JP6972829B2 - Mounting board and manufacturing method of mounting board - Google Patents

Description

The embodiments of the present disclosure relate to a mounting board and a method for manufacturing a mounting board.

Wafer-level-packaging (WLP) is known as a technique for packaging elements such as elements. Wafer level packaging is a technology for carrying out the process of packaging an element in the state of a wafer. For example, Patent Document 1 discloses a technique for improving fan-out wafer level packaging (FOWLP: Fan Out Wafer-Level-Packaging). Fan-out type wafer level packaging is a technique for forming a rewiring layer over a region beyond the region of the device in the process of packaging the device in the state of a wafer. In this specification, the rewiring layer is also simply referred to as a wiring layer.

In the conventional fan-out type wafer level packaging, first, a plurality of elements are prepared, and then a plurality of elements are placed on the carrier. After that, a resin material is supplied so as to cover the carrier and the element, and the resin material is cured to seal each element with the resin. Subsequently, the resin sealing member containing the plurality of resin-sealed elements is removed from the carrier. Next, the resin sealing member is turned over to form a wiring layer on the resin sealing member. Then, the resin sealing member and the wiring layer are cut for each section including one element to obtain an electronic device in which the element is packaged.

Japanese Unexamined Patent Publication No. 2013-55820

The resin material expands and contracts in response to changes in temperature. Further, when the resin material is cured, curing shrinkage occurs. Therefore, it is conceivable that the position of the element covered with the resin material shifts on the carrier due to the expansion or contraction of the resin material.

It is an object of the present disclosure to provide a mounting board capable of effectively solving such a problem.

One embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, the accommodating substrate provided with a recess on the first surface side and having an organic material, and the accommodating substrate. A gap between the element located in the recess of the substrate and having a terminal, the accommodating substrate and the element at least partially on the first surface side, and the wall surface of the recess of the accommodating board and the element. A second portion that penetrates the insulating layer, an insulating layer located at least partially, a first portion located on the insulating layer, and electrically connects the first portion and the terminal of the element. A mounting substrate comprising a conductive layer having and.

The mounting substrate according to the embodiment of the present disclosure may be further provided with a support substrate having an inorganic material, which is located on the second surface side of the accommodating substrate.

The mounting substrate according to one embodiment of the present disclosure further comprises an electrode penetrating the support substrate, and the conductive layer penetrates the insulating layer and the accommodating substrate, and the first portion and the electrode of the support substrate. May further have a third portion that electrically connects the.

In the mounting substrate according to the embodiment of the present disclosure, the supporting substrate may have glass.

In the mounting substrate according to the embodiment of the present disclosure, the recesses of the accommodating substrate include a step portion that supports a surface of the accommodating substrate located on the second surface side of the accommodating substrate, and the surface of the element. And the support substrate may have a penetrating portion penetrating the accommodating substrate.

In the mounting substrate according to the embodiment of the present disclosure, the sensor unit may be formed on the surface of the element that is located on the second surface side of the accommodating substrate.

One embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, the accommodating substrate provided with a recess on the first surface side and having an organic material, and the accommodating substrate. A gap between the element located in the recess of the substrate and having a terminal, the accommodating substrate and the element at least partially on the first surface side, and the wall surface of the recess of the accommodating board and the element. A through silicon via that penetrates the substrate and the insulating layer and is electrically connected to the terminal of the element, the insulating layer located at least partially, the substrate located on the first surface side of the accommodating substrate, and the insulating layer. A mounting substrate comprising a through silicon via substrate.

In the mounting substrate according to the embodiment of the present disclosure, the gap between the wall surface of the recess and the element when viewed along the normal direction of the first surface of the accommodating substrate among the surfaces of the insulating layer. A dent may be formed in the overlapping portion.

In the mounting substrate according to the embodiment of the present disclosure, the organic material of the housing substrate may contain a polyimide resin, an epoxy resin, a polyphenylene ether resin, or a fluorine resin.

In the mounting substrate according to the embodiment of the present disclosure, the material constituting the insulating layer may contain a polyimide resin, an epoxy resin, or an acrylic resin.

