JP2023114039A - Photosensitive resin support structure and method of manufacturing the same - Google Patents

Abstract

To provide a photosensitive resin support structure that has air dischargeability capable of suppressing air from stagnating, and also has sealability high enough to cause no ink permeation at a support end part so as to suppress a risk that a plate peels off from a plate cylinder in spite of long-period use.SOLUTION: A method of manufacturing a photosensitive resin support structure that includes a laminating process of laminating a support c, an adhesive layer d and a support b in this order to form a laminate, and a pressure bonding process of performing pressure bonding of the laminate. In the pressure bonding process, a rate of variation in turbidity of the press-bonded part of the laminate ((the turbidity of the laminate before the pressure bonding-the turbidity of the laminate after the pressure bonding)/the turbidity of the laminate before the pressure bonding×100) is 2.0% or larger, and the adhesive layer d has a recessed part open on a second surface on the opposite side from a first surface contacting the support b, the recessed part being 10 μm or larger deep.SELECTED DRAWING: Figure 4

Description

The present invention relates to a photosensitive resin support structure and a manufacturing method thereof.

In most of the production of relief plates using a photosensitive resin, a photosensitive resin composition layer molded to a certain plate thickness is irradiated with actinic rays, and only the photosensitive resin composition layer that becomes the relief portion of the printing plate is photopolymerized. After performing the exposure step of curing by reaction, the uncured photosensitive resin composition other than the relief portion is removed by dissolving with a predetermined washing liquid (developer), or by swelling and dispersing and mechanically removing to cure. It includes a development step that allows only a portion of the plate to appear as a relief on the surface of the plate.

Relief plates using the above photosensitive resins are widely used for flexographic printing and molding.
A support for fixing a photocured product of a photosensitive resin composition is used for relief formation. In any of the above applications, the obtained relief plate is used by attaching and fixing the back surface of the support to an object according to the application with a detachable adhesive. Here, the support also plays a role of ensuring ease of handling, mechanical strength, or dimensional accuracy of the relief plate.
As such a support, for example, Patent Document 1 discloses a support structure having a pressure-sensitive adhesive layer in advance on the surface of the support opposite to the surface in contact with the photosensitive resin. As another method of attaching a relief plate to an object, there is a method of attaching the back surface of the support and the object with a double-faced tape.

Patent Document 1 discloses a support structure in which an adhesive layer (adhesive layer in the present invention) and its protective film are provided on a support. The support structure described in Patent Document 1 has an air passage that communicates with the adhesive layer on the surface opposite to the surface in contact with the support with the protective film removed. characterized by

However, the photosensitive resin support structure disclosed in Patent Document 1 is used for forming a high-definition relief on a support by means of exposure from the back of the support (for example, the support structure disclosed in Patent Document 2). A plate-making method for a patterned plate, a method for forming match marks when affixing a flexographic printing plate to a target position disclosed in Patent Document 3, and a printing plate information disclosed in Patent Document 4 are transferred to a support. In applications where the adhesive layer or the pressure-sensitive adhesive layer is formed on the surface), the desired relief shape may not be obtained due to the difference in curability of the photosensitive resin composition between the air passage portion and other portions of the adhesive layer or pressure-sensitive adhesive layer. be.

Patent Document 5 discloses a photosensitive resin support structure in which the curability of a photosensitive resin composition is uniformed by reducing the difference in UV transmittance between an air passage portion and other portions of an adhesive layer. disclosed.

Japanese Patent No. 3094647 Japanese Patent Application Laid-Open No. 2004-317978 JP-A-61-32058 Japanese Patent Application Laid-Open No. 2000-181051 JP 2007-139911 A

However, when the photosensitive resin support structure disclosed in Patent Document 5 is attached to a plate cylinder and cleaned with a cleaning agent liquid, the air passage portion of the pressure-sensitive adhesive layer has a cleaning agent liquid. will permeate, sufficient sealing properties cannot be obtained, and the photosensitive resin support structure may peel off from the plate cylinder, and there is room for improvement.

Therefore, in order to prevent permeation of the cleaning agent liquid, the photosensitive resin support structure has an adhesive function, has an air passage portion, suppresses the generation of air pockets, and has a sufficient sealing property. There is a need for a photosensitive resin support structure that suppresses plate separation from the plate cylinder.

Therefore, in the present invention, in order to have an air release property that can suppress the occurrence of air pockets, and to suppress the risk of the plate peeling off from the plate cylinder even when used for a long period of time, ink permeation is caused at the end of the support. It is an object of the present invention to provide a photosensitive resin support structure having sufficient sealing properties such that the structure does not have a seal.

The inventors of the present invention have made intensive studies to solve the above problems, and as a result, found that the above problems can be solved by providing a photosensitive resin support structure having a specific configuration, and have completed the present invention. Ta.
That is, the present invention is as follows.

