JP2023101842A - Component mounting device and component mounting method - Google Patents

Abstract

To provide a component mounting device capable of performing component mounting while discriminating abnormal mounting states of various components, and a component mounting method.SOLUTION: When a mounting head main body part is moved down toward a substrate and a component held by a nozzle is mounted on the substrate, if it is detected by a sensor that the nozzle is displaced upward just by a predetermined distance, it is detected that an abnormal mounting state of the component occurs (step ST6). The mounting head main body part is then moved down in a state where the nozzle is abutted to a top face of the component and a height position of the mounting head main body part at the time, in which it is detected by the sensor that the nozzle is displaced upward just by the predetermined distance, is acquired (step ST13). The abnormal mounting of the component is detected on the basis of the acquired height of the mounting head main body part (step ST14).SELECTED DRAWING: Figure 23

Description

The present invention relates to a component mounting apparatus and a component mounting method for holding a component with a mounting head and mounting the component on a substrate.

2. Description of the Related Art Conventionally, there is known a component mounting apparatus that holds a component with a mounting head and mounts it on a board, and that can detect an abnormal mounting state in which the component is mounted on the board in an abnormal state. For example, in Japanese Unexamined Patent Application Publication No. 2002-200002, an abnormal mounting state of a component can be detected by measuring the height position of the component mounted on the board.

JP-A-4-63000

However, the above-described conventional detection method may not be able to sufficiently cope with various abnormal mounting states that may occur in the component mounting apparatus.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting apparatus capable of performing component mounting while determining abnormal mounting states of various components, and a component mounting method using the component mounting apparatus.

A component mounting apparatus according to the present invention is a component mounting apparatus in which a component is held by a mounting head and mounted on a board, and includes a mounting head main body and a component holder that holds a component at a lower end thereof. a component holder displacement detection sensor for detecting that the component holder has been displaced upward by a predetermined distance relative to the mounting head body; a first abnormal mounting detection unit for detecting abnormal mounting of a component when the component holder displacement detection sensor detects that the component holder has been displaced upward by the predetermined distance when the component held by the component holder is mounted on the board by lowering the mounting head body toward the substrate; A sensor detection height position detection unit for acquiring a detection result of the first height position detection unit when the head body is lowered and the component holder displacement detection sensor detects that the component holder has been displaced upward by the predetermined distance;

A component mounting method according to the present invention is a component mounting method using the component mounting apparatus according to the present invention, comprising a first abnormal mounting detection step of detecting abnormal mounting of a component when the component holder displacement detection sensor detects that the component holder has been displaced upward by the predetermined distance when the mounting head body is lowered toward the substrate to mount the component held by the component holder on the substrate; A sensor detection height position detection step of obtaining a detection result of the first height position detection unit when displacement is detected by the component holder displacement detection sensor; and a second abnormal mounting detection step of detecting abnormal mounting of a component based on the height obtained in the sensor detection height position detection step.

According to the present invention, component mounting can be performed while determining abnormal mounting states of various components.

1 is a configuration diagram of a component mounting device according to an embodiment of the present invention; FIG. 1 is a configuration diagram of a mounting head and a mounting head elevating section included in a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is a configuration diagram of a mounting head included in a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is a block diagram showing a control system of a component mounting device according to one embodiment of the present invention; FIG. FIG. 4 is a diagram showing an example of a production program stored in a storage section of a control section provided in the component mounting apparatus according to one embodiment of the present invention; (a), (b), (c), (d), (e), and (f) are diagrams showing the process of mounting a component on a board by the component mounting apparatus according to the embodiment of the present invention and the change in the position of the dog. FIG. 2 is a side view of a mounting head showing a state in which a component is about to be mounted on a substrate by a component mounting apparatus according to one embodiment of the present invention; FIG. 2 is a side view of a mounting head showing a state in which a component is brought into contact with a substrate by a component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a side view of a mounting head showing a state in which a component mounted on a substrate is pressed by a component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a side view of a mounting head showing a state (first abnormal mounting state) in which a foreign object is caught between a component and a substrate when a component is to be mounted by the component mounting apparatus according to the embodiment of the present invention; FIG. 2 is a side view of a mounting head showing a state (first abnormal mounting state) in which a part of a nozzle is in contact with an obstacle when a component is to be mounted by the component mounting apparatus according to the embodiment of the present invention; FIG. 4 is a side view of a mounting head showing a state in which a dog is detected by a sensor when a search operation is performed on a component by the component mounting apparatus according to the embodiment of the present invention; FIG. 4 is a side view of a mounting head showing a state in which an abnormal mounting state (second abnormal mounting state) of a component is detected by performing a search operation with the component mounting apparatus according to the embodiment of the present invention; FIG. 4 is a side view of a mounting head showing a state in which an abnormal mounting state (second abnormal mounting state) of a component is detected by performing a search operation with the component mounting apparatus according to the embodiment of the present invention; FIG. 4 is a side view of a mounting head showing a state in which a search operation is performed by the component mounting apparatus according to the embodiment of the present invention and an abnormal mounting state due to no component is detected; FIG. 2 is a side view of a mounting head showing a state in which a component with leads is about to be mounted on a substrate by a component mounting apparatus according to one embodiment of the present invention; FIG. 2 is a side view of a mounting head showing a state in which a component with leads is being mounted on a substrate by a component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a side view of a mounting head showing a state in which a component with leads has been mounted on a substrate by a component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a side view of a mounting head showing a state in which an insertion retry is attempted for a component with leads by the component mounting apparatus according to one embodiment of the present invention; FIG. 4 is a side view of a mounting head showing a state in which a search operation is performed after an attempt to retry insertion of a component with leads by the component mounting apparatus according to one embodiment of the present invention; FIG. 2 is a diagram showing a state in which a component with leads is mounted on a substrate by a component mounting apparatus according to an embodiment of the present invention; (a) and (b) are side views of a mounting head showing a state in which additional pressure is applied to a component with leads by the component mounting apparatus according to the embodiment of the present invention. 1 is a flow chart showing the flow of a component mounting operation executed by a component mounting apparatus according to an embodiment of the present invention;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In FIG. 1, the Y-axis is the coordinate axis that extends horizontally in the plane of the paper, the Z-axis is the coordinate axis that extends in the vertical direction of the plane of the paper perpendicular to the Y-axis, the X-axis is the coordinate axis that is perpendicular to both the Y-axis and the Z-axis, and the directions along the respective axes are expressed as the X-direction, the Z-direction (vertical direction), and the X-direction. The direction of horizontal rotation around the axis extending in the Z direction is called the Θ direction. FIG. 1 shows a component mounting device 1 according to one embodiment of the present invention. The component mounting apparatus 1 is a device that repeatedly performs a component mounting operation for mounting a component BH on a board KB. The component mounting apparatus 1 includes, as shown in FIG. 1, a board transport section 11 that transports and positions the board KB, a component supply section 12 that supplies components BH, a mounting head 13, and a head moving mechanism .