One embodiment of the present disclosure includes a step of preparing a support substrate having an inorganic material, a first surface located on a side far from the support substrate, and a second surface located on the support substrate side, said first surface. A step of forming an accommodating substrate having a recess on the side and having an organic material on the support substrate, a step of arranging an element having a terminal in the recess of the accommodating substrate, and the step of arranging an element having a terminal on the first surface side. An insulating layer forming step of forming an insulating layer that at least partially covers the accommodating substrate and the element and at least partially located in a gap between the wall surface of the recess of the accommodating substrate and the element, and the insulating layer. A conductive layer forming step of forming a conductive layer having a first portion located above and a second portion that penetrates the insulating layer and electrically connects the first portion and the terminal of the element. , Is a method for manufacturing a mounting board.

The method for manufacturing a mounting substrate according to an embodiment of the present disclosure may further include a step of separating the supporting substrate from the accommodating substrate.

In the method for manufacturing a mounting substrate according to an embodiment of the present disclosure, the support substrate is provided with an electrode penetrating the support substrate, and the conductive layer forming step penetrates the insulating layer and the accommodation substrate. , The step of forming a third portion for electrically connecting the first portion and the electrode of the support substrate may be included.

In the method for manufacturing a mounting substrate according to an embodiment of the present disclosure, the supporting substrate may have glass.

One embodiment of the present disclosure includes a step of preparing a support substrate having an inorganic material, a first surface located on a side far from the support substrate, and a second surface located on the support substrate side, said first surface. A step of forming an accommodating substrate having a recess on the side and having an organic material on the support substrate, a step of arranging an element having a terminal in the recess of the accommodating substrate, and the step of arranging an element having a terminal on the first surface side. An insulating layer forming step of forming an insulating layer at least partially located in a gap between the wall surface of the recess of the accommodating substrate and the element while covering the accommodating substrate and the element at least partially, and the accommodating substrate. A through electrode substrate having a substrate located on the first surface side of the above and a through electrode penetrating the substrate is prepared, and the penetration electrode of the through electrode substrate comes into contact with the terminal of the element. It is a method of manufacturing a mounting substrate including a step of arranging an electrode substrate on the insulating layer.

In the method for manufacturing a mounting substrate according to an embodiment of the present disclosure, the insulating layer forming step may include a step of sucking the insulating layer into a gap between the wall surface of the recess of the accommodating substrate and the element. good.

According to the embodiment of the present disclosure, it is possible to suppress the occurrence of misalignment of the element.

It is sectional drawing which shows the mounting board by one Embodiment. It is sectional drawing which shows the concave part of the accommodating board of the mounting board shown in FIG. 1 enlarged. It is a figure which shows the process of preparing the accommodating substrate provided with the recess. It is a figure which shows the process of arranging the element in the recess of the accommodating substrate. It is a figure which shows the process of forming an insulating layer on the accommodating substrate. It is sectional drawing which shows one modification of the mounting board. It is sectional drawing which shows one modification of the mounting board. It is sectional drawing which shows one modification of the mounting board. It is sectional drawing which shows one modification of the mounting board. It is a figure which shows the manufacturing process of the mounting board shown in FIG.

Hereinafter, the configuration of the mounting board and the manufacturing method thereof according to the embodiment will be described in detail with reference to the drawings. It should be noted that the embodiments shown below are examples of the embodiments of the present disclosure, and the present disclosure is not construed as being limited to these embodiments. Further, in the present specification, terms such as "board", "base material", "sheet" and "film" are not distinguished from each other based only on the difference in names. For example, "base material" and "base material" are concepts including members that can be called sheets or films. Furthermore, the terms used herein, such as "parallel" and "orthogonal", and the values of length and angle, which specify the shape and geometric conditions and their degrees, are bound by a strict meaning. Instead, the interpretation shall be made to include the range in which similar functions can be expected. Further, in the drawings referred to in the present embodiment, the same parts or parts having similar functions may be designated by the same reference numerals or similar reference numerals, and the repeated description thereof may be omitted. Further, the dimensional ratio of the drawing may differ from the actual ratio for convenience of explanation, or a part of the configuration may be omitted from the drawing.

[Mounting board]
First, the configuration of the mounting board 1 according to the embodiment will be described with reference to FIG. FIG. 1 is a cross-sectional view showing a mounting board 1 according to the present embodiment.

As shown in FIG. 1, the mounting substrate 1 includes a housing substrate 10, an element 50, an insulating layer 20, a conductive layer 25, and a support substrate 30. Hereinafter, each component of the mounting board 1 will be described.

