JP2023098509A - Liquid discharge head and recording device - Google Patents

Abstract

To increase connection reliability between a discharge member and a flexible substrate.SOLUTION: A liquid discharge head includes a discharge member, a flexible substrate, and a relay substrate. The discharge member includes a plurality of nozzles for discharging a liquid, a plurality of elements for discharging the liquid from the plurality of nozzles, and a plurality of terminals electrically connected to the plurality of elements respectively. The flexible substrate includes a plurality of signal lines corresponding to the plurality of terminals. The relay substrate connects the discharge member and the flexible substrate electrically. The relay substrate includes a plurality of first pads, a plurality of second pads, and a plurality of wiring lines. The plurality of first pads are joined to the plurality of terminals of the discharge member. The plurality of second pads are joined to the plurality of signal lines of the flexible substrate. The plurality of wiring lines connect the plurality of first pads and the plurality of second pads. An area of each of the plurality of second pads is larger than an area of each of the plurality of first pads.SELECTED DRAWING: Figure 6

Description

The disclosed embodiments relate to a liquid ejection head and a printing apparatus.

2. Description of the Related Art Inkjet printers and inkjet plotters using an inkjet recording method are known as printing apparatuses. Such an inkjet printing apparatus is equipped with a liquid ejection head for ejecting liquid.

In such a liquid ejection head, for example, a plurality of individual electrodes provided on an ejection member for ejecting a liquid are joined to a plurality of signal lines of a flexible flexible substrate by an anisotropically conductive joining material, thereby ejecting the liquid. The member and the flexible substrate are electrically connected.

JP-A-2005-212238

However, the conventional liquid ejection head has room for further improvement in terms of improving connection reliability between the ejection member and the flexible substrate.

One aspect of the embodiments has been made in view of the above, and an object thereof is to provide a liquid ejection head and a recording apparatus capable of improving connection reliability between an ejection member and a flexible substrate. .

A liquid ejection head according to one aspect of an embodiment includes an ejection member, a flexible substrate, and a relay substrate. The ejection member has a plurality of nozzles for ejecting liquid, a plurality of elements for ejecting liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements. The flexible substrate has multiple signal lines corresponding to multiple terminals. The relay substrate electrically connects the ejection member and the flexible substrate. The relay board has a plurality of first pads, a plurality of second pads, and a plurality of wirings. A plurality of first pads are joined to a plurality of terminals of the ejection member. The plurality of second pads are joined to the plurality of signal lines of the flexible substrate. The plurality of wirings connect the plurality of first pads and the plurality of second pads. The area of each of the plurality of second pads is larger than the area of each of the plurality of first pads.

According to one aspect of the embodiment, it is possible to improve connection reliability between the ejection member and the flexible substrate.

FIG. 1 is a front view schematically showing a schematic front of the printer according to the embodiment. FIG. 2 is a plan view schematically showing a schematic plane of the printer according to the embodiment. FIG. 3 is a schematic side view showing the internal configuration of the liquid ejection head according to the embodiment. FIG. 4 is a schematic diagram showing a side cross section of an ejection member and a support substrate according to the embodiment. FIG. 5 is a schematic side view showing the configuration of the ejection member, relay substrate, and flexible substrate according to the embodiment. FIG. 6 is a schematic plan view showing an example of the configuration of a connecting portion between a relay board and a flexible board according to the embodiment. FIG. 7 is a schematic plan view showing another example of the configuration of the connection portion between the relay board and the flexible board according to the embodiment. FIG. 8 is a schematic side view showing configurations of an ejection member, a relay substrate, and a flexible substrate according to Modification 1. FIG. FIG. 9 is a schematic side view showing configurations of a discharge member, a relay substrate, and a flexible substrate according to Modification 2. FIG. FIG. 10 is a schematic side view showing configurations of a discharge member, a relay substrate, and a flexible substrate according to Modification 3. FIG. 11A and 11B are schematic side views showing configurations of a discharge member, a relay substrate, and a flexible substrate according to Modification 4. FIG. FIG. 12 is a schematic side view showing the internal configuration of a liquid ejection head according to Modification 5. As shown in FIG. FIG. 13 is a schematic side view showing the internal configuration of a liquid ejection head according to Modification 6. As shown in FIG. FIG. 14 is a schematic side view showing the internal configuration of a liquid ejection head according to Modification 7. As shown in FIG. FIG. 15 is a schematic plan view showing an example of the arrangement position of the relay board.

Hereinafter, embodiments of a liquid ejection head and a recording apparatus disclosed in the present application will be described with reference to the accompanying drawings. It should be noted that the present disclosure is not limited by the embodiments shown below. Also, it should be noted that the drawings are schematic, and the relationship of dimensions of each element, the ratio of each element, and the like may differ from reality. Furthermore, even between the drawings, there are cases where portions having different dimensional relationships and ratios are included.

Further, in the embodiments described below, expressions such as "constant", "perpendicular", "perpendicular" or "parallel" may be used, but these expressions are strictly "constant", "perpendicular", " It does not have to be "perpendicular" or "parallel". That is, each of the expressions described above allows deviations in, for example, manufacturing accuracy and installation accuracy.