In FIG. 1, the substrate transfer section 11 is composed of a pair of conveyor mechanisms 11a, and transfers the substrate KB in the X direction. The component supply unit 12 here is a tray feeder that supplies the components BH by means of a tray 12T, but may be of another configuration (for example, a tape feeder, a stick feeder, etc.).

1 and 2, the mounting head 13 has a nozzle 13N as a component holder for holding the component BH at its lower end. A vacuum suction force can be generated at the lower end of the nozzle 13N, thereby allowing the nozzle 13N to suction the component BH. The head moving mechanism 14 moves the mounting head 13 in horizontal directions (X direction, Y direction) and Z direction. The mounting head 13 reciprocates between the board KB positioned by the board conveying section 11 and the component supply section 12 by the head moving mechanism 14, and repeatedly performs the component mounting operation of sucking the component BH supplied by the component supply section 12 by the nozzle 13N and mounting it on the board KB.

2 and 3, the mounting head 13 includes a mounting head body 13A and a component holder 13B. As shown in FIG. 3, the mounting head main body 13A has a hollow area 13S inside. The component holder 13B has a shaft 21, a nozzle holder 22 and the nozzle 13N described above.

In FIG. 3, the shaft 21 extends in the vertical direction (Z direction). The upper half of the shaft 21 penetrates the inside (hollow region 13S) of the mounting head main body 13A, and its upper end extends above the mounting head main body 13A.

2 and 3, the nozzle holder 22 is attached to the lower end of the shaft 21. As shown in FIG. The nozzle holder 22 has a pair of chucks 22a, a chuck spring 22b, and a recess 22c for accommodating the upper end of the nozzle 13N. The nozzle holder 22 detachably holds the nozzle 13N by engaging the lower ends of the pair of chucks 22a with engaging grooves provided in a circumferential manner on the side surface of the nozzle 13N (FIG. 3).

A vent passage 21 a is formed along the central axis of the shaft 21 , and one end of the vent passage 21 a opens into the recess 22 c of the nozzle holder 22 . A pipe joint 23 is attached above the nozzle holder 22 . The piping joint 23 is mounted in a state in which it moves together with the shaft 21 in the Z direction but allows rotation of the shaft 21 in the Θ direction. Therefore, even if the shaft 21 rotates Θ, the piping joint 23 does not rotate Θ. The pipe joint 23 has an annular groove 23a for forming an annular space 23c along the outer periphery of the shaft 21 and a horizontal hole 23b for connecting the annular space 23c and the air pipe 24 attached to the pipe joint 23. Further, the shaft 21 is formed with a communication hole 21b for connecting the air passage 21a to the annular space 23c. Thereby, the negative pressure or air blow from the air pipe 24 can be introduced into the suction hole 13Na of the nozzle 13N attached to the nozzle holder 22 via the horizontal hole 23b, the annular space 23c, the communication hole 21b, and the air passage 21a.

In FIG. 3, two upper and lower portions of a shaft 21 extending upward inside the mounting head main body 13A are supported by upper and lower bearings 31 provided inside the mounting head main body 13A. This bearing 31 supports the shaft 21 in a state allowing sliding in the Z direction and Θ rotation. Therefore, the shaft 21 can be relatively displaced along the Z direction with respect to the mounting head main body 13A and can be rotated in the Θ direction.

In FIG. 3, a brim-shaped spring bearing 32 is provided at the intermediate portion of the shaft 21 supported by the upper and lower bearings 31 . The spring receiver 32 is biased downward by a spring 33 provided in the hollow area 13S of the mounting head main body 13A. A stopper 34 having an outer diameter larger than the outer shape of the shaft 21 is provided at a portion of the outer peripheral surface of the shaft 21 below the spring bearing 32 .

In FIG. 3, the stopper 34 receives the biasing force (restoring force from the compressed state) of the spring 33 and contacts the stopper contact surface 35 formed by the upper surface of the lower bearing 31 from above. When the stopper 34 is in contact with the stopper contact surface 35 in this way, the component holder 13B is restrained at the lowest position with respect to the mounting head main body 13A.

As described above, when the component holder 13B is at the lowest position with respect to the mounting head body 13A, the distance between the component holder 13B and the mounting head body 13A is the largest. The position of the component holder 13B with respect to the mounting head body 13A when the stopper 34 contacts the stopper contact surface 35 and the distance from the mounting head body 13A is the largest (FIG. 3) is hereinafter referred to as the "lowest position."

When the component holder 13B or the component BH held by the component holder 13B comes into contact with some object (for example, the board KB, a foreign object, or another component) while the mounting head main body 13A is being lowered while the component holder 13B is restrained by the mounting head main body 13A, the component holder 13B cannot move further downward, and only the mounting head main body 13A moves downward. As a result, the component holder 13B moves upward relative to the mounting head main body 13A. At this time, since the stopper 34 moves upward with respect to the mounting head body 13A, the stopper 34 is separated upward from the stopper contact surface 35, and the spring 33 is compressed by the amount of the upward movement of the stopper 34.