(Accommodation board)
The accommodating substrate 10 includes a first surface 11 located on the side far from the support substrate 30, and a second surface 12 located on the opposite side of the first surface 11, that is, on the support substrate 30 side. Further, a recess 13 is provided on the first surface 11 side of the accommodating substrate 10. The recess 13 includes a bottom surface 131 and a wall surface 132 extending from the bottom surface 131 to the first surface 11. The thickness t1 of the accommodating substrate 10 is, for example, 50 μm or more, and is, for example, 700 μm or less.

The recess 13 defines a space for accommodating the element 50. The depth d of the recess 13 is, for example, 30 μm or more, and is, for example, 400 μm or less. The width w of the recess 13 is, for example, 300 μm or more, and is, for example, 20000 μm or less.

The accommodating substrate 10 provided with the recess 13 is manufactured by molding an organic material. As the organic material constituting the accommodating substrate 10, for example, a polyimide resin, an epoxy resin, a polyphenylene ether resin, a fluororesin such as a polytetrafluoroethylene resin, or the like can be used. Further, in order to improve the insulating property and the mechanical strength of the accommodating substrate 10, the accommodating substrate 10 may further contain a fiber such as glass fiber or a filler of an inorganic material.

(element)
The element 50 includes device chips such as LSI (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems) and discrete components. MEMS is an electronic device in which machine element parts, sensors, actuators, electronic circuits, etc. are integrated on one substrate. Further, the element 50 may include a power amplifier, a surface acoustic wave filter, a switch, an image pickup element, and the like.

As shown in FIG. 1, the element 50 is located inside the recess 13 of the accommodating substrate 10. Further, the element 50 has a terminal 51. In the example shown in FIG. 1, the element 50 is arranged in the recess 13 so that the terminal 51 is located on the first surface 11 side. Although not shown, the element 50 may be arranged so that the terminal 51 is located on the second surface 12 side. The element 50 may be adhered to the bottom surface 131 of the recess 13 by an adhesive material (not shown) such as a diaphragm material.

In the example shown in FIG. 1, the surface of the element 50 on the first surface 11 side is located on the same plane as the first surface 11. However, the present invention is not limited to this, and the surface of the element 50 on the first surface 11 side may be located closer to the second surface 12 than the first surface 11, that is, inside, and conversely, the first surface. It may be located outside the surface 11.

(Insulation layer)
The insulating layer 20 is a layer having an insulating property that at least partially covers the accommodating substrate 10 and the element 50 on the first surface 11 side of the accommodating substrate 10. In the example shown in FIG. 1, the insulating layer 20 is located on the first surface 11 and on the element 50 so as to cover the element 50 from the first surface 11 side over the entire area. The thickness t2 of the insulating layer 20 is, for example, 5 μm or more, and is, for example, 50 μm or less.

FIG. 2 is an enlarged cross-sectional view showing a recess 13 of the accommodating substrate 10 of the mounting substrate 1 shown in FIG. As shown in FIG. 2, the insulating layer 20 is located not only on the element 50 but also at least partially in the gap between the wall surface 132 of the recess 13 and the element 50. As a result, it is possible to prevent the element 50 from being displaced inside the recess 13. In addition, it is possible to prevent liquids, foreign substances, and the like from entering the gaps between the recesses 13. The dimension s of the gap of the recess 13 is, for example, 5 μm or more, and is, for example, 100 μm or less.

As the material constituting the insulating layer 20, a material having fluidity, flexibility, and the like that can be filled in the gap between the wall surface 132 of the recess 13 and the element 50 is used. As the material constituting the insulating layer 20, for example, a polyimide resin, an epoxy resin, a polyphenylene ether resin, a fluorine resin such as a polytetrafluoroethylene resin, or the like can be used.

(Conductive layer)
The conductive layer 25 is a layer having conductivity that is electrically connected to the terminal 51 of the element 50. The conductive layer 25 includes at least a first portion 26 located on the insulating layer 20 and a second portion 27 penetrating the insulating layer 20 and electrically connecting the first portion 26 and the terminal 51 of the element 50. Have. In the examples shown in FIGS. 1 and 2, the second portion 27 of the conductive layer 25 is physically connected to the terminal 51 of the element 50.

As long as the conductive layer 25 has conductivity, the configuration of the conductive layer 25 is not particularly limited. For example, the conductive layer 25 may be composed of a single layer having conductivity, or may be composed of a plurality of layers having conductivity. For example, the conductive layer 25 may have a first layer having conductivity and a second layer formed on the first layer by electroplating treatment. In this case, the first layer functions as a seed layer as a base for growing the second layer, which is a plating layer.