Further, each embodiment can be appropriately combined within a range that does not contradict the processing contents. Also, in each of the following embodiments, the same parts are denoted by the same reference numerals, and overlapping descriptions are omitted.

<Printer configuration>
First, an outline of a printer 1, which is an example of a recording apparatus according to an embodiment, will be described with reference to FIGS. 1 and 2. FIG. FIG. 1 is a front view schematically showing a schematic front of the printer 1 according to the embodiment. FIG. 2 is a plan view schematically showing a schematic plane of the printer 1 according to the embodiment. The printer 1 according to the embodiment is, for example, a color inkjet printer.

As shown in FIG. 1, the printer 1 includes a paper feed roller 2, a guide roller 3, a coating machine 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, and a plurality of liquid ejection heads. 8 , a conveying roller 9 , a dryer 10 , a conveying roller 11 , a sensor section 12 , and a collection roller 13 . The transport roller 6 is an example of a transport section.

Further, the printer 1 has a control section 14 that controls each section of the printer 1 . The control unit 14 controls the paper feeding roller 2, the guide roller 3, the coater 4, the head case 5, the plurality of conveying rollers 6, the plurality of frames 7, the plurality of liquid ejection heads 8, the conveying roller 9, the dryer 10, and the conveying roller. 11, the sensor unit 12 and the operation of the collection roller 13 are controlled.

The printer 1 records images and characters on the printing paper P by causing droplets to land on the printing paper P. FIG. The printing paper P is an example of a recording medium. The printing paper P is wound around the paper feed roller 2 before use. The printer 1 conveys the printing paper P from the paper supply roller 2 to the inside of the head case 5 via the guide roller 3 and the coater 4 .

The coater 4 evenly coats the printing paper P with the coating agent. As a result, since the printing paper P can be surface-treated, the printing quality of the printer 1 can be improved.

The head case 5 accommodates a plurality of transport rollers 6 , a plurality of frames 7 and a plurality of liquid ejection heads 8 . Inside the head case 5, a space is formed that is isolated from the outside, except for a part that is connected to the outside, such as a portion where the printing paper P enters and exits.

At least one of the control factors such as temperature, humidity, and atmospheric pressure of the internal space of the head case 5 is controlled by the control unit 14 as necessary. The transport roller 6 transports the printing paper P to the vicinity of the liquid ejection head 8 inside the head case 5 .

The frame 7 is a rectangular flat plate and is positioned close to above the printing paper P conveyed by the conveying rollers 6 . Further, as shown in FIG. 2, the frame 7 is positioned so that its longitudinal direction is perpendicular to the direction in which the printing paper P is conveyed. A plurality of (for example, four) frames 7 are positioned inside the head case 5 at predetermined intervals along the direction in which the printing paper P is transported.

Liquid, for example, ink is supplied to the liquid ejection head 8 from a liquid tank (not shown). The liquid ejection head 8 ejects liquid supplied from a liquid tank.

The control unit 14 controls the liquid ejection head 8 based on data such as images and characters to eject the liquid onto the printing paper P. FIG. The distance between the liquid ejection head 8 and the printing paper P is, for example, approximately 0.5 to 20 mm.

The liquid ejection head 8 is fixed to the frame 7 . The liquid ejection head 8 is positioned so that its longitudinal direction is orthogonal to the direction in which the printing paper P is conveyed.

That is, the printer 1 according to the embodiment is a so-called line printer in which the liquid ejection head 8 is fixed inside the printer 1 . Note that the printer 1 according to the embodiment is not limited to a line printer, and may be a so-called serial printer.

A serial printer alternately performs recording while moving the liquid ejection head 8 back and forth in a direction intersecting the conveying direction of the printing paper P, for example, in a direction substantially perpendicular to the conveying direction, and conveying the printing paper P. It is a printer of the method to perform on.

As shown in FIG. 2, a plurality of (for example, five) liquid ejection heads 8 are fixed to one frame 7 . FIG. 2 shows an example in which three liquid ejection heads 8 are positioned in the forward direction of the printing paper P and two liquid ejection heads 8 are positioned in the rearward direction. The liquid ejection heads 8 are positioned so that their centers do not overlap.

A plurality of liquid ejection heads 8 positioned on one frame 7 constitute a head group 8A. The four head groups 8A are positioned along the direction in which the printing paper P is transported. Four color inks are supplied to the liquid ejection heads 8 belonging to the same head group 8A. Thus, the printer 1 can print with four color inks using the four head groups 8A.

The colors of ink ejected from each liquid ejection head 8 are, for example, magenta (M), yellow (Y), cyan (C), and black (K). The control unit 14 can print a color image on the printing paper P by controlling the liquid ejection heads 8 to eject a plurality of colors of ink onto the printing paper P. FIG.

In order to treat the surface of the printing paper P, a coating agent may be ejected onto the printing paper P from the liquid ejection head 8 .

Further, the number of liquid ejection heads 8 included in one head group 8A and the number of head groups 8A mounted on the printer 1 can be appropriately changed according to the target to be printed and printing conditions. For example, if one liquid ejection head 8 is used to print a printable range, the number of liquid ejection heads 8 mounted in the printer 1 may be one.