2 and 3, a Θ-axis motor 41 is provided on the side surface of the mounting head body 13A. The Θ-axis motor 41 has a rotating shaft 41J directed upward, and its upper end is located above the mounting head main body 13A. A driving pulley 42 is attached to the upper end of the rotating shaft 41J.

2 and 3, a driven pulley 43 is provided on a portion of the shaft 21 that protrudes upward from the mounting head body portion 13A. The driven pulley 43 is positioned at the same height level as the drive pulley 42 , and a toothed belt 44 is stretched between the drive pulley 42 and the driven pulley 43 . The shaft 21 and the driven pulley 43 are connected so as to allow relative movement in the Z direction but integrally rotate in the Θ direction. Therefore, the shaft 21 moves up and down while sliding in the Z direction with respect to the driven pulley 43, and when the Θ-axis motor 41 operates to rotate the rotary shaft 41J, the rotational power is transmitted from the drive pulley 42 through the toothed belt 44 and the driven pulley 43, and rotates in the Θ direction.

In FIG. 2, a nut holding portion 45 is provided on the side surface of the mounting head body portion 13A opposite to the side on which the .theta.-axis motor 41 is provided so as to protrude outward. Sliders 46 are provided at upper and lower positions sandwiching the nut holding portion 45 . The upper and lower sliders 46 are engaged with guide rails 52 provided on a frame 51 connected to the head moving mechanism 14 and extending in the Z direction.

In FIG. 2, a Z-axis motor 53 is provided above the frame 51 . A drive shaft 53</b>J of the Z-axis motor 53 extends downward, and its lower end is located inside the frame 51 . The Z-axis motor 53 incorporates an encoder (not shown) for detecting the rotational position of the drive shaft 53J.

In FIG. 2, a feed screw 54 extending in the Z direction is provided in the hollow area 13S of the frame 51. As shown in FIG. The lower end of the feed screw 54 is rotatably supported by the frame 51 , and the upper end is connected to the drive shaft 53 J of the Z-axis motor 53 . The feed screw 54 is screwed with a nut 55 held by the nut holding portion 45 .

When the Z-axis motor 53 operates to rotate the drive shaft 53J, the feed screw 54 connected to the drive shaft 53J rotates about the vertical axis, and the nut 55 moves on the feed screw 54 in the Z direction. As a result, the mounting head main body 13A (that is, the mounting head 13) moves up and down with respect to the frame 51, and at this time, the upper and lower sliders 46 provided on the mounting head main body 13A slide on the guide rails 52 provided on the frame 51 in the Z direction.

As described above, in the present embodiment, the mechanism including the Z-axis motor 53, the feed screw 54, the nut 55, and the nut holding portion 45 constitutes a mounting head elevating portion 14L that lifts and lowers the mounting head 13 as part of the head moving mechanism 14 (FIG. 2).

2 and 3, an air pipe 24 and a dog 25 are attached to the pipe joint 23. As shown in FIG. As shown in FIG. 2, the air pipe 24 is connected to a flow path switching section 61 comprising, for example, a control valve. The dog 25 extends upward at its tip.

The channel switching unit 61 switches the pressure supplied from the air pipe 24 to the nozzle 13N between the vacuum pressure supplied from the vacuum source 62 and the positive pressure supplied from the positive pressure source 63 . The flow path switching unit 61 switches pressure flow paths so that a vacuum pressure is supplied to the nozzle 13N when the component BH is adsorbed by the nozzle 13N, and a positive pressure is supplied to the nozzle 13N when the component BH adsorbed by the nozzle 13N is detached from the nozzle 13N.

In FIG. 2, an air cylinder 72 as a pressure member supported by a plurality of columns 71 extending in the vertical direction is provided on the upper portion of the mounting head main body 13A. The air cylinder 72 uses the aforementioned shaft 21 as a piston rod.

In FIG. 2, the air cylinder 72 is connected to a pressure adjusting section 74 via a pressurization control valve 73 . The pressure regulator 74 regulates the positive pressure supplied from the positive pressure source 63 described above.

The pressurization control valve 73 supplies the air cylinder 72 with the positive pressure adjusted by the pressure adjustment section 74 . The air cylinder 72 urges the shaft 21 downward by positive pressure supplied through the pressurization control valve 73 . The air cylinder 72 supplied with positive pressure presses the component BH against the substrate KB together with the spring 33 when the stopper 34 is separated from the stopper contact surface 35 when the component BH is mounted. The pressing force (load) when pressing the component BH against the substrate KB can be changed by adjusting the magnitude of the positive pressure output from the pressure adjusting section 74 .

In FIG. 3, two sensor bases 81 extending downward are provided on the lower surface of the mounting head main body 13A. These sensor bases 81 are provided with component holder displacement detection sensors (hereinafter referred to as "sensors 82"). The sensor 82 consists of a light-emitting portion 83 and a light-receiving portion 84, and is mounted separately on one side and the other side of the two sensor bases 81, respectively.

In FIG. 3, the light emitting portion 83 and the light receiving portion 84 face each other in the horizontal direction. The light-emitting portion 83 emits light (projects inspection light 82L) toward the light-receiving portion 84 . The light receiving section 84 is on when the inspection light 82L is received, and switches from on to off when the inspection light 82L is not received.

In FIG. 3, the light-emitting portion 83 and the light-receiving portion 84 constituting the sensor 82 are arranged at positions sandwiching the movement passage of the tip portion (upper end portion) of the dog 25 moving in the Z direction integrally with the shaft 21 . When the component holder 13B is at the lowest position with respect to the mounting head body 13A and the stopper 34 is in contact with the stopper contact surface 35 (FIG. 3), the upper end of the dog 25 is positioned below the inspection light 82L of the sensor 82.

