JP7500792B2 - パワーエレクトロニクスアセンブリ及びその製造方法 - Google Patents

パワーエレクトロニクスアセンブリ及びその製造方法 Download PDF

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Publication number
JP7500792B2
JP7500792B2 JP2023010925A JP2023010925A JP7500792B2 JP 7500792 B2 JP7500792 B2 JP 7500792B2 JP 2023010925 A JP2023010925 A JP 2023010925A JP 2023010925 A JP2023010925 A JP 2023010925A JP 7500792 B2 JP7500792 B2 JP 7500792B2
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Japan
Prior art keywords
heat sink
cavity
power electronics
electronics assembly
pcb
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English (en)
Japanese (ja)
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JP2023110904A5 (enExample
JP2023110904A (ja
Inventor
チョウ フォン
ヤンホー リウ
紘嗣 請川
デデ エルカン
Original Assignee
トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023010925A 2022-01-28 2023-01-27 パワーエレクトロニクスアセンブリ及びその製造方法 Active JP7500792B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/587,255 2022-01-28
US17/587,255 US11856689B2 (en) 2022-01-28 2022-01-28 Power electronics assemblies and methods of fabricating the same

Publications (3)

Publication Number Publication Date
JP2023110904A JP2023110904A (ja) 2023-08-09
JP2023110904A5 JP2023110904A5 (enExample) 2024-03-19
JP7500792B2 true JP7500792B2 (ja) 2024-06-17

Family

ID=87401811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023010925A Active JP7500792B2 (ja) 2022-01-28 2023-01-27 パワーエレクトロニクスアセンブリ及びその製造方法

Country Status (3)

Country Link
US (1) US11856689B2 (enExample)
JP (1) JP7500792B2 (enExample)
CN (1) CN116528455A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12309911B2 (en) * 2022-07-11 2025-05-20 Hamilton Sundstrand Corporation Printed circuit board (PCB) cooling
TWI866026B (zh) * 2023-01-11 2024-12-11 緯創資通股份有限公司 包括冷管之液冷組件與電子裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012200141A (ja) 2012-04-27 2012-10-18 Mitsubishi Electric Corp 電子制御装置
JP2013149920A (ja) 2012-01-23 2013-08-01 Nec Corp 電子装置
US10334756B1 (en) 2018-02-28 2019-06-25 Toyota Motor Engineering & Manufacturing North America, Inc. Manifold structures having an integrated fluid channel system and assemblies comprising the same
US20210176896A1 (en) 2019-12-05 2021-06-10 Ge Aviation Systems Llc Cold plate assembly for an electronic component

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5111280A (en) 1988-11-10 1992-05-05 Iversen Arthur H Thermal management of power conditioning systems
US4989070A (en) 1988-11-10 1991-01-29 Coriolis Corporation Modular heat sink structure
JPH0268493U (enExample) * 1988-11-12 1990-05-24
US5168919A (en) 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
US5675473A (en) 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US8488315B2 (en) * 2009-08-18 2013-07-16 GM Global Technology Operations LLC Power module assemblies with staggered coolant channels
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
US8934250B2 (en) 2012-09-26 2015-01-13 International Business Machines Corporation Immersion-cooling of selected electronic component(s) mounted to printed circuit board
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US9980415B2 (en) 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling
US10700571B2 (en) * 2017-12-08 2020-06-30 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling system for vehicle motor drive
US11864323B2 (en) * 2020-07-15 2024-01-02 Toyota Motor Engineering & Manufacturing North America, Inc. Driver board assemblies and methods of forming a driver board assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149920A (ja) 2012-01-23 2013-08-01 Nec Corp 電子装置
JP2012200141A (ja) 2012-04-27 2012-10-18 Mitsubishi Electric Corp 電子制御装置
US10334756B1 (en) 2018-02-28 2019-06-25 Toyota Motor Engineering & Manufacturing North America, Inc. Manifold structures having an integrated fluid channel system and assemblies comprising the same
US20210176896A1 (en) 2019-12-05 2021-06-10 Ge Aviation Systems Llc Cold plate assembly for an electronic component

Also Published As

Publication number Publication date
US11856689B2 (en) 2023-12-26
JP2023110904A (ja) 2023-08-09
CN116528455A (zh) 2023-08-01
US20230284377A1 (en) 2023-09-07

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