[1]
A lamination step of laminating the support c, the adhesive layer d and the support b in this order to form a laminate;
and a crimping step of crimping the laminate,
In the crimping step, the rate of change in the turbidity of the crimped portion of the laminate ((turbidity of the laminate before crimping - turbidity of the laminate after crimping) / turbidity of the laminate before crimping × 100) 2.0% or more,
The pressure-sensitive adhesive layer d has a recess opening on a second surface opposite to the first surface in contact with the support b, and the depth of the recess is 10 μm or more. A method of manufacturing a structure.
[2]
The method for producing a photosensitive resin support structure according to [1], wherein the pressure-sensitive adhesive layer d is present on the entire surface of the support b on the side of the support c.
[3]
The method for producing a photosensitive resin support structure according to [1] or [2], wherein the pressure-sensitive adhesive layer d contains a support e.
[4]
Between the lamination step and the pressure bonding step, a photosensitive resin layer a is laminated on the surface of the support b of the laminate opposite to the surface in contact with the pressure-sensitive adhesive layer d. The method for producing a photosensitive resin support structure according to any one of [1] to [3], further comprising a forming step.
[5]
[1] to [4], wherein, in the pressure-bonding step, pressure is applied in the direction of the support c from the surface of the support b opposite to the surface in contact with the pressure-sensitive adhesive layer d. 3. A method for producing a photosensitive resin support structure according to any one of .
[6]
Manufacture of a photosensitive resin support structure according to any one of [1] to [5], wherein in the pressure bonding step, a range of at least 2 mm in width from the end of the pressure-sensitive adhesive layer d toward the center of the surface is pressed. Method.
[7]
Manufacture of a photosensitive resin support structure according to any one of [1] to [5], wherein, in the pressing step, a range of at least 10 mm in width from the end of the pressure-sensitive adhesive layer d toward the center of the surface is pressed. Method.
[8]
The method for producing a photosensitive resin support structure according to any one of [1] to [7], wherein the pressure during compression in the compression bonding step is 300 g/cm ² or more and 5000 g/cm ² or less.
[9]
A production step of producing a photosensitive resin structure by the production method according to any one of [1] to [8], and disposing the photosensitive resin support structure produced in the production step and a negative film, A photosensitive resin relief plate comprising an exposure step of irradiating an actinic ray from the back side of a negative film, and a developing step of removing a photosensitive resin composition in an area not irradiated with the actinic ray in the exposing step. Production method.
[10]
A laminate in which a support c, an adhesive layer d, and a support b are laminated in this order, a part of the laminate has a pressure-bonded portion, and the turbidity of the pressure-bonded portion of the laminate is 30% or less. and
The difference in turbidity between the crimped portion and the non-crimped portion ((turbidity of the laminate of the non-crimped portion−turbidity of the laminate of the crimped portion)/turbidity of the laminate of the non-crimped portion×100) is 2. 0% or more,
The pressure-sensitive adhesive layer d has a recess opening on a second surface opposite to the first surface in contact with the support b, and the depth of the recess is 10 μm or more. Structure.
[11]
The photosensitive resin support structure according to [10], wherein the pressure-sensitive adhesive layer d is present on the entire surface of the support b on the support c side.
[12]
The photosensitive resin support structure according to [10] or [11], wherein the pressure-sensitive adhesive layer d contains a support e.

According to the present invention, for example, in the case where the photosensitive resin support structure having an adhesive function has an air passage portion, it is possible to suppress the occurrence of air pockets and realize sufficient air release properties. Also, it is possible to provide a photosensitive resin support structure that achieves a sealing property that does not allow ink to permeate at all.

1 shows a schematic cross-sectional view of an example of a structure forming a photosensitive resin support structure; FIG. The schematic sectional drawing of an example of the state which the adhesive layer and to-be-adhered body in a photosensitive resin support structure contact is shown. (A) shows a schematic cross-sectional view of a structure forming a photosensitive resin support structure before contact with an adherend; (B) shows a schematic cross-sectional view of the photosensitive resin support structure after contact with the adherend. 1 shows a schematic cross-sectional view of an example of a photosensitive resin support structure of the present invention; FIG. 1 shows a schematic top view of an example of a photosensitive resin support structure of the present invention; FIG. The schematic diagram of the apparatus which evaluates the sealing property of a photosensitive resin support structure is shown.

EMBODIMENT OF THE INVENTION Hereinafter, the form (henceforth "this embodiment") for implementing this invention is demonstrated in detail.
It should be noted that the present embodiment below is an example for explaining the present invention, and is not intended to limit the present invention to the following contents. The present invention can be carried out with various modifications within the scope of its gist. In the drawings, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted. In addition, unless otherwise specified, positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings. Furthermore, the dimensional ratios of the drawings are not limited to the illustrated ratios.

[Method for producing photosensitive resin support structure]
The method for manufacturing the photosensitive resin support structure of the present embodiment includes:
A lamination step of laminating the support c, the adhesive layer d and the support b in this order to form a laminate;
and a crimping step of crimping the laminate,
In the crimping step, the rate of change in the turbidity of the crimped portion of the laminate ((turbidity of the laminate before crimping - turbidity of the laminate after crimping) / turbidity of the laminate before crimping × 100) 2.0% or more,
The pressure-sensitive adhesive layer d has recesses opened on the second surface opposite to the first surface in contact with the support b, and the depth of the recesses is 10 μm or more.
The photosensitive resin support structure obtained by such a manufacturing method suppresses the formation of air pockets when, for example, the photosensitive resin support structure having an adhesive function has an air passage portion. In addition to achieving sufficient air release, it is also possible to achieve a seal that prevents ink from penetrating.

The thickness of the support b is preferably 10 μm or more and 500 μm or less, more preferably 50 μm or more and 250 μm or less.
The thickness of the support c is preferably 10 μm or more and 500 μm or less, more preferably 50 μm or more and 250 μm or less.
The thickness of the adhesive layer d is preferably 10 μm or more and 200 μm or less, more preferably 20 μm or more and 100 μm or less.