The print paper P printed inside the head case 5 is transported outside the head case 5 by transport rollers 9 and passes through the inside of the dryer 10 . The dryer 10 dries the printing paper P that has been printed. The printing paper P dried by the dryer 10 is conveyed by the conveying roller 11 and collected by the collecting roller 13 .

In the printer 1 , by drying the printing paper P with the dryer 10 , it is possible to suppress adhesion of the printing papers P that are wound together in the collecting roller 13 and prevent undried liquid from rubbing against each other. can.

The sensor unit 12 is composed of a position sensor, a speed sensor, a temperature sensor, and the like. The control unit 14 can determine the state of each unit of the printer 1 and control each unit of the printer 1 based on the information from the sensor unit 12 .

In the printer 1 described so far, the printing paper P is used as the printing object (that is, the recording medium). may be

Further, the printer 1 may convey the printing paper P on a conveyor belt instead of directly conveying it. By using the conveyor belt, the printer 1 can print on sheets, cut cloth, wood, tiles, and the like.

Further, the printer 1 may print a wiring pattern of an electronic device by ejecting liquid containing conductive particles from the liquid ejection head 8 . Further, the printer 1 may eject a predetermined amount of liquid chemical agent or liquid containing the chemical agent from the liquid ejection head 8 toward a reaction container or the like to produce a chemical agent.

The printer 1 may also include a cleaning section that cleans the liquid ejection head 8 . The cleaning section cleans the liquid ejection head 8 by, for example, a wiping process or a capping process.

The wiping process is, for example, a process of removing the liquid adhering to the liquid ejection head 8 by wiping the surface of the portion where the liquid is to be ejected with a flexible wiper.

Also, the capping process is performed, for example, as follows. First, a cap is placed so as to cover a portion to be ejected liquid, for example, the second surface 20b (see FIG. 3) of the ejection member 20 (this is called capping). Thereby, a substantially closed space is formed between the second surface 20b and the cap.

Next, liquid ejection is repeated in such a closed space. As a result, it is possible to remove the liquid, the foreign matter, and the like, which are clogged in the discharge hole (nozzle) 163 (see FIG. 4) and have a viscosity higher than that in the standard state.

<Structure of Liquid Ejection Head>
Next, the configuration of the liquid ejection head 8 according to the embodiment will be described with reference to FIG. FIG. 3 is a schematic side view showing the internal configuration of the liquid ejection head 8 according to the embodiment. FIG. 3 shows a side surface perpendicular to the longitudinal direction of the liquid ejection head 8 .

The liquid ejection head 8 includes an ejection member 20, a support substrate 30, a relay substrate 40, a flexible substrate 50, a drive IC 60, and a liquid supply member (not shown). The ejection member 20, the support substrate 30, the relay substrate 40, the flexible substrate 50, the drive IC 60, and the liquid supply member are housed in a housing (not shown).

In the following description, for the sake of convenience, the direction in which the ejection member 20 is provided in the liquid ejection head 8 is referred to as "downward", and the direction in which the support substrate 30 is provided with respect to the ejection member 20 is referred to as "upper". There is

The discharge member 20 has a substantially flat plate shape, and has a first surface 20a and a second surface 20b located on the opposite side of the first surface 20a. The first surface 20a has an opening (not shown), and liquid is supplied from the support substrate 30 to the interior of the ejection member 20 through the opening.

A plurality of ejection holes 22 (see FIG. 4) for ejecting liquid onto the printing paper P are positioned on the second surface 20b. The ejection member 20 has therein a channel for flowing the liquid from the first surface 20a to the second surface 20b.

The ejection member 20 has a plurality of displacement elements 23 (see FIG. 4). A plurality of displacement elements 23 are positioned on the first surface 20 a of the ejection member 20 .

The support substrate 30 is positioned on the first surface 20 a of the ejection member 20 . The support substrate 30 has a channel inside and supplies the liquid supplied from the liquid supply member to the ejection member 20 . Further, the support substrate 30 has a predetermined thickness greater than that of the ejection member 20 and has a function of reinforcing the ejection member 20 .

A liquid supply member is positioned on the support substrate 30 . The liquid supply member is provided with openings (not shown) at both ends in the main scanning direction, which is parallel to the printing paper P and perpendicular to the sub-scanning direction, which is the direction in which the printing paper P is conveyed. The liquid supply member has a channel inside and is supplied with liquid from the outside through an opening. The liquid supply member supplies liquid to the support substrate 30 . Also, the liquid supply member stores the liquid to be supplied to the support substrate 30 .

The relay substrate 40 is positioned at each of two positions on the first surface 20 a of the ejection member 20 sandwiching the support substrate 30 . One end of the relay board 40 is electrically connected to the ejection member 20 , and the other end of the relay board 40 is electrically connected to the flexible board 50 . The relay board 40 has a function of relaying the signal transmitted by the flexible board 50 to the ejection member 20 . The relay board 40 has a lower height than the support board 30 from the first surface 20 a of the ejection member 20 . As a result, when the liquid supply member is installed on the support substrate 30, it is possible to reduce the possibility of interference between the relay substrate 40 and the liquid supply member, thereby improving the degree of freedom in the layout of the liquid supply member. can be done.

