JP2023107556A - Lid body and method for manufacturing the lid body - Google Patents

Abstract

To allow an antenna and an IC chip to be mounted without depending on a material of a product forming the antenna and the IC chip.SOLUTION: A lid body comprises: an antenna printed with a conductive ink; an IC chip firmly fixed to the antenna with a first ultraviolet curable resin that is cured by ultraviolet light; and an IC chip protective base material that is formed with a second ultraviolet curable resin cured by ultraviolet light and covers at least the IC chip. The lid body is formed with a thermoplastic resin.SELECTED DRAWING: Figure 1

Description

The present invention relates to a lid and a method for manufacturing the lid.

In recent years, in the fields of product manufacturing, management, distribution, etc., there has been a growing movement to apply RFID (Radio Frequency Identification) technology, which transmits and receives information by non-contact communication from an IC chip in which product information and identification information are written. there is Therefore, for example, an RFID label mounted with an RFID-compatible antenna and an IC chip has been adopted (see Patent Document 1).

JP 2015-129989 A

In the RFID label manufacturing method described in Patent Document 1, when a package tag with a built-in IC chip and an antenna pattern formed on a support sheet are joined, a high-melting-point hot-melt layer is interposed to form a hot-melt layer. A method of thermocompression bonding is adopted after arranging the package tag on the substrate.

However, some resins used as materials for products include thermoplastic resins that soften in the curing temperature range of thermosetting adhesives. could not be applied.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to make it possible to mount an antenna or an IC chip regardless of the material of a product forming the antenna or the IC chip.

According to one aspect of the present invention, the cover attached to the container includes an antenna printed with conductive ink, an IC chip fixed to the antenna with a first ultraviolet curable resin that is cured by ultraviolet rays, A cover is provided which is formed of a thermoplastic resin and has an IC chip protection base material which is formed of a second ultraviolet curable resin which is cured by ultraviolet rays and which covers at least the IC chip.

According to this aspect, the antenna and the IC chip can be mounted regardless of the material of the product forming the antenna and the IC chip.

FIG. 1 is an external view for explaining the lid according to the first embodiment. FIG. 2 is a schematic diagram illustrating a process of forming an antenna on the surface of the lid body with conductive ink. FIG. 3 is a schematic diagram for explaining the process of arranging the ultraviolet curable anisotropically conductive resin on the antenna. FIG. 4 is a schematic diagram illustrating a process of mounting an IC chip after arranging an ultraviolet curable anisotropic conductive resin on the antenna. FIG. 5 is a schematic diagram illustrating a process of irradiating an ultraviolet curable anisotropically conductive resin with ultraviolet rays. FIG. 6 is a schematic diagram for explaining the step of disposing the ultraviolet curable resin that forms the IC chip protective base material. FIG. 7 is a schematic diagram illustrating a process of irradiating an ultraviolet curable resin with ultraviolet rays. FIG. 8 is an external view for explaining the lid according to the second embodiment. FIG. 9 is an external view for explaining the lid according to the third embodiment. FIG. 10 is an external view explaining a lid according to the fourth embodiment. FIG. 11 is a cross-sectional view illustrating a lid according to the fifth embodiment. FIG. 12 is a cross-sectional view illustrating a lid body according to another embodiment.

[First embodiment]
<Lid body>
In this embodiment, the lid is a lid attached to the container. Among others, the lid according to this embodiment can be applied to a resin container made of polyethylene terephthalate (PET) or the like. Further, the lid body in this embodiment is a lid body incorporating an antenna and an IC chip compatible with RFID (Radio Frequency Identification) technology for transmitting and receiving information by non-contact communication.

FIG. 1 is an external view illustrating a lid body 1 according to the first embodiment.

The lid body 1 includes a lid body 10 , an antenna 11 , an IC chip 12 and an IC chip protection base material 13 . The lid body 10 has an antenna 11, an IC chip 12, and an IC chip protection base material 13 on a planar portion of the surface of the lid body 1 that forms the exterior surface of the container.

In this embodiment, the lid body 10 is a lid made of thermoplastic resin. Examples of thermoplastic resins that can form the lid body 10 are polyethylene, polypropylene, and the like.

