JP2023099005A - Mounting substrate and mounting substrate manufacturing method - Google Patents

Abstract

To provide a mounting substrate and a manufacturing method of the same that suppress the occurrence of positional displacement of elements.SOLUTION: A mounting substrate includes a housing substrate 10 including a first surface 11 and a second surface 12 located on the opposite side of the first surface 11, provided with a recess 13 on the first surface side, and including an organic material, an element 50 located in a recess 13 of the housing substrate 10 and having a terminal 51, an insulating layer 20 that at least partially covers the housing substrate 10 and the element 50 on the first surface 11 side and is at least partially positioned in a gap between the wall surface 132 of the recess 13 of the housing substrate 10 and the element 50, and a conductive layer 25 having a first portion 26 located on the insulating layer 20 and a second portion 27 penetrating the insulating layer 20 and electrically connecting the first portion 26 and the terminal 51 of the element 50.SELECTED DRAWING: Figure 2

Description

An embodiment of the present disclosure relates to a mounting substrate and a manufacturing method of the mounting substrate.

Wafer-Level-Packaging (WLP) is known as a technique for packaging elements such as elements. Wafer level packaging is a technology that implements the process of packaging elements in a wafer state. For example, Patent Literature 1 discloses a technique for improving fan-out wafer level packaging (FOWLP: Fan Out Wafer-Level-Packaging). Fan-out type wafer level packaging is a technique of forming a rewiring layer over an area exceeding the element area in the process of packaging elements in a wafer state. In this specification, the rewiring layer is also simply referred to as a wiring layer.

In conventional fan-out type wafer level packaging, first, a plurality of devices are prepared, and then a plurality of devices are mounted on a carrier. Thereafter, a resin material is supplied so as to cover the carrier and the elements, and the resin material is cured to seal each element with the resin. Subsequently, the resin sealing member including a plurality of resin-sealed elements is removed from the carrier. Next, the resin sealing member is turned over and a wiring layer is formed on the resin sealing member. After that, the resin sealing member and the wiring layer are cut into sections each containing one element to obtain an electronic device in which the element is packaged.

JP 2013-58520 A

The resin material expands and contracts according to temperature changes. In addition, curing shrinkage occurs when the resin material is cured. For this reason, it is conceivable that the position of the element covered with the resin material may shift on the carrier due to the expansion or contraction of the resin material.

An object of the embodiments of the present disclosure is to provide a mounting substrate that can effectively solve such problems.

An embodiment of the present disclosure includes a housing substrate including a first surface and a second surface opposite to the first surface, provided with a recess on the side of the first surface, and having an organic material; an element positioned in the recess of the substrate and having a terminal; and a gap between the housing substrate and the element and a wall surface of the recess of the housing substrate at least partially covering the housing substrate and the element on the first surface side. a first portion overlying the insulating layer; and a second portion penetrating through the insulating layer and electrically connecting the first portion to the terminal of the element. and a conductive layer having and a mounting substrate.

The mounting substrate according to an embodiment of the present disclosure may further include a support substrate located on the second surface side of the housing substrate and having an inorganic material.

In the mounting substrate according to an embodiment of the present disclosure, the conductive layer may further have a third portion connected to the first portion and penetrating through the insulating layer and the housing substrate.

In the mounting substrate according to an embodiment of the present disclosure, the concave portion of the housing substrate includes a stepped portion that supports a surface of the element located on the second surface side of the housing substrate, and the surface of the element. and the second surface of the housing substrate.

In the mounting substrate according to an embodiment of the present disclosure, a sensor section may be formed on a surface of the element located on the second surface side of the housing substrate.

An embodiment of the present disclosure includes a housing substrate including a first surface and a second surface opposite to the first surface, provided with a recess on the side of the first surface, and having an organic material; an element positioned in the recess of the substrate and having a terminal; and a gap between the housing substrate and the element and a wall surface of the recess of the housing substrate at least partially covering the housing substrate and the element on the first surface side. a substrate located on the first surface side of the housing substrate; and through electrodes penetrating through the substrate and the insulation layer and electrically connected to the terminals of the device. and a through electrode substrate having and.

