JP2019018406A - Liquid jet head and liquid jet device - Google Patents

Abstract

To provide a liquid jet head which can inhibit a paste applied to a support member from coming around to a circuit board, and to provide a liquid jet device.SOLUTION: An inkjet head includes: a circuit board 53 which is electrically connected to a head chip and is formed with a plating lead hole 53k; a support plate 80 having a first surface 80a supporting the circuit board 53 and a second surface 80b to which a paste 85 can be applied, the support plate 80 formed with a relief hole 80k overlapping with the plating lead hole 53k; and an insulating intermediate member 90 disposed between the circuit board 53 and the support plate 80 and covering the relief hole 80k.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus.

2. Description of the Related Art Conventionally, an ink jet printer (liquid ejecting apparatus) provided with an ink jet head (liquid ejecting head) as an apparatus for ejecting droplets of ink onto a recording medium such as recording paper and recording images and characters on the recording medium. There is.
For example, Patent Document 1 includes a head chip that ejects ink, an FPC connected to the head chip, a metal support plate that supports the FPC, and a lid that is fixed to the main body base together with the support plate. A configuration provided is disclosed. A driver or the like for driving the head chip is mounted on the FPC.
On the other hand, in order to transmit heat from the driver to the main body base via the FPC, there is a configuration in which a paste having thermal conductivity is interposed between the support plate and the lid.
On the other hand, gold plating by electroplating may be performed as a surface treatment of FPC. A through hole for cutting an electrode for plating (hereinafter also referred to as “plating lead”) is formed in the FPC in terms of the plating method. In order to prevent the plating lead exposed on the inner surface of the through hole from short-circuiting with the support plate, a clearance hole larger than the through hole is formed at a position overlapping the through hole of the FPC in the support plate.

JP 2016-120616 A

  However, when applying the paste to the support member (support plate), the paste may wrap around the circuit board through the escape hole of the support member and the through hole of the circuit board (FPC). In particular, as the density of the circuit board increases with the miniaturization of the ink jet head, it becomes difficult to apply the paste by avoiding the through holes, so the paste applied to the support member may wrap around the circuit board. Becomes higher.

  SUMMARY An advantage of some aspects of the invention is to provide a liquid ejecting head and a liquid ejecting apparatus capable of suppressing the paste applied to the support member from flowing around the circuit board. Objective.

  A liquid ejecting head according to one embodiment of the present invention is electrically connected to a head chip, and includes a circuit board on which a through hole is formed, a first surface that supports the circuit board, and a paste that can be applied with paste. A support member having two surfaces and having an escape hole formed at least partially overlapping the through hole; and an insulating property interposed between the circuit board and the support member to cover at least the escape hole. And an intermediate member.

  According to this configuration, since the communication between the through hole of the circuit board and the escape hole of the support member is blocked by the intermediate member, it is possible to block the paste applied to the support member from entering the through hole through the escape hole. it can. Therefore, it is possible to suppress the paste applied to the support member from entering the circuit board.

  The liquid ejecting head may further include a contact member that contacts the second surface of the support member via the paste.

  According to this configuration, even when the paste wets and spreads between the support member and the contact member, it is possible to suppress the paste from entering the circuit board.

  In the liquid ejecting head, the contact member may constitute a part of a frame of the liquid ejecting head.

  According to this configuration, it is possible to reduce the number of parts and reduce the size of the liquid ejecting head by sharing the contact member and the frame.

  In the liquid ejecting head, the paste may be more excellent in thermal conductivity than the support member.

  According to this configuration, when the paste is applied to the second surface of the support member, the heat from the circuit board can be transmitted to the contact member via the paste, so that the heat dissipation can be improved.

  In the liquid jet head, the paste may be an adhesive for bonding the support member to the contact member.

  According to this configuration, when the adhesive is applied to the second surface of the support member as a paste, the adhesive can be prevented from flowing around the circuit board.

  In the liquid ejecting head, the contact member may be formed with a liquid flow path communicating with the head chip.

  According to this configuration, the number of parts can be reduced and the liquid ejecting head can be reduced in size by sharing the member that forms the liquid flow path and the contact member. In addition, the circuit board can be cooled by heat exchange between the liquid in the liquid flow path and the circuit board.

  In the liquid ejecting head, a connection wiring may be exposed on the inner surface of the through hole.

  According to this configuration, conduction between the support member and the connection wiring is interrupted by the intermediate member, which is preferable.

  In the liquid jet head, the intermediate member may have the same outer shape as the support member.

  By the way, the arrangement | positioning structure of an intermediate member can consider the structure which arrange | positions an intermediate member only in the part which overlaps the through-hole of a circuit board. However, it may be difficult to align the intermediate member. In addition, since the intermediate member is locally disposed, unevenness may occur between the circuit board and the support member. On the other hand, according to this configuration, since it is only necessary to superimpose the outer shape of the intermediate member on the outer shape of the support member, the alignment of the intermediate member is facilitated. In addition, the intermediate member is not locally disposed, and unevenness does not occur between the circuit board and the support member, which is preferable.

  In the liquid ejecting head, the circuit board includes a base material, a connection wiring formed on the base material, and a cover lay that covers the connection wiring, and the intermediate member is made of the same material as the cover lay. May be formed.