The flexible substrate 50 is a wiring substrate having flexibility, and transmits signals sent from the outside to the relay substrate 40 . One end of the flexible board 50 is electrically connected to the relay board 40, and the other end of the flexible board 50 is pulled out above the support board 30 and electrically connected to a wiring board (not shown). ing.

The drive IC 60 is mounted on the flexible substrate 50 . The drive IC 60 drives each displacement element 23 in the ejection member 20 based on drive signals sent from the control section 14 (see FIG. 1). Thereby, the driving IC 60 can control driving of the liquid ejection head 8 .

3 shows an example of the configuration of the liquid ejection head 8, and may further include members other than the members shown in FIG.

<Structure of discharge member and support substrate>
Next, configurations of the ejection member 20 and the support substrate 30 according to the embodiment will be described with reference to FIG. FIG. 4 is a schematic diagram showing a side cross section of the ejection member 20 and the support substrate 30 according to the embodiment.

As shown in FIG. 4 , the discharge member 20 has a plurality of pressure chambers 21 , a plurality of discharge holes 22 , a plurality of displacement elements 23 and a plurality of terminals 24 .

The plurality of pressurizing chambers 21 are connected to the plurality of flow paths 31 in the support substrate 30, respectively. The plurality of discharge holes 22 are connected to the plurality of pressurization chambers 21 respectively. The plurality of displacement elements 23 are positioned on the first surface 20 a of the discharge member 20 at a plurality of positions corresponding to the plurality of pressure chambers 21 respectively.

The plurality of terminals 24 are located on the first surface 20 a of the ejection member 20 and at positions sandwiching the support substrate 30 . The plurality of terminals 24 are electrically connected to each of the plurality of displacement elements 23 via electrodes and wires (not shown). A plurality of signal lines on the flexible substrate 50 are electrically connected to the plurality of terminals 24 . When a signal transmitted by the flexible substrate 50 is input from the terminal 24 to the displacement element 23, the displacement element 23 is displaced.

The support substrate 30 is positioned on the first surface 20 a of the ejection member 20 . The support substrate 30 has a plurality of spaces for accommodating the plurality of displacement elements 23 on its lower surface. The support substrate 30 has a plurality of channels 31 inside. The plurality of flow paths 31 are connected to the plurality of pressurization chambers 21 respectively. A plurality of flow paths 31 are opened on the upper surface of the support substrate 30 . A liquid supply member (not shown) is positioned on the upper surface of the support substrate 30 . A plurality of channels 31 are connected to the liquid supply member.

Liquid is supplied from the liquid supply member to the inside of the ejection member 20 through the flow path 31 , and the corresponding displacement element 23 is displaced. Dispensed. That is, the plurality of displacement elements 23 function as a plurality of elements for ejecting liquid from the plurality of ejection holes 22 .

As shown in FIG. 4, the ejection member 20 has a laminated structure in which a nozzle plate 20A and an actuator plate 20B are laminated. A plurality of ejection holes 22 are provided in the nozzle plate 20A. A plurality of pressure chambers 21, a plurality of displacement elements 23, and a plurality of terminals 24 are provided in the actuator plate 20B. By aligning and stacking the nozzle plate 20A and the actuator plate 20B, the plurality of pressure chambers 21 and the plurality of discharge holes 22 communicate with each other to form the discharge member 20 .

<Connection Mode of Ejection Member, Intermediate Board and Flexible Board>
Next, with reference to FIGS. 5 and 6, connection modes of the ejection member 20, the relay board 40 and the flexible board 50 will be described. FIG. 5 is a schematic side view showing configurations of the ejection member 20, the relay substrate 40, and the flexible substrate 50 according to the embodiment. FIG. 6 is a schematic plan view showing an example of the configuration of the connecting portion between the relay substrate 40 and the flexible substrate 50 according to the embodiment. FIG. 6 shows the lower surface of the relay substrate 40 (that is, the surface facing the ejection member 20).

As shown in FIG. 5, a plurality of terminals 24 (see FIG. 4) are positioned on the first surface 20a of the ejection member 20, and a plurality of signals corresponding to the plurality of terminals 24 are provided on the surface of the flexible substrate 50. Line 51 (see FIG. 6) is located. One end of the relay board 40 is connected to multiple terminals 24 of the discharge member 20 , and the other end of the relay board 40 is connected to multiple signal lines 51 of the flexible board 50 . That is, a plurality of first pads 41 (see FIG. 6) are formed on one end of the relay substrate 40, and the plurality of first pads 41 and the plurality of terminals 24 of the discharge member 20 are connected by a conductive bonding material 401. joined by A plurality of second pads 42 (see FIG. 6) are formed on the other end of the relay substrate 40, and the plurality of second pads 42 and the plurality of signal lines 51 of the flexible substrate 50 are electrically connected. It is joined by material 402 . The plurality of first pads 41 and the plurality of second pads 42 are connected by a plurality of wirings 43, respectively. As the conductive bonding materials 401 and 402, for example, an anisotropic conductive film (ACF) can be used.