In the mounting substrate according to an embodiment of the present disclosure, a gap between the wall surface of the recess and the element when viewed from the surface of the insulating layer along the normal direction of the first surface of the housing substrate, and A depression may be formed in the overlapping portion.

In the mounting substrate according to an embodiment of the present disclosure, the organic material of the housing substrate may contain polyimide resin, epoxy resin, polyphenylene ether resin, or fluorine resin.

In the mounting substrate according to an embodiment of the present disclosure, the material forming the insulating layer may contain polyimide resin, epoxy resin, or acrylic resin.

An embodiment of the present disclosure includes the steps of providing a support substrate having an inorganic material, a first surface located farther from the support substrate and a second surface located closer to the support substrate, the first surface a step of forming, on the supporting substrate, a housing substrate having a concave portion on the side thereof and containing an organic material; a step of arranging an element having a terminal in the concave portion of the housing substrate; an insulating layer forming step of forming an insulating layer that at least partially covers the housing substrate and the element and is at least partially located in a gap between the wall surface of the recess of the housing substrate and the element; a conductive layer forming step of forming a conductive layer having a first portion located thereon and a second portion penetrating the insulating layer and electrically connecting the first portion and the terminal of the element; and a manufacturing method of a mounting substrate.

The method for manufacturing a mounting substrate according to an embodiment of the present disclosure may further include separating the support substrate from the housing substrate.

In the method for manufacturing a mounting substrate according to an embodiment of the present disclosure, the support substrate is provided with electrodes penetrating the support substrate, and the conductive layer forming step penetrates the insulating layer and the housing substrate. and forming a third portion electrically connecting the first portion and the electrode of the support substrate.

In the mounting substrate manufacturing method according to an embodiment of the present disclosure, the support substrate may have glass.

An embodiment of the present disclosure includes the steps of providing a support substrate having an inorganic material, a first surface located farther from the support substrate and a second surface located closer to the support substrate, the first surface a step of forming, on the supporting substrate, a housing substrate having a concave portion on the side thereof and containing an organic material; a step of arranging an element having a terminal in the concave portion of the housing substrate; an insulating layer forming step of forming an insulating layer that at least partially covers the housing substrate and the element and is at least partially located in a gap between the wall surface of the recess of the housing substrate and the element; and the housing substrate. and a through electrode penetrating through the substrate, the penetrating electrode substrate is provided so that the through electrode of the through electrode substrate is in contact with the terminal of the element. and disposing an electrode substrate on the insulating layer.

In the method for manufacturing a mounting substrate according to an embodiment of the present disclosure, the insulating layer forming step may include a step of sucking the insulating layer into a gap between the wall surface of the concave portion of the housing substrate and the element. good.

According to the embodiments of the present disclosure, it is possible to suppress the occurrence of positional deviation of the element.

1 is a cross-sectional view showing a mounting substrate according to one embodiment; FIG. 2 is a cross-sectional view showing an enlarged recess of a housing substrate of the mounting substrate shown in FIG. 1; FIG. It is a figure which shows the process of preparing the accommodation board|substrate provided with the recessed part. It is a figure which shows the process of arrange|positioning an element in the recessed part of an accommodation board|substrate. It is a figure which shows the process of forming an insulating layer on a housing substrate. FIG. 10 is a cross-sectional view showing a modified example of the mounting board; FIG. 10 is a cross-sectional view showing a modified example of the mounting board; FIG. 10 is a cross-sectional view showing a modified example of the mounting board; FIG. 10 is a cross-sectional view showing a modified example of the mounting board; 10A to 10C are diagrams showing a manufacturing process of the mounting board shown in FIG. 9;

A configuration of a mounting substrate and a method of manufacturing the same according to one embodiment will be described below in detail with reference to the drawings. The embodiments shown below are examples of the embodiments of the present disclosure, and the present disclosure should not be construed as being limited to these embodiments. Also, in this specification, terms such as "substrate", "base material", "sheet" and "film" are not to be distinguished from each other based only on the difference in designation. For example, "substrate" and "base material" are concepts that include members that can be called sheets and films. Furthermore, terms used herein to specify shapes and geometric conditions and their degrees, such as terms such as "parallel" and "perpendicular", length and angle values, etc., are bound by strict meanings. However, it is interpreted to include the extent to which similar functions can be expected. In addition, in the drawings referred to in this embodiment, the same reference numerals or similar reference numerals may be assigned to the same portions or portions having similar functions, and repeated description thereof may be omitted. Also, the dimensional ratios in the drawings may differ from the actual ratios for convenience of explanation, and some of the configurations may be omitted from the drawings.

