JP2023085255A5 - - Google Patents

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JP2023085255A5
JP2023085255A5 JP2023030851A JP2023030851A JP2023085255A5 JP 2023085255 A5 JP2023085255 A5 JP 2023085255A5 JP 2023030851 A JP2023030851 A JP 2023030851A JP 2023030851 A JP2023030851 A JP 2023030851A JP 2023085255 A5 JP2023085255 A5 JP 2023085255A5
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window
failure
components
sensor data
index value
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JP2023030851A
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JP2023085255A (ja
JP7472344B2 (ja
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JP2023030851A 2019-01-31 2023-03-01 イオン注入半導体製造ツールにおける構成要素の故障の是正 Active JP7472344B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US16/264,034 2019-01-31
US16/264,034 US11348813B2 (en) 2019-01-31 2019-01-31 Correcting component failures in ion implant semiconductor manufacturing tool
PCT/US2020/014197 WO2020159730A1 (en) 2019-01-31 2020-01-17 Correcting component failures in ion implant semiconductor manufacturing tool
JP2021544540A JP7238146B2 (ja) 2019-01-31 2020-01-17 イオン注入半導体製造ツールにおける構成要素の故障の是正

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JP2021544540A Division JP7238146B2 (ja) 2019-01-31 2020-01-17 イオン注入半導体製造ツールにおける構成要素の故障の是正

Publications (3)

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JP2023085255A JP2023085255A (ja) 2023-06-20
JP2023085255A5 true JP2023085255A5 (enExample) 2023-10-19
JP7472344B2 JP7472344B2 (ja) 2024-04-22

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JP2021544540A Active JP7238146B2 (ja) 2019-01-31 2020-01-17 イオン注入半導体製造ツールにおける構成要素の故障の是正
JP2023030851A Active JP7472344B2 (ja) 2019-01-31 2023-03-01 イオン注入半導体製造ツールにおける構成要素の故障の是正

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JP2021544540A Active JP7238146B2 (ja) 2019-01-31 2020-01-17 イオン注入半導体製造ツールにおける構成要素の故障の是正

Country Status (6)

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US (2) US11348813B2 (enExample)
JP (2) JP7238146B2 (enExample)
KR (2) KR102731064B1 (enExample)
CN (1) CN113383282B (enExample)
TW (2) TWI851071B (enExample)
WO (1) WO2020159730A1 (enExample)

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