When the conductive layer 25 includes the first layer and the second layer described above, the material of the first layer may be the same as or different from the material of the second layer. For example, the first layer may be a laminated film in which titanium and copper are laminated in order, chromium, or the like. The first layer can be formed by, for example, a sputtering method, a vapor deposition method, an electroless plating method, a sol-gel method, or the like. The second layer contains, for example, copper. The second layer contains, for example, copper as a main component, and more specifically, contains 80% by mass or more of copper. Further, the second layer may contain a metal such as gold, silver, platinum, rhodium, tin, aluminum, nickel or chromium or an alloy using these.

(Support board)
The support substrate 30 is a substrate located on the second surface 12 side of the accommodation substrate 10. In the examples shown in FIGS. 1 and 2, the support substrate 30 is in contact with the second surface 12 of the accommodation substrate 10. When the mounting board 1 includes the support board 30, the rigidity of the entire mounting board 1 can be increased. The thickness of the support substrate 30 is, for example, 0.05 mm or more, and is, for example, 0.7 mm or less.

The support substrate 30 contains an inorganic material having a certain insulating property. For example, the support substrate 30 includes a glass substrate, a quartz substrate, a sapphire substrate, a resin substrate, a silicon substrate, a silicon carbide substrate, an alumina (Al ₂ O ₃ ) substrate, an aluminum nitride (AlN) substrate, a zirconia oxide (ZrO ₂ ) substrate, and the like. A lithium niobate substrate, a tantalum niobate substrate, or the like, or a laminate of these substrates. The support substrate 30 may partially include a substrate made of a conductive material such as an aluminum substrate or a stainless steel substrate.

Examples of the glass used in the support substrate 30 include non-alkali glass. Non-alkali glass is glass that does not contain alkaline components such as sodium and potassium. The non-alkali glass contains, for example, boric acid instead of the alkaline component. The non-alkali glass also contains, for example, alkaline earth metal oxides such as calcium oxide and barium oxide. Examples of non-alkali glass include EN-A1 manufactured by Asahi Glass and Eagle XG manufactured by Corning.

[Manufacturing method of mounting board]
Hereinafter, an example of the manufacturing method of the mounting substrate 1 will be described with reference to FIGS. 3 to 5.

(Forming process of accommodating substrate)
First, the support substrate 30 is prepared. Subsequently, a resin layer containing an organic material is provided on the support substrate 30. As a method for providing the resin layer, a dry laminating method, a printing method, or the like can be used. Subsequently, the resin layer is formed to form a recess on the surface of the resin layer. As a result, as shown in FIG. 3, the accommodating substrate 10 provided with the recess 13 on the first surface 11 side can be formed on the support substrate 30. As a method for forming the housing substrate 10 by molding the resin layer, for example, a method of pressing a mold against the resin layer can be used. When the organic material has photosensitivity, the resin layer may be formed by subjecting it to exposure treatment and development treatment.

Alternatively, by using a 3D printer or the like to provide a resin layer in a portion other than the portion that should be the recess 13, the accommodating substrate 10 having the recess 13 on the first surface 11 side is formed on the support substrate 30. May be good.

(Element placement process)
Subsequently, as shown in FIG. 4, the element 50 is arranged in the recess 13 of the accommodating substrate 10. For example, the element 50 is arranged so that the terminal 51 of the element 50 is located on the first surface 11 side. The element 50 may be adhered to the bottom surface 131 of the recess 13 by an adhesive material (not shown) such as a diaphragm material.

(Insulation layer forming process)
Subsequently, the insulating layer 20 is formed on the first surface 11 of the accommodating substrate 10 and on the element 50. For example, a resin film (not shown) including a support base material and an insulating layer 20 is attached to the first surface 11 of the accommodating substrate 10 and the element 50. Further, the insulating layer 20 is sucked into the gap between the wall surface 132 of the recess 13 of the accommodating substrate 10 and the element 50. For example, by providing the insulating layer 20 on the first surface 11 of the accommodating substrate 10 and the element 50 by using a vacuum laminator, it is possible to realize sticking and suction into the gap of the recess 13. In this way, as shown in FIG. 5, it is possible to form the insulating layer 20 which is located in the gap of the recess 13 and covers the first surface 11 and the element 50.