[Mounting board]
First, the configuration of a mounting substrate 1 according to one embodiment will be described with reference to FIG. FIG. 1 is a cross-sectional view showing a mounting substrate 1 according to this embodiment.

As shown in FIG. 1, the mounting substrate 1 includes a housing substrate 10, an element 50, an insulating layer 20, a conductive layer 25, and a support substrate 30. As shown in FIG. Each component of the mounting board 1 will be described below.

(accommodating substrate)
The housing substrate 10 includes a first surface 11 positioned farther from the support substrate 30 and a second surface 12 positioned opposite to the first surface 11, that is, on the support substrate 30 side. A concave portion 13 is provided on the first surface 11 side of the housing substrate 10 . The recess 13 includes a bottom surface 131 and a wall surface 132 extending from the bottom surface 131 to the first surface 11 . The thickness t1 of the housing substrate 10 is, for example, 50 μm or more and, for example, 700 μm or less.

Recess 13 defines a space for housing element 50 . The depth d of the concave portion 13 is, for example, 30 μm or more and, for example, 400 μm or less. The width w of the recess 13 is, for example, 300 μm or more and, for example, 20000 μm or less.

The housing substrate 10 provided with the recess 13 is produced by molding an organic material. As the organic material forming the housing substrate 10, for example, fluorine-based resin such as polyimide resin, epoxy-based resin, polyphenylene ether-based resin, and polytetrafluoroethylene resin can be used. Further, in order to improve the insulating properties and mechanical strength of the housing substrate 10, the housing substrate 10 may further contain fibers such as glass fibers or inorganic fillers.

(element)
The element 50 includes, for example, device chips such as LSI (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems), and discrete components. A MEMS is an electronic device in which mechanical elements, sensors, actuators, electronic circuits, etc. are integrated on one substrate. Also, the device 50 may include a power amplifier, a surface acoustic wave filter, a switch, an imaging device, and the like.

As shown in FIG. 1, the device 50 is located inside the recess 13 of the housing substrate 10 . The element 50 also has a terminal 51 . In the example shown in FIG. 1, the element 50 is arranged in the recess 13 so that the terminals 51 are positioned on the first surface 11 side. Although not shown, the element 50 may be arranged such that the terminals 51 are located on the second surface 12 side. The element 50 may be adhered to the bottom surface 131 of the recess 13 with an adhesive material (not shown) such as a die attachment material.

In the example shown in FIG. 1 , the surface of the element 50 on the side of the first surface 11 is located on the same plane as the first surface 11 . However, the present invention is not limited to this. It may be located outside the surface 11 .

(insulating layer)
The insulating layer 20 is an insulating layer that at least partially covers the housing substrate 10 and the element 50 on the first surface 11 side of the housing substrate 10 . In the example shown in FIG. 1, the insulating layer 20 is positioned on the first surface 11 and the element 50 so as to cover the entire area of the element 50 from the first surface 11 side. The thickness t2 of the insulating layer 20 is, for example, 5 μm or more and, for example, 50 μm or less.

FIG. 2 is a cross-sectional view showing an enlarged recess 13 of the housing board 10 of the mounting board 1 shown in FIG. As shown in FIG. 2, the insulating layer 20 is located not only on the element 50 but also at least partially in the gap between the wall surface 132 of the recess 13 and the element 50 . As a result, it is possible to prevent the element 50 from being displaced inside the recess 13 . In addition, it is possible to prevent liquid, foreign matter, and the like from entering the gap of the concave portion 13 . The dimension s of the gap of the concave portion 13 is, for example, 5 μm or more and, for example, 100 μm or less.

