adhesive layer is provided between the barrier base material and the sealant layer. The laminate according to any one of [6].
[8] The polyolefin resin base material is a base material containing polypropylene as a main component, the polyolefin resin layer in the barrier base material is a layer containing polypropylene as a main component, and the sealant layer is a base material containing polypropylene as a main component. Alternatively, the polyolefin resin substrate is a substrate containing polyethylene as a main component, and the polyolefin resin layer in the barrier substrate is a layer containing polyethylene as a main component, and the sealant The laminate according to any one of [4] to [7] above, wherein the layer is a layer containing polyethylene as a main component.
[9] The laminate according to any one of [4] to [8] above, wherein the content of polyolefin in the entire laminate is 80% by mass or more.
[10] The laminate according to any one of [4] to [9] above, which is used as a packaging material.
[11] A packaging container comprising the laminate according to any one of [4] to [10] above.

Hereinafter, the barrier substrate and laminate of the present disclosure will be specifically described based on examples, but the barrier substrate and laminate of the present disclosure are not limited by the examples.

[Example 1-1]
6-66 copolymerized nylon resin (manufactured by BASF, NY, trade name: Ultramid C40LN, density: 1.12 g/cm ³ , melting point: 189° C., relative viscosity: 4.0) and ,
Maleic acid-modified polyolefin (manufactured by Mitsui Chemicals, Inc., trade name: ADMER QF551T, density: 0.89 g/cm ³ , melting point: 135° C., MFR: 2.5 g/10 minutes), which constitutes the adhesive resin layer, and ,
Polypropylene (1) (random PP, manufactured by BOREALIS, trade name: RB707CF, density: 0.90 g/cm ³ , melting point: 145° C., MFR: 1.5 g/10 minutes), which constitutes the polypropylene resin layer, A 5-layer coextrusion film was formed by the inflation method, gas barrier resin layer (2 μm) / adhesive resin layer (3 μm) / polypropylene (1) resin layer (10 μm) / polypropylene (1) resin layer (6 μm) / polypropylene (1) ) A resin substrate having a total thickness of 25 μm with a resin layer (4 μm) was prepared. Numbers in parentheses indicate layer thicknesses.

On the gas-barrier resin layer of the resin substrate prepared as described above, a vapor deposited aluminum film having a thickness of 60 nm was formed by a PVD method to obtain a barrier substrate. When the optical density (OD value) of the deposited film was measured, it was 3.0.

As a polypropylene resin substrate, a 20 μm-thick biaxially oriented polypropylene film (manufactured by Toyobo Co., Ltd., trade name: P2171) with one surface subjected to corona discharge treatment was prepared. An image was formed on the corona discharge-treated surface of the biaxially oriented polypropylene film by gravure printing using a solvent type gravure ink (manufactured by DIC Graphics Co., Ltd., Finart).

The barrier substrate and the biaxially stretched polypropylene film are bonded together with a two-component curable polyurethane adhesive ( A laminate was obtained by laminating via a product name: RU-77T/H-7 (manufactured by Rock Paint Co., Ltd.).

Polypropylene (2) (random PP, manufactured by TPC, trade name: FL7540L, density: 0.90 g/cm ³ , melting point: 138°C, MFR: 7.0 g/10 minutes) and polyolefin plastomer (manufactured by SABIC, Product name: COHERE8102L, density: 0.902 g/cm ³ , melting point: 98°C, MFR: 1.0 g/10 min), polypropylene (2): 60% by mass, polyolefin plastomer: 40% by mass. Mixed to prepare a blended polyolefin (1).

Next, the polypropylene (2) and the blended polyolefin (1) are subjected to a multi-layer extrusion film formation by a T-die method to form a polypropylene (2) resin layer (15 μm)/blended polyolefin (1) resin layer (20 μm). An unstretched polypropylene film (sealant film) having a thickness of 35 μm was obtained. Numbers in parentheses indicate layer thicknesses.

The laminate and the sealant film are bonded together with a two-component curable polyurethane adhesive (lock paint ( Co., Ltd., trade name: RU-77T/H-7) to obtain a laminate (polypropylene-based laminate).