The relative positional relationship in the Z direction between the dog 25 and the sensor 82 (specifically, the inspection light 82L) changes depending on the relative positional relationship (vertical distance) between the mounting head body 13A and the component holder 13B. As the component holder 13B is raised relative to the mounting head main body 13A, the dog 25 relatively approaches the inspection light 82L of the sensor 82. When the movement distance of the component holder 13B from the lowest position reaches a predetermined distance (D1), the upper end of the dog 25 blocks the inspection light 82L of the sensor 82, and the light receiving unit 84 is switched from ON to OFF. At this time, the moving distance of the component holder 13B with respect to the mounting head main body 13A from when the component holder 13B starts moving from the lowest position until the dog 25 blocks the inspection light 82L is equal to the vertical distance between the upper end of the dog 25 and the inspection light 82L when the component holder 13B is in the lowest position. Hereinafter, this distance is referred to as "first allowance distance D1" (Fig. 3).

FIG. 4 shows a control system of the component mounting apparatus 1. As shown in FIG. A control unit 90 provided in the component mounting apparatus 1 includes a processing unit 90A and a storage unit 90B. The processing unit 90A includes a mounting operation control unit 91, a first height position detection unit 92, a first abnormal mounting detection unit 93, a sensor detection height position detection unit 94, a second abnormal mounting detection unit 95, and a component height detection unit 96. The storage unit 90B stores a production program 97 necessary for the component mounting operation.

As shown in FIG. 5, the production program 97 includes various data such as mounting coordinates (xyθ) on the board KB of each part BH to be mounted on the board KB, and dimension/shape data. The production program 97 also stores setting information for setting whether or not to set "insertion retry" to be described later and whether or not to perform "second abnormal mounting detection" for each part BH (part name) or type. "Insertion retry" and "second abnormal attachment detection" will be described later. In the present embodiment, the components BH to be mounted on the board KB include both chip-shaped components (chip components) and components with leads having a body portion corresponding to the chip component and a plurality of leads extending downward from the body portion.

In FIG. 4, the mounting operation control section 91 performs control for causing the component mounting apparatus 1 to perform the component mounting operation. Specifically, each operation of the Θ-axis motor 41, the Z-axis motor 53, the flow path switching unit 61, the pressurization control valve 73, and the pressure adjustment unit 74 is controlled, and based on the detection information of the dog 25 by the sensor 82 (on/off information of the light receiving unit 84), the overall component mounting operation for mounting the component BH on the board KB is controlled.

The first height position detection unit 92 receives a signal output from the encoder incorporated in the Z-axis motor 53 described above, and detects the height position of the mounting head main body 13A raised and lowered by the mounting head raising/lowering unit 14L as the "main body height position H" based on the rotational position or amount of rotation of the drive shaft 53J of the Z-axis motor 53. The “main body height position H” corresponds to a downward distance from a preset reference height KH to an arbitrary point of the mounting head main body 13A (for example, the upper surface of the mounting head main body 13A) (FIG. 1).

The mounting operation control section 91 has a function of setting a target height position H2 of the mounting head body section 13A when performing a component mounting operation for mounting the component BH on the board KB. The mounting operation control section 91 reads the size of the component BH to be mounted from the production program 97 stored in the storage section 90B. After reading the size of the component BH from the production program 97, the control unit 90 sets the target height position H2 of the mounting head main body 13A when mounting the component BH based on the component thickness TH included in the read size of the component BH.

The target height position H2 is set to a height that is located a distance d below the height position of the mounting head main body 13A (component contact height position H1) at the timing when the component BH contacts the board KB (see also FIGS. 8 and 9). In this specification, the distance d is referred to as the pushing amount d. By setting the target height position H2 lower than the height position H1 at the time of component contact by the pushing amount d, a state in which the stopper 34 is separated from the stopper contact surface 35 when mounting the component BH on the board KB is surely created, and an appropriate load is applied to the component BH. The pushing amount d is set to be smaller than the first allowance distance D1 (for example, d=D1×0.1). The pushing amount d is set to be smaller than the first allowance distance D1 in consideration of variations in the height position of the board KB positioned on the board transfer section 11, tolerance of the component thickness TH, and the like.

The first abnormal mounting detection unit 93 detects an abnormal mounting state of the component by turning off the sensor 82 while mounting the component BH on the board. FIG. 10 shows a state in which a foreign object IB exists on the board KB and is caught between the component BH to be mounted and the board KB, and as a result, the component BH assumes an inclined posture with respect to the board KB. In this case, the foreign object IB sandwiched between the board KB and the component BH causes the component holder 13B to start relatively rising from the lowest position before the mounting head main body 13A reaches the assumed component contact height position H1. Then, before the mounting head main body 13A reaches the target height position H2, the component holder 13B is displaced upward by the first allowance distance D1, the dog 25 blocks the inspection light 82L, and the sensor 82 is turned off.

In this way, the first abnormal mounting detection section 93 detects that the abnormal mounting state of the component has occurred because the sensor 82 is turned off before the mounting head body section 13A reaches the target height position H2. That is, when the mounting head main body 13A is lowered toward the board KB and the component held by the component holder (nozzle 13N) is mounted on the board KB, the first abnormal mounting detection section detects that the component is abnormally mounted when the sensor 82 detects that the component holder 13B has been displaced upward by a predetermined distance (the first marginal distance D1).

The sensor detection height position detection unit 94 detects the height position of the mounting head main body 13A when the sensor 82 changes from ON to OFF while the mounting head main body 13A is being lowered. Specifically, the height position of the mounting head main body 13A detected by the first height position detector 92 is obtained at the timing when the sensor 82 changes from ON to OFF.