The antenna 11 is printed as a loop pattern on the plane portion of the lid body 10 with conductive ink. In this embodiment, metal nano ink can be used as the conductive ink.

Metal nano-ink is an ink in which metal nanoparticles of several nanometers to several tens of nanometers are dispersed in a dispersion liquid. When metal nano-ink is applied, a thin film in which metal nanoparticles are densely arranged is formed. When this is dried, a melting point depression peculiar to metal nanoparticles occurs, causing the metal nanoparticles to fuse together and form a metallic bond. As a result, metal nano-ink can form a metallic coating layer similar to metallic foil.

In the present embodiment, silver nano ink using silver nanoparticles can be preferably used because of its ease of handling in manufacturing.

The antenna 11 has a pattern designed to have an antenna length and an antenna line width corresponding to the UHF band (300 MHz to 3 GHz, particularly 860 MHz to 960 MHz), microwaves (1 to 30 GHz, Especially near 2.4 GHz), and HF band (3 MHz to 30 MHz, especially near 13.56 MHz). can.

The IC chip 12 is a semiconductor package designed to communicate with equipment such as a reader (not shown).

In this embodiment, the IC chip 12 electrically and mechanically fixed.

The UV curable ACP 14 is obtained by mixing a binder resin, which is an adhesive component, with a conductive filler prepared to have a predetermined particle size.

The binder resin is a resin that has insulating properties and is cured by ultraviolet irradiation. The UV-cured ACP 14 can electrically and mechanically connect the antenna 11 and the IC chip 12 .

The IC chip protection base material 13 is formed of an ultraviolet curable resin 15 (hereinafter referred to as UV curable resin 15, see FIG. 6) as a second ultraviolet curable resin. The IC chip protection base material 13 covers the IC chip 12 .

From the viewpoint of protecting the IC chip 12, it is preferable to use an elastic UV curable resin or a hard UV curable resin that is hard and hard to break as the IC chip protection base material 13. FIG.

For example, epoxy resin, acrylic resin, ester resin, or the like can be used as the elastic ultraviolet curable resin or the hard and hard to crack ultraviolet curable resin.

As the UV curable resin 15 forming the IC chip protection base material 13, the same resin as the binder resin used for the UV curable ACP 14 can be used.

<Effect>
In the lid body 1, the antenna 11 is printed as a loop pattern on the planar portion of the lid body 10 with conductive ink. Also, the IC chip 12 is electrically and mechanically fixed to the antenna 11 by curing the UV curing ACP 14 . An IC chip protection base material 13 covering the IC chip 12 is made of UV curable resin 15 . Therefore, the lid 1 can be manufactured without a heating process.

Therefore, the antenna 11 and the IC chip 12 can be mounted on a product using a thermoplastic resin that softens in the curing temperature range of the thermosetting adhesive used to form the conventional antenna and IC chip. can.

Also, the area of the lid 1 to which the IC chip 12 is fixed is covered with an IC chip protection base material 13 . Therefore, for example, when handling a plurality of lids 1 at the same time, the IC chip 12 can be protected from contact between the lids 1, and the IC chip 12 can be protected from water droplets and dust.

In addition, by using an elastic UV curable resin or a hard UV curable resin that is hard to crack as the IC chip protection base material 13, the effect of protecting the IC chip 12 is enhanced.

<Manufacturing Method of Lid>
Next, a method for manufacturing the lid 1 according to this embodiment will be described.

The method for manufacturing the lid body 1 includes printing the antenna 11 on the surface of the lid body 10 with conductive ink, fixing the IC chip 12 to the antenna 11 using the UV curing ACP 14 , and attaching the IC chip 12 using the UV curing resin 15 . An IC chip protection substrate 13 is formed to cover the .

FIG. 2 is a schematic diagram for explaining the process of printing the pattern of the antenna 11 on the surface of the lid body 10 with conductive ink. FIG. 3 is a schematic diagram for explaining the process of placing the UV curing ACP 14 on the antenna 11. As shown in FIG. FIG. 4 is a schematic diagram illustrating the process of mounting the IC chip 12 after placing the UV-curable ACP 14 on the antenna 11. As shown in FIG.