  According to this configuration, since the material for the cover lay and the intermediate member are made common and there is no need to separately prepare the material for the intermediate member, the cost can be reduced.

  A liquid ejecting apparatus according to one embodiment of the present invention includes the above-described liquid ejecting head.

  According to this configuration, it is possible to provide a liquid ejecting apparatus that can suppress the paste applied to the support member from entering the circuit board.

  According to the present invention, it is possible to provide a liquid ejecting head and a liquid ejecting apparatus that can suppress the paste applied to the support member from flowing around the circuit board.

1 is a perspective view of an inkjet printer according to an embodiment. It is a perspective view of the ink jet head of an embodiment. It is a perspective view which shows the state which removed a part of inkjet head of embodiment. It is a perspective view of the 1st head module of an embodiment. It is a disassembled perspective view of the head chip of an embodiment. It is a disassembled perspective view of the manifold of an embodiment. It is a top view of the connection structure of the circuit board of an embodiment. It is VIII-VIII sectional drawing of FIG. It is a top view of the circuit board of an embodiment. It is a top view of the support member of an embodiment. It is a top view of the intermediate member of an embodiment.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In the following embodiments, an ink jet printer (hereinafter also simply referred to as “printer”) that performs recording on a recording medium using ink (liquid) will be described as an example. In the drawings used for the following description, the scale of each member is appropriately changed in order to make each member a recognizable size.

(Printer)
FIG. 1 is a perspective view of an ink jet printer according to an embodiment.
As shown in FIG. 1, the printer 1 of this embodiment includes a pair of transport mechanisms 2 and 3, an ink supply mechanism 4, inkjet heads 5 </ b> A and 5 </ b> B (liquid ejecting heads), and a scanning mechanism 6. Yes. In the following description, an X, Y, Z orthogonal coordinate system is used as necessary. The X direction is a conveyance direction of the recording medium P (for example, paper). The Y direction is the scanning direction of the scanning mechanism 6. The Z direction is a height direction (vertical direction) orthogonal to the X direction and the Y direction. In the following description, among the X direction, the Y direction, and the Z direction, an arrow direction in the figure is a plus (+) direction, and a direction opposite to the arrow is a minus (−) direction.

  The transport mechanisms 2 and 3 transport the recording medium P in the + X direction. Specifically, the transport mechanism 2 includes a grit roller 11 extending in the Y direction, a pinch roller 12 extending in parallel to the grit roller 11, and a drive mechanism such as a motor that rotates the grit roller 11 (not configured). (Shown). The transport mechanism 3 includes a grit roller 13 that extends in the Y direction, a pinch roller 14 that extends in parallel to the grit roller 13, and a drive mechanism (not shown) that rotates the grit roller 13. Yes.

The ink supply mechanism 4 includes an ink tank 15 that stores ink, and an ink pipe 16 that connects the ink tank 15 and the inkjet heads 5A and 5B.
In the present embodiment, a plurality of ink tanks 15 are arranged in the X direction. For example, each ink tank 15 contains four inks of yellow, magenta, cyan, and black.
For example, the ink pipe 16 is a flexible hose having flexibility. The ink pipe 16 connects between each ink tank 15 and each inkjet head 5A, 5B.

  The scanning mechanism 6 reciprocates the inkjet heads 5A and 5B in the Y direction. Specifically, the scanning mechanism 6 includes a pair of guide rails 21 and 22 extending in the Y direction, a carriage 23 supported movably on the pair of guide rails 21 and 22, and moving the carriage 23 in the Y direction. And a drive mechanism 24 to be operated.

  The drive mechanism 24 is disposed between the guide rails 21 and 22 in the X direction. The drive mechanism 24 is a pair of pulleys 25 and 26 disposed at intervals in the Y direction, an endless belt 27 wound between the pair of pulleys 25 and 26, and a drive that rotationally drives one pulley 25. And a motor 28.

  The carriage 23 is connected to an endless belt 27. A plurality of inkjet heads 5A and 5B are mounted on the carriage 23 in a state of being arranged in the Y direction. Each inkjet head 5A, 5B is configured to be able to eject two colors of ink for each inkjet head 5A, 5B. Therefore, the printer 1 of the present embodiment is configured to be able to eject four color inks of yellow, magenta, cyan, and black by ejecting two different colors of ink from each of the inkjet heads 5A and 5B. .

(Inkjet head)
FIG. 2 is a perspective view of the inkjet head 5A. The inkjet heads 5A and 5B have the same configuration except for the color of the supplied ink. Therefore, in the following description, the inkjet head 5A will be described, and the description of the inkjet head 5B will be omitted.

  As shown in FIG. 2, the inkjet head 5 </ b> A of the present embodiment is configured by mounting head modules 30 </ b> A to 30 </ b> D, a nozzle plate 32, a nozzle guard 33, and the like on a base member 38. In FIG. 2, illustration of a cover or the like that covers the head modules 30 </ b> A to 30 </ b> D is omitted.

(Base member)
FIG. 3 is a perspective view showing a state where a part of the inkjet head 5A is removed.
As shown in FIG. 3, the base member 38 is formed in a plate shape with the Z direction as the thickness direction and the X direction as the longitudinal direction. The base member 38 includes a module holding portion 41 that holds the head modules 30A to 30D (only 30A is shown in FIG. 3), a carriage fixing portion 42 for fixing the base member 38 to the carriage 23 (see FIG. 1), It has.