The support b and the pressure-sensitive adhesive layer d preferably have the same area, and the support c preferably has a larger area than the support b and the pressure-sensitive adhesive layer d.

In the crimping step, the rate of change in turbidity of the crimped portion of the laminate is preferably 2.0% or more and 5.0% or less, more preferably 2.0% or more and 4.0% or less. It is preferably 2.0% or more and 3.5% or less, and particularly preferably 2.1% or more and 3.2% or less. In the pressure-bonding step, when the rate of change in turbidity of the pressure-bonded portion of the laminate is within the above range, the resulting photosensitive resin support structure has increased adhesion between the support c and the adhesive layer d. In addition, it tends to be possible to maintain a state of excellent sealing performance for a longer period of time.
In the crimping step, the method for controlling the rate of change in turbidity of the crimped portion of the laminate within the above-described specific range is not particularly limited, but examples thereof include a method of adjusting the crimping force with a roller or the like. .
In this embodiment, the rate of change in turbidity at the press-bonded portion of the laminate can be measured by the method described in Examples below.

In the adhesive layer d, the depth of the concave portion is preferably 10 μm or more and 40 μm or less, more preferably 10 μm or more and 35 μm or less, and even more preferably 10 μm or more and 30 μm or less. In the pressure-sensitive adhesive layer d, when the depth of the concave portion is within the above range, the photosensitive resin support structure tends to have less air retention and good sealing properties.
In the pressure-sensitive adhesive layer d, the method for controlling the depth of the recesses within the above-described specific range is not particularly limited, but an example thereof includes a method of previously processing the recesses and projections of the liner to a predetermined size.
In addition, in this embodiment, the depth of the concave portion can be measured by the method described in Examples below.

The pressure-sensitive adhesive layer d is preferably present on the entire surface of the support b on the support c side. When the pressure-sensitive adhesive layer d is thus present on the entire surface of the support c side of the support b, the photosensitive resin support structure tends to have excellent sealing properties.

The pressure-sensitive adhesive layer d may contain a support e. Specifically, for example, the pressure-sensitive adhesive layer d may be a pressure-sensitive adhesive layer (eg, double-sided tape) containing a support e between two pressure-sensitive adhesive layers d1 and d2.

Between the lamination step and the pressure bonding step, a photosensitive resin layer a is laminated on the surface of the support b of the laminate opposite to the surface in contact with the pressure-sensitive adhesive layer d. It is preferable to further include a forming step.
Therefore, the photosensitive resin support structure of this embodiment also includes the photosensitive resin layer a. FIG. 4 shows a schematic cross-sectional view of an example of the photosensitive resin support structure of this embodiment, and FIG. 5 shows a schematic top view of an example of the photosensitive resin support structure of this embodiment. As shown in FIG. 4, the photosensitive resin support structure of the present embodiment has a laminate in which a support c, an adhesive layer d, and a support b are laminated in this order from the bottom, and further, the support b, It is preferable to have a photosensitive resin layer a on the surface opposite to the surface in contact with the pressure-sensitive adhesive layer d.

In the pressure-bonding step, it is preferable to apply pressure in the direction of the support c from the surface of the support b opposite to the surface in contact with the pressure-sensitive adhesive layer d. By applying pressure in this way, when working on a workbench or the like, for example, the photosensitive resin a as shown in FIG. It is in.

In the pressure-bonding step, the portion of the laminate to be pressure-bonded preferably has a width of at least 2 mm from the end of the pressure-sensitive adhesive layer d toward the center of the surface, and more preferably has a width of at least 10 mm. preferable. Here, the end portion means, for example, as in the photosensitive resin support structure shown in FIG. When it exists on the entire contact surface, the outer peripheral portion f of the support b is the edge.

The pressure during crimping in the crimping step is preferably 500 g/cm ² or more and 5000 g/cm ² or less, more preferably 800 g/cm ² or more and 2000 g/cm ² or less.

The temperature during crimping in the crimping step is preferably 0° C. or higher and 50° C. or lower, more preferably 10° C. or higher and 40° C. or lower, and further preferably 20° C. or higher and 30° C. or lower. .

A specific method of crimping in the crimping step is not particularly limited, but examples thereof include a method of applying a load to the laminate with a roller, a finger, a nail, or a spatula.

[Photosensitive resin support structure]
The photosensitive resin support structure of the present embodiment includes a laminate in which a support c, an adhesive layer d, and a support b are laminated in this order, and a part of the laminate has a pressure-bonded portion. The turbidity of the crimped portion of the laminate is 30% or less,
The difference in turbidity between the crimped portion and the non-crimped portion ((turbidity of the laminate of the non-crimped portion−turbidity of the laminate of the crimped portion)/turbidity of the laminate of the non-crimped portion×100) is 2. 0% or more,
The pressure-sensitive adhesive layer d has recesses opened on the second surface opposite to the first surface in contact with the support b, and the depth of the recesses is 10 μm or more.
By having such characteristics, the photosensitive resin support structure of the present embodiment has, for example, a sufficient air release property that suppresses the occurrence of air pockets, and a sealing property that prevents ink from penetrating.
In the photosensitive resin support structure of the present embodiment, the turbidity of the laminate in the non-crimped portion refers to the maximum value of the turbidity of the laminate, and the turbidity of the laminate in the crimped portion refers to the turbidity of the laminate. Refers to the minimum value of turbidity.

