CN116528455A - 电力电子组件及其制造方法 - Google Patents

电力电子组件及其制造方法 Download PDF

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Publication number
CN116528455A
CN116528455A CN202310078888.XA CN202310078888A CN116528455A CN 116528455 A CN116528455 A CN 116528455A CN 202310078888 A CN202310078888 A CN 202310078888A CN 116528455 A CN116528455 A CN 116528455A
Authority
CN
China
Prior art keywords
cold plate
heat sink
cavity
printed circuit
coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310078888.XA
Other languages
English (en)
Chinese (zh)
Inventor
周锋
刘阳河
请川纮嗣
E·德得
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Engineering and Manufacturing North America Inc
Original Assignee
Toyota Motor Engineering and Manufacturing North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Engineering and Manufacturing North America Inc filed Critical Toyota Motor Engineering and Manufacturing North America Inc
Publication of CN116528455A publication Critical patent/CN116528455A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
CN202310078888.XA 2022-01-28 2023-01-20 电力电子组件及其制造方法 Pending CN116528455A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/587,255 US11856689B2 (en) 2022-01-28 2022-01-28 Power electronics assemblies and methods of fabricating the same
US17/587,255 2022-01-28

Publications (1)

Publication Number Publication Date
CN116528455A true CN116528455A (zh) 2023-08-01

Family

ID=87401811

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310078888.XA Pending CN116528455A (zh) 2022-01-28 2023-01-20 电力电子组件及其制造方法

Country Status (3)

Country Link
US (1) US11856689B2 (enExample)
JP (1) JP7500792B2 (enExample)
CN (1) CN116528455A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12309911B2 (en) * 2022-07-11 2025-05-20 Hamilton Sundstrand Corporation Printed circuit board (PCB) cooling
TWI866026B (zh) * 2023-01-11 2024-12-11 緯創資通股份有限公司 包括冷管之液冷組件與電子裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110042038A1 (en) * 2009-08-18 2011-02-24 Gm Global Technology Operations, Inc. Power module assemblies with staggered coolant channels
US20190181717A1 (en) * 2017-12-08 2019-06-13 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling system for vehicle motor drive
US20220022323A1 (en) * 2020-07-15 2022-01-20 Toyota Motor Engineering & Manufacturing North America, Inc. Driver board assemblies and methods of forming a driver board assembly

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4989070A (en) 1988-11-10 1991-01-29 Coriolis Corporation Modular heat sink structure
US5111280A (en) 1988-11-10 1992-05-05 Iversen Arthur H Thermal management of power conditioning systems
JPH0268493U (enExample) * 1988-11-12 1990-05-24
US5168919A (en) 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
US5675473A (en) 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
JP5817552B2 (ja) 2012-01-23 2015-11-18 日本電気株式会社 電子装置
JP5523500B2 (ja) 2012-04-27 2014-06-18 三菱電機株式会社 電子制御装置
US8934250B2 (en) 2012-09-26 2015-01-13 International Business Machines Corporation Immersion-cooling of selected electronic component(s) mounted to printed circuit board
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US9980415B2 (en) 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling
US10334756B1 (en) * 2018-02-28 2019-06-25 Toyota Motor Engineering & Manufacturing North America, Inc. Manifold structures having an integrated fluid channel system and assemblies comprising the same
US11350545B2 (en) * 2019-12-05 2022-05-31 Ge Aviation Systems Llc Cold plate assembly for an electronic component

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110042038A1 (en) * 2009-08-18 2011-02-24 Gm Global Technology Operations, Inc. Power module assemblies with staggered coolant channels
US20190181717A1 (en) * 2017-12-08 2019-06-13 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling system for vehicle motor drive
US20220022323A1 (en) * 2020-07-15 2022-01-20 Toyota Motor Engineering & Manufacturing North America, Inc. Driver board assemblies and methods of forming a driver board assembly

Also Published As

Publication number Publication date
US20230284377A1 (en) 2023-09-07
JP7500792B2 (ja) 2024-06-17
JP2023110904A (ja) 2023-08-09
US11856689B2 (en) 2023-12-26

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