  The module holding part 41 is formed in a frame shape in a plan view viewed from the Z direction. That is, a mounting opening 44 that penetrates the base member 38 in the Z direction is formed at the center of the module holding portion 41 in the XY plane. Insertion grooves 46 are respectively formed in the pair of short side portions 45 located on both sides in the X direction in the module holding portion 41. In the present embodiment, the insertion groove 46 includes a plurality of insertion grooves 46 that are opposed to each other in the X direction among the insertion grooves 46 formed in each short side portion 45, and a plurality of insertion grooves 46 that are spaced apart in the Y direction. A set (for example, four sets) is formed.

  Each insertion groove 46 is recessed in the X direction with respect to the inner peripheral surface of the short side portion 45 and penetrates the short side portion 45 in the Z direction. That is, the insertion groove 46 communicates with the mounting opening 44. Head modules 30 </ b> A to 30 </ b> D (see FIG. 2) can be inserted into each set of insertion grooves 46 facing in the X direction. A first urging member for urging the head modules 30 </ b> A to 30 </ b> D in one direction in the X direction toward the other insertion groove 46 on the inner surface of one insertion groove 46 among the insertion grooves 46 of each set. (Not shown) is provided. For example, the first biasing member is formed in a leaf spring shape.

  The carriage fixing part 42 projects from the + Z direction end of the module holding part 41 to the XY plane. The carriage fixing portion 42 is formed with an attachment hole for attaching the base member 38 to the carriage 23 (see FIG. 1).

(Head module)
As shown in FIG. 2, the head modules 30 </ b> A to 30 </ b> D are configured to be able to eject ink supplied from the ink tank 15 (see FIG. 1) toward the recording medium P (see FIG. 1). A plurality of head modules 30 </ b> A to 30 </ b> D are mounted on the base member 38 at intervals in the Y direction. In the present embodiment, four head modules of the first head module 30 </ b> A, the second head module 30 </ b> B, the third head module 30 </ b> C, and the fourth head module 30 </ b> D are mounted on the base member 38.

  In the inkjet head 5A of the present embodiment, one color ink is ejected by two head modules among the four head modules 30A to 30D. Specifically, the first head module 30A and the second head module 30B are configured to be able to eject the same color ink, and the third head module 30C and the fourth head module 30D are configured to be able to eject the same color ink. The number of head modules 30A to 30D mounted on the base member 38, the type of ink ejected from the head modules 30A to 30D, and the like can be changed as appropriate. Further, since the head modules 30A to 30D have the same configuration except for the color of the supplied ink, the first head module 30A will be described in the following description.

FIG. 4 is a perspective view of the first head module 30A of the embodiment.
As shown in FIG. 4, the first head module 30 </ b> A includes a head chip 51, a manifold 52 (contact member), and a circuit board 53.

(Head chip)
FIG. 5 is an exploded perspective view of the head chip 51 of the embodiment.
As shown in FIG. 5, the head chip 51 is of a so-called edge chute type that ejects ink from the end of the ejection channel 57 in the extending direction (Z direction). Specifically, the head chip 51 is configured by overlapping an actuator plate 55 and a cover plate 56 in the Y direction.

  The actuator plate 55 is a so-called monopole substrate in which the polarization direction is set in one direction along the thickness direction (Y direction). For example, the actuator plate 55 is preferably a ceramic substrate made of lead zirconate titanate (PZT) or the like. The actuator plate 55 may be a so-called chevron type formed by laminating two piezoelectric substrates having different polarization directions in the Y direction.

  A plurality of channels 57 and 58 are arranged side by side in the X direction on the surface of the actuator plate 55 facing the −Y direction (hereinafter referred to as “actuator plate 55 surface”). Each channel 57, 58 is formed linearly along the Z direction. Each channel 57, 58 opens on the end surface in the −Z direction of the actuator plate 55 and ends at the end portion in the + Z direction of the actuator plate 55. Each channel 57, 58 may extend with an inclination with respect to the Z direction.

  The plurality of channels 57 and 58 are an ejection channel 57 filled with ink and a non-ejection channel 58 not filled with ink. The ejection channels 57 and the non-ejection channels 58 are arranged alternately in the X direction. Each of the channels 57 and 58 is partitioned in the X direction by a drive wall 61 made of an actuator plate 55. Drive electrodes (not shown) are formed on the inner surfaces of the channels 57 and 58.

  The cover plate 56 is formed in a rectangular shape in plan view as viewed from the Y direction. The cover plate 56 is joined to the surface of the actuator plate 55 with the + Z direction end of the actuator plate 55 protruding.

  A common ink chamber 62 is formed on the surface of the cover plate 56 facing the −Y direction (hereinafter referred to as “the surface of the cover plate 56”). On the other hand, a plurality of slits 63 are formed on the surface of the cover plate 56 facing the + Y direction (hereinafter referred to as “the back surface of the cover plate 56”).

  The common ink chamber 62 is formed at the same position as the + Z direction end of the ejection channel 57 in the Z direction. The common ink chamber 62 is recessed from the front surface of the cover plate 56 toward the back surface of the cover plate 56 and extends in the X direction. Ink flows into the common ink chamber 62 through the manifold 52 (see FIG. 4).