[Example 1-2]
6-66 copolymerized nylon resin (manufactured by BASF, NY, trade name: Ultramid C33, density: 1.12 g/cm ³ , melting point: 196° C., relative viscosity: 3.3) was used as the resin constituting the gas barrier resin layer. ) to obtain a laminate in the same manner as in Example 1-1.

[Example 1-3]
The resin constituting the gas barrier resin layer was an ethylene-vinyl alcohol copolymer (EVOH, manufactured by Kuraray Co., Ltd., trade name: EVAL E171B, density: 1.14 g/cm ³ , melting point: 165°C, MFR: 1. 7 g/10 min, ethylene content: 44 mol %), in the same manner as in Example 1-1 to obtain a laminate.

[Comparative Example 1-1]
A laminate was obtained in the same manner as in Example 1-1, except that the structure of the resin substrate was changed to a structure consisting of a polypropylene (1) resin layer having a thickness of 25 μm. An aluminum deposition film was formed on the polypropylene (1) resin layer.

[Example 2-1]
<Preparation of barrier substrate>
50 parts of linear low-density polyethylene (manufactured by Exxon Mobil, trade name: Exceed XP8656ML, density: 0.916 g/cm ³ , melting point: 121° C., MFR: 0.5 g/10 minutes), medium-density polyethylene (Exxon Mobil Co., trade name: Enable 4002MC, density: 0.938 g/cm ³ , melting point: 128° C., MFR: 0.25 g/10 minutes) were mixed to obtain blended polyethylene (1).
6-66 copolymerized nylon resin (manufactured by BASF, NY, trade name: Ultramid C40LN, density: 1.12 g/cm ³ , melting point: 189° C., relative viscosity: 4.0) and ,
Maleic acid-modified polyolefin (manufactured by Mitsui Chemicals, Inc., trade name: ADMER AT1955, density: 0.89 g/cm ³ , MFR: 2.6 g/10 minutes), which constitutes the adhesive resin layer,
linear low-density polyethylene (manufactured by ExxonMobil, trade name: Exceed XP8656ML, density: 0.916 g/cm ³ , melting point: 121° C., MFR: 0.5 g/10 minutes), which constitutes the polyethylene resin layer; Blend polyethylene (1) and medium density polyethylene (manufactured by Exxon Mobil, trade name: Enable 4002MC, density: 0.938 g/cm ³ , melting point: 128°C, MFR: 0.25 g/10 min) were subjected to an inflation method. Gas barrier resin layer (2 μm) / adhesive resin layer (3 μm) / linear low density polyethylene resin layer (10 μm) / blended polyethylene (1) resin layer (6 μm) / medium density A resin substrate with a total thickness of 25 μm was prepared with a polyethylene resin layer (4 μm). Numbers in parentheses indicate layer thicknesses.

On the gas-barrier resin layer of the resin substrate prepared as described above, a vapor deposited aluminum film having a thickness of 60 nm was formed by a PVD method to obtain a barrier substrate. When the optical density (OD value) of the deposited film was measured, it was 3.0.

<Preparation of polyethylene resin substrate>
As a polyethylene resin substrate, a 25 μm-thick stretched multilayer substrate (uniaxially stretched polyethylene film) was prepared as follows. The polyethylene used in the following examples and comparative examples will be described.
-Medium density polyethylene (hereinafter referred to as "MDPE"):
Product name Enable4002MC
Density: 0.940 g/cm ³ Melting point: 128°C MFR: 0.25 g/10 minutes
High-density polyethylene (1) manufactured by ExxonMobil (hereinafter referred to as "HDPE (1)"):
Product name Elite5960G
Density: 0.960 g/cm ³ Melting point: 134°C MFR: 0.8 g/10 minutes
Dowchemical high-density polyethylene (2) (hereinafter referred to as “HDPE (2)”):
Product name H619F
Density: 0.965 g/cm ³ Melting point: 135°C MFR: 0.7 g/10 minutes
Linear low-density polyethylene manufactured by SCG (hereinafter referred to as “LLDPE”):
Product name Exceed XP8656ML
Density: 0.916 g/cm ³ Melting point: 121°C MFR: 0.5 g/10 minutes
Low-density polyethylene manufactured by ExxonMobil (hereinafter referred to as "LDPE"):
Product name LD2420F
Density: 0.922 g/cm ³ Melting point: 112° C. MFR: 0.75 g/10 minutes
MB containing slip agent manufactured by PTT:
Product name SLIP61 10061-K
Density: 0.910 g/cm ³ , MFR: 10 g/10 minutes,
Polyethylene base, containing 5% by mass of erucamide-based slip agent,
Made by Ampacet