Using the function of the sensor detection height position detection unit 94, it is possible to set a mounting surface reference height H0 that serves as a reference when setting the target height position H2. Specifically, the mounting head main body 13A is lowered to bring the lower end of the nozzle 13N not holding the component BH into contact with the substrate KB, and the height position of the mounting head main body 13A detected by the first height position detection section 92 (search operation end height H9 described later) when the sensor 82 changes from ON to OFF is obtained. The mounting surface reference height H0 is a position offset upward by the first allowance distance D1 from the acquired height position of the mounting head main body 13A. The mounting surface reference height H0 is stored in the storage section 90B. The target height position H2 is a height position offset upward from the mounting surface reference height H0 by a distance obtained by subtracting the pushing amount d from the component thickness TH. The control unit 90 calculates the target height position H2 based on the mounting surface reference height H0, the component thickness TH, and the pushing amount d stored in the storage unit. Incidentally, the height position offset upward by the component thickness TH from the mounting surface reference height H0 is the component contact height position H1 when the component BH is normally mounted on the board KB (see also FIG. 8).

The second abnormal mounting detection section 95 detects abnormal mounting of a component based on the height position of the mounting head main body section 13A detected by the sensor detection height position detection section 94 . The first abnormal mounting detector 93 can detect abnormal mounting of a component due to a relatively large foreign object IB, but cannot detect abnormal mounting of a component due to a foreign object IB smaller than the first allowance distance D1. In addition, in the case of an abnormal mounting of the component such as the component BH dropping out of the nozzle 13N or being flipped off the upper surface of the board KB during the mounting operation, the sensor 82 does not change from ON to OFF, so the first abnormal mounting detection section 93 cannot detect it.

In this way, in the abnormal mounting of parts, there may be abnormal mounting of parts overlooked by the first abnormal mounting detecting part 93, but the second abnormal mounting detecting part 95 detects abnormal mounting of parts that are difficult to detect by the first abnormal mounting detecting part 93 and "no parts". In this embodiment, the component mounting abnormality detected by the first abnormal mounting detector 93 is defined as a first abnormal mounting state, and the component mounting abnormality detected by the second abnormal mounting detector 95 is defined as a second abnormal mounting state.

The component height detection unit 96 obtains the height of the component BH mounted or being mounted on the board KB based on the height position acquired by the sensor detection height position detection unit 94 . The height of the component BH is the height from the upper surface of the board KB. The height of the component is detected by lowering the mounting head main body 13A while the lower end surface of the nozzle 13N is pressed against the component BH on the substrate KB, and acquiring the height position H3 of the mounting head main body 13A from the first height position detection unit 92 when the sensor 82 changes from ON to OFF. Then, the difference (see ΔH in FIG. 12) between the obtained height position H3 and the search operation end height H9 (the height obtained by adding the first allowance distance D1 to the mounting surface reference height H0) is the component height. Incidentally, when the component BH is mounted on the board KB in a normal state, the component height is almost equal to the component thickness TH.

Next, the mounting operation (component mounting method) of the component BH by the component mounting apparatus 1 will be described with reference to the flowchart of FIG. The control unit 90 first reads the production program from the storage unit 90B (step ST1). Then, the target height position H2 of the mounting head main body 13A is calculated (step ST2).

After obtaining the target height position H2 of the mounting head main body 13A in step ST2, the control section 90 positions the mounting head 13 above the component supply section 12 . Then, the mounting head raising/lowering unit 14L lowers the mounting head 13 and causes the nozzle 13N to hold (adsorb) the component BH (step ST3).

After causing the nozzle 13N to hold the component BH, the control unit 90 causes the head moving mechanism 14 to move the mounting head 13 above the mounting coordinates (mounting preparation position) on the substrate KB (step ST4, FIGS. 6A and 7). As for the "mounting coordinates on the board KB", the item "mounting coordinates (xyθ)" of the production program shown in FIG. 5 is referred to.

In step ST4, the control unit 90 operates the Θ-axis motor 41 while positioning the mounting head 13 at the mounting preparation position, and transmits the power of the rotating shaft 41J from the drive pulley 42 to the driven pulley 43 via the toothed belt 44. As a result, the shaft 21 is rotated, and the component BH held by the nozzle 13N is aligned in the rotational direction. Further, the control unit 90 causes the pressure adjusting unit 74 to adjust the magnitude of the positive pressure by the time step ST4 is completed, and sets the pressing force when pressing the component BH against the substrate KB to an appropriate magnitude.

When the mounting head 13 reaches the mounting preparation position and the positioning of the component BH in the Θ rotation direction is completed, the control section 90 operates the mounting head elevating section 14L to start lowering the mounting head body section 13A (step ST5). When the mounting head main body 13A starts to descend, the control section 90 monitors whether the first abnormal mounting detection section 93 detects the first abnormal mounting state before the mounting head main body 13A reaches the target height position H2 (step ST6). When the first abnormal mounting state is not detected, the process proceeds to step ST8 and subsequent steps, and when the first abnormal mounting is detected, the operator is notified of the abnormal mounting state and the component mounting operation is stopped (step ST7). Here, the notification of an abnormality in the wearing state is performed through a display device, a touch panel (not shown), a buzzer, or the like connected to the control section 90 .

The behavior of the mounting head 13 when the component BH is normally mounted on the board KB, that is, when the first abnormal mounting is not detected will be described with reference to FIGS. 6 to 9. FIG. When the mounting head body 13A descends toward the target height position H2, the component BH lands on the board KB at the component contact height position H1 prior to reaching the target height position H2 (FIGS. 6B and 8). During this time, the position of the dog 25 is positioned at a height that is separated from the inspection light 82L by the first marginal distance D1 (FIGS. 6D and 6E). The mounting head main body 13A descends by a distance corresponding to the pushing amount d even after the component BH lands on the board KB, and stops when it reaches the target height position H2 (FIGS. 6C and 9). Since it is separated from the stopper abutment surface 35, a combined load of the biasing force of the spring 33 and the pressing force of the air cylinder 72 is applied to the component BH by the component holder 13B.