As a material for forming the insulating layer 20, a material having sufficient fluidity, flexibility, etc., to fill the gap between the wall surface 132 of the recess 13 and the element 50 is used. As a material for forming the insulating layer 20, for example, fluorine resin such as polyimide resin, epoxy resin, polyphenylene ether resin, polytetrafluoroethylene resin, or the like can be used.

(Conductive layer)
The conductive layer 25 is a conductive layer that is electrically connected to the terminals 51 of the element 50 . The conductive layer 25 has at least a first portion 26 located on the insulating layer 20 and a second portion 27 penetrating the insulating layer 20 and electrically connecting the first portion 26 and the terminal 51 of the element 50 . have. In the example shown in FIGS. 1 and 2, second portion 27 of conductive layer 25 is physically connected to terminal 51 of device 50 .

The configuration of the conductive layer 25 is not particularly limited as long as the conductive layer 25 has conductivity. For example, the conductive layer 25 may consist of a single electrically conductive layer, or may consist of multiple electrically conductive layers. For example, the conductive layer 25 may have a conductive first layer and a second layer formed on the first layer by electroplating. In this case, the first layer functions as a seed layer that serves as a base for growing the second layer, which is a plating layer.

When conductive layer 25 includes the first and second layers described above, the material of the first layer may be the same as or different from the material of the second layer. For example, the first layer may be a laminated film in which titanium and copper are laminated in order, chromium, or the like. The first layer can be formed by, for example, a sputtering method, a vapor deposition method, an electroless plating method, a sol-gel method, or the like. The second layer contains, for example, copper. The second layer contains, for example, copper as a main component, and more specifically contains 80% by mass or more of copper. Also, the second layer may contain a metal such as gold, silver, platinum, rhodium, tin, aluminum, nickel, chromium, or an alloy using these.

(support substrate)
The support substrate 30 is a substrate positioned on the second surface 12 side of the housing substrate 10 . In the example shown in FIGS. 1 and 2 , the support substrate 30 is in contact with the second surface 12 of the housing substrate 10 . By providing the mounting substrate 1 with the support substrate 30, the rigidity of the entire mounting substrate 1 can be increased. The thickness of the support substrate 30 is, for example, 0.05 mm or more and, for example, 0.7 mm or less.

The support substrate 30 contains an inorganic material having a certain insulating property. For example, the support substrate 30 may be a glass substrate, a quartz substrate, a sapphire substrate, a resin substrate, a silicon substrate, a silicon carbide substrate, an alumina (Al ₂ O ₃ ) substrate, an aluminum nitride (AlN) substrate, a zirconia oxide (ZrO ₂ ) substrate, A lithium niobate substrate, a tantalum niobate substrate, or the like, or a laminate of these substrates. The support substrate 30 may partially include a substrate made of a conductive material such as an aluminum substrate or a stainless steel substrate.

Examples of the glass used for the support substrate 30 include alkali-free glass. Alkali-free glass is glass that does not contain alkaline components such as sodium and potassium. Alkali-free glass includes, for example, boric acid instead of an alkaline component. Alkali-free glass also contains, for example, alkaline earth metal oxides such as calcium oxide and barium oxide. Examples of alkali-free glass include EN-A1 manufactured by Asahi Glass and Eagle XG manufactured by Corning.

[Method for manufacturing mounting board]
An example of a method for manufacturing the mounting board 1 will be described below with reference to FIGS.

(Step of forming housing substrate)
First, the support substrate 30 is prepared. Subsequently, a resin layer containing an organic material is provided on the support substrate 30 . As a method for providing the resin layer, a dry lamination method, a printing method, or the like can be used. Subsequently, the resin layer is molded to form recesses on the surface of the resin layer. As a result, as shown in FIG. 3, the housing substrate 10 having the concave portion 13 provided on the first surface 11 side can be formed on the support substrate 30 . As a method of forming the resin layer to produce the housing substrate 10, for example, a method of pressing a mold against the resin layer can be used. Moreover, when the organic material has photosensitivity, the resin layer may be formed by performing exposure treatment and development treatment.