In addition, in this embodiment, the turbidity of the laminate can be measured by the method described in Examples below.

In the laminate, the difference in turbidity between the crimped portion and the uncrimped portion ((turbidity of the uncrimped portion of the laminate - turbidity of the crimped portion of the laminate) / turbidity of the uncrimped portion of the laminate × 100 ) is preferably 2.0% or more and 5.0% or less, more preferably 2.0% or more and 4.0% or less, and 2.0% or more and 3.5% or less More preferably, it is particularly preferably 2.1% or more and 3.2% or less.

The pressure-sensitive adhesive layer d is preferably present on the entire surface of the support b on the support c side. When the pressure-sensitive adhesive layer d is thus present on the entire surface of the support c side of the support b, the photosensitive resin support structure tends to have excellent sealing properties.

The pressure-sensitive adhesive layer d may contain a support e. Specifically, for example, the pressure-sensitive adhesive layer d may be a pressure-sensitive adhesive layer (eg, double-sided tape) containing a support e between two pressure-sensitive adhesive layers d1 and d2.

The photosensitive resin support structure of the present embodiment includes, for example, a support 2 (corresponding to support b) and an adhesive layer 3 (adhesive layer d) and a structure 1 forming a photosensitive resin support structure.
As shown in FIG. 1, the pressure-sensitive adhesive layer 3 preferably has an open recess 3h on the second surface 3b opposite to the first surface 3a in contact with the support 2. As shown in FIG.
As shown in FIG. 1, on the second surface 3b of the adhesive layer 3, a liner 4 having convex portions (which is temporarily placed before laminating the support c) may be laminated. Preferably, the concave portions 3h of the adhesive layer 3 are formed by the convex portions of the liner 4. As shown in FIG.
By using the structure 1 having the above configuration, it is possible to form a photosensitive resin support structure capable of suppressing the formation of air pockets, achieving sufficient air release properties, and realizing sufficient sealing properties.
As shown in FIG. 1, an adhesive layer 5 may be provided on the surface of the support 2 opposite to the surface in contact with the adhesive layer 3 .

The photosensitive resin support structure of the present embodiment may include a photosensitive resin layer a on the surface of the support b of the laminate opposite to the surface in contact with the pressure-sensitive adhesive layer d.
The photosensitive resin that can be used in the photosensitive resin support structure of the present embodiment is preferably a known photosensitive resin that undergoes a radical reaction upon irradiation with actinic rays to polymerize and cure.
Examples of such a photosensitive resin include, but are not limited to, a liquid photosensitive resin obtained by mixing an ethylenically unsaturated compound and a photopolymerization initiator with a prepolymer made of unsaturated polyester, unsaturated polyurethane, or the like. resin, or selected from, for example, styrene-butadiene copolymer rubber, styrene-isoprene copolymer rubber, methyl methacrylate resin, partially saponified polyvinyl acetate, water-soluble polyamide, unsaturated polyurethane, hydrophilic copolymer synthesized by emulsion polymerization, and the like; Examples include a solid photosensitive resin obtained by adding an ethylenically unsaturated compound and a photopolymerization initiator to a binder of a polymer.

The photosensitivity of the photosensitive resin depends on the type of actinic light used in the exposure process, depending on the type of known photoinitiator (Keiichi Yashiro, "Photocuring Technical Data Book", published by Technonet Co., Ltd., 2000, pp. 122-133). It is possible to select and adjust the material from among them, and the effective wavelength region of the actinic rays is the center wavelength region of the irradiation light wavelength distribution of the exposure light source.
In order for the photosensitive resin support structure of the present embodiment to exhibit its effects sufficiently in, for example, flexographic printing plates and mold-making plates, exposure light sources used in the production of these relief plates include, for example, high pressure It preferably has the light transmission characteristics described later for mercury lamps, ultra-high pressure mercury lamps, ultraviolet fluorescent lamps, carbon arc lamps, xenon lamps, etc., that is, light for actinic rays exhibiting a central wavelength region in the range of 300 to 400 nm. It preferably has transmission properties.

(Support b)
The support b used in the photosensitive resin support structure of the present embodiment has the function of reinforcing the relief plate finally obtained after laminating the photosensitive resin layer a on it and curing it, and keeping it in a predetermined shape. It is preferable that the Such a support b can be appropriately selected from those commonly used as supports depending on the purpose.
The material of the support b is not particularly limited. preferably have a predetermined permeability, which will be described later.
A preferably applicable support b is a plastic film or sheet whose material itself has relatively good thickness accuracy, and examples thereof include polyester film, polypropylene film, and polyvinyl chloride film.
When the support b is a plastic film, the thickness of the support is preferably in the range of 10 μm to 500 μm. More preferably, the thickness is 50 μm to 250 μm. A polyester film is preferable as the plastic film having such a thickness.

(adhesive layer)
On the surface of the support b opposite to the surface in contact with the pressure-sensitive adhesive layer d and on the side on which the photosensitive resin layer a is laminated, a may be provided with an adhesive layer.
This adhesive layer is preferably formed by applying an adhesive material to the support b, or modifying the surface of the support b by corona treatment or the like.
The adhesive material is not particularly limited, and for example, known adhesives for supports for photosensitive resin plates can be used. It can be appropriately selected from among those described in JP-A-43561 and the like, taking into account the chemical properties of the photosensitive resin.
A dye or an ultraviolet absorber may be added to this adhesive layer for the purpose of preventing halation and adjusting the ultraviolet transmission wavelength range.
The thickness of the adhesive layer is preferably within the range of 0.1 to 10 μm.