・Blended polyethylene A1
70 parts of MDPE and 30 parts of HDPE (1) were mixed to obtain a blended polyethylene A1 (hereinafter referred to as "blended PE (A1)") having an average density of 0.948 g/cm ³ .
・Blended polyethylene B1
70 parts of MDPE and 30 parts of LLDPE were mixed to obtain a blended polyethylene B1 (hereinafter referred to as "blended PE (B1)") having an average density of 0.933 g/cm ³ .
・Blend polyethylene C1
98 parts of LLDPE and 2 parts of slip agent-containing MB were mixed to obtain a blended polyethylene C1 (hereinafter referred to as "blended PE (C1)") having an average density of 0.916 g/cm ³ .

Blend PE (A1), HDPE (2), blend PE (C1) and blend PE (B1) were formed into blend PE (A1)-1 layer (15 μm)/HDPE (2) layer (20 μm)/ Five layers were co-extruded at a layer thickness ratio of blended PE (C1) layer (55 μm)/blended PE (B1) layer (20 μm)/blended PE (A1)-2 layers (15 μm) to form a tubular film, A polyethylene film with a total thickness of 125 μm was obtained, and the tubular film was folded at the nip to form a double layer. Numbers in parentheses indicate layer thicknesses.

The polyethylene film prepared above was stretched in the longitudinal direction (MD) at a draw ratio of 5 times, and the blended PE (A1)-2 layer was subjected to corona discharge treatment, and then slit at the end to form two sheets. By dividing, a 25 μm-thick stretched multilayer base material (uniaxially stretched polyethylene film) was obtained.

An image was formed on the corona-discharge-treated surface of the uniaxially stretched polyethylene film by gravure printing using a solvent gravure ink (manufactured by DIC Graphics Co., Ltd., Finart).

The barrier substrate and the uniaxially stretched polyethylene film are bonded together with a two-component curable polyurethane adhesive ( A laminate was obtained by laminating via a product name: RU-77T/H-7 (manufactured by Rock Paint Co., Ltd.).

linear low-density polyethylene (manufactured by Dowchemill, trade name: Elite 5400G, density: 0.916 g/cm ³ , melting point: 123° C., MFR: 1.0 g/10 minutes);
55 parts of linear low-density polyethylene (Elite 5400G) and 45 parts of polyolefin plastomer (manufactured by SABIC, trade name: COHERE8102L, density: 0.902 g/cm ³ , melting point: 98°C, MFR: 1.0 g/10 (2) with an average density of 0.910 g/cm ³ , which is a mixture of A nonwoven fabric with a total thickness of 35 μm, comprising a polyethylene resin layer (6 μm)/linear low density polyethylene resin layer (15 μm)/linear low density polyethylene resin layer (6 μm)/blended polyethylene (2) resin layer (4 μm). A stretched polyethylene film was produced. Numbers in parentheses indicate layer thicknesses. This unstretched polyethylene film was used as a sealant film as described below.

The laminate and the sealant film are bonded together with a two-component curable polyurethane adhesive (lock paint (trade name: RU-77T/H-7 manufactured by Co., Ltd.) to obtain a laminate (polyethylene-based laminate).

[Example 2-2]
6-66 copolymerized nylon resin (manufactured by BASF, NY, trade name: Ultramid C33, density: 1.12 g/cm ³ , melting point: 196° C., relative viscosity: 3.3) was used as the resin constituting the gas barrier resin layer. ) to obtain a laminate in the same manner as in Example 2-1.