Further, the insulating layer 20 may be formed by using a curable resin. For example, when a thermosetting resin is used, a resin film (not shown) including a supporting base material and a layer of the thermosetting resin is attached to the first surface 11 of the housing substrate 10 and the element 50. For example, by providing a layer of a thermosetting resin on the first surface 11 of the accommodating substrate 10 and the element 50 using a vacuum laminator, it is possible to realize sticking and suction into the gap of the recess 13. Then, the layer of the thermosetting resin is heated to form the insulating layer 20. The case where the photocurable resin is used is the same as the case where the thermosetting resin is used except that the photocurable resin is irradiated with light such as ultraviolet rays or an electron beam to form the insulating layer 20.

Further, a processing step of forming a through hole in the insulating layer 20 in which the second portion 27 of the above-mentioned conductive layer 25 is provided may be carried out. For example, when the insulating layer 20 is photosensitive, through holes can be formed by subjecting the insulating layer 20 to exposure treatment and development treatment.

When the insulating layer 20 is drawn into the gap between the wall surface 132 of the recess 13 of the accommodating substrate 10 and the element 50 by suction as described above, the insulation layer 20 is insulated in the vicinity of the gap of the recess 13 as compared with other parts. It is conceivable that the thickness of the layer 20 becomes smaller. For example, as shown in FIG. 2, when viewed along the normal direction of the first surface 11 of the accommodating substrate 10 in the surface of the insulating layer 20, it overlaps with the gap between the wall surface 132 of the recess 13 and the element 50. A depression 21 may be formed in the portion. The depth of the recess 21 is, for example, 5 μm or more, and is, for example, 10 μm or less. By forming the depression, stress concentration can be avoided.

(Step of forming the conductive layer)
Subsequently, a conductive layer having a first portion 26 located on the insulating layer 20 and a second portion 27 penetrating the insulating layer 20 and electrically connecting the first portion 26 and the terminal 51 of the element 50. Form 25. As a result, the mounting board 1 shown in FIG. 1 can be obtained.

In the present embodiment, as described above, the element 50 is arranged in the recess 13 of the accommodating substrate 10. Therefore, even when the insulating layer 20 covering the element 50 expands or contracts, the range of the positional deviation of the element 50 can be limited to the inside of the recess 13. This makes it possible to prevent the element 50 from being displaced beyond the permissible range in the manufacturing process of the mounting substrate 1.

It is possible to make various changes to the above-described embodiment. Hereinafter, modification examples will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding portions in the above-described embodiment will be used for the portions that can be configured in the same manner as in the above-described embodiment. Duplicate explanations will be omitted. Further, when it is clear that the action and effect obtained in the above-described embodiment can be obtained in the modified example, the description thereof may be omitted.

(First modification)
In the above-described embodiment, an example is shown in which the mounting substrate 1 includes a support substrate 30 that supports the insulating layer 20 from the second surface 12 side. However, the present invention is not limited to this, and as shown in FIG. 6, the mounting substrate 1 may not include the support substrate 30. Such a mounting substrate 1 can be obtained, for example, by further performing a step of manufacturing the mounting substrate 1 shown in FIG. 1 and then separating the support substrate 30 from the second surface 12 of the accommodating substrate 10.

(Second modification)
As shown in FIG. 7, the support substrate 30 that supports the insulating layer 20 from the second surface 12 side may be provided with an electrode 35 that penetrates the support substrate 30. In this case, as shown in FIG. 7, the conductive layer 25 penetrates the insulating layer 20 and the accommodating substrate 10 in addition to the first portion 26 and the second portion 27, and the electrodes 35 of the first portion 26 and the support substrate 30. It may further have a third portion 28 that electrically connects to and. As a result, the terminal 51 of the element 50 and the electrode 35 of the support substrate 30 can be electrically connected. Other electronic components that transmit and receive electrical signals to and from the element 50 are electrically connected to the electrodes 35 of the support substrate 30.

The through hole of the accommodating substrate 10 provided with the third portion 28 of the conductive layer 25 may be formed in the step of forming the recess 13 in the accommodating substrate 10. Alternatively, the through hole of the accommodating substrate 10 may be formed after forming the recess 13 in the accommodating substrate 10.