(Adhesive layer d)
The pressure-sensitive adhesive layer d used in the photosensitive resin support structure of the present embodiment is an adherend (support c) that differs depending on the application. (corresponding to ). The pressure-sensitive adhesive layer d is arranged on the surface of the support b opposite to the surface on which the photosensitive resin layer a is formed.
The adherend (corresponding to the support c) is not particularly limited. and a carrier sheet.
As a specific form, as shown in FIG. 2, the depression of the photosensitive resin support of the present embodiment having an adhesive layer 3 on a support 2 on which a plate is formed by a cured product of a photosensitive resin layer. is in contact with the plate cylinder via a predetermined carrier sheet.
The adhesive constituting the adhesive layer d is not limited to the following, but for example, acrylic adhesive, rubber adhesive, silicon adhesive, urethane adhesive, polyester adhesive, vinyl acetate known adhesives such as adhesives ("Encyclopedia of Adhesion and Adhesion" supervised by Shozaburo Yamaguchi, published by Asakura Shoten in 1986, pp. 118-169). Adhesive strength and peeling strength with the liner, solvent resistance to the developer, etc. are taken into consideration when selecting the adhesive.
Among them, the adhesive that can be suitably used for the photosensitive resin support structure of the present embodiment is a re-peelable adhesive that does not permanently stick, in order to enable correction work of the sticking position of the printing plate or replacement due to design change. Pressure-sensitive adhesives are preferred, and acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicon-based pressure-sensitive adhesives are preferred.

<Concave>
The pressure-sensitive adhesive layer d is the first layer in contact with the support b in order to prevent the formation of air pockets between the surface of the pressure-sensitive adhesive layer d and the surface of the adherend when the relief plate is adhered to the surface of the adherend. On the second surface opposite to the first surface, there is provided a recessed portion which is a communicating air passage which is open when the liner is peeled off.
The recess is preferably formed continuously from one end of the pressure-sensitive adhesive layer d to the other end. As a result, it is possible to effectively prevent the occurrence of air pockets between the surface of the adherend and the surface of the adherend.
The cross-sectional shape of the air passage formed by the recess is not particularly limited, but examples thereof include a rectangular shape, a wedge shape, and a semicircular shape. The depth of the concave portion is 10 μm or more, and may be shallower than the thickness of the pressure-sensitive adhesive layer d.
As for the structure having air passages formed by recesses, it is preferable that the passages are in communication. , a mesh shape, or a curved shape, and the adhesive layer d itself is a continuous porous body, a laminate of fibrous adhesives, or a combination thereof, thereby realizing the desired air permeability. good too.
A thin film layer may be provided in the adhesive layer d for the purpose of reinforcement.

<Method for Forming Adhesive Layer d>
In the photosensitive resin support structure of the present embodiment, the method for forming the pressure-sensitive adhesive layer d having recesses that are open and communicating air passages is not particularly limited, but examples thereof include the following methods.
For example, a predetermined pattern is formed on a liner-forming roll that serves as a pattern of air passages, the liner is patterned by the forming roll, a pressure-sensitive adhesive is applied to the liner, dried, and a support is obtained. A method of forming the pressure-sensitive adhesive layer d by laminating b together can be mentioned.
When the adhesive is applied, the adhesive may be dissolved or dispersed in a volatile solvent, or may be melted.
Other methods for forming the adhesive layer d are not particularly limited. A method of protruding, a method of once applying the adhesive to the entire surface of the support and then scraping off the adhesive with a fingernail having a desired cross-sectional shape and pitch, and a method of impressing the adhesive on the adhesive surface with a roll having a desired letterpress shape and pattern. a method in which the adhesive is foamed and made porous with a foaming agent and then coated on the support;
The methods described above may be used singly or in combination of two or more.

In order to manufacture the photosensitive resin support structure of the present embodiment as a long sheet with excellent productivity, the air passage of the adhesive layer is formed continuously on the support sheet by any of the above-described methods. It is preferable to form a recess.
The structure forming the photosensitive resin support structure of the present embodiment includes, for example, a structure in which an adhesive layer d is laminated on a support b, and a liner is laminated on the adhesive layer d. When such structures are stacked and stored, the uneven shape of the adhesive layer d may be transferred, the adhesive may protrude from the ends of the structure due to cold flow, and air passages may be blocked. Therefore, in the photosensitive resin support structure of the present embodiment, the thickness of the adhesive layer d, the opening width and depth of the recessed portion that is the air passage, are sufficiently adjusted according to the adhesive strength and flexibility of the adhesive to be used. It is preferable to appropriately select the material so as to maintain a sufficient strength and not to cause the phenomenon described above.

(liner)
In the structure forming the photosensitive resin support structure of the present embodiment, a liner having a convex portion may be laminated on the second surface of the pressure-sensitive adhesive layer d. It is preferable that the concave portion is formed by the convex portion.
A liner is laminated to the adhesive layer d to protect the adhesive layer d during handling or during the platemaking and plate mounting steps.
The liner is preferably resistant to aqueous, alcoholic, and hydrocarbon-based developing solutions used in the plate making process. Such liners include, but are not limited to, clear plastic films made from polyester, polypropylene, polyethylene, propylene-ethylene copolymers, flexible polyvinyl chloride, polyamides, and acrylics. The thickness of the liner is preferably between 5 μm and 200 μm.