When the mounting head main body 13A is lowered from the component contact height position H1 by a pushing amount d, the nozzle 13N is relatively pushed up from the board KB via the component BH, and is moved upward relative to the mounting head main body 13A by the upward force (reaction force). Further, as a result, the dog 25 moves upward relative to the mounting head main body 13A by the same distance as the pushing amount d (FIG. 6(f)).

As described above, in the present embodiment, the component holder 13B is displaceable in the Z direction with respect to the mounting head main body 13A, and has a nozzle 13N as a component holder that holds the component BH at the lower end portion.

Here, the pushing amount d is set to be smaller than the first allowance distance D1. Therefore, when the correct component BH is mounted on the board KB in a normal state, the inspection light 82L of the sensor 82 is not blocked by the dog 25, and the light receiving section 84 is not switched from ON to OFF. Therefore, the first abnormal attachment is not detected in step ST6.

FIG. 10 shows a state in which a foreign object IB of a relatively large size exists on the board KB, so that the foreign object IB is caught between the component BH to be mounted and the board KB, and as a result, the component BH assumes a tilted attitude with respect to the board KB. In such a case, the downward movement of the component holder 13B is restricted at a position higher than expected from the surface of the board KB, while the mounting head body 13A continues to descend, so the sensor 82 approaches the dog 25. Therefore, in the case of a relatively large foreign object IB, the dog 25 is detected by the sensor 82 before the mounting head main body 13A is positioned at the target height position H2 (FIG. 10).

FIG. 11 shows a state in which an obstacle SB exists on the board KB, and part of the component holder 13B comes into contact with the obstacle SB before the lowered mounting head main body 13A reaches the target height position H2. In such a case, the downward movement of the component holder 13B abutting the obstacle SB is restricted at that position, while the mounting head main body 13A continues to descend, so the sensor 82 approaches the dog 25. Therefore, as shown in FIG. 11, the dog 25 may be detected by the sensor 82 when the component holder 13B collides with the obstacle SB before the mounting head body 13A reaches the target height H2.

The dog 25 is detected by the sensor 82 before the mounting head main body 13A reaches the target height H2 in this way. This is the case when the height TH of the read component BH is larger than the height TH (in the case of the wrong component).

Thus, the state in which the dog 25 is detected by the sensor 82 before the mounting head main body 13A is positioned at the target height position H2 is an abnormal mounting state, and such an abnormal mounting state is detected as a first abnormal mounting state by the first abnormal mounting detecting section 93 (step ST6). In the present embodiment, when the mounting head main body 13A is lowered toward the board KB and the component BH held by the nozzle 13N, which is a component holder, is mounted on the board KB, the first abnormal mounting detection section 93 detects that the abnormal mounting state (first abnormal mounting state) of the component BH has occurred when the sensor 82 detects that the nozzle 13N has been displaced upward by the first allowance distance D1.

In this embodiment, when the dog 25 is detected by the sensor 82, the mounting operation control section 91 promptly stops the mounting head lifting section 14L from lowering the mounting head body section 13A. Therefore, when the first abnormal mounting state is detected by the first abnormal mounting detection section 93, the lowering of the mounting head body section 13A is stopped, and the safety of the apparatus is ensured. In addition, it is possible to remove the cause of the abnormal mounting state by giving an instruction to prompt the operator to inspect.

After the mounting head main body 13A reaches the target height position H2 and it is determined in step ST6 that the first abnormal mounting state is not set, the processing branches depending on the setting of "second abnormal mounting detection" in the mounting operation setting information. When the second abnormal mounting detection in the mounting operation setting information is "no", the control section 90 confirms that the second abnormal mounting detection is set to "no" in step ST8, raises the mounting head main body 13A (step ST9), and ends the component mounting operation. In other words, for the component for which the second abnormal mounting detection is set to "no", the mounting operation is finished only after a simple abnormal mounting state inspection by the first abnormal mounting detection section 93. FIG.

On the other hand, the second abnormal mounting detection of the mounting operation setting information is set to "yes" for components that are difficult to detect by the first abnormal mounting detecting section 93 and need to be detected. In this case, when the control unit 90 confirms that the second abnormal mounting detection is set to "yes" in step ST8, the second abnormal mounting detecting unit 95 detects abnormal mounting (steps ST10 to ST12). When the dog 25 is not detected by the sensor 82 when the mounting head main body 13A is positioned at the target height position H2, the mounting head elevating section 14L lowers the mounting head main body 13A by minute distances until the dog 25 is detected by the sensor 82 (FIG. 12).

In the above search operation, step ST10 is a step of lowering the mounting head main body 13A by a small distance by the mounting head elevating unit 14L, and step ST11 is a step of determining whether or not the mounting head main body 13A has reached a search operation end height H9 which is offset downward by a first allowance distance D1 from the mounting surface reference height H0. Step ST12 is a step for determining whether or not the dog 25 is detected by the sensor 82. If the dog 25 is not detected by the sensor 82 in step ST12, the process returns to step ST10.

FIG. 15 shows the state when it is determined in step ST11 that the mounting head main body 13A has reached the search operation end height H9. A component that should have been held by the nozzle 13N is lost for some reason, and the lower end of the nozzle 13N has reached the upper surface of the substrate KB. In the above loop (search operation), when it is determined in step ST11 that the placement head main body 13A has reached the search operation end height H9, the control unit 90 determines that there is no component, and in step ST7, notifies the operator of an abnormality in the mounting state and stops the component mounting operation.

FIG. 12 shows the state when the dog 25 is detected by the sensor 82 in step ST12. In the search operation, the mounting head main body 13A gradually descends, but the component holder 13B is prevented from descending by the component BH on the board KB, so they gradually approach each other. Then, when the dog 25 reaches the position where the inspection light 82L is blocked, the search operation for which the dog 25 was detected by the sensor 82 in step ST12 ends.