Alternatively, by using a 3D printer or the like to provide a resin layer on a portion other than the portion to be the recess 13, the housing substrate 10 having the recess 13 provided on the first surface 11 side is formed on the support substrate 30. good too.

(Device Arrangement Process)
Subsequently, as shown in FIG. 4, the element 50 is arranged in the concave portion 13 of the housing substrate 10 . For example, the element 50 is arranged so that the terminals 51 of the element 50 are located on the first surface 11 side. The element 50 may be adhered to the bottom surface 131 of the recess 13 with an adhesive material (not shown) such as a die attachment material.

(Step of forming insulating layer)
Subsequently, the insulating layer 20 is formed on the first surface 11 of the housing substrate 10 and the device 50 . For example, a resin film (not shown) including the support base material and the insulating layer 20 is attached to the first surface 11 of the housing substrate 10 and the element 50 . Also, the insulating layer 20 is sucked into the gap between the wall surface 132 of the concave portion 13 of the housing substrate 10 and the element 50 . For example, by using a vacuum laminator to provide the insulating layer 20 on the first surface 11 of the housing substrate 10 and the elements 50 , sticking and suction to the gaps of the recesses 13 can be achieved. In this way, as shown in FIG. 5, the insulating layer 20 positioned between the recesses 13 and covering the first surface 11 and the element 50 can be formed.

Alternatively, the insulating layer 20 may be formed using a curable resin. For example, when a thermosetting resin is used, a resin film (not shown) including a supporting substrate and a thermosetting resin layer is attached to the first surface 11 of the housing substrate 10 and the element 50 . For example, by using a vacuum laminator to provide a layer of thermosetting resin on the first surface 11 of the housing substrate 10 and the elements 50 , adhesion and suction into the gaps of the recesses 13 can be achieved. after that,
A layer of thermosetting resin is heated to form the insulating layer 20 . The case of using a photocurable resin is the same as the case of using a thermosetting resin except that the insulating layer 20 is formed by irradiating the photocurable resin with light such as ultraviolet light or an electron beam.

Further, a processing step of forming a through hole in the insulating layer 20 in which the second portion 27 of the conductive layer 25 is provided may be performed. For example, if the insulating layer 20 has photosensitivity, the through holes can be formed by exposing and developing the insulating layer 20 .

When the insulating layer 20 is drawn into the gap between the wall surface 132 of the concave portion 13 of the housing substrate 10 and the element 50 by suction as described above, the vicinity of the gap of the concave portion 13 is more insulated than other portions. It is conceivable that the thickness of layer 20 is reduced. For example, as shown in FIG. 2 , when viewed along the normal direction of the first surface 11 of the housing substrate 10 among the surfaces of the insulating layer 20 , it overlaps with the gap between the wall surface 132 of the recess 13 and the element 50 . A depression 21 may be formed in the part. The depth of the depression 21 is, for example, 5 μm or more and, for example, 10 μm or less. Forming the depressions may avoid stress concentrations.

(Step of forming conductive layer)
Subsequently, a conductive layer having a first portion 26 located on the insulating layer 20 and a second portion 27 penetrating the insulating layer 20 and electrically connecting the first portion 26 and the terminal 51 of the element 50 25 is formed. Thus, the mounting board 1 shown in FIG. 1 can be obtained.

In this embodiment, the element 50 is arranged in the concave portion 13 of the housing substrate 10 as described above. Therefore, even if the insulating layer 20 covering the element 50 expands or contracts, the displacement range of the element 50 can be limited to the inside of the recess 13 . As a result, in the manufacturing process of the mounting board 1, it is possible to prevent the element 50 from being displaced beyond the allowable range.

Various modifications can be made to the above-described embodiment. Modifications will be described below with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding portions in the above-described embodiment are used for the parts that can be configured in the same manner as in the above-described embodiment, Duplicate explanations are omitted. Further, when it is clear that the effects obtained in the above-described embodiment can also be obtained in the modified example, the explanation thereof may be omitted.