As shown in FIG. 6 , in the relay substrate 40 , the area of each of the plurality of second pads 42 is larger than the area of each of the plurality of first pads 41 . In this way, by increasing the area of each of the plurality of second pads 42 that are joined to the plurality of signal lines 51 of the flexible substrate 50, connection failure between the flexible substrate 50 and the relay substrate 40 can be suppressed. . That is, when connecting the flexible board 50 to the relay board 40, mechanical load is applied to the signal line 51 from the second pad 42 as the flexible board 50 is bent. , the mechanical load on the signal line 51 can be reduced. Further, when the flexible substrate 50 is connected to the relay substrate 40 , the conductive bonding material 402 is melted by heating, which causes thermal expansion of the flexible substrate 50 , causing displacement of the signal line 51 from the second pad 42 . easily occur. Even in such a case, by increasing the area of the second pad 42, electrical connection between the second pad 42 and the signal line 51 can be secured even if the signal line 51 is misaligned. can. Since connection failure between the flexible substrate 50 and the relay substrate 40 can be suppressed, the flexible substrate 50 and the ejection member 20 can be stably connected by the relay substrate 40 . As a result, according to the liquid ejection head 8 according to the embodiment, connection reliability between the ejection member 20 and the flexible substrate 50 can be improved. The areas of the first pads 41 and the second pads 42 are planar view areas of the relay board 40 .

Also, the plurality of second pads 42 are arranged along a direction from one end of the relay substrate 40 on the ejection member 20 side to the other end (hereinafter referred to as a "first direction") (here, two pads). ) so as not to be adjacent to each other in the second direction intersecting the first direction. As a result, the size of the second pads 42 along the second direction can be increased within a range in which the second pads 42 do not interfere with each other, so the area of the second pads 42 can be increased.

Moreover, as shown in FIGS. 5 and 6 , the plurality of first pads 41 , the plurality of second pads 42 and the plurality of wirings 43 are located on the lower surface of the relay substrate 40 facing the ejection member 20 . In this way, the plurality of first pads 41, the plurality of second pads 42 and the plurality of wirings 43 are positioned on the same lower surface of the relay substrate 40, thereby minimizing the length of the plurality of wirings 43. , and the electrical resistance in the relay substrate 40 can be reduced.

FIG. 6 shows an example in which the areas of the second pads 42 are increased by locating the plurality of second pads 42 so as not to be adjacent to each other. The structure for doing is not limited to this. For example, as shown in FIG. 7, the area of the second pads 42 may be increased by changing the pitch of the wirings 43 on the relay board 40 . FIG. 7 is a schematic plan view showing another example of the configuration of the connection portion between the relay board 40 and the flexible board 50 according to the embodiment. The plurality of wirings 43 shown in FIG. 7 are pitch-converted on the relay substrate 40. The pitch (interval) between the wirings 43 is small on the side of the plurality of first pads 41, but the pitch (space) between the wirings 43 on the side of the plurality of second pads 42 is small. interval) is increased. As a result, the size of the second pads 42 along the second direction can be increased within a range in which the second pads 42 do not interfere with each other, so the area of the second pads 42 can be increased.

<Method for Manufacturing Liquid Ejection Head>
Next, a method for manufacturing the liquid ejection head 8 according to the embodiment will be described. First, the support substrate 30 is placed on the first surface 20 a of the ejection member 20 . Subsequently, the nozzle plate 20A and the actuator plate 20B are aligned and laminated to form a laminated structure of the ejection member 20. As shown in FIG. Subsequently, the plurality of first pads 41 of the relay board 40 and the plurality of terminals 24 of the ejection member 20 are joined with the conductive bonding material 401 to electrically connect the relay board 40 and the ejection member 20 . Subsequently, the plurality of second pads 42 of the relay substrate 40 and the plurality of signal lines 51 of the flexible substrate 50 are joined with the conductive bonding material 402 to electrically connect the relay substrate 40 and the flexible substrate 50. . After that, the liquid supply member is placed on the support substrate 30, and members such as the ejection member 20 (and other members as necessary) are accommodated in the housing. Thus, the liquid ejection head 8 according to the embodiment is obtained.

<various modifications>
FIG. 8 is a schematic side view showing configurations of the ejection member 20, the relay board 40, and the flexible board 50 according to Modification 1. As shown in FIG. The flexible substrate 50 shown in FIG. 8 does not have the driving IC 60 mounted thereon, and the driving IC 60 is located on the lower surface of the relay substrate 40 (that is, the surface facing the ejection member 20). By locating the drive IC 60 on the lower surface of the relay substrate 40 in this way, the length of the wiring between the drive IC 60 and the ejection member 20 can be shortened. can be reduced. Moreover, since the possibility of disconnection between the drive IC 60 and the ejection member 20 can be reduced, the connection reliability between the drive IC 60 and the ejection member 20 can be improved.

In FIG. 8, a heat dissipation member may be provided on the upper surface of the relay substrate 40 on the side opposite to the drive IC 60 . Thereby, the heat dissipation of the driving IC 60 can be improved. A radiation fin, a Peltier element, or the like may be used as the heat radiation member. Also, the drive IC 60 may be covered with a protective cover. This can prevent the liquid ejected from the ejection member 20 from adhering to the drive IC 60 .