Moreover, FIG. 5 is a schematic diagram for explaining the process of irradiating the UV curing ACP 14 with ultraviolet rays. FIG. 6 is a schematic diagram for explaining the process of disposing the UV curable resin 15 forming the IC chip protection base material 13. As shown in FIG. FIG. 7 is a schematic diagram illustrating the process of irradiating the UV curable resin 15 with ultraviolet rays.

First, as shown in FIG. 2, the pattern of the antenna 11 is printed on the surface of the lid body 10 with conductive ink.

Applicable printing methods include silk screen printing, pad printing, offset printing, UV printing, inkjet printing, and spray coating. Among them, it is preferable to use pad printing, offset printing, UV printing, and inkjet printing using silver nano-ink.

In the present embodiment, the pattern of the antenna 11 is directly printed on the planar portion of the lid body 10 by inkjet printing using silver nano ink.

Subsequently, as shown in FIG. 3, the UV-curable ACP 14 is arranged on the antenna 11 formed by printing. In this embodiment, a dispenser or the like for discharging the UV curing ACP 14 is used to apply the UV curing ACP 14 to the position where the IC chip 12 is mounted.

Next, as shown in FIG. 4, after the UV curing ACP 14 is placed, the IC chip 12 is mounted at a predetermined position on the antenna 11 . Further, as shown in FIG. 5, the UV curing ACP 14 is irradiated with ultraviolet rays by the UV lamp 101 to cure the UV curing ACP 14 .

By the steps shown in FIGS. 4 and 5, the binder resin contained in the UV curing ACP 14 is cured to function as an adhesive, and the antenna 11 and the IC chip 12 are mechanically connected. Also, at this time, the antenna 11 and the IC chip 12 are electrically connected by forming an electrical conduction path with the conductive filler contained in the UV-curable ACP 14 .

Next, as shown in FIG. 6, a UV curable resin 15 is applied to form the IC chip protective base material 13 . The thickness of the UV curable resin 15 is equal to or greater than the thickness of the IC chip 12 and is set according to the thickness of the IC chip 12 . In this embodiment, the thickness is preferably 150 μm, which is equal to or greater than the thickness of the IC chip 12 .

Next, as shown in FIG. 7, the UV curable resin 15 is irradiated with ultraviolet rays by the UV lamp 102 to cure the UV curable resin 15 .

Through the above steps, the lid body 1 in which the antenna 11 and the IC chip 12 are directly provided on the lid body 10 can be manufactured.

In this embodiment, as shown in FIG. 4, after the IC chip 12 is mounted, electrical continuity between the antenna 11 and the IC chip 12 is ensured, and the IC chip 12 is cured by UV curing ACP 14 . In order to temporarily fix the IC chip 12 to the antenna 11, a step of applying a pressure that does not damage the IC chip 12 may be performed.

<Effect>
According to the manufacturing method described above, the antenna 11 is printed as a loop pattern on the flat portion of the lid body 10 with conductive ink, and the IC chip 12 is electrically connected to the antenna 11 by curing the UV curing ACP 14 . and mechanically fixed. Also, the IC chip protection base material 13 covering the IC chip 12 is formed of a UV curable resin 15 . Therefore, the lid 1 can be manufactured without a heating process.

Therefore, according to the method for manufacturing the lid 1 according to the present embodiment, a product using a thermoplastic resin that softens in the curing temperature range of the thermosetting adhesive used in the formation of conventional antennas and IC chips is used. The antenna 11 and the IC chip 12 can also be mounted on the . This increases the degree of freedom in selecting the material forming the lid body 10 .

Further, according to the method for manufacturing the lid 1, the antenna 11 can be directly printed on the surface of the lid body 10 using conductive ink. Therefore, it is easy to form the antenna 11 on the planar portion of the lid body 10 . Therefore, it is possible to expand the application range of the RFID compatible lid without being restricted by the shape of the lid body 10 .

Further, according to the manufacturing method of the lid 1, the IC chip 12 is electrically and mechanically fixed to the antenna 11 by the UV-curing ACP 14. As shown in FIG. Moreover, the IC chip protection base material 13 is also formed of the UV curable resin 15 .