  The slit 63 is formed in the common ink chamber 62 at a position facing the ejection channel 57 in the Y direction. The slit 63 communicates the inside of the common ink chamber 62 and the inside of each discharge channel 57 separately. On the other hand, the non-ejection channel 58 does not communicate with the common ink chamber 62.

(Manifold)
FIG. 6 is an exploded perspective view of the manifold 52 of the embodiment.
As shown in FIG. 6, the manifold 52 is formed with an ink channel 71 (liquid channel) through which ink flows toward the head chip 51 (see FIG. 3). The manifold 52 as a whole is formed in a plate shape whose thickness direction is the Y direction. As shown in FIG. 3, the manifold 52 is held in the base member 38 in a standing state in the + Z direction by being inserted into a pair of insertion grooves 46 opposed in the X direction among the insertion grooves 46. Yes.

  As shown in FIG. 6, second urging members 70 (only the −X direction side is shown in FIG. 4) are provided at both ends in the X direction at the −Z direction end of the manifold 52. As shown in FIG. 4, the second urging member 70 is interposed between the inner surface of the insertion groove 46 and the manifold 52 in the insertion groove 46 (see FIG. 3), and the first head module 30 </ b> A is disposed. Energize in the + Y direction. For example, the second urging member 70 is formed in a leaf spring shape.

  As shown in FIG. 6, the manifold 52 includes a flow path plate 72 and a flow path cover 73 superimposed on the flow path plate 72 in the Y direction. For example, the channel plate 72 is formed of a metal material having excellent thermal conductivity such as aluminum.

The flow path plate 72 includes a flow path plate main body 75 and an inflow port 76.
The flow path plate body 75 is formed in a rectangular plate shape with the Y direction as the thickness direction. An ink flow path 71 is formed on the surface of the flow path plate main body 75 facing the + Y direction (hereinafter referred to as “rear surface of the flow path plate main body 75”). The ink flow path 71 is formed in a groove shape that is recessed in the −Y direction. Specifically, the ink flow path 71 includes a meandering portion 71a and a communication portion 71b.

The meandering portion 71a extends in the Z direction while meandering in the X direction. The + Z direction end of the meandering portion 71 a communicates with the inflow port 76. On the other hand, the −Z direction end portion of the meandering portion 71 a communicates with the communication portion 71 b at the center portion in the X direction of the flow path plate body 75. The meandering direction of the meandering portion 71a meanders so as to be longer with respect to the straight line connecting the communicating portion between the meandering portion 71a and the inflow port 76 and the communicating portion between the meandering portion 71a and the communicating portion 71b. If necessary, it can be changed as appropriate. For example, the meandering portion 71a may be configured to extend in the X direction while meandering in the Z direction.
The communication portion 71 b extends in the X direction at the −Z direction end of the flow path plate main body 75. The communicating portion 71b has a shape equivalent to that of the common ink chamber 62 (see FIG. 5) when viewed from the front in the Y direction.

  The inflow port 76 is provided at the end portion in the −X direction among the + Z direction end surfaces of the flow path plate main body 75. The inflow port 76 is formed in a cylindrical shape protruding from the flow path plate body 75 in the + Z direction. The −Z direction end of the inflow port 76 communicates with the meandering portion 71a.

  The flow path cover 73 is formed in a rectangular plate shape when viewed from the front when viewed from the Y direction. The channel cover 73 has the same outer shape as the channel plate main body 75 in a front view as viewed from the Y direction. The channel cover 73 is thinner in the Y direction than the channel plate main body 75. The flow path cover 73 is fixed to the back surface of the flow path plate main body 75 and closes the ink flow path 71 from the + Y direction. A communication hole 73h that opens the communication part 71b is formed in the flow path cover 73 at a position overlapping the communication part 71b when viewed from the Y direction. The communication hole 73h has the same shape as the communication portion 71b in a front view as viewed from the Y direction. For example, the flow path cover 73 is made of a metal material having excellent thermal conductivity such as stainless steel.

  In the present embodiment, the case where the groove-like ink flow path 71 is formed only on the flow path plate 72 has been described. However, the present invention is not limited to this configuration, and at least one of the flow path plate 72 and the flow path cover 73 is provided. It suffices if an ink flow path is formed. For example, a groove portion may be formed in each of the flow path plate 72 and the flow path cover 73, and the ink flow path may be formed by overlapping the groove portions of the flow path plate 72 and the flow path cover 73.

  An insulating sheet 77 is provided on the surface of the flow path cover 73 facing the + Y direction (hereinafter referred to as “rear surface of the flow path cover 73”). The insulating sheet 77 is formed in a frame shape in a plan view viewed from the Y direction. The insulating sheet 77 surrounds the communication hole 73 h on the back surface of the flow path cover 73. The insulating sheet 77 is fixed to the back surface of the flow path cover 73 by adhesion or the like. For example, the material of the insulating sheet 77 is polyimide. The material of the insulating sheet 77 is not limited to this, and may be a resin material other than polyimide or a rubber material. As the material of the insulating sheet 77, various materials can be adopted as long as they have insulating properties and ink resistance (elution resistance) and are relatively soft materials.