FIG. 9 is a schematic side view showing configurations of the ejection member 20, the relay substrate 40, and the flexible substrate 50 according to Modification 2. As shown in FIG. In the relay board 40 shown in FIG. 9 , the plurality of first pads 41 are positioned on the lower surface of the relay board 40 facing the ejection member 20 . Also, the plurality of second pads 42 are located on the upper surface of the relay board. Moreover, the plurality of wirings 43 are routed to the upper and lower surfaces of the relay board 40 via the side surfaces of the relay board 40 . In this manner, the plurality of first pads 41 and the plurality of second pads 42 are positioned on the lower surface and the upper surface of the relay substrate 40 , thereby electrically connecting the ejection member 20 and the flexible substrate 50 on different surfaces of the relay substrate 40 . can be connected. As a result, even when the width from one end of the relay substrate 40 to the other end on the ejection member 20 side is reduced, the interference between the ejection member 20 and the flexible substrate 50 can be avoided. 8 can be made smaller.

In addition, in FIG. 9, the plurality of wirings 43 may be positioned so as to penetrate the lower surface and the upper surface of the relay board 40 . Thereby, the length of the plurality of wirings 43 can be shortened, and the electrical resistance in the relay board 40 can be reduced.

FIG. 10 is a schematic side view showing configurations of the discharge member 20, the relay board 40, and the flexible board 50 according to Modification 3. As shown in FIG. Modification 3 differs from Modification 2 in the structure of the relay board 40 . In the relay board 40 shown in FIG. 10, the plurality of second pads 42 are positioned to overlap the plurality of first pads 41 in plan view. As a result, the width from one end of the relay substrate 40 to the other end on the side of the ejection member 20 can be minimized, and the downsizing of the liquid ejection head 8 can be further promoted.

FIG. 11 is a schematic side view showing configurations of the ejection member 20, the relay board 40, and the flexible board 50 according to Modification 4. As shown in FIG. The flexible substrate 50 shown in FIG. 11 does not have the driving IC 60 mounted thereon, and the driving IC 60 is located on the upper surface of the relay substrate 40 (that is, the surface opposite to the surface facing the ejection member 20). By positioning the drive ICs 60 on the upper surface of the relay substrate 40 in this manner, the drive ICs 60 can be protected from the liquid ejected from the ejection member 20 .

FIG. 12 is a schematic side view showing the internal configuration of the liquid ejection head 8 according to Modification 5. As shown in FIG. The liquid ejection head 8 shown in FIG. 12 differs from the liquid ejection head 8 shown in FIG. 3 in the structure of the relay substrate 40 . As shown in FIG. 12 , the relay substrate 40 and the support substrate 30 are positioned on the ejection member 20 , and the relay substrate 40 is higher than the support substrate 30 from the first surface 20 a of the ejection member 20 . . In other words, the thickness of the relay substrate 40 is thicker than the thickness of the support substrate 30 . By increasing the thickness of the relay board 40 in this way, the strength of the relay board 40 can be improved. Further, when the liquid supply member is installed on the support substrate 30, the relay substrate 40 can be used as a cushioning material that relieves the load applied to the support substrate 30 from the liquid supply member.

FIG. 13 is a schematic side view showing the internal configuration of the liquid ejection head 8 according to Modification 6. As shown in FIG. The liquid ejection head 8 shown in FIG. 13 differs from the liquid ejection head 8 shown in FIG. 3 in that the relay substrate 40 (see FIG. 6) and the support substrate 30 are integrated. In other words, the relay board 40 and the support board 30 may be made of the same member. In the example of the liquid ejection head 8 according to Modification 6, the support substrate 30 having the function of the relay substrate 40 is positioned above the ejection member 20 . By integrating the relay board 40 and the support board 30 in this manner, the gap between the relay board 40 and the support board 30 is eliminated, and the downsizing of the liquid ejection head 8 can be promoted.

FIG. 14 is a schematic side view showing the internal configuration of a liquid ejection head 8 according to Modification 7. As shown in FIG. The liquid ejection head 8 shown in FIG. 14 differs from the liquid ejection head 8 shown in FIG. 13 in that the drive IC 60 is positioned on the lower surface of the support substrate 30 (that is, the surface facing the ejection member 20). By locating the drive IC 60 on the lower surface of the support substrate 30 in this way, the wiring length between the drive IC 60 and the ejection member 20 can be shortened. can be reduced. Moreover, since the possibility of disconnection between the drive IC 60 and the ejection member 20 can be reduced, the connection reliability between the drive IC 60 and the ejection member 20 can be improved.

In FIG. 14, the drive IC 60 may be positioned on the upper surface of the support substrate 30 (that is, the surface opposite to the surface facing the ejection member 20). By positioning the drive ICs 60 on the upper surface of the support substrate 30 in this manner, the drive ICs 60 can be protected from the liquid ejected from the ejection member 20 .