[Second embodiment]
FIG. 8 is an external view for explaining the lid body 2 according to the second embodiment. In the following embodiments, the same reference numerals are assigned to configurations having the same effects as in the first embodiment, and detailed description thereof will be omitted.

The lid 2 according to this embodiment has a protective base material 13A. The protective base material 13A is made of the second UV curable resin that forms the IC chip protective base material 13, and covers both the antenna 11 and the IC chip 12. As shown in FIG.

As a result, the antenna 11 as well as the IC chip 12 of the cover 2 is covered with the protective base material 13A formed of the second UV-curable resin, which is an elastic UV-curable resin or a hard UV-curable resin that does not break easily. For example, when handling a plurality of lids 1 at the same time, the antenna 11 and IC chip 12 can be protected from contact between the lids 1, and the antenna 11 and IC chip 12 can be protected from water droplets and dust.

In addition, the protective base material 13A for protecting the IC chip 12 and the antenna 11 according to the present embodiment is formed by forming the second ultraviolet curing resin on the surface of the lid body 10 so as to cover both the IC chip 12 and the antenna 11. It can be realized by executing

[Third embodiment]
FIG. 9 is an external view for explaining the lid body 3 according to the third embodiment.

The lid 3 according to this embodiment has an IC chip protection base 13 and an antenna protection base 131 . The antenna protection base material 131 is made of a third ultraviolet curable resin, and is arranged over the area covering the antenna 11 .

If the antenna protection base material 131 is hard, it cannot follow the deformation of the lid body 10, and cracks and damages are likely to occur. Therefore, a resin that is soft and flexible after curing can be selected as the third ultraviolet curable resin.

The antenna protection base material 131 can be made of a third UV curable resin that has higher elasticity after curing than the IC chip protection base material 13 made of the second UV curable resin. In this embodiment, an ultraviolet curable resin having rubber elasticity is applicable, and has a Young's modulus of 3 to 200 N/cm ² , a strength of 3 to 50 N/cm ² , and an elongation of 30 to 300%. A UV curable resin can be used. Epoxy resins or acrylic resins having the above properties can be used.

Since it is not necessary to consider the height of the IC chip 12, the antenna protection base material 131 can be 5 μm to 50 μm.

As described above, the lid 3 has the IC chip 12 covered with the IC chip protection base material 13 formed of the second UV curable resin, which is an elastic UV curable resin or a hard UV curable resin that does not crack easily. , the function of protecting the IC chip 12 is enhanced.

In addition, since the antenna 11 of the cover 3 is covered with the antenna protection base 131 made of the third ultraviolet curable resin having higher elasticity after curing than the IC chip protection base 13, for example, the cover 1 , the surface of the antenna 11 can be protected from contact between the lids 1, and the antenna 11 can be protected from water droplets and dust.

[Fourth embodiment]
FIG. 10 is an external view for explaining the lid body 4 according to the fourth embodiment.

The lid 4 according to the present embodiment has an antenna protection base material 131A made of a third ultraviolet curable resin. The antenna protection base material 131A is arranged over a region covering both the antenna 11 and the IC chip 12 covered with the IC chip protection base material 13 .

The cover 4 is an antenna protection device in which the IC chip 12 is covered with an IC chip protective base material 13 formed of a second ultraviolet curable resin, and the surface of the IC chip protective base material 13 is further formed of a third ultraviolet curable resin. Since it is covered with the base material 131A, the function of protecting the IC chip 12 and the antenna 11 is enhanced.

In this embodiment, the same resin as the second ultraviolet curable resin may be applied as the third ultraviolet curable resin.

Note that the antenna protection base material 131A according to the present embodiment is formed by forming the IC chip protection base material 13 covering the IC chip 12 with the second ultraviolet curable resin, and then the antenna 11 and the IC chip protection base material 13 are formed. can be realized by placing a third ultraviolet curable resin so as to cover and forming the antenna protection base material 131A.

[Fifth embodiment]
FIG. 11 is a cross-sectional view for explaining the lid body 5 according to the fifth embodiment.

The lid 5 according to this embodiment has an antenna 11 and an IC chip 12 on the flat portion of the back surface of the lid 5 facing the inside of the container, and the IC chip 12 is covered with an IC chip protection base material 13. there is

The lid 5 also has a sealing material 20 on the side facing the inside of the container. The lid 5 has an antenna 11 , an IC chip 12 and an IC chip protection substrate 13 between the lid 5 and the sealing material 20 .