[Example 2-3]
The resin constituting the gas barrier resin layer was an ethylene-vinyl alcohol copolymer (EVOH, manufactured by Kuraray Co., Ltd., trade name: EVAL E171B, density: 1.14 g/cm ³ , melting point: 165°C, MFR: 1. 7 g/10 min, ethylene content: 44 mol%), in the same manner as in Example 2-1 to obtain a laminate.

[Comparative Example 2-1]
A laminate was obtained in the same manner as in Example 2-1, except that the structure of the resin substrate was changed to a structure consisting of a medium-density polyethylene resin layer having a thickness of 25 μm. An aluminum deposition film was formed on the medium density polyethylene resin layer.

[Oxygen barrier property evaluation]
The barrier substrates obtained in Examples and Comparative Examples were cut into A4 size, and oxygen permeability (cc/m ² /day/atm) was measured. Tables 1 and 2 show the measurement results.

[Evaluation of water vapor barrier properties]
The barrier substrates obtained in Examples and Comparative Examples were cut into A4 size, and using PERMATRAN 3/31 manufactured by MOCON in the United States, the water vapor permeability (g/m ² /day) was measured. Tables 1 and 2 show the measurement results.

[Heat sealability test]
The laminates obtained in Examples and Comparative Examples were cut into 10 cm×10 cm to prepare sample pieces. This sample piece is folded in half so that the sealant layer is on the inside, and the temperature is 130° C. (for polyethylene laminate) or 150° C. (for polypropylene laminate), pressure 1 kgf/cm ² , for 1 second. A 1 cm×10 cm area was heat-sealed under the conditions.

Cut the heat-sealed sample piece into strips with a width of 15 mm, hold both ends that were not heat-sealed in a tensile tester, and test according to JIS Z 0238 at a speed of 300 mm / min, a peel angle of 90 °, a load range The peel strength (N/15mm) was measured under the condition of 50N. Tables 1 and 2 show the measurement results.

1: Laminate 10: Barrier base material 11: Resin base material 12: Polyolefin resin layer 13: Adhesive resin layer 14: Gas barrier resin layer 15: Deposited film 20: Polyolefin resin base material 30: Sealant layer 32: Deposited film 40A, 40B: adhesive layer

Claims (11)

an unstretched resin substrate having at least a polyolefin resin layer and a gas barrier resin layer;
At least a deposited film provided on the gas barrier resin layer,
A barrier substrate, wherein the resin substrate is formed into a film by a coextrusion inflation method. The barrier substrate according to claim 1, wherein the polyolefin resin layer contains polypropylene or polyethylene as a main component. Claim 1, wherein the gas barrier resin layer contains at least one gas barrier resin selected from polyamide, ethylene-vinyl alcohol copolymer, polyvinyl alcohol, polyacrylonitrile, polyester, polyurethane and (meth)acrylic resin. 3. or the barrier substrate according to 2. The barrier substrate according to any one of claims 1 to 3, wherein the resin substrate further comprises an adhesive resin layer between the polyolefin resin layer and the gas barrier resin layer. at least,
a polyolefin resin base material;
a barrier substrate according to any one of claims 1 to 4;
A sealant layer is provided in this order in the thickness direction,
The polyolefin resin base material is a stretched base material,
The sealant layer is a resin layer containing polyolefin,
laminate. The laminate according to claim 5, wherein the sealant layer is an unstretched resin film. A first adhesive layer is provided between the polyolefin resin base material and the barrier base material,
A second adhesive layer is provided between the barrier substrate and the sealant layer,
The laminate according to claim 5 or 6. The polyolefin resin base material is a base material containing polypropylene as a main component,
The polyolefin resin layer in the barrier substrate is a layer containing polypropylene as a main component,
The sealant layer is a layer containing polypropylene as a main component, or
The polyolefin resin base material is a base material containing polyethylene as a main component,
The polyolefin resin layer in the barrier substrate is a layer containing polyethylene as a main component,
The sealant layer is a layer containing polyethylene as a main component,
The laminate according to any one of claims 5-7. The laminate according to any one of claims 5 to 8, wherein the content of polyolefin in the entire laminate is 80% by mass or more. The laminate according to any one of claims 5 to 9, which is used as a packaging material. A packaging container comprising the laminate according to any one of claims 5 to 10.