Further, in FIG. 14, the drive IC 60 may be formed of a low-temperature polysilicon (LTPS) film. Thereby, the drive IC 60 can be miniaturized.

<Other Modifications>
In the above-described embodiment, an example in which the relay board 40 is positioned at each of the two positions on the first surface 20a of the discharge member 20 with the support board 30 interposed therebetween is shown, but the arrangement position of the relay board 40 is not limited to this. For example, as shown in FIG. 15, the relay substrate 40 may be located at a position surrounding the support substrate 30 on the first surface 20a of the ejection member 20. As shown in FIG. That is, the shape of the relay substrate 40 may be a rectangular frame shape surrounding the support substrate 30 on the first surface 20 a of the ejection member 20 . Thereby, the strength of the relay board 40 can be improved. Note that FIG. 15 is a schematic plan view showing an example of the arrangement position of the relay substrate 40. As shown in FIG. FIG. 15 shows the discharge member 20, the support substrate 30, and the relay substrate 40 viewed from the first surface 20a side.

As described above, the liquid ejection head (eg, the liquid ejection head 8) according to the embodiment includes an ejection member (eg, the ejection member 20), a flexible substrate (eg, the flexible substrate 50), and a relay substrate (eg, a relay substrate). substrate 40). The ejection member is electrically connected to a plurality of nozzles (e.g. ejection holes 22) for ejecting liquid, a plurality of elements (e.g. displacement element 23) for ejecting liquid from the plurality of nozzles, and each of the plurality of elements. and a plurality of terminals (eg, terminal 24). The flexible substrate has a plurality of signal lines (for example, signal lines 51) corresponding to a plurality of terminals. The relay substrate electrically connects the ejection member and the flexible substrate. The relay board has a plurality of first pads (eg, first pads 41), a plurality of second pads (eg, second pads 42), and a plurality of wirings (eg, wirings 43). A plurality of first pads are joined to a plurality of terminals of the ejection member. The plurality of second pads are joined to the plurality of signal lines of the flexible substrate. The plurality of wirings connect the plurality of first pads and the plurality of second pads. The area of each of the plurality of second pads is larger than the area of each of the plurality of first pads. As a result, according to the liquid ejection head of the embodiment, it is possible to improve the connection reliability between the ejection member and the flexible substrate.

In addition, the plurality of second pads are arranged in a plurality of regions (for example, region 421) aligned along the first direction from one end of the relay board on the discharge member side to the other end of the relay substrate in second pads intersecting the first direction. They may be positioned so as not to be adjacent to each other in direction. Thus, according to the liquid ejection head according to the embodiment, it is possible to further increase the area of the second pad.

Also, the relay board may have a plurality of wirings with a larger interval between the wirings at the other end connected to the plurality of second pads than at one end connected to the plurality of first pads. Thus, according to the liquid ejection head according to the embodiment, it is possible to further increase the area of the second pad.

Also, the relay substrate may have a first surface (eg, bottom surface) facing the discharge member and a second surface (eg, top surface) located on the opposite side of the first surface. A plurality of first pads, a plurality of second pads and a plurality of wires may be located on the first surface. As a result, according to the liquid ejection head of the embodiment, the length of the plurality of wirings can be minimized, and the electrical resistance in the relay substrate can be reduced.

Further, the liquid ejection head may further include a drive IC (for example, a drive IC 60) that controls driving of the ejection member. A driving IC may be located on the first surface. As a result, the liquid ejection head according to the embodiment can reduce the resistance loss between the drive IC and the ejection member. Also, the connection reliability between the drive IC and the ejection member can be improved.

Also, the relay board may have a first surface facing the ejection member, a second surface located on the opposite side of the first surface, and a side surface connecting the first surface and the second surface. A plurality of first pads may be located on the first surface. A plurality of second pads may be located on the second surface. The plurality of wirings may be routed to the first surface and the second surface via the side surfaces, or may be positioned so as to penetrate the first surface and the second surface. Thus, according to the liquid ejection head of the embodiment, even when the width from one end of the relay substrate to the other end on the ejection member side is reduced, interference between the ejection member and the flexible substrate can be avoided. Therefore, it is possible to promote miniaturization of the liquid ejection head.

Also, the plurality of second pads may be located at positions overlapping the plurality of first pads in plan view. As a result, according to the liquid ejection head of the embodiment, the width from one end of the relay substrate on the side of the ejection member to the other end can be minimized, further promoting miniaturization of the liquid ejection head. can be done.

Further, the liquid ejection head may further include a drive IC (for example, a drive IC 60) that controls driving of the ejection member. A driving IC may be located on the second surface. Thus, according to the liquid ejection head according to the embodiment, it is possible to protect the drive IC from the liquid ejected from the ejection member.

Further, the liquid ejection head further includes a support substrate (for example, support substrate 30) positioned above the ejection member and having a channel (for example, channel 31) through which the liquid supplied to the ejection member flows. good too. Thus, according to the liquid ejection head according to the embodiment, it is possible to supply the liquid to the ejection member while reinforcing the ejection member with the support substrate.