In this embodiment, the lid 5 is provided on the flat portion of the surface of the lid 5 (that is, the back side of the lid 5) facing the inside of the container where the antenna 11, the IC chip 12, and the IC chip protective base material 13 are. It is

The sealing material 20 is made of a cushioning material such as foamed resin, and prevents the antenna 11, the IC chip 12, and the IC chip protective base material 13 from contacting the contents of the container, and also prevents the lid body 10 from coming into contact with the contents of the container. It is arranged to improve the sealability with the mouth part of the container.

Since the antenna 11, the IC chip 12, and the IC chip protection base material 13 are provided on the back side of the lid 5 facing the inside of the container, the lid 5 is provided on the outer surface of the lid body 10. The function of protecting the IC chip 12 and the antenna 11 is enhanced.

Moreover, since the sealing material 20 is provided between the lid body 10 and the container, the antenna 11, the IC chip 12 and the IC chip protection substrate 13 do not come into contact with the contents of the container.

Incidentally, the antenna 11, the IC chip 12 and the IC chip protection base material 13 can be formed on the back side of the lid 5 by the same method as the manufacturing method of the lid 1. FIG.

[Other embodiments]
Although the embodiments of the present invention have been described above, the above embodiments merely show a part of the application examples of the present invention, and the technical scope of the present invention is limited to the specific configurations of the above embodiments. isn't it.

The material of the container to which the lid 1 according to this embodiment can be applied is not limited to PET resin. Generally, any other resin applicable for use as a container is applicable.

In this embodiment, in the cover 1, the antenna 11 is printed as a loop pattern on the planar portion of the cover body 10 with conductive ink. However, the antenna 11 may be printed on the curved portion of the lid 1 as long as it does not interfere with the user's opening operation.

In this embodiment, it was explained that the IC chip 12 is electrically and mechanically fixed to the antenna 11 by the UV curing ACP 14 . However, it is sufficient that the antenna 11 and the IC chip 12 can maintain an electrical connection. It may be physically fixed to the antenna 11 by resin.

In this embodiment, the antenna 11 may be a dipole antenna having a looped antenna pattern, a loop portion, a meander and a capacitor hat. Further, the antenna 11 may be a coiled antenna pattern.

The IC chip 12 may be a semiconductor package in which an LED or the like is mounted.

The same UV lamp 101 shown in FIG. 5 and the UV lamp 102 shown in FIG. 7 can be used. After the IC chip 12 is mounted on the UV curing ACP 14, the UV curing resin 15 is subsequently applied, and then the UV curing ACP 14 and the UV curing resin 15 are cured by one UV irradiation. may

In this embodiment, the step of covering the IC chip 12 with the second ultraviolet curing resin may be performed after the step of mounting the IC chip 12 .

Moreover, the step of covering the antenna 11 with the third ultraviolet curing resin may be performed after the antenna 11 is printed.

Moreover, the sealing material 20 provided on the lid 5 may be provided on the lids 1 to 4 .

In the present embodiment, the case where the lid 1 is the lid of a PET bottle container has been described, but the lid 1 is not limited to this. For example, it may be a hinge cap in which an upper lid and a main body are integrated by a hinge, a nozzle cap for a foamer container, or a measuring cap having a measuring function. Moreover, it is also applicable to the cover body of a bottomed cylindrical sealed container or a bottomed rectangular cylindrical sealed container.

FIG. 12 is a cross-sectional view of a lid body 6 shown as another embodiment.

In the fifth embodiment, the antenna 11, the IC chip 12 and the IC chip protection substrate 13 are formed between the lid 5 and the sealing material 20, and the antenna 11, the IC chip 12 and the IC chip protection substrate The case where the material 13 is provided on the flat portion of the surface of the lid 5 facing the inside of the container (that is, the back side of the lid 5) has been described.

On the other hand, as shown in FIG. 12, when the antenna 11, the IC chip 12 and the IC chip protection base material 13 are formed between the lid 5 and the sealing material 20, the antenna 11, the IC chip 12 and the IC The chip protection base material 13 may be provided on the cover-side surface of the sealing material 20 .