It is preferable that the surface of the liner opposite to the surface in contact with the pressure-sensitive adhesive layer d is uniformly roughened in order to improve vacuuming during plate making. It is not necessary to roughen the surface excessively. For example, a 10-point average roughness (Rz) according to the JIS standard of about 0.1 μm is sufficient. The roughening method is not particularly limited, but includes, for example, a sandblasting method and a chemical etching method. Further, for example, a resin matting method, in which the surface is roughened when forming a film or sheet to be used as a protective film, may be used.

The adhesive strength of the adhesive layer d is appropriately adjusted as necessary, but the adhesive strength with the support b (for example, the adhesive strength on the first surface 3a in FIG. After the adhesive strength is stabilized by leaving it at 20°C for 1 week, the adhesive strength (180 degree adhesive strength) when peeled at a rate of 300 mm/min in the direction of 180 degrees is preferably 100 g/25 mm or more, more preferably. 200 g/25 mm or more. If the 180-degree adhesive strength is 200 g/25 mm or more, there is a tendency that peeling or the like can be practically suppressed even in a thick plate having a relief thickness of 3 mm or more.
The adhesive strength of the pressure-sensitive adhesive layer d to the surface to be adhered to which the relief plate is adhered (for example, the adhesive strength on the second surface 3b in FIG. 1) is such that when the relief plate once adhered is peeled off, the support If the adhesive strength to the side of the support b is smaller, the adhesive layer d may be peeled off from the side of the support b and transferred to the surface to be adhered. preferable. When the support b and the surface to be adhered are made of the same material, the support b It is preferable to previously provide a known anchor coat layer on the surface of the support, or to corona-treat a support coated with an adhesive to increase the adhesive strength.

The adhesive strength between the pressure-sensitive adhesive layer d and the liner is preferably adjusted to be smaller than the adhesive strength with the above-mentioned support b, in order to allow the liner to be peeled off. From the viewpoints of preventing the liner from falling off and facilitating the peeling of the liner, the 180-degree adhesive strength is preferably adjusted to 1 to 200 g/25 mm, more preferably 5 to 100 g/25 mm, and still more preferably 10 to 50 g/25 mm.
When the backing b and the liner are made of the same material, in order to set the adhesive strength between the adhesive layer d and the liner lower than the adhesive strength between the adhesive layer d and the backing b, the side of the liner in contact with the adhesive layer d It is effective to provide a release agent layer on the surface.
As the release agent, a known silicone-based release agent or fluororesin, which is commonly used for adhesive tapes, can be used.

[Method for producing a photosensitive resin relief plate]
The photosensitive resin support structure of the present embodiment is preferably used for the production of a photosensitive resin relief plate including an exposure step of irradiating the photosensitive resin composition layer with actinic rays.
A method for manufacturing a photosensitive resin relief plate using the photosensitive resin support structure of this embodiment will be described.
As a method for producing a photosensitive resin relief plate, it is preferable to perform an exposure step, a development step, and then, if necessary, a post-exposure step and a drying step. It is more preferable to include a step of arranging a resin support structure (including a photosensitive resin layer) and irradiating actinic light from the back side of the negative film, and the actinic light to be irradiated has a central wavelength in the range of 300 to 400 nm. is more preferred.

Other actions in the exposure step are not limited at all. A step of adhering a protective film to the surface opposite to the surface in contact with the support b and irradiating actinic rays having a central wavelength in the region of 300 to 400 nm through a negative film having an image different from that of the negative film on the support side. It's okay.

After the exposure step, a development step is preferably carried out in order to remove the photosensitive resin composition in the regions not irradiated with actinic rays, and the development method is a method capable of removing uncured photosensitive resin composition. It is not particularly limited as long as it is. For example, a method using a liquid (developer) that allows the photosensitive resin composition to dissolve, disperse, and swell, and in an environment where the uncured photosensitive resin composition has fluidity, high-pressure water and air pressure are used to remove it. method, a method of wiping off with a nonwoven fabric, and the like.

When a conventional photosensitive resin support structure is applied to a developing process using a liquid, the developer tends to penetrate into the air passages provided in the pressure-sensitive adhesive layer during the developing process. In this case, when the liner is removed to attach the plate, the soaked developer emits a foul odor, which is undesirable from an environmental point of view. Otherwise, the photosensitive resin support structure may peel off from the adherend.
On the other hand, in the photosensitive resin support structure of the present embodiment, the laminate has a turbidity of 30% or less, and the pressure-sensitive adhesive layer d is disposed on the second surface opposite to the first surface in contact with the support b. Since the recess has an opening on the surface and the depth of the recess is 10 μm or more, it is possible to realize sufficient air release property by suppressing the occurrence of air pockets, and to achieve sufficient sealing property.

EXAMPLES Hereinafter, the present embodiment will be described in more detail with specific examples and comparative examples, but the present embodiment is not limited by the following examples and comparative examples.