(First modification)
In the embodiment described above, an example in which the mounting substrate 1 includes the support substrate 30 that supports the insulating layer 20 from the second surface 12 side has been described. However, the present invention is not limited to this, and the mounting board 1 may not include the supporting board 30 as shown in FIG. Such a mounting substrate 1 can be obtained, for example, by further performing a step of separating the supporting substrate 30 from the second surface 12 of the housing substrate 10 after manufacturing the mounting substrate 1 shown in FIG.

(Second modification)
As shown in FIG. 7 , electrodes 35 penetrating through the support substrate 30 may be provided on the support substrate 30 that supports the insulating layer 20 from the second surface 12 side. In this case, as shown in FIG. 7, the conductive layer 25 penetrates the insulating layer 20 and the housing substrate 10 in addition to the first portion 26 and the second portion 27, and penetrates the electrodes 35 of the first portion 26 and the support substrate 30. It may further have a third portion 28 electrically connecting the . Thereby, the terminals 51 of the element 50 and the electrodes 35 of the support substrate 30 can be electrically connected. Other electronic components that transmit and receive electrical signals to and from the element 50 are electrically connected to the electrodes 35 of the support substrate 30 .

The through hole of the housing substrate 10 in which the third portion 28 of the conductive layer 25 is provided may be formed in the step of forming the recess 13 in the housing substrate 10 . Alternatively, the through-holes in the housing substrate 10 may be formed after the recesses 13 are formed in the housing substrate 10 .

(Third modification)
As shown in FIG. 8 , the concave portion 13 of the housing substrate 10 includes a step portion 133 that supports the surface 52 of the element 50 located on the second surface 12 side of the housing substrate 10 and the surface 52 of the element 50 . and a penetrating portion 134 that penetrates the insulating layer 20 between the substrate 30 and the substrate 30 . In the example shown in FIG. 8, the stepped portion 133 is formed by forming a penetrating portion 134 penetrating through a portion of the bottom surface 131 of the recess 13 to the support substrate 30 side. In this modification, the element 50 has a sensor portion 53 formed on the surface 52 located on the second surface 12 side. For example, the device 50 includes an imaging device, and the sensor section 53 is a light detection section that detects light.

In this modification, at least part of the surface 52 of the element 50 does not come into contact with the housing substrate 10 . In this case, it is preferable to provide the sensor section 53 on a portion of the surface 52 of the element 50 that does not come into contact with the housing substrate 10 . As a result, it is possible to prevent the accuracy of the sensor section 53 from deteriorating due to contact with the housing substrate 10 .

(Fourth modification)
In the above-described embodiment and each modified example, an example in which the conductive layer 25 provided on the insulating layer 20 is electrically connected to the terminal 51 of the element 50 is shown. In this modified example, an example in which the through electrode 45 of the through electrode substrate 40 located on the first surface 11 side of the housing substrate 10 is electrically connected to the terminal 51 of the element 50 will be described.

FIG. 9 is a cross-sectional view showing the mounting board 1 according to this modification. As shown in FIG. 9 , the mounting substrate 1 includes a housing substrate 10 , elements 50 , an insulating layer 20 and a through electrode substrate 40 .

The through electrode substrate 40 has a substrate 41 located on the side of the first surface 11 of the housing substrate 10 and a through electrode 45 penetrating through the substrate 41 and protruding from the surface of the substrate 41 toward the housing substrate 10 . As shown in FIG. 9 , the through electrode 45 penetrates the insulating layer 20 so as to be electrically connected to the terminal 51 of the element 50 . In the example shown in FIG. 9, the tip of the conductive layer 25 contacts the terminal 51 of the element 50 .

The substrate 41 contains an inorganic material with certain insulating properties. For example, the substrate 41 may be, like the support substrate 30, a glass substrate, a quartz substrate, a sapphire substrate, a resin substrate, a silicon substrate, a silicon carbide substrate, an alumina ( _Al2O3 ) substrate, an aluminum nitride ( _AlN ) substrate, or a zirconia oxide substrate. (ZrO ₂ ) substrate, lithium niobate substrate, tantalum niobate substrate, etc., or a laminate of these substrates. The support substrate 30 may partially include a substrate made of a conductive material such as an aluminum substrate or a stainless steel substrate. Examples of the glass used for the substrate 41 include non-alkali glass, as in the case of the support substrate 30 . The thickness of the substrate 41 is, for example, 0.05 mm or more and, for example, 0.5 mm or less.