(Third modification example)
As shown in FIG. 8, the recess 13 of the accommodating substrate 10 is supported by a step portion 133 that supports a surface 52 of the surface of the element 50 located on the second surface 12 side of the accommodating substrate 10, and a surface 52 of the element 50. It may have a penetration portion 134 that penetrates the insulating layer 20 between the substrate 30 and the substrate 30. In the example shown in FIG. 8, the step portion 133 is formed by forming a penetrating portion 134 penetrating to the support substrate 30 side in a part of the bottom surface 131 of the recess 13. In this modification, the element 50 has a sensor unit 53 formed on a surface 52 located on the second surface 12 side. For example, the element 50 includes an image pickup element, and the sensor unit 53 is a photodetection unit that detects light.

In this modification, at least a part of the surface 52 of the element 50 does not come into contact with the accommodating substrate 10. In this case, it is preferable to provide the sensor unit 53 on the portion of the surface 52 of the element 50 that does not come into contact with the accommodating substrate 10. As a result, it is possible to prevent the accuracy of the sensor unit 53 from being lowered due to contact with the accommodating substrate 10.

(Fourth modification)
In the above-described embodiment and each modification, an example is shown in which the conductive layer 25 provided on the insulating layer 20 is electrically connected to the terminal 51 of the element 50. In this modification, an example in which the through silicon via 45 of the through electrode substrate 40 located on the first surface 11 side of the accommodating substrate 10 is electrically connected to the terminal 51 of the element 50 will be described.

FIG. 9 is a cross-sectional view showing a mounting board 1 according to this modification. As shown in FIG. 9, the mounting substrate 1 includes a housing substrate 10, an element 50, an insulating layer 20, and a through silicon via substrate 40.

The through electrode substrate 40 has a substrate 41 located on the first surface 11 side of the accommodating substrate 10, and a through electrode 45 that penetrates the substrate 41 and protrudes from the surface of the substrate 41 toward the accommodating substrate 10. As shown in FIG. 9, the through electrode 45 penetrates the insulating layer 20 so as to be electrically connected to the terminal 51 of the element 50. In the example shown in FIG. 9, the tip of the conductive layer 25 is in contact with the terminal 51 of the element 50.

The substrate 41 contains an inorganic material having a certain insulating property. For example, the substrate 41 is a glass substrate, a quartz substrate, a sapphire substrate, a resin substrate, a silicon substrate, a silicon carbide substrate, an alumina (Al ₂ O ₃ ) substrate, an aluminum nitride (AlN) substrate, and zirconia oxide, similarly to the support substrate 30. (ZrO ₂ ) substrate, lithium niobate substrate, tantalum niobate substrate, etc., or a laminate of these substrates. The support substrate 30 may partially include a substrate made of a conductive material such as an aluminum substrate or a stainless steel substrate. Examples of the glass used in the substrate 41 include non-alkali glass as in the case of the support substrate 30. The thickness of the substrate 41 is, for example, 0.05 mm or more, and is, for example, 0.5 mm or less.

As long as the through electrode 45 has conductivity, the configuration of the through electrode 45 is not particularly limited. For example, the through silicon via 45 may be composed of a single conductive layer or may be composed of a plurality of conductive layers, similarly to the above-mentioned conductive layer 25. As the material of the through electrode 45, the same metal material as the conductive layer 25 can be used.

Hereinafter, an example of the manufacturing method of the mounting substrate 1 shown in FIG. 9 will be described with reference to FIG.

First, as in the case of the above-described embodiment, the accommodating substrate 10 provided with the recess 13 is formed on the support substrate 30, the element 50 is arranged in the recess 13, and the element 50 is covered with the insulating layer 20. As the insulating layer 20, for example, an adhesive can be used, and specifically, a polyimide resin, an epoxy resin, an acrylic resin, or the like can be used. Further, as shown in FIG. 10, a through electrode substrate 40 having a through electrode 45 protruding toward the accommodating substrate 10 is prepared. Subsequently, the through electrode substrate 40 is arranged on the insulating layer 20 so that the through electrode 45 of the through electrode substrate 40 comes into contact with the terminal 51 of the element 50. For example, the through silicon via 40 is pressed toward the insulating layer 20 so that the through silicon via 45 of the through electrode substrate 40 penetrates the insulating layer 20 and comes into contact with the terminal 51 of the element 50. In this way, the mounting board 1 shown in FIG. 9 can be obtained.