(Head chip fixing mode)
As shown in FIG. 4, the head chip 51 is fixed to the back surface of the flow path cover 73 with an insulating sheet 77 (see FIG. 6) interposed therebetween. Specifically, the head chip 51 is fixed to the insulating sheet 77 by bonding or the like with the surface of the cover plate 56 facing the manifold 52 facing the insulating sheet 77. At this time, the common ink chamber 62 (see FIG. 5) of the cover plate 56 communicates with the communication portion 71b through the communication hole 73h shown in FIG. As a result, the ink flowing through the ink flow path 71 is supplied to the head chip 51.

(Circuit board)
As shown in FIG. 4, the circuit board 53 is configured by mounting a wiring pattern and various electronic components on a base film. For example, the circuit board 53 is a flexible printed board. The circuit board 53 includes a module control unit 53 a supported by the manifold 52, and a chip connection unit 53 b that connects the module control unit 53 a and the head chip 51. In the circuit board 53, as long as at least the chip connection portion 53b is configured by a flexible substrate, the module control unit 53a may be configured by a rigid substrate or the like.

  The module control unit 53a is formed in a rectangular shape when viewed from the Y direction. Electronic components such as a module IC are mounted on the module control unit 53a. As shown in FIG. 2, the circuit board 53 is electrically connected to the main board 59 via a drawing part 53 c drawn from the module control part 53 a (see FIG. 4) in the + Z direction. The main board 59 controls the head modules 30A to 30D in an integrated manner. That is, the main board 59 outputs a drive signal generated by a main IC (not shown) to each circuit board 53. Then, the circuit board 53 drives the head chip 51 (see FIG. 4) based on the drive signal output from the main board 59.

  As shown in FIG. 4, the chip connection part 53 b extends in the −Z direction from the module control part 53 a with a gap in the Y direction with respect to the flow path cover 73. The −Z direction end of the chip connecting portion 53b is fixed to the + Z direction end of the actuator plate 55 by pressure bonding or the like. Thereby, the drive electrode of the head chip 51 and the circuit board 53 are electrically connected. In FIG. 4, the code | symbol 53d shows the extension part extended between the module control part 53a and the drawer | drawing-out part 53c from the chip | tip connection part 53b.

(Circuit board connection structure)
The module control unit 53a of the circuit board 53 is fixed to the manifold 52 with a support plate 80 (supporting member) interposed therebetween at a portion located in the + Z direction with respect to the head chip 51 on the back surface of the flow path cover 73. An intermediate member 90 is interposed between the circuit board 53 and the support plate 80. That is, in the present embodiment, the first head module 30A includes a circuit board 53 that is electrically connected to the head chip 51, a support plate 80 that supports the circuit board 53, and the circuit board 53 and the support plate 80. And an intermediate member 90 interposed therebetween.

FIG. 7 is a plan view of the connection structure of the circuit board 53 according to the embodiment. 8 is a sectional view taken along line VIII-VIII in FIG. In FIG. 8, the paste 85 and the manifold 52 are shown together.
As shown in FIG. 7, a plurality of through holes 53 h to 53 k are formed in the circuit board 53. The plurality of through holes 53h to 53k are a driver hole 53h for arranging the driver 81 (see FIG. 4), a positioning hole 53i for positioning the circuit board 53, and a fixing for fixing the circuit board 53. And a plating lead hole 53k for cutting the plating lead in the plating process. In the example of FIG. 7, two driver holes 53h, three positioning holes 53i, two fixing holes 53j, and eight plating lead holes 53k are shown.

FIG. 9 is a plan view of the circuit board 53 of the embodiment.
In the plan view of FIG. 9, the driver hole 53h has a rectangular shape having a length in the X direction. The two driver holes 53h1 and 53h2 (the first driver hole 53h1 and the second driver hole 53h2) are spaced apart in the X direction at the center in the Z direction and near the center in the X direction of the module control unit 53a. .

  In the plan view of FIG. 9, the positioning hole 53 i has a circular shape. The three positioning holes 53i1 to 53i3 are arranged at the first positioning hole 53i1 arranged at the corner of the module control unit 53a in the + Z direction and the + X direction, and at the corner of the module control unit 53a in the + Z direction and the −X direction. A second positioning hole 53i2 and a third positioning hole 53i3 spaced from the second positioning hole 53i2 in the -Z direction.

  In the plan view of FIG. 9, the fixing hole 53j is a long hole having a length in the Z direction. The two fixing holes 53j1 and 53j2 are provided between the first fixing hole 53j1 disposed on the −Z direction side of the first positioning hole 53i1, and the second positioning hole 53i2 and the third positioning hole 53i3. And the second fixing hole 53j2.

  9, the plating lead hole 53k has a circular shape or a long hole shape. The eight plating lead holes 53k1 to 53k4 include three first plating lead holes 53k1 distributed between the first driver hole 53h1 and the first fixing hole 53j1, and the first driver hole. Two second plating lead holes 53k2 spaced apart in the X direction between 53h1 and the second driver hole 53h2, and between the second driver hole 53h2 and the second fixing hole 53j2 Two third plating lead holes 53k3 spaced apart in the direction and the Z direction, and one fourth plating lead hole 53k4 disposed on the + X direction side of the second positioning hole 53i2.