After completing the search operation in step ST12, the control section 90 detects the height position of the mounting head body section 13A based on the detection information of the first height position detection section 92 (step ST13). Hereinafter, the height position of the mounting head main body 13A detected in step ST13 will be referred to as search height H3.

The control section 90 detects whether or not there is a mounting abnormality based on the search height H3 using the second abnormal mounting detection section 95 . A second abnormal mounting detection part 95 judges the mounting state by paying attention to the fact that the difference between the search height H3 and the search operation end height H9 when the component BH is mounted on the board KB in a normal mounting state is the same value as the component thickness TH. Specifically, the second abnormal mounting detector 95 determines whether the difference between the search height H3 and the search operation end height H9 is within a predetermined allowable range from the component thickness TH read from the production program. If it is within the allowable range, it is determined that the wearing state is normal, that is, the second abnormal wearing is not detected. When the second abnormal mounting state is not detected by the second abnormal mounting detection part 95, it is determined that the component mounting is normally completed, and the process proceeds to step ST9, the mounting head body part 13A is lifted, and the component mounting operation is completed.

FIG. 12 shows a state in which the component BH is mounted in a normal mounting state after the search operation is finished. As shown, the difference ΔH between the search height H3 and the search operation end height H9 substantially coincides with the component thickness TH.

FIG. 13 shows a state in which a part BH1 different from the part BH planned in the production program is mounted after the search operation is completed. The part thickness TH1 of the part BH1 is thinner than the part thickness TH of the part BH. Therefore, the difference .DELTA.H between the search height H3 and the search operation end height H9 is a small value outside the allowable range for the part thickness TH. Therefore, the second abnormal mounting detection unit 95 detects this as the second abnormal mounting state "low" (step ST14). In this case, the control unit 90 advances the process to step ST7, notifies the operator that the component BH is in the abnormal mounting state (second abnormal mounting state), and stops the component mounting operation.

FIG. 14 shows a state in which a part BH2 different from the part BH planned in the production program is mounted after the search operation is completed. The part thickness TH2 of the part BH2 is thicker than the part thickness TH of the part BH. Therefore, the difference .DELTA.H between the search height H3 and the search operation end height H9 is a large value outside the allowable range for the part thickness TH. Therefore, the second abnormal mounting detection unit 95 detects this as the second abnormal mounting state "high" (step ST14).

The processing after detecting the second abnormal mounting state "high" in step ST14 branches depending on the setting of "insertion retry" in the mounting operation setting information. Insertion retry is a function used when mounting a lead-equipped component BH3 (see FIG. 16) having a lead LD delivered to the lead insertion hole KBH of the board KB, and refers to a process of pushing the lead-equipped component BH3 into the board KB again with the component holder 13B when the lead LD is caught in the lead insertion hole KBH and mounting is insufficient. The setting of the insertion retry is set to "no" for the surface mount type component BH without the lead LD and the component not requiring the insertion retry, but when setting the insertion retry for the component BH3 with the lead, it is set to "yes".

When the second abnormal insertion state is "high" in step ST14 (FIG. 14), the control section 90 confirms whether or not the insertion retry setting is set to "yes" (step ST15). This determination is made depending on whether or not the "present" flag is set in the "insertion retry" section shown in FIG.

If the insertion retry setting is set to "no" in step ST15, the control unit 90 proceeds to step ST7, notifies the operator of an abnormality in the mounting state, and stops the component mounting operation. On the other hand, when the insertion retry setting is set to "yes" in step ST15, the control section 90 executes retry processing (step ST16). Specifically, the pressurizing force of the shaft 21 by the air cylinder 72 is increased to press the component BH against the board KB with a stronger force than before (FIG. 19), and an insertion retry is attempted.

Next, the mounting operation will be described by taking as an example the operation of mounting a component BH3 (component thickness TH3) with leads on a substrate. When the component BH3 with leads (hereinafter abbreviated as the component BH3) is to be mounted on the board KB, the mounting head elevating section 14L sucking and holding the body portion BD of the component BH3 by the nozzle 13N is lowered from the mounting preparation position (FIG. 16) (step ST5). Then, the leads LD are inserted through the lead insertion holes KBH of the substrate KB (FIG. 17) and attached to the substrate KB (FIG. 18). When the component BH3 is mounted on the board KB in a normal mounting state, the processing from step ST10 to step ST14 is performed, and if the second abnormal mounting is not detected in step ST14, the process proceeds to step ST9 to end the component mounting operation.

Here, if the leads LD are not smoothly inserted into the lead insertion holes KBH and the component BH3 cannot be pushed down toward the board KB from the state shown in FIG. Therefore, the second abnormal mounting state "high" is detected by the second abnormal mounting detection unit 95 (step ST14).

The state where the leads LD of the component BH3 are not smoothly inserted into the lead insertion holes KBH of the board KB is different from the case where the foreign object IB is caught between the component BH3 and the board KB. If the body portion BD of the component BH3 is pressed more strongly, the leads LD will pass through the lead insertion holes KBH, and the abnormal mounting state (second abnormal mounting state) of the component BH3 may be eliminated. Therefore, in the present embodiment, if the insertion retry is set to "yes" in step ST15, an insertion retry is executed (step ST16).

After attempting the insertion retry, it is determined whether or not the second abnormal attachment has been resolved (step ST17). To determine whether or not the second abnormal attachment has been resolved, the search height H3 is acquired by executing the same operation as the search operation described above (FIG. 20). Then, it is determined whether or not the second abnormal mounting state has been resolved by the same method as in step ST14.

If the result of determination in step ST17 is that the second abnormal mounting state has not been resolved, the control section 90 terminates the mounting operation of the component BH, and proceeds to step ST7. Then, in step ST7, the operator is notified of the abnormality in the mounting state, and the component mounting operation is stopped. On the other hand, when the second abnormal mounting state is resolved in step ST17, it is determined that the component mounting is normally completed, and the process proceeds to step ST9 to raise the mounting head main body 13A and complete the component mounting operation.