Although some modifications to the above-described embodiments have been described, it is naturally possible to apply a plurality of modifications in combination as appropriate.

1 Mounting board 10 Housing board 11 First surface 12 Second surface 13 Recessed 131 Bottom surface 132 Wall surface 133 Stepped part 134 Penetrating part 20 Insulation layer 21 Depression 25 Conductive layer 26 First part 27 Second part 28 Third part 30 Support board 35 Electrode 40 Penetrating electrode board 41 Board 45 Penetrating electrode 50 Element 51 Terminal 53 Sensor unit

Claims (11)

An accommodating substrate including a first surface and a second surface located on the opposite side of the first surface, a recess provided on the first surface side, and an organic material.
An element located in the recess of the accommodating substrate and having a terminal,
An insulating layer that at least partially covers the accommodating substrate and the element on the first surface side and is at least partially located in the gap between the wall surface of the recess of the accommodating substrate and the element.
A conductive layer having a first portion located on the insulating layer and a second portion penetrating the insulating layer and electrically connecting the first portion and the terminal of the element.
A support substrate located on the second surface side of the accommodating substrate and having an inorganic material,
With an electrode penetrating the support substrate ,
The conductive layer is a mounting substrate further comprising a third portion that penetrates the insulating layer and the accommodating substrate and electrically connects the first portion and the electrodes of the support substrate. The supporting substrate has a glass, mounting board according to claim 1. The recess of the accommodating substrate is a step portion that supports a surface of the element that is located on the second surface side of the accommodating substrate, and the accommodating substrate between the surface of the element and the supporting substrate. The mounting substrate according to claim 1 or 2 , wherein the mounting substrate has a penetrating portion penetrating the same. The mounting substrate according to claim 3 , wherein the sensor unit is formed on a surface of the element surface located on the second surface side of the accommodating substrate. A recess is formed in a portion of the surface of the insulating layer that overlaps with the gap between the wall surface of the recess and the element when viewed along the normal direction of the first surface of the accommodation substrate. The mounting board according to any one of claims 1 to 4. The mounting substrate according to any one of claims 1 to 5 , wherein the organic material of the housing substrate contains a polyimide resin, an epoxy resin, a polyphenylene ether resin, or a fluorine resin. The mounting substrate according to any one of claims 1 to 6 , wherein the material constituting the insulating layer contains a polyimide resin, an epoxy resin, or an acrylic resin. The process of preparing a support substrate with an inorganic material,
An accommodating substrate that includes a first surface located on the side far from the support substrate and a second surface located on the support substrate side, has a recess on the first surface side, and has an organic material is placed on the support substrate. And the process of forming
A step of arranging an element having a terminal in the recess of the accommodating substrate,
Forming an insulating layer that covers at least a part of the accommodating substrate and the element on the first surface side and at least partially forms an insulating layer located in a gap between the wall surface of the recess of the accommodating substrate and the element. Process and
A conductive layer forming a conductive layer having a first portion located on the insulating layer and a second portion penetrating the insulating layer and electrically connecting the first portion and the terminal of the element. The formation process and
And separating the supporting substrate from the receiving substrate, Bei El a method of implementation substrate. The process of preparing a support substrate with an inorganic material,
An accommodating substrate that includes a first surface located on the side far from the support substrate and a second surface located on the support substrate side, has a recess on the first surface side, and has an organic material is placed on the support substrate. And the process of forming
A step of arranging an element having a terminal in the recess of the accommodating substrate,
Forming an insulating layer that covers at least a part of the accommodating substrate and the element on the first surface side and at least partially forms an insulating layer located in a gap between the wall surface of the recess of the accommodating substrate and the element. Process and
A conductive layer forming a conductive layer having a first portion located on the insulating layer and a second portion penetrating the insulating layer and electrically connecting the first portion and the terminal of the element. With a forming process,
The support substrate is provided with an electrode that penetrates the support substrate.
The conductive layer forming step, the insulating layer and through said housing substrate, comprising the step of forming a third portion for electrically connecting the electrode of the support substrate and the first portion, of the implementation substrate Production method. The method for manufacturing a mounting substrate according to claim 8 or 9 , wherein the supporting substrate has glass. The mounting substrate according to any one of claims 8 to 10 , wherein the insulating layer forming step includes a step of sucking the insulating layer into a gap between the wall surface of the recess of the accommodating substrate and the element. Production method.

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