[Examples 1 to 12], [Comparative Examples 1 to 16]
A structure for forming a photosensitive resin support structure as shown in FIG. 3A was produced as follows.
First, a rectangular liner 4 made of polyethylene terephthalate (PET) was embossed to form irregularities having a predetermined height in a grid pattern on the surface of the liner 4 .
Next, an adhesive was applied onto the liner 4 and dried to form an adhesive layer 3 having a thickness of 57 μm. Here, the size and shape of the pressure-sensitive adhesive layer 3 were a rectangle of 50 mm×150 mm. Further, the depth of the recesses in the pressure-sensitive adhesive layer 3 was controlled as shown in Table 1 by appropriately adjusting the height of the protrusions on the surface of the liner 4 in contact with the pressure-sensitive adhesive layer 3 . However, in Comparative Examples 1 to 4, the pressure-sensitive adhesive layer 3 having no concave portions was formed by using the liner 4 having no concave portions.
Further, a support 2 having a thickness of 188 μm was adhered to the surface of the pressure-sensitive adhesive layer 3 opposite to the liner 4 side to form a laminate. Here, the pressure-sensitive adhesive layer 3 was present on the entire surface of the support 2 on the liner 4 side.
A photosensitive resin layer a was laminated on the surface of the support 2 of the obtained laminate opposite to the surface in contact with the pressure-sensitive adhesive layer 3 .
Next, as shown in FIG. 3B, the liner 4 is peeled off from the structure 1 forming a photosensitive resin support structure of 50 mm×150 mm to expose the pressure-sensitive adhesive layer 3, and a predetermined adherend 10 ( PET film: Corresponding to the support c).
Specifically, first, the peripheral portion of the surface from which the liner 4 is removed from the structure 1 forming the photosensitive resin supporting structure is attached to the adherend 10, and then the photosensitive resin supporting structure is formed. The central portion of the surface of the body 1 from which the liner 4 was peeled off was attached to the adherend 10 to obtain a laminate.
Next, pressure shown in Table 1 was applied by a roller from the surface of the support 2 opposite to the surface in contact with the pressure-sensitive adhesive layer 3 toward the adherend 10 . Here, the portion of the laminate to be crimped has a width of 5 mm from the end of the adhesive layer 3 toward the center of the surface, and the rate of change in turbidity of the crimped portion of the laminate ((laminate before crimping Turbidity - turbidity of laminate after pressure bonding)/turbidity of laminate before pressure bonding x 100) was adjusted to be as shown in Table 1. The speed of the rollers during pressure bonding was set to 5 cm/sec. However, in Comparative Examples 1, 5, 9 to 12 and 14, crimping was not performed.
As described above, each photosensitive resin support structure having an adhesive layer with a recess depth of 0 to 30 μm was produced and measured by the following method.

(Measurement of depth of concave portion of pressure-sensitive adhesive layer)
The liner 4 is peeled off from the structure 1 forming the photosensitive resin support structure, and the exposed adhesive layer 3 is analyzed using a shape analysis laser microscope (manufactured by Keyence Corporation, VK-X1000). The depth H of the recess 3h was measured. Analysis was performed using the vk analysis application.
In the measurement, arbitrary three points within 5 cm or more from the edge of the pressure-sensitive adhesive layer 3 were selected, and the average value of the measured values was calculated as the measured value of the depth of the concave portion.
In FIG. 3A, (1) corresponds to the sum of the thickness of the support 2, the thickness of the pressure-sensitive adhesive layer 3, and the thickness of the liner 4. In FIG. In FIG. 3A, (2) corresponds to the thickness of the liner 4 including the height of the unevenness.

[Evaluation of characteristics]
The properties of the photosensitive resin supports of the above Examples and Comparative Examples were evaluated as follows. Table 1 shows the evaluation results.

(sealing property)
A hole is made with a puncher in the vicinity of one short side of the photosensitive resin support (rectangle of 50 mm × 150 mm) of the above Examples and Comparative Examples (the side on which the ink does not penetrate), and the other short side (the side where the ink does not penetrate) A measurement sample was prepared by drawing a dotted line with a magic marker on the boundary between the crimped portion (5 mm width) and the non-crimped portion.
As shown in FIG. 6, a measurement sample 13 having a rod 12 passed through a hole 11 was placed in a beaker 14 . At that time, as shown in FIG. 6, the measurement sample 13 was placed so that the boundary 15 of the crimped portion (5 mm width) could be seen, and the other short side portion from the end to 3 mm was immersed in the liquid 16. did. The immersion time was 10 minutes. The liquid 16 is a plate cleaning agent (IC-01 manufactured by Sakata Inx), which is colored with black ink so as to visualize the state of penetration. After the immersion, the measurement sample 13 was allowed to stand in a constant temperature bath at 25°C for 3 hours.
The measurement point is from the entrance of the plate cleaner (ink) to the point along the concave portion where the plate cleaner (ink) has stopped entering. ) was evaluated as × when intrusion was confirmed.

(air release property)
As shown in FIG. 3(B), the liner 4 was peeled off from the structure 1 forming a photosensitive resin support structure of 50 mm×150 mm, the adhesive layer 3 was exposed, and was attached to a predetermined adherend 10. .
Specifically, first, the peripheral portion of the surface from which the liner 4 is removed from the structure 1 forming the photosensitive resin supporting structure is attached to the adherend 10, and then the photosensitive resin supporting structure is formed. The central portion of the surface from which the liner 4 was removed from the body 1 was attached to the adherend 10 .
The air trapped at the boundary between the adhesive layer 3 and the adherend 10 of the photosensitive resin support structure covers the central portion of the surface where the liner 4 is peeled from the structure 1 forming the photosensitive resin support structure. It was evaluated by measuring the thickness of the portion where the air was accumulated to determine whether or not it would come off when attached to the garment 10 .
If the thickness of the part where the air is accumulated is 50 μm or more higher than the surrounding part, it is marked as ×,
When it was less than 50 μm, it was evaluated as ◯.