As described above, in the component mounting apparatus 1 and the component mounting method according to the present embodiment, when the component BH held by the nozzle 13N as a component holder is mounted on the board KB by lowering the mounting head main body 13A toward the board KB, when the component holder displacement detection sensor (sensor 82) detects that the component holder 13B has been displaced upward by a predetermined distance (first allowance D1), it is determined that an abnormal mounting state of the component BH has occurred (first abnormality mounting detection process). Therefore, if a foreign object IB is caught between the component BH to be mounted and the board KB, it can be detected.

Further, when the mounting head body 13A is lowered while the nozzle 13N is in contact with the upper surface of the component BH, and when the sensor 82 detects that the component holder 13B is displaced upward by a predetermined distance (the first allowance distance D1), the search height H3, which is the detection result of the first height position detection unit 92 at that time, is obtained (sensor detection height position detection step), thereby detecting abnormal mounting of the component BH (second abnormal mounting detection step). ).

As a result, it is possible to detect a state in which a minute foreign matter IB that could not be detected in the process of lowering the nozzle 13N (first abnormal mounting detection process) is caught between the component BH and the board KB. Further, when the component BH is not picked up by the nozzle 13N, it can be detected (no component state). As described above, according to the component mounting apparatus 1 (component mounting method) of the present embodiment, component mounting can be performed while determining abnormal mounting states of various components.

Although the embodiments of the present invention have been described so far, the present invention is not limited to those described above, and various modifications and the like are possible. For example, in the above-described embodiment, the component holder displacement detection sensor that detects that the component holder (nozzle 13N) is displaced upward by a predetermined distance relative to the mounting head main body 13A was an optical sensor using inspection light.

Also, the present invention may be implemented with modifications depending on the type, shape, and size of parts. An example thereof will be described with reference to FIGS. 21 and 23. FIG. FIG. 21 shows a state in which a component BH4 with leads having a relatively large lateral dimension (hereinafter referred to as component BH4) is mounted on the board KB by the component mounting apparatus 1 according to the present embodiment. As shown in FIG. 21, if the nozzle 13N holds the central portion of the component BH4, which has a relatively large lateral dimension, and the substrate KB is mounted, the leads LD are likely to be caught in the lead insertion holes KBH, causing the body portion BD to tilt from the horizontal position.

In such a case, a search operation is performed on both ends of the upper surface of the body portion BD of the component BH4 to bring the nozzle 13N into contact with the both ends, and search heights at both ends are acquired (FIG. 22(a)). Then, the mounting state is determined in consideration of the acquired search height and the component thickness of the component BH4 read out from the production program 97 . As a result of the determination, if the body portion BD is tilted, the relatively higher one of the both ends is additionally pressed in the same manner as the aforementioned insertion retry (FIG. 22(b)). By performing such additional pressing, the posture of the body portion BD of the component BH is made horizontal. As a result, even if the body portion BD of the component BH4 is tilted from the horizontal posture during mounting on the board KB, it can be mounted normally on the board KB.

To provide a component mounting device and a component mounting method capable of mounting components while discriminating abnormal mounting states of various components.

REFERENCE SIGNS LIST 1 component mounting device 13 mounting head 13A mounting head body 13B component holder 13N nozzle (component holder)
14L mounting head elevating unit 21 shaft 25 dog 72 air cylinder 82 sensor (component holder displacement detection sensor)
92 First height position detector 93 First abnormal mounting detector 94 Sensor detection height position detector 95 Second abnormal mounting detector 96 Component height detector D1 First allowance distance (predetermined distance)
H Body height position H0 Mounting surface reference height H1 Part contact height position H2 Target height position H3 Search height H9 Search operation end height BH, BH1, BH2, BH3, BH4 Part TH, TH1, TH2, TH3 Part thickness KH Reference height KB Board

Claims (3)

A component mounting device that holds a component with a mounting head and mounts it on a substrate,
a mounting head main body;
a component holder that has a component holder that retains a component at its lower end, is vertically displaceable with respect to the mounting head main body, and is displaced upward relative to the mounting head main body by a reaction force received from the component when the component is mounted;
a mounting head elevating unit that elevates the mounting head main body toward the substrate;
a first height position detection unit that detects a height position of the mounting head main body that is elevated by the mounting head elevating unit;
a component holder displacement detection sensor that detects that the component holder has been displaced upward by a predetermined distance relative to the mounting head main body;
a first abnormal mounting detection unit for detecting abnormal mounting of a component when the component holder displacement detecting sensor detects that the component holder is displaced upward by the predetermined distance when the mounting head main body is lowered toward the substrate and the component held by the component holder is mounted on the substrate;
a sensor detection height position detection unit that acquires a detection result of the first height position detection unit when the mounting head body is lowered while the component holder is in contact with the upper surface of the component, and the component holder displacement detection sensor detects that the component holder is displaced upward by the predetermined distance;
a second abnormal mounting detection unit that detects abnormal mounting of a component based on the height acquired by the sensor detection height position detection unit;
component mounting device. 2. The component mounting apparatus according to claim 1, further comprising a component height detection unit that obtains the height position of the component based on the height position acquired by the sensor detection height position detection unit. A component mounting method using the component mounting apparatus according to claim 1 or 2,
a first abnormal mounting detection step of detecting abnormal mounting of a component when the component holder displacement detection sensor detects that the component holder has been displaced upward by the predetermined distance when the mounting head main body portion is lowered toward the substrate and the component held by the component holder is mounted on the substrate;
a sensor detection height position detection step of obtaining a detection result of the first height position detection unit when the mounting head body is lowered while the component holder is in contact with the upper surface of the component, and the component holder displacement detection sensor detects that the component holder is displaced upward by the predetermined distance;
a second abnormal mounting detection step of detecting abnormal mounting of a component based on the height acquired in the sensor detection height position detection step;
Part mounting method including.

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