Also, the relay substrate may be positioned above the discharge member. Further, the relay substrate may be lower in height from the ejection member than the support substrate. Thus, according to the liquid ejection head according to the embodiment, when the liquid supply member is installed on the support substrate, it is possible to reduce the possibility of interference between the relay substrate and the liquid supply member. The degree of freedom of layout can be improved.

Also, the relay substrate may be positioned above the discharge member. The relay substrate may be higher than the support substrate from the ejection member. As a result, according to the liquid ejection head according to the embodiment, the strength of the relay substrate can be improved. Further, when the liquid supply member is installed on the support substrate, the relay substrate can be used as a cushioning material that relieves the load applied to the support substrate from the liquid supply member.

Also, the relay board and the support board may be integrated. As a result, according to the liquid ejection head of the embodiment, the gap between the relay substrate and the support substrate is eliminated, and the downsizing of the liquid ejection head can be facilitated.

Also, the support substrate may have a first surface (eg, bottom surface) facing the ejection member, and a second surface (eg, top surface) located on the opposite side of the first surface. The liquid ejection head may further include a driving IC that controls driving of the ejection member. The driving IC may be located on the first side or the second side. As a result, the liquid ejection head according to the embodiment can reduce the resistance loss between the drive IC and the ejection member. Also, the connection reliability between the drive IC and the ejection member can be improved. Also, the driving IC can be protected from the liquid ejected from the ejecting member.

Also, the driving IC may be formed of a low-temperature polysilicon film. Thus, according to the liquid ejection head according to the embodiment, it is possible to reduce the size of the drive IC.

Further effects and modifications can be easily derived by those skilled in the art. Therefore, the broader aspects of the invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various changes may be made without departing from the spirit or scope of the general inventive concept defined by the appended claims and equivalents thereof.

1 Printer 8 Liquid Ejection Head 14 Control Unit 20 Ejection Member 21 Pressure Chamber 22 Ejection Hole 23 Displacement Element 24 Terminal 30 Support Substrate 31 Channel 40 Relay Substrate 41 First Pad 42 Second Pad 43 Wiring 50 Flexible Substrate 51 Signal Line 60 drive IC
421 area

Claims (15)

an ejection member having a plurality of nozzles for ejecting liquid, a plurality of elements for ejecting liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements;
a flexible substrate having a plurality of signal lines corresponding to the plurality of terminals;
a relay substrate that electrically connects the discharge member and the flexible substrate;
The relay board is
a plurality of first pads joined to the plurality of terminals of the ejection member;
a plurality of second pads bonded to the plurality of signal lines of the flexible substrate;
a plurality of wires connecting the plurality of first pads and the plurality of second pads;
The liquid ejection head, wherein the area of each of the plurality of second pads is larger than the area of each of the plurality of first pads. The plurality of second pads are adjacent to each other in a second direction crossing the first direction in a plurality of regions aligned along a first direction from one end of the relay substrate to the other end on the ejection member side. 2. The liquid ejection head according to claim 1, wherein the liquid ejection head is positioned so as not to The relay board is
2. The liquid ejection head according to claim 1, comprising the plurality of wirings having a larger interval between the wirings at the other end connected to the plurality of second pads than at the other end connected to the plurality of first pads. The relay substrate has a first surface facing the discharge member and a second surface located on the opposite side of the first surface,
2. The liquid ejection head according to claim 1, wherein said plurality of first pads, said plurality of second pads and said plurality of wirings are located on said first surface. further comprising a driving IC for controlling driving of the ejection member;
5. The liquid ejection head according to claim 4, wherein said drive IC is located on said first surface. The relay board has a first surface facing the ejection member, a second surface located on the opposite side of the first surface, and a side surface connecting the first surface and the second surface,
The plurality of first pads are located on the first surface,
The plurality of second pads are located on the second surface,
2. The wiring according to claim 1, wherein the plurality of wirings are routed to the first surface and the second surface via the side surfaces, or are located so as to penetrate the first surface and the second surface. A liquid ejection head as described. 7. The liquid ejection head according to claim 6, wherein said plurality of second pads are positioned to overlap said plurality of first pads in plan view. further comprising a driving IC for controlling driving of the ejection member;
7. The liquid ejection head according to claim 6, wherein said drive IC is located on said second surface. 2. The liquid ejection head according to claim 1, further comprising a support substrate located on said ejection member and having therein a flow path through which said liquid supplied to said ejection member flows. The relay substrate is positioned on the ejection member,
10. The liquid ejection head according to claim 9, wherein the relay substrate has a lower height from the ejection member than the support substrate. The relay substrate is positioned on the ejection member,
10. The liquid ejection head according to claim 9, wherein the relay substrate has a higher height from the ejection member than the support substrate. 10. The liquid ejection head according to claim 9, wherein said relay substrate and said support substrate are integrated. The support substrate has a first surface facing the ejection member and a second surface located on the opposite side of the first surface,
further comprising a driving IC for controlling driving of the ejection member;
13. The liquid ejection head according to claim 12, wherein said drive IC is located on said first surface or said second surface. 14. The liquid ejection head according to claim 13, wherein said drive IC is formed of a low-temperature polysilicon (LTPS) film. A recording apparatus comprising the liquid ejection head according to any one of claims 1 to 14.

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