The configuration of the through electrode 45 is not particularly limited as long as the through electrode 45 has conductivity. For example, the through electrode 45 may be composed of a single conductive layer, or may be composed of a plurality of conductive layers, similar to the conductive layer 25 described above. As the material of the through electrode 45, the same metal material as that of the conductive layer 25 can be used.

An example of a method for manufacturing the mounting substrate 1 shown in FIG. 9 will be described below with reference to FIG.

First, in the same manner as in the above embodiment, the housing substrate 10 provided with the recess 13 is formed on the support substrate 30 , the element 50 is arranged in the recess 13 , and the element 50 is covered with the insulating layer 20 . As the insulating layer 20, for example, an adhesive can be used, and specifically, a polyimide resin, an epoxy resin, an acrylic resin, or the like can be used. Further, as shown in FIG. 10, a through electrode substrate 40 having through electrodes 45 projecting toward the housing substrate 10 is prepared. Subsequently, the through electrode substrate 40 is arranged on the insulating layer 20 so that the through electrode 45 of the through electrode substrate 40 is in contact with the terminal 51 of the element 50 . For example, the through electrode substrate 40 is pressed toward the insulating layer 20 so that the through electrode 45 of the through electrode substrate 40 penetrates the insulating layer 20 and contacts the terminal 51 of the element 50 . Thus, the mounting board 1 shown in FIG. 9 can be obtained.

Although several modifications of the above-described embodiment have been described, it is of course possible to apply a plurality of modifications in appropriate combination.

1 Mounting substrate 10 Accommodating substrate 11 First surface 12 Second surface 13 Recessed portion 131 Bottom surface 132 Wall surface 133 Stepped portion 134 Through portion 20 Insulating layer 21 Recess 25 Conductive layer 26 First portion 27 Second portion 28 Third portion 30 Supporting substrate 35 Electrode 40 Through electrode substrate 41 Substrate 45 Through electrode 50 Element 51 Terminal 53 Sensor part

Claims (6)

a receiving substrate including a first surface and a second surface located opposite to the first surface, the first surface being provided with recesses, and having an organic material;
an element positioned in the recess of the housing substrate and having a terminal;
an insulating layer that at least partially covers the housing substrate and the element on the first surface side and is at least partially positioned in a gap between the wall surface of the recess of the housing substrate and the element;
a conductive layer having a first portion located on the insulating layer and a second portion penetrating the insulating layer and electrically connecting the first portion and the terminal of the element;
A mounting substrate, wherein the conductive layer further includes a third portion connected to the first portion and penetrating the insulating layer and the housing substrate. a receiving substrate including a first surface and a second surface located opposite to the first surface, the first surface being provided with recesses, and having an organic material;
an element positioned in the recess of the housing substrate and having a terminal;
an insulating layer that at least partially covers the housing substrate and the element on the first surface side and is at least partially positioned in a gap between the wall surface of the recess of the housing substrate and the element;
a conductive layer having a first portion located on the insulating layer and a second portion penetrating the insulating layer and electrically connecting the first portion and the terminal of the element;
The concave portion of the housing substrate includes a stepped portion that supports a surface of the element that is located on the second surface side of the housing substrate, and a step formed by the surface of the element and the second surface of the housing substrate. a through portion penetrating the containing substrate therebetween. 3. The mounting substrate according to claim 1, wherein a sensor portion is formed on a surface of said element located on a side of said second surface of said housing substrate. A recess is formed in a portion of the surface of the insulating layer that overlaps a gap between the wall surface of the recess and the element when viewed along the normal direction of the first surface of the housing substrate. The mounting board according to any one of claims 1 to 3. The mounting substrate according to any one of claims 1 to 4, wherein the organic material of the housing substrate includes polyimide resin, epoxy resin, polyphenylene ether resin, or fluorine resin. The mounting substrate according to any one of claims 1 to 5, wherein a material forming said insulating layer includes polyimide resin, epoxy resin, or acrylic resin.

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