  As shown in FIG. 8, the circuit board 53 includes a base material 54a, connection wirings 54b and 54c formed on the base material 54a, and coverlays 54d and 54e that cover the connection wirings 54b and 54c. The base material 54a, the connection wirings 54b and 54c, and the cover lays 54d and 54e are laminated in the Y direction via an adhesive (not shown). The driver 81 is electrically connected to the circuit board 53 by a gold wire (not shown).

The base material 54a is an insulating sheet-like member.
The connection wirings 54b and 54c are a first connection wiring 54b formed on one surface of the base material 54a and a second connection wiring 54c formed on the other surface of the base material 54b. The connection wires 54b and 54c are exposed on the inner surface of the plating lead hole 53k.
The cover lays 54d and 54e are a first cover lay 54d that covers the first connection wiring 54b and a second cover lay 54e that covers the second connection wiring 54c. For example, the coverlays 54d and 54e are made of a resin material such as polyimide (PI).

(Support plate)
As shown in FIG. 8, the support plate 80 has a first surface 80a for supporting the circuit board 53 and a second surface 80b to which the paste 85 can be applied. For example, the support plate 80 is formed of a material having excellent thermal conductivity such as a metal material. The manifold 52 is in contact with the second surface 80 b of the support plate 80 via the paste 85.

  As shown in FIG. 7, the support plate 80 is formed with a relief hole 80k that overlaps with the plating lead hole 53k in the Y direction. The escape holes 80k are holes for preventing the plating leads (connection electrodes of the connection wirings 54b and 54c shown in FIG. 8) exposed on the inner surface of the plating lead hole 53k from short-circuiting with the support plate 80. The escape hole 80k has an inner diameter larger than that of the plating lead hole 53k.

FIG. 10 is a plan view of the support plate 80 of the embodiment.
As shown in FIG. 10, a plurality of through holes 80 i to 80 k are formed in the support plate 80. The plurality of through holes 80i to 80k are a positioning hole 80i for positioning the support plate 80, a fixing hole 80j for fixing the support plate 80, and a relief hole 80k. In the example of FIG. 10, three positioning holes 80i, two fixing holes 80j, and eight escape holes 80k are shown. 7, the positioning holes 80i, the fixing holes 80j, and the relief holes 80k in the support plate 80 are the positioning holes 53i, the fixing holes 53j, and the plating lead holes in the circuit board 53, respectively. It is arranged at a position overlapping each of 53k.

(paste)
As shown in FIG. 8, the paste 85 is disposed between the support plate 80 and the manifold 52. The paste 85 is applied to an area overlapping the driver 81 on the second surface 80 b of the support plate 80. The paste 85 has better thermal conductivity than the support plate 80. The paste 85 is an adhesive for bonding the support plate 80 to the manifold 52.

(Intermediate member)
As shown in FIG. 8, the intermediate member 90 is sandwiched between the circuit board 53 and the support plate 80. The intermediate member 90 covers the escape hole 80k. That is, the intermediate member 90 is interposed between the plating lead hole 53k and the escape hole 80k to block communication between the plating lead hole 53k and the escape hole 80k. The intermediate member 90 is a sheet-like member having insulating properties. The intermediate member 90 is formed of the same material as the coverlays 54d and 54e. For example, the intermediate member 90 is formed of a resin material such as polyimide (PI).

FIG. 11 is a plan view of the intermediate member 90 of the embodiment.
As shown in FIG. 11, the intermediate member 90 has the same outer shape as the support plate 80 (see FIG. 10). A plurality of through holes 90 h to 90 j are formed in the intermediate member 90. The plurality of through holes 90h to 90j are a driver hole 90h for arranging the driver 81 (see FIG. 8), a positioning hole 90i for positioning the intermediate member 90, and a fixing for fixing the intermediate member 90. Holes 90j. In the example of FIG. 11, two driver holes 90h, three positioning holes 90i, and two fixing holes 90j are shown. 7, the driver holes 90h, the positioning holes 90i, and the fixing holes 90j in the intermediate member 90 are the driver holes 53h, the positioning holes 53i, and the fixing holes in the circuit board 53, respectively. 53j is arranged at a position overlapping each other.

(Arrangement configuration of each head module)
As shown in FIG. 3, the first head module 30 </ b> A is inserted into the attachment opening 44 with the manifold 52 being inserted into the insertion groove 46. The manifold 52 constitutes a part of the frame of the inkjet head 5A. The first head module 30A has a base member 38 such that the head chip 51 faces the + Y direction, and the −Z direction end surface of the head chip 51 is flush with the −Z direction end surface of the base member 38 (module holding portion 41). Is held in.

  The second head module 30B (see FIG. 2) has a mounting opening in a state where it is inserted into the insertion groove 46 adjacent to the insertion groove 46 in which the manifold 52 of the first head module 30A is inserted in the + Y direction. The part 44 is inserted. The second head module 30B is held by the base member 38 with its own head chip 51 facing the head chip 51 of the first head module 30A in the Y direction. As shown in FIG. 2, the inflow ports 76 of the first head module 30A and the second head module 30B are arranged at substantially the same position on the −X direction side.