(Measurement of turbidity change rate)
The turbidity of the press-bonded portion of the laminate and the turbidity of the laminate before press-bonded in the photosensitive resin supports of the above Examples and Comparative Examples were measured using a HAZE METER NDH5000 (Nippon Denshoku Kogyo Co., Ltd.). The rate of change in turbidity before and after crimping of the body ((turbidity of laminate before crimping−turbidity of laminate after crimping)/turbidity of laminate before crimping×100) was calculated.

(Measurement of turbidity of laminate)
The turbidity of the press-bonded portions of the laminates of the photosensitive resin supports of the above Examples and Comparative Examples was measured using a HAZE METER NDH5000 (Nippon Denshoku Kogyo Co., Ltd.). However, in Comparative Examples 1, 5, 9 to 12 and 14, pressure bonding was not performed, so the turbidity of the non-pressure bonding portion of the laminate was measured and shown in Table 1.

In the photosensitive resin support structure of the present invention, when the convenience of the support structure having an adhesive function is required and the photosensitive resin support structure has an air passage portion, the air reservoir It has industrial applicability in fields requiring suppression of the occurrence of , and sufficient sealing properties, for example, in the field of flexographic printing plate manufacturing and patterning plate manufacturing.

REFERENCE SIGNS LIST 1 structure forming a photosensitive resin support structure 2 support 3 adhesive layer 3a first surface 3b second surface 3h recess 4 liner 5 adhesive layer 10 adherend a photosensitive resin layer a
b support b
c support c
d Adhesive layer d
e photosensitive resin support structure f end

Claims (12)

A lamination step of laminating the support c, the adhesive layer d and the support b in this order to form a laminate;
and a crimping step of crimping the laminate,
In the crimping step, the rate of change in the turbidity of the crimped portion of the laminate ((turbidity of the laminate before crimping - turbidity of the laminate after crimping) / turbidity of the laminate before crimping × 100) 2.0% or more,
The pressure-sensitive adhesive layer d has a recess opening on a second surface opposite to the first surface in contact with the support b, and the depth of the recess is 10 μm or more. A method of manufacturing a structure. 2. The method for producing a photosensitive resin support structure according to claim 1, wherein said adhesive layer d is present on the entire surface of said support b on the side of said support c. 3. The method for producing a photosensitive resin support structure according to claim 1, wherein the pressure-sensitive adhesive layer d includes a support e. Between the lamination step and the pressure bonding step, a photosensitive resin layer a is laminated on the surface of the support b of the laminate opposite to the surface in contact with the pressure-sensitive adhesive layer d. 4. The method for producing a photosensitive resin support structure according to any one of claims 1 to 3, further comprising a forming step. 5. Any one of claims 1 to 4, wherein in the pressure-bonding step, pressure is applied in the direction of the support c from the surface of the support b opposite to the surface in contact with the pressure-sensitive adhesive layer d. 3. A method for producing a photosensitive resin support structure according to claim 1. 6. Manufacture of a photosensitive resin support structure according to any one of claims 1 to 5, wherein in the pressure-bonding step, a range of at least 2 mm in width from the end of the pressure-sensitive adhesive layer d toward the center of the surface is pressure-bonded. Method. 6. Manufacture of a photosensitive resin support structure according to any one of claims 1 to 5, wherein in the pressure bonding step, a range of at least 10 mm in width from the end of the pressure-sensitive adhesive layer d toward the center of the surface is pressure-bonded. Method. The method for producing a photosensitive resin support structure according to any one of claims 1 to 7, wherein the pressing pressure in the pressing step is 300 g/cm ² or more and 5000 g/cm ² or less. A manufacturing process for manufacturing a photosensitive resin structure by the manufacturing method according to any one of claims 1 to 8, and disposing the photosensitive resin support structure manufactured in the manufacturing process and a negative film, A photosensitive resin relief plate comprising an exposure step of irradiating an actinic ray from the back side of a negative film, and a developing step of removing a photosensitive resin composition in an area not irradiated with the actinic ray in the exposing step. Production method. A laminate in which a support c, an adhesive layer d, and a support b are laminated in this order, a part of the laminate has a pressure-bonded portion, and the turbidity of the pressure-bonded portion of the laminate is 30% or less. and
The difference in turbidity between the crimped portion and the non-crimped portion ((turbidity of the laminate of the non-crimped portion−turbidity of the laminate of the crimped portion)/turbidity of the laminate of the non-crimped portion×100) is 2. 0% or more,
The pressure-sensitive adhesive layer d has a recess opening on a second surface opposite to the first surface in contact with the support b, and the depth of the recess is 10 μm or more. Structure. 11. The photosensitive resin support structure according to claim 10, wherein the pressure-sensitive adhesive layer d is present on the entire surface of the support b on the support c side. The photosensitive resin support structure according to claim 10 or 11, wherein said adhesive layer d comprises a support e.