JP2023110904A5 - - Google Patents

Download PDF

Info

Publication number
JP2023110904A5
JP2023110904A5 JP2023010925A JP2023010925A JP2023110904A5 JP 2023110904 A5 JP2023110904 A5 JP 2023110904A5 JP 2023010925 A JP2023010925 A JP 2023010925A JP 2023010925 A JP2023010925 A JP 2023010925A JP 2023110904 A5 JP2023110904 A5 JP 2023110904A5
Authority
JP
Japan
Prior art keywords
heat sink
cavity
power electronics
electronics assembly
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023010925A
Other languages
English (en)
Japanese (ja)
Other versions
JP7500792B2 (ja
JP2023110904A (ja
Filing date
Publication date
Priority claimed from US17/587,255 external-priority patent/US11856689B2/en
Application filed filed Critical
Publication of JP2023110904A publication Critical patent/JP2023110904A/ja
Publication of JP2023110904A5 publication Critical patent/JP2023110904A5/ja
Application granted granted Critical
Publication of JP7500792B2 publication Critical patent/JP7500792B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023010925A 2022-01-28 2023-01-27 パワーエレクトロニクスアセンブリ及びその製造方法 Active JP7500792B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/587,255 2022-01-28
US17/587,255 US11856689B2 (en) 2022-01-28 2022-01-28 Power electronics assemblies and methods of fabricating the same

Publications (3)

Publication Number Publication Date
JP2023110904A JP2023110904A (ja) 2023-08-09
JP2023110904A5 true JP2023110904A5 (enExample) 2024-03-19
JP7500792B2 JP7500792B2 (ja) 2024-06-17

Family

ID=87401811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023010925A Active JP7500792B2 (ja) 2022-01-28 2023-01-27 パワーエレクトロニクスアセンブリ及びその製造方法

Country Status (3)

Country Link
US (1) US11856689B2 (enExample)
JP (1) JP7500792B2 (enExample)
CN (1) CN116528455A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12309911B2 (en) * 2022-07-11 2025-05-20 Hamilton Sundstrand Corporation Printed circuit board (PCB) cooling
TWI866026B (zh) * 2023-01-11 2024-12-11 緯創資通股份有限公司 包括冷管之液冷組件與電子裝置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4989070A (en) 1988-11-10 1991-01-29 Coriolis Corporation Modular heat sink structure
US5111280A (en) 1988-11-10 1992-05-05 Iversen Arthur H Thermal management of power conditioning systems
JPH0268493U (enExample) * 1988-11-12 1990-05-24
US5168919A (en) 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
US5675473A (en) 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US8488315B2 (en) * 2009-08-18 2013-07-16 GM Global Technology Operations LLC Power module assemblies with staggered coolant channels
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
JP5817552B2 (ja) 2012-01-23 2015-11-18 日本電気株式会社 電子装置
JP5523500B2 (ja) 2012-04-27 2014-06-18 三菱電機株式会社 電子制御装置
US8934250B2 (en) 2012-09-26 2015-01-13 International Business Machines Corporation Immersion-cooling of selected electronic component(s) mounted to printed circuit board
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US9980415B2 (en) 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling
US10700571B2 (en) * 2017-12-08 2020-06-30 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling system for vehicle motor drive
US10334756B1 (en) * 2018-02-28 2019-06-25 Toyota Motor Engineering & Manufacturing North America, Inc. Manifold structures having an integrated fluid channel system and assemblies comprising the same
US11350545B2 (en) * 2019-12-05 2022-05-31 Ge Aviation Systems Llc Cold plate assembly for an electronic component
US11864323B2 (en) * 2020-07-15 2024-01-02 Toyota Motor Engineering & Manufacturing North America, Inc. Driver board assemblies and methods of forming a driver board assembly

Similar Documents

Publication Publication Date Title
CN116544198B (zh) 一种电力装置组件及其制造方法
JP2023112686A5 (enExample)
US11075331B2 (en) Thermoelectric device having circuitry with structural rigidity
JP2023110904A5 (enExample)
CN212517170U (zh) 一种芯片封装结构及电子设备
US7623347B2 (en) Electric device having first and second electric elements
US10721838B1 (en) Stacked base heat sink with heat pipes in-line with airflow
CN100393183C (zh) 电路形成基板制造方法
US12300653B2 (en) Electronics assemblies with power electronic devices and three-dimensionally printed circuit boards having reduced joule heating
US11864357B2 (en) Double-sided cooling cold plates with overhanging heat sinks and through body busbar for high-power density power electronics
TW201322844A (zh) 裝設印刷電路板之方法
JPH098187A (ja) 集積回路の冷却方法
JPH077282A (ja) 回路部品をパックする装置
CN115702604A (zh) 通信模块
JP7500792B2 (ja) パワーエレクトロニクスアセンブリ及びその製造方法
US11910521B2 (en) Power device assemblies having embedded PCBS and enhanced cooling and methods of fabricating the same
US7643302B2 (en) Electronic device, package having the same, and electronic apparatus
TW200939909A (en) Heat-radiating substrate and method of manufacturing the same
CN217822758U (zh) 功率模组
CN110809384A (zh) 一种散热装置及应用所述散热装置的电力设备
TW202327435A (zh) 具有開口的冷板以及相關系統
CN108990253A (zh) 覆铜板、印刷线路板和电子设备
EP1726197B1 (en) An element for carrying electronic components
CN223182380U (zh) 一种线路板、线路板组件及电气设备
CN223503082U (zh) 电路板