Reference Signs List 1, 2, 3, 4, 5, 6 lid body 10 lid body 11 antenna 12 IC chip 13, 13A IC chip protection substrate 14 ultraviolet curable anisotropic conductive resin (UV curable ACP)
15 UV curable resin (UV curable resin)
20 sealing material 101, 102 UV lamp 131, 131A antenna protection base material

Claims (20)

A lid attached to the container,
an antenna printed with conductive ink;
an IC chip fixed to the antenna by a first ultraviolet curable resin that is cured by ultraviolet rays;
an IC chip protection substrate that is formed of a second UV curable resin that is cured by UV rays and that covers at least the IC chip;
has
made of thermoplastic resin,
lid. The lid according to claim 1,
The first ultraviolet curable resin contains a conductive filler,
The second ultraviolet curable resin does not contain the conductive filler,
lid. The lid according to claim 1 or 2,
The conductive ink is metal nano ink,
lid. The lid according to any one of claims 1 to 3,
the IC chip protection base covers the IC chip and the antenna;
lid. The lid according to any one of claims 1 to 3,
Having an antenna protection base material formed of a third ultraviolet curable resin that is cured by ultraviolet rays and covering at least the antenna;
The third ultraviolet curable resin has higher elasticity after curing than the second ultraviolet curable resin,
lid. The lid according to claim 5,
The third ultraviolet curable resin covers the antenna and the IC chip,
lid. The lid according to any one of claims 1 to 6,
Having the antenna and the IC chip on the planar portion of the lid,
lid. The lid according to claim 7,
The planar portion is a planar portion on the surface side of the lid that forms the exterior surface of the container,
lid. The lid according to claim 7,
The planar portion is a planar portion on the back side of the lid facing the inside of the container,
lid. The lid according to claim 9,
The lid has a sealing material on the back side of the lid for sealing leakage of the contents of the container,
Having the antenna and the IC chip between the lid and the sealing material,
lid. A method for manufacturing a lid that has an antenna and an IC chip, is made of a thermoplastic resin, and is attached to a container,
a step of printing the antenna on the lid body with conductive ink;
a step of fixing the IC chip to the antenna with a first ultraviolet curable resin that is cured by ultraviolet light;
forming an IC chip protective base material covering at least the IC chip with a second ultraviolet curable resin that is cured by ultraviolet rays;
A method for manufacturing a lid. A method for manufacturing the lid according to claim 11,
The first ultraviolet curable resin contains a conductive filler,
The second ultraviolet curable resin does not contain the conductive filler,
A method for manufacturing a lid. A method for manufacturing the lid according to claim 11 or 12,
The conductive ink is metal nano ink,
A method for manufacturing a lid. A method for manufacturing a lid according to any one of claims 11 to 13,
In the step of forming the IC chip protective base material, the IC chip and the antenna are covered with the first ultraviolet curable resin.
A method for manufacturing a lid. A method for manufacturing a lid according to any one of claims 11 to 14,
A step of forming an antenna protection base material covering at least the antenna with a third ultraviolet curable resin that is cured by ultraviolet rays,
The third ultraviolet curable resin has higher elasticity after curing than the second ultraviolet curable resin,
A method for manufacturing a lid. A method for manufacturing the lid according to claim 15,
covering the antenna and the IC chip with the third ultraviolet curable resin;
A method for manufacturing a lid. A method for manufacturing a lid according to any one of claims 11 to 16,
the antenna and the IC chip are formed on the planar portion of the lid;
A method for manufacturing a lid. A method for manufacturing the lid according to claim 17,
The antenna and the IC chip are formed on a planar portion on the surface side of the lid forming the exterior surface of the container,
A method for manufacturing a lid. A method for manufacturing the lid according to claim 17,
The antenna and the IC chip are formed on a planar portion on the back side of the lid facing the inside of the container,
A method for manufacturing a lid. A method for manufacturing the lid according to claim 19,
forming the antenna and the IC chip on a planar portion on the back side of the lid;
forming a sealing material that covers the antenna and the IC chip formed on the planar portion and seals leakage of the contents of the container;
A method for manufacturing a lid.

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