  The head chips 51 of the second head module 30B are arranged such that the arrangement pitch of the discharge channels 57 (see FIG. 5) is shifted by a half pitch (staggered) with respect to the head chips 51 of the first head module 30A. As a result, the head chips 51 of the first head module 30A and the second head module 30B cooperate to discharge one color ink, thereby enabling high density recording of characters or images recorded on the recording medium P. It has become. In the first head module 30A and the second head module 30B, the arrangement pitch of the ejection channels 57 of the head chip 51 can be changed as appropriate.

  The third head module 30C and the fourth head module 30D are also held by the base member 38 with the head chips 51 facing each other in the Y direction. Each head module 30 </ b> A to 30 </ b> D is fixed to the base member 38 via a stay (not shown) erected from the base member 38 in the + Z direction.

(Nozzle plate)
For example, the nozzle plate 32 is formed of a resin material such as polyimide. The + Z direction end surface of the nozzle plate 32 (the surface facing the base member 38) is fixed to the −Z direction end surface of the head chip 51 with an adhesive or the like.

  As illustrated in FIG. 2, the nozzle plate 32 collectively covers the head chips 51 of the head modules 30 </ b> A to 30 </ b> D from the −Z direction. A plurality of nozzle rows (first nozzle row 130A to fourth nozzle row 130D) extending in the X direction are formed in the nozzle plate 32 at intervals in the Y direction.

  Each nozzle row 130A to 130D is formed at a position on the nozzle plate 32 that faces the head chip 51 of the corresponding head module 30A to 30D in the Z direction. Each of the nozzle arrays 130A to 130D includes a nozzle hole that penetrates the nozzle plate 32 in the Z direction. For example, the nozzle holes are separately formed in the nozzle plate 32 at positions facing the ejection channels 57 (see FIG. 5) of the head chips 51 in the head modules 30A to 30D in the Z direction. That is, the nozzle rows 130A to 130D are configured by forming a plurality of nozzle holes in a straight line at intervals in the X direction.

[How the printer works]
Next, a method for recording information on the recording medium P using the printer 1 described above will be described.
As shown in FIG. 1, when the printer 1 is operated, the grit rollers 11 and 13 of the transport mechanisms 2 and 3 rotate, so that the recording medium P is interposed between the grit rollers 11 and 13 and the pinch rollers 12 and 14. It is conveyed in the + X direction. At the same time, the drive motor 28 rotates the pulley 26 to run the endless belt 27. As a result, the carriage 23 reciprocates in the Y direction while being guided by the guide rails 21 and 22.
During this time, in each of the inkjet heads 5A and 5B, a drive voltage is applied to the drive electrode of the head chip 51 shown in FIG. As a result, a thickness-slip deformation is caused in the drive wall 61, and a pressure wave is generated in the ink filled in the ejection channel 57. Due to this pressure wave, the internal pressure of the ejection channel 57 increases, and ink is ejected through the nozzle holes. Various types of information are recorded on the recording medium P by the ink landing on the recording medium P.

  As described above, the inkjet heads 5A and 5B according to the present embodiment are electrically connected to the head chip 51 and support the circuit board 53 and the circuit board 53 on which the plating lead holes 53k are formed. A support plate 80 having a first surface 80a and a second surface 80b to which the paste 85 can be applied and having an escape hole 80k overlapping the plating lead hole 53k, and between the circuit board 53 and the support plate 80. And an intermediate member 90 having an insulating property to cover the escape hole 80k.

  According to the present embodiment, since the communication between the plating lead hole 53k of the circuit board 53 and the relief hole 80k of the support plate 80 is blocked by the intermediate member 90, the paste 85 applied to the support plate 80 is allowed to escape from the relief hole 80k. It is possible to block the penetration into the plating lead hole 53k. Therefore, it is possible to suppress the paste 85 applied to the support plate 80 from entering the circuit board 53.

  In the present embodiment, a manifold 52 that abuts against the second surface 80 b of the support plate 80 via the paste 85 is further provided.

  According to this embodiment, even when the paste 85 wets and spreads between the support plate 80 and the manifold 52, it is possible to suppress the paste 85 from entering the circuit board 53.

  In the present embodiment, the manifold 52 constitutes a part of the frame of the inkjet heads 5A and 5B.

  According to the present embodiment, by sharing the manifold 52 and the frame, the number of parts can be reduced and the inkjet heads 5A and 5B can be reduced in size.

  In the present embodiment, the paste 85 is more excellent in thermal conductivity than the support plate 80.

  According to the present embodiment, when the paste 85 is applied to the second surface 80b of the support plate 80, heat from the circuit board 53 can be transmitted to the manifold 52 via the paste 82, so that heat dissipation is improved. Can be planned.

  In the present embodiment, the paste 85 is an adhesive for bonding the support plate 80 to the manifold 52.

  According to the present embodiment, when the adhesive is applied to the second surface 80 b of the support plate 80 as the paste 85, it is possible to suppress the adhesive from entering the circuit board 53.

  In the present embodiment, the manifold 52 is formed with an ink flow path 71 communicating with the head chip 51.

  According to the present embodiment, the number of components can be reduced and the size of the ink jet heads 5A and 5B can be reduced by sharing the member that forms the ink flow path 71 and the contact member. In addition, the circuit board 53 can be cooled by heat exchange between the ink in the ink flow path 71 and the circuit board 53.

  In the present embodiment, the connection wires 54b and 54c are exposed on the inner surface of the plating lead hole 53k.

  According to the present embodiment, the conduction between the support plate 80 and the connection wirings 54b and 54c is blocked by the intermediate member 90, which is preferable.

  In the present embodiment, the intermediate member 90 has the same outer shape as the support plate 80.

  By the way, as an arrangement configuration of the intermediate member 90, a configuration in which the intermediate member 90 is arranged only in a portion overlapping the plating lead hole 53k of the circuit board 53 is conceivable. However, alignment of the intermediate member 90 may be difficult. In addition, since the intermediate member 90 is locally disposed, unevenness may occur between the circuit board 53 and the support plate 80. On the other hand, according to the present embodiment, it is only necessary to superimpose the outer shape of the intermediate member 90 on the outer shape of the support plate 80, so that the alignment of the intermediate member 90 is facilitated. In addition, the intermediate member 90 is not locally disposed, and unevenness does not occur between the circuit board 53 and the support plate 80, which is preferable.

  In the present embodiment, the circuit board 53 includes a base material 54a, connection wirings 54b and 54c formed on the base material 54a, and cover lays 54d and 54e covering the connection wirings 54b and 54c, and an intermediate member. 90 is formed of the same material as the coverlays 54d and 54e.

  According to the present embodiment, since the materials of the cover lays 54d and 54e and the intermediate member 90 are made common and it is not necessary to prepare the material of the intermediate member 90 separately, the cost can be reduced. For example, when the material of the intermediate member 90 is polyimide (PI), it is preferable because the material of the intermediate member 90 is excellent in heat resistance as compared with the case where the material of the intermediate member 90 is polyethylene terephthalate (PET).

  The printer 1 according to this embodiment includes the inkjet heads 5A and 5B.

  According to the present embodiment, it is possible to provide the printer 1 that can suppress the paste 85 applied to the support plate 80 from entering the circuit board 53.

(Modification)
The technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the ink jet printer 1 has been described as an example of the liquid ejecting apparatus, but the present invention is not limited thereto. For example, the liquid ejecting apparatus may be a fax machine or an on-demand printing machine.

In the above-described embodiment, the configuration in which the four head modules 30A to 30D are mounted on the base member 38 has been described, but the configuration is not limited thereto. For example, the number of head modules mounted on the base member 38 may be one or more.
In the above-described embodiment, the configuration in which the ink of one color is ejected by the two head modules has been described. However, the configuration is not limited thereto. For example, three or more head modules may eject one color ink, and one head module may eject one color ink.

In the embodiment described above, the edge chute head chip has been described, but the present invention is not limited thereto. For example, the present invention may be applied to a so-called side shoot type head chip that ejects ink from the central portion of the ejection channel in the extending direction.
Further, the present invention may be applied to a so-called roof chute type head chip in which the direction of pressure applied to ink and the direction of ink droplet ejection are the same.
Further, the present invention may be applied not only to the piezoelectric type but also to other types of liquid jet heads and liquid jet apparatuses such as a thermal (bubble jet (registered trademark)) type.

  In the above-described embodiment, the intermediate member 90 has been described as an example having the same outer shape as the support plate 80, but the present invention is not limited to this. For example, the intermediate member 90 may be disposed only in a portion overlapping the plating lead hole 53k of the circuit board 53. That is, the intermediate member 90 only needs to have an outer shape that covers at least the escape hole 80k.

  In addition, the constituent elements in the above-described embodiments can be appropriately replaced with known constituent elements without departing from the gist of the present invention.

1 ... Printer (liquid ejecting device)
5A, 5B ... Inkjet head (liquid jet head)
51 ... head chip 52 ... manifold (contact member)
53 ... Circuit board 53k ... Hole for plating lead (through hole)
54b ... First connection wiring (connection wiring)
54c ... Second connection wiring (connection wiring)
54d ... First coverlay (coverlay)
54e ... Second coverlay (coverlay)
71: Ink channel (liquid channel)
80 ... Support plate (support substrate)
80a ... First surface 80b ... Second surface 80k ... Escape hole 85 ... Paste 90 ... Intermediate member

Claims (10)

A circuit board electrically connected to the head chip and having a through-hole formed therein;
A support member having a first surface for supporting the circuit board and a second surface to which a paste can be applied, and an escape hole at least partially overlapping the through hole;
A liquid ejecting head comprising: an intermediate member having an insulating property interposed between the circuit board and the support member and covering at least the escape hole.   The liquid jet head according to claim 1, further comprising a contact member that contacts the second surface of the support member via the paste.   The liquid ejecting head according to claim 2, wherein the contact member constitutes a part of a frame of the liquid ejecting head.   The liquid ejecting head according to claim 2, wherein the paste is superior in thermal conductivity to the support member.   5. The liquid jet head according to claim 2, wherein the paste is an adhesive for adhering the support member to the abutting member. 6.   The liquid ejecting head according to claim 2, wherein the contact member is formed with a liquid flow path communicating with the head chip.   The liquid ejecting head according to claim 1, wherein a connection wiring is exposed on an inner surface of the through hole.   The liquid ejecting head according to claim 1, wherein the intermediate member has the same outer shape as the support member. The circuit board includes a base material, connection wiring formed on the base material, and a coverlay that covers the connection wiring,
The liquid ejecting head according to claim 1, wherein the intermediate member is made of the same material as the coverlay.   A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.

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